Up to 23 effective bits
RMS noise: 40 nV @ 4.17 Hz, 85 nV @ 16.7 Hz
Current: 400 μA typical
Power-down: 1 μA maximum
Low noise, programmable gain, instrumentation amp
Band gap reference with 4 ppm/°C drift typical
Update rate: 4.17 Hz to 470 Hz
Six differential analog inputs
Internal clock oscillator
Simultaneous 50 Hz/60 Hz rejection
Reference detect
Programmable current sources
On-chip bias voltage generator
Burnout currents
Low-side power switch
Power supply: 2.7 V to 5.25 V
Temperature range:
B grade: –40°C to +105°C
C grade: –40°C to +125°C
Independent interface power supply
24-lead TSSOP
3-wire serial interface
SPI®, QSPI™, MICROWIRE™, and DSP compatible
Schmitt trigger on SCLK
APPLICATIONS
Temperature measurement
Pressure measurement
Weigh scales
Strain gage transducers
Gas analysis
FUNCTIONAL BLOCK DIAGRAM
GNDA
Industrial process control
Instrumentation
Blood analysis
Smart transmitters
Liquid/gas chromatography
6-digit DVM
GENERAL DESCRIPTION
The AD7794/AD7795 are low power, low noise, complete
analog front ends for high precision measurement applications.
They contain a low noise, 24-/16-bit ∑-Δ ADC with six
differential inputs. The on-chip low noise instrumentation
amplifier means that signals of small amplitude can be
interfaced directly to the ADC.
Each device contains a precision, low noise, low drift internal
band gap reference, and can also accept up to two external
differential references. Other on-chip features include
programmable excitation current sources, burnout currents,
and a bias voltage generator that is used to set the commonmode voltage of a channel to AV
switch can be used to power down bridge sensors between
conversions, minimizing the system’s power consumption. The
AD7794/AD7795 can operate with either an internal clock or
an external clock. The output data rate from each part can vary
from 4.17 Hz to 470 Hz.
Both parts operate with a power supply from 2.7 V to 5.25 V.
The B-grade parts (AD7794 and AD7795) are specified for a
temperature range of −40°C to +105°C while the C-grade part
(AD7794) is specified for a temperature range of −40°C to
+125°C. They consume a current of 400 μA typical and are
housed in a 24-lead TSSOP.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Changes to Table 19........................................................................ 20
Changes to ADC Circuit Information Section........................... 25
Changes to Ordering Guide.......................................................... 35
Rev. D | Page 2 of 36
4/05—Rev. 0 to Rev. A
Changes to Absolute Maximum Ratings........................................9
Changes to Figure 21...................................................................... 25
Changes to Data Output Coding Section.................................... 28
Changes to Calibration Section.................................................... 30
Changes to Ordering Guide.......................................................... 33
10/04—Revision 0: Initial Version
AD7794/AD7795
SPECIFICATIONS
AVDD = 2.7 V to 5.25 V, DVDD = 2.7 V to 5.25 V, GND = 0 V, all specifications T
Table 1.
Parameter1 AD7794/AD7795 Unit Test Conditions/Comments
CHOP ENABLED
Output Update Rate 4.17 to 470 Hz nom Settling time = 2/output update rate
No Missing Codes
2
AD7794 24 Bits min f
AD7795 16 Bits min
Resolution See the RMS Noise and Resolution Specifications section
RMS Noise and Update Rates See the RMS Noise and Resolution Specifications section
Integral Nonlinearity ±15
ppm of FSR
max
Offset Error
3
±1 μV typ
Offset Error Drift vs. Temperature4±10 nV/°C typ
Full-Scale Error3, 5 ±10 μV typ
Gain Drift vs. Temperature
4
±1 ppm/°C typ Gain = 1 to 16, external reference
±3 ppm/°C typ Gain = 32 to 128, external reference
Power Supply Rejection 100 dB min AIN = 1 V/gain, gain ≥ 4, external reference
ANALOG INPUTS
Differential Input Voltage Ranges ±VREF/gain V nom
Absolute AIN Voltage Limits
2
Unbuffered Mode GND − 30 mV V min Gain = 1 or 2
AVDD + 30 mV V max
Buffered Mode GND + 100 mV V min Gain = 1 or 2
AVDD − 100 mV V max
In-Amp Active GND + 300 mV V min Gain = 4 to 128
AVDD − 1.1 V max
Common-Mode Voltage, V
CM
0.5 V min VCM = (AIN(+) + AIN(−))/2, gain = 4 to 128
Analog Input Current
Buffered Mode or In-Amp
Active
Average Input Current
2
AD7794B/AD7795B ±1 nA max Gain = 1 or 2, update rate < 100 Hz
±250 pA max Gain = 4 to 128, update rate < 100 Hz
±1 nA max AIN6(+)/AIN6(−)
AD7794C ±3 nA max Gain = 1 or 2, update rate < 100 Hz
±2 nA max Gain = 4 to 128, update rate < 100 Hz
±3 nA max AIN6(+)/AIN6(−)
Average Input Current Drift ±2 pA/°C typ
Unbuffered Mode Gain = 1 or 2
Average Input Current ±400 nA/V typ Input current varies with input voltage
Average Input Current Drift ±50 pA/V/°C typ
Normal Mode Rejection2,
6
Internal Clock
@ 50 Hz, 60 Hz 65 dB min 80 dB typ, 50 ± 1 Hz, 60 ± 1 Hz, FS[3:0] = 1010
@ 50 Hz 80 dB min 90 dB typ, 50 ± 1 Hz, FS[3:0] = 1001
@ 60 Hz 90 dB min 100 dB typ, 60 ± 1 Hz, FS[3:0] = 1000
External Clock
@ 50 Hz, 60 Hz 80 dB min 90 dB typ, 50 ± 1 Hz, 60 ± 1 Hz, FS[3:0] = 1010
@ 50 Hz 94 dB min 100 dB typ, 50 ± 1 Hz, FS[3:0] = 1001
@ 60 Hz 90 dB min 100 dB typ, 60 ± 1 Hz, FS[3:0] = 1000
Rev. D | Page 3 of 36
to T
MIN
MAX
ADC
V
REF
gain = 1 to 128
, unless otherwise noted.
≤ 242 Hz
= REFIN(+) − REFIN(−), or internal reference,
AD7794/AD7795
Parameter1 AD7794/AD7795 Unit Test Conditions/Comments
Common-Mode Rejection
AD7794B/AD7795B
@ DC 100 dB min AIN = 1 V/gain, gain ≥ 4
@ 50 Hz, 60 Hz
@ 50 Hz, 60 Hz
AD7794C
@ DC 97 dB min AIN = 1 V/gain, gain ≥ 4
@ 50 Hz, 60 Hz
@ 50 Hz, 60 Hz
CHOP DISABLED
Output Update Rate 4.17 to 470 Hz nom Settling time = 1/output update rate
No Missing Codes
AD7794 24 Bits min f
AD7795 16 Bits min
Resolution See the RMS Noise and Resolution Specifications section
RMS Noise and Update Rates See the RMS Noise and Resolution Specifications section
Integral Nonlinearity ±15
Offset Error
3
Offset Error Drift vs. Temperature4±100/gain nV/°C typ Gain = 1 to 16
10 nV/°C typ Gain = 32 to 128
Full-Scale Error3,
Gain Drift vs. Temperature
±3 ppm/°C typ Gain = 32 to 128, external reference
Power Supply Rejection 100 dB typ AIN = 1 V/gain, gain ≥ 4, external reference
ANALOG INPUTS
Differential Input Voltage Ranges ±V
Absolute AIN Voltage Limits
Unbuffered Mode GND − 30 mV V min Gain = 1 or 2
AVDD + 30 mV V max
Buffered Mode GND + 100 mV V min Gain = 1 or 2
AVDD − 100 mV V max
In-Amp Active GND + 300 mV V min Gain = 4 to 128
AVDD − 1.1 V max
Common-Mode Voltage, V
Analog Input Current
Buffered Mode or In-Amp
Active
Average Input Current
AD7794B/AD7795B ±1 nA max Gain = 1 or 2
±250 pA max Gain = 4 to 128
±1 nA max AIN6(+)/AIN6(−)
AD7794C ±3 nA max Gain = 1 or 2
±2 nA max Gain = 4 to 128
±3 nA max AIN6(+)/AIN6(−)
Average Input Current Drift ±2 pA/°C typ
Unbuffered Mode Gain = 1 or 2
Average Input Current ±400 nA/V typ Input current varies with input voltage
Average Input Current Drift ±50 pA/V/°C typ
2
2
2
2
100 dB min 50 ± 1 Hz, 60 ± 1 Hz, FS[3:0] = 1010
100 dB min 50 ± 1 Hz, FS[3:0] = 1001; 60 ± 1 Hz, FS[3:0] = 1000
97 dB min 50 ± 1 Hz, 60 ± 1 Hz, FS[3:0] = 1010
97 dB min 50 ± 1 Hz, FS[3:0] = 1001; 60 ± 1 Hz, FS[3:0] = 1000
2
≤ 123 Hz
ADC
ppm of FSR
max
±100/gain μV typ Without calibration
5
4
±10 μV typ
±1 ppm/°C typ Gain = 1 to 16, external reference
/gain V nom
REF
= REFIN(+) − REFIN(−), or internal reference,
V
REF
gain = 1 to 128
2
CM
0.2 + (gain/2 × (AIN(+) −
V min AMP − CM = 1, VCM = (AIN(+) + AIN(–))/2, gain = 4 to 128
AIN(−)))
− 0.2 − (gain/2 ×
AV
DD
V max
(AIN(+) − AIN(−)))
2
Rev. D | Page 4 of 36
AD7794/AD7795
Parameter1 AD7794/AD7795 Unit Test Conditions/Comments
Normal Mode Rejection2,
Internal Clock
@ 50 Hz, 60 Hz 60 dB min 70 dB typ, 50 ± 1 Hz, 60 ± 1 Hz, FS[3:0] = 1010
@ 50 Hz 78 dB min 90 dB typ, 50 ± 1 Hz, FS[3:0] = 1001
@ 60 Hz 86 dB min 100 dB typ, 60 ± 1 Hz, FS[3:0] = 1000
External Clock
@ 50 Hz, 60 Hz 60 dB min 70 dB typ, 50 ± 1 Hz, 60 ± 1 Hz, FS[3:0] = 1010
@ 50 Hz 94 dB min 100 dB typ, 50 ± 1 Hz, FS[3:0] = 1001
@ 60 Hz 90 dB min 100 dB typ, 60 ± 1 Hz, FS[3:0] = 1000
Common-Mode Rejection
AD7794B/AD7795B
@ DC 100 dB min AIN = 1 V/gain, with gain = 4, AMP-CM Bit = 1
