= 5 V
Pseudo differential analog input
Wide input bandwidth:
70 dB SINAD at 100 kHz input frequency
Flexible power/serial clock speed management
No pipeline delays
High speed serial interface:
SPI®-/QSPI™-/MICROWIRE™-/DSP-compatible
Power-down mode: 1 µA max
8-lead SOT-23 and MSOP packages
APPLICATIONS
Transducer interface
Battery-powered systems
Data acquisition systems
Portable instrumentation
GENERAL DESCRIPTION
The AD7441/AD74511 are, respectively, 10-bit and 12-bit high
speed, low power, successive approximation (SAR) analog-todigital converters that feature a pseudo differential analog input.
These parts operate from a single 2.7 V to 5.25 V power supply
and achieve very low power dissipation at high throughput rates
of up to 1 MSPS.
The AD7441/AD7451 contain a low noise, wide bandwidth,
differential track-and-hold (T/H) amplifier that handles input
frequencies up to 3.5 MHz. The reference voltage for these
devices is applied externally to the V
100 mV to V
, depending on the power supply and what suits
DD
the application.
The conversion process and data acquisition are controlled
CS
using
and the serial clock, allowing the device to interface
with microprocessors or DSPs. The input signals are sampled
on the falling edge of CS when the conversion is initiated.
The SAR architecture of these parts ensures that there are no
pipeline delays.
1
Protected by U.S. Patent Number 6,681,332.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
pin and can range from
REF
AD7441/AD7451
FUNCTIONAL BLOCK DIAGRAM
V
DD
V
IN+
V
IN–
V
REF
AD7441/AD7451
T/H
GND
PRODUCT HIGHLIGHTS
1. Operation with 2.7 V to 5.25 V power supplies.
2. High throughput with low power consumption. With a 3 V
supply, the AD7441/AD7451 offer 4 mW maximum power
consumption for a 1 MSPS throughput rate.
3. Pseudo differential analog input.
4. Flexible power/serial clock speed management. The
conversion rate is determined by the serial clock, allowing
the power to be reduced as the conversion time is reduced
through the serial clock speed increase. These parts also
feature a shutdown mode to maximize power efficiency at
lower throughput rates.
5. Variable voltage reference input.
6. No pipeline delays.
7. Accurate control of the sampling instant via a
once-off conversion control.
8. ENOB > 10 bits typically with 500 mV reference.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Fax: 781.326.8703
Changes to General Description .......................................................1
Changes to Table 1 Footnotes ............................................................4
Changes to Table 2 Footnotes ............................................................6
Changes to Table 3 Footnotes ............................................................7
Changes to Table 5 .............................................................................. 9
Updated Figures 7, 8, and 9.............................................................. 13
Changes to Figure 23.........................................................................16
Changes to Reference Section..........................................................17
Rev. B | Page 2 of 24
Page 3
AD7441/AD7451
AD7451 SPECIFICATIONS
VDD = 2.7 V to 5.25 V; f
versions: −40°C to +85°C.
Table 1.
Parameter Test Conditions/Comments A Version B Version Unit
DYNAMIC PERFORMANCE fIN = 100 kHz
Signal-to-Noise Ratio (SNR)1 VDD = 2.7 V to 5.25 V 70 70 dB min
Signal to (Noise + Distortion) (SINAD)1 VDD = 2.7 V to 3.6 V 69 69 db min
V
Total Harmonic Distortion (THD)1 V
V
Peak Harmonic or Spurious Noise1 V
V
Intermodulation Distortion (IMD)1 fa = 90 kHz; fb = 110 kHz
Second-Order Terms −80 −80 dB typ
Third-Order Terms −80 −80 dB typ
Aperture Delay1 5 5 ns typ
Aperture Jitter1 50 50 ps typ
Full-Power Bandwidth
@ −0.1 dB 2.5 2.5 MHz typ
DC ACCURACY
Resolution 12 12 Bits
Integral Nonlinearity (INL)1 ±1.5 ±1 LSB max
Differential Nonlinearity (DNL)1 Guaranteed no missed codes to 12 bits ±0.95 ±0.95 LSB max
Offset Error1 ±3.5 ±3.5 LSB max
Gain Error1 ±3 ±3 LSB max
ANALOG INPUT
Full-Scale Input Span V
Absolute Input Voltage
V
V
IN+
3
V
VDD = 2.7 V to 3.6 V −0.1 to +0.4 −0.1 to +0.4 V
IN–
V
DC Leakage Current ±1 ±1 µA max
Input Capacitance When in track and hold 30/10 30/10 pF typ
REFERENCE INPUT
V
Input Voltage
REF
DC Leakage Current ±1 ±1 µA max
V
Input Capacitance When in track and hold 10/30 10/30 pF typ
REF
LOGIC INPUTS
Input High Voltage, V
Input Low Voltage, V
Input Current, IIN Typically 10 nA, VIN = 0 V or VDD ±1 ±1 µA max
Input Capacitance, C
LOGIC OUTPUTS
Output High Voltage, VOH VDD = 4.75 V to 5.25 V; I
V
Output Low Voltage, VOL I
Floating-State Leakage Current ±1 ±1 µA max
Floating-State Output Capacitance5 10 10 pF max
Output Coding
= 18 MHz; fS = 1 MSPS; V
SCLK
= 4.75 V to 5.25 V 70 70 dB min
DD
= 2.7 V to 3.6 V; −78 dB typ −73 −73 dB max
DD
= 4.75 V to 5.25 V; −80 dB typ −75 −75 dB max
DD
= 2.7 V to 3.6 V; −80 dB typ −73 −73 dB max
DD
= 4.75 V to 5.25 V; −82 dB typ −75 −75 dB max
DD
1, 2
@ −3 dB 20 20 MHz typ
− V
IN+
= 4.75 V to 5.25 V −0.1 to +1.5 −0.1 to +1.5 V
DD
±1% tolerance for specified
performance
2.4 2.4 V min
INH
0.8 0.8 V max
INL
5
IN
10 10 pF max
= 2.7 V to 3.6 V; I
DD
= 200 µA 0.4 0.4 V max
SINK
= 2.5 V; TA = T
REF
V
IN–
SOURCE
to T
MIN
= 200 µA 2.8 2.8 V min
SOURCE
, unless otherwise noted. Temperature ranges for A, B
MAX
= 200 µA 2.4 2.4 V min
V
REF
V
REF
4
2.54 V
2.5
Straight
(natural) binary
V
REF
V
REF
Straight
(natural) binary
Rev. B | Page 3 of 24
Page 4
AD7441/AD7451
Parameter Test Conditions/Comments A Version B Version Unit
CONVERSION RATE
Conversion Time 888 ns with an 18 MHz SCLK 16 16 SCLK cycles
Track-and-Hold Acquisition Time1 Sine wave input 250 250 ns max
Full-scale step input 290 290 ns max
Throughput Rate 1 1 MSPS max
POWER REQUIREMENTS
VDD 2.7/5.25 2.7/5.25 V min/max
6, 7
I
DD
Normal Mode (Static) SCLK on or off 0.5 0.5 mA typ
Normal Mode (Operational) VDD = 4.75 V to 5.25 V 1.95 1.95 mA max
V
Full Power-Down Mode SCLK on or off 1 1 µA max
Power Dissipation
Normal Mode (Operational) VDD = 5 V; 1.55 mW typ for 100 ksps6 9.25 9.25 mW max
V
Full Power-Down VDD = 5 V; SCLK on or off 5 5 µW max
V
1
See section. Terminology
2
Analog inputs with slew rates exceeding 27 V/µs (full-scale input sine wave > 3.5 MHz) within the acquisition time could cause the converter to return an incorrect
result.
