Datasheet AD7936 Datasheet (Analog Devices)

Page 1
PRELIMINARY TECHNICAL DATA
AD7936/AD7935
VDD
12-/10-BIT
SAR ADC
AND
CONTROL
PARALLEL INTERFACE/CONTROL REGISTER
VIN0
CS RD WR
W/B
SEQUENCER
VIN7
I/P MUX
T/H
V
REFIN
/
V
REFOUT
CLKIN
CONVST
BUSY
AGND
D0
D7
VDRIVE
DGND
2.5 V VREF
8-Channel, 1.5 MSPS, 12- & 10-Bit
a
FEATURES Fast Throughput Rate: 1.5 MSPS Specified for V Low Power:
8 mW max at 1.5 MSPS with 3V Supplies
16 mW max at 1.5 MSPS with 5V Supplies 8 Analog Input Channels with a Sequencer Software Configurable Analog Inputs:
8-Channel Single Ended Inputs
4-Channel Fully Differential Inputs
4-Channel Pseudo Differential Inputs
7-Channel Pseudo Differential Inputs Accurate On-chip 2.5 V Reference Wide Input Bandwidth:
70dB SNR at 50kHz Input Frequency No Pipeline Delays High Speed Parallel Interface operating in
Byte format Full Shutdown Mode: 1 28-Lead TSSOP Package
of 2.7 V to 5.25 V
DD
µA max
Parallel ADCs with a Sequencer
AD7936/AD7935
FUNCTIONAL BLOCK DIAGRAM
GENERAL DESCRIPTION
The AD7936/AD7935 are 12- & 10-bit, high speed, low power, successive approximation (SAR) ADCs. The parts operate from a single 2.7 V to 5.25 V power supply and feature throughput rates up to 1.5 MSPS. The parts contain a low noise, wide bandwidth, differ­ential track/hold amplifier that can handle input frequencies up to 20MHz.
The AD7936/AD7935 feature 8 analog input channels with a channel sequencer to allow a pre-programmed selection of channels to be converted sequentially. These parts can operate with either Single-ended, Fully Differential or Pseudo Differential analog inputs. The analog input configuration is chosen by setting the rel­evant bits in the on-chip Control Register.
The conversion process and data acquisition are con­trolled using standard control inputs allowing easy interfacing to Microprocessors and Dsps. The input signal is sampled on the falling edge of CONVST and the conversion is also initiated at this point.
The AD7936/AD7935 has an accurate on-chip 2.5 V reference that can be used as the reference source for the analog to digital conversion. Alternatively, this pin can be overdriven to provide an external reference in the range 100mV to 3.5 V.
REV.PrA 03/03
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
These parts use advanced design techniques to achieve very low power dissipation at high throughput rates. They also feature flexible power management options.
An on-chip Control register allows the user to set up dif­ferent operating conditions including analog input range and configuration, output coding, power management and channel sequencing.
PRODUCT HIGHLIGHTS
1. High Throughput with Low Power Consumption The AD7936/AD7935 offer 1.5 MSPS throughput with 8mW power consumption at V
= 3V.
DD
2. Eight Analog Inputs with a Channel Sequencer.
A sequence of input channels can be selected, through which the AD7936/AD7935 will continuously cycle and convert on.
3. Accurate on-chip 2.5 V reference.
4. Software Configurable Analog Inputs
Single-Ended, Pseudo Differential or Fully Differential analog inputs that are software selectable.
5. Single-supply Operation with V
DRIVE
Function.
The AD7936/AD7935 operates from a single 2.7 V to
5.25 V supply. The V
function allows the parallel
DRIVE
interface to connect directly to either 3V or 5 V proces sor systems independent of V
DD
.
6. No Pipeline Delay The parts feature a standard successive-approximation ADC with accurate control of the sampling instant via a CONVST input and once off conversion control.
Page 2
PRELIMINARY TECHNICAL DATA
AD7936–SPECIFICATIONS
1
( VDD = V F
CLKIN
=2.7 V to 5.25V, V
DRIVE
= 20MHz, F
= 1.5 MSPS; TA = T
SAMPLE
REFIN/VREFOUT
= 2.5V unless otherwise noted,
to T
MIN
, unless otherwise noted.)
MAX
Parameter BVersion1 Units Test Conditions/Comments
DYNAMIC PERFORMANCE F
Signal to Noise + Distortion
(SINAD) Signal to Noise Ratio (SNR) Total Harmonic Distortion (THD) Peak Harmonic or Spurious Noise -75 dB max -82dB typ
(SFDR)
2
Intermodulation Distortion (IMD)
2
2
2
2
70 dB min
70 dB min
-75 dB max -80dB typ
=50kHz Sine Wave
IN
fa = 40.1kHz, fb = 51.5kHz Second Order Terms -85 dB typ Third Order Terms -85 dB typ
Aperture Delay 10 ns typ Aperture Jitter 50 ps typ Channel-to-Channel Isolation
2
-8 2 dB typ
Full Power Bandwidth 20 MHz typ @ 3 dB
2.5 MHz typ @ 0.1 dB
DC ACCURACY
Resolution 12 Bits Integral Nonlinearity Differential Nonlinearity Total Unadjusted Error TBD LSB max
0V to V
Input Range
REF IN
2
2
3
±1 LSB max ±0.95 LSB max Guaranteed No Missed Codes to 12 Bits.
Straight Binary Output Coding Offset Error ±3 LSB max Offset Error Match ±0.5 LSB max Gain Error ±2 LSB max Gain Error Match ±0.6 LSB max
0V to 2 x V
Input Range
REF IN
4
-V
REF IN
to +V
Biased about V
REF IN
REF
with
Twos Complement Output Coding Positive Gain Error ±2 LSB max Positive Gain Error Match ±0.6 LSB max Zero Code Error ±3 LSB max Zero Code Error Match ±1 LSB max Negative Gain Error ±1 LSB max Negative Gain Error Match ±0.5 LSB max
ANALOG INPUT
Input Voltage Ranges 0 to V
REF
0 to 2xV
V RANGE bit in the Control register set to 1. V RANGE bit in the Control register set to 0.
REF
V
DD/VDRIVE
= 4.75 V to 5.25 V for 0-2V DC Leakage Current ±1 µA max Input Capacitance 20 pF typ
REFERENCE INPUT/OUTPUT
V
Input Voltage 2.5
REFIN
5
V ±1% Specified Performance DC Leakage Current ±1 µA max V V V
Output Voltage 2.49/2.51 Vmin/max
REFOUT
Tempco 15 ppm/°C typ
REFOUT
Output Impedance 10
REF
LOGIC INPUTS
Input High Voltage, V Input Low Voltage, V Input Current, I
IN
Input Capacitance, C
0.7xV
INH
0.3xV
INL
6
IN
DRIVE
DRIVE
V min
V max
± 1 µA max Typically 10 nA, V 10 pF max
= 0 V or V
IN
DRIVE
LOGIC OUTPUTS
Output High Voltage, V Output Low Voltage, V Floating-State Leakage Current ±10 µA max Floating-State Output Capacitance
V
OH
OL
6
-0.2 V min I
DRIVE
0.4 V max I
10 pF max
= 200 µA; VDD = 2.7 V to 5.25 V
SOURCE
=200µA
SINK
Output Coding Straight (Natural) Binary CODING bit in the control register set to 1.
2s Complement CODING bit in the control register set to 0.
REF
range
–2–
REV. PrA
Page 3
PRELIMINARY TECHNICAL DATA
AD7936–SPECIFICATIONS
1
Parameter B Version
1
Units Test Conditions/Comments
CONVERSION RATE Conversion Time 12 CLKIN
cycles (max)
Track/Hold Acquisition Time 300 ns max Sine Wave Input
325 ns max Full-Scale Step Input
Throughput Rate 1.5 MSPS max Conversion Time + Acquisition Time
POWER REQUIREMENTS
V
DD
V
DRIVE
I
DD
Normal Mode(Static) 0.5 mA typ V Normal Mode (Operational) 3.2 mA max V
2.7/5.25 V min/max
2.7/5.25 V min/max
2.6 mA max V
Digital I/Ps = 0V or V
= 2.7V to 5.25V.
DD
= 4.75V to 5.25V.
DD
= 2.7V to 3.6V.
DD
DRIVE
.
Auto StandBy Mode 1.55 mA typ
90 µA max (Static)
Auto Shutdown Mode 1 mA typ
1 µA max (Static)
Full Shut-Down Mode 1 µA max SCLK On or Off.
Power Dissipation
Normal Mode (Operational) 16 mW max V
8 mW max V
Auto Standby-Mode (Static) 450 µW max V
270 µW max V
Auto Shutdown-Mode (Static) 5 µW max V
3 µW max V
Full Shutdown-Mode 5 µW max V
= 5V.
DD
= 3V.
DD
= 5V.
DD
= 3V.
DD
= 5V.
DD
= 3V.
DD
= 5V.
DD
3 µW max VDD = 3V.