@ 50 Hz, 60 Hz
@ 50 Hz, 60 Hz
AD7794C
@ DC 97 dB min AIN = 1 V/gain, with gain = 4, AMP-CM Bit = 1
@ 50 Hz, 60 Hz
@ 50 Hz, 60 Hz
CHOP ENABLED or DISABLED
REFERENCE INPUT
Internal Reference
Internal Reference Initial
Accuracy
Internal Reference Drift
15 ppm/°C max
Power Supply Rejection 85 dB typ
External Reference
External REFIN Voltage 2.5 V nom REFIN = REFIN(+) − REFIN(−)
Reference Voltage Range
AV
Absolute REFIN Voltage Limits2GND − 30 mV V min
AVDD + 30 mV V max
Average Reference Input
Current
Average Reference Input
Current Drift
Normal Mode Rejection
Common-Mode Rejection 100 dB typ
Reference Detect Levels 0.3 V min
0.65 V max NOXREF bit active if V
EXCITATION CURRENT SOURCES
(IEXC1 and IEXC2)
Output Current 10/210/1000 μA nom
Initial Tolerance at 25°C ±5 % typ
Drift 200 ppm/°C typ
Current Matching ±0.5 % typ Matching between IEXC1 and IEXC2, V
Drift Matching 50 ppm/°C typ
Line Regulation (AVDD) 2 %/V typ AVDD = 5 V ± 5%
Load Regulation 0.2 %/V typ
Output Compliance AVDD − 0.65 V max Current sources programmed to 10 μA or 210 μA
AVDD − 1.1 V max Current sources programmed to 1 mA
GND − 30 mV V min
6
2
2
2
2
100 dB min 50 ± 1 Hz, 60 ± 1 Hz, FS[3:0] = 1010
100 dB min 50 ± 1 Hz, FS[3:0] = 1001; 60 ± 1 Hz, FS[3:0] = 1000
97 dB min 50 ± 1 Hz, 60 ± 1 Hz, FS[3:0] = 1010
97 dB min 50 ± 1 Hz, FS[3:0] = 1001; 60 ± 1 Hz, FS[3:0] = 1000
1.17 ± 0.01% V min/max AV
2
2
4 ppm/°C typ
0.1 V min
DD
V max
= 4 V, TA = 25°C
DD
When V
= AVDD, the differential input must be
REF
limited to 0.9 × V
/gain if the in-amp is active
REF
400 nA/V typ
±0.03 nA/V/°C typ
2
Same as for analog inputs
< 0.3 V
REF
OUT
= 0 V
Rev. D | Page 5 of 36
AD7794/AD7795
Parameter1 AD7794/AD7795 Unit Test Conditions/Comments
BIAS VOLTAGE GENERATOR
V
BIAS
V
Generator Start-Up Time ms/nF typ
BIAS
TEMPERATURE SENSOR
Accuracy ±2 °C typ Applies if user calibrates the temperature sensor
Sensitivity 0.81 mV/°C typ
LOW-SIDE POWER SWITCH
R
ON
9 Ω max AVDD = 3 V
Allowable Current
2
DIGITAL OUTPUTS (P1 and P2)
VOH, Output High Voltage
VOL, Output Low Voltage
VOH, Output High Voltage
VOL, Output Low Voltage
2
2
2
2
INTERNAL/EXTERNAL CLOCK
Internal Clock
Frequenc y
2
Duty Cycle 50:50 % typ
External Clock
Frequency 64 kHz nom
Duty Cycle 45:55 to 55:45 % typ
LOGIC INPUTS
2
CS
V
, Input Low Voltage 0.8 V max DVDD = 5 V
INL
0.4 V max DVDD = 3 V
V
, Input High Voltage 2.0 V min DVDD = 3 V or 5 V
INH
SCLK (Schmitt-Triggered Input),
CLK, and DIN
2
AD7794B/AD7795B
VT(+) 1.4/2 V min/max DVDD = 5 V
VT(−) 0.8/1.7 V min/max DVDD = 5 V
VT(+) to VT(−) 0.1/0.17 V min/max DVDD = 5 V
VT(+) 0.9/2 V min/max DVDD = 3 V
VT(−) 0.4/1.35 V min/max DVDD = 3 V
VT(+) to VT(−) 0.06/0.13 V min/max DVDD = 3 V
AD7794C
VT(+) 1.35/2.05 V min/max DVDD = 5 V
VT(−) 0.8/1.9 V min/max DVDD = 5 V
VT(+) to VT(−) 0.1/0.19 V min/max DVDD = 5 V
VT(+) 0.9/2 V min/max DVDD = 3 V
VT(−) 0.4/1.35 V min/max DVDD = 3 V
VT(+) to VT(−) 0.06/0.15 V min/max DVDD = 3 V
Input Currents ±10 μA max VIN = DVDD or GND
Input Capacitance 10 pF typ All digital inputs
AVDD/2 V nom
Dependent on the capacitance connected to AIN;
Figure 11
See
7 Ω max AVDD = 5 V
30 mA max Continuous current
AVDD − 0.6 V min AVDD = 3 V, I
0.4 V max AVDD = 3 V, I
4 V min AVDD = 5 V, I
0.4 V max AVDD = 5 V, I
64 ± 3%
kHz
= 100 μA
SOURCE
= 100 μA
SINK
= 200 μA
SOURCE
= 800 μA
SINK
min/max
A 128 kHz external clock can be used if the divide-by-2
function is used (Bit CLK1 = CLK0 = 1)
Applies for external 64 kHz clock, a 128 kHz clock can
have a less stringent duty cycle
Rev. D | Page 6 of 36
AD7794/AD7795
Parameter1 AD7794/AD7795 Unit Test Conditions/Comments
LOGIC OUTPUT (INCLUDING CLK)
VOH, Output High Voltage
VOL, Output Low Voltage
VOH, Output High Voltage
VOL, Output Low Voltage
Floating-State Leakage Current ±10 μA max
Floating-State Output Capacitance 10 pF typ
Data Output Coding Offset binary
SYSTEM CALIBRATION
Full-Scale Calibration Limit 1.05 × FS V max
Zero-Scale Calibration Limit −1.05 × FS V min
Input Span 0.8 × FS V min
2.1 × FS V max
POWER REQUIREMENTS
Power Supply Voltage
AVDD to GND 2.7/5.25 V min/max
DVDD to GND 2.7/5.25 V min/max
Power Supply Currents
IDD Current 140 μA max
185 μA max
400 μA max
500 μA max
IDD (Power-Down Mode) 1 μA max AD7794B, AD7795B
2 μA max AD7794C
1
Temperature range: B Grade: −40°C to +105°C, C Grade: −40°C to +125°C. At the 19.6 Hz and 39.2 Hz update rates, the INL, power supply rejection (PSR), common-
mode rejection (CMR), and normal mode rejection (NMR) do not meet the data sheet specification if the voltage on the AIN(+) or AIN(−) pins exceeds AVDD – 1.6 V
typically. In addition, the offset error and offset error drift degrade at these update rates when chopping is disabled. When this voltage is exceeded, the INL, for
example, is reduced to 18 ppm of FS typically while the PSR is reduced to 69 dB typically. Therefore, for guaranteed performance at these update rates, the absolute
voltage on the analog input pins needs to be below AVDD − 1.6 V.
2
Specification is not production tested but is supported by characterization data at initial product release.
3
Following a calibration, this error is in the order of the noise for the programmed gain and update rate selected.
4
Recalibration at any temperature removes these errors.
5
Full-scale error applies to both positive and negative full-scale, and applies at the factory calibration conditions (AVDD = 4 V, gain = 1, TA = 25°C).
6
FS[3:0] are the four bits used in the mode register to select the output word rate.
7
Digital inputs equal to DVDD or GND with excitation currents and bias voltage generator disabled.
2
2
2
2
2
7
DVDD − 0.6 V min DVDD = 3 V, I
0.4 V max DVDD = 3 V, I
4 V min DVDD = 5 V, I
0.4 V max
DV
= 5 V, I
DD
= 100 μA
SOURCE
= 100 μA
SINK
= 200 μA
SOURCE
= 1.6 mA (DOUT/RDY), 800 μA (CLK)
SINK
110 μA typ @ AV
= 3 V, 125 μA typ @ AVDD = 5 V,
DD
unbuffered mode, external reference
130 μA typ @ AV
= 3 V, 165 μA typ @ AVDD = 5 V,
DD
buffered mode, gain = 1 or 2, external reference
300 μA typ @ AV
= 3 V, 350 μA typ @ AVDD = 5 V,
DD
gain = 4 to 128, external reference
400 μA typ @ AV
= 3 V, 450 μA typ @ AVDD = 5 V,
DD
gain = 4 to 128, internal reference
Rev. D | Page 7 of 36
AD7794/AD7795
TIMING CHARACTERISTICS
AVDD = 2.7 V to 5.25 V, DVDD = 2.7 V to 5.25 V, GND = 0 V, Input Logic 0 = 0 V, Input Logic 1 = DVDD, unless otherwise noted.
Table 2.
Parameter1,
t
3
t
4
2
Limit at T
MIN
, T
(B Version) Unit Conditions/Comments
MAX
100 ns min SCLK high pulse width
100 ns min SCLK low pulse width
Read Operation
t
1
0 ns min
CS falling edge to DOUT/RDY active time
60 ns max DVDD = 4.75 V to 5.25 V
80 ns max DVDD = 2.7 V to 3.6 V
3
t
2
0 ns min SCLK active edge to data valid delay
4
60 ns max DVDD = 4.75 V to 5.25 V
80 ns max DVDD = 2.7 V to 3.6 V
6
t
55,
10 ns min
Bus relinquish time after
CS inactive edge
80 ns max
t
6
t
7
0 ns min
10 ns min
SCLK inactive edge to
CS inactive edge
SCLK inactive edge to DOUT/
RDY high
Write Operation
t
8
t
9
t
10
t
11
1
Sample tested during initial release to ensure compliance. All input signals are specified with tR = tF = 5 ns (10% to 90% of DVDD) and timed from a voltage level of 1.6 V.
2
See Figure 3 and Figure 4.
3
These numbers are measured with the load circuit shown in Figure 2 and defined as the time required for the output to cross the VOL or VOH limits.
4
SCLK active edge is falling edge of SCLK.
5
These numbers are derived from the measured time taken by the data output to change 0.5 V when loaded with the circuit shown in Figure 2. The measured number
is then extrapolated back to remove the effects of charging or discharging the 50 pF capacitor. This means that the times quoted in the timing characteristics are the
true bus relinquish times of the part and, therefore, are independent of external bus loading capacitances.
6
RDY
returns high after a read of the ADC. In single conversion mode and continuous conversion mode, the same data can be read again, if required, while
although care should be taken to ensure that subsequent reads do not occur close to the next output update. In continuous read mode, the digital word can be read
only once.
