Datasheet ACT-F512K8N-150P4Q, ACT-F512K8N-150F7Q, ACT-F512K8N-150F6Q, ACT-F512K8N-120P4Q, ACT-F512K8N-120F7Q Datasheet (ACT)

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Features

ACT–F512K8 High Speed

4 Megabit Monolithic FLASH

CIRCUIT TECHNOLOGY

■ Low Power Monolithic 512K x 8 FLASH

■ TTL Compatible Inputs and CMOS Outputs

■ Access Times of 60, 70, 90, 120 and 150ns

■ +5V Programing, 5V ±10% Supply

■ 100,000 Erase / Program Cycles

■ Low Standby Current

■ Page Program Operation and Internal

Program Control Time

■ Supports Full Chip Erase

■ Embedded Erase and Program Algorithms

■ Supports Full Chip Erase

■ MIL-PRF-38534 Compliant Circuits Available

Block Diagram – DIP (P4) & Flat Packages (F6,F7)

CE

WE

OE

A0 – A18

Vss
Vcc

Pin Description

I/O

0-7 Data I/O

A

0–18 Address Inputs

WE

CE

OE

V

CC Power Supply

V

SS Ground

NC Not Connected

512Kx8

8

I/O0-7

Write Enable

Chip Enable

Output Enable

■ Industry Standard Pinouts

■ Packaging – Hermetic Ceramic

● 32 Lead, 1.6" x .6" x .20" Dual-in-line Package (DIP),

Aeroflex code# "P4"

● 32 Lead, .82" x .41" x .11" Ceramic Flat Package

(FP), Aeroflex code# "F6"

● 32 Lead, .82" x .41" x .132" Ceramic Flat Package

(FP Lead Formed), Aeroflex code# "F7"

■ Sector Architecture

● 8 Equal size sectors of 64K bytes each

● Any Combination of Sectors ccan be erased with one

command sequence.

■ Commercial, Industrial and Military

Temperature Ranges

■ DESC SMD Pending

5962-96692 (P4,F6,F7)

General Description

The ACT–F512K8 is a high
speed, 4 megabit CMOS
monolithic Flash module
designed for full temperature
range military, space, or high
reliability applications.

This device is input TTL and
output CMOS compatible. The
command register is written by
bringing WE

IL), while CE is low and OE is

(V
at logic high level (V
is accomplished by chip Enable

) and Output Enable (OE)

(CE
being logically active, see
Figure9. Access time grades of
60ns, 70ns, 90ns, 120ns and
150ns maximum are standard.

The ACT–F512K8 is
available in a choice of

to a logic low level

IH). Reading

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General Description, Cont’d,

hermetically sealed ceramic packages; a
32 lead .82" x .41" x .11"flat package in
both formed or unformed leads or a 32 pin

1.6"x.60" x.20" DIP package for operation
over the temperature range -55°C to
+125°C and military environmental
conditions.

The flash memory is organized as
512Kx8 bits and is designed to be
programmed in-system with the standard
system 5.0V Vcc supply. A 12.0V V

PP is

not required for write or erase operations.
The device can also be reprogrammed with
standard EPROM programmers (with the
proper socket).

The standard ACT–F512K8 offers
access times between 60ns and 150ns,
allowing operation of high-speed
microprocessors without wait states. To
eliminate bus contention, the device has
separate chip enable (CE

) and output enable (OE) controls. The

(WE

), write enable

ACT–F512K8 is command set compatible
with JEDEC standard 1 Mbit EEPROMs.
Commands are written to the command
register using standard microprocessor
write timings. Register contents serve as
input to an internal state-machine which
controls the erase and programming
circuitry. Write cycles also internally latch
addresses and data needed for the
programming and erase operations.

Reading data out of the device is similar
to reading from 12.0V Flash or EPROM
devices. The ACT–F512K8 is programmed
by executing the program command
sequence. This will invoke the Embedded
Program Algorithm which is an internal
algorithm that automatically times the
program pulse widths and verifies proper
cell margin. Typically, each sector can be
programmed and verified in less than 0.3

second. Erase is accomplished by
executing the erase command sequence.
This will invoke the Embedded Erase
Algorithm which is an internal algorithm
that automatically preprograms the array, (if
it is not already programmed before)
executing the erase operation. During
erase, the device automatically times the
erase pulse widths and verifies proper cell
margin.

The device is typically erased and
verified in 1.5 seconds (if already
completely preprogrammed).

Also the device features a sector erase
architecture. The sector mode allows for
64K byte blocks of memory to be erased
and reprogrammed without affecting other
blocks. The ACT-F512K8 is erased when
shipped from the factory.

The device features single 5.0V power
supply operation for both read and write
functions. lnternally generated and
regulated voltages are provided for the
program and erase operations. A low V

CC

detector automatically inhibits write
operations on the loss of power. The end of
program or erase is detected by Data
Polling of D7 or by the Toggle Bit feature on
D6. Once the end of a program or erase
cycle has been completed, the device
internally resets to the read mode.

All bits of each die, or all bits within a
sector of a die, are erased via
Fowler-Nordhiem tunneling. Bytes are
programmed one byte at a time by hot
electron injection.

