Datasheet AD7869JR, AD7869JN, AD7869AQ Datasheet (Analog Devices)

LC2MOS

RO DAC

RI DAC

DGND

AD7869

R

R

RO ADC

AGND

CLOCK

R

R

14 - BIT

DAC

DAC

SERIAL

INTERFACE

ADC SERIAL
INTERFACE

14 - BIT

ADC

DAC 3V

REFERENCE

ADC 3V

REFERENCE

TRACK/HOLD

V

SS

V

DD

V

IN

V

OUT

LDAC

TFS

TCLK

DT

CONTROL

RFS

RCLK

DR

CLK

CONVST

a

Complete, 14-Bit Analog I/O System

FEATURES
Complete 14-Bit l/O System, Comprising

14-Bit ADC with Track/Hold Amplifier

83 kHz Throughput Rate

14-Bit DAC with Output Amplifier

3.5 ms Settling Time

On-Chip Voltage Reference
Operates from 65 V Supplies
Low Power—130 mW typ
Small 0.3" Wide DIP

APPLICATIONS
Digital Signal Processing
Speech Recognition and Synthesis
Spectrum Analysis
High Speed Modems
DSP Servo Control

GENERAL DESCRIPTION

The AD7869 is a complete 14-bit I/O system containing a DAC
and an ADC. The ADC is a successive approximation type with
a track-and-hold amplifier, having a combined throughput rate
of 83 kHz. The DAC has an output buffer amplifier with a set­tling time of 4 µs to 14 bits. Temperature compensated 3 V bur-
ied Zener references provide precision references for the DAC
and ADC.

Interfacing to both the DAC and ADC is serial, minimizing pin
count and giving a small 24-pin package size. Standard control
signals allow serial interfacing to most DSP machines.

Asynchronous ADC conversion control and DAC updating is
made possible with the

CONVST and LDAC logic inputs.

The AD7869 operates from ±5 V power supplies; the analog in­put/output range of the ADC/DAC is ±3 V. The part is fully
specified for dynamic parameters such as signal-to-noise ratio
and harmonic distortion as well as traditional dc specifications.

The part is available in a 24-pin, 0.3 inch wide, plastic or her­metic dual-in-line package (DIP) and in a 28-pin, plastic SOIC
package.

AD7869

FUNCTIONAL BLOCK DIAGRAM

PRODUCT HIGHLIGHTS

1. Complete 14-Bit I/O System.
The AD7869 contains a 14-bit ADC with a track-and-hold
amplifier and a 14-bit DAC with output amplifier. Also in
cluded are separate on-chip voltage references for the DAC
and the ADC.

2. Dynamic Specifications for DSP Users.
In addition to traditional dc specifications, the AD7869 is
specified for ac parameters, including signal-to-noise ratio
and harmonic distortion. These parameters, along with im­portant timing parameters, are tested on every device.

3. Small Package.
The AD7869 is available in a 24-pin DIP and a 28-pin SOIC
package.

REV. A

Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] World Wide Web Site: http://www.analog.com
Fax: [phone] © Analog Devices, Inc., 1996

AD7869–SPECIFICA TIONS

(VDD = +5 V 6 5%, VSS = –5 V 6 5%, AGND = DGND = 0 V, f

ADC SECTION

Parameter J Version1A Version1Units Test Conditions/Comments

DYNAMIC PERFORMANCE

Signal-to-Noise Ratio

T

to T

MIN

Total Harmonic Distortion (THD) –86 –86 dB typ V
Peak Harmonic or Spurious Noise –86 –86 dB typ V
Intermodulation Distortion (IMD)

Second Order Terms –86 –86 dB typ fa = 9 kHz, fb = 9.5 kHz, f
Third Order Terms –88 –88 dB typ fa = 9 kHz, fb = 9.5 kHz, f

Track/Hold Acquisition Time 2 2 µs max

DC ACCURACY

Resolution 14 14 Bits
Minimum Resolution 14 14 Bits No Missing Codes Are Guaranteed
Integral Nonlinearity ±2 ±2 LSB max
Differential Nonlinearity ±1 ±1 LSB max
Bipolar Zero Error ±20 ±20 LSB max
Positive Gain Error
Negative Gain Error

ANALOG INPUT

Input Voltage Range ±3 ±3 Volts
Input Current ±1 ±1 mA max

REFERENCE OUTPUT

RO ADC @ +25°C 2.99/3.01 2.99/3.01 V min/ V max
RO ADC TC ±25 ±25 ppm/°C typ

Reference Load Sensitivity

(∆RO ADC vs. ∆I) –1.5 –1.5 mV max Reference Load Current Change (0–500 µA),

LOGIC INPUTS

(

CONVST, CLK, CONTROL)

Input High Voltage, V
Input Low Voltage, V
Input Current, I
Input Current7 (CONTROL & CLK) ±10 ±10 µA max VIN = VSS to DGND
Input Capacitance, C

LOGIC OUTPUTS

DR,

Output Low Voltage, V

RCLK Output

Output Low Voltage, V

DR,

Floating-State Leakage Current ±10 ±10 µA max
Floating-State Output Capacitance

CONVERSION TIME

External Clock 10 10 µs max
Internal Clock 10 10 µs max The Internal Clock Has a Nominal Value of 2.0 MHz

POWER REQUIREMENTS For Both DAC and ADC

V

DD

V

SS

I

DD

I

SS

Total Power Dissipation 170 170 mW max Typically 130 mW

NOTES

1

Temperature ranges are as follows: J Version, 0°C to +70° C; A Version, –40°C to +85 °C.

2

VIN = ±3 V.

3

SNR calculation includes distortion and noise components.

4

SNR degradation due to asynchronous DAC updating during conversion is 0.1 dB typ.

5

Measured with respect to internal reference.

6

For capacitive loads greater than 50 pF, a series resistor is required (see Internal Reference section).

7

Tying the CONTROL input to VDD places the device in a factory test mode where normal operation is not exhibited.

8

Sample tested @ +25°C to ensure compliance.

Specifications subject to change without notice.

MAX

RFS Outputs

RFS, RCLK Outputs

All specifications T

2

3, 4

(SNR) @ +25°C 78 78 dB min VIN = 10 kHz Sine Wave, f

MIN

to T

unless otherwise noted.)

MAX

78 77 dB min

5

5

6

±20 ±20 LSB max
±20 ±20 LSB max

±40 ±ppm/°C max

INH

INL

IN

8

IN

OL

OL

2.4 2.4 V min VDD = 5 V ± 5%

0.8 0.8 V max VDD = 5 V ± 5%
±10 ±10 µA max VIN = 0 V to V

10 10 pF max

0.4 0.4 V max I

0.4 0.4 V max I

8

15 15 pF max

+5 +5 V nom ±5% for Specified Performance
–5 –5 V nom ±5% for Specified Performance
22 22 mA max Cumulative Current from the Two VDD Pins
12 12 mA max Cumulative Current from the Two VSS Pins

= 2.0 MHz external.