NOTES
1
Temperature ranges as follows: B Versions: –40°C to +85°C.
2
See Terminology Section.
3
Bit 9 in the Control register set to 1
4
Bit 9 in the Control register set to 0
5
This device is operational with an external reference in the range 0.1 V to 3.5 V.
6
Sample tested @ +25°C to ensure compliance.
Specifications subject to change without notice.
REV. PrA
–3–
Page 4
PRELIMINARY TECHNICAL DATA
AD7935–SPECIFICATIONS
1
( VDD = V F
CLKIN
=2.7 V to 5.25V, V
DRIVE
= 20MHz, F
= 1.5MSPS; TA = T
SAMPLE
REFIN/VREFOUT
= 2.5V unless otherwise noted,
to T
MIN
, unless otherwise noted.)
MAX
Parameter B Version1 Units Test Conditions/Comments
DYNAMIC PERFORMANCE F
Signal to Noise + Distortion
(SINAD) Signal to Noise Ratio (SNR) Total Harmonic Distortion (THD) Peak Harmonic or Spurious Noise
(SFDR) Intermodulation Distortion (IMD)
2
2
2
2
60 dB min
60 dB min
-73 dB max
-73 dB max
2
=50kHz Sine Wave
IN
fa = 40.1kHz, fb = 51.5kHz Second Order Terms -75 dB typ Third Order Terms -75 dB typ
Aperture Delay 10 ns typ Aperture Jitter 50 ps typ Channel-to-Channel Isolation
2
-8 2 dB typ
Full Power Bandwidth 20 MHz typ @ 3 dB
2.5 MHz typ @ 0.1 dB
DC ACCURACY
Resolution 10 Bits Integral Nonlinearity
2
±0.5 LSB max Differential Nonlinearity ±0.5 LSB max Guaranteed No Missed Codes to 10 Bits. Total Unadjusted Error TBD LSB max
0V to V
Input Range
REF IN
3
Straight Binary Output Coding Offset Error ±3 LSB max Offset Error Match ±0.5 LSB max Gain Error ±2 LSB max Gain Error Match ±0.6 LSB max
0V to 2 x V
Input Range
REF IN
4
-V
REF IN
to +V
Biased about V
REF IN
REF
with
Twos Complement Output CodingOffset Positive Gain Error ±2 LSB max Positive Gain Error Match ±0.6 LSB max Zero Code Error ±3 LSB max Zero Code Error Match ±1 LSB max Negative Gain Error ±1 LSB max Negative Gain Error Match ±0.5 LSB max
ANALOG INPUT
Input Voltage Ranges 0 to V
REF
0 to 2xV
V RANGE bit in the Control register set to 1. V RANGE bit in the Control register set to 0.
REF
V
DD/VDRIVE
= 4.75 V to 5.25 V for 0-2V
REF
DC Leakage Current ±1 µA max Input Capacitance 20 pF typ
REFERENCE INPUT/OUTPUT
V
Input Voltage 2.5
REFIN
5
V ±1% Specified Performance
DC Leakage Current ±1 µA max
Input Impedance 36 k
V
REFIN
V V V
Output Voltage 2.49/2.51 Vmin/max
REFOUT
Tempco 15 ppm/°C typ
REFOUT
Output Impedance 10
REF
LOGIC INPUTS
Input High Voltage, V Input Low Voltage, V Input Current, I
IN
Input Capacitance, C
0.7xV
INH
0.3xV
INL
6
IN
DRIVE
DRIVE
V min
V max ± 1 µA max Typically 10 nA, V 10 pF max
= 0 V or V
IN
DRIVE
LOGIC OUTPUTS
Output High Voltage, VOH V Output Low Voltage, V Floating-State Leakage Current ±10 µA max Floating-State Output Capacitance
OL
6
-0.2 V min I
DRIVE
0.4 V max I
10 pF max
= 200 µA; VDD = 2.7 V to 5.25 V
SOURCE
=200µA
SINK
Output Coding Straight (Natural) Binary CODING bit in the control register set to 1.
2s Complement CODING bit in the control register set to 0.
–4–
REV. PrA
range
Page 5
PRELIMINARY TECHNICAL DATA
AD7935–SPECIFICATIONS
1
Parameter B Version
1
Units Test Conditions/Comments
CONVERSION RATE Conversion Time 10 CLKIN
cycles (max)
Track/Hold Acquisition Time 300 ns max Sine Wave Input
325 ns max Full-Scale Step Input
Throughput Rate 1.5 MSPS max Conversion Time + Acquisition Time
POWER REQUIREMENTS
V
DD
V
DRIVE
I
DD
Normal Mode(Static) 0.5 mA typ V Normal Mode (Operational) 3.2 mA max V
2.7/5.25 V min/max
2.7/5.25 V min/max
2.6 mA max V
Digital I/Ps = 0V or V
= 2.7V to 5.25V.
DD
= 4.75V to 5.25V.
DD
= 2.7V to 3.6V.
DD
DRIVE
.
Auto StandBy Mode 1.55 mA typ
90 µA max (Static)
Auto Shutdown Mode 1 mA typ
1 µA max (Static)
Full Shut-Down Mode 1 µA max SCLK On or Off.
Power Dissipation
Normal Mode (Operational) 16 mW max V
8 mW max V
Auto Standby-Mode (Static) 450 µW max V
270 µW max V
Auto Shutdown-Mode (Static) 5 µW max V
3 µW max V
Full Shutdown-Mode 5 µW max V
= 5V.
DD
= 3V.
DD
= 5V.
DD
= 3V.
DD
= 5V.
DD
= 3V.
DD
= 5V.
DD
3 µW max VDD = 3V.
NOTES
1
Temperature ranges as follows: B Versions: –40°C to +85°C.
2
See Terminology Section
3
Bit 9 in the Control register set to 1
4
Bit 9 in the Control register set to 0
5
This device is operational with an external reference in the range 0.1 V to 3.5 V.
6
Sample tested @ +25°C to ensure compliance.
Specifications subject to change without notice.
REV. PrA
–5–
Page 6
PRELIMINARY TECHNICAL DATA
AD7936/AD7935
( VDD = V F
CLKIN
TIMING SPECIFICATIONS
Limit at T
MIN
, T
MAX
1,2, 3
Parameter AD7936 AD7935 Units Description
4
f
CLKIN
10 10 kHz min 20 20 MHz max
t
quiet
t
convert
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
t
9
t
10
5
t
11
6
t
12
100 100 ns min Minimum time between conversions TBD TBD ns max Conversion Time 100 100 ns min CONVST pulsewidth 0 0 ns min CS to WR setup time 0 0 ns max CS to WR hold time 55 5 5 ns min WR Pulse Width 10 1 0 ns min Data Setup time before WR 5 1/2 t
CLKIN
5 ns min Data Hold after WR
1/2 t
CLKIN
ns min New data valid before falling edge of BUSY
0 0 ns min CS to RD setup time 0 0 ns max CS to RD hold time 55 50
55 ns min RD Pulse Width
50 ns max Data access time after RD 5 5 ns min Bus relinquish time after RD 40 40 ns max Bus relinquish time after RD
t
13
t
14
t
15
t
16
t
17
15 1 5 ns min HBEN to RD setup time 5 5 ns min HBEN to RD hold time 60 60 ns min/max Minimum time between Reads 0 0 ns min HBEN to WR setup time 5 5 ns max HBEN to RD setup time
=2.7 V to 5.25V, V
DRIVE
= 20MHz, F
= 1.5MSPS; TA = T
SAMPLE
REFIN/VREFOUT
= 2.5V unless otherwise noted,
to T
MIN
, unless otherwise noted.)
MAX
NOTES
1
Sample tested at +25°C to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of V level of 1.6 Volts.
2
See Figure 20 and 21.
3
All timing specifications given above are with a 25pF load capacitance.
4
Mark/Space ratio for the SCLK input is 40/60 to 60/40.
5
The time required for the output to cross 0.4 V or 0.7 x V
6
t12 is derived form the measured time taken by the data outputs to change 0.5 V. The measured number is then extrapolated back to remove the effects of charging or discharging the 25 pF capacitor. This means that the time, t12 quoted in the timing characteristics is the true bus relinquish time of the part and is independent of the bus loading.
Specifications subject to change without notice.
DRIVE
V.
) and timed from a voltage
DD
–6–
REV. PrA
Page 7
PRELIMINARY TECHNICAL DATA
AD7936/AD7935
ABSOLUTE MAXIMUM RATINGS
(TA = +25°C unless otherwise noted)
1
VDD to AGND/DGND . . . . . . . . . . . . . . . . . –0.3 V to 7 V
to AGND/DGND . . . . . . . . . . . . . . . –0.3 V to 7 V
V
DRIVE
Analog Input Voltage to AGND . –0.3 V to V
+ 0.3 V
DD
Digital Input Voltage to DGND . . . . . . . . . . –0.3 V to 7 V
to V
V
DRIVE
Digital Output Voltage to AGND –0.3 V to V REF
to AGND . . . . . . . . . ........–0.3 V to VDD + 0.3 V
IN
Input Current to Any Pin Except Supplies
. . . . . . . . . . . . . . . . . . . . . . . . .
