The AD7693 is a 16-bit, successive approximation analog-todigital converter (ADC) that operates from a single power supply,
VDD. It contains a low power, high speed, 16-bit sampling ADC
with no missing codes, an internal conversion clock, and a
versatile serial interface port. The reference voltage, V
applied externally and can be set up to the supply voltage, VDD.
On the CNV rising edge, it samples the voltage difference
between the IN+ and IN− pins. The voltages on these pins
swing in opposite phase between 0 V and V
Its power scales linearly with throughput.
Using the SDI input, the SPI-compatible serial interface also
features the ability to daisy-chain several ADCs on a single
3-wire bus and provides an optional busy indicator. It is compatible
with 1.8 V, 2.5 V, 3 V, or 5 V logic, using the separate VIO supply.
The AD7693 is housed in a 10-lead MSOP or a 10-lead QFN
(LFCSP) with operation specified from −40°C to +85°C.
06394-001
REF
IN+
AD7693
IN–
GND
Figure 2.
250
kSPS
+5
VDD
VIO
SDI
SCK
SDO
CNV
+1.8V TO VDD
3- OR 4-WIRE
INTERFACE
(SPI, DAISY CHAIN, CS)
400 kSPS
to
500 kSPS
AD7693
about V
REF
ADC
Driver
ADA4941-1
ADA4841-x
ADA4941-1
ADA4841-x
, is
REF
/2.
REF
6394-002
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Changes to Ordering Guide.......................................................... 24
12/06—Revision 0: Initial Version
Rev. A | Page 2 of 24
Page 3
AD7693
SPECIFICATIONS
VDD = 4.5 V to 5.5 V, VIO = 2.3 V to VDD, V
Table 2.
Parameter Conditions/Comments Min Typ Max Unit
RESOLUTION 16 Bits
ANALOG INPUT
Voltage Range IN+ − (IN−) −V
Absolute Input Voltage IN+, IN− −0.1 V
Common-Mode Input Range IN+, IN− V
Analog Input CMRR fIN = 250 kHz 65 dB
Leakage Current at 25°C Acquisition phase 1 nA
Input Impedance1
No Missing Codes 16 Bits
Integral Linearity Error −0.5 ±0.25 +0.5 LSB2
Differential Linearity Error −0.5 ±0.25 +0.5 LSB
Transition Noise REF = VDD = 5 V 0.35 LSB
Gain Error3 −20 ±0.5 +20 LSB
Gain Error Temperature Drift ±0.3 ppm/°C
Zero Error3 −5 ±0.5 +5 LSB
Zero Temperature Drift ±0.3 ppm/°C
Power Supply Sensitivity
AC ACCURACY4
Dynamic Range 96 96.5 dB5
Signal-to-Noise fIN = 1 kHz 95.5 96 dB
f
f
f
Signal-to-(Noise + Distortion) fIN = 1 kHz 95.5 96 dB
f
f
Total Harmonic Distortion fIN = 1 kHz −120 −108 dB
f
f
Spurious-Free Dynamic Range fIN = 1 kHz 120 dB
f
f
Intermodulation Distortion6 115 dB
1
See the Analog Inputs section.
2
LSB means least significant bit. With the ±5 V input range, one LSB is 152.6 μV.
3
See the Terminology section. These specifications include full temperature range variation but not the error contribution from the external reference.
4
With V
= 5 V, unless otherwise noted.
REF
5
All specifications expressed in decibels are referred to a full-scale input FSR and tested with an input signal at 0.5 dB below full scale, unless otherwise specified.
6
f
= 21.4 kHz and f
IN1
= 18.9 kHz, with each tone at −7 dB below full scale.
IN2
= VDD, all specifications T
REF
VDD = 5 V ± 5%
= 10 kHz 95.5 dB
IN
= 100 kHz 93 dB
IN
= 1 kHz, V
IN
= 10 kHz 95.5 dB
IN
= 100 kHz 90 dB
IN
= 10 kHz −113 dB
IN
= 100 kHz −92 dB
IN
= 10 kHz 114 dB
IN
= 100 kHz 93.5 dB
IN
= 2.5 V 93 dB
REF
to T
MIN
+V
REF
/2 – 0.1 V
REF
, unless otherwise noted.
MAX
/2 V
REF
V
REF
+ 0.1 V
REF
/2 + 0.1 V
REF
±1 ppm
Rev. A | Page 3 of 24
Page 4
AD7693
VDD = 4.5 V to 5.5 V, VIO = 2.3 V to VDD, V
Table 3.
Parameter Conditions/Comments Min Typ Max Unit
REFERENCE
Voltage Range 0.5 VDD + 0.3 V
Load Current 500 kSPS, REF = 5 V 100 μA
VIL −0.3 +0.3 × VIO V
VIH 0.7 × VIO VIO + 0.3 V
IIL −1 +1 μA
IIH −1 +1 μA
DIGITAL OUTPUTS
Data Format
Pipeline Delay1
VOL I
VOH I
POWER SUPPLIES
VDD Specified performance 4. 5 5.5 V
VIO Specified performance 2.3 VDD + 0.3 V
VIO Range 1.8 VDD + 0.3 V
Standby Current
2, 3
VDD and VIO = 5 V, 25°C 1 50 nA
Power Dissipation 100 SPS throughput 5 μW
100 kSPS throughput 4 mW
500 kSPS throughput 18 21.5 mW
Energy per Conversion 40 nJ
TEMPERATURE RANGE4
Specified Performance T
1
Conversion results available immediately after completed conversion.
2
With all digital inputs forced to VIO or GND as required.
3
During acquisition phase.
4
Contact an Analog Devices sales representative for the extended temperature range.
= VDD, all specifications T
REF
Serial 16 bits, twos
MIN
to T
, unless otherwise noted.
MAX
complement
= +500 μA 0.4 V
SINK
= −500 μA VIO − 0.3 V
SOURCE
to T
MIN
−40 +85 °C
MAX
Rev. A | Page 4 of 24
Page 5
AD7693
TIMING SPECIFICATIONS
VDD = 4.5 V to 5.5 V, VIO = 2.3 V to VDD, V
Table 4.
