Datasheet AD7621 Datasheet (ANALOG DEVICES)

Page 1
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16-Bit, 2 LSB INL, 3 MSPS PulSAR® ADC

FEATURES

Throughput
3 MSPS (wideband warp and warp mode) 2 MSPS (normal mode)
1.25 MSPS (impulse mode)
2.048 V internal reference (V
Differential input range: ±V INL: ±2 LSB maximum, ±1 LSB typical 16-bit resolution with no missing codes SINAD: 89 dB typical @ 100 kHz THD: 101 dB typical @ 100 kHz
No pipeline delay (SAR architecture) Parallel (16- or 8-bit bus) and serial 5 V/3.3 V/2.5 V interface SPI®-/QSPI™-/MICROWIRE™-/DSP-compatible
2.5 V single-supply operation
Power dissipation: 65 mW typical @ 3 MSPS 48-lead LQFP and 48-lead LFCSP_VQ packages Speed upgrade of the A
D7677

APPLICATIONS

Medical instruments High speed data acquisition Digital signal processing Communications Instrumentation Spectrum analysis ATE
REF
up to 2.5 V)
REF
AD7621

FUNCTIONAL BLOCK DIAGRAM

AGND AVDD
IN+ IN–
PDREF PDBUF
PD
RESET
TEMP
REFBUFIN
REF
CONTROL LOGIC AND
CALIBRATION CIRCUITRY
WARP
REF AMP
SWITCHED
CAP DAC
IMPULSE
REF REFGND
AD7621
CLOCK
CNVST
Figure 1.
Table 1. PulSAR Selection
Type/kSPS 100 to 250 500 to 570
Pseudo
Differential
AD7651 AD7660/61
AD7650/52
AD7664/66
True Bipolar AD7663 AD7665 AD7671 True
Differential AD7675 AD7676 AD7677 AD7621 18-Bit AD7678 AD7679 AD7674 AD7641 Multichannel/
Simultaneous
AD7654 AD7655
DGNDDVDD
OVDD OGND
SERIAL
PORT
16
D[15:0]
PARALLEL
INTERFACE
SER/PAR BUSY RD CS OB/2C BYTESWAP
800 to 1000 >1000
AD7653 AD7667
04565-001

GENERAL DESCRIPTION

The AD7621 is a 16-bit, 3 MSPS, charge redistribution SAR, fully differential analog-to-digital converter (ADC) that operates from a single 2.5 V power supply. It contains a high speed 16-bit sampling ADC, an internal conversion clock, an internal reference (and buffer), error correction circuits, and both serial and parallel system interface ports. It features two very high sampling rate modes (wideband warp and warp), a fast mode (normal) for asynchronous rate applications, and a reduced power mode (impulse) for low power applications where the power is scaled with the throughput. Operation is specified from −40°C to +85°C.
Rev. 0

PRODUCT HIGHLIGHTS

1. Fast Throughput.
The AD7621 is a 3 MSPS, charge redistribution, 16-bit SAR ADC.
2. Superior Linearity.
The AD7621 has no missing 16-bit code.
3. Internal Reference.
The AD7621 has a 2.048 V internal reference with a typical drift of ±7 ppm/°C.
4. Single-Supply Operation.
The AD7621 operates from a 2.5 V single supply and typically dissipates 65 mW. In impulse mod
e
dissipation decreases with th Se
rial or Parallel Interface.
5.
Versatile parallel (16- or 8-bit bus) or 2-wire serial interf arrangement compatible with 2.5 V, 3.3 V, or 5 V logic.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2005 Analog Devices, Inc. All rights reserved.
throughput.
e, its power
ace
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AD7621
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TABLE OF CONTENTS
Specifications..................................................................................... 3
Voltage Reference Input ............................................................ 18
Timing Specifications....................................................................... 5
Serial Clock Timing Specifications ............................................ 6
Absolute Maximum Ratings............................................................ 7
ESD Caution.................................................................................. 7
Pin Configuration and Function Descriptions............................. 8
Te r mi n ol o g y .................................................................................... 11
Typical Performance Characteristics........................................... 12
Theory of Operation ...................................................................... 15
Circuit Information.................................................................... 15
Converter Operation.................................................................. 15
Modes of Operation ................................................................... 15
Transfer Fu nctions...................................................................... 16
Typical Conne ction Diagram ................................................... 17
Analog Inputs.............................................................................. 17
Driver Amplifier Choice............................................................ 17
Power Supply............................................................................... 19
Power Dissipation vs. Throughput .......................................... 20
Conversion Control ...................................................................20
Interfaces.......................................................................................... 21
Digital Interface.......................................................................... 21
Parallel Interface......................................................................... 21
Serial Interface............................................................................ 22
Master Serial Interface............................................................... 22
Slave Serial Interface .................................................................. 24
Microprocessor Interfacing....................................................... 26
Application...................................................................................... 27
Layout ..........................................................................................27
Evaluating the AD7621 Performance...................................... 27
Outline Dimensions .......................................................................28
Ordering Guide .......................................................................... 29
REVISION HISTORY
5/05 — Revision 0: Initial Version
Rev. 0 | Page 2 of 32
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AD7621
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SPECIFICATIONS

AVDD = DVDD = 2.5 V; OVDD = 2.3 V to 3.6 V; V
Table 2.
Parameter Conditions Min Typ Max Unit
RESOLUTION 16 Bits ANALOG INPUT
Voltage Range
VIN+ VIN− Operating Input Voltage VIN+, VIN− to AGND −0.1 AVDD Analog Input CMRR fIN = 100 kHz 55 dB Input Current 3 MSPS throughput 25 μA Input Impedance
2
THROUGHPUT SPEED
Complete Cycle Wideband warp, warp modes 333 ns Throughput Rate Wideband warp, warp modes 0.001 3 MSPS Time Between Conversions Wideband warp, warp modes 1 ms Complete Cycle Normal mode 500 ns Throughput Rate Normal mode 0 2 MSPS Complete Cycle Impulse mode 800 ns Throughput Rate Impulse mode 0 1.25 MSPS
DC ACCURACY All modes
Integral Linearity Error
3
V No Missing Codes V Differential Linearity Error V Transition Noise V Transition Noise V Zero Error, T
MIN
to T
MAX
5
−30 +30 LSB Zero Error Temperature Drift ±1 ppm/°C Gain Error, T
MIN
to T
MAX
5
−0.38 +0.38 % of FSR Gain Error Temperature Drift ±2 ppm/°C Power Supply Sensitivity AVDD = 2.5 V ± 5% ±3 LSB
AC ACCURACY
Dynamic Range fIN = 20 kHz, V Signal-to-Noise fIN = 20 kHz, V f f
IN
IN
Spurious-Free Dynamic Range fIN = 20 kHz 103 dB f
IN
Total Harmonic Distortion fIN = 20 kHz –102 dB f
IN
Signal-to-(Noise + Distortion) fIN = 20 kHz, V
f f
IN
IN
–3 dB Input Bandwidth 50 MHz
SAMPLING DYNAMICS
Aperture Delay 1 ns Aperture Jitter 5 ps rms Transient Response Full-scale step 50 ns
INTERNAL REFERENCE PDREF = PDBUF = low
Output Voltage REF @ 25°C 2.038 2.048 2.058 V Temperature Drift –40°C to +85°C ±7 ppm/°C Line Regulation AVDD = 2.5 V ± 5% ±15 ppm/V
= 2.5 V; all specifications T
REF
= 2.048 V, PDREF = high −2 ±1 +2 LSB
REF
= 2.048 V, PDREF = high 16 Bits
REF
= 2.048 V, PDREF = high −1 +2 LSB
REF
= 2.5 V 0.69 LSB
REF
= 2.048 V 0.82 LSB
REF
= 2.5 V 90.5 dB
REF
= 2.5 V 88 90 dB
REF
= 20 kHz, V = 100 kHz, V
= 2.048 V 86 88 dB
REF
= 2.5 V 89.2 dB
REF
−V
REF
MIN
to T
, unless otherwise noted.
MAX
V
REF
1
= 100 kHz 101 dB
= 100 kHz −100 dB
= 2.5 V 87.5 89.8 dB
REF
= 20 kHz, V = 100 kHz, V
= 2.048 V 87.5 dB
REF
= 2.5 V 89 dB
REF
V V
4
6
Rev. 0 | Page 3 of 32
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AD7621
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Parameter Conditions Min Typ Max Unit
Turn-On Settling Time C REFBUFIN Output Voltage REFBUFIN @ 25°C 1.2 V REFBUFIN Output Resistance 6.33
EXTERNAL REFERENCE PDREF = PDBUF = high
Voltage Range REF 1.8 2.048 AVDD V Current Drain 3 MSPS throughput 250 μA
REFERENCE BUFFER PDREF = high, PDBUF = low
REFBUFIN Input Voltage Range 1.05 1.2 1.30 V
TEMPERATURE PIN
Voltage Output @ 25°C 273 mV Temperature Sensitivity 0.85 mV/°C Output Resistance 4.7
DIGITAL INPUTS
Logic Levels
V
IL
V
IH
I
IL
I
IH
DIGITAL OUTPUTS
Data Format Pipeline Delay
V
OL
V
OH
7
8
POWER SUPPLIES
Specified Performance
AVDD 2.37 2.5 2.63 V DVDD 2.37 2.5 2.63 V OVDD 2.30
Operating Current
11
AVDD
10
DVDD 3.6 mA OVDD 1 mA
Power Dissipation
With Internal Reference Without Internal Reference With Internal Reference Without Internal Reference
11
10
10
12
12
In Power-Down Mode13 PD = high 600 μW
TEMPERATURE RANGE
Specified Performance T
1
When using an external reference. With the internal reference, the input range is −0.1 V to V
2
See the Analog Inputs section.
3
Linearity is tested using endpoints, not best fit. Tested with an external reference at 2.048 V.
4
LSB means least significant bit. With the ±2.048 V input range, 1 LSB is 62.5 μV.
5
See the Voltage Reference Input section. These specifications do not include the error contribution from the external reference.
6
All specifications in dB are referred to a full-scale input FSR. Tested with an input signal at 0.5 dB below full-scale, unless otherwise specified.
7
Parallel or serial 16-bit.
8
Conversion results are available immediately after completed conversion.
9
See the Absolute Maximum Ratings section.
10
In warp mode. Tested in parallel reading mode.
11
With internal reference, PDREF and PDBUF are low; without internal reference, PDREF and PDBUF are high.
12
In impulse mode. Tested in parallel reading mode.
13
With all digital inputs forced to OVDD.
14
Consult factory for extended temperature range.
14
= 10 μF 5 ms
REF
–0.3 +0.6 V
1.7 5.25 V –1 +1 μA –1 +1 μA
I
= 500 μA 0.4 V
SINK
I
= –500 μA OVDD − 0.3 V
SOURCE
9
3.6 V 3 MSPS throughput With internal reference 25.2 mA
3 MSPS throughput 70 86 mW 3 MSPS throughput 65 80 mW
1.25 MSPS throughput 42 55 mW
1.25 MSPS throughput 37 50 mW
MIN
to T
MAX
–40 +85 °C
.
REF
Rev. 0 | Page 4 of 32
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AD7621
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TIMING SPECIFICATIONS

