FEATURES
16-Bit Resolution AD5543
14-Bit Resolution AD5553
1 LSB DNL
2 LSB INL for AD5543
1 LSB INL for AD5553
Low Noise 12 nV/√Hz
Low Power, I
0.5 s Settling Time
4Q Multiplying Reference-Input
2 mA Full-Scale Current 20%, with V
Built-in RFB Facilitates Voltage Conversion
3-Wire Interface
Ultracompact MSOP-8 and SOIC-8 Packages
APPLICATIONS
Automatic Test Equipment
Instrumentation
Digitally Controlled Calibration
Industrial Control PLCs
GENERAL DESCRIPTION
The AD5543/AD5553 are precision 16-/14-bit, low power,
current output, small form factor digital-to-analog converters.
They are designed to operate from a single 5 V supply with a
±10 V multiplying reference.
The applied external reference V
output current. An internal feedback resistor (R
R-2R and temperature tracking for voltage conversion when
combined with an external op amp.
A serial-data interface offers high speed, 3-wire microcontroller
compatible inputs using serial data in (SDI), clock (CLK), and
chip select (CS).
The AD5543/AD5553 are packaged in ultracompact
(3 mm 4.7 mm) MSOP-8 and SOIC-8 packages.
= 10 A
DD
= 10 V
REF
determines the full-scale
REF
) facilitates the
FB
Serial Input, 16-/14-Bit DAC
AD5543/AD5553
FUNCTIONAL BLOCK DIAGRAM
AD5543/AD5553
V
DD
16384
20480
CONVERTER
D/A
16 OR 14
DAC
REGISTER
16 OR 14
16-/14-BIT SHIFT
REGISTER
24575
28672
32768
36864
CODE
V
REF
CS
CLK
SDI
1.0
0.8
0.6
0.4
0.2
0
INL – LSB
–0.2
–0.4
–0.6
–0.8
–1.0
0
CONTROL
LOGIC
4096
8152
12288
Figure 1. Integral Nonlinearity Error
40960
45056
49152
53248
R
I
OUT
GND
57344
FB
61440
65536
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective companies.
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
PIN CONFIGURATION
MSOP and SOIC-8
CLK
V
SDI
R
REF
1
2
3
FB
4
AD5543/
AD5553
TOP VIEW
(Not to Scale)
8
CS
V
7
DD
6
GND
I
5
OUT
PIN FUNCTION DESCRIPTIONS
Pin
No. Mnemonic Function
1CLKClock Input. Positive-edge triggered, clocks
data into shift register.
2SDISerial Register Input. Data loads directly
into the shift register MSB first. Extra leading
bits are ignored.
3R
FB
Internal Matching Feedback Resistor. Connects to external op amp for voltage output.
DAC Current Output. Connects to inverting
terminal of external precision I-to-V op amp
for voltage output.
6GNDAnalog and Digital Ground
7V
DD
Positive Power Supply Input. Specified range
of operation 5 V ± 10%.
8CSChip Select. Active low digital input. Transfers
shift-register data to DAC register on rising
edge. See Truth Table for operation.
