Datasheet AD7868BR, AD7868BQ, AD7868AR, AD7868AQ, AD7868AN Datasheet (Analog Devices)

Page 1
LC2MOS
RO DAC
RI DAC
DGND
AD7868
R
R
RO ADC
AGND
CLOCK
R
R
12-BIT
DAC
DAC SERIAL
INTERFACE
ADC SERIAL INTERFACE
12-BIT
ADC
DAC 3V
REFERENCE
ADC 3V
REFERENCE
TRACK/HOLD
V
IN
V
OUT
LDAC
TFS
TCLK
DT
CONTROL
RFS
RCLK
DR
CLK
CONVST
V
DD
V
SS
a
Complete, 12-Bit Analog I/O System
FEATURES Complete 12-Bit I/O System, Comprising:
12-Bit ADC with Track/Hold Amplifier
83 kHz Throughout Rate 72 dB SNR
12-Bit DAC with Output Amplifier
3 ms Settling Time 72 dB SNR
On-Chip Voltage Reference Operates from 65 V Supplies Low Power – 130 mW typ Small 0.3" Wide DIP
APPLICATIONS Digital Signal Processing Speech Recognition and Synthesis Spectrum Analysis High Speed Modems DSP Servo Control

GENERAL DESCRIPTION

The AD7868 is a complete 12-bit I/O system containing a DAC and an ADC . The ADC is a successive approximation type with a track-and-hold amplifier having a combined throughput rate of 83 kHz. The DAC has an output buffer amplifier with a settling time of 3 µs to 12 bits. Temperature compensated 3 V buried Zener references provide precision references for the DAC and ADC.
Interfacing to both the DAC and ADC is serial, minimizing pin count and giving a small 24-pin package size. Standard control signals allow serial interfacing to most DSP machines. Asyn­chronous ADC conversion control and DAC updating is made possible with the
CONVST and LDAC logic inputs.
The AD7868 operates from ±5 V power supplies, the analog in­put/output range of the ADC/DAC is ±3 V. The part is fully specified for dynamic parameters such as signal-to-noise ratio and harmonic distortion as well as traditional dc specifications.
The part is available in a 24-pin, 0.3" wide, plastic or hermetic dual-in-line package (DIP) and in a 28-pin, plastic SOIC package.
AD7868

FUNCTIONAL BLOCK DIAGRAM

PRODUCT HIGHLIGHTS

1. Complete 12-Bit I/O System. The AD7868 contains a 12-bit ADC with a track-and-hold amplifier and a 12-bit DAC with output amplifier. Also included are separate on-chip voltage references for the DAC and the ADC.
2. Dynamic Specifications for DSP Users. In addition to traditional dc specifications, the AD7868 is specified for ac parameters including signal-to-noise ratio and harmonic distortion. These parameters along with im­portant timing parameters are tested on every device.
3. Small Package. The AD7868 is available in a 24-pin DIP and a 28-pin SOIC package.
REV. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
© Analog Devices, Inc., 1996
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 617/329-4700 Fax: 617/326-8703
Page 2
AD7868–SPECIFICA TIONS
(VDD = +5 V 6 5%, VSS = –5 V 6 5%, AGND = DGND = 0 V, f
ADC SECTION
unless otherwise noted.)
= 2.0 MHz external. All specifications T
CLK
MIN
to T
MAX-
Parameter Version1Version1Version1Units Test Conditions/Comments
ABT
DYNAMIC PERFORMANCE
Signal-to-Noise Ratio
T
to T
MIN
Total Harmonic Distortion (THD) –78 –78 –76 dB max VIN = 10 kHz Sine Wave, f
MAX
Peak Harmonic or Spurious Noise –78 –78 –76 dB max VIN = 10 kHz Sine Wave, f
2
3, 4
(SNR) @ +25°C 70 72 70 dB min VIN = 10 kHz Sine Wave, f
70 71 70 dB min Typically 71.5 dB for 0 < VIN < 41.5 kHz
Typically 71.5 dB for 0 < VIN < 41.5 kHz Typically 71.5 dB for 0 < VIN < 41.5 kHz
SAMPLE
SAMPLE
SAMPLE
= 83 kHz = 83 kHz = 83 kHz
Intermodulation Distortion (IMD)
Second Order Terms –78 –78 –76 dB max fa = 9 kHz, fb = 9.5 kHz, f Third Order Terms –80 –80 –78 dB max fa = 9 kHz, fb = 9.5 kHz, f
Track/Hold Acquisition Time 2 2 2 µs max
SAMPLE SAMPLE
= 50 kHz = 50 kHz
DC ACCURACY
Resolution 12 12 12 Bits Minimum Resolution 12 12 12 Bits No Missing Codes Are Guaranteed Integral Nonlinearity ± 12 ± 12 ±12 LSB typ Integral Nonlinearity ± 1 ±1 LSB max Differential Nonlinearity ± 0.9 ± 0.9 ± 0.9 LSB max Bipolar Zero Error ±5 ±5 ±5 LSB max Positive Gain Error Negative Gain Error
5
5
±5 ±5 ±5 LSB max ±5 ±5 ±5 LSB max
ANALOG INPUT
Input Voltage Range ±3 ±3 ±3 Volts Input Current ± 1 ±1 ±1 mA max
REFERENCE OUTPUT
6
RO ADC @ +25°C 2.99/3.01 2.99/3.01 2.99/3.01 V min/V max RO ADC TC ±25 ±25 ±25 ppm/°C typ RO ADC TC ±40 ±50 ppm/°C max Reference Load Sensitivity (RO ADC vs. I) –1.5 –1.5 –1.5 mV max Reference Load Current Change (0 µA–500 µA),
Reference Load Should Not Be Changed During Conversion
LOGIC INPUTS (CONVST, CLK, CONTROL)
Input High Voltage, V Input Low Voltage, V Input Current, I Input Current7 (CONTROL Input Only) ±10 ±10 ±10 µA max VIN = VSS to DGND Input Capacitance, C
INH
INL
IN
8
IN
2.4 2.4 2.4 V min VDD = 5 V ± 5%
0.8 0.8 0.8 V max VDD = 5 V ± 5% ±10 ±10 ±10 µA max VIN = 0 V to V
10 10 10 pF max
DD
LOGIC OUTPUTS
DR, RFS Outputs
Output Low Voltage, V
RCLK Output
Output Low Voltage, V
DR, RFS, RCLK Outputs
Floating-State Leakage Current ± 10 ±10 ±10 µA max Floating-State Output Capacitance
OL
OL
8
0.4 0.4 0.4 V max I
0.4 0.4 0.4 V max I
15 15 15 pF max
= 1.6 mA, Pull-Up Resistor = 4.7 k
SINK
= 2.6 mA, Pull-Up Resistor = 2 k
SINK
CONVERSION TIME
External Clock 10 10 10 µs max Internal Clock 10 10 10 µs max The Internal Clock Has a Nominal Value of 2.0 MHz
POWER REQUIREMENTS For Both DAC and ADC
V
DD
V
SS
I
DD
I
SS
+5 +5 +5 V nom ± 5% for Specified Performance –5 –5 –5 V nom ±5% for Specified Performance 22 22 25 mA max Cumulative Current from the Two VDD Pins 12 12 13 mA max Cumulative Current from the Two VSS Pins
Total Power Dissipation 170 170 190 mW max Typically 130 mW
NOTES
1
Temperature ranges are as follows: A/B Versions, –40°C to +85 °C; T Version, –55 °C to +125°C.
2
VIN = ±3 V
3
SNR calculation includes distortion and noise components.
4
SNR degradation due to asynchronous DAC updating during conversion is 0.1 dB typ.
5
Measured with respect to internal reference.
6
For capacitive loads greater than 50 pF a series resistor is required (see INTERNAL REFERENCE section).
7
Tying the CONTROL input to VDD places the device in a factory test mode where normal operation is not exhibited.
8
Sample tested @ +25°C to ensure compliance.
Specifications subject to change without notice.
–2–
REV. B
Page 3

