Datasheet AD5301 Datasheet (ANALOG DEVICES)

Page 1
2.5 V to 5.5 V, 120 μA, 2-Wire Interface,
V
A

FEATURES

AD5301: buffered voltage output 8-bit DAC AD5311: buffered voltage output 10-bit DAC AD5321: buffered voltage output 12-bit DAC 6-lead SOT-23 and 8-lead MSOP packages Micropower operation: 120 μA @ 3 V 2-wire (I Data readback capability
2.5 V to 5.5 V power supply Guaranteed monotonic by design over all codes Power-down to 50 nA @ 3 V Reference derived from power supply Power-on reset to 0 V On-chip rail-to-rail output buffer amplifier 3 power-down functions

APPLICATIONS

Portable battery-powered instruments Digital gain and offset adjustment Programmable voltage and current sources Programmable attenuators
2
C®-compatible) serial interface
Voltage-Output 8-/10-/12-Bit DACs
AD5301/AD5311/AD5321

GENERAL DESCRIPTION

The AD5301/AD5311/AD53211 are single 8-/10-/12-bit, buff­ered, voltage-output DACs that operate from a single 2.5 V to
5.5 V supply, consuming 120 μA at 3 V. The on-chip output amplifier allows rail-to-rail output swing with a slew rate of
0.7 V/μs. It uses a 2-wire (I operates at clock rates up to 400 kHz. Multiple devices can share the same bus.
The reference for the DAC is derived from the power supply inputs and thus gives the widest dynamic output range. These parts incorporate a power-on reset circuit, which ensures that the DAC output powers up to 0 V and remains there until a valid write takes place. The parts contain a power-down feature that reduces the current consumption of the device to 50 nA at 3 V and provides software-selectable output loads while in power-down mode.
The low power consumption in normal operation makes these DACs ideally suited to portable battery-operated equipment. The power consumption is 0.75 mW at 5 V and 0.36 mW at 3 V, reducing to 1 μW in all power-down modes.
1
Protected by U.S. Patent No. 5684481.
2
C-compatible) serial interface that

FUNCTIONAL BLOCK DIAGRAM

SCL
SD
A0
A1*
*AVAILABLE O N 8-LEAD VERSI ON ONLY
INTERFACE
LOGIC
POWER-ON
RESET
GND
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
DAC
REGISTER
DD
REF
8-/10-/12-BIT
DAC
Figure 1.
AD5301/AD5311/AD5321
BUFFER
POWER-DOWN
LOGIC
RESISTOR NETWORK
PD*
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©1999–2007 Analog Devices, Inc. All rights reserved.
V
OUT
00927-001
Page 2
AD5301/AD5311/AD5321

TABLE OF CONTENTS

Features.............................................................................................. 1
Applications....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
AC Characteristics........................................................................ 5
Timing Characteristics ................................................................ 5
Absolute Maximum Ratings............................................................ 6
ESD Caution.................................................................................. 6
Pin Configurations and Function Descriptions ........................... 7
Terminology ...................................................................................... 8
Typical Performance Characteristics ............................................. 9
Theory of Operation ...................................................................... 13
Digital-to-Analog .......................................................................13
Resistor String............................................................................. 13
Output Amplifier........................................................................ 13
Power-On Reset.......................................................................... 13
Serial Interface ................................................................................ 14
2-Wire Serial Bus........................................................................ 14
Input Shift Register .................................................................... 14
Write Operation.......................................................................... 15
Read Operation........................................................................... 16
Power-Down Modes .................................................................. 17
Application Notes........................................................................... 18
Using REF19x as a Power Supply ............................................. 18
Bipolar Operation Using the AD5301/AD5311/AD5321..... 18
Multiple Devices on One Bus ................................................... 18
CMOS Driven SCL and SDA Lines.......................................... 18
Power Supply Decoupling......................................................... 19
Outline Dimensions....................................................................... 20
Ordering Guide .......................................................................... 21

REVISION HISTORY

3/07—Rev. A to Rev. B
Updated Format..................................................................Universal
Changes to Table 4............................................................................ 6
Changes to Figure 4 Caption........................................................... 7
Updated Outline Dimensions....................................................... 20
Changes to Ordering Guide.......................................................... 21
11/03—Rev. 0 to Rev. A
Changes to Ordering Guide............................................................ 4
Updated Outline Dimensions....................................................... 15
7/99—Revision 0: Initial Version
Rev. B | Page 2 of 24
Page 3
AD5301/AD5311/AD5321

