Channel-Channel Matching, ⴞ0.1% Gain Error
Channel-Channel Isolation, >80 dB
AC-Coupled Signal Conditioning Included
Selectable Bipolar Input Voltage Range
(ⴞ0.5 V, ⴞ1.0 V, ⴞ2.0 V)
Gain Flatness up to Nyquist: < 0.5 dB
80 dB Spurious-Free Dynamic Range
Twos Complement Output Format
+3.3 V or +5 V CMOS-Compatible Output Levels
65 MSPS performance. The AD10265 uses innovative highdensity circuit design and laser-trimmed thin-film resistor
networks to achieve exceptional matching and performance
while still maintaining excellent isolation, and providing for
significant board area savings.
The AD10265 operates with ±5.0 V for the analog signal
conditioning with a separate +3.3 V supply for the analog-todigital conversion. Each channel is completely independent
allowing operation with independent Encode and Analog inputs. The AD10265 also offers the user a choice of Analog
Input Signal ranges to further minimize additional external
signal conditioning, while still remaining general-purpose.
The AD10265 is packaged in a 68-lead Ceramic Gull Wing
Package, footprint compatible with the earlier generation
AD10242 (12-bit, 40 MSPS). Manufacturing is done on
Analog Devices’ MIL-38534 Qualified Manufacturers Line
(QML) and components are available up to Class-H (–55°C to
+125°C). The AD6640 internal components are manufactured
on Analog Devices’ high speed complementary bipolar process
(XFCB).
PRODUCT DESCRIPTION
The AD10265 is a full channel ADC solution with on-module
signal conditioning for improved dynamic performance and
fully matched channel-to-channel performance. The module
includes two wide dynamic range AD6640 ADCs. Each
AD6640 has an AD9631/AD9632 ac-coupled amplifier front
end. The AD6640s have on-chip track-and-hold circuitry, and
utilize an innovative multipass architecture, to achieve 12-bit,
FUNCTIONAL BLOCK DIAGRAM
AINA2AINA1AINA3
(LSB) D0A
D1A
D2A
D3A
D4A
D5A
D6A
D7A
D8A
9
TIMING
AD9632
AIN
AD6640
OUTPUT BUFFERING
AD9631
AIN
AD10265
12
PRODUCT HIGHLIGHTS
1. Guaranteed sample rate of 65 MSPS.
2. Input amplitude options, user configurable.
3. Input signal conditioning included; both channels matched
for gain.
4. Fully tested/characterized performance for full channel.
5. Footprint compatible family; 68-lead LCCC.
AINB3
AINB2AINB1
AD9632
AIN
OUTPUT BUFFERING
AIN
AD6640
12
7
AD9631
TIMING
5
ENCODEB
ENCODEB
D11B (MSB)
D10B
D9B
D8B
D7B
ENCODEA
ENCODEA
D9A D10A
D11A
(MSB)
REV. 0
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
Power Dissipation (Total)FullI1, 2, 32.12.4W
Power Supply Rejection Ratio (PSRR)FullIV7, 80.010.02% FSR/% V
NOTES
1
Gain tests are performed on AIN1 over specified input voltage range.
2
Input capacitance specifications show only ceramic package capacitance.
3
Full power bandwidth is the frequency at which the spectral power of the fundamental frequency (as determined by FFT analysis) is reduced by 3 dB.
4
ENCODE driven by single-ended source; ENCODE bypassed to ground through 0.01 µF capacitor.
5
ENCODE may also be driven differentially in conjunction with ENCODE; see “Encoding the AD10265” for details.
6
Minimum and maximum conversion rates allow for variation in Encode Duty Cycle of 50% ± 5%.
7
Analog Input signal power at –1 dBFS; signal-to-noise ratio (SNR) is the ratio of signal level to total noise (first 5 harmonics removed). Encode = 65 MSPS.
8
Analog Input signal power at –1 dBFS; signal-to-noise and distortion (SINAD) is the ratio of signal level to total noise + harmonics. Encode = 65 MSPS.
9
Analog Input signal equal –1 dBFS; SFDR is ratio of converter full scale to worst spur.
