Complete, quad, 12-/14-/16-bit DACs
Operates from single/dual supplies
Software programmable output range
+5 V, +10 V, +10.8 V, ±5 V, ±10 V, ±10.8 V
INL error: ±16 LSB maximum, DNL error: ±1 LSB maximum
Total unadjusted error (TUE): 0.1% FSR maximum
Settling time: 10 μs typical
Integrated reference: ±5 ppm/°C maximum
Integrated reference buffers
Output control during power-up/brownout
Simultaneous updating via
Asynchronous
DSP/microcontroller-compatible serial interface
24-lead TSSOP
Operating temperature range: −40°C to +85°C
iCMOS process technology
to zero scale/midscale
CLR
APPLICATIONS
Industrial automation
Closed-loop servo control, process control
Automotive test and measurement
Programmable logic controllers
LDAC
1
Unipolar/Bipolar Voltage Output DACs
AD5724R/AD5734R/AD5754R
GENERAL DESCRIPTION
The AD5724R/AD5734R/AD5754R are quad, 12-/14-/16-bit
serial input, voltage output, digital-to-analog converters (DACs).
They operate from single supply voltages of +4.5 V up to +16.5 V
or dual supply voltages from ±4.5 V up to ±16.5 V. Nominal
full-scale output range is software selectable from +5 V, +10 V,
+10.8 V, ±5 V, ±10 V, or ±10.8 V. Integrated output amplifiers,
reference buffers, and proprietary power-up/power-down
control circuitry are also provided.
The parts offer guaranteed monotonicity, integral nonlinearity
(INL) of ±16 LSB maximum, low noise, 10 µs typical settling
time, and an on-chip +2.5 V reference.
The AD5724R/AD5734R/AD5754R use a serial interface that
operates at clock rates up to 30 MHz and are compatible with
DSP and microcontroller interface standards. Double buffering
allows the simultaneous updating of all DACs. The input coding
is user-selectable twos complement or offset binary for a bipolar
output (depending on the state of Pin BIN/
binary for a unipolar output. The asynchronous clear function
clears all DAC registers to a user-selectable zero-scale or midscale output. The parts are available in a 24-lead TSSOP and
offer guaranteed specifications over the −40°C to +85°C
industrial temperature range.
2sCOMP
) and straight
1
iCMOS®, Reg. U.S. Patent and Trademark Office.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Table 1. Pin Compatible Devices
Part Number Description
AD5724/AD5734/AD5754
AD5722/AD5732/AD5752
AD5722R/AD5732R/AD5752R
AD5724R/AD5734R/AD5754R
without internal reference.
Complete, dual, 12-/14-/16-bit,
serial input, unipolar/bipolar,
voltage output DACs.
Changes to Ordering Guide .......................................................... 32
1/09—Revision 0: Initial Version
Rev. B | Page 2 of 32
Page 3
AD5724R/AD5734R/AD5754R
FUNCTIONAL BLOCK DIAGRAM
AV
AV
SS
AD5724R/AD5734R/AD5754R
DV
CC
DD
2.5V
REFERENCE
REFIN/REFOUT
REFERENCE
BUFFERS
SDIN
SCLK
SYNC
SDO
CLR
BIN/2sCOMP
INPUTSHIFT
REGISTER
AND
CONTROL
LOGIC
AD5724R: n = 12-BI T
AD5734R: n = 14-BI T
AD5754R: n = 16-BI T
n
GND
INPUT
REGISTER A
INPUT
REGISTER B
INPUT
REGISTER C
INPUT
REGISTER D
DAC
REGISTER A
DAC
REGISTER B
DAC
REGISTER C
DAC
REGISTER D
LDAC
n
DAC A
n
DAC B
n
DAC C
n
DAC D
DAC_GND (2)SIG_GND (2)
V
A
OUT
B
V
OUT
C
V
OUT
D
V
OUT
06465-001
Figure 1.
Rev. B | Page 3 of 32
Page 4
AD5724R/AD5734R/AD5754R
SPECIFICATIONS
AVDD = 4.5 V1 to 16.5 V, AVSS = −4.5 V1 to −16.5 V or AVSS = 0 V, GND = 0 V, REFIN= +2.5 V external, DVCC = 2.7 V to 5.5 V,
R
= 2 kΩ, C
LOAD
Table 2.
Parameter Min Typ Max Unit Test Conditions/Comments
ACCURACY Outputs unloaded
Resolution
AD5754R 16 Bits
AD5734R 14 Bits
AD5724R 12 Bits
Total Unadjusted Error (TUE) −0.1 +0.1 % FSR
Integral Nonlinearity (INL)2
AD5754R −16 +16 LSB
AD5734R −4 +4 LSB
AD5724R −1 +1 LSB
Differential Nonlinearity (DNL) −1 +1 LSB All models, guaranteed monotonic
Bipolar Zero Error −6 +6 mV TA = 25°C, error at other temperatures obtained using
Bipolar Zero TC3 ±4 ppm FSR/°C
Zero-Scale Error −6 +6 mV TA = 25°C, error at other temperatures obtained using
Zero-Scale TC
Offset Error −6 +6 mV TA = 25°C, error at other temperatures obtained using
Offset Error TC
Gain Error −0.025 +0.025 % FSR ±10 V range, TA = 25°C, error at other temperatures
Gain Error
Gain Error
Gain TC
DC Crosstalk
REFERENCE INPUT/OUTPUT
Reference Input
Reference Input Voltage 2.5 V ±1% for specified performance
DC Input Impedance 1 5 MΩ
Input Current −2 ±0.5 +2 μA
Reference Range 2 3 V
Reference Output
Output Voltage 2.497 2.501 V TA = 25°C
Reference TC
2.2 10 ppm/°C TA = −40°C to +85°C
Output Noise (0.1 Hz to 10 Hz)3
Noise Spectral Density
OUTPUT CHARACTERISTICS
Output Voltage Range −10.8 +10.8 V AVDD/AVSS = ±11.7 V min, REFIN = +2.5 V
−12 +12 V AVDD/AVSS = ±12.9 V min, REFIN = +3 V
Headroom 0.5 0.9 V
Output Voltage TC ±4 ppm FSR/°C
Output Voltage Drift vs. Time ±12 ppm FSR/500 hr ±15 ppm FSR/1000 hr
Short-Circuit Current 20 mA
Load 2 kΩ For specified performance
Capacitive Load Stability 4000 pF
DC Output Impedance 0.5 Ω
= 200 pF, all specifications T
LOAD
MIN
to T
, unless otherwise noted.
MAX
bipolar zero TC
zero-scale TC
3
±4 ppm FSR/°C
offset error TC
3
±4 ppm FSR/°C
obtained using gain TC
3
−0.065 0 +10 V and +5 V ranges, T
temperatures obtained using gain TC
3
0 +0.08 ±5 V range, T
= 25°C, error at other temperatures
A
obtained using gain TC
3
3
3
3, 4
1.8 5 ppm/°C TA = 0°C to 85°C
±4 ppm FSR/°C
120 μV
5 μV p-p
3
3
75 nV/√Hz @ 10 kHz
Rev. B | Page 4 of 32
= 25°C, error at other
A
Page 5
AD5724R/AD5734R/AD5754R
Parameter Min Typ Max Unit Test Conditions/Comments
DIGITAL INPUTS
Input High Voltage, VIH 2 V
Input Low Voltage, VIL 0.8 V
Input Current ±1 μA Per pin
Pin Capacitance 5 pF Per pin
DIGITAL OUTPUTS (SDO)
Output Low Voltage, VOL 0.4 V DVCC = 5 V ± 10%, sinking 200 μA
Output High Voltage, VOH DVCC − 1 V DV
Output Low Voltage, VOL 0.4 V DVCC = 2.7 V to 3.6 V, sinking 200 μA
Output High Voltage, VOH DVCC − 0.5 V DVCC = 2.7 V to 3.6 V, sourcing 200 μA
High Impedance Leakage Current ±1 μA
High Impedance Output
Capacitance
POWER REQUIREMENTS
AVDD 4.5 16.5 V
AVSS −4.5 −16.5 V
DVCC 2.7 5.5 V
Power Supply Sensitivity
∆V
AIDD 2.5 mA/channel Outputs unloaded
1.75 mA/channel AVSS = 0 V, outputs unloaded
AISS 2.2 mA/channel Outputs unloaded
DICC 0.5 3 μA VIH = DVCC, VIL = GND, 0.5 μA typical
Power Dissipation 310 mW ±16.5 V operation, outputs unloaded
115 mW +16.5 V operation, outputs unloaded
Power-Down Currents All DAC channels and internal reference
AIDD 40 μA
AISS 40 μA
DICC 300 nA
1
For specified performance, headroom requirement is 0.9 V.
