Datasheet A625308AV-70SU, A625308AV-70SI, A625308AV, A625308AM-70SU, A625308AM Datasheet (AMICC)

A625308A Series

Preliminary 32K X 8 BIT CMOS SRAM

Document Title
32K X 8 BIT CMOS SRAM

Revision History

Rev. No. History Issue Date Remark

0.0 Initial issue February 2, 2001 Preliminary

0.1 Add ultra temp grade and 28-pin DIP package type November 7, 2001

0.2 Add SI grade July 17, 2002

PRELIMINARY (July, 2002, Version 0.2) AMIC Technology, Inc.

A625308A Series

Preliminary 32K X 8 BIT CMOS SRAM

Features

n Power Supply Range: 4.5V to 5.5V
n Access times: 70 ns

A625308A-S series: Operating: 35mA (max.)
Standby: 10µA (max.)
A625308A-SI/SU series: Operating: 35mA (max.)
Standby: 15µA (max.)

General Description

The A625308A is a low operating current 262,144-bit
static random access memory organized as 32,768
words by 8 bits and operates on a voltage from 4.5V to

5.5V.
Inputs and three-state outputs are TTL compatible and
allow for direct interfacing with common system bus
structures.

Pin Configurations

n DIP / SOP n TSOP

n Extended operating temperature range: 0°C to 70°C

for -S series, -25°C to 85°C for -SI series, -40°C to
85°C for -SU series.

n Full static operation, no clock or refreshing required
n All inputs and outputs are directly TTL-compatible
n Common I/O using three-state output
n Data retention voltage: 2.0V (min.)
n Available in 28-pin, DIP/SOP and TSOP

Minimum standby power is drawn by this device when

CE is at a high level, independent of the other input
levels.
Data retention is guaranteed at a power supply voltage
as low as 2.0V.

A14
A12

I/O0
I/O1
I/O

GND

A7
A6
A5
A4
A3
A2

A1
A0

2

1
2

3
4

A625308A(M)

5
6

7
8
9
10
11
12
13
14 15

~

VCC

28

WE

27

A13

26

A8

25

A9

24

A11

23

OE

22

A10

21

CE

20

I/O7

19

I/O6

18

I/O5

17

I/O4

16

3

I/O

A11

A13

WE

VCC

A14
A12

1

OE

2
3

A9

4

A8

5
6
7
8
9
10

A7

11

A6

12

A5

13

A4

14

A3

~

A625308AV

~

~

28

A10
CE

27
26

I/O7

25

I/O6
I/O5

24
23

I/O4

22

I/O3

21

VSS
20
19
18
17
16
15

2

I/O

1

I/O

0

I/O

A0

A1

A2

PRELIMINARY (July, 2002, Version 0.2) 1 AMIC Technology, Inc.

A625308A Series

Block Diagram

A0

A12

A13

A14

I/O0

I/O7

CE
OE

WE

Pin Descriptions – DIP / SOP

CONTROL

CIRCUIT

ROW

DECODER

INPUT DATA

CIRCUIT

VCC
GND

512 X 512

MEMORY ARRAY

COLUMN I/O

Pin Description-TSOP

Pin No. Symbol Description

1-10, 21, 23-26 A0 - A14 Address Input

11-13, 15-19 I/O0 - I/O7 Data Input/Output

20
22
27

CE
OE

WE

Chip Enable
Output Enable
Write Enable

28 VCC Power Supply
14 GND Ground

Pin No. Symbol Description

2-5, 8-17, 28 A0 - A14 Address Input
18-20, 22-26 I/O0 - I/O7 Data Input/Output

27

1
6

CE
OE

WE

Chip Enable
Output Enable
Write Enable

7 VCC Power Supply

21 GND Ground

PRELIMINARY (July, 2002, Version 0.2) 2 AMIC Technology, Inc.

A625308A Series

Recommended DC Operating Conditions

(TA = 0°C to +70°C, -25°C to +85°C or -40°C to +85°C)

Symbol Parameter Min. Typ. Max. Unit

VCC Supply Voltage 4.5 5.0 5.5 V

GND Ground 0 0 0 V

VIH Input High Voltage 2.2 - VCC + 0.5 V

VIL Input Low Voltage -0.5 0 +0.8 V

Absolute Maximum Ratings*

VCC to GND . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V

IN, IN/OUT Volt to GND . . . . . . . . . -0.5V to VCC + 0.5V

Operating Temperature, Topr . . . . . . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . 0°C to +70°C or -40°C to +85°C

Storage Temperature, Tstg . . . . . . . . . -55°C to +125°C

Power Dissipation, PT . . . . . . . . . . . . . . . . . . . . . . 0.7W

Soldering Temp. & Time . . . . . . . . . . . . . 260°C, 10 sec

DC Electrical Characteristics (TA = 0°C to +70°C, -25°C to +85°C or -40°C to +85°C, VCC = 5.0V ± 10%, GND = 0V)

*Comments

Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device.
These are stress ratings only. Functional operation of this
device at these or any other conditions above those
indicated in the operational sections of this specification
is not implied and exposure to absolute maximum rating
conditions for extended periods may affect device
reliability.

Symbol Parameter

Min. Max.

