Datasheet AD5764 Datasheet (ANALOG DEVICES)

Complete Quad, 16-Bit, High Accuracy,

Data Sheet

FEATURES

Complete quad, 16-bit digital-to-analog

converter (DAC)

Programmable output range

±10 V, ±10.2564 V, or ±10.5263 V
±1 LSB maximum INL error, ±1 LSB maximum DNL error
Low noise: 60 nV/√Hz
Settling time: 10 μs maximum
Integrated reference buffers
Output control during power-up/brownout
Programmable short-circuit protection
Simultaneous updating via
Asynchronous
Digital offset and gain adjust
Logic output control pins
DSP-/microcontroller-compatible serial interface
Temperature range: −40°C to +85°C
iCMOS process technology

CLR

to zero code

LDAC

1

Serial Input, Bipolar Voltage Output DAC

AD5764

GENERAL DESCRIPTION

The AD5764 is a quad, 16-bit, serial input, bipolar voltage
output DAC that operates from supply voltages of ±11.4 V to
±16.5 V. Nominal full-scale output range is ±10 V. The AD5764
provides integrated output amplifiers, reference buffers, and
proprietary power-up/power-down control circuitry. The part
also features a digital I/O port that is programmed via the serial
interface. The part incorporates digital offset and gain adjust
registers per channel.

The AD5764 is a high performance converter that offers guar­anteed monotonicity, integral nonlinearity (INL) of ±1 LSB, low
noise, and 10 µs settling time. During power-up (when the
supply voltages are changing), VOUTx is clamped to 0 V via a
low impedance path.

The AD5764 uses a serial interface that operates at clock rates of
up to 30 MHz and is compatible with DSP and microcontroller
interface standards. Double buffering allows the simultaneous
updating of all DACs. The input coding is programmable to

APPLICATIONS

Industrial automation
Open-loop/closed-loop servo control
Process control
Data acquisition systems
Automatic test equipment
Automotive test and measurement
High accuracy instrumentation

either twos complement or offset binary formats. The asynchro­nous clear function clears the data register to either bipolar zero or
zero scale depending on the coding used. The AD5764 is ideal
for both closed-loop servo control and open-loop control appli­cations. The AD5764 is available in a 32-lead TQFP, and offers
guaranteed specifications over the −40°C to +85°C industrial
temperature range. See Figure 1 for the functional block diagram.

Table 1. Related Devices

Part No. Description

AD5764R AD5764 with internal voltage reference
AD5744R

Complete quad, 14-bit, high accuracy, serial
input, bipolar voltage output DAC with
internal voltage reference

1

For analog systems designers within industrial/instrumentation equipment OEMs who need high performance ICs at higher voltage levels, iCMOS® is a technology

platform that enables the development of analog ICs capable of 30 V and operating at ±15 V supplies, allowing dramatic reductions in power consumption and package
size, and increased ac and dc performance.

Rev. F

Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
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One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] www.analog.com
Fax: [phone] ©2006–2011 Analog Devices, Inc. All rights reserved.

AD5764 Data Sheet

TABLE OF CONTENTS

Features.............................................................................................. 1

Applications....................................................................................... 1

General Description ......................................................................... 1

Revision History ............................................................................... 2

Functional Block Diagram .............................................................. 3

Specifications..................................................................................... 4

AC Performance Characteristics ................................................ 5

Timing Characteristics ................................................................ 6

Absolute Maximum Ratings............................................................ 9

ESD Caution.................................................................................. 9

Pin Configuration and Function Descriptions........................... 10

Typical Performance Characteristics ........................................... 12

Terminology .................................................................................... 17

Theory of Operation ...................................................................... 18

DAC Architecture....................................................................... 18

Reference Buffers........................................................................ 18

Serial Interface ............................................................................ 18

Simultaneous Updating via

LDAC

........................................... 19

Transfer Function .......................................................................20

Asynchronous Clear (

CLR

)....................................................... 20

REVISION HISTORY

9/11—Rev. E to Rev. F

Changed 30 MHz to 50 MHz Throughout.................................... 1

Changes to t

7/11—Rev. D to Rev. E

Changed 30 MHz to 50 MHz Throughout.................................... 1

Changes to t

8/09—Rev. C to Rev. D

Changes to Table 2 and Table 3 Endnotes ..................................... 6

Changes to t

1/09—Rev. B to Rev. C

Changes to General Description Section ...................................... 1

Changes to Figure 1.......................................................................... 3

Changes to Table 2 Conditions ....................................................... 4

Changes to Table 3 Conditions ....................................................... 5

Changes to Table 4 Conditions ....................................................... 6

Changes to Figure 5.......................................................................... 8

Changes to Table 5............................................................................ 9

Changes to Table 6.......................................................................... 10

Changes to Figure 34...................................................................... 19

Changes to Table 7 and Table 10................................................... 20

Added Table 8; Renumbered Sequentially .................................. 20

Changes to Table 11 and Table 12 ................................................ 21

Changes to Digital Offset and Gain Control Section ................ 24

, t2, and t3 Parameters, Table 4.................................. 6

1

, t2, and t3 Parameters, Table 4.................................. 6

1

Parameter and Endnotes, Table 4 ........................... 7

6

Rev. F | Page 2 of 28

Function Register ....................................................................... 21

Data Register............................................................................... 21

Coarse Gain Register ................................................................. 21

Fine Gain Register...................................................................... 22

Offset Register ............................................................................ 22

Offset and Gain Adjustment Worked Example...................... 23

Design Features............................................................................... 24

Analog Output Control............................................................. 24

Digital Offset and Gain Control............................................... 24

Programmable Short-Circuit Protection ................................ 24

Digital I/O Port........................................................................... 24

Local Ground Offset Adjust...................................................... 24

Applications Information.............................................................. 25

Typical Operating Circuit ......................................................... 25

Layout Guidelines........................................................................... 27

Galvanically Isolated Interface ................................................. 27

Microprocessor Interfacing....................................................... 27

Evaluation Board........................................................................ 27

Outline Dimensions....................................................................... 28

Ordering Guide .......................................................................... 28

Changes to Table 20 ....................................................................... 26

Deleted AD5764 to MC68HC11 Interface Section.................... 27

Deleted Figure 38; Renumbered Sequentially ............................ 27

Deleted AD5764 to 8XC51 Interface Section, Figure 39,
AD5764 to ADSP-2101 Interface Section, Figure 40, and

AD5764 to PIC16C6x/PIC16C7x Interface Section .................. 28

04/08—Rev. A to Rev. B

Changes to Table Summary Statement, Specifications Section...4
Changes to Power Requirements Parameter, Table 2 and

Table Summary Statement................................................................5

Changes to t

Parameter, Table 4 ....................................................6

16

Changes to Table 6.......................................................................... 10

Changed V

to AVSS/AVDD in Typical Performance

SS/VDD

Characteristics Section .................................................................. 13

Changes to Table 16 ....................................................................... 22

Changes to Table 18 ....................................................................... 23

Changes to Typical Operating Circuit Section........................... 28

Changes to AD5764 to ADSP-2101 Section ............................... 29

Changes to Ordering Guide.......................................................... 30

1/07—Rev. 0 to Rev. A

Changes to Absolute Maximum Ratings..................................... 10

Changes to Figure 25 and Figure 26............................................. 16

3/06—Revision 0: Initial Version

Data Sheet AD5764

FUNCTIONAL BLOCK DIAGRAM

DV

DGND

AVDDAVSSAVDDAV

PGND

CC

SS

AD5764

REFABREFGND

REFERENCE

BUFFERS

VOLTAGE
MONITOR

AND

CONTROL

RSTINRSTOUT

ISCC

SDIN

SCLK

SYNC

SDO

BIN/2sCOMP

CLR

16

INPUT
SHIFT

REGISTER

AND

CONTRO L

LOGIC

D0

D1

INPUT
REG A

GAIN REG A

OFFSET REG A

INPUT
REG B

GAIN REG B

OFFSET REG B

INPUT
REG C

GAIN REG C

OFFSET REG C

INPUT
REG D

GAIN REG D

OFFSET REG D

16

DATA
REG A

DATA
REG B

DATA
REG C

DATA
REG D

LDAC REFCD

16

16

16

DAC A

DAC B

DAC C

DAC D

REFERENCE

BUFFERS

G1

G1

G1

G1

G2

G2

G2

G2

VOUTA

AGNDA

VOUTB

AGNDB

VOUTC

AGNDC

VOUTD

AGNDD

05303-001

Figure 1.

Rev. F | Page 3 of 28

AD5764 Data Sheet

SPECIFICATIONS

AVDD = 11.4 V to 16.5 V, AVSS = −11.4 V to −16.5 V, AGNDx = DGND = REFGND = PGND = 0 V; REFAB = REFCD = 5 V;

= 2.7 V to 5.25 V, R

DV

CC

guaranteed to +105°C with degraded performance. All specifications T

Table 2.

