Datasheet AD7653 Datasheet (Analog Devices)

Page 1
16-Bit 1 MSPS PulSAR
TM

FEATURES

Throughput:
666 kSPS (Impulse mode) 16-bit resolution Analog input voltage range: 0 V to 2.5 V No pipeline delay Parallel and serial 5 V/3 V interface
®/QSPI
TM
/MICROWIRETM/DSP compatible
SPI Single 5 V supply operation Power dissipation
92 mW typ @ 666 kSPS, 138 µW @ 1 kSPS without REF
128 mW typ @ 1 MSPS with REF 48-lead LQFP and 48-lead LFCSP packages Pin-to-pin compatible with PulSAR ADCs

APPLICATIONS

Data acquisition Instrumentation Digital signal processing Spectrum analysis Medical instruments Battery-powered systems Process control

GENERAL DESCRIPTION

The AD7653* is a 16-bit, 1 MSPS, charge redistribution SAR analog-to-digital converter that operates from a single 5 V power supply. The part contains a high speed 16-bit sampling ADC, internal conversion clock, internal reference, error correction circuits, and both serial and parallel system interface ports. It features a very high sampling rate mode (Warp), a fast mode (Normal) for asynchronous conversion rate applications, and a reduced power mode (Impulse) for low power applica­tions where power is scaled with the throughput. The AD7653 is fabricated using Analog Devices’ high performance, 0.6 micron CMOS process, with correspondingly low cost. It is available in a 48-lead LQFP and a tiny 48-lead LFCSP with operation specified from –40°C to +85°C.
*
Patent Pending.
Unipolar ADC with Reference
AD7653

FUNCTIONAL BLOCK DIAGRAM

AGND
AVDD
INGND
PDREF
PDBUF
RESET
REFBUFIN
REF
IN
PD
REF REFGND
AD7653
SWITCHED
CAP DAC
CLOCK
CONTROL LOGIC AND
CALIBRATION CIRCUITRY
CNVSTWARP IMPULSE
Figure 1.
Table 1. PulSAR Selection
Type/kSPS 100–250 500–570
Pseudo­Differential
AD7651 AD7660/AD7661
AD7650/AD7652
AD7664/AD7666
True Bipolar AD7663 AD7665 AD7671 True
AD7675 AD7676 AD7677
Differential 18-Bit AD7678 AD7679 AD7674 Multichannel/
Simultaneous
AD7654
AD7655

PRODUCT HIGHLIGHTS

1. Fast Throughput.
The AD7653 is a 1 MSPS, charge redistribution, 16-bit SAR ADC with internal error correction circuitry.
2. Internal Reference.
The AD7653 has an internal reference with a typical temperature drift of 7 ppm/°C.
3. Single-Supply Operation.
The AD7653 operates from a single 5 V supply. In Impulse mode, its power dissipation decreases with the throughput.
4. Serial or Parallel Interface.
Versatile parallel or 2-wire serial interface arrangement is compatible with both 3 V and 5 V logic.
SERIAL
PORT
PARALLEL
INTERFACE
DGNDDVDD
OVDD
OGND
16
DATA[15:0]
BUSY
RD
CS
SER/PAR
OB/2C
BYTESWAP
02966-0-001
800– 1000
AD7653 AD7667
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.326.8703 © 2003 Analog Devices, Inc. All rights reserved.
Page 2
AD7653
TABLE OF CONTENTS
Specifications..................................................................................... 3
Timing Specifications....................................................................... 5
Absolute Maximum Ratings............................................................ 7
Pin Configuration and Function Descriptions............................. 8
Definitions of Specifications ......................................................... 11
Typical Performance Characteristics ........................................... 12
Circuit Information........................................................................ 15
Converter Operation.................................................................. 15
Typical Connection Diagram.................................................... 17
Power Dissipation vs. Throughput........................................... 19
Conversion Control.................................................................... 19
Digital Interface.......................................................................... 20
Parallel Interface......................................................................... 20
Serial Interface............................................................................ 20
Master Serial Interface............................................................... 21
Slave Serial Interface.................................................................. 22
Microprocessor Interfacing....................................................... 24
Application Hints............................................................................ 25
Bipolar and Wider Input Ranges.............................................. 25
Layout .......................................................................................... 25
Evaluating the AD7653’s Performance.................................... 25
Outline Dimensions....................................................................... 26
Ordering Guide........................................................................... 26
REVISION HISTORY
Location Page
9/03—Data Sheet Changed from Rev. 0 to Rev. A
Change to Product Highlights .................................................... 1
Changes to Specifications............................................................ 3
Changes to Absolute Maximum Ratings ................................... 7
Changes to Figure 15.................................................................. 13
Changes to Figure 22.................................................................. 16
Changes to Voltage Reference Input section........................... 18
Changes to Figure 31.................................................................. 20
Rev. A | Page 2 of 28
Page 3
AD7653

SPECIFICATIONS

Table 2. –40°C to +85°C, AVDD = DVDD = 5 V, OVDD = 2.7 V to 5.25 V, unless otherwise noted
Parameter Conditions Min Typ Max Unit
RESOLUTION 16 Bits ANALOG INPUT
Voltage Range VIN – V Operating Input Voltage VIN –0.1 +3 V
0 V
INGND
V
REF
V
–0.1 +0.5 V
INGND
Analog Input CMRR fIN = 10 kHz 65 dB Input Current 1 MSPS Throughput 12 µA Input Impedance1
THROUGHPUT SPEED
Complete Cycle In Warp Mode 1 µs Throughput Rate In Warp Mode 1 1000 kSPS Time between Conversions In Warp Mode 1 ms Complete Cycle In Normal Mode 1.25 µs Throughput Rate In Normal Mode 0 800 kSPS Complete Cycle In Impulse Mode 1.5 µs Throughput Rate In Impulse Mode 0 666 kSPS
DC ACCURACY
Integral Linearity Error –6 +6 LSB2 No Missing Codes 15 Bits Differential Linearity Error –2 +3 LSB Transition Noise 0.7 LSB Unipolar Zero Error, T
MIN
to T
3
±25 LSB
MAX
Unipolar Zero Error Temperature Drift ±0.2 ppm/°C Full-Scale Error, T
MIN
Full-Scale Error Temperature Drift
to T
3
REF = 2.5 V ±0.12 % of FSR
MAX
±0.4
ppm/°C
Power Supply Sensitivity AVDD = 5 V ± 5%, with REF ±2 LSB
AC ACCURACY
Signal-to-Noise fIN = 100 kHz 86 dB4 Spurious Free Dynamic Range fIN = 100 kHz 98 dB Total Harmonic Distortion fIN = 45 kHz –98 dB
f
= 100 kHz –96 dB
IN
Signal-to-(Noise + Distortion) fIN = 100 kHz 86 dB
–60 dB Input, fIN = 100 kHz 30 dB
–3 dB Input Bandwidth 12 MHz
SAMPLING DYNAMICS
Aperture Delay 2 ns Aperture Jitter 5 ps rms Transient Response Full-Scale Step 250 ns
REFERENCE
Internal Reference Voltage V
@ 25°C 2.48 2.50 2.52 V
REF
Internal Reference Temperature Drift –40°C to +85°C ±7 ppm/°C Line Regulation Turn-On Settling Time C
AVDD = 5 V ± 5%
= 10 µF 5 ms
REF
±24 ppm/V
Temperature Pin
Voltage Output @ 25°C 300 mV Temperature Sensitivity 1 mV/°C
Output Resistance 4.3 kΩ External Reference Voltage Range 2.3 2.5 AVDD – 1.85 V External Reference Current Drain 1 MSPS Throughput 300 µA
Rev. A | Page 3 of 28
Page 4
AD7653
Parameter Conditions Min Typ Max Unit
DIGITAL INPUTS
Logic Levels
VIL –0.3 +0.8 V VIH 2.0 DVDD + 0.3 V IIL –1 +1 µA IIH –1 +1 µA
DIGITAL OUTPUTS
Data Format5 Pipeline Delay6
VOL I VOH I
POWER SUPPLIES
Specified Performance
AVDD 4.75 5 5.25 V DVDD 4.75 5 5.25 V OVDD 2.7 5.257 V
Operating Current8 1 MSPS Throughput
AVDD9 With Reference and Buffer 18.7 mA AVDD10 Reference and Buffer Alone 3 mA DVDD11 6.7 mA OVDD11 200 µA
Power Dissipation without REF 666 kSPS Throughput11 92 115 mW
1 kSPS Throughput11 138 µW
Power Dissipation with REF 1 MSPS Throughput8 128 145 mW
TEMPERATURE RANGE12
Specified Performance T
= 1.6 mA 0.4 V
SINK
= –500 µA OVDD – 0.6 V
SOURCE
to T
MIN
–40 +85 °C
MAX
1
See Analog Input section.
2
LSB means least significant bit. With the 0 V to 2.5 V input range, 1 LSB is 38.15 µV.
3
See Definitions of Specifications section. These specifications do not include the error contribution from the external reference.
4
All specifications in dB are referred to a full-scale input FS. Tested with an input signal at 0.5 dB below full-scale, unless otherwise specified.
5
Parallel or serial 16-bit.
6
Conversion results are available immediately after completed conversion.
7
The max should be the minimum of 5.25 V and DVDD + 0.3 V.
8
In Warp mode.
9
With REF, PDREF and PDBUF are LOW; without REF, PDREF and PDBUF are HIGH.
10
With PDREF, PDBUF LOW and PD HIGH.
11
Impulse Mode. Tested in Parallel Reading mode.
12
Consult factory for extended temperature range.
Rev. A | Page 4 of 28
Page 5
AD7653

