The AD7684 is a 16-bit, charge redistribution, successive
approximation, PulSAR
that operates from a single power supply, VDD, between 2.7 V
to 5.5 V. It contains a low power, high speed, 16-bit sampling
ADC with no missing codes, an internal conversion clock, and a
serial, SPI-compatible interface port. The part also contains a
low noise, wide bandwidth, short aperture delay, track-and-hold
™ analog-to-digital converter (ADC)
circuit. On the
falling edge, it samples the voltage difference
CS
between +IN and –IN pins. The reference voltage, REF, is
applied externally and can be set up to the supply voltage. Its
power scales linearly with throughput.
The AD7684 is housed in an 8-lead MSOP package, with an
operating temperature specified from −40°C to +85°C.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Anal og Devices. Trademarks and
registered trademarks are the property of their respective owners.
Voltage Range +IN − (–IN) −V
Absolute Input Voltage +IN, –IN −0.1 VDD + 0.1 V
Analog Input CMRR fIN = 100 kHz 65 dB
Leakage Current at 25°C Acquisition phase 1 nA
Input Impedance See the Analog Input section.
= VDD; TA = –40°C to +85°C, unless otherwise noted.
REF
= V
= V
+IN
−IN
/2 = 2.5 V 50 µA
REF
−0.3 0.3 × VDD V
0.7 × VDD VDD + 0.3 V
−1 +1 µA
−1 +1 µA
I
= −500 µA VDD − 0.3 V
SOURCE
I
= +500 µA 0.4 V
SINK
2.0 5.5 V
2, 3
VDD = 5 V, 25°C
to T
MIN
MAX
REF
+V
REF
V
1 50 nA
−40 +85
°C
1
See the section for more information. Typical Performance Characteristics
2
With all digital inputs forced to VDD or GND, as required.
3
During acquisition phase.
Rev. 0 | Page 3 of 16
Page 4
AD7684
VDD = 5 V; V
Table 3.
Parameter Conditions Min Typ Max Unit
ACCURACY
No Missing Codes 16 Bits
Integral Linearity Error −3 ±1 +3 LSB
Transition Noise 0.5 LSB
Gain Error1, T
Gain Error Temperature Drift ±0.3 ppm/°C
Zero Error1, T
Zero Temperature Drift ±0.3 ppm/°C
Power Supply Sensitivity
AC ACCURACY
Signal-to-Noise fIN = 1 kHz 88 91 dB
Spurious-Free Dynamic Range fIN = 1 kHz −108 dB
Total Harmonic Distortion fIN = 1 kHz −106 dB
Signal-to-(Noise + Distortion) fIN = 1 kHz 88 91 dB
Effective Number of Bits fIN = 1 kHz 14.8 Bits
= VDD; TA = –40°C to +85°C, unless otherwise noted.
REF
MIN
MIN
to T
to T
MAX
MAX
±2 ±15 LSB
±0.4 ±1.6 mV
VDD = 5 V ±5%
±0.05 LSB
2
1
See the section. These specifications include full temperature range variation, but do not include the error contribution from the external reference. Terminology
2
All specifications in dB are referred to a full-scale input, FS. Tested with an input signal at 0.5 dB below full scale, unless otherwise specified.
VDD = 2.7 V; V
= 2.5 V; TA = –40°C to +85°C, unless otherwise noted.
REF
Table 4.
Parameter Conditions Min Typ Max Unit
ACCURACY
No Missing Codes 16 Bits
Integral Linearity Error −3 ±1 +3 LSB
Transition Noise 0.85 LSB
Gain Error1, T
MIN
to T
MAX
±2 ±15 LSB
Gain Error Temperature Drift ±0.3 ppm/°C
Zero Error1, T
MIN
to T
MAX
±0.7 ±3.5 mV
Zero Temperature Drift ±0.3 ppm/°C
Power Supply Sensitivity
VDD = 2.7 V ±5%
±0.05 LSB
AC ACCURACY
Signal-to-Noise fIN = 1 kHz 86 dB
2
Spurious-Free Dynamic Range fIN = 1 kHz −100 dB
Total Harmonic Distortion fIN = 1 kHz −98 dB
Signal-to-(Noise + Distortion) fIN = 1 kHz 86 dB
Effective Number of Bits fIN = 1 kHz 14 Bits
1
See the section. These specifications do include full temperature range variation, but do not include the error contribution from the external reference. Terminology
2
All specifications in dB are referred to a full-scale input FS. Tested with an input signal at 0.5 dB below full scale, unless otherwise specified.
