1.5 MSPS (normal mode)
INL: ±0.5 LSB typical, ±1.5 LSB maximum (±23 ppm of FSR)
16-bit resolution with no missing codes
Dynamic range: 92.5 dB typical
SINAD: 91 dB minimum @ 20 kHz (V
THD: −115 dB typical @ 20 kHz (V
2.048 V internal reference: typical drift
Differential input range: ±V
REF
(V
No pipeline delay (SAR architecture)
Parallel (16-, or 8-bit bus) and serial 5 V/3.3 V/2.5 V interface
SPI®/QSPI™/MICROWIRE™/DSP compatible
Single 2.5 V supply operation
Power dissipation
70 mW typical @ 2 MSPS with internal REF
2 μW in power-down mode
Pb-free, 48-lead LQFP and 48-lead LFCSP_VQ
Pin compatible with other PulSAR 48-lead ADCs
APPLICATIONS
Medical instruments
High speed data acquisition/high dynamic data acquisition
Digital signal processing
Spectrum analysis
Instrumentation
Communications
AT E
GENERAL DESCRIPTION
The AD7622 is a 16-bit, 2 MSPS, charge redistribution SAR,
fully differential, analog-to-digital converter (ADC) that
operates from a single 2.5 V power supply. The part contains a
high speed, 16-bit sampling ADC, an internal conversion clock,
an internal reference (and buffer), error correction circuits, and
both serial and parallel system interface ports. It features two
very high sampling rate modes (wideband warp and warp) and
a fast mode (normal) for asynchronous rate applications. The
AD7622 is hardware factory calibrated and tested to ensure ac
parameters, such as signal-to-noise ratio (SNR), in addition to
the more traditional dc parameters of gain, offset, and linearity.
The AD7622 is available in Pb-free only packages with
operation specified from −40°C to +85°C.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Output Voltage REF @ 25°C 2.038 2.048 2.058 V
Temperature Drift −40°C to +85°C ±8 ppm/°C
Line Regulation AVDD = 2.5 V ± 5% ±15 ppm/V
Turn-On Settling Time C
REF
= 2.5 V; all specifications T
REF
− V
IN−
, V
to AGND −0.1 AVDD
IN−
to T
= −40°C to +85°C −1.5 ±0.5 +1.5 LSB
MAX
MIN
−V
to T
REF
, unless otherwise noted.
MAX
+V
REF
1
V
V
= 2.5 V 0.5 LSB
= 2.048 V 0.6 LSB
= 2.5 V 91.5 92.5 dB
= 2.5 V 91 92 dB
REF
= 2.048 V 89.5 90.5 dB
REF
= 2.5 V 91 dB
REF
= 2.5 V 117 dB
REF
= 2.048 V 110 dB
REF
= 2.5 V 101 dB
REF
= 2.5 V −115 dB
REF
= 2.048 V −109 dB
REF
= 2.5 V −100 dB
REF
= 2.5 V 91 92 dB
REF
= 2.048 V 89.5 90.5 dB
REF
= 2.5 V 91 dB
REF
= 10 μF 5 ms
4
6
Rev. 0 | Page 3 of 28
Page 4
AD7622
Parameter Conditions Min Typ Max Unit
REFBUFIN Output Voltage REFBUFIN @ 25°C 1.19 V
REFBUFIN Output Resistance 6.33 kΩ
EXTERNAL REFERENCE PDREF = PDBUF = high
Voltage Range REF 1.8 2.5 AVDD + 0.1 V
Current Drain 2 MSPS throughput 150 μA
REFERENCE BUFFER PDREF = high, PDBUF = low
REFBUFIN Input Voltage Range REF = 2.048 V typ 1.05 1.2 1.30 V
REFBUFIN Input Current REFBUFIN = 1.2 V 1 nA
TEMPERATURE PIN
Voltage Output @ 25°C 278 mV
Temperature Sensitivity 1 mV/°C
Output Resistance 4.7 kΩ
DIGITAL INPUTS
Logic Levels
V
IL
V
IH
I
IL
I
IH
DIGITAL OUTPUTS
Data Format7
Pipeline Delay
V
OL
V
OH
8
POWER SUPPLIES
Specified Performance
AVDD 2.37 2.5 2.63 V
DVDD 2.37 2.5 2.63 V
OVDD 2.30
Operating Current
11
AVD D
10
AVDD Without internal reference 23 mA
DVDD 2.5 mA
12
OVDD
Power Dissipation
With Internal Reference
Without Internal Reference
In Power-Down Mode
TEMPERATURE RANGE
11
10
10
12
13
Specified Performance T
1
When using an external reference. With the internal reference, the input range is −0.1 V to V
2
See Analog Inputs section.
3
Linearity is tested using endpoints, not best fit.
4
LSB means least significant bit. With the ±2.048 V input range, 1 LSB is 62.5 μV.
5
See Voltage Reference Input section. These specifications do not include the error contribution from the external reference.
6
All specifications in dB are referred to a full-scale input FS. Tested with an input signal at 0.5 dB below full-scale, unless otherwise specified.
7
Parallel or serial 16-bit.
8
Conversion results are available immediately after completed conversion.
9
See the Absolute Maximum Ratings section.
10
In wideband and warp modes. Tested in parallel reading mode.
11
With internal reference, PDREF and PDBUF are low; without internal reference, PDREF and PDBUF are high.
12
With all digital inputs forced to OVDD.
13
Consult sales for extended temperature range.
−0.3 +0.6 V
1.7 5.25 V
−1 +1 μA
−1 +1 μA
I
= 500 μA 0.4 V
SINK
I
= −500 μA OVDD − 0.3 V
SOURCE
9
3.6 V
2 MSPS throughput
With internal reference 24 mA
CONVERSION AND RESET (Refer to Figure 31 and Figure 32)
Convert Pulse Width t
Time Between Conversions (Warp Mode2/Normal Mode3) t
CNVST
Low to BUSY High Delay
BUSY High All Modes (Except Master Serial Read After Convert)
Warp Mode/Normal Mode t
Aperture Delay t
End of Conversion to BUSY Low Delay t
Conversion Time (Warp Mode/Normal Mode) t
Acquisition Time (Warp Mode/Normal Mode) t
RESET Pulse Width t
RESET Low to BUSY High Delay
BUSY High Time from RESET Low
4
4
PARALLEL INTERFACE MODES (Refer to Figure 33 to Figure 36 )
CNVST
Low to Data Valid Delay (Warp Mode/Normal Mode)
Data Valid to BUSY Low Delay t
Bus Access Request to Data Valid t
Bus Relinquish Time t
MASTER SERIAL INTERFACE MODES5 (Refer to Figure 37 and Figure 38)
CS
Low to SYNC Valid Delay
CS
Low to Internal SCLK Valid Delay
CS
Low to SDOUT Delay
CNVST
Low to SYNC Delay (Warp Mode/Normal Mode)
5
SYNC Asserted to SCLK First Edge Delay t
Internal SCLK Period
Internal SCLK High
Internal SCLK Low
SDOUT Valid Setup Time
SDOUT Valid Hold Time
SCLK Last Edge to SYNC Delay
CS
High to SYNC HI-Z
CS
High to Internal SCLK HI-Z
CS
High to SDOUT HI-Z
6
6
6
6
6
6
BUSY High in Master Serial Read After Convert
CNVST
Low to SYNC Asserted Delay (Warp Mode/Normal Mode)
SYNC Deasserted to BUSY Low Delay t
SLAVE SERIAL INTERFACE MODES (Refer to Figure 40 and Figure 41)
External SCLK Setup Time t
External SCLK Active Edge to SDOUT Delay t
SDIN Setup Time t
SDIN Hold Time t
External SCLK Period t
External SCLK High t
External SCLK Low t
All timings for wideband warp mode are the same as warp mode.
3
In warp mode only, the maximum time between conversions is 1 ms; otherwise, there is no required maximum time.
4
See the Digital Interface section and the RESET section.
