Datasheet AD5405 Datasheet (Analog Devices)

Dual 12-Bit, High Bandwidth, Multiplying DAC with

4-Quadrant Resistors and Parallel Interface

FEATURES

On chip 4-quadrant resistors allow flexible output ranges 10 MHz multiplying bandwidth Fast parallel interface write cycle: 58 MSPS

2.5 V to 5.5 V supply operation ±10 V reference input Extended temperature range: −40°C to 125°C 40-lead LFCSP package Guaranteed monotonic 4-quadrant multiplication Power-on reset Readback function .5 µA typical current consumption

APPLICATIONS

Portable battery-powered applications Waveform generators Analog processing Instrumentation applications Programmable amplifiers and attenuators Digitally-controlled calibration Programmable filters and oscillators Composite video Ultrasound Gain, offset, and voltage trimming

R3A R2AR2_3A

AD5405

V

DD

DATA

DB0

INPUTS

DB11

INPUT

BUFFER

AD5405

GENERAL DESCRIPTION

The AD54051 is a dual CMOS, 12-bit, cur rent output dig italto-analog converter (DAC).This device operates from a 2.5 V to

5.5 V power supply, making it suited to battery-powered and other applications.

The applied external reference input voltage (V the full-scale output current. An integrated feedback resistor

) provides temperature tracking and full-scale voltage

(R

FB

output when combined with an external I-to-V precision amplifier. This device also contains all the 4-quadrant resistors necessary for bipolar operation and other configuration modes.

This DAC utilizes data readback, allowing the user to read the contents of the DAC register via the DB pins. On power-up, the internal register and latches are filled with zeros and the DAC outputs are at zero scale.

As a result of manufacture with a CMOS submicron process, the device offers excellent 4-quadrant multiplication characteristics, with large signal multiplying bandwidths of up to 10 MHz.

The AD5405 has a 6 mm × 6 mm, 40-lead LFCSP package.

1

US Patent Number 5,689,257.

V

A

REF

R1A

R2

R3

2R

LATCH

R1 2R

12-BIT

R-2R DAC A

RFB

2R

R

I

OUT

A

FB

1A

2A

) determines

REF

DAC A/B

CS

R/W

LDAC

GND

CONTROL

LOGIC

POWER-ON

RESET

R3 2R

R3B R2BR2_3B

Figure 1. AD5405 Functional Block Diagram

Rev. 0

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Anal og Devices. Trademarks and registered trademarks are the property of their respective owners.

I

1B

LATCH

R2 2R

12-BIT

R-2R DAC B

R1

RFB

2R

V

B

R1B

REF

www.analog.com

OUT

I

OUT

RFB B

2B

04463-0-001

AD5405

TABLE OF CONTENTS

Specifications..................................................................................... 3

Timing Characteristics..................................................................... 5

Absolute Maximum Ratings............................................................ 6

ESD Caution.................................................................................. 6

Pin Configuration and Function Descriptions............................. 7

Typical Performance Characteristics ............................................. 8

Te r m in o l o g y .................................................................................... 13

General Description....................................................................... 14

DAC Section................................................................................ 14

Circuit Operation ....................................................................... 14

Single-Supply Applications........................................................ 15

Positive Output Voltage ............................................................. 15

REVISION HISTORY

7/04—Revision 0: Initial Version

Adding Gain................................................................................ 15

Used as a Divider or Programmable Gain Element............... 16

Reference Selection .................................................................... 16

Amplifier Selection .................................................................... 16

Parallel Interface ......................................................................... 17

Microprocessor Interfacing....................................................... 17

PCB Layout and Power Supply Decoupling ........................... 17

Evaluation Board for the DACs................................................ 18

Overview of AD54xx Devices....................................................... 22

Outline Dimensions....................................................................... 23

Ordering Guide .......................................................................... 23

Rev. 0 | Page 2 of 24

AD5405

REF

IH

IL

1

A = V

IL

OL

OH

OL

OH

B = 10 V, I

REF

2

2 = 0 V. All specifications T

OUT

MIN

to T

unless otherwise noted. DC performance measured

MAX,

±5 ppm FSR/°C

1

OUT

Typical resistor TC = −50 ppm/°C

1.6 2.5 % Typ = 25°C, Max = 125°C

1.7 V VDD = 2.5 V to 5.5 V

0.8 V VDD = 2.7 V to 5.5 V

1 µA

0.4 V I VDD − 1 V I

0.4 V I VDD −0.5 V I

= 200 µA

SINK

= 200 µA

SOURCE

= 200 µA

SINK

= 200 µA

SOURCE

= 5 V pk-pk, DAC loaded all 1s

REF

DAC latch alternately loaded with 0s and 1s.

Feedthrough to DAC output with

alternate loading of all 0s and all 1s

= 5 V p-p, all 1s loaded, f = 1 kHz

REF

= 5 V, sine wave generated from digital code

REF

OUT

1

LOAD

= 100 Ω, C

= 0 V

REF

CS high and

LOAD

=15 pF.

SPECIFICATIONS

VDD = 2.5 V to 5.5 V, V with OP1177, AC performance with AD9631, unless otherwise noted.

Table 1.

Parameter Min Typ Max Unit Conditions

STATIC PERFORMANCE

Resolution 12 Bits Relative Accuracy ±1 LSB Differential Nonlinearity −1/+2 LSB Guaranteed monotonic Gain Error ±25 mV Gain Error Temp Coefficient Bipolar Zero-Code Error ±25 mV Output Leakage Current ±1 nA Data = 0x0000, TA = 25°C, I ±10 nA Data = 0x0000H, I

REFERENCE INPUT2

Reference Input Range ±10 V V

A, V

REF

V

REF

Mismatch R1, RFB Resistance 16 20 24 kΩ R2, R3 Resistance 16 20 24 kΩ R2 to R3 Resistance Mismatch .06 .18 % Typ = 25°C, Max = 125°C

DIGITAL INPUTS/OUTPUT2

Input High Voltage, V Input Low Voltage, V

0.7 V VDD = 2.5 V to 2.7 V Input Leakage Current, I Input Capacitance 10 pF VDD = 4.5 V to 5.5 V

VDD = 2.5 V to 3.6 V

DYNAMIC PERFORMANCE2

Reference Multiplying BW 10 MHz V Output Voltage Settling Time 80 120 ns Measured to ±1 mV of FS. R

Digital Delay 20 40 ns Digital-to-Analog Glitch Impulse 3 nV-s 1 LSB change around major carry, V Multiplying Feedthrough Error −75 dB DAC latch loaded with all 0s. Reference = 10 kHz Output Capacitance 2 pF DAC latches loaded with all 0s 4 pF DAC latches loaded with all 1s Digital Feedthrough 5 nV-s

