Datasheet AD7266 Datasheet (ANALOG DEVICES)

Page 1
Differential/Single-Ended Input, Dual

FEATURES

Dual 12-bit, 3-channel ADC Throughput rate: 2 MSPS Specified for V Power consumption
9 mW at 1.5 MSPS with 3 V supplies 27 mW at 2 MSPS with 5 V supplies
Pin-configurable analog inputs
12-channel single-ended inputs 6-channel fully differential inputs
6-channel pseudo differential inputs 70 dB SNR at 50 kHz input frequency Accurate on-chip reference: 2.5 V
±0.2% maximum @ 25°C, 20 ppm/°C maximum Dual conversion with read 437.5 ns, 32 MHz SCLK High speed serial interface
SPI®-/QSPI™-/MICROWIRE™-/DSP-compatible
−40°C to +125°C operation Shutdown mode: 1 μA maximum 32-lead LFCSP and 32-lead TQFP 1 MSPS version,

GENERAL DESCRIPTION

The AD72661 is a dual, 12-bit, high speed, low power, successive approximation ADC that operates from a single 2.7 V to 5.25 V power supply and features throughput rates up to 2 MSPS. The device contains two ADCs, each preceded by a 3-channel multiplexer, and a low noise, wide bandwidth track-and-hold amplifier that can handle input frequencies in excess of 30 MHz.
The conversion process and data acquisition use standard control inputs allowing easy interfacing to microprocessors or DSPs. The input signal is sampled on the falling edge of conversion is also initiated at this point. The conversion time is determined by the SCLK frequency. There are no pipelined delays associated with the part.
The AD7266 uses advanced design techniques to achieve very low power dissipation at high throughput rates. With 5 V supplies and a 2 MSPS throughput rate, the part consumes
6.2 mA maximum. The part also offers flexible power/ throughput rate management when operating in normal mode as the quiescent current consumption is so low.
The analog input range for the part can be selected to be a 0 V to V
(or 2 × V
REF
complement output coding. The AD7266 has an on-chip 2.5 V reference that can be overdriven when an external reference is preferred. This external reference range is 100 mV to V
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
of 2.7 V to 5.25 V
DD
AD7265
) range, with either straight binary or twos
REF
DD
CS
;
.
2 MSPS, 12-Bit, 3-Channel SAR ADC
AD7266

FUNCTIONAL BLOCK DIAGRAM

REF SELECT D
BUF
REF
V
A1
V
A2
V
A3
MUX
V
A4
V
A5
V
A6
V
B1
V
B2
V
B3
MUX
V
B4
V
B5
V
B6
AGND AGND AGND D
T/H
T/H
BUF
The AD7266 is available in a 32-lead LFCSP and a 32-lead TQFP.

PRODUCT HIGHLIGHTS

1. Two Complete ADC Functions Allow Simultaneous
Sampling and Conversion of Two Channels. Each ADC has three fully/pseudo differential pairs, or six single-ended channels, as programmed. The conversion result of both channels is simultaneously available on separate data lines, or in succession on one data line if only one serial port is available.
2. High Throughput with Low Power Consumption.
The AD7266 offers a 1.5 MSPS throughput rate with 11.4 mW maximum power dissipation when operating at 3 V.
3. The AD7266 offers both a standard 0 V to V
and a 2 × V
4. No Pipeline Delay.
The part features two standard successive approximation ADCs with accurate control of the sampling instant via a CS
input and once off conversion control.
1
Protected by U.S. Patent No. 6,681,332
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2005–2011 Analog Devices, Inc. All rights reserved.
input range.
REF
A AV
CAP
DD
AD7266
12-BIT
SUCCESSIVE
APPROXIMATION
ADC
CONTROL
LOGIC
12-BIT
SUCCESSIVE
APPROXIMATION
ADC
B DGND DGND
CAP
Figure 1.
DV
DD
OUTPUT
DRIVERS
OUTPUT
DRIVERS
D
A
OUT
SCLK
CS RANGE SGL/DIFF A0 A1 A2
V
DRIVE
D
B
OUT
input range
REF
04603-001
Page 2
AD7266

TABLE OF CONTENTS

Features.............................................................................................. 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Timing Specifications .................................................................. 5
Absolute Maximum Ratings............................................................ 6
ESD Caution.................................................................................. 6
Pin Configuration and Function Descriptions............................. 7
Typical Performance Characteristics ............................................. 9
Terminology .................................................................................... 11
Theory of Operation ...................................................................... 13
Circuit Information.................................................................... 13
Converter Operation.................................................................. 13
Analog Input Structure.............................................................. 13
Analog Inputs.............................................................................. 14
Analog Input Selection .............................................................. 17
Output Coding............................................................................ 17
Transfer Functions...................................................................... 18
Digital Inputs ..............................................................................18
V
............................................................................................ 18
DRIVE
Modes of Operation ....................................................................... 19
Normal Mode.............................................................................. 19
Partial Power-Down Mode ....................................................... 19
Full Power-Down Mode............................................................ 20
Power-Up Times......................................................................... 21
Power vs. Throughput Rate....................................................... 21
Serial Interface ................................................................................ 22
Microprocessor Interfacing........................................................... 23
AD7266 to ADSP218x............................................................... 23
AD7266 to ADSP-BF53x........................................................... 24
AD7266 to TMS320C541.......................................................... 24
AD7266 to DSP563xx................................................................ 25
Application Hints ........................................................................... 26
Grounding and Layout.............................................................. 26
PCB Design Guidelines for LFCSP.......................................... 26
Evaluating the AD7266 Performance...................................... 26
Outline Dimensions....................................................................... 27
Ordering Guide .......................................................................... 27

REVISION HISTORY

5/11—Rev. A to Rev. B
Changes to Mnemonic Order for Pin 13 to Pin 18, Pin 23 to Pin
25, and Pin 28, Pin 30 in Table 4 .................................................... 7
Added EPAD Note............................................................................ 7
Updated Outline Dimensions....................................................... 27
Changes to Ordering Guide.......................................................... 27
11/06—Rev. 0 to Rev. A
Changes to Format ............................................................. Universal
Changes to Reference Input/Output Section ................................ 4
Changes to Table 4............................................................................ 7
Changes to Terminology Section.................................................. 11
Changes to Figure 24 and Differential Mode Section................ 15
Changes to Figure 29...................................................................... 16
Changes to Figure 39...................................................................... 21
Changes to AD7265 to ADSP-BF53x Section............................. 24
Updated Outline Dimensions....................................................... 27
Changes to Ordering Guide.......................................................... 27
4/05—Revision 0: Initial Version
Rev. B | Page 2 of 28
Page 3
AD7266

SPECIFICATIONS

TA = T f
SCLK
unless otherwise noted
Table 1.
Parameter Specification Unit Test Conditions/Comments
DYNAMIC PERFORMANCE
SAMPLE AND HOLD
3.5/3 MHz typ @ 0.1 dB, VDD = 5 V/VDD = 3 V DC ACCURACY
±1.5 LSB max
ANALOG INPUT5
to T
MIN
= 32 MHz, fS = 2 MSPS, V
Signal-to-Noise Ratio (SNR) 69 dB min
, VDD = 2.7 V to 3.6 V, f
MAX
DRIVE
1
.
2
= 24 MHz, fS = 1.5 MSPS, V
SCLK
= 2.7 V to 3.6 V; VDD = 4.75 V to 5.25 V,
DRIVE
= 2.7 V to 5.25 V; specifications apply using internal reference or external reference = 2.5 V ± 1%,
71 dB min fIN = 50 kHz sine wave; differential mode
= 50 kHz sine wave; single-ended and
f
IN
pseudo differential modes Signal-to-Noise + Distortion Ratio (SINAD) 68 dB min
2
70 dB min fIN = 50 kHz sine wave; differential mode
= 50 kHz sine wave; single-ended and
f
IN
pseudo differential modes Total Harmonic Distortion (THD) –73 dB max
2
–77 dB max fIN = 50 kHz sine wave; differential mode
= 50 kHz sine wave; single-ended and
f
IN
pseudo differential modes Spurious-Free Dynamic Range (SFDR) Intermodulation Distortion (IMD)
2
2
–75 dB max fIN = 50 kHz sine wave
fa = 30 kHz, fb = 50 kHz Second-Order Terms –88 dB typ Third-Order Terms
Channel-to-Channel Isolation
–88 dB typ
–88 dB typ
Aperture Delay3 11 ns max Aperture Jitter3 50 ps typ Aperture Delay Matching3 200 ps max Full Power Bandwidth 33/26 MHz typ @ 3 dB, VDD = 5 V/VDD = 3 V
Resolution 12 Bits Integral Nonlinearity
2
±1 LSB max ±0.5 LSB typ; differential mode
±0.5 LSB typ; single-ended and pseudo differential modes
Differential Nonlinearity
2, 4
±0.99 LSB max Differential mode
−0.99/+1.5 LSB max Single-ended and pseudo differential modes Straight Binary Output Coding
Offset Error ±7 LSB max ±2 LSB typ Offset Error Match ±2 LSB typ Gain Error ±2.5 LSB max Gain Error Match ±0.5 LSB typ
Twos Complement Output Coding
Positive Gain Error ±2 LSB max Positive Gain Error Match ±0.5 LSB typ Zero Code Error ±5 LSB max Zero Code Error Match ±1 LSB typ Negative Gain Error ±2 LSB max Negative Gain Error Match ±0.5 LSB typ
Single-Ended Input Range 0 V to V 0 V to 2 × V Pseudo Differential Input Range: V
IN+
− V
6
0 to V
IN−
2 × V
Fully Differential Input Range: V
IN+
V
and V
and V
IN+
VCM ± V
IN−
VCM ± V
IN−
V RANGE pin low
REF
RANGE pin high
REF
V RANGE pin low
REF
V RANGE pin high
REF
/2 V VCM = common-mode voltage7 = V
REF
V VCM = V
REF
REF
REF
/2
Rev. B | Page 3 of 28
Page 4
AD7266
Parameter Specification Unit Test Conditions/Comments
DC Leakage Current ±1 μA max
Input Capacitance 45 pF typ When in track 10 pF typ When in hold REFERENCE INPUT/OUTPUT
Reference Output Voltage
Long-Term Stability 150 ppm typ For 1000 hours
Output Voltage Hysteresis2 50 ppm typ
Reference Input Voltage Range 0.1/VDD V min/V max See Typical Performance Characteristics section
DC Leakage Current ±2 μA max External reference applied to Pin D
Input Capacitance 25 pF typ
D
A, D
CAP
B Output Impedance
CAP
Reference Temperature Coefficient 20 ppm/°C max
10 ppm/°C typ
V
Noise 20 μV rms typ
REF
LOGIC INPUTS
Input High Voltage, V
Input Low Voltage, V
Input Current, IIN ±15 nA typ VIN = 0 V or V
Input Capacitance, C LOGIC OUTPUTS
Output High Voltage, VOH V
Output Low Voltage, VOL 0.4 V max
Floating State Leakage Current ±1 μA max
Floating State Output Capacitance
Output Coding Twos complement
CONVERSION RATE
Conversion Time 14 SCLK cycles 437.5 ns with SCLK = 32 MHz
Track-and-Hold Acquisition Time
110 ns max Full-scale step input; VDD = 3 V
Throughput Rate 2 MSPS max POWER REQUIREMENTS
V
DD
V
2.7/5.25 V min/V max
DRIVE
I
DD
Normal Mode (Static) 2.3 mA max VDD = 5.25 V Operational, fS = 2 MSPS 6.4 mA max VDD = 5.25 V; 5.7 mA typ
fS = 1.5 MSPS 4 mA max VDD = 3.6 V; 3.4 mA typ Partial Power-Down Mode 500 μA max Static Full Power-Down Mode (VDD) 1 μA max TA = −40°C to +85°C
2.8 μA max TA > 85°C to 125°C
Power Dissipation
Normal Mode (Operational) 33.6 mW max VDD = 5.25 V Partial Power-Down (Static) 2.625 mW max VDD = 5.25 V Full Power-Down (Static) 5.25 μW max VDD = 5.25 V, TA = −40°C to +85°C
1
Temperature range is −40°C to +125°C.
2
See Terminology section.
3
Sample tested during initial release to ensure compliance.
4
Guaranteed no missed codes to 12 bits.
5
V
or V
must remain within GND/VDD.
IN−
IN+
6
V
= 0 V for specified performance. For full input range on V
IN−
7
For full common-mode range, see Figure 24 and Figure 25.
8
Relates to Pin D
A or Pin D
CAP
8
2.8 V min
INH
0.4 V max
INL
3
IN
3
3
2.5 V min/V max ±0.2% max @ 25°C
10 Ω typ
DRIVE
5 pF typ
− 0.2 V min
DRIVE
7 pF typ
Straight (natural) binary
SGL/DIFF SGL/DIFF
= 1 with 0 V to V
= 0; SGL/DIFF = 1 with 0 V to 2 × V
90 ns max Full-scale step input; VDD = 5 V
2.7/5.25 V min/V max
Digital I/Ps = 0 V or V
B.
CAP
pin, see Figure 28 and Figure 29.
IN−
A/Pin D
CAP
CAP
B
range selected
REF
range
REF
DRIVE
Rev. B | Page 4 of 28
Page 5
AD7266

