Datasheet AD5583 Datasheet (ANALOG DEVICES)

Page 1
Quad, Parallel Input, Voltage Output,
44
VOD
+
33
A1
32
A0
31
DB11
30
DB10
29
DB9
28
DB8
26
DB7
25
DB6
24
DB5
23
DB4
21
DB3
20
DB2
19
DB1
18
DB0
34
CS
35
R/W
14
DV
DD
17
MSB
16
RS
15
LDAC
I N T E R F A C E
OE
CONTROL
LOGIC
22
DGND127DGND236DGND340V
REFHD
39
V
REFLD
41
V
REFHC
42
V
REFLC
45
V
SS2
46
V
DD2
D
O
IN
REG
D
I
47
VOC
3
V
DD1
4
V
SS1
5
VOA
2
VOB
11
R1
12
RCT
13
R2
20k
20k
1
AGND1
48
AGND2
DAC REG
ADDR
DECODE
38
V
DD3
37
V
SS3
4 4
AD5582
+
10
V
REFLA
9
V
REFHA
7
V
REFLB
8
V
REFHB
a
12-/10-Bit Digital-to-Analog Converters
FEATURES 12-Bit Linearity and Monotonic AD5582 10-Bit Linearity and Monotonic AD5583 Wide Operating Range: Single 5 V to 15 V or
Dual 5 V Supply Unipolar or Bipolar Operation Double Buffered Registers Enable Independent or
Simultaneous Multichannel Update 4 Independent Rail-to-Rail Reference Inputs 20 mA High Current Output Drive Parallel Interface Data Readback Capability 5 s Settling Time Built-In Matching Resistor Simplifies
Negative Reference Unconditionally Stable Under Any Capacitive Loading Compact Footprint: TSSOP-48 Extended Temperature Range: 40C to 125C
APPLICATIONS Process Control Equipment Closed-Loop Servo Control Data Acquisition Systems Digitally Controlled Calibration Optical Network Control Loops 4 m to 20 mA Current Transmitter
AD5582/AD5583

AD5582 FUNCTIONAL BLOCK DIAGRAM

GENERAL DESCRIPTION

The AD5582/AD5583 family of quad, 12-/10-bit, voltage output digital-to-analog converters is designed to operate from a single 5 V to 15 V or dual ± 5 V supply. It offers the user ease of use in single- or dual-supply systems. Built using an advance BiCMOS process, this high performance DAC is dynamically stable, capable of high current drive, and in small form factor.
The applied external reference V put voltage ranges from V of full-scale outputs. For multiplying and wide dynamic appli­cations, ac reference inputs can be as high as |V
SS
built-in precision trimmed resistors configured easily to provide four-
A doubled-buffered parallel interface offers a fast settling time. A common level sensitive load DAC strobe (LDAC) input allows additional simultaneous update of all DAC outputs. An external asynchronous reset (RS) forces all registers to the zero code state when the MSB = 0 or to midscale when the MSB = 1.
Both parts are offered in the same pinout and package to allow users to select the appropriate resolution for a given application without PCB layout changes.
REV. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies.
determines the full-scale out-
REF
to VDD, resulting in a wide selection
are available and can be
DD
– VSS|. Two
quadrant multiplications.
ADR421
REF
R1
R2
RCT
+
2.5V
DIGITAL CIRCUITRY OMITTED FOR CLARITY
V
REFHA
V
REFHB
V
REFHC
V
REFHD
V
REFLA
V
REFLB
V
REFLC
V
REFLD
DAC A
DAC B
DAC C
DAC D
2.5V
2.5V
2.5V
2.5V
AD5582/AD5583
2.5V
Figure 1. Using Built-In Matching Resistors to Generate a Negative Voltage Reference
The AD5582 is well suited for DAC8412 replacement in medium voltage applications in new designs, as well as any other general purpose multichannel 10- to 12-bit applications.
The AD5582/AD5583 are specified over the extended industrial (–40C to +125C) temperature range and offered in a thin and compact 1.1 mm TSSOP-48 package.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © 2003 Analog Devices, Inc. All rights reserved.
Page 2
AD5582/AD5583–SPECIFICATIONS

