The AD7683 is a 16-bit, charge redistribution, successive
approximation, PulSAR™ analog-to-digital converter (ADC)
that operates from a single power supply, VDD, between 2.7 V
to 5.5 V. It contains a low power, high speed, 16-bit sampling
ADC with no missing codes (B grade), an internal conversion
clock, and a serial, SPI-compatible interface port. The part also
contains a low noise, wide bandwidth, short aperture delay,
track-and-hold circuit. On the
analog input, +IN, between 0 V to REF with respect to a ground
sense, –IN. The reference voltage, REF, is applied externally and
can be set up to the supply voltage. Its power scales linearly with
throughput.
VDD
DCLOCK
AD7683
GND
Figure 1.
D
OUT
CS
AD7685
AD7694
falling edge, it samples an
CS
3-WIRE SPI
INTERFACE
AD7686
04301-001
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Anal og Devices. Trademarks and
registered trademarks are the property of their respective owners.
The AD7683 is housed in an 8-lead MSOP or an 8-lead QFN
(LFCSP) package, with an operating temperature specified from
−40°C to +85°C.
1
QFN package in development. Contact factory for samples and availability.
= VDD; TA = –40°C to +85°C, unless otherwise noted.
REF
− V
= V
+IN
−IN
/2 = 2.5 V 50 µA
REF
−0.3 0.3 × VDD V
0.7 × VDD VDD + 0.3 V
−1 +1 µA
−1 +1 µA
I
= −500 µA VDD − 0.3 V
SOURCE
I
= +500 µA 0.4 V
SINK
2.0 5.5 V
2, 3
VDD = 5 V, 25°C
to T
MIN
MAX
REF
V
1 50 nA
−40 +85
°C
1
See the section for more information. Typical Performance Characteristics
2
With all digital inputs forced to VDD or GND, as required.
3
During acquisition phase.
Rev. 0 | Page 3 of 16
Page 4
AD7683
VDD = 5 V; V
Table 3.
A Grade B Grade
Parameter Conditions Min Typ Max Min Typ Max Unit
ACCURACY
No Missing Codes 15 16 Bits
Integral Linearity Error −6 ±3 +6 −3 ±1 +3 LSB
Transition Noise 0.5 0.5 LSB
Gain Error1, T
Gain Error Temperature Drift ±0.3 ±0.3 ppm/°C
Offset Error1, T
Offset Temperature Drift ±0.3 ±0.3 ppm/°C
Power Supply Sensitivity
AC ACCURACY
Signal-to-Noise fIN = 1 kHz 90 88 91 dB
Spurious-Free Dynamic Range fIN = 1 kHz −100 −108 dB
Total Harmonic Distortion fIN = 1 kHz −100 −106 dB
Signal-to-(Noise + Distortion) fIN = 1 kHz 90 88 91 dB
Effective Number of Bits fIN = 1 kHz 14.7 14.8 Bits
= VDD; TA = –40°C to +85°C, unless otherwise noted.
REF
MIN
MIN
to T
to T
MAX
MAX
±2 ±24 ±2 ±15 LSB
±0.7 ±1.6 ±0.4 ±1.6 mV
VDD = 5 V ±5%
±0.05 ±0.05 LSB
2
1
See the section. These specifications include full temperature range variation, but do not include the error contribution from the external reference. Terminology
2
All specifications in dB are referred to a full-scale input, FS. Tested with an input signal at 0.5 dB below full scale, unless otherwise specified.
VDD = 2.7 V; V
= 2.5V; TA = –40°C to +85°C, unless otherwise noted.
REF
Table 4.