Total Harmonic Distortion −75 dB V

−75 dB V Output Noise Spectral Density 25 nV/√Hz @ 1 kHz

B Input Resistance 8 10 12 kΩ DAC input resistance

REF

A to V

B Input Resistance

REF

Output Low Voltage, V Output High Voltage, V

Rev. 0 | Page 3 of 24

AD5405

Parameter Min Typ Max Unit Conditions

SFDR Performance (Wideband) Clock = 10 MHz

500 kHz f 100 kHz f 50 kHz f

OUT

Clock = 25 MHz

500 kHz f 100 kHz f 50 kHz f

OUT

SFDR Performance (Narrow Band) Clock = 10 MHz

500 kHz f 100 kHz f 50k Hz f

OUT

Clock = 25 MHz

500 kHz f 100 kHz f 50k Hz f

OUT

Intermodulation Distortion

Clock = 10 MHz

f1 = 400 kHz, f2 = 500 kHz 65 dB f1 = 40 kHz, f2 = 50 kHz 72 dB

Clock = 25 MHz

f1 = 400 kHz, f2 = 500 kHz 51 dB f1 = 40 kHz, f2 = 50 kHz 65 dB

POWER REQUIREMENTS

Power Supply Range 2.5 5.5 V I

DD

Power Supply Sensitivity2 0.001 %/% ∆VDD = ±5%

1

Temperature range for Y version is −40°C to +125°C.

2

Guaranteed by design, not subject to production test.

55 dB 63 dB 65 dB

50 dB 60 dB 62 dB

73 dB 80 dB 87 dB

70 dB 75 dB 80 dB

10 µA Logic inputs = 0 V or V

DD

Rev. 0 | Page 4 of 24

AD5405

TIMING CHARACTERISTICS

VDD = 2.5 V to 5.5 V, V

Table 2.

Parameter

1, 2

Write Mode

t

1

t

2

t

3

t

4

t

5

t

6

t

7

t

8

t

9

Data Readback Mode

t

10

t

11

t

12

35 ns max t

13

10 ns max

1

See Temperature range for Y version is −40°C to +125°C. Guaranteed by design and characterization, not subject to production test. Figure 2.

2

All input signals are specified with tr = tf = 5ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. Digital output timing measured

with load circuit in . Figure 3

= 5 V, I

REF

Limit at T

0 ns min 0 ns min 10 ns min

2 = 0 V. All specifications T

OUT

MIN

, T

Unit Conditions/Comments

MAX

to T

MIN

W to CS setup time

R/

W to CS hold time

R/

unless otherwise noted.

MAX,

CS low time 10 ns min Address setup time 0 ns min Address hold time 6 ns min Data setup time 0 ns min Data hold time 5 ns min 7 ns min

W high to CS low

R/

CS min high time

0 ns typ Address setup time 0 ns typ Address hold time 5 ns typ Data access time

5 ns typ Bus relinquish time

t

R/W

t

1

t

2

8

t

2

t

9

t

10

t

7

12

t

11

DATA VALID

t

13

04463-0-002

DACA/DACB

DATA

CS

t

3

t

4

t

6

DATA VALID

t

5

Figure 2. Timing Diagram

I

OL

V

+ V

OH (MIN)

I

OH

OL (MAX)

2

04463-0-003

TO

OUTPUT

C

L

50pF

200µA

Figure 3. Load Circuit for Data Timing Specifications

Rev. 0 | Page 5 of 24

AD5405

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter Rating

VDD to GND V

A, V

REF

I

OUT

B, RFBA, RFBB to GND

REF

1, I

2 to GND

OUT

Logic Inputs and Output

1

−0.3 V to +7 V

−12 V to +12 V

−0.3 V to +7 V

−0.3V to VDD + 0.3 V

Operating Temperature Range

Automotive (Y Version)

Storage Temperature Range

−40°C to +125°C

−65°C to +150°C

Junction Temperature 150°C 40-lead LFCSP, θJA Thermal Impedance 30°C/W Lead Temperature, Soldering (10 sec.) 300°C IR Reflow, Peak Temperature (< 20 sec.) 235°C

1

Over voltages at DBx,

Current should be limited to the maximum ratings given.

LDAC, CS

, and W/R are clamped by internal diodes.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Rev. 0 | Page 6 of 24

AD5405

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

R1A R2A

R2_3A

R3A

V

REF

DGND

LDAC

DAC A/B

NC

DB11

A

2

1A

A

FB

OUT

40 R

39 I

38 I

1 2 3 4

A

5 6 7 8 9

10

PIN 1 INDICATOR

AD5405

TOP VIEW

B

1

2

B

FB

OUT

37 NC

36 NC

OUT

35 NC

34 NC

33 I

32 I

31 R

30 R1B 29 R2B 28 R2_3B 27 R3B

B

26 V

REF

25 V

DD 24 CLR 23 R/W 22 CS 21 DB0

NC = NO CONNECT

DB10 11

DB5 16

DB9 12

DB8 13

DB7 14

DB6 15

DB4 17

DB2 19

DB1 20

DB3 18

Figure 4. Pin Configuration

Table 4. Pin Function Descriptions

Pin No. Mnemonic Function

1 to 4 R1A to R3A

DAC A 4-Quadrant Resistors. Allow a number of configuration modes, including bipolar operation with minimum of external components.

5, 26 V

REF

A, V

B DAC Reference Voltage Input Terminals.

REF

6 DGND Digital Ground Pin. 7

LDAC Load DAC Input. Allows asynchronous or synchronous updates to the DAC output. The DAC is asynchronously

updated when this signal goes low. Alternatively, if this line is held permanently low, an automatic or synchronous update mode is selected whereby the DAC is updated on the rising edge of

8 DAC A/B Selects DAC A or B. Low selects DAC A, while high selects DAC B. 9, 34, 35,

NC Not internally connected.

36, 37 10 to 21 DB11 to DB0 Parallel Data Bits 11 through 0. 22

CS Chip Select Input. Active low. Used in conjunction with R/W to load parallel data to the input latch or to read

data from the DAC register. Edge sensitive; when pulled high, the DAC data is latched.

23

W Read/Write. When low, used in conjunction with CS to load parallel data. When high, used in conjunction with

R/

CS to read back contents of DAC register. 24 25 V

CLR

DD

26 to 30 R3B to R1B

Active Low Control Input. Clears DAC output and input and DAC registers.

