Datasheet AD75019 Datasheet (Analog Devices)

Page 1
16 16 Crosspoint
SHIFT
REGISTER
CELL #256
LATCH
SERIAL DATA IN
ANALOG
SWITCH
BUSED CLOCK
LINES
SERIAL
DATA TO NEXT STAGES
+12V –12V +5V DGND
AD75019
16 3 16 ARRAY OF SWITCHES,
LATCHES, AND SHIFT REGISTER
CELLS (ONLY TWO LOCATIONS
ARE SHOWN FOR CLARITY)
SHIFT
REGISTER
CELL #1
LATCH
ANALOG
SWITCH
PARALLEL
CLOCK
SERIAL CLOCK
SERIAL
DATA FROM
PRIOR
STAGES
BUSED CLOCK
LINES
VDDVSSV
CC
DGND
X0 X15
ANALOG
INPUTS/OUTPUTS
Y0
Y15
ANALOG
OUTPUTS/
INPUTS
PCLK SCLK SOUT
a
FEATURES 256 Switches in a 16 16 Array Wide Signal Range: to Supply Rails of 24 V or 12 V Low On-Resistance: 200 Typ TTL/CMOS/Microprocessor-Compatible Control Lines Serial Input Simplifies Interface Serial Output Allows Cascading for More Channels Low Power Consumption: 2 mW Quiescent Compact 44-Lead PLCC
PRODUCT DESCRIPTION
The AD75019 contains 256 analog switches in a 16 × 16 array.
Any of the X or Y pins may serve as an input or output. Any or all of the X terminals may be programmed to connect to any or all of the Y terminals. The switches can accommodate signals with amplitudes up to the supply rails and have a typical on-
resistance of 150 Ω.
Data is loaded serially via the SIN input and clocked into an on­board 256-bit shift register via SCLK. When all the switch set­tings have been programmed, data is transferred into a set of 256 latches via PCLK. The serial shift register is dynamic, so there is a minimum clock rate of 20 kHz. The maximum clock
rate of 5 MHz allows loading times as short as 52 µs. The switch
control latches are static and will hold their data as long as power is applied.
Switch Array
AD75019
FUNCTIONAL BLOCK DIAGRAM
To extend the number of switches in the array, you may cascade multiple AD75019s. The SOUT output is the end of the shift register, and may be connected to the SIN input of the next AD75019.
The AD75019 is fabricated in Analog Devices’ BiMOS II process. This epitaxial BiCMOS process features CMOS devices for low distortion switches and bipolar devices for ESD protection.
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Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 1999
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1
AD75019–SPECIFICATIONS
AD75019 Symbol Min Typ Max Units
MULTIPLEXER
Input Signal Range V Switch ON Resistance, V Switch ON Resistance, V Switch ON Resistance Matching Leakage Current, V Input/Output Capacitance C Isolation Between Any Two Channels
R
= 600 , RL = 10 k, V
S
f
= 1 kHz 92 dB
SIGNAL
f
= 20 kHz 69 dB
SIGNAL
f
= 1 MHz 38 dB
SIGNAL
Total Harmonic Distortion
R
= 600 , RL = 10 k, V
S
Switch Frequency Response, –3 dB
R
= 600 , RL = 10 k, V
S
Propagation Delay 48 ns
DIGITAL INPUTS (SIN, SCLK, PCLK)
Logic Levels (TTL Compatible)
Input Voltage, Logic “1” V Input Voltage, Logic “0” V Input Current, V Input Current, V
Input Capacitance C
IH
IL
DIGITAL OUTPUTS (SOUT)
Logic Levels (TTL Compatible)
Output Voltage, Logic “1” V Output Voltage, Logic “0” V Output Current, V Output Current, VOL = 0.4 V I
POWER SUPPLY REQUIREMENTS
Voltage Range, Total Analog V Voltage Range, Positive Analog V Voltage Range, Negative Analog V Voltage Range, Digital V Supply Current, SCLK = 5 MHz, I
V
= 0.8 V, VIH = 2.4 V I
IL
Supply Current, Quiescent, I
VIL = 0.8 V, VIH = 2.4 V I
TEMPERATURE RANGE
Operating T
Storage –65 +150 °C
NOTES
1
All minimum and maximum specifications are guaranteed, and specifications shown in boldface are tested on all production units at final electrical test. Results from those tests are used to calculate outgoing quality levels.
2
Switch resistance matching is measured with zero volts at each analog input and refers to the difference between the maximum and minimum values.
