0.1 μA typical power shutdown
Single-supply 2.7 V to 5.5 V operation
12-bit resolution
Serial interface with Schmitt trigger inputs
APPLICATIONS
Automotive output span voltage
Portable communications
Digitally controlled calibration
PC peripherals
CLK
SDI
(DATA)
LDA
LDB
CS
Serial Input 12-Bit DAC
AD7394
FUNCTIONAL BLOCK DIAGRAM
REF
OP AMP
AGND
A
OP AMP
B
SHDN
EN
SHIFT
REGISTER
DGNDMSB
DAC A
REGISTER
D
PR
12
D
DAC B
REGISTER
PR
DAC A
AD7394
DAC B
RS
Figure 1.
V
V
OUTA
OUTB
08528-001
GENERAL DESCRIPTION
The AD7394 is dual, 12-bit, voltage output digital-to-analog
converter designed to operate from a single 3 V supply. Built
using a CBCMOS process, this monolithic DAC offers the
user low cost and ease-of-use in a single-supply 3 V system.
Operation is guaranteed over the supply voltage range of 2.7 V
to 5.5 V making this device ideal for battery-operated
applications.
The full-scale output voltage is determined by the applied
external reference input voltage, V
input to V
to the positive supply, V
outputs allows for a full-scale voltage set equal
OUT
, or any value in between.
DD
A doubled-buffered serial data interface offers high speed,
microcontroller compatible inputs using the serial-data-in
(SDI), clock (CLK), and load strobe (
CS
A chip-select (
) pin simplifies the connection of multiple
DAC packages by enabling the clock input when active low.
Additionally, an
RS
input sets the output to zero scale or to 1/2
scale based on the logic level applied to the MSB pin. The power
SHDN
shutdown pin,
, reduces power dissipation to nanoamp
current levels. All digital inputs contain Schmitt-triggered logic
levels to minimize power dissipation and prevent false
triggering on the clock input.
. The rail-to-rail V
REF
LDA
and
LDB
REF
) pins.
The AD7394 is specified over the extended industrial (−40°C
to +85°C) temperature range and is available in a low profile
1.75 mm height SOIC surface mount package.
1.0
VDD = 3V
0.8
0.6
0.4
0.2
0
DNL (LSB)
–0.2
–0.4
–0.6
–0.8
–1.0
= 2.5V
V
REF
TA = –55°C, +25°C, +85°C
SUPERIMPOSED
05001000 1500 2000 2500 3000 3500 4000
CODE (Decimal)
Figure 2. Differential Nonlinearity Error vs. Code
08528-002
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Resolution1 N 12 12 Bits
Relative Accuracy2 INL TA = +25°C ±1.5 ±1.5 LSB max
T
= –40°C, +85°C ±2.0 ±2.0 LSB max
A
Differential Nonlinearity2 DNL TA = +25°C, monotonic ±0.9 ±0.9 LSB max
Monotonic ±1 ±1 LSB max
Zero-Scale Error V
Full-Scale Voltage Error V
T
Full-Scale Tempco3 TCV
V
Range V
REF IN
Input Resistance R
Input Capacitance3 C
Output Current (Source) I
Output Current (Sink) I
Data = 000H 4.0 4.0 mV max
ZSE
TA = +25°C, +85°C, data = FFFH ±8 ±8 mV max
FSE
= −40°C, data = FFFH ±20 ±20 mV max
A
−30 −30 ppm/°C typ
FS
0/VDD 0/VDD V min/max
REF
2.5 2.5 MΩ typ4
REF
5 5 pF typ
REF
