Datasheet AD5601, AD5611, AD5621 Datasheet (ANALOG DEVICES)

Page 1
2.7 V to 5.5 V, <100 μA, 8-/10-/12-Bit
nano
Rev. F
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
Trademarks and registered trademarks are the property of their respective owners.
Fax: 781.461.3113 ©2005–2012 Analog Devices, Inc. All rights reserved.
AD5601/AD5611/AD5621
V
DD
V
OUT
GND
POWER-ON
RESET
DAC
REGISTER
12-/10-/8-BIT
DAC
INPUT
CONTROL
LOGIC
POWER-DOWN
CONTROL LOGIC
OUTPUT BUFFER
RESISTOR NETWORK
REF(+)
SCLK SDIN
06853-001
SYNC
Data Sheet

FEATURES

6-lead SC70 and LFCSP packages Micropower operation: 100 µA maximum at 5 V Power-down typically to 0.2 µA at 3 V
2.7 V to 5.5 V power supply Guaranteed monotonic by design Power-on reset to 0 V with brownout detection 3 power-down functions Low power serial interface with Schmitt-triggered inputs On-chip output buffer amplifier, rail-to-rail operation
interrupt facility
SYNC Minimized zero-code error AD5601 buffered 8-bit DAC
B version: ±0.5 LSB INL
AD5611 buffered 10-bit DAC
B version: ±0.5 LSB INL A version: ±4 LSB INL
AD5621 buffered 12-bit DAC
B version: ±1 LSB INL A version: ±6 LSB INL

APPLICATIONS

Voltage level setting Portable battery-powered instruments Digital gain and offset adjustment Programmable voltage and current sources Programmable attenuators

GENERAL DESCRIPTION

The AD5601/AD5611/AD5621, members of the nanoDAC® family, are single, 8-/10-/12-bit, buffered voltage output DACs that operate from a single 2.7 V to 5.5 V supply, consuming typically 75 µA at 5 V. The parts come in tiny LFCSP and SC70 packages. Their on-chip precision output amplifier allows rail­to-rail output swing to be achieved. The AD5601/AD5611/ AD5621 utilize a versatile 3-wire serial interface that operates at clock rates up to 30 MHz and is compatible with SPI, QSPI™, MICROWIRE™, and DSP interface standards.
The reference for the AD5601/AD5611/AD5621 is derived from the power supply inputs and, therefore, gives the widest dynamic output range. The parts incorporate a power-on reset circuit, which ensures that the DAC output powers up to 0 V and remains there until a valid write to the device takes place.
The AD5601/AD5611/AD5621 contain a power-down feature that reduces current consumption to typically 0.2 µA at 3 V.
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without n otice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
DAC, SPI Interface in LFCSP and SC70

FUNCTIONAL BLOCK DIAGRAM

Figure 1.
Table 1. Related Devices
Part Number Description
AD5641 2.7 V to 5.5 V, <100 µA, 14-bit nanoDAC in
SC70 and LFCSP packages
They also provide software-selectable output loads while in power-down mode. The parts are put into power-down mode over the serial interface.
The low power consumption of these parts in normal operation makes them ideally suited to portable battery-operated equip­ment. The combination of small package and low power makes these nanoDAC devices ideal for level-setting requirements, such as generating bias or control voltages in space-constrained and power-sensitive applications.

PRODUCT HIGHLIGHTS

1. Available in 6-lead LFCSP and SC70 packages.
2. Low power, single-supply operation. The AD5601/
AD5611/AD5621 operate from a single 2.7 V to 5.5 V supply with a maximum current consumption of 100 µA, making them ideal for battery-powered applications.
3. The on-chip output buffer amplifier allows the output of
the DAC to swing rail-to-rail with a typical slew rate of
0.5 V/µs.
4. Reference is derived from the power supply.
5. High speed serial interface with clock speeds up to
30 MHz. Designed for very low power consumption. The interface powers up only during a write cycle.
6. Power-down capability. When powered down, the DAC
typically consumes 0.2 µA at 3 V. Power-on reset with brownout detection.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700
www.analog.com
Page 2
AD5601/AD5611/AD5621 Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Timing Characteristics ................................................................ 4
Absolute Maximum Ratings ............................................................ 5
ESD Caution .................................................................................. 5
Pin Configuration and Function Descriptions ............................. 6
Typical Performance Characteristics ............................................. 7
Terminology .................................................................................... 13
Theory of Operation ...................................................................... 14
DAC Section ................................................................................ 14
Resistor String ............................................................................. 14
Output Amplifier ........................................................................ 14
Serial Interface ............................................................................ 14
Input Shift Register .................................................................... 14
SYNC
Interrupt .......................................................................... 14
Power-On Reset .......................................................................... 16
Power-Down Modes .................................................................. 16
Microprocessor Interfacing ....................................................... 16
Applications ..................................................................................... 18
Choosing a Reference as Power Supply for the
AD5601/AD5611/AD5621 ....................................................... 18
Bipolar Operation Using the AD5601/AD5611/AD5621 ..... 18
Using the AD5601/AD5611/AD5621 with a Galvanically
Isolated Interface ........................................................................ 19
Power Supply Bypassing and Grounding ................................ 19
Outline Dimensions ....................................................................... 20
Ordering Guide .......................................................................... 21

REVISION HISTORY

2/12—Rev. E to Rev. F
Added 6-Lead LFCSP ......................................................... Universal
Changes to Features Section, General Description Section,
Table 1, and Product Highlights Section ....................................... 1
Changes to Table 4 ............................................................................ 5
Added Figure 4; Renumbered Sequentially .................................. 6
Changes to Table 5 ............................................................................ 6
Changes to Choosing a Reference as Power Supply for the
AD5601/AD5611/AD5621 Section .............................................. 18
Updated Outline Dimensions ....................................................... 20
Changes to Ordering Guide .......................................................... 21
7/10—Rev. D to Rev. E
Changes to Figure 1 .......................................................................... 1
5/08—Rev. C to Rev. D
Changes to General Description Section ...................................... 1
Changes to Table 2 ............................................................................ 3
Changes to Choosing a Reference as Power Supply for the
AD5601/AD5611/AD5621 Section .............................................. 18
Changes to Ordering Guide .......................................................... 20
12/07—Rev. B to Rev. C
Changes to Features .......................................................................... 1
Changes to Table 2 ............................................................................. 3
Changes to AD5601/AD5611/AD5621 to ADSP-2101
Interface Section ............................................................................. 16
Updated Outline Dimensions ....................................................... 20
Changes to Ordering Guide .......................................................... 20
7/05—Rev. A to Rev. B
Changes to Figure 48...................................................................... 17
Changes to Galvanically Isolated Interface Section ................... 19
Changes to Figure 52...................................................................... 19
3/05—Rev. 0 to Rev. A
Changes to Timing Characteristics ................................................. 4
Changes to Absolute Maximum Ratings ........................................ 5
Changes to Full Scale Error Section ................................................ 7
Changes to Figure 20...................................................................... 10
Changes to Theory of Operation .................................................. 14
Changes to Power Down Modes .................................................. 15
1/05—Revision 0: Initial Version
Rev. F | Page 2 of 24
Page 3
Data Sheet AD5601/AD5611/AD5621
AD5621
Short-Circuit Current
15
15 mA
VDD = 3 V/5 V
DC Output Impedance
0.5
0.5 Ω