Specifications subject to change without notice.
and V
DD
and V
DD
= ±10 V 2 10 nA
SIGNAL
= ±12 V, V
SS
= ±5 V, V
SS
2
, V
SIGNAL
= 2 V p-p
SIGNAL
= 2 V p-p 0.01 %
SIGNAL
= 2 V p-p 20 MHz
SIGNAL
SIGNAL
= ±12 V ∆R
= 5.5 V I
= 0.8 V I
= 2.8 V I
OH
PIN FUNCTION DESCRIPTIONS
(TA = +25C, VDD and VSS = 12 V, VCC = +5 V unless otherwise noted)
= ±12 V R
SIGNAL
= ±5 V R
IN
ON
ON
ON
IN
IH
IL
IH
IL
IN
OH
OL
OH
OL
DD – VSS
– V
DD
– V
SS
– V
CC
, I
DD
SS
CC
, I
DD
SS
CC
, T
MIN
DGND
DGND
DGND
MAX
VSS – 0.5 VDD + 0.5 V
150 300 300 500 20 30
2.4 5.5 V 0 0.8 V
2.8 V
3.2 mA
3.2 mA
9.0 25.2 V (VCC – 0.5) 25.2 V –20.7 0 V
4.5 5 5.5 V
_ 400 µA _ 100 µA
–25 +85 °C
PIN CONFIGURATION
25 pF
±1 µA ±1 µA
10 pF
0.4 V
±70 mA 800 µA
Pin Name Description
1 PCLK Parallel Clock Input 2 SCLK Serial Clock Input 3 SIN Serial Data Input 4VSSNegative Analog Power Supply 5 NC No Internal Connection 6 NC No Internal Connection 7 Y15 Analog Output (or Input) 8 Y14 Analog Output (or Input) 9 Y13 Analog Output (or Input) 10 Y12 Analog Output (or Input) 11 Y11 Analog Output (or Input) 12 Y10 Analog Output (or Input) 13 Y9 Analog Output (or Input) 14 Y8 Analog Output (or Input) 15 X0 Analog Input (or Output) 16 X1 Analog Input (or Output) 17 X2 Analog Input (or Output) 18 X3 Analog Input (or Output) 19 X4 Analog Input (or Output) 20 X5 Analog Input (or Output) 21 X6 Analog Input (or Output) 22 X7 Analog Input (or Output)
Pin Name Description
23 X8 Analog Input (or Output) 24 X9 Analog Input (or Output) 25 X10 Analog Input (or Output) 26 X11 Analog Input (or Output) 27 X12 Analog Input (or Output) 28 X13 Analog Input (or Output) 29 X14 Analog Output (or Input) 30 X15 Analog Output (or Input) 31 Y0 Analog Output (or Input) 32 Y1 Analog Output (or Input) 33 Y2 Analog Output (or Input) 34 Y3 Analog Output (or Input) 35 Y4 Analog Output (or Input) 36 Y5 Analog Output (or Input) 37 Y6 Analog Output (or Input) 38 Y7 Analog Output (or Input) 39 NC No Internal Connection 40 NC No Internal Connection 41 V 42 V 43 DGND Digital Ground
Positive Analog Power Supply
DD
Digital Power Supply
CC
44 SOUT Serial Data Output: Positive True
–2–
NCNCV
6 5 4 3 2 1 44 43 42 41 40
7
Y15 Y14
8 9
Y13
10
Y12 Y11
11 12
Y10
13
Y9
14
Y8
15
X0
16
X1
17
X2
18 19 20 21 22 23 24 25 26 27 28
X3
NC = NO CONNECT
SS
(Not to Scale)
X4
X5X6X8
SIN
SCLK
PCLK
AD75019
TOP VIEW
X7
SOUT
DGND
PIN 1 IDENTIFIER
X9
X10
CC
V
X11
DD
NC
V
X12
X13
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39
NC
38
Y7
37
Y6
36
Y5
35
Y4
34
Y3
33
Y2
32
Y1
31
Y0
30
X15
29
X14
Page 3
AD75019
1
TIMING CHARACTERISTICS
(TA = T
Parameter Symbol Value Units Condition
Data Setup Time t SCLK Pulsewidth t Data Hold Time t SCLK Pulse Separation t SCLK to PCLK Delay t SCLK to PCLK Delay and Release (t PCLK Pulsewidth t Propagation Delay, PCLK to Switches On or Off _ 70 ns max
Data Load Time _ 52 µs SCLK = 5 MHz
SCLK Frequency _ 20 kHz min
SCLK, PCLK Rise and Fall Times _ 1 µs max
NOTES
1
Timing measurement reference level is 1.5 V.
Specifications subject to change without notice.