CLK

= 10 kHz Sine Wave, f

IN

= 10 kHz Sine Wave, f

IN

Reference Load Should Not Be Changed
During Conversion

DD

= 1.6 mA, Pull-Up Resistor = 4.7 kΩ

SINK

= 2.6 mA, Pull-Up Resistor = 2 kΩ

SINK

SAMPLE

SAMPLE
SAMPLE

SAMPLE
SAMPLE

= 83 kHz
= 83 kHz

= 83 kHz
= 50 kHz

= 50 kHz

–2–

REV. A

AD7869

(VDD = +5 V 6 5%, VSS = –5 V 6 5%, AGND = DGND = 0 V, Rl DAC = +3 V and decoupled as shown in Figure 2,
V

DAC SECTION

Load to AGND; = 2 kV, CL = 100 pF. All specifications T

OUT

Parameter J Versions1A Version1Units Test Conditions/Comments

DYNAMIC PERFORMANCE

2

Signal-to-Noise Ratio3 (SNR) @ +25°C 78 78 dB min V

to T

T

MIN

MAX

78 77 dB min Typically 82 dB at +25°C for 0 < V

Total Harmonic Distortion (THD) –86 –86 dB typ V
Peak Harmonic or Spurious Noise –86 –86 dB typ V

DC ACCURACY

Resolution 14 14 Bits
Integral Nonlinearity ±2 ± 2 LSB max
Differential Nonlinearity ±1 ± 1 LSB max Guaranteed Monotonic
Bipolar Zero Error ±10 ±10 LSB max
Positive Full-Scale Error
Negative Full-Scale Error

REFERENCE OUTPUT

5

5

6

±10 ±10 LSB max
±10 ±10 LSB max

RO DAC @ +25°C 2.99/3.01 2.99/3.01 V min/V max
RO DAC TC ±25 ±25 ppm/°C typ

±40 ppm/°C max

Reference Load Change

(∆RO DAC vs. ∆I) –1.5 –1.5 mV max Reference Load Current Change (0 µA–500 µA)

REFERENCE INPUT

RI DAC Input Range 2.85/3.15 2.85/3.15 V min/V max 3 V ± 5%
Input Current 1 1 µA max

LOGIC INPUTS

LDAC, TFS, TCLK, DT)

(

Input High Voltage, V
Input Low Voltage, V
Input Current, I
Input Capacitance, C

INL

IN

IN

INH

7

2.4 2.4 V min VDD = 5 V ± 5%

0.8 0.8 V max VDD = 5 V ± 5%
±10 ±10 µA max VIN = 0 V to V
10 10 pF max

ANALOG OUTPUT

Output Voltage Range ±3 ±3 V nom
DC Output Impedance 0.3 0.3 Ω typ
Short-Circuit Current 20 20 mA typ

AC CHARACTERISTICS

7

Voltage Output Settling-Time Settling Time to Within ±1/2 LSB of Final Value

Positive Full-Scale Change 4 4 µs max Typically 3 µs

Negative Full-Scale Change 4 4 µs max Typically 3.5 µs
Digital-to-Analog Glitch Impulse 10 10 nV secs typ DAC Code Change All 1s to All 0s
Digital Feedthrough 2 2 nV secs typ
VIN to V

Isolation 100 100 dB typ VIN = ±3 V, 41.5 kHz Sine Wave

OUT

POWER REQUIREMENTS As per ADC Section

NOTES

1

Temperature ranges are as follows: J Version, 0°C to +70° C; A Version, –40°C to +85 °C.

2

V

(p-p) = ±3 V.

OUT

3

SNR calculation includes distortion and noise components.

4

Using external sample and hold, see Figures 13 to 15.

5

Measured with respect to REF IN and includes bipolar offset error.

6

For capacitive loads greater than 50 pF a series resistor is required (see Internal Reference section).

7

Sample tested @ +25°C to ensure compliance.

Specifications subject to change without notice

to T

MIN

unless otherwise noted.)

MAX

= 1 kHz Sine Wave, f

OUT

= 1 kHz Sine Wave, f

OUT

Typically –84 dB at +25°C for 0 < V

= 1 kHz, f

OUT

SAMPLE

Typically –84 dB at +25°C for 0 < V

DD

SAMPLE

SAMPLE

= 83 kHz

= 83 kHz

< 20 kHz

OUT

= 83 kHz

< 20 kHz

OUT

< 20 kHz

OUT

4

4

4

REV. A

–3–

AD7869

MIN

1, 2

(VDD = +5 V 6 5%, VSS = –5 V 6 5%, AGND = DGND = 0 V)

, T

MAX

TIMING SPECIFICATIONS

Limit at T

Parameter (All Versions) Units Conditions/Comments

ADC TIMING

t

1

3

t

2

t

3

t

4

4

t

5

t

6

5

t

13

DAC TIMING

t

7

t

8

t

9

t

10

t

11

t

l2

NOTES

1

Timing specifications are sample tested at +25°C to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of 5 V) and timed from a
voltage level of 1.6 V.

2

Serial timing is measured with a 4.7 kΩ pull-up resistor on DR and RFS and a 2 k Ω pull-up resistor on RCLK. The capacitance on all three outputs is 35 pF.

3

When using internal clock, RCLK mark/space ratio (measured form a voltage level of 1.6 V) range is 40/60 to 60/40. For external clock, RCLK mark/space
ratio = external clock mark/space ratio.

4

DR will drive higher capacitance loads but this will add to t5 since it increases the external RC time constant (4.7 k Ω//CL) and hence the time to reach 2.4 V.

5

Time 2 RCLK to 3 RCLK depends on conversion start to ADC clock synchronization.

6

TCLK mark/space ratio is 40/60 to 60/40.