Parameter A Grade B Grade C Grade Unit Test Conditions/Comments

ACCURACY Outputs unloaded

Resolution 16 16 16 Bits

Relative Accuracy (INL) ±4 ±2 ±1 LSB max

Differential Nonlinearity ±1 ±1 ±1 LSB max Guaranteed monotonic

Bipolar Zero Error ±2 ±2 ±2 mV max

Bipolar Zero Temperature

Coefficient (TC)

1

Zero-Scale Error ±2 ±2 ±2 mV max

Zero-Scale TC1 ±2 ±2 ±2 ppm FSR/°C max

Gain Error ±0.02 ±0.02 ±0.02 % FSR max

Gain TC1 ±2 ±2 ±2 ppm FSR/°C max

DC Crosstalk1 0.5 0.5 0.5 LSB max
REFERENCE INPUT1

Reference Input Voltage 5 5 5 V nom ±1% for specified performance

DC Input Impedance 1 1 1 MΩ min Typically 100 MΩ

Input Current ±10 ±10 ±10 μA max Typically ±30 nA

Reference Range 1 to 7 1 to 7 1 to 7 V min to V max
OUTPUT CHARACTERISTICS1

Output Voltage Range2 ±10.5263 ±10.5263 ±10.5263 V min to V max AVDD/AVSS = ±11.4 V, V

±14 ±14 ±14 V min to V max AVDD/AVSS = ±16.5 V, V

Output Voltage Drift vs. Time ±13 ±13 ±13

±15 ±15 ±15

Short-Circuit Current 10 10 10 mA typ R

Load Current ±1 ±1 ±1 mA max For specified performance

Capacitive Load Stability

R

= ∞ 200 200 200 pF max

LOAD

R

= 10 kΩ 1000 1000 1000 pF max

LOAD

DC Output Impedance 0.3 0.3 0.3 Ω max
DIGITAL INPUTS DVCC = 2.7 V to 5.25 V, JEDEC compliant

Input High Voltage, VIH 2 2 2 V min

Input Low Voltage, VIL 0.8 0.8 0.8 V max

Input Current ±1 ±1 ±1 μA max Per pin

Pin Capacitance 10 10 10 pF max Per pin

= 10 kΩ, CL = 200 pF. Temperature range: −40°C to +85°C; typical at +25°C. Device functionality is

LOAD

to T

MIN

, unless otherwise noted.

MAX

At 25°C; error at other temperatures
obtained using bipolar zero TC

±2 ±2 ±2 ppm FSR/°C max

At 25°C; error at other temperatures
obtained using zero-scale TC

At 25°C; error at other temperatures
obtained using gain TC

ppm FSR/
500 hours typ

ppm FSR/
1000 hours typ

= 6 kΩ, see Figure 31

ISCC

REFIN

REFIN

= 5 V
= 7 V

Rev. F | Page 4 of 28

Data Sheet AD5764

Parameter A Grade B Grade C Grade Unit Test Conditions/Comments

DIGITAL OUTPUTS (D0, D1, SDO)1

Output Low Voltage 0.4 0.4 0.4 V max DVCC = 5 V ± 5%, sinking 200 μA
Output High Voltage DVCC − 1 DVCC − 1 DVCC − 1 V min DVCC = 5 V ± 5%, sourcing 200 μA
Output Low Voltage 0.4 0.4 0.4 V max DVCC = 2.7 V to 3.6 V, sinking 200 μA
Output High Voltage DVCC − 0.5 DVCC − 0.5 DVCC − 0.5 V min DVCC = 2.7 V to 3.6 V, sourcing 200 μA
High Impedance Leakage Current ±1 ±1 ±1 μA max SDO only
High Impedance Output

Capacitance

POWER REQUIREMENTS

AVDD/AVSS

DVCC 2.7 to 5.25 2.7 to 5.25 2.7 to 5.25 V min to V max
Power Supply Sensitivity1

∆V

/∆ΑVDD −85 −85 −85 dB typ

OUT

AIDD 3.5 3.5 3.5 mA/channel max Outputs unloaded

AISS 2.75 2.75 2.75 mA/channel max Outputs unloaded
DICC 1.2 1.2 1.2 mA max VIH = DVCC, VIL = DGND, 750 μA typical
Power Dissipation 275 275 275 mW typ ±12 V operation output unloaded

1

Guaranteed by design and characterization; not production tested.

2

Output amplifier headroom requirement is 1.4 V minimum.

5 5 5 pF typ SDO only

±11.4 to
±16.5

±11.4 to
±16.5

±11.4 to
±16.5

V min to V max

AC PERFORMANCE CHARACTERISTICS

AVDD = 11.4 V to 16.5 V, AVSS = −11.4 V to −16.5 V, AGNDx = DGND = REFGND = PGND = 0 V; REFAB = REFCD = 5 V;
DV

= 2.7 V to 5.25 V, R

CC

Table 3.

Parameter A Grade B Grade C Grade Unit Test Conditions/Comments

DYNAMIC PERFORMANCE1

Output Voltage Settling Time 8 8 8 μs typ Full-scale step to ±1 LSB

10 10 10 μs max
2 2 2 μs typ 512 LSB step settling

Slew Rate 5 5 5 V/μs typ
Digital-to-Analog Glitch Energy 8 8 8 nV-sec typ
Glitch Impulse Peak Amplitude 25 25 25 mV max
Channel-to-Channel Isolation 80 80 80 dB typ
DAC-to-DAC Crosstalk 8 8 8 nV-sec typ
Digital Crosstalk 2 2 2 nV-sec typ
Digital Feedthrough 2 2 2 nV-sec typ

Output Noise (0.1 Hz to 10 Hz) 0.1 0.1 0.1 LSB p-p typ
Output Noise (0.1 Hz to 100 kHz) 45 45 45 μV rms max
1/f Corner Frequency 1 1 1 kHz typ
Output Noise Spectral Density 60 60 60 nV/√Hz typ Measured at 10 kHz
Complete System Output Noise Spectral

1

Guaranteed by design and characterization; not production tested.

2

Includes noise contributions from integrated reference buffers, 16-bit DAC, and output amplifier.

Density

2

= 10 kΩ, CL = 200 pF. All specifications T

LOAD

80 80 80 nV/√Hz typ Measured at 10 kHz

MIN

to T

, unless otherwise noted.

MAX

Effect of input bus activity on DAC
outputs

Rev. F | Page 5 of 28

AD5764 Data Sheet

TIMING CHARACTERISTICS

AVDD = 11.4 V to 16.5 V, AVSS = −11.4 V to −16.5 V, AGNDx = DGND = REFGND = PGND = 0 V; REFAB = REFCD = 5 V;
DV

= 2.7 V to 5.25 V, R

CC

= 10 kΩ, CL = 200 pF. All specifications T

LOAD

MIN

to T

, unless otherwise noted.

MAX

Table 4.

Parameter

1, 2, 3

Limit at T

, T

Unit Description

MIN

MAX

t1 33 ns min SCLK cycle time
t2 13 ns min SCLK high time
t3 13 ns min SCLK low time
t4 13 ns min

4

t

13 ns min

5

t6 90 ns min

falling edge to SCLK falling edge setup time

SYNC

th

SCLK falling edge to SYNC rising edge

24
Minimum SYNC

high time
t7 2 ns min Data setup time
t8 5 ns min Data hold time
t9 1.7 μs min
480 ns min
t10 10 ns min
t11 500 ns max

rising edge to LDAC falling edge (all DACs updated)

SYNC

rising edge to LDAC falling edge (single DAC updated)

SYNC

pulse width low

LDAC

falling edge to DAC output response time

LDAC
t12 10 μs max DAC output settling time
t13 10 ns min
t14 2 μs max

5, 6

t

25 ns max SCLK rising edge to SDO valid

15

t16 13 ns min
t17 2 μs max
t18 170 ns min

1

Guaranteed by design and characterization; not production tested.

2

All input signals are specified with tR = tF = 5 ns (10% to 90% of DVCC) and timed from a voltage level of 1.2 V.

3

See Figure 2, Figure 3, and Figure 4.

4

Standalone mode only.

5

Measured with the load circuit of Figure 5.

6

Daisy-chain mode only.

pulse width low

CLR

pulse activation time

CLR

rising edge to SCLK falling edge

SYNC

rising edge to DAC output response time (LDAC = 0)

SYNC

falling edge to SYNC rising edge

LDAC

Rev. F | Page 6 of 28

Data Sheet AD5764

Timing Diagrams

t

1

SCLK

SYNC

SDIN

LDAC

VOUTx

LDAC = 0

VOUTx

CLR

VOUTx

12 24

t

6

t

4

t

7

DB23

t

t

3

t

8

t

13

14

t

2

t

10

t

5

DB0

t

t

9

t

18

t

17

10

t

t

11

t

12

12

SCLK

SYNC

SDIN

SDO

LDAC

Figure 2. Serial Interface Timing Diagram

t

1

24 48

t

6

t

4

t

7

DB23 DB0 DB23 DB0

t

3

t

8

t

2

INPUT WO RD FOR DAC N–1INPUT WORD FOR DAC N

t

15

DB23

INPUT WO RD FOR DAC NUNDEFINED

Figure 3. Daisy-Chain Timing Diagram

DB0

05303-002

t

5

t

16

t

9

t

10

05303-003

Rev. F | Page 7 of 28

AD5764 Data Sheet

SYNC

T

SCLK

24 48

SDIN

SDO

DB23 DB0 DB23 DB0

INPUT WORD SPECIFIES

REGISTER TO BE READ

UNDEFINED

DB23

NOP CONDITI ON

SELECTED REG ISTER DATA

CLOCKED OUT

DB0

05303-004

Figure 4. Readback Timing Diagram

200µA I

O SDO

PIN

C

L

50pF

200µA I

Figure 5. Load Circuit for SDO Timing Diagram

OL

OH

VOH (MIN) OR
V

(MAX)

OL

05303-005

Rev. F | Page 8 of 28

Data Sheet AD5764

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted. Transient currents of up to
100 mA do not cause SCR latch-up.