DD
–0.3 V to VDD + 0.3 V
+ 0.3 V
DD
2
. . . . ±10 mA
Operating Temperature Range
Commercial (B Version) . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . +150°C
Thermal Impedance . . . . . . . . . . . . . 97.9°C/W (TSSOP
θ
JA
Thermal Impedance . . . . . . . . . . . . . . 14°C/W (TSSOP)
θ
JC
Lead Temperature, Soldering
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . +215°C
Infared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . +220°C
E S D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 kV
NOTES
1
Stresses above those listed under “Absolute Maximum Ratings” may
cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
2
Transient currents of up to 100 mA will not cause SCR latch up.
ORDERING GUIDE
Linearity Package Package
Model Range Error (LSB)1 Option Descriptions
AD7936 -40°C to +85°C ±1 RU-28 TSSOP AD7935 -40°C to +85°C ±1 RU-28 TSSOP EVAL-ADxxxxCB EVAL-CONTROL BRD2
NOTES
1
Linearity error here refers to integral linearity error.
2
This can be used as a stand-alone evaluation board or in conjunction with the Evaluation Board Controller for evaluation/demonstration purposes.
3
Evaluation Board Controller. This board is a complete unit allowing a PC to control and communicate with all Analog Devices evaluation boards
ending in the CB designators. The following needs to be ordered to obtain a complete evaluation kit: the ADC Evaluation Board (EVAL­ADxxxxCB), the EVAL-CONTROL BRD2 and a 12 V ac transformer. See the ADxxxx evaluation board technical note for more details.
2
3
Evaluation Board Controller Board
CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7936/AD7935 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
REV. PrA
–7–
Page 8
AD7936/AD7935
PRELIMINARY TECHNICAL DATA
PIN CONFIGURATION TSSOP
VIN7
V
HBEN
DB0
DB1
DB3
DB4
DB5
DB6
DB7
V
DRIVE
DGND
BUSY
CLKIN
DD
DB2
1
AD7936/
2
AD7935
3
4
5
TOP VIEW
6
(Not to
Scale)
7
8
9
10
11
12
13
28
VIN6
27
VIN5
26
VIN4
25
VIN3
24
VIN2
23
VIN1
22
VIN0
21
V
20
REFIN/REFOUT
19
AGND
CS
18
RD
17
WR
16
CONVST
1514
PIN FUNCTION DESCRIPTION
Pin no. Pin Mnemonic Function
1 V
DD
Power Supply Input. The VDD range for the AD7936/AD7935 is from +2.7V to +5.25V. The supply should be decoupled to AGND with a 0.1µF capacitor and a 10µF tantalum capacitor.
2 HBEN High Byte Enable. When HBEN is low, the low byte of data being written to or read from
the AD7936/AD7935 is on DB0 to DB7. When reading from the AD7935, the two LSBs in the low byte are zeros, followed by 6 bits of conversion data. When HBEN is high, the top 4 bits of the data being written to or read from the AD7936/AD7935 are on DB0 to DB3. When reading from the device, DB4 & DB5 of the high byte will contain the ID of the channel for which the conversion result corresponds.
3-10 DB0 to DB7 Data Bits 0 to 7. Three state parallel digital I/O pins that provide the conversion result and
also allow the Control and Shadow registers to be programmed. These pins are controlled by CS, RD and WR. The state of the HBEN input determines which byte of data is written to or read from the bus.The logic high voltage level for these pins is determined by the V
DRIVE
input.
11 V
DRIVE
Logic Power Supply Input. The voltage supplied at this pin determines at what voltage the parallel interface of the AD7936/AD7935 will operate.
12 DGND Digital Ground. This is the ground reference point for all digital circuitry on the AD7936/
AD7935. The DGND and AGND voltages should ideally be at the same potential and must not be more than 0.3 V apart, even on a transient basis.
13 BUSY Busy Output. Logic output indicating the status of the conversion. The BUSY output goes
high following the falling edge of CONVST and stays high for the duration of the conversion. Once the conversion is complete and the result is available in the output register, the BUSY output will go low. The track/hold returns to track mode just prior to the falling edge of BUSY and the acquisition time for the part begins when BUSY goes low.
14 CLKIN Master Clock Input. The clock source for the conversion process is applied to this pin.
Conversion time for the AD7936 takes 12 clock cycles while conversion time for the AD7935 takes 10 clock cycles. The frequency of the master clock input therefore determines the conversion time and achievable throughput rate.
–8–
REV. PrA
Page 9
PRELIMINARY TECHNICAL DATA
AD7936/AD7935
PIN FUNCTION DESCRIPTION
Pin no. Pin Mnemonic Function
15 CONVST Conversion Start Input. Following power down, when operating in Auto-shutdown or Auto
STBY modes, a rising edge on CONVST is used to power up the device. A falling edge on CONVST is used to initiate a conversion. The track/hold goes from track to hold mode on the falling edge of CONVST and the conversion process is initiated at this point.
16 WR Write Input. Active low logic input used in conjunction with CS to write data to the internal
registers.
17 RD Read Input. Active low logic input used in conjunction with CS to access the conversion
result. The conversion result is placed on the data bus following the falling edge of both CS and RD.
18 CS Chip Select. Active low logic input used in conjunction with RD , WR and HBEN to Read
conversion data or to Write data to the internal registers. When reading, depending on the state of the HBEN input, the low or high byte of data is placed on to the data bus following the falling edge of both CS and RD.
19 AGND Analog Ground. This is the ground reference point for all analog circuitry on the AD7936/
AD7935. All analog input signals and any external reference signal should be referred to this AGND voltage. The AGND and DGND voltages should ideally be at the same potential and must not be more than 0.3 V apart, even on a transient basis.
20 V
21-28 V
REFIN/VREFOUT
0 - VIN7 Analog Input 0 to Analog Input 7. Eight analog input channels that are multiplexed into the
IN
Reference Input/Output. This pin is connected to the internal reference and is the reference source for the ADC. The nominal internal reference voltage is 2.5 V and this appears at this pin. This pin can be overdriven by an external reference. The input voltage range for the external reference is 0.1 V to 3.5 V.
on-chip track/hold. The analog inputs can be programmed to be eight single ended inputs, four fully differential pairs, four pseudo differential pairs or 7 pseudo differential inputs by setting the MODE bits in the Control register appropriately (see Table III). The analog input channel to be converted can either be selected by writing to the Address bits (ADD2, ADD1 & ADD0) in the control register prior to the conversion, or the on-chip sequencer can be used. The address bits in conjunction with the SEQ and SHDW bits in the Control register allow the Sequencer and Shadow register to be programmed. The input range for all input channels can either be 0V to V complement, depending on the states of the RANGE and CODING bits in the Control register. Any unsed input channels should be connected to AGND to avoid noise pickup.
or 0V to 2 x V
REF
and the coding can be binary or two’s
REF
REV. PrA
–9–
Page 10
AD7936/AD7935
PRELIMINARY TECHNICAL DATA
TERMINOLOGY Integral Nonlinearity
This is the maximum deviation from a straight line pass­ing through the endpoints of the ADC transfer function. The endpoints of the transfer function are zero scale, a point 1 LSB below the first code transition, and full scale, a point 1 LSB above the last code transition.
Differential Nonlinearity
This is the difference between the measured and the ideal 1 LSB change between any two adjacent codes in the ADC.
Offset Error
This is the deviation of the first code transition (00 . . .
000) to (00 . . . 001) from the ideal, i.e AGND + 1 LSB
Offset Error Match
This is the difference in offset error between any two chan­nels.
Gain Error
This is the deviation of the last code transition (111 . . .
110) to (111 . . . 111) from the ideal (i.e., V
REFIN
– 1
LSB) after the offset error has been adjusted out.
Gain Error Match
This is the difference in Gain error between any two chan­nels.
Zero Code Error
This applies when using the 2’s complement output cod­ing option, in particular to the 2 x V
-V
REFIN
to +V
biased about the V
REFIN
input range with
REFIN
REFIN
point. It is the deviation of the mid scale transition (all 0s to all 1s) from the ideal V
voltage, i.e. V
IN
REFIN
- 1 LSB.
Zero Code Error Match
This is the difference in Zero Code Error between any two channels.
Positive Gain Error
This applies when using the 2’s complement output cod­ing option, in particular to the 2 x V
-V
REFIN
to +V
biased about the V
REFIN
input range with
REFIN
point. It is the
REFIN
deviation of the last code transition (011. . .110) to (011 . . . 111) from the ideal (i.e., +V
- 1 LSB) after the
REFIN
Zero Code Error has been adjusted out.
Positive Gain Error Match
This is the difference in Positive Gain Error between any two channels.