5
In serial interface modes, the SYNC, SCLK, and SDOUT timings are defined with a maximum load CL of 10 pF; otherwise, the load is 60 pF maximum.
6
In serial master read during convert mode. See Table 4 for serial master read after convert mode timing specifications.
Table 4. Serial Clock Timings in Master Read After Convert Mode
DIVSCLK[1] 0 0 1 1
DIVSCLK[0] Symbol 0 1 0 1 Unit
SYNC to SCLK First Edge Delay Minimum t
Internal SCLK Period Minimum t
Internal SCLK Period Maximum t
Internal SCLK High Minimum t
Internal SCLK Low Minimum t
SDOUT Valid Setup Time Minimum t
SDOUT Valid Hold Time Minimum t
SCLK Last Edge to SYNC Delay Minimum t
NOTE
IN SERIAL INT ERFACE MODES, THE S YNC, SCLK, AND
SDOUT TI MING ARE DEFINED WIT H A MAXIMUM LOAD
OF 10pF; OTHERWISE, THE LOAD IS 60pF MAXIMUM.
C
L
OL
1.4V
OH
Figure 3. Load Circuit for Digital Interface Timing,
SDOUT, SYNC, and SCLK Outputs, C
= 10 pF
L
0.8V
t
DELAY
2V
0.8V
6023-002
Figure 4. Voltage Reference Levels for Timing
2V
t
DELAY
2V
0.8V
6023-003
Rev. 0 | Page 6 of 28
Page 7
AD7622
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
Analog Inputs/Outputs
IN+1, IN−, REF, REFBUFIN, TEMP,
INGND, REFGND to AGND
AVDD + 0.3 V to
AGND − 0.3 V
Ground Voltage Differences
AGND, DGND, OGND ±0.3 V
Supply Voltages
AVDD, DVDD −0.3 V to +2.7 V
OVDD −0.3 V to +3.8 V
AVDD to DVDD ±2.8 V
AVDD, DVDD to OVDD −3.8 V to +2.8 V
Digital Inputs −0.3 V to +5.5 V
PDREF, PDBUF
Internal Power Dissipation
Internal Power Dissipation
2
3
4
±20 mA
700 mW
2.5 W
Junction Temperature 125°C
Storage Temperature Range –65°C to +125°C
1
See Analog Inputs section.
2
See Voltage Reference Input section.
3
Specification is for the device in free air:
48-Lead LQFP; θJA = 91°C/W, θJC = 30°C/W.
4
Specification is for the device in free air:
48-Lead LFCSP; θJA = 26°C/W.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 7 of 28
Page 8
AD7622
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
PDBUF
PDREF
REFBUFIN
TEMP
AVD D
IN+
AGND
AGNDNCIN–
REFGND
48 47 46 45 4439 38 3743 42 41 40
1
AGND
AVD D
DGND
BYTESWAP
OB/2C
WAR P
NORMAL
SER/PAR
D0
D1
D2/DIVSCL K[0]
D3/DIVSCL K[1]
NC = NO CONNECT
PIN 1
IDENTIFIER
2
3
4
5
6
7
8
9
10
11
12
13 14 15 16 17 18 19 20 21 22 23 24
D4/EXT/INT
D6/INVSCLK
D5/INVSYNC
AD7622
TOP VIEW
(Not to Scale)
DVDD
OVDD
OGND
D7/RDC/SDIN
Figure 5. Pin Configuration
Table 6. Pin Function Descriptions
Pin
No.
1, 36,
Mnemonic Type
AGND P Analog Power Ground.
1
Description
41, 42
2, 44 AVDD P Input Analog Power Pins. Nominally 2.5 V.
3 DGND P Digital Power Ground.
4 BYTESWAP DI
Parallel Mode Selection (8-Bit/16-Bit). When high, the LSB is output on D[15:8] and the MSB is output
on D[7:0]; when low, the LSB is output on D[7:0] and the MSB is output on D[15:8].
5
OB/
2C
DI
Straight Binary/Binary Twos Complement Output. When high, the digital output is straight binary;
when low, the MSB is inverted resulting in a twos complement output from its internal shift register.
6 WARP DI
Conversion Mode Selection. When WARP = high and
mode with slightly improved linearity and THD. When WARP = high and
warp mode. In either mode, these are the fastest modes; maximum throughput is achievable, and
a minimum conversion rate must be applied to guarantee full specified accuracy.
7
NORMAL
DI
Conversion Mode Selection. When
NORMAL = low and WARP = low, this input selects normal mode
where full accuracy is maintained independent of the minimum conversion rate.
8
SER/
PA R
DI/O Serial/Parallel Selection Input.
When SER/
PA R = high, the serial interface is selected and some bits of the data bus are used as a
serial port; the remaining data bits are high impedance outputs.
9, 10 D[0:1] DO
When SER/
Bit 0 and Bit 1 of the Parallel Port Data Output Bus. These pins are always outputs, regardless of
PA R = low, the parallel port is selected.
the interface mode.
11, 12 D[2:3] DI/O
or DIVSCLK[0:1]
When SER/
When SER/
(EXT/
PA R = low, these outputs are used as Bit 2 and Bit 3 of the parallel port data output bus.
PA R = high, serial clock division selection. When using serial master read after convert mode
INT = low, RDC/SDIN = low), these inputs can be used to slow down the internally generated
serial clock that clocks the data output. In other serial modes, these pins are high impedance outputs.
13 D4 DI/O
or EXT/
INT
When SER/
When SER/
PA R = low, this output is used as Bit 4 of the parallel port data output bus.
PA R = high, serial clock source select. This input is used to select the internally generated
(master) or external (slave) serial data clock.
When EXT/
When EXT/
INT = low, master mode. The internal serial clock is selected on SCLK output.
INT = high, slave mode. The output data is synchronized to an external clock signal,
gated by CS, connected to the SCLK input.
DGND
REF
36
AGND
CNVST
35
34
PD
33
RESET
32
CS
31
RD
30
DGND
29
BUSY
28
D15
27
D14
26
D13
25
D12
D9/SCLK
D10/SYNC
D8/SDOUT
06023-004
D11/RDERROR
NORMAL = high, this selects wideband warp
NORMAL = low, this selects
Rev. 0 | Page 8 of 28
Page 9
AD7622
Pin
No. Mnemonic Type
14 D5 DI/O
or INVSYNC
15 D6 DI/O
or INVSCLK
16 D7 DI/O
or RDC
or SDIN
17 OGND P Input/Output Interface Digital Power Ground.
18 OVDD P
19 DVDD P Digital Power. Nominally at 2.5 V.
20 DGND P Digital Power Ground.
21 D8 DO
or SDOUT
22 D9 DI/O
or SCLK
23 D10 DO
or SYNC
24 D11 DO
or RDERROR
25 to
D[12:15] DO
28
29 BUSY DO
30 DGND P Digital Power Ground.
1
Description
When SER/
When SER/
PA R = low, this output is used as Bit 5 of the parallel port data output bus.
PA R = high, invert sync select. In serial master mode (EXT/INT = low), this input is used
to select the active state of the SYNC signal.
When INVSYNC = low, SYNC is active high.
When INVSYNC = high, SYNC is active low.
When SER/
When SER/
PA R = low, this output is used as Bit 6 of the parallel port data output bus.
PA R] = high, invert SCLK select. In all serial modes, this input is used to
invert the SCLK signal.
When SER/
When SER/
PA R = low, this output is used as bit 7 of the parallel port data output bus.
PA R = high, read during convert. When using serial master mode (EXT/INT = low),
RDC is used to select the read mode.
When RDC = high, the previous conversion result is output on SDOUT during conversion and
the period of SCLK changes (see the
Master Serial Interface section).
When RDC = low (read after convert), the current result can be output on SDOUT only when
the conversion is complete.
When SER/
PA R = low, serial data in. When using serial slave mode, (EXT/INT = high), SDIN could be
used as a data input to daisy-chain the conversion results from two or more ADCs onto a single
SDOUT line. The digital data level on SDIN is output on SDOUT with a delay of 16 SCLK periods after
the initiation of the read sequence. If not used, connect to OVDD or OGND.