3
A small dc input is applied to V
4
The AD7451 is functional with a reference input in the range of 100 mV to VDD.
5
Guaranteed by characterization.
6
See the Power vs. Throughput section.
7
Measured with a full-scale dc input.
to provide a pseudo ground for V
IN–
= 2.7 V to 3.6 V 1.45 1.45 mA max
DD
= 3 V; 0.6 mW typ for 100 ksps6 4 4 mW max
DD
= 3 V; SCLK on or off 3 3 µW max
DD
.
IN+
Rev. B | Page 4 of 24
Page 5
AD7441/AD7451
AD7441 SPECIFICATIONS
VDD = 2.7 V to 5.25 V; f
B version: −40°C to +85°C.
Table 2.
Parameter Test Conditions/Comments B Version Unit
DYNAMIC PERFORMANCE fIN = 100 kHz
Signal to (Noise + Distortion) (SINAD)1 61 dB min
Total Harmonic Distortion (THD)1 2.7 V to 3.6 V; −77 dB typ −72 dB max
4.75 V to 5.25 V; −79 dB typ −73 dB max
Peak Harmonic or Spurious Noise1 2.7 V to 3.6 V; −80 dB typ −72 dB max
4.75 V to 5.25 V; −82 dB typ −74 dB max
Intermodulation Distortion (IMD)
Second-Order Terms −80 dB typ
Third-Order Terms −80 dB typ
Aperture Delay1 5 ns typ
Aperture Jitter1 50 ps typ
Full-Power Bandwidth1, 2 @ −3 dB 20 MHz typ
@ −0.1 dB 2.5 MHz typ
DC ACCURACY
Resolution 10 Bits
Integral Nonlinearity (INL)
Differential Nonlinearity (DNL)1 Guaranteed no missed codes to 10 bits ±0.5 LSB max
Offset Error1 ±1 LSB max
Gain Error1 ±1 LSB max
ANALOG INPUT
Full-Scale Input Span V
Absolute Input Voltage
V
V
IN+
3
V
VDD = 2.7 V to 3.6 V −0.1 to +0.4 V
IN–
V
DC Leakage Current ±1 µA max
Input Capacitance When in track and hold 30/10 pF typ
REFERENCE INPUT
V
Input Voltage
REF
DC Leakage Current ±1 µA max
V
Input Capacitance When in track and hold 10/30 pF typ
REF
LOGIC INPUTS
Input High Voltage, V
Input Low Voltage, V
Input Current, I
IN
Input Capacitance, C
LOGIC OUTPUTS
Output High Voltage, VOH VDD = 4.75 V to 5.25 V ; I
V
Output Low Voltage, VOL I
Floating-State Leakage Current ±1 µA max
Floating-State Output Capacitance5 10 pF max
Output Coding Straight (natural) binary
= 18 MHz; fS = 1 MSPS; V
SCLK
1
1
fa = 90 kHz, fb = 110 kHz
±0.5 LSB max
− V
IN+
= 4.75 V to 5.25 V −0.1 to +1.5 V
DD
±1% tolerance for specified
performance
2.4 V min
INH
0.8 V max
INL
Typically 10 nA, VIN = 0 V or V
5
10 pF max
IN
= 2.7 V to 3.6 V; I
DD
= 200 µA 0.4 V max
SINK
= 2.5 V; TA = T
REF
V
IN–
SOURCE
to T
MIN
DD
= 200 µA 2.8 V min
SOURCE
, unless otherwise noted. Temperature range for
MAX
= 200 µA 2.4 V min
V
REF
V
REF
4
V
2.5
±1 µA max
Rev. B | Page 5 of 24
Page 6
AD7441/AD7451
Parameter Test Conditions/Comments B Version Unit
CONVERSION RATE
Conversion Time 888 ns with an 18 MHz SCLK 16 SCLK cycles
Track-and-Hold Acquisition Time1 Sine wave input 250 ns max
Step input 290 ns max
Throughput Rate 1 MSPS max
POWER REQUIREMENTS
VDD 2.7/5.25 V min/max
6, 7
I
DD
Normal Mode (Static) SCLK on or off 0.5 mA typ
Normal Mode (Operational) VDD = 4.75 V to 5.25 V 1.95 mA max
V
Full Power-Down Mode SCLK on or off 1 µA max
Power Dissipation
Normal Mode (Operational) VDD = 5 V; 1.55 mW typ for 100 ksps6 9.25 mW max
V
Full Power-Down VDD = 5 V; SCLK on or off 5 µW max
V
1
See the Terminology section.
2
Analog inputs with slew rates exceeding 27 V/µs (full-scale input sine wave > 3.5 MHz) within the acquisition time may cause the converter to return an incorrect
result.
3
A small dc input is applied to V
4
The AD7441 is functional with a reference input in the range 100 mV to VDD.
5
Guaranteed by characterization.
6
See the Power vs. Throughput section.
7
Measured with a full-scale dc input.
to provide a pseudo ground for V
IN–
= 2.7 V to 3.6 V 1.25 mA max
DD
= 3 V; 0.6 mW typ for 100 ksps6 4 mW max
DD
= 3 V; SCLK on or off 3 µW max
DD
.
IN+
Rev. B | Page 6 of 24
Page 7
AD7441/AD7451
S
A
TIMING SPECIFICATIONS
VDD = 2.7 V to 5.25 V; f
Table 3.
Parameter Limit at T
2
f
10 kHz min
SCLK
t
CONVERT
t
60 ns min
QUIET
18 MHz max
16 × t
888 ns max
t1 10 ns min
t2 10 ns min
3
t
20 ns max
3
t4 40 ns max Data access time after SCLK falling edge
t5 0.4 t
t6 0.4 t
SCLK
SCLK
t7 10 ns min SCLK edge to data valid hold time
4
t
8
t
POWER-UP
10 ns min SCLK falling edge to SDATA three-state enabled
35 ns max SCLK falling edge to SDATA three-state enabled
5
1 µs max Power-up time from full power-down
1
Guaranteed by characterization. All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V. See , , and
thesection.
Serial Interface
2
Mark/space ratio for the SCLK input is 40/60 to 60/40.
3
Measured with the load circuit of and defined as the time required for the output to cross 0.8 V or 2.4 V with VDD = 5 V and the time required for an output to
cross 0.4 V or 2.0 V for V
4
t8 is derived from the measured time taken by the data outputs to change 0.5 V when loaded with the circuit of Figure 4. The measured number is then extrapolated
back to remove the effects of charging or discharging the 25 pF capacitor. This means that the time, t
time of the part and is independent of the bus loading.
5
See section. Power-Up Time
= 18 MHz; fS = 1 MSPS; V
SCLK
, T
MIN
MAX
SCLK
ns min SCLK high pulse width
ns min SCLK low pulse width
Figure 4
= 3 V.
DD
1
= 2.5 V; TA = T
REF
Unit Description
t
= 1/f
SCLK
SCLK
Minimum quiet time between the end of a serial read and the next falling edge of
Minimum
CS
CS
falling edge to SCLK falling edge set-up time
Delay from
MIN
to T
, unless otherwise noted.
