6-lead SC70 and LFCSP packages
Micropower operation: 100 µA maximum at 5 V
Power-down typically to 0.2 µA at 3 V
2.7 V to 5.5 V power supply
Guaranteed monotonic by design
Power-on reset to 0 V with brownout detection
3 power-down functions
Low power serial interface with Schmitt-triggered inputs
On-chip output buffer amplifier, rail-to-rail operation
Voltage level setting
Portable battery-powered instruments
Digital gain and offset adjustment
Programmable voltage and current sources
Programmable attenuators
GENERAL DESCRIPTION
The AD5601/AD5611/AD5621, members of the nanoDAC®
family, are single, 8-/10-/12-bit, buffered voltage output DACs
that operate from a single 2.7 V to 5.5 V supply, consuming
typically 75 µA at 5 V. The parts come in tiny LFCSP and SC70
packages. Their on-chip precision output amplifier allows railto-rail output swing to be achieved. The AD5601/AD5611/
AD5621 utilize a versatile 3-wire serial interface that operates at
clock rates up to 30 MHz and is compatible with SPI, QSPI™,
MICROWIRE™, and DSP interface standards.
The reference for the AD5601/AD5611/AD5621 is derived
from the power supply inputs and, therefore, gives the widest
dynamic output range. The parts incorporate a power-on reset
circuit, which ensures that the DAC output powers up to 0 V
and remains there until a valid write to the device takes place.
The AD5601/AD5611/AD5621 contain a power-down feature
that reduces current consumption to typically 0.2 µA at 3 V.
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without n otice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
DAC, SPI Interface in LFCSP and SC70
FUNCTIONAL BLOCK DIAGRAM
Figure 1.
Table 1. Related Devices
Part Number Description
AD56412.7 V to 5.5 V, <100 µA, 14-bit nanoDAC in
SC70 and LFCSP packages
They also provide software-selectable output loads while in
power-down mode. The parts are put into power-down mode
over the serial interface.
The low power consumption of these parts in normal operation
makes them ideally suited to portable battery-operated equipment. The combination of small package and low power makes
these nanoDAC devices ideal for level-setting requirements,
such as generating bias or control voltages in space-constrained
and power-sensitive applications.
PRODUCT HIGHLIGHTS
1. Available in 6-lead LFCSP and SC70 packages.
2. Low power, single-supply operation. The AD5601/
AD5611/AD5621 operate from a single 2.7 V to 5.5 V
supply with a maximum current consumption of 100 µA,
making them ideal for battery-powered applications.
3. The on-chip output buffer amplifier allows the output of
the DAC to swing rail-to-rail with a typical slew rate of
0.5 V/µs.
4. Reference is derived from the power supply.
5. High speed serial interface with clock speeds up to
30 MHz. Designed for very low power consumption.
The interface powers up only during a write cycle.
6. Power-down capability. When powered down, the DAC
typically consumes 0.2 µA at 3 V. Power-on reset with
brownout detection.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Page 2
AD5601/AD5611/AD5621 Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. F | Page 5 of 24
Page 6
AD5601/AD5611/AD5621 Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
16
SYNC
SDIN
AD5601/
AD5611/
25
AD5621
TOP VIEW
34
(Not to Scale)
V
OUT
GNDSCLK
V
DD
06853-003
Figure 3. 6-Lead SC70 Pin Configuration
1V
DD
2SCLK
3SDIN
NOTES:
1. CONNECT THE EXPOSED PAD TO GND.
Figure 4. 6-Lead LFCSP Pin Configuration
AD5601/
AD5611/
AD5621
TOP VIEW
(Not to Scale)
6V
5GND
4SYNC
Table 5. Pin Function Descriptions
SC70
Pin No.
1 4
LFCSP
Pin No.
Mnemonic Description
Level-Triggered Control Input (Active Low). This is the frame synchronization signal for the input
SYNC
data. When SYNC
goes low, it enables the input shift register, and data is transferred in on the falling
edges of the clocks that follow. The DAC is updated following the 16th clock cycle, unless SYNC is
taken high before this edge, in which case the rising edge of SYNC acts as an interrupt and the write
sequence is ignored by the DAC.
2 2 SCLK
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock
input. Data can be transferred at rates up to 30 MHz.
3 3 SDIN
Serial Data Input. This device has a 16-bit shift register. Data is clocked into the register on the falling
edge of the serial clock input.
4 1 VDD
Power Supply Input. The AD5601/AD5611/AD5621 can be operated from 2.7 V to 5.5 V. V
decoupled to GND.
5 5 GND Ground. Ground reference point for all circuitry on the AD5601/AD5611/AD5621.
6 6 V
Analog Output Voltage from the DAC. The output amplifier has rail-to-rail operation.
OUT
EP Exposed Pad. Connect to GND.