Rev. 0 | Page 4 of 16
Page 5
AD7684
TIMING SPECIFICATIONS
VDD = 2.7 V to 5.5 V; TA = −40°C to +85°C, unless otherwise noted.
Table 5.
Parameter Symbol Min Typ Max Unit
Throughput Rate t
CS Falling to DCLOCK Low
CS Falling to DCLOCK Rising
DCLOCK Falling to Data Remains Valid t
CS Rising Edge to D
High Impedance
OUT
DCLOCK Falling to Data Valid t
Acquisition Time t
D
Fall Time t
OUT
D
Rise Time t
OUT
t
CYC
CS
t
SUCS
DCLOCK
D
OUT
145
t
CSD
Hi-Z
NOTE:
A MINIMUM OF 22 CLOCK CYCLES ARE REQUIRED FOR 16-BIT CONVERSION. SHOWN ARE 24 CLOCK CYCLES.
D
GOES LOW ON THE DCLOCK FALLING EDGE FOLLOWING THE LSB READING.
VDD to GND −0.3 V to +6 V
Digital Inputs to GND −0.3 V to VDD + 0.3 V
Digital Outputs to GND −0.3 V to VDD + 0.3 V
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
θJA Thermal Impedance 200°C/W
θJC Thermal Impedance 44°C/W
Lead Temperature Range
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
GND − 0.3 V to VDD + 0.3 V
or ±130 mA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1
See the section. Analog Input
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
500µAI
TO D
OUT
C
L
100pF
500µAI
Figure 3. Load Circuit for Digital Interface Timing
0.8V
t
DELAY
2V
Figure 4. Voltage Reference Levels for Timing
D
OUT
t
R
Figure 5. D
OUT
OL
OH
2V
t
DELAY
2V
0.8V0.8V
t
F
Rise and Fall Timing
1.4V
04302-003
90%
10%
04302-004
04302-005
Rev. 0 | Page 6 of 16
Page 7
AD7684
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
REF
+IN
2
AD7684
TOP VIEW
–IN
3
(Not to Scale)
GND
4
Figure 6. 8-Lead MSOP Pin Configuration
Table 7. Pin Function Descriptions
Pin No. Mnemonic Type1Function
1 REF AI
Reference Input Voltage. The REF range is from 0.5 V to VDD. It is referred to the GND pin. This pin should
be decoupled closely to the pin with a ceramic capacitor of a few µF.
2 +IN AI Differential Positive Analog Input.
3 –IN AI Differential Negative Analog Input.
4 GND P Power Supply Ground.
5
CS
DI
Chip Select Input. On its falling edge, it initiates the conversions. The part returns in shutdown mode as
soon as the conversion is done. It also enables D
6 D
OUT
DO Serial Data Output. The conversion result is output on this pin. It is synchronized to SCK.
7 DCLOCK DI Serial Data Clock Input.
8 VDD P Power Supply.
1
AI = Analog Input; DI = Digital Input; DO = Digital Output; and P = Power.
8
VDD
DCLOCK
7
D
6
CS
5
OUT
OUT
04302-006
. When high, D
is high impedance.
OUT
Rev. 0 | Page 7 of 16
Page 8
AD7684
[
(
−+=
TERMINOLOGY
Integral Nonlinearity Error (INL)
Effective Number of Bits (ENOB)
Linearity error refers to the deviation of each individual code
from a line drawn from negative full scale through positive full
scale. The point used as negative full scale occurs ½ LSB before
the first code transition. Positive full scale is defined as a level
1½ LSB beyond the last code transition. The deviation is
measured from the middle of each code to the true straight line
(see Figure 21).
Differential Nonlinearity Error (DNL)
In an ideal ADC, code transitions are 1 LSB apart. DNL is the
maximum deviation from this ideal value. It is often specified in
terms of resolution for which no missing codes are guaranteed.
Zero Error
Zero error is the difference between the ideal midscale voltage,
i.e., 0 V, and the actual voltage producing the midscale output
code, i.e., 0 LSB.
Gain Error
The first transition (from 100 . . . 00 to 100 . . . 01) should occur
at a level ½ LSB above the nominal negative full scale
(−4.999924 V for the ±5 V range). The last transition (from
011…10 to 011…11) should occur for an analog voltage
1½ LSB below the nominal full scale (4.999771 V for the ±5 V
range.) The gain error is the deviation of the difference between
the actual level of the last transition and the actual level of the
first transition from the difference between the idea levels.
