Page 1
+2.7 V to +5.5 V, 140 A, Rail-to-Rail
DAC
REGISTER
10-BIT
DAC
INPUT
CONTROL LOGIC
POWER-DOWN
CONTROL LOGIC
OUTPUT
BUFFER
POWER-ON
RESET
AD5310
V
DD
GND
REF (+) REF (–)
RESISTOR
NETWORK
SYNC
SCLK DIN
V
OUT
a
FEATURES
Single 10-Bit DAC
6-Lead SOT-23 and 8-Lead SOIC Packages
Micropower Operation: 140 A @ 5 V
Power-Down to 200 nA @ 5 V, 50 nA @ 3 V
+2.7 V to +5.5 V Power Supply
Guaranteed Monotonic by Design
Reference Derived from Power Supply
Power-On-Reset to Zero Volts
Three Power-Down Functions
Low Power Serial Interface with Schmitt-Triggered
Inputs
On-Chip Output Buffer Amplifier, Rail-to-Rail
Operation
SYNC Interrupt Facility
APPLICATIONS
Portable Battery Powered Instruments
Digital Gain and Offset Adjustment
Programmable Voltage and Current Sources
Programmable Attenuators
Voltage Output 10-Bit DAC in a SOT-23
AD5310*
FUNCTIONAL BLOCK DIAGRAM
GENERAL DESCRIPTION
The AD5310 is a single, 10-bit buffered voltage out DAC that
operates from a single +2.7 V to +5.5 V supply consuming
115 µA at 3 V. Its on-chip precision output amplifier allows rail-
to-rail output swing to be achieved. The AD5310 utilizes a versatile three-wire serial interface that operates at clock rates up
to 30 MHz and is compatible with standard SPI™, QSPI™,
MICROWIRE™ and DSP interface standards.
The reference for AD5310 is derived from the power supply
inputs and thus gives the widest dynamic output range. The part
incorporates a power-on-reset circuit that ensures that the DAC
output powers up to zero volts and remains there until a valid
write takes place to the device. The part contains a power-down
feature which reduces the current consumption of the device to
200 nA at 5 V and provides software selectable output loads
while in power-down mode. The part is put into power-down
mode over the serial interface.
The low power consumption of this part in normal operation
makes it ideally suited to portable battery operated equipment.
The power consumption is 0.7 mW at 5 V reducing to 1 µW in
power-down mode.
The AD5310 is one of a family of pin-compatible DACs. The
AD5300 is the 8-bit version and the AD5320 is the 12-bit version. The AD5300/AD5310/AD5320 are available in 6-lead
SOT-23 packages and 8-lead µSOIC packages.
SPI and QSPI are trademarks of Motorola, Inc.
MICROWIRE is a trademark of National Semiconductor Corporation.
*Patent pending; protected by U.S. Patent No. 5684481.
REV. A
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
PRODUCT HIGHLIGHTS
1. Available in 6-lead SOT-23 and 8-lead µSOIC packages.
2. Low power, single supply operation. This part operates from
a single +2.7 V to +5.5 V supply and typically consumes
0.35 mW at 3 V and 0.7 mW at 5 V, making it ideal for
battery powered applications.
3. The on-chip output buffer amplifier allows the output of the
DAC to swing rail-to-rail with a slew rate of 1 V/µs.
4. Reference derived from the power supply.
5. High speed serial interface with clock speeds up to 30 MHz.
Designed for very low power consumption. The interface
only powers up during a write cycle.
6. Power-down capability. When powered down, the DAC
typically consumes 50 nA at 3 V and 200 nA at 5 V.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700 World Wide Web Site: http://www.analog.com
Fax: 781/326-8703 © Analog Devices, Inc., 1999
Page 2
(VDD = +2.7 V to +5.5 V; RL = 2 k⍀ to GND; CL = 500 pF to GND; all specifications
T
to T
AD5310–SPECIFICATIONS
MIN
B Version
Parameter Min Typ Max Units Conditions/Comments
STATIC PERFORMANCE
2
Resolution 10 Bits
Relative Accuracy ±4 LSB See Figure 2.
Differential Nonlinearity ±0.5 LSB Guaranteed Monotonic by Design. See Figure 3.