A Grade B Grade
Parameter Conditions Min Typ Max Min Typ Max Unit
ACCURACY
No Missing Codes 15 16 Bits
Integral Linearity Error −6 ±3 +6 −3 ±1 +3 LSB
Transition Noise 0.85 0.85 LSB
Gain Error1, T
MIN
to T
MAX
±2 ±30 ±2 ±15 LSB
Gain Error Temperature Drift ±0.3 ±0.3 ppm/°C
Offset Error1, T
MIN
to T
MAX
±0.7 ±3.5 ±0.7 ±3.5 mV
Offset Temperature Drift ±0.3 ±0.3 ppm/°C
Power Supply Sensitivity
VDD = 2.7 V ±5%
±0.05 ±0.05 LSB
AC ACCURACY
Signal-to-Noise fIN = 1 kHz 85 86 dB
2
Spurious-Free Dynamic Range fIN = 1 kHz −96 −100 dB
Total Harmonic Distortion fIN = 1 kHz −94 −98 dB
Signal-to-(Noise + Distortion) fIN = 1 kHz 85 86 dB
Effective Number of Bits fIN = 1 kHz 13.8 14 Bits
1
See the section. These specifications do include full temperature range variation, but do not include the error contribution from the external reference. Terminology
2
All specifications in dB are referred to a full-scale input FS. Tested with an input signal at 0.5 dB below full scale, unless otherwise specified.
Rev. 0 | Page 4 of 16
Page 5
AD7683
TIMING SPECIFICATIONS
VDD = 2.7 V to 5.5 V; TA = −40°C to +85°C, unless otherwise noted.
Table 5.
Parameter Symbol Min Typ Max Unit
Throughput Rate t
CS Falling to DCLOCK Low
CS Falling to DCLOCK Rising
DCLOCK Falling to Data Remains Valid t
CS Rising Edge to D
High Impedance
OUT
DCLOCK Falling to Data Valid t
Acquisition Time t
D
Fall Time t
OUT
D
Rise Time t
OUT
t
CYC
CS
t
SUCS
DCLOCK
D
OUT
145
t
CSD
Hi-Z
NOTE:
A MINIMUM OF 22 CLOCK CYCLES ARE REQUIRED FOR 16-BIT CONVERSION. SHOWN ARE 24 CLOCK CYCLES.
GOES LOW ON THE DCLOCK FALLING EDGE FOLLOWING THE LSB READING.
VDD to GND −0.3 V to +6 V
Digital Inputs to GND −0.3 V to VDD + 0.3 V
Digital Outputs to GND −0.3 V to VDD + 0.3 V
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
θJA Thermal Impedance 200°C/W (MSOP-8)
θJC Thermal Impedance 44°C/W (MSOP-8)
Lead Temperature Range
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
GND − 0.3 V to VDD + 0.3 V
or ±130 mA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1
See the section. Analog Input
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
500µAI
O D
OUT
C
L
100pF
500µAI
Figure 3. Load Circuit for Digital Interface Timing
0.8V
t
DELAY
2V
Figure 4. Voltage Reference Levels for Timing
D
OUT
t
R
Figure 5. D
OUT
OL
OH
2V
t
DELAY
2V
0.8V0.8V
t
F
Rise and Fall Timing
1.4V
04301-003
90%
10%
04301-004
04301-006
Rev. 0 | Page 6 of 16
Page 7
AD7683
PIN CONFIGURATION AND FUNCTIONAL DESCRIPTIONS
REF
1
2
+IN
AD7683
TOP VIEW
–IN
3
(Not to Scale)
4
GND
Figure 6. 8-Lead MSOP and QFN
Table 7. Pin Function Descriptions
Pin No. Mnemonic Type2Function
1 REF AI
Reference Input Voltage. The REF range is from 0.5 V to VDD. It is referred to the GND pin. This pin should
be decoupled closely to the pin with a ceramic capacitor of a few µF.
2 +IN AI
Analog Input. It is referred to in –IN. The voltage range, i.e., the difference between +IN and –IN, is 0 V
to V
.
REF
3 –IN AI Analog Input Ground Sense. To be connected to the analog ground plane or to a remote sense ground.
4 GND P Power Supply Ground.
5
CS
DI
Chip Select Input. On its falling edge, it initiates the conversions. The part returns in shutdown mode as
soon as the conversion is done. It also enables D
6 D
OUT
DO Serial Data Output. The conversion result is output on this pin. It is synchronized to SCK.