MAX
pulse width
CS
falling edge until SDATA three-state disabled
, quoted in the timing characteristics, is the true bus relinquish
8
Figure 2 Figure 3
CS
t
1
CS
SCLK
DAT
t
2
1234513141516
t
3
0000DB11DB10DB2DB1DB0
4 LEADING ZEROSTHREE-STATE
t
4
t
CONVERT
t
5
t
7
B
t
6
t
8
t
QUIET
03153-A-002
Figure 2. AD7451 Serial Interface Timing Diagram
t
1
CS
SCLK
SDATA
t
2
1234513141516
t
3
0000DB9DB8DB000
4 LEADING ZEROS2 TRAILING ZEROS
t
4
Figure 3. AD7441 Serial Interface Timing Diagram
t
CONVERT
t
5
t
7
Rev. B | Page 7 of 24
B
t
6
t
8
t
QUIET
THREE-STATE
03153-A-003
Page 8
AD7441/AD7451
ABSOLUTE MAXIMUM RATINGS
Table 4. TA = 25°C, unless otherwise noted.
Parameter Rating
VDD to GND −0.3 V to +7 V
V
to GND −0.3 V to VDD + 0.3 V
IN+
V
to GND −0.3 V to VDD + 0.3 V
IN–
Digital Input Voltage to GND −0.3 V to +7 V
Digital Output Voltage to GND −0.3 V to VDD + 0.3 V
V
to GND −0.3 V to VDD + 0.3 V
REF
Input Current to any Pin Except Supplies1±10 mA
Operating Temperature Range
−40°C to +85°C
Commercial (A, B Version)
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
θJA Thermal Impedance 205.9°C/W (MSOP)
211.5°C/W (SOT-23)
θJC Thermal Impedance 43.74°C/W (MSOP)
Lead Temperature, Soldering
91.99°C/W (SOT-23)
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
ESD 1 kV
1
Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 4. Load Circuit for Digital Output Timing Specifications
TO OUTPUT
PIN
25pF
C
L
1.6mAI
200µAI
OL
OH
1.6V
03153-A-004
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. B | Page 8 of 24
Page 9
AD7441/AD7451
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
V
SCLK
SDATA
CS
DD
1
AD7441/
2
AD7451
3
TOP VIEW
(Not to Scale)
4
V
8
REF
V
7
IN+
6
V
IN–
GND
5
Figure 5. 8-Lead SOT-23
Table 5. 8-Lead Pin Function Descriptions
Mnemonic Description
V
REF
Reference Input for the AD7441/AD7451. An external reference in the range of 100 mV to VDD must be applied to this input.
The specified reference input is 2.5 V. This pin should be decoupled to GND with a capacitor of at least 0.1 µF.
V
Noninverting Analog Input.
IN+
V
IN–
GND
CS
SDATA
Inverting Input. This pin sets the ground reference point for the V
pseudo ground.
Analog Ground. Ground reference point for all circuitry on the AD7441/AD7451. All analog input signals and any external
reference signal should be referred to this GND voltage.
Chip Select. Active low logic input. This input provides the dual function of initiating a conversion on the AD7441/AD7451
and framing the serial data transfer.
Serial Data, Logic Output. The conversion result from the AD7441/AD7451 is provided on this output as a serial data stream.
The bits are clocked out on the falling edge of the SCLK input. The data stream of the AD7451 consists of four leading zeros
followed by the 12 bits of conversion data that are provided MSB first; the data stream of the AD7441 consists of four leading
zeros, followed by the 10 bits of conversion data, followed by two trailing zeros. In both cases, the output coding is straight
(natural) binary.
SCLK
VDD
Serial Clock, Logic Input. SCLK provides the serial clock for accessing data from the part. This clock input is also used as the
clock source for the conversion process.
Power Supply Input. VDD is 2.7 V to 5.25 V. This supply should be decoupled to GND with a 0.1 µF capacitor and a
10 µF tantalum capacitor.
1
V
REF
AD7441/
2
V
IN+
AD7451
3
V
IN–
TOP VIEW
(Not to Scale)
GND
03153-A-005
4
8
7
6
5
V
DD
SCLK
SDATA
CS
03153-A-006
Figure 6. 8-Lead MSOP
input. Connect to ground or to a dc offset to provide a
IN+
Rev. B | Page 9 of 24
Page 10
AD7441/AD7451
TERMINOLOGY
Signal to (Noise + Distortion) Ratio (SINAD)
This is the measured ratio of SINAD at the output of the ADC.
The signal is the rms amplitude of the fundamental. Noise is the
sum of all nonfundamental signals up to half the sampling
frequency (f
number of quantization levels in the digitization process; the
more levels, the smaller the quantization noise. The theoretical
SINAD ratio for an ideal N-bit converter with a sine wave input
is given by
Therefore, for 12-bit converters, the SINAD is 74 dB; for10-bit
converters, 62 dB.
Total Harmonic Distortion (THD)
Total harmonic distortion is the ratio of the rms sum of
harmonics to the fundamental. In the AD7441/AD7451,
THD is
where:
is the rms amplitude of the fundamental.
V
1
V
, V3, V4, V5 and V6 are the rms amplitudes of the second to the
2
sixth harmonics.
Peak Harmonic or Spurious Noise
Peak harmonic (spurious noise) is defined as the ratio of the
rms value of the next largest component in the ADC output
spectrum (up to f
fundamental. Normally, the value of this specification is
determined by the largest harmonic in the spectrum, but for
ADCs where the harmonics are buried in the noise floor, it is a
noise peak.
Intermodulation Distortion
With inputs consisting of sine waves at two frequencies, fa and
fb, an active device with nonlinearities creates distortion
products at sum and difference frequencies of mfa ± nfb where
m, n = 0, 1, 2, 3 and so on. Intermodulation distortion terms are
those in which neither m nor n are equal to zero. For example,
the second-order terms include (fa + fb) and (fa − fb), while the
third-order terms include (2fa + fb), (2fa − fb), (fa + 2fb) and
(fa − 2fb).
/2), excluding dc. The ratio is dependent on the
S
Signal to (Noise + Distortion) = (6.02 N + 1.76) dB
22222
++++
VVVVV
THD
()
log20dB
=
/2, excluding dc) to the rms value of the
S
V
1
65432
specified separately. The calculation of the intermodulation
distortion is as per the THD specification where it is the ratio of
the rms sum of the individual distortion products to the rms
amplitude of the sum of the fundamentals expressed in dB.
Aperture Delay
This is the amount of time from the leading edge of the
sampling clock until the ADC actually takes the sample.
Aperture Jitter
This is the sample to sample variation in the effective point in
time at which the actual sample is taken.
Full Power Bandwidth
The full power bandwidth of an ADC is that input frequency at
which the amplitude of the reconstructed fundamental is
reduced by 0.1 dB or 3 dB for a full-scale input.
Integral Nonlinearity (INL)
This is the maximum deviation from a straight line passing
through the endpoints of the ADC transfer function.
Differential Nonlinearity (DNL)
This is the difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.
Offset Error
This is the deviation of the first code transition (000…000 to
000…001) from the ideal (i.e., AGND + 1 LSB).
Gain Error
This is the deviation of the last code transition (111…110 to
111…111) from the ideal (i.e., V
− 1 LSB) after the offset
REF
error has been adjusted out.
Track-and-Hold Acquisition Time
The track-and-hold acquisition time is the minimum time
required for the track-and-hold amplifier to remain in track
mode for its output to reach and settle to within 0.5 LSB of the
applied input signal.