Zero Code Error +5 +40 mV All Zeroes Loaded to DAC Register. See Figure 6.
Full-Scale Error –0.15 –1.25 % of FSR All Ones Loaded to DAC Register. See Figure 6.
Gain Error ±1.25 % of FSR
Zero Code Error Drift –20 µV/°C
Gain Temperature Coefficient –5 ppm of FSR/°C
OUTPUT CHARACTERISTICS
3
Output Voltage Range 0 V
Output Voltage Settling Time 6 8 µs 1/4 Scale to 3/4 Scale Change (100 Hex to 300 Hex).
Slew Rate 1 V/µs
Capacitive Load Stability 470 pF R
1000 pF R
Digital-to-Analog Glitch Impulse 20 nV-s 1 LSB Change Around Major Carry. See Figure 19.
Digital Feedthrough 0.5 nV-s
DC Output Impedance 1 Ω
Short Circuit Current 50 mA V
20 mA V
Power-Up Time 2.5 µs Coming Out of Power-Down Mode. V
5 µs Coming Out of Power-Down Mode. V
LOGIC INPUTS
3
Input Current ±1 µA
V
, Input Low Voltage 0.8 V VDD = +5 V
INL
V
, Input Low Voltage 0.6 V VDD = +3␣ V
INL
V
, Input High Voltage 2.4 V VDD = +5 V
INH
V
, Input High Voltage 2.1 V VDD = +3 V
INH
Pin Capacitance 3 pF
unless otherwise noted)
MAX
1
V
DD
R
= 2 kΩ; 0 pF < C
L
=
∞
L
= 2 kΩ
L
= +5 V
DD
= +3 V
DD
< 500 pF. See Figure 16.
L
= +5␣ V
DD
= +3␣ V
DD
POWER REQUIREMENTS
V
DD
I
(Normal Mode) DAC Active and Excluding Load Current
DD
V
= +4.5 V to +5.5 V 140 250 µAV
DD
V
= +2.7 V to +3.6 V 115 200 µAV
DD
I
(All Power-Down Modes)
DD
V
= +4.5 V to +5.5 V 0.2 1 µAV
DD
V
= +2.7 V to +3.6 V 0.05 1 µAV
DD
2.7 5.5 V
= VDD and V
IH
= VDD and V
IH
= VDD and VIL = GND
IH
= VDD and VIL = GND
IH
= GND
IL
= GND
IL
Power Efficiency
I
OUT/IDD
NOTES
1
Temperature ranges are as follows: B Version: –40°C to +105°C.
2
Linearity calculated using a reduced code range of 12 to 1011. Output unloaded.
3
Guaranteed by design and characterization, not production tested.
Specifications subject to change without notice.
93 % I
= 2 mA. VDD = +5 V
LOAD
–2– REV. A
Page 3
AD5310
WARNING!
ESD SENSITIVE DEVICE
TIMING CHARACTERISTICS
Limit at T
1, 2
(VDD = +2.7 V to +5.5 V; all specifications T
, T
MIN
MAX
MIN
to T
unless otherwise noted)
MAX
Parameter VDD = 2.7 V to 3.6 V VDD = 3.6 V to 5.5 V Units Conditions/Comments
3
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
NOTES
1
All input signals are specified with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
2
See Figure 1.
3
Maximum SCLK frequency is 30 MHz at VDD = +3.6 V to +5.5 V and 20 MHz at VDD = +2.7 V to +3.6 V.
Specifications subject to change without notice.