DAC SECTION

AD7868
(VDD = +5 V 6 5%, VSS = –5 V 6 5%, AGND = DGND = 0 V, RI DAC = +3 V and decoupled as shown in Figure 2, V Load to AGND; RL = 2 k, CL = 100 pF. All specifications T
MIN
to T
unless otherwise noted.)
MAX
OUT
Parameter Version1Version1Version1Units Test Conditions/Comments
ABT
DYNAMIC PERFORMANCE
Signal-to-Noise Ratio3 (SNR) @ +25°C 70 72 70 dB min V
T
to T
MIN
Total Harmonic Distortion (THD) –78 –78 –76 dB max V
MAX
Peak Harmonic or Spurious Noise –78 –78 –76 dB max V
2
= 1 kHz Sine Wave, f
70 71 70 dB min Typically 71.5 dB at +25°C for 0 < V
OUT
= 1 kHz Sine Wave, f
OUT
Typically –84 dB at +25°C for 0 < V
= 1 kHz Sine Wave, f
OUT
Typically –84 dB at +25°C for 0 < V
SAMPLE
SAMPLE
SAMPLE
= 83 kHz
< 20 kHz
OUT
= 83 kHz
< 20 kHz
OUT
= 83 kHz
< 20 kHz
OUT
DC ACCURACY
Resolution 12 12 12 Bits Integral Nonlinearity ±1/2 ±1/2 ±1/2 LSB typ Integral Nonlinearity ± 1 ±1 LSB max Differential Nonlinearity ± 0.9 ± 0.9 ± 0.9 LSB max Guaranteed Monotonic Bipolar Zero Error ±5 ±5 ±5 LSB max Positive Full-Scale Error Negative Full-Scale Error
REFERENCE OUTPUT
5
5
6
± 5 ±5 ±5 LSB max ±5 ±5 ±5 LSB max
RO ADC @ +25°C 2.99/3.01 2.99/3.01 2.99/3.01 V min/V max RO ADC TC ±25 ±25 ±25 ppm/°C typ RO ADC TC ±40 ±50 ppm/°C max Reference Load Change (RO DAC vs. I) –1.5 –1.5 –1.5 mV max Reference Load Current Change (0–500 µA)
REFERENCE INPUT
RI DAC Input Range 2.85/3.15 2.85/3.15 2.85/3.15 V min/V max 3 V ± 5% Input Current 1 1 1 µA max
LOGIC INPUTS (LDAC, TFS, TCLK, DT)
Input High Voltage, V Input Low Voltage, V Input Current, I Input Capacitance, C
IN
INL
IN
INH
7
2.4 2.4 2.4 V min VDD = 5 V ± 5%
0.8 0.8 0.8 V max VDD = 5 V ± 5% ±10 ±10 ±10 µA max VIN = 0 V to V 10 10 10 pF max
DD
ANALOG INPUT
Output Voltage Range ±3 ±3 ±3 V nom dc Output Impedance 0.3 0.3 0.3 typ Short-Circuit Current 20 20 20 mA typ
AC CHARACTERISTICS
7
Voltage Output Settling-Time Settling Time to Within ± 1/2 LSB of Final Value
Positive Full-Scale Change 3 3 3 µs max Typically 2 µs
Negative Full-Scale Change 3 3 3 µs max Typically 2.5 µs Digital-to-Analog Glitch Impulse 10 10 10 nV secs typ DAC Code Change All 1s to All 0s Digital Feedthrough 2 2 2 nV secs typ VIN to V
Isolation 100 100 100 dB typ VIN = ±3 V, 41.5 kHz Sine Wave
OUT
POWER REQUIREMENTS As per ADC Section
NOTES
1
Temperature ranges are as follows: A/B Versions, –40°C to +85 °C; T Version, –55 °C to +125°C.
2
V
(pk–pk) = ±3 V.
OUT
3
SNR calculation includes distortion and noise components.
4
Using external sample and hold.
5
Measured with respect to RI DAC and includes bipolar offset error.
6
For capacitive loads greater than 50 pF a series resistor is required (see INTERNAL REFERENCE section).
7
Sample tested @ +25°C to ensure compliance.
Specifications subject to change without notice.
Model Range SNR (LSB) Option*
AD7868AN –40°C to +85°C 70 dB ±1/2 typ N-24

ORDERING GUIDE

Relative
Temperature Accuracy Package
AD7868AQ –40°C to +85°C 70 dB ± 1/2 typ Q-24 AD7868BN –40°C to +85°C 72 dB ± 1 max N-24 AD7868BQ –40°C to +85°C 72 dB ±1 max Q-24 AD7868AR –40°C to +85°C 70 dB ±1/2 typ R-28 AD7868BR –40°C to +85°C 72 dB ± 1 max R-28
*N = Plastic DIP; Q = Cerdip; R = SOIC (Small Outline IC).
4
4
4
REV. B
–3–
Page 4
AD7868
WARNING!
ESD SENSITIVE DEVICE
RO ADC
DGND
TCLK
DT
RI DAC
AGND
CONTROL
CLK
RCLK
DR
DGND
AGND
RO DAC
NC
V
DD
NC = NO CONNECT
1
7
8 9
24 23
22 21
20
19 18 17
16
15
14
12
13
AD7868
TOP VIEW
(Not to Scale)
CONVST
RFS
V
SS
V
OUT
V
IN
TFS
LDAC
10
11
3
4 5
6
2
28 27
26 25
NC
NC
NC
NC
V
DD
V
SS