1
Parameter Symbol Min Typ Max Unit
Conversion Time: CNV Rising Edge to Data Available t
Acquisition Time t
Time Between Conversions t
CNV Pulse Width (CS Mode)
SCK Period (CS Mode)
SCK Period (Chain Mode) t
VIO Above 4.5 V 17 ns
VIO Above 3 V 18 ns
VIO Above 2.7 V 19 ns
VIO Above 2.3 V 20 ns
SCK Low Time t
SCK High Time t
SCK Falling Edge to Data Remains Valid t
SCK Falling Edge to Data Valid Delay t
VIO Above 4.5 V 14 ns
VIO Above 3 V 15 ns
VIO Above 2.7 V 16 ns
VIO Above 2.3 V 17 ns
CNV or SDI Low to SDO D15 MSB Valid (CS Mode)
VIO Above 4.5 V 15 ns
VIO Above 2.7 V 18 ns
VIO Above 2.3 V 22 ns
CNV or SDI High or Last SCK Falling Edge to SDO High Impedance (CS Mode)
SDI Valid Setup Time from CNV Rising Edge (CS Mode)
SDI Valid Hold Time from CNV Rising Edge (CS Mode)
SCK Valid Setup Time from CNV Rising Edge (Chain Mode) t
SCK Valid Hold Time from CNV Rising Edge (Chain Mode) t
SDI Valid Setup Time from SCK Falling Edge (Chain Mode) t
SDI Valid Hold Time from SCK Falling Edge (Chain Mode) t
SDI High to SDO High (Chain Mode with Busy Indicator) t
VIO Above 4.5 V 15 ns
VIO Above 2.3 V 26 ns
1
See Figure 3 and Figure 4 for load conditions.
= VDD, all specifications T
REF
MIN
t
t
t
t
t
t
to T
CONV
ACQ
CYC
CNVH
SCK
SCK
SCKL
SCKH
HSDO
DSDO
EN
DIS
SSDICNV
HSDICNV
SSCKCNV
HSCKCNV
SSDISCK
HSDISCK
DSDOSDI
, unless otherwise noted.
MAX
0.5 1.6 μs
400 ns
2.0 μs
10 ns
15 ns
7 ns
7 ns
4 ns
25 ns
15 ns
0 ns
5 ns
10 ns
4 ns
4 ns
Rev. A | Page 5 of 24
Page 6
AD7693
T
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
Analog Inputs
IN+,1 IN−1
GND − 0.3 V to VDD + 0.3 V
or ±130 mA
REF GND − 0.3 V to VDD + 0.3 V
Supply Voltages
VDD, VIO to GND −0.3 V to +7 V
VDD to VIO ±7 V
Digital Inputs to GND −0.3 V to VIO + 0.3 V
Digital Outputs to GND −0.3 V to VIO + 0.3 V
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
θJA Thermal Impedance (MSOP-10) 200°C/W
θJC Thermal Impedance (MSOP-10) 44°C/W
Lead Temperature Range JEDEC J-STD-20
1
See the Analog Inputs section.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
O SDO
50pF
C
L
500µAI
500µAI
OL
1.4V
OH
6394-003
Figure 3. Load Circuit for Digital Interface Timing
30% VIO
t
DELAY
2V OR VIO – 0.5V
0.8V OR 0.5V
12V IF VI O ABOVE 2. 5V, VIO – 0.5V IF VIO BEL OW 2.5V .
20.8V IF V IO ABOVE 2.5V, 0.5V IF VI O BELOW 2.5V.
Figure 4. Voltage Levels for Timing
70% VIO
t
1
2
DELAY
2V OR VIO – 0.5V
0.8V OR 0.5V
1
2
06394-004
Rev. A | Page 6 of 24
Page 7
AD7693
G
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
REF
VDD
IN+
IN–
GND
1
2
AD7693
3
TOP VIEW
(Not to Scale)
4
5
VIO
10
SDI
9
SCK
8
SDO
7
6
CNV
06394-005
Figure 5. 10-Lead MSOP Pin Configuration
1REF
2VDD
AD7693
3IN+
TOP VIEW
4IN–
(Not to Scale)
5
ND
NOTES
1. THE EXPOSED PAD IS CONNECTED
TO GND. THIS CONNECTION I S NOT
REQUIRED TO MEET THE ELECTRICAL
PERFORMANCES.
Figure 6. 10-Lead QFN (LFCSP) Pin Configuration
10 VIO
9SDI
8SCK
7SDO
6CNV
05793-006
Table 6. Pin Function Descriptions
Pin No. Mnemonic Type1 Description
1 REF AI
Reference Input Voltage. The REF range is from 0.5 V to VDD. It is referred to the GND pin. This
pin should be decoupled closely to the pin with a 10 μF capacitor.
2 VDD P Power Supply.
3 IN+ AI
4 IN− AI
5 GND P
6 CNV DI
Differential Positive Analog Input.
Differential Negative Analog Input.
Power Supply Ground.
Convert Input. This input has multiple functions. On its leading edge, it initiates the conversions
and selects the interface mode of the part: chain or CS
read when CNV is high. In CS
mode, the SDO pin is enabled when CNV is low.
mode. In chain mode, the data should be
7 SDO DO Serial Data Output. The conversion result is output on this pin. It is synchronized to SCK.
8 SCK DI
Serial Data Clock Input. When the part is selected, the conversion result is shifted out by this
clock.
9 SDI DI
Serial Data Input. This input provides multiple features. It selects the interface mode of the ADC
as follows:
Chain mode is selected if SDI is low during the CNV rising edge. In this mode, SDI is used as a
data input to daisy-chain the conversion results of two or more ADCs onto a single SDO line.
The digital data level on SDI is output on SDO with a delay of 16 SCK cycles.
mode is selected if SDI is high during the CNV rising edge. In this mode, either SDI or CNV
CS
can enable the serial output signals when low and if SDI or CNV is low when the conversion is
complete, the busy indicator feature is enabled.
10 VIO P
Input/Output Interface Digital Power. Nominally at the same supply as the host interface (1.8 V,
2.5 V, 3 V, or 5 V).
EPAD
Exposed Pad. The exposed pad is connected to GND. This connection is not required to meet
the electrical performances. The exposed pad is only on the 10-Lead QFN (LFCSP).
1
AI = analog input, DI = digital input, DO = digital output, and P = power.
Rev. A | Page 7 of 24
Page 8
AD7693
TERMINOLOGY
Least Significant Bit (LSB)
The LSB is the smallest increment that can be represented by a
converter. For a differential analog-to-digital converter with N
bits of resolution, the LSB expressed in volts is
V
2
LSB
(V) =
Integral Nonlinearity Error (INL)
INL refers to the deviation of each individual code from a line
drawn from negative full scale through positive full scale. The
point used as negative full scale occurs ½ LSB before the first
code transition. Positive full scale is defined as a level 1½ LSB
beyond the last code transition. The deviation is measured from
the middle of each code to the true straight line (see Figure 26).
Differential Nonlinearity Error (DNL)
In an ideal ADC, code transitions are 1 LSB apart. DNL is the
maximum deviation from this ideal value. It is often specified in
terms of resolution for which no missing codes are guaranteed.
Zero Error
Zero error is the difference between the ideal midscale voltage,
that is, 0 V, from the actual voltage producing the midscale
output code, that is, 0 LSB.