ORDERING GUIDE*
INLRESTemperaturePackagePackage
Model(LSB)(LSB)RangeDescriptionOptionMarking
AD5543BR± 216–40°C to +85°C SOIC-8RN-8AD5543
AD5543BRM±216–40°C to +85°CMSOP-8RM-8DXB
AD5553CRM± 114–40°C to +85°CMSOP-8RM-8DUC
*The AD5543 contains 1040 transistors. The die size measures 55 mil 73 mil, 4,015 sq. mil.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD5543/AD5553 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
REV. A
–3–
Page 4
AD5543/AD5553–Typical Performance Characteristics
1.0
0.8
0.6
0.4
0.2
0
INL – LSB
–0.2
–0.4
–0.6
–0.8
–1.0
0655368192
16384 24576 32768 40960 49152 57344
CODE – Decimal
TPC 1. AD5543 Integral Nonlinearity Error
1.0
0.8
0.6
0.4
0.2
0
DNL – LSB
–0.2
–0.4
–0.6
–0.8
–1.0
0655368192
16384 24576 32768 40960 49152 57344
CODE – Decimal
1.0
0.8
0.6
0.4
0.2
0
DNL – LSB
–0.2
–0.4
–0.6
–0.8
–1.0
02048 4096 6144 8192 10240 12288 14336 16384
CODE – Decimal
TPC 4. AD5553 Differential Nonlinearity Error
1.5
V
= 2.5V
REF
TA = 25C
1.0
0.5
INL
0
–0.5
LINEARITY ERROR – LSB
–1.0
–1.5
2104
SUPPLY VOLTAGE VDD – V
DNL
GE
68
TPC 2. AD5543 Differential Nonlinearity Error
1.0
0.8
0.6
0.4
0.2
0
INL – LSB
–0.2
–0.4
–0.6
–0.8
–1.0
014336
CODE – Decimal
12288102408192614440962048
16384
TPC 3. AD5553 Integral Nonlinearity Error
5
VDD = 5V
= 25C
T
A
4
– mA
DD
3
2
SUPPLY CURRENT I
1
0
00.5
TPC 5. Linearity Errors vs. V
1.02.01.52.5 3.0 3.54.04.5 5.0
LOGIC INPUT VOLTAGE V
DD
– V
IH
TPC 6. Supply Current vs. Logic Input Voltage
REV. A–4–
Page 5
3.0
2.5
AD5543/AD5553
2.0
1.5
1.0
SUPPLY CURRENT – mA
0.5
0
10k100M100k
CLOCK FREQUENCY – Hz
1M10M
FFFF
0000
5555
H
8000
H
H
H
TPC 7. AD5543 Supply Current vs. Clock Frequency
90
80
70
60
50
40
PSRR – dB
30
20
10
0
1k10010
FREQUENCY – Hz
VDD = 5V 10%
V
= 10V
REF
10k100k
1M
TPC 8. Power Supply Rejection vs. Frequency
TPC 10. Settling Time
CS (5V/DIV)
= 5V
V
DD
= 10V
V
REF
CODES 8000
00.51.01.52.0 2.53.0 3.54.0 4.5 5.0
TIME – s
↔ 7FFF
H
H
V
(50mV/DIV)
OUT
TPC 11. Midscale Transition and Digital Feedthrough
XH No EffectLatched
↑+LShift Register Data Advanced One BitLatched
XH No EffectLatched
X↑+Shift Register Data Transferred to DAC RegisterNew Data Loaded from Serial Register
↑+ positive logic transition; X Don't Care
Table II. AD5543 Serial Input Register Data Format; Data is Loaded in the MSB-First Format
MSBLSB
Bit PositionB15B14B13B12B11B10B9B8B7B6B5B4B3B2B1B0
Data-WordD15D14D13D12D11D10D9D8D7D6D5D4D3D2D1D0
Table III. AD5553 Serial Input Register Data Format; Data is Loaded in the MSB-First Format
MSBLSB
Bit PositionB13B12B11B10B9B8B7B6B5B4B3B2B1B0
Data-Word*D13D12D11D10D9D8D7D6D5D4D3D2D1D0
*A full 16-bit data-word can be loaded into the AD5553 serial input register, but only the last 14 bits entered will be transferred to the DAC register when CS returns
to logic high.
REV. A–6–
Page 7
AD5543/AD5553
V
DD
DIGITAL
INPUTS
5k
DGND
CIRCUIT OPERATION
The AD5543/AD5553 contains a 16-/14-bit, current output,
digital-to-analog converter, a serial input register, and a DAC
register. Both converters use a 3-wire serial data interface.
D/A Converter Section
The DAC architecture uses a current steering R-2R ladder
design. Figure 4 shows the typical equivalent DAC structure.
The DAC contains a matching feedback resistor for use with an
external op amp, (see Figure 5). With R
FB
and I
OUT
terminals
connected to the op amp output and inverting node respectively, a precision voltage output can be achieved as:
VVD AD
=×–/,()65 5365543
OUTREF
VVD AD
=×–/,()16 3845553
OUTREF
Note that the output voltage polarity is opposite to the V
(1)
(2)
REF
polarity for dc reference voltages.