Data = 800H, ΔV
OUT
Data = 800H, ΔV
OUT
= 5 LSB 1 1 mA typ
OUT
= 5 LSB 3 3 mA typ
OUT
Capacitive Load3 CL No oscillation 100 100 pF typ
Logic Input Low Voltage VIL 0.5 0.8 V max
Logic Input High Voltage V
V
IH
− 0.6 4.0 V min
DD
Input Leakage Current IIL 10 10 μA max
Input Capacitance3 C
3, 5
10 10 pF max
IL
Clock Width High tCH 50 30 ns min
Clock Width Low tCL 50 30 ns min
Load Pulsewidth t
30 20 ns min
LDW
Data Setup tDS 10 10 ns min
Data Hold tDH 30 15 ns min
Clear Pulsewidth t
Load Setup t
Load Hold t
15 15 ns min
CLRW
30 15 ns min
LD1
40 20 ns min
LD2
Output Slew Rate SR Data = 000H to FFFH to 000H 0.05 0.05 V/μs typ
Settling Time6 t
To ±0.1% of full scale 70 60 μs typ
S
DAC Glitch Q Code 7FFH to 800H to 7FFH 65 65 nV/s typ
Digital Feedthrough Q
Feedthrough V
V
OUT/VREF
= 1.5 VDC +1 V p-p, 15 15 nV/s typ
REF
Rev. A | Page 3 of 16
Page 4
AD7394
Parameter Symbol Conditions 3 V ± 10% 5 V ± 10% Unit
SUPPLY CHARACTERISTICS
Power Supply Range V
Shutdown Supply Current
Positive Supply Current IDD VIL = 0 V, no load 125/200 125/200 μA typ/max
Power Dissipation P
Power Supply Sensitivity PSS ΔVDD = ±5% 0.006 0.006 %/% max
1
One LSB = V
2
The first two codes (000H, 001H) are excluded from the linearity error measurement.
3
These parameters are guaranteed by design and not subject to production testing.
4
Typicals represent average readings measured at 25°C.
5
All input control signals are specified with tR = tF = 2 ns (10% to 90% of +3 V) and timed from a voltage level of 1.6 V.
6
The settling time specification does not apply for negative going transitions within the last three LSBs of ground.
/4096 V for the 12-bit AD7394.
REF
DNL < ± 1 LSB 2.7/5.5 2.7/5.5 V min/max
DD RANGE
SHDN
I
DD_SD
VIL = 0 V, no load 600 1000 μW max
DISS
= 0, VIL = 0 V, no load
0.1/1.5 0.1/1.5 μA typ/max
Rev. A | Page 4 of 16
Page 5
AD7394
Timing Diagrams
SDI
CLK
t
CSS
CS
LDA, LDB
SDI
CLK
LDA, LDB
RS
V
OUT
t
LD1
tDSt
DH
t
CL
t
CH
FS
ZS
t
LDW
t
S
ERROR BAND
±1 LSB
Figure 3.
SHDN
I
DD
Figure 4.
t
SDR
D0D1D2D3D4D5D6D7D8D9D10D11
t
CSH
t
LD2
t
CLRW
t
S
08528-003
08528-004
Rev. A | Page 5 of 16
Page 6
AD7394
Table 2. Control Logic Truth Table
CS
CLK
H X H X H H No effect Latched
L L H X H H No effect Latched
L H H X H H No effect Latched
L
↑+
L
↑+
L H H X H L No effect Transparent
L H X H H No effect Latched
↑+1
H X H X H
H X H X H L No effect Transparent
X X L H H X No effect Loaded with 800H
X X
X X L L H X No effect Loaded with all zeros
X X
X X X X L X No effect No affect
Serial Shift Register Function DAC Register Function
H X H H Shift-register-data advanced one bit Latched
H X H L Shift-register-data advanced one bit Transparent
2
↓−
H H H No effect Latched with 800H
↑+
L H H No effect Latched all zeros
↑+
No effect Updated with current shift register contents
LDA
LDB
or
are logic low.