SPECIFICATIONS

VDD = 2.7 V to 5.5 V; RL = 2 kΩ to GND; CL = 200 pF to GND; all specifications T for A/B grades is −40°C to +125°C, typical at 25°C.
Table 2.
A Grade B Grade Parameter Min Ty p Max Min Typ Max Unit Test Conditions/Comments
STATIC PERFORMANCE
AD5601
Resolution 8 Bits Relative Accuracy1 (INL) ±0.5 LSB Differential Nonlinearity (DNL) ±0.5 LSB Guaranteed monotonic by design
AD5611
Resolution 10 Bits Relative Accuracy1 (INL) ±4 ±0.5 LSB Differential Nonlinearity (DNL) ±0.5 ±0.5 LSB Guaranteed monotonic by design
Resolution 12 Bits Relative Accuracy1 (INL) ±6 ±1 LSB
Differential Nonlinearity (DNL) ±0.5 ±0.5 LSB Guaranteed monotonic by design Zero-Code Error 0.5 10 0.5 10 mV All 0s loaded to DAC register Full-Scale Error ±0.5 ±0.5 mV All 1s loaded to DAC register Offset Error ±0.063 ±10 ±0.063 ±10 mV Gain Error ±0.0004 ±0.037 ±0.0004 ±0.037 %FSR Zero-Code Error Drift 5.0 5.0 µV/°C
Gain Temperature Coefficient 2.0 2.0 ppm
OUTPUT CHARACTERISTICS2
Output Voltage Range 0 V
DD
0 VDD V Output Voltage Settling Time 6 10 6 10 µs Code ¼ scale to ¾ scale Slew Rate 0.5 0.5 V/µs Capacitive Load Stability 470 470 pF RL = ∞ 1000 1000 pF RL = 2 kΩ Output Noise Spectral Density 120 120
Noise 2 2 µV DAC code = midscale,
Digital-to-Analog Glitch Impulse 5 5 nV-s 1 LSB change around major carry Digital Feedthrough 0.2 0.2 nV-s
MIN
to T
, unless otherwise noted. Temperature range
MAX
FSR/°C
nV/Hz
DAC code = midscale,1 kHz
0.1 Hz to 10 kHz bandwidth
LOGIC INPUTS
Input Current Input High Voltage, V
1.4 1.4 V VDD = 2.7 V to 3.6 V Input Low Voltage, V
0.6 0.6 V VDD = 2.7 V to 3.6 V Pin Input Capacitance 3 3 pF
3
1.8 1.8 V VDD = 4.7 V to 5.5 V
INH
0.8 0.8 V VDD = 4.7 V to 5.5 V
INL
±2 ±2 µA
Rev. F | Page 3 of 24
Page 4
AD5601/AD5611/AD5621 Data Sheet
VDD = ±2.7 V to ±3.6 V
0.2
0.2 µA
VIH = VDD and VIL = GND
t2 5 ns min
SCLK high time
t8
20
ns min
Minimum
high time
t
4
t
3
t
2
t
5
t
7
t
6
D0D1
D2D14D15
SYNC
SCLK
06853-002
t
9
t
1
t
8
D15 D14
SDIN
A Grade B Grade Parameter Min Ty p Max Min Typ Max Unit Test Conditions/Comments
POWER REQUIREMENTS
VDD 2.7 5.5 2.7 5.5 V All digital inputs at 0 V or VDD IDD for Normal Mode DAC active and excluding load
current VDD = ±4.5 V to ±5.5 V 75 100 75 100 µA VIH = VDD and VIL = GND VDD = ±2.7 V to ±3.6 V 60 90 60 90 µA VIH = VDD and VIL = GND
IDD for All Power-Down Modes VIH = VDD and VIL = GND
VDD = ±4.5 V to ±5.5 V 0.5 0.5 µA VIH = VDD and VIL = GND
POWER EFFICIENCY
I
96 96 % I
OUT/IDD
1
Linearity calculated using a reduced code range: AD5621 from Code 64 to Code 4032; AD5611 from Code 16 to Code 1008; AD5601 from Code 4 to Code 252.
2
Guaranteed by design and characterization, not production tested.
3
Total current flowing into all pins.
= 2 mA and VDD = ±5 V
LOAD

TIMING CHARACTERISTICS

VDD = 2.7 V to 5.5 V; all specifications T
Table 3.
Parameter Limit1 Unit Test Conditions/Comments
2
t
33 ns min SCLK cycle time
1
MIN
to T
, unless otherwise noted. See Figure 2.
MAX
t3 5 ns min SCLK low time t4 10 ns min
to SCLK falling edge setup time
SYNC t5 5 ns min Data setup time t6 4.5 ns min Data hold time t7 0 ns min SCLK falling edge to
SYNC
rising edge
SYNC
t9 13 ns min
1
All input signals are specified with tr = tf = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
2
Maximum SCLK frequency is 30 MHz.
rising edge to next SCLK falling edge ignored
SYNC
Figure 2. Timing Diagram
Rev. F | Page 4 of 24
Page 5
Data Sheet AD5601/AD5611/AD5621
Maximum Junction Temperature
150°C

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.
Table 4.
Parameter Rating
VDD to GND −0.3 V to +7.0 V Digital Input Voltage to GND −0.3 V to VDD + 0.3 V V
to GND −0.3 V to VDD + 0.3 V
OUT
Operating Temperature Range
Industrial (A/B Grades) −40°C to +125°C
Storage Temperature Range −65°C to +160°C
SC70 Package
θJA Thermal Impedance 433.34°C/W θJC Thermal Impedance 149.47°C/W
LFCSP Package
θJA Thermal Impedance 95°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C
ESD (Human Body Model) 2.0 kV
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