10
Both input tones at –7 dBFS; two tone intermodulation distortion (IMD) rejection is the ratio of either tone to the worst 3rd order intermod product. f1 = 17.0 MHz
± 100 kHz, f 2 = 18.0 MHz ± 100 kHz.
11
Channel-to-channel isolation tested with A channel/50 ohm terminated <AIN2 grounded, and a full-scale signal applied to B channel (AIN1).
All specifications guaranteed within 100 ms of initial power up regardless of sequencing.
Specifications subject to change without notice.
9
FullII5, 67580dBFS
FullII5, 67279dBFS
FullII5, 67279dBFS
10
11
+25°CIV 1280dB
– 0.2V
CC
S
REV. 0
–3–
Page 4
AD10265
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
1
ParameterMinMaxUnits
ELECTRICAL
V
Voltage07V
CC
Voltage–70V
V
EE
Analog Input VoltageV
EE
V
V
CC
Analog Input Current–10+10mA
Digital Input Voltage (ENCODE)0AV
CC
V
ENCODE, ENCODE Differential Voltage4V
Digital Output Current–10+10mA
ENVIRONMENTAL
2
Operating Temperature (Case)–55+125 °C
Maximum Junction Temperature+175 °C
Lead Temperature (Soldering, 10 sec)+300 °C
Storage Temperature Range (Ambient)–65+150 °C
NOTES
1
Absolute maximum ratings are limiting values to be applied individually, and
beyond which the serviceability of the circuit may be impaired. Functional
operability is not necessarily implied. Exposure to absolute maximum rating
conditions for an extended period of time may affect device reliability.
AD10265AZ–25°C to +85°C (Case)68-Lead Leaded Ceramic Chip CarrierZ-68A
AD10265/PCB+25°CEvaluation Board with AD10265AZ
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD10265 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
–4–
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Page 5
AD10265
PIN FUNCTION DESCRIPTIONS
Pin No.NameFunction
1SHIELDInternal Ground Shield between channels.
2, 5, 9–11, 26, 27GNDAA Channel Ground. A and B grounds should be connected as close to the device as possible.
3, 4, 12, 15, 16,NCNo Connect. Pins 15 and 17 are internal test pins: it is recommended to connect them to
34, 35, 55–57GND
6A
7A
8A
13AV
14AV
17–25, 31–33D0A–D11ADigital Outputs for ADC A. D0 (LSB).
28ENCODEAENCODE is complement of ENCODE.
29ENCODEAData conversion initiated on rising edge of ENCODE input.
30DV
36–42, 45–49D0B–D11BDigital Outputs for ADC B. D0 (LSB).
43, 44, 53, 54,GNDBB Channel Ground. A and B grounds should be connected as close to the device
58–61, 65, 68as possible.
50DV
51ENCODEBData conversion initiated on rising edge of ENCODE input.
52ENCODEBENCODE is complement of ENCODE.
62A
63A
64A
66AV
67AV
A1Analog Input for A side ADC (nominally ±0.5 V).
IN
A2Analog Input for A side ADC (nominally ±1.0 V).
IN
A3Analog Input for A side ADC (nominally ±2.0 V).
IN
EE
CC
CC
CC
B1Analog Input for B side ADC (nominally ±0.5 V).
IN
B2Analog Input for B side ADC (nominally ±1.0 V).
IN
B3Analog Input for B side ADC (nominally ±2.0 V).
IN
CC
EE
Analog Negative Supply Voltage (nominally –5.0 V). For A side ADC.
Analog Positive Supply Voltage (nominally +5.0 V). For A side ADC.
Digital positive supply voltage (nominally +3.3 V) for A side ADC.
Digital Positive Supply Voltage (nominally +3.3 V) for B side ADC.
Analog Positive Supply Voltage (nominally +5.0 V). For B side ADC.
Analog Negative Supply Voltage (nominally –5.0 V). For B side ADC.
The analog input frequency at which the spectral power of the
fundamental frequency (as determined by the FFT analysis) is
reduced by 3 dB.
Aperture Delay
The delay between the 50% point of the rising edge of the
ENCODE command and the instant at which the analog input
is sampled.
Aperture Uncertainty (Jitter)
The sample-to-sample variation in aperture delay.