0 ns min
CS falling edge to SCLK active edge setup time
30 ns min Data valid to SCLK edge setup time
25 ns min Data valid to SCLK edge hold time
0 ns min
CS rising edge to SCLK edge hold time
4
RDY
is high,
I
(1.6mA WITH DVDD=5V,
SINK
100µA WITH DV
=3V)
DD
TO
OUTPUT
PIN
50pF
I
SOURCE
100µA WITH DV
1.6V
(200µA WI TH DVDD=5V,
=3V)
DD
Figure 2. Load Circuit for Timing Characterization
Rev. D | Page 8 of 36
04854-002
AD7794/AD7795
TIMING DIAGRAMS
CS (I)
t
t
1
DOUT/RDY (O)
SCLK (I)
t
2
I= INPUT, O= OUTPUT
MSBLSB
t
3
t
4
Figure 3. Read Cycle Timing Diagram
CS (I)
6
t
5
t
7
4854-003
t
11
4854-004
SCLK (I)
DIN (I)
I = INPUT, O = OUTPUT
t
8
t
9
t
10
MSBLSB
Figure 4. Write Cycle Timing Diagram
Rev. D | Page 9 of 36
AD7794/AD7795
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter Rating
AVDD to GND −0.3 V to +7 V
DVDD to GND −0.3 V to +7 V
Analog Input Voltage to GND −0.3 V to AVDD + 0.3 V
Reference Input Voltage to GND −0.3 V to AVDD + 0.3 V
Digital Input Voltage to GND −0.3 V to DVDD + 0.3 V
Digital Output Voltage to GND −0.3 V to DVDD + 0.3 V
AIN/Digital Input Current 10 mA
Operating Temperature Range
B Grade −40°C to +105°C
C Grade −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Maximum Junction Temperature 150°C
TSSOP
θJA Thermal Impedance 97.9°C/W
θJC Thermal Impedance 14°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. D | Page 10 of 36
AD7794/AD7795
A
A
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
SCLK
1
CLK
2
CS
3
NC
4
AD7794/
AIN1(+)
AIN1(–)
AIN2(+)
AIN2(–)
AIN3(+)
AIN3(–)
5
AD7795
6
TOP VIEW
7
(Not to Scale)
8
9
10
11
12
NC = NO CONNECT
IN6(+)/P1
IN6(–)/P2
Figure 5. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1 SCLK
Serial Clock Input. This serial clock input is for data transfers to and from the ADC. The SCLK has a Schmitttriggered input, making the interface suitable for opto-isolated applications. The serial clock can be
continuous with all data transmitted in a continuous train of pulses. Alternatively, it can be a noncontinuous
clock with the information being transmitted to or from the ADC in smaller batches of data.
2 CLK
Clock In/Clock Out. The internal clock can be made available at this pin. Alternatively, the internal clock can
be disabled, and the ADC can be driven by an external clock. This allows several ADCs to be driven from a
common clock, allowing simultaneous conversions to be performed.
3
CSChip Select Input. This is an active low logic input used to select the ADC. CS can be used to select the ADC in
systems with more than one device on the serial bus or as a frame synchronization signal in communicating
with the device. CS can be hardwired low, allowing the ADC to operate in 3-wire mode with SCLK, DIN, and
DOUT used to interface with the device.
4 NC No Connect.
5 AIN6(+)/P1
Analog Input/Digital Output Pin. AIN6(+) is the positive terminal of the differential analog input pair,
AIN6(+)/AIN6(−). This pin can also function as a general-purpose output bit referenced between AV
6 AIN6(−)/P2
Analog Input/Digital Output Pin. AIN6(−) is the negative terminal of the differential analog input pair,
AIN6(+)/AIN6(−). This pin can also function as a general-purpose output bit referenced between AV
7 AIN1(+) Analog Input. AIN1(+) is the positive terminal of the differential analog input pair, AIN1(+)/AIN1(−).
8 AIN1(−) Analog Input. AIN1(−) is the negative terminal of the differential analog input pair, AIN1(+)/AIN1(−).
9 AIN2(+) Analog Input. AIN2(+) is the positive terminal of the differential analog input pair, AIN2(+)/AIN2(−).
10 AIN2(−) Analog Input. AIN2(−) is the negative terminal of the differential analog input pair, AIN2(+)/AIN2(−).
11 AIN3(+) Analog Input. AIN3(+) is the positive terminal of the differential analog input pair, AIN3(+)/AIN3(−).
12 AIN3(−) Analog Input. AIN3(−) is the negative terminal of the differential analog input pair, AIN3(+)/AIN3(−).
13 REFIN1(+)
Positive Reference Input. An external reference can be applied between REFIN1(+) and REFIN1(−). REFIN1(+)
can lie anywhere between AV
and GND + 0.1 V. The nominal reference voltage, (REFIN1(+) − REFIN1(−)), is
DD
2.5 V, but the part functions with a reference from 0.1 V to AV
14 REFIN1(−) Negative Reference Input. This reference input can lie anywhere between GND and AVDD − 0.1 V.
15 AIN5(+)/IOUT2
Analog Input/Output of Internal Excitation Current Source. AIN5(+) is the positive terminal of the differential
analog input pair AIN5(+)/AIN5(−). Alternatively, the internal excitation current source can be made available at
this pin and is programmable so that the current can be 10 μA, 210 μA, or 1 mA. Either IEXC1 or IEXC2 can be
switched to this output.
16 AIN5(−)/IOUT1
Analog Input/Output of Internal Excitation Current Source. AIN5(−) is the negative terminal of the
differential analog input pair, AIN5(+)/AIN5(−). Alternatively, the internal excitation current source can be
made available at this pin and is programmable so that the current can be 10 μA, 210 μA, or 1 mA. Either
IEXC1 or IEXC2 can be switched to this output.
17 AIN4(+)/REFIN2(+)
Analog Input/Positive Reference Input. AIN4(+) is the positive terminal of the differential analog input pair
AIN4(+)/AIN4(−). This pin also functions as a positive reference input for REFIN2. REFIN2(+) can lie anywhere
between AV
and GND + 0.1 V. The nominal reference voltage (REFIN2(+) to REFIN2(−)) is 2.5 V, but the part
DD
functions with a reference from 0.1 V to AV
DIN
24
DOUT/RDY
23
DV
22
DD
AV
21
DD
20
GND
19
PSW
AIN4(–)/REFIN2(–)
18
AIN4(+)/REF IN2(+)
17
AIN5(–)/IO UT1
16
AIN5(+)/IOUT2
15
14
REFIN1(–)
13
REFIN1(+)
.
DD
4854-005
and GND.
DD
and GND.
DD
.
DD
Rev. D | Page 11 of 36
AD7794/AD7795
Pin No. Mnemonic Description
18 AIN4(−)/REFIN2(−)
19 PSW Low-Side Power Switch to GND.
20 GND Ground Reference Point.
21 AV
22 DV
23
DD
DD
RDYSerial Data Output/Data Ready Output. DOUT/RDY serves a dual purpose. It functions as a serial data output
DOUT/
24 DIN
Analog Input/Negative Reference Input. AIN4(−) is the negative terminal of the differential analog input pair
AIN4(+)/AIN4(−). This pin also functions as the negative reference input for REFIN2. This reference input can
lie anywhere between GND and AV
Supply Voltage, 2.7 V to 5.25 V.
Serial Interface Supply Voltage, 2.7 V to 5.25 V. DVDD is independent of AVDD. Therefore, the serial interface
operates at 3 V with AV
at 5 V or vice versa.
DD
pin to access the output shift register of the ADC. The output shift register can contain data from any of the
on-chip data or control registers. In addition, DOUT/
the completion of a conversion. If the data is not read after the conversion, the pin goes high before the
next update occurs. The DOUT/
that valid data is available. With an external serial clock, the data can be read using the DOUT/
CS low, the data/control word information is placed on the DOUT/RDY pin on the SCLK falling edge and is
valid on the SCLK rising edge.
Serial Data Input to the Input Shift Register on the ADC. Data in this shift register is transferred to the control
registers within the ADC with the register selection bits of the communications register identifying the
appropriate register.
− 0.1 V.
DD
RDY operates as a data ready pin, going low to indicate
RDY falling edge can also be used as an interrupt to a processor, indicating
RDY pin. With
Rev. D | Page 12 of 36
AD7794/AD7795
RMS NOISE AND RESOLUTION SPECIFICATIONS
The AD7794/AD7795 can be operated with chop enabled or
chop disabled, allowing the ADC to be optimized for switching
time or drift performance. With chop enabled, the settling time
is two times the conversion time. However, the offset is
continuously removed by the ADC leading to low offset and low
offset drift. With chop disabled, the allowable update rates are
the same as in chop enable mode. However, the settling time
now equals the conversion time. With chop disabled, the offset
is not removed by the ADC, so periodic offset calibrations can
be required to remove offset due to drift.
Table 5. RMS Noise (μV) vs. Gain and Output Update Rate Using an External 2.5 V Reference with Chop Enabled
Update Rate (Hz) Gain of 1 Gain of 2 Gain of 4 Gain of 8 Gain of 16 Gain of 32 Gain of 64 Gain of 128
Tabl e 5 shows the AD7794/AD7795 rms noise for some update
rates and gain settings. The numbers given are for the bipolar
input range with an external 2.5 V reference. These numbers are
typical and are generated with a differential input voltage of 0 V.
Tabl e 6 and Ta b le 7 show the effective resolution, while the
output peak-to-peak (p-p) resolution is listed in brackets. It is
important to note that the effective resolution is calculated
using the rms noise, while the p-p resolution is calculated based
on peak-to-peak noise. The p-p resolution represents the
resolution for which there is no code flicker. These numbers are
typical and are rounded to the nearest LSB.
Table 6.
Effective Resolution (Bits) vs. Gain and Output Update Rate for the AD7794 Using an External 2.5 V Reference with Chop Enabled
Update Rate (Hz) Gain of 1 Gain of 2 Gain of 4 Gain of 8 Gain of 16 Gain of 32 Gain of 64 Gain of 128
Tabl e 8 shows the AD7794/AD7795 rms noise for some of the
update rates and gain settings. The numbers given are for the
bipolar input range with the internal 1.17 V reference. These
numbers are typical and are generated with a differential input
voltage of 0 V.
Table 9 and Tabl e 10 show the effective resolution
while the output peak-to-peak (p-p) resolution is listed in brackets.
Table 8. RMS Noise (μV) vs. Gain and Output Update Rate Using an Internal 1.17 V Reference with Chop Enabled
Update Rate (Hz) Gain of 1 Gain of 2 Gain of 4 Gain of 8 Gain of 16 Gain of 32 Gain of 64 Gain of 128
It is important to note that the effective resolution is calculated
using the rms noise while the p-p resolution is calculated based
on peak-to-peak noise. The p-p resolution represents the
resolution for which there is no code flicker. These numbers are
typical and rounded to the nearest LSB.