ELECTRICAL CHARACTERISTICS

(VDD = +5 V, VSS = –5 V, DVDD = +5 V 10%, V –40C < TA < +125C, unless otherwise noted.)
= +2.5 V, V
REFH
= –2.5 V,
REFL
Parameter Symbol Condition Min Typ1Max Unit
STATIC PERFORMANCE
Resolution
Relative Accuracy
2
3
N AD5582 12 Bits
AD5583 10 Bits
INL –1 +1 LSB Differential Nonlinearity3DNL Monotonic –1 LSB Zero-Scale Error V
ZSE
Data = 000H for AD5582 –2 +2 LSB and AD5583
Gain Error V
Gain Error V Full-Scale Tempco
4
GE
V
GE
GE
TCV
FS
Data = 0xFFFH for AD5582 –2 +2 LSB Data = 0x3FFH for AD5583 –4 +4 LSB VDD = 2.7 V to 4.5 V –4 +4 LSB
1.5 ppm/∞C
REFERENCE INPUT
V
Input Range V
REFH
Input Range
V
REFL
5
Input Resistance R
Input Capacitance
4
REF Input Current I
V
C
REF
REFH
REFL
REF
REF
REF Multiplying Bandwidth BW
REF
Data = 555H (Minimum R
)12 20 kW
REF
for AD5582 and 155H for AD5583
Data = 555H for AD5582 500 mA Code = Full Scale 1.3 MHz
V
+ 0.5 V
REFL
V
SS
V
V
DD
REFH
– 0.5 V
80 pF
1
R1–R2 Matching R1/R2 AD5582 ± 0.025 %
AD5583 ± 0.100 %
ANALOG OUTPUT
Output Current
Output Current
Capacitive Load
6
6
4, 7
I
OUT
I
OUT
C
Data = 800H for AD5582 and ± 2mA 200
for AD5583, V
H
OUT
£ 2 mV
Data = 800H for AD5582 and
for AD5583, V
200
H
£ ± 15 mV –20 mA
V
OUT
L
No Oscillation Note 7 pF
£ |–8 mV| +20 mA
OUT
LOGIC INPUTS
Logic Input Low Voltage V
Logic Input High Voltage V
Input Leakage Current I Input Capacitance
4
Output Voltage High V Output Voltage Low V
IL
IH
IL
C
IL
OH
OL
DVDD = 5 V ± 10% 0.8 V
= 3 V ± 10% 0.4 V
DV
DD
DVDD = 5 V ± 10% 2.4 V DV
= 3 V ± 10% 2.1 V
DD
0.01 1 mA
5pF IOH = –0.8 mA 2.4 V IOL = 1.2 mA, TA = 85C, 0.4 V
= 0.6 mA, DVDD = 3 V
I
OL
I
= 1.0 mA, TA = 125C, 0.4 V
OL
IOL = 0.5 mA, DVDD = 3 V
AC CHARACTERISTICS
Output Slew Rate SR Data = Zero Scale to Full Scale 2 V/ms
to Zero Scale To ± 0.1% of Full Scale 5 ms
to 800H to 7FF
H
for AD5582 and 1FF
to 200
H
H
H
100 nV-s
Settling Time
8
t
S
DAC Glitch Q Code 7FF
to 1FFH for AD5583
Digital Feedthrough V
OUT/tCS
Data = Midscale, CS Toggles at 5 nV-s f = 16 MHz
Analog Crosstalk V
Output Noise e
OUT/VREFVREF
N
= 1.5 V dc + 1 V p-p, –80 dB
Data = 000
, f = 100 kHz
H
f = 1 kHz 33 nV/÷Hz
REV. A–2–
Page 3
AD5582/AD5583
Parameter Symbol Condition Min Typ
1
Max Unit
SUPPLY CHARACTERISTICS
Single-Supply Voltage Range V Dual-Supply Voltage Range V
Digital Logic Supply DV Positive Supply Current
6
Negative Supply Current I Power Dissipation P Power Supply Sensitivity P
NOTES
1
Typical specifications represent average readings measured at 25C.
2
DAC Output Equation: V AD5582 = 12 bits, AD5583 = 10 bits. One LSB step voltage = (V
3
The first two codes (000H, 001H) of the AD5583 and the first four codes (000H, 001H, 002H, 003H) of the AD5582 are excluded from the linearity error measurement in single-supply operation.
4
These parameters are guaranteed by design and not subject to production testing.
5
Dual-supply operation, V
6
Short circuit output and supply currents are 24 mA and 25 mA, respectively.
7
Part is stable under any capacitive loading conditions.
8
The settling time specification does not apply for negative-going transitions within the last 3 LSBs of ground in single-supply operation.
Specifications subject to change without notice.
= V
OUT
REFL
= VSS, exclude the lowest eight codes for the AD5582 and two codes for the AD5583 for INL and DNL errors.
REFL
+ [(V
DD
DD/VSS
I
DD
SS
DISS
SS
REFH
DD
– V
ELECTRICAL CHARACTERISTICS
VSS = 0 V 3 18 V VDD = +2.7 V to +6.5 V, –9 +9 V
= –6.5 V to –2.7 V
V
SS
2.7 8 V VIL = 0 V, No Load 1.7 3 mA VIL = 0 V, No Load 1.5 3 mA VIL = 0 V, No Load 16 30 mW VDD = ± 5% 30 ppm/V
) D/2N], where D = data loaded in corresponding DAC Register A, B, C, D, and N equals the number of bits;
REFL
– V
REFH
)/4096 V and (V
REFL
REFH
– V
)/1024 V for AD5582 and AD5583, respectively.
REFL
(VDD = 15 V, VSS = 0 V, DVDD = 5 V 10%, V
= 10 V, V
REFH
REFL
= 0 V,
–40C < TA < +125C, unless otherwise noted.)
Parameter Symbol Condition Min Typ1Max Unit
STATIC PERFORMANCE
Resolution
Relative Accuracy Differential Nonlinearity Zero-Scale Error V
2
3
N AD5582 12 Bits
AD5583 10 Bits
INL –1 +1 LSB
3
DNL Monotonic –1 LSB
ZSE
Data = 000H for AD5582 –2 +2 LSB and AD5583
Gain Error V
Full-Scale Tempco
4
GE
V
GE
TCV
FS
Data = 0xFFFH for AD5582 –2 +2 LSB Data = 0x3FFH for AD5583 –4 +4 LSB
1.5 ppm/∞C
REFERENCE INPUT
V
Input Range V
REFH
V
Input Range
REFL
5
Input Resistance R
Input Capacitance
4
REF Input Current I
V
C
REF
REFH
REFL
REF
REF
REF Multiplying Bandwidth BW
REF
Data = 555H (Minimum R
)12 20 kW
REF
for AD5582 and 155H for AD5583
Data = 555H for AD5582 1000 mA Code = Full Scale 1.3 MHz
V
+ 0.5 V
REFL
V
SS
V
V
DD
REFH
– 0.5 V
80 pF
1
R1–R2 Matching R1/R2 AD5582 ± 0.025 %
AD5583 ± 0.100 %
ANALOG OUTPUT
Output Current
Output Current
Capacitive Load
6
6
4, 7
I
OUT
I
OUT
C
Data = 800H for AD5582 and 2 mA
for AD5583, V
200
H
OUT
£ 2 mV
Data = 800H for AD5582 and 200
for AD5583, V
H
£ 15 mV –20 mA
V
OUT
L
No Oscillation Note 7 pF
£ |–8 mV| +20 mA
OUT
REV. A
–3–
Page 4
AD5582/AD5583
ELECTRICAL CHARACTERISTICS
(continued)
Parameter Symbol Condition Min Typ1Max Unit
LOGIC INPUTS/OUTPUTS
Logic Input Low Voltage V
Logic Input High Voltage V
Input Leakage Current I Input Capacitance
4
Output Voltage High V Output Voltage Low V
IL
IH
IL
C
IL
OH
OL
V
OL
= 3 V ± 10% 0.4 V
DV
DD
2.4 V
= 3 V ± 10% 2.1 V
DV
DD
IOH = –0.8 mA 2.4 V IOL = 1.2 mA, TA = 85C, 0.4 V
= 0.6 mA, DVDD = 3 V
I
OL
IOL = 1.0 mA, TA = 125C, 0.4 V
0.8 V
mA pF
IOL = 0.5 mA, DVDD = 3 V
AC CHARACTERISTICS
Output Slew Rate SR Data = Zero Scale to Full Scale 2 V/ms
to Zero Scale To ± 0.1% of Full Scale 14 ms
to 800H to 7FFH for 100 nV-s
AD5582 and 1FF
H
for AD5583
1FF
H
to 200H to
H
Data = Midscale, CS Toggles at 5 nV-s
Settling Time
8
t
S
DAC Glitch Q Code 7FF
Digital Feedthrough V
OUT/tCS
f = 16 MHz V
Analog Crosstalk V
Output Noise e
OUT/VREF
N
= 1.5 V dc + 1 V p-p, –80 dB
REF
Data = 000
, f = 100 kHz
H
f = 1 kHz 33 nV/÷Hz
SUPPLY CHARACTERISTICS
Single-Supply Voltage Range V Dual-Supply Voltage Range V
Digital Logic Supply DV Positive Supply Current
6
Power Dissipation P
DD
DD/VSS
I
DD
DISS
DD
VSS = 0 V 3 16.5 V VDD = +2.7 V to +6.5 V, –6.5 +6.5 V
= –6.5 V to –2.7 V
V
SS
2.7 6.5 V VIL = 0 V, No Load 2.3 3.5 mA VIL = 0 V, No Load 34.5 52.5 mW
Power Supply Sensitivity PSS VDD = ± 5% 30 ppm/V
NOTES
1
Typical specifications represent average readings measured at 25C.
2
DAC Output Equation: V bits; AD5582 = 12 bits, AD5583 = 10 bits. One LSB step voltage = (V
3
The first two codes (000H, 001H) of the AD5583 and the first four codes (000H, 001H, 002H, 003H) of the AD5582 are excluded from the linearity error measurement in single-supply operation.
4
These parameters are guaranteed by design and not subject to production testing.
5
Dual-supply operation, V
6
Short circuit output and supply currents are 24 mA and 25 mA, respectively.
7
Part is stable under any capacitive loading conditions.
8
The settling time specification does not apply for negative-going transitions within the last 3 LSBs of ground in single-supply operation.
Specifications subject to change without notice.
= V
OUT
REFL
+ [(V
REFL
= VSS, exclude the lowest eight codes for the AD5582 and two codes for the AD5583 for INL and DNL errors.
REFH
– V
)  D/2N], where D = data in decimal loaded in corresponding DAC Register A, B, C, D, and N equals the number of
REFL
REFH
– V
)/4096 V and = (V
REFL
REFH
– V
)/1024 V for AD5582 and AD5583, respectively.
REFL
REV. A–4–
Page 5
AD5582/AD5583