Table 5.

Parameter Rating

AVDD to AGNDx, DGND −0.3 V to +17 V
AVSS to AGNDx, DGND +0.3 V to −17 V
DVCC to DGND −0.3 V to +7 V
Digital Inputs to DGND

Digital Outputs to DGND −0.3 V to DVCC + 0.3 V
REFAB, REFCD to AGNDx, PGND −0.3 V to AVDD + 0.3 V
VOUTA, VOUTB, VOUTC, VOUTD to

AGNDx
AGNDx to DGND −0.3 V to +0.3 V
Operating Temperature Range

Industrial −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature (TJ max) 150°C
32-Lead TQFP

θJA Thermal Impedance 65°C/W

θJC Thermal Impedance 12°C/W
Lead Temperature JEDEC industry standard

Soldering J-STD-020

−0.3 V to DV
(whichever is less)

to AVDD

AV

SS

+ 0.3 V or 7 V

CC

Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

ESD CAUTION

Rev. F | Page 9 of 28

AD5764 Data Sheet

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

BIN/2sCOMP

AVDDAVSSNC

32 31 30 29 28 27 26 25

1

SYNC

SCLK

SDIN

SDO

CLR

LDAC

D0

D1

PIN 1

2

3

4

5

6

7

8

9 10 11 12 13 14 15 16

RSTIN

RSTOUT

NC = NO CONNECT

Figure 6. Pin Configuration

Table 6. Pin Function Descriptions

Pin No. Mnemonic Description

1

Active Low Input. This is the frame synchronization signal for the serial interface. While SYNC is low,

SYNC

data is transferred in on the falling edge of SCLK.

2 SCLK

Serial Clock Input. Data is clocked into the input shift register on the falling edge of SCLK. This

operates at clock speeds up to 30 MHz.
3 SDIN Serial Data Input. Data must be valid on the falling edge of SCLK.
4 SDO Serial Data Output. Used to clock data from the serial register in daisy-chain or readback mode.
5

Negative Edge Triggered Input. Asserting this pin sets the data register to 0x0000. There is an internal

CLR

pull-up device on this logic input. Therefore, this pin can be left floating and defaults to a Logic 1

condition.
6

Load DAC. Logic input. This is used to update the data register and consequently the analog outputs.

LDAC

When tied permanently low, the addressed data register is updated on the rising edge of SYNC

is held high during the write cycle, the DAC input shift register is updated but the output

LDAC

update is held off until the falling edge of LDAC. In this mode, all analog outputs can be updated

simultaneously on the falling edge of LDAC
7, 8 D0, D1

Digital I/O Port. The user can set up these pins as inputs or outputs that are configurable and readable

over the serial interface. When configured as inputs, these pins have weak internal pull-ups to DVCC.

When programmed as outputs, D0 and D1 are referenced by DV
9

Reset Logic Output. This is the output from the on-chip voltage monitor used in the reset circuit. If

RSTOUT

desired, it can be used to control other system components.
10

Reset Logic Input. This input allows external access to the internal reset logic. Applying a Logic 0 to

RSTIN

this input clamps the DAC outputs to 0 V. In normal operation, RSTIN should be tied to Logic 1.

Register values remain unchanged.
11 DGND Digital Ground.
12 DVCC Digital Supply. Voltage ranges from 2.7 V to 5.25 V.
13, 31 AVDD Positive Analog Supply. Voltage ranges from 11.4 V to 16.5 V.
14 PGND Ground Reference Point for Analog Circuitry.
15, 30 AVSS Negative Analog Supply. Voltage ranges from −11.4 V to −16.5 V.
16 ISCC

Resistor Connection for Pin Programmable Short-Circuit Current. This pin is used in association with an

optional external resistor to AGND to program the short-circuit current of the output amplifiers. Refer

to the Design Features section for further details.
17 AGNDD Ground Reference Pin for DAC D Output Amplifier.
18 VOUTD

Analog Output Voltage of DAC D. This pin is a buffered output with a nominal full-scale output range

of ±10 V. The output amplifier is capable of directly driving a 10 kΩ, 200 pF load.
19 VOUTC

Analog Output Voltage of DAC C. This pin is a buffered output with a nominal full-scale output range

of ±10 V. The output amplifier is capable of directly driving a 10 kΩ, 200 pF load.
20 AGNDC Ground Reference Pin for DAC C Output Amplifier.

Rev. F | Page 10 of 28

REFGNDNCREFCD

AD5764

TOP VIEW

(Not to Scale)

CCAVDD

DV

DGND

REFAB

24

AGNDA

23

VOUTA

22

VOUTB

21

AGNDB

20

AGNDC

19

VOUTC

VOUTD

18

AGNDD

17

SS

ISCC

AV

PGND

05303-006

. The LDAC pin must not be left unconnected.

and DGND.

CC

. If

Data Sheet AD5764

Pin No. Mnemonic Description

21 AGNDB Ground Reference Pin for DAC B Output Amplifier.
22 VOUTB

23 VOUTA

24 AGNDA Ground Reference Pin for DAC A Output Amplifier.
25 REFAB

26 REFCD

27, 29 NC No Connect.
28 REFGND eturn for the Reference Generator and Buffers. Reference Ground R
32

BIN/2sCOMP

DVCC or DGND. When hardwired to Determines the DAC Coding. This pin should be hardwired to either

Analog Output Voltage of DAC B. Buffered output with a nominal full-scale output range of ±10 V.
The output amplifier is capable of directly driving a 10 kΩ, 200 pF load.

ale output range of ±10 V. Analog Output Voltage of DAC A. Buffered output with a nominal full-sc

The output amplifier is capable of directly driving a 10 kΩ, 200 pF load.

External Reference Voltage Input for Channel A and Channel B. Reference input range is 1 V to 7 V;
programs the full-scale output voltage. V

= 5 V for specified performance.

REFIN

t range is 1 V to 7 V; External Reference Voltage Input for Channel C and Channel D. Reference inpu

programs the full-scale output voltage. V

DV

, input coding is offset binary. When hardwired to DGND, input coding is twos complement

CC

= 5 V for specified performance.

REFIN

(see Table 7 and Table 8).

Rev. F | Page 11 of 28

AD5764 Data Sheet

TYPICAL PERFORMANCE CHARACTERISTICS

1.0

0.8

0.6

0.4

0.2

0

–0.2

INL ERROR (LSB)

–0.4

–0.6

–0.8

–1.0

0 10000 20000 30000 40000 50000 60000

DAC CODE

TA = 25°C
AV
V

Figure 7. Integral Nonlinearity Error vs. Code,

/AVSS = ±15 V

AV

DD

1.0
TA = 25°C

AV

/AVSS = ±12V

0.8

DD

V

= 5V

REFIN

0.6

0.4

0.2

0

–0.2

INL ERROR (LSB)

–0.4

–0.6

–0.8

–1.0

0 10000 20000 30000 40000 50000 60000

DAC CODE

Figure 8. Integral Nonlinearity Error vs. Code,

/AVSS = ±12 V

AV

DD

1.0

0.8

0.6

0.4

0.2

0

–0.2

DNL ERROR (LSB)

–0.4

–0.6

–0.8

–1.0

0 10000 20000 30000 40000 50000 60000

DAC CODE

TA = 25°C
AV
V

Figure 9. Differential Nonlinearity Error vs. Code,

/AVSS = ±15 V

AV

DD

/AVSS = ±15V

DD

= 5V

REFIN

/AVSS = ±15V

DD

= 5V

REFIN

05303-007

05303-008

05303-011

1.0

0.8

0.6

0.4

0.2

0

–0.2

DNL ERROR (LSB)

–0.4

–0.6

–0.8

–1.0

0 10000 20000 30000 40000 50000 60000

DAC CODE

TA = 25°C
AV
V

Figure 10. Differential Nonlinearity Error vs. Code,

/AVSS = ±12 V

AV

DD

0.5
TA = 25°C

AV

/AVSS = ±15V

DD

0.4

V

= 5V

REFIN

0.3

0.2

0.1

INL ERROR (LSB)

0

–0.1

–0.2

–40 100–20 0 20 40 60 80

TEMPERATURE (°C)