Positive Power Supply Input. These parts can be operated from a supply of 2.5 V to 5.5 V.

DAC B 4-Quadrant Resistors. Allow a number of configuration modes, including bipolar operation with a

minimum of external components. 32 I

OUT

2B

DAC A Analog Ground. This pin typically should be tied to the analog ground of the system, but may be biased

to achieve single-supply operation. 33 I 38 I 39 I

1B DAC B Current Outputs.

OUT

1A DAC A Current Outputs.

OUT

2A

DAC A Analog Ground. This pin typically should be tied to the analog ground of the system, but may be biased

to achieve single-supply operation. 31, 40 RFBB, RFBA External Amplifier Output.

04463-0-004

CS.

Rev. 0 | Page 7 of 24

AD5405

TYPICAL PERFORMANCE CHARACTERISTICS

1.0 TA = 25°C

INL (LSB)

DNL (LSB)

INL (LSB)

0.8

0.6

0.4

0.2

0

–0.2

–0.4

–0.6

–0.8

–1.0

1.0

0.8

0.6

0.4

0.2

0

–0.2

–0.4

–0.6

–0.8

–1.0

0.6

0.5

0.4

0.3

0.2

0.1

0

–0.1

–0.2

–0.3

= 10V

V

REF

= 5V

V

DD

20001500500 10000 2500 3000 3500 4000

CODE

Figure 5. INL vs. Code (12-Bit DAC)

TA = 25°C

= 10V

V

REF

= 5V

V

DD

20001500500 10000 2500 3000 3500 4000

CODE

Figure 6. DNL vs. Code (12-Bit DAC)

MAX INL

MIN INL

65342 78910

REFERENCE VOLTAGE

Figure 7. INL vs. Reference Voltage

TA = 25°C V

= 10V

REF

= 5V

V

DD

04463-0-030

04463-0-031

04463-0-032

–0.40

TA = 25°C V

= 10V

–0.45

–0.50

–0.55

DNL (LSB)

–0.60

–0.65

–0.70

REF

V

= 5V

DD

MIN DNL

65342789

REFERENCE VOLTAGE

Figure 8. DNL vs. Reference Voltage

5

4

3

2

1

0

–1

ERROR (mV)

–2

–3

–4

–5

–60 –40 –20 0 20 40 60 80 100 120 140

VDD = 5V

= 2.5V

V

DD

V

= 10V

REF

TEMPERATURE (°C)

Figure 9. Gain Error vs. Temperature

8

7

6

5

4

3

CURRENT (mA)

2

1

0

1.00.50

VDD = 5V

VDD = 3V

VDD = 2.5V

INPUT VOLTAGE (V)

Figure 10. Supply Current vs. Logic Input Voltage

10

04463-0-034

TA = 25°C

4.54.03.53.02.52.01.5

5.0

04463-0-013

Rev. 0 | Page 8 of 24

AD5405

1.6

1.4

1.2

1.0

0.8

0.6

LEAKAGE (nA)

0.4

OUT

I

0.2

0

Figure 11. I

0.50

0.45

0.40

0.35

0.30

0.25

0.20

CURRENT (µA)

0.15

0.10

0.05

0

–60 –40 –20 0 20 40 60 80 100 120 140

OUT

ALL 0sALL 1s

4020–20 0–40 60 80 100 120

TEMPERATURE (°C)

1 Leakage Current vs. Temperature

VDD = 5V

VDD = 2.5V

TEMPERATURE (°C)

I

1 VDD 5V

OUT

I

1 VDD 3V

OUT

TA = 25°C

ALL 0s

ALL 1s

04463-0-036

04463-0-037

6

TA = 25°C

0

LOADING

–6

ZS TO FS

–12

–18

–24

–30

–36

–42

–48

GAIN (dB)

–54

–60

–66

–72 –78 –84 –90 –96

–102

1 100 1k 10k 100k 1M 10M 100M

ALL ON DB11 DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

ALL OFF

10

FREQUENCY (Hz)

AD8038 AMPLIFIER

TA = 25°C

V

DD

= ±3.5V

V

REF

C

=1.8pF

COMP

AD5405 DAC

= 5V

INPUT

Figure 14. Reference Multiplying Bandwidth vs. Frequency and Code

0.2

0

–0.2

GAIN (dB)

–0.4

TA = 25°C

= 5V

V

DD

= ±3.5V

V

REF

–0.6

–0.8

= 1.8pF

C

COMP

AD8038 AMPLIFIER AD5405 DAC

10k1k10 1001 100k 1m 10m 100m

FREQUENCY (Hz)

04463-0-014

04463-0-029

(mA)

DD

I

14

12

10

8

6

4

2

0

Figure 12. Supply Current vs. Temperature

TA = 25°C LOADING ZS TO FS

10k1k10 1001 100k 1m 10m 100m

FREQUENCY (Hz)

Figure 13. Supply Current vs. Update Rate

Figure 15. Reference Multiplying Bandwidth–All 1s Loaded

3

TA = 25°C

= 5V

V

DD

AD5405

V

= 5V

DD

V

= 3V

DD

= 2.5V

V

DD

04463-0-038

0

–3

GAIN (dB)

V

= ±2V, AD8038 CC 1.47pF

REF

–6

–9

10k 100k 1M 10M 100M

= ±2V, AD8038 CC 1pF

V

REF

= ±0.15V, AD8038 CC 1pF

V

REF

= ±0.15V, AD8038 CC 1.47pF

V

REF

= ±3.51V, AD8038 CC 1.8pF

V

REF

FREQUENCY (Hz)

04463-0-015

Figure 16. Reference Multiplying Bandwidth vs. Frequency and Compensation

Capacitor

Rev. 0 | Page 9 of 24

AD5405

0.045 7FF TO 800H

0.040

0.035

0.030

0.025

0.020

0.015

0.010

OUTPUT VOLTAGE (V)

0.005

0 –0.005 –0.010

0 20 40 60 80 100 120 140 160 180 200

–1.68

–1.69

–1.70

–1.71

–1.72

–1.73

–1.74

OUTPUT VOLTAGE (V)

–1.75

–1.76

–1.77

0 20 40 60 80 100 120 140 160 180 200

20

TA = 25°C V AMP = AD8038

0

–20

–40

–60

PSRR (dB)

–80

–100

–120

1 100 1k 10k 100k 1M 10M

TA = 25°C

= 0V

V

VDD = 5V

VDD = 3V

VDD = 5V

TIME (ns)