LSB
Rev. A | Page 6 of 16
Page 7
AD7394
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter Rating
VDD to GND –0.3 V to +7 V
V
to GND –0.3 V to VDD
REF
Logic Inputs to GND –0.3 V to +8 V
V
to GND –0.3 V to VDD + 0.3 V
OUT
I
Short Circuit to GND 50 mA
OUT
Package Power Dissipation (TJ max – TA)/θJA
Thermal Resistance θJA
14-Lead SOIC Package (R-14) 158°C/W
Maximum Junction Temperature (TJ max) 150°C
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Lead Temperature
R-14 (Vapor Phase, 60 sec) 215°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. A | Page 7 of 16
Page 8
AD7394
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
AGND
1
V
2
OUTA
V
DGND
CLK
REF
CS
SDI
AD7394
3
4
TOP VIEW
(Not to Scale)
5
6
7
Figure 5. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1 AGND Analog Ground.
2 V
3 V
DAC A Voltage Output.
OUTA
DAC Reference Voltage Input Terminal. Establishes DAC full-scale output voltage. Pin can be tied to VDD pin.
REF
4 DGND Digital Ground. Should be tied to analog GND.
CS
5
Chip Select, Active Low Input. Disables shift register loading when high. Does not affect LDA or LDB operation.
6 CLK Clock Input. Positive edge clocks data into shift register, MSB data bit first.
7 SDI Serial Data Input. Input data loads directly into the shift register.
8
Load DAC Register Strobe. Level sensitive active low. Transfers shift register data to DAC A register. Asynchronous
LDA
active low input. See Table 2 for operation.
9
10
RS
Load DAC Register Strobe. Level-sensitive active low. Transfers shift register data to DAC B register. Asynchronous
LDB
Resets DAC register to zero condition or half-scale, depending on MSB pin logic level. Asynchronous active low input.
active low input. See Table 2 for operation.
11 MSB
Digital Input. Logic High presets DAC registers to half-scale 800
logic low clears all DAC registers to zero (000H) when the RS pin is strobed.
12
Active Low Shutdown Control Input. Does not affect register contents as long as power is present on VDD. New data
SHDN
can be loaded into the shift register and DAC register during shutdown. When device is powered up the most
recent data loaded into the DAC register controls the DAC output.
13 VDD Positive Power Supply Input. Specified range of operation is 2.7 V to 5.5 V
14 V
DAC B Voltage Output.
OUTB
14
V
OUTB
13
V
DD
12
SHDN
11
MSB
LDB
10
RS
9
LDA
8
08528-005
(sets MSB bit to one) when the RS pin is strobed;
H
Rev. A | Page 8 of 16
Page 9
AD7394
√
TYPICAL PERFORMANCE CHARACTERISTICS
1.5
1.0
0.5
0
INL (LSB)
–0.5
–1.0
–1.5
05001000 1500 2000
TA = –55°C
TA = +25°C, + 85°C
Figure 6. Integral Nonlinearity Error vs. Code
CODE (Decimal)
VDD = 3V
V
= 2.5V
REF
2500 3000 3500 4000
08528-006
30
25
20
15
10
5
FSE (LSB)
0
–10
–15
–5
0
FULL SCALE ERROR
0.5 1.01.5 2.02.5 3.0 3.54.0 4.55.0
TOTAL UNADJUST E D