Spurious-Free Dynamic Range (SFDR)
SFDR is the difference, in decibels (dB), between the rms
amplitude of the input signal and the peak spurious signal.
ENOB is a measurement of the resolution with a sine wave
input. It is related to S/(N+D) by the following formula
]
DNSENOB
dB
and is expressed in bits.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first five harmonic
components to the rms value of a full-scale input signal and is
expressed in dB.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the actual input signal to the
rms sum of all other spectral components below the Nyquist
frequency, excluding harmonics and dc. The value for SNR is
expressed in dB.
Signal-to-(Noise + Distortion) Ratio (S/[N+D])
S/(N+D) is the ratio of the rms value of the actual input signal
to the rms sum of all other spectral components below the
Nyquist frequency, including harmonics but excluding dc. The
value for S/(N+D) is expressed in dB.
Aperture Delay
Aperture delay is a measure of the acquisition performance and
is the time between the falling edge of the
the input signal is held for a conversion.
Transient Response
Transient response is the time required for the ADC to
accurately acquire its input after a full-scale step function
was applied.
)
02.6/76.1/
input and when
CS
Rev. 0 | Page 8 of 16
Page 9
AD7684
TYPICAL PERFORMANCE CHARACTERISTICS
3
2
POSITIVE INL = +0.83LSB
NEGATIVE INL = –1.07LSB
3
2
POSITIVE DNL = +0.9LSB
NEGATIVE DNL = –0.45LSB
1
0
INL (LSB)
–1
–2
–3
016384327684915265536
CODE
Figure 7. Integral Nonlinearity vs. Code
120000
100000
80000
60000
COUNTS
40000
20000
151
0
00
FFFD FFFE FFFF 0000 0001 0002 0003 0004 0005
94794
17388
CODE IN HEX
VDD = REF = 2.5V
18557
182
Figure 8. Histogram of a DC Input at the Code Center
1
0
DNL (LSB)
–1
–2
04302-017
–3
016384327684915265536
CODE
04302-010
Figure 10. Differential Nonlinearity vs. Code
150000
123872
100000
COUNTS
50000
00
04302-008
0
0
FFFBFFFCFFFDFFFEFFFF
3050
CODE IN HEX
VDD = REF = 5V
4150
0
04302-011
Figure 11. Histogram of a DC Input at the Code Center
0
–
20
–
40
–
60
–
80
–
100
–
120
–
140
AMPLITUDE (dB of Full Scale)
–
160
–
180
010203040
FREQUENCY (kHz)
16384 POINT FFT
VDD = REF = 5V
f
= 100kSPS
S
f
= 20.43kHz
IN
Figure 9. FFT Plot
50
04302-009
Rev. 0 | Page 9 of 16
0
–
20
–
40
–
60
–
80
–
100
–
120
–
140
AMPLITUDE (dB of Full Scale)
–
160
–
180
010203040
FREQUENCY (kHz)
16384 POINT FFT
VDD = REF = 2.5V
= 100kSPS
f
S
f
= 20.43kHz
IN
50
04302-012
Figure 12. FFT Plot
Page 10
AD7684
100
95
S/[N+D]
SNR
A)
µ
1200
fS = 100kSPS
1000
800
17
16
90
SNR, S/[N+D] (dB)
85
80
2.02.53.03.54.04.55.05.5
ENOB
REFERENCE VOLTAGE (V)
Figure 13. SNR, S/(N + D), and ENOB vs. Reference Voltage
100
95
90
85
S/[N+D](dB)
80
75
70
050100150200
VREF = 5V, –10dB
VREF = 5V, –1dB
VREF = 2.5V, –1dB
FREQUENCY (kHz)
Figure 14. S/[N + D] vs. Freq uency
15
ENOB (Bits)
14
04302-013
13
600
400
OPERATING CURRENT (
200
0
2.02.53.03.54.04.55.05.5
SUPPLY (V)
04302-016
Figure 16. Operating Current vs. Supply
1000
VDD = 5V
800
04302-014
600
400
OPERATING CURRENT (µA)
200
0
–55 –35–15525456585105125
TEMPERATURE (°C)
VDD = 2.7V
04302-017
Figure 17. Operating Current vs. Temperature
–80
–85
–90
–95
–100
THD (dB)
–105
–110
–115
04080120160200
VREF = 2.5V, –1dB
VREF = 5V, –1dB
FREQUENCY (kHz)
Figure 15. THD, E NOB vs. Frequen cy
04302-015
Rev. 0 | Page 10 of 16
1000
750
500
250
POWER-DOWN CURRENT (µA)
0
–55 –35–15525456585105 125
TEMPERATURE (°C)
Figure 18. Power-Down Current vs. Temperature