50 ns min CONVST Pulse Width
440 ns min RCLK Cycle Time, Internal Clock
100 ns min RFS to RCLK Falling Edge Setup Time
20 ns min RCLK Rising Edge to RFS
100 ns max
155 ns max RCLK to Valid Data Delay, CL = 35 pF
4 ns min Bus Relinquish Time after RCLK
100 ns max
2 RCLK + 200 to ns typ CONVST to RFS Delay
3 RCLK + 200

50 ns min TFS to TCLK Falling Edge
75 ns min TCLK Falling Edge to TFS
150 ns min TCLK Cycle Time
30 ns min Data Valid to TCLK Setup Time
75 ns min Data Valid to TCLK Hold Time
40 ns min LDAC Pulse Width

ABSOLUTE MAXIMUM RATINGS*

(TA = + 25°C unless otherwise noted)

VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

V

to AGND . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –7 V

SS

AGND to DGND . . . . . . . . . . . . . . . . –0.3 V to V

V

to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS to V

OUT

VIN to AGND . . . . . . . . . . . . . . . . V

–0.3 V to VDD + 0.3 V

SS

RO ADC to AGND . . . . . . . . . . . . . . . –0.3 V to V

RO DAC to AGND . . . . . . . . . . . . . . . –0.3 V to V

RI DAC to AGND . . . . . . . . . . . . . . . –0.3 V to V

Digital Inputs to DGND . . . . . . . . . . . –0.3 V to V

Digital Outputs to DGND . . . . . . . . . . –0.3 V to V

+ 0.3 V

DD

+ 0.3 V

DD

+ 0.3 V

DD

+ 0.3 V

DD

+ 0.3 V

DD

+ 0.3 V

DD

DD

Operating Temperature Range

J Version . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C

A Version . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C

Lead Temperature (Soldering, 10 secs) . . . . . . . . . . . +300°C

Power Dissipation (Any Package) to +75°C . . . . . . . 1000 mW

Derates above +75°C by . . . . . . . . . . . . . . . . . . . . 10 mW/°C

*Stresses above those listed under “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress rating only; functional operation
of the device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7869 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.

ORDERING GUIDE

Signal-

Temperature to-Noise Relative Package

Model Range Ratio (SNR) Accuracy Option*

AD7869JN 0°C to +70°C 78 dB ±2 LSB max N-24
AD7869JR 0°C to +70°C 78 dB ±2 LSB max R-28
AD7869AQ –40°C to +85°C 77 dB ±2 LSB max Q-24

*N = Plastic DIP; Q = Cerdip; R = Small Outline IC (SOIC).

WARNING!

ESD SENSITIVE DEVICE

–4–

REV. A

AD7869

0.01 (0.254)

0.006 (0.15)

0.019 (0.49)

0.014 (0.35)

0.096 (2.44)

0.089 (2.26)

0.05
(1.27)
BSC

0.013 (0.32)

0.009 (0.23)

0.042 (1.067)

0.018 (0.457)

6°
0°

0.03 (0.76)

0.02 (0.51)

x 45°

0.708 (18.02)

0.696 (17.67)

0.414 (10.52)

0.398 (10.10)

0.299 (7.6)

0.291 (7.39)

28 15

141

1. LEAD NO. 1 INDENTIFIED BY A DOT.

2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.

AD7869 PIN FUNCTION DESCRIPTION

DIP Pin
Number Mnemonic Function

POWER SUPPLY
7 & 23 V

10 & 22 V

DD
SS

8 & 19 AGND Analog Ground. Both AGND pins must be tied together.
6 & 17 DGND Digital Ground. Both DGND pins must be tied together.

ANALOG SIGNAL AND REFERENCE
21 V

9V

IN
OUT

20 RO ADC Voltage Reference Output. The internal ADC 3 V reference is provided at this pin. This output may be used as a

11 RO DAC DAC Voltage Reference Output. This is one of two internal voltage references. To operate the DAC with this

12 RI DAC DAC Voltage Reference Input. The voltage reference for the DAC must be applied to this pin. It is internally

ADC INTERFACE AND CONTROL
2 CLK Clock Input. An external TTL-compatible clock may be applied to this input. Alternatively, tying this pin to V

3

RFS Receive Frame Synchronization, Logic Output. This is an active low open-drain output that provides a framing

4 RCLK Receive Clock, Logic Output. RCLK is the gated serial clock output that is derived from the internal or external

5 DR Receive Data, Logic Output. This is an open-drain data output used in conjunction with

1

CONVST Convert Start, Logic Input. A low to high transition on this input puts the track-and-hold amplifier into the hold

24 CONTROL Control, Logic Input. With this pin at 0 V, the RCLK is noncontinuous. With this pin at –5 V, the RCLK is contin-

DAC INTERFACE AND CONTROL
14

TFS Transmit Frame Synchronization, Logic Input. This is a frame or synchronization signal for the DAC with serial
15 DT Transmit Data, Logic Input. This is the data input that is used in conjunction with
16 TCLK Transmit Clock, Logic Input. Serial data bits are latched on the falling edge of TCLK when

13

LDAC Load DAC, Logic Input. A new word is transferred into the DAC latch from the input latch on the falling edge
18 NC No Connect.

Positive Power Supply, 5 V ± 5%. Both VDD pins must be tied together.
Negative Power Supply, –5 V ± 5%. Both VSS pins must be tied together.

ADC Analog Input. The ADC input range is ±3 V.
Analog Output Voltage from DAC. This output comes from a buffer amplifier. The range is bipolar, ±3 V

with RI DAC = +3 V.

reference for the DAC by connecting it to the RI DAC input. The external load capability of this reference is 500 µA.

internal reference, RO DAC should be connected to RI DAC. The external load capability of the reference is 500 µA.

buffered before being applied to the DAC. The nominal reference voltage for correct operation of the AD7869 is 3 V.

enables the internal laser-trimmed oscillator.

SS

pulse for serial data. An external 4.7 kΩ pull-up resistor is required on

ADC clock. If the CONTROL input is at V

, the clock runs continuously. With the CONTROL input at DGND,

SS

RFS.

the RCLK output is gated off (three-state) after serial transmission is complete. RCLK is an open-drain output and
requires an external 2 kΩ pull-up resistor.

RFS and RCLK to transmit

data from the ADC. Serial data is valid on the falling edge of RCLK when

RFS is low. An external 4.7 kΩ resistor is

required on the DR output.

mode and starts an ADC conversion. This input is asynchronous to the CLK input.

uous. Note, tying this pin to VDD places the part in a factory test mode where normal operation is not exhibited.

data expected after the falling edge of this signal.

TFS and TCLK to transfer

serial data to the input latch.

TFS is low.

of this signal.

CONVST

REV. A

RCLK

DGND

AGND

RO DAC

RI DAC

V

CLK
RFS

V

V

DR

OUT

1
2
3
4
5
6
7

DD

8
9

10

SS

11
12

DIP

AD7869

TOP VIEW

(Not to Scale)

NC = NO CONNECT

24
23
22
21
20
19
18
17
16
15
14
13

CONTROL
V

DD

V

SS

V

IN

RO ADC
AGND
NC
DGND
TCLK
DT
TFS

LDAC

PIN CONFIGURATIONS

SOIC

–5–

AD7869

CONVERTER DETAILS

The AD7869 is a complete 14-bit I/O port; the only external
components required for normal operation are pull-up resistors
for the ADC data outputs, and power supply decoupling capaci­tors. The AD7869 is comprised of a 14-bit successive approxi­mation ADC with a track/hold amplifier, a 14-bit DAC with a
buffered output and two 3 V buried Zener references, a clock os­cillator and control logic.