A DESC Standard Military Drawing
(SMD) number is pending.

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2

z

Absolute Maximum Ratings

Parameter Symbol Range Units

C -55 to +125 °C

Case Operating Temperature
Storage Temperature Range
Supply Voltage Range
Signal Voltage Range (Any Pin Except A9) Note 1
Maximum Lead Temperature (10 seconds)
Data Retention
Endurance (Write/Erase cycles)
A9 Voltage for sector protect, Note 2
Note 1. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, inputs may undershoot V

up to 20ns. Maximum DC voltage on input and I/O pins is V
overshoot to V

Note 2. Minimum DC input voltage on A9 is -0.5V. During voltage transitions, A9 may undershoot VSS to -2.0V for periods of up to 20ns.

CC + 2.0V for periods up to 20 ns.

T

STG -65 to +150 °C

T

CC -2.0 to +7.0 V

V

G -2.0 to +7.0 V

V

300 °C

10 Years

100,000 Minimum

ID -2.0 to +14.0 V

V

CC + 0.5V. During voltage transitions, inputs and I/O pins may

SS to -2.0v for periods of

Maximum DC input voltage on A9 is +12.5V which may overshoot to 14.0V for periods up to 20ns.

Normal Operating Conditions

Symbol Parameter Minimum Maximum Units

CC

V

V
V

Tc

V

Power Supply Voltage

IH

Input High Voltage

IL

Input Low Voltage
Operating Temperature (Military)

ID

A9 Voltage for sector protect

+4.5 +5.5 V
+2.0 V

+ 0.5 V

CC

-0.5 +0.8 V

-55 +125 °C

11.5 12.5 V

Capacitance

(VIN= 0V, f = 1MHz, Tc = 25°C)

Symbol Parameter Maximum Units

AD

C

C
C

C
C

A0 – A18 Capacitance

OE

OE Capacitance

WE

Write Enable Capacitance

CE

Chip Enable Capacitance

I/O

I/O0 – I/O7 Capacitance

15 pF
15 pF
15 pF
15 pF
15 pF

Parameters Guaranteed but not tested

DC Characteristics – CMOS Compatible

(Vcc = 5.0V, Vss = 0V, Tc = -55°C to +125°C, unless otherwise indicated)

Parameter Sym Conditions

LI

I

CC = 5.5V, VIN = GND to VCC

Input Leakage Current
Output Leakage Current
Active Operating Supply Current for Read (1)
Active Operating Supply Current for Program or Erase (2)
Operating Standby Supply Current
Output Low Voltage
Output High Voltage
Low Power Supply Lock-Out Voltage (4)

V

LOX32

I

I
I
I

V

V

CC = 5.5V, VIN = GND to VCC

V

CC1
CC2
CC3

OL

V

OH

LKO 3.2 V

= VIL, OE = VIH, f = 5MHz

CE

= VIL, OE = VIH

CE

CC = 5.5V, CE = VIH, f = 5MHz

V
IOL = +8.0 mA, VCC = 4.5V
IOH = –2.5 mA, VCC = 4.5V

Note 1. The Icc current listed includes both the DC operating current and the frequency dependent component (At 6 MHz). The frequency

component typically is less than 2 mA/MHz, with OE
Note 2. Icc active while Embedded Algorithm (Program or Erase) is in progress.
Note 3. DC Test conditions: V

IL = 0.3V, VIH = VCC - 0.3V, unless otherwise indicated.

at VIN.

Note 4. Parameter Guaranteed by design, but not tested.

Speeds 60, 70, 90, 120 & 150ns

Minimum Maximum Units

10 µA
10 µA
50 mA
60 mA

1.6 mA

0.45 V

0.85 x V

CC V

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3

Parameter

Read Cycle Time
Address Access Time
Chip Enable Access Time
Output Enable to Output Valid
Chip Enable to Output High Z (1)
Output Enable High to Output High Z(1)
Output Hold from Address, CE

or OE Change, Whichever is First

Note 1. Guaranteed by design, but not tested

AC Characteristics – Write/Erase/Program Operations, WE Controlled

Parameter

Write Cycle Time
Chip Enable Setup Time
Write Enable Pulse Width
Address Setup Time
Data Setup Time
Data Hold Time
Address Hold Time
Write Enable Pulse Width High
Duration of Byte Programming Operation

Typ = 16 µs
Sector Erase Time
Read Recovery Time before Write
Vcc Setup Time
Chip Programming Time
Chip Erase Time

AC Characteristics – Read Only Operations

(Vcc = 5.0V, Vss = 0V, Tc = -55°C to +125°C)

Symbol

JEDEC Stand’d

AVAV tRC 60 70 90 120 150 ns

t

AVQV tACC 60 70 90 120 150 ns

t

ELQV tCE 60 70 90 120 150 ns

t

GLQV tOE 30 35 35 50 55 ns

t

EHQZ tDF 20 20 20 30 35 ns

t

GHQZ tDF 20 20 20 30 35 ns

t
t

AXQX tOH 0 0 0 0 0 ns

(Vcc = 5.0V, Vss = 0V, Tc = -55°C to +125°C)