04302-018
Page 11
AD7684
6
5
4
3
2
1
0
–1
–2
–3
–4
–5
ZERO ERROR, FULL-SCALE ERROR (LSB)
–6
–55 –35–15525456585105125
TEMPERATURE (°C)
ZERO ERROR
GAIN ERROR
Figure 19. Offset and Gain Error vs. Temperature
04302-019
Rev. 0 | Page 11 of 16
Page 12
AD7684
APPLICATION INFORMATION
+IN
REF
GND
16,384C
16,384C
SWITCHES CONTROL
SW+MSB
LSB
4C2CCC32,768C
COMP
4C2CCC32,768C
SW–MSB
LSB
CONTROL
LOGIC
BUSY
OUTPUT CODE
CNV
–IN
Figure 20. ADC Simplified Schematic
CIRCUIT INFORMATION
The AD7684 is a low power, single-supply, 16-bit ADC using a
successive approximation architecture. It is capable of converting 100,000 samples per second (100 kSPS) and powers down
between conversions. When operating at 10 kSPS, for example,
it consumes typically 150 µW with a 2.7 V supply, ideal for
battery-powered applications.
The AD7684 provides the user with an on-chip track-and-hold
and does not exhibit any pipeline delay or latency, making it
ideal for multiple, multiplexed channel applications.
The AD7684 is specified from 2.7 V to 5.5 V. It is housed in a
8-lead MSOP package.
CONVERTER OPERATION
The AD7684 is a successive approximation ADC based on a
charge redistribution DAC. Figure 20 shows the simplified
schematic of the ADC. The capacitive DAC consists of two
identical arrays of 16 binary-weighted capacitors, which are
connected to the two comparator inputs.
During the acquisition phase, terminals of the array tied to the
comparator’s input are connected to GND via SW+ and SW−.
All independent switches are connected to the analog inputs.
Thus, the capacitor arrays are used as sampling capacitors and
acquire the analog signal on the +IN and −IN inputs. When the
acquisition phase is complete and the
conversion phase is initiated. When the conversion phase
begins, SW+ and SW− are opened first. The two capacitor
arrays are then disconnected from the inputs and connected to
the GND input. Therefore, the differential voltage between the
inputs, +IN and −IN, captured at the end of the acquisition
phase is applied to the comparator inputs, causing the
comparator to become unbalanced. By switching each element
of the capacitor array between GND and REF, the comparator
input varies by binary-weighted voltage steps (V
/4...V
V
REF
/65536). The control logic toggles these switches,
REF
starting with the MSB, in order to bring the comparator back
input goes low, a
CS
/2,
REF
into a balanced condition. After the completion of this process,
the part returns to the acquisition phase and the control logic
generates the ADC output code.
TRANSFER FUNCTIONS
The ideal transfer function for the AD7684 is shown in
Figure 21 and Table 8.
011...111
011...110
011...101
ADC CODE (TWOS COMPLEMENT)
100...010
100...001
100...000
–FS
–FS + 1 LSB
–FS + 0.5 LSB
ANALOG INPUT
Figure 21. ADC Ideal Transfer Function
Table 8. Output Codes and Ideal Input Voltages
Analog Input
Description
V
= 5 V Digital Output Code Hexa
REF
FSR – 1 LSB 4.999847 V 7FFF1
Midscale + 1 LSB 152.6 µV 0001
Midscale 0 V 0000
Midscale – 1 LSB –152.6 µV FFFF
–FSR + 1 LSB –4.999847 V 8001
–FSR –5 V 80002
1
This is also the code for an overranged analog input (V
– V
V
2
This is also the code for an underranged analog input (V
+ V
).
REF
GND
).
GND
+
+FS – 1.5 LSB
+IN
+IN
FS – 1 LSB
– V
–IN
– V
–IN
04302-020
above
below −V
04302-021
REF
Rev. 0 | Page 12 of 16
Page 13
AD7684
V
0 TO V
REF
(NOTE 3)
TO 0
REF
(NOTE 3)
NOTE 1: SEE REFERENCE SECTION FOR REFERENCE SELECTION.