TIMING SPECIFICATIONS

AVDD = DVDD = 2.7 V to 5.25 V, V
Table 2.
Parameter Limit at T
2
f
SCLK
t
CONVER T
t
30 ns min
QUIET
t
2
t
3
3
t
4
1 MHz min TA = −40°C to +85°C 4 MHz min TA > 85°C to 125°C 32 MHz max 14 × t
437.5 ns max f
583.3 ns max f
15/20 ns min 20/30 ns min 15 ns max 36 ns max Data access time after SCLK falling edge, VDD = 3 V
27 ns max Data access time after SCLK falling edge, VDD = 5 V t5 0.45 t t6 0.45 t t
7
t
8
10 ns min SCLK to data valid hold time, VDD = 3 V
5 ns min SCLK to data valid hold time, VDD = 5 V
15 ns max
, T
MIN
ns max t
SCLK
SCLK
ns min SCLK high pulse width
SCLK
t9 30 ns min t
10
1
Sample tested during initial release to ensure compliance. All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V.
All timing specifications given are with a 25 pF load capacitance. With a load capacitance greater than this value, a digital buffer or latch must be used. See Serial Interface section and Figure 41 and Figure 42.
2
Minimum SCLK for specified performance; with slower SCLK frequencies, performance specifications apply typically.
3
The time required for the output to cross 0.4 V or 2.4 V.
5 ns min SCLK falling edge to D
35 ns max SCLK falling edge to D
= 2.7 V to 5.25 V, internal/external reference = 2.5 V, TA = T
DRIVE
MAX
Unit Description
= 1/f
SCLK
= 32 MHz, VDD = 5 V, f
SCLK
= 24 MHz, VDD = 3 V, f
SCLK
SCLK
Minimum time between end of serial read and next falling edge of
= 5 V/3 V, CS to SCLK setup time, TA = −40°C to +85°C
V
DD
= 5 V /3 V, CS to SCLK setup time, TA > 85°C to 125°C
V
DD
CS
Delay from
until D
ns min SCLK low pulse width
CS
rising edge to D
CS
rising edge to falling edge pulse width
OUT
= 2 MSPS
SAMPLE
= 1.5 MSPS
SAMPLE
A and D
OUT
A, D
B, high impedance
OUT
A, D
OUT
OUT
A, D
OUT
OUT
to T
MAX
B are three-state disabled
OUT
, unless otherwise noted1.
MIN
B, high impedance B, high impedance
CS
Rev. B | Page 5 of 28
Page 6
AD7266

ABSOLUTE MAXIMUM RATINGS

Table 3.
Parameter Rating
VDD to AGND −0.3 V to +7 V DVDD to DGND −0.3 V to +7 V V
to DGND −0.3 V to DVDD
DRIVE
V
to AGND −0.3 V to AVDD
DRIVE
AVDD to DVDD −0.3 V to +0.3 V AGND to DGND −0.3 V to +0.3 V Analog Input Voltage to AGND −0.3 V to AVDD + 0.3 V Digital Input Voltage to DGND −0.3 V to +7 V Digital Output Voltage to GND −0.3 V to V V
to AGND −0.3 V to AVDD + 0.3 V
REF
Input Current to Any Pin Except Supplies
1
±10 mA
DRIVE
+ 0.3 V
Operating Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C LFCSP/TQFP
θJA Thermal Impedance 108.2°C/W (LFCSP) 55°C/W (TQFP) θJC Thermal Impedance 32.71°C/W (LFCSP)
Lead Temperature, Soldering
Reflow Temperature (10 to 30 sec) 255°C
ESD 1.5 kV
1
Transient currents of up to 100 mA will not cause latch up.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

Rev. B | Page 6 of 28
Page 7
AD7266

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

B
A
DD
OUT
OUT
DRIVE
DV
32
1
DGND
AV
D
CAP
AGND AGND
V V
2 3
DD
4
A
5 6
(Not to Scale)
7
A1
8
A2
9
A3
REF SELECT
NOTES
1. THE EXPOSED M ETAL PADDLE ON THE BOTTO M OF THE LFCSP PACKAGE SHOULD BE SOLDERED TO PCB GROUND.
SCLK
D
DGND
D
V
31302928272625
PIN 1 INDICATOR
AD7266
TOP VIEW
101112
13
141516
VB5VB4V
VB6VA6VA5VA4V
Figure 2. Pin Configuration (CP-32-2)
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 29 DGND
Digital Ground. This is the ground reference point for all digital circuitry on the AD7266. Both DGND pins should connect to the DGND plane of a system. The DGND and AGND voltages should ideally be at the same potential and must not be more than 0.3 V apart, even on a transient basis.
2 REF SELECT
Internal/External Reference Selection. Logic input. If this pin is tied to DGND, the on-chip 2.5 V reference is used as the reference source for both ADC A and ADC B. In addition, Pin D capacitors. If the REF SELECT pin is tied to a logic high, an external reference can be supplied to the AD7266 through the D
3 AV
DD
Analog Supply Voltage, 2.7 V to 5.25 V. This is the only supply voltage for all analog circuitry on the AD7266. The
and DVDD voltages should ideally be at the same potential and must not be more than 0.3 V apart, even on a
AV
DD
transient basis. This supply should be decoupled to AGND.
4, 20
A,
D
CAP
B
D
CAP
Decoupling Capacitor Pins. Decoupling capacitors (470 nF recommended) are connected to these pins to decouple the reference buffer for each respective ADC. Provided the output is buffered, the on-chip reference can be taken from these pins and applied externally to the rest of a system. The range of the external reference is dependent on the analog input range selected.
5, 6, 19 AGND
Analog Ground. Ground reference point for all analog circuitry on the AD7266. All analog input signals and any external reference signal should be referred to this AGND voltage. All three of these AGND pins should connect to the AGND plane of a system. The AGND and DGND voltages ideally should be at the same potential and must not be more than 0.3 V apart, even on a transient basis.
7 to 12 V
to VA6
A1
Analog Inputs of ADC A. These may be programmed as six single-ended channels or three true differential analog input channel pairs. See Tab le 6.
13 to 18 V
to VB1
B6
Analog Inputs of ADC B. These may be programmed as six single-ended channels or three true differential analog input channel pairs. See Tab le 6.
21 RANGE
Analog Input Range Selection. Logic input. The polarity on this pin determines the input range of the analog input channels. If this pin is tied to a logic low, the analog input range is 0 V to V CS
goes low, the analog input range is 2 × V
22
SGL/DIFF
Logic Input. This pin selects whether the analog inputs are configured as differential pairs or single ended. A logic
low selects differential operation while a logic high selects single-ended operation. See the Analog Input Selection section for details.
23 to 25 A2 to A0
Multiplexer Select. Logic inputs. These inputs are used to select the pair of channels to be simultaneously converted, such as Channel 1 of both ADC A and ADC B, Channel 2 of both ADC A and ADC B, and so on. The pair of channels selected may be two single-ended channels or two differential pairs. The logic states of these pins need to be set up prior to the acquisition time and subsequent falling edge of CS multiplexer for that conversion. See the section for further details and for multiplexer address decoding.
26
Chip Select. Active low logic input. This input provides the dual function of initiating conversions on the AD7266
CS
and framing the serial data transfer.
27 SCLK
Serial Clock. Logic input. A serial clock input provides the SCLK for accessing the data from the AD7266. This clock is also used as the clock source for the conversion process.
A0
CS
B3
A and/or D
CAP
24
A1
23
A2
22
SGL/DIFF
21
RANGE
20
D
19
AGND
18
V
17
V
CAP
B1 B2
1
DGND
REF SELECT
B
04603-002
B pins.
CAP
. See the section for details. Analog Input Selection
REF
2
3
AV
DD
4
D
A
CAP
5
AGND
6
AGND
7
V
A1
8
V
A2
Figure 3. Pin Configuration (SU-32-2)
A and Pin D
CAP
Analog Input Selection Tab le 6
Rev. B | Page 7 of 28
A
DD
DV
V
32
31
PIN 1
9
10
A3
V
V
REF
B
OUT
DRIVE
A4
OUT
D
DGND28D
30
29
AD7266
TOP VIEW
(Not to Scale)
11
12
A5
V
V
CAP
CS
SCLK
A0
27
26 25
24
A1
23
A2
22
SGL/DIFF
21
RANGE
20
D
CAP
19
AGND
18
V
B1
17
V
B2
13
14
15
16
A6
B6
B5
B4
V
B3
V
V
V
B must be tied to decoupling
B
. If this pin is tied to a logic high when
to correctly set up the
04603-041
Page 8
AD7266
Pin No. Mnemonic Description
28, 30
31 V
D D
OUT
OUT
DRIVE
B, A
32 DVDD
EPAD Exposed Pad. The exposed metal paddle on the bottom of the LFCSP package should be soldered to PCB ground.
Serial Data Outputs. The data output is supplied to each pin as a serial data stream. The bits are clocked out on the falling edge of the SCLK input and 14 SCLKs are required to access the data. The data simultaneously appears on both pins from the simultaneous conversions of both ADCs. The data stream consists of two leading zeros followed by the 12 bits of conversion data. The data is provided MSB first. If CS
is held low for 16 SCLK cycles rather than 14, then two trailing zeros will appear after the 12 bits of data. If CS is held low for a further 16 SCLK cycles on either D
conversion on both ADCs to be gathered in serial format on either D
OUT
A or D
B, the data from the other ADC follows on the D
OUT
pin. This allows data from a simultaneous
OUT
OUT
A or D
B using only one serial port. See
OUT
the section. Serial Interface Logic Power Supply Input. The voltage supplied at this pin determines at what voltage the interface operates. This
pin should be decoupled to DGND. The voltage at this pin may be different than that at AV
and DVDD but should
DD
never exceed either by more than 0.3 V. Digital Supply Voltage, 2.7 V to 5.25 V. This is the supply voltage for all digital circuitry on the AD7266. The DV
and AV
voltages should ideally be at the same potential and must not be more than 0.3 V apart even on a
DD
DD
transient basis. This supply should be decoupled to DGND.
Rev. B | Page 8 of 28
Page 9
AD7266

TYPICAL PERFORMANCE CHARACTERISTICS

TA = 25°C, unless otherwise noted.
–60
–70
–80
–90
PSRR (dB)
–100
INTERNAL REFERENCE
EXTERNAL REFERENCE
–10
–30
–50
(dB)
–70
4096 POINT FFT
= 5V, V
V
DD
F
SAMPLE
= 52kHz
F
IN
SINAD = 71.4dB THD = –84.42dB DIFFERENTIAL MODE
DRIVE
= 2MSPS
= 3V
–110
100mV p-p SINE WAVE ON AV NO DECOUPLING SINGLE-ENDED MODE
–120
SUPPLY RIPPLE FREQUENCY (kHz)
DD
20000 200 400 600 800 1000 1200 1400 1600 1800
Figure 4. PSRR vs. Supply Ripple Frequency Without Supply Decoupling
–50
VDD = 5V
–55
–60
–65
–70
–75
–80
ISOLATION (dB)
–85
–90
–95
–100
NOISE FREQUENCY (kHz)
10000 100 200 300 400 500 600 800700 900
Figure 5. Channel-to-Channel Isolation
74
72
70
68
66
SINAD (dB)
64
62
60
VDD = 5V DIFFERENTIAL MODE
V
DD
DIFFERENTIAL MODE
INPUT FREQUENCY (kHz)
= 3V
RANGE = 0 TO V
REF
30000 1000 2000500 1500 2500
Figure 6. SINAD vs. Analog Input Frequency for Various Supply Voltages
04603-003
04603-004
04603-005
–110
DNL ERROR (LSB)
INL ERROR (LSB)
–90
–0.2
–0.4
–0.6
–0.8
–1.0
–0.2
–0.4
–0.6
–0.8
–1.0
1.0
0.8
0.6
0.4
0.2
1.0
0.8
0.6
0.4
0.2
FREQUENCY ( kHz)
10000 100 200 300 400 500 600 700 800 900
04603-006
Figure 7. FFT
VDD = 5V, V DIFFERENTIAL MODE
0
CODE
DRIVE
= 3V
40000 1000 2000 3000 3500500 1500 2500
04603-007
Figure 8. Typical DNL
VDD = 5V, V DIFFERENTIAL MODE
0
CODE
DRIVE
= 3V
40000 500 1000 1500 2000 2500 3000 3500
04603-008
Figure 9. Typical INL
Rev. B | Page 9 of 28
Page 10
AD7266
1.0
0.8
0.6
0.4
0.2
0
–0.2
–0.4
LINEARITY ERROR (LSB)
–0.6
–0.8
–1.0
12.0
11.5
11.0
10.5
10.0
9.5
9.0
8.5
8.0
EFFECTIVE NUMBER OF BITS
7.5
7.0
2.5010
2.5005
2.5000
POSITIVE DNL
POSITIVE INL
NEGATIVE INL
NEGATIVE DNL
V
(V)
REF
Figure 10. Linearity Error vs. V
VDD = 5V
SINGLE-ENDED MODE
VDD = 3V
SINGLE-ENDED MODE
VDD = 3V
DIFFERENTIAL MODE
V
(V)
REF
Figure 11. Effective Number of Bits vs. V
VDD = 3V/5V DIFFERENTIAL MODE
REF
VDD = 5V
DIFFERENTIAL MODE
REF
2.50 0.5 1.0 1.5 2.0
04603-009
5.00 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
04603-010
10000
INTERNAL
REFERENCE
9000
8000
7000
6000
5000
4000
3000
NO. OF OCCURRENCES
2000
1000
0
2046 2047 20492048 2050
10000
CODES
CODE
DIFFERENTIAL
MODE
Figure 13. Histogram of Codes for 10k Samples in Differential Mode
10000
INTERNAL
REFERENCE
9000
8000
7000
6000
5000
4000
3000
NO. OF OCCURRENCES
2000
1000
0
2046 2047 2048 2049 2050
5 CODES 11 CODES
9984
CODES
CODE
SINGLE-ENDED
MODE
Figure 14. Histogram of Codes for 10k Samples in Single-Ended Mode
–60
–65
–70
–75
DIFFERENTIAL MODE
= 3V/5V
V
DD
04603-012
04603-042
(V)
2.4995
REF
V
2.4990
2.4985
2.4980
Figure 12. V
CURRENT LOAD (μA)
vs. Reference Output Current Drive
REF
2000 20 40 60 80 100 120 140 160 180
04603-011
–80
CMRR (dB)
–85
–90
–95
–100
RIPPLE FREQUENCY (kHz)
Figure 15. CMRR vs. Common-Mode Ripple Frequency
12000 200 400 600 800 1000
04603-011
Rev. B | Page 10 of 28
Page 11
AD7266

TERMINOLOGY

Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between the measured and the ideal 1 LSB change between any two adjacent codes in the ADC.
Integral Nonlinearity (INL)
Integral nonlinearity is the maximum deviation from a straight line passing through the endpoints of the ADC transfer function. The endpoints of the transfer function are zero scale with a single (1) LSB point below the first code transition, and full scale with a 1 LSB point above the last code transition.
Offset Error
Offset error applies to straight binary output coding. It is the deviation of the first code transition (00 . . . 000) to (00 . . . 001) from the ideal (AGND + 1 LSB).
Offset Error Match
Offset error match is the difference in offset error across all 12 channels.
Gain Error
Gain error applies to straight binary output coding. It is the deviation of the last code transition (111 . . . 110) to (111 . . .
111) from the ideal (V
− 1 LSB) after the offset error is
REF
adjusted out. Gain error does not include reference error.
Gain Error Match
Gain error match is the difference in gain error across all 12 channels.
Zero Code Error
Zero code error applies when using twos complement output coding with, for example, the 2 × V +V
biased about the V
REF
point. It is the deviation of the
REF
midscale transition (all 1s to all 0s) from the ideal V (V
).
REF
input range as −V
REF
REF
voltage
IN
to
Zero Code Error Match
Zero code error match refers to the difference in zero code error across all 12 channels.
Positive Gain Error
This applies when using twos complement output coding with, for example, the 2 × V about the V
point. It is the deviation of the last code
REF
transition (011…110) to (011…111) from the ideal (+V
input range as −V
REF
REF
to +V
biased
REF
REF
1 LSB) after the zero code error is adjusted out.
Track-and-Hold Acquisition Time
The track-and-hold amplifier returns to track mode after the end of conversion. Track-and-hold acquisition time is the time required for the output of the track-and-hold amplifier to reach its final value, within ±1/2 LSB, after the end of conversion.
Rev. B | Page 11 of 28
Signal-to-(Noise + Distortion) Ratio
This ratio is the measured ratio of signal-to-(noise + distortion) at the output of the ADC. The signal is the rms amplitude of the fundamental. Noise is the sum of all non-fundamental signals up to half the sampling frequency (f
/2), excluding dc. The ratio
S
is dependent on the number of quantization levels in the digitization process; the more levels, the smaller the quantization noise. The theoretical signal-to-(noise + distortion) ratio for an ideal N-bit converter with a sine wave input is given by
Signal-to-(Noise + Distortion) = (6.02N + 1.76) dB
Therefore, for a 12-bit converter, this is 74 dB.
Total Harmonic Distortion (THD)
Total harmonic distortion is the ratio of the rms sum of harmonics to the fundamental. For the AD7266, it is defined as
2
2
dBTHD
log20)(
=
4
3
V
1
VVVVV
++++
6
5
2
2
2
2
where:
V
is the rms amplitude of the fundamental.
1
, V3, V4, V5, and V6 are the rms amplitudes of the second
V
2
through the sixth harmonics.
Peak Harmonic or Spurious Noise
Peak harmonic, or spurious noise, is defined as the ratio of the rms value of the next largest component in the ADC output spectrum (up to f
/2, excluding dc) to the rms value of the
S
fundamental. Normally, the value of this specification is determined by the largest harmonic in the spectrum, but for ADCs where the harmonics are buried in the noise floor, it is a noise peak.
Channel-to-Channel Isolation
Channel-to-channel isolation is a measure of the level of crosstalk between channels. It is measured by applying a full­scale (2 × V
when VDD = 5 V, V
REF
when VDD = 3 V), 10 kHz
REF
sine wave signal to all unselected input channels and determining how much that signal is attenuated in the selected channel with a 50 kHz signal (0 V to V
). The result obtained
REF
is the worst-case across all 12 channels for the AD7266.
Intermodulation Distortion
With inputs consisting of sine waves at two frequencies, fa and fb, any active device with nonlinearities create distortion products at sum, and difference frequencies of mfa ± nfb where m, n = 0, 1, 2, 3, and so on. Intermodulation distortion terms are those for which neither m nor n are equal to zero. For example, the second-order terms include (fa + fb) and (fa − fb), while the third-order terms include (2fa + fb), (2fa − fb), (fa + 2fb), and (fa − 2fb).
Page 12
AD7266
The AD7266 is tested using the CCIF standard where two input frequencies near the top end of the input bandwidth are used. In this case, the second-order terms are usually distanced in frequency from the original sine waves, while the third-order terms are usually at a frequency close to the input frequencies. As a result, the second-order and third-order terms are specified separately. The calculation of the intermodulation distortion is as per the THD specification, where it is the ratio of the rms sum of the individual distortion products to the rms amplitude of the sum of the fundamentals expressed in dBs.
Common-Mode Rejection Ratio (CMRR)
CMRR is defined as the ratio of the power in the ADC output at full-scale frequency, f, to the power of a 100 mV p-p sine wave applied to the common-mode voltage of V frequency f
as
S
CMRR (dB) = 10 log(Pf/Pf
)
S
IN+
and V
IN−
of
where:
Pf is the power at frequency f in the ADC output.
is the power at frequency fS in the ADC output.
Pf
S
Power Supply Rejection Ratio (PSRR)
Variations in power supply affect the full-scale transition but not the converter’s linearity. PSRR is the maximum change in the full-scale transition point due to a change in power supply voltage from the nominal value (see Figure 4).
Thermal Hysteresis
Thermal hysteresis is defined as the absolute maximum change of reference output voltage after the device is cycled through temperature from either
T_HYS+ = +25°C to T
to +25°C
MAX
or
T_HYS− = +25°C to T
to +25°C
MIN
It is expressed in ppm by
°
=
)( ×
ppmV
HYS
REFREF
°
V
REF
)C25(
)_()C25(
HYSTVV
10
6
where:
V
(25°C) is V
REF
(T_HYS) is the maximum change of V
V
REF
at 25°C.
REF
at T_HYS+ or
REF
T_HYS−.
Rev. B | Page 12 of 28
Page 13
AD7266
V
V

THEORY OF OPERATION

CIRCUIT INFORMATION

The AD7266 is a fast, micropower, dual, 12-bit, single-supply, ADC that operates from a 2.7 V to a 5.25 V supply. When operated from a 5 V supply, the AD7266 is capable of throughput rates of 2 MSPS when provided with a 32 MHz clock, and a throughput rate of 1.5 MSPS at 3 V.
The AD7266 contains two on-chip, differential track-and-hold amplifiers, two successive approximation ADCs, and a serial interface with two separate data output pins. It is housed in a 32-lead LFCSP or a 32-lead TQFP, offering the user considerable space-saving advantages over alternative solutions. The serial clock input accesses data from the part but also provides the clock source for each successive approximation ADC. The analog input range for the part can be selected to be a 0 V to V
input or a 2 × V
REF
input, configured with either single-
REF
ended or differential analog inputs. The AD7266 has an on-chip
2.5 V reference that can be overdriven when an external reference is preferred. If the internal reference is to be used elsewhere in a system, then the output needs to buffered first.
The AD7266 also features power-down options to allow power saving between conversions. The power-down feature is implemented via the standard serial interface, as described in the Modes of Operation section.

CONVERTER OPERATION

The AD7266 has two successive approximation ADCs, each based around two capacitive DACs. Figure 16 and Figure 17 show simplified schematics of one of these ADCs in acquisition and conversion phase, respectively. The ADC is comprised of control logic, a SAR, and two capacitive DACs. In Figure 16 (the acquisition phase), SW3 is closed, SW1 and SW2 are in Position A, the comparator is held in a balanced condition, and the sampling capacitor arrays acquire the differential signal on the input.
CAPACITIVE
DAC
C
B
V
IN+
A
A
V
IN–
B
V
S
SW1
C
S
SW2
REF
Figure 16. ADC Acquisition Phase
COMPARATOR
SW3
CONTROL
LOGIC
CAPACITIVE
DAC
04603-013
When the ADC starts a conversion (see Figure 17), SW3 opens and SW1 and SW2 move to Position B, causing the comparator to become unbalanced. Both inputs are disconnected once the conversion begins. The control logic and the charge redistribu­tion DACs are used to add and subtract fixed amounts of charge from the sampling capacitor arrays to bring the comparator back into a balanced condition. When the comparator is rebalanced, the conversion is complete. The control logic generates the ADC output code. The output impedances of the sources driving the V
IN+
and V
pins must be matched;
IN−
otherwise, the two inputs will have different settling times, resulting in errors.
CAPACITIVE
DAC
C
B
IN+
A
A
IN–
B
V
S
SW1
C
S
SW2
REF
Figure 17. ADC Conversion Phase
COMPARATOR
SW3
CONTROL
LOGIC
CAPACITIVE
DAC
04603-014

ANALOG INPUT STRUCTURE

Figure 18 shows the equivalent circuit of the analog input structure of the AD7266 in differential/pseudo differential mode. In single-ended mode, V The four diodes provide ESD protection for the analog inputs. Care must be taken to ensure that the analog input signals never exceed the supply rails by more than 300 mV. This causes these diodes to become forward-biased and starts conducting into the substrate. These diodes can conduct up to 10 mA without causing irreversible damage to the part.
The C1 capacitors in Figure 18 are typically 4 pF and can primarily be attributed to pin capacitance. The resistors are lumped components made up of the on resistance of the switches. The value of these resistors is typically about 100 Ω. The C2 capacitors are the ADC’s sampling capacitors with a capacitance of 45 pF typically.
For ac applications, removing high frequency components from the analog input signal is recommended by the use of an RC low-pass filter on the relevant analog input pins with optimum values of 47 Ω and 10 pF. In applications where harmonic dis­tortion and signal-to-noise ratio are critical, the analog input should be driven from a low impedance source. Large source impedances significantly affect the ac performance of the ADC and may necessitate the use of an input buffer amplifier. The choice of the op amp is a function of the particular application.
is internally tied to AGND.
IN−
Rev. B | Page 13 of 28
Page 14
AD7266
V
V
IN+
V
IN–
V
DD
D
C1
C1
D
V
DD
D
D
C2
R1
C2
R1
04603-015
Figure 18. Equivalent Analog Input Circuit,
Conversion Phase—Switches Open, Track Phase—Switches Closed
When no amplifier is used to drive the analog input, the source impedance should be limited to low values. The maximum source impedance depends on the amount of THD that can be toler­ated. The THD increases as the source impedance increases and performance degrades. Figure 19 shows a graph of the THD vs. the analog input signal frequency for different source impedances in single-ended mode, while Figure 20 shows the THD vs. the analog input signal frequency for different source impedances in differential mode.
50
F
= 1.5MSPS
SAMPLE
V
= 3V
DD
–55
–60
–65
–70
THD (dB)
–75
–80
–85
–90
RANGE = 0V TO V
REF
R
SOURCE
R
= 10
SOURCE
INPUT F REQUE NCY (kHz)
Figure 19. THD vs. Analog Input Frequency for Various
Source Impedances, Single-Ended Mode
60
F
= 1.5MSPS
SAMPLE
V
= 3V
DD
–65
–70
–75
THD (dB)
–80
–85
–90
RANGE = 0V TO V
R
REF
= 0
SOURCE
R
= 10
SOURCE
INPUT F REQUE NCY (kHz)
Figure 20. THD vs. Analog Input Frequency for
Various Source Impedances, Differential Mode
R
SOURCE
= 100
= 47
R
SOURCE
R
R
R
SOURCE
R
SOURCE
SOURCE
600 700 800 900 10000 200100 400300 500
= 300
SOURCE
= 47
= 0
6000 200100 400300 500
04603-016
= 300
= 100
04603-017
Rev. B | Page 14 of 28
Figure 21 shows a graph of the THD vs. the analog input frequency for various supplies while sampling at 2 MSPS. In this case, the source impedance is 47 Ω.
–50
F
= 1.5MSPS/2MSPS
SAMPLE
V
= 3V/5V
DD
–55
–60
–65
–70
THD (dB)
–75
–80
–85
–90
RANGE = 0 TO V
REF
V
= 3V
DD
DIFFERENTIAL MODE
V
= 5V
DD

SINGLE-ENDED MODE

INPUT FREQUENCY (kHz)
VDD = 3V SINGLE-ENDED MODE
V
= 5V
DD
DIFFERENTIAL MODE
600 700 800 900 10000 200100 400300 500
04603-018
Figure 21. THD vs. Analog Input Frequency for Various Supply Voltages

ANALOG INPUTS

The AD7266 has a total of 12 analog inputs. Each on-board ADC has six analog inputs that can be configured as six single­ended channels, three pseudo differential channels, or three fully differential channels. These may be selected as described in the Analog Input Selection section.
Single-Ended Mode
The AD7266 can have a total of 12 single-ended analog input channels. In applications where the signal source has high impedance, it is recommended to buffer the analog input before applying it to the ADC. The analog input range can be programmed to be either 0 to V
If the analog input signal to be sampled is bipolar, the internal reference of the ADC can be used to externally bias up this signal to make it correctly formatted for the ADC. Figure 22 shows a typical connection diagram when operating the ADC in single-ended mode.
+1.25V
0V
–1.25V
V
IN
Figure 22. Single-Ended Mode Connection Diagram
R
3R
R
1
ADDITIONAL PI NS OMIT TED FOR CL ARITY.
or 0 to 2 × V
REF
+2.5
R
0V
.
REF
AD7266
A/D
CAP
0.47µF
1
B
04603-019
V
A1
D
V
CAP
B6
Page 15
AD7266

Differential Mode

The AD7266 can have a total of six differential analog input pairs.
Differential signals have some benefits over single-ended signals, including noise immunity based on the device’s common-mode rejection and improvements in distortion performance. Figure 23 defines the fully differential analog input of the AD7266.
p-p
p-p
V
IN+
AD7266
V
IN–
1
04603-020
V
REF
COMMON
MODE
VOLTAGE
V
REF
1
ADDITIONAL PINS OMITTED FOR CLARITY.
Figure 23. Differential Input Definition
The amplitude of the differential signal is the difference
IN+
and V
IN+
and V
between the signals applied to the V differential pair (V
IN+
− V
IN−
). V simultaneously driven by two signals each of amplitude V (or 2 × V
, depending on the range chosen) that are 180° out
REF
IN−
should be
IN−
pins in each
REF
of phase. The amplitude of the differential signal is, therefore (assuming the 0 to V to-peak (2 × V
), regardless of the common mode (CM).
REF
range is selected) −V
REF
REF
to +V
REF
peak-
The common mode is the average of the two signals
+ V
(V
IN+
IN−
)/2
and is, therefore, the voltage on which the two inputs are centered.
This results in the span of each input being CM ± V
/2. This
REF
voltage has to be set up externally and its range varies with the reference value, V
. As the value of V
REF
increases, the common-
REF
mode range decreases. When driving the inputs with an amplifier, the actual common-mode range is determined by the amplifier’s output voltage swing.
Figure 24 and Figure 25 show how the common-mode range typically varies with V V
range or 2 × V
REF
for a 5 V power supply using the 0 to
REF
range, respectively. The common mode
REF
must be in this range to guarantee the functionality of the AD7266.
When a conversion takes place, the common mode is rejected, resulting in a virtually noise free signal of amplitude −V
corresponding to the digital codes of 0 to 4096. If the
+V
REF
2 × V from −2 V
range is used, then the input signal amplitude extends
REF
to +2 V
REF
after conversion.
REF
REF
to
3.5 TA = 25°C
3.0
2.5
2.0
1.5
1.0
COMMON-MO DE RANGE (V)
0.5
0
V
(V)
REF
Figure 24. Input Common-Mode Range vs. V
5.0 TA = 25°C
4.5
4.0
3.5
3.0
2.5
2.0
1.5
COMMON-MODE RANGE (V)
1.0
0.5
0
V
(V)
REF
Figure 25. Input Common-Mode Range vs. V
REF
REF
(0 to V
(2 × V
REF
REF
5.00 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
04603-021
Range, VDD = 5 V)
2.50 0.5 1.0 1.5 2.0
04603-022
Range, VDD = 5 V)

Driving Differential Inputs

Differential operation requires that V
IN+
and V
IN−
be simultaneously driven with two equal signals that are 180° out of phase. The common mode must be set up externally. The common-mode range is determined by V
, the power supply,
REF
and the particular amplifier used to drive the analog inputs. Differential modes of operation with either an ac or dc input provide the best THD performance over a wide frequency range. Because not all applications have a signal preconditioned for differential operation, there is often a need to perform single-ended-to-differential conversion.
Rev. B | Page 15 of 28
Page 16
AD7266

Using an Op Amp Pair

An op amp pair can be used to directly couple a differential signal to one of the analog input pairs of the AD7266. The circuit configurations illustrated in Figure 26 and Figure 27 show how a dual op amp can be used to convert a single-ended signal into a differential signal for both a bipolar and unipolar input signal, respectively.
The voltage applied to Point A sets up the common-mode voltage. In both diagrams, it is connected in some way to the reference, but any value in the common-mode range can be input here to set up the common mode. The AD8022 is a suitable dual op amp that can be used in this configuration to provide differential drive to the AD7266.
Take care when choosing the op amp; the selection depends on the required power supply and system performance objectives. The driver circuits in Figure 26 and Figure 27 are optimized for dc coupling applications requiring best distortion performance.
The circuit configuration shown in Figure 26 converts a unipolar, single-ended signal into a differential signal.
The differential op amp driver circuit shown in Figure 27 is configured to convert and level shift a single-ended, ground­referenced (bipolar) signal to a differential signal centered at the
level of the ADC.
V
REF
p-p
V
REF
GND
2 × V
REF
440
220
V+
27
V–
220 220
V+
27
A
V–
10k
1
ADDITIONAL PINS OMITTE D FOR CLARITY.
Figure 26. Dual Op Amp Circuit to Convert a Single-Ended Unipolar Signal
into a Differential Signal
2 × V
GND
REF
p-p
220k
440
20k
220
V+
27
V–
220 220
V+
27
A
V–
10k
1
ADDITIO NAL PINS O MITT ED FOR CL ARITY.
Figure 27. Dual Op Amp Circuit to Convert a Single-Ended Bipolar Signal
into a Differential Unipolar Signal
3.75V
2.5V
1.25V
3.75V
2.5V
1.25V
3.75V
2.5V
1.25V
3.75V
2.5V
1.25V
AD7266
A/D
CAP
CAP
0.47µF
AD7266
A/D
CAP
0.47µF
1
B
1
B
V
IN+
D
V
IN–
V
IN+
D
V
CAP
IN–
Rev. B | Page 16 of 28
04603-023
04603-024

Pseudo Differential Mode

The AD7266 can have a total of six pseudo differential pairs. In this mode, V an amplitude of V
is connected to the signal source that must have
IN+
(or 2 × V
REF
, depending on the range
REF
chosen) to make use of the full dynamic range of the part. A dc input is applied to the V provides an offset from ground or a pseudo ground for the V
pin. The voltage applied to this input
IN−
IN+
input. The benefit of pseudo differential inputs is that they separate the analog input signal ground from the ADC’s ground allowing dc common-mode voltages to be cancelled. The typical voltage range for the V
pin, while in pseudo differential
IN−
mode, is shown in Figure 28 and Figure 29. Figure 30 shows a connection diagram for pseudo differential mode.
1.0
0.8
0.6
0.4
(V)
IN–
0.2
V
0
–0.2
–0.4
V
(V)
REF
Figure 28. V
Input Voltage Range vs. V
IN−-
Pseudo Differential Mode with V
2.5 TA = 25°C
2.0
1.5
1.0
(V)
IN–
V
0.5
0
–0.5
V
(V)
REF
Figure 29. V
Input Voltage Range vs. V
IN−
Pseudo Differential Mode with V
V
REF
p–p
DC INPUT VOLTAGE
1
ADDITIO NAL PINS O MITTE D FOR CLARI TY.
V
V
Figure 30. Pseudo Differential Mode Connection Diagram
IN+
IN–
V
DD
DD
REF
TA = 25°C
REF
= 3 V
REF
= 5 V
AD7266
0.47µF
in
in
3.00 0.5 1.0 1.5 2.0 2.5
04603-043
5.00 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
04603-044
1
04603-025
Page 17
AD7266

ANALOG INPUT SELECTION

The analog inputs of the AD7266 can be configured as single­ended or true differential via the SGL/ in . If this pin is tied to a logic low, the analog input
Figure 31 channels to each on-chip ADC are set up as three true differential pairs. If this pin is at logic high, the analog input channels to each on-chip ADC are set up as six single-ended analog inputs. The required logic level on this pin needs to be established prior to the acquisition time and remain unchanged during the conversion time until the track-and-hold has returned to track. The track-and-hold returns to track on the 13
CS
edge of SCLK after the
falling edge (see ). If the level on this pin is changed, it will be recognized by the AD7266; therefore, it is necessary to keep the same logic level during acquisition and conversion to avoid corrupting the conversion in progress.
For example, in Figure 31 the SGL/ for the duration of both the acquisition and conversion times so the analog inputs are configured as single ended for that conversion (Sampling Point A). The logic level of the SGL/ changed to low after the track-and-hold returned to track and prior to the required acquisition time for the next sampling instant at Point B; therefore, the analog inputs are configured as differential for that conversion.
A
t
CS
SCLK
SGL/DIFF
Figure 31. Selecting Differential or Single-Ended Configuration
ACQ
114 141
DIFF
logic pin, as shown
Figure 41
DIFF
pin is set at logic high
B
th
rising
DIFF
04603-026
The channels used for simultaneous conversions are selected via the multiplexer address input pins, A0 to A2. The logic states of these pins also need to be established prior to the acquisition time; however, they may change during the conversion time provided the mode is not changed. If the mode is changed from fully differential to pseudo differential, for example, then the acquisition time would start again from this point. The selected input channels are decoded as shown in Tab le 6 .
The analog input range of the AD7266 can be selected as 0 V to V
or 0 V to 2 × V
REF
made in a similar fashion to that of the SGL/ the logic state of the RANGE pin a time t
CS
edge of
. Subsequent to this, the logic level on this pin can be
via the RANGE pin. This selection is
REF
DIFF
pin by setting
prior to the falling
acq
altered after the third falling edge of SCLK. If this pin is tied to a logic low, the analog input range selected is 0 V to V
. If this
REF
pin is tied to a logic high, the analog input range selected is 0 V to 2 × V
REF
.

OUTPUT CODING

The AD7266 output coding is set to either twos complement or straight binary, depending on which analog input configuration is selected for a conversion. Tab l e 5 shows which output coding scheme is used for each possible analog input configuration.
Table 5. AD7266 Output Coding
DIFF
SGL/
DIFF DIFF 0 V to 2 × V SGL 0 V to V SGL 0 V to 2 × V PSEUDO DIFF 0 V to V PSEUDO DIFF
Range Output Coding
0 V to V
REF
REF
REF
0 V to 2 × V
REF
Straight binary
REF
Straight binary
REF
Twos complement
Twos complement
Twos complement
Twos complement
Table 6. Analog Input Type and Channel Selection
ADC A ADC B
SGL/
DIFF
V
A2 A1 A0
IN+
V
IN−
IN+
V
Comment
IN−
V
1 0 0 0 VA1 AGND VB1 AGND Single ended 1 0 0 1 VA2 AGND VB2 AGND Single ended 1 0 1 0 VA3 AGND VB3 AGND Single ended 1 0 1 1 VA4 AGND VB4 AGND Single ended 1 1 0 0 VA5 AGND VB5 AGND Single ended 1 1 0 1 VA6 AGND VB6 AGND Single ended 0 0 0 0 VA1 0 0 0 1 VA1 VA2 V 0 0 1 0 VA3 VA4 V 0 0 1 1 VA3 VA4 V 0 1 0 0 VA5 VA6 V 0 1 0 1 VA5 V
VA2 V
V
A6
VB2 Fully differential
B1
V
B1
VB4 Fully differential
B3
V
B3
VB6 Fully differential
B5
V
B5
Pseudo differential
B2
Pseudo differential
B4
Pseudo differential
B6
Rev. B | Page 17 of 28
Page 18
AD7266

TRANSFER FUNCTIONS

The designed code transitions occur at successive integer LSB values (1 LSB, 2 LSB, and so on). In single-ended mode, the LSB size is V LSB size is 2 × V In differential mode, the LSB size is 2 × V to V 0 V to 2 × V for the AD7266 when straight binary coding is output is shown in Figure 32, and the ideal transfer characteristic for the AD7266 when twos complement coding is output is shown in Figure 33 (this is shown with the 2 × V
/4096 when the 0 V to V
REF
/4096 when the 0 V to 2 × V
REF
range is used, and the LSB size is 4 × V
REF
range is used. The ideal transfer characteristic
REF
111...111
111...110
111...000
011...111
ADC CODE
000...010
000...001
000...000
1LSB
0V
range is used, and the
REF
1LSB = V
ANALOG INPUT
range is used.
REF
/4096 when the 0 V
REF
/4096 when the
REF
range).
REF
/4096
REF
V
– 1LSB
REF

DIGITAL INPUTS

The digital inputs applied to the AD7266 are not limited by the maximum ratings that limit the analog inputs. Instead, the digital inputs can be applied up to 7 V and are not restricted by the V
+ 0.3 V limit as are the analog inputs. See the Absolute
DD
Maximum Ratings section for more information. Another advantage of the SCLK, RANGE, A0 to A2, and being restricted by the V
+ 0.3 V limit is that power supply
DD
sequencing issues are avoided. If one of these digital inputs is applied before V
, there is no risk of latch-up, as there would
DD
be on the analog inputs if a signal greater than 0.3 V were applied prior to V
V
DRIVE
The AD7266 also has a V which the serial interface operates. V
DD
.
feature to control the voltage at
DRIVE
DRIVE
easily interface to both 3 V and 5 V processors. For example, if the AD7266 was operated with a V
of 5 V, the V
DD
could be powered from a 3 V supply, allowing a large dynamic range with low voltage digital processors. Therefore, the AD7266 could be used with the 2 × V
REF
of 5 V while still being able to interface to 3 V digital parts.
CS
pins not
allows the ADC to
pin
DRIVE
input range, with a VDD
NOTE
1. V
IS EITHER V
REF
REF
OR 2 × V
REF
.
Figure 32. Straight Binary Transfer Characteristic
1LSB = 2
×
V
/4096
REF
011...111
011...110
000...001
000...000
111...111
ADC CODE
100...010
100...001
100...000 + 1LSB V
REF
– 1LSB
REF
ANALOG INPUT
– 1 LSB–V
+V
REF
Figure 33. Twos Complement Transfer Characteristic with
V
± V
Input Range
REF
REF
04603-027
04603-028
Rev. B | Page 18 of 28
Page 19
AD7266

MODES OF OPERATION

The mode of operation of the AD7266 is selected by controlling the (logic) state of the
signal during a conversion. There are
CS
three possible modes of operation: normal mode, partial power­down mode, and full power-down mode. After a conversion is
CS
initiated, the point at which
is pulled high determines which power-down mode, if any, the device enters. Similarly, if already in a power-down mode,
can control whether the device
CS
returns to normal operation or remains in power-down. These modes of operation are designed to provide flexible power management options. These options can be chosen to optimize the power dissipation/throughput rate ratio for differing application requirements.

NORMAL MODE

This mode is intended for applications needing fastest throughput rates because the user does not have to worry about any power­up times with the AD7266 remaining fully powered at all times. Figure 34 shows the general diagram of the operation of the AD7266 in this mode.
CS
110 14
SCLK
A
D
OUT
D
B
OUT
The conversion is initiated on the falling edge of CS, as described in the section. To ensure that the part remains fully powered up at all times, at least 10 SCLK falling edges have elapsed after the falling edge
CS
of
. If CS is brought high any time after the 10th SCLK falling edge but before the 14 powered up, but the conversion is terminated and D
B go back into three-state. Fourteen serial clock cycles are
D
OUT
required to complete the conversion and access the conversion result. The D SCLK cycles have elapsed, but instead does so when
brought high again. If (for example, if only a 16 SCLK burst is available), two trailing zeros are clocked out after the data. If 14 (or16) SCLK cycles, the result from the other ADC on board is also accessed on the same D (see the section).
Serial Interface
Once 32 SCLK cycles have elapsed, the D three-state on the 32 prior to this, the D Therefore, brought high again sometime prior to the next conversion (effectively idling returns to three-state upon completion of the dual result read.
LEADING ZEROS + CONVERSION RESULT
Figure 34. Normal Mode Operation
Serial Interface
CS
must remain low until
th
SCLK falling edge, the part remains
line does not return to three-state after 14
OUT
CS
is left low for another 2 SCLK cycles
CS
is left low for a further
line, as shown in
OUT
line returns to
nd
SCLK falling edge. If CS is brought high
line returns to three-state at that point.
OUT
CS
may idle low after 32 SCLK cycles until it is
CS
low), if so desired, because the bus still
OUT
A and
OUT
CS
is
Figure 42
04603-029
Once a data transfer is complete and D returned to three-state, another conversion can be initiated after the quiet time, t
, has elapsed by bringing CS low again
QUIET
(assuming the required acquisition time is allowed).

PARTIAL POWER-DOWN MODE

This mode is intended for use in applications where slower throughput rates are required. Either the ADC is powered down between each conversion, or a series of conversions may be performed at a high throughput rate, and the ADC is then powered down for a relatively long duration between these bursts of several conversions. When the AD7266 is in partial power-down, all analog circuitry is powered down except for the on-chip reference and reference buffer.
To enter partial power-down mode, the conversion process must be interrupted by bringing second falling edge of SCLK and before the 10 SCLK, as shown in . Once Figure 35 window of SCLKs, the part enters partial power-down, the conversion that was initiated by the falling edge of terminated, and D CS
is brought high before the second SCLK falling edge, the
A and D
OUT
part remains in normal mode and does not power down. This avoids accidental power-down due to glitches on the
CS
SCLK
D
OUT
D
OUT
A B
1110 42
Figure 35. Entering Partial Power-Down Mode
To exit this mode of operation and power up the AD7266 again, a dummy conversion is performed. On the falling edge of the device begins to power up and continues to power up as
CS
long as
is held low until after the falling edge of the 10th SCLK. The device is fully powered up after approximately 1 μs has elapsed, and valid data results from the next conversion, as shown in . If Figure 36
CS
falling edge of SCLK, the AD7266 again goes into partial power-down. This avoids accidental power-up due to glitches
CS
on the the falling edge of of and
line. Although the device may begin to power up on
CS
, it powers down again on the rising edge
CS
. If the AD7266 is already in partial power-down mode
CS
is brought high between the second and 10th falling
edges of SCLK, the device enters full power-down mode.
CS
B go back into three-state. If
OUT
is brought high before the second
OUT
A and D
OUT
B have
high anywhere after the
th
falling edge of
CS
is brought high in this
CS
is
CS
line.
THREE-STATE
CS
,
04603-030
Rev. B | Page 19 of 28
Page 20
AD7266
CS

FULL POWER-DOWN MODE

This mode is intended for use in applications where throughput rates slower than those in the partial power-down mode are required, as power-up from a full power-down takes substan­tially longer than that from partial power-down. This mode is more suited to applications where a series of conversions performed at a relatively high throughput rate are followed by a long period of inactivity and thus power-down. When the AD7266 is in full power-down, all analog circuitry is powered down. Full power-down is entered in a similar way as partial power-down, except the timing sequence shown in Figure 35 must be executed twice. The conversion process must be interrupted in a similar fashion by bringing after the second falling edge of SCLK and before the 10 edge of SCLK. The device enters partial power-down at this point. To reach full power-down, the next conversion cycle must be interrupted in the same way, as shown in .
CS
Once
is brought high in this window of SCLKs, the part
completely powers down.
THE PART BEGINS
TO POWER UP.
CS
CS
high anywhere
Figure 37
t
POWER-UP1
th
falling
Note that it is not necessary to complete the 14 SCLKs once is brought high to enter a power-down mode.
To exit full power-down and power up the AD7266, a dummy conversion is performed, as when powering up from partial power-down. On the falling edge of
power up and continues to power up, as long as until after the falling edge of the 10
CS
, the device begins to
CS
th
SCLK. The required
is held low
power-up time must elapse before a conversion can be initiated, as shown in . See the section for the
Figure 38 Power-Up Times
power-up times associated with the AD7266.
THE PART IS FULLY POWERED UP; SEE POWER-UP TIMES SECTION.
SCLK
D
OUT
D
OUT
A
B
11014 141
INVALID DATA
VALID DATA
04603-031
Figure 36. Exiting Partial Power-Down Mode
THE PART BEGINS
TO POWER UP.
1102
THE PART ENTERS
FULL POWER DOWN.
INVALID DATAINVALID DATA
THREE-STATE
14
04603-032
SCLK
D
OUT
D
OUT
CS
THE PART ENTERS
PARTIAL POWER DOWN.
110142
A
B
THREE-STATE
Figure 37. Entering Full Power-Down Mode
Rev. B | Page 20 of 28
Page 21
AD7266
THE PART BEGINS
SCLK
D
OUT
D
OUT
TO POWER UP.
CS
1
A
B
t
POWER-UP2
10
INVALID DATA VALID DATA
Figure 38. Exiting Full Power-Down Mode

POWER-UP TIMES

As described in detail, the AD7266 has two power-down modes, partial power-down and full power-down. This section deals with the power-up time required when coming out of either of these modes. It should be noted that the power-up times, as explained in this section, apply with the recommended capacitors in place on the D
A and D
CAP
CAP
B pins.
To power up from full power-down, approximately 1.5 ms
CS
should be allowed from the falling edge of t
POWER-UP2
in . Powering up from partial power-down
Figure 38
, shown as
requires much less time. The power-up time from partial power-down is typically 1 μs; however, if using the internal reference, then the AD7266 must be in partial power-down for at least 67 μs in order for this power-up time to apply.
When power supplies are first applied to the AD7266, the ADC may power up in either of the power-down modes or normal mode. Because of this, it is best to allow a dummy cycle to elapse to ensure the part is fully powered up before attempting a valid conversion. Likewise, if it is intended to keep the part in the partial power-down mode immediately after the supplies are applied, then two dummy cycles must be initiated. The first dummy cycle must hold
edge (see ); in the second cycle, Figure 34 high before the 10 falling edge (see ). Alternatively, if it is intended to
Figure 35
CS
low until after the 10th SCLK falling
CS
th
SCLK edge but after the second SCLK
must be brought
place the part in full power-down mode when the supplies are applied, then three dummy cycles must be initiated. The first dummy cycle must hold edge (see ); the second and third dummy cycles place
Figure 34
the part in full power-down (see ).
CS
low until after the 10th SCLK falling
Figure 37
Once supplies are applied to the AD7266, enough time must be allowed for any external reference to power up and charge the various reference buffer decoupling capacitors to their final values.