Rev. F | Page 5 of 24
Page 6
AD5601/AD5611/AD5621 Data Sheet

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

16
SYNC
SDIN
AD5601/ AD5611/
25
AD5621
TOP VIEW
34
(Not to Scale)
V
OUT
GNDSCLK
V
DD
06853-003
Figure 3. 6-Lead SC70 Pin Configuration
1V
DD
2SCLK
3SDIN
NOTES:
1. CONNECT THE EXPOSED PAD TO GND.
Figure 4. 6-Lead LFCSP Pin Configuration
AD5601/ AD5611/ AD5621
TOP VIEW
(Not to Scale)
6V
5GND
4SYNC
Table 5. Pin Function Descriptions
SC70 Pin No.
1 4
LFCSP Pin No.
Mnemonic Description
Level-Triggered Control Input (Active Low). This is the frame synchronization signal for the input
SYNC
data. When SYNC
goes low, it enables the input shift register, and data is transferred in on the falling edges of the clocks that follow. The DAC is updated following the 16th clock cycle, unless SYNC is taken high before this edge, in which case the rising edge of SYNC acts as an interrupt and the write sequence is ignored by the DAC.
2 2 SCLK
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input. Data can be transferred at rates up to 30 MHz.
3 3 SDIN
Serial Data Input. This device has a 16-bit shift register. Data is clocked into the register on the falling edge of the serial clock input.
4 1 VDD
Power Supply Input. The AD5601/AD5611/AD5621 can be operated from 2.7 V to 5.5 V. V decoupled to GND.
5 5 GND Ground. Ground reference point for all circuitry on the AD5601/AD5611/AD5621. 6 6 V
Analog Output Voltage from the DAC. The output amplifier has rail-to-rail operation.
OUT
EP Exposed Pad. Connect to GND.
OUT
DD
06853-053
should be
Rev. F | Page 6 of 24
Page 7
Data Sheet AD5601/AD5611/AD5621
–1.0
–0.5
0
0.5
1.0
DAC CODE
INL ERROR (LSB)
06853-004
64 564 1064 1564 2064 2564 3064 3564 4064
VDD = V
REF
= 5V
T
A
= 25°C
0
16 116 216 316 416 516 616 716 816 916
DAC CODE
INL ERROR (LSB)
V
DD
= V
REF
= 5V
T
A
=
25°C
06853-005
–0.5
–0.4
–0.3
–0.2
–0.1
0.1
0.2
0.3
0.4
0.5
0
4 54 104 154 204
DAC CODE
INL ERROR (LSB)
VDD = V
REF
= 5V
T
A
= 25°C
06853-006
–0.100
–0.075
–0.050
–0.025
0.025
0.050
0.075
0.100
–2.5
–1.5
–0.5
0.5
1.5
2.5
64 564 1064 1564 2064 2564 3064 3564
DAC CODE
TOTAL UNADJUS TED ERROR (LS B)
06853-007
0
1.0
2.0
–2.0
–1.0
V
DD
= V
REF
= 5V
T
A
= 25°C
4064
–0.6
–0.4
–0.2
0
0.2
0.4
0.6
16 116 216 316 416 516 616 716 816 916
DAC CODE
TOTAL UNADJUS TED ERROR (LS B)
06853-008
V
DD
= V
REF
= 5V
T
A
= 25°C
–0.20
–0.15
–0.10
–0.05
0.05
0.10
0.15
0.20
4 54 104 154 204
DAC CODE
TOTAL UNADJUS TED ERROR (LS B)
0
VDD = V
REF
= 5V
T
A
= 25°C
06853-009