TIMING CHARACTERISTICS

1, 2
(VDD = +5 V 6 5%, VSS = –5 V 6 5%, AGND = DGND = 0 V)
Limit at T
MIN
, T
MAX
Limit at T
MIN
, T
MAX
Parameter (A, B Versions) (T Version) Units Conditions/Comments
ADC TIMING
t
1
3
t
2
t
3
t
4
4
t
5
t
6
5
t
13
50 50 ns min CONVST Pulse Width 440 440 ns min RCLK Cycle Time, Internal Clock 100 100 ns min RFS to RCLK Falling Edge Setup Time 20 20 ns min RCLK Rising Edge to RFS 100 100 ns max 155 155 ns max RCLK to Valid Data Delay, CL = 35 pF 4 4 ns min Bus Relinquish Time after RCLK 100 100 ns max 2 RCLK +200 to 2 RCLK +200 to ns typ CONVST to RFS Delay 3 RCLK + 200 3 RCLK + 200
DAC TIMING
t
7
t
8
6
t
9
t
10
t
11
t
12
NOTES
1
Timing specifications are sample tested at +25°C to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of 5 V) and timed from a voltage level of 1.6 V.
2
Serial timing is measured with a 4.7 k pull-up resistor on DR and RFS and a 2 k pull-up resistor on RCLK . The capacitance on all three output is 35 pF.
3
When using internal clock, RCLK mark/space ratio (measured from a voltage level of 1.6 V) range is 40/60 to 60/40. For external clock, RCLK mark/space ratio = external clock mark/space ratio.
4
DR will drive higher capacitance loads but this will add to t5 since it increases the external RC time constant (4.7 k/CL) and hence the time to reach 2.4 V.
5
Time 2 RCLK to 3 RCLK depends on conversion start to ADC clock synchronization.
6
TCLK mark/space ratio is 40/60 to 60/40.
50 50 ns min TFS to TCLK Falling Edge 75 100 ns min TCLK Falling Edge to TFS 150 200 ns min TCLK Cycle Time 30 40 ns min Data Valid to TCLK Setup Time 75 100 ns min Data Valid to TCLK Hold Time 40 40 ns min LDAC Pulse Width
ABSOLUTE MAXIMUM RATINGS*
(TA = +25°C unless otherwise noted)
VDD to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
V
SS
AGND to DGND . . . . . . . . . . . . . . . . . –0.3 V to V
V
OUT
VIN to AGND . . . . . . . . . . . . . . . . VSS –0.3 V to VDD + 0.3 V
RO ADC to AGND . . . . . . . . . . . . . . . –0.3 V to V
RO DAC to AGND . . . . . . . . . . . . . . . –0.3 V to V
RI DAC to AGND . . . . . . . . . . . . . . . –0.3 V to V
Digital Inputs to AGND . . . . . . . . . . . –0.3 V to V
Digital Outputs to AGND . . . . . . . . . . –0.3 V to V
Operating Temperature Range
A, B Versions . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
T Version . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . . +300°C
Power Dissipation (Any Package) to +75°C . . . . . . . . 450 mW
Derates above +75°C by . . . . . . . . . . . . . . . . . . . . 10 mW/°C
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7868 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –7 V
+0.3 V
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS to V
DD
+ 0.3 V
DD
+ 0.3 V
DD
+ 0.3 V
DD
+ 0.3 V
DD
+ 0.3 V
DD
DD
–4–
CONVST
CLK
RFS
RCLK
DGND
V
AGND
V
OUT
V
RO DAC
RI DAC
1
2
3
4
5
DR
6
7
DD
8
9
SS
10
11
12

PIN CONFIGURATIONS

DIP
AD7868
TOP VIEW
(Not to Scale)
NC = NO CONNECT
24
23
22
21
20
19
18
17
16
15
14
13
CONTROL
V
DD
V
SS
V
IN
RO ADC
AGND
NC
DGND
TCLK
DT
TFS
LDAC
SOIC
REV. B
Page 5
AD7868