Symbol

JEDEC Stand’d

AVAC tWC 60 70 90 120 150 ns

t

ELWL tCE 0 0 0 0 0 ns

t

WLWH tWP 40 45 45 50 50 ns

t

AVWL tAS 0 0 0 0 0 ns

t

DVWH tDS 40 45 45 50 50 ns

t

WHDX tDH 0 0 0 0 0 ns

t

WLAX tAH 45 45 45 50 50 ns

t

WHWL tWPH 20 20 20 20 20 ns

t

WHWH1 14 TYP 14 TYP 14 TYP 14 TYP 14 TYP µs

t

WHWH2 30 30 30 30 30 Sec

t

GHWL 0 0 0 0 0 µs

t

VCE 50 50 50 50 50 µs

t

WHWH3 120 120 120 120 120 Sec

t

–60

Min Max

–60

Min Max

–70

Min Max

–70

Min Max

50 50 50 50 50 Sec

–90

Min Max

–90

Min Max

–120

Min Max

–120

Min Max

–150

Min Max

–150

Min Max

Units

Units

AC Characteristics – Write/Erase/Program Operations, CE Controlled

(Vcc = 5.0V, Vss = 0V, Tc = -55°C to +125°C)

Parameter

Write Cycle Time
Write Enable Setup Time
Chip Enable Pulse Width
Address Setup Time
Data Setup Time
Data Hold Time
Address Hold Time
Chip Select Pulse Width High
Duration of Byte Programming
Sector Erase Time
Read Recovery Time

Symbol

JEDEC Stand’d

AVAC tWC 60 70 90 120 150 ns

t

WLEL tWS 0 0 0 0 0 ns

t

ELEH tCP 40 45 45 50 55 ns

t

AVEL tAS 0 0 0 0 0 ns

t

DVEH tDS 40 45 45 50 55 ns

t

EHDX tDH 0 0 0 0 0 ns

t

ELAX tAH 45 45 45 50 55 ns

t

EHEL tCPH 20 20 20 20 20 ns

t

WHWH1 14 TYP 14 TYP 14 TYP 14 TYP 14 TYP µs

t

WHWH2 30 30 30 30 30 Sec

t

tGHEL 0 0 0 0 0 ns

Chip Programming Time

WHWH3 120 120 120 120 120 Sec

Chip Erase Time

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t

4

–60

Min Max

–70

Min Max

–90

Min Max

–120

Min Max

–150

Min Max

50 50 50 50 50 Sec

Units

Device Operation

The ACT–F512K8 Monolithic is composed of One, Four
megabit flash device. Programming of the ACT–F512K8
is accomplished by executing the program command
sequence. The program algorithm, which is an internal
algorithm, automatically times the program pulse widths
and verifies proper cell status. Sectors can be pro­gramed and verified in less than 1 second. Erase is
accomplished by executing the erase command
sequence. The erase algorithm, which is internal, auto­matically preprograms the array if it is not already pro­gramed before executing the erase operation. During
erase, the device automatically times the erase pulse
widths and verifies proper cell status. The entire mem­ory is typically erased and verified in 1.5 seconds (if
pre-programmed). The sector mode allows for 64K byte
blocks of memory to be erased and reprogrammed with­out affecting other blocks.

Bus Operation

READ

The ACT–F512K8 has two control functions, both of
which must be logically active, to obtain data at the out­puts. Chip Enable (CE
be used for device selection. Output-Enable (OE
output control and should be used to gate data to the
output pins of the chip selected. Figure 7 illustrates AC
read timing waveforms.

OUTPUT DISABLE

With Output-Enable at a logic high level (VIH), output
from the device is disabled. Output pins are placed in a
high impedance state.

STANDBY MODE

The ACT-F512K8 standby mode consumes less than 6.5
mA. In the standby mode the outputs are in a high
impedance state, independent of the OE
device is deselected during erasure or programming, the
device will draw active current until the operation is com­pleted.

) is the power control and should

) is the

input. If the

WRITE

Device erasure and programming are accomplished via
the command register. The contents of the register
serve as input to the internal state machine. The state
machine outputs dictate the function of the device.

The command register itself does not occupy an addres­sable memory location. The register is a latch used to
store the command, along with address and data infor­mation needed to execute the command. The command
register is written by bringing WE

IL), while CE is low and OE is at VIH. Addresses are

(V
latched on the falling edge of WE

to a logic low level

or CE, whichever hap­pens later. Data is latched on the rising edge of the WE
or CE whichever occurs first. Standard microprocessor
write timings are used. Refer to AC Program Character­istics and Waveforms, Figures 3, 8and13.

Command Definitions

Device operations are selected by writing specific
address and data sequences into the command register.
Table 3 defines these register command sequences.

READ/RESET COMMAND

The read or reset operation is initiated by writing the
read/reset command sequence into the command regis­ter. Microprocessor read cycles retrieve array data from
the memory. The device remains enabled for reads until
the command register contents are altered.

The device will automatically power-up in the read/reset
state. In this case, a command sequence is not required
to read data. Standard microprocessor read cycles will
retrieve array data. The device will automatically
power-up in the read/reset state. In this case, a com­mand sequence is not required to read data. Standard
Microprocessor read cycles will retrieve array data. This
default value ensures that no spurious alteration of the
memory content occurs during the power transition.
Refer to the AC Read Characteristics and Figure 7 for
the specific timing parameters.