Negative Gain Error
This applies when using the 2’s complement output cod­ing option, in particular to the 2 x V
-V
REFIN
to +V
biased about the V
REFIN
input range with
REFIN
point. It is the
REFIN
deviation of the first code transition (100 . . . 000) to (100 . . . 001) from the ideal (i.e., -REF
+ 1 LSB) after the
IN
Zero Code Error has been adjusted out.
Negative Gain Error Match
This is the difference in Negative Gain Error between any two channels.
Channel-to-Channel Isolation
Channel-to-Channel Isolation is a measure of the level of crosstalk between channels. It is measured by applying a fullscale 390 kHz sine wave signal to all 7 nonselected input channels and determining how much that signal is attenuated in the selected channel with a 50 kHz signal.
The figure is given worse case across all 8 channels for the AD7936/AD7935.
PSR (Power Supply Rejection)
Varations in power supply will affect the full scale transi-
–10–
tion, but not the converter’s linearity. Power supply rejec­tion is the maximum change in full-scale transition point due to a change in power-supply voltage from the nominal value. See Typical PerformancePlots.
Track/Hold Acquisition Time
The track/hold amplifier returns into track mode and the end of conversion. Track/Hold acquisition time is the time required for the output of the track/hold amplifier to reach its final value, within ±1/2 LSB, after the end of conver­sion.
Signal to (Noise + Distortion) Ratio
This is the measured ratio of signal to (noise + distortion) at the output of the A/D converter. The signal is the rms amplitude of the fundamental. Noise is the sum of all nonfundamental signals up to half the sampling frequency
/2), excluding dc. The ratio is dependent on the number
(f
S
of quantization levels in the digitization process; the more levels, the smaller the quantization noise. The theoretical signal to (noise + distortion) ratio for an ideal N-bit con­verter with a sine wave input is given by:
Signal to (Noise + Distortion) = (6.02 N + 1.76) dB
Thus for a 12-bit converter, this is 74 dB and for a 10-bit converter, this is 61.96dB.
Total Harmonic Distortion
Total harmonic distortion (THD) is the ratio of the rms sum of harmonics to the fundamental. For the AD7936/ AD7935, it is defined as:
2
2
2
2
2
+ V
5
6
THD (dB ) = 20 log
+ V
+ V
V
2
3
+ V
4
V
1
where V1 is the rms amplitude of the fundamental and V2, V
, V4, V5 and V6 are the rms amplitudes of the second
3
through the sixth harmonics.
Peak Harmonic or Spurious Noise
Peak harmonic or spurious noise is defined as the ratio of the rms value of the next largest component in the ADC output spectrum (up to f
/2 and excluding dc) to the rms
S
value of the fundamental. Normally, the value of this speci­fication is determined by the largest harmonic in the spectrum, but for ADCs where the harmonics are buried in the noise floor, it will be a noise peak
Intermodulation Distortion
With inputs consisting of sine waves at two frequencies, fa and fb, any active device with nonlinearities will create distortion products at sum and difference frequencies of mfa ± nfb where m, n = 0, 1, 2, 3, etc. Intermodulation distor­tion terms are those for which neither m nor n are equal to zero. For example, the second order terms include (fa + fb) and (fa – fb), while the third order terms include (2fa + fb), (2fa – fb), (fa + 2fb) and (fa – 2fb).
The AD7936/AD7935 is tested using the CCIF standard where two input frequencies near the top end of the input bandwidth are used. In this case, the second order terms are usually distanced in frequency from the original sine waves while the third order terms are usually at a frequency close to the input frequencies. As a result, the second and third order terms are specified separately. The calculation of the intermodulation distortion is as per the THD specification where it is the ratio of the rms sum of the individual distor­tion products to the rms amplitude of the sum of the fundamentals expressed in dBs.
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0
0
000
T
I
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L
E
0000
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E
L
T
0
I
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0
000
0000
TITLE
TPC1 PSRR versus Supply ripple
Frequencywith supply decoupling
0
E
L
T
0
I
T
6*,
PRELIMINARY TECHNICAL DATA
TYPICAL PERFORMANCE CHARACTERISTICS
AD7936 Performance Curves
0
E
L
T
I
T
E
L
T
0
I
T
0
000
TPC5. AD7936 SINAD vs Analog Input
Frequency for various Supply Volt-
0
6*,
0000
TITLE
ages
TPC9. Change in INL vs V
0
E
L
T
0
I
T
AD7936/AD7935
0
0
0
000
6*,
0000
TITLE
V
= 5V
DD
6*,
REF
for
0
000
0000
TITLE
TPC2 PSRR versus Supply ripple
Frequencywithout supply decoupling
0
E
L
T
0
I
T
0
000
TPC3 Internal V
6*,
0000
TITLE
Error vs
REF
Temperature
0
E
L
T
0
I
T
0
000
6*,
0000
TITLE
TPC6. FFT @ VDD = 5V
0
E
L
T
0
I
T
0
000
6*,
0000
TITLE
TPC7. Typical DNL @ VDD = 5V
0
0
000
0000
TITLE
TPC10. Change in DNL vs V
VDD = 5V
0
E
L
T
0
I
T
0
000
6*,
0000
TITLE
TPC11. Change in ENOB vs V
VDD = 5V
REF
REF
for
for
E
L
T
0
I
T
0
000
TPC4 V
0000
REF
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out vs Rsource
E
L
T
0
I
T
0
000
6*,
0000
TITLE
TPC8. Typical INL @ VDD = 5V
–11–
TPC12. Offset vs V
REF
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AD7936/AD7935
PRELIMINARY TECHNICAL DATA
E
L
T
I
T
0
0
0
000
6*,
0000
TITLE
AD7935 Performance Curves
0
E
L
T
0
I
T
6*,
0
000
0000
TITLE
E
L
T
I
T
0
0
0
000
6*,
0000
TITLE
0
E
L
T
0
I
T
0
000
6*,
0000
TITLE
TPC13. Histogram of codes TPC13. FFT @ VDD = 5V TPC 14. Typical DNL TPC 15. Typcial INL
@ VDD = 5v @ V
= 5V @ VDD = 5V
DD
ON-CHIP REGISTERS
The AD7936/AD7935 has two on-chip registers that are necessary for the operation of the device. These are the Control register, used to set up different conditions and the Shadow register, used to program the analog input channels to be converted on.
CONTROL REGISTER
The Control Register on the AD7936/AD7935 is a 12-bit, write-only register. Data is written to this register using the CS and WR pins. The Control Register is shown below and the functions of the bits are described in Table I.
MSB
D11
D1D2D3D4D6D7D8D9D10 D5
PM1 PM0 CODING REF ADD2 ADD1 ADD0 MODE1 MODE0 SHDW SEQ RANGE
LSB
D0
Table I. Control Register Bit Function Description
Bit Mnemonic Comment
11, 10 PM1 Power Management Bits. These two bits are used to select the power mode of operation. The
PM0 user can choose between either normal mode or various power down modes of operation as shown
in Table II.
9 C O DI N G This bit selects the output coding of the conversion result. If this bit is set to 0, the output
coding will be 2s complement. If this bit is set to 1, the output coding will be straight binary.
8 R E F This bit selects whether the internal or an external reference is used to perform the conversion. If
this bit is logic 0, the internal reference is selected and if it is 1, an external reference should be applied (see the Reference Section).
7, 6, 5 ADD2, These three address bits are used to either select which analog input channel is to be converted on
ADD1, in the next conversion if the sequencer is not being used, or to select the final channel in a ADD0 consecutive sequence when the sequencer is being used as described in Table IV. The selected
input channel is decoded as shown in Table III.
4,3 MODE1, The two Mode pins select the type of analog input on the eight V
pins. The AD7936/AD7935
IN
MODE0 can have either 8 Single Ended inputs, 4 Fully Differential inputs, 4 Pseudo Differential inputs or
7 Pseudo Differential inputs. See Table III.
2 SHDW The SHDW bit in the control register is used in conjunction with the SEQ bit to control the
sequencer function and access the SHADOW register. See Table IV.
1 S E Q The SEQ bit in the control register is used in conjunction with the SHDW bit to control the
sequencer function and access the SHADOW register. See Table IV.
0 RANGE This bit selects the analog input range of the AD7936/AD7935. If it is set to 0 then the analog
input range will extend from 0V to V extend from 0V to 2xV
. When this range is selected, AVDD must be 4.75 V to 5.25 V.
REF
. If it is set to 1 then the analog input range will
REF
–12–
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PRELIMINARY TECHNICAL DATA
AD7936/AD7935
Table II. Power Mode Selection using the Power Management Bits in the Control Register
PM1 PM2 Mode Description
1 1 Normal Mode When operating in normal mode, all circuitry is fully powerered up at all times. 1 0 Full Shutdown When the AD7936/AD7935 enters this mode, all circuitry is powered down. The
information in the Control Register is retained.
0 1 Auto Shutdown When operating in Auto Shutdown mode, the AD7936/AD7935 will enter Full Shutdown
mode at the end of each conversion. In this mode, all circuitry is powered down.