TIMING CHARACTERISTICS

(VDD = 15 V or 5 V, VSS = 0 V, DVDD = 5 V 10%, V unless otherwise noted.)
= 10 V, V
REFH
= 0 V, –40C < TA < +125C,
REFL
Parameter Symbol Condition Min Typ Max Unit
INTERFACE TIMING*
Chip Select Write Pulse Width t Chip Select Read Pulse Width t Write Setup t Write Hold t Address Setup t Address Hold t Load Setup t Load Hold t Write Data Setup t Write Data Hold t Load Data Pulse Width t Reset Pulse Width t Read Data Hold t Read Data Setup t Data to Hi-Z t Chip Select to Data t Chip Select Repetitive Pulse Width t Load Setup in Double Buffer Mode t Load Data Hold t
*All input control signals are specified with tR = tF = 2 ns (10% to 90% of 3 V) and timed from a voltage level of 1.5 V. Specifications subject to change without notice.
WCS
RCS
WS
WH
AS
AH
LS
LH
WDS
WDH
LDW
RESET
RDH
RDS
DZ
CSD
CSP
LDS
LDH
CL = 10 pF 100 ns CL = 10 pF 100 ns
20 ns 130 ns 35 ns 0ns 35 ns 0ns 0ns 0ns 35 ns 0ns 20 ns 20 ns 0ns 0ns
10 ns 20 ns 0ns
TIMING CHARACTERISTICS
(VDD = 15 V or 5 V, VSS = 0 V, DVDD = 3 V  10%, V unless otherwise noted.)
= 10 V, V
REFH
= 0 V, –40C < TA < +125C,
REFL
Parameter Symbol Condition Min Typ Max Unit
INTERFACE TIMING*
Chip Select Write Pulse Width t Chip Select Read Pulse Width t Write Setup t Write Hold t Address Setup t Address Hold t Load Setup t Load Hold t Write Data Setup t Write Data Hold t Load Data Pulse Width t Reset Pulse Width t Read Data Hold t Read Data Setup t Data to Hi-Z t Chip Select to Data t Chip Select Repetitive Pulse Width t Load Setup in Double Buffer Mode t Load Data Hold t
*All input control signals are specified with tR = tF = 2 ns (10% to 90% of 3 V) and timed from a voltage level of 1.5 V. Specifications subject to change without notice.
WCS
RCS
WS
WH
AS
AH
LS
LH
WDS
WDH
LDW
RESET
RDH
RDS
DZ
CSD
CSP
LDS
LDH
CL = 10 pF 80 100 ns CL = 10 pF 80 100 ns
35 ns 130 ns 50 ns 0ns 50 ns 0ns 0ns 0ns 50 ns 0ns 35 ns 35 ns 0ns 0ns
20 ns 35 ns 0ns
REV. A
–5–
Page 6
AD5582/AD5583

ABSOLUTE MAXIMUM RATINGS*

VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +18 V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +18 V
V
DD
V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –9 V
SS
to V
V
DD
to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +18 V
V
REF–
to V
V
REFH
. . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +18 V
REF+
. . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +18 V
REFL
DVDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V
Logic Inputs to GND . . . . . . . . . . . V
to GND . . . . . . . . . . . . . . . . . VSS – 0.3 V, VDD + 0.3 V
V
OUT
I
Short Circuit to GND . . . . . . . . . . . . . . . . . . . . . . 24 mA
OUT
Thermal Resistance Junction to Ambient,
– 0.3 V, VDD + 0.3 V
SS
. . . . . . 115C/W
JA

ORDERING GUIDE

Thermal Resistance Junction to Case, JC . . . . . . . . . . 42C/W
Maximum Junction Temperature (T
Package Power Dissipation = (T
Max) . . . . . . . . . . 150C
J
Max – TA)/
J
JA
Operating Temperature Range . . . . . . . . . . –40C to +125∞C
Storage Temperature Range . . . . . . . . . . . . –65C to +150∞C
Lead Temperature
RV-48 (Soldering, 60 secs) . . . . . . . . . . . . . . . . . . . . 300∞C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
1
Resolution Temperature Package Package Container Top
Model (Bits) Range Description Option Quantity Marking
AD5582YRV-REEL112 –40C to +125CTSSOP-48 RV-48 2500 AD5582Y AD5583YRV-REEL 10 –40C to +125CTSSOP-48 RV-48 2500 AD5583Y AD5582YRV
1
12 –40C to +125CTSSOP-48 RV-48 39 AD5582Y
AD5583YRV 10 –40C to +125CTSSOP-48 RV-48 39 AD5583Y
NOTES
1
The AD5582 contains 4116 transistors. The die size measures 108 mil 144 mil.
2
First row marking is shown in the table above. Second row marking contains date code in YYWW format. Third row marking contains the lot number.
2
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD5582/AD5583 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. A–6–
Page 7