Differential Nonlinearity
The deviation of any code from an ideal 1 LSB step.
Encode Pulse Width/Duty Cycle
Pulse width high is the minimum amount of time that the
ENCODE pulse should be left in logic “1” state to achieve rated
performance; pulse width low is the minimum time ENCODE
pulse should be left in low state. At a given clock rate, these
Encode
specs define an acceptable
Harmonic Distortion
duty cycle.
The ratio of the rms signal amplitude to the rms value of the
worst harmonic component.
Integral Nonlinearity
The deviation of the transfer function from a reference line
measured in fractions of 1 LSB using a “best straight line” determined by a least square curve fit.
Minimum Conversion Rate
The encode rate at which the SNR of the lowest analog signal
frequency drops by no more than 3 dB below the guaranteed
limit.
Maximum Conversion Rate
The encode rate at which parametric testing is performed.
Output Propagation Delay
The delay between the 50% point of the rising edge of ENCODE
command and the time when all output data bits are within
valid logic levels.
Power Supply Rejection Ratio
The ratio of a change in input offset voltage to a change in
power supply voltage.
Signal-to-Noise-and-Distortion (SINAD)
The ratio of the rms signal amplitude (set at 1 dB below full
scale) to the rms value of the sum of all other spectral components, including harmonics but excluding dc.
Signal-to-Noise Ratio (without Harmonics)
The ratio of the rms signal amplitude (set at 1 dB below full
scale) to the rms value of the sum of all other spectral components, excluding the first five harmonics and dc.
Spurious-Free Dynamic Range
The ratio of the rms signal amplitude to the rms value of the
peak spurious spectral component. The peak spurious component may or may not be a harmonic. May be reported in dBc
(i.e., degrades as signal levels is lowered) or in dBFS (always
related back to converter full scale).
Two-Tone Intermodulation Distortion Rejection
The ratio of the rms value of either input tone to the rms value
of the worst third order intermodulation product; reported in
dBc.
Two-Tone SFDR
The ratio of the rms value of either input tone to the rms value
of the peak spurious component. The peak spurious component may or may not be an IMD product. May be reported
in dBc (i.e., degrades as signal levels is lowered) or in dBFS
(always related back to converter full scale).
–6–
REV. 0
Page 7
AD10265
A
ENCODE
DIGITAL
OUTPUTS
N
IN
t
A
t
OD
N – 2
N + 1
N + 2N + 3
N – 1NN + 1N + 2
Figure 1. Timing Diagram
EQUIVALENT CIRCUITS
AINA3
A2
A
IN
A1
A
IN
Figure 3. Analog Input Stage
R4
200V
R3
100V
AV
N + 4N + 5
TTL CLOCK
10MHz
f
AINA2
ENCD11
ENC
AINA3
AINA1
NOTE: ALL 65V SUPPLY PINS BYPASSED
TO GND WITH A 0.1mF CAPACITOR
1/2
AD10265
SHOWN
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
Figure 2. Equivalent Burn-In Circuit
DV
CC
CURRENT
MIRROR
DV
CC
V
REF
CC
D0 – D11
ENCODE
AV
CC
R1
17kV
8kV
R2
TIMING
CIRCUITS
Figure 4. Encode Inputs
R1
17kV
R2
8kV
AV
CC
ENCODE
CURRENT
MIRROR
Figure 5. Digital Output Stage
REV. 0
–7–
Page 8
AD10265–Typical Performance Characteristics
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
POWER RELATIVE TO FULL SCALE – dB
–130
–140
081921024 2048 3072 4096 5120 6144 7168
FREQUENCY – MHz
ENCODE = 65.0MSPS
= 1.24MHz
A
IN
= –1.004dBFS
A
IN
SNR = 64.88dB
SFDR = 78.81dBc
Figure 6. Single Tone @ 1.24 MHz
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
POWER RELATIVE TO FULL SCALE – dB
–130
–140
081921024 2048 3072 4096 5120 6144 7168
FREQUENCY – MHz
ENCODE = 65.0MSPS
A
= 17MHz
IN
A
= –1dBFS
IN
SNR = 63.83dB
SFDR = 78.22dBc
Figure 7. Single Tone @ 17 MHz
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
POWER RELATIVE TO FULL SCALE – dB
–130
–140
081921024 2048 3072 4096 5120 6144 7168
FREQUENCY – MHz
ENCODE = 65.0MSPS
AIN = 17MHz AND 18MHz
AIN = –7.067dBFS
SFDR = 78dBc
Figure 9. Two-Tone FFT @ 17 MHz/18 MHz
66
ENCODE = 65MHz
65
64
63
SNR – dB
62
61
60
1.2432
ANALOG FREQUENCY – MHz
Figure 10. SNR vs. A
+258C
+1258C
–558C
17
IN
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
POWER RELATIVE TO FULL SCALE – dB
–130
–140
081921024 2048 3072 4096 5120 6144 7168
FREQUENCY – MHz
ENCODE = 65.0MSPS
AIN = 32MHz
A
= –1.021dBFS
IN
SNR = 64.11dB
SFDR = 78.14dBc
Figure 8. Single Tone @ 32 MHz
90
80
70
SFDR – dBFS
60
50
40
SFDR – dBc
30
20
10
0
–60.09
–70.18–50.18
FUNDAMENTAL – dBFS
SFDR – dBc
SFDR – 75dB
AIN = 17MHz
ENCODE RATE 65MHz
–39.92 –30.07 –20.02 –10.1 –1.099
Figure 11. Single Tone SFDR (AIN @ 17 MHz) vs. Power
Level
–8–
REV. 0
Page 9
90
FREQUENCY – MHz
–2
–7
0.02
–5
–4
–3
–6
0.060.10.5
–1
0
12016060
LEVEL – dBFS
ENCODE RATE = 65MHz
ROOM TEMPERATURE
–8
–9
–10
0.040.080.32014090
80 SFDR – dBc
70
60
50
40
30
20
SNR, WORST SPUR – dB, dBc
10
0
1.2417
SNR – dB
ENCODE FREQUENCY = 65MHz
A
= –1dBFS
IN
32376580100
ANALOG INPUT FREQUENCY – MHz
Figure 12. SNR/Harmonics to A
> Nyquist MSPS
IN
AD10265
Figure 13. Gain Flatness vs. Input Frequency
REV. 0
–9–
Page 10
AD10265
THEORY OF OPERATION
Refer to the Functional Block Diagram. The AD10265 employs three monolithic ADI components per channel (AD9631
AD9632 and AD6640), along with multiple passive resistor
networks and decoupling capacitors to fully integrate a complete 12-bit analog-to-digital converter.
The input signal is first passed through a precision laser-trimmed
resistor divider, allowing the user to externally select operation
with a full-scale signal of ±0.5 V, ±1.0 V, or ±2.0 V by choosing
the proper input terminal for the application.
Since the AD6640 implements a true differential analog input,
the AD9631/AD9632 have been configured to provide a differential input for the AD6640 ADC through ac-coupling. The ac
signal gain of the AD9631/AD9632 can be trimmed to provide a
constant differential input to the AD6640. This allows the converter to be used in multiple system applications without the
need for external gain circuit normally requiring trim. The
AD9631/AD9632 were chosen for their superior ac performance
and input drive capabilities, which have limited the ability of
many amplifiers to drive high performance ADCs. As new amplifiers are developed, pin-compatible improvements are planned
to incorporate the latest operational amplifier technology.
APPLYING THE AD10265
Encoding the AD10265
Best performance is obtained by driving the encode pins differentially. However, the AD10265 is also designed to interface
with TTL and CMOS logic families. The source used to drive
the ENCODE pin(s) must be clean and free from jitter. Sources
with excessive jitter will limit SNR and overall performance.
TTL OR CMOS
SOURCE
0.01mF
Figure 14. Single-Ended TTL/CMOS Encode
The AD10265 encode inputs are connected to a differential
input stage (see Figure 4 under Equivalent Circuits). With no
input connected to either ENCODE pin, the voltage divider
biases the inputs to 1.6 volts. For TTL or CMOS usage, the
encode source should be connected to ENCODE. ENCODE
should be decoupled using a low inductance or microwave chip
capacitor to ground.
If a logic threshold other than the nominal +1.6 V is required,
the following equations show how to use an external resistor,
Rx, to raise or lower the trip point (see Figure 4, R1 = 17 kΩ,
R2 = 8 kΩ).
RR
52
V
=
1
RR RRx R Rx
12 12
x
++
to lower logic threshold.
AD10265
ENCODE
ENCODE
ENCODE
SOURCE
0.01mF
ENCODE
V
1
ENCODE
R
x
AD10265
+5V
R1
R2
Figure 15. Lower Threshold for Encode
R
V
52
=
1
R
2
RRx
1
+
RRx
1
+
to raise logic threshold.
AV
CC
R
x
ENCODE
SOURCE
0.01mF
V
1
ENCODE
ENCODE
AD10265
+5V
R1
R2
Figure 16. Raise Logic Threshold for Encode
While the single-ended encode will work well for many applications, driving the encode differentially will provide increased
performance. Depending on circuit layout and system noise, a
1 dB to 3 dB improvement in SNR can be realized. It is recommended that differential TTL logic be used, however, because
most TTL families that support complementary outputs are not
delay or slew rate matched. Instead, it is recommended that the
encode signal be ac-coupled into the ENCODE and ENCODE
pins.
The simplest option is shown below. The low jitter TTL signal
is coupled with a limiting resistor, typically 100 Ω, to the pri-
mary side of an RF transformer (these transformers are inexpensive and readily available; part number in Figure 17 is from MiniCircuits). The secondary side is connected to the ENCODE
and ENCODE pins of the converter. Since both encode inputs
are self-biased, no additional components are required.
100V
TTLENCODE
T1–1T
AD10265
ENCODE
Figure 17. TTL Source—Differential Encode
A clean sine wave may be substituted for a TTL clock. In this
case, the matching network is shown below. Select a transformer
ratio to match source and load impedances. The input imped-
ance of the AD10265 encode is approximately 11 kΩ differen-
tially. Therefore “R,” shown in Figure 18, may be any value that
is convenient for available drive power.
SINE
SOURCE
T1–1T
ENCODE
R
AD10265
ENCODE
–10–
Figure 18. Sine Source—Differential Encode
REV. 0
Page 11
AD10265
If a low jitter ECL clock is available, another option is to accouple a differential ECL signal to the encode input pins as
shown below. The capacitors shown here should be chip capacitors, but do not need to be of the low inductance variety.
ECL
GATE
510V
0.1mF
0.1mF
510V
–V
S
ENCODE
ENCODE
AD10265
Figure 19. Differential ECL for Encode
As a final alternative, the ECL gate may be replaced by an ECL
comparator. The input to the comparator could then be a logic
signal or a sine signal.
AD96687 (1/2)
50V
510V
0.1mF
0.1mF
510V
–V
S
ENCODE
ENCODE
AD10265
Figure 20. ECL Comparator for Encode
USING THE FLEXIBLE INPUT
The AD10265 has been designed with the user’s ease of operation in mind. Multiple input configurations have been included
on board to allow the user a choice of input signal levels and
input impedance. While the standard inputs are ±0.5 V, ±1.0 V
and ±2.0 V, the user can select the input impedance of the
AD10265 on any input by using the other inputs as alternate
locations for GND or an external resistor. The following
chart summarizes the impedance options available at each
input location:
1 = 100 Ω when A
A
IN
A
1 = 75 Ω when A
IN
A
1 = 50 Ω when A
IN
2 = 200 Ω when A
A
IN
A
2 = 100 Ω when A
IN
A
2 = 75 Ω when A
IN
2 = 300 Ω, with A
A
IN
A
2 = 50 Ω when A
IN
A
2 = 100 Ω, with A
IN
3 = 400 Ω.
A
IN
A
3 = 100 Ω when AIN3 Has an External Resistor of 133 Ω to GND.
IN
A
3 = 75 Ω when AIN3 Has an External Resistor of 92 Ω to GND.
IN
3 = 50 Ω when AIN3 Has an External Resistor of 57 Ω to GND.
A
IN
2 and AIN3 Are Open.
IN
3 Is Shorted to GND.
IN
2 Is Shorted to GND.
IN
3 Is Open.
IN
3 Is Shorted to GND.
IN
2 to AIN3 Has an External Resistor of
IN
3 Shorted to GND.
IN
2 to AIN3 Has an External Resistor of
IN
3 Shorted to GND.
IN
GROUNDING AND DECOUPLING
Analog and Digital Grounding
Proper grounding is essential in any high speed, high resolution
system. Multilayer printed circuit boards (PCBs) are recommended to provide optimal grounding and power schemes. The
use of ground and power planes offers distinct advantages:
1. The minimization of the loop area encompassed by a signal
and its return path.
2. The minimization of the impedance associated with ground
and power paths.
3. The inherent distributed capacitor formed by the power
plane, PCB insulation and ground plane.
These characteristics result in both a reduction of electromagnetic interference (EMI) and an overall improvement in
performance.
It is important to design a layout that prevents noise from coupling to the input signal. Digital signals should not be run in
parallel with input signal traces and should be routed away from
the input circuitry. The AD10265 does not distinguish between
analog and digital ground pins as the AD10265 should always
be treated as an analog component. All ground pins should be
connected together directly under the AD10265. The PCB
should have a ground plane covering all unused portions of the
component side of the board to provide a low impedance path
and manage the power and ground currents. The ground plane
should be removed from the area near the input pins to reduce
stray capacitance.
LAYOUT INFORMATION
The schematic of the evaluation board (Figure 21) represents a
typical implementation of the AD10265. The pinout of the
AD10265 is very straightforward and facilitates ease of use
and the implementation of high frequency/high resolution
design practices. It is recommended that high quality ceramic
chip capacitors be used to decouple each supply pin to
ground directly at the device. All capacitors can be standard
high quality ceramic chip capacitors.
Care should be taken when placing the digital output runs.
Because the digital outputs have such a high slew rate, the
capacitive loading on the digital outputs should be minimized.
Circuit traces for the digital outputs should be kept short and
connect directly to the receiving gate. Internal circuitry buffers
the outputs of the AD6640 ADC through a resistor network to
eliminate the need to externally isolate the device from the
receiving gate.
The AD10265 evaluation board (Figure 22) is designed to
provide optimal performance for evaluation of the AD10265
analog-to-digital converter. The board encompasses everything
needed to ensure the highest level of performance for evaluating
the AD10265.
+5VAB–5VABGND
U4
J10
B1
A
IN
C21
ENCB
U1
C16
PIN 1
J6
B2
A
IN
J5
B3
A
IN
J8
Power to the analog supply pins is connected via banana jacks.
The analog supply powers the crystal oscillator, the associated
components and amplifiers, and the analog section of the
AD10265. The digital outputs of the AD10265 are powered via
Pin 1 of either J1 or J2 found on the digital interface connector
with +3.3 V. Contact the factory if additional layout or applications assistance is required.
J2
R30
R29
R28
R27
R26
R25
C17
R36
R35
R34
R33
R32
R31
U8
U9
J3
A1
A
IN
J4
A2
A
IN
J7
+5VAA–5VAAGND
Figure 22. Evaluation Board Mechanical Layout
R18
R17
R16
U6
C23
U7
J9
A3
A
IN
ENCA
R22
R21
R20
R19
C2
C10
R14
R13
R24
R23
AD10265 EVALUATION BOARD
GS01685 ( 2 )
R15
YW
J1
REV. 0
–13–
Page 14
AD10265
Figure 23. Top Layer
–14–
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Page 15
AD10265
REV. 0
Figure 24. Bottom Layer
–15–
Page 16
AD10265
Figure 25. Power Plane Layer
–16–
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Page 17
AD10265
REV. 0
Figure 26. Ground Plane Layer
–17–
Page 18
AD10265
0.060 (1.52)
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
68-Lead Leaded Ceramic Chip Carrier
(Z-68A)
1.180 (29.97) SQ
0.950 (24.13) SQ
961
10
PIN 1
60
0.240 (6.096)
0.800
(20.32)
TOP VIEW
(PINS DOWN)
26
27
0.050 (1.27)
0.018 (0.457)
44
43
–18–
REV. 0
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