Datasheet ACS86MS Datasheet (Intersil Corporation)

Page 1
April 1995
ACS86MS
Radiation Hardened
Quad 2-Input Exclusive OR Gate
Features
• 1.25 Micron Radiation Hardened SOS CMOS
• Total Dose 300K RAD (Si)
• Single Event Upset (SEU) Immunity <1 x 10
• SEU LET Threshold >80 MEV-cm
• Dose Rate Upset >10
-10
Errors/Bit-Day (Typ)
11
RAD (Si)/s, 20ns Pulse
2
/mg
• Latch-Up Free Under Any Conditions
o
• Military Temperature Range: -55
C to +125oC
• Significant Power Reduction Compared to ALSTTL Logic
• DC Operating Voltage Range: 4.5V to 5.5V
• Input Logic Levels
- VIL = 30% of VCC Max
- VIH = 70% of VCC Min
• Input Current 1µA at VOL, VOH
Description
The Intersil ACS86MS is a radiation hardened quad 2-input exclusive OR gate. A high logic level on both inputs forces the output to a logic low state.
The ACS86MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of the radiation hardened, high-speed, CMOS/SOS Logic Family.
Pinouts
14 LEAD CERAMIC DUAL-IN-LINE
MIL-STD-1835 DESIGNATOR, CDIP2-T14, LEAD FINISH C
TOP VIEW
A1
1 2
B1
3
Y1
4
A2
5
B2
6
Y2
7
GND
14 LEAD CERAMIC FLATPACK
MIL-STD-1835 DESIGNATOR, CDFP3-F14, LEAD FINISH C
TOP VIEW
A1 B1 Y1 A2 B2 Y2
GND
1 2 3 4 5 6 7
14
VCC
13
B4
12
A4
11
Y4
10
B3
9
A3
8
Y3
14 13
12 11 10
9 8
VCC B4 A4 Y4 B3 A3 Y3
Ordering Information
PART NUMBER TEMPERATURE RANGE SCREENING LEVEL PACKAGE
ACS86DMSR -55oC to +125oC Intersil Class S Equivalent 14 Lead SBDIP ACS86KMSR -55oC to +125oC Intersil Class S Equivalent 14 Lead Ceramic Flatpack ACS86D/Sample +25oC Sample 14 Lead SBDIP ACS86K/Sample +25oC Sample 14 Lead Ceramic Flatpack ACS86HMSR +25oC Die Die
Truth Table
INPUTS OUTPUT
An Bn Yn
LLL
LHH HLH HHL
NOTE: L = Logic Level Low, H = Logic Level High
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
Functional Diagram
(1, 4, 9, 12)
An Bn
(2, 5, 10, 13)
1
(3, 6, 8, 11)
Spec Number
File Number 3995
Yn
518849
Page 2
Specifications ACS86MS
Absolute Maximum Ratings Reliability Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5V to +6.0V
Input Voltage Range. . . . . . . . . . . . . . . . . . . . . .-0.5V to VCC +0.5V
DC Input Current, Any One Input . . . . . . . . . . . . . . . . . . . . . . . .±10mA
DC Drain Current, Any One Output. . . . . . . . . . . . . . . . . . . . . . .±50mA
Storage Temperature Range (TSTG). . . . . . . . . . . -65oC to +150oC
Lead Temperature (Soldering 10s). . . . . . . . . . . . . . . . . . . . +265oC
Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . +175oC
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
(All Voltages Referenced to VSS)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Operating Conditions
Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Input Rise and Fall Time at 4.5V VCC (TR, TF). . . . . . .10ns/V Max
Operating Temperature Range. . . . . . . . . . . . . . . . -55oC to +125oC
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
Thermal Impedance θ
DIP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74oC/W 24oC/W
Flatpack. . . . . . . . . . . . . . . . . . . . . . . . . . 116oC/W 30oC/W
Maximum Package Power Dissipation at +125oC
DIP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.7W
Flatpack. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.4W
Maximum Device Power Dissipation. . . . . . . . . . . . . . . . . . .(TBD)W
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52 Gates
Input High Voltage (VIH). . . . . . . . . . . . . . . . . . VCC to 70% of VCC
Input Low Voltage (VIL). . . . . . . . . . . . . . . . . . . . .0V to 30% of VCC
JA
θ
JC
(NOTE 1)
PARAMETER SYMBOL
Supply Current ICC VCC = 5.5V,
Output Current (Source)
Output Current (Sink)
Output Voltage High VOH VCC = 5.5V, VIH = 3.85V,
Output Voltage Low VOL VCC = 5.5V, VIH = 3.85V,
Input Leakage Current
IOH VCC = 4.5V, VIH = 4.5V,
IOL VCC = 4.5V, VIH = 4.5V,
IIN VCC = 5.5V,
CONDITIONS
VIN = VCC or GND
VOUT = VCC -0.4V, VIL = 0V, (Note 2)
VOUT = 0.4V, VIL = 0V, (Note 2)
VIL = 1.65V, IOH = -50µA
VCC = 4.5V, VIH = 3.15V, VIL = 1.35V, IOH = -50µA
VIL = 1.65V, IOL = 50µA
VCC = 4.5V, VIH = 3.15V, VIL = 1.35V, IOL = 50µA
VIN = VCC or GND
GROUP
A SUB-
GROUPS TEMPERATURE
1 +25oC-5µA
2, 3 +125oC, -55oC - 100 µA
1 +25oC -12 - mA
2, 3 +125oC, -55oC-8-mA
1 +25oC12-mA
2, 3 +125oC, -55oC8-mA
1, 2, 3 +25oC, +125oC, -55oC VCC -0.1 - V
1, 2, 3 +25oC, +125oC, -55oC VCC -0.1 - V
1, 2, 3 +25oC, +125oC, -55oC - 0.1 V
1, 2, 3 +25oC, +125oC, -55oC - 0.1 V
1 +25oC-±0.5 µA
2, 3 +125oC, -55oC-±1.0 µA
LIMITS
UNITSMIN MAX
Noise Immunity Functional Test
NOTES:
1. All voltages referenced to device GND.
2. Force/measure functions may be interchanged.
3. For functional tests, VO 4.0V is recognized as a logic “1”, and VO 0.5V is recognized as a logic “0”.
FN VCC = 4.5V, VIH = 3.15V,
VIL = 1.35V, (Note 3)
7, 8A, 8B +25oC, +125oC, -55oC- - V
2
Spec Number 518849
Page 3
Specifications ACS86MS
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS
GROUP
(NOTES 1, 2)
PARAMETER SYMBOL
Propagation Delay Input to Output
NOTES:
1. All voltages referenced to device GND.
2. AC measurements assume RL = 500, CL = 50pF, Input TR = TF = 3ns.
PARAMETER SYMBOL CONDITIONS NOTE TEMP
Capacitance Power Dissipation
Input Capacitance CIN VCC = 5.0V, VIH = 5.0V,
NOTE:
1. The parameters listed in T able 3 are controlled via design or process parameters. Min and Max Limits are guaranteed but not directly test­ed. These parameters are characterized upon initial design release and upon design changes which affect these characteristics.
TPHL VCC = 4.5V, VIH = 4.5V,
TPLH VCC = 4.5V, VIH = 4.5V,
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS
CPD VCC = 5.0V, VIH = 5.0V,
CONDITIONS
VIL = 0V
VIL = 0V
VIL = 0V, f = 1MHz
VIL = 0V, f = 1MHz
A SUB-
GROUPS TEMPERATURE
9 +25oC 2 12 ns
10, 11 +125oC, -55oC 2 13 ns
1 +25oC­1 +125oC­1 +25oC--10pF
1 +125oC--10pF
LIMITS
LIMITS
TBD TBD
UNITSMIN MAX
UNITSMIN TYP MAX
-pF
-pF
TABLE 4. POST IRRADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS
RAD
(NOTE 1)
PARAMETER SYMBOL
Supply Current ICC VCC = 5.5V, VIN = VCC or GND +25oC - 100 µA Output Current
(Source) Output Current (Sink) IOL VCC = VIH = 4.5V,
Output Voltage High VOH VCC = 5.5V, VIH = 3.85V,
Output Voltage Low VOL VCC = 5.5V, VIH = 3.85V,
Input Leakage Current IIN VCC = 5.5V, VIN = VCC or GND +25oC-±1 µA Noise Immunity
Functional Test Propagation Delay
Input to Output
NOTES:
1. All voltages referenced to device GND.
2. For functional tests, VO 4.0V is recognized as a logic “1”, and VO 0.5V is recognized as a logic “0”.
IOH VCC = VIH = 4.5V,
VOUT = VCC -0.4V, VIL = 0
VOUT = 0.4V, VIL = 0
VIL = 1.65V, IOH = -50µA VCC = 4.5V, VIH = 3.15V,
VIL = 1.35V, IOH = -50µA
VIL = 1.65V, IOL = 50µA VCC = 4.5V, VIH = 3.15V,
VIL = 1.35V, IOL = 50µA
FN VCC = 4.5V , VIH = 3.15V,
VIL = 1.35V , (Note 2)
TPHL TPLH
VCC = 4.5V, VIH = 4.5V, VIL = 0V +25oC 2 13 ns
CONDITIONS TEMPERATURE
+25oC -8.0 - mA
+25oC 8.0 - mA
+25oC VCC -0.1 - V
+25oC VCC -0.1 - V
+25oC - 0.1 V
+25oC - 0.1 V
+25oC--V
LIMITS
UNITSMIN MAX
TABLE 5. DELTA PARAMETERS (+25oC)
(NOTE 1)
PARAMETER SYMBOL
Supply Current ICC ±1.0 µA Output Current IOL/IOH ±15 %
NOTE:
1. All delta calculations are referenced to 0 hour readings or pre-life readings.
DELTA LIMIT UNITS
3
Spec Number 518849
Page 4
Specifications ACS86MS
TABLE 6. APPLICABLE SUBGROUPS
CONFORMANCE GROUP METHOD GROUP A SUBGROUPS READ AND RECORD
Initial Test (Preburn-In) 100%/5004 1, 7, 9 ICC, IOL/H Interim Test 1 (Postburn-In) 100%/5004 1, 7, 9 ICC, IOL/H Interim Test 2 (Postburn-In) 100%/5004 1, 7, 9 ICC, IOL/H PDA 100%/5004 1, 7, 9, Deltas Interim Test 3 (Postburn-In) 100%/5004 1, 7, 9 ICC, IOL/H PDA 100%/5004 1, 7, 9, Deltas Final Test 100%/5004 2, 3, 8A, 8B, 10, 11 Group A (Note 1) Sample/5005 1, 2, 3, 7, 8A, 8B, 9, 10, 11 Group B Subgroup B-5 Sample/5005 1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas Subgroups 1, 2, 3, 9, 10, 11
Subgroup B-6 Sample/5005 1, 7, 9
Group D Sample/5005 1, 7, 9
NOTE:
1. Alternate Group A testing may be exercised in accordance with MIL-STD-883, Method 5005.
TABLE 7. TOTAL DOSE IRRADIATION
TEST READ AND RECORD
CONFORMANCE GROUP METHOD
Group E Subgroup 2 5005 1, 7, 9 Table 4 1, 9 Table 4 (Note 1)
NOTE:
1. Except FN test which will be performed 100% Go/No-Go.
PRE RAD POST RAD PRE RAD POST RAD
TABLE 8. BURN-IN TEST CONNECTIONS (+125oC < TA < 139oC)
OSCILLATOR
OPEN GROUND 1/2 VCC = 3V ±0.5V VCC = 6V ±0.5V
STATIC BURN-IN 1 (Note 1)
- 1, 2, 4, 5, 7, 9, 10, 12, 13
STATIC BURN-IN 2 (Note 1)
- 7 3, 6, 8, 11 1, 2, 4, 5, 9,
DYNAMIC BURN-IN (Note 1)
- 7 3, 6, 8, 11 14 1, 2, 4, 5, 9,
NOTE:
1. Each pin except VCC and GND will have a series resistor of 500Ω±5%.
TABLE 9. IRRADIATION TEST CONNECTIONS (TA = +25oC, ±5oC)
FUNCTION OPEN GROUND VCC ±0.5V
Irradiation Circuit (Note 1) 3, 6, 8, 11 7 1, 2, 4, 5, 9, 10, 12, 13, 14
NOTE:
1. Each pin except VCC and GND will have a series resistor of 47kΩ±5%. Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures.