AVDD = DVDD = 2.5 V; OVDD = 2.3 V to 3.6 V; V
Table 3.
Parameter Symbol Min Typ Max Unit
CONVERSION AND RESET (Refer to Figure 31 and Figure 32)
Convert Pulse Width t Time Between Conversions (Warp2 Mode/Normal Mode/Impulse Mode)3t CNVST Low to BUSY High Delay BUSY High All Modes (Except Master Serial Read After Convert) t Aperture Delay t End of Conversion to BUSY Low Delay t Conversion Time (Warp Mode/Normal Mode/Impulse Mode) t Acquisition Time (Warp Mode/Normal Mode/Impulse Mode) t RESET Pulse Width t RESET Low to BUSY High Delay BUSY High Time from RESET Low
4
4
PARALLEL INTERFACE MODES (Refer to Figure 33 and Figure 35)
CNVST Low to DATA Valid Delay
(Warp Mode/Normal Mode/Impulse Mode) DATA Valid to BUSY Low Delay t Bus Access Request to DATA Valid t Bus Relinquish Time t
MASTER SERIAL INTERFACE MODES5 (Refer to Figure 37 and Figure 38)
CS Low to SYNC Valid Delay CS Low to Internal SCLK Valid Delay
5
CS Low to SDOUT Delay CNVST Low to SYNC Delay
(Warp Mode/Normal Mode/Impulse Mode) t SYNC Asserted to SCLK First Edge Delay t Internal SCLK Period Internal SCLK High Internal SCLK Low SDOUT Valid Setup Time SDOUT Valid Hold Time SCLK Last Edge to SYNC Delay
6
6
6
6
6
6
CS High to SYNC HI-Z CS High to Internal SCLK HI-Z CS High to SDOUT HI-Z BUSY High in Master Serial Read after Convert CNVST Low to SYNC Asserted Delay (All Modes) SYNC Deasserted to BUSY Low Delay t
= 2.5 V; all specifications T
REF
6
to T
MIN
1
2
t
3
4
5
6
7
8
9
t
38
t
39
t
10
11
12
13
t
14
t
15
t
16
, unless otherwise noted.
MAX
15 70
1
ns
333/500/800 ns 23 ns
283/430/560 ns 1 ns 10 ns 283/430/560 ns 50/70/50 ns 15 ns 10 ns 600 ns
283/430/560 ns
2 ns 20 ns 2 15 ns
10 ns 10 ns 10 ns
17
18
t
19
t
20
t
21
t
22
t
23
t
24
t
25
t
26
t
27
t
28
t
29
30
12/137/263 ns
0.5 ns 8 12 ns 2 ns 3 ns 1 ns 0 ns 0 ns
10 ns 10 ns 10 ns
See Table 4 275/400/500 ns
13 ns
Rev. 0 | Page 5 of 32
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AD7621
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Parameter Symbol Min Typ Max Unit
SLAVE SERIAL INTERFACE MODES5 (Refer to Figure 40 and Figure 41)
External SCLK Setup Time t External SCLK Active Edge to SDOUT Delay t SDIN Setup Time t SDIN Hold Time t External SCLK Period t External SCLK High t External SCLK Low t
1
See the Conversion Control section.
2
All timings for wideband warp mode are the same as warp mode.
3
In warp mode only, the time between conversions is 1 ms; otherwise, there is no required maximum time.
4
See the Digital Interface, and RESET sections.
5
In serial interface modes, the SYNC, SCLK, and SDOUT timings are defined with a maximum load CL of 10 pF; otherwise, the load is 60 pF maximum.
6
In serial master read during convert mode. See Table 4 for serial master read after convert mode timing specifications.
31
32
33
34
35
36
37

SERIAL CLOCK TIMING SPECIFICATIONS

Table 4. Serial Clock Timings in Master Read After Convert Mode
DIVSCLK[1] 0 0 1 1 DIVSCLK[0] Symbol 0 1 0 1 Unit
SYNC to SCLK First Edge Delay Minimum t Internal SCLK Period Minimum t Internal SCLK Period Maximum t Internal SCLK High Minimum t Internal SCLK Low Minimum t SDOUT Valid Setup Time Minimum t SDOUT Valid Hold Time Minimum t SCLK Last Edge to SYNC Delay Minimum t BUSY High Width Maximum (Wideband and Warp Modes) t BUSY High Width Maximum (Normal Mode) t BUSY High Width Maximum (Impulse Mode) t
18
19
19
20
21
22
23
24
28
28
28
5 ns 1 8 ns 5 ns 5 ns
12.5 ns 5 ns 5 ns
0.5 3 3 3 ns 8 16 32 64 ns 12 25 50 100 ns 2 6 15 31 ns 3 7 16 32 ns 1 5 5 5 ns 0 0.5 10 28 ns 0 0.5 9 26 ns
0.500 0.720 1.160 2.040 μs
0.650 0.870 1.310 2.190 μs
0.780 1.000 1.440 2.320 μs
500μAI
TO OUTPUT
PIN
C
L
50pF
500μAI
NOTE IN SERIAL INTERFACE MODES, THE SYNC, SCLK AND SDOUT ARE DEFINED WITH A MAXIMUM LOAD. C
OF 10pF; OTHERWISE, THE LOAD IS 60pF MAXIMUM.
L
Figure 2. Load Circuit for Digital Interface Timing,
, SYNC, and SCLK Outputs, C
SDOUT
OL
1.4V
OH
04565-002
= 10 pF
L
0.8V
t
DELAY
2V
0.8V
Figure 3. Voltage Reference Levels for Timing
Rev. 0 | Page 6 of 32
2V
t
DELAY
2V
0.8V
05665-003
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AD7621
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ABSOLUTE MAXIMUM RATINGS

Table 5.
Parameter Rating
Analog Inputs/Outputs
IN+1, IN−, REF, REFBUFIN, TEMP,
INGND, REFGND to AGND
Ground Voltage Differences
AGND, DGND, OGND ±0.3 V
Supply Voltages
AVDD, DVDD –0.3 V to +2.7 V OVDD –0.3 V to +3.8 V AVDD to DVDD ±2.8 V AVDD to OVDD +2.8 V to −3.8 V OVDD to DVDD
Digital Inputs −0.3 V to +5.5 V PDREF, PDBUF Internal Power Dissipation Internal Power Dissipation Junction Temperature 125°C Storage Temperature Range –65°C to +125°C
1
See the Analog Inputs section.
2
See the Power Supply section.
3
See the Voltage Reference Input section.
4
Specification is for the device in free air: 48-Lead LQFP; θJA = 91°C/W,
θJC = 30°C/W.
5
Specification is for the device in free air: 48-Lead LFCSP; θJA = 26°C/W.
2
3
4
5
AVDD + 0.3 V to
AGND − 0.3 V
≤ +0.3 V if DVDD < 2.3 V
±20 mA 700 mW
2.5 W
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to
performance degradation or loss of functionality.
avoid
Rev. 0 | Page 7 of 32
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AD7621
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PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