Power Supply Rejection Ratio (PSRR)
The power supply rejection ratio is defined as the ratio of the
power in the ADC output at full-scale frequency, f, to the power
of a 100 mV p-p sine wave applied to the ADC V
supply of
DD
frequency fs. The frequency of this input varies from 1 kHz
to 1 MHz.
PSRR (dB) = 10 log (Pf/Pfs)
The AD7441/AD7451 is tested using the CCIF standard where
two input frequencies near the top end of the input bandwidth
are used. In this case, the second-order terms are usually
distanced in frequency from the original sine waves while the
third-order terms are usually at a frequency close to the input
frequencies. As a result, the second- and third-order terms are
Rev. B | Page 10 of 24
Pf is the power at frequency f in the ADC output; Pfs is the
power at frequency fs in the ADC output.
Page 11
AD7441/AD7451
TYPICAL PERFORMANCE CHARACTERISTICS
Default conditions: TA = 25°C, fS = 1 MSPS, f
75
= 4.75V
70
65
SINAD (dB)
60
55
101001000
V
DD
FREQUENCY (kHz)
= 3.6V
V
DD
= 2.7V
V
DD
= 18 MHz, VDD = 2.7 V to 5.25 V, V
SCLK
VDD = 5.25V
03153-A-007
= 2.5 V, unless otherwise noted.
REF
1.0
0.8
0.6
0.4
0.2
0
–0.2
DNL ERROR (LSB)
–0.4
–0.6
–0.8
–1.0
0102420483072
CODE
03153-A-010
4096
Figure 7. SINAD vs. Analog Input Frequency for the AD7451 for
Various Supply Voltages
0
100mV p-p SINE WAVE ON V
NO DECOUPLING ON V
–20
–40
–60
PSRR (dB)
–80
–100
–120
0100 200 300 400 500 600 700 800 900 1000
SUPPLY RIPPLE FREQUENCY (kHz)
DD
VDD = 3V
DD
V
DD
= 5V
03153-A-008
Figure 8. PSRR vs. Supply Ripple Frequency Without Supply Decoupling
0
–20
–40
–60
–80
SNR (dB)
–100
–120
–140
0100200
FREQUENCY (kHz)
8192 POINT FFT
f
SAMPLE
f
= 100kSPS
IN
SINAD = 71dB
THD = –82dB
SFDR = –83dB
300400
= 1MSPS
03153-A-009
500
Figure 10. Typical DNL for the AD7451 for V
DD
= 5 V
1.0
0.8
0.6
0.4
0.2
0
–0.2
INL ERROR (LSB)
–0.4
–0.6
–0.8
–1.0
0102420483072
Figure 11. Typical INL for the AD7451 for V
10,000
9,000
8,000
7,000
6,000
5,000
COUNTS
4,000
3,000
2,000
1,000
0
204620472048204920502051
27 CODES24 CODES
CODE
9949
CODES
CODES
DD
= 5 V
03153-A-011
4096
03153-A-012
Figure 9. AD7451 Dynamic Performance for V
DD
= 5 V
Figure 12. Histogram of 10,000 Conversions of a DC Input for the AD7451
Rev. B | Page 11 of 24
Page 12
AD7441/AD7451
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
CHANGE IN DNL (LSB)
0
–0.5
–1.0
01234
Figure 13. Change in DNL vs. V
5
4
3
2
1
CHANGE IN INL (LSB)
0
–1
–2
01234
Figure 14. Change in INL vs. V
12
11
10
9
8
EFFECTIVE NUMBER OF BITS
7
6
012345
VDD = 3V
V
= 5V
DD
Figure 15. ENOB vs. V
0
–20
–40
–60
–80
POSITIVE DNL
NEGATIVE DNL
03153-A-013
V
(V)
REF
for VDD = 5 V
REF
5
POSITIVE DNL
NEGATIVE DNL
03153-A-014
V
(V)
REF
for VDD = 5 V
REF
5
03153-A-015
(V)
V
REF
REF
for V
= 5 V and 3V
DD
SNR (dB)
–100
–120
–140
0100200300400500
(V)
V
REF
Figure 16. AD7441 Dynamic Performance
0.5
0.4
0.3
0.2
0.1
0
–0.1
DNL ERROR (LSB)
–0.2
–0.3
–0.4
–0.5
02565127681024
CODE
Figure 17. Typical DNL for the AD7441
0.5
0.4
0.3
0.2
0.1
0
–0.1
INL ERROR (LSB)
–0.2
–0.3
–0.4
–0.5
02565127681024
Figure 18. Typical INL for the AD7441
CODE
8192 POINT FFT
f
= 1MSPS
SAMPLE
f
= 100kSPS
IN
SINAD = 61.7dB
THD = –81.7dB
SFDR = –82dB
03153-A-016
03153-A-017
03153-A-018
Rev. B | Page 12 of 24
Page 13
AD7441/AD7451
V
V
V
THEORY OF OPERATION
CIRCUIT INFORMATION
The AD7441/AD7451 are 10-bit and 12-bit, fast, low power,
single-supply, successive approximation analog-to-digital
converters (ADCs) with a pseudo differential analog input.
They operate with a single 2.7 V to 5.25 V power supply and are
capable of throughput rates up to 1 MSPS when supplied with
an 18 MHz SCLK. They require an external reference to be
applied to the V
REF
pin.
The AD7441/AD7451 have a successive approximation (SAR)
ADC, an on-chip differential track-and-hold amplifier, and a
serial interface housed in either an 8-lead SOT-23 or an MSOP
package. The serial clock input accesses data from the part and
provides the clock source for the successive approximation
ADC. The AD7441/AD7451 feature a power-down option for
reduced power consumption between conversions. The powerdown feature is implemented across the standard serial
interface, as described in the Modes of Operation section.
CONVERTER OPERATION
The AD7441/AD7451 are successive approximation ADCs
based around two capacitive DACs. Figure 19 and Figure 20
show simplified schematics of the ADC in the acquisition and
conversion phase, respectively. The ADC is comprised of
control logic, an SAR, and two capacitive DACs. In Figure 19
(acquisition phase), SW3 is closed; SW1 and SW2 are in
Position A, the comparator is held in a balanced condition, and
the sampling capacitor arrays acquire the differential signal on
the input.
CAPACITIVE
DAC
V
B
IN+
A
A
IN–
B
C
S
SW1
SW2
C
S
V
REF
SW3
Figure 19. ADC Acquisition Phase
COMPARATOR
CONTROL
LOGIC
CAPACITIVE
DAC
03153-A-019
CAPACITIVE
DAC
B
IN+
A
A
IN–
B
C
S
SW1
SW2
C
S
V
REF
SW3
COMPARATOR
CONTROL
LOGIC
CAPACITIVE
DAC
03153-A-020
Figure 20. ADC Conversion Phase
ADC TRANSFER FUNCTION
The output coding for the AD7441/AD7451 is straight (natural)
binary. The designed code transitions occur at successive LSB
values (1 LSB, 2 LSB, and so on). The LSB size of the AD7451 is
/4096, and the LSB size of the AD7441 is V
V
REF
ideal transfer characteristic of the AD7441/AD7451 is shown in
Figure 21.