AD5582 PIN CONFIGURATION

AD5582/AD5583
AGND1
VOB
V
DD1
V
SS1
VOA
NC
V
REFLB
V
REFHB
V
REFHA
V
REFLA
R1
RCT
R2
DV
DD
LDAC
RS
MSB
DB0
DB1
DB2
DB3
DGND1
DB4
DB5
1
2
3
4
5
6
7
8
9
10
AD5582
11
TOP VIEW
(Not to Scale)
12
13
14
15
16
17
18
19
20
21
22
23
24
NC = NO CONNECT
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
AGND2
VOC
V
DD2
V
SS2
VOD
NC
V
REFLC
V
REFHC
V
REFHD
V
REFLD
V
DD3
V
SS3
DGND3
R/W
CS
A1
A0
DB11
DB10
DB9
DB8
DGND2
DB7
DB6

AD5582 PIN FUNCTION DESCRIPTIONS*

Pin No. Mnemonic Description
1 AGND1 Analog Ground for DAC A and B 2 VOB DAC B Output 3V
DD1
4V
SS1
Positive Power Supply for DAC A and B
Negative Power Supply for DAC A and B 5 VOA DAC A Output 6NCNo Connect 7V 8V 9V
10 V
REFLB
REFHB
REFHA
REFLA
DAC B Voltage Reference Low Terminal
DAC B Voltage Reference High Terminal
DAC A Voltage Reference High Terminal
DAC A Voltage Reference Low Terminal
11 R1 R1 Terminal (for Negative Reference) 12 RCT Center Tap Terminal (for Negative Reference) 13 R2 R2 Terminal (for Negative Reference) 14 DV
DD
Power Supply for Digital Circuits
15 LDAC DAC Register Load, Active Low Level Sensitive 16 RS Reset Strobe 17 MSB MSB = 0, Reset to 000
MSB = 1, Reset to 800
.
H
.
H
18 DB0 Data Bit 0 19 DB1 Data Bit 1 20 DB2 Data Bit 2 21 DB3 Data Bit 3 22 DGND1 Digital Ground 1 23 DB4 Data Bit 4
Pin No. Mnemonic Description
25 DB6 Data Bit 6 26 DB7 Data Bit 7 27 DGND2 Digital Ground 2 28 DB8 Data Bit 8 29 DB9 Data Bit 9 30 DB10 Data Bit 10 31 DB11 Data Bit 11 32 A0 Address Input 0 33 A1 Address Input 1 34 CS Chip Select, Active Low 35 R/W Read/Write Mode Select 36 DGND3 Digital Ground 3 37 V 38 V 39 V 40 V 41 V 42 V
SS3
DD3
REFLD
REFHD
REFHC
REFLC
Negative Power Supply for Analog Switches Positive Power Supply for Analog Switches DAC D Voltage Reference Low Terminal DAC D Voltage Reference High Terminal DAC C Voltage Reference High Terminal
DAC C Voltage Reference Low Terminal 43 NC No Connect 44 VOD DAC D Output 45 V 46 V
SS2
DD2
Negative Power Supply for DAC C and D
Positive Power Supply for DAC C and D 47 VOC DAC C Output 48 AGND2 Analog Ground for DAC C and D
24 DB5 Data Bit 5
*AD5582 optimizes internal layout design to reduce die area so that all supply voltage pins are required to be connected externally. See Figure 5.
REV. A
–7–
Page 8
AD5582/AD5583

AD5583 PIN CONFIGURATION

AGND1
VOB
V
DD1
V
SS1
VOA
NC
V
REFLB
V
REFHB
V
REFHA
V
REFLA
R1
RCT
R2
DV
LDAC
RS
MSB
NC
NC
DB0
DB1
DGND1
DB2
DB3
DD
1
2
3
4
5
6
7
8
9
10
AD5583
11
TOP VIEW
(Not to Scale)
12
13
14
15
16
17
18
19
20
21
22
23
24
NC = NO CONNECT
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
AGND2
VOC
V
DD2
V
SS2
VOD
NC
V
REFLC
V
REFHC
V
REFHD
V
REFLD
V
DD3
V
SS3
DGND3
R/W
CS
A1
A0
DB9
DB8
DB7
DB6
DGND2
DB5
DB4

AD5583 PIN FUNCTION DESCRIPTIONS*

Pin No. Mnemonic Description
1 AGND1 Analog Ground for DAC A and B 2 VOB DAC B Output 3V
DD1
4V
SS1
Positive Power Supply for DAC A and B
Negative Power Supply for DAC A and B 5 VOA DAC A Output 6NCNo Connect (Do Not Connect Anything
other than Dummy Pad) 7V 8V 9V
10 V
REFLB
REFHB
REFHA
REFLA
DAC B Voltage Reference Low Terminal
DAC B Voltage Reference High Terminal
DAC A Voltage Reference High Terminal
DAC A Voltage Reference Low Terminal
11 R1 R1 Terminal (for Negative Reference) 12 RCT Center Tap Terminal (for Negative Reference) 13 R2 R2 Terminal (for Negative Reference) 14 DV
DD
Power Supply for Digital Circuits
15 LDAC DAC Register Load, Active Low Level Sensitive 16 RS Reset Strobe 17 MSB MSB = 0, Reset to 000
MSB = 1, Reset to 200
.
H
.
H
18 NC No Connect (Do Not Connect Anything
other than Dummy Pad)
19 NC No Connect (Do Not Connect Anything
other than Dummy Pad)
20 DB0 Data Bit 0 21 DB1 Data Bit 1
Pin No. Mnemonic Description
25 DB4 Data Bit 4 26 DB5 Data Bit 5 27 DGND2 Digital Ground 2 28 DB6 Data Bit 6 29 DB7 Data Bit 7 30 DB8 Data Bit 8 31 DB9 Data Bit 9 32 A0 Address Input 0 33 A1 Address Input 1 34 CS Chip Select, Active Low 35 R/W Read/Write Mode Select 36 DGND3 Digital Ground 3 37 V 38 V 39 V 40 V 41 V 42 V
SS3
DD3
REFLD
REFHD
REFHC
REFLC
Negative Power Supply for Analog Switches Positive Power Supply for Analog Switches DAC D Voltage Reference Low Terminal DAC D Voltage Reference High Terminal DAC C Voltage Reference High Terminal DAC C Voltage Reference Low Terminal
43 NC No Connect (Do Not Connect Anything
other than Dummy Pad) 44 VOD DAC D Output 45 V 46 V
SS2
DD2
Negative Power Supply for DAC C and D
Positive Power Supply for DAC C and D 47 VOC DAC C Output 48 AGND2 Analog Ground for DAC C and D
22 DGND1 Digital Ground 1 23 DB2 Data Bit 2 24 DB3 Data Bit 3
*AD5583 optimizes internal layout design to reduce die area so that all supply voltage pins are required to be connected externally. See Figure 5.
REV. A–8–
Page 9