PDBUF
PDREF
REFBUFIN
TEMP
AVDD
IN+
AGND
AGNDNCIN–
DGND
D8/SDOUT
D9/SCLK
REFGND
D10/SYNC
48 47 46 45 44 39 38 3743 42 41 40
1
AGND AVDD
NC
BYTESWAP
OB/2C
WARP IMPULSE SER/PAR
D0
D1 D2/DIVSCLK[0] D3/DIVSCLK[1]
NC = NO CONNECT
PIN 1 IDENTIFIER
2 3 4 5 6 7 8
9 10 11 12
13 14 15 16 17 18 19 20 21 22 23 24
D4/EXT/INT
D6/INVSCLK
D5/INVSYNC
AD7621
TOP VIEW
(Not to Scale)
DVDD
OVDD
OGND
D7/RDC/SDIN
Figure 4. Pin Configuration
Table 6. Pin Function Descriptions
Pin No. Mnemonic Type1 Description
1, 41, 42 AGND P Analog Power Ground Pin. 2, 44 AVDD P Input Analog Power Pins. Nominally 2.5 V. 3, 40 NC 4 BYTESWAP DI
No Connect. Parallel Mode Selection (8-Bit/16-Bit). When high, the LSB is output on D[15:8] and the MSB is output
on D[7:0]; when low, the LSB is output on D[7:0] and the MSB is output on D[15:8].
5
OB/2C
DI
Straight Binary/Binary Twos Complement Output. When high, the digital output is straight binary; when low, the MSB is inverted resulting in a twos complement output from its internal shift register.
6 WARP DI
Conversion Mode Selection. When WARP = high and IMPULSE = high, this selects wideband mode with slightly improved linearity and THD. When WARP = high and IMPULSE = low, this selects warp mode. In either mode, these are the fastest modes; maximum throughput is achievable, and a minimum conversion rate must be applied in order to guarantee full specified accuracy.
When WARP = low and IMPULSE = low, this input selects normal mode where full accuracy is maintained independent of the minimum conversion rate.
7 IMPULSE DI
Conversion Mode Selection. When IMPULSE = high and WARP = low, this input selects impulse mode, a reduced power mode. In this mode, the power dissipation is approximately proportional to the sampling rate.
8
SER/PAR
DI
Serial/Parallel Selection Input. When high, the serial interface is selected and some bits of the data bus are used as a serial port; the remaining data bits are high impedance outputs. When SER/PAR
the parallel port is selected. 9, 10 D[0:1] DO Bit 0 and Bit 1 of the Parallel Port Data Output Bus. 11, 12 D[2:3] DI/O
or DIVSCLK[0:1]
When SER/PAR = low, these outputs are used as Bit 2 and Bit 3 of the parallel port data output bus.
When SER/PAR
mode (EXT/INT
= high, serial clock division selection. When using serial master read after convert
= low, RDC/SDIN = low) these inputs can be used to slow down the internally generated serial clock that clocks the data output. In other serial modes, these pins are high impedance outputs.
13 D4 DI/O
or EXT/INT
When SER/PAR When SER/PAR
= low, this output is used as Bit 4 of the parallel port data output bus.
= high, serial clock source select. This input is used to select the internally generated (master ) or external (slave) serial data clock.
When EXT/INT When EXT/INT
= low: master mode. The internal serial clock is selected on SCLK output. = high: slave mode. The output data is synchronized to an external clock signal, gated
by CS, connected to the SCLK input.
REF
D11/RDERROR
36 35 34 33 32 31 30 29 28 27 26 25
AGND CNVST PD RESET CS RD DGND BUSY D15 D14 D13 D12
04565-004
= low,
Rev. 0 | Page 8 of 32
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Pin No. Mnemonic Type1 Description
14 D5 DI/O or INVSYNC
15 D6 DI/O or INVSCLK Invert SCLK Select. In all serial modes, this input is used to invert the SCLK signal.
16 D7 DI/O Bit 7 of the Parallel Port Data Output Bus. or RDC
or SDIN
17 OGND P Input/Output Interface Digital Power Ground. 18 OVDD P
19 DVDD P Digital Power. Nominally at 2.5 V. 20 DGND P Digital Power Ground. 21 D8 DO
or SDOUT
22 D9 DI/O
or SCLK
23 D10 DO or SYNC
24 D11 DO
or RDERROR
25 to 28 D[12:15] DO Bit 12 to Bit 15 of the Parallel Port Data Output Bus. 29 BUSY DO
30 DGND P Digital Power Ground. 31
RD
DI
When SER/PAR When SER/PAR
select the active state of the SYNC signal. When INVSYNC = low, SYNC is active high. When INVSYNC = high, SYNC is active low.
When SER/
When SER/PAR used to select the read mode.
When RDC = high, the previous conversion result is read during SCLK changes (see the Master Serial Interface section).
When RDC = low (read after convert), the current result is read after conversi Serial Data In. When using serial slave mode, (EXT/INT
daisy-chain the conversion results from two or more ADCs onto a single SDOUT line. The digital data level on SDIN is output on SDOUT with a delay of 16 SCLK periods after the initiation of the read sequence.
Input/Output Interface Digital Power. Nomin (2.5 V or 3 V).
When SER/PAR When SER/PAR
synchronized to SCLK. Conversion results are stored in an on-chip register. The AD7621 provides the conversion result, MSB first, from its internal shift register. The data format is determined by the logic level of OB/2C.
In master mode (EXT/INT In slave mode (EXT/INT
When INVSCLK = low, SDOUT is updated on SCLK rising edge and valid on the next falling edge. When INVSCLK = high, SDOUT is updated on SCLK falling edge and valid on the next rising edge.
Parallel Port Data Output Bus Bit 9. When SER/PAR data output bus.
Serial Clock. When SER/PAR clock input or output, dependent upon the logic state of the EXT/INT data SDOUT is updated depends upon the logic state of the INVSCLK pin. When SER/PAR
When SER/PAR used as a digital output frame synchronization for use with the internal data clock.
When a read sequence is initiated and INVSYNC = low, SYNC is driven high and remains high while SDOUT output i When a read sequence is initiated and INVSYNC = high, SYNC is driven low and remains low while SDOUT output is valid.
Parallel Port Data Output Bus Bit 11. When SER/PAR port data output bus.
Read Error. When SER/PAR as an incomplete read error flag. If a data read is started and not completed when the current conversion is complete, the current data is lost and RDERROR is pulsed high.
Busy Output. Transitions high when a conversion is started, and remains hig complete and the data is latched into the on-chip shift register. The falling edge of BUSY can be used as a data ready clock signal.
Read Data. When CS
= low this output is used as Bit 5 of the parallel port data output bus. = high, invert sync select. In serial master mode (EXT/INT = low), this input is used to
PAR
= low this output is used as Bit 6 of the parallel port data output bus.
= high, read during convert. When using Serial Master mode (EXT/INT = low), RDC is
current conversion and the period of
on.
= high), SDIN could be used as a data input to
ally at the same supply as the supply of the host interface
= low this output is used as Bit 8 of the parallel port data output bus. = high, serial data output. In serial mode, this pin is used as the serial data output
= low). SDOUT is valid on both edges of SCLK.
= high):
= low, this output is used as Bit 9 of the parallel port
= high, serial clock. In all serial modes, this pin is used as the serial data
pin. The active edge where the
= low, this output is used as Bit 10 of the parallel port data output bus. = high, frame synchronization. In serial master mode (EXT/INT= low), this output is
s valid.
= low, this output is used as Bit 11 of the parallel
= high, read error. In serial slave mode (EXT/INT = high), this output is used
h until the conversion is
and RD are both low, the interface parallel or serial output bus is enabled.
Rev. 0 | Page 9 of 32
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Pin No. Mnemonic Type1 Description
32
33 RESET DI
34 PD DI
35
36 AGND P Analog Power Ground Pin. 37 REF AI/O
38 REFGND AI Reference Input Analog Ground. 39 IN− AI Differential Negative Analog Input. 43 IN+ AI Differential Positive Analog Input. 45 TEMP AO Temperature Sensor Analog Output. 46 REFBUFIN AI/O
47 PDREF DI
48 PDBUF DI
1
AI = analog input; AI/O = bidirectional analog; AO = analog output; DI = digital input; DI/O = bidirectional digital; DO = digital output; P = power.
CS
CNVST
DI
DI
Chip Select. When CS and RD are both low, the interface parallel or serial output bus is enabled. CS is also used to gate the external clock in slave serial mode.
Reset Input. When high, reset the AD7621. Current conversi enables the calibration mode indicated by pulsing BUSY high. Refer to the Digital Interface section. If not used, this pin can be tied to DGND.
Power-Down Input. When high, power down the ADC. Power consumption is reduced and
sions are inhibited after the current one is completed.
conver Conversion Start. A falling edge on CNVST
initiates a conversion.
Reference Output/Input.
PDREF/PDBUF = low, the internal reference and buffer are enabled producing 2.048 V on this pin.
When When PDREF/PDBUF = high, the internal reference and buffer are disabled allowing an externally supplied voltage reference up to AVDD volts. Decoupling is required with or without the internal reference and buffer. Refer to the Voltage Reference Input section.
Internal Reference Output/Reference Buffer Input.
When PDREF/PDBUF = low, the (typical) bandgap output on this pin, which needs external decoupling. The internal fixed gain reference buffer uses this to produce 2.048V on the REF pin. When using an external reference with the internal reference buffer (PDBUF = low, PDREF = high), applying 1.2 V on this pin produces 2.048 V on the REF pin. Refer to the Voltage Reference Input section.
Internal Reference Power-Down Input.
When low, the i When high, the internal reference is powered down and an external reference must been used.
Internal Reference Buffer Power-Down Input.
When low, the buffer is enabled (must be low when using inter When high, the buffer is powered-down.
nternal reference is enabled.
puts the internal sample-and-hold into the hold state and
internal reference and buffer are enabled producing the 1.2 V
on if any is aborted. Falling edge of RESET
nal reference).
Rev. 0 | Page 10 of 32
Page 11
AD7621
www.BDTIC.com/ADI