Figure 11. Integral Nonlinearity Error vs. Temperature,

/AVSS = ±15 V

AV

DD

0.5

0.4

0.3

0.2

0.1

INL ERROR (LSB)

0

–0.1

–40 100–20 0 20 40 60 80

TA = 25°C
AV

/AVSS = ±12V

DD

V

= 5V

REFIN

TEMPERATURE (°C)

Figure 12. Integral Nonlinearity Error vs. Temperature,

/AVSS = ±12 V

AV

DD

/AVSS = ±12V

DD

= 5V

REFIN

05303-012

05303-015

05303-016

Rev. F | Page 12 of 28

Data Sheet AD5764

0.15

0.10

0.15

0.10

TA = 25°C
V

= 5V

REFIN

0.05

0

–0.05

–0.10

DNL ERROR (LSB)

–0.15

–0.20

–0.25

–40 100–20 0 20 40 60 80

TA = 25°C
AV

/AVSS = ±15V

DD

V

= 5V

REFIN

TEMPERATURE (°C)

Figure 13. Differential Nonlinearity Error vs. Temperature,

/AVSS = ±15 V

AV

DD

0.15

0.10

0.05

0

–0.05

–0.10

DNL ERROR (LSB)

–0.15

–0.20

–0.25

–40 100–20 0 20 40 60 80

TA = 25°C
AV

/AVSS = ±12V

DD

V

= 5V

REFIN

TEMPERATURE (°C)

Figure 14. Differential Nonlinearity Error vs. Temperature,

/AVSS = ±12 V

AV

DD

0.5

0.4

0.3

0.2

0.1

INL ERROR (LSB)

0

–0.1

–0.2

11.4 16.415.414.413.412.4

SUPPLY VOLTAGE (V)

Figure 15. Integral Nonlinearity Error vs. Supply Voltage

TA = 25°C
V

= 5V

REFIN

0.05

0

–0.05

–0.10

DNL ERROR (LSB)

–0.15

–0.20

05303-019

–0.25

11.4 16.415.414.413.412.4

SUPPLY VOLTAGE (V)

05303-025

Figure 16. Differential Nonlinearity Error vs. Supply Voltage

0.8
TA = 25°C

AV

/AVSS = ±16.5V

DD

0.6

0.4

0.2

0

–0.2

–0.4

INL ERROR (LSB)

–0.6

–0.8

05303-020

–1.0

1756432

REFERENCE VOL TAGE (V)

05303-027

Figure 17. Integral Nonlinearity Error vs. Reference Voltage,

/AVSS = ±16.5 V

AV

DD

0.4

0.3

0.2

0.1

0

–0.1

DNL ERROR (LSB)

–0.2

–0.3

05303-023

–0.4

1756432

REFERENCE VOL TAGE (V)

TA = 25°C
AV

/AVSS = ±16.5V

DD

05303-031

Figure 18. Differential Nonlinearity Error vs. Reference Voltage,

/AVSS = ±16.5 V

AV

DD

Rev. F | Page 13 of 28

AD5764 Data Sheet

0.6
TA = 25°C

AV

/AVSS = ±16.5V

0.4

DD

0.2

0

–0.2

–0.4

–0.6

TUE (mV)

–0.8

–1.0

–1.2

–1.4

–1.6

1756432

REFERENCE VOL TAGE (V)

Figure 19. Total Unadjusted Error vs. Reference Voltage,

/AVSS = ±16.5 V

AV

DD

14

TA = 25°C
V

= 5V

REFIN

13

|I

|

12

(mA)

11

SS

/I

DD

I

10

9

8

11.4 16.415.414.413.412.4

0.25

0.20

0.15

0.10

0.05

0

–0.05

–0.10

ZERO-SCALE ERROR (mV)

–0.15

–0.20

–0.25

–40 100806040200–20

V

REFIN

Figure 20. I

= 5V

DD

|

|I

SS

AVDD/AVSS (V)

vs. AVDD/AVSS

DD/ISS

AVDD/AVSS = ±15V

TEMPERATURE (°C)

AV

DD

/AVSS = ±12V

Figure 21. Zero-Scale Error vs. Temperature

05303-035

05303-037

05303-038

BIPOLAR ZERO ERROR (mV)

GAIN ERROR (mV)

0.0014

0.0013

0.0012

0.0011

(mA)

0.0010

CC

DI

0.0009

0.0008

0.0007

0.0006

–0.2

–0.4

–0.2

0.8
V

= 5V

REFIN

0.6

0.4

0.2

0

–40 100806040200–20

TEMPERATURE (°C)

AVDD/AVSS = ±15V

Figure 22. Bipolar Zero Error vs. Temperature

1.4
V

= 5V

REFIN

1.2

1.0

0.8

0.6

0.4

0.2

0

–40 100806040200–20

TEMPERATURE (°C)

Figure 23. Gain Error vs. Temperature

TA = 25°C

5V

3V

054.54. 03. 53. 02. 52. 01. 51.00.5

Figure 24. DI

V

LOGIC

vs. Logic Input Voltage

CC

AV

DD

AV

/AVSS = ±12V

DD

AVDD/AVSS = ±15V

/AVSS = ±12V

05303-039

05303-040

05303-041

.0

Rev. F | Page 14 of 28

Data Sheet AD5764

–

7000

TA = 25°C
V

= 5V

REFIN

6000

RI

= 6k

5000

4000

3000

2000

1000

OUTPUT VO LTAGE DEL TA (µV)

0

–1000

–10 1050–5

SCC

SOURCE/SINK CURRENT (mA)

AVDD/AVSS = ±15V

/AVSS = ±12V

AV

DD

Figure 25. Source and Sink Capability of Output Amplifier with

Positive Full Scale Loaded

10000

TA = 25°C
V

9000

8000

7000

6000

5000

4000

3000

2000

OUTPUT VO LTAGE DEL TA (µV)

1000

–1000

= 5V

REFIN

RI

= 6k

SCC

0

–12 83–2–7

15V SUPPLIES

12V SUPPLIES

SOURCE/SINK CURRENT (mA)

05303-042

05303-043

AVDD/AVSS = ±15V
T

= 25°C

A

V

= 5V

REFIN

1

CH1 3.00V M1 .00µs CH1 –120mV

1µs/DIV

Figure 27. Full-Scale Settling Time

4

–6

–8

–10

–12

–14

(mV)

–16

OUT

V

–18

–20

–22

–24

–26

–2.0–1.5–1.0–0.5 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

TIME (µs)

AVDD/AVSS = ±12V
V

= 5V

REFIN

T

= 25°C

A

0x8000 TO 0x7FF F
500ns/DIV

05303-044

05303-047

Figure 26. Source and Sink Capability of Output Amplifier with

Negative Full Scale Loaded

Rev. F | Page 15 of 28

Figure 28. Major Code Transition Glitch Energy, AV

/AVSS = ±12 V

DD

AD5764 Data Sheet

SHORT-CIRCUIT CURRENT (mA)

10

9

8

7

6

5

4

3

2

1

0

0110080604020

Figure 31. Short-Circuit Current vs. RI

AVDD/AVSS = ±15V
T

= 25°C

A

V

= 5V

REFIN

05303-050

RI

(k)

SCC

SCC

20

AVDD/AVSS = ±15V
MIDSCALE LO ADED

V

= 0V

REFIN

4

50µV/DIV

CH4 50.0µV M1.00s CH4 26µV

Figure 29. Peak-to-Peak Noise (100 kHz Bandwidth)

05303-048

1

2

3

CH1 10.0V

CH3 10.0mV

T

AVDD/AVSS = ±12V
V

= 5V

REFIN

T

= 25°C

A

RAMP TIME = 100µs
LOAD = 200pF ||10k

B

CH2 10.0V M100µs A CH1 7.80mV

W

B

W

Figure 30. V

vs. AVDD/AVSS on Power-Up

OUT

T 29.60%

05303-055

Rev. F | Page 16 of 28

Data Sheet AD5764

TERMINOLOGY

Relative Accuracy or Integral Nonlinearity (INL)

For the DAC, relative accuracy or integral nonlinearity (INL) is
a measure of the maximum deviation, in LSBs, from a straight
line passing through the endpoints of the DAC transfer function. A
typical INL vs. code plot can be seen in Figure 7.

Differential Nonlinearity (DNL)

Differential nonlinearity is the difference between the measured
change and the ideal 1 LSB change between any two adjacent
codes. A specified differential nonlinearity of ±1 LSB maximum
ensures monotonicity. This DAC is guaranteed monotonic. A
typical DNL vs. code plot can be seen in Figure 9.

Monotonicity

A DAC is monotonic if the output either increases or remains
constant for increasing digital input code. The AD5764 is
monotonic over its full operating temperature range.

Bipolar Zero Error

Bipolar zero error is the deviation of the analog output from the
ideal half-scale output of 0 V when the data register is loaded
with 0x8000 (offset binary coding) or 0x0000 (twos complement
coding). A plot of bipolar zero error vs. temperature can be seen
in Figure 22.