0 0 Auto Standby When the AD7936/AD7935 enter this mode, all circuitry is powered down excluding the
internal reference. This mode is similar to Auto Shutdown and allows the part to power up in 1µsec.
Table III. Analog Input Type Selection
Channel Address MODE0=0, MODE1=0 MODE0=0, MODE1=1 MODE0=1, MODE1=0 MODE0=1, MODE1=1
8 Single-Ended I/P 4 Fully Differential 4 Pseudo Differential 7 Pseudo Differential
Channels I/P Channels I/P Channels I/P Channels
ADD2 ADD1 ADD0 V
0 0 0 VIN0 AGND VIN0 VIN1 VIN0 VIN1 VIN0 VIN7 0 0 1 VIN1 AGND VIN1 VIN0 VIN1 VIN0 VIN1 VIN7 0 1 0 VIN2 AGND VIN2 VIN3 VIN2 VIN3 VIN2 VIN7 0 1 1 VIN3 AGND VIN3 VIN2 VIN3 VIN2 VIN3 VIN7 1 0 0 VIN4 AGND VIN4 VIN5 VIN4 VIN5 VIN4 VIN7 1 0 1 VIN5 AGND VIN5 VIN4 VIN5 VIN4 VIN5 VIN7 1 1 0 VIN6 AGND VIN6 VIN7 VIN6 VIN7 VIN6 VIN7 1 1 1 VIN7 AGND VIN7 VIN6 VIN7 VIN6 VIN7 VIN7
V
IN+
IN-
V
V
IN+
IN-
V
V
IN+
IN-
V
V
IN+
IN-
SEQUENCER OPERATION
The configuration of the SEQ and SHDW bits in the control register allows the user to select a particular mode of operation of the sequencer function. Table IV outlines the four modes of operation of the Sequencer.
Table IV. Sequence Selection
SEQ SHDW Sequence Type
0 0 This configuration is selected when the sequence function is not used. The analog input channel selected on
each individual conversion is determined by the contents of the channel address bits ADD2-ADD0 in each prior write operation. This mode of operation reflects the normal operation of a multi-channel ADC, without the Sequencer function being used, where each write to the AD7936/35 selects the next channel for conversion.
0 1 This configuration selects the Shadow register for programming. The following two write operations will load
the data to the Shadow Register. This will program the sequence of channels to be converted on continuously after each CONVST falling edge (see the Shadow register description and Table V).
1 0 If the SEQ and SHADOW bits are set in this way then the sequence function will not be interrupted upon
completion of the WRITE operation. This allows other bits in the Control Register to be altered between conversions while in a sequence without terminating the cycle.
1 1 This configuration is used in conjunction with the Channel Address bits (ADD2 -ADD0) to program
continuous conversions on a consecutive sequence of channels from Channel 0 through to a selected final channel as determined by the Channel Address bits in the Control Register.
SHADOW REGISTER
The Shadow Register on the AD7936/AD7935 is an 8-bit, write-only register. Data is loaded from DB0 to DB11 on the ris­ing edge of WR. The 8 LSBs will be loaded into the Shadow register. The information is written into the Shadow Register provided the SEQ and SHADOW bits in the control register were set to 0 & 1 respectively in the previous write to the Con­trol Register. Each bit represents an analog input from channel 0 through to channel 7. A sequence of channels may be selected through which the AD7936/AD7935 will cycle with each consecutive conversion after the write to the Shadow regis­ter. To select a sequence of channels, the associated channel bit must be set for each analog input. The AD7936/AD7935 will continuously cycle through the selected channels in ascending order, beginning with the lowest channel, until a write operation occurs with the SEQ and SHADOW bits configured in any way except 1,0 (see Table IV). The bit functions are outlined in Table V.
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VIN0
Table V. Shadow Register Bit Functions
VIN7VIN6VIN5VIN4VIN3VIN2VIN1
–13–
Page 14
AD7936/AD7935
PRELIMINARY TECHNICAL DATA
CIRCUIT INFORMATION
The AD7936/AD7935 are fast, 8 channel, 12-&10-bit, single supply, Analog to Digital converters. The parts can be operated from a either a 2.7 V to 3.6 V or a 4.75 V to
5.25 V power supply and feature throughput rates up to
1.5MSPS.
The AD7936/AD7935 provide the user with an on-chip track/hold, an internal accurate reference, an analog to digital converter, and a byte parallel interface housed in a 28-lead TSSOP.
The AD7936/AD7935 have eight analog input channels which can be configured to be 8 single ended inputs, 4 fully differential pairs, 4 pseudo differential pairs or 7 pseudo differential inputs. There is an on-chip user-pro­grammable channel sequencer which allows the user to select a sequence of channels through which the ADC can cycle.
The analog input range for the AD7936/AD7935 is 0 to V
or 0 to 2 x V
REF
RANGE bit in the Control register. For the 0 to 2 x V
depending on the status of the
REF
REF
range the part must be operated from a 4.75 V to 5.25 V supply.
The AD7936/AD7935 provides flexible power manage­ment options to allow the user to achieve the best power performance for a given throughput rate. These options are selected by programming the power management bits, PM1 and PM0, in the Control Register.
CONVERTER OPERATION
The AD7936/AD7935 is a successive approximation ADC based around two capacitive DACs. Figures 1 and 2 show simplified schematics of the ADC in Acquisition and Con­version phase respectively. The ADC comprises of Control Logic, a SAR and two capacitive DACs. Figure 1 shows the operation of the ADC in Differential/Pseudo Differential Mode. Single Ended mode operation is simi­lar but V
is internally tied to AGND. In acquisition
IN-
phase, SW3 is closed and SW1 and SW2 are in position A, the comparator is held in a balanced condition and the sampling capacitor arrays acquire the differential signal on the input.
CAPACITIVE
DAC
SW3
COMPARATOR
CONTROL
LOGIC
CAPACITIVE
DAC
C
REF
s
C
s
V
IN+
V
IN-
B
A
SW1 SW2
A
B
V
disconnected once the conversion begins. The Control Logic and the charge redistribution DACs are used to add and subtract fixed amounts of charge from the sampling capacitor arrays to bring the comparator back into a bal­anced condition. When the comparator is rebalanced, the conversion is complete. The Control Logic generates the ADC’s output code. The output impedances of the sources driving the V
and the V
IN+
pins must be
IN-
matched otherwise the two inputs will have different set­tling times, resulting in errors.
CAPACITIVE
DAC
SW3
COMPARATOR
CONTROL
LOGIC
CAPACITIVE
DAC
C
REF
s
C
s
V
IN+
V
IN-
B
A
SW1
SW2
A B
V
Figure 2. ADC Conversion Phase
ADC TRANSFER FUNCTION
The output coding for the AD7936/AD7935 is either straight binary or two’s complement, depending on the status of the CODING bit in the control register. The designed code transitions occur at successive LSB values (i.e. 1LSB, 2LSBs, etc.) and the LSB size is V for the AD7936 and V
/1024 for the AD7935. The ideal
REF
REF
/4096
transfer characteristics of the AD7936/AD7935 for both straight binary and twos complement output coding are shown in Figures 3 and 4 respectively.
111...111
111...110
111...000
011...111
ADC CODE
000...010
000...001
000...000
0V
NOTE: V
1LSB
1LSB = V 1LSB = V
ANALOG INPUT
is either V
REF
/4096 (AD7936)
REF
/1024 (AD7935)
REF
+V
REF
or 2 X V
REF
-1LSB
REF
Figure 3. AD7936/AD7935 Ideal Transfer Characteristic
with Straight Binary Output Coding
Figure 1. ADC Acquisition Phase
When the ADC starts a conversion (figure 2), SW3 will open and SW1 and SW2 will move to position B, causing the comparator to become unbalanced. Both inputs are
–14–
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Page 15
011...111
011...110
000...001
000...000
111...111
ADC CODE
100...010
100...001
100...000
-V
REF
1LSB = 2xV
1LSB = 2xV
+ 1LSB
ANALOG INPUT (V
PRELIMINARY TECHNICAL DATA
ANALOG INPUT STRUCTURE
/4096 (AD7936)
REF
/1024 (AD7935)
REF
0LSB
- V
IN+
IN-
+V
- 1LSB
REF
)
Figure 6 shows the equivalent circuit of the analog input structure of the AD7936/AD7935 in Differential/Pseudo Differential Mode. In Single Ended mode, V nally tied to AGND. The four diodes provide ESD protection for the analog inputs. Care must be taken to ensure that the analog input signals never exceed the sup­ply rails by more than 300mV. This will cause these diodes to become forward biased and start conducting into the substrate. These diodes can conduct up to 10mA without causing irreversible damage to the part.
The capacitors C1, in figure 6 are typically 4pF and can primarily be attributed to pin capacitance. The resistors are lumped components made up of the on-resistance of the switches. The value of these resistors is typically about 100. The capacitors, C2, are the ADC’s sampling ca­pacitors and have a capacitance of 16pF typically.