TERMINOLOGY

Integral Nonlinearity Error (INL)
Linearity error refers to the deviation of each individual code from a line drawn from negative full-scale through positive full­scale. The point used as negative full-scale occurs ½ LSB before the first code transition. Positive full-scale is defined as a level 1½ LSBs beyond the last code transition. The deviation is measured from the middle of each code to the true straight line.
Differential Nonlinearity Error (DNL)
n an ideal ADC, code transitions are 1 LSB apart. Differential
I nonlinearity is the maximum deviation from this ideal value. It is often specified in terms of resolution for which no missing codes are guaranteed.
Gain Error
irst transition (from 000…00 to 000…01) should occur for
The f an analog voltage ½ LSB above the nominal negative full-scale (−2.0479688 V for the ±2.048 V range). The last transition (from 111…10 to 111…11) should occur for an analog voltage 1½ LSBs below the nominal full-scale (2.0479531 V for the ±2.048 V range). The gain error is the deviation of the difference between the actual level of the last transition and the actual level of the first transition from the difference between the ideal levels.
Zero Error
The zer
o error is the difference between the ideal midscale input voltage (0 V) and the actual voltage producing the midscale output code.
Dynamic Range
D
ynamic range is the ratio of the rms value of the full-scale to the rms noise measured with the inputs shorted together. The value for dynamic range is expressed in decibels.
Signal-to-Noise Ratio (SNR)
S
NR is the ratio of the rms value of the actual input signal to the rms sum of all other spectral components below the Nyquist frequency, excluding harmonics and dc. The value for SNR is expressed in decibels.
Signal-to-(Noise + Distortion) Ratio (SINAD)
INAD is the ratio of the rms value of the actual input signal to
S the rms sum of all other spectral components below the Nyquist frequency, including harmonics but excluding dc. The value for SINAD is expressed in decibels.
Spurious-Free Dynamic Range (SFDR)
ference, in decibels (dB), between the rms amplitude of
The dif the input signal and the peak spurious signal.
Effective Number of Bits (ENOB)
OB is a measurement of the resolution with a sine wave
EN input. It is related to SINAD and is expressed in bits by
1.76)/6.02]
ENOB = [(SI
NAD
dB
Aperture Delay
A
perture delay is a measure of the acquisition performance
measured from the falling edge of the
CNVST
input to when
the input signal is held for a conversion.
Transi ent Res p onse
The t
ime required for the AD7621 to achieve its rated accuracy
after a full-scale step function is applied to its input.
Reference Voltage Temperature Coefficient
ence voltage temperature coefficient is derived from the
Refer typical shift of output voltage at 25°C on a sample of parts at the maximum and minimum reference output voltage (V measured at T
MIN
REF
, T(25°C), and T
)(TCV ×
Cppm/
. It is expressed in ppm/°C as
MAX
REFREF
×°=°C
)(V–)(V
MinMax
)TT()25(V
MINMAXREF
)
REF
6
10
where:
V
(Max) = maximum V
REF
V
(Min) = minimum V
REF
(25°C) = V
V
REF
T
MAX
T
MIN
= +85°C
= –40°C
REF
at 25°C
REF
REF
at T
at T
MIN
MIN
, T (25°C), or T
, T (25°C), or T
MAX
MAX
Total Harmonic Distortion (THD)
HD is the ratio of the rms sum of the first five harmonic
T components to the rms value of a full-scale input signal and is expressed in decibels.
Rev. 0 | Page 11 of 32
Page 12
AD7621
www.BDTIC.com/ADI

TYPICAL PERFORMANCE CHARACTERISTICS

2.0
1.5
1.0
1.5
1.0
0.5
0
INL (LSB)
–0.5
–1.0
–1.5
–2.0
0 16384 32768 49152
CODE
Figure 5. Integral Nonlinearity vs. Code
160000
140000
120000
100000
80000
COUNTS
60000
40000
20000
013
0
7FFC 7FFD 7FFE 7FFF 8000 8001 8002 8003 8004
2080
149969
51847
CODE IN HEX
54791
2415
Figure 6. Histogram of 261,120 Conversions of a DC Input
at
the Code Center (External Reference)
2.0530
2.0525
2.0520
2.0515
2.0510
(V)
2.0505
REF
V
2.0500
2.0495
2.0490
2.0485
2.0480 –55 –35 –15 5 25 45 65 85 105 125
Figure 7. Typical Reference Voltage Out
TEMPERATURE (°C)
put vs. Temperature (3 Units)
65536
σ
= 0.69
50
04565-005
04565-006
04565-007
0.5
DNL (LSB)
0
–0.5
–1.0
0 16384 32768 49152
CODE
65536
Figure 8. Differential Nonlinearity vs. Code
160000
140000
120000
100000
80000
COUNTS
60000
40000
20000
0
0
7FFC 7FFD 7FFE 7FFF 8000 8001 8002 8003 8004
176
6644
127317
60842
CODE IN HEX
59637
6376
σ
128
= 0.82
0
Figure 9. Histogram of 261,120 Conversions of a DC Input
Center (Internal Reference)
–FS
ZERO ERROR
TEMPERATURE (°C)
10
8
6
4
2
0
–2
–4
–6
–8
ZERO SCALE, FULL-SCALE ERROR (LSB)
–10
–55 –35 –15 125105856545255
at the Code
+FS
Figure 10. Zero Error, Positive and Negative Full Scale vs. Temperature
04565-008
04565-009
04565-010
Rev. 0 | Page 12 of 32
Page 13
AD7621
www.BDTIC.com/ADI
0
–20
–40
–60
–80
–100
–120
–140
AMPLITUDE (dB of Full-Scale)
–160
–180
0 100 200 300 400 500 600 700 800 900 100011001200 1300 1400 1500
FREQUENCY (kHz)
f
= 3MSPS
S
f
= 20.1kHz
IN
SNR = 90.1dB THD = –103.2dB SFDR = 103.8dB SINAD = 89.9dB
Figure 11. FFT 20 kHz
95
93
91
89
87
85
83
SNR, SINAD (dB)
81
79
77
75
1 10 100 1000
FREQUENCY (kHz)
SINAD
ENOB
Figure 12. SNR, SINAD and ENOB vs. Frequency
–70
–75
–80
–85
–90
–95
–100
–105
THD, HARMONICS (dB)
–110
–115
–120
THIRD HARMONIC
SECOND HARMONIC
1 10 100 1000
FREQUENCY (kHz)
THD
SFDR
Figure 13. THD, Harmonics, and SFDR v s. Frequency
SNR
16.0
15.6
15.2
14.8
14.4
14.0
13.6
13.2
12.8
12.4
12.0
120
110
100
90
80
70
60
50
40
30
20
04565-011
ENOB (Bits)
04565-012
SFDR (dB)
04565-013
0
–20
–40
–60
–80
–100
–120
–140
AMPLITUDE (dB of Full-Scale)
–160
–180
0 100 200 300 400 500 600 700 800 900 100011001200 1300 1400 1500
FREQUENCY (kHz)
Figure 14. FFT 100 kHz
92
91
90
89
88
87
SNR, SINAD (dB)
86
85
84
–55 –35 –15 125105856545255
SNR
SINAD
ENOB
TEMPERATURE (°C)
Figure 15. SNR, SINAD, and ENOB vs. Temperature
–80
–85
–90
–95
–100
–105
–110
–115
THD, HARMONICS (dB)
–120
–125
–130
–55 –35 –15 125105856545255
SFDR
THD
THIRD HARMONIC
SECOND HARMONIC
TEMPERATURE (°C)
Figure 16. THD, Harmonics, and SFDR vs. Temperature
f
= 3MSPS
S
f
= 98.79kHz
IN
SNR = 89.9dB THD = –104.9dB SFDR = 106.6dB SINAD = 89.8dB
16.0
15.5
15.0
14.5
14.0
110
105
100
95
90
85
80
75
70
65
60
04565-014
ENOB (Bits)
04565-015
SFDR (dB)
04565-016
Rev. 0 | Page 13 of 32
Page 14
AD7621
www.BDTIC.com/ADI
91.0
SNR
100k
AVDD, WARP/NORMAL
10k
90.5 SINAD
90.0
SNR, SINAD REFERRED TO FULL-SCALE (dB)
89.5
–60 –50 –40 –30 –20 –10
INPUT LEVEL (dB)
Figure 17. SNR and SINAD vs. Input Level (Referred to Full Scale)
16
14
12
A)
μ
10
8
6
DVDD, OVDD (
4
2
0
–55 –35 –15 5 25 45 65 85 105 125
AVDD
OVDD, 3.3V
OVDD, 2.5V
DVDD
TEMPERATURE (°C)
Figure 18. Power-Down Operating Currents vs. Temperature
280
270
260
250
240
230
220
210
200
0
04565-017
A)
μ
AVDD (
04565-019
1k
AVDD, IMPULSE
100
OPERATING CURRENTS (μA)
0.1
OVDD = 3.3V, ALL MODES
10
DVDD, ALL MODES
1
10 100 1k 10k 100M 1M 10M
SAMPLING RATE (SPS)
OVDD, 2.5V, ALL MODES
PDREF = PDBUF = HIGH
Figure 19. Operating Current vs. Sample Rate
20
18
16
14
12
DELAY (ns)
12
10
t
8
6
4
0 50 100 150 200
CL (pF)
OVDD = 2.5V @ 85°C
OVDD = 2.5V @ 25°C
OVDD = 3.3V @ 85°C OVDD = 3.3V @ 25°C
Figure 20. Typical Delay vs. Load Capacitance C
04565-020
04565-022
L
Rev. 0 | Page 14 of 32
Page 15
AD7621
www.BDTIC.com/ADI

THEORY OF OPERATION

IN+
MSB
32,768C 16,384C 4C 2C C C
REF
REFGND
32,768C 16,384C 4C 2C C C
MSB
IN–
Figure 21. ADC Simplified Schematic

CIRCUIT INFORMATION

The AD7621 is a very fast, low power, single-supply, precise, 16-bit analog-to-digital converter (ADC) using successive approximation architecture. The AD7621 features different modes to optimize performances according to the applications. In warp mode, the AD7621 is capable of converting 3,000,000 samples per second (3 MSPS).
The AD7621 provides the user with an on-chip track-and-hold, s
uccessive approximation ADC that does not exhibit any pipeline or latency, making it ideal for multiple multiplexed channel applications.
The AD7621 can be operated from a single 2.5 V supply and be
interfaced to either 5 V, 3.3 V, or 2.5 V digital logic. It is housed in 48-lead LQFP or tiny LFCSP packages that combine space savings with flexibility, allowing the AD7621 to be configured as either a serial or parallel interface. The AD7621 is pin-to-pin-compatible with, and a speed upgrade of, the AD7677.