OUT
DD
06853-053
should be
Rev. F | Page 6 of 24
Page 7
Data Sheet AD5601/AD5611/AD5621
–1.0
–0.5
0
0.5
1.0
DAC CODE
INL ERROR (LSB)
06853-004
645641064 1564 20642564 3064 3564 4064
VDD = V
REF
= 5V
T
A
= 25°C
0
16116 216 316 416 516 616 716 816 916
DAC CODE
INL ERROR (LSB)
V
DD
= V
REF
= 5V
T
A
=
25°C
06853-005
–0.5
–0.4
–0.3
–0.2
–0.1
0.1
0.2
0.3
0.4
0.5
0
454104154204
DAC CODE
INL ERROR (LSB)
VDD = V
REF
= 5V
T
A
= 25°C
06853-006
–0.100
–0.075
–0.050
–0.025
0.025
0.050
0.075
0.100
–2.5
–1.5
–0.5
0.5
1.5
2.5
645641064 1564 20642564 3064 3564
DAC CODE
TOTAL UNADJUS TED ERROR (LS B)
06853-007
0
1.0
2.0
–2.0
–1.0
V
DD
= V
REF
= 5V
T
A
= 25°C
4064
–0.6
–0.4
–0.2
0
0.2
0.4
0.6
16116 216 316 416 516 616 716 816 916
DAC CODE
TOTAL UNADJUS TED ERROR (LS B)
06853-008
V
DD
= V
REF
= 5V
T
A
= 25°C
–0.20
–0.15
–0.10
–0.05
0.05
0.10
0.15
0.20
454104154204
DAC CODE
TOTAL UNADJUS TED ERROR (LS B)
0
VDD = V
REF
= 5V
T
A
= 25°C
06853-009
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 5. Typical AD5621 INL
Figure 6. Typical AD5611 INL
Figure 8. AD5621 Total Unadjusted Error (TUE)
Figure 9. AD5611 Total Unadjusted Error (TUE)
Figure 7. Typical AD5601 INL
Figure 10. AD5601 Total Unadjusted Error (TUE)
Rev. F | Page 7 of 24
Page 8
AD5601/AD5611/AD5621 Data Sheet
–0.20
–0.15
–0.10
–0.05
0
0.05
0.10
0.15
0.20
645641064 15642064 25643064 3564
DAC CODE
DNL ERROR (LS B)
VDD = 5V
T
A
= 25°C
0
06853-010
–0.05
–0.04
–0.03
–0.02
–0.01
0
0.01
0.02
0.03
0.04
0.05
16116 216 316 416 516 616 716 816 916
DAC CODE
DNL ERROR (LSB)
V
DD
= 5V
T
A
= 25°C
06853-011
–0.010
–0.008
–0.006
–0.004
–0.002
0
0.002
0.004
0.006
0.008
0.010
454104154204
DAC CODE
DNL ERROR (LSB)
06853-012
V
DD
= 5V
T
A
= 25°C
0
2
4
6
8
10
12
0.05456
0.05527
0.05599
0.05671
0.05742
0.05814
0.05885
0.06648
0.06710
0.06773
0.06835
0.06897
0.06960
0.07022
0.07084
0.07147
0.07209
0.07271
0.07334
IDD (mA)
NUMBER OF DEV ICES
06853-013
VDD = 5V
V
IH
= DV
DD
VIL = GND
T
A
= 25°C
V
DD
= 3V
V
IH
= DV
DD
V
IL
= GND
T
A
= 25°C
CH1 = 5V/DIV CH2 = 1V /DIV TI M E BAS E = 2µs/DIV
CH1 = SCLK
CH2 = V
OUT
06853-014
TA = 25°C
V
DD
= 5V
CH1 = 5V/DIV CH2 = 1V /DIV TI M E BAS E = 2µs/DIV
CH1 = SCLK
CH2 = V
OUT
TA = 25°C
V
DD
= 5V
06853-015
Figure 11. Typical AD5621 DNL
Figure 12. Typical AD5611 DNL
Figure 14. IDD Histogram (3 V/5 V)
Figure 15. Full-Scale Settling Time
Figure 13. Typical AD5601 DNL
Figure 16. Half-Scale Settling Time
Rev. F | Page 8 of 24
Page 9
Data Sheet AD5601/AD5611/AD5621
VDD = 5V
T
= 25°C
A
V
DD
VDD = 5V
T
= 25°C
A
MIDSCALE LOADED
CH1
CH2
CH1
CH2
V
= 70mV
OUT
CH1 1V, CH2 20mV, TIME BASE = 20µs/DIV
Figure 17. Power-On Reset to 0 V
V
DD
V
OUT
CH1 1V, CH2 5V, T IME BASE = 50µ s/DIV
Figure 18. V
DD
vs. V
OUT
VDD = 5V
T
= 25°C
A
CH1
06853-016
CH1 5µV/DIV
06853-019
Figure 20. 1/f Noise, 0.1 Hz to 10 Hz Bandwidth
VDD = 5V
= 25°C
CH1
V
OUT
CH2
06853-017
CH1 5V, CH2 1V, TI ME BASE = 2µ s/DIV
T
A
06853-020
Figure 21. Exiting Power-Down Mode
2.458
2.456
2.454
2.452
2.450
2.448
2.446
AMPLI TUDE (V)
2.444
2.442
2.440
2.438
2.436
0100200300400500
SAMPLE NUMBER
TA = 25°C
V
= 5V
DD
LOAD = 2kΩ AND 220pF
CODE 0x2000 TO 0x1FFF
10ns/SAMPLE NUMBER
Figure 19. Digital-to-Analog Glitch Energy
06853-018
Rev. F | Page 9 of 24
140
120
100
80
(µA)
60
DD
I
40
20
0
0510152025
FULL SCALE
Figure 22. I
1/4 SCALE
ZERO SCALE
FREQUE NCY (MHz )
vs. SCLK vs. Code
DD
3/4 SCALE
MIDSCALE
06853-021
Page 10
AD5601/AD5611/AD5621 Data Sheet
0
100
200
300
400
500
600
700
1001k10k100k
FREQUENCY ( Hz )
OUTPUT NOISE SPECTRAL DENSITY (nV/ Hz)
VDD = 5V
T
A
= 25°C
UNLOADED OUTPUT
MIDSCALE
ZERO SCAL E
FULL SCALE
06853-022
0
10
20
30
40
50
60
70
02000 4000 6000 8000 10000 12000 14000 16000