TYPICAL PERFORMANCE CHARACTERISTICS

Figure 5. Typical AD5621 INL
Figure 6. Typical AD5611 INL
Figure 8. AD5621 Total Unadjusted Error (TUE)
Figure 9. AD5611 Total Unadjusted Error (TUE)
Figure 7. Typical AD5601 INL
Figure 10. AD5601 Total Unadjusted Error (TUE)
Rev. F | Page 7 of 24
Page 8
AD5601/AD5611/AD5621 Data Sheet
–0.20
–0.15
–0.10
–0.05
0
0.05
0.10
0.15
0.20
64 564 1064 1564 2064 2564 3064 3564
DAC CODE
DNL ERROR (LS B)
VDD = 5V T
A
= 25°C
0
06853-010
–0.05
–0.04
–0.03
–0.02
–0.01
0
0.01
0.02
0.03
0.04
0.05
16 116 216 316 416 516 616 716 816 916
DAC CODE
DNL ERROR (LSB)
V
DD
= 5V
T
A
= 25°C
06853-011
–0.010
–0.008
–0.006
–0.004
–0.002
0
0.002
0.004
0.006
0.008
0.010
4 54 104 154 204
DAC CODE
DNL ERROR (LSB)
06853-012
V
DD
= 5V
T
A
= 25°C
0
2
4
6
8
10
12
0.05456
0.05527
0.05599
0.05671
0.05742
0.05814
0.05885
0.06648
0.06710
0.06773
0.06835
0.06897
0.06960
0.07022
0.07084
0.07147
0.07209
0.07271
0.07334
IDD (mA)
NUMBER OF DEV ICES
06853-013
VDD = 5V V
IH
= DV
DD
VIL = GND T
A
= 25°C
V
DD
= 3V
V
IH
= DV
DD
V
IL
= GND
T
A
= 25°C
CH1 = 5V/DIV CH2 = 1V /DIV TI M E BAS E = 2µs/DIV
CH1 = SCLK
CH2 = V
OUT
06853-014
TA = 25°C V
DD
= 5V
CH1 = 5V/DIV CH2 = 1V /DIV TI M E BAS E = 2µs/DIV
CH1 = SCLK
CH2 = V
OUT
TA = 25°C V
DD
= 5V
06853-015
Figure 11. Typical AD5621 DNL
Figure 12. Typical AD5611 DNL
Figure 14. IDD Histogram (3 V/5 V)
Figure 15. Full-Scale Settling Time
Figure 13. Typical AD5601 DNL
Figure 16. Half-Scale Settling Time
Rev. F | Page 8 of 24
Page 9
Data Sheet AD5601/AD5611/AD5621
VDD = 5V T
= 25°C
A
V
DD
VDD = 5V T
= 25°C
A
MIDSCALE LOADED
CH1
CH2
CH1
CH2
V
= 70mV
OUT
CH1 1V, CH2 20mV, TIME BASE = 20µs/DIV
Figure 17. Power-On Reset to 0 V
V
DD
V
OUT
CH1 1V, CH2 5V, T IME BASE = 50µ s/DIV
Figure 18. V
DD
vs. V
OUT
VDD = 5V T
= 25°C
A
CH1
06853-016
CH1 5µV/DIV
06853-019
Figure 20. 1/f Noise, 0.1 Hz to 10 Hz Bandwidth
VDD = 5V
= 25°C
CH1
V
OUT
CH2
06853-017
CH1 5V, CH2 1V, TI ME BASE = 2µ s/DIV
T
A
06853-020
Figure 21. Exiting Power-Down Mode
2.458
2.456
2.454
2.452
2.450
2.448
2.446
AMPLI TUDE (V)
2.444
2.442
2.440
2.438
2.436 0 100 200 300 400 500
SAMPLE NUMBER
TA = 25°C V
= 5V
DD
LOAD = 2k AND 220pF CODE 0x2000 TO 0x1FFF 10ns/SAMPLE NUMBER
Figure 19. Digital-to-Analog Glitch Energy
06853-018
Rev. F | Page 9 of 24
140
120
100
80
(µA)
60
DD
I
40
20
0
0 5 10 15 20 25
FULL SCALE
Figure 22. I
1/4 SCALE
ZERO SCALE
FREQUE NCY (MHz )
vs. SCLK vs. Code
DD
3/4 SCALE
MIDSCALE
06853-021
Page 10
AD5601/AD5611/AD5621 Data Sheet
0
100
200
300
400
500
600
700
100 1k 10k 100k
FREQUENCY ( Hz )
OUTPUT NOISE SPECTRAL DENSITY (nV/ Hz)
VDD = 5V T
A
= 25°C
UNLOADED OUTPUT
MIDSCALE
ZERO SCAL E
FULL SCALE
06853-022
0
10
20
30
40
50
60
70
0 2000 4000 6000 8000 10000 12000 14000 16000
DIGITAL INPUT CODE
I
DD
(µA)
V
DD
= 5V
V
DD
= 3V
06853-023
T
A
= 25°C
–0.6
–0.4
–0.2
0.0
0.2
0.4
0.6
0.8
–15 –10 –5 0 5 10 15
I (mA)
ΔV
OUT
(V)
06853-024
DAC LOADED WITH ZERO- S CALE CODE
VDD = 5V T
A
= 25°C
DAC LOADED WITH FULL - S CALE CODE
–0.6
–0.5
–0.4
–0.3
–0.2
–0.1
0
0.1
0.2
0.3
–40 –20 0 4020 60 80 100 120
TEMPERATURE (°C)
INL ERROR ( LSB)
06853-025
AD5611 MIN INL E RROR
AD5621 MIN INL E RROR
AD5621 MAX INL ERROR
V
DD
= 5V
AD5611 MAX INL ERROR
AD5601 MAX INL ERROR
AD5601 MIN INL E RROR
–0.08
–0.07
–0.06
–0.05
–0.04
–0.03
–0.02
–0.01
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
–40 10 60 110 160
TEMPERATURE (°C)
DNL ERROR (L S B)
VDD = 5V
06853-026
AD5611 MIN DNL ERRO R
AD5621 MAX DNL ERROR
AD5611 MAX DNL ERROR
AD5601 MAX DNL ERROR AD5601 MIN DNL ERRO R
AD5621 MIN DNL ERRO R
–40 40 60 80 100
–20 0 –20 120 140
TEMPERATURE (°C)
ERROR (LSB)
AD5621 ZERO-CO DE E RROR
AD5611 FULL-S CALE ERROR AD5621 FULL-S CALE ERROR
VDD = 5V
06853-027
0.00149
0.00099
0.00049
–0.00001
–0.00051
AD5611 ZERO-CO DE E RROR AD5601 ZERO-CO DE E RROR
AD5601 FULL-S CALE ERROR
Figure 23. Noise Spectral Density
Figure 26. INL vs. Temperature (5 V)
Figure 24. Supply Current vs. Digital Input Code
Figure 25. Sink and Source Capability
Figure 27. DNL vs. Temperature (5 V)
Figure 28. Zero-Code Error and Full-Scale Error vs. Temperature
Rev. F | Page 10 of 24
Page 11
Data Sheet AD5601/AD5611/AD5621
–0.5
–0.3
–0.1
0.1
0.3
0.5
1.5
–40 –20
TEMPERATURE (°C)
TOTAL UNADJUSTED ERROR
(LSB)
AD5601 MIN TUE AD5611 MIN TUE AD5621 MIN TUE
06853-028
0.7
0.9
1.1
1.3
0 20 40 60 80 100 120 140
AD5621 MAX TUE
AD5601 MAX TUE AD5611 MAX TUE
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.1
1.2
1.3
1.4
1.5
–40 –20 0 20 100 120 140
TEMPERATURE (°C)
OFFSET ERROR (mV)
40 60 80
1.0
VDD = 5V
VDD = 3V
06853-029
–0.016
–0.014
–0.012
–0.010
–0.008
–0.006
–0.004
–0.002
0
–40 –20 0 20 40 60 80 100 120 140
TEMPERATURE (°C)
GAIN ERROR ( %FSR)
VDD = 3V
V
DD
= 5V
06853-030
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.10
–40 –20 0 20 40 60 80 100 120 140
TEMPERATURE (°C)
I
DD
(mA)
VDD = 3V
V
DD
= 5V
06853-031
2.7 3.2 3.7 4.2 4.7 5.2 SUPPLY VOLTAGE (V)
INL ERROR ( LSB)
T
A
= 25°C
06853-032
AD5621 MAX INL ERROR
AD5611 MIN INL E RROR
AD5621 MIN INL E RROR
AD5611 MAX INL ERROR
AD5601 MIN INL E RROR
AD5601 MAX INL ERROR
–0.6
–0.4
–0.2
0
0.2
0.4
–0.10
–0.09
–0.08
–0.07
–0.06
–0.05
–0.04
–0.03
–0.02
–0.01
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.10
2.7 3.2 3.7 4.2 4.7 5.2 5.7 6.2 6.7 SUPPLY VOLTAGE (V)
DNL ERROR (L S B)
0
TA = 25°C
AD5621 MAX DNL ERROR
AD5601 MAX DNL ERROR AD5601 MIN DNL ERRO R
AD5621 MIN DNL ERRO R
06853-033
AD5611 MAX DNL ERROR
AD5611 MIN DNL ERRO R
Figure 29. Total Unadjusted Error (TUE) vs. Temperature (5 V)
Figure 30. Offset Error vs. Temperature (3 V/5 V Supply)
Figure 32. Supply Current vs. Temperature (3 V/5 V Supply)
Figure 33. INL vs. Supply Voltage at 25°C
Figure 31. Gain Error vs. Temperature ( 3 V/5 V Supply)
Figure 34. DNL vs. Supply Voltage at 25°C
Rev. F | Page 11 of 24
Page 12
AD5601/AD5611/AD5621 Data Sheet
2.7 3.2 3.7 4.2 4.7 5.2
SUPPLY VOLTAGE (V)
TOTAL UNADJUS TED ERROR (LS B)
T
A
= 25°C
AD5621 MAX TUE
AD5601 MAX TUE AD5611 MIN TUE AD5601 MIN TUE
AD5621 MIN TUE
06853-034
–0.3
–0.1
0.1
0.3
0.5
0.7
0.9
1.1
1.3
1.5
AD5611 MAX TUE
2.7 3.2 3.7 4.2 4.7 5.2 5.7 6.2 6.7 SUPPLY VOLTAGE (V)
ERROR (LSB)
TA = 25°C
AD5621 ZERO-CO DE E RROR
AD5611 ZERO-CO DE E RROR
AD5621 FULL-S CALE ERROR
AD5611 FULL-S CALE ERROR
AD5601 ZERO-CO DE E RROR
AD5601 FULL-S CALE ERROR
06853-035
–0.0004
–0.0002
0
0.0002
0.0004
0.0006
0.0008
0.0010
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.10
2.7 3.2 3.7 4.2 4.7 5.2 SUPPLY VOLTAGE (V)
I
DD
(
m
A)
TA = 25°C
06853-036
0
50
100
150
200
250
300
350
400
450
0
V
LOGIC
(V)
I
DD
(µA)
SCLK/SDIN INCREASING V
DD
= 3V
SCLK/SDI N DE CRE AS ING V
DD
= 3V
SCLK/SDIN DECREASING V
DD
= 5V
SCLK/SDIN INCREASING V
DD
= 5V
64 5321
TA = 25°C
06853-037
Figure 35. Total Unadjusted Error (TUE) vs. Supply Voltage at 25°C
Figure 37. Supply Current vs. Supply Voltage at 25°C
Figure 36. Zero-Code Error and Full-Scale Error vs. Supply Voltage at 25°C
Figure 38. SCLK/SDIN vs. Logic Voltage
Rev. F | Page 12 of 24
Page 13
Data Sheet AD5601/AD5611/AD5621

