Datasheet A62S6308X-70SI, A62S6308X-70S, A62S6308X-10SI, A62S6308X, A62S6308V-70SI Datasheet (AMICC)
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A62S6308 Series
64K X 8 BIT LOW VOLTAGE CMOS SRAM
Document Title
64K X 8 BIT LOW VOLTAGE CMOS SRAM
Revision History
Rev. No. History Issue Date Remark
1.0 Initial issue September 01, 1997 Preliminary
1.1 Modify TSOP (TSSOP) pin configuration. January 16, 1998
Modify SOP 32L, TSOP 32L and TSSOP 32L type
packages outline dimensions.
1.2 Change TSSOP 32L type package to sTSOP 32L. June 16, 1998
Modify sTSOP 32L type package LE symbol dimensions.
1.3 Modify 32-pin TSOP package L symbol dimensions.
2.0
Add 36-ball Mini BGA (6X8) package
Finalize
June 22, 1998
October 9, 1998 Final
(October, 1998, Version 2.0) AMIC Technology, Inc.
A62S6308 Series
64K X 8 BIT LOW VOLTAGE CMOS SRAM
Features
n Power supply range: 2.7V to 3.6V
n Access times:70/100 ns (max.)
n Current:
A62S6308-S series: Operating: 40mA (max.)
Standby: 15µA (max.)
A62S6308-SI series: *Operating: 40mA (max.)
*Standby: 30µA (max.)
n Extended operating temperature range:-25°C to 85°C
n Full static operation, no clock or refreshing required
General Description
The A62S6308 is a low operating current 524,288-bit
static random access memory organized as 65,536
words by 8 bits and operates on a low power supply
voltage from 2.7V to 3.6V.
Inputs and three-state outputs are TTL compatible and
allow for direct interfacing with common system bus
structures.
n All inputs and outputs are directly TTL-compatible
n Common I/O using three-state output
n Output enable and two chip enable inputs for easy
application
n Data retention voltage: 2V (min.)
n Available in 32-pin SOP, TSOP, sTSOP (8 X
13.4mm) forward type and 36-ball Mini BGA (6X8)
packages
Two chip enable inputs are provided for POWER-DOWN
and a device enable and an output enable input are
included for easy interfacing.
Data retention is guaranteed at a power supply voltage
as low as 2V.
Pin Configurations
nn SOP nn TSOP/(sTSOP) nn Mini BGA (6X8) Top View
NC
NC
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
1
2
3
4
5
A62S6308M
6
7
8
9
10
11
12
13
14
15
16 17
VCC
32
A15
31
CE2
30
WE
29
A13
28
A8
27
A9
26
A11
25
OE
24
A10
23
22
CE1
I/O7
21
I/O6
20
I/O5
19
I/O4
18
I/O3GND
A11
A13
WE
CE2
A15
VCC
NC
NC
A14
A12
A9
A8
A7
A6
A5
A4
(forward type)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
A62S6308V
(A62S6308X)
1 2 3 4 5 6
~
~
~
~
OE
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A A0 A1 CE2 A3 A6 A8
A10
CE1
B I/O4 A2
7
I/O
6
I/O
C I/O5 NC A5 I/O1
5
I/O
4
I/O
3
I/O
D VSS VCC
GND
2
I/O
E VCC VSS
1
I/O
0
I/O
F I/O6 NC NC I/O2
A0
A1
G I/O7
A2
A3
WE
OE CE1
A4 A7 I/O0
NC A15 I/O3
H A9 A10 A11 A12 A13 A14
(October, 1998, Version 2.0) 1 AMIC Technology, Inc.