Bipolar Zero Temperature Coefficient (TC)

Bipolar zero TC is the measure of the change in the bipolar zero
error with a change in temperature. It is expressed in ppm FSR/°C.

Full-Scale Error

Full-scale error is a measure of the output error when full-scale
code is loaded to the data register. Ideally, the output voltage
should be 2 × V

− 1 LSB. Full-scale error is expressed in

REF

percentage of full-scale range.

Negative Full-Scale Error/Zero-Scale Error

Negative full-scale error is the error in the DAC output voltage
when 0x0000 (offset binary coding) or 0x8000 (twos complement
coding) is loaded to the data register. Ideally, the output voltage
should be −2 × V

. A plot of zero-scale error vs. temperature

REF

can be seen in Figure 21.

Output Voltage Settling Time

Output voltage settling time is the amount of time it takes for the
output to settle to a specified level for a full-scale input change.

Slew Rate

The slew rate of a device is a limitation in the rate of change of
the output voltage. The output slewing speed of a voltage-output
DAC is usually limited by the slew rate of the amplifier used at
its output. Slew rate is measured from 10% to 90% of the output
signal and is given in V/µs.

Gain Error

Gain error is a measure of the span error of the DAC. It is the
deviation in slope of the DAC transfer characteristic from the
ideal, expressed as a percentage of the full-scale range. A plot of
gain error vs. temperature can be seen in Figure 23.

Rev. F | Page 17 of 28

Tot a l U n ad ju s te d E rr o r

Total unadjusted error (TUE) is a measure of the output error
considering all the various errors. A plot of total unadjusted
error vs. reference voltage can be seen in Figure 19.

Zero-Scale Error Temperature Coefficient (TC)

Zero-scale error TC is a measure of the change in zero-scale
error with a change in temperature. Zero-scale error TC is
expressed in ppm FSR/°C.

Gain Error Temperature Coefficient (TC)

Gain error TC is a measure of the change in gain error with
changes in temperature. Gain error TC is expressed in
ppm FSR/°C.

Digital-to-Analog Glitch Energy

Digital-to-analog glitch impulse is the impulse injected into the
analog output when the input code in the data register changes
state. It is normally specified as the area of the glitch in nV-sec,
and is measured when the digital input code is changed by 1 LSB at
the major carry transition (0x7FFF to 0x8000); see Figure 28.

Digital Feedthrough

Digital feedthrough is a measure of the impulse injected into
the analog output of the DAC from the digital inputs of the DAC
but is measured when the DAC output is not updated. It is speci­fied in nV-sec and measured with a full-scale code change on
the data bus, that is, from all 0s to all 1s, and vice versa.

Power Supply Sensitivity

Power supply sensitivity indicates how the output of the DAC is
affected by changes in the power supply voltage.

DC Crosstalk

DC crosstalk is the dc change in the output level of one DAC in
response to a change in the output of another DAC. It is measured
with a full-scale output change on one DAC while monitoring
another DAC, and is expressed in LSBs.

DAC-to-DAC C rosst a l k

DAC-to-DAC crosstalk is the glitch impulse transferred to the
output of one DAC due to a digital code change and subsequent
output change of another DAC. This includes both digital and
analog crosstalk. It is measured by loading one of the DACs with
a full-scale code change (all 0s to all 1s and vice versa) with

LDAC

low and monitoring the output of another DAC. The energy of
the glitch is expressed in nV-sec.

Channel-to-Channel Isolation

Channel-to-channel isolation is the ratio of the amplitude of the
signal at the output of one DAC to a sine wave on the reference
input of another DAC. It is measured in dB.

Digital Crosstalk

Digital crosstalk is a measure of the impulse injected into the
analog output of one DAC from the digital inputs of another DAC,
but is measured when the DAC output is not updated. It is specified
in nV-sec and measured with a full-scale code change on the data
bus, that is, from all 0s to all 1s, and vice versa.

AD5764 Data Sheet

THEORY OF OPERATION

The AD5764 is a quad, 16-bit, serial input, bipolar voltage output
DAC and operates from supply voltages of ±11.4 V to ±16.5 V and
has a buffered output voltage of up to ±10.5263 V. Data is written to
the AD5764 in a 24-bit word format, via a 3-wire serial interface.
The device also offers an SDO pin that is available for daisy­chaining or readback.

The AD5764 incorporates a power-on reset circuit, which ensures
that the data register powers up loaded with 0x0000. The AD5764
features a digital I/O port that can be programmed via the serial
interface, on-chip reference buffers and per channel digital gain,
and offset registers.

DAC ARCHITECTURE

The DAC architecture of the AD5764 consists of a 16-bit,
current mode, segmented R-2R DAC. The simplified circuit
diagram for the DAC section is shown in Figure 32.

The four MSBs of the 16-bit data word are decoded to drive
15 switches, E1 to E15. Each of these switches connects one of
the 15 matched resistors to either AGNDx or IOUT. The remain­ing 12 bits of the data-word drive Switch S0 to Switch S11 of
the 12-bit R-2R ladder network.

V

REF

2R

2R

E15

E14 E1

15 EQUAL SEGMENTS

RR R

2R

S11

Figure 32. DAC Ladder Structure

2R

2R

S10

12-BIT, R-2R L ADDER4 MSBs DECODED INTO

2RS02R

R/8

IOUT

AGNDx

VOUTx

REFERENCE BUFFERS

The AD5764 operates with an external reference. The reference
inputs (REFAB and REFCD) have an input range up to 7 V. This
input voltage is used to provide a buffered positive and negative
reference for the DAC cores. The positive reference is given by

+V

= 2 × V

REF

The negative reference to the DAC cores is given by

−V

= −2 × V

REF

These positive and negative reference voltages (along with the
gain register values) define the output ranges of the DACs.

REF

REF

05303-060

SERIAL INTERFACE

The AD5764 is controlled over a versatile 3-wire serial interface
that operates at clock rates of up to 30 MHz and is compatible
with SPI, QSPI™, MICROWIRE™, and DSP standards.

Input Shift Register

The input shift register is 24 bits wide. Data is loaded into the
device MSB first as a 24-bit word under the control of a serial
clock input, SCLK. The input shift register consists of a read/
write bit, three register select bits, three DAC address bits, and
16 data bits, as shown in Tab l e 9 . The timing diagram for this
operation is shown in Figure 2.

Upon power-up, the data register is loaded with zero code
(0x0000), and the outputs are clamped to 0 V via a low imped­ance path. The outputs can be updated with the zero code value
at this time by asserting either

LDAC

output voltage depends on the state of the BIN/
the BIN/

2sCOMP

pin is tied to DGND, the data coding is twos
complement, and the outputs update to 0 V. If the BIN/
pin is tied to DV

, the data coding is offset binary, and the

CC

outputs update to negative full scale. To power up the outputs
with zero code loaded to the outputs, hold the
during power-up.

Standalone Operation

The serial interface works with both a continuous and noncon­tinuous serial clock. A continuous SCLK source can only be

SYNC

used if

is held low for the correct number of clock cycles.
In gated clock mode, a burst clock containing the exact number
of clock cycles must be used and
the final clock to latch the data. The first falling edge of
starts the write cycle. Exactly 24 falling clock edges must be
applied to SCLK before
brought high before the 24

SYNC

is brought high again. If

th

falling SCLK edge, the data written
is invalid. If more than 24 falling SCLK edges are applied before
SYNC

is brought high, the input data is also invalid. The input
shift register addressed is updated on the rising edge of
For another serial transfer to take place,
low again. After the end of the serial data transfer, data is

automatically transferred from the input shift register to the
addressed register.

When the data has been transferred into the chosen register of
the addressed DAC, the data register and outputs can be
updated by taking

LDAC

low.

CLR

or

. The corresponding

2sCOMP

CLR

SYNC

must be taken high after

SYNC

must be brought

pin. If

2sCOMP

pin low

SYNC

SYNC

SYNC

is

.

Rev. F | Page 18 of 28

Data Sheet AD5764

x

Daisy-Chain Operation

1

68HC11

MOSI

SCK

PC7

PC6

MISO

1

ADDITIONAL PINS OMITTED FO R CLARITY

Figure 33. Daisy-Chaining the AD5764

SDIN

SCLK

SYNC

LDAC

SCLK

SYNC

LDAC

SCLK

SYNC

LDAC

AD5764

SDO

SDIN

AD5764

SDO

SDIN

AD5764

SDO

1

1

1

05303-061

For systems that contain several devices, the SDO pin can be
used to daisy-chain several devices together. This daisy-chain
mode can be useful in system diagnostics and in reducing the
number of serial interface lines. The first falling edge of

SYNC
starts the write cycle. The SCLK is continuously applied to the
input shift register when

SYNC

is low. If more than 24 clock
pulses are applied, the data ripples out of the input shift register
and appears on the SDO line. This data is clocked out on the
rising edge of SCLK and is valid on the falling edge. By connect­ing the SDO of the first device to the SDIN input of the next device
in the chain, a multidevice interface is constructed. Each device in
the system requires 24 clock pulses. Therefore, the total number of
clock cycles must equal 24N, where N is the total number of
AD5764 devices in the chain. When the serial transfer to all
devices is complete,

SYNC

is taken high. This latches the input
data in each device in the daisy chain and prevents any further
data from being clocked into the input shift register. The serial
clock can be a continuous or a gated clock.