7 DCLOCK DI Serial Data Clock Input.
8 VDD P Power Supply.
VDD
8
7
DCLOCK
D
6
OUT
5
CS
04301-005
1
(LFCSP) Pin Configuration
. When high, D
OUT
is high impedance.
OUT
1
QFN package in development. Contact factory for samples and availability.
2
AI = Analog Input; DI = Digital Input; DO = Digital Output; and P = Power
Rev. 0 | Page 7 of 16
Page 8
AD7683
[
(
−+=
TERMINOLOGY
Integral Nonlinearity Error (INL)
Linearity error refers to the deviation of each individual code
from a line drawn from negative full scale through positive full
scale. The point used as negative full scale occurs ½ LSB before
the first code transition. Positive full scale is defined as a level
1½ LSB beyond the last code transition. The deviation is
measured from the middle of each code to the true straight line
(see Figure 21).
Effective Number of Bits (ENOB)
ENOB is a measurement of the resolution with a sine wave
input. It is related to S/(N+D) by the following formula
]
DNSENOB
dB
and is expressed in bits.
Total Harmonic Distortion (THD)
)
02.6/76.1/
Differential Nonlinearity Error (DNL)
In an ideal ADC, code transitions are 1 LSB apart. DNL is the
maximum deviation from this ideal value. It is often specified in
terms of resolution for which no missing codes are guaranteed.
Offset Error
The first transition should occur at a level ½ LSB above analog
ground (38.1 µV for the 0 V to 5 V range). The offset error is the
deviation of the actual transition from that point.
Gain Error
The last transition (from 111...10 to 111...11) should occur for
an analog voltage 1½ LSB below the nominal full scale
(4.999886 V for the 0 V to 5 V range). The gain error is the
deviation of the actual level of the last transition from the ideal
level after the offset has been adjusted out.
Spurious-Free Dynamic Range (SFDR)
The difference, in decibels (dB), between the rms amplitude of
the input signal and the peak spurious signal.
THD is the ratio of the rms sum of the first five harmonic
components to the rms value of a full-scale input signal and is
expressed in dB.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the actual input signal to the
rms sum of all other spectral components below the Nyquist
frequency, excluding harmonics and dc. The value for SNR is
expressed in dB.
Signal-to-(Noise + Distortion) Ratio (S/[N+D])
S/(N+D) is the ratio of the rms value of the actual input signal
to the rms sum of all other spectral components below the
Nyquist frequency, including harmonics but excluding dc. The
value for S/(N+D) is expressed in dB.
Aperture Delay
Aperture delay is a measure of the acquisition performance and
is the time between the falling edge of the
the input signal is held for a conversion.
Transient Response
The time required for the ADC to accurately acquire its input
after a full-scale step function was applied.