AD7936/AD7935
is inter-
IN-
Figure 4. AD7936/AD7935 Ideal Transfer Characteristic
with Twos Complement Output Coding
TYPICAL CONNECTION DIAGRAM
Figure 5 shows a typical connection diagram for the AD7936/AD7935. The AGND and DGND pins are connected together at the device for good noise supression. The V
REFIN/VREFOUT
pin is decoupled to AGND with a
0.47µF capacitor to avoid noise pickup if the internal reference is used. Alternatively, V
REFIN/VREFOUT
can be connected to a external reference source. In this case, the V
REFIN/VREFOUT
pin should be decoupled to AGND with a
0.1µF capacitor. In both cases the analog input range can either be 0V to V
(Range bit = 1) or 0V to 2 x V
REF
REF
(Range bit = 0). The analog input configuration can be either 8 Single Ended inputs, 4 Differential Pairs, 4 Pseudo Differential Pairs or 7 Pseudo Differential Inputs (see Table III). The V or 5V supply. The voltage applied to the V
pin is connected to either a 3V
DD
DRIVE
input controls the voltage of the digital interface and here, it is connected to the same 3V supply of the microprocessor to allow a 3V logic interface (See the digital inputs section).
+3V/+5V
0.1µF 10µF
SUPPLY
For ac applications, removing high frequency components from the analog input signal is recommended by the use of an RC low-pass filter on the relevant analog input pins. In applications where harmonic distortion and signal to noise ratio are critical, the analog input should be driven from a low impedance source. Large source impedances will significantly affect the ac performance of the ADC. This may necessitate the use of an input buffer amplifier. The choice of the opamp will be a function of the particu­lar application.
V
DD
D
V
IN+
C1
V
IN-
C1
D
V
DD
D
D
C2
R1
C2
R1
0 to V
0 to 2 x V
2.5V VREF
REV. PrA
REF
V
/
REF
V
AD7936/AD7935
DD
VIN0
VIN7
AGND
DGND
REFIN/VREFOUT
0.1µF External Vref
0.47µF Internal Vref
HBEN
CLKIN
CS
RD
WR
BUSY
CONVST
DB0
DB7
V
DRIVE
0.1µF
Figure 5. Typical Connection Diagram
10µF
µC/µP
+3V
SUPPLY
Figure 6. Equivalent Analog Input Circuit.
Conversion Phase - Switches Open
Track Phase - Switches Closed
When no amplifier is used to drive the analog input, the source impedance should be limited to low values. The maximum source impedance will depend on the amount of Total Harmonic Distortion (THD) that can be toler­ated. The THD will increase as the source impedance increases and performance will degrade. Figure 7 shows a graph of the THD versus analog input signal frequency for different source impedances for both V
= 5 V and 3
DD
V.
–15–
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AD7936/AD7935
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connection diagram when operating the ADC in single ended mode.
+2.5
+1.25V
-1.25
0V
V
V
IN
R
R
3R
R
V
0V
V
AD7936/
0
IN
AD7935*
V
V
IN7
REFOUT
0
000
0000
TITLE
Figure 7.THD vs Analog Input Frequency for Various
Source Impedances
Figure 8 shows a graph of THD versus analog input fre­quency for various supplies, while sampling at 1.5MHz with an SCLK of 20 MHz. In this case the source imped­ance is 10.
0
E
L
T
0
I
T
6*,
*Addition Pins Omitted for Clarity
0.1µF
Figure 9. Single Ended Mode Connection Diagram
Differential Mode
The AD7936/AD7935 can have 4 Differential Input Pairs by setting the MODE0 and MODE1 bits in the control register to 0 and 1 respectively.
Differential signals have some benefits over single ended signals including noise immunity based on the device’s common mode rejection and improvements in distortion performance. Figure 10 defines the fully differential ana­log input of the AD7936/AD7935.
V
COMMON
MODE
VOLTAGE
REF
P-to-P
V
REF
P-to-P
V
IN+
V
IN-
AD7936/ AD7935*
0
000
0000
TITLE
Figure 8.THD vs Analog Input Frequency for various
Supply Voltages
THE ANALOG INPUTS
The AD7936/AD7935 has software selectable analog in­put configurations. The user can choose either 8 Single Ended Inputs, 4 Fully Differential Pairs, 4 Pseudo Differ­ential Pairs or 7 Pseudo Differential Inputs. The analog input configuration is chosen by setting the MODE0/ MODE1 bits in the internal control register (See Table III).
Single Ended Mode
The AD7936/AD7935 can have 8 single ended analog input channels by setting the MODE0 and MODE1 bits in the control register both to 0. In applications where the signal source has a high impedance, it is recommended to buffer the analog input before applying it to the ADC. The internal reference is used to externally bias up a bipo­lar analog input signal. Figure 9 shows a typical
–16–
*Additional Pins Omitted for Clarity
Figure 10. Differential Input Definition
The amplitude of the differential signal is the difference between the signals applied to the V each differential pair (i.e. V
IN+
- V
IN+
). V
IN-
and V
and V
IN+
pins in
IN-
IN-
should be simultaneously driven by two signals each of amplitude V of the differential signal is therefore -V to-peak (i.e. 2 x V
that are 180° out of phase. The amplitude
REF
). This is regardless of the common
REF
to +V
REF
REF
peak-
mode (CM). The common mode is the average of the two signals, i.e. (V
IN+
+ V
)/2 and is therefore the voltage
IN-
that the two inputs are centered on. This results in the span of each input being CM ± V to be set up externally and its range varies with V the value of V
increases, the common mode range de-
REF
/2. This voltage has
REF
REF
. As
creases. When driving the inputs with an amplfier, the actual common mode range will be determined by the amplifier’s output voltage swing.
Figures 11 and 12 show how the common mode range typically varies with V
for both a 5 V and a 3 V power
REF
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PRELIMINARY TECHNICAL DATA
AD7936/AD7935
supply. The common mode must be in this range to guar­antee the functionality of the AD7936/AD7935. When a conversion takes place, the common mode is re­jected resulting in a virtually noise free signal of amplitude
-V
to +V
REF
corresponding to he digital codes of 0 to
REF
4095.
0
E
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T
0
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6*,
0
000
Figure 11. Input Common Mode Range versus V
(VDD = 5V and V
0
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0000
TITLE
(max) = 3.5V)
REF
6*,
REF
Differential Amplifier
An ideal method of applying differential drive to the AD7936/ AD7935 is to use a differential amplifier such as the AD8138. This part can be used as a single ended to differential amplifier or as a differential to differential amplifier. In both cases the analog input needs to be bipolar. It also provides common mode level shifting and buffering of the bipolar input signal. Figure 13 shows how the AD8138 can be used as a single ended to differential amplifier. The positive and negative outputs of the AD8138 are connected to the respec­tive inputs on the ADC via a pair of series resistors to minimize the effects of switched capacitance on the front end of the ADC. The RC low pass filter on each analog input is recommended in ac applications to remove high frequency components of the analog input. The architecture of the AD8138 results in outputs that are very highly balanced over a wide frequency range without requiring tightly matched external components.
If the analog input source being used has zero impedance then all four resistors (Rg1, Rg2, Rf1, Rf2) should be the same. If the source has a 50 impedance and a 50 termination for example, the value of Rg2 should be increased by 25  to balance this parallel impedance on the input and thus ensure that both the positive and negative analog inputs have the same gain (see figure 13). The outputs of the amplifier are perfectly matched, balanced differential outputs of identical amplitude and are exactly 180
o
out of phase. The AD8138 is specified with 3 V, 5 V and ±5 V power supplies but the best results are obtained when it is supplied by ±5 V. A lower cost device that could also be used in this configuration with slight differences in characteristics to the AD8138 but with similar performance and operation is the AD8132.
0
000
Figure 12. Input Common Mode Range versus V
(VDD= 3V and V
0000
TITLE
(max) = 2.2V)
REF
REF
Driving Differential Inputs
Differential operation requires that V multaneously driven with two equal signals that are 180
and V
IN+
be si-
IN-
o
out of phase. The common mode must be set up exter­nally and has a range which is determined by V
REF
, the power supply and the particular amplifier used to drive the analog inputs. Differential modes of operation with either an ac or dc input, provide the best THD performance over a wide frequency range. Since not all applications have a signal preconditioned for differential operation, there is often a need to perform single ended to differen­tial conversion.
REV. PrA
–17–
TBD
Figure 13. Using the AD8138 as a Single Ended to
Differential Amplifier
Pseudo Differential Mode
The AD7936/AD7935 can have 4 Pseudo Differential pairs or 7 Pseudo Differential inputs by setting the MODE0 and MODE1 bits in the control register to 1, 0 and 1, 1 respectively. In the case of the 4 Pseudo differen­tial pairs, V must have an amplitude of V
is connected to the signal source which
IN+
to make use of the full
REF
dynamic range of the part. A DC input in the range
-100mV to +100mV is applied to the V
pin . The volt-
IN-
age applied to this input provides an offset from ground or
Page 18
AD7936/AD7935
PRELIMINARY TECHNICAL DATA
a pseudo ground for the V
input. In the case of the 7
IN+
Pseudo Differential inputs, the 7 inputs are referred to the voltage applied to V
. The benefit of pseudo differential
IN7
inputs is that they separate the analog input signal ground from the ADCs ground allowing DC common mode volt­ages to be cancelled. Figure 14 shows a connection diagram for Pseudo Differential Mode.