PIN FUNCTION DESCRIPTION

DIP Pin Number Mnemonic Function
POWER SUPPLY 7 & 23 V
10 & 22 V
DD SS
8 & 19 AGND Analog Ground. Both AGND pins must be tied together. 6 &17 DGND Digital Ground. Both DGND pins must be tied together.
ANALOG SIGNAL AND REFERENCE 21 V
9V
IN OUT
20 RO ADC Voltage Reference Output. The internal ADC 3 V reference is provided at this pin. This output may be
11 RO DAC DAC Voltage Reference Output. This is one of two internal voltage references. To operate the DAC
12 RI DAC DAC Voltage Reference Input. The voltage reference for the DAC must be applied to this pin. It is
Positive Power Supply, 5 V ± 5%. Both VDD pins must be tied together. Negative Power Supply, –5 V ± 5%. Both VSS pins must be tied together.
ADC Analog Input. The ADC input range is ± 3 V. Analog Output Voltage from DAC. This output comes from a buffer amplifier. The range is
bipolar, ±3 V with RI DAC = +3 V.
used as a reference for the DAC by connecting it to the RI DAC input. The external load capability of this reference is 500 µA.
with this internal reference, RO DAC should be connected to RI DAC. The external load capability of the reference is 500 µA.
internally buffered before being applied to the DAC. The nominal reference voltage for correct operation of the AD7868 is 3 V.
ADC INTERFACE AND CONTROL 2 CLK Clock Input. An external TTL-compatible clock may be applied to this input. Alternatively, tying pin to
V
enables the internal laser-trimmed oscillator.
SS
3
RFS Receive Frame Synchronization, Logic Output. This is an active low open-drain output which provides
a framing pulse for serial data. An external 4.7 k pull-up resistor is required on
RFS.
4 RCLK Receive Clock, Logic Output. RCLK is the gated serial clock output which is derived from the internal
or external ADC clock. If the CONTROL input is at V
the clock runs continuously. With the
SS
CONTROL input at DGND the RCLK output is gated off (three-stated) after serial transmission is complete. RCLK is an open-drain output and requires an external 2 k pull-up resistor.
5 DR Receive Data, Logic Output. This is an open-drain data output used in conjunction with
RCLK to transmit data from the ADC. Serial data is valid on the falling edge of RCLK when
RFS and
RFS is
low. An external 4.7 k resistor is required on the DR output.
1
CONVST Convert Start, Logic Input. A low to high transition on this input puts the track-and-hold amplifier into
the hold mode and starts an ADC conversion. This input in asynchronous to the CLK input.
24 CONTROL Control, Logic Input. With this pin at 0 V, the RCLK is noncontinuous. With this pin at –5 V, the
RCLK is continuous. Note, tying this pin to V
places the part in a factory test mode where normal
DD
operation is not exhibited.
DAC INTERFACE AND CONTROL 14
TFS Transmit Frame Synchronization, Logic Input. This is a frame or synchronization signal for the DAC
with serial data expected after the falling edge of this signal.
15 DT Transmit Data, Logic Input. This is the data input which is used in conjunction with
TFS and TCLK
to transfer serial data to the input latch.
16 TCLK Transmit Clock, Logic Input. Serial data bits are latched on the falling edge of TCLK when 13
LDAC Load DAC, Logic Input. A new word is transferred into the DAC latch from the input latch on the
TFS is low.
falling edge of this signal.
18 NC No Connect.
REV. B
–5–
Page 6
AD7868
CONVERTER DETAILS
The AD7868 is a complete 12-bit I/O port, the only external components required for normal operation are pull-up resistors for the ADC data outputs and power supply decoupling capaci­tors. It is comprised of a 12-bit successive approximation ADC with a track/hold amplifier, a 12-bit DAC with a buffered output and two 3 V buried Zener references, a clock oscillator and con­trol logic.
ADC CLOCK
The AD7868 has an internal clock oscillator which can be used for the ADC conversion procedure. The oscillator is enabled by tying the CLK input to V
. The oscillator in laser trimmed at
SS
the factory to give a conversion time of between 8.5 and 10 µs. The mark/space ratio can vary from 40/60 to 60/40. Alterna­tively, an external TTL compatible clock may be applied to this input. The allowable mark/space ratio of an external clock is 40/60 to 60/40. RCLK is a clock output, used for the serial in­terface. This output is derived directly from the ADC clock source and can be switched off at the end of conversion with the CONTROL input.
ADC CONVERSION TIMING
The conversion time for both external clock and continuous in­ternal clock can vary from 19 to 20 rising clock edges depending on the conversion start to ADC clock synchronization. If a con­version is initiated within 30 ns prior to a rising edge of the ADC clock, the conversion time will consist of 20 rising clock edges, i.e., 9.5 µs conversion time. For noncontinuous internal clock, the conversion time is always 19 rising clock edges.
ADC TRACK-AND-HOLD AMPLIFIER
The track-and-hold amplifier on the analog input of the AD7868 allows the ADC to accurately convert an input sine wave of 6 V peak–peak amplitude to 12-bit accuracy. The input impedance is typically 9 k, an equivalent circuit is shown in Figure 1. The input bandwidth of the track/hold amplifier is much greater than the Nyquist rate of the ADC, even when the ADC is operated at its maximum throughput rate. The 0.1 dB cutoff frequency oc­curs typically at 500 kHz. The track/hold amplifier acquires an input signal to 12-bit accuracy in less than 2 µs.
The operation of the track/hold amplifier is essentially transpar­ent to the user. The track/hold amplifier goes from its track mode to its hold mode at the start of conversion on the rising edge of
CONVST.
INTERNAL REFERENCES
The AD7868 has two on-chip temperature compensated buried Zener references which are factory trimmed to 3 V ± 10 mV. One reference provides the appropriate biasing for the ADC, while the other is available as a reference of the DAC. Both ref­erence outputs are available (labeled RO DAC and RO ADC) and are capable of providing up to 500 µA to an external load.
The DAC input reference (RI DAC) can be stored externally or connected to any of the two on-chip references. Applications requiring good full-scale error matching between the DAC and the ADC should use the ADC reference as shown in Figure 4.
The maximum recommended capacitance on either of the refer­ence output pins for normal operation is 50 pF. If either of the reference outputs is required to drive a capacitive load greater than 50 pF, then a 200 resistor must be placed in series with the capacitive load. The addition of decoupling capacitors, 10 µF in parallel with 0.1 µF, as shown in Figure 2, improves noise performance. The improvement in noise performance can be seen from the graph in Figure 3. Note, this applies for the DAC output only; reference decoupling components do not af­fect ADC performance. So, a typical application will have just the DAC reference source decoupled with the other one open circuited.
RO DAC
or
RO ADC*
RI DAC
*RO DAC/RO ADC CAN BE LEFT OPEN CIRCUIT IF NOT USED
200
10µF
EXT LOAD GREATER THAN 50pF
0.1µF
Figure 2. Reference Decoupling Circuitry
TRACK/HOLD
V
IN
4.5kΩ
4.5kΩ
*ADDITIONAL PINS OMITTED FOR CLARITY
AMPLIFIER
AD7868*
TO INTERNAL 3V REFERENCE
TO INTERNAL COMPARATOR
Figure 1. ADC Analog Input
The overall throughput rate is equal to the conversion time plus the track/hold amplifier acquisition time. For a 2.0 MHz input clock the throughput time is 12 µs max.
–6–
DAC OUTPUT AMPLIFIER
The output from the voltage-mode DAC is buffered by a nonin­verting amplifier. The buffer amplifier is capable of developing ±3 V across 2 k and 100 pF load to ground and can produce 6 V peak-to-peak sine wave signals to a frequency of 20 kHz. The output is updated on the falling edge of the
LDAC input. The output voltage settling time, to within 1/2 LSB of its final value, is typically less than 2 µs.
The small signal (200 mV p-p) bandwidth of the output buffer amplifier is typically 1 MHz. The output noise from the ampli­fier is low with a figure of 30 nV/
Hz at a frequency of 1 kHz. The broadband noise from the amplifier exhibits a typical peak­to-peak figure of 150 µV for a 1 MHz output bandwidth. Fig- ure 3 shows a typical plot of noise spectral density versus fre­quency for the output buffer amplifier and for either of the on-chip references.
REV. B
Page 7
AD7868
500
TA = +25°C V
= +5V
200
100
nV – Hz
50
20
10
50 100 200
REF OUT
DAC OUTPUT WITH ALL 0s LOADED
REF OUT DECOUPLED AS SHOWN IN FIGURE 2
1k 2k FREQUENCY – Hz
DD
V
= –5V
SS
10k
20k
100k
Figure 3. Noise Spectral Density vs. Frequency

INPUT/OUTPUT TRANSFER FUNCTIONS

A bipolar circuit for the AD7868 is shown in Figure 4. The ana­log input/output voltage range of the AD7868 is ± 3 V. The de­signed code transitions for the ADC occur midway between successive integer LSB values (i.e., 1/2 LSB, 3/2 LSB, 5/2 LSB . . . FS – 3/2 LSBs). The input/output code is 2s complement binary with 1 LSB = FS/4096 = 1.46 mV. The ideal transfer function is shown in Figure 5.
ANALOG INPUT RANGE = ±3V
10µF
AD7868*
V
IN
RI DAC
R1
200
C1
*ADDITIONAL PINS OMITTED FOR CLARITY
C2
0.1µF
RO ADC
AGND
ANALOG OUTPUT RANGE = ±3V
V
OUT
Figure 4. AD7868 Basic Bipolar Operation Using RO ADC as a Reference Input for the DAC
OUTPUT CODE
011...111
011...110
000...010
000...001
000...000
111...111
111...110
100...001
100...000
-FS 2
0V
INPUT VOLTAGE
+
FS
FS = 6V
1LSB =
-1LSB
2
FS
4096
Figure 5. AD7868 Input/Output Transfer Function

OFFSET AND FULL-SCALE ADJUSTMENT

In most digital signal processing (DSP) applications, offset and full-scale errors have little or no effect on system performance. Offset error can always be eliminated in the analog domain by ac coupling. Full-scale errors do not cause problems as long as
REV. B
–7–
the input signal is within the full dynamic range of the ADC. For applications which require that the input signal range match the full analog input dynamic range of the ADC, offset and full-scale errors have to be adjusted to zero.