TERMINOLOGY

Relative Accuracy
For the DAC, relative accuracy or integral nonlinearity (INL) is a measure of the maximum deviation, in LSBs, from a straight line passing through the endpoints of the DAC transfer func­tion. See Figure 5 to Figure 7 for plots of typical INL vs. code.
Differential Nonlinearity
Differential nonlinearity (DNL) is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±1 LSB maximum ensures monotonicity. This DAC is guaranteed monotonic by design. See Figure 11 to Figure 13 for plots of typical DNL vs. code.
Zero-Code Error
Zero-code error is a measure of the output error when zero code (0x0000) is loaded to the DAC register. Ideally, the output should be 0 V. The zero-code error is always positive in the AD5601/AD5611/AD5621 because the output of the DAC cannot go below 0 V. Ze ro -code error is due to a combination of the offset errors in the DAC and output amplifier. Zero-code error is expressed in mV. See Figure 28 for a plot of zero-code error vs. temperature.
Full-Scale Error
Full-scale error is a measure of the output error when full-scale code (0xFFFF) is loaded to the DAC register. Ideally, the output should be V Figure 28 for a plot of full-scale error vs. temperature.
Gain Error
Gain error is a measure of the span error of the DAC. It is the deviation in slope of the DAC transfer characteristic from the ideal, expressed as a percent of the full-scale range.
− 1 LSB. Full-scale error is expressed in mV. See
DD
Total Unadjusted Error
Total unadjusted error (TUE) is a measure of the output error, taking all the various errors into account. See Figure 8 to Figure 10 for plots of typical TUE vs. code.
Zero-Code Error Drift
Zero-code error drift is a measure of the change in zero-code error with a change in temperature. It is expressed in µV/°C.
Gain Temperature Coefficient
Gain temperature coefficient is a measure of the change in gain error with changes in temperature. It is expressed in (ppm of full-scale range)/°C.
Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the analog output when the input code in the DAC register changes state. It is normally specified as the area of the glitch in nV-s and is measured when the digital input code is changed by 1 LSB at the major carry transition (0x2000 to 0x1FFF). See Figure 19.
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into the analog output of the DAC from the digital inputs of the DAC, but is measured when the DAC output is not updated. It is specified in nV-s and is measured with a full-scale code change on the data bus—from all 0s to all 1s and vice versa.
Rev. F | Page 13 of 24
Page 14
 
 
×=
n
DD
OUT
D
VV
2
V
DD
V
OUT
GND
RESISTOR NETWORK
REF (+)
REF (–)

OUTPUT AMPLIFIER

DAC REGISTER
06853-038
R
R
R
R
R
TO OUTPUT AMPLIFIER
06853-039
AD5601/AD5611/AD5621 Data Sheet

THEORY OF OPERATION

DAC SECTION

The AD5601/AD5611/AD5621 DACs are fabricated on a CMOS process. The architecture consists of a string DAC followed by an output buffer amplifier. Figure 39 is a block diagram of the DAC architecture.
Figure 39. DAC Architecture
Because the input coding to the DAC is straight binary, the ideal output voltage is given by
where: D is the decimal equivalent of the binary code that is loaded to the DAC register. n is the bit resolution of the DAC.

RESISTOR STRING

The resistor string structure is shown in Figure 40. It is simply a string of resistors, each of Value R. The code loaded to the DAC register determines at which node on the string the voltage is tapped off to be fed into the output amplifier. The voltage is tapped off by closing one of the switches connecting the string to the amplifier. Because it is a string of resistors, it is guaran­teed monotonic.
Figure 40. Resistor String Structure
Rev. F | Page 14 of 24
OUTPUT AMPLIFIER
The output buffer amplifier is capable of generating rail-to-rail voltages on its output, giving an output range of 0 V to V
DD
. It is capable of driving a load of 2 kΩ in parallel with 1000 pF to GND. The source and sink capabilities of the output amplifier are shown in Figure 25. The slew rate is 0.5 V/µs, with a half­scale settling time of 8 µs with the output loaded.

