Datasheet AD7277, AD7278 Datasheet (ANALOG DEVICES)

3 MSPS, 12-/10-/8-Bit
V
V
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FEATURES

Throughput rate: 3 MSPS Specified for V Power consumption
12.6 mW at 3 MSPS with 3 V supplies
Wide input bandwidth
70 dB SNR at 1 MHz input frequency Flexible power/serial clock speed management No pipeline delays High speed serial interface
SPI®-/QSPI™-/MICROWIRE™-/DSP-compatible Temperature range: −40°C to +125°C Power-down mode: 0.1 μA typical 6-lead TSOT package 8-lead MSOP package AD7476 and AD7476A pin-compatible

GENERAL DESCRIPTION

The AD7276/AD7277/AD7278 are 12-/10-/8-bit, high speed, low power, successive approximation analog-to-digital converters (ADCs), respectively. The parts operate from a single
2.35 V to 3.6 V power supply and feature throughput rates of up to 3 MSPS. The parts contain a low noise, wide bandwidth track-and-hold amplifier that can handle input frequencies in excess of 55 MHz.
The conversion process and data acquisition are controlled
g
usin
with microprocessors or DSPs. The input signal is sampled on the falling edge of
point. There are no pipeline delays associated with the part.
The AD7276/AD7277/AD7278 use advanced design techniques
o achieve very low power dissipation at high throughput rates.
t
The reference for the part is taken internally from V allows the widest dynamic input range to the ADC; therefore, the analog input range for the part is 0 to V rate is determined by the SCLK.
and the serial clock, allowing the devices to interface
CS
of 2.35 V to 3.6 V
DD
, and the conversion is also initiated at this
CS
. The conversion
DD
DD
. This
ADCs in 6-Lead TSOT
AD7276/AD7277/AD7278

FUNCTIONAL BLOCK DIAGRAM

DD
12-/10-/8-BIT
IN
T/H
AD7276/ AD7277/ AD7278
Table 1.
Part Number Resolution Package
AD7276 12 8-Lead MSOP 6-Lead TSOT AD7277 10 8-Lead MSOP 6-Lead TSOT AD7278 8 8-Lead MSOP 6-Lead TSOT AD72741 12 8-Lead MSOP 8-Lead TSOT AD72731 10 8-Lead MSOP 8-Lead TSOT
1
Part contains external reference pin.

PRODUCT HIGHLIGHTS

1. 3 MSPS ADCs in a 6-lead TSOT package.
2. AD7476/AD74
AD7478A pin-compatible.
3. H
igh throughput with low power consumption.
4. Flexi
ble power/serial clock speed management. This allows maximum power efficiency at low throughput rates.
SUCCESSIVE
APPROXIMATION
ADC
SCLK
CONTROL
LOGIC
GND
Figure 1.
SDATA
CS
04903-001
77/AD7478 and AD7476A/AD7477A/
5. Refer
6. N
ence derived from the power supply.
o pipeline delay. The parts feature a standard successive approximation ADC with accurate control of the sampling instant via a
conversion control.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 © 2005 Analog Devices, Inc. All rights reserved.
input and once-off
CS
AD7276/AD7277/AD7278
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TABLE OF CONTENTS
Features.............................................................................................. 1
Theory of Operation ...................................................................... 16
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Product Highlights ........................................................................... 1
Specifications..................................................................................... 3
AD7276 Specifications................................................................. 3
AD7277 Specifications................................................................. 5
AD7278 Specifications................................................................. 7
Timing Specifications—AD7276/AD7277/AD7278 ...............8
Timing Examples........................................................................ 10
Absolute Maximum Ratings.......................................................... 11
ESD Caution................................................................................ 11
Pin Configurations and Function Descriptions ......................... 12
Typical Performance Characteristics ........................................... 13
Terminology .................................................................................... 15
Circuit Information.................................................................... 16
Converter Operation.................................................................. 16
ADC Transfer Function............................................................. 16
Typical Connection Diagram ................................................... 16
Modes of Operation................................................................... 18
Power vs. Throughput Rate....................................................... 21
Serial Interface ................................................................................ 22
AD7278 in a 10 SCLK Cycle Serial Interface.......................... 24
Microprocessor Interfacing....................................................... 24
Application Hints ........................................................................... 25
Grounding and Layout.............................................................. 25
Evaluating Performance.............................................................. 25
Outline Dimensions....................................................................... 26
Ordering Guide .......................................................................... 26
REVISION HISTORY
10/05—Rev. 0 to Rev. A
Updated Format..................................................................Universal
Changes to Table 2............................................................................ 3
Changes to Table 5............................................................................ 8
Changes to the Partial Power-Down Mode Section .................. 18
Changes to the Power vs. Throughput Rate Section.................. 21
Updated Outline Dimensions....................................................... 26
Changes to Ordering Guide.......................................................... 26
7/05—Revision 0: Initial Version
Rev. A | Page 2 of 28
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SPECIFICATIONS

AD7276 SPECIFICATIONS

VDD = 2.35 V to 3.6 V, B Grade: f otherwise noted.
Table 2.
Parameter B, Y Grade
DYNAMIC PERFORMANCE fIN = 1 MHz sine wave, B Grade f
Signal-to-Noise + Distortion (SINAD) Signal-to-Noise Ratio (SNR) 69 dB min 70 dB typ Total Harmonic Distortion (THD)4 −73 dB max
−78 dB typ Peak Harmonic or Spurious Noise (SFDR)4 −80 dB typ Intermodulation Distortion (IMD)4
Second-Order Terms −82 dB typ fa = 1 MHz, fb = 0.97 MHz
Third-Order Terms −82 dB typ fa = 1 MHz, fb = 0.97 MHz Aperture Delay 5 ns typ Aperture Jitter 18 ps typ Full Power Bandwidth 55 MHz typ @ 3 dB 8 MHz typ @ 0.1 dB
DC ACCURACY
Resolution 12 Bits Integral Nonlinearity Differential Nonlinearity Offset Error Gain Error
4
4
4
4
Total Unadjusted Error4 (TUE) ±3.5 LSB max
ANALOG INPUT
Input Voltage Ranges 0 to VDD V DC Leakage Current ±1 μA max −40°C to +85°C ±5.5 μA max 85°C to 125°C Input Capacitance 42 pF typ When in track 10 pF typ When in hold
LOGIC INPUTS
Input High Voltage, V
1.7 V min 2.35 V ≤ VDD ≤ 2.7 V
INH
2 V min 2.7 V < VDD ≤ 3.6 V Input Low Voltage, V
0.7 V max 2.35 V ≤ VDD ≤ 2.7 V
INL
0.8 V max 2.7 V < VDD ≤ 3.6 V Input Current, IIN ±1 μA max Typically 10 nA, VIN = 0 V or VDD Input Capacitance, C
5
IN
LOGIC OUTPUTS
Output High Voltage, VOH V Output Low Voltage, VOL 0.2 V max I Floating-State Leakage Current ±2.5 μA max Floating-State Output Capacitance Output Coding Straight (natural) binary
= 48 MHz, f
SCLK
4
5
= 3 MSPS, Y Grade:1 f
SAMPLE
2, 3
Unit Test Conditions/Comments
= 16 MHz, f
SCLK
= 1 MSPS, TA = T
SAMPLE
= 100 KHz sine wave, Y Grade
IN
68 dB min
±1 LSB max +1/−0.99 LSB max Guaranteed no missed codes to 12 bits ±3 LSB max ±3.5 LSB max
2 pF typ
– 0.2 V min I
DD
= 200 μA, VDD = 2.35 V to 3.6 V
SOURCE
= 200 μA
SINK
4.5 pF typ
MIN
to T
MAX
, unless
Rev. A | Page 3 of 28
AD7276/AD7277/AD7278
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Parameter B, Y Grade
2, 3
Unit Test Conditions/Comments
CONVERSION RATE
Conversion Time 291 ns max 14 SCLK cycles with SCLK at 48 MHz, B Grade 875 ns max 14 SCLK cycles with SCLK at 16 MHz, Y Grade Track-and-Hold Acquisition Time
4
60 ns min
Throughput Rate 3 MSPS max See the Serial Interface section
POWER REQUIREMENTS
VDD 2.35/3.6 V min/max IDD Digital I/Ps 0 V or VDD
Normal Mode (Static) 1 mA typ VDD = 3.6 V, SCLK on or off Normal Mode (Operational) 5.5 mA max VDD = 2.35 V to 3.6 V, f
2.5 mA max VDD = 2.35 V to 3.6 V, f
4.2 mA typ VDD = 3 V, f
1.6 mA typ VDD = 3 V, f
= 3 MSPS, B Grade
SAMPLE
= 1 MSPS, Y Grade
SAMPLE
= 3 MSPS, B Grade
SAMPLE
= 1 MSPS, Y Grade
SAMPLE
Partial Power-Down Mode (Static) 34 μA typ Full Power-Down Mode (Static) 2 μA max −40°C to +85°C, typically 0.1 μA 10 μA max 85°C to 125°C
Power Dissipation
Normal Mode (Operational) 19.8 mW max VDD = 3.6 V, f 9 mW max VDD = 3.6 V, f
12.6 mW typ VDD = 3 V, f
4.8 mW typ VDD = 3 V, f
6
SAMPLE
SAMPLE
= 3 MSPS, B Grade
SAMPLE
= 1 MSPS, Y Grade
SAMPLE
= 3 MSPS, B Grade = 1 MSPS, Y Grade
Partial Power-Down 102 μW typ VDD = 3 V Full Power-Down 7.2 μW max VDD = 3.6 V, −40°C to +85°C
1
Y Grade specifications are guaranteed by characterization.
2
Temperature range from −40°C to +125°C.
3
Typical specifications are tested with VDD = 3 V and at 25°C.
4
See the Terminology section.
5
Guaranteed by characterization.
6
See the Power vs. Throughput Rate section.
Rev. A | Page 4 of 28
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AD7277 SPECIFICATIONS