FULL SCALE ERROR
V
(V)
REF
Figure 9. Full-Scale Error vs. V
TA = 25°C
08528-011
REF
25
SS = 200 UNITS
T
= 25°C
A
V
= 2.7V
DD
20
V
= 2.5V
REF
15
10
FREQUENCY
5
0
–3–2–101
TOTAL UNADJUS TED ERROR (LS B)
08528-007
Figure 7. Total Unadjusted Error Histogram
0.6
0.5
VDD = 5.0V
= 25°C
(V)
T
A
CODE = 768
REF
H
08528-010
0.4
0.3
INL (LSB)
0.2
0.1
0
0.51.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
0
Figure 8. Integral Nonlinearity Error vs. V
V
REF
10
8
Hz)
6
4
2
OUTPUT NOISE DENSITY (µV/
0
FREQUENCY (Hz)
VDD = 5V
V
REF
= +25°C
T
A
Figure 10. Output Noise Density vs. Frequency
140
135
130
125
120
(µA)
DD
115
I
110
105
100
VDD = 3V
VIN 3V TO 0V
00.51.01.52.02.53.0
VIN (V)
VIN 0V TO 3V
Figure 11. Supply Current vs. Logic Input Voltage
= 2.5V
100k101001k10k1
08528-012
08528-013
Rev. A | Page 9 of 16
Page 10
AD7394
5.0
4.5
4.0
3.5
3.0
2.5
LOGIC THRESHOLD (V)
2.0
1.5
1.0
V
FROM LOW TO HIGH
LOGIC
V
LOGIC
FROM HIGH TO LOW
VDD(V)
734562
8528-014
Figure 12. Logic Threshold vs. Supply Voltage
1800
A: IDD = 2.7V, CO DE = 555
1600
B: IDD = 2.7V, CO DE = 3FF
C: VDD = 5.5V, CO DE = 155
1400
D: VDD = 5.5V, CO DE = 3FF
1200
1000
(µA)
DD
800
I
600
400
200
0
CLOCK FREQ UENCY ( Hz )
H
H
H
H
D
C
B
A
10M10k100k1M1k
8528-015
Figure 13. Supply Current vs. Clock Frequency
80
70
60
= 5.0V, ±5%
V
50
40
PSRR (dB)
30
20
10
0
VDD = 3.0V, ±5%
1101001k10k
FREQUENCY (Hz)
DD
TA = 25°C
Figure 14. Power Supply Rejection vs. Frequency
20
18
16
14
12
10
8
6
CURRENT SINKING (m A)
4
2
0
VDD = 5V
123456789100
Figure 15. I
ΔV
OUT
Sink Current vs. ΔV
OUT
(LSB)
V
DD
V
= 2.5V
REF
CODE = 800
= 3V
OUT
08528-016
H
08528-017
Rev. A | Page 10 of 16
Page 11
AD7394
10
V
= 2.5V
REF
9
CODE = 800
8
7
6
5
4
3
CURRENT SOURCING ( mA)
2
1
0
–10 –90
H
VDD = 5V
VDD = 3V
–8–7–6–5–4–3–2–1
Figure 16. I
ΔV
(LSB)
OUT
Source Current vs. ΔV
OUT
OUT
1.262
VDD = +5V
V
REF
= 2.5V
= 25°C
T
A
CODE = 800
5mV/DIV
(V)
V
1.257
1.252
OUT
1.247
TO 7FF
H
1.4
1.2
(mV)
1.0
OUT
0.8
0.6
0.4
NOMINAL CHANGE IN V
0.2
0
08528-018
CODE = 000
1002003004005006000
HOURS OF O P E RATION (150° C)
H
CODE = FFF
H
08528-021
Figure 18. Long-Term Drift Accelerated by Burn-In
H
1.242
1.237
TIME (2µs/DIV)
08528-019
Figure 17. Midscale Transition Performance
Rev. A | Page 11 of 16
Page 12
AD7394
V
THEORY OF OPERATION
The AD7394 is a pin compatible, dual, 12-bit digital-to-analog
converter. This single-supply operation device consumes less
than 200 microamps of current while operating from power
supplies in the 2.7 V to 5.5 V range, making it ideal for batteryoperated applications. The AD7394 contains a voltage-switched,
12-bit, laser trimmed digital-to-analog converter, rail-to-rail
output op amps, two DAC registers, and a serial input shift
register. The external reference input has constant input
resistance independent of the digital code setting of the DAC.