TIMING SPECIFICATIONS

Table 3. –40°C to +85°C, AVDD = DVDD = 5 V, OVDD = 2.7 V to 5.25 V, unless otherwise noted
Parameter
Refer to Figure 26 and Figure 27
Convert Pulse Width Time between Conversions (Warp Mode/Normal Mode/Impulse Mode)1 CNVST
LOW to BUSY HIGH Delay t3
BUSY HIGH All Modes Except Master Serial Read after Convert
(Warp Mode/Normal Mode/Impulse Mode) Aperture Delay End of Conversion to BUSY LOW Delay Conversion Time (Warp Mode/Normal Mode/Impulse Mode) Acquisition Time RESET Pulse Width
Refer to Figure 28, Figure 29, and (Parallel Interface Modes)
CNVST
LOW to DATA Valid Delay (Warp Mode/Normal Mode/Impulse Mode) t10
Figure 30
DATA Valid to BUSY LOW Delay Bus Access Request to DATA Valid Bus Relinquish Time
Refer to Figure 32 and Figure 33 (Master Serial Interface Modes)2
CS
LOW to SYNC Valid Delay t14 CS
LOW to Internal SCLK Valid Delay2 CS
LOW to SDOUT Delay t16 CNVST
LOW to SYNC Delay (Warp Mode/Normal Mode/Impulse Mode) t17 SYNC Asserted to SCLK First Edge Delay Internal SCLK Period3 Internal SCLK HIGH3 Internal SCLK LOW3 SDOUT Valid Setup Time3 SDOUT Valid Hold Time3 SCLK Last Edge to SYNC Delay3 CS
HIGH to SYNC HI-Z t25
CS
HIGH to Internal SCLK HI-Z t26
CS
HIGH to SDOUT HI-Z t27
BUSY HIGH in Master Serial Read after Convert3
(Warp Mode/Normal Mode/Impulse Mode)
CNVST
LOW to SYNC Asserted Delay
(Warp Mode/Normal Mode/Impulse Mode)
SYNC Deasserted to BUSY LOW Delay
Refer to and (Slave Serial Interface Modes) 2
Figure 34 Figure 35 External SCLK Setup Time External SCLK Active Edge to SDOUT Delay SDIN Setup Time SDIN Hold Time External SCLK Period External SCLK HIGH External SCLK LOW
1In Warp mode only, the maximum time between conversions is 1 ms; otherwise, there is no required maximum time.
2
In serial interface modes, the SYNC, SCLK, and SDOUT timings are defined with a maximum load CL of 10 pF; otherwise, the load is 60 pF maximum.
3
In Serial Master Read during Convert Mode. See for Serial Master Read after Convert mode. Table 4
Symbol
t
1
t
2
t
4
t
5
t
6
t
7
t
8
t
9
t
11
t
12
t
13
t
15
t
18
t
19
t
20
t
21
t
22
t
23
t
24
t
28
t
29
t
30
t
31
t
32
t
33
t
34
t
35
t
36
t
37
Min Typ Max Unit
10 ns 1/1.25/1.5 µs
35 ns
0.75/1/1.25 µs 2 ns 10 ns
0.75/1/1.25 µs 250 ns 10 ns
0.75/1/1.25 µs 12 ns 45 ns 5 15 ns
10 ns 10 ns 10 ns 25/275/525 ns 3 ns 25 40 ns 12 ns 7 ns 4 ns 2 ns 3 ns 10 ns 10 ns 10 ns
See Table 4
0.75/1/1.25 µs 25 ns
5 ns 3 18 ns 5 ns 5 ns 25 ns 10 ns 10 ns
Rev. A | Page 5 of 28
Page 6
AD7653
Table 4. Serial Clock Timings in Master Read after Convert
DIVSCLK[1] 0 0 1 1 DIVSCLK[0] Symbol 0 1 0 1 Unit
SYNC to SCLK First Edge Delay Minimum t18 3 17 17 17 ns Internal SCLK Period Minimum t19 25 50 100 200 ns Internal SCLK Period Maximum t19 40 70 140 280 ns Internal SCLK HIGH Minimum t20 12 22 50 100 ns Internal SCLK LOW Minimum t21 7 21 49 99 ns SDOUT Valid Setup Time Minimum t22 4 18 18 18 ns SDOUT Valid Hold Time Minimum t23 2 4 30 80 ns SCLK Last Edge to SYNC Delay Minimum t24 3 55 130 290 ns BUSY HIGH Width Maximum (Warp) t28 1.5 2 3 5.25 µs BUSY HIGH Width Maximum (Normal) t28 1.75 2.25 3.25 5.55 µs BUSY HIGH Width Maximum (Impulse) t28 2 2.5 3.5 5.75 µs
Rev. A | Page 6 of 28
Page 7
AD7653

ABSOLUTE MAXIMUM RATINGS

Table 5. AD7653 Absolute Maximum Ratings1
Parameter Rating
IN2, TEMP2,REF, REFBUFIN,
INGND, REFGND to AGND
AVDD + 0.3 V to AGND – 0.3 V
Ground Voltage Differences
AGND, DGND, OGND ±0.3 V
Supply Voltages
AVDD, DVDD, OVDD –0.3 V to +7 V AVDD to DVDD, AVDD to OVDD ±7 V
TO OUTPUT
PIN
60pF*
* IN SERIAL INTERFACE MODES, THE SYNC, SCLK, AND SDOUT TIMINGS ARE DEFINED WITH A MAXIMUM LOAD
OF 10pF; OTHERWISE,THE LOAD IS 60pF MAXIMUM.
C
L
1.6mA
C
L
500µA
DVDD to OVDD –0.3 V to +7 V
Digital Inputs –0.3 V to DVDD + 0.3 V PDREF, PDBUF3 ±20 mA Internal Power Dissipation4 700 mW
Figure 2. Load Circuit for Digital Interface Timing,
SDOUT, SYNC, SCLK Outputs C
Internal Power Dissipation5 2.5 W Junction Temperature 150°C Storage Temperature Range –65°C to +150°C Lead Temperature Range
300°C
0.8V
t
DELAY
2V
0.8V
(Soldering 10 sec)
1
Stresses above those listed under Absolute Maximum Ratings may cause
permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
2
See section.
Analog Input
3
See Voltage Reference Input section.
4
Specification is for the device in free air:
48-Lead LQFP; θJA = 91°C/W, θJC = 30°C/W
5
Specification is for the device in free air:
48-Lead LFCSP; θJA = 26°C/W.
Figure 3. Voltage Reference Levels for Timing
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
I
OL
1.4V
I
OH
L
2V
= 10 pF
t
DELAY
2V
0.8V
02966-0-006
02966-0-007
Rev. A | Page 7 of 28
Page 8
AD7653