Table 9.
Effective Resolution (Bits) vs. Gain and Output Update Rate for the AD7794 Using an Internal 1.17 V Reference with Chop Enabled
Update Rate (Hz) Gain of 1 Gain of 2 Gain of 4 Gain of 8 Gain of 16 Gain of 32 Gain of 64 Gain of 128
With chop disabled, the switching time or settling time is
reduced by a factor of two. However, periodic offset calibrations
may now be required to remove offset and offset drift. When
chop is disabled, the AMP-CM bit in the mode register should
be set to 1. This limits the allowable common-mode voltage that
can be used. However, the common-mode rejection degrades if
the bit is not set.
Tabl e 11 shows the rms noise of the AD7794/AD7795 for some
of the update rates and gain settings with chop disabled.
Table 11. RMS Noise (μV) vs. Gain and Output Update Rate Using an Internal 1.17 V Reference with Chop Disabled
Update Rate (Hz) Gain of 1 Gain of 2 Gain of 4 Gain of 8 Gain of 16 Gain of 32 Gain of 64 Gain of 128
The numbers given are for the bipolar input range with the
internal 1.17 V reference. These numbers are typical and are
generated with a differential input voltage of 0 V.
Tabl e 12 and Table 1 3 show the effective resolution while the
output peak-to-peak (p-p) resolution is listed in brackets. It is
important to note that the effective resolution is calculated
using the rms noise, while the p-p resolution is calculated based
on peak-to-peak noise. The p-p resolution represents the
resolution for which there is no code flicker. These numbers are
typical and rounded to the nearest LSB.
Table 12.
Effective Resolution (Bits) vs. Gain and Output Update Rate for the AD7794 Using an Internal 1.17 V Reference with Chop Disabled
Update Rate (Hz) Gain of 1 Gain of 2 Gain of 4 Gain of 8 Gain of 16 Gain of 32 Gain of 64 Gain of 128
Figure 7. Noise Distribution Histogram for the AD7794 (Internal Reference,
Gain = 64, Update Rate = 16.7 Hz, Chop Enabled)
8388450
8388400
8388350
8388300
8388250
CODE READ
8388200
8388150
8388100
8388050
01000800600400200
READING NUMBER
Figure 8. Typical Noise Plot for the AD7794 (Internal Reference,
Gain = 64, Update Rate = 16.7 Hz, AMP-CM = 1, Chop Disabled)
04854-007
0
–2.0 –1.2 –0.8 –0.400.40.81.21.62.0
MATCHING (%)
04854-010
Figure 10. Excitation Current Matching (210 μA) at Ambient Temperature
90
80
70
60
50
40
30
POWER-UP TIME (ms)
20
10
04854-008
0
02004006008001000
BOOST = 0
BOOST = 1
LOAD CAPACITANCE (nF)
04854-011
Figure 11. Bias Voltage Generator Power-Up Time vs. Load Capacitance
Rev. D | Page 16 of 36
AD7794/AD7795
ON-CHIP REGISTERS
The ADC is controlled and configured via a number of on-chip
registers that are described in the following sections. In the
following descriptions, set implies a Logic 1 state and cleared
implies a Logic 0 state, unless otherwise noted.
COMMUNICATIONS REGISTER
RS2, RS1, RS0 = 0, 0, 0
The communications register is an 8-bit write-only register. All
communications to the part must start with a write operation to
the communications register. The data written to the communications register determines whether the next operation is a read
or write operation, and to which register this operation takes
place. For read or write operations, once the subsequent read or
write operation to the selected register is complete, the interface
CR7 CR6 CR5 CR4 CR3 CR2 CR1 CR0
WEN(0) R/W(0)
Table 14. Communications Register Bit Designations
Bit No. Mnemonic Description
CR7
CR6
CR5 to
CR3
CR2 CREAD
CR1 to
CR0
WENWrite Enable Bit. A 0 must be written to this bit so that the write to the communications register actually occurs. If
a 1 is the first bit written, the part does not clock on to subsequent bits in the register. It stays at this bit location
until a 0 is written to this bit. Once a 0 is written to the
communications register.
WA 0 in this bit location indicates that the next operation is a write to a specified register. A 1 in this position
R/
indicates that the next operation is a read from the designated register.
RS2 to RS0
0 These bits must be programmed to Logic 0 for correct operation.
Register Address Bits. These address bits are used to select which registers of the ADC are being selected during
this serial interface communication. See
Continuous Read of the Data Register. When this bit is set to 1 (and the data register is selected), the serial
interface is configured so that the data register can be read continuously, that is, the contents of the data register
are automatically placed on the DOUT pin when the SCLK pulses are applied after the
indicate that a conversion is complete. The communications register does not have to be written to for data reads.
To enable continuous read mode, the instruction 01011100 must be written to the communications register. To
exit the continuous read mode, the instruction 01011000 must be written to the communications register while
RDY pin is low. While in continuous read mode, the ADC monitors activity on the DIN line so it can receive the
the
instruction to exit continuous read mode. Additionally, a reset occurs if 32 consecutive 1s are seen on DIN.
Therefore, DIN should be held low in continuous read mode until an instruction is written to the device.
RS2(0) RS1(0) RS0(0) CREAD(0) 0(0) 0(0)
Table 15.
returns to where it expects a write operation to the
communications register. This is the default state of the
interface and, on power-up or after a reset, the ADC is in this
default state waiting for a write operation to the communications
register. In situations where the interface sequence is lost, a
write operation of at least 32 serial clock cycles with DIN high
returns the ADC to this default state by resetting the entire part.
Tabl e 14 outlines the bit designations for the communications
register. CR0 through CR7 indicate the bit location, with CR
denoting the bits are in the communications register. CR7
denotes the first bit of the data stream. The number in brackets
indicates the power-on/reset default status of that bit.
WEN bit, the next seven bits are loaded to the
RDY pin goes low to
Table 15. Register Selection
RS2 RS1 RS0 Register Register Size
0 0 0 Communications Register During a Write Operation 8-bit
0 0 0 Status Register During a Read Operation 8-bit
0 0 1 Mode Register 16-bit
0 1 0 Configuration Register 16-bit
0 1 1 Data Register 24-bit (AD7794)/16-Bit (AD7795)
1 0 0 ID Register 8-bit
1 0 1 IO Register 8-bit
1 1 0 Offset Register 24-bit (AD7794)/16-Bit (AD7795)
1 1 1 Full-Scale Register 24-bit (AD7794)/16-Bit (AD7795)
The status register is an 8-bit read-only register. To access the
ADC status register, the user must write to the communications
register, select the next operation to be read, and load Bit RS2,
Bit RS1, and Bit RS0 with 0.
SR7 SR6 SR5 SR4 SR3 SR2 SR1 SR0
RDY(1)
ERR(0) NOXREF(0) 0(0) 0/1 CH2(0) CH1(0) CH0(0)
Table 16. Status Register Bit Designations
Bit No. Mnemonic Description
SR7
SR6 ERR
SR5 NOXREF
SR4 0 This bit is automatically cleared.
SR3 0/1 This bit is automatically cleared on the AD7795 and is automatically set on the AD7794.
SR2 to
SR0
RDYReady Bit for ADC. Cleared when data is written to the ADC data register. The RDY bit is set automatically after the
ADC data register has been read or a period of time before the data register is updated with a new conversion
result to indicate to the user not to read the conversion data. It is also set when the part is placed in power-down
mode. The end of a conversion is also indicated by the DOUT/
status register for monitoring the ADC for conversion data.
ADC Error Bit. This bit is written to at the same time as the
ADC data register has been clamped to all 0s or all 1s. Error sources include overrange, underrange, or the absence
of a reference voltage. Cleared by a write operation to start a conversion.
No External Reference Bit. Set to indicate that the selected reference (REFIN1 or REFIN2) is at a voltage that is
below a specified threshold. When set, conversion results are clamped to all 1s. Cleared to indicate that a valid
reference is applied to the selected reference pins. The NOXREF bit is enabled by setting the REF_DET bit in the
configuration register to 1. The ERR bit is also set if the voltage applied to the selected reference input is invalid.
CH2 to CH0 These bits indicate which channel is being converted by the ADC.
Tabl e 16 outlines the bit designations for the status register. SR0
through SR7 indicate the bit locations, with SR denoting that
the bits are in the status register. SR7 denotes the first bit of the
data stream. The number in brackets indicates the poweron/reset default status of that bit.
RDY pin. This pin can be used as an alternative to the
RDY bit. Set to indicate that the result written to the
Rev. D | Page 18 of 36
AD7794/AD7795
MODE REGISTER
RS2, RS1, RS0 = 0, 0, 1; Power-On/Reset = 0x000A
The mode register is a 16-bit read/write register that is used to
select the operating mode, the update rate, and the clock source.
Tabl e 17 outlines the bit designations for the mode register.
MR0 through MR15 indicate the bit locations with MR
MR15 to MR13 MD2 to MD0 Mode Select Bits. These bits select the operating mode of the AD7794/AD7795 (see Tabl e 18).
MR12 PSW
MR11 to MR10 0 These bits must be programmed with a Logic 0 for correct operation.
MR9 AMP-CM
MR8 0 This bit must be programmed with a Logic 0 for correct operation.
MR7 to MR6 CLK1 to CLK0
0 0 Internal 64 kHz clock. Internal clock is not available at the CLK pin.
0 1 Internal 64 kHz clock. This clock is made available at the CLK pin.
1 0
1 1 External clock. The external clock is divided by 2 within the AD7794/AD7795.
MR5 0 This bit must be programmed with a Logic 0 for correct operation.
MR4 CHOP-DIS
MR3 to MR0 FS3 to FS0 Filter Update Rate Select Bits (see Table 19).
Power Switch Control Bit. Set by user to close the power switch PSW to GND. The power switch can sink
up to 30 mA. Cleared by user to open the power switch. When the ADC is placed in power-down mode,
the power switch is opened.
Instrumentation Amplifier Common-Mode Bit. This bit is used in conjunction with the CHOP-DIS bit. With
chop disabled, the user can operate with a wider range of common-mode voltages when AMP-CM is
cleared. However, the dc common-mode rejection degrades. With AMP-CM set, the span for the commonmode voltage is reduced (see the Specifications section). However, the dc common-mode rejection is
significantly better.
These bits are used to select the clock source for the AD7794/AD7795. Either the on-chip 64 kHz clock can
be used or an external clock can be used. The ability to use an external clock allows several AD7794/AD7795
devices to be synchronized. Also, 50 Hz/60 Hz rejection is improved when an accurate external clock
drives the AD7794/AD7795.
CLK1 CLK0 ADC Clock Source
External 64 kHz. The external clock can have a 45:55 duty cycle (see the
Specifications section for the external clock).