DIGITAL INPUT CODE
I
DD
(µA)
V
DD
= 5V
V
DD
= 3V
06853-023
T
A
= 25°C
–0.6
–0.4
–0.2
0.0
0.2
0.4
0.6
0.8
–15–10–5051015
I (mA)
ΔV
OUT
(V)
06853-024
DAC LOADED WITH ZERO- S CALE CODE
VDD = 5V
T
A
= 25°C
DAC LOADED WITH FULL - S CALE CODE
–0.6
–0.5
–0.4
–0.3
–0.2
–0.1
0
0.1
0.2
0.3
–40–20040206080100120
TEMPERATURE (°C)
INL ERROR ( LSB)
06853-025
AD5611 MIN INL E RROR
AD5621 MIN INL E RROR
AD5621 MAX INL ERROR
V
DD
= 5V
AD5611 MAX INL ERROR
AD5601 MAX INL ERROR
AD5601 MIN INL E RROR
–0.08
–0.07
–0.06
–0.05
–0.04
–0.03
–0.02
–0.01
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
–401060110160
TEMPERATURE (°C)
DNL ERROR (L S B)
VDD = 5V
06853-026
AD5611 MIN DNL ERRO R
AD5621 MAX DNL ERROR
AD5611 MAX DNL ERROR
AD5601 MAX DNL ERROR
AD5601 MIN DNL ERRO R
AD5621 MIN DNL ERRO R
–40406080100
–200–20120140
TEMPERATURE (°C)
ERROR (LSB)
AD5621 ZERO-CO DE E RROR
AD5611 FULL-S CALE ERROR
AD5621 FULL-S CALE ERROR
VDD = 5V
06853-027
0.00149
0.00099
0.00049
–0.00001
–0.00051
AD5611 ZERO-CO DE E RROR
AD5601 ZERO-CO DE E RROR
AD5601 FULL-S CALE ERROR
Figure 23. Noise Spectral Density
Figure 26. INL vs. Temperature (5 V)
Figure 24. Supply Current vs. Digital Input Code
Figure 25. Sink and Source Capability
Figure 27. DNL vs. Temperature (5 V)
Figure 28. Zero-Code Error and Full-Scale Error vs. Temperature
Rev. F | Page 10 of 24
Page 11
Data Sheet AD5601/AD5611/AD5621
–0.5
–0.3
–0.1
0.1
0.3
0.5
1.5
–40–20
TEMPERATURE (°C)
TOTAL UNADJUSTED ERROR
(LSB)
AD5601 MIN TUE
AD5611 MIN TUE
AD5621 MIN TUE
06853-028
0.7
0.9
1.1
1.3
020406080100120140
AD5621 MAX TUE
AD5601 MAX TUE
AD5611 MAX TUE
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.1
1.2
1.3
1.4
1.5
–40–20020100120140
TEMPERATURE (°C)
OFFSET ERROR (mV)
406080
1.0
VDD = 5V
VDD = 3V
06853-029
–0.016
–0.014
–0.012
–0.010
–0.008
–0.006
–0.004
–0.002
0
–40–20020406080100120140
TEMPERATURE (°C)
GAIN ERROR ( %FSR)
VDD = 3V
V
DD
= 5V
06853-030
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.10
–40–20020406080100120140
TEMPERATURE (°C)
I
DD
(mA)
VDD = 3V
V
DD
= 5V
06853-031
2.73.23.74.24.75.2
SUPPLY VOLTAGE (V)
INL ERROR ( LSB)
T
A
= 25°C
06853-032
AD5621 MAX INL ERROR
AD5611 MIN INL E RROR
AD5621 MIN INL E RROR
AD5611 MAX INL ERROR
AD5601 MIN INL E RROR
AD5601 MAX INL ERROR
–0.6
–0.4
–0.2
0
0.2
0.4
–0.10
–0.09
–0.08
–0.07
–0.06
–0.05
–0.04
–0.03
–0.02
–0.01
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.10
2.73.23.74.24.75.25.76.26.7
SUPPLY VOLTAGE (V)
DNL ERROR (L S B)
0
TA = 25°C
AD5621 MAX DNL ERROR
AD5601 MAX DNL ERROR
AD5601 MIN DNL ERRO R
AD5621 MIN DNL ERRO R
06853-033
AD5611 MAX DNL ERROR
AD5611 MIN DNL ERRO R
Figure 29. Total Unadjusted Error (TUE) vs. Temperature (5 V)
Figure 30. Offset Error vs. Temperature (3 V/5 V Supply)
Figure 32. Supply Current vs. Temperature (3 V/5 V Supply)
Figure 33. INL vs. Supply Voltage at 25°C
Figure 31. Gain Error vs. Temperature ( 3 V/5 V Supply)
Figure 34. DNL vs. Supply Voltage at 25°C
Rev. F | Page 11 of 24
Page 12
AD5601/AD5611/AD5621 Data Sheet
2.73.23.74.24.75.2
SUPPLY VOLTAGE (V)
TOTAL UNADJUS TED ERROR (LS B)
T
A
= 25°C
AD5621 MAX TUE
AD5601 MAX TUE
AD5611 MIN TUE
AD5601 MIN TUE
AD5621 MIN TUE
06853-034
–0.3
–0.1
0.1
0.3
0.5
0.7
0.9
1.1
1.3
1.5
AD5611 MAX TUE
2.73.23.74.24.75.25.76.26.7
SUPPLY VOLTAGE (V)
ERROR (LSB)
TA = 25°C
AD5621 ZERO-CO DE E RROR
AD5611 ZERO-CO DE E RROR
AD5621 FULL-S CALE ERROR
AD5611 FULL-S CALE ERROR
AD5601 ZERO-CO DE E RROR
AD5601 FULL-S CALE ERROR
06853-035
–0.0004
–0.0002
0
0.0002
0.0004
0.0006
0.0008
0.0010
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.10
2.73.23.74.24.75.2
SUPPLY VOLTAGE (V)
I
DD
(
m
A)
TA = 25°C
06853-036
0
50