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

PDBUF
PDREF
REFBUFIN
TEMP
AVDDINAGND
AGNDNCINGND
REFGND
48
47 46 45 44 39 38 3743 42 41 40
1
AGND
AVDD
NC
BYTESWAP
OB/2C WARP
IMPULSE
SER/PAR
D0
D1 D2/DIVSCLK0
D3/DIVSCLK1
NC = NO CONNECT
PIN 1 IDENTIFIER
2
3
4
5
6
7
8
9
10
11
12
13 14
D4/EXT/INT
AD7653
TOP VIEW
(Not to Scale)
15 16 17 18 19 20 21 22 23 24
DVDD
OVDD
DGND
OGND
D6/INVSCLK
D5/INVSYNC
D7/RDC/SDIN
Figure 4. 48-Lead LQFP (ST-48) and 48-Lead LFCSP (CP-48)
Table 6. Pin Function Descriptions
Pin No. Mnemonic Type1 Description
1, 36,
AGND P Analog Power Ground Pin.
41, 42 2, 44 AVDD P Input Analog Power Pin. Nominally 5 V. 3, 40 NC No Connect. 4 BYTESWAP DI Parallel Mode Selection (8-/16-bit). When LOW, the LSB is output on D[7:0] and the MSB is output on
D[15:8]. When HIGH, the LSB is output on D[15:8] and the MSB is output on D[7:0].
5
OB/2C
DI
Straight Binary/Binary Twos Complement. When OB/2C is HIGH, the digital output is straight binary; when LOW, the MSB is inverted, resulting in a twos complement output from its internal shift register.
6 WARP DI Mode Selection. When this pin is HIGH and the IMPULSE pin is LOW, this input selects the fastest
mode, the maximum throughput is achievable, and a minimum conversion rate must be applied in order to guarantee full specified accuracy. When LOW, full accuracy is maintained independent of the minimum conversion rate.
7 IMPULSE DI Mode Selection. When IMPULSE is HIGH and WARP is LOW, this input selects a reduced power
mode. In this mode, the power dissipation is approximately proportional to the sampling rate.
8
SER/PAR
DI Serial/Parallel Selection Input. When LOW, the parallel port is selected; when HIGH, the serial
interface mode is selected and some bits of the DATA bus are used as a serial port.
9, 10 D[0:1] DO
Bit 0 and Bit 1 of the Parallel Port Data Output Bus. When SER/PAR impedance.
11, 12 D[2:3]or
DIVSCLK[0:1]
DI/O
When SER/PAR When SER/PAR
is LOW, these outputs are used as Bit 2 and Bit 3 of the parallel port data output bus.
is HIGH, EXT/INT is LOW, and RDC/SDIN is LOW (serial master read after convert), these inputs, part of the serial port, are used to slow down, if desired, the internal serial clock that clocks the data output. In other serial modes, these pins are not used.
13 D4 or
INT
EXT/
DI/O
When SER/PAR is LOW, this output is used as Bit 4 of the parallel port data output bus. When SER/PAR
is HIGH, this input, part of the serial port, is used as a digital select input for choos­ing the internal data clock or an external data clock. With EXT/INT selected on the SCLK output. With EXT/INT external clock signal connected to the SCLK input.
14 D5 or
INVSYNC
DI/O
When SER/PAR When SER/PAR
is LOW, this output is used as Bit 5 of the parallel port data output bus.
is HIGH, this input, part of the serial port, is used to select the active state of the SYNC signal. It is active in both master and slave modes. When LOW, SYNC is active HIGH. When HIGH, SYNC is active LOW.
REF
36
AGND
35
CNVST
34
PD
33
RESET
32
CS
31
RD
30
DGND
29
BUSY
28
D15
27
D14
26
D13
25
D12
D9/SCLK
D10/SYNC
D8/SDOUT
D11/RDERROR
02966-0-002
is HIGH, these outputs are in high
tied LOW, the internal clock is
set to logic HIGH, output data is synchronized to an
Rev. A | Page 8 of 28
Page 9
AD7653
Pin No. Mnemonic Type1 Description
15 D6 or
INVSCLK
16 D7 or
RDC/SDIN
17 OGND P Input/Output Interface Digital Power Ground. 18 OVDD P Input/Output Interface Digital Power. Nominally at the same supply as the host interface
19 DVDD P Digital Power. Nominally at 5 V. 20 DGND P Digital Power Ground. 21 D8 or
SDOUT
22 D9 or
SCLK
23 D10 or
SYNC
24 D11 or
RDERROR
25–28 D[12:15] DO Bit 12 to Bit 15 of the Parallel Port Data Output Bus. These pins are always outputs regardless of the
29 BUSY DO Busy Output. Transitions HIGH when a conversion is started and remains HIGH until the conversion
30 DGND P Must Be Tied to Digital Ground. 31
32
33 RESET DI Reset Input. When set to a logic HIGH, this pin resets the AD7653 and the current conversion, if any,
34 PD DI Power-Down Input. When set to logic HIGH, power consumption is reduced and conversions are
35
RD CS
CNVST
DI/O
DI/O
DO
DI/O
DO
DO
DI DI
DI
When SER/PAR When SER/PAR in both master and slave modes. When SER/PAR When SER/PAR read mode selection input depending on the state of EXT/INT
When EXT/INT results from two or more ADCs onto a single SDOUT line. The digital data level on SDIN is output on DATA with a delay of 16 SCLK periods after the initiation of the read sequence. When EXT/INT is LOW, RDC/SDIN is used to select the read mode. When RDC/SDIN is HIGH, the data is output on SDOUT during conversion. When RDC/SDIN is LOW, the data can be output on SDOUT only when the conversion is complete.
(5 V or 3 V).
When SER/PAR When SER/PAR nized to SCLK. Conversion results are stored in an on-chip register. The AD7653 provides the
conversion result, MSB first, from its internal shift register. The DATA format is determined by the logic level of OB/2C serial mode when EXT/INT and valid on the next falling edge; if INVSCLK is HIGH, SDOUT is updated on the SCLK falling edge and valid on the next rising edge.
When SER/PAR When SER/PAR
depending upon the logic state of the EXT/INT updated depends upon the logic state of the INVSCLK pin. When SER/PAR
When SER/PAR synchronization for use with the internal data clock (EXT/INT initiated and INVSYNC is LOW, SYNC is driven HIGH and remains HIGH while the SDOUT output is
valid. When a read sequence is initiated and INVSYNC is HIGH, SYNC is driven LOW and remains LOW while the SDOUT output is valid.
When SER/PAR SER/PAR error flag. In slave mode, when a data read is started and not complete when the following
conversion is complete, the current data is lost and RDERROR is pulsed HIGH.
state of SER/PAR
is complete and the data is latched into the on-chip shift register. The falling edge of BUSY could be used as a data ready clock signal.
Read Data. When CS and RD are both LOW, the interface parallel or serial output bus is enabled. Chip Select. When CS and RD are both LOW, the interface parallel or serial output bus is enabled. CS
is also used to gate the external clock.
is aborted. If not used, this pin could be tied to DGND.
inhibited after the current one is completed. Start Conversion. A falling edge on CNVST puts the internal sample/hold into the hold state and
initiates a conversion. In Impulse mode (IMPULSE HIGH, WARP LOW), if CNVST the acquisition phase (t8) is complete, the internal sample/hold is put into the hold state and a conversion is immediately started.
is LOW, this output is used as Bit 6 of the parallel port data output bus. is HIGH, this input, part of the serial port, is used to invert the SCLK signal. It is active
is LOW, this output is used as Bit 7 of the parallel port data output bus. is HIGH, this input, part of the serial port, is used as either an external data input or a
.
is HIGH, RDC/SDIN could be used as a data input to daisy-chain the conversion
is LOW, this output is used as Bit 8 of the parallel port data output bus. is HIGH, this output, part of the serial port, is used as a serial data output synchro-
. In serial mode when EXT/INT is LOW, SDOUT is valid on both edges of SCLK. In
is HIGH, if INVSCLK is LOW, SDOUT is updated on the SCLK rising edge
is LOW, this output is used as Bit 9 of the parallel port data or SCLK output bus. is HIGH, this pin, part of the serial port, is used as a serial data clock input or output,
pin. The active edge where the data SDOUT is
is LOW, this output is used as Bit 10 of the parallel port data output bus. is HIGH, this output, part of the serial port, is used as a digital output frame
= logic LOW). When a read sequence is
is LOW, this output is used as Bit 11 of the parallel port data output bus. When
and EXT/INT are HIGH, this output, part of the serial port, is used as an incomplete read
.
is held LOW when
Rev. A | Page 9 of 28
Page 10
AD7653
Pin No. Mnemonic Type1 Description
37 REF AI/O Reference Input Voltage. On-chip reference output voltage. 38 REFGND AI Reference Input Analog Ground. 39 INGND AI Analog Input Ground. 43 IN AI Primary Analog Input with a Range of 0 V to 2.5 V. 45 TEMP AO Temperature Sensor Voltage Output. 46 REFBUFIN AI/O Reference Input Voltage. The reference output and the reference buffer input. 47 PDREF DI This pin allows the choice of internal or external voltage references. When LOW, the on-chip
reference is turned on. When HIGH, the internal reference is switched off and an external reference must be used.
48 PDBUF DI This pin allows the choice of buffering an internal or external reference with the internal buffer.
When LOW, the buffer is selected. When HIGH, the buffer is switched off.
1
AI = Analog Input; AI/O = Bidirectional Analog; AO = Analog Output; DI = Digital Input; DI/O = Bidirectional Digital; DO = Digital Output; P = Power.
Rev. A | Page 10 of 28
Page 11
AD7653