V
REF
P-to-P
DC INPUT VOLTAGE RANGE ±100mV
*ADDITIONAL PINS OMITTED FOR CLARITY
V
V
V
REF
IN+
IN-
0.1µF
AD7936/AD7935*
Figure 14. Pseudo Differential Mode Connection Diagram
ANALOG INPUT SELECTION
As illustrated in Table III, the user can set up their analog input configuration by setting the values in the MODE0 and MODE1 bits in the Control Register. Assuming the configuration has been chosen, there are different ways of selecting the analog input to be converted on depending on the state of the SEQ and SHDW bits in the Control register.
Using the Sequencer
Programmable Sequence (SEQ = 0, SHDW = 1 )
The AD7936/AD7935 may be configured to automatically cycle through a number of selected channels using the on­chip programmable sequencer by setting SEQ = 0 and SHDW = 1 in the Control register. The Analog input channels to be converted on are selected by programming the relevent bits in the Shadow Register, see Table V.
Once the shadow register has been programmed with the required sequence, the next conversion executed will be on the lowest channel programmed in the SHADOW register. The next conversion will be on the next highest channel in the sequence and so on. When the last channel in the sequence has been converted, the ADC will return to the first channel selected in the Shadow register
It is not necessary to write to the control register once a sequencer operation has been initiated. The WRITE in­put must be kept high to ensure that the Control Register is not accidently overwritten, or a sequence operation interrupted. If the control register is written to at any time during the sequence then it must be ensured that the SEQ and SHDW bits are set to 1,0 to avoid interrupting the automatic conversion sequence. This pattern will con­tinue until such time as the AD7936/AD7935 is written to and the SEQ and SHADOW bits are configured with any bit combination except 1,0. On completion of the se­quence, the AD7936/AD7935 sequencer will return to the first selected channel in the Shadow register and com­mence the sequence again. Figure 16 shows a flow chart of the Programmable Sequence operation
Normal Multichannel Operation (SEQ=SHDW= 0)
Any one of eight analog input channels or 4 pairs of chan­nels may be selected for conversion in any order by setting the SEQ & SHDW bits in the Control register both to 0. The channel to be converted on is selected by writing to the address bits ADD2 - ADD0 in the control register to program the multiplexer prior to the conversion. This mode of operation is of a normal multichannel ADC where each data write selects the next channel for conver­sion. Figure 15 shows a flow chart of this mode of operation. The channel configurations are shown in table III.
TBD
Figure 15. Normal Multichannel Operation Flow Chart
TBD
Figure 16. Programmable Sequence Flow Chart
Consecutive Sequence (SEQ =1, SHDW = 1)
A sequence of consecutive channels can be converted on beginning with channel 0 and ending with a final channel selected by writing to the ADD2-ADD0 bits in the Con­trol register. This is done by setting the SEQ and SHDW bits in the control register both to 1. In this mode, the sequencer can be used without having to write to the Shadow register. Once the control register has been writ­ten to to set this mode up, the next conversion will be on Channel 0, then Channel 1 and so on until the channel selected via the address bits is reached. The cycle will begin again provided the WR input is tied high or if low, the SEQ and SHDW bits set to 1, 0; then the ADC will continue its pre-programmed automatic sequence uninter­rupted. Figure 17 shows the flow chart of the Consecutive Sequence mode.
–18–
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Page 19
PRELIMINARY TECHNICAL DATA
AD7936/AD7935
TBD
Figure 17. Consecutive Sequence Mode Flow Chart
REFERENCE SECTION
The AD7936/AD7935 can operate with either the on chip reference or an external reference. The internal reference is selected by setting the REF bit in the interal Control register to 0. A block diagram of the internal reference circuitry is shown in Figure 18. The internal reference circuitry includes an on-chip 2.5 V band gap reference, and a reference buffer. When using the internal reference the V
REFIN/VREFOUT
with a 0.47µF capacitor. This internal reference not only provides the reference for the analog to digital conversion but can also be used externally in the system. It is recom­mended that the reference output is buffered using an external precision opamp before applying it anywhere in the system.
V
REFIN
V
REFOUT
pin should be decoupled to AGND
BUFFER
ADC
REFERENCE
AD7936/ AD7935
/
Therefore, when operating at V V
can range from 100mV to a maximum value of
REF
3.5V. When V
= 4.75 V, V
DD
= 5 V, the value of
DD
max = 3.17 V.
REF
Example 2:
VINmax = V
VINmax = V
If V
= 3.6V
DD
+ 0.3
DD
+ V
REF
REF
/2
then VINmax = 3.9 V
Therefore 3xV
V
max = 2.6 V
REF
Therefore, when operating at V V
can range from 100mV to a maximum value of
REF
2.4V. When V
/2 = 3.6 V
REF
= 2.7 V, V
DD
= 3 V, the value of
DD
max = 2 V.
REF
These examples show that the maximum reference ap­plied to the AD7936/AD7935 is directly dependant on the value applied to V
DD
.
The performance of the part at different reference values is shown in TBD to TBD. The value of the reference sets the analog input span and the common mode voltage range. Errors in the reference source will result in gain errors in the AD7936/AD7935 transfer function and will add to specified full scale errors on the part. When using an external reference, a capacitor of 0.1µF should be used to decouple the V
pin to AGND.
REF
Table VI lists examples of suitable voltage references that could be used that are available from Analog Devices and Figure 19 shows a typical connection diagram for an ex­ternal reference.
Figure 18. Internal Reference Circuit Block Diagram
Alternatively, an external reference source in the range of 100mV to 3.5V can be applied to the V
REFIN/VREFOUT
pin of the AD7936/AD7935. An external reference is selected by setting the REF bit in the interal Control register to
1.When using an external reference, the V
REFIN/VREFOUT
pin should be decoupled to AGND with a 0.1µF capaci­tor. With a 5 V power supply, the specified reference is
2.5 V and maximum reference is 3.5V. With a 3 V power supply, the specified reference is 2.5V and the maximum reference is 2.6 V. In both cases, the reference is func­tional from 100mV. It is important to ensure that, when chosing the reference value, the maximum analog input range (VINmax) is never greater than V
+ 0.3V to comply with the maxi-
DD
mum ratings of the device. The following two examples calculate the maximum V operating the AD7936/AD7935 at V
input that can be used when
REF
of 5 V and 3 V
DD
respectively.
Example 1:
VINmax = V
VINmax = V
If V
= 5 V
DD
+ 0.3
DD
+ V
REF
REF
/2
then VINmax = 5.3 V
Therefore 3xV
V
max = 3.5 V
REF
/2 = 5.3 V
REF
Table VI Examples of Suitable Voltage References
Reference Output Initial Operating
Voltage Accuracy Current
(% max) (µA)
AD589 1.235 1.2-2.8 50 AD1580 1.225 0.08-0.8 50 REF192 2.5 0.08-0.4 45 REF43 2. 5 0.06-0.1 600 AD780 2.5 0.04-0.2 1000
AD7936/ AD7935*
AD780
8
NC
VDD
0.1µF
10nF
0.1µF
*ADDITIONAL PINS OMITTED FOR CLA RITY
Figure 19. Typical V
OpSel
1
2
3
4
VIN
Te mp
GND
REF
7
2.5 V
6
Vout
Tr im
5
Connection Diagram
NC
NC
NC
V
REF
0.1µF
REV. PrA
–19–
Page 20
AD7936/AD7935
PRELIMINARY TECHNICAL DATA
Digital Inputs
The digital inputs applied to the AD7936/AD7935 are not limited by the maximum ratings which limit the analog inputs. Instead, the digital inputs applied can go to 7V and are not restricted by the AV
+0.3V limit as on the ana-
DD
log inputs. Another advantage of the digital inputs not being re-
stricted by the AV
+ 0.3 V limit is the fact that power
DD
supply sequencing issues are avoided. If any of these in­puts are applied before AV
then there is no risk of
DD
latch-up as there would be on the analog inputs if a signal greater than 0.3 V was applied prior to AV
V
DRIVE
The AD7936/AD7935 has a V
Input
feature. V
DRIVE
DD
.
DRIVE
con-
trols the voltage at which the Parallel Interface operates.
allows the ADC to easily interface to both 3 V and
V
DRIVE
5 V processors. For example, if the AD7936/AD7935 were operated with an AV
of 5V, and the V
DD
DRIVE
pin could be powered from a 3V supply. The AD7936/ AD7935 has better dynamic performance with an AV
DD
of 5V while still being able to interface to 3V processors. Care should be taken to ensure V AV
by more than 0.3 V. (See Absolute Maximum Rat-
DD
does not exceed
DRIVE
ings Section).