A continuous SCLK source can only be used if

SYNC

is held low
for the correct number of clock cycles. In gated clock mode, a burst
clock containing the exact number of clock cycles must be used,

SYNC

and

must be taken high after the final clock to latch the data.

Readback Operation

Before a readback operation is initiated, the SDO pin must be
enabled by writing to the function register and clearing the SDO

disable bit; this bit is cleared by default. Readback mode is invoked
by setting the R/
With R/

W

bit = 1 in the serial input shift register write.

W

= 1, Bit A2 to Bit A0, in association with Bit REG2,
Bit REG1, and Bit REG0, select the register to be read. The
remaining data bits in the write sequence are don’t cares. During
the next SPI write, the data appearing on the SDO output
contain the data from the previously addressed register. For a
read of a single register, the NOP command can be used in
clocking out the data from the selected register on SDO. The
readback diagram in shows the readback sequence. For

Figure 4
example, to read back the fine gain register of Channel A on the
AD5764, implement the following:

1. Write 0xA0XXXX to the AD5764 input shift register. This

configures the AD5764 for read mode with the fine gain
register of Channel A selected. Note that all the data bits,
DB15 to DB0, are don’t cares.

2. Follow this with a second write, an NOP condition,

0x00XXXX. During this write, the data from the fine gain
register is clocked out on the SDO line, that is, data clocked
out contain the data from the fine gain register in Bit DB5
to Bit DB0.

SIMULTANEOUS UPDATING VIA LDAC

Depending on the status of both

SYNC
data has been transferred into the input register of the DACs,
there are two ways in which the data register and DAC outputs
can be updated.

Individual DAC Updating

In this mode,

LDAC

is held low while data is being clocked into
the input shift register. The addressed DAC output is updated
on the rising edge of

SYNC

.

Simultaneous Updating of All DACs

In this mode,

LDAC

is held high while data is being clocked
into the input shift register. All DAC outputs are updated by
taking

LDAC

low any time after

SYNC

The update now occurs on the falling edge of

V

REFIN

LDAC

SCLK

SYNC

SDIN

Figure 34. Simplified Serial Interface of Input Loading Circuitry

16-BIT

DAC

DATA

REGISTER

INPUT

REGISTER

INTERFACE

LOGIC

for One DAC Channel

LDAC

and

, and after

has been taken high.

LDAC

.

OUTPUT

I/V AMPLIFI ER

V

OUT

SDO

05303-062

Rev. F | Page 19 of 28

AD5764 Data Sheet

TRANSFER FUNCTION

Tabl e 7 and Ta b le 8 show the ideal input code to output voltage
relationship for the AD5764 for both offset binary and twos
complement data coding, respectively.

Table 7. Ideal Output Voltage to Input Code Relationship—
Offset Binary Data Coding

Digital Input Analog Output

MSB LSB VOUTx

1111 1111 1111 1111 +2 V
1000 0000 0000 0001 +2 V
1000 0000 0000 0000 0 V
0111 1111 1111 1111
0000 0000 0000 0000 −2 V

Table 8. Ideal Output Voltage to Input Code Relationship—
Twos Complement Data Coding

Digital Input Analog Output

MSB LSB VOUTx

0111 1111 1111 1111 +2 V
0000 0000 0000 0001 +2 V
0000 0000 0000 0000
1111 1111 1111 1111
1000 0000 0000 0000 −2 V

× (32,767/32,768)

REF

× (1/32,768)

REF

−2 V

× (1/32,768)

REF

× (32,767/32,768)

REF

× (32,767/32,768)

REF

× (1/32,768)

REF

0 V

−2 V

× (1/32,768)

REF

× (32,767/32,768)

REF

The output voltage expression for the AD5764 is given by

D

OUT

×+×−=

42

⎡

VVV

REFINREFIN

⎢
⎣

⎤
⎥

536,65

⎦

where:
D is the decimal equivalent of the code loaded to the DAC.

is the reference voltage applied at the REFAB/REFCD pins.

V

REFIN

ASYNCHRONOUS CLEAR (CLR)

CLR

is a negative edge triggered clear that allows the outputs to

be cleared to either 0 V (twos complement coding) or negative
full scale (offset binary coding). It is necessary to maintain
low for a minimum amount of time (see ) for the operation

CLR

to complete. When the

signal is returned high, the output

Figure 2

remains at the cleared value until a new value is programmed. If

CLR

at power-on,

is at 0 V, then all DAC outputs are updated
with the clear value. A clear can also be initiated through software
by writing Command 0x04XXXX to the AD5764.

CLR

Table 9. Input Shift Register Bit Map

MSB LSB
DB23 DB22 DB21 DB20 DB19 DB18 DB17 DB16 DB15:DB0

0 REG2 REG1 REG0 A2 A1 A0 Data

R/W

Table 10. Input Shift Register Bit Functions

Bit Description

R/W
REG2, REG1, REG0

Indicates a read from or a write to the addressed register.
Used in association with the address bits to determine if a read or write operation is to the data register, offset

register, coarse gain register, fine gain register, or function register.

REG2 REG1 REG0 Function

0 0 0 Function register
0 1 0 Data register
0 1 1 Coarse gain register
1 0 0 Fine gain register
1 0 1 Offset register
A2, A1, A0 These bits are used to decode the DAC channels.

A2 A1 A0 Channel Address

0 0 0 DAC A
0 0 1 DAC B
0 1 0 DAC C
0 1 1 DAC D
1 0 0 All DACs
Data Data bits.

Rev. F | Page 20 of 28

Data Sheet AD5764

FUNCTION REGISTER

The function register is addressed by setting the three REG bits to 000. The values written to the address bits and the data bits determine
the function addressed. The functions available via the function register are outlined in Table 1 1 and Ta b le 1 2.

Table 11. Function Register Options

REG2 REG1 REG0 A2 A1 A0 DB15:DB6 DB5 DB4 DB3 DB2 DB1 DB0

0 0 0 0 0 0 NOP, data = don’t care
0 0 0 0 0 1 Don’t care Local ground

0 0 0 1 0 0 Clear, data = don’t care
0 0 0 1 0 1 Load, data = don’t care

offset adjust

Table 12. Explanation of Function Register Options

Option Description

NOP No operation instruction used in readback operations.
Local Ground Offset Adjust

D0/D1 Direction

D0/D1 Value

SDO Disable Set by the user to disable the SDO output. Cleared by the user to enable the SDO output (default).
Clear

Load Addressing this function updates the data register and consequently the analog outputs.

Set by the user to enable the local ground offset adjust function. Cleared by the user to disable the local
ground offset adjust function (default). Refer to the Design Features section for further details.

Set by the user to enable D0/D1 as outputs. Cleared by the user to enable D0/D1 as inputs (default). Refer
to the Design Features section for further details.

I/O port status bits. Logic values written to these locations determine the logic outputs on the D0 and D1
pins when configured as outputs. These bits indicate the status of the D0 and D1 pins when the I/O port is
active as an input. When enabled as inputs, these bits are don’t cares during a write operation.

Addressing this function resets the DAC outputs to 0 V in twos complement mode and negative full scale in
binary mode.

D1 direction D1 value D0 direction D0 value SDO disable

DATA REGISTER

The data register is addressed by setting the three REG bits to 010. The DAC address bits select with which DAC channel the data transfer
is to take place (see Tabl e 10 ). The data bits are in Position DB15 to Position DB0, as shown in Tab le 1 3.

Table 13. Programming the Data Register Bit Map

REG2 REG1 REG0 A2 A1 A0 DB15:DB0

0 1 0 DAC address 16-bit DAC data

COARSE GAIN REGISTER

The coarse gain register is addressed by setting the three REG bits to 011. The DAC address bits select with which DAC channel the data
transfer is to take place (see Tabl e 10 ). The coarse gain register is a 2-bit register and allows the user to select the output range of each
DAC, as shown in Tabl e 1 4 and Tab l e 1 5 .

Table 14. Programming the Coarse Gain Register Bit Map

REG2 REG1 REG0 A2 A1 A0 DB15: DB2 DB1 DB0

0 1 1 DAC address Don’t care CG1 CG0

Table 15. Output Range Selection

Output Range CG1 CG0

±10 V (Default) 0 0
±10.2564 V 0 1
±10.5263 V 1 0

Rev. F | Page 21 of 28

AD5764 Data Sheet

FINE GAIN REGISTER

The fine gain register is addressed by setting the three REG bits
to 100. The DAC address bits select with which DAC channel
the data transfer is to take place (see Tab l e 1 0 ). The fine gain
register is a 6-bit register and allows the user to adjust the gain
of each DAC channel by −32 LSBs to +31 LSBs in 1 LSB
increments, as shown in Tabl e 1 6 and Tab l e 1 7 . The adjustment
is made to both the positive full-scale points and the negative
full-scale points simultaneously, each point being adjusted by ½
of one step. The fine gain register coding is twos complement.