In addition, the reference input can be tied to the same supply
voltage as V
0 to V
(SDI), clock (CLK), a chip select pin (
Register pins (
, resulting in a maximum output voltage span of
DD
. The serial interface consists of a serial data input
DD
CS
), and two load DAC
LDA
and
LDB
). A reset (RS) pin is available to
reset the DAC register to zero scale or midscale, depending on
the digital level applied to the MSB pin. This function is useful
for power-on reset or system failure recovery to a known state.
Additional power savings are accomplished by activating the
SHDN
pin resulting in a 1.5 mA maximum consumption sleep
mode.
DAC SECTION
The voltage switched R-2R DAC generates an output voltage
dependent on the external reference voltage connected to the
REF pin according to the following equation:
DV
×
V
OUT
where:
D is the decimal data word loaded into the DAC register.
N is the number of bits of DAC resolution.
For the 12-bit AD7394 operating from a 5.0 V reference
Equation 1 becomes:
V
OUT
Using Equation 3 the AD7394 provides a nominal midscale
voltage of 2.50 V for D = 2048, and a full-scale output of 4.998 V.
The LSB step size is = 5.0 × 1/4096 = 0.0012 V.
REF
= (1)
N
2
0.5
D
×
= (3)
4096
AMPLIFIER SECTION
The internal DAC’s output is buffered by a low power
consumption precision amplifier. The op amp has a 60 μs
typical settling time to 0.1% of full scale. There are slight
differences in settling time for negative slewing signals vs.
positive. Also, negative transition settling time to within the
last 6 LSBs of zero volts has an extended settling time. The
rail-to-rail output stage of this amplifier has been designed
to provide precision performance while operating near either
power supply. Figure 19 shows an equivalent output schematic
of the rail-to-rail-amplifier with its N-channel pull-down FETs
that will pull an output load directly to GND. The output
sourcing current is provided by a P-channel pull-up device
that can source current to GND terminated loads.
DD
P-CH
V
OUT
N-CH
AGND
08528-022
Figure 19. Equivalent Analog Output Circuit
The rail-to-rail output stage provides more than ±1 mA of
output current. The N-channel output pull-down MOSFET
shown in Figure 19 has a 35 Ω on resistance, which sets the
sink current capability near ground. In addition to resistive
load driving capability, the amplifier has also been carefully
designed and characterized for up to 100 pF capacitive load
driving capability.
REFERENCE INPUT
The reference input terminal has a constant input resistance
independent of digital code, which results in reduced glitches
on the external reference voltage source. The high 2.5 MΩ
input resistance minimizes power dissipation within the
AD7394 DAC. The V
from ground to the positive supply voltage V
simplest applications, which saves an external reference voltage
source, is connection of the V
supply. This connection results in a rail-to-rail voltage output
span maximizing the programmed range. The reference input
accepts ac signals as long as they are kept within the supply
voltage range, 0 < V
integral nonlinearity error performance are plotted in Figure 8.
The ratiometric reference feature makes the AD7394 an ideal
companion to ratiometric analog-to-digital converters such
as the AD7896.
input accepts input voltages ranging
REF
. One of the
DD
terminal to the positive VDD
REF
< VDD. The reference bandwidth and
REF
Rev. A | Page 12 of 16
Page 13
AD7394
*
V
V
C
POWER SUPPLY
The very low power consumption of the AD7394 is a direct
result of a circuit design optimizing the use of a CBCMOS process.
By using the low power characteristics of CMOS for the logic,
and the low noise, tight matching of the complementary bipolar
transistors, excellent analog accuracy is achieved. One advantage of the rail-to-rail output amplifiers used in the AD7394 is
the wide range of usable supply voltage. The part is fully
specified and tested for operation from 2.7 V to 5.5 V.
POWER SUPPLY BYPASSING AND GROUNDING
Local supply bypassing consisting of a 10 μF tantalum
electrolytic in parallel with a 0.1 μF ceramic capacitor is
recommended in all applications (Figure 20).