VDD = 2.35 V to 3.6 V, f
Table 3.
Parameter B Grade
DYNAMIC PERFORMANCE fIN = 1 MHz sine wave
Signal-to-Noise + Distortion (SINAD) Total Harmonic Distortion (THD)3 −71 dB max
−76 dB typ Peak Harmonic or Spurious Noise (SFDR)3 −80 dB typ Intermodulation Distortion (IMD)3
Second-Order Terms −82 dB typ fa = 1 MHz, fb = 0.97 MHz
Third-Order Terms −82 dB typ fa = 1 MHz, fb = 0.97 MHz Aperture Delay 5 ns typ Aperture Jitter 18 ps typ Full Power Bandwidth 74 MHz typ @ 3 dB 10 MHz typ @ 0.1 dB
DC ACCURACY
Resolution 10 Bits Integral Nonlinearity Differential Nonlinearity Offset Error Gain Error
3
3
Total Unadjusted Error (TUE)3 ±2.5 LSB max
ANALOG INPUT
Input Voltage Ranges 0 to VDD V DC Leakage Current ±1 μA max −40°C to +85°C ±5.5 μA max 85°C to 125°C Input Capacitance 42 pF typ When in track 10 pF typ When in hold
LOGIC INPUTS
Input High Voltage, V 2 V min 2.7 V < VDD ≤ 3.6 V Input Low Voltage, V
0.8 V max 2.7 V < VDD ≤ 3.6 V Input Current, IIN ±1 μA max Typically 10 nA, VIN = 0 V or VDD Input Capacitance, C
LOGIC OUTPUTS
Output High Voltage, VOH V Output Low Voltage, VOL 0.2 V max I Floating-State Leakage Current ±2.5 μA max Floating-State Output Capacitance Output Coding Straight (natural) binary
CONVERSION RATE
Conversion Time 250 ns max 12 SCLK cycles with SCLK at 48 MHz Track-and-Hold Acquisition Time Throughput Rate 3.45 MSPS max SCLK at 48 MHz
= 48 MHz, f
SCLK
3
3
= 3 MSPS, TA = T
SAMPLE
3
MIN
to T
1, 2
, unless otherwise noted.
MAX
Unit Test Conditions/Comments
60.5 dB min
±0.5 LSB max ±0.5 LSB max Guaranteed no missed codes to 10 bits ±1 LSB max ±1.5 LSB max
1.7 V min 2.35 V ≤ VDD ≤ 2.7 V
INH
0.7 V max 2.35 V ≤ VDD ≤ 2.7 V
INL
4
IN
4
3
2 pF typ
− 0.2 V min I
DD
= 200 μA, VDD = 2.35 V to 3.6 V
SOURCE
= 200 μA
SINK
4.5 pF typ
60 ns min
Rev. A | Page 5 of 28
AD7276/AD7277/AD7278
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Parameter B Grade
POWER REQUIREMENTS
VDD 2.35/3.6 V min/max IDD Digital I/Ps 0 V or VDD
Normal Mode (Static) 0.6 mA typ VDD = 3.6 V, SCLK on or off Normal Mode (Operational) 5.5 mA max VDD = 2.35 V to 3.6 V, f
3.5 mA typ VDD = 3 V Partial Power-Down Mode (Static) 34 μA typ Full Power-Down Mode (Static) 2 μA max −40°C to +85°C, typically 0.1 μA 10 μA max 85°C to 125°C
Power Dissipation
Normal Mode (Operational) 19.8 mW max VDD = 3.6 V, f
10.5 mW typ VDD = 3 V Partial Power-Down 102 μW typ VDD = 3 V Full Power-Down 7.2 μW max VDD = 3.6 V, −40°C to +85°C
1
Temperature range from −40°C to +125°C.
2
Typical specifications are tested with VDD = 3 V and at 25°C.
3
See the Terminology section.
4
Guaranteed by characterization.
5
See the Power vs. Throughput Rate section.
5
1, 2
Unit Test Conditions/Comments
SAMPLE
= 3 MSPS
SAMPLE
= 3 MSPS
Rev. A | Page 6 of 28
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AD7278 SPECIFICATIONS

VDD = 2.35 V to 3.6 V, f
Table 4.
Parameter B Grade
DYNAMIC PERFORMANCE fIN = 1 MHz sine wave
Signal-to-Noise + Distortion (SINAD) Total Harmonic Distortion (THD)3 −67 dB max
−73 dB typ Peak Harmonic or Spurious Noise (SFDR)3 −69 dB typ Intermodulation Distortion (IMD)3
Second-Order Terms −76 dB typ fa = 1 MHz, fb = 0.97 MHz
Third-Order Terms −76 dB typ fa = 1 MHz, fb = 0.97 MHz Aperture Delay 5 ns typ Aperture Jitter 18 ps typ Full Power Bandwidth 74 MHz typ @ 3 dB Full Power Bandwidth 10 MHz typ @ 0.1 dB
DC ACCURACY
Resolution 8 Bits Integral Nonlinearity Differential Nonlinearity Offset Error Gain Error
3
3
Total Unadjusted Error (TUE)3 ±1.5 LSB max
ANALOG INPUT
Input Voltage Ranges 0 to VDD V DC Leakage Current ±1 μA max −40°C to +85°C ±5.5 μA max 85°C to 125°C Input Capacitance 42 pF typ When in track 10 pF typ When in hold
LOGIC INPUTS
Input High Voltage, V 2 V min 2.7 V < VDD ≤ 3.6 V Input Low Voltage, V
0.8 V max 2.7 V < VDD ≤ 3.6 V Input Current, IIN ±1 μA max Input Capacitance, C
LOGIC OUTPUTS
Output High Voltage, VOH V Output Low Voltage, VOL 0.2 V max I Floating-State Leakage Current ±2.5 μA max Floating-State Output Capacitance Output Coding Straight (natural) binary
CONVERSION RATE
Conversion Time 208 ns max 10 SCLK cycles with SCLK at 48 MHz Track-and-Hold Acquisition Time Throughput Rate 4 MSPS max SCLK at 48 MHz
= 48 MHz, f
SCLK
3
3
= 3 MSPS, TA = T
SAMPLE
3
MIN
to T
1, 2
, unless otherwise noted.
MAX
Unit Test Conditions/Comments
49 dB min
±0.2 LSB max ±0.3 LSB max Guaranteed no missed codes to 8 bits ±0.5 LSB max ±1 LSB max
1.7 V min 2.35 V ≤ VDD ≤ 2.7 V
INH
0.7 V max 2.35 V ≤ VDD ≤ 2.7 V
INL
4
IN
4
3
2 pF typ
– 0.2 V min I
DD
= 200 μA, VDD = 2.35 V to 3.6 V
SOURCE
= 200 μA
SINK
4.5 pF typ
60 ns min
Rev. A | Page 7 of 28
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Parameter B Grade
1, 2
Unit Test Conditions/Comments
POWER REQUIREMENTS
VDD 2.35/3.6 V min/max IDD Digital I/Ps = 0 V or VDD
Normal Mode (Static) 0.5 mA typ VDD = 3.6 V, SCLK on or off Normal Mode (Operational) 5.5 mA max VDD = 2.35 V to 3.6 V, f
SAMPLE
= 3 MSPS
3.5 mA typ VDD = 3 V Partial Power-Down Mode (Static) 34 μA typ Full Power-Down Mode (Static) 2 μA max −40°C to +85°C, typically 0.1 μA 10 μA max +85°C to +125°C Power Dissipation
Normal Mode (Operational) 19.8 mW max VDD = 3.6 V, f
5
SAMPLE
= 3 MSPS
10.5 mW typ VDD = 3 V Partial Power-Down 102 μW typ VDD = 3 V Full Power-Down 7.2 μW max VDD = 3.6 V, −40°C to +85°C
1
Temperature range from −40°C to +125°C.
2
Typical specifications are tested with VDD = 3 V and at 25°C.
3
See the Terminology section.
4
Guaranteed by characterization.
5
See the Power vs. Throughput Rate section.