Input/Output Interface Digital Power. Nominally at the same supply as the supply of the
host interface (2.5 V or 3 V).
When SER/
When SER/
PA R = low, this output is used as Bit 8 of the parallel port data output bus.
PA R = high, serial data output. In serial mode, this pin is used as the serial data output
synchronized to SCLK. Conversion results are stored in an on-chip register. The AD7622 provides the
conversion result, MSB first, from its internal shift register. The data format is determined by the logic
level of OB/2C.
In master mode, EXT/
In slave mode, EXT/
INT = low, SDOUT is valid on both edges of SCLK.
INT = high:
When INVSCLK = low, SDOUT is updated on SCLK rising edge and valid on the next falling edge.
When INVSCLK = high, SDOUT is updated on SCLK falling edge and valid on the next rising edge.
When SER/
When SER/
data clock input or output, depending upon the logic state of the EXT/
PA R = low, this output is used as Bit 9 of the parallel port data output bus.
PA R = high, serial clock. In all serial modes, this pin is used as the serial
INT pin. The active edge
where the data SDOUT is updated, depends on the logic state of the INVSCLK pin.
When SER/
When SER/
PA R = low, this output is used as Bit 10 of the parallel port data output bus.
PA R = high, frame synchronization. In serial master mode (EXT/INT= low),
this output is used as a digital output frame synchronization for use with the internal data clock.
When a read sequence is initiated and INVSYNC = low, SYNC is driven high and remains high
while SDOUT output is valid.
When a read sequence is initiated and INVSYNC = high, SYNC is driven low and remains low
while SDOUT output is valid.
When SER/
When SER/
PA R = low, this output is used as Bit 11 of the parallel port data output bus.
PA R = high, read error. In serial slave mode (EXT/INT = high), this output
is used as an incomplete read error flag. If a data read is started and not completed when the
current conversion is complete, the current data is lost and RDERROR is pulsed high.
Bit 12 to Bit 15 of the parallel port data output bus. These pins are always outputs, regardless of
the interface mode.
Busy Output. Transitions high when a conversion is started and remains high until the conversion
is complete and the data is latched into the on-chip shift register. The falling edge of BUSY can be
used as a data-ready clock signal.
2
2
Rev. 0 | Page 9 of 28
Page 10
AD7622
Pin
No. Mnemonic Type
31
RD
DI
1
Description
Read Data. When
CS and RD are both low, the interface parallel or serial output bus is enabled.
32
CS
33 RESET DI
DI
Chip Select. When
CS
is also used to gate the external clock in slave serial mode.
CS and RD are both low, the interface parallel or serial output bus is enabled.
Reset Input. When high, resets the AD7622. Current conversion, if any, is aborted. Falling edge of
RESET enables the calibration mode indicated by pulsing BUSY high. Refer to the
RESET section.
If not used, this pin can be tied to DGND.
34 PD DI
Power-Down Input. When high, power downs the ADC. Power consumption is reduced and
conversions are inhibited after the current one is completed.
35
CNVST
DI
Conversion Start. A falling edge on
CNVST puts the internal sample-and-hold into the hold state
and initiates a conversion.
37 REF AI/O Reference Output/Input.
When PDREF/PDBUF = low, the internal reference and buffer are enabled producing 2.048 V on this pin.
When PDREF/PDBUF = high, the internal reference and buffer are disabled allowing an externally
supplied voltage reference up to AVDD volts. Decoupling is required with or without the internal
reference and buffer. Refer to the
Voltage Reference Input section.
38 REFGND AI Reference Input Analog Ground.
39 IN− AI Differential Negative Analog Input.
40 NC No Connect.
43 IN+ AI Differential Positive Analog Input.
45 TEMP AO
Temperature Sensor Analog Output. Normally, 278 mV @ 25°C with a temperature coefficient of
1 mV/°C. This pin can be used to measure the temperature of the AD7622. See the
Temperature Sensor section.
When PDREF/PDBUF = low, the internal reference and buffer are enabled producing the 1.2 V (typical)
band gap output on this pin, which needs external decoupling. The internal fixed gain reference
buffer uses this to produce 2.048 V on the REF pin.
When using an external reference with the internal reference buffer (PDBUF = low, PDREF = high),
applying 1.2 V on this pin produces 2.048 V on the REF pin. Refer to the
Voltage Reference Input section.
47 PDREF DI Internal Reference Power-Down Input.
When low, the internal reference is enabled.
When high, the internal reference is powered down and an external reference must been used.
48 PDBUF DI Internal Reference Buffer Power-Down Input.
When low, the buffer is enabled (must be low when using internal reference).
When high, the buffer is powered-down.
1
AI = analog input; AI/O = bidirectional analog; AO = analog output; DI = digital input; DI/O = bidirectional digital; DO = digital output; P = power.
2
With an SCLK period ≥ (2 × t32). With an SCLK period < (2 × t32), SDOUT is valid on the next rising edge with INVSCLK = low and next falling edge with INVSCLK = high.
Rev. 0 | Page 10 of 28
Page 11
AD7622
TERMINOLOGY
Integral Nonlinearity Error (INL)
Linearity error refers to the deviation of each individual code
from a line drawn from negative full scale through positive full
scale. The point used as negative full scale occurs ½ LSB before
the first code transition. Positive full scale is defined as a level
1½ LSB beyond the last code transition. The deviation is
measured from the middle of each code to the true straight line.
Differential Nonlinearity Error (DNL)
In an ideal ADC, code transitions are 1 LSB apart. Differential
nonlinearity is the maximum deviation from this ideal value. It
is often specified in terms of resolution for which no missing
codes are guaranteed.
Gain Error
The first transition (from 000…00 to 000…01) should occur for
an analog voltage ½ LSB above the nominal negative full scale
(−2.0479688 V for the ±2.048 V range). The last transition
(from 111…10 to 111…11) should occur for an analog voltage
1½ LSB below the nominal full scale (+2.0479531 V for the
±2.048 V range). The gain error is the deviation of the
difference between the actual level of the last transition and the
actual level of the first transition from the difference between
the ideal levels.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first five harmonic
components to the rms value of a full-scale input signal and is
expressed in decibels.
Signal to (Noise + Distortion) Ratio (SINAD)
SINAD is the ratio of the rms value of the actual input signal to
the rms sum of all other spectral components below the Nyquist
frequency, including harmonics but excluding dc. The value for
SINAD is expressed in decibels.
Spurious-Free Dynamic Range (SFDR)
The difference, in decibels (dB), between the rms amplitude of
the input signal and the peak spurious signal.
Effective Number of Bits (ENOB)
ENOB is a measurement of the resolution with a sine wave
input. It is related to SINAD and is expressed in bits by
ENOB = [(SINADdB − 1.76)/6.02]
Aperture Delay
Aperture delay is a measure of the acquisition performance and
is measured from the falling edge of the
CNVST
input to when
the input signal is held for a conversion.
Zero Error
The zero error is the difference between the ideal midscale
input voltage (0 V) and the actual voltage producing the
midscale output code.
Dynamic Range
It is the ratio of the rms value of the full scale to the rms noise
measured with the inputs shorted together. The value for
dynamic range is expressed in decibels.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the actual input signal to the
rms sum of all other spectral components below the Nyquist
frequency, excluding harmonics and dc. The value for SNR is
expressed in decibels.
Transi ent Res p ons e
The time required for the AD7622 to achieve its rated accuracy
after a full-scale step function is applied to its input.