2.7V TO 5.5
C
*
CS
LDA, LDB
CLK
SDI
RS
OPTIO NAL EXTERNAL
REFERENCE BYPASS
Figure 20. Recommended Supply Bypassing for the AD7394
REFV
DGND
DD
AD7394
AGND
0.1µF
10µF
V
V
OUTA
OUTB
08528-023
INPUT LOGIC LEVELS
All digital inputs are protected with a Zener-type ESD protection
structure (Figure 21) that allows logic input voltages to exceed
supply voltage. This feature can be useful if the user is
the V
DD
driving one or more of the digital inputs with a 5 V CMOS logic
input-voltage level while operating the AD7394 on a 3 V power
supply. If this mode of interface is used, make sure that the V
of the 5 V CMOS meets the V
input requirement of the
IL
AD7394 operating at 3 V. See Figure 12 for a graph of digital
logic input threshold vs. operating V
DD
LOGI
IN
GND
Figure 21. Equivalent Digital Input ESD Protection
supply voltage.
DD
08528-024
To minimize power dissipation from input logic levels that are
near the V
and VIL logic input voltage specifications, a Schmitt
IH
trigger design was used that minimizes the input buffer current
consumption compared to traditional CMOS input stages.
Figure 11 is a plot of incremental input voltage vs. supply current
showing that negligible current consumption takes place when
logic levels are in their quiescent state. The normal crossover
current still occurs during logic transitions. A secondary
advantage of this Schmitt trigger is the prevention of false
triggers that would occur with slow moving logic transitions
when a standard CMOS logic interface or opto isolators are
LDA, LDB, RS
CS
used. The logic inputs SDI, CLK,
SHDN
all contain the Schmitt trigger circuits.
,
, and
OL
Rev. A | Page 13 of 16
Page 14
AD7394
DIGITAL INTERFACE
The AD7394 has a serial data input. A functional block diagram
of the digital section is shown in Figure 22, while Ta b le 2
contains the truth table for the logic control inputs. Three pins
control the serial data input register loading. Two additional
pins determine which DAC receives the data loaded into the
input shift register. Data at the SDI is clocked into the shift
register on the rising edge of the CLK. Data is entered in the
CS
MSB-first format. The active low chip select (
loading of data into the shift register from the SDI pin. Twelve
clock pulses are required to load the 12-bit AD7390 DAC shift
register. If additional bits are clocked into the shift register, for
example, when a microcontroller sends two 8-bit bytes, the
CS
MSBs are ignored (). When Tabl e 6
returns to logic high,
shift register loading is disabled. The load pins
control the flow of data from the shift register to the DAC register.
After a new value is clocked into the serial-input register, it is
transferred to the DAC register associated with its
logic control line. Note, if the user wants to load both DAC
registers with the current contents of the shift register, both
control lines
LDA
and
LDB
LDA
pins are level-sensitive and should be returned
and
LDB
should be strobed together. The
to logic high prior to any new data being sent to the input shift
register to avoid changing the DAC register values. See
for a complete set of conditions.
) pin enables
LDA
and
LDA
or
Tabl e 2
LDB
LDB
CS
CLK
SDI
EN
DAC A REGISTER
DPR
SHIFT
REGISTER
Q
Figure 22. Equivalent Digital Interface Logic
DAC B REGISTER
DPR
MSB
SRBDLADL
08528-025
RESET (RS) PIN
Forcing the asynchronous RS pin low sets the DAC register to
all zeros, or midscale, depending on the logic level applied to
the MSB pin. When the MSB pin is set to logic high, both DAC
registers are reset to midscale (that is, the DAC register’s MSB
bit is set to Logic 1 followed by all zeros). The reset function is
useful for setting the DAC outputs to zero at power-up or after
a power supply interruption. Test systems and motor controllers
are two of many applications that benefit from powering up to
a known state. The external reset pulse can be generated by the
microprocessor’s power-on reset signal, by an output from the
RS
microprocessor, or by an external resistor and capacitor.
has
a Schmitt trigger input, which results in a clean reset function
when using external resistor/capacitor generated pulses. See
B15 B14 B13 B12 B11 B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
X X X X D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
X X X X X X D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
1
D11 to D0: 12-bit AD7394 DAC data; X = don’t care; the MSB of byte 1 is the first bit that is loaded into the SDI input.