TIMING SPECIFICATIONS—AD7276/AD7277/AD7278

VDD = 2.35 V to 3.6 V, TA = T
MIN
to T
, unless otherwise noted.
MAX
Table 5.
Parameter2Limit at T
3
f
SCLK
500 kHz min
MIN
, T
Unit Description
MAX
48 MHz max B grade 16 MHz max Y grade t
14 × t
CONVER T
12 × t 10 × t t
4 ns min
QUIET
AD7276
SCLK
AD7277
SCLK
AD7278
SCLK
t1 3 ns min t2 6 ns min
5
t
3
5
t
4
t5 0.4 t t6 0.4 t
5
t
7
4 ns max 15 ns max Data access time after SCLK falling edge
ns min SCLK low pulse width
SCLK
ns min SCLK high pulse width
SCLK
5 ns min SCLK to data valid hold time t8 14 ns max SCLK falling edge to SDATA three-state 5 ns min SCLK falling edge to SDATA three-state t
9
T
POWER-UP
1
Sample tested during initial release to ensure compliance. All timing specifications given are with a 10 pF load capacitance. With a load capacitance greater than this
value, a digital buffer or latch must be used.
2
Guaranteed by characterization. All input signals are specified with tr = tf = 2 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V.
3
Mark/space ratio for the SCLK input is 40/60 to 60/40.
4
Minimum f
5
The time required for the output to cross the VIH or VIL voltage.
6
See the Power-Up Times section.
4.2 ns max
6
1 μs max Power-up time from full power-down
at which specifications are guaranteed.
SCLK
1
4
Minimum quiet time required between the bus relinquish and the
t of the next conversion
star Minimum CS
to SCLK setup time
CS Delay from CS
rising edge to SDATA three-state
CS
pulse width
until SDATA three-state disabled
Rev. A | Page 8 of 28
AD7276/AD7277/AD7278
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t
SCLK
SDATA
SCLK
SDATA
4
Figure 2. Access Time After SCLK Falling Edge
t
7
V
IH
V
IL
Figure 3. Hold Time After SCLK Falling Edge
SCLK
V
IH
V
IL
04903-002
SDATA
Figure 4. SCLK Falling Edge SDATA Three-State
04903-003
t
8
1.4V
04903-004
Rev. A | Page 9 of 28
AD7276/AD7277/AD7278
S
K
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TIMING EXAMPLES

For the AD7276, if CS is brought high during the 14th SCLK rising
edge after the two leading zeros and 12 bits of the conversion have been provided, the part can achieve the fastest throughput rate, 3 MSPS. If
edge after the two leading zeros and 12 bits of the conversion and two trailing zeros have been provided, a throughput rate of
2.97 MSPS is achievable. This is illustrated in the following two timing examples.
Timing Example 1
In Figure 6, using a 14 SCLK cycle, f throughput is 3 MSPS. This produces a cycle time of t
12.5(1/f t
= 67 ns.
ACQ
SCLK
is brought high during the 16th SCLK rising
CS
= 48 MHz and the
SCLK
) + t
= 333 ns, where t2 = 6 ns minimum and
ACQ
CS
t
CONVERT
234
DB11 DB10 DB9 DB1 DB0
SCLK
DATA
SDATA
CS
SCL
STATE
CS
SCLK
THREE-
STATE 2 LE ADING
t
2
1 2 345 13141516
t
3
ZEROZ DB11 DB10 DB9 DB1 DB0 ZERO ZERO
2 LEADING
ZEROS
t
2
1513
t
3
ZZERO
ZEROS
t
2
12345 1312 14 15 16
+
2
t
6
t
4
Figure 5. AD7276 Serial Interface Timing Diagram
t
CONVERT
t
t
4
Figure 6. AD7276 Serial Interface Timing 14 SCLK Cycle
t
CONVERT
SCLK
)
12.5(1/f
Figure 7. AD7276 Serial Interface Timing 16 SCLK Cycle
t
7
1/THROUGHPUT
6
t
7
1/THROUGHPUT
This satisfies the requirement of 60 ns for t shows that t t
= 14 ns max. This allows a value of 43 ns for t
8
comprises 0.5(1/f
ACQ
SCLK
) + t8 + t
the minimum requirement of 4 ns.
Timing Example 2
The example in Figure 7 uses a 16 SCLK cycle, f and the throughput is 2.97 MSPS. This produces a cycle time of t
+ 12.5(1/f
2
t
= 70 ns. Figure 7 shows that t
ACQ
t
, where t8 = 14 ns max. This satisfies the minimum
QUIET
requirement of 4 ns for t
B
t
5
t
1/THROUGHPUT
B
SCLK
2 TRAILI NG
ZEROS
B
5
t
t
8
) + t
= 336 ns, where t2 = 6 ns minimum and
ACQ
comprises 2.5(1/f
ACQ
QUIET.
t
1
8
14
t
9
t
ACQUISITION
t
QUIET
THREE-STATETHREE-
t
1
t
QUIET
THREE-STATE
t
QUIET
t
1
. Figure 6 also
ACQ
, where
QUIET
, satisfying
QUIET
= 48 MHz,
SCLK
04903-005
04903-034
04903-006
SCLK
) + t8 +
Rev. A | Page 10 of 28
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ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.
Table 6.
Parameters Ratings
VDD to GND −0.3 V to +6 V Analog Input Voltage to GND −0.3 V to VDD + 0.3 V Digital Input Voltage to GND −0.3 V to +6 V Digital Output Voltage to GND −0.3 V to VDD + 0.3 V Input Current to Any Pin Except Supplies1±10 mA Operating Temperature Range
Commercial (B grade) −40°C to +125°C
Storage Temperature Range −65°C to +150°C Junction Temperature 150°C 6-Lead TSOT Package
θJA Thermal Impedance 230°C/W
θJC Thermal Impedance 92°C/W 8-Lead MSOP Package
θJA Thermal Impedance 205.9°C/W
θJC Thermal Impedance 43.74°C/W Lead Temperature Soldering
Reflow (10 sec to 30 sec) 255°C Lead Temperature Soldering
Reflow (10 sec to 30 sec) 260°C ESD 1.5 kV
1
Transient currents of up to 100 mA cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings ma rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
y cause permanent damage to the device. This is a stress

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. A | Page 11 of 28
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PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

V
GND
V
DD
IN
1
AD7276/ AD7277/
2
AD7278
TOP VIEW
(Not to Scale)
3
6
5
4
CS
SDATA
SCLK
04903-007
Figure 8. 6-Lead TSOT Pin Configuration
1
V
DD
AD7276/
2
SDATA
AD7277/
AD7278
CS
3
TOP VIEW
NC
4
(Not to Scale)
NC = NO CO NNECT
Figure 9. 8-Lead MSOP Pin Configuration
8
7
6
5
V
IN
GND
SCLK
NC
Table 7. Pin Function Descriptions
6-Lead TSOT Pin No.
8-Lead MSOP Pin No.
Mnemonic
Description
1 1 VDD Power Supply Input. The VDD range for the AD7276/AD7277/AD7278 is 2.35 V to 3.6 V. 2 7 GND
Analog Ground. Ground reference point for all circuitry on the AD7276/AD7277/AD7278. All analog input signal
s should be referred to this GND voltage. 3 8 VIN Analog Input. Single-ended analog input channel. The input range is 0 V to VDD. 4 6 SCLK
Serial Clock. Logic input. SCLK provides the serial clock f
or accessing data from the part. This clock
input is also used as the clock source for the conversion process of the AD7276/AD7277/AD7278.
5 2 SDATA
Data Out. Logic output. The conversion result fr
om the AD7276/AD7277/AD7278 is provided on this output as a serial data stream. The bits are clocked out on the falling edge of the SCLK input. The data stream from the AD7276 consists of two leading zeros followed by 12 bits of conversion data and two trailing zeros, provided MSB first. The data stream from the AD7277 consists of two leading zeros followed by 10 bits of conversion data and four trailing zeros, provided MSB first. The data stream from the AD7278 consists of two leading zeros followed by 8 bits of conversion data and six trailing zeros, provided MSB first.
6 3
CS
Chip Select. Active low logic input. This input provides the dual function of initiating conversion on the AD7276/AD7277/AD7278 and framing the serial data transfer.
4, 5 NC No Connect.
04903-008
Rev. A | Page 12 of 28
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TYPICAL PERFORMANCE CHARACTERISTICS