100
150
200
250
300
350
400
450
0
V
LOGIC
(V)
I
DD
(µA)
SCLK/SDIN
INCREASING
V
DD
= 3V
SCLK/SDI N DE CRE AS ING V
DD
= 3V
SCLK/SDIN
DECREASING
V
DD
= 5V
SCLK/SDIN
INCREASING
V
DD
= 5V
645321
TA = 25°C
06853-037
Figure 35. Total Unadjusted Error (TUE) vs. Supply Voltage at 25°C
Figure 37. Supply Current vs. Supply Voltage at 25°C
Figure 36. Zero-Code Error and Full-Scale Error vs. Supply Voltage at 25°C
Figure 38. SCLK/SDIN vs. Logic Voltage
Rev. F | Page 12 of 24
Page 13
Data Sheet AD5601/AD5611/AD5621
TERMINOLOGY
Relative Accuracy
For the DAC, relative accuracy or integral nonlinearity (INL) is
a measure of the maximum deviation, in LSBs, from a straight
line passing through the endpoints of the DAC transfer function. See Figure 5 to Figure 7 for plots of typical INL vs. code.
Differential Nonlinearity
Differential nonlinearity (DNL) is the difference between the
measured change and the ideal 1 LSB change between any two
adjacent codes. A specified differential nonlinearity of ±1 LSB
maximum ensures monotonicity. This DAC is guaranteed
monotonic by design. See Figure 11 to Figure 13 for plots of
typical DNL vs. code.
Zero-Code Error
Zero-code error is a measure of the output error when zero
code (0x0000) is loaded to the DAC register. Ideally, the output
should be 0 V. The zero-code error is always positive in the
AD5601/AD5611/AD5621 because the output of the DAC cannot
go below 0 V. Ze ro -code error is due to a combination of the
offset errors in the DAC and output amplifier. Zero-code error
is expressed in mV. See Figure 28 for a plot of zero-code error
vs. temperature.
Full-Scale Error
Full-scale error is a measure of the output error when full-scale
code (0xFFFF) is loaded to the DAC register. Ideally, the output
should be V
Figure 28 for a plot of full-scale error vs. temperature.
Gain Error
Gain error is a measure of the span error of the DAC. It is the
deviation in slope of the DAC transfer characteristic from the
ideal, expressed as a percent of the full-scale range.
− 1 LSB. Full-scale error is expressed in mV. See
DD
Total Unadjusted Error
Total unadjusted error (TUE) is a measure of the output error,
taking all the various errors into account. See Figure 8 to
Figure 10 for plots of typical TUE vs. code.
Zero-Code Error Drift
Zero-code error drift is a measure of the change in zero-code
error with a change in temperature. It is expressed in µV/°C.
Gain Temperature Coefficient
Gain temperature coefficient is a measure of the change in gain
error with changes in temperature. It is expressed in (ppm of
full-scale range)/°C.
Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the
analog output when the input code in the DAC register changes
state. It is normally specified as the area of the glitch in nV-s
and is measured when the digital input code is changed by
1 LSB at the major carry transition (0x2000 to 0x1FFF). See
Figure 19.
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into
the analog output of the DAC from the digital inputs of the
DAC, but is measured when the DAC output is not updated.
It is specified in nV-s and is measured with a full-scale code
change on the data bus—from all 0s to all 1s and vice versa.
Rev. F | Page 13 of 24
Page 14
×=
n
DD
OUT
D
VV
2
V
DD
V
OUT
GND
RESISTOR
NETWORK
REF (+)
REF (–)
OUTPUT
AMPLIFIER
DAC REGISTER
06853-038
R
R
R
R
R
TO OUTPUT
AMPLIFIER
06853-039
AD5601/AD5611/AD5621 Data Sheet
THEORY OF OPERATION
DAC SECTION
The AD5601/AD5611/AD5621 DACs are fabricated on a
CMOS process. The architecture consists of a string DAC
followed by an output buffer amplifier. Figure 39 is a block
diagram of the DAC architecture.