A62S6308 Series
Block Diagram
A0
A13
A14
A15
I/O1
I/O8
CE2
CE1
OE
WE
Pin Descriptions - SOP
CONTROL
CIRCUIT
ROW
DECODER
INPUT DATA
CIRCUIT
VCC
GND
512 X 1024
MEMORY ARRAY
COLUMN I/O
Pin Description - TSOP/sTSOP
Pin No. Symbol Description
1,2 NC No Connection
3 - 12, 23,
25 - 28, 31
13 - 15,
17 - 21
A0 - A15 Address Inputs
I/O1 - I/O8 Data Inputs/Outputs
16 GND Ground
22
24
29
CE1
OE
WE
Chip Enable
Output Enable
Write Enable
30 CE2 Chip Enable
32 VCC Power Supply
Pin No. Symbol Description
1 - 4, 7,
11 - 20, 31
5
A0 - A15 Address Inputs
WE
Write Enable
6 CE2 Chip Enable
8 VCC Power Supply
9, 10 NC No Connection
21 - 23,
25 - 29
I/O1 - I/O8 Data Inputs/Outputs
24 GND Ground
30
32
CE1
OE
Chip Enable
Output Enable
(October, 1998, Version 2.0) 2 AMIC Technology, Inc.
A62S6308 Series
Recommended DC Operating Conditions
(TA = 0°C to + 70°C, -25°C to 85°C)
Symbol Parameter Min. Typ. Max. Unit
VCC Supply Voltage 2.7 3.0 3.6 V
GND Ground 0 0 0 V
VIH Input High Voltage 2.0 - VCC + 0.3 V
VIL Input Low Voltage -0.3 - +0.6 V
CL Output Load - - 30 pF
TTL Output Load - - 1 -
Absolute Maximum Ratings*
VCC to GND . . . . . . . . . . . . . . . . . . . . . -0.5V to + 4.6V
IN, IN/OUT Volt to GND . . . . . . . . . -0.5V to VCC + 0.5V
Operating Temperature, Topr . . . . . . . . -25°C to + 85°C
Storage Temperature, Tstg . .. . . . . . . . -55°C to + 125°C
Power Dissipation, PT . . . . . . . . . . . . . . . . . . . . . . 0.7W
Soldering Temp. & Time . . . . . . . . . . . . . 260°C, 10 sec
*Comments
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of this
device at these or any other conditions above those
indicated in the operational sections of this specification
is not implied or intended. Exposure to the absolute
maximum rating conditions for extended periods may
affect device reliability.
DC Electrical Characteristics (TA = 0°C to + 70°C or -25°C to 85°C, VCC = 2.7V to 3.6V, GND = 0V)
Symbol Parameter
ILI
ILO
ICC
ICC1
ICC2
Input Leakage
Current
Output Leakage
Current
Active Power
Supply Current
Dynamic Operating
Current
A62S6308-70S/10S A62S6308-70SI/10SI
Min. Max. Min. Max.
- 1 - 1
- 1 - 1
- 3 - 3 mA
- 40 - 40 mA
- 5 - 5 mA
Unit Conditions
VIN = GND to VCC
µA
CE1 = VIH or CE2 = VIL or
µA
OE = VIH or WE = VIL
VI/O = GND to VCC
CE1 = VIL, CE2 = VIH
II/O = 0mA
Min. Cycle, Duty = 100%
CE1 = VIL, CE2 = VIH
II/O = 0mA
CE1 = VIL, CE2 = VIH
VIH = VCC, VIL = 0V
f = 1MHZ, II/O = 0mA
(October, 1998, Version 2.0) 3 AMIC Technology, Inc.
A62S6308 Series
CE1
CE1
OE WE
DC Electrical Characteristics (continued)
Symbol Parameter
Min. Max. Min. Max.
ISB - 0.5 - 0.5 mA
ISB1
ISB2 - 15 - 30
VOL Output Low Voltage - 0.4 - 0.4 V IOL = 2.1mA
VOH Output High Voltage 2.4 - 2.4 - V IOH = -1.0mA
Standby Power
Supply Current
A62S6308-70S/10S A62S6308-70SI/10SI
- 15 - 30
Unit Conditions
CE1 = VIH or
CE2 = VIL
CE2 ≥ VCC - 0.2V
µA
VIN ≥ 0V
CE2 ≤ 0.2V
µA
VIN ≥ 0V
Truth Table
Mode
Standby
H X X X High Z ISB, ISB1
CE2
I/O Operation Supply Current
≥ VCC - 0.2V
Output Disable L H H H High Z ICC, ICC1, ICC2
Read L H L H DOUT ICC, ICC1, ICC2
Write L H X L DIN ICC, ICC1, ICC2
Note: X = H or L
X L X X High Z ISB, ISB2
Capacitance (TA = 25°C, f = 1.0MHz)
Symbol Parameter Min. Max. Unit Conditions
CIN* Input Capacitance 6 pF VIN = 0V
CI/O* Input/Output Capacitance 8 pF VI/O = 0V
* These parameters are sampled and not 100% tested.