These DACs are designed to operate with either negative or
positive reference voltages. The V
power pin is only used by
DD
the internal logic to drive the DAC switches’ ON and OFF states.
V
V
REF
RRR
2R2R2RR5k
DD
R
FB
S1S2
I
OUT
GND
various resistances and capacitances. External amplifier choice
should take into account the variation in impedance generated
by the AD5543 on the amplifier’s inverting input node. The
feedback resistance, in parallel with the DAC ladder resistance,
dominates output voltage noise. To maintain good analog performance, power supply bypassing of 0.01 µF to 0.1 µF ceramic or
chip capacitors in parallel with a 1 µF tantalum capacitor is recom-
mended. Due to degradation of power supply rejection ratio in
frequency, users must avoid using switching power supplies.
SERIAL DATA INTERFACE
The AD5543/AD5553 uses a 3-wire (CS, SDI, CLK) serial
data interface. New serial data is clocked into the serial input
register in a 16-bit data-word format for AD5543. The MSB is
loaded first. Table II defines the 16 data-word bits. Data is
placed on the SDI pin and clocked into the register on the positive
edge of CLK, subject to the data setup and hold time
clock
requirements specified in the interface timing specifications
.
Only the last 16 bits clocked into the serial register are interrogated when the CS pin is strobed to transfer the serial register
data to the DAC register. Since most microcontrollers output
serial data in 8-bit bytes, two data bytes can be written to the
AD5543/AD5553. After loading the serial register, the rising edge
of CS transfers the serial register data to the DAC register;
during this strobe, the CLK should not be toggled. For the
AD5553, with 16-bit clock cycles, the two LSBs are ignored.
ESD Protection Circuits
All logic-input pins contain back-biased ESD protection Zener
diodes connected to ground (GND) and V
as shown in Figure 6.
DD
DIGITAL INTERFACE CONNECTIONS OMITTED FOR CLARITY;
SWITCHES S1 AND S2 ARE CLOSED, V
MUST BE POWERED
DD
Figure 4. Equivalent R-2R DAC Circuit
Note that a matching switch is used in series with the internal 5 kΩ
feedback resistor. If users attempt to measure RFB, power must be
applied to V
to achieve continuity.
DD
V
U1
V
V
REF
V
REF
GND
AD5543/AD5553
DD
R
DD
FB
I
OUT
U2
AD8628
V+
V–
–5V
V
O
Figure 5. Voltage Output Configuration
These DACs are also designed to accommodate ac reference
input signals. The AD5543 accommodates input reference
voltages in the range of –12 V to +12 V. The reference voltage
inputs exhibit a constant nominal input resistance value of 5 kΩ,±30%. The DAC output (I
) is code-dependent, producing
OUT
Figure 6. Equivalent ESD Protection Circuits
PCB Layout and Power Supply Bypassing
It is a good practice to employ compact, minimum lead length
PCB layout design. The leads to the input should be as short as
possible to minimize IR drop and stray inductance.
It is also essential to bypass the power supplies with quality
capacitors for optimum stability. Supply leads to the device should
be bypassed with 0.01 µF to 0.1 µF disc or chip ceramic capaci-
tors. Low-ESR 1 µF to 10 µF tantalum or electrolytic capacitors
should also be applied at the supplies to minimize transient
disturbance and filter out low frequency ripple
The PCB metal traces between V
and RFB should also be
REF
matched to minimize gain error.
REV. A
–7–
Page 8
AD5543/AD5553
APPLICATIONS
Stability
V
DD
U1
V
REF
V
REF
V
GND
R
FB
DD
AD5543/AD5553
I
OUT
C1
V
AD8628
U2
O
Figure 7. Optional Compensation Capacitor for Gain
Peaking Prevention
In the I-to-V configuration, the I
of the DAC and the inverting
OUT
node of the op amp must be connected as close as possible, and
proper PCB layout technique must be employed. Since every code
change corresponds to a step function, gain peaking may occur
if the op amp has limited GBP and there is excessive parasitic
capacitance at the inverting node.