3, 6, 8, 11 14 - -
10, 12, 13
50kHz 25kHz
--
-
10, 12, 13
Spec Number 518849
4
Page 5
Specifications ACS86MS
Intersil - Space Products MS Screening
Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) Radiation Verification (Each Wafer) Method 1019,
4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull Method 2023 100% Internal Visual Inspection Method 2010 100% Temperature Cycling Method 1010 Condition C
(-65
o
to +150oC) 100% Constant Acceleration 100% PIND Testing 100% External Visual Inspection 100% Serialization 100% Initial Electrical Test
o
100% Static Burn-In 1 Method 1015, 24 Hours at +125
C Min
100% Interim Electrical Test 1 (Note 1)
NOTES:
1. Failures from interim electrical tests 1 and 2 are combined for determining PDA (PDA = 5% for subgroups 1, 7, 9 and delta failures com­bined, PDA = 3% for subgroup 7 failures). Interim electrical tests 3 PDA (PDA = 5% for subgroups 1, 7, 9 and delta failures combined, PDA = 3% for subgroup 7 failures).
2. These steps are optional, and should be listed on the purchase order if required.
3. Data Package Contents: Cover Sheet (P.O. Number , Customer Number, Lot Date Code, Intersil Number, Lot Number, Quantity). Certificate of Conformance (as found on shipper). Lot Serial Number Sheet (Good Unit(s) Serial Number and Lot Number). Variables Data (All Read, Record, and delta operations). Group A Attributes Data Summary. Wafer Lot Acceptance Report (Method 5007) to include reproductions of SEM photos. NOTE: SEM photos to include percent of step coverage. X-Ray Report and Film, including penetrometer measurements. GAMMA Radiation Report with initial shipment of devices from the same wafer lot; containing a Cover Page, Disposition, RAD Dose,
Lot Number, Test Package, Spec Number(s), Test Equipment, etc. Irradiation Read and Record data will be on file at Intersil.
100% Static Burn-In 2 Method 1015, 24 Hours at +125oC Min 100% Interim Electrical Test 2 (Note 1) 100% Dynamic Burn-In Method 1015, 240 Hours at +125
or 180 Hours at +135
o
C 100% Interim Electrical Test 3 (Note 1) 100% Final Electrical Test 100% Fine and Gross Seal Method 1014 100% Radiographics Method 2012 (2 Views) 100% External Visual Method 2009 Group A (All Tests) Method 5005 (Class S) Group B (Optional) Method 5005 (Class S) (Note 2) Group D (Optional) Method 5005 (Class S) (Note 2) CSI and/or GSI (Optional) (Note 2) Data Package Generation (Note 3)
o
C
Propagation Delay Timing Diagram and Load Circuit
VIH
TPLH
INPUT
VS
TPHL
OUTPUT
PARAMETER ACS UNITS
VCC 4.50 V VIH 4.50 V VS 2.25 V VIL 0 V GND 0 V
5
VS
VSS
VOH
VOL
DUT TEST
CL
50pF
AC VOLTAGE LEVELS
POINT
RL 500
Spec Number 518849
Page 6
Die Characteristics
ACS86MS
DIE DIMENSIONS:
88 mils x 88 mils
2.24mm x 2.24mm
METALLIZATION:
Type: AlSiCu Metal 1 Thickness: 6.75k Metal 2 Thickness: 9k
Å (Min), 8.25kÅ (Max)
Å (Min), 11kÅ (Max)
GLASSIVATION:
Type: SiO
2
Thickness: 8kÅ ±1kÅ
Metallization Mask Layout
DIE ATTACH:
Material: Silver Glass or JM7000 Polymer after 7/1/95
WORST CASE CURRENT DENSITY:
< 2.0 x 10
BOND PAD SIZE:
> 4.3 mils x 4.3 mils > 110µm x 110µm
ACS86MS
(2) (1) (13)
A1 B4B1
VCC
(14)
5
A/cm
2
Y1 (3)
A2 (4)
NC
B2 (5)
(6) (7) (8)
GND Y3Y2
(9) A3
(12) A4
(11) Y4
NC
(10) B3
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Spec Number 518849
6
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