Figure 8. Histogram of a DC Input at the Code Center
00
04301-011
04301-009
1
0
DNL (LSB)
–1
–2
–3
016384327684915265536
CODE
Figure 10. Differential Nonlinearity vs. Code
120000
100000
80000
60000
COUNTS
40000
20000
00600
0
7A0E 7A0F 7A10 7A11 7A12 7A13 7A14 7A15 7A16
102287
15152
CODE IN HEX
VDD = REF = 5V
13619
8
Figure 11. Histogram of a DC Input at the Code Center
04301-011
04301-010
0
–20
–40
–60
–80
–100
–120
–140
AMPLITUDE (dB OF FULL SCALE)
–160
–180
0 10203040
FREQUENCY (kHz)
16384 POINT FFT
VDD = REF = 5V
f
= 100kSPS
S
f
= 20.43kHz
IN
SNR = 92.7dB
THD = –105.7dB
SFDR = –106.4dB
Figure 9. FFT Plot
04301-008
50
Rev. 0 | Page 9 of 16
0
–20
–40
–60
–80
–100
–120
–140
AMPLITUDE (dB OF FULL SCALE)
–160
–180
0 10203040
FREQUENCY (kHz)
16384 POINT FFT
VDD = REF = 2.5V
f
= 100kSPS
S
f
= 20.43kHz
IN
SNR = 88.7dB
THD = –102.6dB
SFDR = –104.6dB
Figure 12. FFT Plot
04301-007
50
Page 10
AD7683
100
95
SNR
17
16
1200
1000
800
f
= 100kSPS
S
90
S/[N+D]
SNR, S/[N+D] (dB)
85
80
2.05.55.04.54.03.53.02.5
ENOB
REFERENCE VOLTAGE (V)
Figure 13. SNR, S/(N + D), and ENOB vs. Reference Voltage
100
95
90
85
S/[N+D] (dB)
80
75
70
020015010050
FREQUENCY (kHz)
= 2.5V, –1dB
V
REF
V
REF
V
REF
= 5V, –10dB
Figure 14. S/[N + D] vs. Freq uency
= 5V, –1dB
15
ENOB (Bits)
14
04301-013
13
600
400
OPERATING CURRENT (µA)
200
0
2.05.55.04.54.03.53.02.5
SUPPLY (V)
04301-017
Figure 16. Operating Current vs. Supply
900
VDD = 5V,
f
= 100kSPS
S
TEMPERATURE (°C)
VDD = 2.7V, fS = 100kSPS
04301-018
04301-014
800
700
600
500
400
300
OPERATING CURRENT (µA)
200
100
0
–55–34 –15525456585105125
Figure 17. Operating Current vs. Temperature
–80
–85
–90
–95
THD (dB)
–100
–105
–110
02001201608040
V
2.5V = –1dB
REF
5V = –1dB
V
REF
FREQUENCY (kHz)
Figure 15. THD, E NOB vs. Frequen cy
04301-015
Rev. 0 | Page 10 of 16
1000
750
500
250
POWER-DOWN CURRENT (nA)
0
–55–35 –15525456585105125
TEMPERATURE (°C)
Figure 18. Power-Down Current vs. Temperature
04301-019
Page 11
AD7683
6
5
4
3
2
1
0
–1
–2
–3
OFFSET, GAIN ERROR (LSB)
–4
–5
–6
–55 –35–15525456585105125
TEMPERATURE (°C)
OFFSET ERROR
GAIN ERROR
04301-016
Figure 19. Offset and Gain Error vs. Temperature
Rev. 0 | Page 11 of 16
Page 12
AD7683
APPLICATION INFORMATION
+IN
REF
GND
16,384C
16,384C
SWITCHES CONTROL
SW+MSB
LSB
4C2CCC32,768C
COMP
4C2CCC32,768C
SW–MSB
LSB
CONTROL
LOGIC
BUSY
OUTPUT CODE
CNV
–IN
Figure 20. ADC Simplified Schematic
CIRCUIT INFORMATION
The AD7683 is a low power, single-supply, 16-bit ADC using a
successive approximation architecture.
The AD7683 is capable of converting 100,000 samples per second (100 kSPS) and powers down between conversions. When
operating at 10 kSPS, for example, it consumes typically 150 µW
with a 2.7 V supply, ideal for battery-powered applications.
The AD7683 provides the user with an on-chip track-and-hold
and does not exhibit any pipeline delay or latency, making it
ideal for multiple, multiplexed channel applications.
The AD7683 is specified from 2.7 V to 5.5 V. It is housed in a
8-lead MSOP package or a tiny, 8-lead QFN (LFCSP)
package.
The AD7683 is an improved second source to the ADS8320 and
ADS8325. For even better performance, consider the
AD7685.
CONVERTER OPERATION
The AD7683 is a successive approximation ADC based on a
charge redistribution DAC. Figure 20 shows the simplified
schematic of the ADC. The capacitive DAC consists of two
identical arrays of 16 binary-weighted capacitors, which are
connected to the two comparator inputs.