BYTE PROGRAMING

The device is programmed on a byte-byte basis. Pro­gramming is a four bus cycle operation. There are two
"unlock" write cycles. These are followed by the program

Table 1 – Bus Operations

Operation CE OE WE A0 A1 A9 I/O

READ
STANDBY
OUTPUT DISABLE
WRITE
ENABLE SECTOR

PROTECT

VERIFY SECTOR

PROTECT

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L L H A

H X X X X X HIGH Z

L H H X X X HIGH Z
L H L A

L V

ID L X X VID X

L L H L H V

0 A1 A9 DOUT

0 A1 A9 DIN

ID Code

5

Table 2 – Sector Addresses Table

A16 A15 A14 Address Range

SA0 0 0 0 00000h – 03FFFh
SA1 0 0 1 04000h – 07FFFh
SA2 0 1 0 08000h – 0BFFFh
SA3 0 1 1 0C000h – 0FFFFh
SA4 1 0 0 10000h – 13FFFh
SA5 1 0 1 14000h – 17FFFh
SA6 1 1 0 18000h – 1BFFFh
SA7 1 1 1 1C000h – 1FFFFh

Table 3 — Commands Definitions

Command
Sequence

Required Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data
Read/Reset 1 XXXH F0H
Read/Reset 4 5555H AAH 2AAAH 55H 5555H F0H RA RD
Autoselect 4 5555H AAH 2AAAH 55H 5555H 90H
Byte Program 6 5555H AAH 2AAAH 55H 5555H A0H PA PD
Chip Erase 6 5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H 5555H 10H
Sector Erase 6 5555H AAH 2AAAH 55H 5555H 80H 5555H AAH 2AAAH 55H SA 30H
Sector Erase Suspend Erase can be suspended during sector erase with Address (Don’t care), Data (B0H)
Sector Erase Resume Erase can be resumed after suspend with Address (Don’t care), Data (30H)

NOTES:

1. Address bit A15, A16, A17 and A18 = X = Don't Care. Write Sequences may be initiated with A15 in either state.

2. Address bit A15, A16, A17 and A18 = X = Don't Care for all address commands except for Program Address (PA) and Sector Address (SA).

3. RA = Address of the memory location to be read
PA = Address of the memory location to be programmed. Addresses are latched on the falling edge of the WE
SA = Address of the sector to be erased. The combination of A18, A17, A16 will uniquely select any sector.

4. RD = Data read from location RA during read Operation.
PD = Data to be programmed at location PA. Data is latched on the rising edge of WE

set-up command and data write cycles. Addresses are
latched on the falling edge of CE
occurs later, while the data is latched on the rising edge

or WE whichever occurs first. The rising edge of

of CE

or WE begins programming. Upon executing the pro-

CE
gram algorithm command sequence the system is not
required to provide further controls or timings. The
device will automatically provide adequate internally
generated program pulses and verity the programmed
cell status. The automatic programming operation is
completed when the data on D
written to this bit at which time the device returns to the
read mode and addresses are no longer latched. The
device requires a valid address be supplied by the Sys­tem at this time. Data
memory location which is being programmed.

Programming is allowed in any address sequence and
across sector boundaries.

Figure 3 illustrates the programming algorithm using typ­ical command strings and bus operations.

Bus

Write

Cycles

First Bus Write

Cycle

Second Bus Write

Cycle

or WE, whichever

7 is equivalent to data

Polling must be performed at the

Third Bus Write

Cycle

.

Fourth Bus

Read/Write Cycle

pulse.

Fifth Bus Write

Cycle

Sixth Bus Write

SECTOR ERASE

Sector erase is a six bus cycle operation. There are two
"unlock" write cycles. These are followed by writing the
"setup" command. Two more "unlock" write cycles are
then followed by the sector erase command. The sector
address (any address location within the desired sector)
is latched on the falling edge of WE
(data) is latched on the rising edge of WE
100µs from the rising edge of the last sector erase com­mand will initiate the sector erase command(s).

Multiple sectors may be erased concurrently by writing
the six bus cycle operations as described above. This
sequence is followed with writes of the sector erase com­mand 30H to address in other sectors desired to be con­currently erased. A time-out of 100µs from the rising
edge of the WE

pulse for the last sector erase command
will initiate the sector erase. If another sector erase
command is written within the 100µs time-out window
the timer is reset. Any command other than sector erase
within the time-out window will reset the device to the

, while the command

. A time-out of

Cycle

read mode, ignoring the previous command string.

CHIP ERASE

Chip erase is a six bus cycle operation. There are two
'unlock' write cycles. These are followed by writing the
'set-up' command. Two more 'unlock' write cycles are
then followed by the chip erase command.

Chip erase does not require the user to program the
device prior to erase. Upon executing the erase algo­rithm (Figure 4) sequence the device automatically will

Loading the sector erase buffer may be done in any
sequence and with any number of sectors (0 to 7).