POWER vs. THROUGHPUT RATE

The power consumption of the AD7266 varies with the throughput rate. When using very slow throughput rates and as fast an SCLK frequency as possible, the various power-down options can be used to make significant power savings. However, the AD7266 quiescent current is low enough that
THE PART IS FULLY POWERED UP, SEE POWER-UP TIMES SECTION.
14
1
14
04603-033
even without using the power-down options, there is a noticeable variation in power consumption with sampling rate. This is true whether a fixed SCLK value is used or if it is scaled with the sampling rate. Figure 39 and Figure 40 show plots of power vs. the throughput rate when operating in normal mode for a fixed maximum SCLK frequency and an SCLK frequency that scales with the sampling rate with V
= 3 V and VDD = 5 V,
DD
respectively. In all cases, the internal reference was used.
10.0 = 25°C
T
A
9.5
9.0
8.5
8.0
7.5
7.0
POWER (mW)
6.5
6.0
5.5
5.0
Figure 39. Power vs. Throughput in Normal Mode with V
30
T
= 25°C
A
28
26
24
22
20
18
POWER (mW)
16
14
12
10
Figure 40. Power vs. Throughput in Normal Mode with V
VARIABLE SCLK
24MHz SCLK
THROUGHPUT (kSPS)
VARIABLE SCLK
32MHz SCLK
THROUGHPUT (kSPS)
14000 200 400 600 800 1000 1200
DD
DD
= 3 V
20000 200 400 600 800 1000 1200 1400 1600 1800
= 5 V
04603-045
04603-046
Rev. B | Page 21 of 28
Page 22
AD7266

SERIAL INTERFACE

Figure 41 shows the detailed timing diagram for serial inter­facing to the AD7266. The serial clock provides the conversion clock and controls the transfer of information from the AD7266 during conversion.
CS
signal initiates the data transfer and conversion process.
The The falling edge of
CS
puts the track-and-hold into hold mode, at which point the analog input is sampled and the bus is taken out of three-state. The conversion is also initiated at this point and requires a minimum of 14 SCLKs to complete. Once 13 SCLK falling edges have elapsed, the track-and-hold goes back into track on the next SCLK rising edge, as shown in
Figure 41 at Point B. If a 16 SCLK transfer is used, then two trailing zeros appear after the final LSB. On the rising edge of conversion is terminated and D
CS
three-state. If
is not brought high but is instead held low for a further 14 (or 16) SCLK cycles on D Conversion B is output on D
CS
Likewise, if on D
OUT
is illustrated in where the case for D this case, the D
nd
SCLK falling edge or the rising edge of
32
is held low for a further 14 (or 16) SCLK cycles
B, the data from Conversion A is output on D
Figure 42
line in use goes back into three-state on the
OUT
A and D
OUT
A, the data from
OUT
A (followed by two trailing zeros).
OUT
CS
, the
B go back into
OUT
A is shown. In
OUT
CS
, whichever
OUT
B. This
occurs first.
A minimum of 14 serial clock cycles are required to perform the conversion process and to access data from one conversion
CS
on either data line of the AD7266.
going low provides the leading zero to be read in by the microcontroller or DSP. The remaining data is then clocked out by subsequent SCLK falling edges, beginning with a second leading zero. Thus, the first falling clock edge on the serial clock has the leading zero provided and also clocks out the second leading zero. The 12-bit result then follows with the final bit in the data transfer valid on
th
the 14
falling edge, having being clocked out on the previous
th
) falling edge. In applications with a slower SCLK, it may be
(13 possible to read in data on each SCLK rising edge depending on the SCLK frequency. The first rising edge of SCLK after the
CS
falling edge would have the second leading zero provided, and
th
the 13
rising SCLK edge would have DB0 provided.
Note that with fast SCLK values, and thus short SCLK periods, in order to allow adequately for t
, an SCLK rising edge may
2
occur before the first SCLK falling edge. This rising edge of SCLK may be ignored for the purposes of the timing descriptions in this section. If a falling edge of SCLK is coincident with the falling edge of
CS
, then this falling edge of SCLK is not acknowledged by the AD7266, and the next falling edge of SCLK will be the first registered after the falling edge of
CS
.
CS
t
9
SCLK
D
OUT
D
OUT
A B
THREE­STATE
2 LEADING ZEROS
t
2
2
DB11
34
DB10
1
t
3
0
0
t
6
5
t
7
t
4
DB9 DB8
DB2
B
13
t
5
DB1
t
8
DB0
t
QUIET
THREE-STATE
04603-034
Figure 41. Serial Interface Timing Diagram
CS
t
6
5
14
t
5
t
4
A
t
7
2 TRAILING ZEROS
15
16
17
ZEROZERO ZERO
2 LEADING ZEROS
Line with 32 SCLKs
OUT
DB11
32
t
10
B
ZERO ZERO
2 TRAILING ZEROS
THREE­STATE
04603-035
SCLK
D
OUT
A
THREE­STATE
t
2
1
t
3
ZERO0 ZERO
2 LEADING
ZEROS
2
DB11
A
34
DB10ADB9
Figure 42. Reading Data from Both ADCs on One D
Rev. B | Page 22 of 28
Page 23
AD7266

MICROPROCESSOR INTERFACING

The serial interface on the AD7266 allows the part to be directly connected to a range of many different microprocessors. This section explains how to interface the AD7266 with some of the more common microcontroller and DSP serial interface protocols.

AD7266 TO ADSP-218x

The ADSP-218x family of DSPs interface directly to the AD7266 without any glue logic required. The V AD7266 takes the same supply voltage as that of the ADSP-218x. This allows the ADC to operate at a higher supply voltage than its serial interface and therefore, the ADSP-218x, if necessary. This example shows both D
A and D
OUT
B of the AD7266
OUT
connected to both serial ports of the ADSP-218x. The SPORT0 and SPORT1 control registers should be set up as shown in Tabl e 7 and Ta b le 8 .
Table 7. SPORT0 Control Register Setup
Setting Description
TFSW = RFSW = 1 Alternate framing INVRFS = INVTFS = 1 Active low frame signal DTYPE = 00 Right justify data SLEN = 1111
16-bit data-word (or may be set to
1101 for 14-bit data-word) ISCLK = 1 Internal serial clock TFSR = RFSR = 1 Frame every word IRFS = 0 ITFS = 1
Table 8. SPORT1 Control Register Setup
Setting Description
TFSW = RFSW = 1 Alternate framing INVRFS = INVTFS = 1 Active low frame signal DTYPE = 00 Right justify data SLEN = 1111
16-bit data-word (or may be set to
1101 for 14-bit data-word) ISCLK = 0 External serial clock TFSR = RFSR = 1 Frame every word IRFS = 0 ITFS = 1
To implement the power-down modes, SLEN should be set to 1001 to issue an 8-bit SCLK burst.
DRIVE
pin of the
The connection diagram is shown in Figure 43. The ADSP-218x has the TFS0 and RFS0 of the SPORT0 and the RFS1 of SPORT1 tied together. TFS0 is set as an output, and both RFS0 and RFS1 are set as inputs. The DSP operates in alternate framing mode, and the SPORT control register is set up as described. The frame synchronization signal generated on the TFS is tied to CS
, and as with all signal processing applications, equidistant sampling is necessary. However, in this example, the timer interrupt is used to control the sampling rate of the ADC and, under certain conditions, equidistant sampling may not be achieved.
AD7266
1
ADDITIONAL PINS OMI TTED FO R CLARITY.
1
SCLK
CS
D
A
OUT
D
B DR1
OUT
V
DRIVE
Figure 43. Interfacing the AD7266 to the ADSP-218x
ADSP-218x
SCLK0
SCLK1
TFS0
RFS0
RFS1
DR0
V
DD
1
04603-036
The timer registers are loaded with a value that provides an interrupt at the required sample interval. When an interrupt is received, a value is transmitted with TFS/DT (ADC control word). The TFS is used to control the RFS, and hence, the reading of data. The frequency of the serial clock is set in the SCLKDIV register. When the instruction to transmit with TFS is given (AX0 = TX0), the state of the SCLK is checked. The DSP waits until the SCLK has gone high, low, and high again before transmission starts. If the timer and SCLK values are chosen such that the instruction to transmit occurs on or near the rising edge of SCLK, then the data may be transmitted or it may wait until the next clock edge.
For example, the ADSP-2111 has a master clock frequency of 16 MHz. If the SCLKDIV register is loaded with the value 3, then an SCLK of 2 MHz is obtained, and eight master clock periods will elapse for every one SCLK period. If the timer registers are loaded with the value 803, then 100.5 SCLKs will occur between interrupts and, subsequently, between transmit instructions. This situation yields sampling that is not equidistant as the transmit instruction is occurring on an SCLK edge. If the number of SCLKs between interrupts is a whole integer figure of N, then equidistant sampling will be implemented by the DSP.
Rev. B | Page 23 of 28
Page 24
AD7266

AD7266 TO ADSP-BF53x

The ADSP-BF53x family of DSPs interface directly to the AD7266 without any glue logic required. The availability of secondary receive registers on the serial ports of the Blackfin® DSPs means only one serial port is necessary to read from both D
pins simultaneously. Figure 44 shows both D
OUT
B of the AD7266 connected to Serial Port 0 of the
D
OUT
ADSP-BF53x. The SPORT0 Receive Configuration 1 register and SPORT0 Receive Configuration 2 register should be set up as outlined in Tabl e 9 and Tab l e 1 0 .
1
AD7266
D
A
OUT
SCLK
CS
D
B
OUT
V
DRIVE
1
ADDITIONAL PINS OMITTED FOR CLARITY.
SERIAL
DEVICE A
(PRIMARY)
SERIAL
DEVICE B
(SECONDARY)
Figure 44. Interfacing the AD7266 to the ADSP-BF53x
ADSP-BF53x
SPORT0
DR0PRI
RCLK0
RFS0
DR0SEC
V
DD
Table 9. The SPORT0 Receive Configuration 1 Register (SPORT0_RCR1)
Setting Description
RCKFE = 1 Sample data with falling edge of RSCLK LRFS = 1 Active low frame signal RFSR = 1 Frame every word IRFS = 1 Internal RFS used RLSBIT = 0 Receive MSB first RDTYPE = 00 Zero fill IRCLK = 1 Internal receive clock RSPEN = 1 Receive enabled SLEN = 1111
16-bit data-word (or may be set to 1101 for 14-bit data-word)
TFSR = RFSR = 1
Table 10. The SPORT0 Receive Configuration 2 Register (SPORT0_RCR2)
Setting Description
RXSE = 1 Secondary side enabled SLEN = 1111
16-bit data-word ( or may be set to 1101 for 14-bit data-word)
To implement the power-down modes, SLEN should be set to 1001 to issue an 8-bit SCLK burst. A Blackfin driver for the AD7266 is available to download at www.analog.com.
OUT
A and
1
04603-037
Rev. B | Page 24 of 28