2
INL is the relative accuracy. It is measured from Code 512, Code 128, Code 32 for the AD5754R, AD5734R, AD5724R respectively.
3
Guaranteed by characterization; not production tested.
4
The on-chip reference is production trimmed and tested at 25°C and 85°C. It is characterized from −40°C to +85°C.
3
3
DVCC = 2.7 V to 5.5 V, JEDEC compliant
= 5 V ± 10%, sourcing 200 μA
CC
5 pF
3
/∆ΑVDD −65 dB 200 mV sine wave superimposed on AVSS/AVDD @
OUT
50 Hz/60 Hz
powered-down
Rev. B | Page 5 of 32
Page 6
AD5724R/AD5734R/AD5754R
AC PERFORMANCE CHARACTERISTICS
AVDD = 4.5 V1 to 16.5 V, AVSS = −4.5 V1 to −16.5 V or 0 V, GND = 0 V, REFIN= 2.5 V external, DVCC = 2.7 V to 5.5 V, R
C
= 200 pF, all specifications T
LOAD
MIN
to T
, unless otherwise noted.
MAX
Table 3.
Parameter2 Min Typ Max Unit Test Conditions/Comments
DYNAMIC PERFORMANCE
Output Voltage Settling Time 10 12 μs 20 V step to ±0.03 % FSR
7.5 8.5 μs 10 V step to ±0.03 % FSR
5 μs 512 LSB step settling (16-bit resolution)
Slew Rate 3.5 V/μs
Digital-to-Analog Glitch Energy 13 nV-sec
Glitch Impulse Peak Amplitude 35 mV
Digital Crosstalk 10 nV-sec
DAC-to-DAC Crosstalk 10 nV-sec
Digital Feedthrough 0.6 nV-sec
Output Noise
Output Noise Spectral Density 320 nV/√Hz Measured at 10 kHz, 0x8000 DAC code
1
For specified performance, headroom requirement is 0.9 V.
2
Guaranteed by design and characterization; not production tested.
LOAD
= 2 kΩ,
TIMING CHARACTERISTICS
AVDD = 4.5 V to 16.5 V, AVSS = −4.5 V to −16.5 V or 0 V, GND = 0 V, REFIN = 2.5 V external, DVCC = 2.7 V to 5.5 V, R
C
= 200 pF, all specifications are T
LOAD
Table 4.
1, 2, 3
Parameter
4
t
33 ns min SCLK cycle time
1
Limit at T
t2 13 ns min SCLK high time
t3 13 ns min SCLK low time
t4 13 ns min
t5 13 ns min
t6 100 ns min
t7 5 ns min Data setup time
t8 0 ns min Data hold time
t9 20 ns min
t10 20 ns min
t11 20 ns min
t12 10 μs typ DAC output settling time
t13 20 ns min
t14 2.5 μs max
5
t
15
5
t
40 ns max SCLK rising edge to SDO valid (C
16
13 ns min
t17 200 ns min
1
Guaranteed by characterization; not production tested.
2
All input signals are specified with tR = tF = 5 ns (10% to 90% of DVCC) and timed from a voltage level of 1.2 V.
3
See Figure 2, Figure 3, and Figure 4.
4
To accommodate t16, in readback and daisy-chain modes the SCLK cycle time must be increased to 90 ns.
5
Daisy-chain and readback mode.
6
C
= capacitive load on SDO output.
L SDO
MIN
, T
MIN
MAX
to T
, unless otherwise noted.
MAX
Unit Description
falling edge to SCLK falling edge setup time
SYNC
SCLK falling edge to SYNC
Minimum SYNC
falling edge to SYNC falling edge
LDAC
rising edge to LDAC falling edge
SYNC
pulse width low
LDAC
pulse width low
CLR
pulse activation time
CLR
rising edge to SCLK falling edge
SYNC
Minimum SYNC
rising edge
high time (write mode)
6
= 15 pF)
L SDO
high time (readback/daisy-chain mode)
LOAD
= 2 kΩ,
Rev. B | Page 6 of 32
Page 7
AD5724R/AD5734R/AD5754R
TIMING DIAGRAMS
t
1
SCLK
SYNC
SDIN
LDAC
V
OUT
V
OUT
CLR
V
OUT
t
6
t
4
t
7
DB23
t
9
x
x
x
t
3
t
8
t
13
t
14
4221
t
2
t
5
DB0
t
t
10
11
t
12
t
12
06465-002
Figure 2. Serial Interface Timing Diagram
t
1
SCLK
SYNC
SDIN
SDO
LDAC
t
17
t
4
t
7
t
3
t
8
t
2
INPUTWORDFORDACN-1INPUTWORD FOR DACN
t
16
DB23
INPUT WORD F OR DAC NUNDEFINED
8442
DB0
t
5
t
15
0BD32BD0BD32BD
t
10
t
11
06465-003
Figure 3. Daisy-Chain Timing Diagram
Rev. B | Page 7 of 32
Page 8
AD5724R/AD5734R/AD5754R
SCLK
SYNC
1
t
1
17
4242
SDIN
SDO
REGISTER TO BE READ
UNDEFINED
Figure 4. Readback Timing Diagram
NOP CONDITIONINPUT WORD SPECIFIES
SELECTED REGISTER DATA
CLOCKED OUT
0BD32BD0BD32BD
0BD32BD0BD32BD
06465-004
Rev. B | Page 8 of 32
Page 9
AD5724R/AD5734R/AD5754R
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Transient currents of up to
100 mA do not cause SCR latch-up.
Table 5.
Parameter Rating
AVDD to GND −0.3 V to +17 V
AVSS to GND +0.3 V to −17 V
DVCC to GND −0.3 V to +7 V
Digital Inputs to GND
Digital Outputs to GND
REFIN/REFOUT to GND −0.3 V to +5 V
V
x to GND AVSS to AVDD
OUT
DAC_GND to GND −0.3 V to +0.3 V
SIG_GND to GND −0.3 V to +0.3 V
Operating Temperature Range, TA
Industrial −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Junction Temperature, TJ max 150°C
24-Lead TSSOP Package
θJA Thermal Impedance 42°C/W
θJC Thermal Impedance 9°C/W
Power Dissipation (TJ max – TA)/θJA
Lead Temperature JEDEC industry standard
Soldering J-STD-020
ESD (Human Body Model) 3.5 kV
−0.3 V to DV
(whichever is less)
−0.3 V to DV
(whichever is less)
+ 0.3 V or 7 V
CC
+ 0.3 V or 7 V
CC
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. B | Page 9 of 32
Page 10
AD5724R/AD5734R/AD5754R
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
AV
1
AV
SS
2
NC
AD5724R/
3
A
V
OUT
V
OUT
BIN/2sCOMP
SYNC
SCLK
SDIN
LDAC
NOTES
1. NC = NO CONNECT
2. IT IS RE COMMENDED THAT THE
EXPOSED PAD BE THERMALLY
CONNECTED TO A COPPER PLANE
FOR ENHANCED THERMA L
PERFORMANCE.