(October, 1998, Version 2.0) 4 AMIC Technology, Inc.
A62S6308 Series
AC Characteristics (TA = 0°C to + 70°C or -25°C to 85°C, VCC = 2.7V to 3.6V)
Symbol Parameter
Min. Max. Min. Max.
Read Cycle
tRC Read Cycle Time 70 - 100 - ns
tAA Address Access Time - 70 - 100 ns
tACE1
tACE2
tOE Output Enable to Output Valid - 35 - 50 ns
tCLZ1
tCLZ2 CE2 10 - 10 - ns
tOLZ Output Enable to Output in Low Z 5 - 5 - ns
tCHZ1
tCHZ2 CE2 0 25 0 35 ns
tOHZ Output Disable to Output in High Z 0 25 0 35 ns
Chip Enable Access Time
Chip Enable to Output in Low Z
Chip Disable to Output in High Z
CE1
CE2 - 70 - 100 ns
CE1
CE1
A62S6308-70S/SI A62S6308-10S/SI
- 70 - 100 ns
10 - 10 - ns
0 25 0 35 ns
Unit
tOH Output Hold from Address Change 10 - 10 - ns
Read Cycle
tWC Write Cycle Time 70 - 100 - ns
tCW Chip Enable to End of Write 60 - 80 - ns
tAS Address Setup Time 0 - 0 - ns
tAW Address Valid to End of Write 60 - 80 - ns
tWP Write Pulse Width 50 - 60 - ns
tWR Write Recovery Time 0 - 0 - ns
tWHZ Write to Output in High Z 0 25 0 35 ns
tDW Data to Write Time Overlap 30 - 40 - ns
tDH Data Hold from Write Time 0 - 0 - ns
tOW Output Active from End of Write 5 - 5 - ns
Notes: tCHZ1, tCHZ2, tOHZ and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are
not referred to output voltage levels.
(October, 1998, Version 2.0) 5 AMIC Technology, Inc.
A62S6308 Series
Timing Waveforms
Read Cycle 1
Address
DOUT
(1, 2, 4)
tRC
tAA
tOH
tOH
Read Cycle 2
CE1
DOUT
Read Cycle 3
CE2
(1, 3, 4, 6)
(1, 4, 7 ,8)
tACE1
5
tCLZ1
tCHZ1
5
tACE2
5
tCHZ2
DOUT
tCLZ2
5
(October, 1998, Version 2.0) 6 AMIC Technology, Inc.
A62S6308 Series
Timing Waveforms (continued)
Read Cycle 4
Address
(1)
tRC
tAA
OE
CE1
CE2
DOUT
tCLZ1
tCLZ2
tOE
5
tOLZ
tACE1
5
tACE2
5
tCHZ2
tOH
tCHZ1
5
5
tOHZ
5
Notes: 1. WE is high for Read Cycle.
2. Device is continuously enabled CE1 = VIL and CE2 = VIH.
3. Address valid prior to or coincident with CE1 transition low.
4. OE = VIL.
5. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.
6. CE2 is high.
7. CE1 is low.
8. Address valid prior to or coincident with CE2 transition high.
(October, 1998, Version 2.0) 7 AMIC Technology, Inc.
A62S6308 Series
Timing Waveforms (continued)
Write Cycle 1
(Write Enable Controlled)
Address
(6)
tWC
CE1
CE2
WE
DOUT
DIN
tAW
5
tCW
(4)
(4)
1
tAS
tWHZ
tWP
2
tDW
tWR
tDH
3
tOW
(October, 1998, Version 2.0) 8 AMIC Technology, Inc.
A62S6308 Series
Timing Waveforms (continued)
Write Cycle 2
(Chip Enable Controlled)
tWC
Address
3
CE1
tAW tWR
5
tCW
(4)
1
tAS
CE2
WE
DIN
DOUT
(4)
5
tCW
2
tWP
tWHZ
tDW
7
tDH
Notes: 1. tAS is measured from the address valid to the beginning of Write.