ADC CLOCK

The AD7869 has an internal clock oscillator that can be used for
the ADC conversion procedure. The oscillator is enabled by ty­ing the CLK input to V

. The oscillator is laser trimmed at the

SS

factory to give a maximum conversion time of 10 µs. The mark/
space ratio can vary from 40/60 to 60/40. Alternatively, an exter­nal TTL compatible clock may be applied to this input. The al­lowable mark/space ratio of an external clock is 40/60 to 60/40.

RCLK is a clock output, used for the serial interface. This out­put is derived directly from the ADC clock source and can be
switched off at the end of conversion with the CONTROL
input.

ADC CONVERSION TIMING

The conversion time for both external clock and continuous in­ternal clock can vary from 19 to 20 rising clock edges, depending
on the conversion start to ADC clock synchronization. If a con­version is initiated within 30 ns prior to a rising edge of the ADC
clock, the conversion time will consist of 20 rising clock edges,
i.e., 9.5 µs conversion time. For noncontinuous internal clock,
the conversion time always consists of 19 rising clock edges.

The operation of the track/hold amplifier is essentially transpar­ent to the user. The track/hold amplifier goes from its track
mode to its hold mode at the start of conversion on the rising
edge of

CONVST.

INTERNAL REFERENCES

The AD7869 has two on-chip temperature compensated buried
Zener references that are factory trimmed to 3 V ±10 mV. One
reference provides the appropriate biasing for the ADC, while
the other is available as a reference for the DAC. Both reference
outputs are available (labelled RO DAC and RO ADC) and are
capable of providing up to 500 µA to an external load.

The DAC input reference (RI DAC) can be sourced externally
or connected to any of the two on-chip references. Applications
requiring good full-scale error matching between the DAC and
the ADC should use the ADC reference as shown in Figure 4.

The maximum recommended capacitance on either of the refer­ence output pins for normal operation is 50 pF. If either of the
reference outputs is required to drive a capacitive load greater
than 50 pF, then a 200 Ω resistor must be placed in series with
the capacitive load. The addition of decoupling capacitors,
10 µF in parallel with 0.1 µF as shown in Figure 2, improves
noise performance. The improvement in noise performance can
be seen from the graph in Figure 3. Note: this applies for the
DAC output only; reference decoupling components do not af­fect ADC performance. Consequently, a typical application will
have just the DAC reference decoupled with the other one open
circuited.

ADC TRACK-AND-HOLD AMPLIFIER

The track-and-hold amplifier on the analog input of the AD7869
allows the ADC to accurately convert an input sine wave of 6 V
peak–peak amplitude to 14-bit accuracy. The input impedance is
typically 9 kΩ; an equivalent circuit is shown in Figure 1. The
input bandwidth of the track/hold amplifier is much greater
than the Nyquist rate of the ADC even when the ADC is oper­ated at its maximum throughput rate. The 0.1 dB cutoff fre­quency occurs typically at 500 kHz. The track/hold amplifier
acquires an input signal to 14-bit accuracy in less than 2 µs. The
overall throughput rate is equal to the conversion time plus the
track/hold amplifier acquisition time. For a 2.0 MHz input clock,
the throughput time is 12 µs max.

TRACK/HOLD

V

IN

4.5kΩ

4.5kΩ

*ADDITIONAL PINS OMITTED FOR CLARITY

AMPLIFIER

TO INTERNAL
3V REFERENCE

TO INTERNAL
COMPARATOR

AD7869*

Figure 1. ADC Analog Input

RI DAC

RO DAC

or

RO ADC*

*RO DAC/RO ADC CAN BE LEFT
OPEN CIRCUIT IF NOT USED

200Ω

10µF

EXT LOAD
GREATER THAN 50pF

0.1µF

Figure 2. Reference Decoupling Components

DAC OUTPUT AMPLIFIER

The output from the voltage mode DAC is buffered by a non­inverting amplifier. The buffer amplifier is capable of developing
±3 V across 2 kΩ and 100 pF load to ground and can produce
6 V peak-to-peak sine wave signals to a frequency of 20 kHz.
The output is updated on the falling edge of the LDAC input.
The output voltage settling time, to within 1/2 LSB of its final
value, is typically less than 3.5 µs.

The small signal (200 mV p–p) bandwidth of the output buffer
amplifier is typically 1 MHz. The output noise from the ampli­fier is low with a figure of 30 nV/√

Hz at a frequency of 1 kHz.
The broadband noise from the amplifier exhibits a typical peak­to-peak figure of 150 µV for a 1 MHz output bandwidth. Figure
3 shows a typical plot of noise spectral density versus frequency
for the output buffer amplifier and for either of the on-chip
references.

–6–

REV. A

AD7869

500

TA = +25°C

= +5V

V

DD

V

200

100

nV – √Hz

50

20

10

50 100 200

REF OUT

OUTPUT WITH
ALL 0s LOADED

REF OUT DECOUPLED
AS SHOWN IN
FIGURE 2

1k 2k
FREQUENCY – Hz

= –5V

SS

10k

20k

100k

Figure 3. Noise Spectral Density vs. Frequency

INPUT/OUTPUT TRANSFER FUNCTIONS

A bipolar circuit for the AD7869 is shown in Figure 4.
The analog input/output voltage range of the AD7869 is ±3 V.

The designed code transitions for the ADC occur midway be­tween successive integer LSB values (i.e., 1/2 LSB, 3/2 LSB,
5/2 LSB . . . FS –3/2 LSBs). The input/output code is 2s
Complement Binary with 1 LSB = FS/16384 = 366 µV. The
ideal transfer function is shown in Figure 5.

ANALOG INPUT
RANGE = ±3V

V

IN

RI DAC

R1

200

RO ADC

C2

C1

10µF

0.1µF

AGND

*ADDITIONAL PINS OMITTED FOR CLARITY

AD7869*

V

OUT

ANALOG OUTPUT
RANGE = ±3V

Figure 4. Basic Bipolar Operation

OUTPUT
CODE

011...111

011...110

000...010

-FS

000...001

000...000

111...111

111...110

100...001

100...000

2

0V

INPUT VOLTAGE

1LSB =

+

FS
2

FS = 6V

-1LSB

16384

FS

Figure 5. Input/Output Transfer Function

OFFSET AND FULL SCALE ADJUSTMENT

In most digital signal processing (DSP) applications, offset and
full-scale errors have little or no effect on system performance.
Offset error can always be eliminated in the analog domain by
ac coupling. Full-scale errors do not cause problems as long as
the input signal is within the full dynamic range of the ADC.
For applications requiring that the input signal range match the
full analog input dynamic range of the ADC, offset and full­scale errors have to be adjusted to zero.

