FEATURES
256 Switches in a 16 ⴛ 16 Array
Wide Signal Range: to Supply Rails of 24 V or ⴞ12 V
Low On-Resistance: 200 ⍀ Typ
TTL/CMOS/Microprocessor-Compatible Control Lines
Serial Input Simplifies Interface
Serial Output Allows Cascading for More Channels
Low Power Consumption: 2 mW Quiescent
Compact 44-Lead PLCC
PRODUCT DESCRIPTION
The AD75019 contains 256 analog switches in a 16 × 16 array.
Any of the X or Y pins may serve as an input or output. Any or
all of the X terminals may be programmed to connect to any or
all of the Y terminals. The switches can accommodate signals
with amplitudes up to the supply rails and have a typical on-
resistance of 150 Ω.
Data is loaded serially via the SIN input and clocked into an onboard 256-bit shift register via SCLK. When all the switch settings have been programmed, data is transferred into a set of
256 latches via PCLK. The serial shift register is dynamic, so
there is a minimum clock rate of 20 kHz. The maximum clock
rate of 5 MHz allows loading times as short as 52 µs. The switch
control latches are static and will hold their data as long as power
is applied.
Switch Array
AD75019
FUNCTIONAL BLOCK DIAGRAM
To extend the number of switches in the array, you may cascade
multiple AD75019s. The SOUT output is the end of the shift
register, and may be connected to the SIN input of the next
AD75019.
The AD75019 is fabricated in Analog Devices’ BiMOS II
process. This epitaxial BiCMOS process features CMOS
devices for low distortion switches and bipolar devices for
ESD protection.
REV. C
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
Input Signal RangeV
Switch ON Resistance, V
Switch ON Resistance, V
Switch ON Resistance Matching
Leakage Current, V
Input/Output CapacitanceC
Isolation Between Any Two Channels
R
= 600 Ω, RL = 10 kΩ, V
S
f
= 1 kHz92dB
SIGNAL
f
= 20 kHz69dB
SIGNAL
f
= 1 MHz38dB
SIGNAL
Total Harmonic Distortion
R
= 600 Ω, RL = 10 kΩ, V
S
Switch Frequency Response, –3 dB
R
= 600 Ω, RL = 10 kΩ, V
S
Propagation Delay48ns
DIGITAL INPUTS (SIN, SCLK, PCLK)
Logic Levels (TTL Compatible)
Input Voltage, Logic “1”V
Input Voltage, Logic “0”V
Input Current, V
Input Current, V
Input CapacitanceC
IH
IL
DIGITAL OUTPUTS (SOUT)
Logic Levels (TTL Compatible)
Output Voltage, Logic “1”V
Output Voltage, Logic “0”V
Output Current, V
Output Current, VOL = 0.4 VI
POWER SUPPLY REQUIREMENTS
Voltage Range, Total AnalogV
Voltage Range, Positive AnalogV
Voltage Range, Negative AnalogV
Voltage Range, DigitalV
Supply Current, SCLK = 5 MHz,I
V
= 0.8 V, VIH = 2.4 VI
IL
Supply Current, Quiescent,I
VIL = 0.8 V, VIH = 2.4 VI
TEMPERATURE RANGE
OperatingT
Storage–65+150°C
NOTES
1
All minimum and maximum specifications are guaranteed, and specifications shown in boldface are tested on all production units at final electrical test. Results from those tests
are used to calculate outgoing quality levels.
2
Switch resistance matching is measured with zero volts at each analog input and refers to the difference between the maximum and minimum values.
Specifications subject to change without notice.
and V
DD
and V
DD
= ±10 V210nA
SIGNAL
= ±12 V, V
SS
= ±5 V, V
SS
2
, V
SIGNAL
= 2 V p-p
SIGNAL
= 2 V p-p0.01%
SIGNAL
= 2 V p-p20MHz
SIGNAL
SIGNAL
= ±12 V∆R
= 5.5 VI
= 0.8 VI
= 2.8 VI
OH
PIN FUNCTION DESCRIPTIONS
(TA = +25ⴗC, VDD and VSS = ⴞ12 V, VCC = +5 V unless otherwise noted)
Data Setup Timet
SCLK Pulsewidtht
Data Hold Timet
SCLK Pulse Separationt
SCLK to PCLK Delayt
SCLK to PCLK Delay and Release(t
PCLK Pulsewidtht
Propagation Delay, PCLK to Switches On or Off_70nsmax
Data Load Time_52µsSCLK = 5 MHz
SCLK Frequency_20kHzmin
SCLK, PCLK Rise and Fall Times_1µsmax
NOTES
1
Timing measurement reference level is 1.5 V.
Specifications subject to change without notice.