1LSB = V
111...11
111...10
111...00
011...11
ADC CODE
000...10
000...01
000...00
1LSB = V
0V
Figure 21. AD7441/AD7451 Ideal Transfer Characteristic
/4096 (AD7451)
REF
/1024 (AD7441)
REF
ANALOG INPUT
V
REF
REF
– 1LSB1LSB
/1024. The
03153-A-021
When the ADC starts a conversion (Figure 20), SW3 opens and
SW1 and SW2 move to Position B, causing the comparator to
become unbalanced. Both inputs are disconnected once the
conversion begins. The control logic and the charge
redistribution DACs are used to add and subtract fixed amounts
of charge from the sampling capacitor arrays to bring the
comparator back into a balanced condition. When the
comparator is rebalanced, the conversion is complete. The
control logic generates the ADC’s output code. The output
impedances of the sources driving the V
and the V
IN+
IN–
pins
must be matched; otherwise the two inputs have different
settling times, resulting in errors.
Rev. B | Page 13 of 24
Page 14
AD7441/AD7451
+
–
TYPICAL CONNECTION DIAGRAM
Figure 22 shows a typical connection diagram for the device. In
this setup the GND pin is connected to the analog ground plane
of the system. The V
pin is connected to the AD780, a 2.5 V
REF
decoupled reference source. The signal source is connected to
the V
connected to the V
V
analog input via a unity gain buffer. A dc voltage is
IN+
pin to provide a pseudo ground for the
IN–
input. The VDD pin should be decoupled to AGND with a
IN+
10 µF tantalum capacitor in parallel with a 0.1 µF ceramic
capacitor. The reference pin should be decoupled to AGND
with a capacitor of at least 0.1 µF. The conversion result is
output in a 16-bit word with 4 leading zeros followed by the
MSB of the 12-bit or 10-bit result. The 10-bit result of the
AD7441 is followed by 2 trailing zeros.
2.7V TO 5.25V
µ
F
SCLK
GND
CS
SUPPLY
SERIAL
INTERFACE
µC/µ
PSDATA
03153-A-022
AD7441/
AD7451
2.5V
AD780
10
0.1µF
V
0.1
DD
V
IN+
V
IN–
V
REF
µ
F
V
REF
p-p
DC INPUT
VOLTAGE
Figure 22. Typical Connection Diagram
ANALOG INPUT
The AD7441/AD7451 has a pseudo differential analog input.
The V
amplitude of V
the part. A dc input is applied to the V
this input provides an offset from ground or a pseudo ground
for the V
input signal ground from the ADC’s ground, allowing dc
common-mode voltages to be cancelled.
input is coupled to the signal source and must have an
IN+
p-p to make use of the full dynamic range of -
REF
. The voltage applied to
IN–
input. Pseudo differential inputs separate the analog
IN+
2.5V
1.25V
0V
V
IN+
AD7441/
AD7451
V
IN–
V
REF
03153-A-023
1.25V
1.25V
R
R
0V
V
IN+
3R
R
0.1µF
EXTERNAL
V
(2.5V)
REF
Figure 23. Op Amp Configuration to Level Shift a Bipolar Input Signal
ANALOG INPUT STRUCTURE
Figure 24 shows the equivalent circuit of the analog input
structure of the AD7441/AD7451. The four diodes provide
ESD protection for the analog inputs. Care must be taken to
ensure that the analog input signals never exceed the supply
rails by more than 300 mV. This causes these diodes to become
forward-biased and start conducting into the substrate. These
diodes can conduct up to 10 mA without causing irreversible
damage to the part. The capacitors, C1 in Figure 24, are
typically 4 pF and can be attributed primarily to pin capacitance. The resistors are lumped components made up of
the on resistance of the switches. The value of these resistors
is typically about 100 Ω. The capacitors, C2, are the ADC’s
sampling capacitors and have a capacitance of 16 pF typically.
For ac applications, removing high frequency components from
the analog input signal through the use of an RC low-pass filter
on the relevant analog input pins is recommended. In applications where harmonic distortion and the signal-to-noise
ratio are critical, the analog input should be driven from a low
impedance source. Large source impedances significantly affect
the ac performance of the ADC, which may necessitate the use
of an input buffer amplifier. The choice of the amp is a function
of the particular application.
V
DD
Because the ADC operates from a single supply, it is necessary
to level shift ground-based bipolar signals to comply with the
input requirements. An op amp (for example, the AD8021) can
V
IN+
D
D
C1
C2
R1
be configured to rescale and level shift a ground based (bipolar)
signal so that it is compatible with the input range of the
V
AD7441/AD7451. (See Figure 23.)
When a conversion takes place, the pseudo ground corresponds
to 0, and the maximum analog input corresponds to 4096 for
the AD7451 and 1024 for the AD7441.
V
IN–
C1
DD
D
D
C2
R1
03153-A-024
Figure 24. Equivalent Analog Input Circuit;
Conversion Phase—Switches Open;
Track Phase—Switches Closed
Rev. B | Page 14 of 24
Page 15
AD7441/AD7451
When no amplifier is used to drive the analog input, the source
impedance should be limited to low values. The maximum
source impedance depends on the amount of total harmonic
distortion that can be tolerated. The THD increases as the
source impedance increases and performance degrades.
Figure 25 shows a graph of THD vs. analog input signal
frequency for different source impedances.
0
TA = 25°C
V
= 5V
DD
–10
–20
–30
–40
–50
THD (dB)
–60
–70
–80
–90
–100
10k100k1M
INPUT FREQUENCY (Hz)
100
200
Ω
Ω
10
62
Ω
Ω
03153-A-025
Figure 25. THD vs. Analog Input Frequency for Various Source Impedances
Figure 26 shows a graph of THD vs. analog input frequency for
various supply voltages, while sampling at 1 MSPS with an
SCLK of 18 MHz. In this case the source impedance is 10 Ω.
–50
TA = 25°C
–55
–60
–65
= 2.7V
V
–70
THD (dB)
–75
–80
–85
–90
101001000
Figure 26. THD vs. Analog Input Frequency for Various Supply Voltages
DD
= 3.6V
V
DD
V
= 4.75V
DD
INPUT FREQUENCY (kHz)
V
= 5.25V
DD
03153-A-026
DIGITAL INPUTS
The digital inputs applied to the AD7441/AD7451 are not
limited by the maximum ratings that limit the analog inputs.
Instead the digital inputs applied—that is,
go to 7 V and are not restricted by the V
CS
and SCLK—can
+ 0.3 V limits as on
DD
the analog input. The main advantage of the inputs not being
restricted to the V
sequencing issues are avoided. If
, there is no risk of latch-up as there would be on the analog
V
DD
inputs if a signal greater than 0.3 V were applied prior to V
+ 0.3 V limit is that power supply
DD
CS
or SCLK are applied before
DD
.
REFERENCE
An external source is required to supply the reference to the
AD7441/AD7451. This reference input can range from 100 mV
. The specified reference is 2.5 V for the power supply
to V
DD
range 2.7 V to 5.25 V. The reference input chosen for an
application should never be greater than the power supply.
Errors in the reference source result in gain errors in the
AD7441/AD7451 transfer function and add to the specified
full-scale errors of the part. A capacitor of at least 0.1 µF
should be placed on the V
the AD7441/AD7451 include the AD780 and the ADR421.
Figure 27 shows a typical connection diagram for the V
V
DD
0.1µF
*ADDITIONAL PINS OMITTED FOR CLARITY
10nF0.1µF
Figure 27. Typical V
pin. Suitable reference sources for
REF
AD780
1
NC
2
V
IN
3
TEMP
4
GND
NC = NO CONNECT
Connection Diagram for VDD = 5 V
REF
OPSEL
V
OUT
TRIM
8
NC
7
NC
2.5V
6
5
NC
REF
AD7441/
AD7451*
0.1µF
pin.