ADC ADJUSTMENT

Figure 6 has signal conditioning at the input and output of the AD7868 for trimming the end points of the transfer functions of both the ADC and the DAC. Offset error must be adjusted be­fore full-scale error. For the ADC, this is achieved by trimming the offset of A1 while the input voltage, V1, is 1/2 LSB below ground. The trim procedure is as follows: apply a voltage of –0.73 mV (–1/2 LSB) at V1 in Figure 6 and adjust the offset voltage of A1 until the ADC output code flickers between 1111 1111 1111 (FFF HEX) and 0000 0000 0000 (000 HEX).
ADC gain error can be adjusted at either the first code transi­tion (ADC negative full scale) or the last code transition (ADC positive full scale). The trim procedures for both cases are as follows (see Figure 6).
ADC Positive Full-Scale Adjustment
Apply a voltage of 2.9978 V (FS/2 – 3/2 LSBs) at V1. Adjust R2 until the ADC output code flickers between 0111 1111 1110 (7FE HEX) and 0111 1111 1111 (7FF HEX).
ADC Negative Full-Scale Adjustment
Apply a voltage of –2.9993 V (–FS/2 + 1/2 LSB) at V1 and adjust R2 until the ADC output code flickers between 1000 0000 0000 (800 HEX) and 1000 0000 0001 (801 HEX).

DAC ADJUSTMENT

Op amp A2 is included in Figure 6 for the DAC transfer func­tion adjustment. Again offset must be adjusted before full scale. To adjust offset: load the DAC with 0000 0000 0000 (000 HEX) and trim the offset of A2 to 0 V. As with the ADC adjust­ment, gain error can be adjusted at either the first code transi­tion (DAC negative full scale) or the last code transition (DAC positive full scale). The trim procedures for both cases are as follows:
DAC Positive Full-Scale Adjustment
Load the DAC with 0111 1111 1111 (7FF HEX) and adjust R7 until the op amp output voltage is equal to 2.9985 V, (FS/2 – 1 LSB).
DAC Negative Full-Scale Adjustment
Load the DAC with 1000 0000 0000 (800 HEX) and adjust R7 until the op amp output voltage is equal to 3.0 V (–FS/2).
V1
INPUT VOLTAGE
RANGE = ±3V
R1
10k
R2
500
R3
10k
*ADDITIONAL PINS OMITTED FOR CLARITY
10k
A1
R4
R5
10k
V
IN
AD7868*
AGND
V
OUT
R6
10k
500
10k
R7
R8
R10
10k
A2
V0
OUTPUT VOLTAGE
RANGE = ± 3V
R9
10k
Figure 6. AD7868 with Input/Output Adjustment
Page 8
AD7868