TA = 25°C.
16,384 POI NT FF T F
–20
–40
–60
SNR (dB)
–80
–100
–120
0 100 200 300 400 500 600 700 800 900 1000 11001200 1300 1400
FREQUENCY (kHz)
=3MSPS
SAMPLE
F
=1MHz
IN
SINAD = 71. 2dB THD = –80. 9dB SFDR = –82.4dB V
=3V
DD
04903-009
1500
Figure 10. AD7276 Dynamic Performance at 3 MSPS, Input Tone = 1 MHz
73.0
72.5
72.0
71.5 VDD=3V
71.0
SNR (dB)
70.5
70.0
69.5
69.0
100
INPUT FREQUENCY (kHz)
VDD=3.6V
VDD= 2.35V
Figure 13. AD7276 SNR vs. Analog Input Frequency at 3 MSPS
arious Supply Voltages, SCLK Frequency = 48 MHz
for V
04903-013
15001000
10
–20
–30
–40
–50
–60
SNR (dB)
–70
–80
–90
–100
–110
0 100 200 300 400 500 600 700 800 900 1000 11001200 1300 1400
FREQUENCY (kHz)
16,384 POINT F FT F
= 3MSPS
SAMPLE
F
=1MHz
IN
SINAD = 61.6dB THD = –80 .2dB SFDR = –83.4dB V
=3V
DD
04903-010
1500
Figure 11. AD7277 Dynamic Performance at 3 MSPS, Input Tone = 1 MHz
72.5
72.0
71.5
71.0
70.5
70.0
SINAD (dB)
69.5
69.0
68.5
68.0
67.5 100
VDD= 2.35V
INPUT FREQUENCY (kHz)
VDD=3.6V
VDD=3V
04903-012
15001000
Figure 12. AD7276 SINAD vs. Analog Input Frequency at 3 MSPS
for V
arious Supply Voltages, SCLK Frequency = 48 MHz
30,000
25,000
20,000
15,000
10,000
NUMBER OF OCCURRENCES
5,000
0
2046
30,000
CODES
CODE
Figure 14. Histogram of Codes for 30,000 Samples
72
–74
–76
–78
–80
–82
THD (dB)
–84
–86
–88
–90
100
INPUT FRE QUENCY (kHz)
VDD= 2.35V
VDD=3V
Figure 15. THD vs. Analog Input Frequency at 3 MSPS
arious Supply Voltages, SCLK Frequency = 48 MHz
for V
2050204920482047
04903-016
VDD=3.6V
04903-017
15001000
Rev. A | Page 13 of 28
AD7276/AD7277/AD7278
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50
–55
–60
–65
–70
THD (dB)
–75
–80
–85
–90
100
RIN= 100
RIN=10
RIN=0
04903-015
15001000
INPUT FRE QUENCY (kHz)
Figure 16. THD vs. Analog Input Frequency at 3 MSPS for Various Source
Impedances, SCLK Frequency = 48 MHz, Supply Voltage = 3 V
1.0
0.8
0.6
0.4
0.2
0
–0.2
DNL ERROR (LSB)
–0.4
–0.6
–0.8
–1.0
0
CODE
VDD=3V
04903-014
4000350030002500200015001000500
Figure 18. AD7276 DNL Performance
INL ERROR (LSB)
–0.2
–0.4
–0.6
–0.8
–1.0
1.0
0.8
0.6
0.4
0.2
0
0
CODE
VDD=3V
04903-011
4000350030002500200015001000500
Figure 17. AD7276 INL Performance
Rev. A | Page 14 of 28
AD7276/AD7277/AD7278
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TERMINOLOGY

Integral Nonlinearity
The maximum deviation from a straight line passing through the endpoints of the ADC transfer function. For the AD7276/ AD7277/AD7278, the endpoints of the transfer function are zero scale at 0.5 LSB below the first code transition, and full scale at 0.5 LSB above the last code transition.
Differential Nonlinearity
ference between the measured and the ideal 1 LSB
The dif change between any two adjacent codes in the ADC.
Offset Error
The devia (00 . . . 001) from the ideal, that is, AGND + 0.5 LSB.
Gain Error
The devia (111 . . . 111) from the ideal after adjusting for the offset error, that is, V
Tot a l U n ad ju s te d E rr o r
A co offset errors.
Track-and-Hold Acquisition Time
The t track-and-hold amplifier to reach its final value within ±0.5 LSB. See the Serial Interface section for more details.
Signal-to-Noise + Distortion Ratio (SINAD)
The me of the ADC. The signal is the rms amplitude of the fundamental, and noise is the rms sum of all nonfundamental signals up to half the sampling frequency (fs/2), including harmonics but excluding dc. The ratio is dependent on the number of quantization levels in the digitization process: the more levels, the smaller the quanti­zation noise. For an ideal N-bit converter, the SINAD is defined as
According to this equation, the SINAD is 74 dB for a 12-bit co error sources in the ADC, including integral and differential nonlinearities and internal ac noise sources, cause the measured SINAD to be less than its theoretical value.
tion of the first code transition (00 . . . 000) to
tion of the last code transition (111 . . . 110) to
− 1.5 LSB.
REF
mprehensive specification that includes gain, linearity, and
ime required after the conversion for the output of the
asured ratio of signal to noise plus distortion at the output
dB76.102.6 += NSINAD
nverter and 62 dB for a 10-bit converter. However, various
Total Harmonic Distortion (THD)
The ratio of the rms sum of harmonics to the fundamental. It is defined as:
2
2
2
2
2
()
THD
where:
V
is the rms amplitude of the fundamental.
1
V
, V3, V4, V5, and V6 are the rms amplitudes of the second
2
through sixth harmonics.
Peak Harmonic or Spurious Noise
The ratio of the rms value of the next largest component in the ADC output spectrum (up to f of the fundamental. Normally, the value of this specification is determined by the largest harmonic in the spectrum; however, for ADCs with harmonics buried in the noise floor, it is determined by a noise peak.
Intermodulation Distortion
With inputs consisting of sine waves at two frequencies, fa and fb, any active device with nonlinearities creates distortion products at sum and difference frequencies of mfa ± nfb, where m and n = 0, 1, 2, 3, …. Intermodulation distortion terms are those for which neither m nor n are equal to zero. For example, the second-order terms include (fa + fb) and (fa − fb), and the third-order terms include (2fa + fb), (2fa − fb), (fa + 2fb), and (fa − 2fb).
The AD7276/AD7277/AD7278 are tested using the CCIF
tandard in which two input frequencies are used (see fa and fb
s in the specifications). In this case, the second-order terms are usually distanced in frequency from the original sine waves, and the third-order terms are usually at a frequency close to the input frequencies. As a result, the second- and third-order terms are specified separately. The calculation of the intermodulation distortion is as per the THD specification, where it is the ratio of the rms sum of the individual distortion products to the rms amplitude of the sum of the fundamentals expressed in decibels.
Aperture Delay
The measured interval between the leading edge of the sampling clock and the point at which the ADC takes the sample.
Aperture Jitter
The sample-to-sample variation when the sample is taken.
=
2
log20dB
/2, excluding dc) to the rms value
S
4
3
V
1
VVVVV
++++
5
6
Rev. A | Page 15 of 28
AD7276/AD7277/AD7278
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THEORY OF OPERATION