Sector erase does not require the user to program the
device prior to erase. The device automatically pro­grams all memory locations in the sector(s) to be erased
prior to electrical erase. When erasing a sector or sec­tors the remaining unselected sectors are not affected.
The system is not required to provide any controls or tim­ings during these operations.

program and verify the entire memory for an all zero data
pattern prior to electrical erase. The system is not
required to provide any controls or timings during these
operations.

The automatic erase begins on the rising edge of the last

pulse in the command sequence and terminates

WE
when the data in D7 is "1" (see Write Operation Status
section - Table 4) at which time the device returns to read
the mode. See Figures 4 and9.

Data Protection

The ACT–F512K8 is designed to offer protection against
accidental erasure or programming caused by spurious
system level singles that may exist during power transi­tions. During power up the device automatically resets
the internal state machine in the read mode. Also, with

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6

its control register architecture, alteration of the memory
content only occurs after successful completion of spe­cific multi-bus cycle command sequences.

The device also incorporates several features to prevent
inadvertent write cycles resulting from Vcc power-up and
power-down transitions or system noise.

LOW Vcc WRITE INHIBIT

To avoid initiation of a write cycle during Vcc power-up
and power-down, a write cycle is locked out for V
than 3.2V (typically 3.7V). If V

CC <VLKO, the command

CC less

register is disabled and all internal program/erase cir­cuits are disabled. Under this condition the device will
reset to read mode. Subsequent writes will be ignored
until the Vcc level is greater than V

LKO. It is the users

responsibility to ensure that the control pins are logically
correct to prevent unintentional writes when Vcc is above

3.2V.

WRITE PULSE GLITCH PROTECTION

Noise pulses of less than 5ns (typical) on OE, CE or WE
will not initiate a write cycle.

LOGICAL INHIBIT

Writing is inhibited by holding anyone of OE = VIL, CE =

IH or WE = VIH. To initiate a write cycle CE and WE

V
must be logical zero while OE is a logical one.

POWER-UP WRITE INHIBIT

Power-up of the device with WE = CE = VIL and OE =

IH will not accept commands on the rising edge ofWE.

V
The internal state machine is automatically reset to the
read mode on power-up.

Write Operation Status

D7
DATA POLLING

The ACT-F512K8 features Data Polling as a method to
indicate to the host that the internal algorithms are in
progress or completed. During the program algorithm, an
attempt to read the device will produce compliment data
of the data last written to D
an attempt to read the device will produce a "0" at the D
Output. Upon completion of the erase algorithm an
attempt to read the device will produce a "1" at the D
Output.

For chip Erase, the Data
edge of the sixth WE
sequence. For sector erase, the Data
the last rising edge of the sector erase WE
polling must be performed at a sector address within any
of the sectors being erased and not a protected sector.
Otherwise, the status may not be valid. Once the algo-

7. During the erase algorithm,

Polling is valid after the rising

pulse in the six write pulse

Polling is valid after

pulse. Data

rithm operation is close to being completed, data pins
(D

7) change asynchronously while the output enable

) is asserted low. This means that the device is driv-

(OE
ing status information on D

7 at one instance of time and

then that byte's valid data at the next instant of time.
Depending on when the system samples the D
it may read the status or valid data. Even if the device
has completed internal algorithm operation and D
valid data, the data outputs on D
invalid. The valid data on D0-D
cessive read attempts. The Data

0 - D6 may be still

7 will be read on the suc-

Polling feature is only
active during the programming algorithm, erase algo­rithm, or sector erase time-out.

See Figures 6 and 10 for the Data Polling specifications.

D6
TOGGLE BIT

The ACT–F512K8 also features the "Toggle Bit" as a
method to indicate to the host system that algorithms are
in progress or completed.

During a program or erase algorithm cycle, successive
attempts to read data from the device will result in D
toggling between one and zero. Once the program or
erase algorithm cycle is completed, D

6 Will stop toggling

and valid data will be read on successive attempts. Dur­ing programming the Toggle Bit is valid after the rising
edge of the fourth WE

pulse in the four write pulse
sequence. For chip erase the Toggle Bit is valid after the
rising edge of the sixth

WE pulse in the six write pulse

sequence. For Sector erase, the Toggle Bit is valid after
the last rising edge of the sector erase

WE pulse. The

Toggle Bit is active during the sector time out.
See Figure 1 and 5.

D5
EXCEEDED TIMING LIMITS

D5 will indicate if the program or erase time has
exceeded the specified limits. Under these conditions

5 will produce a "1". The Program or erase cycle was

D
not successfully completed. Data

Polling is the only
operation function of the device under this condition.
The CE

circuit will partially power down the device under

these conditions by approximately 2 mA. The OE

pins will control the output disable functions as

WE
shown in Table 1. To reset the device, write the reset
command sequence to the device. This allows the sys­tem to continue to use the other active sectors in the
device.

7
7

D3
SECTOR ERASE TIMER

After the completion of the initial sector erase command
sequence the sector erase time-out will begin. D
remain low until the time-out is complete. Data Polling
and Toggle Bit are valid after the initial sector erase com­mand sequence.