Table 16. Programming the Fine Gain Register Bit Map

REG2 REG1 REG0 A2 A1 A0 DB15:DB6 DB5 DB4 DB3 DB2 DB1 DB0

1 0 0 DAC address Don’t care FG5 FG4 FG3 FG2 FG1 FG0

Table 17. Fine Gain Register Options

Gain Adjustment FG5 FG4 FG3 FG2 FG1 FG0

+31 LSBs 0 1 1 1 1 1
+30 LSBs 0 1 1 1 1 0
… … … … … … …
+2 LSBs 0 0 0 0 1 0
+1 LSB 0 0 0 0 0 1
No Adjustment (Default) 0 0 0 0 0 0

−1 LSB 1 1 1 1 1 1

−2 LSBs 1 1 1 1 1 0
… … … … … … …

−31 LSBs 1 0 0 0 0 1

−32 LSBs 1 0 0 0 0 0

OFFSET REGISTER

The offset register is addressed by setting the three REG bits to

101. The DAC address bits select with which DAC channel the
data transfer is to take place (see Tab l e 1 0 ). The AD5764 offset
register is an 8-bit register and allows the user to adjust the offset
of each channel by −16 LSBs to +15.875 LSBs in increments of
⅛ LSB, as shown in Tab le 1 8 and Ta b le 1 9. The offset register
coding is twos complement.

Table 18. Programming the Offset Register Bit Map

REG2 REG1 REG0 A2 A1 A0 DB15:DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

1 0 1 DAC address Don’t care OF7 OF6 OF5 OF4 OF3 OF2 OF1 OF0

Table 19. AD5764 Offset Register Options

Offset Adjustment OF7 OF6 OF5 OF4 OF3 OF2 OF1 OF0

+15.875 LSBs 0 1 1 1 1 1 1 1
+15.75 LSBs 0 1 1 1 1 1 1 0
… … … … … … … … …
+0.25 LSBs 0 0 0 0 0 0 1 0
+0.125 LSBs 0 0 0 0 0 0 0 1
No Adjustment (Default) 0 0 0 0 0 0 0 0

−0.125 LSBs 1 1 1 1 1 1 1 1

−0.25 LSBs 1 1 1 1 1 1 1 0
… … … … … … … … …

−15.875 LSBs 1 0 0 0 0 0 0 1

−16 LSBs 1 0 0 0 0 0 0 0

Rev. F | Page 22 of 28

Data Sheet AD5764

e

t

d

OFFSET AND GAIN ADJUSTMENT WORKED EXAMPLE

Using the information provided in the Fine Gain Register and
Offset Register sections, the following worked example demon­strates how the AD5764 functions can be used to eliminate both
offset and gain errors. Because the AD5764 is factory calibrated,
offset and gain errors should be negligible. However, errors can
be introduced by the system that the AD5764 is operating within;
for example, a voltage reference value that is not equal to 5 V
introduces a gain error. An output range of ±10 V and twos
complement data coding is assumed.

Removing Offset Error

The AD5764 can eliminate an offset error in the range of −4.88 mV
to +4.84 mV with a step size of ⅛ of a 16-bit LSB.

Calculate the step size of the offset adjustment.

20

=SizeStepAdjustOffset

16

82

×

Measure the offset error by programming 0x0000 to the data
register and measuring the resulting output voltage. For this
example, the measured value is 614 µV.

Calculate the number of offset adjustment steps that this value
represents.

StepsofNumber

V614

=

V14.38

The offset error measured is positive, therefore, a negative
adjustment of 16 steps is required. The offset register is eight
bits wide and the coding is twos complement. The required
offset register value can be calculated as follows:

Convert the adjustment value to binary: 00010000.

Measure

Steps16

Offse

V14.38

=

Valu

SizeStepOffset

==

Convert this to a negative twos complement number by inverting
all bits and adding 1 to obtain 11110000, the value that should
be programmed to the offset register.

Note that this twos complement conversion is not necessary in the
case of a positive offset adjustment. The value to be programmed to
the offset register is simply the binary representation of the
adjustment value.

Removing Gain Error

The AD5764 can eliminate a gain error at negative full-scale
output in the range of −9.77 mV to +9.46 mV with a step size of
½ of a 16-bit LSB.

Calculate the step size of the gain adjustment.

20

=SizeStepAdjustGain

Measure the gain error by programming 0x8000 to the data
register and measuring the resulting output voltage. The gain
error is the difference between this value and −10 V. For this
example, the gain error is −1.2 mV.

Calculate how many gain adjustment steps this value represents.

StepsofNumber

mV2.1

V59.152

The gain error measured is negative (in terms of magnitude);
therefore, a positive adjustment of eight steps is required. The
gain register is 6 bits wide and the coding is twos complement,
the required gain register value can be determined as follows:

Convert the adjustment value to binary: 001000.

The value to be programmed to the gain register is simply this
binary number.

Steps8

=

=

16

22

×

V59.152

ValueGainMeasured

SizeStepGain

==

Rev. F | Page 23 of 28

AD5764 Data Sheet

DESIGN FEATURES

ANALOG OUTPUT CONTROL

In many industrial process control applications, it is vital that
the output voltage be controlled during power-up and during
brownout conditions. When the supply voltages are changing,
the VOUTx pins are clamped to 0 V via a low impedance path.
To prevent the output amp being shorted to 0 V during this time,
Transmission Gate G1 is also opened (see Figure 35). These condi­tions are maintained until the power supplies stabilize and a
valid word is written to the data register. At this time, G2 opens and
G1 closes. Both transmission gates are also externally controllable
via the reset logic (

RSTIN

) control input. For instance, if

is driven from a battery supervisor chip, the

RSTIN

RSTIN

input is
driven low to open G1 and close G2 upon power-down or during
a brownout. Conversely, the on-chip voltage detector output

RSTOUT

(

) is also available to the user to control other parts of
the system. The basic transmission gate functionality is shown
in . Figure 35

RSTOUT

VOLTAGE
MONITOR

AND

CONTRO L

G1

Figure 35. Analog Output Control Circuitry

G2

RSTIN

VOUTA

AGNDA

05303-063

DIGITAL OFFSET AND GAIN CONTROL

The AD5764 incorporates a digital offset adjust function with a
±16 LSB adjust range and 0.125 LSB resolution. The coarse gain
register allows the user to adjust the AD5764 full-scale output
range. The full-scale output can be programmed to achieve full­scale ranges of ±10 V, ±10.2564 V, and ±10.5263 V. A fine gain
trim is also provided.

PROGRAMMABLE SHORT-CIRCUIT PROTECTION

The short-circuit current of the output amplifiers can be pro­grammed by inserting an external resistor between the ISCC
pin and PGND. The programmable range for the current is 500 µA
to 10 mA, corresponding to a resistor range of 120 kΩ to 6 kΩ.
The resistor value is calculated as follows:

60

=

R

I

C

S

If the ISCC pin is left unconnected, the short-circuit current
limit defaults to 5 mA. Note that limiting the short-circuit
current to a small value can affect the slew rate of the output
when driving into a capacitive load; therefore, the value of the
programmed short circuit should take into account the size of
the capacitive load being driven.

DIGITAL I/O PORT

The AD5764 contains a 2-bit digital I/O port (D1 and D0).
These bits can be configured as inputs or outputs independently,
and can be driven or have their values read back via the serial
interface. The I/O port signals are referenced to DV

and DGND.

CC

When configured as outputs, they can be used as control signals
to multiplexers or can be used to control calibration circuitry
elsewhere in the system. When configured as inputs, the logic
signals from limit switches can, for example, be applied to D0
and D1 and can be read back via the digital interface.

LOCAL GROUND OFFSET ADJUST

The AD5764 incorporates a local ground offset adjust feature
that, when enabled in the function register, adjusts the DAC
outputs for voltage differences between the individual DAC ground
pins, AGNDx, and the REFGND pin, ensuring that the DAC
output voltages are always with respect to the local DAC ground
pin. For instance, if Pin AGNDA is at +5 mV with respect to the
REFGND pin and VOUTA is measured with respect to AGNDA,
a −5 mV error results, enabling the local ground offset adjust
feature to adjust VOUTA by +5 mV, eliminating the error.

Rev. F | Page 24 of 28

Data Sheet AD5764

V

APPLICATIONS INFORMATION

TYPICAL OPERATING CIRCUIT

Figure 36 shows the typical operating circuit for the AD5764.
The only external components needed for this precision 16-bit
DAC are a reference voltage source, decoupling capacitors on
the supply pins and reference inputs, and an optional short­circuit current setting resistor. Because the device incorporates
reference buffers, it eliminates the need for an external bipolar

+15

10µF

100nF

BIN/2sCO MP

+5V

SYNC

SCLK

SDIN

SDO

LDAC

D0

D1

1

SYNC

2

SCLK

3

SDIN

4

SDO

5

CLR

6

LDAC

7

D0

8

D1

2 6

+15V –15V

32 31 30 29 28 27 26 25

BIN/2sCOMP

reference and associated buffers. This leads to an overall savings
in both cost and board space.