CIRCUIT INFORMATION

The AD7276/AD7277/AD7278 are fast, micropower, 12-/10-/ 8-bit, single-supply ADCs, respectively. The parts can be operated from a 2.35 V to 3.6 V supply. When operated from a supply voltage within this range, the AD7276/AD7277/AD7278 are capable of throughput rates of 3 MSPS when provided with a 48 MHz clock.
The AD7276/AD7277/AD7278 provide the user with an on­chi
p track-and-hold ADC and a serial interface housed in a tiny 6-lead TSOT or an 8-lead MSOP package, which offers the user considerable space-saving advantages over alternative solutions. The serial clock input accesses data from the part and provides the clock source for the successive approximation ADC. The analog input range is 0 V to V required for the ADC, and there is no reference on-chip. The reference for the AD7276/AD7277/AD7278 is derived from the power supply, resulting in the widest dynamic input range.
. An external reference is not
DD
SAMPLING
CAPACITOR
A
V
IN
SW1
ACQUISITION
B
PHASE
V
AGND
Figure 20. ADC Conversion Phase
SW2
/2
DD
COMPARATOR

ADC TRANSFER FUNCTION

The output coding of the AD7276/AD7277/AD7278 is straight binary. The designed code transitions occur midway between successive integer LSB values, such as 0.5 LSB and 1.5 LSB. The LSB size is V and V
DD
for the AD7276/AD7277/AD7278 is shown in
/4,096 for the AD7276, VDD/1,024 for the AD7277,
DD
/256 for the AD7278. The ideal transfer characteristic
CHARGE
REDISTRIBUT ION
DAC
CONTROL
LOGIC
Figure 21.
04903-020
The AD7276/AD7277/AD7278 also feature a power-down
ion to save power between conversions. The power-down
opt feature is implemented across the standard serial interface as described in the
Modes of Operation section.

CONVERTER OPERATION

The AD7276/AD7277/AD7278 are successive approximation ADCs that are based on a charge redistribution DAC. Figure 19 and Figure 20 show simplified schematics of the ADC. Figure 19
ws the ADC during its acquisition phase, where SW2 is closed,
sho SW1 is in Position A, the comparator is held in a balanced con­dition, and the sampling capacitor acquires the signal on V
CHARGE
REDISTRIBUT ION
DAC
SAMPLING
CAPACITOR
A
V
IN
SW1
ACQUISITION
B
PHASE
V
AGND
Figure 19. ADC Acquisition Phase
SW2
/2
DD
COMPARATOR
CONTROL
LOGIC
When the ADC starts a conversion, SW2 opens and SW1 moves to Position B, causing the comparator to become unbalanced (see Figure 20). The control logic and the charge redistribution
ACs are used to add and subtract fixed amounts of charge
D from the sampling capacitor to bring the comparator back into a balanced condition. When the comparator is rebalanced, the conversion is complete. The control logic generates the ADC output code.
.
IN
04903-019
111.. .111
111. ..110
111...000
011...111
ADC CODE
000...010
000...001
000...000
0V
Figure 21. AD7276/AD7277/AD7278 Transfer Characteristics
1LSB = V 1LSB = V 1LSB = V
ANALOG INPUT
/4096 (AD7278)
REF
/1024 (AD7277)
REF
/256 (AD7276)
REF
+V
DD
–1.5LSB0.5LSB
04903-021

TYPICAL CONNECTION DIAGRAM

Figure 22 shows a typical connection diagram for the AD7276/ AD7277/AD7278. V
should be decoupled. This provides an analog input range
V
DD
of 0 V to V
. The conversion result is output in a 16-bit word
DD
with two leading zeros followed by the 12-bit, 10-bit, or 8-bit result. The 12-bit result from the AD7276 is followed by two trailing zeros; the 10-bit and 8-bit results from the AD7277 and AD7278 are followed by four and six trailing zeros, respectively.
Alternatively, because the supply current required by the AD7276/ AD7277/AD7
278 is so low, a precision reference can be used as the supply source for the AD7276/AD7277/AD7278. A REF19x voltage reference (REF193 for 3 V) can be used to supply the required voltage to the ADC (see Figure 22). This configuration is especially
eful if the power supply is noisy or the system’s supply voltage is a
us value other than 3 V (for example, 5 V or 15 V). The REF19x outputs a steady voltage to the AD7276/AD7277/AD7278. If the low dropout REF193 is used, it must supply a current of typically 1 mA to the AD7276/AD7277/AD7278. When the ADC is converting at a rate of 3 MSPS, the REF193 must supply a maxi­mum of 5 mA to the AD7276/AD7277/AD7278.
is taken internally from VDD; therefore,
REF
Rev. A | Page 16 of 28
AD7276/AD7277/AD7278
0
V
V
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The load regulation of the REF193 is typically 10 ppm/mA (REF193, V for the 5 mA drawn from it. When V
= 5 V), which results in an error of 50 ppm (150 µV)
S
= 3 V from the REF193, it
DD
corresponds to an error of 0.204 LSB, 0.051 LSB, and 0.0128 LSB for the AD7276, AD7277, and AD7278, respectively. For applica­tions where power consumption is of concern, use the power-down mode of the ADC and the sleep mode of the REF19x reference to improve power performance. See the
3
TANT
AD7276/ AD7277/
AD7278
1µF
0.1µF
680nF
V
DD
VTOV
INPUT
Figure 22. REF193 as Power Supply to AD7276/AD7277/AD7278
V
DD
IN
GND
Modes of Operation section.
REF193
0.1µF10µF
SCLK
SDATA
CS
SERIAL
INTERFACE
DSP/
µC/µP
5V SUPPLY
04903-022
Tabl e 8 provides typical performance data with various references used as a V
source with the same setup conditions.
DD
Table 8. AD7276 Performance (Various Voltage References IC)
Reference Tied to VDD SNR Performance, 1 MHz Input
AD780 @ 3 V 71.3 dB AD780 @ 2.5 V 70.1 dB REF193 70.9 dB
Analog Input
Figure 23 shows an equivalent circuit of the analog input structure of the AD7276/AD7277/AD7278. The two diodes, D1 and D2, provide ESD protection for the analog inputs. Care must be taken to ensure that the analog input signal never exceeds the supply rails by more than 300 mV. Signals exceeding this value cause these diodes to become forward biased and to start conducting current into the substrate. These diodes can conduct a maximum current of 10 mA without causing irreversible damage to the part. Capacitor C1 in p
rimarily be attributed to pin capacitance. Resistor R1 is a
Figure 23 is typically about 4 pF and can
lumped component made up of the on resistance of a switch. This resistor is typically about 75 Ω. Capacitor C2 is the ADC sampling capacitor and has a capacitance of 4 pF typically when in hold mode and 32 pF typically when in track mode. For ac applications, removing high frequency components from the analog input signal is recommended by using a band-pass filter on the relevant analog input pin. In applications where the harmonic distortion and signal-to-noise ratio are critical, the analog input should be driven from a low impedance source.
Large source impedances significantly affect the ac performance
f these ADCs and can necessitate the use of an input buffer
o amplifier. The AD8021 op amp is compatible with these devices; however, the choice of the op amp is a function of the particular application.
DD
D1
V
IN
C1
4pF
Figure 23. Equivalent Analog Input Circuit
D2
CONVERSION PHASE—SWITCH OPEN TRACK PHASE—SW ITCH CLOSED
R1
C2
04903-023
When no amplifier is used to drive the analog input, the source impedance should be limited to a low value. The maximum source impedance depends on the amount of THD that can be tolerated. The THD increases as the source impedance increases and per­formance degrades. Figure 16 shows a graph of the THD vs. the
nalog input frequency for different source impedances when
a using a supply voltage of 3 V and sampling at a rate of 3 MSPS.
Digital Inputs
The digital inputs applied to the AD7276/AD7277/AD7278 are not limited by the maximum ratings that limit the analog inputs. Instead, the digital inputs applied to the AD7276/AD7277/ AD7278 can be 6 V and are not restricted by the V
+ 0.3 V
DD
limit of the analog inputs. For example, if the AD7276/AD7277/ AD7278 are operated with a V
of 3 V, then 5 V logic levels can
DD
be used on the digital inputs. However, it is important to note that the data output on SDATA still has 3 V logic levels when
= 3 V. Another advantage of SCLK and CS not being
V
DD
restricted by the V
+ 0.3 V limit is that power supply sequencing
DD
issues are avoided. For example, unlike with the analog inputs, with the digital inputs, if
or SCLK is applied before VDD,
CS
there is no risk of latch-up.
Rev. A | Page 17 of 28
AD7276/AD7277/AD7278
A
/
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MODES OF OPERATION