Rev. A | Page 14 of 16
Page 15
AD7394
V
POWER SHUTDOWN (SHDN)
Maximum power savings can be achieved by using the power
shutdown control function. This hardware activated feature is
SHDN
controlled by the active low input
pin. This pin has a
Schmitt trigger input, which helps to desensitize it to slowly
changing inputs. By placing a logic low on this pin, the internal
consumption of the device is reduced to nano amp levels, guaranteed to 1.5 μA maximum over the operating temperature
range. When the AD7394 has been programmed into the power
shutdown state, the present DAC register data is maintained
as long as V
command,
remains greater than 2.7 V. Once a wake-up
DD
SHDN
= 1, is given, the DAC voltage outputs return to
their previous values. It typically takes 80 microseconds for the
output voltage to fully stabilize. In the shutdown state the DAC
output amplifier exhibits an open circuit with a nominal output
resistance of 500 kΩ to ground. If the power shutdown feature is
SHDN
not needed, tie the
pin to the VDD voltage thereby
disabling this function.
UNIPOLAR OUTPUT OPERATION
This is the basic mode of operation for the AD7394. As shown
in Figure 23, the AD7394 has been designed to drive loads as
low as 5 kΩ in parallel with 100 pF. The code table for this
operation is shown in Table 7.
The circuit can be configured with an external reference plus
power supply, or powered from a single dedicated regulator or
reference depending on the application performance requirements.
+2.7V TO +5.5
R
0.01µF
EXT
REF
CONTROLLER
V
V
MICRO-
5
DIGITAL
Figure 23. AD7394 Unipolar Output Operation
DD
REF
DAC A
DAC B
DGNDAGND
DIGITAL INTERFACE
CIRCUITRY OM ITTE D
FOR CLARIT Y .
75kΩ
75kΩ
0.1µF
100pF
100pF
Table 7. Unipolar Code Table
Output
Hexadecimal Number
in DAC Register
Decimal Number
in DAC Register
Voltage (V)
= 2.5 V]
[V
REF
FFF 4095 2.4994
801 2049 1.2506
800 2048
7FF 2047
1.2500
1.2494
000 0 0
V
V
10µF
OUTA
OUTB
8528-026
Rev. A | Page 15 of 16
Page 16
AD7394
OUTLINE DIMENSIONS
8.75 (0.3445)
8.55 (0.3366)
BSC
8
7
6.20 (0.2441)
5.80 (0.2283)
1.75 (0.0689)
1.35 (0.0531)
SEATING
PLANE
8°
0°
0.25 (0.0098)
0.17 (0.0067)
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
45°
060606-A
4.00 (0.1575)
3.80 (0.1496)
0.25 (0.0098)
0.10 (0.0039)
COPLANARITY
0.10
14
1
1.27 (0.0500)
0.51 (0.0201)
0.31 (0.0122)
CONTROLLING DIME NSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLI M E TER EQUIVALENTS FOR
REFERENCE ONLYAND ARE NOT APP ROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AB
Figure 24. 14-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-14)
Dimensions shown in millimeters and (inches)
ORDERING GUIDE
1, 2
Model
AD7394ARZ 12 −40°C to +85°C 14-Lead Standard Small Outline Package [SOIC_N] R-14
AD7394ARZ-REEL7
1
The AD7394 contains 709 transistors. The die size measures 70 mil × 99 mil.
2
Z = RoHS Compliant Part.
Res (LSB) Temperature Range Package Description Package Option
12 −40°C to +85°C 14-Lead Standard Small Outline Package [SOIC_N] R-14