DEFINITIONS OF SPECIFICATIONS

Integral Nonlinearity Error (INL)
Linearity error refers to the deviation of each individual code from a line drawn from negative full scale through positive full scale. The point used as negative full scale occurs ½ LSB before the first code transition. Positive full scale is defined as a level 1½ LSB beyond the last code transition. The deviation is measured from the middle of each code to the true straight line.
Differential Nonlinearity Error (DNL)
In an ideal ADC, code transitions are 1 LSB apart. Differential nonlinearity is the maximum deviation from this ideal value. It is often specified in terms of resolution for which no missing codes are guaranteed.
Full-Scale Error
The last transition (from 011…10 to 011…11 in twos complement coding) should occur for an analog voltage 1½ LSB below the nominal full scale (2.49994278 V for the 0 V to 2.5 V range). The full-scale error is the deviation of the actual level of the last transition from the ideal level.
Unipolar Zero Error
The first transition should occur at a level ½ LSB above analog ground (19.073 µV for the 0 V to 2.5 V range). Unipolar zero error is the deviation of the actual transition from that point.
Spurious-Free Dynamic Range (SFDR)
SFDR is the difference, in decibels (dB), between the rms amplitude of the input signal and the peak spurious signal.
Effective Number of Bits (ENOB)
ENOB is a measurement of the resolution with a sine wave input. It is related to S/(N+D) by the following formula:
ENOB = (S/[N+D]dB – 1.76)/6.02
and is expressed in bits.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first five harmonic components to the rms value of a full-scale input signal, and is expressed in decibels.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the actual input signal to the rms sum of all other spectral components below the Nyquist frequency, excluding harmonics and dc. The value for SNR is expressed in decibels.
Signal-to-(Noise + Distortion) Ratio (S/[N+D])
S/(N+D) is the ratio of the rms value of the actual input signal to the rms sum of all other spectral components below the Nyquist frequency, including harmonics but excluding dc. The value for S/(N+D) is expressed in decibels.
Aperture Delay
Aperture delay is a measure of the acquisition performance and is measured from the falling edge of the
CNVST
input to when
the input signal is held for a conversion.
Transient Response
Transient response is the time required for the AD7653 to achieve its rated accuracy after a full-scale step function is applied to its input.
Overvoltage Recovery
Overvoltage recovery is the time required for the ADC to recover to full accuracy after an analog input signal 150% of the full-scale value is reduced to 50% of the full-scale value.
Reference Voltage Temperature Coefficient
Reference voltage temperature coefficient is the change of internal reference voltage output voltage V over the operating temperature range and normalized by the output voltage at 25°C, expressed in ppm/°C. The equation follows:
)(–)(
TVTV
12
6
)/( ×
=°
CppmTCV
×°
10
12
)()C25(
TTV
where: V(25°C) = V at +25°C
) = V at Temperature 2 (+85°C)
V(T
2
) = V at Temperature 1 (–40°C)
V(T
1
Rev. A | Page 11 of 28
Page 12
AD7653

TYPICAL PERFORMANCE CHARACTERISTICS

4
2.0
3
2
1
0
INL (LSB)
–1
–2
–3
–4
0
16384 32768 65536
CODE
Figure 5. Integral Nonlinearity vs. Code
140000
120000
100000
80000
60000
COUNTS
40000
20000
15906
00 00
0
7FFB
679
114641
112516
CODE IN HEX
Figure 6. Histogram of 261,120 Conversions of a
DC Input at the Code Transition
0
–20
–40
–60
–80
–100
–120
–140
AMPLITUDE (dB of Full Scale)
–160
–180
0
100
200 300 500400
FREQUENCY (kHz)
Figure 7. FFT Plot
49152
17001
377
8000 8001 80038002
f
= 1000kSPS
S
f
IN
SNR = 86.0dB THD = 90.3dB SFDR = 91.5dB S/[N+D] = 84.8dB
= 101kHz
02966-0-023
80047FFC 7FFD 7FFE 7FFF
02966-0-027
02966-0-029
1.5
1.0
0.5
DNL (LSB)
0
–0.5
–1.0
0
16384 32768 65536
CODE
49152
02966-0-026
Figure 8. Differential Nonlinearity vs. Code
160000
140000
120000
100000
80000
COUNTS
60000
40000
20000
0
0
2856
53
146148
54482
8000 8001 80038002
CODE IN HEX
54473
3099
90
80047FFC 7FFD 7FFE 7FFF
02966-0-028
Figure 9. Histogram of 261,120 Conversions of a
DC Input at the Code Center
SNR
S/[N+D]
02966-0-030
1000
15.0
14.5
14.0
13.5
ENOB (Bits)
13.0
12.5
12.0
90
87
84
81
78
SNR, S/[N+D] (dB)
75
72
1
10
FREQUENCY (kHz)
ENOB
100
Figure 10. SNR, S/(N+D), and ENOB vs. Frequency
Rev. A | Page 12 of 28
Page 13
AD7653
–50
SFDR
THD
SECOND HARMONIC
10
FREQUENCY (kHz)
THIRD HARMONIC
100
1000
02966-0-031
–100
THD, HARMONICS (dB)
–110
–120
–60
–70
–80
–90
1
Figure 11. THD, Harmonics, and SFDR vs. Frequency
92
91
90
88
87
86
85
84
83
SNR, S/[N+D] REFERRED TO FULL SCALE (dB)
82
89
–60
INPUT LEVEL (dB)
SNR
S/[N+D]
02966-A-032
Figure 12. SNR and S/(N+D) vs. Input Level (Referred to Full Scale)
89
88
87
SNR, S/[N+D] (dB)
86
85
–55
SNR
S[N+D]
ENOB
585
TEMPERATURE (°C)
105
02966-0-033
125–35 –15 25 45 65
Figure 13. SNR, S/(N+D), and ENOB vs. Temperature
120
100
80
60
SFDR (dB)
40
20
0
0–50 –40 –30 –20 –10
14.75
14.50
14.25
ENOB (Bits)
14.00
13.75
–95
SECOND HARMONIC
THIRD HARMONIC
–105
–115
THD, HARMONICS (dB)
–125
–55
THD
585
TEMPERATURE (°C)
Figure 14. THD and Harmonics vs. Temperature
100000
OPERATING CURRENT (µA)
10000
1000
100
10
0.1
0.01
0.001
AVDD, IMPULSE
1
10
AVDD, WARP/NORMAL
DVDD, WARP/NORMAL
DVDD, IMPULSE
OVDD, ALL MODES
PDREF = PDBUF = HIGH
1000
SAMPLE RATE (SPS)
Figure 15. Operating Current vs. Sample Rate
6
5
4
3
2
1
0
–1
–2
–3
–4
ZERO ERROR, FULL SCALE (LSB)
–5
–6
–55
–15
TEMPERATURE (°C)
FULL SCALE
ZERO ERROR
85
Figure 16. Zero Error, Full Scale with Reference vs. Temperature
105
02966-0-034
02966-0-036
105
02966-0-040
125–35 –15 25 45 65
1000000100 10000 100000
125–35 5 25 45 65
Rev. A | Page 13 of 28
Page 14
AD7653
2.5020
2.5019
2.5018
2.5017
2.5016
2.5015
2.5014
VREF (V)
2.5013
2.5012
2.5011
2.5010
2.5009
2.5008 –40
–20 0 20 40 60
TEMPERATURE (°C)
Figure 17. Typical Reference Output Voltage vs. Temperature
90
80
60
50
40
30
NUMBER OF UNITS
20
10
0
–30
–26 –22 –18 –1470–10 –6 –2 2 3026221814106
REFERENCE DRIFT (ppm/°C)
Figure 18. Reference Voltage Temperature Coefficient Distribution (335 Units)
80 100 120
02966-0-038
02966-0-039
50
OVDD = 2.7V @ 85°C
40
30
DELAY (ns)
20
12
t
10
0
0
Figure 19. Typical Delay vs. Load Capacitance C
OVDD = 2.7V @ 25°C
CL (pF)
OVDD = 5V @ 85°C
OVDD = 5V @ 25°C
02966-0-035
L
20050 100 150
Rev. A | Page 14 of 28
Page 15
AD7653