CONVERTER OPERATION

The AD7621 is a successive approximation analog-to-digital converter (ADC) based on a charge redistribution DAC. Figure 21 s
hows the simplified schematic of the ADC. The capacitive DAC consists of two identical arrays of 16 binary weighted capacitors which are connected to the two comparator inputs.
During the acquisition phase, terminals of the array tied to the
mparator’s input are connected to AGND via SW+ and SW−.
co All independent switches are connected to the analog inputs. Thus, the capacitor arrays are used as sampling capacitors and acquire the analog signal on IN+ and IN− inputs. A conversion phase is initiated once the acquisition phase is complete and the CNVST SW+ and SW− are opened first. The two capacitor arrays are then disconnected from the inputs and connected to the REFGND input. Therefore, the differential voltage between the inputs (IN+ and IN−) captured at the end of the acquisition
input goes low. When the conversion phase begins,
AGND
SWITCHES
COMP
CONTROL
CONTROL
LOGIC
CNVST
BUSY
OUTPUT CODE
04565-024
LSB
LSB
SW+
SW–
AGND
phase is applied to the comparator inputs, causing the comparator to become unbalanced. By switching each element of the capacitor array between REFGND and REF, the comparator input varies by binary weighted voltage steps (V
/2, V
REF
/4 through V
REF
/65536). The control logic toggles
REF
these switches, starting with the MSB first, in order to bring the comparator back into a balanced condition. After the completion of this process, the control logic generates the ADC output code and brings BUSY output low.

MODES OF OPERATION

The AD7621 features four modes of operation: wideband warp, warp, normal, and impulse. Each of these modes is more suitable to specific applications.
Wideband warp (WARP = high, IMPULSE = high) and warp
ARP = high, IMPULSE = low) modes allow the fastest
(W conversion rate up to 3 MSPS. However, in these modes, the full specified accuracy is guaranteed only when the time between conversions does not exceed 1 ms. If the time between two consecutive conversions is longer than 1 ms (after power up), the first conversion result should be ignored. These modes make the AD7621 ideal for applications where both high accuracy and fast sample rate are required. Wideband warp mode offers slightly improved linearity and THD over warp mode.
Normal mode (WARP = low, IMPULSE = low) is the fastest
ode (2 MSPS) without any limitation on time between
m conversions. This mode makes the AD7621 ideal for asynchronous applications such as data acquisition systems, where both high accuracy and fast sample rate are required.
Impulse mode (WARP = low, IMPULSE = high), the lowest
ower dissipation mode, allows power saving between
p conversions. The maximum throughput in this mode is
1.25 MSPS. In this mode, the ADC powers down circuits after conversion making the AD7621 ideal for battery-powered applications.
Rev. 0 | Page 15 of 32
Page 16
AD7621
www.BDTIC.com/ADI

TRANSFER FUNCTIONS

Using the OB/2C digital input, the AD7621 offers two output codings: straight binary and twos complement. The LSB size with V Figure 22 and Table 7 for the ideal transfer characteristic.
= 2.048 V is 2 × V
REF
111...111
111...110
111...101
ADC CODE (Straight Binary)
000...010
000...001
000...000 –FSR
–FSR+0.5 LSB
Figure 22. ADC Ideal Transfer Function
ANALOG
SUPPLY (2.5V)
10μF
/65536, which is 62.5 μV. Refer to
REF
+FSR–1 LSB–FSR+1 LSB
ANALOG INPUT
100nF
+FSR–1.5 LSB
NOTE 5
10Ω
10μF
100nF 100nF
04565-025
DIGITAL
SUPPLY (2.5V)
Table 7. Output Codes and Ideal Input Voltages
Digital Output Code
Description
V
= 2.048 V
REF
FSR −1 LSB +2.047938 V 0xFFFF1 FSR − 2 LSB +2.047875 V 0xFFFE 0x7FFE Midscale + 1 LSB +62.5 μV 0x8001 0x0001 Midscale 0 V 0x8000 0x0000 Midscale − 1 LSB −62.5 μV 0x7FFF 0xFFFF
−FSR + 1 LSB −2.047938 V 0x0001 0x8001
−FSR −2.048 V 0x00002
1
This is also the code for overrange analog input (V
V
− V
Analog Input
REF
2
This is also the code for underrange analog input (V
−V
).
REFGND
+ V
REFGND
).
(2.5V OR 3.3V)
10μF
REF
Straight Binary
DIGITAL
INTERFACE
SUPPLY
− V
IN+
− V
IN+
Twos Complement
1
0x7FFF
2
0x8000
above
IN−
below
IN−
AVDD
AGND DGND DVDD OVDD OGND
REF
C
REF
10μF
100nF
NOTE 4
NOTE 2
ANALOG
INPUT +
ANALOG
INPUT –
1. SEE ANALOG INPUT SECTION.
2. THE AD8021 IS RECOMMENDED. SEE DRIVER AMPLIFIER CHOICE SECTION.
3. THE CONFIGURATION SHOWN IS USING THE INTERNAL REFERENCE. SEE VOLTAGE REFERENCE INPUT SECTION.
4. A 10μF CERAMIC CAPACITOR (X5R, 1206 SIZE) IS RECOMMENDED (e.g., PANASONIC ECJ3YB0J106M). SEE VOLTAGE REFERENCE INPUT SECTION.
5. OPTION, SEE POWER SUPPLY SECTION.
6. OPTION, SEE POWER UP SECTION.
7. OPTIONAL LOW JITTER CNVST, SEE CONVERSION CONTROL SECTION.
U1
C
NOTE 2
U2
C
10Ω
C
C
1nF
NOTE 1
10Ω
1nF
NOTE 1
REFBUFIN
REFGND
IN+
IN–
NOTE 3
AD7621
PD
PDREF
NOTE 3
PDBUF
SCLK
SDOUT
BUSY
CNVST
OB/2C
SER/PAR
WARP
IMPULSE
CS RD
RESET
Figure 23. Typical Connection Diagram
50Ω
50pF
50pF
10kΩ
NOTE 6
SERIAL
PORT
NOTE 7
OVDD
D
CLOCK
MICROCONVERTER/ MICROPROCESSOR/
DSP
04565-026
Rev. 0 | Page 16 of 32
Page 17
AD7621
www.BDTIC.com/ADI

TYPICAL CONNECTION DIAGRAM

Figure 23 shows a typical connection diagram for the AD7621. Different circuitry from that shown in this diagram are optional and are discussed below.

ANALOG INPUTS

Figure 24 shows an equivalent circuit of the input structure of the AD7621.
The two diodes, D analog inputs, IN+ and IN−. Care must be taken to ensure that the analog input signal never exceeds the supply rails by more than 0.3 V as this causes the diodes to become forward-biased and start conducting current. These diodes can handle a forward-biased current of 100 mA maximum. For instance, these conditions could eventually occur when the input buffer’s U1 or U2 supplies are different from AVDD. In such a case, an input buffer with a short-circuit current limitation can be used to protect the part.
IN+ OR IN–
AGND
The analog input of AD7621 is a true differential structure. By using this differential input, small signals common to both inputs are rejected, as shown in Figure 25, representing the t
ypical CMRR over frequency with internal and external
references.
75
70
65
60
CMRR (dB)
55
50
45
1 10 100 1k 10k
During the acquisition phase for ac signals, the impedance of the analog inputs, IN+ and IN−, can be modeled as a parallel combination of Capacitor C series connection of R capacitance. R
and D2, provide ESD protection for the
1
AVDD
D
1
C
PIN
Figure 24. AD7621 Simplified Analog Input.
Figure 25. Analog Input C MRR vs. Frequency
is typically 350 Ω and is a lumped component
IN
D
EXT REF
FREQUENCY (kHz)
PIN
and CIN. C
IN
2
INT REF
and the network formed by the
is primarily the pin
PIN
C
R
IN
IN
04565-027
04565-099
comprised of some serial resistors and the on resistance of the switches. C
is typically 12 pF and is mainly the ADC sampling
IN
capacitor. During the conversion phase, when the switches are opened, the input impedance is limited to C
. RIN and CIN
PIN
make a one-pole, low-pass filter that has a typical −3 dB cutoff frequency of 50 MHz, thereby reducing an undesirable aliasing effect while limiting noise from the inputs.
Since the input impedance of the AD7621 is very high, the AD7621 can
be directly driven by a low impedance source without gain error. To further improve the noise filtering achieved by the AD7621 analog input circuit, an external, one­pole RC filter between the amplifier’s outputs and the ADC analog inputs can be used, as shown in
rge source impedances significantly affect the ac performance,
la
Figure 23. However,
especially total harmonic distortion (THD). The maximum source impedance depends on the amount of THD that can be tolerated. The THD degrades as a function of the source impedance and the maximum input frequency, as shown in Figure 26.
–60
PDBUF = PDREF = LOW
–65
–70
–75
–80
–85
THD (dB)
–90
–95
–100
–105
1 10 100 1k
Figure 26. THD vs. Analog Input Frequency and Source Resistance
INPUT FREQUENCY (kHz)
R
= 50Ω
S
R
S
RS = 500Ω
= 100Ω
= 10Ω
R
S
04565-029

DRIVER AMPLIFIER CHOICE

Although the AD7621 is easy to drive, the driver amplifier needs to meet the following requirements:
ogether, the driver amplifier and the AD7621 analog
T
input circuit must be able to settle for a full-scale step of the capacitor array at a 16-bit level (0.0015%). In the amplifier data sheet, settling at 0.1% to 0.01% is more commonly specified. This could differ significantly from the settling time at a 16-bit level and should be verified prior to driver selection. The AD8021 op amp, which combines ultralow noise and high gain bandwidth, meets this settling time requirement even when used with gains up to 13.
The
noise generated by the driver amplifier needs to be kept as low as possible in order to preserve the SNR and transition noise performance of the AD7621. The noise
Rev. 0 | Page 17 of 32
Page 18
AD7621
www.BDTIC.com/ADI
coming from the driver is filtered by the AD7621 analog input circuit one-pole, low-pass filter made by R or by the external filter, if one is used. The SNR degradation due to the amplifier is
and CIN
IN
ANALOG INPUT
(UNIPOLAR 0V TO 2.048V)
U1
AD8021
10pF
SNR
LOSS
⎛ ⎜
=
log20
⎜ ⎜
2809
53
+
π
−23
⎞ ⎟
⎟ ⎟
()
Nef
NdB
where:
f
is the input bandwidth of the AD7621 (50 MHz) or
–3dB
the cutoff frequency of the input filter (16 MHz), if one is used.
N is t
he noise factor of the amplifier (+1 in buffer
configuration).
e
is the equivalent input voltage noise density of the op
N
amp, in nV/√Hz.
For instance, a driver with an equivalent input noise den
sity of 2.1 nV/√Hz, like the AD8021 with a noise gain of +1 when configured as a buffer, degrades the SNR by only 0.33 dB when using the RC filter in Figure 23, and by 1 dB wi
thout.
The dr
iver needs to have a THD performance suitable to that of the AD7621. Figure 13 gives the THD vs. frequency t
hat the driver should exceed.
The AD8021
meets these requirements and is appropriate for almost all applications. The AD8021 needs a 10 pF external compensation capacitor that should have good linearity as an NPO ceramic or mica type. Moreover, the use of a noninverting +1 gain arrangement is recommended and helps to obtain the best signal-to-noise ratio.
The AD8022
can also be used when a dual version is needed and a gain of 1 is present. The AD829 is an alternative in applications where high frequency (above 100 kHz) performance is not required. In applications with a gain of 1, an 82 pF compensation capacitor is required. The AD8610 is an option when low bias current is needed in low frequency applications.