50 33 ns min SCLK Cycle Time
13 13 ns min SCLK High Time
22.5 13 ns min SCLK Low Time
0 0 ns min SYNC to SCLK Rising Edge Setup Time
5 5 ns min Data Setup Time
4.5 4.5 ns min Data Hold Time
0 0 ns min SCLK Falling Edge to SYNC Rising Edge
50 33 ns min Minimum SYNC High Time
t
1
SCLK
t
2
DB0
t
7
SYNC
DIN
t
8
t
4
t
5
DB15
t
3
t
6
Figure 1. Serial Write Operation
ABSOLUTE MAXIMUM RATINGS*
(T
= +25°C unless otherwise noted)
A
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to GND . . . . . . . .–0.3 V to V
to GND . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
V
OUT
+ 0.3 V
DD
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40°C to +105°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature (T
Max) . . . . . . . . . . . . . . . . .+150°C
J
SOT-23 Package
Power Dissipation . . . . . . . . . . . . . . . . . . . (T
Max–T
J
)/θ
A
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 240°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .+220°C
µSOIC Package
Power Dissipation . . . . . . . . . . . . . . . . . . . (T
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 206°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 44°C/W
θ
JC
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . .+220°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
JA
of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ORDERING GUIDE
Temperature Branding Package
Model Range Information Options*
AD5310BRT –40°C to +105°C D3B RT-6
AD5310BRM –40°C to +105°C D3B RM-8
*RT = SOT-23; RM = µSOIC.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD5310 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
Max–T
J
)/θ
A
JA
–3–REV. A
Page 4
AD5310
PIN CONFIGURATIONS
V
OUT
GND
V
DD
SOT-23
1
AD5310
2
3
TOP VIEW
(Not to Scale)
6
5
4
SYNC
SCLK
DIN
mSOIC
1
V
DD
NC
2
NC
3
4
V
OUT
(Not to Scale)
NC = NO CONNECT
AD5310
TOP VIEW
8
7
6
5
GND
DIN
SCLK
SYNC
PIN FUNCTION DESCRIPTIONS
SOT-23 Pin Numbers
Pin
No. Mnemonic Function
1V
OUT
Analog output voltage from DAC. The output amplifier has rail-to-rail operation.
2 GND Ground reference point for all circuitry on the part.
3V
DD
Power Supply Input. These parts can be operated from +2.5 V to +5.5 V and VDD should be de-
coupled to GND.
4 DIN Serial Data Input. This device has a 16-bit shift register. Data is clocked into the register on the
falling edge of the serial clock input.
5 SCLK Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock
input. Data can be transferred at rates up to 30 MHz.
6 SYNC Level triggered control input (active low). This is the frame synchronization signal for the input
data. When SYNC goes low, it enables the input shift register and data is transferred in on the
falling edges of the following clocks. The DAC is updated following the 16th clock cycle unless
SYNC is taken high before this edge in which case the rising edge of SYNC acts as an interrupt and
the write sequence is ignored by the DAC.
–4– REV. A
Page 5
AD5310
TERMINOLOGY
Relative Accuracy
For the DAC, relative accuracy or Integral Nonlinearity (INL)
is a measure of the maximum deviation, in LSBs, from a straight
line passing through the endpoints of the DAC transfer function. A typical INL vs. code plot can be seen in Figure 2.
Differential Nonlinearity
Differential Nonlinearity (DNL) is the difference between the
measured change and the ideal 1 LSB change between any two
adjacent codes. A specified differential nonlinearity of ±1 LSB
maximum ensures monotonicity. This DAC is guaranteed
monotonic by design. A typical DNL vs. code plot can be seen
in Figure 3.
Zero-Code Error
Zero-code error is a measure of the output error when zero code
(000 Hex) is loaded to the DAC register. Ideally the output
should be 0 V. The zero-code error is always positive in the
AD5310 because the output of the DAC cannot go below 0 V.
It is due to a combination of the offset errors in the DAC and
output amplifier. Zero-code error is expressed in mV. A plot of
zero-code error vs. temperature can be seen in Figure 6.
Full-Scale Error
Full-scale error is a measure of the output error when full-scale
code (3FF Hex) is loaded to the DAC register. Ideally the output should be V
– 1 LSB. Full-scale error is expressed in
DD
percent of full-scale range. A plot of full-scale error vs. temperature can be seen in Figure 6.
Gain Error
This is a measure of the span error of the DAC. It is the deviation in slope of the DAC transfer characteristic from ideal
expressed as a percent of the full-scale range.
Total Unadjusted Error
Total Unadjusted Error (TUE) is a measure of the output error
taking all the various errors into account. A typical TUE vs.
code plot can be seen in Figure 4.
Zero-Code Error Drift
This is a measure of the change in zero-code error with a
change in temperature. It is expressed in µV/°C.
Gain Error Drift
This is a measure of the change in gain error with changes in
temperature. It is expressed in (ppm of full-scale range)/°C.
Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the
analog output when the input code in the DAC register changes
state. It is normally specified as the area of the glitch in nV secs
and is measured when the digital input code is changed by
1 LSB at the major carry transition (1FF Hex to 200 Hex). See
Figure 19.
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into the
analog output of the DAC from the digital inputs of the DAC
but is measured when the DAC output is not updated. It is
specified in nV secs and is measured with a full-scale code
change on the data bus, i.e., from all 0s to all 1s and vice versa.
–5–REV. A
Page 6
AD5310
CODE
TUE – LSBs
4
2
–4
0 200 1000
400 600 800
0
–2
TUE @ 3V
TUE @ 5V
TA = +258C
2500
2000
500
50
1500
1000
0
FREQUENCY
70 90
110 130 150 170 190
60 80
100 120 140 160 180
VDD = +5V
IDD – mA
VDD = +3V
–1
INL ERROR – LSBs
–2
–3
–4
–Typical Performance Characteristics
4
3
TA = +258C
2
1
0
0
200 1000
400 600 800
Figure 2. Typical INL Plot
CODE
INL @ 5V
INL @ 3V
0.5
0.4
0.3
0.2
0.1
0
–0.1
–0.2
DNL ERROR – LSBs
–0.3
–0.4
–0.5
0
200 1000
400 600 800
CODE
Figure 3. Typical DNL Plot
DNL @ 3V
DNL @ 5V
TA = +258C
Figure 4. Typical Total Unadjusted
Error Plot
4
VDD = +5V
2
0
ERROR – LSBs
–2
–4
–40 0 12040 80
TEMPERATURE – 8C
Figure 5. INL Error and DNL Error
vs. Temperature
3
DAC LOADED WITH 3FF HEX
2
– V
OUT
V
1
DAC LOADED WITH 000 HEX
0
0
Figure 8. Source and Sink Current
515
I
SOURCE/SINK
Capability with V
– mA
= 3 V
DD
10
MAX INL
MAX DNL
MIN DNL
MIN INL
T
= +258C
A
30
VDD = +5V
20
10
0
ERROR – mV
–10
–20
–30
–40 12004080
TEMPERATURE – 8C
ZS ERROR
FS ERROR
Figure 6. Zero-Scale Error and FullScale Error vs. Temperature
5
DAC LOADED WITH 3FF HEX
4
3
– V
T
= +258C
A
OUT
V
2
1
DAC LOADED WITH 000 HEX
0
0
51510
I
SOURCE/SINK
– mA
Figure 9. Source and Sink Current
Capability with V
DD
= 5 V
–6– REV. A
Figure 7. IDD Histogram with VDD =
3 V and V
500
400
300
– mA
DD
I
200
100
0
0
= 5 V
DD
VDD = +5V
VDD = +3V
400 600 800
200 1000
CODE
Figure 10. Supply Current vs. Code
Page 7
AD5310
VDD – V
1.0
0.9
0
2.7 3.2 5.23.7 4.2 4.7
0.4
0.3
0.2
0.1
0.8
0.6
0.7
0.5
THREE–STATE
CONDITION
–408C
+258C
+1058C
I
DD
– mA
V
OUT
CLK
VDD = +5V
HALF-SCALE CODE CHANGE
100 HEX – 300 HEX
TA = +258C
OUTPUT LOADED WITH
2kV AND 200pF TO GND
CH1 1V, CH2 5V, TIME BASE = 1ms/DIV
CH 1
CH 2
V
OUT
– V
500ns/DIV
2.54
2.46
2.50
2.48
2.52
LOADED WITH 2kV
AND 200pF TO GND
CODE CHANGE:
200 HEX TO 1FF HEX
300
VDD = +5V
250
200
150
– mA
DD
I
100
50
0
–40 80040
TEMPERATURE – 8C
120
Figure 11. Supply Current vs.
Temperature
800
TA = +258C
600
400
– mA
DD
I
200
VDD = +3V
0
01 5234
V
LOGIC
VDD = +5V
– V
Figure 14. Supply Current vs. Logic
Input Voltage
300
250
200
150
– mA
DD
I
100
50
0
2.7 3.2 5.23.7 4.2 4.7
VDD – V
Figure 12. Supply Current vs. Supply Voltage
CH 2
CLK
V
OUT
VDD = +5V
CH1
CH1 1V, CH 2 5V, TIME BASE = 1ms/DIV
FULL-SCALE CODE CHANGE
000 HEX – 3FF HEX
TA = +258C
OUTPUT LOADED WITH
2kV AND 200pF TO GND
Figure 15. Full-Scale Settling Time
Figure 13. Power-Down Current vs.
Supply Voltage
Figure 16. Half-Scale Settling Time
CH1
CH2
Figure 17. Power-On Reset to 0 V
2kV LOAD
TO V
DD
V
DD
V
OUT
CH1 1V, CH2 1V, TIME BASE = 20ms/DIV
CH2
CLK
CH1
V
OUT
CH1 1V, CH2 5V, TIME BASE = 5ms/DIV
VDD = +5V
Figure 18. Exiting Power-Down
(200 Hex Loaded)
–7–REV. A
Figure 19. Digital-to-Analog Glitch
Impulse
Page 8
AD5310
GENERAL DESCRIPTION
D/A Section
The AD5310 DAC is fabricated on a CMOS process. The
architecture consists of a string DAC followed by an output
buffer amplifier. Since there is no reference input pin, the
power supply (V
) acts as the reference. Figure 20 shows a
DD
block diagram of the DAC architecture.
V
DD
REF (+)
DAC REGISTER
RESISTOR
STRING
REF (–)
GND
OUTPUT
AMPLIFIER
V
OUT
Figure 20. DAC Architecture
Since the input coding to the DAC is straight binary, the ideal
output voltage is given by:
V
OUT=VDD
×
1024
D
where D = decimal equivalent of the binary code which is
loaded to the DAC register; it can range from 0 to 1023.
R
R
R TO OUTPUT
R
R
AMPLIFIER
Figure 21. Resistor String
Resistor String
The resistor string section is shown in Figure 21. It is simply a
string of resistors, each of value R. The code loaded to the DAC
register determines at what node on the string the voltage is
tapped off to be fed into the output amplifier. The voltage is
tapped off by closing one of the switches connecting the string
to the amplifier. Because it is a string of resistors, it is guaranteed monotonic.
Output Amplifier
The output buffer amplifier is capable of generating rail-to-rail
voltages on its output which gives an output range of 0 V to
. It is capable of driving a load of 2 kΩ in parallel with
V
DD
1000 pF to GND. The source and sink capabilities of the output
amplifier can be seen in Figures 8 and 9. The slew rate is 1 V/µs
with a half-scale settling time of 6 µs with the output loaded.
SERIAL INTERFACE
The AD5310 has a three-wire serial interface (SYNC, SCLK
and DIN) which is compatible with SPI, QSPI and MICROWIRE
interface standards as well as most DSPs. See Figure 1 for a
timing diagram of a typical write sequence.
The write sequence begins by bringing the SYNC line low. Data
from the DIN line is clocked into the 16-bit shift register on the
falling edge of SCLK. The serial clock frequency can be as high
as 30 MHz making the AD5310 compatible with high speed
DSPs. On the sixteenth falling clock edge, the last data bit is
clocked in and the programmed function is executed (i.e., a
change in DAC register contents and/or a change in the mode of
operation). At this stage, the SYNC line may be kept low or be
brought high. In either case, it must be brought high for a minimum of 33 ns before the next write sequence so that a falling
edge of SYNC can initiate the next write sequence. Since the
SYNC buffer draws more current when V
when V
= 0.8 V, SYNC should be idled low between write
IN
= 2.4 V than it does
IN
sequences for even lower power operation of the part. As is
mentioned above, however, it must be brought high again just
before the next write sequence.
Input Shift Register
The input shift register is 16 bits wide (see Figure 22). The first
two bits are “don’t cares.” The next two are control bits which
control which mode of operation the part is in (normal mode or
any one of three power-down modes). There is a more complete
description of the various modes in the Power-Down Modes
section. The next ten bits are the data bits. These are transferred
to the DAC register on the sixteenth falling edge of SCLK. Finally,
the last two bits are “don’t cares.”
DB15 (MSB)
X XPD1PD0 D7D6D5D4D3D2D1D0X X
0 0 NORMAL OPERATION
011kV TO GND
1 0 100kV TO GND
1 1 THREE-STATE
D8D9
DATA BITS
POWER-DOWN MODES
DB0 (LSB)
Figure 22. Input Register Contents
–8– REV. A
Page 9
SYNC Interrupt
POWER-DOWN
CIRCUITRY
RESISTOR
NETWORK
V
OUT
RESISTOR
STRING DAC
AMPLIFIER
SCLK
ADSP-2101/
ADSP-2103*
DT
*ADDITIONAL PINS OMITTED FOR CLARITY
DIN
SCLK
AD5310*
TFS
DB15
DB0
SCLK
SYNC
DIN
DB15 DB0
VALID WRITE SEQUENCE, OUTPUT UPDATES
INVALID WRITE SEQUENCE:
SYNC HIGH BEFORE 16TH FALLING EDGE
ON THE 16
TH
FALLING EDGE
In a normal write sequence, the SYNC line is kept low for at
least 16 falling edges of SCLK and the DAC is updated on the
16th falling edge. However, if SYNC is brought high before the
16th falling edge this acts as an interrupt to the write sequence.
The shift register is reset and the write sequence is seen as
invalid. Neither an update of the DAC register contents or a
change in the operating mode occurs—see Figure 23.
Power-On-Reset
The AD5310 contains a power-on-reset circuit which controls
the output voltage during power-up. The DAC register is filled
with zeros and the output voltage is 0 V. It remains there until
a valid write sequence is made to the DAC. This is useful in
applications where it is important to know the state of the output of the DAC while it is in the process of powering up.
Power-Down Modes
The AD5310 contains four separate modes of operation. These
modes are software-programmable by setting two bits (DB13
and DB12) in the control register. Table I shows how the state
of the bits corresponds to the mode of operation of the device.
Table I. Modes of Operation for the AD5310
DB13 DB12 Operating Mode
0 0 Normal Operation
Power-Down Modes
01 1 kΩ to GND
1 0 100 kΩ to GND
1 1 Three-State
AD5310
Figure 24. Output Stage During Power-Down
The bias generator, the output amplifier, the resistor string and
other associated linear circuitry are all shut down when the
power-down mode is activated. However, the contents of the
DAC register are unaffected when in power-down. The time to
exit power-down is typically 2.5 µs for V
= 3 V. See Figure 18 for a plot.
V
DD
MICROPROCESSOR INTERFACING
AD5310 to ADSP-2101/ADSP-2103 Interface
Figure 25 shows a serial interface between the AD5310 and the
ADSP-2101/ADSP-2103. The ADSP-2101/ADSP-2103 should
be set up to operate in the SPORT Transmit Alternate Framing
Mode. The ADSP-2101/ADSP-2103 SPORT is programmed
through the SPORT control register and should be configured as
follows: Internal Clock Operation, Active Low Framing, 16-Bit
Word Length. Transmission is initiated by writing a word to the
Tx register after the SPORT has been enabled.
= 5 V and 5 µs for
DD
When both bits are set to 0, the part works normally with its
normal power consumption of 140 µA at 5 V. However, for the
three power-down modes, the supply current falls to 200 nA at
5 V (50 nA at 3 V). Not only does the supply current fall but
the output stage is also internally switched from the output of
the amplifier to a resistor network of known values. This has the
advantage that the output impedance of the part is known
while the part is in power-down mode. There are three different options. The output is connected internally to GND through a
1 kΩ resistor, a 100 kΩ resistor or it is left open-circuited (Three-
State). The output stage is illustrated in Figure 24.
Figure 23.