TIMING AND CONTROL

Communication with the AD7868 is managed by 6 dedicated pins. These consist of separate serial clocks, word framing or strobe pulses and data signals for both receiving and transmit­ting data. Conversion starts and DAC updating are controlled by two digital inputs;
CONVST and LDAC. These inputs can be asserted independently of the microprocessor by an external timer when precise sampling intervals are required. Alterna­tively, the
LDAC and CONVST can be driven from a decoded address bus allowing the microprocessor control over conversion start and DAC updating as well as data communication to the AD7868.
ADC Timing
Conversion control is provided by the CONVST input. A low to high transition on
CONVST input starts conversion and drives the track/hold amplifier into its hold mode. Serial data then be­comes available while conversion is in progress. The correspond­ing timing diagram is shown in Figure 7. The word length is 16 bits; 4 leading zeros, followed by the 12-bit conversion result starting with the MSB. The data is synchronized to the serial clock output (RCLK) and is framed by the serial strobe (
RFS). Data is clocked out on a low to high transition of the serial clock and is valid on the falling edge of this clock while the put is low.
RFS goes low at the start of conversion and the first
RFS out-
serial data bit (which is the first leading zero) is valid on the first falling edge of RCLK. All the ADC serial lines are open-drain outputs and require external pull-up resistors.
The serial clock out is derived from the ADC master clock source which may be internal or external. Normally, RCLK is required during the serial transmission only. In these cases it can be shut down (i.e., placed into high impedance) at the end of conversion to allow multiple ADCs to share a common serial bus. However, some serial systems (e.g., TMS32020) require a
serial clock which runs continuously. Both options are available on the AD7868 ADC. With the CONTROL input at 0 V, RCLK is noncontinuous and when it is at –5 V, RCLK is continuous.
DAC Timing
The AD7868 DAC contains two latches, an input latch and a DAC latch. Data must be loaded to the input latch under the control of the TCLK,
TFS and DT serial logic inputs. Data is then transferred from the input latch to the DAC latch under the control of the
LDAC signal. Only the data in the DAC latch
determines the analog output of the AD7868. Data is loaded to the input latch under control of TCLK,
TFS
and DT. The AD7868 DAC expects a 16-bit stream of serial data on its DT input. Data must be valid on the falling edge of TCLK. The
TFS input provides the frame synchronization sig­nal which tells the AD7868 DAC that valid serial data will be available for the next 16 falling edges of TCLK. Figure 8 shows the timing diagram for the serial data format.
Although 16 bits of data are clocked into the input latch, only 12 bits are transferred into the DAC latch. Therefore, 4 bits in the stream are don’t cares since their value does not affect the DAC latch data. The bit positions are 4 don’t cares followed by the 12-bit DAC data starting with the MSB.
The
LDAC signal controls the transfer of data to the DAC latch. Normally, data is loaded to the DAC latch on the falling edge of
LDAC. However, if LDAC is held low, then serial data is loaded to the DAC latch on the sixteenth falling edge of TCLK. If
LDAC goes low during the loading of serial data to the input latch, no DAC latch update takes place on the falling edge of
LDAC. If LDAC stays low until the serial transfer is completed, then the update takes place on the sixteenth falling edge of TCLK. If
LDAC returns high before the serial data
transfer is completed, no DAC latch update takes place.
t
1
CONVST
1
RFS
2, 3
RCLK
1
DR
NOTES
1
EXTERNAL 4.7kΩ PULL-UP RESISTOR
2
EXTERNAL 2kΩ PULL-UP RESISTOR
3
CONTINUOUS RCLK (DASHED LINE) WHEN THE CONTROL INPUT = –5V AND
NONCONTINUOUS WHEN THE CONTROL INPUT = 0V
t
13
t
3
CONVERSION TIME
t
DB11 DB10 DB9 DB1 DB0
Figure 7. ADC Control Timing Diagram
t
TFS
TCLK
DT
7
DON'T CARE
t
9
DON'T
CARE
DON'T CARE
DON'T CARE
Figure 8. DAC Control Timing Diagram
–8–
t
2
5
t
11
t
10 DB11 DB10 DB1 DB0
t
4
t
6
t
8
REV. B
Page 9
AD7868
AD7868 DYNAMIC SPECIFICATIONS
The AD7868 is specified and 100% tested for dynamic perfor­mance specifications as well as traditional dc specifications such as integral and differential nonlinearity. These ac specifications are required for signal processing applications such as speech recognition, spectrum analysis, and high-speed modems. These applications require information on the converter’s effect on the spectral content of the input signal. Hence, the parameters for which the AD7868 is specified include SNR, harmonic distor­tion and peak harmonics. These terms are discussed in more de­tail in the following sections.
Signal-to-Noise Ratio (SNR)
SNR is the measured signal-to-noise ratio at the output of the ADC or DAC. The signal is the rms magnitude of the funda­mental. Noise is the rms sum of all the nonfundamental signals up to half the sampling frequency (fs/2) excluding dc. SNR is dependent upon the number of levels used in the quantization process; the more levels, the smaller the quantization noise. The theoretical signal-to-noise ratio for a sine wave input is given by
SNR = (6.02N + 1.76) dB (1)
where N is the number of bits. Thus for an ideal 12-bit con­verter, SNR = 74 dB.
Effective Number of Bits
The formula given in Equation 1 relates the SNR to the number of bits. Rewriting the formula, as in Equation 2, it is possible to get a measure of performance expressed in effective number of bits (N).
Figure 10 shows a typical plot of effective number of bits versus frequency for an AD7868BQ with a sampling frequency of 83 kHz. The effective number of bits typically falls between 11.7 and 11.85 corresponding to SNR figures of 72.2 and 73.1 dB.
Figure 9. AD7868, ADC FFT Plot
12
11.5
SNR–1.76
N =
6.02
(2)
The effective number of bits for a device can be calculated di­rectly from its measured SNR.
Harmonic Distortion
Harmonic distortion is the ratio of the rms sum of harmonics to the fundamental. For the AD7868, total harmonic distortion (THD) is defined as
2
2
2
2
2
+V
5
6
THD =20 log
+V
+V
V
2
+V
3
4
V
1
where V1 is the rms amplitude of the fundamental and V2, V3, V
, V5 and V6 are the rms amplitudes of the second through to
4
the sixth harmonic. The THD is also derived from the FFT plot of the ADC or DAC output spectrum.
ADC Testing
The output spectrum from the ADC is evaluated by applying a sine-wave signal of very low distortion to the V
input which is
IN
sampled at an 83 kHz sampling rate. A Fast Fourier Transform (FFT) plot is generated from which the SNR data can be ob­tained. Figure 9 shows a typical 2048 point FFT plot of the AD7868BQ ADC with an input signal of 10 kHz and a sam­pling frequency of 83 kHz. The SNR obtained from this graph is 73 dB. It should be noted that the harmonics are taken into account when calculating the SNR.
11
10.5
EFFECTIVE NUMBER OF BITS
10
0 41.5
SAMPLE FREQUENCY = 83 kHz T
= 25°C
A
INPUT FREQUENCY – kHz
Figure 10. Effective Number of Bits vs. Frequency for the ADC
DAC Testing
A simplified diagram of the method used to test the dynamic performance specifications of the DAC is outlined in Figure 11. Data is loaded to the DAC under control of the microcontroller and associated logic. The output of the DAC is applied to a 9th order low-pass filter whose cutoff frequency corresponds to the Nyquist limit. The output of the filter is in turn applied to a 16-bit accurate digitizer. This digitizes the signal and the micro­controller generates an FFT plot from which the dynamic per­formance of the DAC can be evaluated.
REV. B
–9–
Page 10
AD7868
TA = +25°C
FREQUENCY – kHz
80
70
0
0
205
SNR – dBs
10 15
40
30
20
10
60
50
MICRO-
CONTROLLER
AD7868
DAC
LOW-PASS
FILTER
16-BIT
DIGITIZER
Figure 11. AD7868 DAC Dynamic Performance Test Circuit
The digitizer sampling is synchronized with the DAC update rate to ease FFT calculations. The digitizer samples the DAC output after the output has settled to its new value. Therefore, if the digitizer were to sample the output directly it would effec­tively be sampling a dc value each time. As a result, the dynamic performance of the DAC would not be measured correctly. Us­ing the digitizer directly on the DAC output would give better results than the actual performance of the DAC. Using a filter between the DAC and the digitizer means that the digitizer samples a continuously moving signal and the true dynamic per­formance of the AD7868 DAC output is measured.
Figure 12 shows a typical 2048 point Fast Fourier Transform plot for the AD7868 DAC with an update rate of 83 kHz and an output frequency of 1 kHz. The SNR obtained from the graph is 73 dBs.
quencies at an update rate of 83 kHz. The plot of Figure 14 is without a sample-and-hold on the DAC output while the plot of Figure 15 is generated with a sample-and-hold on the output.
R2
2k2
C9
330pF
AD711
IN1
LDAC
AD7868*
LDAC
V
OUT
DELAY
1µs
ONE
SHOT
ADG201HS
R1
2k2
S1 D1
Q
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 13. DAC Sample-and-Hold Circuit
80
70
60
50
40
SNR – dBs
30
Figure 12. AD7868 DAC FFT Plot
Some applications will require improved performance versus fre­quency from the AD7868 DAC. In these applications, a simple sample-and-hold circuit such as that outlined in Figure 13 will extend the very good performance of the DAC to 20 kHz. Other applications will already have an inherent sample-and-hold function following the AD7868 DAC output. An example of this type of application is driving a switched-capacitor filter where the updating of the DAC is synchronized with the switched-capacitor filter. This inherent sample-and-hold function also extends the frequency range performance.
Performance versus Frequency
The typical performance plots of Figures 14 and 15 show the AD7868’s DAC performance over a wide range of input fre-
20
10
0
051
234
FREQUENCY – kHz
TA = +25°C
Figure 14. DAC Performance vs. Frequency (No Sample­and-Hold)
Figure 15. DAC Performance vs. Frequency (Sample-and­Hold)
–10–
REV. B
Page 11
AD7868
DSP56000
STD
TFS
*ADDITIONAL PINS OMITTED FOR CLARITY
DT
SCK
SRD
RCLK
DR
CONVST
RFS
TIMER
AD7868*
4.7k 2k 4.7k
LDAC
CONTROL
TCLK
5V+
SC0