TIMING DIAGRAMS

R/W
ADDRESS
LDAC
CS
t
20ns
WCS =
t
WS =
t
AS =
ADDRESS
ONE
t
LS =
t
WDS =
35ns
35ns
0ns
t
CSP =
35ns
10ns
ADDRESS
TWO
ADDRESS
THREE
ADDRESS
t
LH =
t
WDH =
FOUR
0ns
0ns
AD5582/AD5583
t
0ns
WH =
DATA IN
CS
R/W
ADDRESS
LDAC
DATA1 VA LI D
DATA2 VA LI D
DATA3
VA LI D
DATA4 VA LI D
Figure 2a. Single Buffer Mode, Output Updated Individually, DVDD = 5 V
t
10ns
CSP =
t
20ns
WCS =
t
35ns
WS =
t
35ns
AS =
ADDRESS
ONE
t
WDS =
35ns
ADDRESS
TWO
ADDRESS
t
LDS =
THREE
0ns
ADDRESS
FOUR
t
0ns
LDH =
t
LDW =
20ns
t
t
WH =
WDH =
0ns
0ns
REV. A
DATA IN
DATA1
VA LI D
DATA2 VA LI D
DATA3 VA LI D
DATA4 VA LI D
Figure 2b. Double Buffer Mode, Output Updated Simultaneously, DVDD = 5 V
–9–
Page 10
AD5582/AD5583
CS
R/W
A0/A1
LDAC
DATA IN
RS
t
LS =
t
WDS =
0ns
35ns
t
RESET =
20ns
t
WS =
t
AS =
t
WCS =
35ns
35ns
20ns
t
LH =
0ns
t
WDH =
t
AH =
t
WH =
0ns
0ns
0ns
t
LDW =
20ns
CS
R/W
A0/A1
DATA OUT
Figure 2c. Data Write (Input and Output Registers) Timing
t
130ns
RCS =
t
35ns
RDS =
t
35ns
AS =
t
100ns MAX
CSD =
HI-Z DATA VALID HI-Z
t
RDH =
t
AH =
0ns
0ns
t
DZ =
100ns MAX
Figure 2d. Data Output (Read Timing)
REV. A–10–
Page 11
Typical Performance Characteristics–AD5582/AD5583
1.0
0.8
0.6
0.4
0.2
0
INL (LSB)
–0.2
–0.4
–0.6
–0.8
–1.0
0512 1024 2048 3072 4096
1536 2560 3584
CODE (Decimal)
TPC 1. AD5582 Integral Nonlinearity Error
1.0
0.8
0.6
0.4
0.2
0
DNL ( LSB)
–0.2
–0.4
–0.6
–0.8
–1.0
0 512 1024 2048 3072 4096
1536 2560 3584
CODE (Decimal)
TPC 2. AD5582 Differential Nonlinearity Error
1.0
0.8
0.6
0.4
0.2
0
DNL (LSB)
–0.2
–0.4
–0.6
–0.8
–1.0
01282565127681024
384 640 896
CODE (Decimal)
TPC 4. AD5583 Differential Nonlinearity Error
6
4
2
ZSE
0
DNL
ERROR (LSB)
–2
–4
–6
0510 20 30
INL
GE
15 25
VDD – V
REFH
(mV)
V
= 5V
DD
= 0V
V
SS
= 0V
V
REFL
NO LOAD
TPC 5. AD5582 INL, DNL, ZSE, and GE at Positive Rail-to-Rail Operation
REV. A
1.0
0.8
0.6
0.4
0.2
0
INL (LSB)
–0.2
–0.4
–0.6
–0.8
–1.0
0128 256 512 768 1024
DAC-A
DAC-B
DAC-C
DAC-D
384 640 896
CODE (Decimal)
TPC 3. AD5583 Integral Nonlinearity Error
–11–
4
3
2
1
0
ERROR (LSB)
–1
–2
–3
–4
0510 20 35
DNL
GE
ZSE
INL
15 25
V
– VSS (mV)
REFL
V
= +5V
DD
= –5V
V
SS
= +4V
V
REFH
NO LOAD
30
TPC 6. AD5582 INL, DNL, GE, and ZSE at Negative Rail-to-Rail Operation
Page 12
AD5582/AD5583
1.0 V
= 5V
DD
0.8
= 5V
V
SS
= 4V
V
REFH
0.6
0.4
0.2
INL (LSB)
–0.2
–0.4
–0.6
–0.8
–1.0
= 0V
V
REFL
0
RESISTIVE LOAD RL IS BETWEEN
AND GND
V
OUT
0 512 1024 2048 4096
1536 2560
CODE (Decimal)
= 260
R
L
R
= 790
L
RL = 390
RL = NO LOAD
3072
3584
TPC 7. AD5582 INL at Various Resistive Loads
0.5 V
= 5V
DD
0.4
= 5V
V
SS
= 4V
V
REFH
0.3
0.2
0.1
DNL (LSB)
–0.1
–0.2
–0.3
–0.4
–0.5
= 0V
V
REFL
RL = NO LOAD
0
= 260
R
L
RESISTIVE LOAD RL IS BETWEEN
AND GND
V
OUT
0 512 1024 2048 4096
1536 2560
CODE (Decimal)
3072
3584
40
ZERO
30
20
10
ERROR (LSB)
–10
–20
–30
–40
SCALE ERROR
V
> V
REFL
SS
0
GAIN ERROR
100 1k 1M
RL_PU ()
ZERO SCALE ERROR
V
= V
REFL
SS
GAIN ERROR
PULL-UP RESISTIVE LOAD R IS BETWEEN V
10k
100k
DD
AND V
OUT
L
TPC 10. AD5582 Gain and Zero-Scale Error vs. Pull-Up Resistive Loads
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
LINEARITY ERROR (LSB)
INL
1.0
0.5
0
02 12
DNL
V
REFH
– V
6
(V)
REFL
10
84
TPC 8. AD5582 DNL at Various Resistive Loads
0
–2
–4
–6
–8
–10
GAIN ERROR (LSB)
–12
–14
–16
100 1k 100k
= +5V OR +15V
V
DD
= –5V OR 0V
V
SS
= +4V
V
REFH
= 0V
V
REFL
V
= +15V
DD
= 0V
V
SS
= +10V
V
REFH
= 0V
V
REFL
RESISTIVE LOAD RL IS BETWEEN
AND GND
V
OUT
()
R
L
10k
TPC 9. AD5582 Gain Error vs. Resistive Load
TPC 11. AD5582 Linearity Errors vs. Differential Reference Ranges
2.00
1.95
1.90
1.85
1.80
1.75
(mA)
DD
I
1.70
V V V
DD
SS
REFH
= +5V = –5V
= +4V
V V V
SS
REFH
REFL
= 0V
= +4V = 0V
1.65
1.60
1.55
1.50 02 16
6
1410
1284
VDD (V)
TPC 12. AD5582 Supply Current vs. Supply Voltage
REV. A–12–
Page 13
AD5582/AD5583
3.5
3.0
2.5
= +15V
V
= +5V
V
DD
= –5V
V
SS
= –5V
V
REFL
= +5V
V
DD
= 0V
V
SS
= 0V
V
REFL
0
–10 –5 20
V
REFH
5
(V)
(mA)
DD
I
2.0
1.5
1.0
0.5
DD
= 0V
V
SS
= 0V
V
REFL
100
15
TPC 13. AD5582 Supply Current vs. Reference Voltage
4.0
3.5
3.0
2.5
2.0
(mA)
DD
I
1.5
1.0
0.5
VDD = 15V
= 0V
V
SS
= 10V
V
REFH
= 0V
V
REFL
V V V V
DD
SS
REFH
REFL
= 5V
= 5V
= 4V = 0V
300
V
= 5V
DD
= 0V
V
SS
250
200
150
100
REFERENCE CURRENT (A)
50
0
= 4V
V
REFH
= 0V
V
REFL
0 512 4096
1536
CODE (Decimal)
2560
30721024 2048
TPC 16. AD5582 Reference Current
140
120
100
80
(k)
REF
60
R
40
20
3584
0
–60 –40 140
20
TEMPERATURE (C)
60–20
100 12004080
TPC 14. AD5582 Supply Current vs. Temperature
20
VDD = 5V OR 15V
(mA)
DD
I
18
16
14
12
10
= 3V
DV
DD
= 0V
V
SS
V
= 5V OR 15V
DD
= 5V
DV
DD
= 0V
V
SS
8
6
4
2
0
01 5
2
3
VIH (V)
4
TPC 15. AD5582 Supply Current vs. Logic Input Voltage
0
0 512 4096
1536
CODE (Decimal)
2560 30721024 2048
3584
TPC 17. AD5582 Referenced Input Resistance
6
VDD = 5V 0.5V
= 0V
V
SS
= 4V
V
5
REF
DATA = 800
4
3
2
SUPPLY CURRENT (mA)
1
0
10k 100k 100M
H
CLOCK FREQUENCY (Hz)
1M
10M
TPC 18. AD5582 Supply Current vs. Clock Frequency
REV. A
–13–
Page 14
AD5582/AD5583
–100
–90
–80
–70
–60
–50
PSRR (dB)
–40
–30
–20
–10
0
110 1M
100
1k
FREQUENCY (Hz)
VDD = 5V 0.5V
= 0V
V
SS
= 4V
V
REF
DATA = 800
10k 100k
H
TPC 19. AD5582 PSRR vs. Frequency
V
200mV/DIV
OUT
DATA 5V/DIV
100
90
VDD = 5V V
= 0V
SS
V
= 2.5V
REFH
10
0
V
0.5V/DIV5s/DIV
OUT
GRAPH <1> : CL = 0 GRAPH <2> w/RINGING : C
= 10nF
L
TPC 22. Large Signal Settling When Loaded (See Test Circuit 1)
V
5s/DIV
200mV/DIV
REF
TPC 20. Small Signal Response Operating at Near Rail, C
100
90
10
0
= 2 nF (See Test Circuit 1)
L
VDD = 15V
V
SS
V
REFH
V
2V/DIV
OUT
5s/DIV
DATA 5V/DIV
= 0V
= 10V
TPC 21. Large Signal Settling
V
0.1V/DIV2s/DIV
OUT
TPC 23. Midscale Transition Glitch
3980
1260
398
126
39.90
12.60
4.00
AMPLITUDE (V)
1.26
0.40
0.13
0.04 1Hz 2kHz
33nV/
TPC 24. AD5582 Output Noise Density
RBW = 30Hz
Hz @ 1kHz
23004
7285
2300
730
230
73
23
7.3
NOISE DENSITY (nV/ Hz)
REV. A–14–
Page 15
AD5582/AD5583
+
V
O
R
2R
2R
SW0
b0
2R
SW1
b1
2R
SW2
b2
2R
SWn–3
bn–2
2R
SWn–1
bn–1
2R
R R R
V
REFL
+
V
REFH
+
FFF
H
800
H
400
H
200
H
100
H
080
H
040
H
020
H
010
H
008
H
004
H
002
H
001
H
000
H
100 1k 10k 100k 1M 10M
TPC 25. AD5582 Multiplying Bandwidth