Figure 25. AD5310 to ADSP-2101/ADSP-2103 Interface
SYNC
Interrupt Facility
–9–REV. A
Page 10
AD5310
SCLK
MICROWIRE*
SK
*ADDITIONAL PINS OMITTED FOR CLARITY
DIN
SO
AD5310*
CS
THREE-WIRE
SERIAL
INTERFACE
+15V
+5V
140mA
V
OUT
= 0V TO 5V
AD5310
REF195
SYNC
SCLK
DIN
AD5310 to 68HC11/68L11 Interface
Figure 26 shows a serial interface between the AD5310 and the
68HC11/68L11 microcontroller. SCK of the 68HC11/68L11
drives the SCLK of the AD5310, while the MOSI output
drives the serial data line of the DAC. The SYNC signal is derived from a port line (PC7). The setup conditions for correct
operation of this interface are as follows: the 68HC11/68L11
should be configured so that its CPOL bit is a 0 and its CPHA
bit is a 1. When data is being transmitted to the DAC, the
SYNC line is taken low (PC7). When the 68HC11/68L11 is
configured as above, data appearing on the MOSI output is valid
on the falling edge of SCK. Serial data from the 68HC11/68L11
is transmitted in 8-bit bytes with only eight falling clock edges
occurring in the transmit cycle. Data is transmitted MSB first. In
order to load data to the AD5310, PC7 is left low after the first
eight bits are transferred, and a second serial write operation is
performed to the DAC and PC7 is taken high at the end of this
procedure.
68HC11/68L11*
PC7
SCK
MOSI
*ADDITIONAL PINS OMITTED FOR CLARITY
AD5310*
SCLK
DIN
Figure 26. AD5310 to 68HC11/68L11 Interface
AD5310 to 80C51/80L51 Interface
Figure 27 shows a serial interface between the AD5310 and the
80C51/80L51 microcontroller. The setup for the interface is as
follows: TXD of the 80C51/80L51 drives SCLK of the AD5310,
while RXD drives the serial data line of the part. The SYNC
signal is again derived from a bit programmable pin on the port.
In this case port line P3.3 is used. When data is to be transmitted to the AD5310, P3.3 is taken low. The 80C51/80L51 transmits data only in 8-bit bytes; thus only eight falling clock edges
occur in the transmit cycle. To load data to the DAC, P3.3 is
left low after the first eight bits are transmitted, and a second
write cycle is initiated to transmit the second byte of data. P3.3
is taken high following the completion of this cycle. The 80C51/
80L51 outputs the serial data in a format which has the LSB
first. The AD5310 requires its data with the MSB as the first bit
received. The 80C51/80L51 transmit routine should take this
into account.
80C51/80L51*
P3.3
TXD
RXD
AD5310*
SCLK
DIN
AD5310 to Microwire Interface
Figure 28 shows an interface between the AD5310 and any
microwire compatible device. Serial data is shifted out on the
falling edge of the serial clock and is clocked into the AD5310
on the rising edge of the SK.
Figure 28.␣ AD5310 to MICROWIRE Interface
APPLICATIONS
Using REF19x as a Power Supply for AD5310
Because the supply current required by the AD5310 is extremely
low, an alternative option is to use a REF19x voltage reference
(REF195 for 5 V or REF193 for 3 V) to supply the required
voltage to the part—see Figure 29. This is especially useful if
your power supply is quite noisy or if the system supply voltages
are at some value other than 5 V or 3 V (e.g., 15 V). The REF19x
will output a steady supply voltage for the AD5310. If the low
dropout REF195 is used, the current which it needs to supply to
the AD5310 is 140 µA. This is with no load on the output of the
DAC. When the DAC output is loaded, the REF195 also needs to
supply the current to the load. The total current required (with
a 5 kΩ load on the DAC output) is:
µ
A + (5 V/5 kΩ) = 1.14 mA
140
The load regulation of the REF195 is typically 2 ppm/mA
which results in an error of 2.3 ppm (11.5 µV) for the 1.14 mA
current drawn from it. This corresponds to a 0.002 LSB error.
Figure 29. REF195 as Power Supply to AD5310
*ADDITIONAL PINS OMITTED FOR CLARITY
Figure 27. AD5310 to 80C51/80L51 Interface
–10– REV. A
Page 11
Bipolar Operation Using the AD5310
V
DD
0.1mF
V
DD
10kV
10kV
V
DD
10kV
+5V
REGULATOR
V
OUT
GND
DIN
SYNC
SCLK
POWER
10mF
V
DD
SYNC
SCLK
DATA
AD5310
The AD5310 has been designed for single-supply operation
but a bipolar output range is also possible using the circuit in
Figure 30. The circuit below will give an output voltage
range of ±5 V. Rail-to-rail operation at the amplifier output
is achievable using an AD820 or an OP295 as the output
amplifier.