7 Output,

7 has a

6

and

3 will

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7

If Data Polling or the Toggle Bit indicates the device has
been written with a valid erase command, D

3 may be

used to determine if the sector erase timer window is still
open. If D

3 is high ("1") the internally controlled erase

cycle has begun; attempts to write subsequent com­mands to the device will be ignored until the erase oper­ation is completed as indicated by Data
Bit. If D

3 is low ("0"), the device will accept additional

Polling or Toggle

sector erase commands. To ensure the command has
been accepted, the software should check the status of

3 prior to and following each subsequent sector erase

D
command. If D

3 were high on the second status check,

the command may not have been accepted. See Table 4

Sector Protection
Algorithims

SECTOR PROTECTION

The ACT-F512K8 features hardware sector protection
which will disable both program and erase operations to
an individual sector or any group of sectors. To activate
this mode, the programming equipment must force V
on control pin OE and address pin A9. The sector
addresses should be set using higher address lines A

17, and A16. The protection mechanism begins on the

A
falling edge of the WE

pulse and is terminated with the

rising edge of the same.
To verify programming of the protection circuitry, the pro-

gramming equipment must force V
with CE
tor addresses (A

and OE at VIL and WE at VIH. Scanning the sec-

16, A17, and A18) while (A6, A1, A0) =

ID on address pin A9

(0, 1, 0,) will produce a logical "1" code at device output

0 for a protected sector. Otherwise the device will read

D

18,

00H for unprotected sector. In this mode, the lower order
addresses, except for 0, A1, and A6 are don't care.

It is also possible to verify if a sector is protected during
the sector protection operation. This is done by setting
A6 = CE

ID). Reading the device at address location XXX2H,

V
where the higher order addresses (A

= OE = VIL and WE = VIH (A9 remains high at

18, A17, and A16)

define a particular sector, will produce 01H at data out­puts (D0 - D7) for a protected sector.

SECTOR UNPROTECT

The ACT-F512K8 also features a sector unprotect mode,
so that a protected sector may be unprotected to incor­porate any changes in the code. All sectors should be
protected prior to unprotecting any sector.

To activate this mode, the programming equipment must
force Vid on control pins OE
The address pins A

6, A16, and A12 should be set to VIH.

The unprotection mechanism begins on the falling edge
of the WE pulse and is terminated with the rising edge of
the same.

It is also possible to determine if a sector is unprotected
in the system by writing the autoselect command and A6

ID

is set at V

IH. Performing a read operation at address

location XXX2H, where the higher order addresses (A

17, and A16) define a particular sector address, will pro-

A
duce 00H at data outputs (D
sector.

, CE, and address pin A9.

0-D7) for an unprotected

18,

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8

Table 4 — Hardware Sequence Flags

In Progress

Exceeding Time Limits

Status D

Auto-Programming
Programming in Auto Erase
Auto-Programming
Programming in Auto Erase

7 D6 D5 D3 D2 – D0

D

7 Toggle 0 0

0 Toggle 0 1

7 Toggle 1 1

D

0 Toggle 1 1

D

D

Figure 1
AC Waveforms for Toggle Bit During Embedded Algorithm Operations

CE

tOEH

WE

tOES

OE

(1)

Data

0-D7

D

Note:

1. D6 stops toggling (The device has completed the embedded operation)

D6=Toggle

D6=Toggle

D6

Stop Toggle

D

0-D7

Valid

Figure 2
AC Test Circuit

Current Source

IOL

Parameter Typical Units

Z ~ 1.5 V (Bipolar Supply)

To Device Under Test

CL =
50 pF

Current Source

V

OH

I

Notes:

1) V

Z is programmable from -2V to +7V. 2) IOL and IOH programmable from 0 to 16 mA. 3) Tester Impedance

Z

O =75Ω. 4) VZ is typically the midpoint of VOH and VOL. 5) IOL and IOH are adjusted to simulate a typical

resistance load circuit. 6) ATE Tester includes jig capacitance.

Input Pulse Level 0 – 3.0 V
Input Rise and Fall 5 ns
Input and Output Timing Reference Level 1.5 V
Output Lead Capacitance 50 pF

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9

Figure 3
Programming Algorithm

Bus
Operations

Standby

(1)

Command
Sequence

Comments

Write Program Valid Address/Data Sequence
Read Data
Standby

Note:

1. Device is either powered-down, erase or program inhibit.

Start

(1) Compare Data Output to Data Expected

Polling to Verify Programming

Write Program Command Sequence

Increment

Address

(See Below)

Data Poll Device

No

Last Address

?

Yes

Programming Complete

Program Command Sequence (Address/Command):

5555H/AAH

2AAAH/55H

5555H/A0H

Programming Address/Program Data

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10

Figure 4
Erase Algorithm

Bus
Operations

Standby
Write Program Valid Address/Data Sequence
Read Data
Standby Compare Data Output to Data Expected

Start

Write Erase Command Sequence

(See Below)

Data

Poll or Toggle Bit

Successfully Completed

Erasure Completed

Command
Sequence

Comments

Polling to Verify Programming

Chip Erase Command Sequence

(Address/Command)

5555H/AAH

2AAAH/55H

5555H/80H

5555H/AAH

2AAAH/55H

5555H/10H

Additional Sector
Erase Commands

are Optional

Individual Sector/Multiple Sector

Erase Command Sequence

(Address/Command)

5555H/AAH

2AAAH/55H

5555H/80H

5555H/AAH

2AAAH/55H

Sector Address/30H

Sector Address/30H

Sector Address/30H

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11

Figure 5
Toggle Bit Algorithm

Figure 6

Polling Algorithm

Data

Address = VA

No

Address = VA

Start

VA = Byte Address for Programming

Read Byte

D

0-D7

D

6 = Toggle

?

Yes

D5 = 1

? ?

Yes

Read Byte

D

0-D7

D

6 =

Toggle?
(Note 1)

Yes

Fail

= Any of the Sector Addresses

within the sector being erased
during sector erase operation

= XXXXH during Chip Erase

No

No

Pass

No

Start

Read Byte

D

0-D7

Address = VA

D

7 =

Toggle?

No

D5 = 1

Yes

Read Byte

D

0-D7

Address = VA

D7 =
Data

?

No

Fail

VA = Byte Address for Programming

= Any of the Sector Addresses

within the sector being erased
during sector erase operation

= XXXXH during Chip Erase

Yes

Yes

Pass

Note 1. D6 is rechecked even if D5 = "1" because D6 may stop toggling at
the same time as D

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5 changes to "1".

Note 1. D
simultaneously with D

12

7 is rechecked even if D5 = "1" because D7 may change

5.

Figure 7
AC Waveforms for Read Operations

Addresses Addresses Stable

CE

tRC

tACC

tDF

OE

WE

Outputs

Figure 8
Write/Erase/Program
Operation, WE

Addresses

CE

Controlled

5555H PA

tWC

tAS

tAH

tOE

Data

Polling

Output Valid

PA

tOHtCE

High ZHigh Z

tRC

tGHWL

OE

tWP

WE

Data

5.0V

Notes:

1. PA is the address of the memory location to be programmed.

2. PD is the data to be programmed at byte address.

3. D7 is the 0utput of the complement of the data written to the deviced.

4. Dout is the output of the data written to the device.

5. Figure indicates last two bus cycles of four bus cycle sequence.

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tCE

tDS

tWPH

tDH

t

WHWH1

13

D7

tOE

tDF

DOUTPDAOH

tOH

tCE

Figure 9
AC Waveforms Chip/Sector
Erase Operations

Data

AH

t

Polling

Addresses

CE

OE

WE

Data

CC

V

5555H

tAS

tGHWL

tWP

tWPH

tCE

tDH

55H AAH80H 55H 10H/30HAAH

tDS

tVCE

Notes:

1. SA is the sector address for sector erase.

5555H 5555H SA2AAAH 2AAAH

Figure 10
AC Waveforms for Data Polling

During Embedded Algorithm Operations

CE

OE

WE

tCH

tOE

tOEH

tCE

DQ7

tWHWH1 or 2

DQ0-DQ6

* DQ7=Valid Data (The device has completed the Embedded operation).

DQ

7

DQ0–DQ6=Invalid

*

DQ7=

Valid Data

DQ0–DQ6
Valid Data

tOE

tDF

tOH

High Z

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14

Figure 11
Sector Protection Algorithm

Start

Set Up Sector Address

(A

18, A17, A16)

PLSCNT = 1

OE = VID

A

9 = VID, CE = VIL

Activate WE Pulse

Time Out 100µs

Increment

PLSCNT

No

PLSCNT = 25

?

Yes

Device Failure

Power Down OE

WE = VIH

CE = OE = VIH

A9 Should Remain VID

Read From Sector

Address = SA, A0 = 0, A1 = 1, A6 = 0

No

Data = 01H

?

Yes

Protect
Another

Sector?

No

Remove VID from A9

Write Reset Command

Yes

Sector Protection

Complete

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15

Figure 12

Sector Unprotect Algorithm

Start

Start

Protect All Sectors

PLSCNT = 1

Set Up Sector

Unprotect Mode

A

12 = A16 = VIH

Set

OE = CE = A9 = VID

Increment

Sector Address

Activate WE

Time Out 10 msms

Set OE

Setup Sector Address SA0

Set A

1 = 1, A0 = 0, A6 = 1

Pulse

= CE = VIL

A9 = VID

Read Data

From Device

Data = 00H

?

Yes

No

Increment

PLSCNT

No

PLSCNT = 1000

?

Yes

No

Notes:

Sector

Address = SA7

?

Yes

Remove VID from A9

Device Failure

SA0 = Sector Address for initial sector
SA7 = Sector Address for last sector
Please refer to Table 2

Sector Unprotect

Completed

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16

Figure 13
Alternate CE Controlled Programming Operation Timings

Data

Polling

Addresses

CE

OE

WE

Data

5.0V

5555H

tWC

PA

tAHtAS

tGHWL

tWS

tCP

tCPH

t

tDH

tDS

Notes:

1. PA is the address of the memory location to be programmed.

2. PD is the data to be programmed at byte address.
is the 0utput of the complement of the data written to the device.

3. D7

OUT is the output of the data written to the device.