Test Circuit

FREQUENCY (Hz)
V
DAC
OUT
0
–24
–48
–72
ATTENUATION (dB)
–96
0.8 VDD = +5V
= –5V
V
SS
0.6 V
= +4V
REFH
= –4V
V
REFL
0.4
200
ZSE DRIFT
300
+3
+3
–3
400 500
0.2
0
ERROR (LSB)
–0.2
–0.4
–0.6
–0.8
0 100 600
HOURS OF OPERATION AT 150C
–3
GE DRIFT
TPC 26. AD5582 Long-Term Drift
V
DD
1k
C
1k
L
Test Circuit 1

THEORY OF OPERATION

The AD5582/AD5583 are quad, voltage output, 12-/10-bit parallel input DACs in compact TSSOP-48 packages.
Each DAC is a voltage switching, high impedance (R = 20 kW), R-2R ladder configuration with segmentation to optimize die area and precision. Figure 3 shows a simplified R-2R structure without the segmentation. The 2R resistances are switched between V
REFH
and V
, and the output is obtained from
REFL
These DACs feature double buffers, which allow both synchro­nous and asynchronous channels update with additional data readback capability. These parts can be reset to zero scale or mid­scale controlled by the RS and MSB pins. When RS is activated, the MSB of 0 resets the DACs to zero scale and the MSB of 1 resets the DACs to midscale. The ability to operate from wide supply voltages, +5 V to +15 V or ± 5 V, with multiplying bipolar references is another key feature of these DACs.
the rightmost ladder node. As the code is sequenced through all possible states, the voltage of this node changes in steps of
– V
(2/3 V
REFH
)/(2N – 1) starting from the lowest V
REFL
going to the highest V
– DUTLSB. Buffering it with an
REFH
REFL
and
amplifier with a gain of 1.5 brings the output to:
=
D
VV V
()
N
21
REFH REFL REFL
+
()
(1)
V
OUT
where D is the decimal equivalent of the data bits and N is the numbers of bits.
If –V
is equal to V
REFL
REFH
as V
REF
, V
is simplified to:
OUT
Figure 3. Simplified R-2R Architecture (Segmentation Not Shown)
2
D
2
D
ˆ
1
V
˜ ¯
ˆ
1
V
˜ ¯
(For AD5582) (2)
(For AD5583) (3)