V
DD
V
REF
03153-A-027
Rev. B | Page 15 of 24
Page 16
AD7441/AD7451
SERIAL INTERFACE
Figure 2 and Figure 3 show detailed timing diagrams for the
serial interface of the AD7451 and the AD7441, respectively.
The serial clock provides the conversion clock and also controls
the transfer of data from the device during conversion.
initiates the conversion process and frames the data transfer.
The falling edge of
and takes the bus out of three-state. The analog input is sampled
and the conversion initiated at this point. The conversion
requires 16 SCLK cycles to complete.
Once 13 SCLK falling edges have occurred, the track-and-hold
goes back into track mode on the next SCLK rising edge, as
shown at Point B in Figure 2 and Figure 3. On the 16th SCLK
falling edge, the SDATA line goes back into three-state.
If the rising edge of
the conversion is terminated and the SDATA line goes back into
three-state.
The conversion result from the AD7441/AD7451 is provided on
the SDATA output as a serial data stream. The bits are clocked
out on the falling edge of the SCLK input. The data stream of
the AD7451 consists of four leading zeros, followed by 12 bits of
conversion data, provided MSB first. The data stream of the
AD7441 consists of 4 leading zeros, followed by the 10 bits of
conversion data, followed by 2 trailing zeros, which is also
provided MSB first. In both cases, the output coding is straight
(natural) binary.
CS
puts the track-and-hold into hold mode
CS
occurs before 16 SCLKs have elapsed,
CS
Sixteen serial clock cycles are required to perform a conversion
CS
and to access data from the AD7441/AD7451.
provides the first leading zero to be read in by the DSP or the
microcontroller. The remaining data is then clocked out on the
subsequent SCLK falling edges, beginning with the second
leading zero. Thus, the first falling clock edge on the serial clock
provides the second leading zero. The final bit in the data
transfer is valid on the 16th falling edge, having been clocked
out on the previous (15th) falling edge. Once the conversion is
complete and the data has been accessed after the 16 clock
cycles, it is important to ensure that, before the next conversion
is initiated, enough time is left to meet the acquisition and
quiet-time specifications (see the timing examples that follow).
To achieve 1 MSPS with an 18 MHz clock, an 18-clock burst
performs the conversion and leaves enough time before the next
conversion for the acquisition and quiet time.
In applications with slower SCLKs, it could be possible to read
in data on each SCLK rising edge; that is, the first rising edge of
CS
SCLK after the
provided and the 15th SCLK edge would have DB0 provided.
falling edge would have the leading zero
going low
Rev. B | Page 16 of 24
Page 17
AD7441/AD7451
Timing Example 1
Having F
= 18 MHz and a throughput rate of 1 MSPS gives a
SCLK
cycle time of
Timing Example 2
Having F
= 5 MHz and a throughput rate of 315 kSPS gives a
SCLK
cycle time of
1/Throughput = 1/1000000 = 1 µs
A cycle consists of
Therefore if t
+ 12.5 (1/F
t
2
= 10 ns, then
2
10 ns + 12.5 (1/18 MHz) + t
t
= 296 ns
ACQ
SCLK
) + t
ACQ
= 1 µs
= 1 µs
ACQ
This 296 ns satisfies the requirement of 290 ns for t
From Figure 28, t
comprises
ACQ
2.5 (1/F
SCLK
) + t8 = t
QUIET
where t8 = 35 ns. This allows a value of 122 ns for t
satisfying the minimum requirement of 60 ns.
ACQ
QUIET
1/Throughput = 1/315000 = 3.174 µs
A cycle consists of
+ 12.5 (1/F
t
2
Therefore if t
is 10 ns, then
2
10 ns + 12.5 (1/5 MHz) + t
.
This 664 ns satisfies the requirement of 290 ns for t
From Figure 28, t
comprises
ACQ
2.5 (1/F
,
where t8 = 35 ns. This allows a value of 129 ns for t
SCLK
= 664 ns
t
ACQ
SCLK
) + t
ACQ
) + t8 = t
= 3.174 µs
= 3.174 µs
ACQ
QUIET
ACQ
QUIET
.
,
satisfying the minimum requirement of 60 ns.
As in this example and with other slower clock values, the signal
may already be acquired before the conversion is complete, but
it is still necessary to leave 60 ns minimum t
QUIET
between
conversions. In Example 2, the signal should be fully acquired at
approximately Point C in Figure 28.
CS
SCLK
10ns
t
2
1234513141516
12.5(1/F
SCLK
t
CONVERT
t
5
)
1/THROUGHPUT
BC
t
6
t
8
t
ACQUISITION
t
QUIET
03153-A-028
Figure 28. Serial Interface Timing Example
Rev. B | Page 17 of 24
Page 18
AD7441/AD7451
S
A
MODES OF OPERATION
The operating mode of the AD7441/AD7451 is selected by
CS
controlling the logic state of the
There are two operating modes: normal mode and power-down
mode. The point at which
CS
has been initiated determines whether the part enters powerdown mode. Similarly, if already in power-down,
whether the device returns to normal operation or remains in
power-down. These modes provide flexible power management
options that can optimize the power dissipation/throughput
rate ratio for differing application requirements.
NORMAL MODE
This mode is intended for fastest throughput rate performance.
The user does not have to worry about any power-up times with
the AD7441/AD7451 remaining fully powered up all the time.
Figure 29 shows the general diagram of the operation of the
AD7441/AD7451 in this mode. The conversion is initiated on
the falling edge of
section. To ensure that the part remains fully powered up,
must remain low until at least 10 SCLK falling edges have
elapsed after the falling edge of
CS
If
is brought high any time after the 10th SCLK falling edge,
but before the 16th SCLK falling edge, the part remains
powered up but the conversion is terminated and SDATA goes
back into three-state. Sixteen serial clock cycles are required to
complete the conversion and access the complete conversion
CS
result.
may idle high until the next conversion or may idle
low until sometime prior to the next conversion. Once a data
transfer is complete—that is, when SDATA has returned to
three-state—another conversion can be initiated after the quiet
time, t
QUIET
CS
SCLK
SDATA
CS
, as described in the Serial Interface
, has elapsed by again bringing CS low.
110
4 LEADING ZEROS + CONVERSION RESULT
Figure 29. Normal Mode Operation
signal during a conversion.
is pulled high after the conversion
CS
controls
CS
CS
.
16
03153-A-029
POWER-DOWN MODE
This mode is intended for use in applications where slower
throughput rates are required; either the ADC is powered down
between each conversion or a series of conversions may be
performed at a high throughput rate and the ADC is then
powered down for a relatively long duration between these
bursts of conversions. When the AD7441/AD7451 is in powerdown mode, all analog circuitry is powered down. For the
AD7441/AD7451 to enter power-down mode, the conversion
CS
process must be interrupted by bringing
the second falling edge of SCLK and before the 10th falling edge
of SCLK, as shown in Figure 30.
CS
Once
has been brought high in this window of SCLKs, the
part enters power-down and the conversion that was initiated
by the falling edge of
CS
is terminated and SDATA goes back
into three-state. The time from the rising edge of
three-state enabled is never greater than t
Specifications). If
CS
is brought high before the second SCLK
falling edge, the part remains in normal mode and does not
power down. This avoids accidental power-down due to glitches
CS
on the
line.
To exit power-down mode and power up the AD7441/AD7451
again, a dummy conversion is performed. On the falling edge of
CS
the device begins to power up and continues to power up as
CS
long as
is held low until after the falling edge of the 10th
SCLK. The device is fully powered up after 1 µs has elapsed and,
as shown in Figure 31, valid data results from the next
conversion.