Figure 39. DAC Architecture
Because the input coding to the DAC is straight binary, the ideal
output voltage is given by
where:
D is the decimal equivalent of the binary code that is loaded to
the DAC register.
n is the bit resolution of the DAC.
RESISTOR STRING
The resistor string structure is shown in Figure 40. It is simply a
string of resistors, each of Value R. The code loaded to the DAC
register determines at which node on the string the voltage is
tapped off to be fed into the output amplifier. The voltage is
tapped off by closing one of the switches connecting the string
to the amplifier. Because it is a string of resistors, it is guaranteed monotonic.
Figure 40. Resistor String Structure
Rev. F | Page 14 of 24
OUTPUT AMPLIFIER
The output buffer amplifier is capable of generating rail-to-rail
voltages on its output, giving an output range of 0 V to V
DD
. It is
capable of driving a load of 2 kΩ in parallel with 1000 pF to
GND. The source and sink capabilities of the output amplifier
are shown in Figure 25. The slew rate is 0.5 V/µs, with a halfscale settling time of 8 µs with the output loaded.
SERIAL INTERFACE
The AD5601/AD5611/AD5621 have a 3-wire serial interface
SYNC
(
, SCLK, and SDIN) that is compatible with SPI, QSPI,
and MICROWIRE interface standards as well as most DSPs. See
Figure 2 for a timing diagram of a typical write sequence.
The write sequence begins by bringing the
SYNC
line low. Data
from the SDIN line is clocked into the 16-bit shift register on
the falling edge of SCLK. The serial clock frequency can be as
high as 30 MHz, making the AD5601/AD5611/AD5621 compatible with high speed DSPs. On the 16
th
falling clock edge,
the last data bit is clocked in and the programmed function is
executed (a change in DAC register contents and/or a change
in the mode of operation). At this stage, the
SYNC
line may be
kept low or brought high. In either case, it must be brought high
for a minimum of 33 ns before the next write sequence so that a
falling edge of
Because the
than it does when V
SYNC
can initiate the next write sequence.
SYNC
buffer draws more current when VIN = 1.8 V
= 0.8 V,
IN
SYNC
should be idled low
between write sequences for even lower power operation of the
part, as mentioned previously. However, it must be brought
high again just before the next write sequence.
INPUT SHIFT REGISTER
The input shift register is 16 bits wide (see Figure 41). The first
two bits are control bits, which control the operating mode of
the part (normal mode or any one of three power-down
modes). For a complete description of the various modes, see
the Power-Down Modes section. For the AD5621, the next
12 bits are the data bits, which are transferred to the DAC
register on the 16
the last two bits is ignored by the AD5621. See Figure 42 and
Figure 43 for the AD5611 and AD5601 input shift register map.
INTERRUPT
SYNC
In a normal write sequence, the
least 16 falling edges of SCLK and the DAC is updated on the
th
falling edge. However, if
16
th
16
falling edge, this acts as an interrupt to the write sequence.
The shift register is reset and the write sequence is seen as
invalid. Neither an update of the DAC register contents nor a
change in the operating mode occurs (see
th
falling edge of SCLK. The information in
SYNC
line is kept low for at
SYNC
is brought high before the
Figure 44).
Page 15
Data Sheet AD5601/AD5611/AD5621
DB15 (MSB)
PD1PD0D11D10D9D8D7D6D5D4D3D2D1D0X
X
DB0 (LSB)
DATA BITS
POWER-DOWN MODES
0
1
0
1
0
0
1
1
NORMAL OPERATION
1kΩ TO GND
100kΩ TO G ND
THREE-STATE
06853-040
DB15 (MSB)
PD1PD0D9D8D7D6D5D4D3D2D1D0XXX
X
DB0 (LSB)
DATA BITS
POWER-DOWN MODES
0
1
0
1
0
0
1
1
NORMAL OPERATION
1kΩ TO GND
100kΩ TO G ND
THREE-STATE
06853-041
DB15 (MSB)
PD1PD0D8D7D6D5D4D3D2D1XXXXX
X
DB0 (LSB)
DATA BITS
POWER-DOWN MODES
0
1
0
1
0
0
1
1
NORMAL OPERATION
1kΩ TO GND
100kΩ TO G ND
THREE-STATE
06853-042
06853-043
DB15DB15DB0DB0
INVALID W RITE SEQ UE NCE :
SYNC HIGH BEF ORE 16
TH
FALLING EDGE
VALID WRI TE SEQUENCE , OUTPUT UP DATES
ON THE 16TH FALLING EDGE
SYNC
SCLK
SDIN
Figure 41. AD5621 Input Register Contents
Figure 42. AD5611 Input Register Contents
Figure 43. AD5601 Input Register Contents
Figure 44.