2. A Write occurs during the overlap (tWP) of a low CE1, a high CE2 and a low WE .
3. tWR is measured from the earliest of CE1 or WE going high or CE2 going low to the end of the Write cycle.
4. If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transition or after
the WE transition, outputs remain in a high impedance state.
5. tCW is measured from the later of CE1 going low or CE2 going high to the end of Write.
6. OE is continuously low. ( OE = VIL)
7. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.
(October, 1998, Version 2.0) 9 AMIC Technology, Inc.
A62S6308 Series
AC Test Conditions
Input Pulse Levels 0.4V to 2.4V
Input Rise and Fall Time 5 ns
Input and Output Timing Reference Levels 1.5V
Output Load See Figures 1 and 2
TTL
CL
30pF
* Including scope and jig. * Including scope and jig.
CL
TTL
5pF
Figure 1. Output Load Figure 2. Output Load for tCLZ1,
tCLZ2, tOHZ, tOLZ, tCHZ1,
tCHZ2, tWHZ, and tOW
Data Retention Characteristics (TA = 0°C to + 70°C or -25°C to 85°C)
Symbol Parameter Min. Max. Unit Conditions
VDR1 2.0 3.6 V
VCC for Data Retention
VDR2
ICCDR1
S-Version - 10*
SI-Version - 20**
2.0 3.6 V
µA
Data Retention Current
CE1 ≥ VCC - 0.2V
CE2 ≤ 0.2V
CE1 ≥ VCC - 0.2V or
CE1 ≤ 0.2V
VCC = 2.0V
CE1 ≥ VCC - 0.2V
CE2 ≥ VCC - 0.2V
VIN ≥ 0V
ICCDR2
tCDR Chip Disable to Data Retention Time 0 - ns
tR Operation Recovery Time tRC - ns
tVR
VCC Rise Time from Data Retention Voltage
to Operating Voltage
S-Version - 10*
SI-Version - 20**
5 - ms
µA
VCC = 2.0V
CE2 ≤ 0.2V
VIN ≥ 0V
See Retention Waveform
** A62S6308-70S/10S ICCDR: Max. 3µA at TA = 0°C + 40°C
* A62S6308-70SI/10SI ICCDR: Max. 3µA at TA = 0°C + 40°C
(October, 1998, Version 2.0) 10 AMIC Technology, Inc.
A62S6308 Series
CE1
Low VCC Data Retention Waveform (1) (
Controlled)
DATA RETENTION MODE
VCC
CE1
2.7V
tCDR
VIH
VDR ≥ 2V
CE1 ≥ VDR - 0.2V
Low VCC Data Retention Waveform (2) (CE2 Controlled)
DATA RETENTION MODE
VCC
CE2
2.7V
tCDR
VIL
VDR ≥ 2V
CE2 < 0.2V
2.7V
tR
tVR
VIH
2.7V
tR
tVR
VIL
(October, 1998, Version 2.0) 11 AMIC Technology, Inc.
A62S6308 Series
Ordering Information
Part No.
A62S6308M-70S 40 15 32L SOP
A62S6308M-70SI
A62S6308V-70S 40 15 32L TSOP
A62S6308V-70SI
A62S6308X-70S 40 15 32L sTSOP
A62S6308X-70SI 40 30 32L sTSOP
A62S6308G-70S 40 15 36B Mini BGA
A62S6308G-70SI 40 30 36B Mini BGA
A62S6308M-10S 40 15 32L SOP
A62S6308M-10SI
A62S6308V-10S 40 15 32L TSOP
A62S6308V-10SI
Access Time (ns) Operating Current
Max. (mA)
70
100
40 30 32L SOP
40 30 32L TSOP
40 30 32L SOP
40 30 32L TSOP
Standby Current
Max. (µµA)
Package
A62S6308X-10S 40 15 32L sTSOP
A62S6308X-10SI 40 30 32L sTSOP
A62S6308G-10S 40 15 36B Mini BGA
A62S6308G-10SI 40 30 36B Mini BGA
(October, 1998, Version 2.0) 12 AMIC Technology, Inc.