CS
1
SCLK
DAT
2
Figure 30. Entering Power-Down Mode
high anywhere after
(see the Timing
8
10
THREE-STATE
CS
to SDATA
03153-A-030
Rev. B | Page 18 of 24
Page 19
AD7441/AD7451
t
POWER-UP
101611016
THIS PART IS FULLY POWERED
UP WITH V
FULLY ACQUIRED
IN
SCLK
CS
PART BEGINS
TO POWER UP
A
1
SDATA
INVALID DATAVALID DATA
Figure 31. Exiting Power-Down Mode
CS
is brought high before the 10th falling edge of SCLK, the
If
AD7441/AD7451 again goes back into power-down. This
avoids accidental power-up due to glitches on the
inadvertent burst of eight SCLK cycles while
CS
CS
is low. So
line or an
although the device may begin to power up on the falling edge
CS
of
, it again powers down on the rising edge of CS as long as
it occurs before the 10th SCLK falling edge.
Power-Up Time
The power-up time of the AD7441/AD7451 is typically 1 µs,
which means that with any frequency of SCLK up to 18 MHz,
one dummy cycle is always sufficient to allow the device to
power up. Once the dummy cycle is complete, the ADC is fully
powered up and the input signal is acquired properly. The quiet
time, t
, must still be allowed—from the point at which the
QUIET
bus goes back into three-state after the dummy conversion to
the next falling edge of
CS
.
When running at the maximum throughput rate of 1 MSPS,
the AD7441/AD7451 power up and acquire a signal within
±0.5 LSB in one dummy cycle, that is, 1 µs. When powering up
from the power-down mode with a dummy cycle, as in Figure
31, the track-and-hold, which was in hold mode while the part
was powered down, returns to track mode after the first SCLK
CS
edge the part receives after the falling edge of
. This is shown
as Point A in Figure 31.
03153-A-031
For example, when a 5 MHz SCLK frequency is applied to the
ADC, the cycle time is 3.2 µs (that is, 1/(5 MHz) × 16). In one
dummy cycle, 3.2 µs, the part is powered up and VIN acquired
fully. However after 1 µs with a 5 MHz SCLK, only five SCLK
cycles elapse. At this stage, the ADC is fully powered up and the
CS
signal acquired. So, in this case, the
can be brought high
after the 10th SCLK falling edge and brought low again after a
time, t
, to initiate the conversion.
QUIET
When power supplies are first applied to the AD7441/AD7451,
the ADC can power up either in power-down mode or normal
mode. For this reason, it is best to allow a dummy cycle to
elapse to ensure that the part is fully powered up before
attempting a valid conversion. Likewise, if the user wants the
part to power up in power-down mode, then the dummy cycle
can be used to ensure the device is in power-down mode by
executing a cycle such as that shown in Figure 30. Once supplies
are applied to the AD7441/AD7451, the power-up time is the
same as that when powering up from power-down mode. It
takes approximately 1 µs to power up fully in normal mode. It is
not necessary to wait 1 µs before executing a dummy cycle to
ensure the desired mode of operation. Instead, the dummy cycle
can occur directly after power is supplied to the ADC. If the
first valid conversion is then performed directly after the
dummy conversion, care must be taken to ensure that adequate
acquisition time has been allowed.
Although at any SCLK frequency one dummy cycle is sufficient
to power up the device and acquire V
, it does not necessarily
IN
mean that a full dummy cycle of 16 SCLKs must always elapse
to power up the device and acquire V
fully; 1 µs is sufficient to
IN
power up the device and acquire the input signal.
Rev. B | Page 19 of 24
As mentioned earlier, when powering up from the power-down
mode, the part returns to track mode upon the first SCLK edge
CS
applied after the falling edge of
. However, when the ADC
powers up initially after supplies are applied, the track-and-hold
is already in track mode. This means (assuming one has the
facility to monitor the ADC supply current) that if the ADC
powers up in the desired mode of operation, a dummy cycle is
not required to change mode. Thus, a dummy cycle is also not
required to place the track-and-hold into track.
Page 20
AD7441/AD7451
POWER VS. THROUGHPUT RATE
By using the power-down mode on the device when not converting, the average power consumption of the ADC decreases at
lower throughput rates. Figure 32 shows how, as the throughput
rate is reduced, the device remains in its power-down state
longer and the average power consumption reduces accordingly.
For example, if the AD7441/AD7451 are operated in continuous sampling mode with a throughput rate of 100 kSPS and an
SCLK of 18 MHz, and the device is placed in the power-down
mode between conversions, then the power consumption
during normal operation equals 9.25 mW max (for V
If the power-up time is one dummy cycle (1 µs) and the
remaining conversion time is another cycle (1 µs), then the
AD7441/AD7451 can be said to dissipate 9.25 mW for 2 µs
during each conversion cycle. (This power consumption figure
assumes a very short time to enter power-down mode. This
power figure increases as the burst of clocks used to enter
power-down mode is increased). The AD7441/AD7451
consumes just 5 µW for the remaining 8 µs.
If the throughput rate = 100 kSPS, then the cycle time = 10 µs,
and the average power dissipated during each cycle is
mW85.1mW25.9)10/2(=×
= 5 V).
DD
MICROPROCESSOR AND DSP INTERFACING
The serial interface on the AD7441/AD7451 allows the part to
be connected directly to a range of different microprocessors.
This section explains how to interface the AD7441/AD7451
with some of the more common microcontroller and DSP serial
interface protocols.
AD7441/AD7451 to ADSP-21xx
The ADSP-21xx family of DSPs is interfaced directly to the
AD7441/AD7451 without any glue logic required. The SPORT
control register should be set up as follows:
TFSW = RFSW = 1 Alternate framing
INVRFS = INVTFS = 1 Active low frame signal
DTYPE = 00 Right justify data
SLEN = 1111 16-bit data-words
ISCLK = 1 Internal serial clock
TFSR = RFSR = 1 Frame every word
IRFS = 0
ITFS = 1
For the same scenario, if V
= 3 V, the power dissipation
DD
during normal operation is 4 mW max.
The AD7441/AD7451 can now be said to dissipate 4 mW for
2 µs during each conversion cycle.
The average power dissipated during each cycle with a
throughput rate of 100 kSPS is therefore
(2/10) × 4 mW = 0.8 mW
This is how the power numbers in Figure 32 are calculated.
100
10
1
POWER (mW)
0.1
0.01
0350
50100150200250300
Figure 32. Power vs. Throughput Rate for Power-Down Mode
VDD = 5V
V
DD
THROUGHPUT (kSPS)
= 3V
03051-A-044
For optimum power performance in throughput rates above
320 kSPS, it is recommended that the serial clock frequency be
reduced.
To implement power-down mode, SLEN should be set to 1001
to issue an 8-bit SCLK burst.
The connection diagram is shown in Figure 33. ADSP-21xx has
the TFS and RFS of the SPORT tied together, with TFS set as an
output and RFS set as an input. The DSP operates in alternate
framing mode, and the SPORT control register is set up as
described. The frame synchronization signal generated on the
CS
TFS is tied to
, and, as with all signal processing applications,
equidistant sampling is necessary. However, in this example,
the timer interrupt is used to control the sampling rate of the
ADC and, under certain conditions, equidistant sampling
cannot be achieved.