During the acquisition phase, terminals of the array tied to the
comparator’s input are connected to GND via SW+ and SW−.
All independent switches are connected to the analog inputs.
Thus, the capacitor arrays are used as sampling capacitors and
acquire the analog signal on the +IN and −IN inputs. When the
acquisition phase is complete and the
version phase is initiated. When the conversion phase begins,
SW+ and SW− are opened first. The two capacitor arrays are
then disconnected from the inputs and connected to the GND
input. Therefore, the differential voltage between the inputs,
+IN and −IN, captured at the end of the acquisition phase is
applied to the comparator inputs, causing the comparator to
become unbalanced. By switching each element of the capacitor
input goes low, a con-
CS
array between GND and REF, the comparator input varies by
binary-weighted voltage steps (V
REF
REF
/4...V
/65536). The
REF
/2, V
control logic toggles these switches, starting with the MSB, to
bring the comparator back into a balanced condition. After the
completion of this process, the part returns to the acquisition
phase and the control logic generates the ADC output code.
TRANSFER FUNCTIONS
The ideal transfer function for the AD7683 is shown in
Figure 21 and Table 8.
111...111
111...110
111...101
ADC CODE (STRAIGHT BINARY)
000...010
000...001
000...000
–FS
–FS + 1 LSB
–FS + 0.5 LSB
ANALOG INPUT
Figure 21. ADC Ideal Transfer Function
Table 8. Output Codes and Ideal Input Voltages
Description
V
REF
= 5 V
FSR – 1 LSB 4.999924 V FFFF1
Midscale + 1 LSB 2.500076 V 8001
Midscale 2.5 V 8000
Midscale – 1 LSB 2.499924 V 7FFF
–FSR + 1 LSB 76.3 µV 0001
–FSR 0 V 00002
Analog Input
Digital Output Code
Hexadecimal
1
This is also the code for an overranged analog input (V
V
– V
).
REF
GND
2
This is also the code for an underranged analog input (V
+
+FS – 1.5 LSB
+IN
+IN
FS – 1 LSB
– V
–IN
– V
04301-020
above
below V
–IN
04301-021
).
GND
Rev. 0 | Page 12 of 16
Page 13
AD7683
0 TO V
REF
(NOTE 3)
NOTE 1: SEE REFERENCE SECTION FOR REFERENCE SELECTION.
NOTE 2: C
REF
NOTE 3: SEE DRIVER AMPLIFIER CHOICE SECTION.
NOTE 4. OPTIONAL FILTER. SEE ANALOG INPUT SECTION.
(NOTE 1)
REF
2.2 TO 10µF
(NOTE 2)
33Ω
2.7nF
(NOTE 4)
IS USUALLY A 10µF CERAMIC CAPACITOR (X5R).
Figure 22. Typical Application Diagram
TYPICAL CONNECTION DIAGRAM
Figure 22 shows an example of the recommended application
diagram for the AD7683.
ANALOG INPUT
Figure 23 shows an equivalent circuit of the input structure of
the AD7683.
The two diodes, D1 and D2, provide ESD protection for the
analog inputs, +IN and −IN. Care must be taken to ensure that
the analog input signal never exceeds the supply rails by more
than 0.3 V, because this will cause these diodes to become forward-biased and start conducting current. However, these
diodes can handle a forward-biased current of 130 mA maximum. For instance, these conditions could eventually occur
when the input buffer’s (U1) supplies are different from VDD.
In such a case, an input buffer with a short-circuit current
limitation can be used to protect the part.
VDD
+IN
OR –IN
GND
D1
C
PIN
D2
Figure 23. Equivalent Analog Input Circuit
R
This analog input structure allows the sampling of the
differential signal between +IN and −IN. By using this
differential input, small signals common to both inputs are
rejected. For instance, by using −IN to sense a remote signal
ground, ground potential differences between the sensor and
the local ADC ground are eliminated. During the acquisition
phase, the impedance of the analog input +IN can be modeled
as a parallel combination of the capacitor C
formed by the series connection of R
the pin capacitance. R
is typically 600 Ω and is a lumped com-
IN
and CIN. C
IN
ponent made up of some serial resistors and the on-resistance
of the switches. C
is typically 30 pF and is mainly the ADC
IN
C
IN
IN
and the network
PIN
is primarily
PIN
04301-023
+IN
–IN
2.7V TO 5.25V
3-WIRE INTERFACE
04301-022
REF
AD7683
GND
VDD
DCLOCK
D
OUT
CS
100nF
sampling capacitor. During the conversion phase, where the
switches are opened, the input impedance is limited to C
and C
make a 1-pole, low-pass filter that reduces undesirable
IN
aliasing effects and limits the noise.
When the source impedance of the driving circuit is low, the
AD7683 can be driven directly. Large source impedances significantly affect the ac performance, especially THD. The dc
performances are less sensitive to the input impedance.
DRIVER AMPLIFIER CHOICE
Although the AD7683 is easy to drive, the driver amplifier
needs to meet the following requirements:
•The noise generated by the driver amplifier needs to be
kept as low as possible in order to preserve the SNR and
transition noise performance of the AD7683. Note that the
AD7683 has a noise much lower than most other 16-bit
ADCs and, therefore, can be driven by a noisier op amp
while preserving the same or better system performance.
The noise coming from the driver is filtered by the AD7683
analog input circuit 1-pole, low-pass filter made by R
or by the external filter, if one is used.
C
IN
•For ac applications, the driver needs to have a THD
performance suitable to that of the AD7683. Figure 15
shows the THD versus frequency that the driver should
exceed.
•For multichannel multiplexed applications, the driver
amplifier and the AD7683 analog input circuit must be able
to settle for a full-scale step of the capacitor array at a
16-bit level (0.0015%). In the amplifier’s data sheet, settling
at 0.1% to 0.01% is more commonly specified. This could
differ significantly from the settling time at a 16-bit level
and should be verified prior to driver selection.
PIN
. RIN
IN
and
Rev. 0 | Page 13 of 16
Page 14
AD7683
Table 9. Recommended Driver Amplifiers
Amplifier Typical Application
AD8021Very low noise and high frequency
AD8022Low noise and high frequency
OP184Low power, low noise, and low frequency
AD8605, AD86155 V single-supply, low power
AD8519Small, low power, and low frequency
AD8031High frequency and low power
VOLTAGE REFERENCE INPUT
The AD7683 voltage reference input, REF, has a dynamic input
impedance. It should therefore be driven by a low impedance
source with efficient decoupling between the REF and GND
pins, as explained in the Layout section.
When REF is driven by a very low impedance source (e.g., an
unbuffered reference voltage like the low temperature drift
ADR43x reference or a reference buffer using the AD8031 or
the
AD8605), a 10 µF (X5R, 0805 size) ceramic chip capacitor is
appropriate for optimum performance.
If desired, smaller reference decoupling capacitor values down
to 2.2 µF can be used with a minimal impact on performance,
especially DNL.
POWER SUPPLY
The AD7683 powers down automatically at the end of each
conversion phase and, therefore, the power scales linearly with
the sampling rate, as shown in Figure 24. This makes the part
ideal for low sampling rates (even of a few Hz) and low batterypowered applications.
1000
100
A)
µ
10
VDD = 5V
VDD = 2.7V
A falling edge on
After the fifth DCLOCK falling edge, D
initiates a conversion and the data transfer.
CS
is enabled and
OUT
forced low. The data bits are then clocked, MSB first, by subsequent DCLOCK falling edges. The data is valid on both SCK
edges. Although the rising edge can be used to capture the data,
a digital host also using the SCK falling edge allows a faster
reading rate, provided it has an acceptable hold time.