Figure 17. Midscale Transition, V

REF

AD8038 AMPLIFIER C

COMP

800 TO 7FFH VDD = 3V

REF

= 1.8pF

= 0 V

7FF TO 800H

VDD = 5V

VDD = 3V

VDD = 5V

800 TO 7FFH

TIME (ns)

Figure 18. Midscale Transition, V

TA = 25°C V

REF

AD8038 AMPLIFIER C

COMP

VDD = 3V

REF

= 3.5V

= 1.8pF

= 3.5 V

= 3V

DD

FULL SCALE

ZERO SCALE

10

FREQUENCY (Hz)

Figure 19. Power Supply Rejection vs. Frequency

04463-0-039

04463-0-040

04463-0-026

–60

TA = 25°C V

= 3V

DD

= 3.5V p-p

V

REF

–65

–70

–75

THD + N (dB)

–80

–85

–90

100 1k1 10 10k 100k 1M

FREQUENCY (Hz)

Figure 20. THD and Noise vs. Frequency

100

MCLK = 1MHz

80

MCLK = 200kHz

60

MCLK = 0.5MHz

SFDR (dB)

40

20

0

0 20 40 60 80 100 120 140 160 180 200

f

(kHz)

OUT

Figure 21. Wideband SFDR vs. f

TA = 25°C V

= 3.5V

REF

AD8038 AMPLIFIER AD5405

Frequenc y

OUT

90

80

70

60

50

40

SFDR (dB)

30

20

10

MCLK = 5MHz

MCLK = 10MHz

MCLK = 25MHz

TA = 25°C V

= 3.5V

REF

AD8038 AMPLIFIER

0

0 100 200 300 400 500 600 700 800 900 1000

f

(kHz)

OUT

Figure 22. Wideband SFDR vs. f

AD5405

Frequency

OUT

04463-0-041

04463-0-027

04463-0-028

Rev. 0 | Page 10 of 24

AD5405

0

–10

–20

–30

–40

–50

SFDR (dB)

–60

–70

–80

–90

0

2 4 6 8 10 12

Figure 23. Wideband SFDR, f

0

–10

–20

–30

–40

–50

SFDR (dB)

–60

–70

–80

–90

–100

0.5 1.5 3.0 3.5 4.01.0 2.0 2.5 4.5 5.0

0

Figure 24. Wideband SFDR, f

0

–10

–20

–30

–40

–50

SFDR (dB)

–60

–70

–80

–90

0.5 1.5 3.0 3.5 4.01.0 2.0 2.5 4.5 5.0

0

Figure 25. Wideband SFDR, f

FREQUENCY (MHz)

= 100 kHz, Clock = 25 MHz

OUT

FREQUENCY (MHz)

=500 kHz, Clock = 10 MHz

OUT

FREQUENCY (MHz)

= 50 kHz, Clock = 10 MHz

OUT

TA = 25°C V

= 5V

DD

AMP = AD8038 AD5405 65k CODES

TA = 25°C



= 5V

V

DD

AMP = AD8038 AD5405 65k CODES

TA = 25°C VDD = 5V AMP = AD8038 AD5405 65k CODES

04463-0-018

04463-0-019

04463-0-020

0

–10

–20

–30

–40

–50

–60

SFDR (dB)

–70

–80

–90

–100

250 750300 350 400 650 700

Figure 26. Narrow-Band Spectral Response, f

450 500 550 600

FREQUENCY (MHz)

OUT

= 500 kHz, Clock = 25 MHz

20

0

–20

–40

–60

SFDR (dB)

–80

–100

–120

50 150

60 70 80 130 140

Figure 27. Narrow-Band SFDR, f

90 100 110 120

FREQUENCY (MHz)

= 100 kHz, Clock = 25 MHz

OUT

0

–10

–20

–30

–40

–50

(dB)

–60

–70

–80

–90

–100

70 12075 80 85 115

Figure 28. Narrow-Band IMD, f

95

90 100 105 110

FREQUENCY (MHz)

= 90 kHz, 100 kHz, Clock = 10 MHz

OUT

TA = 25°C



V

= 3V

DD

AMP = AD8038 AD5405 65k CODES

TA = 25°C



V

= 3V

DD

AMP = AD8038 AD5405 65k CODES

TA = 25°C



= 3V

V

DD

AMP = AD8038 AD5405 65k CODES

04463-0-021

04463-0-022

04463-0-023

Rev. 0 | Page 11 of 24

AD5405

0

–10

–20

–30

–40

–50

(dB)

–60

–70

–80

–90

–100

0 400

50 300 350100 150 200 250

Figure 29. Wideband IMD, f

FREQUENCY (kHz)

= 90 kHz, 100 kHz, Clock = 25 MHz

OUT

TA = 25°C



= 5V

V

DD

AMP = AD8038 AD5405 65k CODES

04463-0-024

300

ZERO SCALE LOADED TO DAC

250

200

150

100

OUTPUT NOISE (nV/ Hz)

50

0

100 1k 10k 100k

MIDSCALE LOADED TO DAC

FULL SCALE LOADED TO DAC

FREQUENCY (Hz)

TA = 25°C AMP = AD8038

Figure 30. Output Noise Spectral Density

04463-0-025

Rev. 0 | Page 12 of 24

AD5405

(

)

(

)

TERMINOLOGY

Relative Accuracy

Relative accuracy or endpoint nonlinearity is a measure of the maximum deviation from a straight line passing through the endpoints of the DAC transfer function. It is measured after adjusting for zero and full scale and is normally expressed in LSBs or as a percentage of full-scale reading.

Differential Nonlinearity

Differential nonlinearity is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±1 LSB max over the operating temperature range ensures monotonicity.

Gain Error

Gain error or full-scale error is a measure of the output error between an ideal DAC and the actual device output. For this DAC, ideal maximum output is V

− 1 LSB. Gain error of the

REF

DACs is adjustable to zero with external resistance.

Output Leakage Current

Output leakage current is current that flows in the DAC ladder switches when these are turned off. For the I

1 terminal, it can

OUT

be measured by loading all 0s to the DAC and measuring the

1 current. Minimum current flows in the I

I

OUT

2 line when

OUT

the DAC is loaded with all 1s.

Output Capacitance

Capacitance from I

OUT

1 or I

2 to AGND.

OUT

Output Current Settling Time

This is the amount of time it takes for the output to settle to a specified level for a full-scale input change. For this device, it is specified with a 100 Ω resistor to ground.

Digital to Analog Glitch lmpulse

The amount of charge injected from the digital inputs to the analog output when the inputs change state. This is typically specified as the area of the glitch in either pA-secs or nV-secs depending upon whether the glitch is measured as a current or voltage signal.