CIRCUIT INFORMATION

IN
REF
REFGND
INGND
MSB
32,768C
16,384C 4C 2C C C
Figure 20. ADC Simplified Schematic
65,536C
LSB
SW
SW
A
COMP
B
SWITCHES
CONTROL
CONTROL
LOGIC
CNVST
BUSY
OUTPUT
CODE
02966-0-005
The AD7653 is a very fast, low power, single supply, precise 16-bit analog-to-digital converter (ADC). The AD7653 features different modes to optimize performance according to the application. In Warp mode, the part can convert 1 million samples per second.
The AD7653 provides the user with an on-chip track/hold, successive approximation ADC that does not exhibit any pipeline or latency, making it ideal for multiple multiplexed channel applications.
The AD7653 can be operated from a single 5 V supply and can be interfaced to either 5 V or 3 V digital logic. It is housed in either a 48-lead LQFP or a 48-lead LFCSP that saves space and allows flexible configurations as either a serial or a parallel interface. The AD7653 is a pin-to-pin compatible upgrade of the AD7651/AD7652.

CONVERTER OPERATION

The AD7653 is a successive approximation ADC based on a charge redistribution DAC. F shows a simplified schematic of the ADC. The capacitive DAC consists of an array of 16 binary weighted capacitors and an additional LSB capacitor. The comparator’s negative input is connected to a dummy capacitor of the same value as the capacitive DAC array.
During the acquisition phase, the common terminal of the array tied to the comparator’s positive input is connected to AGND via SWA. All independent switches are connected to the analog input IN. Thus, the capacitor array is used as a sampling capacitor and acquires the analog signal on IN. Similarly, the dummy capacitor acquires the analog signal on INGND.
When
CNVST
goes LOW, a conversion phase is initiated. When
the conversion phase begins, SWA and SWB are opened. The capacitor array and dummy capacitor are then disconnected
igure 20
from the inputs and connected to REFGND. Therefore, the differential voltage between IN and INGND captured at the end of the acquisition phase is applied to the comparator inputs, causing the comparator to become unbalanced. By switching each element of the capacitor array between REFGND and REF, the comparator input varies by binary weighted voltage steps (VREF/2, VREF/4, …VREF/65536). The control logic toggles these switches, starting with the MSB, to bring the comparator back into a balanced condition.
After this process is completed, the control logic generates the ADC output code and brings the BUSY output LOW.
Modes of Operation
The AD7653 features three modes of operations: Warp, Normal, and Impulse. Each mode is best suited for specific applications.
Warp mode allows the fastest conversion rate up to 1 MSPS. However in this mode and this mode only, the full specified accuracy is guaranteed only when the time between conversions does not exceed 1 ms. If the time between two consecutive conversions is longer than 1 ms (e.g., after power-up), the first conversion result should be ignored. This mode makes the AD7653 ideal for applications where both high accuracy and fast sample rate are required.
Normal mode is the fastest mode (800 kSPS) without any limitations on the time between conversions. This mode makes the AD7653 ideal for asynchronous applications such as data acquisition systems, where both high accuracy and fast sample rate are required.
Impulse mode, the lowest power dissipation mode, allows power saving between conversions. When operating at 1 kSPS, for example, it typically consumes only 138 µW. This feature makes the AD7653 ideal for battery-powered applications.
Rev. A | Page 15 of 28
Page 16
AD7653
Transfer Functions
Using the OB/2C digital input, the AD7653 offers two output codings: straight binary and twos complement. The LSB size is
/65536, which is about 38.15 µV. The AD7653’s ideal
V
REF
transfer characteristic is shown in and . Table 7
1 LSB = V
111...111
111...110
111...101
ADC CODE (Straight Binary)
000...010
000...001
000...000 1LSB0V
0.5 LSB
Figure 21. ADC Ideal Transfer Function
Figure 21
/65536
REF
ANALOG INPUT
V
REF
V
REF
– 1.5 LSB
– 1 LSB
02966-0-003
Table 7. Output Codes and Ideal Input Voltages
Digital Output Code (Hex)
Description
Analog Input
Straight Binary
Twos Complement
FSR – 1 LSB 2.499962 V FFFF1 7FFF1 FSR – 2 LSB 2.499923 V FFFE 7FFE Midscale + 1 LSB 1.250038 V 8001 0001 Midscale 1.25 V 8000 0000 Midscale – 1 LSB 1.249962 V 7FFF FFFF –FSR + 1 LSB 38 µV 0001 8001 –FSR 0 V 00002 80002
1
This is also the code for overrange analog input (VIN – V
V
– V
REFGND
).
REF
2
This is also the code for underrange analog input (VIN below V
INGND
above
INGND
).
ANALOG
SUPPLY
(5V)
ANALOG INPUT
(0VTO 2.5V)
+
4
C
R
15
2
U1
C
C
NOTES
1
THE CONFIGURATION SHOWN IS USING THE INTERNAL REFERENCE AND INTERNAL BUFFER.
2
THE AD8021 IS RECOMMENDED. SEE DRIVER AMPLIFIER CHOICE SECTION.
3
OPTIONAL LOW JITTER.
4
A 10µF CERAMIC CAPACITOR (X5R, 1206 SIZE) IS RECOMMENDED (e.g., PANASONIC ECJ3YB0J106M).
SEE VOLTAGE REFERENCE INPUT SECTION.
10µF
100nF
100nF
2.7nF
PDREF
20
+
AVDD DGND DVDD OVDD OGND
REF
REFBUFIN
REFGND
IN
INGND
GND
1
PDBUF
PD RESET
10µF
AD7653
100nF
SCLK
SDOUT
BUSY
CNVST
OB/2C
SER/PAR
WARP
BYTESWAP
IMPULSE
RDCS
Figure 22. Typical Connection Diagram
100nF
DIGITAL SUPPLY
10
µ
F
SERIAL
PORT
(3.3V OR 5V)
+
µC/µP/DSP
3
D
DVD D
CLOCK
02966-A-004
Rev. A | Page 16 of 28
Page 17
AD7653
O