SPECIFICATIONS

VDD = 2.5 V to 5.5 V; RL = 2 kΩ to GND; CL = 200 pF to GND; all specifications T
MIN
to T
, unless otherwise noted.
MAX
Table 1.
B Version Parameter
DC PERFORMANCE
2
3, 4
Min Typ Max Unit Conditions/Comments
1
AD5301
Resolution 8 Bits Relative Accuracy ±0.15 ±1 LSB Differential Nonlinearity ±0.02 ±0.25 LSB Guaranteed monotonic by design over all codes.
AD5311
Resolution 10 Bits Relative Accuracy ±0.5 ±4 LSB Differential Nonlinearity ±0.05 ±0.5 LSB Guaranteed monotonic by design over all codes.
AD5321
Resolution 12 Bits Relative Accuracy ±2 ±16 LSB
Differential Nonlinearity ±0.3 ±0.8 LSB Guaranteed monotonic by design over all codes. Zero-Code Error 5 20 mV All zeros loaded to DAC, see Figure 12. Full-Scale Error ±0.15 ±1.25 % of FSR All ones loaded to DAC, see Figure 12. Gain Error ±0.15 ±1 % of FSR Zero-Code Error Drift Gain Error Drift
OUTPUT CHARACTERISTICS
Minimum Output Voltage 0.001 V Maximum Output Voltage VDD − 0.001 V
5
5
–20 μV/°C
−5 ppm of FSR/°C
5
This is a measure of the minimum and maximum drive capability of the output amplifier.
DC Output Impedance 1 Ω Short-Circuit Current 50 mA VDD = 5 V. 20 mA VDD = 3 V. Power-Up Time 2.5 μs Coming out of power-down mode. VDD = 5 V. 6 μs Coming out of power-down mode. VDD = 3 V.
5
LOGIC INPUTS (A0, A1, PD)
Input Current ±1 μA Input Low Voltage, VIL 0.8 V VDD = 5 V ± 10%.
0.6 V VDD = 3 V ± 10%.
0.5 V VDD = 2.5 V.
Input High Voltage, VIH 2.4 V VDD = 5 V ± 10%.
2.1 V VDD = 3 V ± 10%.
2.0 V VDD = 2.5 V. Pin Capacitance 3 pF
LOGIC INPUTS (SCL, SDA)5
Input High Voltage, VIH 0.7 × VDD VDD + 0.3 V Input Low Voltage, VIL −0.3 +0.3 × VDD V Input Leakage Current, IIN ±1 μA VIN = 0 V to VDD. Input Hysteresis, V
0.05 × VDD V
HYST
Input Capacitance, CIN 6 pF Glitch Rejection
6
50 ns Pulse width of spike suppressed.
Rev. B | Page 3 of 24
Page 4
AD5301/AD5311/AD5321
B Version1 Parameter
LOGIC OUTPUT (SDA)
Output Low Voltage, VOL 0.4 V I
0.6 V I Three-State Leakage
Current Three-State Output
POWER REQUIREMENTS
VDD 2.5 5.5 V IDD specification is valid for all DAC codes. IDD (Normal Mode) DAC active and excluding load current.
IDD (Power-Down Mode)
1
Temperature range is as follows: B Version: −40°C to +105°C.
2
See the Terminology section.
3
DC specifications tested with the outputs unloaded.
4
Linearity is tested using a reduced code range: AD5301 (Code 7 to 250); AD5311 (Code 28 to 1000); and AD5321 (Code 112 to 4000).
5
Guaranteed by design and characterization, not production tested.
6
Input filtering on both the SCL and SDA inputs suppress noise spikes that are less than 50 ns.
2
5
Min Typ Max Unit Conditions/Comments
= 3 mA.
SINK
= 6 mA.
SINK
±1 μA
6 pF
Capacitance
VDD = 4.5 V to 5.5 V 150 250 μA VIH = VDD and VIL = GND. VDD = 2.5 V to 3.6 V 120 220 μA VIH = VDD and VIL = GND.
VDD = 4.5 V to 5.5 V 0.2 1 μA VIH = VDD and VIL = GND. VDD = 2.5 V to 3.6 V 0.05 1 μA VIH = VDD and VIL = GND.
Rev. B | Page 4 of 24
Page 5
AD5301/AD5311/AD5321

AC CHARACTERISTICS

VDD = 2.5 V to 5.5 V; RL = 2 kΩ to GND; CL = 200 pF to GND; all specifications T
Table 2.
B Version Parameter
3
Output Voltage Settling Time VDD = 5 V
AD5301 6 8 μs 1/4 scale to 3/4 scale change (0x40 to 0xC0) AD5311 7 9 μs 1/4 scale to 3/4 scale change (0x100 to 0x300) AD5321 8 10 μs 1/4 scale to 3/4 scale change (0x400 to 0xC00)
Slew Rate 0.7 V/μs Major-Code Change Glitch Impulse 12 nV-s 1 LSB change around major carry Digital Feedthrough 0.3 nV-s
1
See the Terminology section.
2
Temperature range for the B Version is as follows: –40°C to +105°C.
3
Guaranteed by design and characterization, not production tested.

TIMING CHARACTERISTICS

VDD = 2.5 V to 5.5 V; all specifications T
Table 3.
Limit at T
Parameter2(B Version) Unit Conditions/Comments
f
400 kHz max SCL clock frequency
SCL
t1 2.5 μs min SCL cycle time t2 0.6 μs min t t3 1.3 μs min t t4 0.6 μs min t t5 100 ns min t
3
t
6
0 μs min t7 0.6 μs min t t8 0.6 μs min t t9 1.3 μs min t t10 300 ns max tR, rise time of both SCL and SDA when receiving 0 ns min May be CMOS driven t11 250 ns max tF, fall time of SDA when receiving 300 ns max tF, fall time of both SCL and SDA when transmitting 20 + 0.1C Cb 400 pF max Capacitive load for each bus line
1
See Figure 2.
2
Guaranteed by design and characterization, not production tested.
3
A master device must provide a hold time of at least 300 ns for the SDA signal (refer to the V
falling edge.
4
tR and tF measured between 0.3 VDD and 0.7 VDD.
5
Cb is the total capacitance of one bus line in picofarads.
0.9 μs max t
1
to T
MIN
2
, unless otherwise noted.
MAX
Min Typ Max Unit Conditions/Comments
1
to T
MIN
, T
MIN
5
b
MAX
ns min
, unless otherwise noted.
MAX
, SCL high time
HIGH
, SCL low time
LOW
, start/repeated start condition hold time
HD,STA
data setup time
SU,DAT,
, data hold time
HD,DAT
, setup time for repeated start
SU,STA
, stop condition setup time
SU,STO
, bus free time between a stop condition and a start condition
BUF
4
4
4
of the SCL signal) in order to bridge the undefined region of SCL’s
IH MIN
SDA
SCL
t
9
t
4
START
CONDIT ION
t
3
t
10
t
6
Figure 2. 2-Wire Serial Interface Timing Diagram
t
11
t
2
t
t
5
7
REPEATED
START
CONDITIO N
t
4
t
1
t
8
STOP
CONDITION
00927-002
Rev. B | Page 5 of 24
Page 6
AD5301/AD5311/AD5321