MICROPROCESSOR INTERFACING

Microprocessor interfacing to the AD7868 is via a serial bus that uses standard protocol compatible with DSP machines. The communication interface consists of separate transmit (DAC) and receive (ADC) sections whose operations can be either syn­chronous or asynchronous with respect to each other. Each sec­tion has a clock signal, a data signal and a frame or strobe pulse. Synchronous operation means that data is transmitted from the ADC and to the DAC at the same time. In this mode only one interface clock is needed and this has to be the ADC clock out, so RCLK must be connected to TCLK. For asynchronous op­eration, DAC and ADC data transfers are independent of each other, the ADC provides the receive clock (RCLK) while the transmit clock (TCLK) may be provided by the processor or the ADC or some other external clock source.
Another option to be considered with serial interfacing is the use of a gated clock. A gated clock means that the device that is sending the data switches on the clock when data is ready to be transmitted and three states the clock output when transmission is complete. Only 16 clock pulses are transmitted with the first data bit getting latched into the receiving device on the first fall­ing clock edge. Ideally, there is no need for frame pulses, how­ever, the AD7868 DAC frame input (
TFS) has to be driven high between data transmissions. The easiest method is to use RFS to drive TFS and use only synchronous interfacing. This avoids the use of interconnects between the processor and AD7868 frame signals. Not all processors have a gated clock facility, Figure 16 shows an example with the DSP56000.
Table I below shows the number of interconnect lines between the processor and the AD7868 for the different interfacing op­tions. The AD7868 has the facility to use different clocks for transmitting and receiving data. This option, however, only ex­ists on some processors and normally just one clock (ADC clock) is used for all communication with the AD7868. For sim­plicity, all the interface examples in this data sheet use synchro­nous interfacing and use the ADC clock (RCLK) as an input for the DAC clock (TCLK). For a better understanding of each of these interfaces, consult the relevant processor data sheet.
Table I. Interconnect Lines for Different Interfacing Options
DSP56000 internal serial control registers have to be configured for a 16-bit data word with valid data on the first falling clock edge. Conversion starts and DAC updating are controlled by an external timer. Data transfers, which occur during ADC conver­sions, are between the processor receive and transmit shift regis­ters and the AD7868’s ADC and DAC. At the end of each 16-bit transfer the DSP56000 receives an internal interrupt indi­cating the transmit register is empty and the receive register is full.
Figure 16. AD7868—DSP56000 Interface

AD7868—ADSP-2101/ADSP-2102 Interface

An interface which is suitable for the ADSP-2101 or the ADSP­2102 is shown in Figure 17. The interface is configured for syn­chronous, continuous clock operation. The the DAC gets updated on the sixteenth falling clock after goes low. Alternatively
LDAC may be driven from a timer as
LDAC is tied low so
TFS
shown in Figure 16. As with the previous interface the processor receives an interrupt after reading or writing to the AD7868 and updates its own internal registers in preparation for the next data transfer.
Configuration Interconnects Signals
Synchronous 4 RCLK, DR, DT and Asynchronous* 5 or 6 RCLK, DR,
Synchronous 3 RCLK, DR and DT Gated Clock (TCLK = RCLK, TFS = RFS)
*5 LINES OF INTERCONNECT WHEN TCLK = RCLK
6 LINES OF INTERCONNECT WHEN TCLK = µP SERIAL CLK

AD7868—DSP56000 Interface

Figure 16 shows a typical interface between the AD7868 and DSP56000. The interface arrangement is synchronous with a gated clock requiring only three lines of interconnect. The
REV. B
No. of
(TCLK = RCLK,
TFS = RFS)
RFS, DT, TFS
(TCLK = RCLK or µP serial CLK)
RFS
TIMER
5V
ADSP-2101/ ADSP-2102
*ADDITIONAL PINS OMITTED FOR CLARITY
RFS
SCLK
TFS
+
5V
4.7k 2k 4.7k
DR
DT
Figure 17. AD7868—ADSP-2101/ADSP-2102 Interface
–11–
CONVST
CONTROL
AD7868*
RFS RCLK DR
TFS
TCLK
DT
LDAC
Page 12
AD7868

AD7868—TMS32020/TMS320C25 Interface

Figure 18 shows an interface which is suitable for the TMS32020/TMS320C25 processors. This interface is config­ured for synchronous, continuous clock operation. Note, the AD7868 will not interface correctly to these processors if the AD7868 is configured for a noncontinuous clock. Conversion starts and DAC updating are controlled by an external timer.
CONVST
LDAC
5V
CONTROL
AD7868*
RFS RCLK
DR
TFS
TCLK
DT
TMS32020
TMS320C25
CLKR
CLKX
*ADDITIONAL PINS OMITTED FOR CLARITY
FSR
FSX
+
5V
4.7k 2k 4.7k
DR
DX
TIMER
Figure 18. AD7868—TMS32020/TMS320C25 Interface

APPLICATION HINTS

Good printed circuit board (PCB) layout is as important as the circuit design itself in achieving high speed A/D performance. The AD7868’s comparator is required to make bit decisions on an LSB size of 1.465 mV. To achieve this, the designer has to be conscious of noise both in the ADC itself and in the preced­ing analog circuitry. Switching mode power supplies are not rec­ommended as the switching spikes will feed through to the comparator causing noisy code transitions. Other causes of con­cern are ground loops and digital feedthrough from micropro­cessors. These are factors which influence any ADC, and a proper PCB layout which minimizes these effects is essential for best performance.

LAYOUT HINTS

Ensure that the layout for the printed circuit board has the digi­tal and analog signal lines separated as much as possible. Take care not to run any digital track alongside an analog signal track. Guard (screen) the analog input with AGND.
Establish a single point analog ground (star ground) separate from the logic system ground as close as possible to the AD7868 AGND pins. Connect all other grounds and the AD7868 DGND to this single analog ground point. Do not connect any other digital grounds to this analog ground point.
Low impedance analog and digital power supply common re­turns are essential to low noise operation of the ADC, so make the foil width for these tracks as wide as possible. The use of ground planes minimizes impedance paths and also guards the
analog circuitry from digital noise. The circuit layout of Figures 22 and 23 have both analog and digital ground planes which are kept separated and only joined together at the AD7868 AGND pins.