ADC ADJUSTMENT

Figure 6 has signal conditioning at the input and output of the
AD7869 for trimming the endpoints of the transfer functions of
both the ADC and the DAC. Offset error must be adjusted be­fore full-scale error. For the ADC, this is achieved by trimming
the offset of A1 while the input voltage, V1, is 1/2 LSB below
ground. The trim procedure is as follows: apply a voltage of
–183 µV (–1/2 LSB) at V1 in Figure 6 and adjust the offset volt-
age of A1 until the ADC output code flickers between 11 1111
1111 1111 (3FFF HEX) and 00 0000 0000 0000 (0000 HEX).

V1

INPUT VOLTAGE

RANGE = ±3V

R1

10k

R2

500

R3

10k

R5

10k

*ADDITIONAL PINS
OMITTED FOR
CLARITY

A1

R4
10k

V

IN VOUT

AD7869*

AGND

10k

500

10k

R6

R7

R8

R10

10k

A2

R9

10k

V0

OUTPUT VOLTAGE

RANGE = ± 3V

Figure 6. AD7869 with Input/Output Adjustment

ADC gain error can be adjusted at either the first code transi­tion (ADC negative full scale) or the last code transition (ADC
positive full scale). The trim procedures for both cases are as
follows (see Figure 6).

ADC Positive Full-Scale Adjustment

Apply a voltage of 2.99945 V (FS/2 – 3/2 LSBs) at V1. Adjust
R2 until the ADC output code flickers between 01 1111 1111
1110 (1FFE HEX) and 01 1111 1111 1111 (1FFF HEX).

ADC Negative Full-Scale Adjustment

Apply a voltage of –2.99982 V (–FS/2 + 1/2 LSB) at V1 and ad­just R2 until the ADC output code flickers between 10 0000
0000 0000 (2000 HEX) and 10 0000 0000 0001 (2001 HEX).

DAC ADJUSTMENT

Op amp A2 is included in Figure 6 for the DAC transfer func­tion adjustment. Again, offset must be adjusted before full scale.
To adjust offset, load the DAC with 00 0000 0000 0000 (0000
HEX) and trim the offset of A2 to 0 V. As with the ADC adjust­ment, gain error can be adjusted at either the first code transi­tion (DAC negative full scale) or the last code transition (DAC
positive full scale). The trim procedures for both cases are as
follows:

DAC Positive Full-Scale Adjustment

Load the DAC with 01 1111 1111 1111 (1FFF HEX) and ad­just R7 until the op amp output voltage is equal to 2.99963 V
(FS/2 – 1 LSB).

DAC Negative Full-Scale Adjustment

Load the DAC with 10 0000 0000 0000 (2000 HEX) and adjust
R7 until the op amp output voltage is equal to –3 V (–FS/2).

REV. A

–7–

AD7869

TIMING AND CONTROL

Communication with the AD7869 is managed by six dedicated
pins. These consist of separate serial clocks, word framing or
strobe pulses, and data signals for both receiving and transmit­ting data. Conversion starts and DAC updating are controlled
by two digital inputs,

CONVST and LDAC. These inputs can
be asserted independently of the microprocessor by an external
timer when precise sampling intervals are required. Alterna­tively, the

LDAC and CONVST can be driven from a decoded
address bus, allowing the microprocessor control over conver­sion start and DAC updating as well as data communication to
the AD7869.

ADC Timing

Conversion control is provided by the CONVST input. A low to
high transition on

CONVST input starts conversion and drives
the track/hold amplifier into its hold mode. Serial data then be­comes available while conversion is in progress. The corre­sponding timing diagram is shown in Figure 7. The word length
is 16 bits, two leading zeros followed by the 14-bit conversion
result starting with the MSB. The data is synchronized to the
serial clock output (RCLK) and is framed by the serial strobe
(

RFS). Data is clocked out on a low to high transition of the se­rial clock and is valid on the falling edge of this clock while the
RFS output is low. RFS goes low at the start of conversion, and
the first serial data bit (which is the first leading zero) is valid on
the first falling edge of RCLK. All the ADC serial lines are
open-drain outputs and require external pull-up resistors.

CONVERSION TIME

t

13

t

3

t

5

DB13 DB12 DB11 DB1 DB0

t

2

t

4

t

6

CONVST

RFS

RCLK

DR

t

1

1

2,3

1

Figure 7. ADC Control Timing Diagram

The serial clock out is derived from the ADC master clock
source, which may be internal or external. Normally, RCLK is
required during the serial transmission only. In these cases, it
can be shut down (i.e., placed into three-state) at the end of
conversion to allow multiple ADCs to share a common serial
bus. However, some serial systems (e.g., TMS32020) require a
serial clock that runs continuously. Both options are available
on the AD7869 ADC. With the CONTROL input at 0 V,
RCLK is noncontinuous; when it is at –5 V, RCLK is
continuous.

DAC TIMING

The AD7869 DAC contains two latches, an input latch and a
DAC latch. Data must be loaded to the input latch under the
control of the TCLK,

TFS and DT serial logic inputs. Data is
then transferred from the input latch to the DAC latch under
the control of the

LDAC signal. Only the data in the DAC latch

determines the analog output of the AD7869.
Data is loaded to the input latch under control of TCLK,

TFS

and DT. The AD7869 DAC expects a 16-bit stream of serial
data on its DT input. Data must be valid on the falling edge of
TCLK. The

TFS input provides the frame synchronization sig­nal, which tells the AD7869 DAC that valid serial data will be
available for the next 16 falling edges of TCLK. Figure 8 shows
the timing diagram for the serial data format.

TFS

TCLK

DT

t

7

DON'T
CARE

t

DON'T
CARE

9

DB13 DB12

t

11

t

10

DB11 DB10 DB1 DB0

t

8

Figure 8. DAC Control Timing Diagram

Although 16 bits of data are clocked into the input latch, only
14 bits are transferred into the DAC latch. Therefore, two bits
in the stream are don’t cares since their value does not affect the
DAC latch data. The bit positions are two don’t cares, followed
by the 14-bit DAC data starting with the MSB.

The

LDAC signal controls the transfer of data to the DAC
latch. Normally, data is loaded to the DAC latch on the falling
edge of

LDAC. However, if LDAC is held low, then serial data
is loaded to the DAC latch on the sixteenth falling edge of
TCLK. If

LDAC goes low during the loading of serial data to
the input latch, no DAC latch update takes place on the falling
edge of

LDAC. If LDAC stays low until the serial transfer is
completed, the update takes place on the sixteenth falling edge
of TCLK. If

LDAC returns high before the serial data transfer

is completed, no DAC latch update takes place.