An optional compensation capacitor C1 can be added for stability
as shown in Figure 7. C1 should be found empirically but 20 pF
is generally adequate for the compensation.
Positive Voltage Output
To achieve the positive voltage output, an applied negative
reference to the input of the DAC is preferred over the output
inversion through an inverting amplifier because of the resistor’s
tolerance errors. To generate a negative reference, the reference
can be level-shifted by an op amp such that the V
and GND
OUT
pins of the reference become the virtual ground and –2.5 V
respectively, (see Figure 8).
+5V
V
IN
U1
V
R
DD
V
FB
REF
GND
U3
AD5543/AD5553
I
OUT
C1
V
U2
1/2AD8628
0 < V
< +2.5
O
O
U4
+5V
V+
1/2AD8620
V–
–5V
ADR03
V
OUT
GND
–2.5V
Figure 8. Positive Voltage Output Configuration
Bipolar Output
The AD5543/AD5553 is inherently a 2-quadrant multiplying
D/A converter. That is, it can easily be set up for unipolar output
operation. The full-scale output polarity is the inverse of the
reference input voltage.
In some applications, it may be necessary to generate the full
4-quadrant multiplying capability or a bipolar output swing. This
is easily accomplished by using an additional external amplifier
U4 configured as a summing amplifier (see Figure 9). In this
circuit, the second amplifier U4 provides a gain of 2 that increases
the output span magnitude to 5 V. Biasing the external amplifier
with a 2.5 V offset from the reference voltage results in a full
4-quadrant multiplying circuit. The transfer equation of this circuit
shows that both negative and positive output voltages are created
as the input data (D) is incremented from code zero (V
–2.5 V) to midscale (V
VD VAD
=×(/ , –)()32 768 15543
OUTREF
VD VAD
=×(/, –)()16 384 15553
OUTREF
= 0 V) to full-scale (V
OUT
OUT
=
OUT
= +2.5 V).
(3)
(4)
For AD5543, the resistance tolerance becomes the dominant
error of which users should be aware.
Figure 10 shows a versatile V-I conversion circuit using an
improved Howland Current Pump. In addition to the precision
current conversion it provides, this circuit enables a bidirectional current flow and high voltage compliance. This circuit
can be used in 4 to 20 mA current transmitters with up to 500 Ω
of load. In Figure 10, it can be shown that if the resistor network is
matched, the load current is:
RRR
+
231
()
I
=
LREF
/
VD
3
××
R
(5)
R3 in theory can be made small to achieve the current needed
within the U3 output current driving capability. This circuit is
versatile such that AD8510 can deliver ±20 mA in both directions and the voltage compliance approaches 15 V, which is
limited mainly by the supply voltages of U3. However, users
must pay attention to the compensation. Without C1, it can be
shown that the output impedance becomes:
131 2
'
Z
=
O
RR R R
12 31 2 3
''–'
RR RR R R
+
()
+
()
+
()
(6)
If the resistors are perfectly matched, ZO is infinite, which is
desirable, and behaves as an ideal current source. On the other
hand, if they are not matched, Z
can be either positive or nega-
O
tive. Negative can cause oscillation. As a result, C1 is needed to
prevent the oscillation. For critical applications, C1 could be
found empirically, but typically falls in the range of few pF.
REV. A
Figure 10. Programmable Current Source with Bidirectional Current Control and High Voltage Compliance
Capabilities
–9–
Page 10
AD5543/AD5553
OUTLINE DIMENSIONS
8-Lead microSOIC Package [MSOP]
(RM-8)
Dimensions shown in millimeters
3.00
BSC
85
3.00
BSC
1
PIN 1
0.65 BSC
0.15
0.00
0.38
0.22
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187AA
4
SEATING
PLANE
4.90
BSC
1.10 MAX
0.23
0.08
8
0
0.80
0.40
8-Lead Standard Small Outline Package [SOIC]
Narrow Body
(RN-8)
Dimensions shown in millimeters and (inches)
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
85
6.20 (0.2440)
5.80 (0.2284)
41
1.27 (0.0500)
0.25 (0.0098)
0.10 (0.0040)
COPLANARITY
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN