Datasheet AD5174 Datasheet (ANALOG DEVICES)

Page 1
Single-Channel, 1024-Position, Digital Rheostat
V

FEATURES

Single-channel, 1024-position resolution 10 kΩ nominal resistance 50-times programmable (50-TP) wiper memory Rheostat mode temperature coefficient: 35 ppm/°C
2.7 V to 5.5 V single-supply operation ±2.5 V to ±2.75 V dual-supply operation for ac or bipolar
operations SPI-compatible interface Wiper setting and memory readback Power on refreshed from memory Resistor tolerance stored in memory Thin LFCSP 10-lead, 3 mm × 3 mm× 0.8 mm package Compact MSOP, 10-lead, 3 mm × 4.9 mm × 1.1 mm package

APPLICATIONS

Mechanical rheostat replacements Op-amp: variable gain control Instrumentation: gain, offset adjustment Programmable voltage-to-current conversions Programmable filters, delays, time constants Programmable power supply Sensor calibration
with SPI Interface and 50-TP Memory
AD5174

FUNCTIONAL BLOCK DIAGRAM

DD
POWER-ON
SCLK
SYNC
DIN
SDO
RESET
SPI
SERIAL
INTERFACE
V
SS
REGISTER
10
50-TP
MEMORY
BLOCK
EXT_CAP GND
Figure 1.
AD5174
RDAC
A
W
08718-001

GENERAL DESCRIPTION

The AD5174 is a single-channel, 1024-position digital rheostat that combines industry leading variable resistor performance with nonvolatile memory (NVM) in a compact package.
This device supports both dual-supply operation at ±2.5 V to ±2.75 V and single-supply operation at 2.7 V to 5.5 V and offers 50-times programmable (50-TP) memory.
The AD5174 device wiper settings are controllable through the SPI digital interface. Unlimited adjustments are allowed before programming the resistance value into the 50-TP memory. The AD5174 does not require any external voltage supply to facili­tate fuse blow and there are 50 opportunities for permanent programming. During 50-TP activation, a permanent blow fuse command freezes the resistance position (analogous to placing epoxy on a mechanical rheostat).
The AD5174 is available in a 3 mm × 3mm 10-lead LFCSP package and in a 10-lead MSOP package. The part is guaranteed to operate over the extended industrial temperature range of
−40°C to +125°C.
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2010 Analog Devices, Inc. All rights reserved.
Page 2
AD5174

TABLE OF CONTENTS

Features.............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Electrical Characteristics ............................................................. 3
Interface Timing Specifications.................................................. 4
Absolute Maximum Ratings............................................................ 6
Thermal Resistance ...................................................................... 6
ESD Caution.................................................................................. 6
Pin Configuration and Function Descriptions............................. 7
Typical Performance Characteristics ............................................. 8
Test Circuits..................................................................................... 11
Theory of Operation ...................................................................... 12
Serial Data Interface................................................................... 12
Shift Register............................................................................... 12
RDAC Register............................................................................ 12
50-TP Memory Block ................................................................ 12
Write Protection ......................................................................... 12
RDAC and 50-TP Read Operation .......................................... 13
Shutdown Mode ......................................................................... 14
Reset ............................................................................................. 14
SDO Pin and Daisy-Chain Operation..................................... 15
RDAC Architecture.................................................................... 16
Programming the Variable Resistor......................................... 16
EXT_CAP Capacitor.................................................................. 17
Terminal Voltage Operating Range ......................................... 17
Power-Up Sequence ................................................................... 17
Outline Dimensions....................................................................... 18
Ordering Guide .......................................................................... 18

REVISION HISTORY

12/10—Rev. A to Rev. B
Changes to SDO Pin Description................................................... 7
Changes to SDO Pin and Daisy-Chain Operation Section....... 15
7/10—Rev. 0 to Rev. A
Changes to Daisy-Chain Operation Section including Changing
Title to SDO Pin and Daisy-Chain Operation Section ............. 15
Added Table 11 ...............................................................................15
Changes to Ordering Guide.......................................................... 18
3/10—Revision 0: Initial Version
Rev. B | Page 2 of 20
Page 3
AD5174

SPECIFICATIONS

ELECTRICAL CHARACTERISTICS

VDD = 2.7 V to 5.5 V, VSS = 0 V; VDD = 2.5 V to 2.75 V, VSS = −2.5 V to −2.75 V; −40°C < TA < 125°C, unless otherwise noted.
Table 1.
Parameter Symbol Test Conditions/Comments Min Typ1 Max Unit
DC CHARACTERISTICS—RHEOSTAT MODE
Resolution 10 Bits
Resistor Integral Nonlinearity
|VDD − VSS| = 3.3 V to 3.6 V −1 +1.5 LSB
|VDD − VSS| = 2.7 V to 3.3 V −2.5 +2.5 LSB Resistor Differential Nonlinearity2 R-DNL Nominal Resistor Tolerance ±15 % Resistance Temperature Coefficient Wiper Resistance Code = zero scale 35 70 Ω
RESISTOR TERMINALS
Terminal Voltage Range Capacitance A4 f = 1 MHz, measured to GND, code = half scale 90 pF Capacitance W4 f = 1 MHz, measured to GND, code = half scale 40 pF Common-Mode Leakage Current4 V
DIGITAL INPUTS
Input Logic4
High V
Low V Input Current IIN ±1 μA Input Capacitance4 C
DIGITAL OUTPUT
Output Voltage4
High VOH R
Low VOL R V V Tristate Leakage Current −1 +1 μA Output Capacitance4 5 pF
POWER SUPPLIES
Single-Supply Power Range VSS = 0 V 2.7 5.5 V Dual-Supply Power Range ±2.5 ±2.75 V Supply Current
Positive IDD 1 μA
Negative ISS −1 μA 50-TP Store Current
Positive I
Negative I 50-TP Read Current
4, 8
Positive I
Negative I Power Dissipation9 P Power Supply Rejection Ratio4 PSRR ΔVDD/ΔVSS = ±5 V ± 10% −50 −55 dB
2, 3
R-INL |VDD − VSS| = 3.6 V to 5.5 V −1 +1 LSB
4, 5
Code = full scale 35 ppm/°C
4, 6
V
4, 7
V
TERM
= VW 50 nA
A
2.0 V
INH
0.8 V
INL
5 pF
IN
= 2.2 kΩ to VDD V
PULL_UP
= 2.2 kΩ to VDD
PULL_UP
= 2.7 V to 5.5 V, VSS = 0 V 0.4 V
DD
= 2.5 V to 2.75 V, VSS = −2.5 V to −2.75 V 0.6 V
DD
DD_OTP_STORE
SS_OTP_STORE
4 mA
−4 mA
−1 +1 LSB
V
SS
− 0.1 V
DD
V
DD
DD_OTP_READ
SS_OTP_READ
DISS
500 μA
−500 μA
VIH = VDD or VIL = GND 5.5 μW
Rev. B | Page 3 of 20
Page 4
AD5174
Parameter Symbol Test Conditions/Comments Min Typ1 Max Unit
DYNAMIC CHARACTERISTICS
Bandwidth −3 dB, RAW = 5 kΩ, Terminal W, see Figure 24 700 kHz Total Harmonic Distortion VA = 1 V rms, f = 1 kHz, RAW = 5 kΩ −90 dB Resistor Noise Density RWB = 5 kΩ, TA = 25°C, f = 10 kHz 13 nV/√Hz
1
Typical specifications represent average readings at 25°C, VDD = 5 V, and VSS = 0 V.
2
Resistor position nonlinearity error (R-INL) is the deviation from an ideal value measured between the maximum resistance and the minimum resistance wiper
positions. R-DNL measures the relative step change from the ideal between successive tap positions.
3
The maximum current in each code is defined by IAW = (VDD − 1)/RAW.
4
Guaranteed by design and not subject to production test.
5
See Figure 9 for more details.
6
Resistor Terminal A and Resistor Terminal W have no limitations on polarity with respect to each other. Dual-supply operation enables ground referenced bipolar
signal adjustment.
7
Different from operating current; the supply current for the fuse program lasts approximately 55 ms.
8
Different from operating current; the supply current for the fuse read lasts approximately 500 ns.
9
P
is calculated from (IDD × VDD) + (ISS × VSS).
DISS
10
All dynamic characteristics use VDD = +2.5 V, VSS = −2.5 V.

INTERFACE TIMING SPECIFICATIONS

VDD = 2.7 V to 5.5 V, VSS = 0 V; VDD = 2.5 V, VSS = −2.5 V; all specifications T
Table 2.
Parameter Limit1 Unit Test Conditions/Comments
2
t
20 ns min SCLK cycle time
1
t2 10 ns min SCLK high time t3 10 ns min SCLK low time t4 15 ns min
t5 5 ns min Data setup time t6 5 ns min Data hold time t7 1 ns min
3
t
400 ns min
8
t9 15 ns min
4
t
450 ns max SCLK rising edge to SDO valid
10
t
MEMORY_READ
t
MEMORY_PROGRAM
t
RESET
t
POWER-UP
1
All input signals are specified with tr = tf = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
2
Maximum SCLK frequency is 50 MHz.
3
Refer to t
4
R
PULL_UP
5
Maximum time after VDD − VSS is equal to 2.5 V.
6 μs max Memory readback execute time
350 ms max Memory program time
600 μs max Reset OTP restore time
5
2 ms max Power-on 50-TP restore time
and
MEMORY_READ
= 2.2 kΩ to VDD with a capacitance load of 168 pF.
t
MEMORY_PROGRAM
4, 10
to SCLK falling edge setup time
SYNC
SCLK falling edge to SYNC Minimum SYNC
rising edge to next SCLK fall ignored
SYNC
for memory commands operations.
MIN
high time
to T
rising edge
, unless otherwise noted.
MAX
Rev. B | Page 4 of 20
Page 5
AD5174

Shift Register and Timing Diagrams

DB9 (MSB) DB0 (LSB)
C0C1
D9
D7 D6 D5 D4 D3
D8
DATA BITS
Figure 2. Shift Register Content
t
5
D2 D1
t
6
D0
08718-002
t
7
t
9
SCLK
SYNC
DIN
C3
00
t
4
t
8
t
2
t
3
0 0 C3 C2 D7 D6 D5 D2 D1 D0
C2
CONTROL BITS
t
1
SDO
SCLK
SYNC
DIN
SDO
Figure 3. Write Timing Diagram, CPOL=0, CPHA = 1
00 00C3 C3
X X C3 D1 D0
Figure 4. Read Timing Diagram, CPOL=0, CPHA = 1
08718-003
t
9
D1 D0D0 D0
t
10
08718-004
Rev. B | Page 5 of 20
Page 6
AD5174

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.
Table 3.
Parameter Rating
VDD to GND –0.3 V to +7.0 V VSS to GND +0.3 V to −7.0 V VDD to VSS 7 V VA, VW to GND VSS − 0.3 V, VDD + 0.3 V Digital Input and Output Voltage to GND −0.3 V to VDD + 0.3 V EXT_CAP to VSS 7 V IA, IW
Pulsed1
Frequency > 10 kHz ±6 mA/d2 Frequency ≤ 10 kHz ±6 mA/√d2
Continuous ±6 mA Operating Temperature Range3 −40°C to +125°C Maximum Junction Temperature
(T
Maximum)
J
150°C
Storage Temperature Range −65°C to +150°C Reflow Soldering
Peak Temperature 260°C
Time at Peak Temperature 20 sec to 40 sec Package Power Dissipation (TJ max − TA)/θJA
1
Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum applied voltage across any two of the A and W terminals at a given resistance.
2
Pulse duty factor.
3
Includes programming of 50-TP memory.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

θJA is defined by JEDEC specification JESD-51 and the value is dependent on the test board and test environment.
Table 4. Thermal Resistance
Package Type θ
10-Lead LFCSP 50 3 °C/W 10-Lead MSOP 135 N/A °C/W
1
JEDEC 2S2P test board, still air (0 m/sec airflow).

ESD CAUTION

1
θJC Unit
JA
Rev. B | Page 6 of 20
Page 7
AD5174
1
2
3
4

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

10 9 8 7 6
SYNC
SCLK DIN SDO GND
SS
.
08718-103
VDD1
2
V
V
EXT_CAP
DD
A
W
SS
1
AD5174
2 3
TOP VIEW
4
(Not to Scale)
5
A
10
SYNC
9
SCLK
8
DIN
7
SDO
6
GND
08718-005
W
V
SS
EXT_CAP
*LEAVE FLOATING O R CONNECTED TO V
AD5174
3
(EXPOSED
4 5
PAD)*
Figure 5. MSOP Pin Configuration Figure 6. LFCSP Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1 VDD Positive Power Supply. Decouple this pin with 0.1 μF ceramic capacitors and 10 μF capacitors. 2 A Terminal A of RDAC. VSS ≤ VA ≤ VDD. 3 W Wiper Terminal of RDAC. VSS ≤ VW ≤ VDD. 4 VSS
Negative Supply. Connect to 0 V for single-supply applications. Decouple this pin with 0.1 μF ceramic capacitors and 10 μF capacitors.
5 EXT_CAP
External Capacitor. Connect a 1 μF capacitor between EXT_CAP and V
. This capacitor must have a voltage
SS
rating of ≥7 V. 6 GND Ground Pin, Logic Ground Reference. 7 SDO
Serial Data Output. This pin can be used to clock data from the shift register in daisy-chain mode or in readback
mode. This open-drain output requires an external pull-up resistor even if it is not use. 8 DIN
Serial Data Line. This pin is used in conjunction with the SCLK line to clock data into or out of the 16-bit
input register. 9 SCLK
Serial Clock Input. Data is clocked into the shift register on the falling edge of the serial clock input. Data can be
transferred at rates of up to 50 MHz. 10
Falling Edge Synchronization Signal. This is the frame synchronization signal for the input data. When SYNC
SYNC
goes low, it enables the shift register and data is transferred in on the falling edges of the subsequent clocks.
The selected register is updated on the rising edge of SYNC following the 16th clock cycle. If SYNC is taken
high before the 16th clock cycle, the rising edge of SYNC acts as an interrupt, and the write sequence is ignored
by the RDAC. EPAD Exposed Pad Leave floating or connected to VSS
Rev. B | Page 7 of 20
Page 8
AD5174

TYPICAL PERFORMANCE CHARACTERISTICS

0.8
0.6
0.4
+25°C –40°C +125°C
1.0
0.8
VDD/VSS = 5V/0V
0.2
0
INL (LSB)
–0.2
–0.4
–0.6
0 128 256 384 512 640 768 896 1023
CODE (Decimal)
Figure 7. R-INL vs. Code vs. Temperature
0.4
0.3
0.2
0.1
0
DNL (LSB)
–0.1
–0.2
–0.3
+25°C –40°C +125°C
0 128 256 384 512 640 768 896 1023
CODE (Decimal)
Figure 8. R-DNL vs. Code vs. Temperature
700
600
500
400
300
200
100
RHEOSTAT MO DE T EMPCO (ppm/ °C)
VDD/VSS = 5V/0V
0.6
0.4
CURRENT (mA)
0.2
0
08718-014
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VOLTAGE (V)
Figure 10. Supply Current (I
) vs. Digital Input Voltage
DD
8718-023
500
400
300
200
100
0
–100
CURRENT (nA)
–200
–300
–400
–500
–40 –30 –20 –10 0 20 30 40 50 60 70 80 90 100 11010
08718-015
ISS = 3V
TEMPERATURE (°C)
Figure 11. Supply Current (I
IDD = 5V
IDD = 3V
ISS = 5V
, ISS) vs. Temperature
DD
08718-018
7
6
5
(mA)
4
WA_MAX
3
2
THEORETI CAL l
1
VDD/VSS = 5V/0V
0
0 128 256 384 512 640 768 896 1023
CODE (Decimal)
Figure 9. Tempco ΔR
/ΔT vs. Code
WA
08718-019
Rev. B | Page 8 of 20
0
0 1023850765 935680510 595340 425170 25585
CODE (Decimal )
Figure 12. Theoretical Maximum Current vs. Code
08718-028
Page 9
AD5174
20
GAIN (dB)
0
0x200
–5
–10
0x100
–15
0x080
–20
0x040
–25
0x020
–30
0x010
–35
0x008
–40
0x004 0x002
–45
0x001
–50
1 10M1M100k10k1k10010
FREQUENCY (Hz)
Figure 13. Bandwidth vs. Frequency vs. Code
VDD/VSS = 5V/0V
PSRR (dB)
08718-031
VDD/VSS = 5V/0V
–25
CODE = HALF SCALE
–30
–35
–40
–45
–50
–55
–60
10 100 1M100k10k1k
Figure 16. PSRR vs. Frequency
FREQUENCY (Hz)
08718-024
0
V
= ±2.5V
DD/VSS
CODE = HALF S CAL E f
= 1V rms
IN
–20
NOISE BW = 22kHz
–40
–60
THD + N (dB)
–80
–100
–120
10 100 1k 10k
FREQUENCY (Hz)
Figure 14. THD + N vs. Frequency
0
–20
–40
–60
THD + N (dB)
–80
–100
0.001 0.01 0.1 1
= ±2.5V
V
DD/VSS
CODE = HALF SCA LE
f
= 1kHz
IN
NOISE BW = 22 kHz
AMPLITUDE ( V rms)
Figure 15. THD + N vs. Amplitude
100k
10k
1M
8
7
6
VOLTAGE (V)
5
4
0.07 0.09 0.11 0.13 0.15 0.17
08718-039
Figure 17. V
TIME (Seco nds)
Waveform While Writing Fuse
EXT_CAP
8718-029
20
10
0
–10
–20
–30
–40
GLITCH AMPLITUDE (mV)
–50
–60
–70
08718-026
–2 420
TIME (µs)
VDD/VSS = ±2.5V I
= 200µA
AW
08718-102
Figure 18. Maximum Glitch Energy
Rev. B | Page 9 of 20
Page 10
AD5174
R
1.0
0.5
0.006
0.005
0.004
VDD/VSS = 5V/0V I
= 10µA
AW
CODE = HALF S CAL E
0.003
0.002
RESISTANCE (%)
0.001
AW
0
–0.001
–0.002
0 1000900800700600500400300200100
OPERATION AT 150°C (Hours)
Figure 20. Long-Term Drift Accelerated Average by Burn-In
08718-101
–0.5
VOLTAGE (mV)
–1.0
–1.5
0
–10 6050403020100
TIME (µs)
Figure 19. Digital Feedthrough
VDD/VSS = ±2.5V I
= 200µA
AW
08718-100
Rev. B | Page 10 of 20
Page 11
AD5174
V
V
%

TEST CIRCUITS

Figure 21 to Figure 25 define the test conditions used in the Specifications section.
DUT
W
A
I
W
V
MS
08718-033
Figure 21. Resistor Position Nonlinearity Error
(Rheostat Operation; R-INL, R-DNL)
MS
RWA =
I
W
CODE = 0x00
DUT
W
A
V
MS
R
RW =
WA
2
NC
08718-034
+2.75V –2.75V
I
W
Figure 22. Wiper Resistance
+ = VDD ±10
PSRR (dB) = 20 log
I
W
V
DD
V+
W
A
V
PSS (%/%) =
MS
VMS%
V
DD
V
MS
V
DD
%
08718-035
Figure 23. Power Supply Sensitivity (PSS, PSRR)
DUT
W
A
1G
V
MS
V
08718-036
Figure 24. Gain vs. Frequency
DUT
I
CM
W
A
GND
GND
GND
NC = NO CONNECT
+2.75V –2.75V
Figure 25. Common Leakage Current
08718-037
Rev. B | Page 11 of 20
Page 12
AD5174

THEORY OF OPERATION

The AD5174 is designed to operate as a true variable resistor for analog signals within the terminal voltage range of V < V
. The RDAC register contents determine the resistor wiper
DD
position. The RDAC register acts as a scratchpad register, which allows unlimited changes of resistance settings. The RDAC register can be programmed with any position setting by using the SPI interface. When a desirable wiper position is found, this value can be stored in a 50-TP memory register. Thereafter, the wiper position is always restored to that position for subsequent power-ups. The storing of 50-TP data takes approximately 350 ms; during this time, the AD5174 locks to prevent any changes from taking place.
The AD5174 also feature a patented 1% end-to-end resistor tolerance. This simplifies precision, rheostat mode, and open­loop applications where knowledge of absolute resistance is critical.

SERIAL DATA INTERFACE

The AD5174 contains a serial interface ( and SDO) that is compatible with SPI interface standards, as well as most DSPs. This device allows writing of data via the serial interface to every register.
SYNC

SHIFT REGISTER

The shift register is 16 bits wide, as shown in Figure 2. The 16-bit word consists of two unused bits, which should be set to 0, followed by four control bits and 10 RDAC data bits. Data is loaded MSB first (Bit D9). The four control bits determine the function of the software command as listed in Tabl e 6. Figure 3 shows a timing diagram of a typical AD5174 write sequence.
The write sequence begins by bringing the SYNC
pin must be held low until the complete data-word is loaded from the DIN pin. When data-word is decoded according to the instructions in .
The command bits (Cx) control the operation of the digital potentiometer. The data bits (Dx) are the values that are loaded into the decoded register. The AD5174 has an internal counter that counts a multiple of 16 bits (a frame) for proper operation. For example, AD5174 works with a 32-bit word but does not work properly with a 31-bit or 33-bit word. The AD5174 does not require a continuous SCLK when To minimize power consumption in the digital input buffers, operate all serial interface pins close to the V
SYNC
SYNC
returns high, the serial
SYNC
DD
< V
SS
TERM
, SCLK, DIN,
line low. The
Tabl e 6
is high.
supply rails.

RDAC REGISTER

The RDAC register directly controls the position of the digital rheostat wiper. For example, when the RDAC register is loaded with all 0s, the wiper is connected to Terminal A of the variable resistor. The RDAC register is a standard logic register, and there is no restriction on the number of changes allowed. The basic mode of setting the variable resistor wiper position (programming the RDAC register) is accomplished by loading the serial data input register with Command 1 (see Tab le 6 ) and with the desired wiper position data.

50-TP MEMORY BLOCK

The AD5174 contains an array of 50-TP programmable memory registers, which allow the wiper position to be programmed up to 50 times. Tabl e 10 shows the memory map. When the desired wiper position is determined, the user can load the serial data input register with Command 3 (see Tab l e 6 ), which stores the wiper position data in a 50-TP memory register. The first address to be programmed is Location 0x01 (see Tab le 1 0); the AD5174 increments the 50-TP memory address for each subsequent program until the memory is full. Programming data to 50-TP consumes approximately 4 mA for 55 ms, and takes approx­imately 350 ms to complete, during which time the shift register locks to prevent any changes from occurring. Bit C2 of the control register can be polled to verify that the fuse program command was completed properly. No change in supply voltage is required to program the 50-TP memory; however, a 1 μF capacitor on the EXT_CAP pin is required (see Figure 28). Prior to 50-TP activation, the AD5174 presets to midscale on power-up.

WRITE PROTECTION

At power-up, the serial data input register write commands for both the RDAC register and the 50-TP memory registers are disabled. The RDAC write protect bit, C1, of the control register (see Tabl e 8 and Ta b le 9 ) is set to 0 by default. This disables any change of the RDAC register content regardless of the software commands, except that the RDAC register can be refreshed from the 50-TP memory using the software reset, Command 4 (see Tabl e 6). To enable programming of the RDAC register, the write protect bit (Bit C1), of the control register must first be programmed by loading the serial data input register with Command 7. To enable programming of the 50-TP memory, the program enable bit (Bit C0) of the control register, which is set to 0 by default, must first be set to 1.
Rev. B | Page 12 of 20
Page 13
AD5174

RDAC AND 50-TP READ OPERATION

A serial data output SDO pin is available for readback of the internal RDAC register or 50-TP memory contents. The contents of the RDAC register can be read back through SDO by using Command 2 (see Tab l e 6 ). Data from the RDAC register is clocked out of the SDO pin during the last 10 clocks of the next SPI operation.
It is possible to read back the contents of any of the 50-TP memory registers through SDO by using Command 5. The lower six LSB bits, D5 to D0 of the data byte, select which memory location is to be read back, as shown in Tabl e 10 .
Table 6. Command Operation Truth Table
Command Number
0 0 0 0 0 X X X X X X X X X X NOP: do nothing. 1 0 0 0 1 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
2 0 0 1 0 X X X X X X X X X X
3 0 0 1 1 X X X X X X X X X X
4 0 1 0 0 X X X X X X X X X X
52 0 1 0 1 X X X X D5 D4 D3 D2 D1 D0
6 0 1 1 0 X X X X X X X X X X
73 0 1 1 1 X X X X X X X X D1 D0
8 1 0 0 0 X X X X X X X X X X Read contents of control register. 9 1 0 0 1 X X X X X X X X X D0 Software shutdown. D0 = 0; normal mode.
1
X is don’t care.
2
See Table 10 for 50-TP memory map.
3
See Table 9 for bit details.
Command[DB13:DB10] Data[DB9:DB0]1 C3 C2 C1 C0 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
Data from the selected memory location is clocked out of the SDO pin during the next SPI operation. A binary encoded version address of the most recently programmed wiper memory location can be read back using Command 6 (see Tab le 6 ). This can be used to monitor the spare memory status of the 50-TP memory block.
Tabl e 7 provides a sample listing for the sequence of serial data input (DIN) words with the serial data output appearing at the SDO pin in hexadecimal format for a write and read to both the RDAC register and the 50-TP memory (Memory Location 20).
Operation
Write contents of serial register data to RDAC.
Read contents of RDAC wiper register.
Store wiper setting: store RDAC setting to 50-TP.
Software reset: refresh RDAC with last 50-TP memory stored value.
Read contents of 50-TP from SDO output in the next frame.
Read address of last 50-TP programmed memory location.
Write contents of serial register data to control register.
D0 = 1; device placed in shutdown mode.
Rev. B | Page 13 of 20
Page 14
AD5174

SHUTDOWN MODE

The AD5174 can be shut down by executing the software shutdown command, Command 9 (see Tabl e 6), and setting the LSB to 1. This feature places the RDAC in a zero-power­consumption state where Terminal A is open circuited and the wiper terminal, W, remains connected. It is possible to execute any command from Ta b le 6 while the AD5174 is in shutdown mode. The parts can be taken out of shutdown mode by executing Command 9 and setting the LSB to 0 or by a software reset, Command 4 (see Tabl e 6 ).
Table 7. Write and Read to RDAC and 50-TP Memory
DIN SDO1 Action
0x1C03 0xXXXX Enable update of the wiper position and the 50-TP memory contents through the digital interface. 0x0500 0x1C03 Write 0x100 to the RDAC register; wiper moves to ¼ full-scale position. 0x0800 0x0500 Prepares data read from RDAC register. 0x0C00 0x100
0x1800 0x0C00 Prepares data read of the last programmed 50-TP memory monitor location. 0x0000 0xXX19
0x1419 0x0000 Prepares data read from Memory Location 0x19. 0x2000 0x0100
0x0000 0xXXXX
1
X is don’t care.
Stores RDAC register content into the 50-TP memory. A 16-bit word appears out of SDO, where the last 10 bits contain the contents of the RDAC register (0x100).
NOP Instruction 0 sends a 16-bit word out of SDO, where the six LSBs (that is, last six bits) contain the binary address of the last programmed 50-TP memory location, for example, 0x19 (see Table 10).
Prepares data read from the control register. Sends a 16-bit word out of SDO, where the last 10 bits contain the contents of Memory Location 0x19.
NOP Instruction 0 sends a 16-bit word out of SDO, where the last four bits contain the contents of the control register. If Bit C2 = 1, the fuse program command was successful.

RESET

The AD5174 can be reset through software by executing Com­mand 4 (see Tabl e 6). The reset command loads the RDAC register with the contents of the most recently programmed 50-TP memory location. The RDAC register loads with midscale if no 50-TP memory location has been previously programmed.
Table 8. Control Register Bit Map
D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
0 0 0 0 0 0 C2 0 C1 C0
Table 9. Control Register Bit Description
Bit Name Description
C0 50-TP program enable 0 = 50-TP program disabled (default) 1 = enable device for 50-TP program C1 RDAC register write protect 0 = wiper position frozen to value in 50-TP memory (default)1 1 = allow update of wiper position through digital interface C2 50-TP memory program success bit 0 = fuse program command was unsuccessful (default) 1 = fuse program command was successful
1
Wiper position frozen to the last value programmed in the 50-TP memory. The wiper is frozen to midscale if the 50-TP memory has not been previously programmed.
Rev. B | Page 14 of 20
Page 15
AD5174
V
Table 10. Memory Map
Data Byte[DB9:DB0]1
Command Number
5
D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
X X X 0 0 0 0 0 0 0 Reserved X X X 0 0 0 0 0 0 1 1st programmed wiper location (0x01) X X X 0 0 0 0 0 1 0 2nd programmed wiper location (0x02) X X X 0 0 0 0 0 1 1 3rd programmed wiper location (0x03) X X X 0 0 0 0 1 0 0 4th programmed wiper location (0x04) … … … … … … … … … … … X X X 0 0 0 1 0 1 0 10th programmed wiper location (0xA) … … … … … … … … … … … X X X 0 0 1 0 1 0 0 20th programmed wiper location (0x14) … … … … … … … … … … … X X X 0 0 1 1 1 1 0 30th programmed wiper location (0x1E) … … … … … … … … … … … X X X 0 1 0 1 0 0 0 40th programmed wiper location (0x28) … … … … … … … … … … … X X X 0 1 1 0 0 1 0 50th programmed wiper location (0x32) … … … … … … … … … … … X X X 0 1 1 1 0 0 1 MSB resistance tolerance (0x39) X X X 0 1 1 1 0 1 0 LSB resistance tolerance (0x3A)
1
X is don’t care.

SDO PIN AND DAISY-CHAIN OPERATION

The serial data output pin (SDO) serves two purposes: it can be used to read the contents of the wiper setting and 50-TP values using Command 2 and Command 5, respectively (see Ta b le 6 ) or the SDO pin can be used in daisy-chain mode. Data is clocked out of SDO on the rising edge of SCLK. The SDO pin contains an open-drain N-channel FET that requires a pull-up resistor. To place the pin in high impedance and minimize the power dissipation when the pin is used, the 0x8001 data word followed by Command 0 should be sent to the part. Tab l e 1 1 provides a sample listing for the sequence of the serial data input (DIN). Daisy chaining minimizes the number of port pins required from the controlling IC. As shown in Figure 26, users need to tie the SDO pin of one package to the DIN pin of the next package. Users may need to increase the clock period, because the pull-up resistor and the capacitive loading at the SDO-to-DIN interface may require additional time delay between subsequent devices. When two AD5174 devices are daisy-chained, 32 bits of data are required. The first 16 bits go to U2, and the second 16 bits go to U1.
Table 11. Minimize Power Dissipation at SDO Pin
DIN SDO1 Action
0xXXXX 0xXXXX Last user command sent to the digipot 0x8001 0xXXXX
0x0000
1
X is don’t care.
Keep the
SYNC
respective serial registers. The complete the operation.
µC
Register Contents
Prepares the SDO pin to be placed in high impedance mode
High Impedance
The SDO pin is placed in high impedance
pin low until all 32 bits are clocked into their
SYNC
pin is then pulled high to
DD
AD5174
U1
DINMOSI
SDO
SSSCLK
SYNC
SCLK
Figure 26. Daisy-Chain Configuration Using SDO
R
P
2.2k
AD5174
U2
DIN SDO
SYNC
SCLK
08718-006
Rev. B | Page 15 of 20
Page 16
AD5174

RDAC ARCHITECTURE

To achieve optimum performance, Analog Devices, Inc., has patented the RDAC segmentation architecture for all the digital potentiometers. In particular, the AD5174 employs a three-stage segmentation approach as shown in Figure 27. The AD5174 wiper switch is designed with the transmission gate CMOS topology.
A
R
L
R
L
10-BIT
ADDRESS
DECODER
Figure 27. Simplified RDAC Circuit

PROGRAMMING THE VARIABLE RESISTOR

Rheostat Operation

The nominal resistance between Terminal W and Terminal A,
, is 10 kΩ and has 1024-tap points accessed by the wiper ter-
R
WA
minal. The 10-bit data in the RDAC latch is decoded to select one of the 1024 possible wiper settings. As a result, the general equation for determining the digitally programmed output resistance between the W terminal and the A terminal is
D
DR ×=
)(
1024
where:
D is the decimal equivalent of the binary code loaded in the
10-bit RDAC register.
R
is the end-to-end resistance.
WA
(1)
R
WAWA
R
M
S
W
R
M
R
W
W
R
W
08718-007
In the zero-scale condition, a finite total wiper resistance of 120 Ω is present. Regardless of which setting the part is oper­ating in, take care to limit the current between Terminal A and Terminal W to the maximum continuous current of ±6 mA or a pulse current specified in Tab le 3 . Otherwise, degradation or possible destruction of the internal switch contact may occur.

Calculate the Actual End-to-End Resistance

The resistance tolerance is stored in the internal memory during factory testing. The actual end-to-end resistance can, therefore, be calculated (which is valuable for calibration, tolerance matching, and precision applications).
The resistance tolerance (in percentage) is stored in fixed-point format, using a 16-bit sign magnitude binary. The sign bit(0 = negative and 1 = positive) and the integer part is located in Address 0x39 as shown in Tab le 1 0. Address 0x3A contains the fractional part as shown in Ta bl e 12 .
That is, if the data readback from Address 0x39 is 0000001010 and data from Address 0x3A is 0010110000, then the end-to-end resistance can be calculated as follows.
For Memory Location 0x39,
DB[9:8]: XX = don’t care
DB[7]: 0 = negative
DB[6:0]: 0001010 = 10
For Memory Location 0x3A,
DB[9:8]: XX = don’t care
−8
DB[7:0]: 10110000 = 176 × 2
Therefore, tolerance = −10.6875% and R
= 0.6875
(1023)= 8.931 kΩ.
WA
Table 12. End-to-End Resistance Tolerance Bytes
Data Byte1
Memory Map Address
0x39 X X Sign 26 2 0x3A X X 2−1 2
1
X is don’t care.
DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
5
−2
2
Rev. B | Page 16 of 20
2
−3
2
4
2
−4
2
3
2
−5
2
2
2
−6
2
1
2
−7
2
0
−8
Page 17
AD5174
V

EXT_CAP CAPACITOR

A 1 μF capacitor to VSS must be connected to the EXT_CAP pin, as shown in Figure 28, on power-up and throughout the operation of the AD5174.
AD5174
50-TP
EXT_CAP
C1
1µF
Figure 28. EXT_CAP Hardware Setup
MEMORY
BLOCK
V
SS
V
SS
08718-008

TERMINAL VOLTAGE OPERATING RANGE

The positive VDD and negative VSS power supplies of the AD5174 define the boundary conditions for proper 2-terminal digital resistor operation. Supply signals present on Terminal A and Terminal W that exceed V forward-biased diodes (see Figure 29).
or VSS are clamped by the internal
DD
DD
The ground pin of the AD5174 is primarily used as a digital ground reference. To minimize the digital ground bounce, join the AD5174 ground terminal remotely to the common ground. The digital input control signals to the AD5174 must be referenced to the device ground pin (GND) and must satisfy the logic level defined in the Specifications section. An internal level shift circuit ensures that the common-mode voltage range of the three terminals extends from V
to VDD, regardless of the
SS
digital input level.

POWER-UP SEQUENCE

Because there are diodes to limit the voltage compliance at Ter m in a l A a nd Te rm i na l W ( s ee Figure 29), it is important to power V and Terminal W; otherwise, the diode is forward-biased such that V
DD/VSS
up sequence is V The order of powering V important as long as they are powered after V
As soon as V which first sets the RDAC to midscale and then restores the last programmed 50-TP value to the RDAC register.
first before applying any voltage to Terminal A
DD/VSS
are powered unintentionally. The ideal power-
, GND, VDD, digital inputs, VA, and VW.
SS
, VW, and the digital inputs is not
A
DD/VSS
is powered, the power-on preset activates,
DD
.
Figure 29. Maximum Terminal Voltages Set by V
A
W
V
SS
08718-009
and V
DD
SS
Rev. B | Page 17 of 20
Page 18
AD5174

OUTLINE DIMENSIONS

3.10
3.00 SQ
2.90
2.48
2.38
2.23
0.50 BSC
PIN 1 INDEX
AREA
0.80
0.75
0.70
SEATING
PLANE
TOP VIEW
0.30
0.25
0.20
0.50
0.40
0.30
0.05 MAX
0.02 NOM
0.20 REF
6
EXPOSED
PAD
5
BOTTOM VIEW
FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET.
10
1.74
1.64
1.49
1
P
N
I
1
A
O
R
T
N
I
D
C
I
)
5
1
.
R
0
(
121009-A
Figure 30. 10-Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3mm Body, Very Thin, Dual Lead
(CP-10-9)
Dimensions shown in millimeters
3.10
3.00
2.90
10
6
3.10
3.00
2.90
PIN 1
IDENTIFIER
0.95
0.85
0.75
0.15
0.05
COPLANARITY
1
0.50 BSC
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-BA
5.15
4.90
4.65
5
15° MAX
6° 0°
0.23
0.13
0.70
0.55
0.40
091709-A
0.30
0.15
1.10 MAX
Figure 31. 10-Lead Mini Small Outline Package [MSOP]
(RM-10)
Dimensions shown in millimeters

ORDERING GUIDE

Model1 R
AD5174BRMZ-10 10 1,024 −40°C to +125°C 10-Lead MSOP RM-10 DDT AD5174BRMZ-10-RL7 10 1,024 −40°C to +125°C 10-Lead MSOP RM-10 DDT AD5174BCPZ-10-RL7 10 1,024 −40°C to +125°C 10-Lead LFCSP_WD CP-10-9 DEF
1
Z = RoHS Compliant Part.
(kΩ) Resolution Temperature Range Package Description Package Option Branding
AB
Rev. B | Page 18 of 20
Page 19
AD5174
NOTES
Rev. B | Page 19 of 20
Page 20
AD5174
NOTES
©2010 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D08718-0-12/10(B)
Rev. B | Page 20 of 20
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