Gain Error
The first transition (from 100 ... 00 to 100 ... 01) should occur at
a level ½ LSB above nominal negative full scale (−4.999847 V
for the ±5 V range). The last transition (from 011 … 10 to
011 … 11) should occur for an analog voltage 1½ LSB below the
nominal full scale (+4.999771 V for the ±5 V range.) The gain
error is the deviation of the difference between the actual level
of the last transition and the actual level of the first transition
from the difference between the ideal levels.
Aperture Delay
Aperture delay is the measure of the acquisition performance. It
is the time between the rising edge of the CNV input and when
the input signal is held for a conversion.
2
REF
N
Transi ent Res p ons e
Transient response is the time required for the ADC to accurately
acquire its input after a full-scale step function is applied.
Dynamic Range
Dynamic range is the ratio of the rms value of the full scale to
the total rms noise measured with the inputs shorted together.
The value for dynamic range is expressed in decibels.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the actual input signal to the
rms sum of all other spectral components below the Nyquist
frequency, excluding harmonics and dc. The value for SNR is
expressed in decibels.
Signal-to-(Noise + Distortion) Ratio (SINAD)
SINAD is the ratio of the rms value of the actual input signal to
the rms sum of all other spectral components below the Nyquist
frequency, including harmonics but excluding dc. The value for
SINAD is expressed in decibels.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first five harmonic
components to the rms value of a full-scale input signal and is
expressed in decibels.
Spurious-Free Dynamic Range (SFDR)
SFDR is the difference, in decibels, between the rms amplitude
of the input signal and the peak spurious signal.
Effective Number of Bits (ENOB)
ENOB is a measurement of the resolution with a sine wave
input. It is related to SINAD by the following formula:
ENOB = (SINAD
and is expressed in bits.
− 1.76)/6.02
dB
Rev. A | Page 8 of 24
Page 9
AD7693
–
TYPICAL PERFORMANCE CHARACTERISTICS
VDD = 4.5 V to 5.5 V, VIO = 2.3 V to VDD, V
1.0
0.8
0.6
0.4
0.2
0
INL (LSB)
–0.2
–0.4
–0.6
–0.8
–1.0
065536
163843276849152
Figure 7. Integral Nonlinearity vs. Code
POSITIVE INL = +0.17LSB
NEGATIVE INL = –0. 17LSB
CODE
= VDD, TA = 25C.
REF
06394-007
1.0
0.8
0.6
0.4
0.2
0
DNL (LSB)
–0.2
–0.4
–0.6
–0.8
–1.0
065536
163843276849152
POSITIVE DNL = +0. 22LSB
NEGATIVE DNL = –0.22L SB
CODE
06394-010
Figure 10. Differential Nonlinearity vs. Code
300000
258774
250000
200000
150000
COUNTS
100000
50000
0000
0
67
1905
8 9 ABC
CODE IN HEX
441
6394-008
Figure 8. Histogram of a DC Input at the Code Center
Figure 11. Histogram of a DC Input at the Code Transition
100
99
98
97
96
95
SNR (dB)
94
93
92
91
90
–10–8–6–4–20
Figure 9. FFT Plot
135054
126066
00
89ABCD
CODE IN HEX
SNR
THD
INPUT LEVEL (dB)
Figure 12. SNR, THD vs. Input Level
80
–85
–90
–95
–100
–105
–110
–115
–120
–125
–130
6394-011
THD (dB)
6394-012
Rev. A | Page 9 of 24
Page 10
AD7693
–
–
–
100
99
98
97
96
95
94
SNR, SINAD (dB)
93
92
91
90
2.02.53.03.54.04.55.05.5
SNR, SINAD
ENOB
REFERENCE VOL TAGE (V)
Figure 13. SNR, SINAD, and ENOB vs. Reference Voltage
20.0
19.5
19.0
18.5
18.0
17.5
17.0
16.5
16.0
15.5
15.0
80
–85
–90
–95
–100
–105
THD (dB)
ENOB (Bits)
06394-013
–110
–115
–120
–125
–130
2.05.5
2.53.03.54.04.55.0
REFERENCE VOL TAGE (V)
SFDR
THD
Figure 16. THD, SFDR vs. Reference Voltage
130
125
120
115
110
105
100
95
90
85
80
SFDR (dB)
06394-016
100
99
98
97
96
95
94
SNR, SINAD (dB)
93
92
91
90
–55–35–15525456585105125
SNR, SINAD
ENOB
TEMPERATURE ( °C)
Figure 14. SNR, SINAD, and ENOB vs. Temperature
100
98
96
94
92
90
88
SNR, SINAD (dB)
86
84
82
80
050100150200
VIN = –10dBFS
= –1dBFS
V
IN
FREQUENCY (kHz)
Figure 15. SINAD vs. Frequency
20.0
19.5
19.0
18.5
18.0
17.5
17.0
16.5
16.0
15.5
15.0
100
= 5V
V
DD
–105
–110
–115
ENOB (Bits)
06394-014
THD (dB)
–120
–125
–130
–55–35–15525456585105125
SFDR
THD
TEMPERATURE (°C)
130
125
120
115
110
105
100
SFDR (dB)
06394-017
Figure 17. THD, SFDR vs. Temperature
80
–85
–90
–95
–100
–105
THD (dB)
–110
–115
–120
–125
–130
050100150200
06394-015
= –1dBFS
V
IN
VIN = –10dBFS
FREQUENCY (kHz)
06394-018
Figure 18. THD vs. Frequency
Rev. A | Page 10 of 24
Page 11
AD7693
1000
800
600
f
= 100kSPS
S
VDD
1000
800
600
400
OPERATING CURRENT (µA)
200
VIO
0
4.504. 755. 005. 25
SUPPLY (V)
Figure 19. Operating Currents vs. Supply
1000
f
= 100kSPS
S
800
600
400
OPERATING CURRENT (µA)
200
0
–55–35–15–525456585105125
VDD
VIO
TEMPERATURE (°C)
Figure 20. Operating Currents vs. Temperature
5.50
400
POWER-DOW N CURRENT (nA)
200
VDD + VIO
0
–55125105856545255–15–35
06394-019
TEMPERATURE (°C)
06394-022
Figure 22. Power-Down Currents vs. Temperature
1.0
0.5
ZERO ERROR
0
GAIN ERROR
–0.5
ZERO, GAIN ERROR (LSB)
–1.0
–55–35–15525456585105125
06394-020
TEMPERATURE ( °C)
06394-023
Figure 23. Zero Error and Gain Error vs. Temperature
10k
1k
100
10
1
OPERATING CURRENT (µA)
0.1
0.01
101M100k10k1k100
VDD
VIO
SAMPLING RAT E (SPS)
Figure 21. Operating Currents vs. Sample Rate
06394-021
Rev. A | Page 11 of 24
DELAY (ns)
DSDO
t
25
20
15
10
5
0
Figure 24. t
VDD = 5V, 85° C
VDD = 5V, 25°C
SDO CAPACITI VE LOAD (pF)
Delay vs. Capacitance Load and Supply
DSDO
1200 20406080100
6394-031
Page 12
AD7693
+
THEORY OF OPERATION
IN
SWITCHES CO NTROL
SW+MSB
LSB
REF
GND
16,384C
16,384C
4C2CCC32,768C
COMP
4C2CCC32,768C
SW–MSB
LSB
CONTROL
LOGIC
CNV
BUSY
OUTPUT CODE
IN–
Figure 25. ADC Simplified Schematic
CIRCUIT INFORMATION
The AD7693 is a fast, low power, single-supply, precise, 16-bit
ADC using a successive approximation architecture.