NC
CLR
NC
4
B
5
6
7
8
9
10
11
12
AD5734R/
AD5754R
TOP VIEW
(Not to Scale)
Figure 5. Pin Configuration
Table 6. Pin Function Descriptions
Pin No. Mnemonic Description
1 AVSS
Negative Analog Supply Pin. Voltage range is from –4.5 V to –16.5 V. This pin can be connected to 0 V if
output ranges are unipolar.
2, 6, 12, 13 NC No Connect. Do not connect to these pins.
3 V
4 V
5
A Analog Output Voltage of DAC A. The output amplifier is capable of directly driving a 2 kΩ, 4000 pF load.
OUT
B Analog Output Voltage of DAC B. The output amplifier is capable of directly driving a 2 kΩ, 4000 pF load.
OUT
BIN/2sCOMP
This pin determines the DAC coding for a bipolar output range. This pin should be hardwired to either DV
or GND. When hardwired to DV
, input coding is offset binary. When hardwired to GND, input coding is twos
Active Low Input. This is the frame synchronization signal for the serial interface. While SYNC is low, data is
SYNC
transferred on the falling edge of SCLK. Data is latched on the rising edge of SYNC.
8 SCLK
Serial Clock Input. Data is clocked into the shift register on the falling edge of SCLK. This operates at clock
speeds up to 30 MHz.
9 SDIN Serial Data Input. Data must be valid on the falling edge of SCLK.
10
LDAC
Load DAC, Logic Input. This is used to update the DAC registers and, consequently, the analog output. When
tied permanently low, the addressed DAC register is updated on the rising edge of SYNC
during the write cycle, the DAC input register is updated, but the output update is held off until the falling
11
CLR
edge of LDAC
The LDAC
Active Low Input. Asserting this pin sets the DAC registers to zero-scale code or midscale code (user selectable).
. In this mode, all analog outputs can be updated simultaneously on the falling edge of LDAC.
pin should not be left unconnected.
14 DVCC Digital Supply Pin. Voltage range is from 2.7 V to 5.5 V.
15 GND Ground Reference Pin.
16 SDO
Serial Data Output. Used to clock data from the serial register in daisy-chain or readback mode. Data is
clocked out on the rising edge of SCLK and is valid on the falling edge of SCLK.
17 REFIN/REFOUT
External Reference Voltage Input and Internal Reference Voltage Output. Reference input range is 2 V to 3 V.
REFIN = 2.5 V for specified performance. REFOUT = 2.5 V ± 2 mV @ 25°C.
18, 19 DAC_GND Ground reference pins for the four digital-to-analog converters.
20, 21 SIG_GND Ground reference pins for the four output amplifiers.
22 V
23 V
D Analog Output Voltage of DAC D. The output amplifier is capable of directly driving a 2 kΩ, 4000 pF load.
OUT
C Analog Output Voltage of DAC C. The output amplifier is capable of directly driving a 2 kΩ, 4000 pF load.
OUT
24 AVDD Positive Analog Supply Pin. Voltage range is from 4.5 V to 16.5 V.
25 (EPAD)
Exposed
Paddle (EPAD)
The exposed paddle should be connected to the potential of the AV
electrically unconnected. It is recommended that the paddle be thermally connected to a copper plane for
enhanced thermal performance.
24
DD
23
V
C
OUT
22
D
V
OUT
21
SIG_GND
SIG_GND
20
19
DAC_GND
18
DAC_GND
17
REFIN/REFOUT
16
SDO
15
GND
DV
14
CC
NC
13
06465-005
CC
. If LDAC is held high
pin or, alternatively, it can be left
SS
Rev. B | Page 10 of 32
Page 11
AD5724R/AD5734R/AD5754R
TYPICAL PERFORMANCE CHARACTERISTICS
6
4
2
AVDD/AVSS = +12V/0V, RANGE = +10V
AV
/AVSS = ±12V, RANGE = ±10V
DD
AV
/AVSS = ±6.5V, RANGE = ±5V
DD
AV
/AVSS = +6.5V/0V, RANGE = +5V
DD
0.6
0.4
0.2
0
–2
INL ERROR (LSB)
–4
–6
–8
010,000 20,000 30,00040,000 50,000 60,000
CODE
Figure 6. AD5754R Integral Nonlinearity Error vs. Code
1.5
1.0
0.5
0
–0.5
INL ERROR (LSB)
–1.0
–1.5
–2.0
02000 4000 6000 8000 10,000 12,000 14,000 16,000
AVDD/AVSS = +12V/0V, RANGE = +10V
AV
/AVSS = ±12V, RANGE = ±10V
DD
AV
/AVSS = ±6.5V, RANGE = ±5V
DD
AV
/AVSS = +6.5V/0V, RANGE = +5V
DD
CODE
Figure 7. AD5734R Integral Nonlinearity Error vs. Code
0
–0.2
DNL ERROR (LS B)
–0.4
AVDD/AVSS = +12V/0V, RANGE = +10V
–0.6
AV
/AVSS = ±12V, RANGE = ±10 V
DD
AV
/AVSS = ±6.5V, RANGE = ±5V
DD
AV
/AVSS = +6.5V/0V, RANGE = +5V
–0.8
6465-013
DD
010,000 20,000 30,00040,000 50,000 60,000
CODE
06465-016
Figure 9. AD5754R Differential Nonlinearity Error vs. Code
0.15
0.10
0.05
0
–0.05
DNL ERROR (LSB)
–0.10
AVDD/AVSS = +12V/0V, RANGE = +10V
–0.15
AV
/AVSS = ±12V, RANGE = ±10V
DD
AV
/AVSS = ±6.5V, RANGE = ±5V
DD
AV
/AVSS = +6.5V/0V, RANGE = +5V
–0.20
6465-014
DD
02000 4000 6000 8000 10,000 12,000 14,000 16,000
CODE
06465-017
Figure 10. AD5734R Differential Nonlinearity Error vs. Code
0.3
0.2
0.1
0
–0.1
–0.2
INL ERROR (LSB)
–0.3
–0.4
–0.5
05001000 1500 2000 2500 3000 3500 4000
AVDD/AVSS = +12V/0V, RANGE = +10V
AV
/AVSS = ±12V, RANGE = ±10 V
DD
AV
/AVSS = ±6.5V, RANGE = ±5V
DD
AV
/AVSS = +6.5V/0V, RANGE = +5V
DD
CODE
Figure 8. AD5724R Integral Nonlinearity Error vs. Code
06465-015
Rev. B | Page 11 of 32
0.04
AVDD/AVSS = +12V/0V, RANGE = +10V
AV