TYPICAL CONNECTION DIAGRAM

Figure 22 shows a typical connection diagram for the AD7653.
Analog Input
Figure 23 the AD7653.
The two diodes, D1 and D2, provide ESD protection for the analog inputs IN and INGND. Care must be taken to ensure that the analog input signal never exceeds the supply rails by more than 0.3 V. This will cause these diodes to become forward-biased and start conducting current. These diodes can handle a forward-biased current of 100 mA maximum. For instance, these conditions could eventually occur when the input buffer’s (U1) supplies are different from AVDD. In such a case, an input buffer with a short-circuit current limitation can be used to protect the part.
This analog input structure allows the sampling of the different­tial signal between IN and INGND. Unlike other converters, INGND is sampled at the same time as IN. By using this differ­ential input, small signals common to both inputs are rejected. For instance, by using INGND to sense a remote signal ground, ground potential differences between the sensor and the local ADC ground are eliminated.
During the acquisition phase, the impedance of the analog input IN can be modeled as a parallel combination of capacitor C1 and the network formed by the series connection of R1 and C2. C1 is primarily the pin capacitance. R1 is typically 168 Ω and is a lumped component made up of some serial resistors and the on resistance of the switches. C2 is typically 60 pF and is mainly the ADC sampling capacitor. During the conversion phase,
shows an equivalent circuit of the input structure of
AV D D
R INGND
AGND
IN
Figure 23. Equivalent Analog Input Circuit
D1
C1
D2
R1
C2
02966-0-008
when the switches are opened, the input impedance is limited to C1. R1 and C2 make a 1-pole low-pass filter that reduces undesirable aliasing effects and limits the noise.
When the source impedance of the driving circuit is low, the AD7653 can be driven directly. Large source impedances will significantly affect the ac performance, especially total harmonic distortion.
Driver Amplifier Choice
Although the AD7653 is easy to drive, the driver amplifier needs to meet the following requirements:
The driver amplifier and the AD7653 analog input circuit
must be able to settle for a full-scale step of the capacitor array at a 16-bit level (0.0015%). In the amplifier’s data sheet, settling at 0.1% to 0.01% is more commonly specified. This could differ significantly from the settling time at a 16-bit level and should be verified prior to driver selection. The tiny op amp AD8021, which combines ultralow noise and high gain-bandwidth, meets this settling time requirement even when used with gains up to 13.
The noise generated by the driver amplifier needs to be
kept as low as possible in order to preserve the SNR and transition noise performance of the AD7653. The noise coming from the driver is filtered by the AD7653 analog input circuit 1-pole low-pass filter made by R1 and C2 or by the external filter, if one is used.
The driver needs to have a THD performance suitable to
that of the AD7653.
The AD8021 meets these requirements and is appropriate for almost all applications. The AD8021 needs a 10 pF external compensation capacitor that should have good linearity as an NPO ceramic or mica type.
The AD8022 could also be used if a dual version is needed and gain of 1 is present. The AD829 is an alternative in applications where high frequency (above 100 kHz) performance is not required. In gain of 1 applications, it requires an 82 pF compensation capacitor. The AD8610 is an option when low bias current is needed in low frequency applications.
Rev. A | Page 17 of 28
Page 18
AD7653
A
T
Voltage Reference Input
The AD7653 allows the choice of either a very low temperature drift internal voltage reference or an external 2.5 V reference.
For applications that use multiple AD7653s, it is more effective to use the internal buffer to buffer the reference voltage.
Unlike many ADCs with internal references, the internal reference of the AD7653 provides excellent performance and can be used in almost all applications.
To use the internal reference along with the internal buffer, PDREF and PDBUF should both be LOW. This will produce a
1.207 V voltage on REFBUFIN which, amplified by the buffer, will result in a 2.5 V reference on the REF pin.
The output impedance of REFBUFIN is 11 k
the reference is enabled.
It is useful to decouple REFBUFIN with
Ω (minimum) when
a 100 nF ceramic capacitor. Thus, the 100 nF capacitor provides an RC filter for noise reduction.
To use an external reference along with the internal buffer, PDREF should be HIGH and PDBUF should be LOW. This powers down the internal reference and allows the 2.5 V reference to be applied to REFBUFIN.
To use an external reference directly on the REF pin, PDREF and PDBUF should both be HIGH.
PDREF and PDBUF, respectively, power down the internal reference and the internal reference. Note that the PDREF and PDBUF input current should never exceed 20 mA. This could eventually occur when input voltage is above AVDD (for instance at power-up). In this case, a 100 Ω series resistor is recommended.
The internal reference is temperature compensated to 2.5 V ± 20 mV. The reference is trimmed to provide a typical drift of 7
. This typical drift characteristic is shown in .
ppm/°C Figure 17 For improved drift performance, an external reference such as the AD780 can be used.
The AD7653 voltage reference input REF has a dynamic input impedance; it should, therefore, be driven by a low impedance source with efficient decoupling between the REF and REFGND inputs. This decoupling depends on the choice of the voltage reference, but usually consists of a low ESR capacitor connected to REF and REFGND with minimum parasitic inductance. A 10 µF (X5R, 1206 size) ceramic chip capacitor (or 47 µF tantalum capacitor) is appropriate when using either the internal reference or one of these recommended reference voltages:
Care should be taken with the voltage reference’s temperature coefficient, which directly affects the full-scale accuracy, if this parameter matters. For instance, a ±15 ppm/°C temperature coefficient of the reference changes full scale by ±1 LSB/°C.
Note that V input range is defined in terms of V
can be increased to AVDD – 1.85 V. Since the
REF
, this would essentially
REF
increase the range to 0 V to 3 V with an AVDD above 4.85 V. The AD780 can be selected with a 3 V reference voltage.
The TEMP pin, which measures the temperature of the AD7653, can be used as shown in . The output of the TEMP pin
Figure 24 is applied to one of the inputs of the analog switch (e.g.,
ADG779), and the ADC itself is used to measure its own
temperature. This configuration is very useful for improving the calibration accuracy over the temperature range.
TEMP
AD7653
TEMPERATURE SENSOR
02966-0-024
NALOG INPU
(UNIPOLAR)
ADG779
IN
AD8021
Figure 24. Temperature Sensor Connection Diagram
C
C
Power Supply
The AD7653 uses three power supply pins: an analog 5 V supply AVDD, a digital 5 V core supply DVDD, and a digital input/output interface supply OVDD. OVDD allows direct interface with any logic between 2.7 V and DVDD + 0.3 V. To reduce the supplies needed, the digital core (DVDD) can be supplied through a simple RC filter from the analog supply, as shown in . The AD7653 is independent of power
Figure 22 supply sequencing once OVDD does not exceed DVDD by more than 0.3 V, and is thus free of supply voltage induced latch-up.
The low noise, low temperature drift ADR421 and AD780
The low power ADR291
The low cost AD1582
Rev. A | Page 18 of 28
Page 19
AD7653

POWER DISSIPATION VS. THROUGHPUT

Operating currents are very low during the acquisition phase, allowing significant power savings when the conversion rate is reduced (see F ). This power savings depends on the
igure 25 mode used. In Impulse mode, the AD7653 automatically reduces power consumption at the end of each conversion phase. This makes the part ideal for very low power battery applications. The digital interface and the reference remain active even during the acquisition phase. To reduce operating digital supply currents even further, digital inputs need to be driven close to the power supply rails (i.e., DVDD or DGND), and OVDD should not exceed DVDD by more than 0.3 V.
1000000
100000
10000
1000
POWER DISSIPATION (µW)
100
10
WARP MODE POWER
IMPULSE MODE POWER
10
1000
SAMPLE RATE (SPS)
PDREF = PDBUF = HIGH
Figure 25. Power Dissipation vs. Sampling Rate
1000000100 10000 100000
02966-0-041

CONVERSION CONTROL

Figure 26 process. The AD7653 is controlled by the
initiates conversion. Once initiated, it cannot be restarted or aborted, even by the power-down input PD, until the conversion is complete.
In Impulse mode, conversions can be automatically initiated. If CNVST the acquisition phase and automatically initiates a new con­version. By keeping
conversion process running by itself. It should be noted that the analog input must be settled when BUSY goes low. Also, at power-up,
conversion process. In this mode, the AD7653 can run slightly faster than the guaranteed 666 kSPS limits in Impulse mode. This feature does not exist in Warp and Normal modes.
Although
special care with fast, clean edges, and levels with minimum overshoot and undershoot or ringing.
shows the detailed timing diagrams of the conversion
signal, which
CNVST
operates independently of CS and RD.
CNVST
is held LOW when BUSY is LOW, the AD7653 controls
LOW, the AD7653 keeps the
CNVST
CNVST
CNVST
should be brought LOW once to initiate the
is a digital signal, it should be designed with
The
value serial resistor (i.e., 50 close to the output of the component that drives this line.
For applications where SNR is critical, the
have very low jitter. This may be achieved by using a dedicated oscillator for
high frequency, low jitter clock, as shown in . Figure 22
CNVST
BUSY
MODE
RESET
BUSY
DATA
CNVST
CS = RD = 0
CNVST
BUSY
DATA
BUS
Figure 28. Master Parallel Data Timing for Reading (Continuous Read)
trace should be shielded with ground and a low
CNVST
) termination should be added
signal should
CNVST
generation, or to clock
CNVST
t
t
1
t
t
3
t
5
ACQUIRE CONVERT ACQUIRE CONVERT
4
t
7
2
t
6
t
8
CNVST
Figure 26. Basic Conversion Timing
t
9
t
8
Figure 27. RESET Timing
t
1
t
10
t
t
3
PREVIOUS CONVERSION DATA NEW DATA
4
t
11
with a
02966-0-011
02966-0-011
02966-0-012
Rev. A | Page 19 of 28
Page 20
AD7653

DIGITAL INTERFACE

The AD7653 has a versatile digital interface; it can be interfaced with the host system by using either a serial or a parallel inter­face. The serial interface is multiplexed on the parallel data bus. The AD7653 digital interface also accommodates both 3 V and 5 V logic by simply connecting the OVDD supply pin of the AD7653 to the host system interface digital supply. Finally, by using the OB/
binary coding can be used.
The two signals,
have a similar effect because they are OR’d together internally. When at least one of these signals is HIGH, the interface outputs are in high impedance. Usually
of each AD7653 in multicircuit applications and is held LOW in a single AD7653 design.
conversion result on the data bus.

PARALLEL INTERFACE

The AD7653 is configured to use the parallel interface when SER/
PA R conversion, which is during the next acquisition phase, or during the following conversion, as shown in F and Figure 30 conversion, however, it is recommended that it is read only during the first half of the conversion phase. This avoids any potential feedthrough between voltage transients on the digital interface and the most critical analog conversion circuitry.
The BYTESWAP pin allows a glueless interface to an 8-bit bus. As shown in , the LSB byte is output on D[7:0] and the MSB is output on D[15:8] when BYTESWAP is LOW. When BYTESWAP is HIGH, the LSB and MSB bytes are swapped and the LSB is output on D[15:8] and the MSB is output on D[7:0]. By connecting BYTESWAP to an address line, the 16-bit data can be read in two bytes on either D[15:8] or D[7:0].
input pin, both twos complement and straight
2C
and RD, control the interface. CS and RD
CS
allows the selection
CS
is generally used to enable the
RD
is held LOW. The data can be read either after each
igure 29
, respectively. When the data is read during the
Figure 31
CS
RD
BUSY
DATA
BUS
CS = 0
CNVST,
BUSY
DATA
BUS
RD
CURRENT
CONVERSION
t
12
t
13
Figure 29. Slave Parallel Data Timing for Reading
(Read after Convert Mode)
t
1
t
4
t
3
PREVIOUS
CONVERSION
t
12
t
13
Figure 30. Slave Parallel Data Timing for Reading
(Read during Convert Mode)
CS
RD
02966-0-013
02966-0-014

SERIAL INTERFACE

The AD7653 is configured to use the serial interface when SER/
MSB first, on the SDOUT pin. This data is synchronized with the 16 clock pulses provided on the SCLK pin. The output data is valid on both the rising and falling edges of the data clock.
is held HIGH. The AD7653 outputs 16 bits of data,
PA R
Rev. A | Page 20 of 28
BYTESWAP
PINS D[15:8]
PINS D[7:0]
HI-Z
HI-Z
HIGH BYTE LOW BYTE
t
12
LOW BYTE HIGH BYTE
Figure 31. 8-Bit Parallel Interface
HI-Z
t
12
t
13
HI-Z
02966-A-025
Page 21
AD7653

MASTER SERIAL INTERFACE

Internal Clock
The AD7653 is configured to generate and provide the serial data clock SCLK when the EXT/
AD7653 also generates a SYNC signal to indicate to the host when the serial data is valid. The serial clock SCLK and the SYNC signal can be inverted, if desired. Depending on the RDC/SDIN input, the data can be read after each conversion or during the following conversion. F and show the detailed timing diagrams of these two modes.
CS, RD
t
CNVST
pin is held LOW. The
INT
igure 32
3
Figure 33
EXT/INT = 0
RDC/SDIN = 0 INVSCLK = INVSYNC = 0
Usually, because the AD7653 is used with a fast throughput, the Master Read During Conversion mode is the most recommended serial mode. In this mode, the serial clock and data toggle at appropriate instants, minimizing potential feedthrough between digital activity and critical conversion decisions.
In Read After Conversion mode, it should be noted that unlike in other modes, the BUSY signal returns LOW after the 16 data bits are pulsed out and not at the end of the conversion phase, which results in a longer BUSY width.
BUSY
SYNC
SCLK
SDOUT
t
29
t
14
t
15
X
t
16
t
22
t
18
t
19
t
20
123 141516
D15 D14 D2 D1 D0
t
28
t
21
t
23
Figure 32. Master Serial Data Timing for Reading (Read after Convert)
EXT/INT = 0 RDC/SDIN = 1 INVSCLK = INVSYNC = 0
CS, RD
t
1
CNVST
t
3
BUSY
t
17
SYNC
SCLK
SDOUT
t
14
t
15
t
18
t
16
t
22
t
19
t20t
21
12 3 141516
D15 D14 D2 D1 D0X
t
23
Figure 33. Master Serial Data Timing for Reading (Read Previous Conversion during Convert)
t
30
t
25
t
24
t
26
t
27
02966-0-015
t
25
t
24
t
26
t
27
02966-0-016
Rev. A | Page 21 of 28
Page 22
AD7653
S

SLAVE SERIAL INTERFACE

External Clock
The AD7653 is configured to accept an externally supplied serial data clock on the SCLK pin when the EXT/
HIGH. In this mode, several methods can be used to read the data. The external serial clock is gated by
. When CS and RD
CS are both LOW, the data can be read after each conversion or during the following conversion. The external clock can be either a continuous or a discontinuous clock. A discontinuous clock can be either normally HIGH or normally LOW when inactive. F and F show the detailed timing
igure 34
igure 35
diagrams of these methods.
RD
BUSY
t
t36t
SCLK
SDOUT
t
31
t
16
1 2 3 14151617 18
X
pin is held
INT
EXT/INT = 1
35
37
t
32
D15 D14 D1
t
34
D13
While the AD7653 is performing a bit decision, it is important that voltage transients be avoided on digital input/output pins, or degradation of the conversion result could occur. This is particularly important during the second half of the conversion phase because the AD7653 provides error correction circuitry that can correct for an improper bit decision made during the first half of the conversion phase. For this reason, it is recom­mended that when an external clock is being provided, it is a discontinuous clock that is toggling only when BUSY is LOW, or, more importantly, that it does not transition during the latter half of BUSY HIGH.
INVSCLK = 0
RD = 0
D0
X15 X14
SDIN
CS
CNVST
BUSY
SCLK
DOUT
X15 X14 X13 X1 X0 Y15 Y14
t
33
Figure 34. Slave Serial Data Timing for Reading (Read after Convert)
D1
RD = 0
D0
EXT/INT = 1 INVSCLK = 0
t
3
t
16
t
35
t36t
37
123 141516
t
31
X
D15 D14 D13
t
32
Figure 35. Slave Serial Data Timing for Reading (Read Previous Conversion during Convert)
02966-0-017
02966-0-018
Rev. A | Page 22 of 28
Page 23
AD7653
External Discontinuous Clock Data Read After Conversion
Though the maximum throughput cannot be achieved using this mode, it is the most recommended of the serial slave modes. Figure 34
shows the detailed timing diagrams of this method. After a conversion is complete, indicated by BUSY returning LOW, the conversion’s result can be read while both
and RD
CS are LOW. Data is shifted out MSB first with 16 clock pulses and is valid on the rising and falling edges of the clock.
Among the advantages of this method is the fact that conversion performance is not degraded because there are no voltage transients on the digital interface during the conversion process. Another advantage is the ability to read the data at any speed up to 40 MHz, which accommodates both the slow digital host interface and the fastest serial reading.
Finally, in this mode only, the AD7653 provides a daisy-chain feature using the RDC/SDIN pin for cascading multiple converters together. This feature is useful for reducing compo­nent count and wiring connections when desired, as, for instance, in isolated multiconverter applications.
External Clock Data Read During Conversion
Figure 35 shows the detailed timing diagrams of this method. During a conversion, while both
and RD are both LOW, the
CS result of the previous conversion can be read. The data is shifted out MSB first with 16 clock pulses, and is valid on both the rising and falling edges of the clock. The 16 bits must be read before the current conversion is complete; otherwise, RDERROR is pulsed HIGH and can be used to interrupt the host interface to prevent incomplete data reading. There is no daisy-chain feature in this mode, and the RDC/SDIN input should always be tied either HIGH or LOW.
To reduce performance degradation due to digital activity, a fast discontinuous clock (at least 18 MHz when Impulse mode is used, 25 MHz when Normal mode is used, or 40 MHz when Warp mode is used) is recommended to ensure that all the bits are read during the first half of the conversion phase. It is also possible to begin to read data after conversion and continue to read the last bits after a new conversion has been initiated. This allows the use of a slower clock speed like 14 MHz in Impulse mode, 18 MHz in Normal mode, and 25 MHz in Warp mode.
The concatenation of two devices is shown in . Simultaneous sampling is possible by using a common
Figure 36
CNVST signal. It should be noted that the RDC/SDIN input is latched on the edge of SCLK opposite the one used to shift out the data on SDOUT. Thus, the MSB of the upstream converter follows the LSB of the downstream converter on the next SCLK cycle.
BUSY OUT
BUSYBUSY
AD7653
(UPSTREAM)
RDC/SDIN SDOUT
SCLK IN
CS IN
CNVST IN
Figure 36. Two AD7653s in a Daisy-Chain Configuration
#2
CNVST
CS
SCLK
AD7653
#1
(DOWNSTREAM)
SDOUTRDC/SDIN
CNVST
SCLK
CS
DATA OUT
02966-0-019
Rev. A | Page 23 of 28
Page 24
AD7653

MICROPROCESSOR INTERFACING

The AD7653 is ideally suited for traditional dc measurement applications supporting a microprocessor, and for ac signal processing applications interfacing to a digital signal processor. The AD7653 is designed to interface either with a parallel 8-bit or 16-bit wide interface, or with a general-purpose serial port or I/O ports on a microcontroller. A variety of external buffers can be used with the AD7653 to prevent digital noise from coupling into the ADC. The following section discusses the use of an AD7653 with an ADSP-219x SPI equipped DSP.
SPI Interface (ADSP-219x)
Figure 37 the SPI equipped ADSP-219x. To accommodate the slower speed of the DSP, the AD7653 acts as a slave device and data must be read after conversion. This mode also allows the daisy­chain feature. The convert command can be initiated in response to an internal timer interrupt. The reading process can be initiated in response to the end-of-conversion signal (BUSY going LOW) using an interrupt line of the DSP. The serial inter-
shows an interface diagram between the AD7653 and
face (SPI) on the ADSP-219x is configured for master mode— (MSTR) = 1, Clock Polarity bit (CPOL) = 0, Clock Phase bit (CPHA) = 1, and SPI Interrupt Enable (TIMOD) = 00—by writing to the SPI control register (SPICLTx). To meet all timing requirements, the SPI clock should be limited to 17 Mbps, which allows it to read an ADC result in less than 1 µs. When a higher sampling rate is desired, use of one of the parallel interface modes is recommended.
DVD D
AD7653*
SER/PAR
EXT/INT
BUSY
RD
INVSCLK
Figure 37. Interfacing the AD7653 to an SPI Interface
CS
SDOUT
SCLK
CNVST
* ADDITIONAL PINS OMITTED FOR CLARITY
ADSP-219x*
PFx
SPIxSEL (PFx)
MISOx
SCKx
PFx or TFSx
02966-0-021
Rev. A | Page 24 of 28
Page 25
AD7653

APPLICATION HINTS

BIPOLAR AND WIDER INPUT RANGES

In some applications, it is desirable to use a bipolar or wider analog input range such as ±10 V, ±5 V, or 0 V to 5 V. Although the AD7653 has only one unipolar range, simple modifications of input driver circuitry allow bipolar and wider input ranges to be used without any performance degradation. shows
Figure 38 a connection diagram that allows this. Component values required and resulting full-scale ranges are shown in .
Table 8
When desired, accurate gain and offset can be calibrated by acquiring a ground and voltage reference using an analog
U1
C
REF
Figure 38
C
F
R1
2.7nF
100nF
15
IN
AD7653
INGND
REF
REFGND
02966-0-022
multiplexer (U2) as shown in .
U2
R2
R3 R4
ANALOG
INPUT
Figure 38. Using the AD7653 in 16-Bit Bipolar and/or Wider Input Ranges
Table 8. Component Values and Input Ranges
Input Range R1 (Ω) R2 (kΩ) R3 (kΩ) R4 (kΩ)
±10 V 500 4 2.5 2 ±5 V 500 2 2.5 1.67 0 V to –5 V 500 1 None 0

LAYOUT

The AD7653 has very good immunity to noise on the power supplies. However, care should still be taken with regard to grounding layout.
The printed circuit board that houses the AD7653 should be designed so that the analog and digital sections are separated and confined to certain areas of the board. This facilitates the use of ground planes that can be separated easily. Digital and analog ground planes should be joined in only one place, preferably underneath the AD7653, or as close as possible to the AD7653. If the AD7653 is in a system where multiple devices require analog-to-digital ground connections, the connection should still be made at one point only, a star ground point that should be established as close as possible to the AD7653.
Running digital lines under the device should be avoided since these will couple noise onto the die. The analog ground plane should be allowed to run under the AD7653 to avoid noise coupling. Fast switching signals like
CNVST
or clocks should be
shielded with digital ground to avoid radiating noise to other sections of the board, and should never run near analog signal paths. Crossover of digital and analog signals should be avoided. Traces on different but close layers of the board should run at right angles to each other to will reduce the effect of crosstalk through the board.
The power supply lines to the AD7653 should use as large a trace as possible to provide low impedance paths and to reduce the effect of glitches on the power supply lines. Good decoupling is also important to lower the supply’s impedance presented to the AD7653, and to reduce the magnitude of the supply spikes. Decoupling ceramic capacitors, typically 100 nF, should be placed on each power supply pin—AVDD, DVDD, and OVDD—close to, and ideally right up against these pins and their corresponding ground pins. Additionally, low ESR 10 µF capacitors should be located near the ADC to further reduce low frequency ripple.
The DVDD supply of the AD7653 can be a separate supply or can come from the analog supply AVDD or the digital interface supply OVDD. When the system digital supply is noisy or when fast switching digital signals are present, if no separate supply is available, the user should connect DVDD to AVDD through an RC filter (see F ), and the system supply to OVDD and
igure 22 the remaining digital circuitry. When DVDD is powered from the system supply, it is useful to insert a bead to further reduce high frequency spikes.
The AD7653 has five different ground pins: INGND, REFGND, AGND, DGND, and OGND. INGND is used to sense the analog input signal. REFGND senses the reference voltage and, because it carries pulsed currents, should be a low impedance return to the reference. AGND is the ground to which most internal ADC analog signals are referenced; it must be connected with the least resistance to the analog ground plane. DGND must be tied to the analog or digital ground plane depending on the config­uration. OGND is connected to the digital system ground.

EVALUATING THE AD7653’S PERFORMANCE

A recommended layout for the AD7653 is outlined in the
EVAL-AD7653 evaluation board for the AD7653. The
evaluation board package includes a fully assembled and tested evaluation board, documentation, and software for controlling the board from a PC via the EVAL-CONTROL BRD2.
Rev. A | Page 25 of 28
Page 26
AD7653

OUTLINE DIMENSIONS

1.45
1.40
1.35
0.15
0.05
PIN 1 INDICATOR
10°
6° 2°
SEATING PLANE
VIEW A
ROTATED 90°CCW
7.00
BSC SQ
0.75
0.60
0.45
SEATING
PLANE
0.20
0.09
°
3.5 0°
0.08 MAX COPLANARITY
COMPLIANT TO JEDEC STANDARDS MS-026BBC
1.60 MAX
VIEW A
1
12
0.50
BSC
48
13
Figure 39. 48-Lead Quad Flatpack (LQFP)(ST-48)
Dimensions shown in millimeters
37
36
0.60 MAX
0.60 MAX
9.00 BSC SQ
PIN 1
TOP VIEW
(PINS DOWN)
0.30
0.23
0.18
37
36
7.00
BSC SQ
25
24
0.27
0.22
0.17
PIN 1
48
INDICATOR
1
5.25
5.10 SQ
4.95
12
0.25 MIN
PADDLE CONNECTED TO AGND. THIS CONNECTION IS NOT REQUIRED TO MEET THE ELECTRICAL PERFORMANCES
1.00
0.85
0.80
12° MAX
SEATING PLANE
TOP
VIEW
6.75
BSC SQ
0.50
0.40
0.30
0.80 MAX
0.65 TYP
0.50 BSC
COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2
0.20 REF
0.05 MAX
0.02 NOM
25
24
COPLANARITY
0.08
BOTTOM
VIEW
5.50 REF
13
Figure 40. 48-Lead Frame Chip Scale Package (LFCSP) (CP-48)
Dimensions shown in millimeters

ORDERING GUIDE

Model Temperature Range Package Description Package Option
AD7653AST –40°C to +85°C Quad Flatpack (LQFP) ST-48 AD7653ASTRL –40°C to +85°C Quad Flatpack (LQFP) ST-48 AD7653ACP –40°C to +85°C Lead Frame Chip Scale (LFCSP) CP-48 AD7653ACPRL –40°C to +85°C Lead Frame Chip Scale (LFCSP) CP-48 EVAL-AD7653CB EVAL-CONTROL BRD2
1
This board can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL BRD2 for evaluation/demonstration purposes.
2
This board allows a PC to control and communicate with all Analog Devices evaluation boards ending in the CB designators.
1
2
Evaluation Board Controller Board
Rev. A | Page 26 of 28
Page 27
AD7653
NOTES
Rev. A | Page 27 of 28
Page 28
AD7653
NOTES
© 2003 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.
C02966–0–9/03(A)
Rev. A | Page 28 of 28
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