Power Supplies

There are three separate power supplies needed for the opera­tion of the DACs. For dual supply, V to –2.7 V and V supply, V
SS
can be set from +2.7 V to +6.5 V. For single
DD
should be set at 0 V while VDD is set from 3 V to
16.5 V. However, setting the single supply of V
can be set from –6.5 V
SS
below 4.5 V
DD
can impact the overall accuracy of the device.
V
V
The advantage of this scheme is that it allows the DAC to inter-
Ê
=
Á
OUT REF
Ë
4095
Ê
=
Á
OUT REF
Ë
1023
polate between two voltages for differential references or single-ended reference.
REV. A
–15–
Page 16
AD5582/AD5583
Since these DACs can be operated at high voltages, the digital signal levels are therefore controlled separately by the provision of DV
. DVDD can be set as low as 2.7 V but no greater than
DD
6.5 V. This allows the DAC to be operable from low level digital signals generated from a wide range of microcontrollers, FPGA, and signal processors.

Reference Input

All four channels of DACs allow independent and differential reference voltages. The flexibility of independent references allows users to apply a unique reference voltage to each channel. Similarly, bipolar references can be applied across the differential references. To maintain optimum accuracy, the difference between V
REFH
and V
should be greater than 1 V. See TPC 11.
REFL
The voltages applied to these reference inputs set the output voltage limits of all four channels of the DACs, and V always be higher than V
+ 0.5 V to VDD, while V
V
REFL
to V
V
SS
– 0.5 V. In addition, a symmetrical negative reference
REFH
REFL
. V
can be set at any voltage from
REFH
can be set at any voltage from
REFL
REFH
must
can be generated easily by an external op amp in an inverting mode with a pair of built-in precision resistors, R1 and R2. These resistors are matched within ± 0.025% for the AD5582 and 0.1% for the AD5583, which is equivalent to less than 1 LSB mis­match. Figure 4 shows a simple configuration.
Common reference or references can be applied to all four chan­nels, but each reference pin should be decoupled with a 0.1 mF ceramic capacitor mounted close to the pin.
V
REFHA
V
REFHB
V
REFHC
V
REFHD
V
REFLA
V
REFLB
V
REFLC
V
REFLD
AD5582
DAC A
DAC B
DAC C
DAC D
2.5V
2.5V
2.5V
2.5V
RCT
ADR421
REF
R1
R2
+
+2.5V
–2.5V
Figure 4. Using On-Board Matching Resistors to Generate a Negative Voltage REF

Digital I/O

Digital I/O consists of a 12-/10-bit bidirectional data bus, two register select inputs, A0 and A1, an R/W input, a Reset (RS), a Chip Select (CS), and a Load DAC (LDAC) input. Control of the DACs and the bus direction is determined by these inputs as shown in Table I. All digital pins are TTL/CMOS compat­ible and all internal registers are level triggered.
The register selects inputs A0 and A1. Decoding of the registers is enabled by the CS input. When CS is high, no decoding is taking place and neither the writing nor the reading of the input registers is enabled. The loading of the second bank of registers is controlled by the asynchronous LDAC input. By taking LDAC low while CS is enabled, the individual channel is updated as single buffer mode, Figure 2a. If CS is enabled sequentially to load data into all input registers, then a subsequent LDAC pulse will allow all channels to be updated simultaneously as double buffer mode, Figure 2b.
R/W controls the writing to and reading from the input register.

Reset

The RS function can be used either at power-up or at any time during operation. The RS function has priority over any other digital inputs. This pin is active low and sets the DAC output registers to either zero scale or midscale, determined by the state of the MSB. The reset to midscale is useful when the DAC is configured for bipolar references and the output will be reset to 0 V.

Output Amplifiers

Unlike many voltage output DACs, the AD5582/AD5583 feature buffered voltage outputs with high output current driving capa­bility. Each output is capable of both sourcing and sinking ±20 mA, eliminating the need for external buffers when driving any capaci­tive loads without oscillation. These amplifiers also have short circuit protection.

Glitch

The worst-case glitch of the AD5582 occurs at the transitions between midscale (1000 0000 0000 (0111 1111 1111
), or vice versa. The glitch energy is mea-
B
) to midscale minus 1
B
sured as 100 mV  1 ms or equivalent to 100 nV-s. Such glitch occurs in a shorter duration than the settling time and therefore most applications will be immune to such an effect without a deglitcher.