NOTE 2: C
NOTE 3: SEE DRIVER AMPLIFIER CHOICE SECTION.
NOTE 4: OPTIONAL FILTER. SEE ANALOG INPUT SECTION.
NOTE 5: SEE DIGITAL INTERFACE FOR MOST CONVENIENT INTERFACE MODE.
IS USUALLY A 10µF CERAMIC CAPACITOR (X5R).
REF
33Ω
2.7nF
(NOTE 4)
33Ω
2.7nF
(NOTE 4)
(NOTE 1)
REF
2.2µF TO 10µF
(NOTE 2)
Figure 22. Typical Application Diagram
TYPICAL CONNECTION DIAGRAM
Figure 22 shows an example of the recommended application
diagram for the AD7684.
ANALOG INPUT
Figure 23 shows an equivalent circuit of the input structure of
the AD7684. The two diodes, D1 and D2, provide ESD protection for the analog inputs, +IN and −IN. Care must be taken to
ensure that the analog input signal never exceeds the supply
rails by more than 0.3 V, because this will cause these diodes to
become forward-biased and start conducting current. However,
these diodes can handle a forward-biased current of 130 mA
maximum. For instance, these conditions could eventually
occur when the input buffer’s (U1) supplies are different from
VDD. In such a case, an input buffer with a short-circuit current
limitation can be used to protect the part.
VDD
+IN
OR –IN
GND
D1
C
PIN
D2
R
Figure 23. Equivalent Analog Input Circuit
This analog input structure allows the sampling of the differential signal between +IN and −IN. By using this differential
input, small signals common to both inputs are rejected. For
instance, by using −IN to sense a remote signal ground, ground
potential differences between the sensor and the local ADC
ground are eliminated. During the acquisition phase, the impedance of the analog input +IN can be modeled as a parallel
combination of the capacitor C
the series connection of R
capacitance. R
is typically 600 Ω and is a lumped component
IN
and the network formed by
PIN
and CIN. C
IN
is primarily the pin
PIN
made up of some serial resistors and the on-resistance of the
C
IN
IN
04302-023
2.7V TO 5.25V
3-WIRE INTERFACE
04302-022
+IN
–IN
REF
AD7684
GND
switches. C
100nF
VDD
DCLOCK
D
OUT
CS
is typically 30 pF and is mainly the ADC sampling
IN
capacitor. During the conversion phase, when the switches are
opened, the input impedance is limited to C
. RIN and CIN
PIN
make a 1-pole, low-pass filter that reduces undesirable aliasing
effects and limits the noise.
When the source impedance of the driving circuit is low, the
AD7684 can be driven directly. Large source impedances significantly affect the ac performance, especially THD. The dc
performances are less sensitive to the input impedance.
DRIVER AMPLIFIER CHOICE
Although the AD7684 is easy to drive, the driver amplifier
needs to meet the following requirements:
•The noise generated by the driver amplifier needs to be
kept as low as possible in order to preserve the SNR and
transition noise performance of the AD7684. Note that the
AD7684 has a noise much lower than most other 16-bit
ADCs and, therefore, can be driven by a noisier op amp
while preserving the same or better system performance.
The noise coming from the driver is filtered by the AD7684
analog input circuit 1-pole, low-pass filter made by R
C
or by the external filter, if one is used.
IN
•For ac applications, the driver needs to have a THD
performance suitable to that of the AD7684. Figure 15
shows the THD vs. frequency that the driver should
exceed.
•For multichannel multiplexed applications, the driver
amplifier and the AD7684 analog input circuit must be able
to settle for a full-scale step of the capacitor array at a
16-bit level (0.0015%). In the amplifier’s data sheet, settling
at 0.1% to 0.01% is more commonly specified. This could
differ significantly from the settling time at a 16-bit level
and should be verified prior to driver selection.
IN
and
Rev. 0 | Page 13 of 16
Page 14
AD7684
Table 9. Recommended Driver Amplifiers
Amplifier Typical Application
AD8021Very low noise and high frequency
AD8022Low noise and high frequency
OP184Low power, low noise, and low frequency
AD8605, AD86155 V single-supply, low power
AD8519Small, low power, and low frequency
AD8031High frequency and low power
VOLTAGE REFERENCE INPUT
The AD7684 voltage reference input, REF, has a dynamic input
impedance. It should therefore be driven by a low impedance
source with efficient decoupling between the REF and GND
pins, as explained in the Layout section.