This bit is used to enable or disable chop. On power-up or following a reset, CHOP-DIS is cleared so chop is
enabled. When CHOP-DIS is set, chop is disabled. This bit is used in conjunction with the AMP-CM bit.
When chop is disabled, the AMP-CM bit should be set. This limits the common-mode voltage that can be
used by the ADC, but the dc common-mode rejection does not degrade.
denoting that the bits are in the mode register. MR15 is the first
bit of the data stream. The number in parentheses indicates the
power-on/reset default status of that bit. Any write to the setup
register resets the modulator and filter, and sets the
RDY
bit.
Rev. D | Page 19 of 36
AD7794/AD7795
Table 18. Operating Modes
MD2 MD1 MD0 Mode
0 0 0 Continuous Conversion Mode (Default).
0 0 1 Single Conversion Mode.
0 1 0 Idle Mode.
0 1 1 Power-Down Mode.
1 0 0 Internal Zero-Scale Calibration.
1 0 1 Internal Full-Scale Calibration.
A full-scale input voltage is automatically connected to the selected analog input for this calibration.
1 1 0 System Zero-Scale Calibration.
1 1 1 System Full-Scale Calibration.
A full-scale calibration is required each time the gain of a channel is changed.
In continuous conversion mode, the ADC continuously performs conversions and places the result in the data
register.
RDY goes low when a conversion is complete. The user can read these conversions by placing the device
in continuous read mode whereby the conversions are automatically placed on the DOUT line when SCLK pulses
are applied. Alternatively, the user can instruct the ADC to output the conversion by writing to the communications register. After power-on, the first conversion is available after a period of 2/f
when chop is disabled. Subsequent conversions are available at a frequency of f
1/f
ADC
when chop is enabled or
ADC
with chop either
ADC
enabled or disabled.
When single conversion mode is selected, the ADC powers up and performs a single conversion. The oscillator
requires 1 ms to power up and settle. The ADC then performs the conversion, which takes a time of 2/f
chop is enabled, or 1/f
low, and the ADC returns to power-down mode. The conversion remains in the data register and
when chop is disabled. The conversion result is placed in the data register, RDY goes
ADC
RDY remains
active (low) until the data is read or another conversion is performed.
In idle mode, the ADC filter and modulator are held in a reset state although the modulator clocks are still
provided.
In power-down mode, all the AD7794/AD7795 circuitry is powered down including the current sources, power
switch, burnout currents, bias voltage generator, and clock circuitry.
An internal short is automatically connected to the enabled channel. A calibration takes two conversion cycles to
complete when chop is enabled and one conversion cycle when chop is disabled.
RDY goes high when the
calibration is initiated and returns low when the calibration is complete. The ADC is placed in idle mode following
a calibration. The measured offset coefficient is placed in the offset register of the selected channel.
When the gain equals 1, a calibration takes two conversion cycles to complete when chop is enabled and one
conversion cycle when chop is disabled.
For higher gains, four conversion cycles are required to perform the full-scale calibration when chop is enabled
and 2 conversion cycles when chop is disabled.
RDY goes high when the calibration is initiated and returns low when the calibration is complete. The ADC is
placed in idle mode following a calibration. The measured full-scale coefficient is placed in the full-scale register
of the selected channel.
Internal full-scale calibrations cannot be performed when the gain equals 128. With this gain setting, a system
full-scale calibration can be performed. A full-scale calibration is required each time the gain of a channel is
changed to minimize the full-scale error.
User should connect the system zero-scale input to the channel input pins as selected by the CH2 bit, CH1 bit,
and CH0 bit. A system offset calibration takes two conversion cycles to complete when chop is enabled and one
conversion cycle when chop is disabled.
RDY goes high when the calibration is initiated and returns low when
the calibration is complete. The ADC is placed in idle mode following a calibration. The measured offset coefficient is placed in the offset register of the selected channel.
User should connect the system full-scale input to the channel input pins as selected by the CH2 bit, CH1 bit, and
CH0 bit.
A calibration takes two conversion cycles to complete when chop is enabled and one conversion cycle when
chop is disabled.
RDY goes high when the calibration is initiated and returns low when the calibration is
complete. The ADC is placed in idle mode following a calibration. The measured full-scale coefficient is placed in
the full-scale register of the selected channel.
ADC
when
Rev. D | Page 20 of 36
AD7794/AD7795
Table 19. Update Rates Available (Chop Enabled)
FS3 FS2 FS1 FS0 f
(Hz) T
ADC
0 0 0 0 x x
0 0 0 1 470 4
0 0 1 0 242 8
0 0 1 1 123 16
0 1 0 0 62 32
0 1 0 1 50 40
0 1 1 0 39 48
0 1 1 1 33.2 60
1 0 0 0 19.6 101 90 dB (60 Hz only)
1 0 0 1 16.7 120 80 dB (50 Hz only)
1 0 1 0 16.7 120 65 dB (50 Hz and 60 Hz)
1 0 1 1 12.5 160 66 dB (50 Hz and 60 Hz)
1 1 0 0 10 200 69 dB (50 Hz and 60 Hz)
1 1 0 1 8.33 240 70 dB (50 Hz and 60 Hz)
1 1 1 0 6.25 320 72 dB (50 Hz and 60 Hz)
1 1 1 1 4.17 480 74 dB (50 Hz and 60 Hz)
1
With chop disabled, the update rates remain unchanged, but the settling time for each update rate is reduced by a factor of 2. The rejection at 50 Hz/60 Hz for a
16.6 Hz update rate degrades to 60 dB.
1
(ms) Rejection @ 50 Hz/60 Hz (Internal Clock)
SETTLE
Rev. D | Page 21 of 36
AD7794/AD7795
CONFIGURATION REGISTER
RS2, RS1, RS0 = 0, 1, 0; Power-On/Reset = 0x0710
The configuration register is a 16-bit read/write register that is
used to configure the ADC for unipolar or bipolar mode, enable
or disable the buffer, enable or disable the burnout currents,
select the gain, and select the analog input channel.
0 0 Bias voltage generator disabled
0 1 Bias voltage generator connected to AIN1(−)
1 0 Bias voltage generator connected to AIN2(−)
1 1 Bias voltage generator connected to AIN3(−)
CON13 BO
0 0 External reference applied between REFIN1(+) and REFIN1(−)
0 1 External reference applied between REFIN2(+) and REFIN2(−)
1 0 Internal 1.17 V reference
1 1 Reserved
VBIAS1 to VBIAS0
B Unipolar/Bipolar Bit. Set by user to enable unipolar coding, that is, zero differential input results in
U/
G2 to G0
REFSEL1/REFSEL0
Bias Voltage Generator Enable. The negative terminal of the analog inputs can be biased up to AV
These bits are used in conjunction with the BOOST bit.
VBIAS1 VBIAS0 Bias Voltage
Burnout Current Enable Bit. This bit must be programmed with a Logic 0 for correct operation. When this
bit is set to 1 by the user, the 100 nA current sources in the signal path are enabled. When BO = 0, the
burnout currents are disabled. The burnout currents can be enabled only when the buffer or in-amp is active.
0x000000 output and a full-scale differential input results in 0xFFFFFF output. Cleared by the user to
enable bipolar coding. Negative full-scale differential input results in an output code of 0x000000, zero
differential input results in an output code of 0x800000, and positive full-scale differential input results in
an output code of 0xFFFFFF.
This bit is used in conjunction with the VBIAS1 and VBIAS0 bits. When set, the current consumed by the
bias voltage generator is increased, which reduces its power-up time.
Gain Select Bits.
Written by the user to select the ADC input range as follows:
G2 G1 G0 Gain ADC Input Range (2.5 V Reference)
Reference Select Bits.
The reference source for the ADC is selected using these bits.
REFSEL1 REFSEL0 Reference Source
Tabl e 20 outlines the bit designations for the filter register.
CON0 through CON15 indicate the bit locations. CON denotes
that the bits are in the configuration register. CON15 is the first
bit of the data stream. The number in parentheses indicates the
power-on/reset default status of that bit.
Enables the reference detect function. When set, the NOXREF bit in the status register indicates when the
external reference being used by the ADC is open circuit or less than 0.5 V. When cleared, the reference
detect function is disabled.
Configures the ADC for buffered or unbuffered mode of operation. If cleared, the ADC operates in
unbuffered mode, lowering the power consumption of the device. If set, the ADC operates in buffered
mode, allowing the user to place source impedances on the front end without contributing gain errors to
the system. For gains of 1 and 2, the buffer can be enabled or disabled. For higher gains, the buffer is
automatically enabled. With the buffer disabled, the voltage on the analog input pins can be from 30 mV
below GND to 30 mV above AV
on any input pin must be limited to 100 mV within the power supply rails.
Channel Select Bits.
Written by the user to select the active analog input channel to the ADC.
CH3 CH2 CH1 CH0 Channel Calibration Pair
. When the buffer is enabled, it requires some headroom so the voltage
DD
Automatically selects the internal 1.17 V reference
and sets the gain to 1
Automatically selects the internal 1.17 V reference
and sets the gain to 1/6
The conversion result from the ADC is stored in this data
register. This is a read-only register. On completion of a read
operation from this register, the
RDY
bit/pin is set.
ID REGISTER
RS2, RS1, RS0 = 1, 0, 0; Power-On/Reset = 0xXF
The identification number for the AD7794/AD7795 is stored in
the ID register. This is a read-only register.
Configures Pin AIN6(+)/P1 and Pin AIN6(−)/P2 as analog input pins or digital output pins. When this
bit is set, the pins are configured as Digital Output Pin P1 and Digital Output Pin P2. When this bit is
cleared, these pins are configured as Analog Input Pin AIN6(+) and Analog Input Pin AIN6(−).
P2/P1 Data. When IOEN is set, the data for Digital Output Pin P1 and Digital Output Pin P2 is written
to Bit IO2DAT and Bit IO1DAT.
IEXCDIR1 IEXCDIR0 Current Source Direction
These bits are used to enable and disable the current sources. They also select the value of the
excitation currents.
IEXCEN1 IEXCEN0 Current Source Value
IO REGISTER
RS2, RS1, RS0 = 1, 0, 1; Power-On/Reset = 0x00
The IO register is an 8-bit read/write register that is used
to enable the excitation currents and select the value of the
excitation currents.
Tabl e 21 outlines the bit designations for the IO register. IO0
through IO7 indicate the bit locations. IO denotes that the bits
are in the IO register. IO7 denotes the first bit of the data
stream. The number in brackets indicates the power-on/reset
default status of that bit.
Current Source IEXC1 connected to Pin IOUT1. Current Source IEXC2
connected to Pin IOUT2.
Current Source IEXC1 connected to Pin IOUT2. Current Source IEXC2
connected to Pin IOUT1.
Both current sources connected to Pin IOUT1. Permitted only when the
current sources are set to 10 μA or 210 μA.
Both current sources connected to Pin IOUT2. Permitted only when the
current sources are set to 10 μA or 210 μA.
The offset register is a 16-bit register on the AD7795 and a 24-bit
register on the AD7794. The offset register holds the offset
calibration coefficient for the ADC and its power-on reset value
is 0x8000/0x800000, for the AD7794/AD7795, respectively. The
AD7794/AD7795 each have four offset registers. Channel AIN1
to Channel AIN3 have dedicated offset registers while the
AIN4, AIN5, and AIN6 channels share an offset register. Each
of these registers is a read/write register. The register is used in
conjunction with its associated full-scale register to form a
register pair. The power-on reset value is automatically
overwritten if an internal or system zero-scale calibration is
initiated by the user. The AD7794/AD7795 must be placed in
power-down mode or idle mode when writing to the offset
register.
The full-scale register is a 16-bit register on the AD7795 and a
24-bit register on the AD7794. The full-scale register holds the
full-scale calibration coefficient for the ADC. The AD7794/
AD7795 each have four full-scale registers. The AIN1, AIN2,
and AIN3 channels have dedicated full-scale registers, while the
AIN4, AIN5, and AIN6 channels share a register. The full-scale
registers are read/write registers. However, when writing to the
full-scale registers, the ADC must be placed in power-down
mode or idle mode. These registers are configured on power-on
with factory calibrated full-scale calibration coefficients, the
calibration being performed at gain = 1. Therefore, every device
has different default coefficients. The coefficients are different,
depending on whether the internal reference or an external
reference is selected. The default value is automatically
overwritten if an internal or system full-scale calibration is
initiated by the user or the full-scale register is written to.
Rev. D | Page 25 of 36
AD7794/AD7795
Y
V
ADC CIRCUIT INFORMATION
OVERVIEW
The AD7794/AD7795 are low power ADCs that incorporate a
∑-Δ modulator, buffer, reference, in-amp, and on-chip digital
filtering, which are intended for the measurement of wide
dynamic range, low frequency signals (such as those in pressure
transducers), weigh scales, and temperature measurement
applications.
Each part has six differential inputs that can be buffered or
unbuffered. The devices operate with an internal 1.17 V reference or by using an external reference.
basic connections required to operate the parts.
The output rate of the AD7794/AD7795 (f
grammable. The allowable update rates, along with the
corresponding settling times, are listed in
enabled. With chop disabled, the allowable update rates remain
unchanged, but the settling time equals 1/f
rejection is the major function of the digital filter. Simultaneous
Figure 12 shows the
) is user pro-
ADC
Tabl e 19 for chop
. Normal mode
ADC
DD
50 Hz and 60 Hz rejection is optimized when the update rate
equals 16.7 Hz or less, as notches are placed at both 50 Hz and
60 Hz with these update rates (see
Figure 14).
The AD7794/AD7795 use slightly different filter types,
depending on the output update rate, so that the rejection of
quantization noise and device noise is optimized. When the
update rate is 4.17 Hz to 12.5 Hz, a Sinc3 filter along with an
averaging filter is used. When the update rate is 16.7 Hz to
39 Hz, a modified Sinc3 filter is used. This filter gives
simultaneous 50 Hz/60 Hz rejection when the update rate
equals 16.7 Hz. A Sinc4 filter is used when the update rate is
50 Hz to 242 Hz. Finally, an integrate-only filter is used when
the update rate equals 470 Hz. Figure 13 to Figure 16 show the
frequency response of the different filter types for some of the
update rates when chop is enabled. In this mode, the settling
time equals twice the update rate. Figure 17 to Figure 20 show
the filter response with chop disabled.
As previously outlined in the On-Chip Registers section, the
programmable functions of the AD7794/AD7795 are controlled
using a set of on-chip registers. Data is written to these registers
via the serial interface. Read access to the on-chip registers is
also provided by this interface. All communications with the
parts must start with a write to the communications register.
After power-on or reset, each device expects a write to its
communications register. The data written to this register
determines whether the next operation is a read operation or a
write operation, and determines to which register this read or
write operation occurs. Therefore, write access to any of the
other registers on the parts begins with a write operation to the
communications register, followed by a write to the selected
register. A read operation from any other register (except when
continuous read mode is selected) starts with a write to the
communications register, followed by a read operation from the
selected register.
The serial interface of the AD7794/AD7795 consists of four
signals:
CS
, DIN, SCLK, and DOUT/
RDY
. The DIN line is used
04854-023
04854-024
RDY
to transfer data into the on-chip registers, while DOUT/
is
used for accessing data from the on-chip registers. SCLK is the
serial clock input for the devices, and all data transfers (either
on DIN or DOUT/
The DOUT/
RDY
) occur with respect to the SCLK signal.
RDY
pin also operates as a data ready signal; the
line goes low when a new data-word is available in the output
register. It is reset high when a read operation from the data
register is complete. It also goes high prior to the updating of
the data register to indicate when not to read from the device, to
ensure that a data read is not attempted while the register is
being updated.
CS
is used to select a device. It can be used to
decode the AD7794/AD7795 in systems where several
components are connected to the serial bus.
Figure 3 and Figure 4 show timing diagrams for interfacing to the
AD7794/AD7795 with
CS
, which is being used to decode the parts.
Figure 3 shows the timing for a read operation from the output
shift register of the AD7794/AD7795, while Figure 4 shows the
timing for a write operation to the input shift register. It is
possible to read the same word from the data register several
times, even though the DOUT/
RDY
line returns high after the
first read operation. However, care must be taken to ensure that
the read operations have been completed before the next output
update occurs. In continuous read mode, the data register can
be read only once.
CS
The serial interface can operate in 3-wire mode by tying
In this case, the SCLK, DIN, and DOUT/
RDY
lines are used to
low.
communicate with the AD7794/AD7795. The end of the
RDY
conversion can be monitored using the
bit in the status
register. This scheme is suitable for interfacing to micro-
CS
controllers. If
is required as a decoding signal, it can be
generated from a port pin. For microcontroller interfaces, it is
recommended that SCLK idle high between data transfers.
CS
The AD7794/AD7795 can be operated with
being used as a
frame synchronization signal. This scheme is useful for DSP
interfaces. In this case, the first bit (MSB) is effectively clocked
CS
out by
, because CS normally occurs after the falling edge of
SCLK in DSPs. The SCLK can continue to run between data
transfers, provided the timing numbers are obeyed.
The serial interface can be reset by writing a series of 1s on the
DIN input. If a Logic 1 is written to the AD7794/AD7795 line
for at least 32 serial clock cycles, the serial interface is reset.
This ensures that the interface can be reset to a known state if
the interface gets lost due to a software error or some glitch in
the system. Reset returns the interface to the state in which it is
expecting a write to the communications register. This
operation resets the contents of all registers to their power-on
values. Following a reset, the user should allow a period of
500 μs before addressing the serial interface.
The AD7794/AD7795 can be configured to continuously convert
or perform a single conversion (see Figure 21 through Figure 23).
Rev. D | Page 28 of 36
AD7794/AD7795
CS
DIN
DOUT/RDY
SCLK
DIN
DOUT/RDY
CS
0x080x200A
0x58
DATA
Figure 21. Single Conversion
0x580x58
DATADATA
04854-014
SCLK
DIN
DOUT/RDY
SCLK
CS
0x5C
Figure 22. Continuous Conversion
DATADATADAT A
Figure 23. Continuous Read
4854-015
4854-016
Rev. D | Page 29 of 36
AD7794/AD7795
Single Conversion Mode
In single conversion mode, the AD7794/AD7795 are placed in
shutdown mode between conversions. When a single
conversion is initiated by setting MD2 to 0, MD1 to 0, and MD0
to 1 in the mode register, the AD7794/AD7795 power up,
perform a single conversion, and then return to shutdown
mode. The on-chip oscillator requires 1 ms to power up. A
conversion requires a time period of 2 × t
low to indicate the completion of a conversion. When the dataword has been read from the data register, DOUT/
CS
high. If
conversion is initiated and completed. The data register can be
read several times, if required, even when DOUT/
gone high.
is low, DOUT/
RDY
remains high until another
. DOUT/
ADC
Continuous Conversion Mode
This is the default power-up mode. The AD7794/AD7795
RDY
continuously convert with the
going low each time a conversion is complete. If
RDY
DOUT/
To read a conversion, the user writes to the communications
register, indicating that the next operation is a read of the data
register. The digital conversion is placed on the DOUT/
pin as soon as SCLK pulses are applied to the ADC. DOUT/
returns high when the conversion is read. The user can read this
register additional times, if required. However, the user must
ensure that the data register is not being accessed at the completion
of the next conversion, or else the new conversion word is lost.
line also goes low when a conversion is complete.
pin in the status register
RDY
RDY
RDY
CS
is low, the
goes
has
RDY
RDY
goes
Continuous Read
Rather than write to the communications register each time a
conversion is complete to access the data, the AD7794/AD7795
can be configured so that the conversions are placed on the
DOUT/
communications register, the user need only apply the
appropriate number of SCLK cycles to the ADC. The 24-bit
word is automatically placed on the DOUT/
conversion is complete. The ADC should be configured for
continuous conversion mode.
When DOUT/
sufficient SCLK cycles must be applied to the ADC, and the
data conversion is placed on the DOUT/
conversion is read, DOUT/
conversion is available.
In this mode, the data can be read only once. Also, the user must
ensure that the data-word is read before the next conversion is
complete. If the user has not read the conversion before the
completion of the next conversion, or if insufficient serial clocks are
applied to the AD7794/AD7795 to read the word, the serial
output register is reset when the next conversion is complete.
The new conversion is then placed in the output serial register.
To exit the continuous read mode, the instruction 01011000
must be written to the communications register while the
pin is low. While in the continuous read mode, the ADC
monitors activity on the DIN line so that it can receive the
instruction to exit the continuous read mode. Additionally, a
reset occurs if 32 consecutive 1s are seen on DIN. Therefore,
DIN should be held low in continuous read mode until an
instruction is to be written to the device.
RDY
line automatically. By writing 01011100 to the
RDY
RDY
goes low to indicate the end of a conversion,
RDY
line. When the
RDY
returns high until the next
line when a
RDY
Rev. D | Page 30 of 36
AD7794/AD7795
CIRCUIT DESCRIPTION
ANALOG INPUT CHANNEL
The AD7794/AD7795 have six differential analog input
channels. These are connected to the on-chip buffer amplifier
when the devices are operated in buffered mode. When in
unbuffered mode, the channels connect directly to the
modulator. In buffered mode (the BUF bit in the configuration
register is set to 1), the input channel feeds into a high
impedance input stage of the buffer amplifier. Therefore, the
input can tolerate significant source impedances and is tailored
for direct connection to external resistive-type sensors such as
strain gages or resistance temperature detectors (RTDs).
When BUF = 0, the parts operate in unbuffered mode. This
results in a higher analog input current. Note that this
unbuffered input path provides a dynamic load to the driving
source. Therefore, resistor/capacitor combinations on the input
pins can cause gain errors, depending on the output impedance
of the source that is driving the ADC input. Tabl e 22 shows the
allowable external resistance/capacitance values for unbuffered
mode so that no gain error at the 20-bit level is introduced.
Table 22. External R-C Combination for 20-Bit No Gain Error
Capacitance (pF) Resistance (Ω)
50 9 k
100 6 k
500 1.5 k
1000 900
5000 200
The AD7794/AD7795 can be operated in unbuffered mode
only when the gain equals 1 or 2. At higher gains, the buffer
is automatically enabled. The absolute input voltage range in
buffered mode is restricted to a range between GND + 100 mV
and AV
in-amp is enabled. The absolute input voltage range when the inamp is active is restricted to a range between GND + 300 mV and
AV
mode voltage so that these limits are not exceeded. Otherwise,
there is degradation in linearity and noise performance.
The absolute input voltage in unbuffered mode includes the
range between GND − 30 mV and AV
being unbuffered. The negative absolute input voltage limit does
allow the possibility of monitoring small, true bipolar signals
with respect to GND.
− 100 mV. When the gain is set to 4 or higher, the
DD
− 1.1 V. Care must be taken in setting up the common-
DD
+ 30 mV as a result of
DD
INSTRUMENTATION AMPLIFIER
Amplifying the analog input signal by a gain of 1 or 2 is
performed digitally within the AD7794/AD7795. However,
when the gain equals 4 or higher, the output from the buffer is
applied to the input of the on-chip instrumentation amplifier.
This low noise in-amp means that signals of small amplitude
can be gained within the AD7794/AD7795 while still
maintaining excellent noise performance. For example, when
the gain is set to 64, the rms noise is 40 nV typically, which is
equivalent to 21 bits effective resolution or 18.5 bits peak-topeak resolution.
Each AD7794/AD7795 can be programmed to have a gain of 1,
2, 4, 8, 16, 32, 64, and 128 using Bit G2 to Bit G0 in the
configuration register. Therefore, with an external 2.5 V
reference, the unipolar ranges are from 0 mV to 20 mV to 0 V
to 2.5 V and the bipolar ranges are from ±20 mV to ±2.5 V.
When the in-amp is active (gain ≥ 4), the common-mode
voltage ((AIN(+) + AIN(−))/2) must be greater than or equal to
0.5 V when chop is enabled. With chop disabled, and with the
AMP-CM bit set to 1 to prevent degradation in the commonmode rejection, the allowable common-mode voltage is limited
to between
0.2 + (Gain/2 × (AIN(+) − AIN(−)))
and
− 0.2 − (Gain/2 × (AIN(+) − AIN(−)))
AV
DD
If the AD7794/AD7795 are operated with an external reference
that has a value equal to AV
input signal must be limited to 90% of V
, for correct operation, the analog
DD
/gain when the in-
REF
amp is active.
BIPOLAR/UNIPOLAR CONFIGURATION
The analog input to the AD7794/AD7795 can accept either
unipolar or bipolar input voltage ranges. A bipolar input range
does not imply that the parts can tolerate negative voltages with
respect to system GND. Unipolar and bipolar signals on the
AIN(+) input are referenced to the voltage on the AIN(−) input.
For example, if AIN(−) is 2.5 V and the ADC is configured for
unipolar mode with a gain of 1, the input voltage range on the
AIN(+) pin is 2.5 V to 5 V.
If the ADC is configured for bipolar mode, the analog input
range on the AIN(+) input is 0 V to 5 V. The bipolar/unipolar
option is chosen by programming the U/
configuration register.
B
bit in the
Rev. D | Page 31 of 36
AD7794/AD7795
DATA OUTPUT CODING
When the ADC is configured for unipolar operation, the output
code is natural (straight) binary with a zero differential input
voltage resulting in a code of 00...00, a miscalled voltage
resulting in a code of 100...000, and a full-scale input voltage
resulting in a code of 111...111. The output code for any analog
input voltage can be represented as
N
Code = (2
When the ADC is configured for bipolar operation, the output
code is offset binary with a negative full-scale voltage resulting
in a code of 000...000, a zero differential input voltage resulting
in a code of 100...000, and a positive full-scale input voltage
resulting in a code of 111...111. The output code for any analog
input voltage can be represented as
Code = 2
where:
AIN is the analog input voltage.
GAIN is the in-amp setting (1 to 128).
N = 24.
BURNOUT CURRENTS
The AD7794/AD7795 contain two 100 nA constant current
generators, one sourcing current from AV
sinking current from AIN(−) to GND. The currents are
switched to the selected analog input pair. Both currents are
either on or off, depending on the burnout current enable (BO)
bit in the configuration register. These currents can be used to
verify that an external transducer is still operational before
attempting to take measurements on that channel. Once the
burnout currents are turned on, they flow in the external
transducer circuit, and a measurement of the input voltage on
the analog input channel can be taken. If the resulting voltage
measured is full scale, the user needs to verify why this is the
case. A full-scale reading could mean that the front-end sensor
is open circuit. It could also mean that the front-end sensor is
overloaded and is justified in outputting full scale, or that the
reference may be absent and the NOXREF bit is set, thus
clamping the data to all 1s.
When reading all 1s from the output, the user needs to check
these three cases before making a judgment. If the voltage
measured is 0 V, it may indicate that the transducer has short
circuited. For normal operation, these burnout currents are
turned off by writing a 0 to the BO bit in the configuration
register. The current sources work over the normal absolute
input voltage range specifications with buffers on.
× AIN × GAIN)/V
N – 1
× [(AIN × GAIN/V
REF
) + 1]
REF
to AIN(+), and one
DD
EXCITATION CURRENTS
The AD7794/AD7795 also contain two matched, software
configurable, constant current sources that can be programmed
to equal 10 μA, 210 μA, or 1 mA. Both source currents from
AV
are directed to either the IOUT1 or IOUT2 pin of the
DD
device. These current sources are controlled via bits in the IO
register. The configuration bits enable the current sources and
direct the current sources to IOUT1 or IOUT2, along with
selecting the value of the current. These current sources can be
used to excite external resistive bridge or RTD sensors.
BIAS VOLTAGE GENERATOR
A bias voltage generator is included on the AD7794/AD7795. It
biases the negative terminal of the selected input channel to
AV
/2. This function is available on inputs AIN1(−) to
DD
AIN3(−). It is useful in thermocouple applications, as the
voltage generated by the thermocouple must be biased about
some dc voltage if the gain is greater than 2. This is necessary
because the instrumentation amplifier requires headroom. If
there is no headroom, signals close to GND or AV
do not
DD
convert accurately.
The bias voltage generator is controlled using the VBIAS1 and
VBIAS0 bits in conjunction with the BOOST bit in the
configuration register. The power-up time of the bias voltage
generator is dependent on the load capacitance. To accommodate
higher load capacitances, each AD7794/AD7795 has a BOOST
bit. When this bit is set to 1, the current consumed by the bias
voltage generator is increased so that power-up time is reduced
considerably. Figure 11 shows the power-up times when
BOOST equals 0 and BOOST equals 1 for different load
capacitances. The current consumption of the AD7794/AD7795
increases by 40 μA when the bias voltage generator is enabled,
and BOOST equals 0. With the BOOST function enabled, the
current consumption increases by 250 μA.
REFERENCE
The AD7794/AD7795 have embedded 1.17 V references. These
references can be used to supply the ADC or external references
can be applied. The embedded references are low noise, low
drift references with 4 ppm/°C drift typically. For external
references, the ADC has a fully differential input capability for
the channel. In addition, the user has the option of selecting one
of two external reference options (REFIN1 or REFIN2). The
reference source for the AD7794/AD7795 is selected using the
REFSEL1 and REFSEL0 bits in the configuration register. When
the internal reference is selected, it is internally connected to
the modulator (it is not available on the REFIN pins).
The common-mode range for these differential inputs is from
GND to AV
excessive R-C source impedances introduce gain errors. The
reference voltage REFIN (REFIN(+) − REFIN(−)) is 2.5 V
nominal, but the AD7794/AD7795 are functional with reference
voltages from 0.1 V to AV
excitation (voltage or current) for the transducer on the analog
. The reference input is unbuffered; therefore,
DD
. In applications where the
DD
Rev. D | Page 32 of 36
AD7794/AD7795
input also drives the reference voltage for the parts, the effect of
the low frequency noise in the excitation source is removed,
because the application is ratiometric. If the AD7794/AD7795
are used in nonratiometric applications, a low noise reference
should be used.
Recommended 2.5 V reference voltage sources for the
AD7794/AD7795 include the
low noise, low power references. Also, note that the reference
inputs provide a high impedance, dynamic load. Because the
input impedance of each reference input is dynamic, resistor/capacitor combinations on these inputs can cause dc gain
errors, depending on the output impedance of the source
driving the reference inputs.
Reference voltage sources (for example, the
have low output impedances and are, therefore, tolerant to
having decoupling capacitors on REFIN(+) without introducing
gain errors in the system. Deriving the reference input voltage
across an external resistor means that the reference input sees a
significant external source impedance. External decoupling on
the REFIN pins is not recommended in this type of circuit
configuration.
ADR381 and ADR391, which are
ADR391) typically
REFERENCE DETECT
The AD7794/AD7795 include on-chip circuitry to detect if they
have a valid reference for conversions or calibrations when the
user selects an external reference as the reference source. This
feature is enabled when the REF_DET bit in the configuration
register is set to 1. If the voltage between the selected REFIN(+)
and REFIN(–) pins goes below 0.3 V, or either the REFIN(+) or
REFIN(–) inputs are open circuit, the AD7794/AD7795 detect
that they no longer have valid references. In this case, the
NOXREF bit of the status register is set to 1. If the AD7794/
AD7795 are performing normal conversions and the NOXREF
bit becomes active, the conversion results revert to all 1s.
Therefore, it is not necessary to continuously monitor the status
of the NOXREF bit when performing conversions. It is only
necessary to verify its status if the conversion result read from
the ADC data register is all 1s. If the AD7794/AD7795 are
performing either offset or full-scale calibrations and the
NOXREF bit becomes active, the updating of the respective
calibration registers is inhibited to avoid loading incorrect
coefficients to these registers, and the ERR bit in the status
register is set. If the user is concerned about verifying that a
valid reference is in place every time a calibration is performed,
the status of the ERR bit should be checked at the end of the
calibration cycle.
RESET
The circuitry and serial interface of the AD7794/AD7795 can
be reset by writing 32 consecutive 1s to the device. This resets
the logic, the digital filter, and the analog modulator, and all onchip registers are reset to their default values. A reset is
automatically performed on power-up. When a reset is initiated,
the user must allow a period of 500 μs before accessing any of
the on-chip registers. A reset is useful if the serial interface
becomes asynchronous due to noise on the SCLK line.
AVDD MONITOR
Along with converting external voltages, the ADC can be
used to monitor the voltage on the AV
to Bit CH0 equals 1, the voltage on the AV
attenuated by 6, and the resulting voltage is applied to the
∑-Δ modulator using an internal 1.17 V reference for analogto-digital conversion. This is useful because variations in the
power supply voltage can be monitored.
pin. When Bit CH2
DD
pin is internally
DD
CALIBRATION
The AD7794/AD7795 provide four calibration modes that can
be programmed via the mode bits in the mode register. These
are internal zero-scale calibration, internal full-scale calibration,
system zero-scale calibration, and system full-scale calibration,
which effectively reduce the offset error and full-scale error to
the order of the noise. After each conversion, the ADC
conversion result is scaled using the ADC calibration registers
before being written to the data register. The offset calibration
coefficient is subtracted from the result prior to multiplication
by the full-scale coefficient.
To start a calibration, write the relevant value to the MD2 to
MD0 bits in the mode register. After the calibration is
completed, the contents of the corresponding calibration
registers are updated, the
the DOUT/
AD7794/AD7795 revert to idle mode.
During an internal zero-scale or full-scale calibration, the
respective zero input and full-scale input are automatically
connected internally to the ADC input pins. A system calibration,
however, expects the system zero-scale and system full-scale
voltages to be applied to the ADC pins before initiating the
calibration mode. In this way, external ADC errors are removed.
From an operational point of view, a calibration should be
treated like another ADC conversion. A zero-scale calibration,
if required, should always be performed before a full-scale
calibration. System software should monitor the
status register or the DOUT/
calibration via a polling sequence or an interrupt-driven routine.
With chop enabled, both an internal offset calibration and
a system offset calibration take two conversion cycles. With
chop enabled, an internal offset calibration is not needed
because the ADC itself removes the offset continuously. With
chop disabled, an internal offset calibration or system offset
calibration takes one conversion cycle to complete. Internal
offset calibrations are required with chop disabled and should
occur before the full-scale calibration.
To perform an internal full-scale calibration, a full-scale input
voltage is automatically connected to the selected analog input
for this calibration. When the gain equals 1, a calibration takes
two conversion cycles to complete when chop is enabled and
RDY
pin goes low (if CS is low), and the
RDY
bit in the status register is set,
RDY
RDY
pin to determine the end of
bit in the
Rev. D | Page 33 of 36
AD7794/AD7795
one conversion cycle when chop is disabled. For higher gains,
four conversion cycles are required to perform the full-scale
calibration when chop is enabled, and two conversion cycles
when chop is disabled. DOUT/
calibration is initiated and returns low when the calibration is
complete. The ADC is placed in idle mode following a calibration. The measured full-scale coefficient is placed in the fullscale register of the selected channel. Internal full-scale
calibrations cannot be performed when the gain equals 128.
With this gain setting, a system full-scale calibration can be
performed. A full-scale calibration is required each time the
gain of a channel is changed to minimize the full-scale error.
An internal full-scale calibration can be performed at specified
update rates only. For gains of 1, 2, and 4, an internal full-scale
calibration can be performed at any update rate. However, for
higher gains, internal full-scale calibrations can be performed
only when the update rate is less than or equal to 16.7 Hz, 33.3 Hz,
and 50 Hz. However, the full-scale error does not vary with
update rate, so a calibration at one update is valid for all update
rates (assuming the gain or reference source is not changed).
A system full-scale calibration takes two conversion cycles to
complete, irrespective of the gain setting when chop is enabled
and one conversion cycle when chop is disabled. A system fullscale calibration can be performed at all gains and all update
rates. With chop disabled, the offset calibration (internal or
system offset) should be performed before the system full-scale
calibration is initiated.
GROUNDING AND LAYOUT
Because the analog inputs and reference inputs of the ADC are
differential, most of the voltages in the analog modulator are
common-mode voltages. The excellent common-mode
rejection of the part removes common-mode noise on these
inputs. The digital filter provides rejection of broadband noise
on the power supply, except at integer multiples of the
modulator sampling frequency. The digital filter also removes
noise from the analog and reference inputs, provided that these
noise sources do not saturate the analog modulator. As a result,
the AD7794/AD7795 are more immune to noise interference
than conventional high resolution converters. However, because
the resolution of the AD7794/AD7795 is so high, and the noise
RDY
goes high when the
levels from the AD7794/AD7795 are so low, care must be taken
with regard to grounding and layout.
The printed circuit board that houses the AD7794/AD7795
should be designed so that the analog and digital sections are
separated and confined to certain areas of the board. A minimum
etch technique is generally best for ground planes because it
gives the best shielding.
It is recommended that the GND pin of the AD7794/AD7795
be tied to the AGND plane of the system. In any layout, it is
important that the user keep in mind the flow of currents in the
system, ensuring that the return paths for all currents are as
close as possible to the paths the currents took to reach their
destinations. Avoid forcing digital currents to flow through the
AGND sections of the layout.
The ground plane of the AD7794/AD7795 should be allowed to
run under the AD7794/AD7795 to prevent noise coupling. The
power supply lines to the AD7794/AD7795 should use as wide a
trace as possible to provide low impedance paths and reduce the
effects of glitches on the power supply line. Fast switching
signals, such as clocks, should be shielded with digital ground
to avoid radiating noise to other sections of the board. In
addition, clock signals should never be run near the analog
inputs. Avoid crossover of digital and analog signals. Traces on
opposite sides of the board should run at right angles to each
other. This reduces the effects of feedthrough through the
board. A microstrip technique is the best, but it is not always
possible with a double-sided board. In this technique, the
component side of the board is dedicated to ground planes,
while signals are placed on the solder side.
Good decoupling is important when using high resolution
ADCs. AV
parallel with 0.1 μF capacitors to GND. DV
should be decoupled with 10 μF tantalum in
DD
should be
DD
decoupled with 10 μF tantalum in parallel with 0.1 μF
capacitors to the system’s DGND plane, with the system’s
AGND to DGND connection being close to the
AD7794/AD7795. To achieve the best from these decoupling
components, they should be placed as close as possible to the
device, ideally right up against the device. All logic chips should
be decoupled with 0.1 μF ceramic capacitors to DGND.
Rev. D | Page 34 of 36
AD7794/AD7795
Y
V
APPLICATIONS INFORMATION
The AD7794/AD7795 offer low cost, high resolution analog-todigital functions. Because the analog-to-digital function is
provided by a ∑-Δ architecture, it makes the parts more immune
to noisy environments, making them ideal for use in sensor
measurement, and industrial and process control applications.
FLOWMETER
Figure 24 shows the AD7794/AD7795 being used in a
flowmeter application that consists of two pressure transducers,
with the rate of flow being equal to the pressure difference. The
pressure transducers shown are the BP01 from Sensym. The
pressure transducers are arranged in a bridge network and give
a differential output voltage between its OUT+ and OUT–
terminals. With rated full-scale pressure (in this case
300 mmHg) on the transducer, the differential output voltage is
3 mV/V of the input voltage (that is, the voltage between the
IN(+) and IN(–) terminals).
Assuming a 5 V excitation voltage, the full-scale output range
from the transducer is 15 mV. The excitation voltage for the
bridge can be used to directly provide the reference for the
ADC, as the reference input range includes the supply voltage.
DD
A second advantage of using the AD7794/AD7795 in transducerbased applications is that the low-side power switch can be fully
utilized in low power applications. The low-side power switch is
connected in series with the cold side of the bridges. In normal
operation, the switch is closed and measurements can be taken.
In applications where power is of concern, the AD7794/AD7795
can be placed in standby mode, thus significantly reducing the
power consumed in the application. In addition, the low-side
power switch can be opened while in standby mode, thus
avoiding unnecessary power consumption by the front-end
transducers. When the parts are taken out of standby mode, and
the low-side power switch is closed, the user should ensure that
the front-end circuitry is fully settled before attempting a read
from the AD7794/AD7795.
In the diagram, temperature compensation is performed using a
thermistor. The on-chip excitation current supplies the thermistor.
In addition, the reference voltage for the temperature measurement
is derived from a precision resistor in series with the thermistor.
This allows a ratiometric measurement so that variation of the
excitation current has no effect on the measurement (it is the
ratio of the precision reference resistance to the thermistor
resistance that is measured).
OUT–OUT+
IN+
OUT–OUT+
IN–
IN+
IN–
REFIN1(+)
AIN1(+)
AIN1(–)
AIN2(+)
AIN2(–)
AIN3(+)
AIN3(–)
R
CM
REFIN2(+)
REFIN2(–)
IOUT1
REFIN1(–)
PSW
GNDAV
MUX
GND
DD
V
DD
GND
BUF
V
AD7794/AD7795
SERIAL
INTERFACE
CLK
Σ-Δ
ADC
INTERNAL
CLOCK
AND
LOGIC
CONTROL
IN-AMP
DD
DOUT/RD
DIN
SCLK
CS
DV
DD
04854-025
Figure 24. Typical Application (Flowmeter)
Rev. D | Page 35 of 36
AD7794/AD7795
OUTLINE DIMENSIONS
7.90
7.80
7.70
24
PIN 1
0.15
0.05
0.10 COPLANARITY
0.65
BSC
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153-AD
13
121
1.20
MAX
SEATING
PLANE
4.50
4.40
4.30
6.40 BSC
0.20
0.09
8°
0°
0.75
0.60
0.45
Figure 25. 24-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-24)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD7794BRU –40°C to +105°C 24-Lead Thin Shrink Small Outline Package [TSSOP] RU-24
AD7794BRU-REEL –40°C to +105°C 24-Lead Thin Shrink Small Outline Package [TSSOP] RU-24
AD7794BRUZ
AD7794BRUZ-REEL
AD7794CRUZ
AD7794CRUZ-REEL
AD7795BRUZ
AD7795BRUZ-REEL
EVAL-AD7794EB Evaluation Board
EVAL-AD7795EB Evaluation Board
1
Z = RoHS Compliant Part.
1
1
1
–40°C to +105°C 24-Lead Thin Shrink Small Outline Package [TSSOP] RU-24
1
–40°C to +105°C 24-Lead Thin Shrink Small Outline Package [TSSOP] RU-24
–40°C to +125°C 24-Lead Thin Shrink Small Outline Package [TSSOP] RU-24
1
–40°C to +125°C 24-Lead Thin Shrink Small Outline Package [TSSOP] RU-24
–40°C to +105°C 24-Lead Thin Shrink Small Outline Package [TSSOP] RU-24
1
–40°C to +105°C 24-Lead Thin Shrink Small Outline Package [TSSOP] RU-24