Rev. F | Page 15 of 24
SYNC
Interrupt Facility
Page 16
AD5601/AD5611/AD5621 Data Sheet
POWER-DOWN
CIRCUITRY
RESISTOR
NETWORK
V
OUT
RESISTOR
STRING DAC
AMPLIFIER
06853-044
AD5601/AD5611/
AD5621*
*ADDITIONAL PINS OMITTED FOR CLARITY
TFS
DT
SCLK
SYNC
SDIN
SCLK
06853-045
ADSP-2101*
68HC11/
68L11*
AD5601/AD5611/
AD5621*
*ADDITIONAL PINS OMITTED FOR CLARITY
PC7
SCK
MOSI
SYNC
SCLK
SDIN
06853-046
POWER-ON RESET
The AD5601/AD5611/AD5621 contain a power-on reset circuit
that controls the output voltage during power-up. The DAC
register is filled with 0s and the output voltage is 0 V. It remains
there until a valid write sequence is made to the DAC. This is
useful in applications in which it is important to know the state
of the DAC output while it is in the process of powering up.
POWER-DOWN MODES
The AD5601/AD5611/AD5621 have four separate modes of
operation. These modes are software-programmable by setting
two bits (DB15 and DB14) in the control register. Table 6 shows
how the state of the bits corresponds to the operating mode of
the device.
Table 6. Operating Modes of the AD5601/AD5611/AD5621
DB15 DB14 Operating Mode
0 0 Normal operation
Power-down modes:
0 1 1 kΩ to GND
1 0 100 kΩ to GND
1 1 Three-state
When both bits are set to 0, the part has normal power
consumption of 100 µA maximum at 5 V. However, for the
three power-down modes, the supply current falls to typically
0.2 µA at 3 V.
Not only does the supply current fall, but the output stage is
also internally switched from the output of the amplifier to a
resistor network of known values. This has the advantage that
the output impedance of the part is known while the part is in
power-down mode.
There are three different options: the output is connected
internally to GND through a 1 kΩ resistor or a 100 kΩ resistor,
or the output is left open-circuited (three-stated). Figure 45
shows the output stage.
MICROPROCESSOR INTERFACING
AD5601/AD5611/AD5621 to ADSP-2101 Interface
Figure 46 shows a serial interface between the AD5601/
AD5611/AD5621 and the ADSP-2101. The ADSP-2101 should
be set up to operate in SPORT transmit alternate framing mode.
The ADSP-2101 SPORT is programmed through the SPORT
control register and should be configured as follows: internal
clock operation, active low framing, and 16-bit word length.
Transmission is initiated by writing a word to the Tx register
after the SPORT is enabled.
Figure 46. AD5601/AD5611/AD5621 to ADSP-2101Interface
AD5601/AD5611/AD5621 to 68HC11/68L11 Interface
Figure 47 shows a serial interface between the AD5601/AD5611/
AD5621 and the 68HC11/68L11 microcontroller. SCK of the
68HC11/68L11 drives the SCLK of the AD5601/AD5611/
AD5621, while the MOSI output drives the serial data line of
the DAC. The
The setup conditions for correct operation of this interface are
as follows: the 68HC11/68L11 should be configured so that the
CPOL bit is 0 and the CPHA bit is 1. When data is being transmitted to the DAC, the
68HC11/68L11 are configured as indicated, data appearing on
the MOSI output is valid on the falling edge of SCK. Serial data
from the 68HC11/68L11 is transmitted in 8-bit bytes with only
eight falling clock edges occurring in the transmit cycle. Data is
transmitted MSB first. To load data to the AD5601/AD5611/
AD5621, PC7 is left low after the first eight bits are transferred
and a second serial write operation is performed to the DAC.
PC7 is taken high at the end of this procedure.
SYNC
signal is derived from a port line (PC7).
SYNC
line is taken low (PC7). When the
Figure 45. Output Stage During Power-Down
The bias generator, output amplifier, resistor string, and other
associated linear circuitry are all shut down when power-down
mode is activated. However, the contents of the DAC register
are unaffected when in power-down. The time to exit powerdown is typically 13 µs for V
See Figure 21 for a plot.
= 5 V and 16 µs for VDD = 3 V.
DD
Figure 47. AD5601/AD5611/AD5621 to 68HC11/68L11 Interface
Rev. F | Page 16 of 24
Page 17
Data Sheet AD5601/AD5611/AD5621
ADSP-BF53x*
AD5601/AD5611/
AD5621*
*ADDITIONAL PINS OMITTED FOR CLARITY
DT0PRI
TSCLK0
TFS0
SDIN
SCLK
SYNC
06853-047
80C51/80L51*
AD5601/AD5611/
AD5621*
*ADDITIONAL PINS OMITTED FOR CLARITY
P3.3
TxD
RxD
SYNC
SCLK
SDIN
06853-048
MICROWIRE*
AD5601/AD5611/
AD5621*
*ADDITIONAL PINS OMITTED FOR CLARITY
CS
SK
SO
SYNC
SCLK
SDIN
06853-049
AD5601/AD5611/AD5621 to Blackfin® ADSP-BF53x
Interface
Figure 48 shows a serial interface between the AD5601/AD5611/
AD5621 and the Blackfin ADSP-BF53x microprocess or. The
ADSP-BF53x processor family incorporates two dual-channel
synchronous serial ports, SPORT1 and SPORT0, for serial and
multiprocessor communications. Using SPORT0 to connect to
the AD5601/AD5611/AD5621, the setup for the interface is as
follows: DT0PRI drives the SDIN pin of the AD5601/AD5611/
AD5621, while TSCLK0 drives the SCLK of the part. The
SYNC
is driven from TFS0.
and a second write cycle is initiated to transmit the second byte
of data. P3.3 is taken high following the completion of this
cycle. The 80C51/80L51 output the serial data LSB first. The
AD5601/AD5611/AD5621 require data with the MSB as the
first bit received. The 80C51/80L51 transmit routine should
take this into account.