1
SCLK
1 = CLOSE
SIN
0 = OPEN
PCLK
0
1
0
t
2
t
1
Y15–X15
to T
MIN
, rated power supplies unless otherwise noted)
MAX
1
2
3
4
5
+ t6) 5 ms max
5
6
20 ns min 100 ns min 40 ns min 100 ns min 65 ns min
65 ns min
TIMING DIAGRAM
t
4
t
3
LOAD DATA INTO
SERIAL REGISTER
DURING RISING EDGE
TRANSFER DATA FROM SERIAL
REGISTER TO PARALLEL
LATCHES DURING LOW LEVEL
Y0–X0Y15–X14
t
5
t
6
OPERATION TRUTH TABLE
Control Lines PCLK SCLK SIN SOUT Operation/Comment
1 0 X X No operation. 1 1 Data
Data
i
i-256
The data on the SIN line is loaded into the serial register; data clocked into the serial register 256 clocks ago appears at the SOUT output.
0 X X X Data in the serial shift register transfers into the parallel latches which control the
switch array.
APPLICATIONS INFORMATION Loading Data
Data to control the switches is clocked serially into a 256-bit shift register and then transferred in parallel to 256 bits of mem­ory. The rising edge of SCLK, the serial clock input, loads data into the shift register. The first bit loaded via SIN, the serial data input, controls the switch at the intersection of row Y15 and column X15. The next bits control the remaining columns (down to X0) of row Y15, and are followed by the bits for row Y14, and so on down to the data for the switch at the intersec­tion of row Y0 and column X0. The shift register is dynamic, so there is a minimum clock rate, specified as 20 kHz.
After the shift register is filled with the new 256 bits of control data, PCLK is activated (pulsed low) to transfer the data to the parallel latches. Since the shift register is dynamic, there is a maximum time delay specified before the data is lost: PCLK must be activated and brought back high within 5 ms after fill­ing the shift register. The switch control latches are static and will hold their data as long as power is applied.
To extend the number of switches in the array, you may cascade multiple AD75019s. The SOUT output is the end of the shift
Power Supply Sequencing and Bypassing
All junction-isolated parts operating on multiple power supplies require proper attention to supply sequencing. Because BiMOS II is a junction-isolated process, parasitic diodes exist between
and VCC, and between VSS and DGND. As a result, V
V
DD
DD
must always be greater than (VCC – 0.5 V), and VSS must always be less than (DGND + 0.5 V).
If you can’t ensure that system power supplies will sequence to meet these conditions, external Schottky (e.g., 1N5818) or silicon (e.g., 1N4001) diodes may be used. To protect the posi­tive side, the anode would connect to V cathode to V anode to V
(Pin 41). For the negative side, connect the
DD
(Pin 4) and the cathode to DGND (Pin 43).
SS
Each of the three power supply pins [V
42) and V
(Pin 4)] should be bypassed to DGND (Pin 43)
SS
(Pin 42) and the
CC
(Pin 41), VCC (Pin
DD
through a 0.1 µF ceramic capacitor located close to the package
pins.
Transistor Count
AD75019 contains 5,472 transistors. This number may be used for calculating projected reliability.
register, and may be directly connected to the SIN input of the next AD75019.
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–3–
Page 4
AD75019
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS*
Min Max Units Conditions
to DGND –0.5 +25.2 V
V
DD
V
to DGND –25.2 +0.5 V
SS
to DGND –0.5 +7.0 V
V
CC
V
to V
DD
CC
to V
SS
SS
V Digital Inputs to DGND –0.3 V Power Dissipation 1.0 W T
Operating Temperature Range 0 +70 °C Storage Temperature –65 +150 °C Lead Temperature +300 °C Soldering, 10 sec
*Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. The digital control inputs are Zener protected; however, permanent damage may occur on unconnected devices subject to high energy electrostatic fields. Unused devices must be stored in conductive foam or shunts. The protective foam should be discharged to the destination socket before devices are removed.
–0.5 +25.2 V –0.5 +25.2 V
+ 0.5 V
CC
A
75°C
C1502c–0–8/99
0.048 (1.21)
0.042 (1.07)
0.020 (0.50)
ORDERING GUIDE
Model Temperature Range Package Option*
AD75019JP 0°C to +70°C P-44A
*P = Plastic Leaded Chip Carrier (PLCC) Package.
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
44-Lead Plastic Leaded Chip Carrier
(P-44A)
0.180 (4.57)
0.165 (4.19)
PIN 1
IDENTIFIER
TOP VIEW
0.056 (1.42)
0.042 (1.07)
40
39
29
28
SQ
SQ
0.110 (2.79)
0.085 (2.16)
0.025 (0.63)
0.015 (0.38)
0.050 (1.27) BSC
0.021 (0.53)
0.013 (0.33)
0.032 (0.81)
0.026 (0.66)
0.040 (1.01)
0.025 (0.64)
0.020 (0.50)
0.63 (16.00)
0.59 (14.99)
R
0.048 (1.21)
0.042 (1.07)
6
7
(PINS DOWN)
17
18
R
0.656 (16.66)
0.650 (16.51)
0.695 (17.65)
0.685 (17.40)
PIN 1
IDENTIFIER
BOTTOM VIEW
(PINS UP)
PRINTED IN U.S.A.
–4–
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