Datasheet AD5061 Datasheet (ANALOG DEVICES)

Page 1
16-Bit V
A
nanoDAC
OUT
SPI Interface 2.7 V to 5.5 V, in an SOT-23
Single 16-bit DAC, 4 LSB INL Power-on reset to midscale or zero-scale Guaranteed monotonic by design 3 power-down functions Low power serial interface with Schmitt-triggered inputs Small 8-lead SOT-23 package, low power Fast settling time of 4 μs typically
2.7 V to 5.5 V power supply Low glitch on power-up
interrupt facility
SYNC

APPLICATIONS

Process control Data acquisition systems Portable battery-powered instruments Digital gain and offset adjustment Programmable voltage and current sources Programmable attenuators

GENERAL DESCRIPTION

The AD5061, a member of ADI’s nanoDAC family, is a low power, single 16-bit buffered voltage-out DAC that operates from a single 2.7 V to 5.5 V supply. The part offers a relative accuracy specification of ±4 LSB and operation is guaranteed monotonic with a ±1 LSB DNL specification. The part uses a versatile 3-wire serial interface that operates at clock rates up to 30 MHz, and is compatible with standard SPI®, QSPI™, MICROWIRE™, and DSP interface standards. The reference for the AD5061 is supplied from an external V buffer is also provided on-chip. The part incorporates a power­on reset circuit that ensures the DAC output powers up to mid­scale or zero scale and remains there until a valid write takes place to the device. The part contains a power-down feature that reduces the current consumption of the device to typically 330 nA at 5 V and provides software-selectable output loads while in power-down mode. The part is put into power-down mode over the serial interface. Total unadjusted error for the part is <3 mV. This part exhibits very low glitch on power-up.
pin. A reference
REF
AD5061

FUNCTIONAL BLOCK DIAGRAM

V
REF
POWER-ON
RESET
DAC
REGISTER
INPUT
CONTROL
LOGIC
SCLK DIN
SYNC DACGND
BUF
REF(+)
DAC
POWER-DOWN
CONTROL LO GIC
Figure 1.
Table 1. Related Devices
Part No. Description
AD5062
2.7 V to 5.5 V, 16-bit nanoDAC D/A, 1 LSB INL, SOT-23
AD5063
2.7 V to 5.5 V, 16-bit nanoDAC D/A, 1 LSB INL, MSOP
AD5040/AD5060
2.7 V to 5.5 V, 14-bit/16-bit nanoDAC D/A, 1 LSB INL, SOT-23

PRODUCT HIGHLIGHTS

1. Available in a small 8-lead SOT-23 package.
2. 16-bit resolution, 4 LSB INL.
3. Low glitch on power-up.
4. High speed serial interface with clock speeds up to 30 MHz.
5. Three power-down modes available to the user.
6. Reset to known output voltage (midscale or zero scale).
V
DD
OUTPUT BUFFER
AD5061
RESISTOR NETWORK
V
OUT
GND
04762-001
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2005–2011 Analog Devices, Inc. All rights reserved.
Page 2
AD5061
TABLE OF CONTENTS
Features.............................................................................................. 1
Reference Buffer ......................................................................... 15
Applications....................................................................................... 1
Functional Block Diagram ..............................................................1
General Description......................................................................... 1
Product Highlights........................................................................... 1
Revision History ...............................................................................2
Specifications..................................................................................... 3
Timing Characteristics..................................................................... 5
Absolute Maximum Ratings............................................................ 6
ESD Caution.................................................................................. 6
Pin Configuration and Function Descriptions............................. 7
Typical Performance Characteristics ............................................. 8
Terminology .................................................................................... 14
Theory of Operation ......................................................................15
DAC Architecture....................................................................... 15
Serial Interface............................................................................ 15
Input Shift Register .................................................................... 15
SYNC
Interrupt ..........................................................................15
Power-On to Zero-Scale or Midscale ...................................... 16
Software Reset............................................................................. 16
Power-Down Modes .................................................................. 16
Microprocessor Interfacing....................................................... 16
Applications..................................................................................... 18
Choosing a Reference ................................................................18
Bipolar Operation....................................................................... 18
Using a Galvanically-Isolated Interface Chip......................... 19
Power Supply Bypassing and Grounding................................ 19
Outline Dimensions....................................................................... 20
Ordering Guide .......................................................................... 20

REVISION HISTORY

5/11—Rev. A to Rev. B
Changes to Data Sheet Title and Product Highlights Section.... 1
Changes to Ordering Guide.......................................................... 20
1/06—Rev. 0 to Rev. A
Changes to General Description .................................................... 1
Changes to Table 2............................................................................ 3
Changes to Figure 19 Caption....................................................... 10
Added Figure 28 to Figure 36........................................................12
Changes to Serial Interface Section.............................................. 15
Changes to Power-Down Modes Section.................................... 16
Changes to Ordering Guide.......................................................... 20
7/05—Revision 0: Initial Version
Rev. B | Page 2 of 20
Page 3
AD5061

SPECIFICATIONS

VDD = 5.5 V, V
Table 2.
B Grade1 Parameter Min Typ Max Unit Test Conditions/Comments
STATIC PERFORMANCE
Resolution 16 Bits Relative Accuracy (INL)2 ±0.5 ±4 LSB −40°C to +85°C, B grade ±0.5 ±4 −40°C to +125°C, Y grade Total Unadjusted Error (TUE) ±0.5 ±3.0 mV −40°C to +85°C, B grade ±0.5 ±3.0 −40°C to +125°C, Y grade Differential Nonlinearity (DNL) ±0.5 ±1 LSB Guaranteed monotonic, −40°C to +85°C, B grade ±0.5 ±1
Gain Error ±0.01 ±0.05 % of FSR TA = −40°C to +85°C, B grade ±0.01 ±0.05 TA = −40°C to +125°C , Y grade Gain Error Temperature Coefficient 1 ppm of FSR/°C Offset Error ±0.02 ±3.0 mV TA = −40°C to + 85°C, B grade ±0.02 ±3.0 TA = −40°C to + 125°C, Y grade Offset Error Temperature Coefficient 0.5 µV/°C Full-Scale Error ±0.05 ±3.0 mV
±0.05 ±3.0
OUTPUT CHARACTERISTICS3
Output Voltage Range 0 V Output Voltage Settling Time 4 µs
Output Noise Spectral Density 64 Output Voltage Noise 6 µV p-p DAC code = midscale , 0.1 Hz to 10 Hz bandwidth
Digital-to-Analog Glitch Impulse 2 nV-s 1 LSB change around major carry, RL = 5 KΩ Digital Feedthrough 0.003 nV-s DAC code = full-scale DC Output Impedance (Normal) 0.015 Output impedance tolerance ±10% DC Output Impedance (Power-Down)
(Output Connected to 1 kΩ Network) 1 kΩ Output impedance tolerance ±400 Ω (Output Connected to 100 kΩ Network) 100 kΩ Output impedance tolerance ±20 kΩ
Capacitive Load Stability 1 nF Loads used: RL = 5 kΩ, RL = 100 kΩ, RL = ∞ Output Slew Rate 1.2 V/s
Short-Circuit Current 60 mA
45 mA
DAC Power-Up Time
DC Power Supply Rejection Ratio −92 dB VDD ±10%, DAC code = full-scale Wideband Spurious-Free Dynamic Range −67 dB Output frequency = 10 kHz
REFERENCE INPUT/OUTPUT
V
Input Range4 2 V
REF
Input Current (Power-Down) ±0.1 µA Zero-scale loaded Input Current (Normal) ±0.5 µA DC Input Impedance 1 MΩ
= 4.096 V, RL = unloaded, CL= unloaded, T
REF
MIN
to T
, unless otherwise specified.
MAX
V
REF
nV/Hz
− 50 mV
DD
Guaranteed monotonic, −40°C to +125°C, Y grade
All 1s loaded to DAC register, TA = −40°C to +85°C, B grade
All 1s loaded to DAC register,
= −40°C to +125°C , Y grade
T
A
¼ scale to ¾ scale code transition to ±1LSB,
= 5 KΩ
R
L
DAC code = midscale, 1 kHz
¼ scale to ¾ scale code transition to ±1 LSB, R
= 5 kΩ, CL = 200 pF
L
DAC code = full-scale, output shorted to GND,
= 25°C
T
A
DAC code = zero-scale, output shorted to V
= 25°C
T
A
Time to exit power-down mode to normal mode of AD5061, 24
th
clock edge to 90% of
DD
DAC final value, output unloaded
,
Rev. B | Page 3 of 20
Page 4
AD5061
B Grade1 Parameter Min Typ Max Unit Test Conditions/Comments
LOGIC INPUTS
Input Current5 ±1 ±5 μA Input Low Voltage (VIL) 0.8 V VDD = 4.5 V to 5.5 V
0.8 VDD = 2.7 V to 3.6 V Input High Voltage (VIH) 2.0 V VDD = 2.7 V to 5.5 V
1.8 VDD = 2.7 V to 3.6 V Pin Capacitance 4 pF
POWER REQUIREMENTS
VDD 2.7 5.5 V All digital inputs at 0 V or VDD IDD (Normal Mode) DAC active and excluding load current VDD = 2.7 V to 5.5 V 1.0 1.2 mA
0.89
IDD (All Power-Down Modes)
VDD = 2.5 V to 5.5 V 1 μA
0.265
1
Temperature range for B grade: −40°C to +85°C, typical at 25°C; temperature range for Y grade: −40°C to +125°C.
2
Linearity calculated using a reduced code range (160 to 65535).
3
Guaranteed by design and characterization, not production tested.
4
The typical output supply headroom performance for various reference voltages at −40°C can be seen in Figure 27.
5
Total current flowing into all pins.
= VDD and VIL = GND, VDD = 5.5 V,
V
IN
V
= 4.096 V, code = midscale
REF
= VDD and VIL = GND, VDD = 3.0 V,
V
IN
= 4.096 V, code = midscale
V
REF
= VDD and VIL = GND, VDD = 5.5 V,
V
IH
= 4.096 V, code = midscale
V
REF
= VDD and VIL = GND, VDD = 3.0 V,
V
IH
V
= 4.096 V, code = midscale
REF
Rev. B | Page 4 of 20
Page 5
AD5061

TIMING CHARACTERISTICS

VDD = 2.7 V to 5.5 V, all specifications T
Table 3.
Parameter Limit1 Unit Test Conditions/Comments
2
t
33 ns min SCLK cycle time
1
t2 t
3
t
4
t5 t
6
t
7
t8 t9
1
All input signals are specified with tr = tf = 1 ns/V (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
2
Maximum SCLK frequency is 30 MHz.
5 ns min 3 ns min 10 ns min 3 ns min 2 ns min 0 ns min 12 ns min 9 ns min
SCLK
SYNC
DIN
t
8
MIN
to T
unless otherwise specified.
MAX
,
SCLK high time SCLK low time SYNC to SCLK falling edge set-up time Data set-up time Data hold time SCLK falling edge to SYNC rising edge Minimum SYNC high time SYNC rising edge to next SCLK fall ignore
t
4
t
t
2
1
t
3
t
6
t
5
t
9
t
7
D0D1D2D22D23
D23 D22
04762-002
Figure 2. Timing Diagram
Rev. B | Page 5 of 20
Page 6
AD5061

ABSOLUTE MAXIMUM RATINGS

Table 4.
Parameter Rating
VDD to GND −0.3 V to +7.0 V Digital Input Voltage to GND −0.3 V to VDD + 0.3 V V
to GND −0.3 V to VDD + 0.3 V
OUT
V
to GND −0.3 V to VDD + 0.3 V
REF
Operating Temperature Range
Industrial (B Grade) −40°C to + 85°C Extended Automotive Temperature
Range (Y Grade) −40°C to +125°C Storage Temperature Range −65°C to +150°C Maximum Junction Temperature 150°C SOT-23 Package
Power Dissipation (TJ max − TA)/θJA θJA Thermal Impedance 206°C/W θJC Thermal Impedance 44°C/W
Reflow Soldering (Pb-Free)
Peak Temperature 260°C Time-at-Peak Temperature 10 sec to 40 sec
ESD 1.5 kV
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
This device is a high performance integrated circuit with an ESD rating of <2 kV, and is ESD-sensitive. Proper precautions should be taken for handling and assembly.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. B | Page 6 of 20
Page 7
AD5061
V

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

18
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1 DIN
Serial Data Input. This device has a 24-bit shift register. Data is clocked into the register on the falling edge of the
serial clock input. 2 3 V 4 V 5 AGND 6 DACGND 7
Power Supply Input. These parts can be operated from 2.7 V to 5.5 V and VDD should be decoupled to GND.
V
DD
Reference Voltage Input.
REF
Analog Output Voltage from DAC.
OUT
Ground Reference Point for Analog Circuitry.
Ground Input to the DAC.
SYNC Level-Triggered Control Input (Active Low). This is the frame synchronization signal for the input data. When SYNC
goes low, it enables the input shift register and data is transferred in on the falling edges of the following clocks.
The DAC is updated following the 24th clock cycle unless SYNC is taken high before this edge, in which case the
rising edge of SYNC 8 SCLK
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock input. Data can
be transferred at rates up to 30 MHz.
DIN
V
V
REF
OUT
AD5061
27
TOP VIEW
DD
(Not to Scale)
36
45
Figure 3. Pin Configuration
acts as an interrupt and the write sequence is ignored by the DAC.
SCLK
SYNC
DACGND
AGND
04762-003
Rev. B | Page 7 of 20
Page 8
AD5061

TYPICAL PERFORMANCE CHARACTERISTICS

1.6 TA = 25°C
1.4
= 5V, V
V
DD
1.2
1.0
0.8
0.6
0.4
0.2
0
–0.2
–0.4
INL ERRO R (LSB)
–0.6
–0.8
–1.0
–1.2
–1.4
–1.6
160
= 4.096V
REF
DAC CODE
Figure 4. Typical INL Plot
601605016040160301602016010160
04762-004
1.2 VDD = 5.5V, V
1.0
= 2.7V, V
V
DD
0.8
0.6
MAX DNL ERROR @ V
0.4
0.2
0
–0.2
–0.4
DNL ERROR (LSB)
–0.6
–0.8
MIN DNL ERROR @ VDD = 5.5V
–1.0
–1.2
–40 –20 0 20 40 60 80 100 120
= 4.096V
REF
= 2.0V
REF
= 2.7V
DD
MAX DNL E RROR @ VDD = 5.5V
MIN DNL ERROR @ VDD = 2.7V
TEMPERATURE (°C)
Figure 7. DNL vs. Temperature
04762-007
140
TUE ERROR (mV)
DNL ERROR (LSB)
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
–0.02
–0.04
–0.06
–0.08
–0.10
–0.12
–0.14
–0.16
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
–0.2
–0.4
–0.6
–0.8
–1.0
–1.2
–1.4
–1.6
TA = 25°C V
0
160
TA = 25°C V
0
160
DD
DD
= 5V, V
REF
= 4.096V
Figure 5. Typical TUE Plot
= 5V, V
REF
= 4.096V
Figure 6. Typical DNL Plot
DAC CODE
DAC CODE
1.2 VDD = 5.5V, V
1.0
= 2.7V, V
V
DD
0.8
0.6
0.4
0.2
MIN TUE ERROR @ VDD = 5.5V
0
–0.2
TUE ERROR (mV)
–0.4
–0.6
–0.8
–1.0
601605016040160301602016010160
04762-005
–1.2
–40 –20 0 20 40 60 80 100 120
= 4.096V
REF
= 2.0V
REF
MAX TUE ERROR @ V
MIN TUE ERROR @ VDD = 2.7V
TEMPERATURE (°C)
= 2.7V
DD
MAX TUE ERROR @ VDD = 5.5V
04762-008
140
Figure 8. TUE vs. Temperature
1.6 VDD = 5.5V, V
1.4
= 2.7V, V
V
DD
1.2
1.0
0.8
0.6
0.4
0.2
0
–0.2
–0.4
INL ERRO R (LSB)
–0.6
–0.8
–1.0
–1.2
601605016040160301602016010160
04762-006
–1.4
–1.6
MIN INL ERROR @ VDD = 5.5V
–40 –20 0 20 40 60 80 100 120
= 4.096V
REF
= 2.0V
REF
MAX INL ERROR @ V
MAX INL ERROR @ VDD = 5.5V
MIN INL ERROR @ VDD = 2.7V
TEMPERATURE (°C)
DD
= 2.7V
04762-090
140
Figure 9. INL vs. Temperature
Rev. B | Page 8 of 20
Page 9
AD5061
1.6 TA = 25°C
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
–0.2
–0.4
DNL ERROR (LSB)
–0.6
–0.8
–1.0
–1.2
–1.4
–1.6
2.0
MAX DNL E RROR @ VDD = 5.5V
MIN DNL E RROR @ VDD = 5.5V
REFERENCE VO LTAGE (V)
04762-010
5.55.04.54.03.53.02.5
Figure 10. DNL vs. Reference Input Voltage
1.5 VDD = 5.5V, V
1.4 V
1.3 CODE = FULL -SCALE
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
SUPPLY CURRENT (mA)
0.4
0.3
0.2
0.1
0 –40
= 2.7V, V
DD
= 2.0V
REF
TEMPERATURE (°C)
VDD = 5.5V
= 2.7V
V
DD
= 4.096V
REF
Figure 13. Supply Current vs. Temperature
04762-013
140120100806040200–20
1.2 TA = 25°C
1.0
0.8
0.6
0.4
0.2
0
–0.2
TUE ERROR (mV)
–0.4
–0.6
–0.8
–1.0
–1.2
2.0
MAX TUE ERROR @ VDD = 5.5V
MIN TUE ERROR @ VDD = 5.5V
REFERENCE VO LTAGE (V)
04762-011
5.55.04.54.03.53.02.5
Figure 11. TUE vs. Reference Input Voltage
1.6 TA = 25°C
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
–0.2
–0.4
INL ERRO R (LSB)
–0.6
–0.8
–1.0
–1.2
–1.4
–1.6
2.0
MAX INL ERROR @ VDD = 5.5V
MIN INL E RROR @ VDD = 5.5V
REFERENCE VO LTAGE (V)
04762-009
5.55.04.54.03.53.02.5
Figure 12. INL vs. Reference Input Voltage
3.00 TA = 25°C
2.75
2.50
2.25
2.00
1.75
1.50
1.25
1.00
SUPPLY CURRENT (mA)
0.75
0.50
0.25
0
0
VDD = 5.5V, V
VDD = 3.0V, V
DAC CODE
Figure 14. Supply Current vs. Digital Input Code
2.0 V
= 2.5V
REF
1.8
= 25°C
T
A
CODE = MIDSCALE
1.6
1.4
1.2
1.0
0.8
0.6
SUPPLY CURRENT (mA)
0.4
0.2
0
2.5
SUPPLY VOLTAGE (V)
Figure 15. Supply Current vs. Supply Voltage
REF
REF
= 4.096V
= 2.5V
04762-014
70000600005000040000300002000010000
04762-015
6.05.55.04.54.03.53.0
Rev. B | Page 9 of 20
Page 10
AD5061
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
OFFSET ERROR (mV)
0
–0.2
–0.4
–0.6
–40
VDD = 5.5V, V
= 2.7V, V
V
DD
OFFSET ERROR @ VDD = 5.5V
= 4.096V
REF
= 2.0V
REF
OFFSET ERROR @ V
TEMPERATURE (°C)
Figure 16. Offset vs. Temperature
DD
= 2.7V
CH3 = SCLK
CH2 = V
OUT
CH1 = TRIGG ER
04762-012
140120100806040200–20
CH2 2V/DIVCH1 2V/DIV TIME BASE = 5.00µsCH3 2V
04762-019
Figure 19. Exiting Power-Down Time to Midscale
24TH CLOCK FALLI NG
CH1 = SCLK
CH2 = V
OUT
CH2 50mV/DIV CH1 2V/DIV TIME BASE 400ns/ DIV
Figure 17. Digital-to-Analog Glitch Impulse; See Figure 21
300
VDD = 5V T
= 25°C
A
V
= 4.096V
REF
250
200
150
FULL-SCALE
100
50
NOISE SPECT RAL DENSITY (n V/ Hz)
MIDSCALE
ZERO-SCALE
VDD = 3V DAC = FULL-SCALE V
= 2.7V
REF
T
= 25°C
A
Y AXIS = 2µV/DIV
04762-017
X AXIS = 4s/DIV
04762-020
Figure 20. 0.1 Hz to 10 Hz Noise Plot
VDD = 5V
V
= 4.096V
REF
T
= 25°C
A
10ns/SAMPL E
AMPLITUDE (200µV/DIV )
0
100
1000 10000 100000 1000000
FREQUENCY ( Hz)
Figure 18. Output Noise Spectral Density
04762-018
Rev. B | Page 10 of 20
50 100 150 200 250 300 350 400 450 5000
SAMPLES
04762-021
Figure 21. Glitch Energy
Page 11
AD5061
0.10
GAIN ERROR (%F SR)
–0.02
–0.04
–0.06
–0.08
–0.10
0.08
0.06
0.04
0.02
0
–40 –20
VDD = 5.5V, V V
= 2.7V, V
DD
= 4.096V
REF
= 2.0V
REF
GAIN ERROR @ V
TEMPERATURE (°C)
= 2.7V
DD
GAIN ERROR @ V
Figure 22. Gain Error vs. Temperature
DD
= 5.5V
CH1 = V
DD
CH2 = V
OUT
VDD = 5V V RAMP RATE = 200µs T
= 25°C
04762-022
140120100806040200
A
CH1 2V/DIV CH2 1V/DIV TIME BASE = 100µs
REF
= 4.096V
DD
04762-025
Figure 25. Hardware Power-Down Glitch
16
14
12
10
8
FREQUENCY
6
4
2
0
0.83 0.84 0.85 0.86 0.87 0.88 0.89 0.90 0 .91
Figure 23. I
14
12
10
8
6
FREQUENCY
4
2
0
1.00 1.01 1.02 1.03 1.04 1.05 1.06 1.07 1.08 1.09 1.10 1.11
Figure 24. I
BIN
Histogram @ VDD = 3 V
DD
BIN
Histogram @ VDD = 5 V
DD
MORE
MORE
CH1 = SCLK
CH2 = SYNC
CH3 = V
OUT
VDD = 5V V TA = 25°C
04762-023
CH1 2V/DIV CH2 2V/DIV CH3 20mV/DIV CH4 2V/DIV TIME BASE 1µs/ DIV
REF
= 4.096V
DD
CH4 = TRIG GER
04762-026
Figure 26. Exiting Software Power-Down Glitch
0.50
0.45
0.40
0.35
0.30
0.25
0.20
HEADROOM (V)
0.15
0.10
0.05
04762-024
0
2.72.93.13.33.53.73.94.14.34.54.74.95.1
Figure 27. V
REFERENCE VO LTAGE (V)
Headroom vs. Reference Voltage.
DD
04762-091
5.55.3
Rev. B | Page 11 of 20
Page 12
AD5061
5.05
5.00
4.95
4.90
4.85
4.80
4.75
DAC OUTPUT (V)
4.70
4.65
4.60
4.55
Figure 28. Typical Output Voltage vs. Reference Voltage
5.005
5.000
VDD = 5.0V
= 25°C
T
A
DAC = FULL-SCAL E
4.70 4. 72 4.74 4.76 4. 78 4.80 4.82 4. 84 4.86 4.88 4.90 4. 92 4.94 4.96 4.98 5. 00
V
(V)
REF
V
= 5V
REF
T
= 25°C
A
1kTO GND ZERO-SCALE
04762-042
CH4 20.0mV M1.00µs CH1 1.64V
C4 = 50mV p-p
04762-048
Figure 31. Typical Glitch upon Exiting Software Power-Down to Zero-Scale
C2 25mV p-p
4.995
4.990
DAC OUTPUT (V)
4.985
4.980
4.975
5.50 5.005.055.105.155.205.255.305.355.405. 45
VDD (V)
04762-065
Figure 29. Typical Output Voltage vs. Supply Voltage
C4 = 143mV p-p
1kTO GNDZERO-SCALE
CH4 50.0mV M4.00µs CH1 1.64V
04762-047
Figure 30. Typical Glitch upon Entering Software Power-Down to Zero-Scale
2
3
CH3 2.00V CH2 50mV M1.00ms CH3 1.36V
T
T
C3
4.96V p-p
C3 FALL
935.0µs
C3 RISE s NO VALID EDGE
04762-049
Figure 32. Typical Glitch upon Exiting Hardware Power-Down to Three State
C2 30mV p-p
2
3
CH3 2.00V CH2 50mV M1.00ms CH3 1.36V
T
T
C3
4.96V p-p
C3 FALL s NO VALID EDGE
C3 RISE
946.2µs
04762-050
Figure 33. Typical Glitch upon Entering Hardware Power-Down to Zero-Scale
Rev. B | Page 12 of 20
Page 13
AD5061
0.0010 CODE = MIDSCAL E
= 5V, V
V
0.0008
DD
= 3V, V
V
DD
0.0006
0.0004
0.0002
0
VOLTAGE (V)
–0.0002
VDD = 5.5V
–0.0004
–0.0006
–0.0008
–25 –20 –15 –10 –5 0 5 10 15 20 25 30
= 4.096V
REF
= 2.5V
REF
VDD = 3V
CURRENT (mA)
Figure 34. Typical Output Load Regulation
04762-051
2.1
VDD = 5.5V V
= 4.096V
2.0
REF
10% TO 90% RISE TIME = 0.688µs SLEW RATE = 1.16 V/µs
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0 –10µs 9.96µs8µs6µs4µs2µs0–2µs–4µs–6µ s–8µs
Figure 36. Typical Output Slew Rate
DAC
OUTPUT
1.04V
2.04V
04762-052
0.10 CODE = MIDSCAL E
= 5V, V
V
0.08
DD
= 3V, V
V
DD
0.06
0.04
0.02
(V)
0
OUT
V
–0.02
–0.04
–0.06
–0.08
–0.10
–25 –20 –15 –10 –5 0 5 10 15 20 25 30
= 4.096V
REF
= 2.5V
REF
VDD = 5V, V
REF
= 4.096V
I
OUT
VDD = 3V, V
(mA)
REF
= 2.5V
04762-063
Figure 35. Typical Current Limiting Plot
Rev. B | Page 13 of 20
Page 14
AD5061

TERMINOLOGY

Relative Accuracy
For the DAC, relative accuracy or integral nonlinearity (INL) is a measure of the maximum deviation, in LSBs, from a straight line passing through the endpoints of the DAC transfer function. A typical INL vs. code plot is shown in Figure 4.
Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between the measured change and the ideal 1 LSB change between any two adjacent codes. A specified differential nonlinearity of ±1 LSB maximum ensures monotonicity. This DAC is guaranteed monotonic by design. A typical AD5061 DNL vs. code plot is shown in Figure 6.
Zero-Code Error
Zero-code error is a measure of the output error when zero code (0x0000) is loaded to the DAC register. Ideally, the output should be 0 V. The zero-code error is always positive in the AD5061 because the output of the DAC cannot go below 0 V. This is due to a combination of the offset errors in the DAC and output amplifier. Zero-code error is expressed in mV.
Full-Scale Error
Full-scale error is a measure of the output error when full-scale code (0xFFFF) is loaded to the DAC register. Ideally, the output should be V of full-scale range.
Gain Error
This is a measure of the span error of the DAC. It is the devia­tion in slope of the DAC transfer characteristic from ideal expressed as a percent of the full-scale range.
− 1 LSB. Full-scale error is expressed in percent
DD
Tot a l Un a dj us t ed Er ro r (T UE )
Total unadjusted error is a measure of the output error taking all the various errors into account. A typical TUE vs. code plot is shown in Figure 5.
Zero-Code Error Drift
This is a measure of the change in zero-code error with a change in temperature. It is expressed in μV/°C.
Gain Error Drift
This is a measure of the change in gain error with changes in temperature. It is expressed in (ppm of full-scale range)/°C.
Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the analog output when the input code in the DAC register changes state. It is normally specified as the area of the glitch in nV-s and is measured when the digital input code is changed by 1 LSB at the major carry transition; see Figure 17 and Figure 21. The expanded view in Figure 17 shows the glitch generated following completion of the calibration routine; Figure 21 zooms in on this glitch.
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into the analog output of the DAC from the digital inputs of the DAC, but is measured when the DAC output is not updated. It is specified in nV-s and measured with a full-scale code change on the data bus; that is, from all 0s to all 1s, and vice versa.
Rev. B | Page 14 of 20
Page 15
AD5061
V

THEORY OF OPERATION

The AD5061 is a single 16-bit, serial input, voltage output DAC. It operates from supply voltages of 2.7 V to 5.5 V. Data is writ­ten to the AD5061 in a 24-bit word format, via a 3-wire serial interface.
The AD5061 incorporates a power-on reset circuit that ensures the DAC output powers up to zero-scale or midscale. The device also has a software power-down mode pin that reduces the typical current consumption to less than 1 μA.

DAC ARCHITECTURE

The DAC architecture of the AD5061 consists of two matched DAC sections. A simplified circuit diagram is shown in Figure 37. The four MSBs of the 16-bit data word are decoded to drive 15 switches, E1 to E15. Each of these switches connects one of 15 matched resistors to either DACGND or V
output.
The remaining 12 bits of the data word drive switches
buffer
REF
S0 to S11 of a 12-bit voltage mode R-2R ladder network.
OUT
2R
2R
2R
2R
S1
S0
V
REF
12-BIT R-2R L ADDER FOUR MSBs DECODED INTO
Figure 37. DAC Ladder Structure
2R
2R
E1
S11
15 EQUAL SEGMENTS
E2
2R
E15

REFERENCE BUFFER

The AD5061 operates with an external reference. The reference input (V
) has an input range of 2 V to VDD − 50 mV. This
REF
input voltage is then used to provide a buffered reference for the DAC core.

SERIAL INTERFACE

The AD5061 has a 3-wire serial interface ( DIN), which is compatible with SPI, QSPI, and MICROWIRE interface standards, as well as most DSPs. See for a timing diagram of a typical write sequence.
SYNC
, SCLK, and
Figure 2
DB15 (MSB) DB0 (LSB)
The write sequence begins by bringing the from the DIN line is clocked into the 24-bit shift register on the falling edge of SCLK. The serial clock frequency can be as high as 30 MHz, making these parts compatible with high speed DSPs. On the 24th falling clock edge, the last data bit is clocked in and the programmed function is executed (that is, a change in the DAC register contents and/or a change in the mode of operation).
At this stage, the
SYNC
line may be kept low or be brought high. In either case, it must be brought high for a minimum of 12 ns before the next write sequence so that a falling edge of SYNC
can initiate the next write sequence. Because the buffer draws more current when V V
= 0.8 V,
IH
should be idled low between write sequences
SYNC
IH
for an even lower power operation of the part. As previously indicated, however, it must be brought high again just before the next write sequence.

INPUT SHIFT REGISTER

The input shift register is 24 bits wide; see Figure 38. PD1 and PD0 are control bits that control which mode of operation the part is in (normal mode or any one of three power-down modes). There is a more complete description of the various
047762-027
modes in the Power-Down Modes section. The next 16 bits are the data bits. These are transferred to the DAC register on the 24th falling edge of SCLK.

SYNC INTERRUPT

In a normal write sequence, the least 24 falling edges of SCLK and the DAC is updated on the
24th falling edge. However, if 24th falling edge, this acts as an interrupt to the write sequence.
The shift register is reset and the write sequence is seen as invalid. Neither an update of the DAC register contents nor a change in the operating mode occurs; see . Figure 41
SYNC
SYNC
SYNC
line low. Data
SYNC
= 1.8 V than it does when
line is kept low for at
is brought high before the
0000 00PD1PD0
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
DATA BITS
0 0
1
1
NORMAL O PERATION
0
3-STATE
1
100kTO GND
0
1
1kTO GND
Figure 38. Input Register Contents
Rev. B | Page 15 of 20
POWER-DOW N MODES
04762-028
Page 16
AD5061

POWER-ON TO ZERO-SCALE OR MIDSCALE

The AD5061 contains a power-on reset circuit that controls the output voltage during power-up. The DAC register is filled with the zero-scale or midscale code and the output voltage is zero­scale or midscale. It remains there until a valid write sequence is made to the DAC. This is useful in applications where it is important to know the state of the output of the DAC while it is in the process of powering up.

SOFTWARE RESET

The device can be put into software reset by setting all bits in the DAC register to 1; this includes writing 1s to Bit D23 to Bit D16, which is not the normal mode of operation. Note that the
interrupt command cannot be performed if a
SYNC
software reset command is started.

POWER-DOWN MODES

The AD5061 contains four separate modes of operation. These modes are software-programmable by setting two bits (DB17 and DB16) in the control register. Table 6 shows how the state of the bits corresponds to the mode of operation of the device.
Table 6. Modes of Operation
DB17 DB16 Operating Mode
0 0 Normal operation Power-down mode: 0 1 3-state 1 0 100 kΩ to GND 1 1 1 kΩ to GND
When both bits are set to 0, the part works normally with its normal power consumption. However, for the three power­down modes, the supply current falls to less than 1 A at 5 V (265 nA at 3 V). Not only does the supply current fall, but the output stage is also internally switched from the output of the amplifier to a resistor network of known values. This has the advantage that the output impedance of the part is known while the part is in power-down mode. There are three different options. The output is connected internally to GND through a 1 kΩ resistor or a 100 kΩ resistor, or it is left open-circuited (3-state). The output stage is illustrated in Figure 39.
OUTPUT
AD5061
DAC
Figure 39. Output Stage During Power-Down
BUFFER
POWER-DOWN
CIRCUITRY
RESISTOR
NETWORK
V
OUT
04762-029
The bias generator, the DAC core and other associated linear circuitry are all shut down when the power-down mode is activated. However, the contents of the DAC register are unaffected when in power-down. The time to exit power-down is typically 2.5 µs for V
= 5 V, and 5 µs for VDD = 3 V;
DD
see Figure 19.

MICROPROCESSOR INTERFACING

AD5061-to-ADSP-2101/ADSP-2103 Interface

Figure 40 shows a serial interface between the AD5061 and the ADSP-2101/ADSP-2103. The ADSP-2101/ADSP-2103 should be set up to operate in the SPORT transmit alternate framing mode. The ADSP-2101/ADSP-2103 SPORT is programmed through the SPORT control register and should be configured as follows: internal clock operation, active low framing, 16-bit word length. Transmission is initiated by writing a word to the Tx register after the SPORT has been enabled.
ADSP-2101/ ADSP-2103
1
ADDITIONAL PINS OMIT TED FOR CLARI TY
1
TFS
DT
SCLK
Figure 40. AD5061-to-ADSP-2101/ADSP-2103 Interface
AD5061
SYNC DIN SCLK
04762-030
SCLK
SYNC
DIN
DB23 DB23 DB0DB0
INVALID WRITE SEQUENCE:
SYNC HIGH BEF ORE 24
TH
FALLING EDGE
Figure 41.
SYNC
Rev. B | Page 16 of 20
VALID WRITE SEQUENCE, OUTP UT UPDATES
Interrupt Facility
ON THE 24THFALLING EDGE
04762-031
Page 17
AD5061

AD5061-to-68HC11/68L11 Interface

Figure 42 shows a serial interface between the AD5061 and the 68HC11/68L11 microcontroller. SCK of the 68HC11/68L11 drives the SCLK pin of the AD5061, while the MOSI output drives the serial data line of the DAC. The
SYNC
signal is derived from a port line (PC7). The set-up conditions for correct operation of this interface require that the 68HC11/ 68L11 be configured so that its CPOL bit is 0 and its CPHA bit is 1. When data is being transmitted to the DAC, the
SYNC
line is taken low (PC7). When the 68HC11/68L11 is configured where its CPOL bit is 0 and its CPHA bit is 1, data appearing on the MOSI output is valid on the falling edge of SCK. Serial data from the 68HC11/68L11 is transmitted in 8-bit bytes with only eight falling clock edges occurring in the transmit cycle. Data is transmitted MSB first. To load data to the AD5061, PC7 is left low after the first eight bits are transferred, a second serial write operation is performed to the DAC, and PC7 is taken high at the end of this procedure.

AD5061-to-80C51/80L51 Interface

Figure 44 shows a serial interface between the AD5061 and the 80C51/80L51 microcontroller. The setup for the interface is: TxD of the 80C51/80L51 drives SCLK of the AD5061 while RxD drives the serial data line of the part. The
SYNC
signal is again derived from a bit-programmable pin on the port. In this case, Port Line P3.3 is used. When data is to be transmitted to the AD5061, P3.3 is taken low. The 80C51/80L51 transmits data only in 8-bit bytes; thus only eight falling clock edges occur in the transmit cycle. To load data to the DAC, P3.3 is left low after the first eight bits are transmitted, and a second write cycle is initiated to transmit the second byte of data. P3.3 is taken high following the completion of this cycle. The 80C51/80L51 out­puts the serial data in a format that has the LSB first. The AD5061 requires its data with the MSB as the first bit received. The 80C51/80L51 transmit routine should take this into account.
80C51/80L51
1
AD5061
1
68HC11/
1
68L11
PC7
SCK
MOSI
1
ADDITIONAL PI NS OMITTED FOR CLARI TY
SYNC
SCLK
DIN
AD5061
1
Figure 42. AD5061-to-68HC11/68L11 Interface

AD5061-to-Blackfin® ADSP-BF53x Interface

Figure 43 shows a serial interface between the AD5061 and the Blackfin ADSP-53x microprocessor. The ADSP-BF53x proces­sor family incorporates two dual-channel synchronous serial ports, SPORT1 and SPORT0, for serial and multiprocessor communications. Using SPORT0 to connect to the AD5061, the setup for the interface is: DT0PRI drives the DIN pin of the AD5061, while TSCLK0 drives the SCLK of the part; the SYNC
is driven from TFS0.
ADSP-BF53x
1
ADDITIONAL PI NS OMITTED FOR CLARI TY
1
DT0PRI
TSCLK0
TFS0
Figure 43. AD5061-to-Blackfin ADSP-BF53x Interface
DIN
SCLK
SYNC
AD5061
1
P3.3
TxD
RxD
1
ADDITIONAL PI NS OMITTED FOR CLARI TY
04762-032

AD5061-to-MICROWIRE Interface

Figure 44. AD5061-to-80C51/80L51 Interface
SYNC
SCLK
DIN
04762-034
Figure 45 shows an interface between the AD5061 and any MICROWIRE-compatible device. Serial data is shifted out on the falling edge of the serial clock and is clocked into the AD5061 on the rising edge of the SK.
MICROWIRE
1
ADDITIONAL PI NS OMITTED FOR CLARI TY
1
CS
SK
SO
Figure 45. AD5061-to-MICROWIRE Interface
AD5061
SYNC
SCLK
DIN
1
04762-035
04762-033
Rev. B | Page 17 of 20
Page 18
AD5061

APPLICATIONS

CHOOSING A REFERENCE

To achieve the optimum performance from the AD5061, thought should be given to the choice of a precision voltage reference. The AD5061 has just one reference input, V voltage on the reference input is used to supply the positive input to the DAC. Therefore, any error in the reference is reflected in the DAC.
There are four possible sources of error when choosing a vol­tage reference for high accuracy applications: initial accuracy, ppm drift, long-term drift, and output voltage noise. Initial accuracy on the output voltage of the DAC leads to a full-scale error in the DAC. To minimize these errors, a reference with high initial accuracy is preferred. Also, choosing a reference with an output trim adjustment, such as the ADR43x family, allows a system designer to trim out system errors by setting a reference voltage to a voltage other than the nominal. The trim adjustment can also be used at the operating temperature to trim out any errors.
REF
. The
Table 7 shows examples of recommended precision references for use as a supply to the AD5061.
Table 7. Precision References Part List for the AD5061
Part No.
Initial Accuracy (mV max)
Temperature Drift (ppm/°C max)
0.1 Hz to 10 Hz Noise (μV p-p typ)
ADR435 ±2 3 (SO-8) 8 ADR425 ±2 3 (SO-8) 3.4 ADR02 ±3 3 (SO-8) 10 ADR02 ±3 3 (SC70) 10 ADR395 ±5 9 (TSOT-23) 8

BIPOLAR OPERATION

The AD5061 has been designed for single-supply operation, but a bipolar output range is also possible using the circuit shown in Figure 47. The circuit shown yields an output voltage range of ±5 V. Rail-to-rail operation at the amplifier output is achievable using an AD8675/AD820/AD8032 or an OP196/OP295.
Because the supply current required by the AD5061 is extremely low, the parts are ideal for low supply applications. The ADR395 voltage reference is recommended. This requires less than 100 μA of quiescent current and can, therefore, drive multiple DACs in one system, if required. It also provides very good noise performance at 8 μV p-p in the 0.1 Hz to 10 Hz range.
7V
5V
AD5061
V
OUT
= 0V TO 5V
3-WIRE
SERIAL
INTERFACE
ADR395
SYNC
SCLK
DIN
Figure 46. ADR395 as Reference to the AD5061
Long-term drift is a measure of how much the reference drifts over time. A reference with a tight long-term drift specification ensures that the overall solution remains relatively stable during its entire lifetime. The temperature coefficient of a reference’s output voltage affects INL, DNL, and TUE. A reference with a tight temperature coefficient specification should be chosen to reduce temperature dependence of the DAC output voltage on ambient conditions.
In high accuracy applications, which have a relatively low noise budget, reference output voltage noise needs to be considered. It is important to choose a reference with as low an output noise voltage as practical for the system noise resolution required. Precision voltage references, such as the ADR435, produce low output noise in the 0.1 Hz to 10 Hz region.
The output voltage for any input code can be calculated as follows:
+
×=
VV
O
65536
×
⎟ ⎠
2R1RD
⎛ ⎜ ⎝
V
1R
2R
×
DDDD
1R
where D represents the input code in decimal (0 to 65536).
With V
= 5 V, R1 = R2 = 10 kΩ,
REF
10
×=D
65536
⎟ ⎠
V
O
V5
This is an output voltage range of ±5 V with 0x0000 correspond­ing to a −5 V output and 0xFFFF corresponding to a +5 V output.
04762-036
+5V
10µF
0.1µF
Figure 47. Bipolar Operation with the AD5061
R1 = 10k
V
REF
AD5061
3-WIRE
SERIAL
INTERFACE
V
BF
V
OUT
R2 = 10k
– AD820/ OP295
+
+5V
–5V
±5V
04762-037
Rev. B | Page 18 of 20
Page 19
AD5061

USING A GALVANICALLY-ISOLATED INTERFACE CHIP

In process control applications in industrial environments, it is often necessary to use a galvanically-isolated interface to protect and isolate the controlling circuitry from any hazardous common-mode voltages that may occur in the area where the
DAC is functioning. iCoupler
2.5 kV. Because the AD5061 uses a 3-wire serial logic interface, the ADuM130x family provides an ideal digital solution for the DAC interface.
The ADuM130x isolators provide three independent isolation channels in a variety of channel configurations and data rates. They operate across the full range from 2.7 V to 5.5 V, providing compatibility with lower voltage systems and enabling a voltage translation functionality across the isolation barrier.
Figure 48 shows a typical galvanically-isolated configuration using the AD5061. The power supply to the part also needs to be isolated; this is accomplished by using a transformer. On the DAC side of the transformer, a 5 V regulator provides the 5 V supply required for the AD5061.
POWER
ADuM130x
® provides isolation in excess of
5V
REGULATOR
SCLKV0AV1ASCLK
SYNCV0BV1BSDI
V
DD
AD5061
V
OUT
0.1µF10µ F

POWER SUPPLY BYPASSING AND GROUNDING

When accuracy is important in a circuit, it is helpful to carefully consider the power supply and ground return layout on the board. The printed circuit board containing the AD5061 should have separate analog and digital sections, each having its own area of the board. If the AD5061 is in a system where other devices require an AGND-to-DGND connection, then the connection should be made at one point only. This ground point should be as close as possible to the AD5061.
The power supply to the AD5061 should be bypassed with 10 μF and 0.1 μF capacitors. The capacitors should be physically as close as possible to the device with the 0.1 μF capacitor ideally right up against the device. The 10 μF capacitors are the tantalum bead type. It is important that the 0.1 μF capacitor has low effective series resistance (ESR) and effective series inductance (ESI), as do common ceramic types of capacitors. This 0.1 μF capacitor provides a low impedance path to ground for high frequencies caused by transient currents due to internal logic switching.
The power supply line itself should have as large a trace as possible to provide a low impedance path and reduce glitch effects on the supply line. Clocks and other fast switching digital signals should be shielded from other parts of the board by digital ground. Avoid crossover of digital and analog signals, if possible. When traces cross on opposite sides of the board, ensure that they run at right angles to each other to reduce feedthrough effects through the board. The best board layout technique is the microstrip technique where the component side of the board is dedicated to the ground plane only, and the signal traces are placed on the solder side. However, this is not always possible with a 2-layer board.
DINV0CV1CDATA
GND
Figure 48. AD5061 with a Galvanically-Isolated Interface
04762-038
Rev. B | Page 19 of 20
Page 20
AD5061
0
0

OUTLINE DIMENSIONS

INDICATOR
.15 MAX .05 MIN
1.70
1.60
1.50
1.30
1.15
0.90
PIN 1
3.00
2.90
2.80
76
8
1234
1.95 BSC
5
0.38 MAX
0.22 MIN
0.65 BSC
1.45 MAX
0.95 MIN
3.00
2.80
2.60
SEATING PLANE
0.22 MAX
0.08 MIN
0.60
BSC
0.60
0.45
0.30
COMPLIANT TO JEDEC STANDARDS MO-178-BA
12-16-2008-A
Figure 49. 8-Lead Small Outline Transistor Package [SOT-23]
(RJ-8)
Dimensions shown in millimeters

ORDERING GUIDE

Temperature
Model1
AD5061BRJZ-1REEL7
Range INL Description
−40°C to +85°C 4 LSB 2.7 V to 5.5 V, Reset to 0 V 8-Lead SOT-23 RJ-8 D43 AD5061BRJZ-1500RL7 −40°C to +85°C 4 LSB 2.7 V to 5.5 V, Reset to 0 V 8-Lead SOT-23 RJ-8 D43 AD5061BRJZ-2REEL7
−40°C to +85°C 4 LSB 2.7 V to 5.5 V, Reset to Midscale 8-Lead SOT-23 RJ-8 D44 AD5061BRJZ-2500RL7 −40°C to +85°C 4 LSB 2.7 V to 5.5 V, Reset to Midscale 8-Lead SOT-23 RJ-8 D44 AD5061YRJZ-1500RL7 −40°C to +125°C 4 LSB 2.7 V to 5.5 V, Reset to 0 V 8-Lead SOT-23 RJ-8 D6G AD5061YRJZ-1REEL7 −40°C to +125°C 4 LSB 2.7 V to 5.5 V, Reset to 0 V 8-Lead SOT-23 RJ-8 D6G EVAL-AD5061EBZ
1
Z = RoHS Compliant Part.
Evaluation Board
Package Description
Package Option Branding
©2005–2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D04762-0-5/11(B)
Rev. B | Page 20 of 20
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