AD7266 TO TMS320C541

The serial interface on the TMS320C541 uses a continuous serial clock and frame synchronization signals to synchronize the data transfer operations with peripheral devices like the AD7266. The TMS320C541 and the AD7266 without any glue logic required. The serial ports of the TMS320C541 are set up to operate in burst mode with internal CLKX0 (TX serial clock on Serial Port 0) and FSX0 (TX frame sync from Serial Port 0). The serial port control registers (SPC) must have the following setup.
Table 11. Serial Port Control Register Set Up
SPC FO FSM MCM TXM
SPC0 0 1 1 1 SPC1 0 1 0 0
The format bit, FO, may be set to 1 to set the word length to 8 bits to implement the power-down modes on the AD7266.
The connection diagram is shown in Figure 45. It is imperative that for signal processing applications, the frame synchroniza­tion signal from the TMS320C541 provides equidistant sampling. The V
DRIVE
that of the TMS320C541. This allows the ADC to operate at a higher voltage than its serial interface and therefore, the TMS320C541, if necessary.
1
ADDITIONAL PINS OMITTED FOR CLARITY.
CS
input allows easy interfacing between the
pin of the AD7266 takes the same supply voltage as
AD7266
1
SCLK
D
A
OUT
D
B
OUT
CS FSX0
V
DRIVE
TMS320C541
CLKX0
CLKR0
CLKX1
CLKR1
DR0
DR1
FSR0
FSR1
V
DD
Figure 45. Interfacing the AD7266 to the TMS320C541
1
04603-038
Page 25
AD7266

AD7266 TO DSP563xx

The connection diagram in Figure 46 shows how the AD7266 can be connected to the ESSI (synchronous serial interface) of the DSP563xx family of DSPs from Motorola. There are two on-board ESSIs, and each is operated in synchronous mode (Bit SYN = 1 in CRB register) with internally generated word length frame sync for both TX and RX (Bit FSL1 = 0 and Bit FSL0 = 0 in CRB).
Normal operation of the ESSI is selected by making MOD = 0 in the CRB. Set the word length to 16 by setting Bit WL1 = 1 and Bit WL0 = 0 in CRA.
To implement the power-down modes on the AD7266, the word length can be changed to 8 bits by setting Bit WL1 = 0 and Bit WL0 = 0 in CRA. The FSP bit in the CRB should be set to 1 so the frame sync is negative. It is imperative for signal processing applications that the frame synchronization signal from the DSP563xx provides equidistant sampling.
In the example shown in Figure 46, the serial clock is taken from the ESSI0 so the SCK0 pin must be set as an output, SCKD = 1, while the SCK1 pin is set as an input, SCKD = 0. The frame sync signal is taken from SC02 on ESSI0, so SCD2 = 1, while on ESSI1, SCD2 = 0; therefore, SC12 is configured as an input. The V
pin of the AD7266 takes the same supply
DRIVE
voltage as that of the DSP563xx. This allows the ADC to operate at a higher voltage than its serial interface and therefore, the DSP563xx, if necessary.
1
AD7266
SCLK
D
A
OUT
B
D
OUT
CS
V
DRIVE
1
ADDITIONAL PINS OMITTED FOR CLARITY.
Figure 46. Interfacing the AD7266 to the DSP563xx
DSP563xx
SCK0
SCK1
SRD0
SRD1
SC02
SC12
V
1
DD
04603-039
Rev. B | Page 25 of 28
Page 26
AD7266

APPLICATION HINTS

GROUNDING AND LAYOUT

The analog and digital supplies to the AD7266 are independent and separately pinned out to minimize coupling between the analog and digital sections of the device. The printed circuit board (PCB) that houses the AD7266 should be designed so that the analog and digital sections are separated and confined to certain areas of the board. This design facilitates the use of ground planes that can be easily separated.
To provide optimum shielding for ground planes, a minimum etch technique is generally best. All three AGND pins of the AD7266 should be sunk in the AGND plane. Digital and analog ground planes should be joined in only one place. If the AD7266 is in a system where multiple devices require an AGND to DGND connection, the connection should still be made at one point only, a star ground point that should be established as close as possible to the ground pins on the AD7266.
Avoid running digital lines under the device as this couples noise onto the die. However, the analog ground plane should be allowed to run under the AD7266 to avoid noise coupling. The power supply lines to the AD7266 should use as large a trace as possible to provide low impedance paths and reduce the effects of glitches on the power supply line.
To avoid radiating noise to other sections of the board, fast switching signals, such as clocks, should be shielded with digital ground, and clock signals should never run near the analog inputs. Avoid crossover of digital and analog signals. To reduce the effects of feedthrough within the board, traces on opposite sides of the board should run at right angles to each other. A microstrip technique is the best method but is not always possible with a double-sided board. In this technique, the component side of the board is dedicated to ground planes, while signals are placed on the solder side.
Good decoupling is also important. All analog supplies should be decoupled with 10 μF tantalum capacitors in parallel with
0.1 μF capacitors to GND. To achieve the best results from these decoupling components, they must be placed as close as possible to the device, ideally right up against the device. The
0.1 μF capacitors should have low effective series resistance (ESR) and effective series inductance (ESI), such as the common ceramic types or surface-mount types. These low ESR and ESI capacitors provide a low impedance path to ground at high frequencies to handle transient currents due to internal logic switching.

PCB DESIGN GUIDELINES FOR LFCSP

The lands on the chip scale package (CP-32-3) are rectangular. The PCB pad for these should be 0.1 mm longer than the package land length, and 0.05 mm wider than the package land width, thereby having a portion of the pad exposed. To ensure that the solder joint size is maximized, the land should be centered on the pad.
The bottom of the chip scale package has a thermal pad. The thermal pad on the PCB should be at least as large as the exposed pad. On the PCB, there should be a clearance of at least
0.25 mm between the thermal pad and the inner edges of the pad pattern to ensure that shorting is avoided.
To improve thermal performance of the package, use thermal vias on the PCB incorporating them in the thermal pad at
1.2 mm pitch grid. The via diameter should be between 0.3 mm and 0.33 mm, and the via barrel should be plated with 1 oz. copper to plug the via. The user should connect the PCB thermal pad to AGND.

EVALUATING THE AD7266 PERFORMANCE

The recommended layout for the AD7266 is outlined in the evaluation board documentation. The evaluation board package includes a fully assembled and tested evaluation board, docu­mentation, and software for controlling the board from the PC via the evaluation board controller. The evaluation board con­troller can be used in conjunction with the AD7266 evaluation board, as well as many other Analog Devices, Inc. evaluation boards ending in the CB designator, to demonstrate/evaluate the ac and dc performance of the AD7266.
The software allows the user to perform ac (fast Fourier transform) and dc (histogram of codes) tests on the AD7266. The software and documentation are on a CD shipped with the evaluation board.
Rev. B | Page 26 of 28
Page 27
AD7266

OUTLINE DIMENSIONS

0.08
32
1
8
9
LEAD PITCH
0.60 MAX
25
24
EXPOSED
PAD
(BOTTOM VIEW)
17
16
3.50 REF
9.00 BSC SQ
PIN 1
TOP VIEW
(PINS DOWN)
0.80
BSC
PIN 1
32
9
FORPROPERCONNECTIONOF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET.
0.45
0.37
0.30
INDICATOR
1
3.25
3.10 SQ
2.95
8
0.25 MIN
25
24
7.00
BSC SQ
17
16
011708-A
PIN 1
INDICATOR
1.00
0.85
0.80
5.00
BSC SQ
TOP
VIEW
12° MAX
SEATING PLANE
1.05
1.00
0.95
0.15
SEATING
0.05
PLANE
VIEW A
ROTATED 90° CCW
0.60 MAX
0.50
4.75
BSC SQ
0.80 MAX
0.65 TYP
0.05 MAX
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
0.02 NOM
0.20 REF
BSC
0.50
0.40
0.30
COPLANARITY
Figure 47. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad (CP-32-2)
Dimensions shown in millimeters
1.20
0.75 MAX
0.60
0.45
0° MIN
0.20
0.09 7°
3.5° 0°
0.08 MAX COPLANARITY
VIEW A
COMPLIANT TO JEDEC STANDARDS MS-026-AB A
020607-A
Figure 48. 32-Lead Thin Quad Flat Package [TQFP]
(SU-32-2)
Dimensions shown in millimeters

ORDERING GUIDE

1, 2, 3
Model
AD7266BCPZ –40°C to +125°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2 AD7266BCPZ-REEL7 –40°C to +125°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2 AD7266BCPZ-REEL –40°C to +125°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2 AD7266BSUZ –40°C to +125°C 32-Lead Thin Quad Flat Package (TQFP) SU-32-2 AD7266BSUZ-REEL7 –40°C to +125°C 32-Lead Thin Quad Flat Package (TQFP) SU-32-2 AD7266BSUZ-REEL –40°C to +125°C 32-Lead Thin Quad Flat Package (TQFP) SU-32-2 EVAL-AD7266EDZ EVAL-CED1Z
1
Z = RoHS Compliant Part.
2
The EVAL-AD7266CB can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL Board for evaluation/demonstration purposes.
3
The EVAL-CED1Z controller board allows a PC to control and communicate with all Analog Devices evaluation boards whose model numbers end in ED.
Temperature Range Package Description Package Option
Evaluation Board Control Board
Rev. B | Page 27 of 28
Page 28
AD7266
NOTES
©2005–2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D04603-0-5/11(B)
Rev. B | Page 28 of 28
Loading...