Reference Voltage Temperature Coefficient
It is derived from the typical shift of output voltage at 25°C on a
sample of parts maximum and minimum reference output
voltage (V ) measured at T, T(25°C), and T. It is
Figure 17. THD, Harmonics, and SFDR vs. Temperature
16.0
15.5
15.0
14.5
14.0
120
110
100
90
80
70
60
06023-014
ENOB (Bits)
06023-015
SFDR (dB)
06023-016
Rev. 0 | Page 13 of 28
Page 14
AD7622
93.0
92.5
SINAD
92.0
91.5
SNR, SINAD REFE RRED TO FULL SCALE (dB)
91.0
–60–50–40–30–20–100
SNR
INPUT LEVEL (dB)
Figure 18. SNR and SINAD vs. Input Level (Referred to Full Scale)
16
14
12
10
8
6
4
OPERATING CURRENTS (µA)
2
0
–55125
–35–155 25456585105
TEMPERATURE (° C)
DVDD
OVDD, 3.3V
OVDD, 2.5V
AVDD
Figure 19. Power-Down Operating Currents vs. Temperature
06023-017
06023-018
100k
AVDD
10k
1k
100
OVDD = 3.3V, ALL MO DES
10
1
OPERATING CURRENTS (µA)
0.1
0.01
1010M
1001k10k100k1M
OVDD = 2.5V, ALL MODE S
SAMPLING RATE (SPS)
DVDD
PDREF = PDBUF = HIGH
Figure 20. Operating Currents vs. Sample Rate
20
18
16
14
12
DELAY (ns)
12
10
t
8
6
4
OVDD = 2.5V @ 85°C
OVDD = 2.5V @ 2 5°C
4
50100150200
OVDD = 3.3V @ 25°C
OVDD = 3.3V @ 8 5°C
C
(pF)
L
Figure 21. Typical Delay vs. Load Capacitance C
06023-019
06023-020
L
Rev. 0 | Page 14 of 28
Page 15
AD7622
APPLICATIONS INFORMATION
IN+
MSB
32,768C 16,384C4C2CCC
REF
REFGND
32,768C 16,384C4C2CCC
MSB
IN–
Figure 22. ADC Simplified Schematic
CIRCUIT INFORMATION
The AD7622 is a very fast, low power, single-supply, precise
16-bit ADC using successive approximation architecture. The
AD7622 features different modes to optimize performances
according to the applications. In warp mode, the AD7622 is
capable of converting 2,000,000 samples per second (2 MSPS).
The AD7622 provides the user with an on-chip track-and-hold,
successive approximation ADC that does not exhibit any
pipeline or latency, making it ideal for multiple multiplexed
channel applications.
The AD7622 can operate from a single 2.5 V supply and
interface to either 5 V, 3.3 V, or 2.5 V digital logic. It is housed
in a 48-lead LQFP package or a tiny 48-lead LFCSP package,
which combines space savings with flexibility and allows the
AD7622 to be configured as either a serial or a parallel
interface. The AD7622 is pin-to-pin compatible with other
PulSAR ADC’s and is a speed upgrade of the
AD7677.
CONVERTER OPERATION
The AD7622 is a successive approximation ADC based on a
charge redistribution DAC.
schematic of the ADC. The capacitive DAC consists of two
identical arrays of 16 binary weighted capacitors that are
connected to the two comparator inputs.
During the acquisition phase, terminals of the array tied to the
comparator’s input are connected to AGND via SW+ and SW−.
All independent switches are connected to the analog inputs.
Therefore, the capacitor arrays are used as sampling capacitors
and acquire the analog signal on the IN+ and IN− inputs. A
conversion phase is initiated once the acquisition phase is complete
and the
CNVST
input goes low. When the conversion phase
begins, SW+ and SW− are opened first. The two capacitor
arrays are then disconnected from the inputs and connected to
the REFGND input. Therefore, the differential voltage between
the inputs (IN+ and IN−) captured at the end of the acquisition
phase is applied to the comparator inputs, causing the
Figure 22 shows the simplified
AGND
SWITCHES
COMP
CONTROL
CONTROL
LOGIC
CNVST
BUSY
OUTPUT
CODE
6023-021
LSB
LSB
SW+
SW–
AGND
comparator to become unbalanced. By switching each element
of the capacitor array between REFGND and REF, the comparator
input varies by binary weighted voltage steps (V
throughV
/65536). The control logic toggles these switches,
REF
REF
/2, V
REF
/4
starting with the MSB first, to bring the comparator back into a
balanced condition. After the completion of this process, the
control logic generates the ADC output code and brings BUSY
output low.
MODES OF OPERATION
The AD7622 features three modes of operations: wideband
warp, warp, and normal. Each of these modes is more suitable
for specific applications.
The wideband warp (WARP = high,
warp (WARP = high,
NORMAL
NORMAL
= low) modes allow the fastest
conversion rate of up to 2 MSPS. However, in these modes, the
full specified accuracy is guaranteed only when the time between
conversions does not exceed 1 ms. If the time between two
consecutive conversions is longer than 1 ms (for instance after
power-up), the first conversion result should be ignored. These
modes make the AD7622 ideal for applications where both high
accuracy and fast sample rates are required. Wideband warp
mode offers slightly improved linearity and THD over warp mode.
Normal mode (
NORMAL
= low, WARP = low) is the fastest
mode (1.5 MSPS) without any limitation on time between
conversions. This mode makes the AD7622 ideal for
asynchronous applications, such as data acquisition systems,
where both high accuracy and fast sample rates are required.
= high) and
Rev. 0 | Page 15 of 28
Page 16
AD7622
TRANSFER FUNCTIONS
Using the OB/2C digital input, the AD7622 offers two output
codings: straight binary and twos complement. The LSB size
with V
Figure 23 and Tabl e 7 for the ideal transfer characteristic.
This is also the code for overrange analog input (V
+V
− V
+ V
REFGND
REFGND
).
).
10µF
REF
2
This is also the code for underrange analog input (V
−V
REF
DIGITAL
DIGITAL
INTERFACE
SUPPLY
(2.5V OR 3.3V)
2
− V
IN+
IN−
− V
IN+
Two s
Complement
1
0x7FFF
2
0x8000
above
below
IN−
AVDD
AGND DGNDDVDD OVDDOGND
REF
C
REF
10µF
100nF
NOTE 4
NOTE 2
ANALOG
INPUT +
ANALOG
INPUT –
1. SEE ANALOG I NPUTS SECT ION.
2. THE AD8021 IS RECOM MENDED. SEE DRIVER AMPLIFIER CHO ICE SECTI ON.
3. THE CONFIG URATION SHO WN IS USI NG THE INT ERNAL REFE RENCE. SEE VOLTAGE REFERENCE INPUT SECTION.
4. A 10µF CERAMIC CAP ACITOR ( X5R, 1206 SIZ E) IS RECO MMENDED (F OR EXAMPL E, PANASONIC ECJ3YB0J106M).
SEE VOLTAGE REFERENCE INPUT SECTION.
5. OPTION, SEE POWER SUPPLY SECTION.
6. OPTION, SEE POWER-UP SECTION.
7. OPTIONAL LOW JI TTER CNVST , SEE CO NVERSION CO NTROL S ECTION.
U1
C
NOTE 2
U2
C
15Ω
2.7nF
C
NOTE 1
15Ω
2.7nF
C
NOTE 1
REFBUFIN
REFGND
IN+
IN–
NOTE 3
PD
AD7622
NOTE 3
PDREF
PDBUF
SCLK
SDOUT
BUSY
CNVST
OB/2C
SER/PAR
WARP
NORMAL
RESET
Figure 24. Typical Connection Diagram
CS
RD
50Ω
50pF
50pF
10kΩ
NOTE 6
SERIAL
PORT
NOTE 7
OVDD
D
CLOCK
MICROCONVERTER/
MICROPROCESSOR/
DSP
06023-023
Rev. 0 | Page 16 of 28
Page 17
AD7622
A
V
–
TYPICAL CONNECTION DIAGRAM
Figure 24 shows a typical connection diagram for the AD7622.
Different circuitry shown in this diagram is optional and is
discussed in the following sections.
ANALOG INPUTS
Figure 25 shows an equivalent circuit of the input structure of
the AD7622.