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.1
Table 4.
Parameter Rating
VDD to GND −0.3 V to +7 V SCL, SDA to GND −0.3 V to VDD + 0.3 V PD, A1, A0 to GND V
to GND −0.3 V to VDD + 0.3 V
OUT
Operating Temperature Range
Industrial (B Version) −40°C to +105°C Storage Temperature Range −65°C to +150°C Junction Temperature (TJ max) 150°C SOT-23 Package
Power Dissipation (TJ max − TA)/θJA
θJA Thermal Impedance 229.6°C/W MSOP Package
Power Dissipation (TJ max – TA)/θJA
θJA Thermal Impedance 206°C/W Lead Temperature JEDEC Industry Standard
Soldering J-STD-020
1
Transient currents of up to 100 mA do not cause SCR latch-up.
−0.3 V to V
+ 0.3 V
DD
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

Rev. B | Page 6 of 24
Page 7
AD5301/AD5311/AD5321
V

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

V
DD
1
AD5301/ AD5311/
2
A0
AD5321
3
A1
TOP VIEW
4
OUT
(Not to Scale)
Figure 3. 8-Lead MSOP
(RM-8) Pin Configuration
1
SCL
AD5301/ AD5311/
2
AD5321
TOP VIEW
(Not to Scale)
3
8
GND
7
SDA
6
SCL
5
PD
00927-004
SDA
Figure 4. 6-Lead SOT-23
(RJ-6) Pin Configuration
6
5
4
GND
Table 5. Pin Function Descriptions
MSOP Pin No.
1 6 VDD
SOT-23 Pin No.
Mnemonic Description
Power Supply Input. These parts can be operated from 2.5 V to 5.5 V and the supply should be decoupled
with a 10 μF in parallel with a 0.1 μF capacitor to GND. 2 5 A0 Address Input. Sets the least significant bit of the 7-bit slave address. 3 N/A A1 Address Input. Sets the second least significant bit of the 7-bit slave address. 4 4 V 5 N/A
Buffered Analog Output Voltage from the DAC. The output amplifier has rail-to-rail operation.
OUT
PD Active Low Control Input. Acts as a hardware power-down option. This pin overrides any software
power-down option. The DAC output goes three-state and the current consumption of the part
drops to 50 nA @ 3 V (200 nA @ 5 V). 6 3 SCL
Serial Clock Line. This is used in conjunction with the SDA line to clock data into the 16-bit input shift
register. Clock rates of up to 400 kbps can be accommodated in the I
2
C-compatible interface. SCL may
be CMOS/TTL driven. 7 2 SDA
Serial Data Line. This is used in conjunction with the SCL line to clock data into the 16-bit input shift
register during the write cycle and to read back one or two bytes of data (one byte for the AD5301,
two bytes for the AD5311/AD5321) during the read cycle. It is a bidirectional open-drain data line that
should be pulled to the supply with an external pull-up resistor. If not used in readback mode, SDA may
be CMOS/TTL driven. 8 1 GND Ground Reference Point for All Circuitry on the Part.
V
DD
A0
V
OUT
0927-003
Rev. B | Page 7 of 24
Page 8
AD5301/AD5311/AD5321

TERMINOLOGY

Relative Accuracy
For the DAC, relative accuracy or integral nonlinearity (INL) is a measure of the maximum deviation, in LSBs, from a straight line passing through the actual endpoints of the DAC transfer function. Typical INL vs. code plots can be seen in Figure 7.
Differential Nonlinearity (DNL)
DNL is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±1 LSB maximum ensures monotonic­ity. These DACs are guaranteed monotonic by design over all codes. Typical DNL vs. code plots can be seen in Figure 10.
Zero-Code Error
Zero-code error is a measure of the output error when zero code (0x00) is loaded to the DAC register. Ideally, the output should be 0 V. The zero-code error of the AD5301/AD5311/ AD5321 is always positive because the output of the DAC cannot go below 0 V, due to a combination of the offset errors in the DAC and output amplifier. It is expressed in millivolts, see
Figure 12.
Full-Scale Error (FSR)
Full-scale error is a measure of the output error when full scale is loaded to the DAC register. Ideally, the output should be V
– 1 LSB. Full-scale error is expressed in percent of FSR.
DD
A plot can be seen in
Figure 12.
Figure 5 to
Figure 8 to
Gain Error
Gain error is a measure of the span error of the DAC. It is the deviation in slope of the actual DAC transfer characteristic from the ideal expressed as a percentage of the full-scale range.
Zero-Code Error Drift
Zero-code error drift is a measure of the change in zero-code error with a change in temperature. It is expressed in μV/°C.
Gain Error Drift
Gain error drift is a measure of the change in gain error with changes in temperature. It is expressed in (ppm of full-scale range)/°C.
Major Code Transition Glitch Energy
Major code transition glitch energy is the energy of the impulse injected into the analog output when the code in the DAC register changes state. It is normally specified as the area of the glitch in nV-s and is measured when the digital code is changed by 1 LSB at the major carry transition (011 . . . 11 to 100 . . . 00 or 100 . . . 00 to 011 . . . 11).
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into the analog output of the DAC from the digital input pins of the device, but is measured when the DAC is not being written to. It is specified in nV-s and is measured with a full-scale change on the digital input pins, that is, from all 0s to all 1s and vice versa.
Rev. B | Page 8 of 24
Page 9
AD5301/AD5311/AD5321

TYPICAL PERFORMANCE CHARACTERISTICS

1.0
0.5
T
A
V
DD
= 25°C
= 5V
0.3
0.2
0.1
T
A
V
DD
= 25°C
= 5V
0
INL ERROR (L SB)
–0.5
–1.0
0 50 100 150 200 255
CODE
Figure 5. AD5301 Typical INL Plot
3
TA = 25°C V
= 5V
DD
2
1
0
INL ERROR (L SB)
–1
–2
–3
0 200 400 600 800 1023
CODE
Figure 6. AD5311 Typical INL Plot
3
TA = 25°C V
= 5V
DD
2
1
0
–0.1
DNL ERROR (LSB)
–0.2
–0.3
0927-005
0 50 100 150 255
CODE
200
7-00 0092 8
Figure 8. AD5301 Typical DNL Plot
0.6
TA = 25°C V
= 5V
DD
0.4
0.2
0
–0.2
DNL ERROR (LSB)
–0.4
–0.6
7-00 0092 6
0 200 400 600 800 1023
CODE
0092 97-00
Figure 9. AD5311 Typical DNL Plot
1.0
T
= 25°C
A
V
= 5V
DD
0.5
0
INL ERROR (L SB)
–4
–8
–12
0 1000 2000 3000 4095
CODE
Figure 7. AD5321 Typical INL Plot
00927-007
Rev. B | Page 9 of 24
0
DNL ERROR (LSB)
–0.5
–1.0
0 1000 2000 3000 4095
CODE
Figure 10. AD5321 Typical DNL Plot
00927-010
Page 10
AD5301/AD5311/AD5321
5
4
3
(V)
OUT
V
2
1
5V SOURCE
3V SOURCE
3V SINK
5V SINK
ERROR (LSB)
1.00
0.75
0.50
0.25
–0.25
–0.50
–0.75
0
VDD= 5V
MAX DNL
MIN INL
MAX INL
MIN DNL
–1.00
–40 0 40 80 120
TEMPERATURE (° C)
Figure 11. AD5301 INL Error and DNL Error vs. Temperature
10
VDD= 5V
8
6
4
2
0
–2
ERROR (mV)
–4
–6
–8
–10
–40 0 40 806020–20 100
ZERO CODE
FULL SCALE
TEMPERATURE ( °C)
Figure 12. Zero-Code Error and Full-Scale Error vs. Temperature
= 3V
V
DD
FREQUENCY (Hz)
VDD= 5V
–0
0369121
00927-011
I (mA)
5
0927-014
Figure 14. Source and Sink Current Capability
200
TA= 25°C
180
160
140
120
100
(µA)
DD
I
80
60
40
20
0
ZERO SCALE FULL SCALE
0927-012
VDD= 5V
VDD= 5V
= 3V
V
DD
CODE
0927-015
Figure 15. Supply Current vs. Code
200
150
–40°C
100
(µA)
DD
I
50
+25°C
+105°C
80 120 160 190140100 200
Figure 13. I
Histogram with VDD = 3 V and VDD = 5 V
DD
IDD (µA)
00927-013
Rev. B | Page 10 of 24
0
2.7 3.2 3.7 4.2 4.7 5.2 VDD (V)
Figure 16. Supply Current vs. Supply Voltage
00927-016
Page 11
AD5301/AD5311/AD5321
1.0
VDD = 5V T
= 25°C
0.8
0.6
(µA)
DD
I
0.4
0.2
–40°C
1
+25°C
V
OUT
A
LOAD = 2kΩ AND 200pF TO GND
0
2.7 3.2 3.7 4.2 4.7 5. 2 VDD (V)
+105°C
00927-017
Figure 17. Power-Down Current vs. Supply Voltage
300
TA = 25°C
250
200
150
(µA)
DD
I
100
50
V
= 5V
DD
DECREASING
VDD = 3V
0
0 1.0 2.0 3.0 4.0 5.0
V
LOGIC
INCREASING
(V)
00927-018
Figure 18. Supply Current vs. Logic Input Voltage for SDA and SCL Voltage
Increasing and Decreasing
CH1 1V, TI ME BASE = 5µs/ DIV
Figure 19. Half-Scale Settling (1/4 to 3/4 Scale Code Charge)
TA = 25°C
V
DD
CH1
CH2
CH1 1V, CH2 1V, T IME BASE = 20µs/DIV
V
OUT
Figure 20. Power-On Reset to 0 V
00927-019
00927-020
Rev. B | Page 11 of 24
Page 12
AD5301/AD5311/AD5321
C
C
2.440
TA = 25°C VDD = 5V
2.445
V
OUT
H1
H2
CLK
CH1 1V, CH2 5V, T IME BASE = 1µs/DIV
Figure 21. Exiting Power-Down to Midscale
00927-021
(V)
V
OUT
2.450
2.455
1ns/DIV
Figure 23. Digital Feedthrough
00927-023
2.50
2.49
(V)
OUT
V
2.48
2.47
1µs/DIV
00927-022
Figure 22. Major-Code Transition
Rev. B | Page 12 of 24
Page 13
AD5301/AD5311/AD5321
V

THEORY OF OPERATION

The AD5301/AD5311/AD5321 are single resistor-string DACs fabricated on a CMOS process with resolutions of 8/10/12 bits, respectively. Data is written via a 2-wire serial interface. The devices operate from single supplies of 2.5 V to 5.5 V and the output buffer amplifiers provide rail-to-rail output swing with a slew rate of 0.7 V/μs. The power supply (V
) acts as the
DD
reference to the DAC. The AD5301/AD5311/AD5321 have three programmable power-down modes, in which the DAC can be turned off completely with a high impedance output, or the output can be pulled low by an on-chip resistor (see the Power-Down Modes section).

DIGITAL-TO-ANALOG

The architecture of the DAC channel consists of a resistor string DAC followed by an output buffer amplifier. The voltage at the V
pin provides the reference voltage for the DAC. Figure 24
DD
shows a block diagram of the DAC architecture. Since the input coding to the DAC is straight binary, the ideal output voltage is given by
DV
×
DD
V
=
OUT
where:
N = DAC resolution D = decimal equivalent of the binary code that is loaded to the
DAC register:
0–255 for AD5301 (8 bits) 0–1023 for AD5311 (10 bits) 0–4095 for AD5321 (12 bits)
DAC
REGISTER
N
2
DD
REF(+)
RESISTOR
STRING
REF(–)
GND
Figure 24. DAC Channel Architecture
OUTPUT BUFFER
AMPLIFIER
V
OUT
00927-024

RESISTOR STRING

The resistor string section is shown in Figure 25. It is simply a string of resistors, each with a value of R. The digital code loaded to the DAC register determines at what node on the string the voltage is tapped off to be fed into the output ampli­fier. The voltage is tapped off by closing one of the switches connecting the string to the amplifier. Because it is a string of resistors, it is guaranteed monotonic over all codes.
R
R
R
R
R
Figure 25. Resistor String
TO OUTPUT AMPLIFIER
00927-025

OUTPUT AMPLIFIER

The output buffer amplifier is capable of generating output volt­ages to within 1 mV from either rail, which gives an output range of 0.001 V to V 2 kΩ to GND and V
− 0.001 V. It is capable of driving a load of
DD
, in parallel with 500 pF to GND. The
DD
source and sink capabilities of the output amplifier can be seen in
Figure 14.
The slew rate is 0.7 V/μs with a half-scale settling time to ±0.5 LSB (at 8 bits) of 6 μs with the output unloaded.

POWER-ON RESET

The AD5301/AD5311/AD5321 are provided with a power-on reset function, ensuring that they power up in a defined state.
The DAC register is filled with zeros and remains so until a valid write sequence is made to the device. This is particularly useful in applications where it is important to know the state of the DAC output while the device is powering up.
Rev. B | Page 13 of 24
Page 14
AD5301/AD5311/AD5321

SERIAL INTERFACE

2-WIRE SERIAL BUS

The AD5301/AD5311/AD5321 are controlled via an I2C­compatible serial bus. The DACs are connected to this bus as slave devices (no clock is generated by the AD5301/AD5311/ AD5321 DACs).
The AD5301/AD5311/AD5321 has a 7-bit slave address. In the case of the 6-lead device, the six MSBs are 000110 and the LSB is determined by the state of the A0 pin. In the case of the 8-lead device, the five MSBs are 00011 and the two LSBs are determined by the state of the A0 and A1 pins. A1 and A0 allow the user to use up to four of these DACs on one bus.
The 2-wire serial bus protocol operates as follows:
1. The master initiates data transfer by establishing a start
condition, which is when a high-to-low transition on the SDA line occurs while SCL is high. The following byte is the address byte that consists of the 7-bit slave address
W
followed by an R/ is read from or written to the slave device).
The slave whose address corresponds to the transmitted address responds by pulling the SDA line low during the ninth clock pulse (this is termed the acknowledge bit). At this stage, all other devices on the bus remain idle while the selected device waits for data to be written to or read from its serial register. If the R/
from the slave device. However, if the R/ master writes to the slave device.
2. Data is transmitted over the serial bus in sequences of nine
clock pulses (eight data bits followed by an acknowledge bit). The transitions on the SDA line must occur during the low period of SCL and remain stable during the high period of SCL.
3. When all data bits have been read or written, a stop con-
dition is established by the master. A stop condition is defined as a low-to-high transition on the SDA line while
bit (this bit determines whether data
W
bit is high, the master reads
W
bit is low, the
XX XXXX
X X PD1 PD0 D11 D10 D9 D8 D7 D6 D4D5 D3 D2 D1 D0
PD1 PD0 D7 D6 D5 D4 D3 D2 D1 D0
Figure 26. AD5301 Input Shift Register Contents
D7D8 D6 D5X X D1 D0 X XPD1 PD0 D9 D4 D3 D2
Figure 27. AD5311 Input Shift Register Contents
Figure 28. AD5321 Input Shift Register Contents
DATA BITS
DATA BITS
SCL is high. In write mode, the master pulls the SDA line
th
high during the 10
clock pulse to establish a stop condi­tion. In read mode, the master issues a no acknowledge for the ninth clock pulse (that is, the SDA line remains high). The master then brings the SDA line low before the 10 clock pulse and then high during the 10
th
clock pulse to
th
establish a stop condition.
In the case of the AD5301/AD5311/AD5321, a write operation contains two bytes whereas a read operation may contain one or two bytes. See Figure 29 to Figure 34 for a graphical explanation of the serial interface.
A repeated write function gives the user flexibility to update the DAC output a number of times after addressing the part only once. During the write cycle, each multiple of two data bytes updates the DAC output. For example, after the DAC acknowl­edges its address byte, and receives two data bytes; the DAC output updates after the two data bytes, if another two data bytes are written to the DAC while it is still the addressed slave device. These data bytes also cause an output update. A repeat read of the DAC is also allowed.

INPUT SHIFT REGISTER

The input shift register is 16 bits wide. Figure 26, Figure 27, and Figure 28 illustrate the contents of the input shift register for each part. Data is loaded into the device as a 16-bit word under the control of a serial clock input, SCL. The timing diagram for this operation is shown in Figure 2. The 16-bit word consists of four control bits followed by 8/10/12 bits of data, depending on the device type. MSB (Bit 15) is loaded first. The first two bits are don’t cares. The next two are control bits that control the mode of operation of the device (normal mode or any one of three power-down modes). See the Power-Down Modes section for a complete description. The remaining bits are left justified DAC data bits, starting with the MSB and ending with the LSB.
DB0 (LSB)DB15 (MSB)
0927-026
DB0 (LSB)DB15 (MSB)
0927-037
DB0 (LSB)DB15 (MSB)
DATA BITS
00927-038
Rev. B | Page 14 of 24
Page 15
AD5301/AD5311/AD5321
SDA
SDA
A
A

WRITE OPERATION

When writing to the AD5301/AD5311/AD5321 DACs, the user must begin with an address byte, after which the DAC acknowledges that it is prepared to receive data by pulling
SCL
SDA low. This address byte is followed by the 16-bit word in the form of two control bytes. The write operations for the three DACs are shown in
Figure 29 to Figure 31.
0A1*A00011
START
COND
BY
MASTER
SCL
D3 D2 D1 D0 X X X X
LEAST SI GNIFICANT CONTROL BYTE
*THIS BIT MUST BE 0 IN T HE 6-LEAD SO T-23 VERSI ON.
R/W
ACK
BY
AD5301
ACK
BY
AD5301
PD1XX PD0 D7 D6 D5 D4
MOST SI GNIFICANT CONTROL BYTEADDRESS BYTE
STOP
COND
BY
MASTER
ACK
BY
AD5301
0927-027
Figure 29. AD5301 Write Sequence
SCL
SD
SCL
SD
*THIS BIT MUST BE 0 IN T HE 6-LEAD SO T-23 VERSI ON.
0A1*A00011
START
COND
BY
MASTER
D5 D4 D3 D2 D1 D0 X X
LEAST SIGNIFICANT CONTROL BYT E
R/W
ACK
BY
AD5311
ACK
BY
AD5311
PD1XX PD0 D9 D8 D7 D6
MOST SI GNIFICANT CONTROL BYTEADDRESS BYTE
STOP
COND
BY
MASTER
ACK
BY
AD5311
00927-028
Figure 30. AD5311 Write Sequence
SCL
SDA
SCL
SDA
*THIS BIT MUST BE 0 IN THE 6-LEAD SOT-23 VERSION.
0A1*A000 11
START
COND
BY
MASTER
D7 D6 D5 D4 D3 D2 D1 D0
LEAST SIG NIFICANT CONTROL BY TE
R/W
ACK
BY
AD5321
ACK
BY
AD5321
PD1XX PD0 D11 D10 D9 D8
MOST SIG NIFICANT CONTROL BYTEADDRESS BYTE
STOP
COND
BY
MASTER
ACK
BY
AD5321
00927-029
Figure 31. AD5321 Write Sequence
Rev. B | Page 15 of 24
Page 16
AD5301/AD5311/AD5321
A
A

READ OPERATION

When reading data back from the AD5301/AD5311/AD5321 DACs, the user must begin with an address byte after which the DAC acknowledges that it is prepared to transmit data by pulling SDA low. There are two different read operations. In the case of the AD5301, the readback is a single byte that consists of
SCL
the eight data bits in the DAC register. However, in the case of the AD5311 and AD5321, the readback consists of two bytes that contain both the data and the power-down mode bits. The read operations for the three DACs are shown in
Figure 32 to
Figure 34.
SDA
*THIS BIT MUST BE 0 IN T HE 6-LEAD SO T-23 VERSI ON.
00011
START
COND
BY
MASTER
ADDRESS BYTE
A1* A0 R/W
D7 D6 D5 D4 D3 D2 D1 D0
ACK
BY
AD5301
DATA BYTE
NO ACK
BY
MASTER
STOP COND
BY
MASTER
00927-030
Figure 32. AD5301 Readback Sequence
SCL
SDA
START
COND
BY
MASTER
SCL
SDA
*THIS BIT MUST BE 0 IN THE 6-LEAD SO T-23 VERSION.
D5 D4 D3 D2 D1 D0 X X
LEAST SIGNIFICANT CONTROL BYTE
ACK
BY
AD5311
NO ACK
BY
MASTER
MOST SI GNIFICANT BYTEADDRESS BYTE
STOP
COND
BY
MASTER
PD1XX PD0 D9 D8 D7 D60A1*A00011 R/W
ACK
BY
AD5311
00927-031
Figure 33. AD5311 Readback Sequence
SCL
SD
START
COND
BY
MASTER
0
0011
ADDRESS BYTE
A1* A0 R/W
ACK
BY
AD5321
X X PD1 PD0 D11 D10 D9 D8
MOST SII GNIFICANT BYTE
STOP
COND
BY
MASTER
SCL
SD
*THIS BIT MUST BE 0 IN T HE 6-LEAD SO T-23 VERSIO N.
D7 D6 D5 D4 D3 D2 D1 D0
LEAST SIG NIFICANT BYTE
NO ACK
BY
MASTER
STOP COND
BY
MASTER
00927-032
Figure 34. AD5321 Readback Sequence
Rev. B | Page 16 of 24
Page 17
AD5301/AD5311/AD5321

POWER-DOWN MODES

The AD5301/AD5311/AD5321 have very low power consump­tion, dissipating typically 0.36 mW with a 3 V supply and 0.75 mW with a 5 V supply. Power consumption can be further reduced when the DAC is not in use by putting it into one of three power-down modes, which are selected by Bit 13 and Bit 12 (PD1 and PD0) of the control word. the bits corresponds to the mode of operation of the DAC.
Table 6. PD1 and PD0 Operating Modes
PD1 PD0 Operating Mode
0 0 Normal operation 0 1 Power-down (1 kΩ load to GND) 1 0 Power-down (100 kΩ load to GND) 1 1 Power-down (three-state output)
The software power-down modes programmed by PD1 and PD0 may be overridden by the Taking this pin low puts the DAC into three-state power-down mode. If
PD
is not used, tie it high.
When both bits are set to 0, the DAC works normally with its normal power consumption of 150 μA at 5 V, while for the three power-down modes, the supply current falls to 200 nA at 5 V (50 nA at 3 V). Not only does the supply current drop, but the
Table 6 shows how the state of
PD
pin on the 8-lead version.
output stage is also internally switched from the output of the amplifier to a resistor network of known values. This has the advantage that the output impedance of the part is known while the part is in power-down mode and provides a defined input condition for whatever is connected to the output of the DAC amplifier. There are three different options. The output is con­nected internally to GND through a 1 kΩ resistor, a 100 kΩ resistor, or it is left three-stated. Resistor tolerance = ±20%. The output stage is illustrated in
REGISTE R
STRING DAC
POWER-DOWN
CIRCUITRY
Figure 35. Output Stage During Power-Down
Figure 35.
AMPLIFIER
RESISTOR NETWORK
V
OUT
00927-033
The bias generator, the output amplifier, the resistor string, and all other associated linear circuitry are shut down when the power-down mode is activated. However, the contents of the DAC register are unchanged when in power-down. The time to exit power-down is typically 2.5 μs for V V
= 3 V (see Figure 21).
DD
= 5 V and 6 μs when
DD
Rev. B | Page 17 of 24
Page 18
AD5301/AD5311/AD5321

APPLICATIONS NOTES

USING REF19x AS A POWER SUPPLY

Because the supply current required by the AD5301/AD5311/ AD5321 is extremely low, the user has an alternative option to employ a reference (for 3 V) to supply the required voltage to the part (see
This is especially useful if the power supply is quite noisy or if the system supply voltages are at some value other than 5 V or 3 V (for example, 15 V). The supply voltage for the AD5301/AD5311/AD5321. If the low dropout to the AD5301/AD5311/AD5321. This is with no load on the output of the DAC. When the DAC output is loaded, the also needs to supply the current to the load.
The total current required (with a 2 kΩ load on the DAC output and full scale loaded to the DAC) is
The load regulation of the which results in an error of 5.3 ppm (26.5 μV) for the 2.65 mA current drawn from it. This corresponds to a 0.00136 LSB error.

BIPOLAR OPERATION USING THE AD5301/ AD5311/AD5321

The AD5301/AD5311/AD5321 has been designed for single­supply operation, but a bipolar output range is also possible using the circuit in voltage range of ±5 V. Rail-to-rail operation at the amplifier output is achievable using an amplifier.
REF195 voltage reference (for 5 V) or a REF193 voltage
Figure 36).
REF195
2-WIRE
SDA
SERIAL
INTERFACE
Figure 36. REF195 as Power Supply to AD5301/AD5311/AD5321
SCL
5V
V
AD5301/ AD5311/ AD5321
DD
150µA TYP
V
OUT
= 0V TO 5V
REF193/REF195 output a steady
REF195 is used, it needs to supply a current of 150 μA
REF195
150 μA + (5 V/2 kΩ) = 2.65 mA
REF195 is typically 2 ppm/mA,
Figure 37. The circuit below gives an output
AD820 or an OP295 as the output
00927-034
R2
10k
R1
10k
+5V
AD5301/ AD5311/
AD5321
V
10µF 0.1µF
Figure 37. Bipolar Operation with the AD5301/AD5311/AD5321
DD
2-WIRE SERIAL
INTERFACE
V
OUT
+5V
–5V
AD820/ OP295
±5V
The output voltage for any input code can be calculated as
= [(VDD × (D/2N) × R1 + R2)/R1) − VDD × (R2/R1)]
V
OUT
where:
D is the decimal equivalent of the code loaded to the DAC. N is the DAC resolution.
With V
= 5 V, R1 = R2 = 10 kΩ,
DD
V
= (10 × D/2N) − 5 V
OUT

MULTIPLE DEVICES ON ONE BUS

Figure 38 shows four AD5301 devices on the same serial bus. Each has a different slave address since the state of their A0 and A1 pins is different. This allows each DAC to be written to or read from independently. The master device output bus line drivers are open-drain, pull-downs in a fully I
2
C-compatible
interface.

CMOS DRIVEN SCL AND SDA LINES

For single or multisupply systems where the minimum SCL swing requirements allow it, a CMOS SCL driver may be used, and the SCL pull-up resistor can be removed, making the SCL bus line fully CMOS compatible. This reduces power consump­tion in both the SCL driver and receiver devices. The SDA line remains open-drain, I
Further changes, in the SDA line driver, may be made to make the system more CMOS compatible and save more power. As the SDA line is bidirectional, it cannot be made fully CMOS compatible. A switched pull-up resistor can be combined with a CMOS device with an open-circuit (three-state) input such that the CMOS SDA driver is enabled during write cycles and
2
I
C mode is enabled during shared cycles, that is, readback,
acknowledge bit cycles, start conditions, and stop conditions.
2
C compatible.
00927-035
Rev. B | Page 18 of 24
Page 19
AD5301/AD5311/AD5321
V

POWER SUPPLY DECOUPLING

In any circuit where accuracy is important, careful considera­tion of the power supply and ground return layout helps to ensure the rated performance. The AD5301/AD5311/AD5321 should be decoupled to GND with 10 μF in parallel with a
0.1 μF capacitor, located as close to the package as possible. The 10 μF capacitor should be the tantalum bead type, while
5
R
MASTER
R
P
P
a ceramic 0.1 μF capacitor provides a sufficient low impedance path to ground at high frequencies. The power supply lines of the AD5301/AD5311/AD5321 should use as large a trace as possible to provide low impedance paths. A ground line routed between the SDA and SCL lines helps reduce crosstalk between them. This is not required on a multilayer board as there is a ground plane layer, but separating the lines helps.
SDA
SCL
A1
A0
AD5301
V
DD
V
OUT
A1
V
A0
AD5301
OUT
V
DD
A1
V
A0
OUT
AD5301
V
DD
SDASCLSDASCLSDASCLSDA A1
A0
SCL
V
OUT
AD5301
00927-036
Figure 38. Multiple AD5301 Devices on One Bus
Rev. B | Page 19 of 24
Page 20
AD5301/AD5311/AD5321