The AD7693 is capable of converting 500,000 samples per
second (500 kSPS) and powers down between conversions.
When operating at 1 kSPS, for example, it consumes 40 μW
typically, ideal for battery-powered applications.
The AD7693 provides the user with an on-chip track-and-hold
and does not exhibit pipeline delay or latency, making it ideal
for multiple multiplexed channel applications.
The AD7693 is specified from 4.5 V to 5.5 V and can be
interfaced to any 1.8 V to 5 V digital logic family. It is housed in
a 10-lead MSOP or a tiny 10-lead QFN (LFCSP) that combines
space savings and allows flexible configurations.
It is pin-for-pin compatible with the 16-bit AD7687 and
AD7688 and with the 18-bit AD7690 and AD7691.
CONVERTER OPERATION
The AD7693 is a successive approximation ADC based on a
charge redistribution DAC. Figure 25 shows the simplified
schematic of the ADC. The capacitive DAC consists of two
identical arrays of 16 binary-weighted capacitors, which are
connected to the two comparator inputs.
6394-024
During the acquisition phase, terminals of the array tied to the
comparator’s input are connected to GND via SW+ and SW−.
All independent switches are connected to the analog inputs.
Thus, the capacitor arrays are used as sampling capacitors and
acquire the analog signal on the IN+ and IN− inputs. When the
acquisition phase is complete and the CNV input goes high, a
conversion phase is initiated. When the conversion phase
begins, SW+ and SW− are opened first. The two capacitor
arrays are then disconnected from the inputs and connected to
the GND input. Therefore, the differential voltage between the
IN+ and IN− inputs captured at the end of the acquisition phase
is applied to the comparator inputs, causing the comparator to
become unbalanced. By switching each element of the capacitor
array between GND and REF, the comparator input varies by
binary-weighted voltage steps (V
REF
/2, V
REF
/4 ... V
/32,768).
REF
The control logic toggles these switches, starting with the MSB,
to bring the comparator back into a balanced condition. After
the completion of this process, the part returns to the
acquisition phase, and the control logic generates the ADC
output code and a busy signal indicator.
Because the AD7693 has an on-board conversion clock, the
serial clock, SCK, is not required for the conversion process.
Rev. A | Page 12 of 24
Page 13
AD7693
V
Transfer Functions
The ideal transfer characteristic for the AD7693 is shown in
Figure 26 and Tabl e 7.
011...111
011...110
011...101
ADC CODE (TWO S COMPLEM ENT)
100...010
100...001
100...000
–FSR
–FSR + 1LSB
–FSR + 0.5LSB
+FSR – 1.5LSB
ANAL OG INP UT
+FSR – 1LSB
Figure 26. ADC Ideal Transfer Function
1
REF
33Ω
2.7nF
4
33Ω
2.7nF
4
10µF
2
Figure 27. Typical Application Diagram with Multiple Supplies
0TO V
ADA4841-2
TO 0
REF
ADA4841-2
V+
V+
REF
3
V–
V+
3
V–
1
SEE REFERENCE SE CTION FOR REFERENCE SELECTIO N.
2
C
IS USUALLY A 10µF CERAMIC CAPACITOR (X5R) .
REF
3
SEE TABLE 8 F OR ADDITI ONAL RECOMM ENDED AMPLIFIERS.
4
OPTIONAL FILTER. SEE ANALOG INPUT SECTION.
5
SEE THE DIG ITAL INTERFACE SECT ION FOR MOST CONVE NIENT INTERFACE MODE.
This is also the code for an overranged analog input (V
2
This is also the code for an underranged analog input (V
Analog Input
Digital Output
Code (Hex)
− V
above V
IN+
IN−
− V
IN+
TYPICAL CONNECTION DIAGRAM
Figure 27 shows an example of the recommended connection
diagram for the AD7693 when multiple supplies are available.
5V
1.8V TO VDD
3- OR 4-WIRE INTERFACE
5
6394-026
VDD
VIO
100nF
100nF
SDI
SCK
SDO
CNV
below V
IN−
− V
REF
GND
GND
).
).
Rev. A | Page 13 of 24
Page 14
AD7693
V
–
ANALOG INPUTS
Figure 28 shows an equivalent circuit of the input structure of
the AD7693.
The two diodes, D1 and D2, provide ESD protection for the
analog inputs, IN+ and IN−. Care must be taken to ensure that
the analog input signal does not exceed the supply rails by more
than 0.3 V because this causes the diodes to become forward
biased and to start conducting current. These diodes can handle
a forward-biased current of 130 mA maximum. For instance,
these conditions could eventually occur when the input buffer’s
(U1) supplies are different from VDD. In such a case, for
example, an input buffer with a short circuit, the current
limitation can be used to protect the part.
DD
IN+
OR IN–
GND
D1
C
PIN
D2
R
Figure 28. Equivalent Analog Input Circuit
The analog input structure allows the sampling of the true
differential signal between IN+ and IN−. By using these
differential inputs, signals common to both inputs are rejected.
100
95
90
85
80
75
70
CMRR (dB)
65
60
55
50
110100100010000
FREQUENCY (kHz)
Figure 29. Analog Input CMRR vs. Frequency
During the acquisition phase, the impedance of the analog
inputs (IN+ and IN−) can be modeled as a parallel combination
of the capacitor, C
connection of R
R
is typically 600 Ω and is a lumped component made up of
IN
, and the network formed by the series
PIN
and CIN. C
IN
is primarily the pin capacitance.
PIN
serial resistors and the on resistance of the switches. C
typically 30 pF and is mainly the ADC sampling capacitor.
During the conversion phase, where the switches are opened,
the input impedance is limited to C
. RIN and CIN make a 1-pole,
PIN
low-pass filter that reduces undesirable aliasing effects and
limits the noise.