The two diodes, D
analog inputs IN+ and IN−. Care must be taken to ensure that
the analog input signal never exceeds the supply rails by more
than 0.3 V, because this causes the diodes to become forwardbiased and to start conducting current. These diodes can handle
a forward-biased current of 100 mA maximum. For instance,
these conditions could eventually occur when the input buffer’s
U1 or U2 supplies are different from AVDD. In such a case, an
input buffer with a short-circuit current limitation can be used
to protect the part.
IN+ OR IN–
AGND
The analog input of the AD7622 is a true differential structure.
By using this differential input, small signals common to both
inputs are rejected, as shown in
typical CMRR over frequency with internal and external references.
75
70
65
60
CMRR (dB)
55
50
45
110000
During the acquisition phase for ac signals, the impedance of
the analog inputs, IN+ and IN−, can be modeled as a parallel
combination of capacitor C
series connection of R
capacitance. R
comprised of some serial resistors and the on resistance of the
and D2, provide ESD protection for the
1
DD
D
1
C
PIN
D
2
C
R
IN
IN
Figure 25. AD7622 Simplified Analog Input
Figure 26, representing the
EXT REF
INT REF
101001000
FREQUENCY (kHz)
Figure 26. Analog Input CMRR vs. Frequency
and the network formed by the
PIN
and CIN. C
IN
is typically 175 Ω and is a lumped component
IN
is primarily the pin
PIN
06023-024
06023-025
switches. C
capacitor. During the conversion phase, when the switches are
opened, the input impedance is limited to C
make a 1-pole, low-pass filter that has a typical −3 dB cutoff
frequency of 50 MHz, thereby reducing an undesirable aliasing
effect and limiting the noise coming from the inputs.
Because the input impedance of the AD7622 is very high, the
AD7622 can be directly driven by a low impedance source
without gain error. To further improve the noise filtering achieved
by the AD7622’s analog input circuit, an external 1-pole RC
filter between the amplifier’s outputs and the ADC analog
inputs can be used, as shown in
impedances significantly affect the ac performance, especially
the total harmonic distortion (THD). The maximum source
impedance depends on the amount of THD that can be
tolerated. The THD degrades as a function of the source
impedance and the maximum input frequency, as shown in
Figure 27.
THD (dB)
Figure 27. THD vs. Analog Input Frequency and Source Resistance
MULTIPLEXED INPUTS
When using the full 2 MSPS throughput in multiplexed
applications for a full-scale step, the RC filter, as shown in
Figure 24, does not settle in the required acquisition time, t8.
These values are chosen to optimize the best SNR performance
of the AD7622. To use the full 2 MSPS throughput in multiplexed
applications, the RC should be adjusted to satisfy t
~ 7 × RC time constant). However, lowering R and C increases
the RC filter bandwidth and allows more noise into the AD7622,
which degrades SNR. To preserve the SNR performance in these
applications using the RC filter shown in
should be run with t
1.55 MSPS in wideband and warp modes.
is typically 12 pF and is mainly the ADC sampling
IN
. RIN and CIN
PIN
Figure 24. However, large source
60
–65
–70
–75
–80
–85
–90
–95
–100
–105
11000
RS = 500Ω
R
= 50Ω
R
S
= 15Ω
R
S
10100
INPUT FREQ UENCY (kHz)
= 100Ω
S
Figure 24, the AD7622
> 280 ns; or approximately 1/(t7 + t8) ~
8
(which is
8
06023-026
Rev. 0 | Page 17 of 28
Page 18
AD7622
(
DRIVER AMPLIFIER CHOICE
Although the AD7622 is easy to drive, the driver amplifier
needs to meet the following requirements:
• For multichannel, multiplexed applications, the driver
amplifier and the AD7622 analog input circuit must be
able to settle for a full-scale step of the capacitor array at an
16-bit level (0.0015%). In the amplifier’s data sheet, settling
at 0.1% to 0.01% is more commonly specified. This could
differ significantly from the settling time at a 16-bit level
and should be verified prior to driver selection. The
AD8021 op amp, which combines ultralow noise and high
gain bandwidth, meets this settling time requirement even
when used with gains up to 13.
• The noise generated by the driver amplifier needs to be
kept as low as possible to preserve the SNR and transition
noise performance of the AD7622. The noise coming from
the driver is filtered by the AD7622 analog input circuit
1-pole, low-pass filter made by R
external filter, if one is used. The SNR degradation due
to the amplifier is
⎛
⎜
SNR
LOSS
=
20log
⎜
⎜
⎜
⎜
⎝
45
f
π
−
where:
f
is the input bandwidth of the AD7622 (50 MHz) or
–3dB
the cutoff frequency of the input RC filter shown in
(3.9 MHz), if one is used.
N is the noise factor of the amplifier (1 in buffer
configuration).
and eN− are the equivalent input voltage noise densities
e
N+
of the op amps connected to IN+ and IN−, in nV/√Hz.
This approximation can be used when the resistances used
around the amplifier are small. If larger resistances are
used, their noise contributions should also be root-sum
squared.
For instance, when using op amps with an equivalent input
noise density of 2.1 nV/√Hz, such as the
noise gain of 1 when configured as a buffer, degrades the
SNR by only 0.1 dB when using the RC filter in
and by 1.3 dB without it.
• The driver needs to have a THD performance suitable to
that of the AD7622.
Figure 14 gives the THD vs. frequency
that the driver should exceed.
and CIN or by the
IN
45
f
π
−
3dB
()()
Ne
+
N
2
3dB
++
2
Ne
222
−
N
Figure 24
AD8021, with a
Figure 24,
⎞
⎟
⎟
⎟
⎟
⎟
⎠
The AD8021 meets these requirements and is appropriate for
almost all applications. The
AD8021 needs a 10 pF external
compensation capacitor that should have good linearity as an
NPO ceramic or mica type. Moreover, the use of a noninverting
1 gain arrangement is recommended and helps to obtain the
best signal-to-noise ratio.
AD8022 can also be used when a dual version is needed
The
and a gain of 1 is present. The
AD829 is an alternative in
applications where high frequency (above 100 kHz) performance is
not required. In applications with a gain of 1, an 82 pF
compensation capacitor is required. The
AD8610 is an option
when low bias current is needed in low frequency applications.
Refer to
Table 8 for some recommended op amps.
Table 8. Recommended Driver Amplifiers
Amplifier Typical Application
ADA4841-x
Very low noise, low distortion, low power,
low frequency
AD829Very low noise, low frequency
AD8021Very low noise, high frequency
AD8022Very low noise, high frequency, dual
AD8610/AD8620Low bias current, low frequency, single/dual
Single-to-Differential Driver
For applications using unipolar analog signals, a single-endedto-differential driver, as shown in
Figure 28, allows for a
differential input into the part. This configuration, when
provided an input signal of 0 to V
±V
with midscale at V
REF
/2. The 1-pole filter using R = 15 Ω
REF
, produces a differential
REF
and C = 2.7nF provides a corner frequency of 3.9 MHz.
The AD7622 allows the choice of either a very low temperature
drift internal voltage reference, an external 1.2 V reference that
can be buffered using the internal reference buffer, or an
external reference.
Unlike many ADCs with internal references, the internal
reference of the AD7622 provides excellent performance and
can be used in almost all applications.
Internal Reference (PDBUF = Low, PDREF = Low)
To use the internal reference, the PDREF and PDBUF inputs
must both be low. This produces a 1.2 V band gap output on
REFBUFIN, which is amplified by the internal buffer and
results in a 2.048 V reference on the REF pin.
The internal reference is temperature compensated to 2.048 V ±
10 mV. The reference is trimmed to provide a typical drift of
8 ppm/°C. This typical drift characteristic is shown in
The output resistance of REFBUFIN is 6.33 kΩ (minimum)
when the internal reference is enabled. It is necessary to
decouple this with a ceramic capacitor greater than 100 nF.
Therefore, the capacitor provides an RC filter for noise reduction.
Because the output impedance of REFBUFIN is typically
6.33 kΩ, relative humidity (among other industrial contaminates)
can directly affect the drift characteristics of the reference.