Single-to-Differential Driver

For applications using unipolar analog signals, a single-ended­to-differential driver, as shown in Figure 27, allows for a
ferential input into the part. This configuration, when
dif provided an input signal of 0 to V ±V
with midscale at V
REF
/2. The one-pole filter using R = 10 Ω
REF
, will produce a differential
REF
and C = 1 nF provides a corner frequency of 16 MHz.
If the application can tolerate more noise, the AD8139
ferential driver can be used.
dif
590Ω 590Ω
1kΩ
1kΩ
100nF
Figure 27. Single-Ended-to-Dif
U2
AD8021
10pF
(Internal Reference Buffer Used)
10Ω
1nF
10Ω
1nF
ferential Driver Circuit
IN+
IN–
AD7621
REF
10μF

VOLTAGE REFERENCE INPUT

The AD7621 allows the choice of either a very low temperature drift internal voltage reference or an external reference.
Unlike many ADCs with internal references, the internal r
eference of the AD7621 provides excellent performance and
can be used in almost all applications.
Internal Reference (PDBUF = Low, PDREF = Low)
To use the internal reference, the PDREF and PDBUF inputs must be low. This produces a 1.2 V band gap output on REFBUFIN which, amplified by the internal buffer, results in a
2.048 V reference on the REF pin. The internal reference is temperature-compensated to 2.048 V ±
10 mV
. The reference is trimmed to provide a typical drift of
7 ppm/°C. This typical drift characteristic is shown in
The output resistance of the REFBUFIN is 6.33 kΩ (minimum)
hen the internal reference is enabled. It is necessary to
w decouple this with a ceramic capacitor greater than 100 nF. Thus, the capacitor provides an RC filter for noise reduction.
Since the output impedance of REFBUFIN is typically 6.33 kΩ, r
elative humidity (among other industrial contaminates) can directly affect the drift characteristics of the reference. Typically, a guard ring is used to reduce the effects of drift under such circumstances. However, since the AD7621 has a fine lead pitch, guarding this node is not practical. Therefore, in these industrial and other types of applications, it is recommended to use a conformal coating such as Dow Corning 1-2577 or Humiseal 1B73.
External 1.2 V Reference and Internal Buffer (PDREF = High, PBBUF = Low)
To use an external reference with the internal buffer, PDREF should be high and PDBUF should be low. This powers down the internal reference and allows the 1.2 V reference to be applied to REFBUFIN.
Figure 7.
04565-030
Rev. 0 | Page 18 of 32
Page 19
AD7621
www.BDTIC.com/ADI
External Reference (PDBUF = High, PRBUF = High)
To use an external reference directly on the REF pin, PDREF and PDBUF should both be high.
For improved drift performance, an external reference, such as
e AD780 or ADR431, can be used. The advantages of directly
th using the external voltage reference are:
S
NR and dynamic range improvement (about 1.7 dB) resulting from the use of a reference voltage very close to the supply (2.5 V) instead of a typical 2.048 V reference when the internal reference is used. This is calculated by
048.2
=
log20SNR
⎜ ⎝
ower savings when the internal reference is powered
P
50.2
down (PBREF = PDBUF = high).
PDREF and PDBUF power down the internal reference and the
nternal reference buffer, respectively.
i

Reference Decoupling

Whether using an internal or external reference, the AD7621 voltage reference input (REF) has a dynamic input impedance; therefore, it should be driven by a low impedance source with efficient decoupling between the REF and REFGND inputs. This decoupling depends on the choice of the voltage reference, but usually consists of a low ESR capacitor connected to REF and REFGND with minimum parasitic inductance. A 10 μF (X5R, 1206 size) ceramic chip capacitor (or 47 μF tantalum capacitor) is appropriate when using either the internal reference or one of these recommended reference voltages:
The lo
The lo
The lo
w noise, low temperature drift ADR431 and AD780 w power ADR291 w cost AD1582
The placement of the reference decoupling is also important to th
e performance of the AD7621. The decoupling capacitor should be mounted on the same side as the ADC right at the REF pin with a thick PCB trace. The REFGND should also connect to the reference decoupling capacitor with the shortest distance.

Temperature Sensor

The TEMP pin measures the temperature of the AD7621. To improve the calibration accuracy over the temperature range, the output of the TEMP pin is applied to one of the inputs of the analog switch (such as, ADG779), and the ADC itself is used to measure its own temperature. This configuration is shown in Figure 28.
ANALOG INPUT
(UNIPOLAR)
ADG779
AD8021
Figure 28. Use of the Temperature Sensor
C
C
IN+
TEMP
AD7621
TEMPERATURE SENSOR
04565-031

POWER SUPPLY

The AD7621 uses three sets of power supply pins: an analog
2.5 V supply AVDD, a digital 2.5 V core supply DVDD, and a digital input/output interface supply OVDD. The OVDD supply allows direct interface with any logic working between 2.3 V and 5.25 V. To reduce the number of supplies needed, the digital core (DVDD) can be supplied through a simple RC filter from the analog supply as shown in

Power Sequencing

The AD7621 is independent of power supply sequencing once OVDD does not exceed DVDD by more than 0.3 V until DVDD = 2.3 V during any time; for instance, at power-up or power-down (see the
dditionally, it is very insensitive to power supply variations
A
Absolute Maximum Ratings section).
over a wide frequency range as shown in
75
70
65
60
PSRR (dB)
55
50
EXT REF
Figure 23.
Figure 29.
INT REF
For applications that use multiple AD7621 devices, it is more ef
fective to use the internal reference buffer in order to buffer
45
1 10 100 1k 10k
the reference voltage.
The voltage reference temperature coefficient (TC) directly
pacts full scale; therefore, in applications where full-scale
im
Figure 29. PSRR v s. Frequency
accuracy matters, care must be taken with the TC. For instance, a ±15 ppm/°C TC of the reference changes full-scale by ±1 LSB/°C.
Rev. 0 | Page 19 of 32
FREQUENCY (kHz)
04565-098
Page 20
AD7621
www.BDTIC.com/ADI

Power-Up

At power-up, or returning to operational mode from the power­down mode (PD = high), the AD7621 engages an initialization process. During this time, the first 128 conversions should be ignored or the RESET input could be pulsed to engage a faster initialization process. Refer to the RES
ET and timing details.
A simple power-on reset circuit, as shown in Figure 23, can be
ed to minimize the digital interface. As OVDD powers up, the
us capacitor is shorted and brings RESET high; it is then charged returning RESET to low. However, this circuit only works when powering up the AD7621 because the power down mode (PD = high) does not power down any of the supplies. As a result, RESET is low.

POWER DISSIPATION VS. THROUGHPUT

In impulse mode, the AD7621 automatically reduces its power consumption at the end of each conversion phase. During the acquisition phase, the operating currents are very low which allows a significant power saving when the conversion rate is reduced (see f
or very low power, battery-operated applications.
It should be noted that the digital interface remains active even d
uring the acquisition phase. To reduce the operating digital supply currents even further, drive the digital inputs close to the power rails (that is, OVDD and OGND).
100k
10k
Figure 30). This feature makes the AD7621 ideal
WARP MODE POWER
Digital Interface section for

CONVERSION CONTROL

t
CNVST
CNVST
input. A falling edge
2
t
6
t
8
CNVST
should not
low time, t1, or until the end
Figure 23.
The AD7621 is controlled by the
CNVST
on
is all that is necessary to initiate a conversion. Detailed timing diagrams of the conversion process are shown in Figure 31. Once initiated, it cannot be restarted or aborted,
ven by the power-down input, PD, until the conversion is
e complete. The RD
signals.
CNVST
BUSY
MODE
CNVST
signal operates independently of CS and
t
1
t
1
t
t
3
t
5
4
CONVERT ACQUIREACQUIRE CONVERT
t
7
Figure 31. Basic Conversion Timing
For optimal performance, the rising edge of occur after the maximum of conversion.
CNVST
Although
is a digital signal, it should be designed with special care with fast, clean edges, and levels with minimum overshoot, undershoot, or ringing.
CNVST
The
trace should be shielded with ground and a low value (such as 50 Ω) serial resistor termination should be added close to the output of the component that drives this line. Also, a 60 pF capacitor is recommended to further reduce the effects of overshoot and undershoot as shown in
04565-034
IMPULSE MODE POWER
1k
POWER DISSIPATION (μW)
For applications where SNR is critical, the have very low jitter. This can be achieved by using a dedicated oscillator for
CNVST
generation, or by clocking
high frequency, low jitter clock, as shown in Figure 23.
100
100 1k 10k 100k 1M 10M
SAMPLING RATE (SPS)
Figure 30. Power Dissipation vs. Sample Rate
PDREF = PDBUF = HIGH
04565-032
Rev. 0 | Page 20 of 32
CNVST
signal should
CNVST
with a
Page 21
AD7621
A
www.BDTIC.com/ADI

INTERFACES

DIGITAL INTERFACE

The AD7621 has a versatile digital interface that can be set up as either a serial or parallel interface with the host system. The serial interface is multiplexed on the parallel data bus. The AD7621 digital interface also accommodates 2.5 V, 3.3 V, or 5 V logic with either OVDD at 2.5 V or 3.3 V. OVDD defines the logic high output voltage. In most applications, the OVDD supply pin of the AD7621 is connected to the host system interface 2.5 V or 3.3 V digital supply. Finally, by using the
2C
OB/
input pin, both twos complement or straight binary
coding can be used.
CS
The two signals, one of these signals is high, the interface outputs are in high impedance. Usually, multicircuit applications and is held low in a single AD7621
RD
design.
is generally used to enable the conversion result on
the data bus.