When the source impedance of the driving circuit is low, the
AD7693 can be driven directly. Large source impedances
significantly affect the ac performance, especially total
C
IN
IN
VREF = 5V
06394-027
06394-028
is
IN
Rev. A | Page 14 of 24
harmonic distortion (THD). The dc performances are less
sensitive to the input impedance. The maximum source
impedance depends on the amount of THD that can be
tolerated. The THD degrades as a function of the source
impedance and the maximum input frequency.
80
VDD = 5V
–85
–90
–95
–100
–105
THD (dB)
–110
–115
–120
–125
–130
0 102030405060708090
250Ω
100Ω
50Ω
33Ω
FREQUENCY (kHz)
6394-047
Figure 30. THD vs. Analog Input Frequency and Source Resistance
DRIVER AMPLIFIER CHOICE
Although the AD7693 is easy to drive, the driver amplifier must
meet the following requirements:
•The noise generated by the driver amplifier needs to be
kept as low as possible to preserve the SNR and transition
noise performance of the AD7693. The noise coming from
the driver is filtered by the AD7693 analog input circuit’s
1-pole, low-pass filter made by R
external filter, if one is used. Because the typical noise of
the AD7693 is 56 μV rms, the SNR degradation due to the
amplifier is
⎛
⎜
SNR
LOSS
=
⎜
log20
⎜
2
⎜
56
⎜
⎝
where:
f
is the input bandwidth in megahertz of the AD7693
−3 dB
(9 MHz) or the cutoff frequency of the input filter, if
one is used.
N is the noise gain of the amplifier (for example, 1 in
buffer configuration).
e
is the equivalent input noise voltage of the op amp,
N
in nV/√Hz.
•For ac applications, the driver should have a THD
performance commensurate with the AD7693.
•For multichannel multiplexed applications, the driver
amplifier and the AD7693 analog input circuit must settle
for a full-scale step onto the capacitor array at a 16-bit level
(0.0015%, 15 ppm). In the amplifier’s data sheet, settling at
0.1% to 0.01% is more commonly specified. This could
differ significantly from the settling time at a 16-bit level
and should be verified prior to driver selection.
and CIN or by the
IN
π
dB3
2
56
π
2
++
)(
−−
2
)(
NefNef
dB3
NN
2
⎞
⎟
⎟
⎟
⎟
⎟
⎠
Page 15
AD7693
±
Table 8. Recommended Driver Amplifiers
Amplifier Typical Application
ADA4941-1 Very low noise, low power single to differential
ADA4841-x Very low noise, small, and low power
AD8655 5 V single supply, low noise
AD8021 Very low noise and high frequency
AD8022 Low noise and high frequency
OP184 Low power, low noise, and low frequency
AD8605, AD8615 5 V single supply, low power
SINGLE-ENDED-TO-DIFFERENTIAL DRIVER
For applications using a single-ended analog signal, either
bipolar or unipolar, the
driver allows for a differential input into the part. The
schematic is shown in Figure 31.
R1 and R2 set the attenuation ratio between the input range and
the ADC range (V
the desired input resistance, signal bandwidth, antialiasing and
noise contribution. For example, for the ±10 V range with a 4 kΩ
impedance, R2 = 1 kΩ and R1 = 4 kΩ.
R3 and R4 set the common mode on the IN− input, and R5 and
R6 set the common mode on the IN+ input of the ADC. The
common mode should be set close to V
supply is desired, it can be set slightly above V
some headroom for the
for the ±10 V range with a single supply, R3 = 8.45 kΩ, R4 =
If an unbuffered reference voltage is used, the decoupling value
depends on the reference used. For instance, a 22 μF (X5R,
1206 size) ceramic chip capacitor is appropriate for optimum
performance using low temperature drift ADR43x and ADR44x
references.
If desired, smaller reference decoupling capacitor values down
to 2.2 μF can be used with a minimal impact on performance,
especially DNL.
Regardless, there is no need for an additional lower value
ceramic decoupling capacitor (for example, 100 nF) between the
REF and GND pins.
POWER SUPPLY
The AD7693 uses two power supply pins: a core supply, VDD,
and a digital input/output interface supply, VIO. VIO allows
direct interface with any logic between 1.8 V and VDD. To
reduce the supplies needed, the VIO and VDD pins can be tied
together. The AD7693 is independent of power supply sequencing
between VIO and VDD. Additionally, it is very insensitive to
power supply variations over a wide frequency range, as shown
in Figure 32.
100
95
90
85
80
75
PSRR (dB)
70
65
60
55
50
110100100010000
FREQUENCY (kHz)
Figure 32. PSRR vs. Frequency
The AD7693 powers down automatically at the end of each
conversion phase; therefore, the operating currents and power
scale linearly with the sampling rate (refer to Figure 21). This
makes the part ideal for low sampling rates (even of a few hertz)
and low battery-powered applications.
VREF = 5V
06394-030
VOLTAGE REFERENCE INPUT
The AD7693 voltage reference input, REF, has a dynamic input
impedance and should therefore be driven by a low impedance
source with efficient decoupling between the REF and GND
pins, as explained in the Layout section.
When REF is driven by a very low impedance source (for
example, a reference buffer using the AD8031 or the AD8605),
a 10 μF (X5R, 0805 size) ceramic chip capacitor is appropriate
for optimum performance.
Rev. A | Page 15 of 24
Page 16
AD7693
SUPPLYING THE ADC FROM THE REFERENCE
For simplified applications, the AD7693, with its low operating
current, can be supplied directly using the reference circuit
shown in Figure 33. The reference line can be driven by
• The system power supply directly
• A reference voltage with enough current output capability,
such as the ADR43x
•A reference buffer, such as the AD8031, which can also
filter the system power supply, as shown in Figure 33.
5V
10kΩ
5V
1µF
1
OPTIONAL REFE RENCE BUFFER AND FILTER.
AD8031
Figure 33. Example of an Application Circuit
5V
10Ω
10µF1µF
1
AD7693
VIOREFVDD
06394-032
DIGITAL INTERFACE
Generally, a user is interested in either minimizing the wiring
complexity of a multichannel ADC system or communicating
with the parts via a specific interface standard. Although the
ADC has only four digital pins (CNV, SCK, SDI, and SDO), it
offers a significantly flexible serial interface, including
compatibility with SPI, QSPI, digital hosts, and DSPs (such as
Blackfin® ADSP-BF53x or ADSP-219x). By configuring the
ADC into one of six modes, virtually any serial interface
scenario can be accommodated.
For wiring efficiency, the best way to configure a multichannel,
simultaneous-sampling system is to use the 3-wire chain mode.