Digital Feedthrough

When the device is not selected, high frequency logic activity on the device’ s digital inputs is capacitively coupled through the device to show up as noise on the I

pins and subsequently

OUT

into the following circuitry. This noise is digital feedthrough.

Multiplying Feedthrough Error

This is the error due to capacitive feedthrough from the DAC reference input to the DAC I

1 terminal, when all 0s are

OUT

loaded to the DAC.

Digital Crosstalk

This is the glitch impulse transferred to the outputs of one DAC in response to a full-scale code change (all 0s to all 1s, and vice versa) in the input register of the other DAC. It is expressed in nV-s.

Analog Crosstalk

This is the glitch impulse transferred to the output of one DAC due to a change in the output of another DAC. It is measured by loading one of the input registers with a full-scale code change (all 0s to all 1s, and vice versa), while keeping LDAC high. Then pulse LDAC low and monitor the output of the DAC whose digital code was not changed. The area of the glitch is expressed in nV-s.

Channel to Channel Isolation

This refers to the proportion of input signal from one DAC’s reference input which appears at the output of the other DAC, and is expressed in dBs.

Total Harmonic Distortion (THD)

The DAC is driven by an ac reference. The ratio of the rms sum of the harmonics of the DAC output to the fundamental value is the THD. Usually only the lower-order harmonics are included, such as the second to the fifth.

2

THD

2

3

2

log20

=

V

VVVV

+++

5

4

1

Intermodulation Distortion

The DAC is driven by two combined sine wave references of frequencies fa and fb. Distortion products are produced at sum and difference frequencies of mfa ± nfb where m, n = 0, 1, 2, 3,... Intermodulation terms are those for which m or n is not equal to zero. The second-order terms include (fa + fb) and (fa − fb) and the third-order terms are (2fa + fb), (2fa − fb), (f + 2fa + 2fb) and (fa − 2fb). IMD is defined as

IMD log20=

productsdistortiondiffandsumtheofsumrms

lfundamentatheofamplituderms

Compliance Voltage Range

The maximum range of (output) terminal voltage for which the device provides the specified characteristics.

Rev. 0 | Page 13 of 24

AD5405

GENERAL DESCRIPTION

DAC SECTION

The AD5405 is a 12-bit, dual-channel, current-output DAC consisting of a standard inverting R-2R ladder configuration. Figure 31 shows a simplified diagram for a single channel of the AD5405. The feedback resistor R of R is typically 10 kΩ (minimum 8 kΩ and maximum 12 kΩ). If I

1A and I

OUT

2A are kept at the same potential, a constant

OUT

current flows in each ladder leg, regardless of digital input code. Thus, the input resistance presented at V

V

REFA

2RS12RS22R

DAC DATA LATCHES

AND DRIVERS

Figure 31. Simplified Ladder Configuration

Access is provided to the V each DAC, making the device extremely versatile and allowing it to be configured in several different operating modes, such as for unipolar output, bipolar output, or single-supply mode.

CIRCUIT OPERATION

Unipolar Mode

Using a single op amp, this DAC can easily be configured to provide 2-quadrant multiplying operation or a unipolar output voltage swing, as shown in Figure 32.

V

DD

R1A

R1 2R

R2A

R2

R2_3A

AGND

2R

R3 2R

R3A

V

A

REF

NOTES

1. SIMILAR CONFIGURATION FOR DAC B

2. C1 PHASE COMPENSATION (1pF–2pF) MAY BE REQUIRED IF A1 IS A HIGH SPEED AMPLIFIER.

When an output amplifier is connected in unipolar mode, the output voltage is given by

OUT

where D is the fractional representation of the digital word loaded to the DAC, and n is the resolution of the DAC.

40950 toD =

AD5405

12-Bit DAC A

R

Figure 32. Unipolar Operation

n

VDV ×−= 2

REF

has a value of 2R. The value

FB

is always constant.

REF

RRR

2R

S3

R

REF

2R

FB

, RFB, I

GND

AGND

S12

OUT

I

OUT

I

OUT

2R

1, and I

RFBA

C1

1A

2A

AGND

RFB A I

OUT1A

I

OUT 2A

2 terminals of

OUT

A1

= 0V TO –V

V

OUT

04463-0-005

IN

With a fixed 10 V reference, the circuit shown in Figure 32 gives a unipolar 0 V to −10 V output voltage swing. When V

is an ac

IN

signal, the circuit performs 2-quadrant multiplication.

Table 5 shows the relationship between digital code and expected output voltage for unipolar operation.

Table 5. Unipolar Code Table

Digital Input Analog Output (V)

1111 1111 −V 1000 0000 −V 0000 0001 −V 0000 0000 −V

(4095/4096)

REF

(2048/4096) = −V

REF

(1/4096)

REF

(0/4096) = 0

REF

/2

Bipolar Operation

In some applications, it may be necessary to generate full 4-quadrant multiplying operation or a bipolar output swing. This can be easily accomplished by using another external amplifier, as shown in Figure 33.

V

DD

AGND

R1A

R2A

V

IN

A1

R2 2R

R2_3A

R3 2R

R3A

V

A

REF

NOTES

1. SIMILAR CONFIGURATION FOR DAC B

2. C1 PHASE COMPENSATION (1pF–2pF) MAY BE REQUIRED IF A1 IS A HIGH SPEED AMPLIFIER.

R1 2R

AD5405

12-Bit DAC A

R

FB

R

GND

AGND

A

FB

C1

1A

I

OUT

I

2A

OUT

AGND

A1

V

=–VIN TO +V

OUT

IN

04463-0-007

2R

R

Figure 33. Bipolar Operation (4-Quadrant Multiplication)

When in bipolar mode, the output voltage is given by

OUT

REF

2

REF

−1

n

VDVV ××=

where D is the fractional representation of the digital word loaded to the DAC, in the range of 0 to 4095, and n is the number of bits. When V

is an ac signal, the circuit performs

IN

4-quadrant multiplication.

Table 6 shows the relationship between the digital code and the

04463-0-006

expected output voltage for bipolar operation.

Table 6. Bipolar Code Table

Digital Input Analog Output (V)

1111 1111 +V

(2047/2048)

REF

1000 0000 0 0000 0001 −V 0000 0000 −V

(2047/2048)

REF

(2048/2048)

REF

Rev. 0 | Page 14 of 24

AD5405

Stability

In the I-to-V configuration, the I

of the DAC and the

OUT

inverting node of the op amp must be connected as close as possible, and proper PCB layout techniques must be employed. Because every code change corresponds to a step function, gain peaking may occur if the op amp has limited GBP and there is excessive parasitic capacitance at the inverting node. This parasitic capacitance introduces a pole into the open loop response which can cause ringing or instability in the closedloop applications circuit.