A62S6308 Series
Package Information
SOP (W.B.) 32L Outline Dimensions unit: inches/mm
1732
E
HE
θ
L
16
b
A
e
A1 A2
See Detail F
Detail F
Dimensions in inches Dimensions in mm
Min Nom Max Min Nom Max
y - - 0.004 - - 0.10
0° - 10° 0° - 10°
c
LE
1
S
Seating Plane
D
y
D
Symbol
A - - 0.118 - - 3.00
A1 0.004 - - 0.10 - A2 0.101 0.106 0.111 2.57 2.69 2.82
b 0.014 0.016 0.020 0.36 0.41 0.51
c 0.006 0.008 0.012 0.15 0.20 0.31
D - 0.805 0.817 - 20.45 20.75
E 0.440 0.445 0.450 11.18 11.30 11.43
e 0.044 0.050 0.056 1.12 1.27 1.42
HE 0.546 0.556 0.566 13.87 14.12 14.38
L 0.023 0.031 0.039 0.58 0.79 0.99
LE 0.047 0.055 0.063 1.19 1.40 1.60
S - - 0.036 - - 0.91
θ
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
(October, 1998, Version 2.0) 13 AMIC Technology, Inc.
A62S6308 Series
Dimensions in inches
Dimensions in mm
Package Information
TSOP 32L TYPE I (8 X 20mm) Outline Dimensions unit: inches/mm
D
e
A2
E
HD
Detail "A"
y
D
c
A1
L
LE
Detail "A"
S
b
A
θ
Symbol
A - - 0.047 - - 1.20
A1
A2
b 0.007 0.009 0.011 0.18 0.22 0.27
c 0.004 - 0.008 0.11 - 0.20
D 0.720 0.724 0.728 18.30 18.40 18.50
E - 0.315 0.319 - 8.00 8.10
e 0.020 BSC 0.50 BSC
HD 0.779 0.787 0.795 19.80 20.00 20.20
L 0.016 0.020 0.024 0.40 0.50 0.60
LE - 0.032 - - 0.80 -
S - - 0.020 - - 0.50
y - - 0.003 - - 0.08
θ 0°
Min Nom Max Min Nom Max
0.002 - 0.006 0.05 - 0.15
0.037 0.039 0.041 0.95 1.00 1.05
-
5° 0°
-
5°
(October, 1998, Version 2.0) 14 AMIC Technology, Inc.
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
A62S6308 Series
Dimensions in inches
Dimensions in mm
Package Information
sTSOP 32L TYPE I (8 X 13.4mm) Outline Dimensions unit: inches/mm
e
0.076MM
D
SEATING PLANE
E
D1
D
Detail "A"
A2
c
A1
L
LE
Detail "A"
S
b
A
θ
Symbol
A
A1 0.002
A2 0.037 0.039 0.041 0.95 1.00 1.05
b 0.007 0.008 0.009 0.17 0.20 0.23
c 0.0056 0.0059 0.0062 0.142 0.150 0.158
E 0.311 0.315 0.319 7.90 8.00 8.10
e 0.020 TYP 0.50 TYP
D 0.520 0.528 0.535 13.20 13.40 13.60
D1 0.461 0.465 0.469 11.70 11.80 11.90
L 0.012 0.020 0.028 0.30 0.50 0.70
LE 0.0275 0.0315 0.0355 0.700 0.800 0.900
S 0.0109 TYP 0.278 TYP
θ 0° 3° 5° 0° 3° 5°
Min Nom Max Min Nom Max
- -
0.049
- -
- -
0.05
1.25
- -
(October, 1998, Version 2.0) 15 AMIC Technology, Inc.
Notes:
1. The maximum value of dimension D1 includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
A62S6308 Series
Symbol
Min
Typ
Max
Package Information
Mini BGA 6X8 (36 BALLS) Outline Dimensions unit : millimeter(mm)
C1
Bottom View
Pin A1 Index
123456
A
B
C
D
E
A
F
G
H
Pin A1 Index
Top View
C
B1
E1
A
Diameter D
Solder Ball
D
0.10
B
E2
E
A - 0.75 B 5.90 6.00 6.10
B1 - 3.75 -
C 7.90 8.00 8.10
C1 - 5.25 -
D 0.30 0.35 0.40
E 1.00 1.10 1.20
E1 - 0.36 E2 - 0.22 -
(October, 1998, Version 2.0) 16 AMIC Technology, Inc.
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