The mode of operation of the AD7276/AD7277/AD7278 is selected by controlling the logic state of the
conversion. There are three possible modes of operation: normal mode, partial power-down mode, and full power-down mode. The point at which
is pulled high after the conversion has
CS
been initiated determines which power-down mode, if any, the device enters. Similarly, if the device is already in power-down mode,
can control whether the device returns to normal
CS
operation or remains in power-down mode. These modes of operation are designed to provide flexible power management options, which can be chosen to optimize the power dissipation/ throughput rate ratio for different application requirements.
Normal Mode
This mode is intended for fastest throughput rate performance because the device remains fully powered at all times, eliminating worry about power-up times. Figure 24 shows the general diagram
f AD7276/AD7277/AD7278 operation in this mode.
o
signal during a
CS
can idle high until the next conversion or low until CS returns
CS
high before the next conversion (effectively idling
CS
low).
Once a data transfer is complete (SDATA has returned to three­s
tate), another conversion can be initiated after the quiet time,
, has elapsed by bringing CS low again.
t
QUIET
Partial Power-Down Mode
This mode is intended for use in applications where slower throughput rates are required. An example of this is when either the ADC is powered down between each conversion or a series of conversions is performed at a high throughput rate and then the ADC is powered down for a relatively long duration between these bursts of several conversions. When the AD7276/AD7277/ AD7278 are in partial power-down mode, all analog circuitry is powered down except the bias-generation circuit.
To enter partial power-down mode, interrupt the conversion
cess by bringing
pro
high between the second and 10th falling
CS
edges of SCLK, as shown in Figure 25.
The conversion is initiated on the falling edge of
as described
CS
in the Serial Interface section. To ensure that the part remains full
y powered up at all times, 10 SCLK falling edges elapse after the falling edge of brought high after the 10
must remain low until at least
CS
. If CS is
th
SCLK falling edge but before the 16th
CS
SCLK falling edge, the part remains powered up, but the con­version is terminated and SDATA goes back into three-state.
For the AD7276, a minimum of 14 serial clock cycles are required to
complete the conversion and access the complete conversion result. For the AD7277 and AD7278, a minimum of 12 and 10 serial clock cycles are required to complete the conversion and to access the complete conversion result, respectively.
CS
110121416
SCLK
SDATA VAL ID DATA
Figure 24. Normal Mode Operation
Once
is brought high in this window of SCLKs, the part
CS
enters partial power-down mode, the conversion that was initiated by the falling edge of
goes back into three-state. If
is terminated, and SDATA
CS
is brought high before the
CS
second SCLK falling edge, the part remains in normal mode and does not power down. This prevents accidental power-down due to glitches on the
CS
line.
D7276
AD7677/AD7278
04903-024
CS
12 10 16
SCLK
SDATA
Figure 25. Entering Partial Power-Down Mode
Rev. A | Page 18 of 28
THREE-STATE
04903-025
AD7276/AD7277/AD7278
www.BDTIC.com/ADI
To exit this mode of operation and power up the AD7276/ AD7277/AD7278, users should perform a dummy conversion. On the falling edge of continues to power up as long as falling edge of the 10 once 16 SCLKs elapse; valid data results from the next conversion, as shown in edge of SCLK, the AD7276/AD7277/AD7278 go into full power­down mode. Therefore, although the device can begin to power up on the falling edge of
CS
of
If the AD7276/AD7277/AD7278 are already in partial power­do
wn mode and
of SCLK, the device enters full power-down mode. For more information on the power-up times associated with partial power-down mode in various configurations, see the Power-Up
mes
Ti
Figure 26. If
as long as this occurs before the 10th SCLK falling edge.
CS
section.
, the device begins to power up and
CS
is held low until after the
th
SCLK. The device is fully powered up
CS
CS
is brought high before the 10th falling edge
CS
is brought high before the 10th falling
, it powers down on the rising edge
Full Power-Down Mode
This mode is intended for use in applications where throughput rates slower than those in the partial power-down mode are required, because power-up from a full power-down takes substantially longer than that from a partial power-down. This mode is suited to applications where a series of conversions performed at a relatively high throughput rate are followed by a long period of inactivity and thus power down.
When the AD7276/AD7277/AD7278 are in full power-down
de, all analog circuitry is powered down. To enter full power-
mo down mode, put the device into partial power-down mode by bringing
SCLK. In the next conversion cycle, interrupt the conversion process in the same way as shown in Figure 27 by bringing
high before the 10
in this window of SCLKs, the part powers down completely. Note that it is not necessary to complete the 16 SCLKs once
brought high to enter either of the power-down modes. Glitch protection is not available when entering full power-down mode.
To exit full power-down mode and power up AD7276/ AD7277/AD72 similar to when powering up from partial power-down mode. On the falling edge of
continues to power up as long as falling edge of the 10
elapse before a conversion can be initiated, as shown in Figure
28. See the Power-Up Times section for the power-up times sociated with the AD7276/AD7277/AD7278.
as
high between the second and 10th falling edges of
CS
th
SCLK falling edge. Once CS is brought high
78, users should perform a dummy conversion,
, the device begins to power up and
CS
is held low until after the
th
SCLK. The required power-up time must
CS
CS
CS
is
Power-Up Times
The AD7276/AD7277/AD7278 have two power-down modes, partial power-down and full power-down, which are described in detail in the Modes of Operation section. This section deals
th the power-up time required when coming out of either of
wi these modes.
To power up from partial power-down mode, one cycle is re
quired. Therefore, with an SCLK frequency of up to 48 MHz, one dummy cycle is sufficient to allow the device to power up from partial power-down mode. Once the dummy cycle is complete, the ADC is fully powered up and the input signal is acquired properly. The quiet time, t from the point where the bus goes back into three-state after the dummy conversion to the next falling edge of
To power up from full power-down, approximately 1 s should b
e allowed from the falling edge of
.
t
POWER UP
Note that during power-up from partial power-down mode, the t
rack-and-hold, which is in hold mode while the part is powered down, returns to track mode after the first SCLK edge that the part receives after the falling edge of in Figure 26.
When power supplies are first applied to the AD7276/AD7277/ AD7278, t modes or in normal mode. Because of this, it is best to allow a dummy cycle to elapse to ensure that the part is fully powered up before attempting a valid conversion. Likewise, if the part is to be kept in partial power-down mode immediately after the supplies are applied, then two dummy cycles must be initiated. The first dummy cycle must hold SCLK falling edge; in the second cycle, between the second and 10
Alternatively, if the part is to be placed into full power-down m
ode when the supplies are applied, three dummy cycles must
be initiated. The first dummy cycle must hold
the 10 place the part into full power-down mode (see Figure 27). See
e
th
he ADC can power up in either of the power-down
th
SCLK falling edges (see Figure 25).
th
SCLK falling edge; the second and third dummy cycles
Modes of Operation section.
, must still be allowed
QUIET
.
CS
, shown in Figure 28 as
CS
. This is shown as Point A
CS
low until after the 10th
CS
must be brought high
CS
low until after
CS
Rev. A | Page 19 of 28
AD7276/AD7277/AD7278
AR
S
S
S
www.BDTIC.com/ADI
TISFULLY
THE PART BEGINS
TO PO WER UP
CS
THE P POWERED UP, SEE T HE POWE R­UP TIMES SECTION
SCLK
DATA
CS
SCLK
DATA
CS
SCLK
1
10 16 1 16
A
INVALID DATA VALID DATA
04903-026
Figure 26. Exiting Partial Power-Down Mode
THE PARTENTERS
PARTIAL POWER-DOWN
12 10 16 1 1610
INVALID DATA VALID DATA
THREE-STATE THREE-STATE
THE PARTBEGINS
TO PO WER UP
THE PARTENTERS
FULL POWER-DOWN
04903-027
Figure 27. Entering Full Power-Down Mode
THE PART BEGINS
TO PO WER UP
110161 1
t
POWER UP
THE PARTIS
FULLY POWERED UP
6
DATA
INVALID DATA VALID DATA
04903-028
Figure 28. Exiting Full Power-Down Mode
Rev. A | Page 20 of 28
AD7276/AD7277/AD7278
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POWER VS. THROUGHPUT RATE