4. D

5. Figure indicates last two bus cycles of four bus cycle sequence.

WHWH1

PA

D7

DOUTPDAOH

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17

Pin Numbers & Functions

32 Pins — DIP Package

1 A18 17 I/O3
2 A16 18 I/O4
3 A15 19 I/O5
4 A12 20 I/O6

5\ A7 21 I/O7

6 A6 22 CS
7 A5 23 A10
8 A4 24 OE

9 A3 25 A11
10 A2 26 A9
11 A1 27 A8
12 A0 28 A13
13 I/O0 29 A14
14 I/O1 30 A17
15 I/O2 31 WE
16 VSS 32 VCC

Package Outline "P4" — .590" x 1.67" DIP Package

1.686

1.654

Pin 32

Pin 1

.100 .055

TYP

.045

.020
.016

.048
.019

.200
.145

.125
MIN

.012
.009

.605
.580

.610
.590

All dimensions in inches

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18

Pin Numbers & Functions

32 Pins — Flat Package

1 A18 17 I/O3

2 A16 18 I/O4

3 A15 19 I/O5

4 A12 20 I/O6

5 A7 21 I/O7

6 A6 22 CS

7 A5 23 A10

8 A4 24 OE

9 A3 25 A11
10 A2 26 A9
11 A1 27 A8
12 A0 28 A13
13 I/O0 29 A14
14 I/O1 30 A17
15 I/O2 31 WE
16 VSS 32 VCC

Package Outline "F6" — 32 Lead, Ceramic Flat Package

0.820
±.010

Pin 16

Pin 17

.410

±.005

0.400
MIN

.125 MAX

+.002

.005

-.001

Pin 32

Pin 1

0.017

All dimensions in inches

Aeroflex Circuit Technology SCD1668 REV A 4/28/98 Plainview NY [phone]

(15 spaces at .050)

.750

2 sides

±.002

19

Pin Numbers & Functions

32 Pins — Flat Package

1 A18 17 I/O3
2 A16 18 I/O4
3 A15 19 I/O5
4 A12 20 I/O6
5 A7 21 I/O7
6 A6 22 CS
7 A5 23 A10
8 A4 24 OE

9 A3 25 A11
10 A2 26 A9
11 A1 27 A8
12 A0 28 A13
13 I/O0 29 A14
14 I/O1 30 A17
15 I/O2 31 WE

Pin 32

Pin 1

16 VSS 32 VCC

Package Outline "F7" — 32 Lead, Ceramic Flat Package

.132

MAX

0.820
±.010

0.017

(15 spaces at .050)

.750

2 sides

±.002

Pin 16

Pin 17

.410

±.005

.006

TYP

.025
TYP

.005

.530

±.005

+.002

-.001

0° / -4°

Base Plane

.125

MAX

.068
TYP

.030
TYP

Seating Plane

All dimensions in inches

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20

CIRCUIT TECHNOLOGY

Screened to the individual test methods of MIL-STD-883

Ordering Information

Model Number DESC Drawing Number Speed Package

ACT–F512K8N–150F6Q 5962-9669201HUC* 150 ns Flat Pack
ACT–F512K8N–120F6Q 5962-9669202HUC* 120 ns Flat Pack
ACT–F512K8N–090F6Q 5962-9669203HUC* 90 ns Flat Pack
ACT–F512K8N–070F6Q 5962-9669204HUC* 70 ns Flat Pack
ACT–F512K8N–060F6Q 5962-9669205HUC* 60ns Flat Pack
ACT–F512K8N–150F7Q 5962-9669201HTC* 150 ns Flat Pack (Formed)
ACT–F512K8N–120F7Q 5962-9669202HTC* 120 ns Flat Pack (Formed)
ACT–F512K8N–090F7Q 5962-9669203HTC* 90 ns Flat Pack (Formed)
ACT–F512K8N–070F7Q 5962-9669204HTC* 70 ns Flat Pack (Formed)
ACT–F512K8N–060F7Q 5962-9669205HTC* 60ns Flat Pack (Formed)
ACT–F512K8N–150P4Q 5962-9669201HXC* 150 ns DIP Pack
ACT–F512K8N–120P4Q 5962-9669202HXC* 120 ns DIP Pack
ACT–F512K8N–090P4Q 5962-9669203HXC* 90 ns DIP Pack
ACT–F512K8N–070P4Q 5962-9669204HXC* 70 ns DIP Pack
ACT–F512K8N–060P4Q 5962-9669205HXC* 60ns DIP Pack
* Pending

Part Number Breakdown

ACT– F 512K 8 N– 090 F6 Q

Aeroflex Circuit
Technology

Memory Type

F = FLASH EEPROM

Memory Depth

Memory Width, Bits

Options

N = None

Memory Speed, ns

C = Commercial Temp, 0°C to +70°C
I = Industrial Temp, -40°C to +85°C
T = Military Temp, -55°C to +125°C
M = Military Temp, -55°C to +125°C, Screening
Q = MIL-PRF-38534 Compliant / SMD

Surface Mount Packages Thru-Hole Packages

F6 = .82" x .40" 32 Lead FP Unformed P4 = 32 Pin DIP
F7 = .82" x .40" 32 Lead FP Formed

Specifications subject to change without notice.

*

Screening

*

Package Type & Size

Aeroflex Circuit Technology
35 South Service Road
Plainview New York 11830

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Toll Free Inquiries: 1-[phone]

21

Telephone: [phone]
FAX: [phone]