Layout and Power Supply Bypassing

It is a good practice to employ compact, minimum lead length PCB layout design. The leads to the input should be as short as possible to minimize IR drop and stray inductance.
It is also essential to bypass the power supplies with quality capaci­tors for optimum stability. Supply leads to the device should be bypassed with 0.01 mF to 0.1 mF disc or chip ceramics capacitors. Low ESR 1 mF to 10 mF tantalum or electrolytic capacitors should also be applied at the supplies to minimize transient disturbance. The AD5582/AD5583 optimize internal layout design to reduce die area so that all analog supply pins are required to be con­nected externally. See Figure 5.
AD5582/
AD5583
V
DD
V
SS
DV
DD
10F
10F
+
C2
C1
0.1F
+
C4
C3
0.1F
C5
0.1F
V
DD1
V
DD2
V
DD3
AGND1
AGND2
V
SS1
V
SS2
V
SS3
DGND
Figure 5. Power Supply Configurations
APPLICATIONS Programmable Current Source
AD5582/AD5583 high current capability allow them to be used directly in programmable current source applications, such as 4 m to 20 mA current transmitter and other general purpose applications. For higher compliance voltage that is higher than 15 V, Figure 6 shows a versatile V-I conversion circuit using an improved Howland Current Pump. In addition to the precision current conversion it provides, this circuit enables a bidirec­tional current flow and high voltage compliance. The voltage
REV. A–16–
Page 17
AD5582/AD5583
Table I. AD5582/AD5583 Logic Table
INPUT DAC OPERATION SELECTED
A1 A0 R/WCS LDAC RS REGISTER REGISTER MODE DAC
000001Write Transparent Transparent A 010001Write Transparent Transparent B 100001Write Transparent Transparent C 110001Write Transparent Transparent D 000011Write Hold Write Input A 010011Write Hold Write Input B 100011Write Hold Write Input C 110011Write Hold Write Input D 001011Read Hold Readback to D0 to DN A 011011Read Hold Readback to D0 to DN B 101011Read Hold Readback to D0 to DN C 111011Read Hold Readback to D0 to DN D XXX101Hold Update All Registers Update All Registers All XXX 1 1 1 Hold Hold Hold All XXXXX0All registers reset to midscale or zero scale. All XXX 1 X All registers latched to midscale or zero scale. All
MSB = 0 resets to zero scale, MSB = 1 resets to midscale. X: Don’t Care. Input and output registers are transparent when asserted.
compliance is mainly limited by the op amp supply voltages. This circuit can be used in 4 to 20 mA current transmitters with up to 500 W of load.
R2'
15k
C1
10pF
+15V
U4
AD8510
+
–15V
R1
R2
15k
LOAD
R3' 50
R3 50
VL
IL
+5V
U1
ADR421
+5V
OP1177
+
–5V
R1'
150k
+2.5V
–2.5V
+5V
V
V
V
REFH
R1 RCT R2 V
DD
U2
AD5582
V
SS
REFL
–5V
DECOUPLING CAPS ARE OMITTED FOR CLARITY
DAC
150k
Figure 6. Programmable Current Source with Bidirectional Current Control and High Voltage Compliance Capabilities
Figure 6 shows that if the resistor network is matched, the load current is:
This circuit is versatile, but users must pay attention to the compensation. Without C1, it can be shown that the output impedance becomes:
131 2
'
Z
=
O
RR R R
+
12 3 1 2 3
''–'
RR R R R R
()
+
()
+
()
(5)
If the resistors are perfectly matched, ZO is infinite, which is highly desirable. On the other hand, if they are not matched, Z
O
can either be positive or negative. The latter, because of the pole in the right S-plane, can cause oscillation. As a result, C1 in the range of a few pF is needed to prevent the oscillation. For critical applications, C1 should be found empirically without overcompensating.

Boosted Programmable Voltage Source

For users who need higher than 20 mA current driving capabil­ity, they can add an external op amp and power transistors. The capacitive loading capability will change, but it can still drive 100 nF capacitive load without oscillation in this circuit. Figure 7 shows a programmable power supply with 200 mA capability.
FDV30IN
LOAD
V
O
V
+5V
DD
U1
REF198
1F
C1
+4.096V
V
REFH
AD5582
V
REFL
V
DD
U2
V
SS
+15V
+
U3
OP1177
N1
RRR
+
231
()
I
=
L DAC
/
R
V
3
(4)
R3 in theory can be made small to achieve the current needed within the U4 output current driving capability. In this circuit, the AD8510 can deliver ± 20 mA in both directions and the voltage compliance approaches ± 15 V.
REV. A
–17–
DECOUPLING CAPS ARE OMITTED FOR CLARITY
Figure 7. Boosted Programmable Voltage Source
Page 18
AD5582/AD5583
V
DD
V
DD
U1
V+
U5
AD603
V–
FDBK
COMM
OUT
DV
DD
50k
50k
10k
ADR510
G+
V
DD
R3
R4
V
DD
R2
+IN
U3
–IN
V
100
+
U4
AD8565
R1
10k
+IN
U2
ADR510
–IN
DECOUPLING CAPS ARE OMITTED FOR CLARITY
C1
IN
R1
2.0V
VINP
0.1F G–
VOA VOB VDD1-TO-3 VOC VOD
V
REFHA
V
REFHB
V
REFHC
V
REFHD
AD5582
V
REFLA
1.0V
V
REFLB
V
REFLC
V
REFLD
VSS1-TO-3
Figure 8. Programmable PGA
In this circuit, the inverting input of the op amp forces the VO to be equal to the DAC output. The load current is then delivered by the supply via the N-Ch FET N1. U3 needs to be a rail-to-rail input type. With a V
of 5 V, this circuit can source a maximum
DD
of 200 mA at 4.096 V full scale, 100 mA at midscale, and 50 mA near zero-scale outputs. Higher current can be achieved with N1 in a larger package mounted on a heat sink.

Programmable PGA

The AD603 is a low noise, voltage controlled amplifier for use in RF and IF AGC (automatic gain control) systems. It provides accurate, pin selectable gains of –11 dB to +31 dB with a band­width of 90 MHz, or 9 dB to 51 dB with a bandwidth of 9 MHz. Any intermediate gain range may be arranged using one external resistor between Pin 5 and Pin 7. The input referred noise spectral density is only 1.3 nV/÷Hz and power consumption is 125 mW at the recommended ± 5 V supplies.
V
DD
+10V+10V
C2
0.1F
G+
VINP
G–
V+
U6
AD603
V–
FDBK
COMM
OUT
C3
0.1F
V
O
The decibel gain is linear in dB, accurately calibrated, and stable over temperature and supply. The gain is controlled at a high impedance (50 MW), low bias (200 nA) differential input; the scaling is 25 mV/dB, requiring a gain control voltage of only 1 V to span the central 40 dB of the gain range. An overrange and underrange of 1 dB is provided whatever the selected range. The gain control response time is less than 1 ms for a 40 dB change.
The differential gain control interface allows the use of either differential or single-ended positive or negative control voltages, where the common-mode range is –1.2 V to +2.0 V. The AD5582/AD5583 is ideally suited to provide the differential input range of 1 V within the common-mode range of 0 V to 2 V. To accomplish this, place V
REFH
at 2.0 V and V
at 1.0 V,
REFL
then all 4096 V levels of the AD5582 will fall within the gain control range of the AD603. Please refer to the AD603 data sheet for further information regarding gain control, layout, and general operation.
REV. A–18–
Page 19

OUTLINE DIMENSIONS

48-Lead Thin Shrink Small Outline Package [TSSOP]
(RV-48)
Dimensions shown in millimeters
12.60
12.50
12.40
AD5582/AD5583
0.15
0.05
PIN 1
1.20 MAX
SEATING
PLANE
25
6.20
6.10
6.00
8.10 BSC
241
0.75
0.60
0.45
0.20
0.09
8 0
48
0.5
BSC
0.27
0.17
COMPLIANT TO JEDEC STANDARDS MO-153ED
REV. A
–19–
Page 20
AD5582/AD5583

Revision History

Location Page
8/03—Data Sheet changed from REV. 0 to REV. A.
Change to Figure 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Changes to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Changes to TIMING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Changes to PIN FUNCTION DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Changes to Figures 2a, 2b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
C0304008/03(A)
20
REV. A
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