The output voltage for any input code can be calculated as
follows:
AD5310
V
O
= VDD×
1024
×
R1+R2
D
R1
–V
DD
R2
×
R1
where D represents the input code in decimal (0–1023).
With V
= 5 V, R1 = R2 = 10 kΩ:
DD
10 ×D
V
=
O
1024
–5V
This is an output voltage range of ±5 V with 000 Hex corre-
sponding to a –5 V output and 3FF Hex corresponding to a
+5 V output.
R2 = 10kV
AD820/
OP295
+5V
65V
–5V
+5V
10mF 0.1mF
V
DD
AD5310
THREE-WIRE
SERIAL
INTERFACE
R1 = 10kV
V
OUT
Figure 30. Bipolar Operation with the AD5310
Using AD5310 with an Opto-Isolated Interface
In process-control applications in industrial environments it
is often necessary to use an opto-isolated interface in order to
protect and isolate the controlling circuitry from any hazardous common-mode voltages which may occur in the area
where the DAC is functioning. Opto-isolators provide isolation in excess of 3 kV. Because the AD5310 uses a three-wire
serial logic interface, it only requires three opto-isolators to
provide the required isolation (see Figure 31). The power
supply to the part also needs to be isolated. This is done by
using a transformer. On the DAC side of the transformer, a
+5 V regulator provides the +5 V supply required for the
AD5310.
Figure 31. AD5310 with an Opto-Isolated Interface
Power Supply Bypassing and Grounding
When accuracy is important in a circuit it is helpful to consider
carefully the power supply and ground return layout on the
board. The printed circuit board containing the AD5310 should
have separate analog and digital sections, each having their own
area of the board. If the AD5310 is in a system where other
devices require an AGND to DGND connection, the connection should be made at one point only. This ground point
should be as close as possible to the AD5310.
The power supply to the AD5310 should be bypassed with
10 µF and 0.1 µF capacitors. The capacitors should be physi-
cally as close as possible to the device with the 0.1 µF capacitor
ideally right up against the device. The 10 µF capacitors are the
tantalum bead type. It is important that the 0.1 µF capacitor has
low Effective Series Resistance (ESR) and Effective Series Inductance (ESI), e.g., common ceramic types of capacitors. This
0.1 µF capacitor provides a low impedance path to ground for
high frequencies caused by transient currents due to internal
logic switching.
The power supply line itself should have as large a trace as possible to provide a low impedance path and reduce glitch effects
on the supply line. Clocks and other fast switching digital signals
should be shielded from other parts of the board by digital
ground. Avoid crossover of digital and analog signals if possible.
When traces cross on opposite sides of the board ensure that
they run at right angles to each other to reduce feedthrough
effects through the board. The best board layout technique is
the microstrip technique where the component side of the board
is dedicated to the ground plane only and the signal traces are
placed on the solder side. However, this is not always possible
with a two-layer board.
–11–REV. A
Page 12
AD5310
0.071 (1.80)
0.059 (1.50)
0.051 (1.30)
0.035 (0.90)
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
6-Lead SOT-23
(RT-6)
0.122 (3.10)
0.106 (2.70)
5
2
BSC
0.020 (0.50)
0.010 (0.25)
4
0.118 (3.00)
0.098 (2.50)
3
0.037 (0.95) BSC
0.057 (1.45)
0.035 (0.90)
SEATING
PLANE
6
1
PIN 1
0.075 (1.90)
0.006 (0.15)
0.000 (0.00)
8-Lead SOIC
(RM-8)
0.122 (3.10)
0.114 (2.90)
0.009 (0.23)
0.003 (0.08)
10°
0°
C3192a–0–5/99
0.022 (0.55)
0.014 (0.35)
0.122 (3.10)
0.114 (2.90)
0.006 (0.15)
0.002 (0.05)
SEATING
85
1
PIN 1
0.0256 (0.65) BSC
0.120 (3.05)
0.112 (2.84)
0.018 (0.46)
0.008 (0.20)
PLANE
0.199 (5.05)
0.187 (4.75)
4
0.043 (1.09)
0.037 (0.94)
0.011 (0.28)
0.003 (0.08)
0.120 (3.05)
0.112 (2.84)
33°
27°
0.028 (0.71)
0.016 (0.41)
PRINTED IN U.S.A.
–12–
REV. A
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