Figure 29 shows the power consumption of the device in normal mode, in which the part is never powered down. By using the power-down mode of the AD7276/AD7277/AD7278 when not performing a conversion, the average power consump­tion of the ADC decreases as the throughput rate decreases. Figure 30 shows that as the throughput rate is reduced, the
vice remains in its power-down state longer and the average
de power consumption over time drops accordingly. For example, if the AD7276/AD7277/AD7278 are operated in continuous sampling mode with a throughput rate of 200 kSPS and an SCLK of 48 MHz (V down mode between conversions, then the power consumption is calculated as follows. The power dissipation during normal operation is 12.6 mW (V dummy cycle, that is, 333 ns, and the remaining conversion time is 290 ns, then the AD7276/AD7277/AD7278 can be said to dissipate 12.6 mW for 623 ns during each conversion cycle. If the throughput rate is 200 kSPS, then the cycle time is 5 µs and the average power dissipated during each cycle is 623/5,000 ×
12.6 mW = 1.56 mW. ra
te when using the partial power-down mode between conver­sions at 3 V. The power-down mode is intended for use with throughput rates of less than 600 kSPS, because at higher sampling rates, there is no power saving achieved by using the power-down mode.
= 3 V) and the devices are placed into power-
DD
= 3 V). If the power-up time is one
DD
Figure 29 shows the power vs. throughput
7.4
7.2
7.0
6.8
6.6
6.4
6.2
6.0
5.8
5.6
5.4
5.2
5.0
4.8
POWER (mW)
4.6
4.4
4.2
4.0
3.8
3.6
3.4
3.2
3.0 0
200 400 600 800 1000 1200 1400 1600 1800
THROUGHPUT (kSPS)
50MHz SCLK
Figure 29. Power vs. Throughput Normal Mode
8.0
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
3.5
POWER (mW)
3.0
2.5
2.0
1.5
1.0
0.5
0
0
200 400 600 800
THROUGHPUT (kSPS)
Figure 30. Power vs. Throughput Partial Powe
VARIABLE
SCLK
VDD=3V
r-Down Mode
04903-029
2000
04903-035
1000
Rev. A | Page 21 of 28
AD7276/AD7277/AD7278
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SERIAL INTERFACE

Figure 31 through Figure 34 show the detailed timing diagrams for serial interfacing to the AD7276, AD7277, and AD7278. The serial clock provides the conversion clock and controls the transfer of information from the AD7276/AD7277/AD7278 during conversion.
The
signal initiates the data transfer and conversion process.
CS
The falling edge of
puts the track-and-hold into hold mode
CS and takes the bus out of three-state. The analog input is sampled and the conversion is initiated at this point.
For the AD7276, the conversion requires completing 14 SCLK
ycles. Once 13 SCLK falling edges have elapsed, the track-and-
c hold goes back into track mode on the next SCLK rising edge, as shown in Figure 31 at Point B. If the rising edge of
occurs
CS before 14 SCLKs have elapsed, the conversion is terminated and the SDATA line goes back into three-state. If 16 SCLKs are considered in the cycle, the last two bits are zeros and SDATA
th
returns to three-state on the 16
SCLK falling edge, as shown in
Figure 32.
For the AD7277, the conversion requires completing 12 SCLK c
ycles. Once 11 SCLK falling edges elapse, the track-and-hold goes back into track mode on the next SCLK rising edge, as shown in
Figure 33 at Point B. If the rising edge of
CS
occurs
before 12 SCLKs elapse, the conversion is terminated and the SDATA line goes back into three-state. If 16 SCLKs are considered in the cycle, the AD7277 clocks out four trailing zeros for the last four bits and SDATA returns to three-state on the 16 falling edge, as shown in
Figure 33.
th
SCLK
For the AD7278, the conversion requires completing 10 SCLK c
ycles. Once 9 SCLK falling edges elapse, the track-and-hold goes back into track mode on the next rising edge. If the rising edge of
occurs before 10 SCLKs elapse, the part enters power-
CS
down mode.
CS
SCLK
SDATA
THREE-
STATE
t
2
1513
t
3
ZZERO
2 LEADING
ZEROS
234
DB11 DB10 DB9 DB1 DB0
Figure 31. AD7276 Serial Interface Timing Diagram 14 SCLK Cycle
t
CONVERT
t
6
t
4
If 16 SCLKs are considered in the cycle, then the AD7278 clocks o
ut six trailing zeros for the last six bits and SDATA returns to
three-state on the 16
th
SCLK falling edge, as shown in Figure 34.
If the user considers a 14 SCLK cycle serial interface for the AD7276/AD72
th
the 14
SCLK falling edge. Then the last two trailing zeros are
77/AD7278, then
must be brought high after
CS
ignored, and SDATA goes back into three-state. In this case, the 3 MSPS throughput can be achieved by using a 48 MHz clock frequency.
going low clocks out the first leading zero to be read by the
CS microcontroller or DSP. The remaining data is then clocked out by subsequent SCLK falling edges, beginning with the second leading zero. Therefore, the first falling clock edge on the serial clock provides the first leading zero and clocks out the second leading zero. The final bit in the data transfer is valid on the 16 falling edge, because it is clocked out on the previous (15
falling edge.
In applications with a slower SCLK, it is possible to read data on
h SCLK rising edge. In such cases, the first falling edge of SCLK
eac clocks out the second leading zero and can be read on the first rising edge. However, the first leading zero clocked out when
goes low is missed if read within the first falling edge. The
CS
th
15
falling edge of SCLK clocks out the last bit and can be read
th
on the 15
If
CS
rising SCLK edge.
goes low just after one SCLK falling edge elapses, then CS
clocks out the first leading zero and can be read on the SCLK rising edge. The next SCLK falling edge clocks out the second leading zero and can be read on the following rising edge.
t
1
B
14
t
7
t
5
1/THROUGHPUT
t
9
t
QUIET
THREE-STATE
04903-099
th
th
)
Rev. A | Page 22 of 28
AD7276/AD7277/AD7278
S
S
S
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t
1
CS
t
CONVERT
SCLK
DATA
CS
SCLK
DATA
THREE­STATE
THREE­STATE
t
2
1 2 3 4 5 13 15 1614
t
3
DB11 DB10 DB9 DB1 DB0 ZERO ZEROZEROZ
2 LEADING ZEROS
Figure 32. AD7276 Serial Interface Timing Diagram 16 SCLK Cycle
t
2
1 2 3 4 10 11 12 14 161513
t
2 LEADING ZEROS
t
3
4
DB9 DB8 DB0DB1 ZERO ZERO ZERO ZEROZEROZ
t
6
t
4
1/THROUGHPUT
B
t
t
7
5
2 TRAILI NG ZEROS
t
CONVERT
t
5
B
1/THROUGHPUT
t
6
t
7
4 TRAILI NG ZERO S
Figure 33. AD7277 Serial Interface Timing Diagram
t
8
THREE-STATE
t
THREE-STATE
t
QUIET
8
t
QUIET
04903-030
t
1
4903-031
CS
SCLK
DATA
CS
SCLK
SDATA
THREE­STATE
THREE­STATE
t
t
2
1 2 3 4 8910 14 161511
t
3
2 LEADING ZEROS
t
4
DB7 DB6 DB0DB1 ZERO ZERO ZEROZEROZ
CONVERT
t
5
t
6
B
1/THROUGHPUT
Figure 34. AD7278 Serial Interface Timing Diagram
t
CONVERT
t
2
1 2 3 4 9 105
DB7 DB6 DB5 DB1 DB0ZEROZ
2 LEADING ZEROS
8.5 (1/f
t
6
)
SCLK
1/THROUGHPUT
Figure 35. AD7278 in a 10 SCLK Cycle Serial Interface
t
7
6 TRAILI NG ZERO S
B
THREE-STATE
t
1
t
8
t
QUIET
THREE-STATE
04903-032
t
1
t
8
t
QUIET
t
ACQ
04903-033
Rev. A | Page 23 of 28
AD7276/AD7277/AD7278
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AD7278 IN A 10 SCLK CYCLE SERIAL INTERFACE

For the AD7278, if CS is brought high during the 10th rising
edge after the two leading zeros and eight bits of the conversion are provided, then the part can achieve a 4 MSPS throughput rate. For the AD7278, the track-and-hold goes back into track mode on the ninth rising edge. In this case, a f and throughput of 4 MSPS result in a cycle time of t
) + t
8.5(1/f
SCLK
= 250 ns, where t2 = 6 ns minimum and t
ACQ
67 ns. This satisfies the requirement of 60 ns for t shows that t
comprises 0.5(1/f
ACQ
ns max. This allows a value of 43 ns for t
SCLK
) + t8 + t
QUIET
= 48 MHz
SCLK
+
2
. Figure 35
ACQ
, where t8 = 14
QUIET
, satisfying the
ACQ
=
minimum requirement of 4 ns.