/AVSS = ±12V, RANGE = ±10V
DD
AV
/AVSS = ±6.5V, RANGE = ±5V
DD
AV
/AVSS = +6.5V/0V, RANGE = +5V
DD
0
05001000 1500 2000 2500 3000 3500 4000
CODE
DNL ERROR (LSB)
0.03
0.02
0.01
–0.01
–0.02
–0.03
–0.04
–0.05
Figure 11. AD5724R Differential Nonlinearity Error vs. Code
06465-018
Page 12
AD5724R/AD5734R/AD5754R
8
6
4
MAX INL ±10V
2
0
–2
INL ERROR (LSB)
–4
–6
–8
–40–20020406080
TEMPE R ATURE ( °C)
MAX INL ±5V
MIN INL ±10V
MIN INL ±5V
MAX INL + 10V
MIN INL +10V
MAX INL +5V
MIN INL +5V
Figure 12. AD5754R Integral Nonlinearity Error vs. Temperature
06465-044
10
8
6
4
2
0
–2
INL ERROR (LSB)
–4
–6
–8
–10
5.58.56.5 7.510.5 11.59.512.513.514.515.516.5
SUPPLY VOLTAGE (V)
BIPOLAR 5V M IN
UNIPOLAR 5V M IN
BIPOLAR 5V M AX
UNIPOLAR 5V M AX
Figure 15. AD5754R Integral Nonlinearity Error vs. Supply Voltage
06465-050
0.1
0
–0.1
–0.2
–0.3
DNL ERROR (LSB)
–0.4
–0.5
–0.6
–40–20020406080
TEMPE R ATURE ( °C)
MAX DNL ±10V
MAX DNL ±5V
MIN DNL ±10V
MIN DNL ±5V
MAX DNL +10V
MIN DNL +10 V
MAX DNL +5V
MIN DNL +5V
Figure 13. AD5754R Differential Nonlinearity Error vs. Temperature
10
8
6
4
2
0
–2
INL ERROR (LSB)
–4
–6
–8
–10
11.512.512.013.5 14.013.014.5 15.0 15.5 16.0 16.5
SUPPLY VOLT AGE ( V)
BIPOLAR 10V MIN
UNIPOLAR 10V M IN
BIPOLAR 10V MAX
UNIPOLAR 10V M AX
Figure 14. AD5754R Integral Nonlinearity Error vs. Supply Voltage
1.0
0.8
0.6
0.4
0.2
0
–0.2
DNL ERROR (LSB)
–0.4
–0.6
–0.8
–1.0
11.512.512.013.5 14.013.014.5 15.0 15.5 16.0 16.5
06465-045
SUPPLY VOLTAGE (V)
BIPOLAR 10V M IN
UNIPOLAR 10V MIN
BIPOLAR 10V M A X
UNIPOLAR 10V MAX
06465-033
Figure 16. AD5754R Differential Nonlinearity Error vs. Supply Voltage
1.0
0.8
0.6
0.4
0.2
0
–0.2
DNL ERROR (LSB)
–0.4
–0.6
–0.8
–1.0
5.58.56.5 7.510.5 11.59.512.5 13.5 14.5 15.5 16.5
06465-032
SUPPLY VOLTAGE (V)
BIPOLAR 5V MIN
UNIPOLAR 5V MIN
BIPOLAR 5V MAX
UNIPOLAR 5V MAX
06465-034
Figure 17. AD5754R Differential Nonlinearity Error vs. Supply Voltage
BIPOLAR 5V M IN
UNIPOLAR 5V M IN
BIPOLAR 5V M AX
UNIPOLAR 5V M AX
Figure 19. AD5754R Total Unadjusted Error vs. Supply Voltage
4
3
2
1
0
–1
ZERO-SCAL E E RROR (mV)
–2
–3
–40–20020406080
+10V
±10V
±5V
TEMPERATURE (°C)
Figure 20. Zero-Scale Error vs. Temperature
0.06
±5V
0.04
0.02
0
–0.02
GAIN ER ROR (% FSR)
–0.04
–0.06
–40–20020406080
06465-037
±10V
+10V
TEMPERATURE ( ° C)
6465-048
Figure 22. Gain Error vs. Temperature
1000
900
800
700
600
500
(µA)
CC
400
DI
300
200
100
0
–100
0123456
06465-046
DV
CC
= 3V
V
LOGIC
DVCC = 5V
(V)
06465-043
Figure 23. Digital Current vs. Logic Input Voltage
Rev. B | Page 13 of 32
Page 14
AD5724R/AD5734R/AD5754R
0.010
±5V RANGE, CODE = 0xFFFF
±10V RANGE, CODE = 0xFFFF
+10V RANGE, CO DE = 0xFFFF
+5V RANG E , CODE = 0 xFFFF
0.005
±5V RANGE, CODE = 0 x0000
±10V RANGE, CODE = 0x0000
0
12
10
8
–0.005
–0.010
OUTPUT VOLTAGE DELTA (V)
–0.015
–0.020
–25 –20 –15 –10 –50510152025
OUTPUT CURRENT ( mA)
Figure 24. Output Source and Sink Capability
15
10
5
0
–5
OUTPUT VO LTAGE (V)
–10
–15
–3–11357911
TIME (µs)
Figure 25. Full-Scale Settling Time, ±10 V Range
6
4
OUTPUT VOLTAGE (V)
2
0
–3–11357911
06465-040
TIME (µs)
06465-024
Figure 27. Full-Scale Settling, +10 V Range
6
5
4
3
2
OUTPUT VOLTAGE (V)
1
0
–3–11357911
06465-022
TIME (µs)
06465-025
Figure 28. Full-Scale Settling, +5 V Range
7
5
3
1
–1
–3
OUTPUT VOLTAGE (V)
–5
–7
–3–11357911
TIME (µs)
Figure 26. Full-Scale Settling, ±5 V Range
06465-023
Rev. B | Page 14 of 32
0.020
0.015
0.010
0.005
0
–0.005
OUTPUT VOLTAGE (V)
–0.010
–0.015
–1012345
±10V RANGE, 0x7FFF TO 0x8000
±10V RANGE, 0x8000 TO 0x7FFF
±5V RANGE, 0x7FFF TO 0x8000
±5V RANGE, 0x8000 TO 0x7FFF
+10V RANGE, 0x7 FFF TO 0x8000
+10V RANGE, 0x8 000 TO 0x7FFF
+5V RANGE, 0x7FFF TO 0x8000
+5V RANGE, 0x8000 TO 0x7FF F
TIME (µs)
±
±
±
±
Figure 29. Digital-to-Analog Glitch Energy
06465-039
Page 15
AD5724R/AD5734R/AD5754R
1
2
RANGE = ±5V
RANGE = +5V
CH1 5µVM 5sLINE 73.8V
RANGE = +10V
RANGE = ±10V
Figure 30. Peak-to-Peak Noise, 0.1 Hz to 10 Hz Bandwidth
1.01.52.02.53.03.54.04.55.0
TEMPERATURE COEFFI CIENT (ppm/°C)
06465-052
Figure 41. Reference Output TC (0°C to 85°C)
Rev. B | Page 16 of 32
Page 17
AD5724R/AD5734R/AD5754R
2.50120
20 DEVICES SHOWN
2.50100
2.50120
20 DEVICES SHOWN
2.50100
2.50080
2.50060
2.50040
2.50020
REFERENCE OUT PUT VOLTAGE (V)
2.50000
2.49980
020–20–40406080
TEMPERATURE ( °C)
06465-054
2.50080
2.50060
2.50040
2.50020
REFERENCE OUT PUT VOLTAGE (V)
2.50000
2.49980
0 1020304050607080
TEMPERATURE ( °C)
Figure 42. Reference Output Voltage vs. Temperature (−40°C to+ 85°C) Figure 43. Reference Output Voltage vs. Temperature (0°C to 85°C)
06465-053
Rev. B | Page 17 of 32
Page 18
AD5724R/AD5734R/AD5754R
TERMINOLOGY
Relative Accuracy or Integral Nonlinearity (INL)
For the DAC, relative accuracy, or integral nonlinearity, is a
measure of the maximum deviation in LSBs from a straight line
passing through the endpoints of the DAC transfer function. A
typical INL vs. code plot can be seen in Figure 6.
Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between the measured
change and the ideal 1 LSB change between any two adjacent
codes. A specified differential nonlinearity of ±1 LSB maximum
ensures monotonicity. This DAC is guaranteed monotonic by
design. A typical DNL vs. code plot can be seen in Figure 9.
Monotonicity
A DAC is monotonic if the output either increases or remains
constant for increasing digital input code. The AD5724R/
AD5734R/AD5754R are monotonic over their full operating
temperature range.
Bipolar Zero Error
Bipolar zero error is the deviation of the analog output from the
ideal half-scale output of 0 V when the DAC register is loaded
with 0x8000 (straight binary coding) or 0x0000 (twos complement
coding). A plot of bipolar zero error vs. temperature can be seen
in Figure 21.
Bipolar Zero TC
Bipolar zero TC is a measure of the change in the bipolar
zero error with a change in temperature. It is expressed in
ppm FSR/°C.
Zero-Scale Error/Negative Full-Scale Error
Zero-scale error is the error in the DAC output voltage when
0x0000 (straight binary coding) or 0x8000 (twos complement
coding) is loaded to the DAC register. Ideally, the output voltage
should be negative full-scale − 1 LSB. A plot of zero-scale error
vs. temperature can be seen in Figure 20.
Zero-Scale TC
Zero-scale TC is a measure of the change in zero-scale error with a
change in temperature. It is expressed in ppm FSR/°C.
Output Voltage Settling Time
Output voltage settling time is the amount of time it takes
for the output to settle to a specified level for a full-scale
input change. A plot of full-scale settling time can be seen
in Figure 25.
Slew Rate
The slew rate of a device is a limitation in the rate of change of
the output voltage. The output slewing speed of a voltage output
DAC is usually limited by the slew rate of the amplifier used at
its output. Slew rate is measured from 10% to 90% of the output
signal and is given in V/µs.
Gain Error
Gain error is a measure of the span error of the DAC. It is the
deviation in slope of the DAC transfer characteristic from ideal
expressed in % FSR. A plot of gain error vs. temperature can be
seen in Figure 22.
Gain TC
Gain TC is a measure of the change in gain error with changes
in temperature. It is expressed in ppm FSR/°C.
Tot a l U n ad ju s te d E rr o r ( TU E )
Total unadjusted error is a measure of the output error taking
all the various errors into account, namely INL error, offset
error, gain error, and output drift over supplies, temperature,
and time. TUE is expressed in % FSR.
Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the
analog output when the input code in the DAC register changes
state, but the output voltage remains constant. It is normally
specified as the area of the glitch in nV-sec and is measured
when the digital input code is changed by 1 LSB at the major
carry transition (0x7FFF to 0x8000). See Figure 29.
Glitch Impulse Peak Amplitude
Glitch impulse peak amplitude is the peak amplitude of the
impulse injected into the analog output when the input code
in the DAC register changes state. It is specified as the amplitude
of the glitch in millivolts and is measured when the digital input
code is changed by 1 LSB at the major carry transition (0x7FFF
to 0x8000). See Figure 29.
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into
the analog output of the DAC from the digital inputs of the
DAC but is measured when the DAC output is not updated.
It is specified in nV-sec and measured with a full-scale code
change on the data bus.
Power Supply Sensitivity
Power supply sensitivity indicates how the output of the DAC is
affected by changes in the power supply voltage. It is measured
by superimposing a 50 Hz/60 Hz, 200 mV p-p sine wave on the
supply voltages and measuring the proportion of the sine wave
that transfers to the outputs.
Rev. B | Page 18 of 32
Page 19
AD5724R/AD5734R/AD5754R
DC Crosstalk
DC crosstalk is the dc change in the output level of one DAC
in response to a change in the output of another DAC. It is
measured with a full-scale output change on one DAC while
monitoring another DAC. It is expressed in LSBs.
Digital Crosstalk
Digital crosstalk is a measure of the impulse injected into the
analog output of one DAC from the digital inputs of another
DAC but is measured when the DAC output is not updated.
It is specified in nV-sec and measured with a full-scale code
change on the data bus.
DAC-to-DAC Crosstalk
DAC-to-DAC crosstalk is the glitch impulse transferred to the
output of one DAC due to a digital code change and subsequent
output change of another DAC. This includes both digital and
analog crosstalk. It is measured by loading one of the DACs
with a full-scale code change (all 0s to all 1s and vice versa)
with
low and monitoring the output of another DAC.
LDAC
The energy of the glitch is expressed in nV-sec.
Volt age R efe r en c e TC
Voltage reference TC is a measure of the change in the reference
output voltage with a change in temperature. The reference TC
is calculated using the box method, which defines the TC as the
maximum change in the reference output over a given temperature range expressed in ppm/°C as follows;
TC
⎡
=
⎢
⎢
REFnom
⎣
−
VV
REFminREFmax
×
TempRangeV
⎤
6
10×
⎥
⎥
⎦
where:
V
is the maximum reference output measured over the
REFmax
total temperature range.
V
is the minimum reference output measured over the total
REFmin
temperature range.
V
is the nominal reference output voltage, 2.5 V.
REFnom
Temp R an ge is the specified temperature range, either 0°C to
85°C or −40°C to +85°C.
Rev. B | Page 19 of 32
Page 20
AD5724R/AD5734R/AD5754R
THEORY OF OPERATION
The AD5724R/AD5734R/AD5754R are quad, 12-/14-/16-bit,
serial input, unipolar/bipolar, voltage output DACs. They
operate from single supply voltages of +4.5 V to +16.5 V or dual
supply voltages of ±4.5 V to ±16.5 V. In addition, the parts have
software-selectable output ranges of +5 V, +10 V, +10.8 V, ±5 V,
±10 V, and ±10.8 V. Data is written to the AD5724R/AD5734R/
AD5754R in a 24-bit word format via a 3-wire serial interface.
The devices also offer an SDO pin to facilitate daisy chaining or
readback.
The AD5724R/AD5734R/AD5754R incorporate a power-on
reset circuit to ensure that the DAC registers power up loaded
with 0x0000. When powered on, the outputs are clamped to 0 V
via a low impedance path. The parts also feature on-chip
reference and reference buffers.
ARCHITECTURE
The DAC architecture consists of a string DAC followed by an
output amplifier. Figure 44 shows a block diagram of the DAC
architecture. The reference input is buffered before being applied
to the DAC.
REFIN
REF (+)
DAC REGISTER
Figure 44. DAC Architecture Block Diagram
The resistor string structure is shown in Figure 45. It is a string
of resistors, each of value R. The code loaded to the DAC register
determines the node on the string where the voltage is to be
tapped off and fed into the output amplifier. The voltage is
tapped off by closing one of the switches connecting the
string to the amplifier. Because it is a string of resistors, it is
guaranteed monotonic.
RESISTOR
STRING
REF (–)
GND
OUTPUT
RANGE CONTROL
V
OUT
CONFIGURABLE
OUTPUT
AMPLIFIER
x
REFIN
R
R
R
R
R
Figure 45. Resistor String Structure
TO OUT P U T
AMPLIFIER
06465-007
Output Amplifiers
The output amplifiers are capable of generating both unipolar
and bipolar output voltages. They are capable of driving a load
of 2 kΩ in parallel with 4000 pF to GND. The source and sink
capabilities of the output amplifiers can be seen in Figure 24.
The slew rate is 3.5 V/µs with a full-scale settling time of 10 µs.
Reference Buffers
06465-006
The AD5724R/AD5734R/AD5754R can operate with either an
external or internal reference. The reference input has an input
range of 2 V to 3 V with 2.5 V for specified performance. This
input voltage is then buffered before it is applied to the DAC cores.