–8–

REV. A

AD7869

DAC

LOW-PASS

FILTER

16-BIT

DIGITIZER

MICRO-

CONTROLLER

AD7869 DYNAMIC SPECIFICATIONS

The AD7869 is specified and 100% tested for dynamic perfor­mance specifications as well as traditional dc specifications such
as Integral and Differential Nonlinearity. These ac specifications
are required for signal processing applications such as speech
recognition, spectrum analysis and high speed modems. These
applications require information on the converter’s effect on the
spectral content of the input signal. Hence, the parameters for
which the AD7869 is specified include SNR, harmonic distor­tion and peak harmonics. These terms are discussed in more de­tail in the following sections.

Signal-to-Noise Ratio (SNR)

SNR is the measured signal-to-noise ratio at the output of the
ADC or DAC. The signal is the rms magnitude of the funda­mental. Noise is the rms sum of all the nonfundamental signals
up to half the sampling frequency (f

/2), excluding dc.

SAMPLE

SNR is dependent upon the number of levels used in the quanti­zation process; the more levels, the smaller the quantization
noise. The theoretical signal-to-noise ratio for a sine wave input
is given by

SNR = (6.02N + 1.76) dB (1)

where N is the number of bits. Thus for an ideal 14-bit con­verter, SNR = 86 dB.

Effective Number of Bits

The formula given in Equation (1) relates the SNR to the num­ber of bits. Rewriting the formula, as in Equation (2), it is pos­sible to obtain a measure of performance expressed in effective
number of bits (N).

SNR–1.76

N =

6.02

(2)

The effective number of bits for a device can be calculated di­rectly from its measured SNR.

Harmonic Distortion

Harmonic Distortion is the ratio of the rms sum of harmonics to
the fundamental. For the AD7869, total harmonic distortion
(THD) is defined as:

2

2

THD =20 log

2

2

+V

+V

V

2

3

+V

4

V

1

2

+V

5

6

where V1 is the rms amplitude of the fundamental and V2, V3,
V4, V5 and V6 are the rms amplitudes of the second through to
the sixth harmonic. The THD is also derived from the FFT plot
of the ADC or DAC output spectrum.

ADC Testing

The output spectrum from the ADC is evaluated by applying a
sine wave signal of very low distortion to the V

input while

IN

reading multiple conversion results. A Fast Fourier Transform
(FFT) plot is generated from which the SNR data can be ob­tained. Figure 9 shows a typical 2048 point FFT plot of the
AD7869AQ ADC with an input signal of 10 kHz and a sam­pling frequency of 60 kHz. The SNR obtained from this graph
is 80 dB. It should be noted that the harmonics are taken into
account when calculating the SNR.

AD7869

Figure 9. ADC FFT Plot

Figure 10 shows a typical plot of effective number of bits versus
frequency for an AD7869AQ with a sampling frequency of
60 kHz. The effective number of bits typically falls between 12.7
and 13.1, corresponding to SNR figures of 79 dB and 80.4 dB.

Figure 10. Effective Number of Bits vs. Frequency for the
ADC

DAC Testing

A simplified diagram of the method used to test the dynamic
performance specifications of the DAC is outlined in Figure 11.
Data is loaded to the DAC under control of the microcontroller
and associated logic. The output of the DAC is applied to a 9th
order low pass filter whose cutoff frequency corresponds to the
Nyquist limit. The output of the filter is, in turn, applied to a
16-bit accurate digitizer. This digitizes the signal and the micro­controller generates an FFT plot from which the dynamic per­formance of the DAC can be evaluated.

Figure 11. DAC Dynamic Performance Test Circuit

REV. A

–9–

AD7869

The digitizer sampling is synchronized with the DAC update
rate to ease FFT calculations. The digitizer samples the DAC
output after the output has settled to its new value. Therefore, if
the digitizer were to directly sample the output, it would effec­tively be sampling a dc value each time. As a result, the dynamic
performance of the DAC would not be measured correctly. Us­ing the digitizer directly on the DAC output would give better
results than the actual performance of the DAC. Using a filter
between the DAC and the digitizer means that the digitizer
samples a continuously moving signal, and the true dynamic
performance of the AD7869 DAC output is measured.

Figure 12 shows a typical 2048 point Fast Fourier Transform
plot for the AD7869 DAC with an update rate of 83 kHz and an
output frequency of 1 kHz. The SNR obtained from the graph is
82 dBs.

Performance versus Frequency

The typical performance plots of Figures 14 and 15 show the
AD7869 DAC performance over a wide range of input frequen­cies at an update rate of 83 kHz. The plot of Figure 14 is with­out a sample-and-hold on the DAC output while the plot of
Figure 15 is generated with a sample-and-hold on the output.

Figure 14. DAC Performance vs. Frequency (No
Sample-and-Hold)

Figure 12. DAC FFT Plot

Some applications will require improved performance versus fre­quency from the AD7869 DAC. In these applications, a simple
sample-and-hold circuit such as that outlined in Figure 13 will
extend the very good performance of the DAC to 20 kHz. Other
applications will already have an inherent sample-and-hold
function following the AD7869 DAC output. An example of
this type of application is driving a switched capacitor filter
where the updating of the DAC is synchronized with the
switched capacitor filter. This inherent sample-and-hold func­tion also extends the frequency range performance.

R2

2k2

C9

330pF

AD711

LDAC

AD7869*

LDAC

V

OUT

1µs

ONE SHOT

DELAY

ADG201HS

R1

2k2

S1 D1

IN1

Q

*ADDITIONAL PINS OMITTED FOR CLARITY

Figure 13. DAC Sample-and-Hold Circuit

Figure 15. DAC Performance vs. Frequency (Sample-and­Hold)

–10–

REV. A

AD7869

MICROPROCESSOR INTERFACING

Microprocessor interfacing to the AD7869 is via a serial bus that
uses standard protocol compatible with DSP machines. The
communication interface consists of separate transmit (DAC)
and receive (ADC) sections whose operations can be either syn­chronous or asynchronous with respect to each other. Each sec­tion has a clock signal, a data signal and a frame or strobe pulse.
Synchronous operation means that data is transmitted from the
ADC and to the DAC at the same time. In this mode, only one
interface clock is needed, and this has to be the ADC clock out;
RCLK must be connected to TCLK. For asynchronous opera­tion, DAC and ADC data transfers are independent of each
other; the ADC provides the receive clock (RCLK) while the
transmit clock (TCLK) may be provided by the processor or the
ADC or some other external clock source.

Another option to be considered with serial interfacing is the use
of a gated clock. A gated clock means that the device sending
the data switches on the clock when data is ready to be transmit­ted and three states the clock output when transmission is com­plete. Only 16 clock pulses are transmitted with the first data bit
being latched into the receiving device on the first falling clock
edge. Ideally, there is no need for frame pulses, however the
AD7869 DAC frame input (

TFS) has to be driven high between
data transmissions. The easiest method is to use RFS to drive
TFS and use only synchronous interfacing. This avoids the use
of interconnects between the processor and AD7869 frame sig­nals. Not all processors have a gated clock facility; Figure 16
shows an example with the DSP56000.