In Figure 36, AV
to −15 V. However, AV
to +16.5 V and AV

is connected to +15 V and AVSS is connected

DD

can operate with supplies from +11.4 V

DD

can operate with supplies from −11.4 V to

SS

−16.5 V.

ADR02

VOUTVIN

GND

4

10µF

SS

DD

AV

AV

AD5764

100nF

NC

REFGND

NC

REFCD

100nF

REFAB

AGNDA

VOUTA

VOUTB

AGNDB

AGNDC

VOUTC

VOUTD

AGNDD

24

23

22

21

20

19

18

17

VOUTA

VOUTB

VOUTC

VOUTD

RSTOUT

RSTIN

DGND

RSTOUT

RSTIN

NC = NO CONNECT

10µF

DVCCAVDDPGND

100nF

+5V

9 10 11 12 13 14 15 16

100nF

10µF

+15V –15V

AVSSISCC

100nF

10µF

05303-064

Figure 36. Typical Operating Circuit

Rev. F | Page 25 of 28

AD5764 Data Sheet

Precision Voltage Reference Selection

To achieve the optimum performance from the AD5764 over its
full operating temperature range, a precision voltage reference
must be used. Consideration should be given to the selection of
a precision voltage reference. The AD5764 has two reference
inputs, REFAB and REFCD. The voltages applied to the refer­ence inputs are used to provide a buffered positive and negative
reference for the DAC cores. Therefore, any error in the voltage
reference is reflected in the outputs of the device.

There are four possible sources of error to consider when
choosing a voltage reference for high accuracy applications:
initial accuracy, temperature coefficient of the output voltage,
long-term drift, and output voltage noise.

Initial accuracy error on the output voltage of an external refer­ence can lead to a full-scale error in the DAC. Therefore, to
minimize these errors, a reference with low initial accuracy
error specification is preferred. Choosing a reference with an
output trim adjustment, such as the ADR425, allows a system
designer to trim system errors out by setting the reference

Table 20. Some Precision References Recommended for Use with the AD5764

Part No. Initial Accuracy (mV Max) Long-Term Drift (ppm Typ) Temp Drift (ppm/°C Max) 0.1 Hz to 10 Hz Noise (μV p-p Typ)

ADR435 ±2 40 3 8
ADR425 ±2 50 3 3.4
ADR02 ±5 50 3 10
ADR395 ±5 50 9 8

voltage to a voltage other than the nominal. The trim adjust­ment can also be used at temperature to trim out any error.

Long-term drift is a measure of how much the reference output
voltage drifts over time. A reference with a tight long-term drift
specification ensures that the overall solution remains relatively
stable over its entire lifetime.

The temperature coefficient of a reference output voltage affects
INL, DNL, and TUE. Choose a reference with a tight temperature
coefficient specification to reduce the dependence of the DAC
output voltage on ambient conditions.

In high accuracy applications, which have a relatively low noise
budget, reference output voltage noise needs to be considered.
Choosing a reference with as low an output noise voltage as
practical for the system resolution required is important. Precision
voltage references such as the ADR435 (XFET® design) produce
low output noise in the 0.1 Hz to 10 Hz region. However, as the
circuit bandwidth increases, filtering the output of the reference
may be required to minimize the output noise.

Rev. F | Page 26 of 28

Data Sheet AD5764

LAYOUT GUIDELINES

In any circuit where accuracy is important, careful consideration
of the power supply and ground return layout helps to ensure the
rated performance. The PCB on which the AD5764 is mounted
must be designed so that the analog and digital sections are sepa­rated and confined to certain areas of the board. If the AD5764 is
in a system where multiple devices require an AGND-to-DGND
connection, the connection is to be made at one point only. The
star ground point is established as close as possible to the device.
The AD5764 must have ample supply bypassing of 10 µF in parallel
with 0.1 µF on each supply, located as close to the package as
possible, ideally right up against the device. The 10 µF capacitors
are the tantalum bead type. The 0.1 µF capacitor must have low
effective series resistance (ESR) and low effective series inductance
(ESI), such as the common ceramic types, which provide a low
impedance path to ground at high frequencies to handle transient
currents due to internal logic switching.

The power supply lines of the AD5764 must be as large a trace
as possible to provide low impedance paths and reduce the effects
of glitches on the power supply line. Fast switching signals, such as
clocks, must be shielded with digital ground to avoid radiating
noise to other parts of the board, and must never be run near
the reference inputs. A ground line routed between the SDIN
and SCLK lines helps reduce crosstalk between them (not required
on a multilayer board, which has a separate ground plane; however,
it is helpful to separate the lines). It is essential to minimize noise
on the reference inputs because it couples through to the DAC
output. Avoid crossover of digital and analog signals. Traces on
opposite sides of the board must run at right angles to each other.
This reduces the effects of feedthrough on the board. A microstrip
technique is recommended, but not always possible with a double­sided board. In this technique, the component side of the board
is dedicated to the ground plane, and signal traces are placed on
the solder side.

GALVANICALLY ISOLATED INTERFACE

In many process control applications, it is necessary to provide
an isolation barrier between the controller and the unit being
controlled to protect and isolate the controlling circuitry from
any hazardous common-mode voltages that may occur. Isocoup­lers provide voltage isolation in excess of 2.5 kV. The serial
loading structure of the AD5764 makes it ideal for isolated

interfaces because the number of interface lines is kept to a
minimum. Figure 37 shows a 4-channel isolated interface to the
AD5764 using an ADuM1400. For more information, go to

www.analog.com.

MICRO CONTROLLER

SERIAL CLOCK

SERIAL DATA

SYNC OUT

CONTROL OUT

*ADDITI ONAL PI NS OMI TTED FO R CLARITY.

ADuM1400*

V

IA

OUT

OUT

ENCODE DECODE

V

IB

ENCODE DECODE

V

IC

ENCODE DECODE

V

ID

ENCODE DECODE

Figure 37. Isolated Interface

V

OA

TO SCLK

V

OB

TO SDIN

V

OC

TO SYNC

V

OD

TO LDAC

05303-065

MICROPROCESSOR INTERFACING

Microprocessor interfacing to the AD5764 is via a serial bus
that uses a standard protocol that is compatible with micro­controllers and DSP processors. The communications channel
is a 3-wire (minimum) interface consisting of a clock signal, a
data signal, and a synchronization signal. The AD5764 requires
a 24-bit data-word with data valid on the falling edge of SCLK.

For all the interfaces, the DAC output update can be performed
automatically when all the data is clocked in, or it can be done

LDAC

under the control of

. The contents of the data register

can be read using the readback function.

EVALUATION BOARD

The AD5764 comes with a full evaluation board to aid designers
in evaluating the high performance of the part with minimum
effort. All that is required with the evaluation board is a power
supply and a PC. The AD5764 evaluation kit includes a populated,
tested AD5764 PCB. The evaluation board interfaces to the USB
port of the PC. Software is available with the evaluation board,
which allows the user to easily program the AD5764. The software
runs on any PC that has Microsoft® Windows® 2000/NT/XP
installed.

The EVAL-AD5764EB data sheet is available, which gives full
details on the operation of the evaluation board.

Rev. F | Page 27 of 28

AD5764 Data Sheet

OUTLINE DIMENSIONS

1.20

0.75

1.05

1.00

0.95

0.15

SEATING

0.05

PLANE

VIEW A

ROTATED 90° CCW

0° MIN

0.08 MAX
COPLANARIT Y

0.20

0.09
7°

3.5°
0°

0.60

0.45

MAX

VIEW A

32

1

8

9

LEAD PITCH

9.00 BSC SQ

PIN 1

TOP VIEW

(PINS DOWN)

0.80
BSC

0.45

0.37

0.30

25

24

7.00

BSC SQ

17

16

COMPLIANT TO JEDEC STANDARDS MS-026-AB A

020607-A

Figure 38. 32-Lead Thin Plastic Quad Flat Package [TQFP]

(SU-32-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model1 INL Temperature Range Package Description Package Option

AD5764ASUZ ±4 LSB max −40°C to +85°C 32-Lead TQFP SU-32-2
AD5764ASUZ-REEL7 ±4 LSB max −40°C to +85°C 32-Lead TQFP SU-32-2
AD5764BSUZ ±2 LSB max −40°C to +85°C 32-Lead TQFP
AD5764BSUZ-REEL7 ±2 LSB max −40°C to +85°C 32-Lead TQFP
AD5764CSUZ ±1 LSB max −40°C to +85°C 32-Lead TQFP
AD5764CSUZ-REEL7 ±1 LSB max −40°C to +85°C 32-Lead TQFP
EVAL-AD5764EBZ Evaluation Board

1

Z = RoHS Compliant Part.

SU-32-2
SU-32-2
SU-32-2
SU-32-2

©2006–2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D05303-0-9/11(F)

Rev. F | Page 28 of 28