Figure 48. AD5601/AD5611/AD5621 to Blackfin ADSP-BF53x Interface
AD5601/AD5611/AD5621 to 80C51/80L51 Interface
Figure 49 shows a serial interface between the AD5601/
AD5611/AD5621 and the 80C51/80L51 microcontroller. The
setup for the interface is as follows: TxD of the 80C51/80L51
drives SCLK of the AD5601/AD5611/AD5621, while RxD
drives the serial data line of the part. The
SYNC
signal is again
derived from a bit programmable pin on the port. In this case,
Port Line P3.3 is used. When data is to be transmitted to the
AD5601/AD5611/AD5621, P3.3 is taken low. The 80C51/80L51
transmit data only in 8-bit bytes; therefore, only eight falling
clock edges occur in the transmit cycle. To load data to the
DAC, P3.3 is left low after the first eight bits are transmitted,
Figure 49. AD5601/AD5611/AD5621 to 80C51/80L51 Interface
AD5601/AD5611/AD5621 to MICROWIRE Interface
Figure 50 shows an interface between the AD5601/AD5611/
AD5621 and any MICROWIRE-compatible device. Serial data
is shifted out on the falling edge of the serial clock and is
clocked into the AD5601/AD5611/AD5621 on the rising edge
of the SK.
Figure 50. AD5601/AD5611/AD5621 to MICROWIRE Interface
Rev. F | Page 17 of 24
Page 18
AD5601/AD5611/AD5621 Data Sheet
×−
+
×
×=
R1
R2
V
R1
R2R1D
VV
DD
N
DD
OUT
2
V5
2
10
−
×
=
N
OUT
D
V
3-WIRE
SERIAL
INTERFACE
SYNC
SCLK
SDIN
7V
5V
V
OUT
= 0V TO 5V
ADR395
06853-050
AD5601/AD5611/
AD5621
R2 = 10kΩ
06853-051
+5V
–5V
AD820/
OP295
3-WIRE
SERIAL
INTERFACE
+5V
AD5601/AD5611/
AD5621
10µF
0.1µF
V
DD
V
OUT
R1 = 10kΩ
+5V
APPLICATIONS
CHOOSING A REFERENCE AS POWER SUPPLY FOR
THE AD5601/AD5611/AD5621
The AD5601/AD5611/AD5621 come in tiny LFCSP and SC70
packages with less than a 100 µA supply current. Because of
this, the choice of reference depends on the application
requirements. For applications with space-saving requirements,
the ADR02 is recommended. It is available in an SC70 package
and has excellent drift at 9 ppm/°C (3 ppm/°C in the R-8 package)
and provides very good noise performance at 3.4 µV p-p in the 0.1
Hz to 10 Hz range.
Because the supply current required by the AD5601/AD5611/
AD5621 is extremely low, the parts are ideal for low supply
applications. The ADR395 voltage reference is recommended in
this case. It requires less than 100 µA of quiescent current and
can, therefore, drive multiple DACs in one system, if required. It
also provides very good noise performance at 8 µV p-p in the
0.1 Hz to 10 Hz range.
BIPOLAR OPERATION USING THE
AD5601/AD5611/AD5621
The AD5601/AD5611/AD5621 have been designed for singlesupply operation, but a bipolar output range is also possible
using the circuit shown in Figure 52. The circuit in Figure 52
gives an output voltage range of ±5 V. Rail-to-rail operation at
the amplifier output is achievable using an AD820 or OP295 as
the output amplifier.
Figure 51. ADR395 as Power Supply to the AD5601/AD5611/AD5621
Some recommended precision references for use as supplies to
the AD5601/AD5611/AD5621 are listed in Tabl e 7.
Table 7. Precision References for the AD5601/AD5611/AD5621
Figure 52. Bipolar Operation with the AD5601/AD5611/AD5621
The output voltage for any input code can be calculated as
where D represents the input code in decimal (0 – 2
With V
= 5 V, R1 = R2 = 10 kΩ
DD
N
).
This is an output voltage range of ±5 V, with 0x0000 corresponding to a −5 V output and 0x3FFF corresponding to a
+5 V output.
Rev. F | Page 18 of 24
Page 19
Data Sheet AD5601/AD5611/AD5621
06853-052
V
DD
AD5601/
AD5611/
AD5621
ADuM1300
POWER10µF0.1µF
GND
5V
REGULATOR
SCLKV
OA
V
OUT
V
OB
SYNC
V
OC
V
IA
V
IB
V
IC
SCLK
SDI
DATASDIN
USING THE AD5601/AD5611/AD5621 WITH A
GALVANICALLY ISOLATED INTERFACE
In process control applications in industrial environments,
it is often necessary to use a galvanically isolated interface to
protect and isolate the controlling circuitry from any hazardous
common-mode voltages that might occur in the area where the
DAC is functioning. iCoupler® provides isolation in excess of
2.5 kV. Because the AD5601/AD5611/AD5621 use a 3-wire serial
logic interface, the ADuM1300 3-channel digital isolator
provides the required isolation (see Figure 53). The power
supply to the part also needs to be isolated, which is done by
using a transformer. On the DAC side of the transformer, a 5 V
regulator provides the 5 V supply required for the AD5601/
AD5611/AD5621.