This system is easily created by cascading multiple (M) ADCs
into a shift register structure. The CNV and CLK pins are
common to all ADCs, and the SDO of one part feeds the SDI of
the next part in the chain. The 3-wire interface is simply the
CNV, SCK, and SDO of the last ADC in the chain. For a system
containing M- and N-bit converters, the user needs to provide
M × N SCK transitions to read back all of the data. This 3-wire
interface is also ideally suited for isolated applications.
Additional flexibility is provided by optionally configuring the
ADCs to provide a busy indication. Without a busy indication,
the user must externally timeout the maximum ADC
conversion time before commencing readback. This
configuration is described in the Chain Mode Without Busy
Indicator section. With the busy indication enabled, external
timer circuits are not required because the SDO at the end of
the chain provides a low-to-high transition (that is, a start bit)
when all of the chain members have completed their
conversions and are ready to transmit data. However, one
additional SCK is required to flush the SDO busy indication
prior to reading back the data. This configuration is described
in the Chain Mode with Busy Indicator section.
The primary limitations of 3-wire chain mode are that all ADCs
are simultaneously sampled and the user cannot randomly
select an individual ADC for readback. This can be overcome
only by increasing the number of wires (for example, one chip
select wire per ADC). To operate with this increased
functionality, the part must be used in
CS
Mode. CS mode is
separated into two categories (3-wire and 4-wire) whereby
flexibility is traded off for wiring complexity. In
CS
4-wire
mode, the user has independent control over the sampling
operation (via CNV) and the chip select operation (via SDI) for
each ADC. In
CS
3-wire mode, SDI is unused (tied high) and
CNV is used to both sample the input and chip select the part
when needed. As with chain mode, the parts can optionally be
configured to provide a busy indication, but at the expense of
one additional SCK when reading back the data. So in total
there are four
CS
modes: 3-wire and 4-wire modes, each with
busy and without busy.
There is no elaborate writing of configuration words into the
part via the SDI pin. The mode in which the part operates is
defined by ensuring a specific relationship between the CNV,
SDI, and SCK inputs at key times. To select
CS
mode, ensure
that SDI is high at the rising edge of CNV; otherwise, chain
mode will be selected. Once in
CS
mode, selecting the part for
readback before the conversion is complete (by bringing either
SDI or CNV low) instructs the part to provide a busy indicator,
a high-to-low impedance transition on SDO, to tell the user
when the conversion has finished. If the part is selected after the
conversion has finished, SDO outputs the MSB when it is
selected. In chain mode, the busy indicator, a low-to-high
transition on SDO, is selected based on the state of SCK at the
rising edge of CNV. If SCK is high, the busy indicator is
enabled; otherwise, the busy indicator is not enabled.
The following sections provide specifics for each of the different
serial interface modes. Note that in the following sections, the
timing diagrams indicate digital activity (SCK, CNV) during
conversion. However, due to the possibility of performance
degradation, digital activity should only occur during the first
quarter of the conversion phase because the AD7693 provides
error correction circuitry that can correct for an incorrect bit
during this time. The user should initiate the busy indicator if
desired during this time. It is also possible to corrupt the sample
by having SCK or SDI transitions near the sampling instant.
Therefore, it is recommended to keep the digital pins quiet for
approximately 30 ns before and 10 ns after the rising edge of
CNV. The exception is when the device is in the chain mode
with busy configuration, where SDI is tied to CNV, because this
scenario does not yield a corrupted sample. To this extent, it is
recommended, to use a discontinuous SCK whenever possible to
avoid any potential performance degradation.
Rev. A | Page 16 of 24
Page 17
AD7693
V
CS MODE, 3-WIRE WITHOUT BUSY INDICATOR
This mode is usually used when a single AD7693 is connected
to an SPI-compatible digital host. The connection diagram is
shown in Figure 34, and the corresponding timing is given in
Figure 35.
With SDI tied to VIO, a rising edge on CNV initiates a
conversion, selects the
impedance. Once a conversion is initiated, it continues until
completion irrespective of the state of CNV. This could be
useful, for instance, to bring CNV low to select other SPI
devices, such as analog multiplexers; however, CNV must be
mode, and forces SDO to high
CS
returned high before the minimum conversion time elapses and
then held high for the maximum possible conversion time to
avoid the generation of the busy signal indicator. When the
conversion is complete, the AD7693 enters the acquisition
phase and powers down. When CNV goes low, the MSB is
output onto SDO. The remaining data bits are clocked by
subsequent SCK falling edges. The data is valid on both SCK
edges. Although the rising edge can be used to capture the data,
a digital host using the SCK falling edge will allow a faster
reading rate, provided it has an acceptable hold time. After the
th
16
SCK falling edge or when CNV goes high (whichever
occurs first), SDO returns to high impedance.
CONVERT
SDI = 1
CNV
SCK
SDO
t
CNVH
t
CONV
CONVERSIONACQUISITI ON
Figure 35.
IO
AD7693
Figure 34.
CNV
SDOSDI
SCK
CS
Mode, 3-Wire Without Busy Indicator
DIGITAL HOST
DATA IN
CLK
06394-033
Connection Diagram (SDI High)
t
CYC
t
ACQ
ACQUISITI ON
t
SCK
t
SCKL
123141516
t
HSDO
t
EN
D15D14D13D1D0
CS
Mode, 3-Wire Without Busy Indicator Serial Interface Timing (SDI High)
t
DSDO
t
SCKH
t
DIS
06394-034
Rev. A | Page 17 of 24
Page 18
AD7693
V
CS MODE, 3-WIRE WITH BUSY INDICATOR
This mode is usually used when a single AD7693 is connected
to an SPI-compatible digital host having an interrupt input.
The connection diagram is shown in Figure 36, and the
corresponding timing is given in Figure 37.
With SDI tied to VIO, a rising edge on CNV initiates a
conversion, selects the
impedance. SDO is maintained in high impedance until the
completion of the conversion irrespective of the state of CNV.
Prior to the minimum conversion time, CNV can be used to
select other SPI devices, such as analog multiplexers, but CNV
must be returned low before the minimum conversion time
elapses and then held low for the maximum possible conversion
time to guarantee the generation of the busy signal indicator.
When the conversion is complete, SDO goes from high
CS
mode, and forces SDO to high
IO
CNV
AD7693
SCK
SDOSDI
impedance to low impedance. With a pull-up on the SDO line,
this transition can be used as an interrupt signal to initiate the
data reading controlled by the digital host. The AD7693 then
enters the acquisition phase and powers down. The data bits are
clocked out, MSB first, by subsequent SCK falling edges. The
data is valid on both SCK edges. Although the rising edge can
be used to capture the data, a digital host using the SCK falling
edge will allow a faster reading rate, provided it has an
acceptable hold time. After the optional 17
th
SCK falling edge or
when CNV goes high (whichever occurs first), SDO returns to
high impedance.