MICROPROCESSOR INTERFACING

AD7276/AD7277/AD7278-to-ADSP-BF53x
The ADSP-BF53x family of DSPs interfaces directly to the AD7276/AD7277/AD7278 without requiring glue logic. The SPORT0 Receive Configuration 1 Register should be set up as outlined in
Tabl e 9 .
Table 9. The SPORT0 Receive Configuration 1 Register (SPORT0_RCR1)
Setting Description
RCKFE = 1 Sample data with falling edge of RSCLK LRFS = 1 Active low frame signal RFSR = 1 Frame every word IRFS = 1 Internal RFS used RLSBIT = 0 Receive MSB first RDTYPE = 00 Zero fill IRCLK = 1 Internal receive clock RSPEN = 1 Receive enabled SLEN = 1111
16-bit data-word (or can be set to 1101 for 14-bit da
ta-word)
TFSR = RFSR = 1
To implement the power-down modes, SLEN should be set to 1001 to issue an 8-bit SCLK burst.
AD7276/ AD7277/
AD7278*
SCLK RCLK0
DOUT
CS
DIN
*ADDITIONAL PINS OMIT TED FOR CL ARITY
Figure 36. Interfacing with ADSP-BF53x
ADSP-BF53x*
SPORT0
DR0PRI
RFS0
DT0
4903-098
Rev. A | Page 24 of 28
AD7276/AD7277/AD7278
www.BDTIC.com/ADI

APPLICATION HINTS

GROUNDING AND LAYOUT

The printed circuit board that houses the AD7276/AD7277/ AD7278 should be designed so that the analog and digital sections are separated and confined to certain areas of the board. This design facilitates using ground planes that can easily be separated.
To provide optimum shielding for ground planes, a minimum et
ch technique is generally best. All AGND pins of the AD7276/ AD7277/AD7278 should be sunk into the AGND plane. Digital and analog ground planes should be joined in one place only. If the AD7276/AD7277/AD7278 are in a system where multiple devices require an AGND-to-DGND connection, the connection should still be made at only one point, a star ground point established as close as possible to the ground pin on the AD7276/AD7277/AD7278.
Avoid running digital lines under the device because this
uples noise onto the die. However, the analog ground plane
co should be allowed to run under the AD7276/AD7277/AD7278 to avoid noise coupling. The power supply lines to the AD7276/ AD7277/AD7278 should use as large a trace as possible to provide low impedance paths and reduce the effects of glitches on the power supply line.
To avoid radiating noise to other sections of the board, co
mponents with fast-switching signals, such as clocks, should be shielded with digital ground, and they should never be run near the analog inputs. Avoid crossover of digital and analog signals. To reduce the effects of feedthrough within the board, traces on opposite sides of the board should run at right angles to each other. A microstrip technique is by far the best method, but it is not always possible to use this approach with a double­sided board. In this technique, the component side of the board is dedicated to ground planes, and signals are placed on the solder side.
Good decoupling is also important. All analog supplies should
decoupled with 10 µF ceramic capacitors in parallel with
be
0.1 µF capacitors to GND. To achieve the best results from these decoupling components, they must be placed as close as possible to the device, ideally right up against the device. The 0.1 µF capacitors should have low effective series resistance (ESR) and low effective series inductance (ESI), such as is typical of common ceramic or surface-mount types of capacitors. Capacitors with low ESR and low ESI provide a low impedance path to ground at high frequencies, which allow them to handle transient currents due to internal logic switching.

EVALUATING PERFORMANCE

The recommended layout for the AD7276/AD7277/AD7278 is outlined in the evaluation board documentation. The evaluation board package includes a fully assembled and tested evaluation board, documentation, and software for controlling the board from the PC via the evaluation board controller. To demonstrate/evaluate the ac and dc performance of the AD7276/AD7277, the evaluation board controller can be used in conjunction with the AD7276/AD7277 evaluation board, as well as with many other Analog Devices evaluation boards ending in the CB designator,
The software allows the user to perform ac (fast Fourier
nsform) and dc (histogram of codes) tests on the AD7276/
tra AD7277. The software and documentation are on a CD shipped with the evaluation board.
Rev. A | Page 25 of 28
AD7276/AD7277/AD7278
R
www.BDTIC.com/ADI

OUTLINE DIMENSIONS

2.90 BSC
1.90 BSC
0.50
0.30
45
2.80 BSC
2
0.95 BSC
0.95
*
1.00 MAX
SEATING PLANE
0.20
0.08 8°
0.60
0.45
0.30
0.85
0.75
0.15
0.00
COPLANARITY
1.60 BSC
PIN 1
INDICATO
*
0.90
0.87
0.84
0.10 MAX
6
13
*
COMPLIANT TO JEDEC STANDARDS MO-193-AA WITH
THE EXCEPTION OF PACKAGE HEIGHT AND THICKNESS.
Figure 37. 6-Lead Thin Small Outline Transistor Package [TSOT ]
(UJ-6)
Di
mensions shown in millimeters

ORDERING GUIDE

Model
AD7276BRM −40°C to +125°C ±1 max 8-Lead Mini Small Outline Package (MSOP) RM-8 C1W AD7276BRMZ −40°C to +125°C ±1 max 8-Lead Mini Small Outline Package (MSOP) RM-8 C30
2
AD7276BRMZ-REEL −40°C to +125°C ±1 max 8-Lead Mini Small Outline Package (MSOP) RM-8 C30 AD7276BUJ-500RL7 −40°C to +125°C ±1 max 6-Lead Thin Small Outline Transistor Package (TSOT) UJ-6 C1W AD7276BUJZ-500RL7 −40°C to +125°C ±1 max 6-Lead Thin Small Outline Transistor Package (TSOT) UJ-6 AD7276BUJZ-REEL7 −40°C to +125°C ±1 max 6-Lead Thin Small Outline Transistor Package (TSOT) UJ-6 C30 AD7276YUJZ-500RL72, −40°C to +125°C ±1 max 6-Lead Thin Small Outline Transistor Package (TSOT) UJ-6 C4W AD7276YUJZ-REEL2, −40°C to +125°C ±1 max 6-Lead Thin Small Outline Transistor Package (TSOT) UJ-6 C4W AD7277BRMZ −40°C to +125°C ±0.5 max 8-Lead Mini Small Outline Package (MSOP) RM-8 C31
2
AD7277BRMZ-REEL −40°C to +125°C ±0.5 max 8-Lead Mini Small Outline Package (MSOP) RM-8 C31 AD7277BUJZ-500RL7 −40°C to +125°C ±0.5 max 6-Lead Thin Small Outline Transistor Package (TSOT) UJ-6 C31 AD7277BUJZ-REEL7 −40°C to +125°C ±0.5 max 6-Lead Thin Small Outline Transistor Package (TSOT) UJ-6 C31 AD7278BRMZ −40°C to +125°C ±0.3 max 8-Lead Mini Small Outline Package (MSOP) RM-8 C32
2
AD7278BRMZ-REEL −40°C to +125°C ±0.3 max 8-Lead Mini Small Outline Package (MSOP) RM-8 C32 AD7278BUJZ-500RL7 −40°C to +125°C ±0.3 max 6-Lead Thin Small Outline Transistor Package (TSOT) UJ-6 C32 AD7278BUJZ-REEL7 −40°C to +125°C ±0.3 max 6-Lead Thin Small Outline Transistor Package (TSOT) UJ-6 C32 EVAL-AD7276CB Evaluation Board EVAL-AD7277CB Evaluation Board
4
4
EVAL-CONTROL BRD2 Control Board
1
Linearity error refers to integral nonlinearity.
2
Z = Pb-free part.
3
Y Grade part, F
4
This can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL board for evaluation/demonstration purposes.
5
This board is a complete unit allowing a PC to control and communicate with all Analog Devices evaluation boards that end in a CB designator. To order a complete
SAMPLE
= 1 MSPS.
evaluation kit, the particular ADC evaluation board (such as, EVAL-AD7276/AD7277CB), the EVAL-CONTROL BRD2, and a 12 V transformer must be ordered. See the relevant evaluation board technical note for more information.
2
2
2
3
3
2
2
2
2
2
2
5
Temperature Range
Linearity Error
1
(LSB)
Package Description
3.20
3.00
2.80
8
5
4
SEATING PLANE
5.15
4.90
4.65
1.10 MAX
0.23
0.08
8° 0°
3.20
3.00
1
2.80
PIN 1
0.65 BSC
0.38
0.22
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 38. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
mensions shown in millimeters
Di
Package Option
0.80
0.60
0.40
Branding
C30
Rev. A | Page 26 of 28
AD7276/AD7277/AD7278
www.BDTIC.com/ADI
NOTES
Rev. A | Page 27 of 28
AD7276/AD7277/AD7278
www.BDTIC.com/ADI
NOTES
© 2005 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D04903-0-10/05(A)
Rev. A | Page 28 of 28
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