Typically, a guard ring is used to reduce the effects of drift
under such circumstances. However, because the AD7622 has a
fine lead pitch, guarding this node is not practical. Therefore, in
these industrial and other types of applications, it is recommended
to use a conformal coating, such as Dow Corning® 1-2577 or
HumiSeal® 1B73.
External 1.2 V Reference and Internal Buffer (PDBUF =
Low, PDREF = High)
To use an external reference along with the internal buffer,
PDREF should be high and PDBUF should be low. This powers
down the internal reference and allows an external 1.2 V
reference to be applied to REFBUFIN, producing 2.048 V
(typically) on the REF pin.
External 2.5 V Reference (PDBUF = High, PDREF = High)
To use an external 2.5 V reference directly on the REF pin,
PDREF and PDBUF should both be high.
For improved drift performance, an external reference, such as
the
AD780, ADR421, ADR431, or ADR441, can be used.
Figure 8.
The advantages of directly using the external voltage reference are:
• The SNR and dynamic range improvement (about 1.7 dB)
resulting from the use of a reference voltage very close to
the supply (2.5 V) instead of a typical 2.048 V reference
when the internal reference is used. This is calculated by
048.2
=
• The power savings when the internal reference is powered
down (PDREF high).
PDREF and PDBUF power down the internal reference and
the internal reference buffer, respectively. The input current
of PDREF and PDBUF should never exceed 20 mA. This can
occur when the driving voltage is above AVDD (for instance, at
power-up). In this case, a 125 Ω series resistor is recommended.
⎜
⎝
⎛
log20SNR
⎞
⎟
50.2
⎠
Reference Decoupling
Whether using an internal or external reference, the AD7622
voltage reference input (REF) has a dynamic input impedance;
therefore, it should be driven by a low impedance source with
efficient decoupling between the REF and REFGND inputs.
This decoupling depends on the choice of the voltage reference
but usually consists of a low ESR capacitor connected to REF
and REFGND with minimum parasitic inductance. A 10 μF
(X5R, 1206 size) ceramic chip capacitor (or 47 μF tantalum
capacitor) is appropriate when using either the internal
reference or one of the recommended reference voltages.
The placement of the reference decoupling is also important to
the performance of the AD7622. The decoupling capacitor
should be mounted on the same side as the ADC right at the
REF pin with a thick PCB trace. The REFGND should also connect
to the reference decoupling capacitor with the shortest distance.
For applications that use multiple AD7622 devices, it is more
effective to use an external reference with the internal reference
buffer to buffer the reference voltage. However, because the
reference buffers are not unity gain, ratiometric, simultaneously
sampled designs should use an external reference and external
buffer, such as the
same reference level for all converters.
The voltage reference temperature coefficient (TC) directly
impacts full scale; therefore, in applications where full-scale
accuracy matters, care must be taken with the TC. For instance,
a ±15 ppm/°C TC of the reference changes full scale by ±1 LSB/°C.
Note that V
input range is defined in terms of V
increase the range to 0 V to 2.8 V with an AVDD = 2.7 V.
AD8031/AD8032; therefore, preserving the
can be increased to AVDD + 0.1 V. Because the
REF
, this would essentially
REF
Rev. 0 | Page 19 of 28
Page 20
AD7622
Temperature Sensor
The TEMP pin measures the temperature of the AD7622. To
improve the calibration accuracy over the temperature range,
the output of the TEMP pin is applied to one of the inputs of
the analog switch (such as,
ADG779), and the ADC itself is
used to measure its own temperature. This configuration is
shown in
Figure 29.
ANALOG I NPUT
(UNIPOLAR)
IN+
TEMP
AD7622
TEMPERATURE
SENSOR
ADG779
AD8021
Figure 29. Use of the Temperature Sensor
C
C
06023-027
POWER SUPPLY
The AD7622 uses three sets of power supply pins: an analog
2.5 V supply AVDD, a digital 2.5 V core supply DVDD, and a
digital input/output interface supply OVDD. The OVDD supply
allows direct interface with any logic working between 2.3 V
and 5.25 V. To reduce the number of supplies needed, the digital
core (DVDD) can be supplied through a simple RC filter from
the analog supply, as shown in
Figure 24.
A simple power-on reset circuit, as shown in
used to minimize the digital interface. As OVDD powers up, the
capacitor is shorted and brings RESET high; it is then charged
returning RESET to low. However, this circuit only works when
powering up the AD7622 because the power-down mode
(PD = high) does not power down any of the supplies and as a
result, RESET is low.
It should be noted that the digital interface remains active even
during the acquisition phase. To reduce the operating digital
supply currents even further, drive the digital inputs close to
the power rails (that is, OVDD and OGND).
CONVERSION CONTROL
The AD7622 is controlled by the
CNVST
on
is all that is necessary to initiate a conversion.
Detailed timing diagrams of the conversion process are shown
in
Figure 31. Once initiated, it cannot be restarted or aborted,
even by the power-down input, PD, until the conversion is
complete. The
RD
signals.
CNVST
signal operates independently of CS and
t
1
CNVST
t
2
Figure 24, can be
input. A falling edge
Power Sequencing
The AD7622 is independent of power supply sequencing and
thus free from supply induced voltage latch-up. In addition, it is
very insensitive to power supply variations over a wide
frequency range, as shown in
65.0
62.5
60.0
57.5
55.0
PSRR (dB)
52.5
50.0
47.5
45.0
110000
101001000
Figure 30. PSRR vs. Frequency
Figure 30.
EXT REF
INT REF
FREQUENCY (kHz)
06023-029
Power-Up
At power-up, or when returning to operational mode from the
power-down mode (PD = high), the AD7622 engages an
initialization process. During this time, the first 128 conversions
should be ignored or the RESET input could be pulsed to
engage a faster initialization process. Refer to the
Interface
section for RESET and timing details.
Digital
CNVST
BUSY
t
3
t
5
MODE
For optimal performance, the rising edge of
occur after the maximum
t
4
t
6
CONVERTACQUIREACQUIRECONVERT
t
7
Figure 31. Basic Conversion Timing
CNVST
t
8
CNVST
should not
low time, t1, or until the end
of conversion.
Although
CNVST
is a digital signal, it should be designed with
special care with fast, clean edges and levels with minimum
overshoot and undershoot or ringing.
The
trace should be shielded with ground and a low
CNVST
value serial resistor (for example, 50 Ω) termination should be
added close to the output of the component that drives this line.
In addition, a 50 pF capacitor is recommended to further reduce
the effects of overshoot and undershoot as shown in
For applications where SNR is critical, the
CNVST
Figure 24.
signal should
have very low jitter. This can be achieved by using a dedicated
oscillator for
CNVST
high frequency, low jitter clock, as shown in
generation, or by clocking
Figure 24.
CNVST
with a
06023-030
Rev. 0 | Page 20 of 28
Page 21
AD7622
INTERFACES
DIGITAL INTERFACE
The AD7622 has a versatile digital interface that can be set up
as either a serial or a parallel interface with the host system. The
serial interface is multiplexed on the parallel data bus. The AD7622
digital interface also accommodates 2.5 V, 3.3 V, or 5 V logic
with either OVDD at 2.5 V or 3.3 V. OVDD defines the logic
high output voltage. In most applications, the OVDD supply pin
of the AD7622 is connected to the host system interface 2.5 V
or 3.3 V digital supply. By using the OB/
twos complement or straight binary coding can be used.
The two signals
CS
and RD control the interface. When at least
one of these signals is high, the interface outputs are in high
impedance. Usually,
CS
allows the selection of each AD7622 in
multicircuit applications and is held low in a single AD7622
RD
design.
is generally used to enable the conversion result on
the data bus.