An optional compensation capacitor, C1, can be added in parallel with R

for stability, as shown in Figure 32 and

FB

Figure 33. Too small a value of C1 can produce ringing at the output, while too large a value can adversely affect the settling time. C1 should be found empirically, but 1 pF to 2 pF is generally adequate for the compensation.

SINGLE-SUPPLY APPLICATIONS

Voltage Switching Mode of Operation

Figure 34 shows these DACs operating in the voltage switching mode. The reference voltage, V I

2 is connected to AGND, and the output voltage is available

OUT

at the V

terminal. In this configuration, a positive reference

REF

voltage results in a positive output voltage, making singlesupply operation possible. The output from the DAC is voltage at a constant impedance (the DAC ladder resistance). Thus an op amp is necessary to buffer the output voltage. The reference input no longer sees a constant input impedance, but one that varies with code. So, the voltage input should be driven from a low impedance source.

V

DD

R

V

FB

V

IN

I

OUT

DD

1 2

GND

, is applied to the I

IN

R

1

V

REF

1 pin,

OUT

R

2

V

OUT

POSITIVE OUTPUT VOLTAGE

Note that the output voltage polarity is opposite to the V polarity for dc reference voltages. In order to achieve a positive voltage output, an applied negative reference to the input of the DAC is preferred over the output inversion through an inverting amplifier because of the resistor’s tolerance errors. To generate a negative reference, the reference can be level shifted by an op amp such that the V

and GND pins of the reference

OUT

become the virtual ground and −2.5 V respectively, as shown in Figure 35.

VDD = +5V

ADR03

V

IN

OUT

GND

+

5V

–2.5V

V

12-BIT DAC

1/2 AD8552

–5V

REF

NOTES

1. SIMILAR CONFIGURATION FOR DAC B

2. C1 PHASE COMPENSATION (1pF–2pF) MAY BE REQUIRED IF A1 IS A HIGH SPEED AMPLIFIER.

V

GND

R

FB

DD

I

OUT

I

OUT

Figure 35. Positive Voltage Output with Minimum Components

C

1

1 2

1/2 AD8552

V

= 0V TO +2.5V

OUT

REF

ADDING GAIN

In applications where the output voltage is required to be greater than VIN, gain can be added with an additional external amplifier or it can also be achieved in a single stage. Consider the effect of temperature coefficients of the thin film resistors of the DAC. Simply placing a resistor in series with the R resistor causes mismatches in the temperature coefficients resulting in larger gain temperature coefficient errors. Instead, the circuit of Figure 36 is a recommended method of increasing the gain of the circuit. R

, R2, and R3 should all have similar

1

temperature coefficients, but they need not match the temperature coefficients of the DAC. This approach is recommended in circuits where gains of > 1 are required.

V

DD

FB

04463-0-010

NOTES

1. SIMILAR CONFIGURATION FOR DAC B

2. C1 PHASE COMPENSATION (1pF–2pF) MAY BE REQUIRED IF A1 IS A HIGH SPEED AMPLIFIER.

Figure 34. Single-Supply Voltage Switching Mode

Note that VIN is limited to low voltages because the switches in the DAC ladder no longer have the same source-drain drive voltage. As a result, their on resistance differs and degrades the integral linearity of the DAC. Also, V

must not go negative by

IN

more than 0.3 V or an internal diode turns on, exceeding the max ratings of the device. In this type of application, the full range of multiplying capability of the DAC is lost.

Rev. 0 | Page 15 of 24

04463-0-009

C

DD

DAC

R

V

R2

V

IN

NOTES

1. SIMILAR CONFIGURATION FOR DAC B

2. C1 PHASE COMPENSATION (1pF–2pF) MAY BE REQUIRED IF A1 IS A HIGH SPEED AMPLIFIER.

12-BIT

V

REF

GND

I I

FB

OUT

1

1 2

Figure 36. Increasing Gain of Current Output DAC

R

3

GAIN = R2 + R3

R2

R1 = R2R3 R2 + R3

V

OUT

04463-0-011

AD5405

(

)

A

Y

USED AS A DIVIDER OR PROGRAMMABLE GAIN ELEMENT

Used as a divider or programmable gain element, currentsteering DACs are very flexible and lend themselves to many different applications. If this type of DAC is connected as the feedback element of an op amp, and R resistor, as shown in Figure 37, then the output voltage is inversely proportional to the digital input fraction D.

For

D = 1−2

n

the output voltage is

VDVV

−−=−= 21

OUT

V

IN

NOTE

DDITIONAL PINS OMITTED FOR CLARIT

Figure 37. Current-Steering DAC Used as a Divider or

ININ

V

DD

R

V

FB

DD

1

I

OUT

I

2

OUT

GND

Programmable Gain Element

As D is reduced, the output voltage increases. For small values of the digital fraction D

, it is important to ensure that the

amplifier does not saturate and also that the required accuracy is met. For example, an 8-bit DAC driven with the binary code 0 × 10 (00010000), that is, 16 decimal, in the circuit of Figure 37 should cause the output voltage to be 16 × V DAC has a linearity specification of ±0.5 LSB, then D can, in fact, have the weight anywhere in the range 15.5/256 to 16.5/256 so that the possible output voltage is in the range 15.5 V

—an error of 3% even though the DAC itself has a

16.5 V

IN

maximum error of 0.2%.

DAC leakage current is also a potential error source in divider circuits. The leakage current must be counterbalanced by an opposite current supplied from the op amp through the DAC. Because only a fraction D of the current into the V is routed to the I

1 terminal, the output voltage has to change

OUT

as follows:

Output Error Voltage Due to DAC Leakage = (Leakage × R)/D

where R is the DAC resistance at the V

For a DAC leakage current of 10 nA, R = 10 kΩ and a gain (that is, 1/D) of 16, the error voltage is 1.6 mV.

is used as the input

FB

n

−

V

REF

IN

terminal.

REF

V

OUT

04463-0-012

. However, if the

to

IN

terminal

REF

REFERENCE SELECTION

When selecting a reference for use with the AD5405 series of current output DACs, pay attention to the reference output voltage temperature coefficient specification. This parameter not only affects the full-scale error, but can also affect the linearity (INL and DNL) performance. The reference temperature coefficient should be consistent with the system accuracy specifications. For example, an 8-bit system required to hold its overall specification to within 1 LSB over the temperature range 0°C to 50°C dictates that the maximum system drift with temperature should be less than 78 ppm/°C. A 12-bit system with the same temperature range to overall specification within 2 LSBs requires a maximum drift of 10 ppm/°C. By choosing a precision reference with low output temperature coefficient, this error source can be minimized. Table 7 lists some references available from Analog Devices that are suitable for use with this range of current output DACs.