Table I below shows the number of interconnect lines between
the processor and the AD7869 for the different interfacing
options.

The AD7869 has the ability to use different clocks for transmit­ting and receiving data. This option, however, exists only on
some processors and normally just one clock (ADC clock) is
used for all communication with the AD7869. For simplicity, all
the interface examples in this data sheet use synchronous inter­facing and use the ADC clock (RCLK) as an input for the DAC
clock (TCLK). For a better understanding of each of these in­terfaces, consult the relevant processor data sheet.

Table I. Interconnect Lines for Different Interfacing Options

Number of

Configuration Interconnects Signals

AD7869–DSP56000 Interface

Figure 16 shows a typical interface between the AD7869 and
DSP56000. The interface arrangement is synchronous with a
gated clock requiring only three lines of interconnect. The
DSP56000 internal serial control registers have to be configured
for a 16-bit data word with valid data on the first falling clock
edge. Conversion starts and DAC updating are controlled by an
external timer. Data transfers, which occur during ADC conver­sions, are between the processor receive and transmit shift regis­ters and the AD7869’s ADC and DAC. At the end of each
16-bit transfer, the DSP56000 receives an internal interrupt in­dicating the transmit register is empty, and the receive register is
full.

CONVST

LDAC

CONTROL

AD7869*

RFS

TFS
RCLK

DR

DT

TCLK

5V+

DSP56000

SC0

SCK

SRD

STD

*ADDITIONAL PINS OMITTED FOR CLARITY

4.7kΩ 2kΩ 4.7kΩ

TIMER

Figure 16. AD7869–DSP56000 Interface

AD7869–ADSP-2101/2102 Interface

An interface that is suitable for the ADSP-2101 or the ADSP­2102 is shown in Figure 17. The interface is configured for syn­chronous, continuous clock operation. The
the DAC gets updated on the sixteenth falling clock after
goes low. Alternatively,

LDAC may be driven from a timer as

LDAC is tied low so

TFS

shown in Figure 16. As with the previous interface, the proces­sor receives an interrupt after reading or writing to the AD7869
and updates its own internal registers in preparation for the next
data transfer.

TIMER

CONVST

Synchronous 4 RCLK, DR, DT and

RFS

(TCLK = RCLK, TFS = RFS)

Asynchronous* 5 or 6 RCLK, DR, RFS, DT, TFS

(TCLK = RCLK or
µP serial CLK)

Synchronous 3 RCLK, DR and DT
Gated Clock (TCLK = RCLK, TFS = RFS)

*5 LINES OF INTERCONNECT WHEN TCLK = RCLK

6 LINES OF INTERCONNECT WHEN TCLK = µP SERIAL CLK

REV. A

–11–

CONTROL

–

5V

+

RFS

TFS

5V

4.7kΩ 2kΩ 4.7kΩ

DR

DT

AD7869*

RFS
RCLK
DR

TFS

TCLK

DT

LDAC

ADSP-2101/2

SCLK

*ADDITIONAL PINS OMITTED FOR CLARITY

Figure 17. AD7869–ADSP-2101/ADSP-2102 Interface

AD7869

AD7869–TMS32020 Interface

Figure 18 shows an interface that is suitable for the TMS32020/
TMS320C25 processors. This interface is configured for syn­chronous, continuous clock operation. Note the AD7869 will
not correctly interface to these processors if the AD7869 is con­figured for a noncontinuous clock. Conversion starts and DAC
updating are controlled by an external timer.

TMS32020/

TMS320C25

*ADDITIONAL PINS OMITTED FOR CLARITY

FSR

CLKR

FSX

CLKX

DR

DX

+

5V

4.7kΩ 2kΩ 4.7kΩ

TIMER

CONVST
LDAC

–

5V

CONTROL

AD7869*

RFS
RCLK

DR

TFS

TCLK

DT

Figure 18. AD7869–TMS32020/TMS32025 Interface

APPLICATION HINTS

Good printed circuit board (PCB) layout is as important as the
circuit design itself in achieving high speed A/D performance.
The AD7869’s comparator is required to make bit decisions on
an LSB size of 366 µV. To achieve this, the designer has to be
conscious of noise both in the ADC itself and in the preceding
analog circuitry. Switching mode power supplies are not recom­mended as the switching spikes will feed through to the com­parator causing noisy code transitions. Other causes of concern
are ground loops and digital feedthrough from microprocessors.
These are factors that influence any ADC, and a proper PCB
layout that minimizes these effects is essential for best
performance.

LAYOUT HINTS

Ensure that the layout for the printed circuit board has the digi­tal and analog signal lines separated as much as possible. Take
care not to run any digital track alongside an analog signal track.
Guard (screen) the analog input with AGND.

Establish a single point analog ground (star ground), separate
from the logic system ground, as close as possible to the
AD7869 AGND pins. Connect all other grounds and the
AD7869 DGND to this single analog ground point. Do not
connect any other digital grounds to this analog ground point.

Low impedance analog and digital power supply common re­turns are essential to low noise operation of the ADC, so make
the foil width for these tracks as wide as possible. The use of
ground planes minimizes impedance paths and also guards the
analog circuitry from digital noise. The circuit layout of Figures
22 and 23 have both analog and digital ground planes that are
kept separated and only joined together at the AD7869 AGND
pins.

NOISE

Keep the input signal leads to VIN and signal return leads from
AGND as short as possible to minimize input noise coupling. In
applications where this is not possible, use a shielded cable be-

tween the source and the ADC. Reduce the ground circuit im­pedance as much as possible since any potential difference in
grounds between the signal source and the ADC appears as an
error voltage in series with the input signal.

INPUT/OUTPUT BOARD

Figure 19 shows an analog I/O board based on the AD7869.
The corresponding printed circuit (PC) board layout and
silkscreen are shown in Figures 21 to 23.

The analog input to the AD7869 is buffered with an AD711 op
amp. There is a component grid provided near the analog input
on the PC board that may be used for an antialiasing filter for
the ADC or a reconstruction filter for the DAC or any other
conditioning circuitry. To facilitate this option, there are two
wire links (labeled LK1 and LK2) required on the analog input
and output tracks.

The board contains a SHA circuit that can be used on the out­put of the AD7869 DAC to extend the very good performance
of the part over a wider frequency range. The increased perfor­mance from the SHA can be seen from Figures 14 and 15 of
this data sheet. A wire link (labeled LK3) connects the board
output to either the SHA output or directly to the AD7869
DAC output .

There are three
driven from an external source independent of

LDAC link options on the board; LDAC can be

CONVST,

LDAC can be tied to CONVST or LDAC can be tied to GND.

Choosing the latter option disables the SHA operation and
places the SHA permanently in the track mode.