1
SCLK
1 = CLOSE
SIN
0 = OPEN
PCLK
0
1
0
t
2
t
1
Y15–X15
to T
MIN
, rated power supplies unless otherwise noted)
MAX
1
2
3
4
5
+ t6)5msmax
5
6
20nsmin
100nsmin
40nsmin
100nsmin
65nsmin
65nsmin
TIMING DIAGRAM
t
4
t
3
LOAD DATA INTO
SERIAL REGISTER
DURING RISING EDGE
TRANSFER DATA FROM SERIAL
REGISTER TO PARALLEL
LATCHES DURING LOW LEVEL
Y0–X0Y15–X14
t
5
t
6
OPERATION TRUTH TABLE
Control Lines
PCLKSCLKSINSOUTOperation/Comment
10XXNo operation.
11Data
Data
i
i-256
The data on the SIN line is loaded into the serial register; data clocked into the
serial register 256 clocks ago appears at the SOUT output.
0XXXData in the serial shift register transfers into the parallel latches which control the
switch array.
APPLICATIONS INFORMATION
Loading Data
Data to control the switches is clocked serially into a 256-bit
shift register and then transferred in parallel to 256 bits of memory. The rising edge of SCLK, the serial clock input, loads data
into the shift register. The first bit loaded via SIN, the serial
data input, controls the switch at the intersection of row Y15
and column X15. The next bits control the remaining columns
(down to X0) of row Y15, and are followed by the bits for row
Y14, and so on down to the data for the switch at the intersection of row Y0 and column X0. The shift register is dynamic, so
there is a minimum clock rate, specified as 20 kHz.
After the shift register is filled with the new 256 bits of control
data, PCLK is activated (pulsed low) to transfer the data to the
parallel latches. Since the shift register is dynamic, there is a
maximum time delay specified before the data is lost: PCLK
must be activated and brought back high within 5 ms after filling the shift register. The switch control latches are static and
will hold their data as long as power is applied.
To extend the number of switches in the array, you may cascade
multiple AD75019s. The SOUT output is the end of the shift
Power Supply Sequencing and Bypassing
All junction-isolated parts operating on multiple power supplies
require proper attention to supply sequencing. Because BiMOS
II is a junction-isolated process, parasitic diodes exist between
and VCC, and between VSS and DGND. As a result, V
V
DD
DD
must always be greater than (VCC – 0.5 V), and VSS must always
be less than (DGND + 0.5 V).
If you can’t ensure that system power supplies will sequence to
meet these conditions, external Schottky (e.g., 1N5818) or
silicon (e.g., 1N4001) diodes may be used. To protect the positive side, the anode would connect to V
cathode to V
anode to V
(Pin 41). For the negative side, connect the
DD
(Pin 4) and the cathode to DGND (Pin 43).
SS
Each of the three power supply pins [V
42) and V
(Pin 4)] should be bypassed to DGND (Pin 43)
SS
(Pin 42) and the
CC
(Pin 41), VCC (Pin
DD
through a 0.1 µF ceramic capacitor located close to the package
pins.
Transistor Count
AD75019 contains 5,472 transistors. This number may be used
for calculating projected reliability.
register, and may be directly connected to the SIN input of the
next AD75019.
REV. C
–3–
Page 4
AD75019
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS*
MinMaxUnitsConditions
to DGND–0.5+25.2V
V
DD
V
to DGND–25.2+0.5V
SS
to DGND–0.5+7.0V
V
CC
V
to V
DD
CC
to V
SS
SS
V
Digital Inputs to DGND–0.3V
Power Dissipation1.0WT
Operating Temperature Range0+70°C
Storage Temperature–65+150°C
Lead Temperature+300°CSoldering, 10 sec
*Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only; functional operation of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. The digital control inputs are Zener protected;
however, permanent damage may occur on unconnected devices subject to high energy
electrostatic fields. Unused devices must be stored in conductive foam or shunts. The protective
foam should be discharged to the destination socket before devices are removed.
–0.5+25.2V
–0.5+25.2V
+ 0.5V
CC
A
ⱕ 75°C
C1502c–0–8/99
0.048 (1.21)
0.042 (1.07)
0.020
(0.50)
ORDERING GUIDE
ModelTemperature RangePackage Option*
AD75019JP0°C to +70°CP-44A
*P = Plastic Leaded Chip Carrier (PLCC) Package.
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
44-Lead Plastic Leaded Chip Carrier
(P-44A)
0.180 (4.57)
0.165 (4.19)
PIN 1
IDENTIFIER
TOP VIEW
0.056 (1.42)
0.042 (1.07)
40
39
29
28
SQ
SQ
0.110 (2.79)
0.085 (2.16)
0.025 (0.63)
0.015 (0.38)
0.050
(1.27)
BSC
0.021 (0.53)
0.013 (0.33)
0.032 (0.81)
0.026 (0.66)
0.040 (1.01)
0.025 (0.64)
0.020
(0.50)
0.63 (16.00)
0.59 (14.99)
R
0.048 (1.21)
0.042 (1.07)
6
7
(PINS DOWN)
17
18
R
0.656 (16.66)
0.650 (16.51)
0.695 (17.65)
0.685 (17.40)
PIN 1
IDENTIFIER
BOTTOM VIEW
(PINS UP)
PRINTED IN U.S.A.
–4–
REV. C
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.