AD7441/
AD7451*
SCLK
SDATA
CS
*ADDITIONAL PINS REMOVED FOR CLARITY
Figure 33. Interfacing to the ADSP-21xx
ADSP-21xx*
SCLK
DR
RFS
TFS
03153-A-033
Rev. B | Page 20 of 24
Page 21
AD7441/AD7451
The timer registers, for example, are loaded with a value that
provides an interrupt at the required sample interval. When an
interrupt is received, a value is transmitted with TFS/DT (ADC
control word). The TFS is used to control the RFS and therefore
the reading of data. The frequency of the serial clock is set in
the SCLKDIV register. When the instruction to transmit with
TFS is given, that is, AX0 = TX0, the state of the SCLK is
checked. The DSP waits until the SCLK has gone high, low, and
high before starting transmission. If the timer and SCLK values
are chosen such that the instruction to transmit occurs on or
near the rising edge of SCLK, then the data may be transmitted
or it may wait until the next clock edge.
For example, the ADSP-2111 has a master clock frequency of
16 MHz. If the SCLKDIV register is loaded with the value 3, an
SCLK of 2 MHz is obtained, and eight master clock periods
elapse for every one SCLK period. If the timer registers are
loaded with the value 803, 100.5 SCLKs occur between
interrupts and subsequently between transmit instructions.
This situation results in nonequidistant sampling because the
transmit instruction is occurring on an SCLK edge. If the
number of SCLKs between interrupts is a whole integer figure
of N, equidistant sampling is implemented by the DSP.
AD7441/AD7451 to TMS320C5x/C54x
The serial interface on the TMS320C5x/C54x uses a continuous
serial clock and frame synchronization signals to synchronize
the data transfer operations with peripheral devices such as the
AD7441/AD7451. The
CS
input allows easy interfacing between
the TMS320C5x/C54x and the AD7441/AD7451 without any
glue logic required. The serial port of the TMS320C5x/C54x
is set up to operate in burst mode with internal CLKX (Tx serial
clock) and FSX (Tx frame sync). The serial port control
register (SPC) must have the following setup: FO = 0, FSM = 1,
MCM = 1, and TXM = 1. The format bit, FO, can be set to 1 to
set the word length to 8 bits in order to implement the powerdown mode on the AD7441/AD7451. The connection diagram
is shown in Figure 34. Note that for signal processing
applications, the frame synchronization signal from the
TMS320C5x/C54x must provide equidistant sampling.
AD7441/AD7451 to DSP56xxx
The connection diagram in Figure 35 shows how the AD7441/
AD7451 can be connected to the SSI (synchronous serial
interface) of the DSP56xxx family of DSPs from Motorola. The
SSI is operated in synchronous mode (SYN bit in CRB = 1) with
internally generated 1-bit clock period frame sync for both Tx
and Rx (Bit FSL1 = 1 and Bit FSL0 = 0 in CRB). Set the word
length to 16 by setting bits WL1 = 1 and WL0 = 0 in CRA. To
implement the power-down mode on the AD7441/AD7451, the
word length can be changed to eight bits by setting bits WL1 = 0
and WL0 = 0 in CRA. Note that for signal processing
applications, the frame synchronization signal from the
DSP56xxx must provide equidistant sampling.
AD7441/
AD7451*
SCLK
SDATA
CS
*ADDITIONAL PINS REMOVED FOR CLARITY
Figure 35. Interfacing to the DSP56xxx
DSP56xxx*
SCLK
SRD
SR2
03153-A-035
AD7441/
AD7451*
SCLK
SDATA
CS
*ADDITIONAL PINS REMOVED FOR CLARITY
Figure 34. Interfacing to the TMS320C5x/C54x
TMS320C5x/
C54x*
CLKx
CLKR
DR
FSx
FSR
03153-A-034
Rev. B | Page 21 of 24
Page 22
AD7441/AD7451
GROUNDING AND LAYOUT HINTS
The printed circuit board that houses the AD7441/AD7451
should be designed so that the analog and digital sections are
separated and confined to certain areas of the board. This
facilitates the use of ground planes that can be easily separated.
A minimum etch technique is generally best for ground planes
as it gives the best shielding. Digital and analog ground planes
should be joined in only one place, a star ground point
established as close to the GND pin on the AD7441/AD7451
as possible.
EVALUATING PERFORMANCE
The evaluation board package includes a fully assembled
and tested evaluation board, documentation, and software
for controlling the board from a PC via the evaluation board
controller. The evaluation board controller can be used in
conjunction with the AD7441 and the AD7451 evaluation
boards, as well as with many other Analog Devices evaluation
boards ending with the CB designator, to demonstrate and
evaluate the ac and dc performance of the AD7441 and the
AD7451.
Avoid running digital lines under the device as this couples
noise onto the die. The analog ground plane should be allowed
to run under the AD7441/AD7451 to avoid noise coupling. The
power supply lines to the AD7441/AD7451 should use as large a
trace as possible to provide low impedance paths and reduce the
effects of glitches on the power supply line.
Fast switching signals like clocks should be shielded with digital
grounds to avoid radiating noise to other sections of the board,
and clock signals should never run near the analog inputs.
Avoid crossover of digital and analog signals. Traces on
opposite sides of the board should run at right angles to each
other. This reduces the effects of feedthrough on the board. A
microstrip technique is by far the best but is not always possible
with a double-sided board.
In this technique the component side of the board is dedicated
to ground planes while signals are placed on the solder side.
Good decoupling is also important. All analog supplies should
be decoupled with 10 µF tantalum capacitors in parallel with
0.1 µF capacitors to GND. To achieve the best from these
decoupling components, they must be placed as close as
possible to the device.
The software allows the user to perform ac (fast Fourier
transform) and dc (histogram of codes) tests on the
AD7441/AD7451. See the AD7441/AD7451 application note
that accompanies the evaluation kit for more information.
Rev. B | Page 22 of 24
Page 23
AD7441/AD7451
R
OUTLINE DIMENSIONS
2.90 BSC
2
1.95
BSC
56
0.65 BSC
2.80 BSC
1.45 MAX
SEATING
PLANE
0.22
0.08
8°
4°
0°
0.60
0.45
0.30
1.60 BSC
PIN 1
INDICATO
1.30
1.15
0.90
0.15 MAX
847
13
0.38
0.22
COMPLIANT TO JEDEC STANDARDS MO-178BA
Figure 36. 8-Lead Small Outline Transistor Package [SOT-23]
(RT-8)
Dimensions shown in millimeters
3.00
BSC
8
5
3.00
BSC
PIN 1
1
0.65 BSC
4.90
BSC
4
0.15
0.00
0.38
0.22
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187AA
1.10 MAX
SEATING
PLANE
0.23
0.08
8°
0°
Figure 37. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
0.80
0.60
0.40
Rev. B | Page 23 of 24
Page 24
AD7441/AD7451
ORDERING GUIDE
Model Temperature Range Linearity Error (LSB)1Package Description Package Option Branding
Linearity error here refers to integral nonlinearity error.
2
This can be used as a standalone evaluation board or in conjunction with the evaluation board controller for evaluation/demonstration purposes.
3
The evaluation board controller is a complete unit allowing a PC to control and communicate with all Analog Devices evaluation boards ending in the CB designators.
To order a complete evaluation kit, you must order the ADC evaluation board (EVAL-AD7451CB or EVAL-AD7441CB), the EVAL-CONTROL BRD2, and a 12 V ac
transformer. See the AD7451/AD7441 application note that accompanies the evaluation kit for more information.