SERIAL INTERFACE

The AD5601/AD5611/AD5621 have a 3-wire serial interface
SYNC
(
, SCLK, and SDIN) that is compatible with SPI, QSPI, and MICROWIRE interface standards as well as most DSPs. See Figure 2 for a timing diagram of a typical write sequence.
The write sequence begins by bringing the
SYNC
line low. Data from the SDIN line is clocked into the 16-bit shift register on the falling edge of SCLK. The serial clock frequency can be as high as 30 MHz, making the AD5601/AD5611/AD5621 com­patible with high speed DSPs. On the 16
th
falling clock edge, the last data bit is clocked in and the programmed function is executed (a change in DAC register contents and/or a change in the mode of operation). At this stage, the
SYNC
line may be kept low or brought high. In either case, it must be brought high for a minimum of 33 ns before the next write sequence so that a falling edge of
Because the than it does when V
SYNC
can initiate the next write sequence.
SYNC
buffer draws more current when VIN = 1.8 V
= 0.8 V,
IN
SYNC
should be idled low between write sequences for even lower power operation of the part, as mentioned previously. However, it must be brought high again just before the next write sequence.

INPUT SHIFT REGISTER

The input shift register is 16 bits wide (see Figure 41). The first two bits are control bits, which control the operating mode of the part (normal mode or any one of three power-down modes). For a complete description of the various modes, see the Power-Down Modes section. For the AD5621, the next 12 bits are the data bits, which are transferred to the DAC register on the 16 the last two bits is ignored by the AD5621. See Figure 42 and Figure 43 for the AD5611 and AD5601 input shift register map.

INTERRUPT

SYNC
In a normal write sequence, the least 16 falling edges of SCLK and the DAC is updated on the
th
falling edge. However, if
16
th
16
falling edge, this acts as an interrupt to the write sequence. The shift register is reset and the write sequence is seen as invalid. Neither an update of the DAC register contents nor a change in the operating mode occurs (see
th
falling edge of SCLK. The information in
SYNC
line is kept low for at
SYNC
is brought high before the
Figure 44).
Page 15
Data Sheet AD5601/AD5611/AD5621
DB15 (MSB)
PD1 PD0 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X
X
DB0 (LSB)
DATA BITS
POWER-DOWN MODES
0 1 0 1
0 0 1 1
NORMAL OPERATION
1kΩ TO GND
100kΩ TO G ND
THREE-STATE
06853-040
DB15 (MSB)
PD1 PD0 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 X X X
X
DB0 (LSB)
DATA BITS
POWER-DOWN MODES
0 1 0 1
0 0 1 1
NORMAL OPERATION
1kΩ TO GND
100kΩ TO G ND
THREE-STATE
06853-041
DB15 (MSB)
PD1 PD0 D8 D7 D6 D5 D4 D3 D2 D1 X X X X X
X
DB0 (LSB)
DATA BITS
POWER-DOWN MODES
0 1 0 1
0 0 1 1
NORMAL OPERATION
1kΩ TO GND
100kΩ TO G ND
THREE-STATE
06853-042
06853-043
DB15 DB15 DB0DB0
INVALID W RITE SEQ UE NCE :
SYNC HIGH BEF ORE 16
TH
FALLING EDGE
VALID WRI TE SEQUENCE , OUTPUT UP DATES
ON THE 16TH FALLING EDGE
SYNC
SCLK
SDIN
Figure 41. AD5621 Input Register Contents
Figure 42. AD5611 Input Register Contents
Figure 43. AD5601 Input Register Contents
Figure 44.
Rev. F | Page 15 of 24
SYNC
Interrupt Facility
Page 16
AD5601/AD5611/AD5621 Data Sheet
POWER-DOWN
CIRCUITRY
RESISTOR
NETWORK
V
OUT
RESISTOR
STRING DAC
AMPLIFIER
06853-044
AD5601/AD5611/ AD5621*
*ADDITIONAL PINS OMITTED FOR CLARITY
TFS
DT
SCLK
SYNC SDIN SCLK
06853-045
ADSP-2101*
68HC11/
68L11*
AD5601/AD5611/ AD5621*
*ADDITIONAL PINS OMITTED FOR CLARITY
PC7
SCK
MOSI
SYNC SCLK SDIN
06853-046

POWER-ON RESET

The AD5601/AD5611/AD5621 contain a power-on reset circuit that controls the output voltage during power-up. The DAC register is filled with 0s and the output voltage is 0 V. It remains there until a valid write sequence is made to the DAC. This is useful in applications in which it is important to know the state of the DAC output while it is in the process of powering up.

POWER-DOWN MODES

The AD5601/AD5611/AD5621 have four separate modes of operation. These modes are software-programmable by setting two bits (DB15 and DB14) in the control register. Table 6 shows how the state of the bits corresponds to the operating mode of the device.
Table 6. Operating Modes of the AD5601/AD5611/AD5621
DB15 DB14 Operating Mode
0 0 Normal operation Power-down modes: 0 1 1 kΩ to GND 1 0 100 kΩ to GND 1 1 Three-state
When both bits are set to 0, the part has normal power consumption of 100 µA maximum at 5 V. However, for the three power-down modes, the supply current falls to typically
0.2 µA at 3 V.
Not only does the supply current fall, but the output stage is also internally switched from the output of the amplifier to a resistor network of known values. This has the advantage that the output impedance of the part is known while the part is in power-down mode.
There are three different options: the output is connected internally to GND through a 1 kΩ resistor or a 100 kΩ resistor, or the output is left open-circuited (three-stated). Figure 45 shows the output stage.

MICROPROCESSOR INTERFACING

AD5601/AD5611/AD5621 to ADSP-2101 Interface

Figure 46 shows a serial interface between the AD5601/ AD5611/AD5621 and the ADSP-2101. The ADSP-2101 should be set up to operate in SPORT transmit alternate framing mode. The ADSP-2101 SPORT is programmed through the SPORT control register and should be configured as follows: internal clock operation, active low framing, and 16-bit word length. Transmission is initiated by writing a word to the Tx register after the SPORT is enabled.
Figure 46. AD5601/AD5611/AD5621 to ADSP-2101 Interface