CONVERT
CS
AD7683
D
DCLOCK
OUT
Figure 25. Connection Diagram
DIGITAL HOST
DATA IN
CLK
04301-025
LAYOUT
The printed circuit board housing the AD7683 should be
designed so that the analog and digital sections are separated
and confined to certain areas of the board. The pinout of the
AD7683 with all its analog signals on the left side and all its
digital signals on the right side eases this task.
Avoid running digital lines under the device because these
couple noise onto the die, unless a ground plane under the
AD7683 is used as a shield. Fast switching signals, such as
clocks, should never run near analog signal paths. Crossover of
digital and analog signals should be avoided.
At least one ground plane should be used. It could be common
or split between the digital and analog section. In such a case, it
should be joined underneath the AD7683.
The AD7683 voltage reference input REF has a dynamic input
impedance and should be decoupled with minimal parasitic
inductances. That is done by placing the reference decoupling
ceramic capacitor close to, and ideally right up against, the REF
and GND pins and by connecting these pins with wide, low
impedance traces.
CS
or
1
OPERATING CURRENT (
0.1
0.01
101001k10k100k
Figure 24. Operating Current vs. Sampling Rate
SAMPLING RATE (SPS)
DIGITAL INTERFACE
The AD7683 is compatible with SPI, QSPI, digital hosts, and
DSPs (e.g., Blackfin® ADSP-BF53x or ADSP-219x). The connection diagram is shown in Figure 25 and the corresponding
timing is given in Figure 2.
Finally, the power supply, VDD, of the AD7683 should be
decoupled with a ceramic capacitor, typically 100 nF, and placed
close to the AD7683. It should be connected using short and
large traces to provide low impedance paths and reduce the
04301-024
effect of glitches on the power supply lines.
EVALUATING THE AD7683’S PERFORMANCE
Other recommended layouts for the AD7683 are outlined in the
evaluation board for the AD7683 (
ation board package includes a fully assembled and tested
evaluation board, documentation, and software for controlling
the board from a PC via the
Rev. 0 | Page 14 of 16
EVAL-AD7683). The evalu-
EVAL-CONTROL BRD2.
Page 15
AD7683
OUTLINE DIMENSIONS
3.00
BSC
1.50
BCS SQ
0.80
0.75
0.70
SEATING
PLANE
85
3.00
BSC
PIN 1
0.65 BSC
0.15
0.00
0.38
0.22
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187AA
4
SEATING
PLANE
4.90
BSC
1.10 MAX
0.23
0.08
8°
0°
Figure 26. 8-Lead Micro Small Outline Package [MSOP]
(RM-8)
Dimensions Shown in Millimeters
INDEX
AREA
3.00
BSC SQ
TOP VIEW
0.80 MAX
0.55 TYP
SIDE VIEW
0.30
0.23
0.18
0.65
BSC
0.20 REF
0.50
0.40
0.30
0.05 MAX
0.02 NOM
8
EXPOSED
(BOTTOM VIEW)
5
PIN 1
INDICATOR
PAD
1.74
1.64
1.49
Figure 27. 8-Terminal Quad Flat No Lead Package[QFN
3 mm × 3 mm Body
(CP-8-9)
Dimensions Shown in Millimeters
0.80
0.60
0.40
1
2.48
2.38
2.23
4
PADDLE CONNECTED TO GND.
THIS CONNECTION IS NOT
REQUIRED TO MEET THE
ELECTRICAL PERFORMANCES
1
(LFCSP)]
ORDERING GUIDE
Transport Media,
Models Integral Nonlinearity Temperature Range Package (Option)
AD7683ARM ±6 LSB max –40°C to +85°C MSOP (RM-8) Tube, 50 C1L
AD7683ARMRL7 ±6 LSB max –40°C to +85°C MSOP (RM-8) Reel, 1,000 C1L
AD7683BRM ±3 LSB max –40°C to +85°C MSOP (RM-8) Tube, 50 C1C
AD7683BRMRL7 ±3 LSB max –40°C to +85°C MSOP (RM-8) Reel, 1,000 C1C
EVAL-AD7683CB