Datasheet A62S8308X-70SI, A62S8308X-70S, A62S8308X-55SI, A62S8308X, A62S8308V-70SI Datasheet (AMICC)

A62S8308 Series

Preliminary 256K X 8 BIT LOW VOLTAGE CMOS SRAM

Document Title
256K X 8 BIT LOW VOLTAGE CMOS SRAM

Revision History

Rev. No. History Issue Date Remark

0.0 Initial issue December 6, 1999 Preliminary

0.1 Modify VCCmax from 3.3V to 3.6V December 20, 2000

0.2 Add 55ns grade spec. for VCC = 3.0V to 3.6V March 23, 2001

PRELIMINARY (March, 2001, Version 0.2) AMIC Technology, Inc.

A62S8308 Series

Preliminary 256K X 8 BIT LOW VOLTAGE CMOS SRAM

Features

n Power supply range: 2.7V to 3.6V
n Access times: 55ns (max.): for VCC = 3.0V to 3.6V

70ns (max.): for VCC = 2.7V to 3.6V
n Current:
A62S8308-S series: Operating: 40mA (max.)
Standby: 10µA (max.)
A62S8308-SI series: Operating: 40mA (max.)
Standby: 15µA (max.)
n Extended operating temperature range:-25°C to 85°C

for –SI series

General Description

The A62S8308 is a low operating current 2,097,152-bit
static random access memory organized as 262,144
words by 8 bits and operates on a low power supply
voltage from 2.7V to 3.6V.
Inputs and three-state outputs are TTL compatible and
allow for direct interfacing with common system bus
structures.

n Full static operation, no clock or refreshing required
n All inputs and outputs are directly TTL compatible
n Common I/O using three-state output
n Output enable and two chip enable inputs for easy

application

n Data retention voltage: 2V (min.)
n Available in 32-pin SOP, TSOP, sTSOP (8X

13.4mm) forward type and 36-ball Mini BGA (6X8)
packages

Two chip enable inputs are provided for power down and
a device enable and an output enable input are included
for easy interfacing.
Data retention is guaranteed at a power supply voltage
as low as 2V.

Pin Configurations

nn SOP nn TSOP/(sTSOP) nn Mini BGA (6X8) Top View
(forward type)

A17
A16

A14
A12

A7
A6
A5
A4
A3
A2
A1

A0
I/O0
I/O1
I/O2

1
2

3
4
5
6

A62S8308M

7
8
9
10
11
12
13
14
15
16 17

VCC

32

A15

31

CE2

30

WE

29

A13

28

A8

27

A9

26

A11

25

OE

24

A10

23
22

CE1
I/O7

21

I/O6

20

I/O5

19

I/O4

18

I/O3GND

A11

A13
WE

CE2

A15

VCC

A17
A16
A14
A12

A9
A8

A7
A6
A5
A4

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16

~

~

A62S8308V

(A62S8308X)

~

~

1 2 3 4 5 6

OE

32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17

A A0 A1 CE2 A3 A6 A8

A10
CE1

B I/O4A2

7

I/O

6

I/O

5

C I/O5 NC A5 I/O1

I/O

4

I/O

3

I/O

D VSS VCC

GND

2

I/O

E VCC VSS

1

I/O

0

I/O

F I/O6 NC A17 I/O2

A0
A1
A2
A3

G I/O

7

OE CE1

A4 A7 I/O

WE

A16 A15 I/O

H A9 A10 A11 A12 A13 A14

0

3

PRELIMINARY (March, 2001, Version 0.2) 1 AMIC Technology, Inc.

A62S8308 Series

Block Diagram

A0

A15

A16

A17

I/O0

I/O7

CE2
CE1

OE

WE

Pin Descriptions - SOP

CONTROL

CIRCUIT

ROW

DECODER

INPUT DATA

CIRCUIT

VCC
GND

1024 X 2048

MEMORY ARRAY

COLUMN I/O

Pin Description - TSOP/sTSOP

Pin No. Symbol Description

1 - 12, 23,

25 - 28, 31

13 - 15,

17 - 21

A0 - A17 Address Inputs

I/O0 - I/O7 Data Inputs/Outputs

16 GND Ground

22

24

29

CE1

OE

WE

Chip Enable 1

Output Enable

Write Enable

30 CE2 Chip Enable 2

32 VCC Power Supply

Pin No. Symbol Description

1 - 4, 7,

9 - 20, 31

5

A0 - A17 Address Inputs

WE

Write Enable

6 CE2 Chip Enable 2

8 VCC Power Supply

21 - 23,

25 - 29

I/O0 - I/O7 Data Inputs/Outputs

24 GND Ground

30

32

CE1

OE

Chip Enable 1

Output Enable

PRELIMINARY (March, 2001, Version 0.2) 2 AMIC Technology, Inc.

A62S8308 Series

Recommended DC Operating Conditions

(TA = 0°C to + 70°C or -25°C to 85°C)

Symbol Parameter Min. Typ. Max. Unit

VCC Supply Voltage 2.7 3.0 3.6 V

GND Ground 0 0 0 V

VIH Input High Voltage 2.4 - VCC + 0.3 V

VIL Input Low Voltage -0.3 - +0.6 V

CL Output Load - - 30 pF

TTL Output Load - - 1 -

Absolute Maximum Ratings*

VCC to GND . . . . . . . . . . . . . . . . . . . . . -0.5V to + 4.6V

IN, IN/OUT Volt to GND . . . . . . . . . -0.5V to VCC + 0.5V

Operating Temperature, Topr . . . . . . . . -25°C to + 85°C

Storage Temperature, Tstg . .. . . . . . . . -55°C to + 125°C

Power Dissipation, PT . . . . . . . . . . . . . . . . . . . . . . 0.7W

Soldering Temp. & Time . . . . . . . . . . . . . 260°C, 10 sec

*Comments

Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of
this device at these or any other conditions above those
indicated in the operational sections of this specification
is not implied or intended. Exposure to the absolute
maximum rating conditions for extended periods may
affect device reliability.

DC Electrical Characteristics (TA = 0°C to + 70°C or -25°C to 85°C, VCC = 2.7V to 3.6V, GND = 0V)

Symbol Parameter

ILI

ILO

ICC

ICC1 - 40 - 40 mA

ICC2

Input Leakage
Current

Output Leakage
Current

Active Power
Supply Current

Dynamic Operating
Current

A62S8308-55S/70S A62S8308-55SI/70SI

Min. Max. Min. Max.

- 1 - 1

- 1 - 1

- 3 - 3 mA

- 10 - 10 mA

Unit Conditions

VIN = GND to VCC

µA

CE1 = VIH or CE2 = VIL or

µA

OE = VIH or WE = VIL

VI/O = GND to VCC

CE1 = VIL, CE2 = VIH

II/O = 0mA
Min. Cycle, Duty = 100%

CE1 = VIL, CE2 = VIH

II/O = 0mA

CE1 = VIL, CE2 = VIH

VIH = VCC, VIL = 0V,
f = 1MHz, II/O = 0mA

PRELIMINARY (March, 2001, Version 0.2) 3 AMIC Technology, Inc.

A62S8308 Series

CE1

OE WE

DC Electrical Characteristics (continued)

Symbol Parameter

Min. Max. Min. Max.

ISB - 0.5 - 0.5 mA

ISB1

ISB2 - 10 - 15

VOL Output Low Voltage - 0.4 - 0.4 V IOL = 2.1mA

VOH Output High Voltage 2.4 - 2.4 - V IOH = -1.0mA

Standby Power
Supply Current

A62S8308-55S/70S A62S8308-55SI/70SI

- 10 - 15

Unit Conditions

CE1 = VIH or

CE2 = VIL

CE1 ≥ VCC - 0.2V

CE2 ≥ VCC - 0.2V

µA

VIN ≥ 0V

CE2 ≤ 0.2V

µA

VIN ≥ 0V

Truth Table

Mode

Standby

H X X X High Z ISB, ISB1

CE2

I/O Operation Supply Current

Output Disable L H H H High Z ICC, ICC1, ICC2

Read L H L H DOUT ICC, ICC1, ICC2

Write L H X L DIN ICC, ICC1, ICC2

Note: X = H or L

X L X X High Z ISB, ISB2

Capacitance (TA = 25°C, f = 1.0MHz)

Symbol Parameter Min. Max. Unit Conditions

CIN* Input Capacitance 6 pF VIN = 0V

CI/O* Input/Output Capacitance 8 pF VI/O = 0V

* These parameters are sampled and not 100% tested.

PRELIMINARY (March, 2001, Version 0.2) 4 AMIC Technology, Inc.

A62S8308 Series

AC Characteristics (TA = 0°C to + 70°C or -25°C to 85°C, VCC = 2.7V to 3.6V)

Symbol Parameter A62S8308-55S/SI

(VCC = 3.0V to 3.6V)

Min. Max. Min. Max.

Read Cycle

tRC Read Cycle Time 55 - 70 - ns
tAA Address Access Time - 55 - 70 ns
tACE1 Chip Enable Access Time

tACE2
tOE Output Enable to Output Valid - 30 - 35 ns
tCLZ1 Chip Enable to Output in Low Z

tCLZ2 CE2 10 - 10 - ns
tOLZ Output Enable to Output in Low Z 5 - 5 - ns
tCHZ1 Chip Disable to Output in High Z

tCHZ2 CE2 0 20 0 25 ns
tOHZ Output Disable to Output in High Z 0 20 0 25 ns

CE1

CE2

CE1

CE1

- 55 - 70 ns

-

10

0 20 0 25 ns

55 - 70 ns

-

A62S8308-70S/SI

(VCC = 2.7V to 3.6V)

10 - ns

Unit

tOH Output Hold from Address Change 5 - 10 - ns

Read Cycle

tWC Write Cycle Time 55 - 70 - ns
tCW Chip Enable to End of Write 50 - 60 - ns
tAS Address Setup Time 0 - 0 - ns
tAW Address Valid to End of Write 50 - 60 - ns
tWP Write Pulse Width 40 - 50 - ns
tWR Write Recovery Time 0 - 0 - ns
tWHZ Write to Output in High Z 0 25 0 25 ns
tDW Data to Write Time Overlap 25 - 30 - ns
tDH Data Hold from Write Time 0 - 0 - ns
tOW Output Active from End of Write 5 - 5 - ns

Notes: tCHZ1, tCHZ2, tOHZ and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are
not referred to output voltage levels.

PRELIMINARY (March, 2001, Version 0.2) 5 AMIC Technology, Inc.

A62S8308 Series

Timing Waveforms

Read Cycle 1

Address

DOUT

(1, 2, 4)

tRC

tAA

tOH

tOH

Read Cycle 2

CE1

DOUT

Read Cycle 3

CE2

(1, 3, 4, 6)

(1, 4, 7 ,8)

tACE1

5

tCLZ1

tCHZ1

5

tACE2

5

tCHZ2

DOUT

tCLZ2

5

PRELIMINARY (March, 2001, Version 0.2) 6 AMIC Technology, Inc.

A62S8308 Series

Timing Waveforms (continued)

Read Cycle 4

Address

(1)

tRC

tAA

OE

CE1

CE2

DOUT

tCLZ1

tCLZ2

tOE

5

tOLZ

tACE1

5

tACE2

5

tCHZ2

tOH

tCHZ1

5

5

tOHZ

5

Notes: 1. WE is high for Read Cycle.

2. Device is continuously enabled CE1 = VIL and CE2 = VIH.

3. Address valid prior to or coincident with CE1 transition low.

4. OE = VIL.

5. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.

6. CE2 is high.

7. CE1 is low.

8. Address valid prior to or coincident with CE2 transition high.

PRELIMINARY (March, 2001, Version 0.2) 7 AMIC Technology, Inc.

A62S8308 Series

Timing Waveforms (continued)

Write Cycle 1
(Write Enable Controlled)

Address

(6)

tWC

CE1

CE2

WE

DIN

DOUT

tAW

5

tCW

(4)

(4)

1

tAS

tWHZ

tWP

2

tWR

tDHtDW

3

tOW

PRELIMINARY (March, 2001, Version 0.2) 8 AMIC Technology, Inc.

A62S8308 Series

Timing Waveforms (continued)

Write Cycle 2
(Chip Enable Controlled)

tWC

Address

3

CE1

tAW tWR

5

tCW

(4)

1

tAS

CE2

WE

DIN

DOUT

(4)

tWHZ

5

tCW

2

tWP

tDW

7

tDH

Notes: 1. tAS is measured from the address valid to the beginning of Write.

2. A Write occurs during the overlap (tWP) of a low CE1 , a high CE2 and a low WE .

3. tWR is measured from the earliest of CE1 or WE going high or CE2 going low to the end of the Write cycle.

4. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transition or after
the WE transition, outputs remain in a high impedance state.

5. tCW is measured from the later of CE1 going low or CE2 going high to the end of Write.

6. OE is continuously low. ( OE = VIL)

7. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.

PRELIMINARY (March, 2001, Version 0.2) 9 AMIC Technology, Inc.

A62S8308 Series

AC Test Conditions

Input Pulse Levels 0V to 3.0V
Input Rise and Fall Time 5 ns
Input and Output Timing Reference Levels 1.5V
Output Load See Figures 1 and 2

TTL

CL

30pF

* Including scope and jig. * Including scope and jig.

CL

TTL

5pF

Figure 1. Output Load Figure 2. Output Load for tCLZ1,
tCLZ2, tOHZ, tOLZ, tCHZ1,
tCHZ2, tWHZ, and tOW

Data Retention Characteristics (TA = 0°C to + 70°C or -25°C to 85°C)

Symbol Parameter Min. Max. Unit Conditions

VDR1 2.0 3.6 V

VCC for Data Retention

VDR2

ICCDR1

S-Version - 5*

SI-Version - 10**

2.0 3.6 V

µA

Data Retention Current

CE1 ≥ VCC - 0.2V

CE2 ≤ 0.2V

CE1 ≥ VCC - 0.2V or
CE1 ≤ 0.2V

VCC = 2.0V

CE1 ≥ VCC - 0.2V

CE2 ≥ VCC - 0.2V
VIN ≥ 0V

ICCDR2

tCDR Chip Disable to Data Retention Time 0 - ns

S-Version - 5*

SI-Version - 10**

µA

VCC = 2.0V
CE2 ≤ 0.2V

VIN ≥ 0V

See Retention Waveform

tR Operation Recovery Time tRC - ns

* A62S8308-55S/70S ICCDR: Max. 1µA at TA = 0°C + 40°C
** A62S8308-55SI/70SI ICCDR: Max. 1µA at TA = 0°C + 40°C

PRELIMINARY (March, 2001, Version 0.2) 10 AMIC Technology, Inc.

A62S8308 Series

CE1

Low VCC Data Retention Waveform (1) (

Controlled)

DATA RETENTION MODE

VCC

CE1

2.7V

tCDR

VIH

VDR ≥ 2V

CE1 ≥ VDR - 0.2V

Low VCC Data Retention Waveform (2) (CE2 Controlled)

DATA RETENTION MODE

VCC

CE2

2.7V

tCDR

VIL

CE2

VDR ≥ 2V

<

0.2V

2.7V
tR

VIH

2.7V
tR

VIL

PRELIMINARY (March, 2001, Version 0.2) 11 AMIC Technology, Inc.

A62S8308 Series

Ordering Information

Part No. Access Time

(ns)

A62S8308M-55S 40 10 32L SOP

A62S8308M-55SI

A62S8308V-55S 40 10 32L TSOP

A62S8308V-55SI

A62S8308X-55S 40 10 32L sTSOP

A62S8308X-55SI 40 15 32L sTSOP

A62S8308G-55S 40 10 36B Mini BGA

A62S8308G-55SI 40 15 36B Mini BGA

A62S8308M-70S 40 10 32L SOP

A62S8308M-70SI

A62S8308V-70S 40 10 32L TSOP

55

Operating Current

Max. (mA)

40 15 32L SOP

40 15 32L TSOP

40 15 32L SOP

Standby Current

Max. (µµA)

Package

A62S8308V-70SI

A62S8308X-70S 40 10 32L sTSOP

A62S8308X-70SI 40 15 32L sTSOP

A62S8308G-70S 40 10 36B Mini BGA

A62S8308G-70SI 40 15 36B Mini BGA

70

40 15 32L TSOP

PRELIMINARY (March, 2001, Version 0.2) 12 AMIC Technology, Inc.