If multiple AD7693s are selected at the same time, the SDO
output pin handles this contention without damage or induced
latch-up. Meanwhile, it is recommended to keep this contention
as short as possible to limit extra power dissipation.
CONVERT
VIO
DIGITAL HOST
DATA IN
IRQ
SDI = 1
CNV
SCK
SDO
t
CNVH
t
CONV
CONVERSIONACQUISITION
Figure 37.
Figure 36.
CLK
CS
Mode, 3-Wire with Busy Indicator
6394-035
Connection Diagram (SDI High)
t
CYC
t
ACQ
ACQUISITI ON
t
SCK
t
SCKL
123151617
t
HSDO
t
D15D14D1D0
CS
Mode, 3-Wire with Busy Indicator Serial Interface Timing (SDI High)
DSDO
t
SCKH
t
DIS
6394-036
Rev. A | Page 18 of 24
Page 19
AD7693
CS MODE, 4-WIRE WITHOUT BUSY INDICATOR
This mode is usually used when multiple AD7693s are
connected to an SPI-compatible digital host.
A connection diagram example using two AD7693s is shown in
Figure 38, and the corresponding timing is given in Figure 39.
With SDI high, a rising edge on CNV initiates a conversion,
selects the
mode, CNV must be held high during the conversion phase and
the subsequent data readback. (If SDI and CNV are low, SDO is
driven low.) Prior to the minimum conversion time, SDI can be
used to select other SPI devices, such as analog multiplexers,
but SDI must be returned high before the minimum conversion
mode, and forces SDO to high impedance. In this
CS
time elapses and then held high for the maximum possible
conversion time to avoid the generation of the busy signal
indicator. When the conversion is complete, the AD7693 enters
the acquisition phase and powers down. Each ADC result can
be read by bringing its SDI input low, which consequently
outputs the MSB onto SDO. The remaining data bits are clocked
by subsequent SCK falling edges. The data is valid on both SCK
edges. Although the rising edge can be used to capture the data,
a digital host using the SCK falling edge will allow a faster
reading rate, provided it has an acceptable hold time. After the
th
16
SCK falling edge or when SDI goes high (whichever occurs
first), SDO returns to high impedance and another AD7693 can
be read.
CS2
CS1
CONVERT
CNV
SCK
Figure 38.
SDOSDI
CS
Mode, 4-Wire Without Busy Indicator Connection Diagram
CNV
AD7693AD7693
SDOSDI
SCK
DIGITAL HOST
DATA IN
CLK
6394-037
t
CYC
CNV
t
ACQ
ACQUISITION
171816
D0D16D15
t
DIS
6394-038
t
SSDICNV
SDI(CS1)
SDI(CS2)
SCK
SDO
t
HSDICNV
t
CONV
CONVERS IONACQUISITION
t
SCK
t
SCKL
t
DSDO
1415
t
SCKH
D1
123303132
t
t
EN
HSDO
D15D14D13D1D0
CS
Figure 39.
Mode, 4-Wire Without Busy Indicator Serial Interface Timing
Rev. A | Page 19 of 24
Page 20
AD7693
CS MODE, 4-WIRE WITH BUSY INDICATOR
This mode is usually used when a single AD7693 is connected
to an SPI-compatible digital host with an interrupt input and it
is desired to keep CNV, which is used to sample the analog
input, independent of the signal used to select the data reading.
This requirement is particularly important in applications
where low jitter on CNV is desired.
The connection diagram is shown in Figure 40, and the
corresponding timing is given in Figure 41.
With SDI high, a rising edge on CNV initiates a conversion,
selects the
mode, CNV must be held high during the conversion phase and
the subsequent data readback. (If SDI and CNV are low, SDO is
driven low.) Prior to the minimum conversion time, SDI can be
used to select other SPI devices, such as analog multiplexers,
CS
mode, and forces SDO to high impedance. In this
CNV
AD7693
SCK
SDOSDI
but SDI must be returned low before the minimum conversion
time elapses and then held low for the maximum possible
conversion time to guarantee the generation of the busy signal
indicator. When the conversion is complete, SDO goes from
high impedance to low impedance. With a pull-up on the SDO
line, this transition can be used as an interrupt signal to initiate
the data readback controlled by the digital host. The AD7693
then enters the acquisition phase and powers down. The data
bits are clocked out, MSB first, by subsequent SCK falling edges.
The data is valid on both SCK edges. Although the rising edge
can be used to capture the data, a digital host using the SCK
falling edge will allow a faster reading rate, provided it has an
acceptable hold time. After the optional 17
th
SCK falling edge,
or when SDI goes high (whichever occurs first), SDO returns to
high impedance.
CS1
CONVERT
VIO
DIGITAL HOST
DATA IN
IRQ
CNV
t
SDI
SCK
SDO
SSDICNV
t
HSDICNV
CONVERSIONACQUISITI ON
Figure 40.
t
CONV
t
EN
Figure 41.
CLK
CS
Mode, 4-Wire with Busy Indicator Connection Diagram
t
CYC
t
ACQ
ACQUISITI ON
t
SCK
t
SCKL
123151617
t
HSDO
t
DSDO
D15D14D1D0
CS
Mode, 4-Wire with Busy Indicator Serial Interface Timing
t
SCKH
06394-039
t
DIS
06394-040
Rev. A | Page 20 of 24
Page 21
AD7693
CHAIN MODE WITHOUT BUSY INDICATOR
This mode can be used to daisy-chain multiple AD7693s on
a 3-wire serial interface. This feature is useful for reducing
component count and wiring connections, for example, in
isolated multiconverter applications or for systems with a
limited interfacing capacity. Data readback is analogous to
clocking a shift register.
A connection diagram example using two AD7693s is shown in
Figure 42, and the corresponding timing is given in Figure 43.
When SDI and CNV are low, SDO is driven low. With SCK low,
a rising edge on CNV initiates a conversion, selects the chain
mode, and disables the busy indicator. In this mode, CNV is
held high during the conversion phase and the subsequent data
readback. When the conversion is complete, the MSB is output
onto SDO and the AD7693 enters the acquisition phase and
powers down. The remaining data bits stored in the internal
shift register are clocked by subsequent SCK falling edges. For
each ADC, SDI feeds the input of the internal shift register and
is clocked by the SCK falling edge. Each ADC in the chain
outputs its data MSB first, and 16 × N clocks are required to
read back the N ADCs. The data is valid on both SCK edges.
Although the rising edge can be used to capture the data, a
digital host using the SCK falling edge will allow a faster
reading rate and consequently more AD7693s in the chain,
provided the digital host has an acceptable hold time. The
maximum conversion rate can be reduced due to the total
readback time.