AMPLIFIER SELECTION

The primary requirement for the current-steering mode is an amplifier with low input bias currents and low input offset voltage. The input offset voltage of an op amp is multiplied by the variable gain (due to the code-dependent output resistance of the DAC) of the circuit. A change in this noise gain between two adjacent digital fractions produces a step change in the output voltage due to the amplifier’s input offset voltage. This output voltage change is superimposed upon the desired change in output between the two codes and gives rise to a differential linearity error, which, if large enough, could cause the DAC to be nonmonotonic.

The input bias current of an op amp also generates an offset at the voltage output as a result of the bias current flowing in the feedback resistor R enough to prevent any significant errors in 12-bit applications.

Common-mode rejection of the op amp is important in voltage-switching circuits, because it produces a codedependent error at the voltage output of the circuit. Most op amps have adequate common-mode rejection for use at 12-bit resolution.

Provided the DAC switches are driven from true wide band, low impedance sources (V Consequently, the slew rate and settling time of a voltageswitching DAC circuit is determined largely by the output op amp. To obtain minimum settling time in this configuration, minimize capacitance at the V this application) of the DAC. This is done by using low input capacitance buffer amplifiers and careful board design.

Most single-supply circuits include ground as part of the analog signal range, which in turn requires an amplifier that can handle rail-to-rail signals. Analog Devices offers a large range of singlesupply amplifiers, as listed in Table 8.

. Most op amps have input bias currents low

FB

and AGND) they settle quickly.

IN

node (voltage output node in

REF

Rev. 0 | Page 16 of 24

AD5405

Table 7. Suitable ADI Precision References Recommended for Use with AD5405 DACs

Reference Output Voltage Initial Tolerance Temperature Drift 0.1 Hz to 10 Hz noise Package

ADR01 10 V 0.1% 3 ppm/°C 20 µV p-p SC70, TSOT, SOIC ADR02 5 V 0.1% 3 ppm/°C 10 µV p-p SC70, TSOT, SOIC ADR03 2.5 V 0.2% 3 ppm/°C 10 µV p-p SC70, TSOT, SOIC ADR425 5 V 0.04% 3 ppm/°C 3.4 µV p-p MSOP, SOIC

Table 8. Precision ADI Op Amps Suitable for Use with AD5405 DACs

Part No. Max Supply Voltage V V

OP97 ±20 25 0.1 0.9 0.2 OP1177 ±18 60 2 1.3 0.7 AD8551 +6 5 0.05 1.5 0.4

Table 9. High Speed ADI Op Amps Suitable for Use with AD5405 DACs

Part No. Max Supply Voltage V V

AD8065 ±12 1500 0.01 145 180 AD8021 ±12 1000 1000 200 100 AD8038 ±5 3000 0.75 350 425

PARALLEL INTERFACE

Data is loaded to the AD5405 in the format of a 12-bit parallel word. Control lines CS and R/W allow data to be written to or

read from the DAC register. A write event takes place when and R/ the shift register, and the rising edge of

are brought low, data available on the data lines fills

W

latches the data and

CS

transfers the latched data word to the DAC register. The DAC latches are not transparent, thus a write sequence must consist of a falling and rising edge on

to ensure data is loaded to the

CS DAC register and its analog equivalent reflected on the DAC output. A read event takes place when R/

is held high and CS

W is brought low. Data is loaded from the DAC register back to the input register and out onto the data line where it can be read back to the controller for verification or diagnostic purposes. The input and DAC registers of these devices are not trans-

parent, so a falling and rising edge of

is required to load

CS

each data-word.

MICROPROCESSOR INTERFACING

The AD5405 can be interfaced to a variety of 16-bit microcontrollers or DSP processors. Figure 38 shows the AD5405 DAC interfaced to a generic 16-bit microcontroller/DSP processor. Microprocessor interfacing to this family of DAC is via a data bus that uses a standard protocol compatible with microcontrollers and DSP processors. The address decoder selects DAC A or DAC B and also to loads parallel data to the input latch or to read data from the DAC using an AND gate.

(max) µV IB (max) nA GBP MHz Slew Rate V/µs

OS

(max) µV IB (max) nA BW @ ACL MHz Slew Rate V/µs

OS

CS

A0 TO AX

MICRO/DSP*

DB0 TO DB11

*ADDITIONAL PINS OMITTED FOR CLARITY

ADDRESS DECODER

WR

Figure 38. AD54xx to Parallel Interface

ADDRESS BUS

A

A + 1

DATA BUS

AD54xx*

DAC A/B

CS

WR

DB0 TO DB11

PCB LAYOUT AND POWER SUPPLY DECOUPLING

In any circuit where accuracy is important, careful consideration of the power supply and ground return layout helps to ensure the rated performance. The printed circuit board on which the AD5405 is mounted should be designed so that the analog and digital sections are separated, and confined to certain areas of the board. If the DAC is in a system where multiple devices require an AGND-to-DGND connection, the connection should be made at one point only. The star ground point should be established as close as possible to the device.

04462-0-055

Rev. 0 | Page 17 of 24

AD5405

These DACs should have ample supply bypassing of 10 µF in parallel with 0.1 µF on the supply located as close to the package as possible, ideally right up against the device. The 0.1 µF capacitor should have low effective series resistance (ESR) and effective series inductance (ESI), like the common ceramic types that provide a low impedance path to ground at high frequencies, to handle transient currents due to internal logic switching. Low ESR 1 µF to 10 µF tantalum or electrolytic capacitors should also be applied at the supplies to minimize transient disturbance and filter out low frequency ripple.

Fast switching signals such as clocks should be shielded with digital ground to avoid radiating noise to other parts of the board, and should never be run near the reference inputs.

It is good practice to employ compact, minimum lead length PCB layout design. Leads to the input should be as short as possible to minimize IR drops and stray inductance.

The PCB metal traces between V

and RFB should also be

REF

matched to minimize gain error. To maximize high frequency performance, the I-to-V amplifier should be located as close to the device as possible.

EVALUATION BOARD FOR THE DACS

The evaluation board consists of a DAC and a current-tovoltage amplifier, the AD8065. Included on the evaluation board is a 10 V reference, the ADR01. An external reference may also be applied via an SMB input.