RESET
The RESET input is used to reset the AD7622 and generate a
fast initialization. A rising edge on RESET aborts the current
conversion (if any) and tristates the data bus. The falling edge of
RESET clears the data bus and engages the initialization process
indicated by pulsing BUSY high. Conversions can take place
after the falling edge of BUSY. Refer to
timing details.
t
9
RESET
2C
input pin, either
Figure 32 for the RESET
CS = RD = 0
CNVST
BUSY
DATA
BUS
t
t
1
t
10
t
3
PREVIOUS CONVERSI ON DATANEW DATA
4
t
11
Figure 33. Master Parallel Data Timing for Reading (Continuous Read)
Slave Parallel Interface
In slave parallel reading mode, the data can be read either after
each conversion, which is during the next acquisition phase, or
during the following conversion, as shown in
Figure 34 and
Figure 35, respectively. When the data is read during the
conversion, it is recommended that it is read-only during the
first half of the conversion phase. This avoids any potential
feedthrough between voltage transients on the digital interface
and the most critical analog conversion circuitry.
CS
RD
BUSY
04761-032
CNVST
DATA
BUSY
t
38
t
39
t
8
Figure 32. RESET Timing
PARALLEL INTERFACE
The AD7622 is configured to use the parallel interface when
PA R
SER/
Master Parallel Interface
Data can be continuously read by tying CS and RD low, thus
requiring minimal microprocessor connections. However, in
this mode, the data bus is always driven and cannot be used in
shared bus applications, unless the device is held in RESET.
Figure 33 details the timing for this mode.
is held low.
Rev. 0 | Page 21 of 28
DATA
BUS
t
12
CURRENT
CONVERSION
t
13
04761-033
Figure 34. Slave Parallel Data Timing for Reading (Read After Convert)
06023-031
CS = 0
CNVST,
BUSY
DATA
RD
BUS
t
3
t
12
t
1
PREVIOUS
CONVERSION
t
4
t
13
06023-042
Figure 35. Slave Parallel Data Timing for Reading (Read During Convert)
Page 22
AD7622
8-Bit Interface (Master or Slave)
The BYTESWAP pin allows a glueless interface to an 8-bit bus.
As shown in
Figure 36, when BYTESWAP is low, the LSB byte is
output on D[7:0] and the MSB is output on D[15:8]. When
BYTESWAP is high, the LSB and MSB bytes are swapped, and
the LSB is output on D[15:8] and the MSB is output on D[7:0].
By connecting BYTESWAP to an address line, the 16-bit data
can be read in two bytes on either D[15:8] or D[7:0]. This
interface can be used in both master and slave parallel reading
modes.
MASTER SERIAL INTERFACE
Internal Clock
The AD7622 is configured to generate and provide the serial
data clock SCLK when the EXT/
also generates a SYNC signal to indicate to the host when the
serial data is valid. The serial clock SCLK and the SYNC signal
can be inverted. Depending on the state of the read during
convert input, RDC/SDIN, the data can be read after each
conversion or during the following conversion.
Figure 38 show detailed timing diagrams of these two modes.
pin = low. The AD7622
INT
Figure 37 and
CS
RD
BYTESWAP
PINS D[15:8]
PINS D[7:0]
HI-Z
HI-Z
Figure 36. 8-Bit and 16-Bit Parallel Interface
HIGH BYTELOW BYTE
t
12
LOW BYTEHIGH BYTE
t
12
t
13
HI-Z
HI-Z
SERIAL INTERFACE
The AD7622 is configured to use the serial interface when
SER/
first, on the SDOUT pin. This data is synchronized with the
16 clock pulses provided on the SCLK pin. The output data is
valid on both the rising and falling edge of the data clock.
= high. The AD7622 outputs 16 bits of data, MSB
PA R
Usually, because the AD7622 is used with a fast throughput, the
master read during conversion mode, RDC/SDIN = high, is the
most recommended serial mode. In this mode, the serial clock
and data toggle at appropriate instants, minimizing potential
feedthrough between digital activity and critical conversion
decisions. In this mode, the SCLK period changes because the
LSBs require more time to settle and the SCLK is derived from the
SAR conversion cycle.
In read after conversion mode, RDC/SDIN = low, it should be
06023-034
noted that unlike other modes, the BUSY signal returns low
after the 16 data bits are pulsed out and not at the end of the
conversion phase, resulting in a longer BUSY width. As a result,
the maximum throughput cannot be achieved in this mode.
In addition, in read after convert mode, the SCLK frequency
can be slowed down to accommodate different hosts using the
DIVSCLK[1:0] inputs. Refer to
Table 4 for the SCLK timing
details when using these inputs.
Rev. 0 | Page 22 of 28
Page 23
AD7622
S
CS, RD
CNVST
BUSY
SYNC
SCLK
DOUT
EXT/INT = 0
t
3
t
29
t
14
t
20
t
15
X
t
16
t
22
RDC/SDIN = 0INVSCLK = INVSYNC = 0
t
28
t
30
t
18
t
19
t
21
123141516
D15D14D2D1D0
t
23
t
24
t
25
t
26
t
27
06023-035
Figure 37. Master Serial Data Timing for Reading (Read After Convert)
CS, RD
CNVST
BUSY
EXT/INT = 0
t
1
t
3
RDC/SDIN = 1INVSCLK = I NVSYNC = 0
SYNC
SCLK
SDOUT
t
17
t
14
t
15
t
18
t
16
t
22
t
19
t20t
21
123141516
D15D14D2D1D0X
t
23
t
24
t
25
t
26
t
27
06023-036
Figure 38. Master Serial Data Timing for Reading (Read Previous Conversion During Convert)
Rev. 0 | Page 23 of 28
Page 24
AD7622
SLAVE SERIAL INTERFACE
External Clock
The AD7622 is configured to accept an externally supplied
serial data clock on the SCLK pin when the EXT/
INT
pin is
held high. In this mode, several methods can be used to read
the data. The external serial clock is gated by
are both low, the data can be read after each conversion or
RD
. When CS and
CS
during the following conversion. The external clock can be
either a continuous or a discontinuous clock. A discontinuous
clock can be either normally high or normally low when
inactive.
Figure 40 and Figure 41 show the detailed timing
diagrams of these methods.
While the AD7622 is performing a bit decision, it is important
that voltage transients be avoided on digital input/output pins
or degradation of the conversion result could occur. This is
particularly important during the second half of the conversion
phase because the AD7622 provides error correction circuitry
that can correct for an improper bit decision made during
the first half of the conversion phase. For this reason, it is
recommended that when an external clock is being provided,
a discontinuous clock is toggled only when BUSY is low or,
more importantly, that it does not transition during the latter
half of BUSY high.
Finally, in this mode only, the AD7622 provides a daisy-chain
feature using the RDC/SDIN pin for cascading multiple converters
together. This feature is useful for reducing component count
and wiring connections when desired, as, for instance, in
isolated multiconverter applications.
An example of the concatenation of two devices is shown in
Figure 39. Simultaneous sampling is possible by using a
common
CNVST
signal. It should be noted that the RDC/SDIN
input is latched on the edge of SCLK opposite to the one used to
shift out the data on SDOUT. Therefore, the MSB of the
upstream converter just follows the LSB of the downstream
converter on the next SCLK cycle.
BUSY
OUT
BUSY
AD7622
#1
(DOWNSTREAM)
SDOUTRDC/SDIN
CNVST
SCLK
CS
DATA
OUT
AD7622
(UPSTREAM)
RDC/SDIN
BUSY
#2
SDOUT
CNVST
CS
SCLK
External Discontinuous Clock Data Read After Conversion
Though the maximum throughput cannot be achieved using
this mode, it is the most recommended of the serial slave
modes.
Figure 40 shows the detailed timing diagrams of this
method. After a conversion is complete, indicated by BUSY
returning low, the conversion result can be read while both
are low. Data is shifted out MSB first with 16 clock
and
RD
CS
pulses and is valid on the rising and falling edges of the clock.
Among the advantages of this method is the fact that conversion
performance is not degraded because there are no voltage
transients on the digital interface during the conversion process.
Another advantage is the ability to read the data at any speed up
to 80 MHz, which accommodates both the slow digital host
interface and the fast serial reading.