CONVERT
CNV
AD7693
A
SCK
SDOSDI
CNV
AD7693
B
SCK
DIGITAL HOST
SDOSDI
DATA IN
CLK
6394-041
Figure 42. Chain Mode Without Busy Indicator Connection Diagram
SDIA = 0
CNV
SCK
t
HSCKCNV
SDOA = SDI
SDO
t
CONV
CONVERSIONACQUISITION
t
t
SSCKCNV
123303132
t
t
EN
B
t
HSDO
t
DSDO
B
SSDISCK
DA15DA14DA13
DB15DB14DB13DA1DB1DB0DA15DA14
SCKL
t
Figure 43. Chain Mode Without Busy Indicator Serial Interface Timing
1415
HSDISCK
t
CYC
ACQUISITI ON
t
SCK
DA1
t
t
SCKH
ACQ
DA0
171816
DA0
06394-042
Rev. A | Page 21 of 24
Page 22
AD7693
CHAIN MODE WITH BUSY INDICATOR
This mode can also be used to daisy-chain multiple AD7693s
on a 3-wire serial interface while providing a busy indicator.
This feature is useful for reducing component count and wiring
connections, for example, in isolated multiconverter applications
or for systems with a limited interfacing capacity. Data readback
is analogous to clocking a shift register.
A connection diagram example using three AD7693s is shown
in Figure 44, and the corresponding timing is given in Figure 45.
When SDI and CNV are low, SDO is driven low. With SCK
high, a rising edge on CNV initiates a conversion, selects the
chain mode, and enables the busy indicator feature. In this
mode, CNV is held high during the conversion phase and the
subsequent data readback. When all ADCs in the chain have
completed their conversions, the SDO pin of the ADC closest to
the digital host (see the AD7693 ADC labeled C in Figure 44) is
driven high. This transition on SDO can be used as a busy
indicator to trigger the data readback controlled by the digital
host. The AD7693 then enters the acquisition phase and powers
down. The data bits stored in the internal shift register are
clocked out, MSB first, by subsequent SCK falling edges. For
each ADC, SDI feeds the input of the internal shift register and
is clocked by the SCK falling edge. Each ADC in the chain
outputs its data MSB first, and 16 × N + 1 clocks are required to
readback the N ADCs. Although the rising edge can be used to
capture the data, a digital host using the SCK falling edge allows
a faster reading rate and consequently more AD7693s in the
chain, provided the digital host has an acceptable hold time.
CONVERT
CNV = SDI
ACQUISITI ON
SCK
t
HSCKCNV
SDOA = SDI
= SDI
SDO
B
SDO
A
B
C
C
CNV
AD7693
A
SCK
t
CONV
CONVERSION
t
SSCKCNV
t
EN
t
DSDOSDI
t
DSDOSDI
CNV
SDOSDI
AD7693
B
SCK
SDOSDI
CNV
AD7693
C
SCK
SDOSDI
DIGITAL HOST
DATA IN
IRQ
CLK
06394-043
Figure 44. Chain Mode with Busy Indicator Connection Diagram
t
CYC
t
ACQ
ACQUISITION
t
t
SCKH
123354748
t
SSDISCK
DA15 DA14 DA13
t
HSDO
t
DSDO
DB15 DB14 DB13DA1DB1DB0DA15 DA14
DC15 DC14 DC13DA1DA0DC1DC0D
SCK
415
t
HSDISCK
DA1
t
SCKL
173416
DA0
19313218
33
DA0
1DB0DA15DB15 DB14
D
B
14
A
t
DSDOSDI
t
DSDOSDI
t
49
DSDOSDI
Figure 45. Chain Mode with Busy Indicator Serial Interface Timing
06394-044
Rev. A | Page 22 of 24
Page 23
AD7693
APPLICATION HINTS
LAYOUT
The printed circuit board that houses the AD7693 should be
designed so that the analog and digital sections are separated
and confined to certain areas of the board. The pinout of the
AD7693, with all its analog signals on the left side and all its
digital signals on the right side, eases this task.
Avoid running digital lines under the device because these
couple noise onto the die unless a ground plane under the
AD7693 is used as a shield. Fast switching signals, such as CNV
or clocks, should not run near analog signal paths. Crossover of
digital and analog signals should be avoided.
At least one ground plane should be used. It could be common
or split between the digital and analog sections. In the latter
case, the planes should be joined underneath the AD7693s.
The AD7693 voltage reference input REF has a dynamic input
impedance and should be decoupled with minimal parasitic
inductances. This is done by placing the reference decoupling
ceramic capacitor close to, ideally right up against, the REF and
GND pins and connecting them with wide, low impedance traces.
Finally, the power supplies VDD and VIO of the AD7693
should be decoupled with ceramic capacitors, typically 100 nF,
placed close to the AD7693 and connected using short, wide
traces to provide low impedance paths and reduce the effect of
glitches on the power supply lines.
An example of a layout following these rules is shown in
Figure 46 and Figure 47.
Figure 46. Example Layout of the AD7693 (Top Layer)
06394-045
EVALUATING AD7693 PERFORMANCE
Other recommended layouts for the AD7693 are outlined
in the documentation of the evaluation board for the AD7693
(EVAL-AD7693CB). The evaluation board package includes
a fully assembled and tested evaluation board, documentation,
and software for controlling the board from a PC via the
EVAL-CONTROL BRD3.
Figure 47. Example Layout of the AD7693 (Bottom Layer)
6394-046
Rev. A | Page 23 of 24
Page 24
AD7693
OUTLINE DIMENSIONS
3.10
3.00
2.90
10
6
3.10
3.00
2.90
PIN 1
IDENTIFIER
0.95
0.85
0.75
0.15
0.05
COPLANARITY
0.10
1
0.50 BSC
COMPLIANT TO JEDEC STANDARDS MO-187-BA
Figure 48.10-Lead Mini Small Outline Package [MSOP]
3.10
3.00 SQ
2.90
5.15
4.90
4.65
5
15° MAX
6°
0°
0.23
0.13
0.30
0.15
1.10 MAX
(RM-10)
Dimensions shown in millimeters
2.48
2.38
2.23
0.70
0.55
0.40
0.50 BSC
091709-A
PIN 1 INDEX
AREA
0.80
0.75
0.70
SEATING
PLANE
TOP VIEW
0.30
0.25
0.20
0.50
0.40
0.30
0.05 MAX
0.02 NOM
0.20 REF
6
EXPOSED
PAD
5
BOTTOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
10
1.74
1.64
1.49
1
N
1
P
I
R
C
I
A
O
T
N
I
D
)
5
1
.
R
0
(
121009-A
Figure 49. 10-Lead Lead Frame Chip Scale Package [QFN (LFCSP_WD)]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-10-9)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Notes Temperature Range Package Description Package Option Branding Ordering Quantity