PARALLEL INTERFACE
The AD7936/AD7935 has a flexible, high speed, parallel interface. This interface is 8-bits wide and operates in Byte mode. The CONVST signal is used to power up the ADC and to initiate conversions.
A falling edge on the CONVST signal is used to initiate conversions. Once the CONVST signal goes low, the BUSY signal goes high for the duration of the Conver­sion. At the end of the Conversion, BUSY goes low and can be used to activate an Interrupt Service Routine. The CS and RD lines are then activated in parallel to read the high byte and low byte containing the conversion data depending on the state of the HBEN input. When operat­ing the device Auto Shutdown or Auto Standby mode, where the ADC powers down at the end of each conver­sion, a rising edge on the CONVST signal is used to power up the device.
CONVST
t
1
Reading Data from the AD7936/AD7935
AD7936/AD7935 interface operates in Byte mode. The 12- or 10-bits of conversion data from the AD7936/ AD7935 must be acessed in two read operations with 8 bits of data provided on DB0 to DB7 for each of the read operations. The HBEN pin determines whether the read operation accesses the high byte or the low byte of the 12­or 10-bit word. For a low byte read, for 12-bit operation, DB0 to DB7 provide the 8 LSBs of the 12-bit word. For 10-bit operation, the two LSBs of the low byte are zeros and are followed by 6-bits of conversion data. For a high byte read, DB0 to DB4 provide the 4MSBs of the 12-/10­bit word. The remainder of the bits in the high byte provide the Channel ID. Figure 20 shows the timing of the two read cycles shown which are required to access the conversion data from the device. The CS and RD signals are gated internally and level triggered active low. CS and RD may be tied together as the timing specification t
8
and t9 is 0ns min. The data is placed onto the data bus a time t
after both CS and RD go low. The RD rising
11
edge can be used to latch data out of the device. After a time, t
, the data lines will become 3 stated.
9
Writing Data to the AD7936/AD7935
The AD7936/AD7935 interface operates in Byte mode therefore two write operations are required to transfer a full 12-/10-Bit word into the device. Data to be written to the AD7936/AD7935 should be provided on the DB0 to DB7 inputs. HBEN determines whether the byte to be written is high byte or low byte data. For a low byte write, HBEN should be low and DB0 will contain the LSB of the data. For the high byte write, HBEN should be high and the data on the DB0 input should be data bit 8 of the 12-/10-bit word.
Figure 21 shows the timing of the two write cycles shown which are required to access the full conversion data word from the device. In figure 21, the first write transfers the lower 8 bits of data from DB0 to DB7 and the second write transfers the upper 2 or 4 bits of the data word.
The CS and WR signals are gated internally. CS and WR may be tied together as the timing specification for t
2
and t3 is 0ns min. The data is latched into the device on
BUSY
HBEN
CS
RD
DB0-DB7
INTERNAL DATA LATCH
t
7
OLD DATA
t
13
t
8
t
10
t
11
LOW BYTE
t
9
NEW DATA
t
14
t
12
t
13
t
15
Figure 20. Read Cycle Timing for Byte Mode Operation
–20–
HIGH BYTE
t
14
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Page 21
PRELIMINARY TECHNICAL DATA
AD7936/AD7935
the rising edge of WR. The data needs to be setup a time
before the WR rising edge and held for a time t6 after
t
5
the WR rising edge.
HBEN
CS
WR
DB0-DB7
t
16
t
2
LOW BYTE
t
17
t
3
t
4
t
5
t
6
t
16
HIGH BYTE
t
17
Figure 21. Write Cycle Timing for Byte Mode Operation
MODES OF OPERATION
The AD7936/AD7935 has a number of different power modes of operation. These modes are designed to provide flexible power management options. Different options can be chosen to optimize the power dissipation/through­put rate ratio for differing applications. The mode of operation is selected by the power management bits, PM1 and PM0, in the Control register, as detailed in Table II. At power on reset, the default power up condition is nor­mal mode.
Normal Mode (PM1 = PM0 = 1)
This mode is intended for the fastest throughput rate per­formance as the user does not have to worry about any power up times as the AD7936/AD7935 remaining fully powered up at all times. At power on reset, this mode is the default setting in the control register.
Full Shutdown Mode (PM1 = 1; PM0 = 0)
When this mode is entered, all circuitry on the AD7936/ AD7935 is powered down. The part retains the informa­tion in the Control Register during the Full Shutdown. The AD7936/AD7935 remains in Full Shutdown mode until the power management bits in the Control Register are changed. If a write to the Control register occurs while the part is in Full Shutdown mode, and the Power Management bits are changed to PM0 = PM1 = 1, i.e. Normal Mode, the part will begin to power up on the CONVST rising edge. To ensure the part is fully pow­ered up before a conversion is initiated, the power up time, TBD, should be allowed before the CONVST falling edge, otherwise, invalid data will be read.
AutoShutdown (PM1 = 0; PM0 = 1)
In this mode of operation, the AD7936/AD7935 automati­cally enters shutdown at the end of each conversion. In shutdown mode, all internal circuitry on the device is powered. The part retains information in the Control register during shutdown. It remains in shutdown mode until the next rising edge of CONVST. On this rising edge, the part will begin to power up and the power up time will depend on whether the user is operating with the internal or external reference. The user should ensure that the power up time has elapsed before initiating a con­version.
Auto Standby (PM1 = 0; PM0 = 0)
In this mode of operation, the AD7936/AD7935 automati­cally enters Standby mode at the end of each conversion. When this mode is entered, all circuitry on the AD7936/ AD7935 is powered down except the internal reference. A rising edge on CONVST will power up the device which will take at least 1µsec.
POWER VS. THROUGHPUT RATE
A big advantage of powering the ADC down after a con­version is that the power consumption of the part is significantly reduced at lower throughput rates. When using the different power modes, the AD7936/AD7935 is only powered up for the duration of the conversion. Therefore, the average power consumption is significantly reduced.
MICROPROCESSOR INTERFACING
AD7936/AD7935 To ADSP-2189 Interface
Figure 22 shows a typical interface between the AD7936/ AD7935 and the ADSP-2189. The ADSP-2189 can be used in one of two memory modes - Full Memory Mode and Host Mode. The Mode C pin determines in which mode the processor works. The interface, in Figure 23 is set up to have the processor working in Full Memory Mode, which allows full external addressing. When the AD7936/AD7935 has finished converting, the BUSY line goes low and thus requests an interrupt through the IRQ2 pin. The IRQ2 interrupt has to be set up in the interrupt control register as edge-sensitive. The DMS (Data Memory Select) pin latches in the address of the ADC into the address decoder and therefore starts a read opera­tion.
TBD
Figure 22. Interfacing to the ADSP-2189
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–21–
Page 22
AD7936/AD7935
PRELIMINARY TECHNICAL DATA
APPLICATION HINTS
Grounding and Layout
The printed circuit board that houses the AD7936/ AD7935 should be designed so that the analog and digital sections are separated and confined to certain areas of the board. This facilitates the use of ground planes that can be easily separated. A minimum etch technique is gener­ally best for ground planes as it gives the best shielding. Digital and analog ground planes should be joined in only one place and the connection should be a star ground point established as close to the Ground pins on the AD7936/AD7935 as possible. Avoid running digital lines under the device as this will couple noise onto the die. The analog ground plane should be allowed to run under the AD7936/AD7935 to avoid noise coupling. The power supply lines to the AD7936/AD7935 should use as large a trace as possible to provide low impedance paths and re­duce the effects of glitches on the power supply line. Fast switching signals like clocks should be shielded with digital ground to avoid radiating noise to other sections
OUTLINE DIMENSIONS
Dimensions shown in inches and mm
of the board, and clock signals should never run near the analog inputs. Avoid crossover of digital and analog sig­nals. Traces on opposite sides of the board should run at right angles to each other. This will reduce the effects of feedthrough through the board. A microstrip technique is by far the best but is not always possible with a double­sided board. In this technique the component side of the board is dedicated to ground planes while signals are placed on the solder side. Good decoupling is also im­portant. All analog supplies should be decoupled with 10µF tantalum capacitors in parallel with 0.1µF capacitors to GND. To achieve the best from these decoupling com­ponents, they must be placed as close as possible to the device.
28
0.177 (4.50)
0.169 (4.30)
0.006 (0.15)
0.002 (0.05)
SEATING
PLANE
1
PIN 1
28 Lead TSSOP
0.386 (9.80)
0.378 (9.60)
0.0256 (0.65)
BSC
RU-28
0.0118 (0.30)
0.0075 (0.19)
15
14
0.256 (6.50)
0.246 (6.25)
0.0433
(1.10)
MAX
0.0079 (0.20)
0.0035 (0.090)
o
8
o
0
0.028 (0.70)
0.020 (0.50)
–22–
REV. PrA
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