RESET

The RESET input is used to reset the AD7621 and generate a fast initialization. A rising edge on RESET aborts the current conversion (if any) and tristates the data bus. The falling edge of RESET clears the data bus and engages the initialization process indicated by pulsing BUSY high. Conversions can take place after the falling edge of BUSY. Refer to ti
ming details.
RESET
and RD, control the interface. When at least
CS
allows the selection of each AD7621 in
Figure 32 for the RESET
t
9

PARALLEL INTERFACE

The AD7621 is configured to use the parallel interface when
PA R
SER/

Master Parallel Interface

Data can be continuously read by tying CS and RD low thus requiring minimal microprocessor connections. However, in this mode the data bus is always driven and cannot be used in shared bus applications (unless the device is held in RESET). Figure 33 details the timing for this mode.
CS = RD = 0
CNVST
BUSY
DATA

Slave Parallel Interface

In slave parallel reading mode, the data can be read either after each conversion, which is during the next acquisition phase, or during the following conversion, as shown in Figure 34 and Figure 35, respectively. When the data is read during the co first half of the conversion phase. This avoids any potential feedthrough between voltage transients on the digital interface and the most critical analog conversion circuitry.
is held low.
t
1
t
10
t
t
3
BUS
Figure 33. Master Parallel Data Timing for Reading (Continuous Read)
PREVIOUS CONVERSION DATA NEW DATA
4
t
11
nversion, it is recommended that it is read-only during the
04565-036
CNVST
DATA
BUSY
t
38
t
39
Figure 32. RESET Timing
CS
RD
t
8
04565-035
Rev. 0 | Page 21 of 32
BUSY
DAT
BUS
t
12
Figure 34. Slave Parallel Data Timing for Reading (Read After Convert)
CURRENT
CONVERSION
t
13
04565-037
Page 22
AD7621
www.BDTIC.com/ADI
CS = 0
CNVST,
RD
BUSY
t
DATA
BUS
t
12
Figure 35. Slave Parallel Data Timing for Reading (Read During Convert)

8-Bit Interface (Master or Slave)

The BYTESWAP pin allows a glueless interface to an 8-bit bus. As shown in Figure 36, when BYTESWAP is low, the LSB byte is output
on D[7:0] and the MSB is output on D[15:8]. When BYTESWAP is high, the LSB and MSB bytes are swapped, and the LSB is output on D[15:8] and the MSB is output on D[7:0]. By connecting BYTESWAP to an address line, the 16-bit data can be read in two bytes on either D[15:8] or D[7:0]. This interface can be used in both master and slave parallel reading modes.
CS
RD
BYTESWAP
PINS D[15:8]
PINS D[7:0]
HI-Z
HI-Z
Figure 36. 8-Bit and 16-Bit Parallel Interface
t
1
3
PREVIOUS
CONVERSION
t
13
HIGH BYTE LOW BYTE
t
12
LOW BYTE HIGH BYTE
t
4
HI-Z
t
t
12
13
HI-Z
04565-038
04565-039

SERIAL INTERFACE

The AD7621 is configured to use the serial interface when
PA R
SER/
is held high. The AD7621 outputs 16 bits of data, MSB first, on the SDOUT pin. This data is synchronized with the 16 clock pulses provided on the SCLK pin. The output data is valid on both the rising and falling edge of the data clock.

MASTER SERIAL INTERFACE

Internal Clock

The AD7621 is configured to generate and provide the serial
INT
data clock SCLK when the EXT/ AD7621 also generates a SYNC signal to indicate to the host when the serial data is valid. The serial clock SCLK and the SYNC signal can be inverted, if desired. Depending on the read during convert input, RDC/SDIN, the data can be read after each conversion or during the following conversion. a
nd Figure 38 show detailed timing diagrams of these two
mo
des.
Usually, because the AD7621 is used with a fast throughput, the
ter read during conversion mode is the most recommended
mas serial mode. In this mode, the serial clock and data toggle at appropriate instants, minimizing potential feedthrough between digital activity and critical conversion decisions. In this mode, the SCLK period changes since the LSBs require more time to settle and the SCLK is derived from the SAR conversion cycle.
In read after conversion mode, unlike other modes, the BUSY
nal returns low after the 16 data bits are pulsed out and not at
sig the end of the conversion phase resulting in a longer BUSY width. As a result, the maximum throughput cannot be achieved in this mode.
pin is held low. The
Figure 37
Rev. 0 | Page 22 of 32
Page 23
AD7621
S
www.BDTIC.com/ADI
CS, RD
CNVST
BUSY
SYNC
SCLK
DOUT
EXT/INT = 0
t
3
t
29
t
14
t
20
t
15
X
t
16
t
22
RDC/SDIN = 0 INVSCLK = INVSYNC = 0
t
28
t
30
t
18
t
19
t
21
123 141516
D15 D14 D2 D1 D0
t
23
t
24
t
25
t
26
t
27
04565-040
Figure 37. Master Serial Data Timing for Reading (Read After Convert)
RDC/SDIN = 1 INVSCLK = INVSYNC = 0
23
t
25
t
24
t
26
t
27
04565-041
CS, RD
CNVST
BUSY
SYNC
SCLK
SDOUT
EXT/INT = 0
t
1
t
3
t
17
t
14
t
15
t
18
t
16
t
22
t
19
t20t
21
123 141516
D15 D14 D2 D1 D0X
t
Figure 38. Master Serial Data Timing for Reading (Read Previous Conversion During Convert)
Rev. 0 | Page 23 of 32
Page 24
AD7621
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SLAVE SERIAL INTERFACE

External Clock

The AD7621 is configured to accept an externally supplied
INT
serial data clock on the SCLK pin when the EXT/ held high. In this mode, several methods can be used to read the data. The external serial clock is gated by RD
are both low, the data can be read after each conversion or
CS
during the following conversion. The external clock can be either a continuous or a discontinuous clock. A discontinuous clock can be either normally high or normally low when inactive. d
Figure 40 and Figure 41 show the detailed timing
iagrams of these methods.
While the AD7621 is performing a bit decision, it is important
at voltage transients be avoided on digital input/output pins
th or degradation of the conversion result could occur. This is particularly important during the second half of the conversion phase because the AD7621 provides error correction circuitry that can correct for an improper bit decision made during the first half of the conversion phase. For this reason, it is recommended that when an external clock is being provided, it is a discontinuous clock that is toggling only when BUSY is low or, more importantly, that it does not transition during the latter half of BUSY high.

External Discontinuous Clock Data Read After Conversion

Though the maximum throughput cannot be achieved using this mode, it is the most recommended of the serial slave modes. Figure 40 shows the detailed timing diagrams of this m
ethod. After a conversion is complete, indicated by BUSY
returning low, the conversion result can be read while both
are low. Data is shifted out MSB first with 16 clock
and
RD
pulses and is valid on the rising and falling edges of the clock.
Among the advantages of this method is the fact that
nversion performance is not degraded because there are no
co voltage transients on the digital interface during the conversion process. Another advantage is the ability to read the data at any speed up to 80 MHz, which accommodates both the slow digital host interface and the fastest serial reading.
Finally, in this mode only, the AD7621 provides a daisy-chain f
eature using the RDC/SDIN pin for cascading multiple converters together. This feature is useful for reducing component count and wiring connections when desired, as, for instance, in isolated multiconverter applications.
An example of the concatenation of two devices is shown in Figure 39. Simultaneous sampling is possible by using a
pin is
. When CS and
CS
CNVST
mmon
co
signal. It should be noted that the RDC/SDIN input is latched on the edge of SCLK opposite to the one used to shift out the data on SDOUT. Hence, the MSB of the upstream converter just follows the LSB of the downstream converter on the next SCLK cycle.
BUSY OUT
BUSYBUSY
AD7621
#2
(UPSTREAM)
RDC/SDIN SDOUT
CNVST
CS
SCLK
SCLK IN
CS IN
CNVST IN
Figure 39. Two AD7621 Devices in a Daisy-Chain Configuration
AD7621
#1
(DOWNSTREAM)
SDOUTRDC/SDIN
CNVST
SCLK
CS
DATA OUT
04565-042