OUTLINE DIMENSIONS

2.90 BSC
4526
1.60 BSC
PIN 1
INDICATOR
1.30
1.15
0.90
0.15 MAX
1 3
1.90 BSC
0.50
0.30
2.80 BSC
0.95 BSC
1.45 MAX
SEATING PLANE
0.22
0.08 10°
0.60
0.45
0.30
COMPLIANT TO JEDEC STANDARDS MO-178-AB
Figure 39. 6-Lead Small Outline Transistor Package [SOT-23]
(RJ-6)
Dimensions shown in millimeters
3.20
3.00
2.80
8
5
4
SEATING PLANE
5.15
4.90
4.65
1.10 MAX
0.23
0.08
8° 0°
0.80
0.60
0.40
3.20
3.00
1
2.80
PIN 1
0.65 BSC
0.95
0.85
0.75
0.15
0.38
0.00
0.22
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 40. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
Rev. B | Page 20 of 24
Page 21
AD5301/AD5311/AD5321

ORDERING GUIDE

Model Temperature Range Package Description Package Option Branding
AD5301BRM –40°C to +105°C 8-Lead MSOP RM-8 D8B AD5301BRM-REEL –40°C to +105°C 8-Lead MSOP RM-8 D8B AD5301BRM-REEL7 –40°C to +105°C 8-Lead MSOP RM-8 D8B AD5301BRMZ AD5301BRMZ-REEL AD5301BRMZ-REEL7 AD5301BRT-500RL7 –40°C to +105°C 6-Lead SOT-23 RJ-6 D8B AD5301BRT-REEL –40°C to +105°C 6-Lead SOT-23 RJ-6 D8B AD5301BRT-REEL7 –40°C to +105°C 6-Lead SOT-23 RJ-6 D8B AD5301BRTZ-500RL7 AD5301BRTZ-REEL AD5301BRTZ-REEL7 AD5311BRM –40°C to +105°C 8-Lead MSOP RM-8 D9B AD5311BRM-REEL –40°C to +105°C 8-Lead MSOP RM-8 D9B AD5311BRM-REEL7 –40°C to +105°C 8-Lead MSOP RM-8 D9B AD5311BRMZ AD5311BRMZ-REEL AD5311BRMZ-REEL7 AD5311BRT-500RL7 –40°C to +105°C 6-Lead SOT-23 RJ-6 D9B AD5311BRT-REEL –40°C to +105°C 6-Lead SOT-23 RJ-6 D9B AD5311BRT-REEL7 –40°C to +105°C 6-Lead SOT-23 RJ-6 D9B AD5311BRTZ-500RL7 AD5311BRTZ-REEL AD5311BRTZ-REEL7 AD5321BRM –40°C to +105°C 8-Lead MSOP RM-8 DAB AD5321BRM-REEL –40°C to +105°C 8-Lead MSOP RM-8 DAB AD5321BRM-REEL7 –40°C to +105°C 8-Lead MSOP RM-8 DAB AD5321BRMZ AD5321BRMZ-REEL AD5321BRMZ-REEL7 AD5321BRT-500RL7 –40°C to +105°C 6-Lead SOT-23 RJ-6 DAB AD5321BRT-REEL –40°C to +105°C 6-Lead SOT-23 RJ-6 DAB AD5321BRT-REEL7 –40°C to +105°C 6-Lead SOT-23 RJ-6 DAB AD5321BRTZ-500RL7 AD5321BRTZ-REEL AD5321BRTZ-REEL7
1
Z = RoHS Compliant Part; # denotes RoHS Compliant product, may be top or bottom marked.
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
–40°C to +105°C 8-Lead MSOP RM-8 D8B# –40°C to +105°C 8-Lead MSOP RM-8 D8B# –40°C to +105°C 8-Lead MSOP RM-8 D8B#
–40°C to +105°C 6-Lead SOT-23 RJ-6 D8B# –40°C to +105°C 6-Lead SOT-23 RJ-6 D8B# –40°C to +105°C 6-Lead SOT-23 RJ-6 D8B#
–40°C to +105°C 8-Lead MSOP RM-8 D9B# –40°C to +105°C 8-Lead MSOP RM-8 D9B# –40°C to +105°C 8-Lead MSOP RM-8 D9B#
–40°C to +105°C 6-Lead SOT-23 RJ-6 D9B# –40°C to +105°C 6-Lead SOT-23 RJ-6 D9B# –40°C to +105°C 6-Lead SOT-23 RJ-6 D9B#
–40°C to +105°C 8-Lead MSOP RM-8 DAB# –40°C to +105°C 8-Lead MSOP RM-8 DAB# –40°C to +105°C 8-Lead MSOP RM-8 DAB#
–40°C to +105°C 6-Lead SOT-23 RJ-6 DAB# –40°C to +105°C 6-Lead SOT-23 RJ-6 DAB# –40°C to +105°C 6-Lead SOT-23 RJ-6 DAB#
Rev. B | Page 21 of 24
Page 22
AD5301/AD5311/AD5321
NOTES
Rev. B | Page 22 of 24
Page 23
AD5301/AD5311/AD5321
NOTES
Rev. B | Page 23 of 24
Page 24
AD5301/AD5311/AD5321
NOTES
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent Rights to use these components in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.
©1999–2007 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D00927-0-3/07(B)
Rev. B | Page 24 of 24
Loading...