Figure 53. AD5601/AD5611/AD5621 with a Galvanically Isolated Interface
POWER SUPPLY BYPASSING AND GROUNDING
When accuracy is important in a circuit, it is helpful to carefully
consider the power supply and ground return layout on the
board. The PCB containing the AD5601/AD5611/AD5621
should have separate analog and digital sections, each having its
own area of the board. If the AD5601/AD5611/AD5621 are in a
system where other devices require an AGND-to-DGND
connection, the connection should be made at one point only.
This ground point should be as close as possible to the
AD5601/AD5611/AD5621.
The power supply to the AD5601/AD5611/AD5621 should be
bypassed with 10 µF and 0.1 µF capacitors. The capacitors
should be physically as close as possible to the device, with the
0.1 µF capacitor ideally right up against the device. The 10 µF
capacitors are the tantalum bead type. It is important that the
0.1 µF capacitor have low effective series resistance (ESR) and
effective series inductance (ESI), such as in common ceramic
types of capacitors. This 0.1 µF capacitor provides a low impedance path to ground for high frequencies caused by transient
currents due to internal logic switching.
The power supply line itself should have as large a trace as
possible to provide a low impedance path and reduce glitch
effects on the supply line. Clocks and other fast switching
digital signals should be shielded from other parts of the board
by digital ground. Avoid crossover of digital and analog signals,
if possible. When traces cross on opposite sides of the board,
ensure that they run at right angles to each other to reduce
feedthrough effects on the board. The best board layout technique is the microstrip technique, where the component side of
the board is dedicated to the ground plane only and the signal
traces are placed on the solder side. However, this is not always
possible with a two-layer board.
Rev. F | Page 19 of 24
Page 20
AD5601/AD5611/AD5621 Data Sheet
1.30BSC
COMPLIANT TO JEDEC STANDARDS MO-203-AB
1.00
0.90
0.70
0.46
0.36
0.26
2.20
2.00
1.80
2.40
2.10
1.80
1.35
1.25
1.15
072809-A
0.10 MAX
1.10
0.80
0.40
0.10
0.22
0.08
3
12
46
5
0.65BSC
COPLANARITY
0.10
SEATING
PLANE
0.30
0.15
1.50
1.40
1.30
0.45
0.40
0.35
TOP VIEW
6
1
4
3
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.70
1.60
1.50
0.203 REF
0.05 MAX
0.00 MIN
0.65 REF
EXPOSED
PAD
PIN 1
INDICATOR
(R 0.15)
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
10-18-2010-A
2.10
2.00
1.90
3.10
3.00
2.90
COMPLIANT
TO
JEDEC STANDARDS MO-229
COPLANARITY
0.08
0.20 MIN
0.35
0.30
0.25
OUTLINE DIMENSIONS
Figure 54. 6-Lead Thin Shrink Small Outline Transistor Package [SC70]
(KS-6)
Dimensions shown in millimeters
Figure 55. 6-Lead Lead Frame Chip Scale Package [LFCSP_WD]
2.00 × 3.00 mm Body, Very Very Thin, Dual Lead
(CP-6-5)
Dimensions shown in millimeters
Rev. F | Page 20 of 24
Page 21
Data Sheet AD5601/AD5611/AD5621
Temperature
Package
ORDERING GUIDE
Model1
AD5601BKSZ-500RL7 –40°C to +125°C ±0.5 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3V
AD5601BKSZ-REEL7 –40°C to +125°C ±0.5 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3V
AD5601BCPZ-RL7 –40°C to +125°C ±0.5 LSB 6-Lead Lead Frame Chip Scale Package [LFCSP_WD] CP-6-5 89
AD5611AKSZ-500RL7 –40°C to +125°C ±4.0 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3U
AD5611AKSZ-REEL7 –40°C to +125°C ±4.0 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3U
AD5611ACPZ-RL7 –40°C to +125°C ±4.0 LSB 6-Lead Lead Frame Chip Scale Package[LFCSP_WD] CP-6-5 8B
AD5611BKSZ-500RL7 –40°C to +125°C ±0.5 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3T
AD5611BKSZ-REEL7 –40°C to +125°C ±0.5 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3T
AD5621AKSZ-500RL7 –40°C to +125°C ±6.0 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3S
AD5621AKSZ-REEL7 –40°C to +125°C ±6.0 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3S
AD5621ACPZ-RL7 –40°C to +125°C ±6.0 LSB 6-Lead Lead Frame Chip Scale Package[LFCSP_WD] CP-6-5 88
AD5621BKSZ-500RL7 –40°C to +125°C ±1.0 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3R
AD5621BKSZ-REEL7 –40°C to +125°C ±1.0 LSB 6-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-6 D3R
EVAL-AD5621EBZ Evaluation Board