External Clock Data Read During Previous Conversion

Figure 41 shows the detailed timing diagrams of this method. During a conversion, while both
CS
and RD are low, the result of the previous conversion can be read. The data is shifted out, MSB first, with 16 clock pulses and is valid on both the rising and falling edge of the clock. The 16 bits have to be read before the current conversion is complete, otherwise; RDERROR is pulsed high and can be used to interrupt the host interface to prevent incomplete data reading. There is no daisy-chain feature in this mode and RDC/SDIN input should always be tied either high or low.
To reduce performance degradation due to digital activity, a fast
iscontinuous clock (at least 30 MHz when impulse mode is
d used, 60 MHz when normal mode is used, or 80 MHz when warp mode is used) is recommended to ensure that all the bits are read during the first half of the SAR conversion phase.
It is also possible to begin to read data after conversion and
ntinue to read the last bits after a new conversion has been
co initiated. However, this is not recommended when using the fastest throughput of any mode since the acquisition times are only 70 ns, 100 ns, and 50 ns for warp, normal, and impulse modes.
If the maximum throughput is not used, thus allowing more acq
uisition time, then the use of a slower clock speed can be
used to read the data.
Rev. 0 | Page 24 of 32
Page 25
AD7621
S
S
www.BDTIC.com/ADI
BUSY
SCLK
DOUT
SDIN
CS
CS
EXT/INT = 1
t
35
t36t
37
123 1415161718
t
31
X
D15 D14 D1
t
16
t
33
t
34
X15 X14 X13 X1 X0 Y15 Y14
Figure 40. Slave Serial Data Timing for Reading (Read After Convert)
t
32
D13
EXT/INT = 1 INVSCLK = 0
INVSCLK = 0
RD = 0
RD = 0
D0
X15 X14
04565-043
CNVST
BUSY
SCLK
DOUT
t
3
t
31
t
16
t
35
t36t
37
123 141516
t
32
X
D15 D14 D13
Figure 41. Slave Serial Data Timing for Reading (Read Previous Conversion During Convert)
D1
D0
04565-044
Rev. 0 | Page 25 of 32
Page 26
AD7621
www.BDTIC.com/ADI

MICROPROCESSOR INTERFACING

The AD7621 is ideally suited for traditional dc measurement applications supporting a microprocessor, and ac signal processing applications interfacing to a digital signal processor. The AD7621 is designed to interface with a parallel 8-bit or 16-bit wide interface, or with a general-purpose serial port or I/O ports on a microcontroller. A variety of external buffers can be used with the AD7621 to prevent digital noise from coupling into the ADC. The following section illustrates the use of the AD7621 with an ADSP-219x SPI-equipped DSP.

SPI Interface (ADSP-219x)

Figure 42 shows an interface diagram between the AD7621 and an SPI-equipped DSP, ADSP-219x. To accommodate the slower speed of the DSP, the AD7621 acts as a slave device and data must be read after conversion. This mode also allows the daisy­chain feature. The convert command could be initiated in response to an internal timer interrupt. The reading process can be initiated in response to the end-of-conversion signal (BUSY
going low) using an interrupt line of the DSP. The serial p
eripheral interface (SPI) on the ADSP-219x is configured for master mode (MSTR) = 1, clock polarity bit (CPOL) = 0, clock phase bit (CPHA) = 1, and SPI interrupt enable (TIMOD) = 00 by writing to the SPI control register (SPICLTx). It should be noted that to meet all timing requirements, the SPI clock should be limited to 17 Mb/s allowing it to read an ADC result in less than 1 μs. When a higher sampling rate is desired, use one of the parallel interface modes.
DVDD
AD7621*
SER/PAR EXT/INT
RD INVSCLK
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 42. Interfacing the AD7621 to SPI Interface
BUSY
CS
SDOUT
SCLK
CNVST
ADSP-219x*
PFx SPIxSEL (PFx) MISOx SCKx PFx OR TFSx
04565-045
Rev. 0 | Page 26 of 32
Page 27
AD7621
www.BDTIC.com/ADI

APPLICATION

LAYOUT

While the AD7621 has very good immunity to noise on the power supplies, exercise care with the grounding layout. To facilitate the use of ground planes that can be easily separated, design the printed circuit board that houses the AD7621 so that the analog and digital sections are separated and confined to certain areas of the board. Digital and analog ground planes should be joined in only one place, preferably underneath the AD7621, or as close as possible to the AD7621. If the AD7621 is in a system where multiple devices require analog-to-digital ground connections, the connections should still be made at one point only, a star ground point, established as close as possible to the AD7621.
To prevent coupling noise onto the die, avoid radiating noise,
d to reduce feedthrough:
an
D
o not run digital lines under the device.
Do r
un the analog ground plane under the AD7621.
CNVST
o shield fast switching signals, like
D
digital ground to avoid radiating noise to other sections of the board, and never run them near analog signal paths.
A
void crossover of digital and analog signals.
R
un traces on different but close layers of the board, at right angles to each other, to reduce the effect of feedthrough through the board.
The power supply lines to the AD7621 should use as large a
race as possible to provide low impedance paths and reduce the
t effect of glitches on the power supply lines. Good decoupling is also important to lower the impedance of the supplies presented to the AD7621, and to reduce the magnitude of the supply spikes. Decoupling ceramic capacitors, typically 100 nF, should be placed on each of the power supplies pins, AVDD, DVDD, and OVDD. The capacitors should be placed close to, and ideally right up against, these pins and their corresponding ground pins. Additionally, low ESR 10 μF capacitors should be located in the vicinity of the ADC to further reduce low frequency ripple.
or clocks, with
The DVDD supply of the AD7621 can be either a separate
pply or come from the analog supply, AVDD, or from the
su digital interface supply, OVDD. When the system digital supply is noisy, or fast switching digital signals are present, and no separate supply is available, it is recommended to connect the DVDD digital supply to the analog supply AVDD through an RC filter, and to connect the system supply to the interface digital supply OVDD and the remaining digital circuitry. Refer to
Figure 23 for an example of this configuration. When DVDD
is
powered from the system supply, it is useful to insert a bead
to further reduce high frequency spikes.
The AD7621 has four different ground pins: REFGND, AGND, D
GND, and OGND. REFGND senses the reference voltage and, because it carries pulsed currents, should be a low impedance return to the reference. AGND is the ground to which most internal ADC analog signals are referenced; it must be connected with the least resistance to the analog ground plane. DGND must be tied to the analog or digital ground plane depending on the configuration. OGND is connected to the digital system ground.
The layout of the decoupling of the reference voltage is
portant. To minimize parasitic inductances, place the
im decoupling capacitor close to the ADC and connect it with short, thick traces.

EVALUATING THE AD7621 PERFORMANCE

A recommended layout for the AD7621 is outlined in the documentation of the EVAL-AD7621CB evaluation board for the AD7621. The evaluation board package includes a fully assembled and tested evaluation board, documentation, and software for controlling the board from a PC via the EVAL-
CONTROLBRD3.
Rev. 0 | Page 27 of 32
Page 28
AD7621
www.BDTIC.com/ADI

OUTLINE DIMENSIONS

1.45
1.40
1.35
0.15
SEATING
0.05
PLANE
VIEW A
ROTATED 90° CCW
7.00
BSC SQ
PIN 1 INDICATOR
TOP
VIEW
0.75
0.60
0.45
0.20
0.09 7°
3.5° 0°
0.08 MAX COPLANARITY
COMPLIANT TO JEDEC STANDARDS MS-026BBC
1.60 MAX
VIEW A
LEAD PITCH
1
12
0.50
BSC
48
13
9.00 BSC SQ
PIN 1
TOP VIEW
(PINS DOWN)
Figure 43. 48-Lead Low Profile Quad Flatpack (LQFP)
[ST
-48]
Dimensions shown in millimeters
37
36
0.60 MAX
EXPOSED
P
A
D
(BOTTOM VIEW)
6.75
BSC SQ
0.60 MAX
0.30
0.23
0.18
37
36
7.00
BSC SQ
25
24
0.27
0.22
0.17
PIN 1
48
INDICATOR
1
5.25
5.10 SQ
4.95
1.00
0.85
0.80
12° MAX
SEATING PLANE
0.50
0.40
0.30
0.80 MAX
0.65 TYP
0.50 BSC
COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2
0.20REF
0.05 MAX
0.02 NOM
25
24
COPLANARITY
0.08
5.50 REF
13
Figure 44. 48-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
mm × 7 mm Body, Very Thin Quad
7
[CP-48-1]
Dimensions shown in millimeters
12
0.25 MIN
PADDLE CONNECTED TO GND. THIS CONNECTION IS NOT REQUIRED TO MEET THE ELECTRICAL PERFORMANCES
Rev. 0 | Page 28 of 32
Page 29
AD7621
www.BDTIC.com/ADI

ORDERING GUIDE

Model Temperature Range Package Description Package Option
AD7621ACP −40°C to +85°C 48-Lead Lead Frame Chip Scale (LFCSP_VQ) CP-48-1 AD7621ACPRL −40°C to +85°C 48-Lead Lead Frame Chip Scale (LFCSP_VQ) CP-48-1 AD7621ACPZ1 −40°C to +85°C 48-Lead Lead Frame Chip Scale (LFCSP_VQ) CP-48-1 AD7621ACPZRL AD7621AST −40°C to +85°C 48-Lead Low Profile Quad Flatpack (LQFP) ST-48 AD7621ASTRL −40°C to +85°C 48-Lead Low Profile Quad Flatpack (LQFP) ST-48 AD7621ASTZ AD7621ASTZRL EVAL-AD7621CB EVAL-CONTROLBRD3
1
Z = Pb-free part.
2
This board can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL BRD3 for evaluation/demonstration purposes.
3
This board allows a PC to control and communicate with all Analog Devices, Inc. evaluation boards ending in the CB designators.
1
1
1
2
−40°C to +85°C 48-Lead Lead Frame Chip Scale (LFCSP_VQ) CP-48-1
−40°C to +85°C 48-Lead Low Profile Quad Flatpack (LQFP) ST-48
−40°C to +85°C 48-Lead Low Profile Quad Flatpack (LQFP) ST-48 Evaluation Board
3
Controller Board
Rev. 0 | Page 29 of 32
Page 30
AD7621
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NOTES
Rev. 0 | Page 30 of 32
Page 31
AD7621
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NOTES
Rev. 0 | Page 31 of 32
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AD7621
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NOTES
©2005 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.
D04565–0–5/05(0)
Rev. 0 | Page 32 of 32
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