Microprocessor connections to the board are made by a 9-way
D-type connector. The pinout is shown in Figure 20. The
ADC’s digital outputs are buffered with 74HC4050s. These
buffers provide a higher current output capability for high
capacitance loads or cables. Normally, these buffers are not re­quired as the AD7869 will be sitting on the same board as the
processor.

POWER SUPPLY CONNECTIONS

The PC board requires two analog power supplies and one 5 V
digital supply. Connections to the analog supply are made di­rectly to the PC board as shown on the silkscreen in Figure 21.
The connections are labeled V+ and V–, and the range for both
of these supplies is 12 V to 15 V. Connections to the 5 V digital
supply are made through the D-type connector SKT6. The
±5 V analog supply required by the AD7869 is generated from
two voltage regulators on the V+ and V– supplies.

WIRE LINK OPTIONS
LK1, Analog Input Link

LK1 connects the analog input to a component grid or to a
buffer amplifier which drives the ADC input.

LK2, Analog Output Link

LK2 connects the analog output to the component grid or to ei­ther the SHA or DAC output (see LK3).

LK3, SHA or DAC Select

The analog output may be taken directly from the DAC or from
a SHA at the output of the DAC.

LK4, DAC Reference Selection

The DAC reference may be connected to either the ADC refer­ence output (RO ADC) or to the DAC reference (RO DAC).

–12–

REV. A

AD7869

ANALOG INPUT

±3V RANGE

SKT1

SKT2

ANALOG OUTPUT

±3V RANGE

AD711

R6

15k

C22

68pF

V–

C12

0.1µF

C21

330pF

5V

V

R

EXT/CEXT

C

EXT

IC8 1/2
74HC221

LK1

A

B

C

COMPONENT
GRID

COMPONENT
GRID

LK2

A

C10

0.1µFC910µF

+

IC3

R2

2k

Ω

CC

CLR

GND

C11
10µF

Q

A
B

10µF

V

C5

C

+

0.1µF

10µF

B

ADG201HS

5V

+

V

C6

+

C7

B

A
C

LK3

IC4

ABC

IC2

0.1µF

LK6

+

V

AD711

V

C8

IN OUT

–

R1

2k

Ω

IC5

78L05

GND

V

V

IN

AD7869

AGND

AGND

DGND

DGND

V

OUT

LDAC

CONVST

V

C4

0.1µF

DD

IC1

SS

5V

V

DD

RO ADC

RI DAC

RO DAC

CONTROL

RCLK

RFS

TFS

TCLK

CLK

V

SS

C3
10µF

C2

C1

0.1µF

10µF

R7

200

C24

A

0.1µF

B

LK4

C

–

5V

A
B

LK5

C

5V

R3

Ω

IC6

79L05

GND

R4

2k

4.7k

Ω

V–

INOUT

4.7k

DR

DT

–

5V

C23
10µF

SKT6

9-WAY D-TYPE

IC7 1/2

74HC4050

R5

Ω

LK8

B

A

C

LK7

–

5V

CONNECTOR

5V

DR

RCLK

RFS

LK9

TFS

TCLK

DT

DGND

SKT3
LDAC

SKT4

CONVST

Figure 19. Input/Output Circuit Based on the AD7869

LK5, ADC Internal Clock Selection

This link configures the ADC for continuous or noncontinuous
internal clock operation.

LK6, DAC Updating

The DAC, LDAC input may asserted independently of the
ADC

CONVST signal or it may be tied to CONVST or it may

tied to GND.

LK7, ADC Clock Source

This link provides the option for the ADC to use its own inter­nal clock oscillator or an external TTL compatible clock.

LK8 Frame Synchronous Option

LK8 provides the option of tying the ADC RFS output to the
DAC

TFS input.

REV. A

–13–

SKT5
EXT CLK

LK9 Transmit/Receive Clock Option

LK9 provides the option to connect the ADC RCLK to the
DAC TCLK.

RFS

TCLK

DT

RCLK

DR

2 431 5

6 7 8 9

5V

NC

TFS

DGND

NC = NO CONNECT

Figure 20. SKT6, D-Type Connector Pinout

AD7869

COMPONENT LIST

IC1 AD7869
IC2, IC3 2X AD711
IC4, ADG201HS
IC5, MC78L05
IC6, MC79L05
IC7, 74HC4050
IC8, 74HC221

C1, C3, C5, C7
C9, C11, C13, C15 10 µF Capacitor
C17, C19, C23

C2, C4, C6, C8
C10, C12, C14, C16 0.1 µF Capacitor
C18, C20, C24

C21 330 pF Capacitor
C22 68 pF Capacitor

R1, R2, R4 2 kΩ Resistor
R3, R5 4.7 kΩ Resistor
R6 15 kΩ Resistor
R7 200 Ω Resistor

LK1, LK2, LK3,
LK4, LK5, LK6,
LK7, LK8, LK9 Shorting Plugs

SKT1, SKT2, SKT3,
SKT4, SKT5 BNC Sockets

SKT6 9-Contact D-Type Connector

Figure 21. Silkscreen for the Circuit Diagram of Figure 19

–14–

REV. A

AD7869

Figure 22. Component Side Layout for the Circuit Diagram of Figure 19

REV. A

Figure 23. Solder Side Layout for the Circuit Diagram of Figure 19

–15–

AD7869

)
)

0.708 (18.02)

OUTLINE DIMENSIONS

Dimensions shown in inches and (mm).

24-Pin Plastic DIP (N-24)

1.275 (32.30)

1.125 (28.60)

24

112

MAX

0.200 (5.05)

0.125 (3.18)

PIN 1

0.022 (0.558)

0.014 (0.356)

0.100
(2.54)

BSC

0.210
(5.33)

13

0.060 (1.52)

0.015 (0.38)

0.070 (1.77)

0.045 (1.15)

0.280 (7.11)

0.240 (6.10)

0.150
(3.81)
MIN

SEATING
PLANE

0.325 (8.25)

0.300 (7.62)

0.015 (0.381)

0.008 (0.204)

0.299 (7.6)

0.195 (4.95)

0.115 (2.93)

0.291 (7.39)

24-Pin Cerdip (Q-24)

28-Pin Plastic SOIC (R-28)

0.696 (17.67)

28 15

0.414 (10.52)

0.398 (10.10)

141

0.096 (2.44)

0.089 (2.26)

0.05

0.01 (0.254)

0.006 (0.15)

1. LEAD NO. 1 INDENTIFIED BY A DOT.

2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.

(1.27)

BSC

0.019 (0.49)

0.014 (0.35)

0.013 (0.32)

0.009 (0.23)

0.03 (0.76)

0.02 (0.51)

6°
0°

x 45°

0.042 (1.067

0.018 (0.457

C1472–10–11/90

PRINTED IN U.S.A.

–16–

REV. A