A62S8308 Series

D

Package Information
SOP (W.B.) 32L Outline Dimensions unit: inches/mm

1732

E

HE

θ

L

16

b

A

e

A1 A2

See Detail F

Detail F

Dimensions in inches Dimensions in mm

Min Nom Max Min Nom Max

y - - 0.004 - - 0.10

0° - 10° 0° - 10°

c

LE

1

S

Seating Plane

D

y

Symbol

A - - 0.118 - - 3.00
A1 0.004 - - 0.10 - ­A2 0.101 0.106 0.111 2.57 2.69 2.82

b 0.014 0.016 0.020 0.36 0.41 0.51

c 0.006 0.008 0.012 0.15 0.20 0.31

D - 0.805 0.817 - 20.45 20.75

E 0.440 0.445 0.450 11.18 11.30 11.43

e 0.044 0.050 0.056 1.12 1.27 1.42
HE 0.546 0.556 0.566 13.87 14.12 14.38

L 0.023 0.031 0.039 0.58 0.79 0.99
LE 0.047 0.055 0.063 1.19 1.40 1.60

S - - 0.036 - - 0.91

θ

Notes:

1. The maximum value of dimension D includes end flash.

2. Dimension E does not include resin fins.

3. Dimension S includes end flash.

PRELIMINARY (March, 2001, Version 0.2) 13 AMIC Technology, Inc.

A62S8308 Series

Dimensions in inches

Dimensions in mm

Package Information
TSOP 32L TYPE I (8 X 20mm) Outline Dimensions unit: inches/mm

D

e

A2

E

HD

Detail "A"

y

D

c

A1

L

LE

Detail "A"

S

b

A

θ

Symbol

A - - 0.047 - - 1.20

A1 0.002 - 0.006 0.05 - 0.15
A2 0.037 0.039 0.041 0.95 1.00 1.05

b 0.007 0.009 0.011 0.18 0.22 0.27

c 0.004 - 0.008 0.11 - 0.20

D 0.720 0.724 0.728 18.30 18.40 18.50

E - 0.315 0.319 - 8.00 8.10

e 0.020 BSC 0.50 BSC
HD 0.779 0.787 0.795 19.80 20.00 20.20

L 0.016 0.020 0.024 0.40 0.50 0.60
LE - 0.032 - - 0.80 -

S - - 0.020 - - 0.50

y - - 0.003 - - 0.08

θ 0°

Min Nom Max Min Nom Max

-

5° 0°

-

5°

PRELIMINARY (March, 2001, Version 0.2) 14 AMIC Technology, Inc.

Notes:

1. The maximum value of dimension D includes end flash.

2. Dimension E does not include resin fins.

3. Dimension S includes end flash.

A62S8308 Series

Dimensions in inches

Dimensions in mm

Package Information
sTSOP 32L TYPE I (8 X 13.4mm) Outline Dimensions unit: inches/mm

e

0.076MM

D

SEATING PLANE

E

D1

D

Detail "A"

A2

c

A1

L

LE

Detail "A"

S

b

A

θ

Symbol

A
A1 0.002
A2 0.037 0.039 0.041 0.95 1.00 1.05

b 0.007 0.008 0.009 0.17 0.20 0.23

c 0.0056 0.0059 0.0062 0.142 0.150 0.158

E 0.311 0.315 0.319 7.90 8.00 8.10

e 0.020 TYP 0.50 TYP

D 0.520 0.528 0.535 13.20 13.40 13.60
D1 0.461 0.465 0.469 11.70 11.80 11.90

L 0.012 0.020 0.028 0.30 0.50 0.70
LE 0.0275 0.0315 0.0355 0.700 0.800 0.900

S 0.0109 TYP 0.278 TYP

θ 0° 3° 5° 0° 3° 5°

Min Nom Max Min Nom Max

- -

0.049

- -

- -

0.05

1.25

- -

PRELIMINARY (March, 2001, Version 0.2) 15 AMIC Technology, Inc.

Notes:

1. The maximum value of dimension D1 includes end flash.

2. Dimension E does not include resin fins.

3. Dimension S includes end flash.

A62S8308 Series

Package Information
Mini BGA 6X8 (36 BALLS) Outline Dimensions unit : millimeter(mm)

C1

Bottom View

Pin A1 Index

123456

A
B
C
D

E

A

F
G
H

Pin A1 Index

Top View

C

B1

E1

A

Diameter D

Solder Ball

D

0.10

B

E2

E

Symbol Min Typ Max

A - 0.75 ­B 5.90 6.00 6.10

B1 - 3.75 -

C 7.90 8.00 8.10

C1 - 5.25 -

D 0.30 0.35 0.40

E 1.00 1.10 1.20
E1 - 0.36 ­E2 - 0.22 -

PRELIMINARY (March, 2001, Version 0.2) 16 AMIC Technology, Inc.