SERIAL INTERFACE
The AD5724R/AD5734R/AD5754R are controlled over a
versatile 3-wire serial interface that operates at clock rates up
to 30 MHz. It is compatible with SPI, QSPI™, MICROWIRE™,
and DSP standards.
Input Shift Register
The input shift register is 24 bits wide. Data is loaded into the
device MSB first as a 24-bit word under the control of a serial
clock input, SCLK. The input register consists of a read/write
bit, three register select bits, three DAC address bits, and 16 data
bits. The timing diagram for this operation is shown in Figure 2.
Rev. B | Page 20 of 32
Page 21
AD5724R/AD5734R/AD5754R
*
Standalone Operation
The serial interface works with both a continuous and a
noncontinuous serial clock. A continuous SCLK source can
SYNC
only be used if
is held low for the correct number of
clock cycles. In gated clock mode, a burst clock containing the
SYNC
exact number of clock cycles must be used, and
must be
taken high after the final clock to latch the data. The first falling
SYNC
edge of
edges must be applied to SCLK before
again. If
starts the write cycle. Exactly 24 falling clock
SYNC
is brought high
SYNC
is brought high before the 24th falling SCLK
edge, the data written is invalid. If more than 24 falling SCLK
edges are applied before
SYNC
is brought high, the input data
is also invalid. The input register addressed is updated on the
SYNC
rising edge of
SYNC
must be brought low again. After the end of the serial
. For another serial transfer to take place,
data transfer, data is automatically transferred from the input
shift register to the addressed register.
When the data has been transferred into the chosen register
of the addressed DAC, all DAC registers and outputs can be
LDAC
updated by taking
68HC11
MISO
ADDITIONAL P INS OMIT TED FOR CLARITY.
Figure 46. Daisy Chaining the AD5724R/AD5734R/AD5754R
low while
*
MOSI
SCK
PC7
PC6
SYNC
SDIN
SCLK
SYNC
LDAC
SCLK
SYNC
LDAC
SCLK
SYNC
LDAC
is high.
AD5724R/
AD5734R/
AD5754R*
SDO
SDIN
AD5724R/
AD5734R/
AD5754R*
SDO
SDIN
AD5724R/
AD5734R/
AD5754R*
SDO
06465-008
Daisy-Chain Operation
For systems that contain several devices, the SDO pin can be
used to daisy-chain several devices together. Daisy-chain mode
can be useful in system diagnostics and in reducing the number
SYNC
of serial interface lines. The first falling edge of
starts the
write cycle. SCLK is continuously applied to the input shift
SYNC
register when
is low. If more than 24 clock pulses are
applied, the data ripples out of the shift register and appears
on the SDO line. This data is clocked out on the rising edge of
SCLK and is valid on the falling edge. By connecting the SDO
of the first device to the SDIN input of the next device in the
chain, a multidevice interface is constructed. Each device in the
system requires 24 clock pulses. Therefore, the total number of
clock cycles must equal 24 × N, where N is the total number of
AD5724R/AD5734R/AD5754R devices in the chain. When the
SYNC
serial transfer to all devices is complete,
is taken high.
This latches the input data in each device in the daisy chain and
prevents any further data from being clocked into the input shift
register. The serial clock can be a continuous or gated clock.
SYNC
A continuous SCLK source can only be used if
is held
low for the correct number of clock cycles. In gated clock mode,
a burst clock containing the exact number of clock cycles must
be used, and
SYNC
must be taken high after the final clock to
latch the data.
Readback Operation
Readback mode is invoked by setting the R/W bit to 1 in the
write operation to the serial input shift register. (If the SDO
output is disabled via the SDO disable bit in the control register,
it is automatically enabled for the duration of the read operation,
W
after which it is disabled again.) With R/
set to 1, Bit A2 to Bit
A0 in association with Bit REG2 to Bit REG0 select the register
to be read. The remaining data bits in the write sequence are don’t
care bits. During the next SPI write, the data appearing on the
SDO output contains the data from the previously addressed
register. For a read of a single register, the NOP command can
be used in clocking out the data from the selected register on
SDO. The readback diagram in shows the readback
Figure 4
sequence. For example, to read back the DAC register of
Channel A, the following sequence should be implemented:
Write 0x800000 to the AD5724R/AD5734R/AD5754R
1.
input register. This configures the part for read mode
with the DAC register of Channel A selected. Note that
all the data bits, DB15 to DB0, are don’t care bits.
Follow this with a second write, a NOP condition, 0x180000.
2.
During this write, the data from the register is clocked out
on the SDO line.
Rev. B | Page 21 of 32
Page 22
AD5724R/AD5734R/AD5754R
LOAD DAC (LDAC) CONFIGURING THE AD5724R/AD5734R/AD5754R
After data has been transferred into the input register of the
DACs, there are two ways to update the DAC registers and DAC
outputs. Depending on the status of both
SYNC
and
LDAC
, one
of two update modes is selected: individual DAC updating or
simultaneous updating of all DACs.
OUTPUT
AMPLIFIER
V
REFIN
LDAC
SCLK
SYNC
SDIN
Figure 47. Simplified Diagram of Input Loading Circuitry for One DAC
12-/14-/16-BIT
DAC
DAC
REGISTER
INPUT
REGISTER
INTERFACE
LOGIC
SDO
V
x
OUT
06465-009
Individual DAC Updating
In this mode,
LDAC
is held low while data is clocked into the
input shift register. The addressed DAC output is updated on
SYNC
the rising edge of
.
Simultaneous Updating of All DACs
LDAC
In this mode,
is held high while data is clocked into the
input shift register. All DAC outputs are asynchronously updated
LDAC
by taking
low after
update now occurs on the falling edge of
SYNC
has been taken high. The
LDAC
.
ASYNCHRONOUS CLEAR (CLR)
CLR
is an active low clear that allows the outputs to be cleared
to either zero-scale code or midscale code. The clear code value
is user selectable via the CLR select bit of the control register
CLR
(see the section). It is necessary to keep Control Register
low for a minimum amount of time to complete the operation
CLR
(see ). When the Figure 2
signal is returned high, the output
remains at the cleared value until a new value is programmed.
The outputs cannot be updated with a new value while the
pin is low. A clear operation can also be performed via the clear
command in the control register.
CLR
When the power supplies are applied to the AD5724R/
AD5734R/ AD5754R, the power-on reset circuit ensures that
all registers default to 0. This places all channels and the internal
reference in power-down mode. The first communication to
the AD5724R/AD5734R/AD5754R should be to set the required
output range on all channels (the default range is the 5 V unipolar
range) by writing to the output range select register. The user
should then write to the power-control register to power-on the
required channels and the internal reference, if required. If an
external reference source is being used, the internal reference
must remain in power-down mode. To program an output value
on a channel, that channel must first be powered up; any writes
to a channel while it is in power-down mode are ignored. The
AD5724R/AD5734R/AD5754R operate with a wide power supply
range. It is important that the power supply applied to the parts
provide adequate headroom to support the chosen output ranges.
TRANSFER FUNCTION
Tabl e 8 to Ta b le 1 6 show the relationships of the ideal input code
to output voltage for the AD5754R, AD5734R, and AD5724R for
all output voltage ranges. For unipolar output ranges, the data
coding is straight binary. For bipolar output ranges, the data
coding is user selectable via the BIN/
2sCOMP
either offset binary or twos complement.
For a unipolar output range, the output voltage expression is
given by
D
⎡
OUT
REFIN
×=
GainVV
⎤
N
⎢
⎥
2
⎣
⎦
For a bipolar output range, the output voltage expression is given by
D
⎡
OUT
×=
GainVV
REFIN
⎤
−
N
⎢
⎥
⎣
⎦
where:
D is the decimal equivalent of the code loaded to the DAC.
N is the bit resolution of the DAC.
V
is the reference voltage applied at the REFIN pin.
REFIN
Gain is an internal gain the value of which depends on the
output range selected by the user as shown in Tabl e 7.
Table 7. Internal Gain Values
Output Range (V) Gain Value
+5 2
+10 4
+10.8 4.32
±5 4
±10 8
±10.8 8.64
pin and can be
VGain
×
REFIN
22
Rev. B | Page 22 of 32
Page 23
AD5724R/AD5734R/AD5754R
Ideal Output Voltage to Input Code Relationship—AD5754R
Table 8. Bipolar Output, Offset Binary Coding
Digital Input Analog Output
MSB LSB ±5 V Output Range ±10 V Output Range ±10.8 V Output Range
The input register is 24 bits wide and consists of a read/write bit (R/W), a reserved bit (zero) which must always be set to 0, three register
select bits (REG1, REG2, REG3), three DAC address bits (A2, A1, A0), and 16 data bits (data). The register data is clocked in MSB first on
the SDIN pin. shows the register format, while describes the function of each bit in the register. All registers are read/
write registers.
0 0 0 DAC register
0 0 1 Output range select register
0 1 0 Power control register
0 1 1 Control register
A2, A1, A0 These bits are used to decode the DAC channels
0 0 0 DAC A
0 0 1 DAC B
0 1 0 DAC C
0 1 1 DAC D
1 0 0 All four DACs
DB15 to DB0 Data bits
Table 1 7Tabl e 18
Zero REG2 REG1 REG0 A2 A1 A0 Data
Indicates a read from or a write to the addressed register
Used in association with the address bits to determine if a write operation is to the DAC register, output range
select register, power control register, or control register
REG2 REG1 REG0 Function
A2 A1 A0 Channel Address
Rev. B | Page 26 of 32
Page 27
AD5724R/AD5734R/AD5754R
DAC REGISTER
The DAC register is addressed by setting the three REG bits to 000. The DAC address bits select the DAC channel which the data transfer
is to take place (see Tab l e 1 8 ). The data bits are in positions DB15 to DB0 for the AD5754R (see Tab l e 19), DB15 to DB2 for the AD5734R
(see Tabl e 20 ), and DB15 to DB4 for the AD5724R (see Ta b le 2 1 ).
Table 19. Programming the AD5754R DAC Register
MSB LSB
W
R/
0 0 0 0 0 DAC address 16-bit DAC data
Table 20. Programming the AD5734R DAC Register
MSB LSB
W
R/
0 0 0 0 0 DAC address 14-bit DAC data X X
Table 21. Programming the AD5724R DAC Register
MSB LSB
W
R/
0 0 0 0 0 DAC address 12-bit DAC data X X X X
OUTPUT RANGE SELECT REGISTER
The output range select register is addressed by setting the three REG bits to 001. The DAC address bits select the DAC channel, while the
range bits (R2, R1, R0) select the required output range (see Tab l e 22 and Ta ble 2 3).
Zero REG2 REG1 REG0 A2 A1 A0 DB15 to DB0
Zero REG2 REG1 REG0 A2 A1 A0 DB15 to DB2 DB1 DB0
Zero REG2 REG1 REG0 A2 A1 A0 DB15 to DB4 DB3 DB2 DB1 DB0
Table 22. Programming the Required Output Range
MSB LSB
R/
W
Zero REG2 REG1 REG0 A2 A1 A0 DB15 to DB3 DB2 DB1 DB0
The control register is addressed by setting the three REG bits to 011. The value written to the address and data bits determines the
control function selected. The control register options are shown in Ta ble 2 4 and Tabl e 25 .
Table 24. Programming the Control Register
MSB LSB
Zero REG2 REG1 REG0 A2 A1 A0 DB15 to DB4 DB3 DB2 DB1 DB0
W
R/
0 0 0 1 1 0 0 0 NOP, data = don’t care
0 0 0 1 1 0 0 1 Don’t care TSD enable Clamp enable CLR select SDO disable
0 0 0 1 1 1 0 0 Clear, data = don’t care
0 0 0 1 1 1 0 1 Load, data = don’t care
Table 25. Control Register Functions
Option Description
NOP No operation instruction used in readback operations.
Clear Addressing this function sets the DAC registers to the clear code and updates the outputs.
Load Addressing this function updates the DAC registers and, consequently, the DAC outputs.
SDO disable Set by the user to disable the SDO output. Cleared by the user to enable the SDO output (default).
CLR select See Ta ble 26 for a description of the CLR select operation.
Clamp enable
TSD enable
Set by the user to enable the current limit clamp (default). The channel does not power down on detection of
overcurrent; the current is clamped at 20 mA.
Cleared by the user to disable the current-limit clamp. The channel powers down on detection of overcurrent.
Set by the user to enable the thermal shutdown feature. Cleared by the user to disable the thermal shutdown
feature (default).
Table 26. CLR Select Options
Output CLR Value
CLR Select Setting
0 0 V 0 V
1 Midscale Negative full scale
Unipolar Output Range Bipolar Output Range
Rev. B | Page 28 of 32
Page 29
AD5724R/AD5734R/AD5754R
POWER CONTROL REGISTER
The power control register is addressed by setting the three REG bits to 010. This register allows the user to control and determine the
power and thermal status of the AD5724R/AD5734R/AD5754R. The power control register options are shown in Tab le 2 7 and Tabl e 28 .
Table 27. Programming the Power Control Register
MSB LSB
W
R/
Zero REG2 REG1 REG0 A2 A1 A0
0 0 0 1 0 0 0 0 X OCD OCC OCB OCA 0 TSD PU
Table 28. Power Control Register Functions
Option Description
PUA
DAC A power-up. When set, this bit places DAC A in normal operating mode. When cleared, this bit places DAC A in power-down
mode (default). If the clamp enable bit of the control register is cleared, DAC A powers down automatically on detection of an
is cleared to reflect this.
A
PUB
overcurrent, and PU
DAC B power-up. When set, this bit places DAC B in normal operating mode. When cleared, this bit places DAC B in power-down
mode (default). If the clamp enable bit of the control register is cleared, DAC B powers down automatically on detection of an
is cleared to reflect this.
B
PUC
overcurrent, and PU
DAC C power-up. When set, this bit places DAC C in normal operating mode. When cleared, this bit places DAC C in power-down
mode (default). If the clamp enable bit of the control register is cleared, DAC C powers down automatically on detection of an
is cleared to reflect this.
C
PUD
overcurrent, and PU
DAC D power-up. When set, this bit places DAC D in normal operating mode. When cleared, this bit places DAC D in power-down
mode (default). If the clamp enable bit of the control register is cleared, DACD powers down automatically on detection of an
is cleared to reflect this.
D
PU
overcurrent, and PU
Reference power-up. When set, this bit places the internal reference in normal operating mode. When cleared, this bit places the
REF
internal reference in power-down mode (default).
TSD
Thermal shutdown alert. Read-only bit. In the event of an overtemperature situation, the four DACs are powered down and this
bit is set.
OCA DAC A overcurrent alert. Read-only bit. In the event of an overcurrent situation on DAC A, this bit is set.
OCB DAC B overcurrent alert. Read-only bit. In the event of an overcurrent situation on DAC B, this bit is set.
OCC DAC C overcurrent alert. Read-only bit. In the event of an overcurrent situation on DAC C, this bit is set.
OCD DAC D overcurrent alert. Read-only bit. In the event of an overcurrent situation on DAC D, this bit is set.
In many industrial process control applications, it is vital that
the output voltage be controlled during power-up. When the
supply voltages change during power-up, the V
x pins are
OUT
clamped to 0 V via a low impedance path (approximately 4 k).
To prevent the output amplifiers from being shorted to 0 V
during this time, Transmission Gate G1 is also opened (see
Figure 48). These conditions are maintained until the power
supplies have stabilized and a valid word is written to a DAC
register. At this time, G2 opens and G1 closes.
VOLTAGE
MONITOR
AND
CONTROL
G1
G2
Figure 48. Analog Output Control Circuitry
V
A
OUT
6465-010
POWER-DOWN MODE
Each DAC channel of the AD5724R/AD5734R/AD5754R can
be individually powered down. By default, all channels are in
power-down mode. The power status is controlled by the power
control register (see Ta ble 2 7 and Tab l e 28 for details). When a
channel is in power-down mode its output pin is clamped to
ground through a resistance of approximately 4 k and the
output of the amplifier is disconnected from the output pin.
OVERCURRENT PROTECTION
Each DAC channel of the AD5724R/AD5734R/AD5754R
incorporates individual overcurrent protection. The user has
two options for the configuration of the overcurrent protection:
constant current clamp or automatic channel power-down. The
configuration of the overcurrent protection is selected via the
clamp enable bit in the control register.
Constant Current Clamp (Clamp Enable = 1)
If a short circuit occurs in this configuration, the current is
clamped at 20 mA. This event is signaled to the user by the
setting of the appropriate overcurrent (OC
) bit in the power
X
control register. Upon removal of the short-circuit fault, the
bit is cleared.
OC
X
Automatic Channel Power-Down (Clamp Enable = 0)
If a short circuit occurs in this configuration, the shorted
channel powers down and its output is clamped to ground via
a resistance of approximately 4 k. Also, at this time, the output
of the amplifier is disconnected from the output pin. The shortcircuit event is signaled to the user via the overcurrent bits (OC
while the power-up bits (PU
) indicate which channels have
X
),
X
powered down. After the fault is rectified, the channels can be
powered up again by setting the PU
bits.
X
THERMAL SHUTDOWN
The AD5724R/AD5734R/AD5754R incorporate a thermal
shutdown feature that automatically shuts down the device if
the core temperature exceeds approximately 150°C. The thermal
shutdown feature is disabled by default and can be enabled
via the TSD enable bit of the control register. In the event of a
thermal shutdown, the TSD bit of the power control register is set.
INTERNAL REFERENCE
The on-chip voltage reference is powered down by default. If
an external voltage reference source is to be used, the internal
reference must remain powered down at all times. If the internal
reference is to be used as the reference source, it must be powered
up via the PU
reference voltage is accessible at the REFIN/REFOUT pin for use
as a reference source for other devices within the system. If the
internal reference is to be used external to the AD5724R/
AD5734R/AD5754R, it must first be buffered.
bit of the power control register. The internal
REF
Rev. B | Page 30 of 32
Page 31
AD5724R/AD5734R/AD5754R
A
APPLICATIONS INFORMATION
+5 V/±5 V OPERATION
When operating from a single +5 V supply or a dual ±5 V supply,
an output range of +5 V or ±5 V is not achievable because
sufficient headroom for the output amplifier is not available.
In this situation, a reduced reference voltage can be used; for
instance, if a 2 V reference produces an output range of +4 V
or ±4 V, the 1 V of headroom is more than enough for full
operation. A standard value voltage reference of 2.048 V can
be used to produce output ranges of +4.096 V and ±4.096 V.
Refer to the Typical Performance Characteristics plots for
performance data at a range of voltage reference values.
LAYOUT GUIDELINES
In any circuit where accuracy is important, careful consideration
of the power supply and ground return layout helps to ensure
the rated performance. Design the printed circuit board on
which the AD5724R/AD5734R/AD5754R are mounted so that
the analog and digital sections are separated and confined to
certain areas of the board. If the AD5724R/AD5734R/ AD5754R
are in a system which multiple devices require an AGND-toDGND connection, the connection should be made at one
point only. Establish the star ground point as close as possible
to the device.
Bypass the AD5724R/AD5734R/AD5754R with an ample
supply of a 10 µF capacitor in parallel with a 0.1 µF capacitor
on each supply located as close to the package as possible,
ideally right up against the device. The 10 µF capacitors are
the tantalum bead type. The 0.1 µF capacitor should have
low effective series resistance (ESR) and low effective series
inductance (ESI) such as the common ceramic types, which
provide a low impedance path to ground at high frequencies
to handle transient currents due to internal logic switching.
The power supply lines of the AD5724R/AD5734R/AD5754R
should use as large a trace as possible to provide low impedance
paths and reduce the effects of glitches on the power supply
line. Shield fast switching signals such as clocks with digital
ground to avoid radiating noise to other parts of the board
and never run them near the reference inputs. A ground line
routed between the SDIN and SCLK lines helps reduce crosstalk
between them (this is not required on a multilayer board that
has a separate ground plane, but separating the lines does help).
It is essential to minimize noise on the REFIN line because it
couples through to the DAC output.
Avoid crossover of digital and analog signals. Traces on
opposite sides of the board should run at right angles to each
other. This reduces the effects of feed through the board. A
microstrip technique is by far the best but not always possible
with a double-sided board. In this technique, the component
side of the board is dedicated to the ground plane, while signal
traces are placed on the solder side.
Rev. B | Page 31 of 32
GALVANICALLY ISOLATED INTERFACE
In many process control applications, it is necessary to provide
an isolation barrier between the controller and the unit being
controlled to protect and isolate the controlling circuitry from
any hazardous common-mode voltages that may occur. The
iCoupler® family of products from Analog Devices, Inc., provides
voltage isolation in excess of 2.5 kV. The serial loading structure
of the AD5724R/AD5734R/AD5754R makes them ideal for
isolated interfaces because the number of interface lines is kept
to a minimum. Figure 49 shows a 4-channel isolated interface to
the AD5724R/AD5734R/AD5754R using an ADuM1400. For
further information, visit http://www.analog.com/icouplers.
MICROCONTROLLER
V
SERIAL CLOCK OUT
SERIAL DATA OUT
SYNC OUT
CONTRO L OUT
*ADDITIONAL PINS OMIT TED FOR CLARITY.
IA
V
IB
V
IC
V
ID
Figure 49. Isolated Interface
DuM1400*
ENCODEDECODE
ENCODEDECODE
ENCODEDECODE
ENCODEDECODE
V
OA
TO SCLK
V
OB
TO SDIN
V
OC
TO SYNC
V
OD
TO LDAC
MICROPROCESSOR INTERFACING
Microprocessor interfacing to the AD5724R/AD5734R/AD5754R
is via a serial bus that uses a standard protocol compatible with
microcontrollers and DSP processors. The communications
channel is a 3-wire (minimum) interface consisting of a clock
signal, a data signal, and a synchronization signal. The AD5724R/
AD5734R/AD5754R require a 24-bit data-word with data valid
on the falling edge of SCLK.
For all interfaces, the DAC output update can be initiated
automatically when all the data is clocked in, or it can be
LDAC
performed under the control of
registers can be read using the readback function.
AD5724R/AD5734R/AD5754R to Blackfin® DSP interface
Figure 50 shows how the AD5724R/AD5734R/AD5754R can be
interfaced to a Blackfin DSP from Analog Devices. The Blackfin
has an integrated SPI port that can be connected directly to the
SPI pins of the AD5724R/AD5734R/AD5754R and the programmable I/O pins that can be used to set the state of a digital input