AD5601/AD5611/AD5621 to 68HC11/68L11 Interface

Figure 47 shows a serial interface between the AD5601/AD5611/ AD5621 and the 68HC11/68L11 microcontroller. SCK of the 68HC11/68L11 drives the SCLK of the AD5601/AD5611/ AD5621, while the MOSI output drives the serial data line of the DAC. The The setup conditions for correct operation of this interface are as follows: the 68HC11/68L11 should be configured so that the CPOL bit is 0 and the CPHA bit is 1. When data is being trans­mitted to the DAC, the 68HC11/68L11 are configured as indicated, data appearing on the MOSI output is valid on the falling edge of SCK. Serial data from the 68HC11/68L11 is transmitted in 8-bit bytes with only eight falling clock edges occurring in the transmit cycle. Data is transmitted MSB first. To load data to the AD5601/AD5611/ AD5621, PC7 is left low after the first eight bits are transferred and a second serial write operation is performed to the DAC. PC7 is taken high at the end of this procedure.
SYNC
signal is derived from a port line (PC7).
SYNC
line is taken low (PC7). When the
Figure 45. Output Stage During Power-Down
The bias generator, output amplifier, resistor string, and other associated linear circuitry are all shut down when power-down mode is activated. However, the contents of the DAC register are unaffected when in power-down. The time to exit power­down is typically 13 µs for V See Figure 21 for a plot.
= 5 V and 16 µs for VDD = 3 V.
DD
Figure 47. AD5601/AD5611/AD5621 to 68HC11/68L11 Interface
Rev. F | Page 16 of 24
Page 17
Data Sheet AD5601/AD5611/AD5621
ADSP-BF53x*
AD5601/AD5611/ AD5621*
*ADDITIONAL PINS OMITTED FOR CLARITY
DT0PRI
TSCLK0
TFS0
SDIN SCLK SYNC
06853-047
80C51/80L51*
AD5601/AD5611/ AD5621*
*ADDITIONAL PINS OMITTED FOR CLARITY
P3.3
TxD
RxD
SYNC SCLK SDIN
06853-048
MICROWIRE*
AD5601/AD5611/ AD5621*
*ADDITIONAL PINS OMITTED FOR CLARITY
CS SK SO
SYNC SCLK SDIN
06853-049

AD5601/AD5611/AD5621 to Blackfin® ADSP-BF53x Interface

Figure 48 shows a serial interface between the AD5601/AD5611/ AD5621 and the Blackfin ADSP-BF53x microprocess or. The ADSP-BF53x processor family incorporates two dual-channel synchronous serial ports, SPORT1 and SPORT0, for serial and multiprocessor communications. Using SPORT0 to connect to the AD5601/AD5611/AD5621, the setup for the interface is as follows: DT0PRI drives the SDIN pin of the AD5601/AD5611/ AD5621, while TSCLK0 drives the SCLK of the part. The
SYNC
is driven from TFS0.
and a second write cycle is initiated to transmit the second byte of data. P3.3 is taken high following the completion of this cycle. The 80C51/80L51 output the serial data LSB first. The AD5601/AD5611/AD5621 require data with the MSB as the first bit received. The 80C51/80L51 transmit routine should take this into account.
Figure 48. AD5601/AD5611/AD5621 to Blackfin ADSP-BF53x Interface

AD5601/AD5611/AD5621 to 80C51/80L51 Interface

Figure 49 shows a serial interface between the AD5601/ AD5611/AD5621 and the 80C51/80L51 microcontroller. The setup for the interface is as follows: TxD of the 80C51/80L51 drives SCLK of the AD5601/AD5611/AD5621, while RxD drives the serial data line of the part. The
SYNC
signal is again derived from a bit programmable pin on the port. In this case, Port Line P3.3 is used. When data is to be transmitted to the AD5601/AD5611/AD5621, P3.3 is taken low. The 80C51/80L51 transmit data only in 8-bit bytes; therefore, only eight falling clock edges occur in the transmit cycle. To load data to the DAC, P3.3 is left low after the first eight bits are transmitted,
Figure 49. AD5601/AD5611/AD5621 to 80C51/80L51 Interface

AD5601/AD5611/AD5621 to MICROWIRE Interface

Figure 50 shows an interface between the AD5601/AD5611/ AD5621 and any MICROWIRE-compatible device. Serial data is shifted out on the falling edge of the serial clock and is clocked into the AD5601/AD5611/AD5621 on the rising edge of the SK.
Figure 50. AD5601/AD5611/AD5621 to MICROWIRE Interface
Rev. F | Page 17 of 24
Page 18
AD5601/AD5611/AD5621 Data Sheet
 
 
 
  
×
 
  
+
×
 
  
×=
R1
R2
V
R1
R2R1D
VV
DD
N
DD
OUT
2
V5
2
10
 
 
×
=
N
OUT
D
V
3-WIRE
SERIAL
INTERFACE
SYNC
SCLK
SDIN
7V
5V
V
OUT
= 0V TO 5V
ADR395
06853-050
AD5601/AD5611/
AD5621
R2 = 10kΩ
06853-051
+5V
–5V
AD820/ OP295
3-WIRE SERIAL
INTERFACE
+5V
AD5601/AD5611/
AD5621
10µF
0.1µF
V
DD
V
OUT
R1 = 10kΩ
+5V

APPLICATIONS

CHOOSING A REFERENCE AS POWER SUPPLY FOR THE AD5601/AD5611/AD5621

The AD5601/AD5611/AD5621 come in tiny LFCSP and SC70 packages with less than a 100 µA supply current. Because of this, the choice of reference depends on the application requirements. For applications with space-saving requirements, the ADR02 is recommended. It is available in an SC70 package and has excellent drift at 9 ppm/°C (3 ppm/°C in the R-8 package) and provides very good noise performance at 3.4 µV p-p in the 0.1 Hz to 10 Hz range.
Because the supply current required by the AD5601/AD5611/ AD5621 is extremely low, the parts are ideal for low supply applications. The ADR395 voltage reference is recommended in this case. It requires less than 100 µA of quiescent current and can, therefore, drive multiple DACs in one system, if required. It also provides very good noise performance at 8 µV p-p in the
0.1 Hz to 10 Hz range.

BIPOLAR OPERATION USING THE AD5601/AD5611/AD5621

The AD5601/AD5611/AD5621 have been designed for single­supply operation, but a bipolar output range is also possible using the circuit shown in Figure 52. The circuit in Figure 52 gives an output voltage range of ±5 V. Rail-to-rail operation at the amplifier output is achievable using an AD820 or OP295 as the output amplifier.
Figure 51. ADR395 as Power Supply to the AD5601/AD5611/AD5621
Some recommended precision references for use as supplies to the AD5601/AD5611/AD5621 are listed in Tabl e 7.
Table 7. Precision References for the AD5601/AD5611/AD5621
Initial
Part No.
Accuracy (mV max)
Temp Drift (ppm/°C max)
0.1 Hz to 10 Hz Noise (µV p-p typ)
ADR435 ±2 3 (R-8) 8 ADR425 ±2 3 (R-8) 3.4 ADR02 ±3 3 (R-8) 10 ADR02 ±3 3 (SC70) 10 ADR395 ±5 9 (TSOT-23) 8
Figure 52. Bipolar Operation with the AD5601/AD5611/AD5621
The output voltage for any input code can be calculated as
where D represents the input code in decimal (0 – 2
With V
= 5 V, R1 = R2 = 10 kΩ
DD
N
).
This is an output voltage range of ±5 V, with 0x0000 corre­sponding to a −5 V output and 0x3FFF corresponding to a +5 V output.
Rev. F | Page 18 of 24
Page 19
Data Sheet AD5601/AD5611/AD5621
06853-052
V
DD
AD5601/ AD5611/ AD5621
ADuM1300
POWER 10µF 0.1µF
GND
5V
REGULATOR
SCLKV
OA
V
OUT
V
OB
SYNC
V
OC
V
IA
V
IB
V
IC
SCLK
SDI
DATA SDIN