Avoid crossover of digital and analog signals. Traces on opposite sides of the board should run at right angles to each other. This reduces the effects of feedthrough on the board. A microstrip technique is by far the best, but not always possible with a double-sided board. In this technique, the component side of the board is dedicated to the ground plane while signal traces are placed on the soldered side.

The evaluation kit consists of a CD-ROM with self-installing PC software to control the DAC. The software simply allows the user to write a code to the device.

POWER SUPPLIES FOR THE EVALUATION BOARD

The board requires ±12 V and 5 V supplies. The 12 V V

are used to power the output amplifier, while the 5 V is used

V

SS

to power the DAC (V

) and transceivers (VCC).

DD1

Both supplies are decoupled to their respective ground plane with 10

µF tantalum and 0.1 µF ceramic capacitors.

DD

and

Rev. 0 | Page 18 of 24

AD5405

Figure 39. Schematic of AD5405 Evaluation Board

Rev. 0 | Page 19 of 24

04463-0-045

AD5405

Figure 40. Component-Side Artwork

04463-0-046

04463-0-047

Figure 41. Silkscreen—Component-Side View ( Top Layer)

Rev. 0 | Page 20 of 24

AD5405

04463-0-048

Figure 42. Solder-Side Artwork

Rev. 0 | Page 21 of 24

AD5405

OVERVIEW OF AD54xx DEVICES

Table 10.

Part No. Resolution No. DACs INL(LSB) Interface Package Features

AD5424 8 1 ±0.25 Parallel RU-16, CP-20 AD5426 8 1 ±0.25 Serial RM-10 10 MHz BW, 50 MHz Serial

AD5428 8 2 ±0.25 Parallel RU-20 AD5429 8 2 ±0.25 Serial RU-10 10 MHz BW, 50 MHz Serial AD5450 8 1 ±0.25 Serial RJ-8 10 MHz BW, 50 MHz Serial AD5432 10 1 ±0.5 Serial RM-10 10 MHz BW, 50 MHz Serial AD5433 10 1 ±0.5 Parallel RU-20, CP-20 AD5439 10 2 ±0.5 Serial RU-16 10 MHz BW, 50 MHz Serial AD5440 10 2 ±0.5 Parallel RU-24 AD5451 10 1 ±0.25 Serial RJ-8 10 MHz BW, 50 MHz Serial AD5443 12 1 ±1 Serial RM-10 10 MHz BW, 50 MHz Serial AD5444 12 1 ±0.5 Serial RM-8 10 MHz BW, 50 MHz Serial

AD5415 12 2 ±1 Serial RU-24 10 MHz BW, 58 MHz Serial AD5445 12 2 ±1 Parallel RU-20, CP-20

AD5447 12 2 ±1 Parallel RU-24 AD5449 12 2 ±1 Serial RU-16 10 MHz BW, 50 MHz Serial

AD5452 12 1 ±0.5 Serial RJ-8, RM-8 10 MHz BW, 50 MHz Serial AD5446 14 1 ±1 Serial RM-8 10 MHz BW, 50 MHz Serial AD5453 14 1 ±2 Serial UJ-8, RM-8 10 MHz BW, 50 MHz Serial AD5553 14 1 ±1 Serial RM-8 4 MHz BW, 50 MHz Serial Clock AD5556 14 1 ±1 Parallel RU-28 AD5555 14 2 ±1 Serial RM-8 4 MHz BW, 50 MHz Serial Clock AD5557 14 2 ±1 Parallel RU-38

AD5543 16 1 ±2 Serial RM-8 4 MHz BW, 50 MHz Serial Clock AD5546 16 1 ±2 Parallel RU-28

AD5545 16 2 ±2 Serial RU-16 4 MHz BW, 50 MHz Serial Clock AD5547 16 2 ±2 Parallel RU-38

10 MHz BW, 17 ns

10 MHz BW, 17 ns 10 MHz BW, 17 ns

4 MHz BW, 20 ns

CS Pulse Width

CS Pulse Width CS Pulse Width

WR Pulse Width

Rev. 0 | Page 22 of 24

AD5405

OUTLINE DIMENSIONS

PIN 1

INDICATOR

1.00

0.85

0.80

126° MAX

SEATING PLANE

6.00

BSC SQ

TOP

VIEW

0.80 MAX

0.65 TYP

0.30

0.23

0.18

COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2

5.75

BCS SQ

0.20 REF

0.05 MAX

0.02 NOM

COPLANARITY

0.60 MAX

0.50 BSC

0.50

0.40

0.30

0.08

0.60 MAX

31

30

EXPOSED

(BOTTOM VIEW)

21

20

PAD

4.50 REF

PIN 1

40

11

INDICATOR

1

4.25

4.10 SQ

3.95

10

0.25 MIN

Figure 43. 40 Lead LFCSP

(CP-40)

Dimensions shown in inches and (mm)

ORDERING GUIDE

Model Resolution INL (LSBs) Temperature Range Package Description Package Option

AD5405YCP 12 ±1 −40°C to +125°C LFCSP CP-40 AD5405YCP–REEL 12 ±1 −40°C to +125°C LFCSP CP-40 AD5405YCP–REEL7 12 ±1 −40°C to +125°C LFCSP CP-40 EVAL-AD5405EB Evaluation Kit

Rev. 0 | Page 23 of 24

AD5405

NOTES

D04463–0–7/04(0)

Rev. 0 | Page 24 of 24

Datasheet AD5405 Datasheet (Analog Devices)

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES

APPLICATIONS

GENERAL DESCRIPTION

SPECIFICATIONS

TIMING CHARACTERISTICS

ABSOLUTE MAXIMUM RATINGS

ESD CAUTION

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

TYPICAL PERFORMANCE CHARACTERISTICS

TERMINOLOGY

GENERAL DESCRIPTION

DAC SECTION

CIRCUIT OPERATION

Unipolar Mode

Bipolar Operation

Stability

SINGLE-SUPPLY APPLICATIONS

Voltage Switching Mode of Operation

POSITIVE OUTPUT VOLTAGE

ADDING GAIN

USED AS A DIVIDER OR PROGRAMMABLE GAIN ELEMENT

REFERENCE SELECTION

AMPLIFIER SELECTION

PARALLEL INTERFACE

MICROPROCESSOR INTERFACING

PCB LAYOUT AND POWER SUPPLY DECOUPLING

EVALUATION BOARD FOR THE DACS

POWER SUPPLIES FOR THE EVALUATION BOARD

OVERVIEW OF AD54xx DEVICES

OUTLINE DIMENSIONS

ORDERING GUIDE