It is also possible to begin to read data after conversion and
continue to read the last bits after a new conversion is initiated.
In this reading mode, it is recommended to pause digital
activity just prior to initiating a conversion (SCLK should be
held high or low). Once the conversion has begun, the reading
can continue. In addition, in this mode, the use of a slower
clock speed can be used to read the data because the total
reading time is the acquisition time, t
time, t
(t8 + ½ × t7, see the External Clock Data Read During
7
Previous Conversion
section).
+ half of the conversion
8
SCLK IN
CS IN
CNVST IN
Figure 39. Two AD7622 Devices in a Daisy-Chain Configuration
06023-037
External Clock Data Read During Previous Conversion
Figure 41 shows the detailed timing diagrams of this method.
During a conversion, while
CS
and RD are both low, the result
of the previous conversion can be read. The data is shifted out,
MSB first, with 16 clock pulses and is valid on both the rising
and falling edge of the clock. The 16 bits have to be read before
the current conversion is complete; otherwise, RDERROR is
pulsed high and can be used to interrupt the host interface to
prevent incomplete data reading. There is no daisy-chain
feature in this mode, and the RDC/SDIN input should always
be tied either high or low.
To reduce performance degradation due to digital activity, a fast
discontinuous clock (at least 60 MHz when normal mode is
used, or 80 MHz when warp mode is used) is recommended to
ensure that all the bits are read during the first half of the SAR
conversion phase.
If the maximum throughput is not used, thus allowing more
acquisition time, then the use of a slower clock speed can be
used to read the data.
Rev. 0 | Page 24 of 28
Page 25
AD7622
S
S
CS
BUSY
SCLK
DOUT
SDIN
EXT/INT = 1
t
35
t36t
37
1231415161718
t
31
X
D15D14D1
t
16
X15X14X13X1X0Y15Y14
t
33
t
32
D13
t
34
INVSCLK = 0
RD = 0
D0
X15X14
06023-038
Figure 40. Slave Serial Data Timing for Reading (Read After Convert)
CS
CNVST
EXT/INT = 1INVSCLK = 0
RD = 0
BUSY
t
SCLK
DOUT
3
t
16
t
35
t36t
37
123141516
t
31
X
D15D14D13
t
32
D1
D0
06023-039
Figure 41. Slave Serial Data Timing for Reading (Read Previous Conversion During Convert)
Rev. 0 | Page 25 of 28
Page 26
AD7622
MICROPROCESSOR INTERFACING
The AD7622 is ideally suited for traditional dc measurement
applications supporting a microprocessor, and ac signal processing
applications interfacing to a digital signal processor. The
AD7622 is designed to interface with a parallel 8-bit or 16-bit
wide interface or with a general-purpose serial port or I/O ports
on a microcontroller. A variety of external buffers can be used
with the AD7622 to prevent digital noise from coupling into the
ADC. The
of the AD7622 with the ADSP-219x SPI-equipped DSP.
SPI Interface (ADSP-219x) section illustrates the use
SPI Interface (ADSP-219x)
Figure 42 shows an interface diagram between the AD7622 and
an SPI-equipped DSP, the ADSP-219x. To accommodate the
slower speed of the DSP, the AD7622 acts as a slave device and
data must be read after conversion. This mode also allows the
daisy-chain feature. The convert command can be initiated in
response to an internal timer interrupt. The 16-bit output data
are read with three SPI byte access. The reading process can be
initiated in response to the end-of-conversion signal (BUSY
going low) using an interrupt line of the DSP. The serial peripheral
interface (SPI) on the ADSP-219x is configured for master
mode (MSTR) = 1, clock polarity bit (CPOL) = 0, clock phase
bit (CPHA) = 1, and the SPI interrupt enable (TIMOD) = 00 by
writing to the SPI control register (SPICLTx). It should be noted
that to meet all timing requirements, the SPI clock should be
limited to 17 Mbps, allowing it to read an ADC result in less
than 1 μs. When a higher sampling rate is desired, it is
recommended to use one of the parallel interface modes.
DVDD
AD7622
MODE0
BUSY
MODE1
EXT/INT
RD
INVSCLK
1
ADDITIONAL PINS OMITTED FOR CLARITY.
Figure 42. Interfacing the AD7622 to ADSP-219x
CS
SDOUT
SCLK
CNVST
ADSP-219x
PFx
SPIxSEL (PFx)
MISOx
SCKx
PFx OR TFSx
1
06023-040
Rev. 0 | Page 26 of 28
Page 27
AD7622
APPLICATION HINTS
LAYOUT
While the AD7622 has very good immunity to noise on the
power supplies, exercise care with the grounding layout. To
facilitate the use of ground planes that can be easily separated,
design the printed circuit board that houses the AD7622 so that
the analog and digital sections are separated and confined to
certain areas of the board. Digital and analog ground planes
should be joined in only one place, preferably underneath the
AD7622, or as close as possible to the AD7622. If the AD7622 is
in a system where multiple devices require analog-to-digital
ground connections, the connections should still be made at
one point only, a star ground point, established as close as
possible to the AD7622.
To prevent coupling noise onto the die, avoid radiating noise,
and reduce feedthrough:
• Do not run digital lines under the device.
• Run the analog ground plane under the AD7622.
The DVDD supply of the AD7622 can be either a separate
supply or come from the analog supply, AVDD, or from the
digital interface supply, OVDD. When the system digital supply
is noisy, or fast switching digital signals are present, and no
separate supply is available, it is recommended to connect the
DVDD digital supply to the analog supply AVDD through an
RC filter, and to connect the system supply to the interface
digital supply OVDD and the remaining digital circuitry. Refer
to
Figure 24 for an example of this configuration. When DVDD
is powered from the system supply, it is useful to insert a bead
to further reduce high frequency spikes.
The AD7622 has four different ground pins: REFGND, AGND,
DGND, and OGND. REFGND senses the reference voltage and,
because it carries pulsed currents, should have a low impedance
return to the reference. AGND is the ground to which most
internal ADC analog signals are referenced; it must be connected
with the least resistance to the analog ground plane. DGND
must be tied to the analog or digital ground plane depending on the
configuration. OGND is connected to the digital system ground.
• Shield fast switching signals, like
digital ground to avoid radiating noise to other sections of
the board, and never run them near analog signal paths.
• Avoid crossover of digital and analog signals.
• Run traces on different but close layers of the board, at right
angles to each other, to reduce the effect of feedthrough
through the board.
The power supply lines to the AD7622 should use as large a
trace as possible to provide low impedance paths and reduce the
effect of glitches on the power supply lines. Good decoupling is
also important to lower the impedance of the supplies presented
to the AD7622, and to reduce the magnitude of the supply
spikes. Decoupling ceramic capacitors, typically 100 nF, should
be placed on each of the power supplies pins, AVDD, DVDD,
and OVDD. The capacitors should be placed close to, and
ideally right up against, these pins and their corresponding
ground pins. Additionally, low ESR 10 μF capacitors should be
located in the vicinity of the ADC to further reduce low
frequency ripple.
CNVST
or clocks, with
The layout of the decoupling of the reference voltage is
important. To minimize parasitic inductances, place the
decoupling capacitor close to the ADC and connect it with
short, thick traces.
EVALUATING THE AD7622 PERFORMANCE
A recommended layout for the AD7622 is outlined in the
documentation of the EVAL-AD7622-CB evaluation board for
the AD7622. The evaluation board package includes a fully
assembled and tested evaluation board, documentation, and
software for controlling the board from a PC via the
CONTROL BRD3
.
EVAL-
Rev. 0 | Page 27 of 28
Page 28
AD7622
OUTLINE DIMENSIONS
0.30
0.23
0.18
PIN 1
48
INDICATOR
1
BSC SQ
PIN 1
INDICATOR
7.00
0.60 MAX
37
36
0.60 MAX
1.00
0.85
0.80
12° MAX
SEATING
PLANE
TOP
VIEW
Figure 43. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]