USING THE AD5601/AD5611/AD5621 WITH A GALVANICALLY ISOLATED INTERFACE

In process control applications in industrial environments, it is often necessary to use a galvanically isolated interface to protect and isolate the controlling circuitry from any hazardous common-mode voltages that might occur in the area where the DAC is functioning. iCoupler® provides isolation in excess of
2.5 kV. Because the AD5601/AD5611/AD5621 use a 3-wire serial logic interface, the ADuM1300 3-channel digital isolator provides the required isolation (see Figure 53). The power supply to the part also needs to be isolated, which is done by using a transformer. On the DAC side of the transformer, a 5 V regulator provides the 5 V supply required for the AD5601/ AD5611/AD5621.
Figure 53. AD5601/AD5611/AD5621 with a Galvanically Isolated Interface

POWER SUPPLY BYPASSING AND GROUNDING

When accuracy is important in a circuit, it is helpful to carefully consider the power supply and ground return layout on the board. The PCB containing the AD5601/AD5611/AD5621 should have separate analog and digital sections, each having its own area of the board. If the AD5601/AD5611/AD5621 are in a system where other devices require an AGND-to-DGND connection, the connection should be made at one point only. This ground point should be as close as possible to the AD5601/AD5611/AD5621.
The power supply to the AD5601/AD5611/AD5621 should be bypassed with 10 µF and 0.1 µF capacitors. The capacitors should be physically as close as possible to the device, with the
0.1 µF capacitor ideally right up against the device. The 10 µF capacitors are the tantalum bead type. It is important that the
0.1 µF capacitor have low effective series resistance (ESR) and effective series inductance (ESI), such as in common ceramic types of capacitors. This 0.1 µF capacitor provides a low imped­ance path to ground for high frequencies caused by transient currents due to internal logic switching.
The power supply line itself should have as large a trace as possible to provide a low impedance path and reduce glitch effects on the supply line. Clocks and other fast switching digital signals should be shielded from other parts of the board by digital ground. Avoid crossover of digital and analog signals, if possible. When traces cross on opposite sides of the board, ensure that they run at right angles to each other to reduce feedthrough effects on the board. The best board layout tech­nique is the microstrip technique, where the component side of the board is dedicated to the ground plane only and the signal traces are placed on the solder side. However, this is not always possible with a two-layer board.
Rev. F | Page 19 of 24
Page 20
AD5601/AD5611/AD5621 Data Sheet
1.30BSC
COMPLIANT TO JEDEC STANDARDS MO-203-AB
1.00
0.90
0.70
0.46
0.36
0.26
2.20
2.00
1.80
2.40
2.10
1.80
1.35
1.25
1.15
072809-A
0.10 MAX
1.10
0.80
0.40
0.10
0.22
0.08
3
1 2
46
5
0.65BSC
COPLANARITY
0.10
SEATING PLANE
0.30
0.15
1.50
1.40
1.30
0.45
0.40
0.35
TOP VIEW
6
1
4
3
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.70
1.60
1.50
0.203 REF
0.05 MAX
0.00 MIN
0.65 REF
EXPOSED
PAD
PIN 1 INDICATOR (R 0.15)
FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET.
10-18-2010-A
2.10
2.00
1.90
3.10
3.00
2.90
COMPLIANT
TO
JEDEC STANDARDS MO-229
COPLANARITY
0.08
0.20 MIN
0.35
0.30
0.25

OUTLINE DIMENSIONS

Figure 54. 6-Lead Thin Shrink Small Outline Transistor Package [SC70]
(KS-6)
Dimensions shown in millimeters
Figure 55. 6-Lead Lead Frame Chip Scale Package [LFCSP_WD]
2.00 × 3.00 mm Body, Very Very Thin, Dual Lead (CP-6-5)
Dimensions shown in millimeters
Rev. F | Page 20 of 24
Page 21
Data Sheet AD5601/AD5611/AD5621
Temperature
Package

ORDERING GUIDE

Model1
AD5601BKSZ-500RL7 –40°C to +125°C ±0.5 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3V AD5601BKSZ-REEL7 –40°C to +125°C ±0.5 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3V AD5601BCPZ-RL7 –40°C to +125°C ±0.5 LSB 6-Lead Lead Frame Chip Scale Package [LFCSP_WD] CP-6-5 89 AD5611AKSZ-500RL7 –40°C to +125°C ±4.0 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3U AD5611AKSZ-REEL7 –40°C to +125°C ±4.0 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3U AD5611ACPZ-RL7 –40°C to +125°C ±4.0 LSB 6-Lead Lead Frame Chip Scale Package[LFCSP_WD] CP-6-5 8B AD5611BKSZ-500RL7 –40°C to +125°C ±0.5 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3T AD5611BKSZ-REEL7 –40°C to +125°C ±0.5 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3T AD5621AKSZ-500RL7 –40°C to +125°C ±6.0 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3S AD5621AKSZ-REEL7 –40°C to +125°C ±6.0 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3S AD5621ACPZ-RL7 –40°C to +125°C ±6.0 LSB 6-Lead Lead Frame Chip Scale Package[LFCSP_WD] CP-6-5 88 AD5621BKSZ-500RL7 –40°C to +125°C ±1.0 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3R AD5621BKSZ-REEL7 –40°C to +125°C ±1.0 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3R EVAL-AD5621EBZ Evaluation Board
1
Z = RoHS Compliant Part.
Range
INL Package Description
Option
Branding
Rev. F | Page 21 of 24
Page 22
AD5601/AD5611/AD5621 Data Sheet
NOTES
Rev. F | Page 22 of 24
Page 23
Data Sheet AD5601/AD5611/AD5621
NOTES
Rev. F | Page 23 of 24
Page 24
AD5601/AD5611/AD5621 Data Sheet
©2005–2012 Analog Devices, Inc. All rights reserved. Trademarks and
NOTES
registered trademarks are the property of their respective owners. D06853-0-2/12(F)
Rev. F | Page 24 of 24
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