NOISE

Keep the input signal leads to VIN and signal return leads from AGND as short as possible to minimize input noise coupling. In applications where this is not possible, use a shielded cable be­tween the source and the ADC. Reduce the ground circuit im­pedance as much as possible since any potential difference in grounds between the signal source and the ADC appears as an error voltage in series with the input signal.

INPUT/OUTPUT BOARD

Figure 19 shows an analog I/O board based on the AD7868. The corresponding printed circuit board (PCB) layout and silkscreen are shown in Figures 21 to 23.
The analog input to the AD7868 is buffered with an AD711 op amp. There is a component grid provided near the analog input on the PCB which may be used for an antialiasing filter for the ADC or a reconstruction filter for the DAC or any other condi­tioning circuitry. To facilitate this option, there are two wire links (labeled LK1 and LK2) required on the analog input and output tracks.
The board contains a SHA circuit which can be used on the output of the AD7868 DAC to extend the very good perfor­mance of the part over a wider frequency range. The increased performance from the SHA can be seen in Figures 14 and 15 of this data sheet. A wire link (labeled LK3) connects the board output to either the SHA output or directly to the AD7868 DAC output.
There are three driven from an external source independent of
LDAC link options on the board; LDAC can be
CONVST,
LDAC can be tied to CONVST or LDAC can be tied to GND.
Choosing the latter option of tying
LDAC to GND disables the SHA operation, and places the SHA permanently in the track mode.
Microprocessor connections to the board are made by a 9-way D-type connector. The pinout is shown in Figure 20. The ADC’s digital outputs are buffered with 74HC4050s. These buffers provide a higher current output capability for high capacitance loads or cables. Normally, these buffers are not required as the AD7868 will be sitting on the same board as the processor.

POWER SUPPLY CONNECTIONS

The PCB requires two analog power supplies and one 5 V digi­tal supply. Connections to the analog supply are made directly to the PCB as shown on the silkscreen in Figure 21. The con­nections are labeled V+ and V– and the range for both of these supplies is 12 V to 15 V. Connections to the 5 V digital supply are made through the D-type connector SKT6. The ± 5 V ana­log supply required by the AD7868 are generated from two volt­age regulators on the V+ and V– supplies.
–12–
REV. B
Page 13
AD7868
ANALOG INPUT
±3V RANGE
SKT1
SKT2
ANALOG OUTPUT
±3V RANGE
AD711
R6
15k
C22
68pF
A
COMPONENT GRID
IC3
V–
C12
0.1µF
C21
330pF
5V
V
CC
R
EXT/CEXT
C
EXT
IC8 1/2 74HC221
GND
LK1
B
C
COMPONENT GRID
LK2
A
C10
0.1µFC910µF
+
R2
2k
Q
A B
CLR
10µF
V
C11 10µF
C5
C
+
B
ADG201HS
5V
V+
0.1µF
C7
10µF
V+
IN OUT
IC5
78L05
C6
+
IC2
0.1µF
B
A C
LK3
GND
AD711
V–
C8
IC4
R1
2k
C
AB LK6
5V
V
V
DD
V
RO ADC
IN
RI DAC
RO DAC
IC1
AD7868
CONTROL
AGND
AGND
DGND
DGND
V
OUT
LDAC
CONVST
V
V
SS
SS
C4
0.1µFC310µF
DD
RCLK
TFS
TCLK
RFS
CLK
200
5V
4.7k
OUT
C1 10µF
R7
C24
0.1µF
A B
LK4
C
–5V A B
LK5
C
R3
R4
4.7k
2k
V–
IN
IC6
R5
C23 10µF
IC7 1/2
74HC4050
A
–5V
LK7
SKT6
9-WAY D-TYPE
CONNECTOR
5V
DR
RCLK
RFS
LK8
B
C
LK9
TFS
TCLK
DT
DGND
C2
0.1µF
DR
DT
–5V
79L05
GND
REV. B
SKT3 LDAC
SKT4
CONVST
Figure 19. Input/Output Circuit Based on the AD7868
TCLK
RFS
DT
DR
RCLK
24315
6789
5V
NC
TFS
DGND
NC = NO CONNECT
Figure 20. SKT6, D-Type Connector Pinout
SKT5 EXT CLK
WIRE LINK OPTIONS LK1, Analog Input Link
LK1 connects the analog input to a component grid or to a buffer amplifier which drives the ADC input.
LK2, Analog Output Link
LK2 connects the analog output to the component grid or to either the SHA or DAC output (see LK3).
LK3, SHA or DAC Select
The analog output may be taken directly from the DAC or from a SHA at the output of the DAC.
–13–
Page 14
AD7868
LK4, DAC Reference Selection
The DAC reference may be connected to either the ADC refer­ence output (RO ADC) or to the DAC reference (RO DAC).
LK5, ADC Internal Clock Selection
This link configures the ADC for continuous or noncontinuous internal clock operation.
LK6, DAC Updating
The DAC, LDAC input may asserted independently of the ADC
CONVST signal or it may be tied to CONVST or it may
tied to GND.
LK7, ADC Clock Source
This link provides the option for the ADC to use its own inter­nal clock oscillator or an external TTL compatible clock.
LK8 Frame Synchronous Option
LK8 provides the option of tying the ADC RFS output to the DAC
TFS input.
LK9 Transmit/Receive Clock Option
LK9 provides the option to connect the ADC RCLK to the DAC TCLK.

COMPONENT LIST

IC1 AD7868 IC2, IC3 2X AD711 IC4, ADG201HS IC5, MC78L05 IC6, MC79L05 IC7, 74HC4050 IC8, 74HC221
C1, C3, C5, C7 C9, C11, C13, C15 10 µF Capacitor C17, C19, C23
C2, C4, C6, C8 C10, C12, C14, C16 0.1 µF Capacitor C18, C20, C24
C21 330 pF Capacitor C22 68 pF Capacitor
R1, R2, R4 2 k Resistor R3, R5 4.7 k Resistor
R6 15 k Resistor R7 200 Resistor
LK1, LK2, LK3, LK4, LK5, LK6, LK7, LK8 Shorting Plugs LK9
SKT1, SKT2, SKT3, SKT4, SKT5 BNC Sockets
SKT6 9-Contact D-Type Connector
Figure 21. Silkscreen for the Circuit Diagram of Figure 19
–14–
REV. B
Page 15
AD7868
Figure 22. Component Side Layout for the Circuit Diagram of Figure 19
REV. B
Figure 23. Solder Side Layout for the Circuit Diagram of Figure 19
–15–
Page 16
AD7868

OUTLINE DIMENSIONS

Dimensions shown in inches and (mm).
24-Pin Plastic (N-24)
24-Pin Cerdip (Q-24)
C1410–10–7/90
28-Pin Plastic SOIC (R-28)
–16–
PRINTED IN U.S.A.
REV. B
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