When REF is driven by a very low impedance source (e.g., an
unbuffered reference voltage like the low temperature drift
ADR43x reference or a reference buffer using the AD8031 or
the
AD8605), a 10 µF (X5R, 0805 size) ceramic chip capacitor is
appropriate for optimum performance.
If desired, smaller reference decoupling capacitor values down
to 2.2 µF can be used with a minimal impact on performance,
especially DNL.
POWER SUPPLY
The AD7684 powers down automatically at the end of each
conversion phase and therefore the power scales linearly with
the sampling rate, as shown in Figure 24. This makes the part
ideal for low sampling rates (even of a few Hz) and low batterypowered applications.
1000
100
10
VDD = 5V
VDD = 2.7V
A falling edge on
After the fifth DCLOCK falling edge, D
initiates a conversion and the data transfer.
CS
is enabled and
OUT
forced low. The data bits are then clocked MSB first by subsequent DCLOCK falling edges. The data is valid on both SCK
edges. Although the rising edge can be used to capture the data,
a digital host also using the SCK falling edge allows a faster
reading rate, provided it has an acceptable hold time.
CONVERT
CS
AD7684
D
DCLOCK
OUT
Figure 25. Connection Diagram
DIGITAL HOST
DATA IN
CLK
04302-025
LAYOUT
The printed circuit board housing the AD7684 should be
designed so that the analog and digital sections are separated
and confined to certain areas of the board. The pinout of the
AD7684 with all its analog signals on the left side and all its
digital signals on the right side eases this task.
Avoid running digital lines under the device because these
couple noise onto the die, unless a ground plane under the
AD7684 is used as a shield. Fast switching signals, such as
clocks, should never run near analog signal paths. Crossover of
digital and analog signals should be avoided.
At least one ground plane should be used. It could be common
or split between the digital and analog section. In such a case, it
should be joined underneath the AD7684.
The AD7684 voltage reference input REF has a dynamic input
impedance and should be decoupled with minimal parasitic
inductances. This is done by placing the reference decoupling
ceramic capacitor close to, and ideally right up against, the REF
and GND pins and by connecting these pins with wide, low
impedance traces.
CS
or
1
OPERATING CURRENT (µA)
0.1
0.01
100101k10k100k
SAMPLING RATE (SPS)
Figure 24. Operating Current vs. Sampling Rate
DIGITAL INTERFACE
The AD7684 is compatible with SPI, QSPI, digital hosts, and
DSPs (e.g., Blackfin® ADSP-BF53x or ADSP-219x). The connection diagram is shown in Figure 25 and the corresponding
timing is given in Figure 2.
Finally, the power supply, VDD, of the AD7684 should be
decoupled with a ceramic capacitor, typically 100 nF, and placed
close to the AD7684. It should be connected using short and
large traces to provide low impedance paths and reduce the
04302-024
effect of glitches on the power supply lines.
EVALUATING THE AD7684’S PERFORMANCE
Other recommended layouts for the AD7684 are outlined in the
evaluation board for the AD7684 (
tion board package includes a fully assembled and tested
evaluation board, documentation, and software for controlling
the board from a PC via the
Rev. 0 | Page 14 of 16
EVAL-AD7684). The evalua-
EVAL-CONTROL BRD2.
Page 15
AD7684
OUTLINE DIMENSIONS
3.00
BSC
85
3.00
BSC
PIN 1
0.65 BSC
0.15
0.00
0.38
0.22
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187AA
4
SEATING
PLANE
4.90
BSC
1.10 MAX
0.23
0.08
8°
0°
0.80
0.60
0.40
Figure 26. 8-Lead Micro Small Outline Package [MSOP]
(RM-8)
Dimensions Shown in Millimeters
ORDERING GUIDE
Integral
Models
Nonlinearity Temperature Range Package (Option)
AD7684BRM ±3 LSB max –40°C to +85°C MSOP (RM-8) Tube, 50 C1D
AD7684BRMRL7 ±3 LSB max –40°C to +85°C MSOP (RM-8) Reel, 1,000 C1D
EVAL-AD7684CB1 Evaluation Board
EVAL-CONTROL BRD2
2
Controller Board
EVAL-CONTROL BRD32 Controller Board
1
This board can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL BRDx for evaluation/demonstration purposes.
2
These boards allow a PC to control and communicate with all Analog Devices’ evaluation boards ending in the CB designators.