ILI

ILO

ICC Active Power Supply Current - 5 mA

ICC1 Dynamic Operating Current - 35 mA

ICC2

Input Leakage Current - 1

Output Leakage Current - 1

Dynamic Operating Current

A625308A-70S/SI/SU

-

Unit Conditions

µA

µA

5

mA

VIN = GND to VCC

CE = VIH

VI/O = GND to VCC

CE = VIL, II/O = 0mA

Min. Cycle, Duty = 100%

CE = VIL, II/O = 0mA

CE = VIL, VIH = VCC
VIL = 0V, f = 1 MHz
II/O = 0 mA

PRELIMINARY (July, 2002, Version 0.2) 3 AMIC Technology, Inc.

A625308A Series

CE OE WE

DC Electrical Characteristics (continued)

Symbol Parameter

Min. Max. Min. Max.

ISB

ISB1

VOL Output Low Voltage - 0.4 - 0.4 V IOL = 2.1 mA

VOH Output High Voltage 2.4 - 2.4 - V IOH = -1.0 mA

Supply Current
Standby Power

A625308A-70S A625308A-70SI/SU

- 0.5 - 0.5 mA

- 10 - 15

Unit Conditions

CE = VIH

µA

CE ≥ VCC - 0.2V

VIN ≥ 0V

Truth Table

Mode

Standby H X X High Z ISB, ISB1

Output Disable L H H High Z ICC, ICC1, ICC2

Read L L H DOUT ICC, ICC1, ICC2

Write L X L DIN ICC, ICC1, ICC2

I/O Operation Supply Current

Note: X: H or L

Capacitance (TA = 25°C, f = 1.0 MHz)

Symbol Parameter Min. Max. Unit Conditions

CIN* Input Capacitance - 6 pF VIN = 0V

CI/O* Input/Output Capacitance - 8 pF VI/O = 0V

* These parameters are sampled and not 100% tested.

PRELIMINARY (July, 2002, Version 0.2) 4 AMIC Technology, Inc.

A625308A Series

AC Characteristics (TA = 0°C to +70°C, -25°C to +85°C or -40°C to +85°C, VCC = 5.0V ± 10%)

Symbol Parameter

Min. Max.

Read Cycle

tRC Read Cycle Time 70 - ns

tAA Address Access Time - 70 ns

tACE Chip Enable Access Time - 70 ns

tOE Output Enable to Output Valid - 35 ns

tCLZ Chip Enable to Output in Low Z 10 - ns

tOLZ Output Enable to Output in Low Z 5 - ns

tCHZ Chip Disable to Output in High Z - 25 ns

tOHZ Output Disable to Output in High Z - 25 ns

tOH Output Hold from Address Change 10 - ns

Write Cycle

A625308A-70S/SI/SU

Unit

tWC Write Cycle Time 70 - ns

tCW Chip Enable to End of Write 60 - ns

tAS Address Set up Time 0 - ns

tAW Address Valid to End of Write 60 - ns

tWP Write Pulse Width 50 - ns

tWR Write Recovery Time 0 - ns

tWHZ Write to Output in High Z - 25 ns

tDW Data to Write Time Overlap 30 - ns

tDH Data Hold from Write Time 0 - ns

tOW Output Active from End of Write 5 - ns

Notes: tCHZ, tOHZ and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are not
referred to output voltage levels.

PRELIMINARY (July, 2002, Version 0.2) 5 AMIC Technology, Inc.

A625308A Series

Timing Waveforms

Read Cycle 1

(1)

tRC

Address

tAA

OE

DOUT

Read Cycle 2

Address

DOUT

CE

(1, 2, 4)

tCLZ

tOE

5

OLZ

t

tACE

5

tCHZ

tOH

5

tOHZ

5

tRC

tAA

tOH

tOH

PRELIMINARY (July, 2002, Version 0.2) 6 AMIC Technology, Inc.

A625308A Series

Timing Waveforms (continued)

Read Cycle 3

Notes: 1. WE is high for Read Cycle.

2. Device is continuously enabled, CE = VIL.

3. Address valid prior to or coincident with CE transition low.

4. OE = VIL.

5. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.

Write Cycle 1
(Write Enable Controlled)

CE

DOUT

(1, 3, 4)

(6)

tCLZ

tACE

5

tCHZ

5

Address

CE

WE

DOUT

DIN

tWC

tAW

5

tCW

(4)

1

tAS

tWHZ

2

tWP

7

tWR

3

tDHtDW

7

tOW

PRELIMINARY (July, 2002, Version 0.2) 7 AMIC Technology, Inc.

A625308A Series

Timing Waveforms (continued)

Write Cycle 2
(Chip Enable Controlled)

Address

CE

WE

(6)

tWC

tAW tWR

5

tCW

(4)

1

tAS

2

tWP

3

DOUT

DIN

tWHZ

tDW

7

tDH

Notes: 1. tAS is measured from the address valid to the beginning of Write.

2. A Write occurs during the overlap (tWP) of a low CE and a low WE.

3. tWR is measured form the earliest of CE or WE going high to the end of the Write cycle.

4. If the CE low transition occurs simultaneously with the WE low transition or after the WE transition, outputs
remain in a high impedance state.

5. tCW is measured from the later of CE going low to the end of Write.

6. OE level is high or low.

7. Transition is measured ±500mV from steady. This parameter is sampled and not 100% tested.

PRELIMINARY (July, 2002, Version 0.2) 8 AMIC Technology, Inc.

A625308A Series

AC Test Conditions

Input Pulse Levels 0V, 3V

Input Rise And Fall Time 5 ns

Input and Output Timing Reference Levels 1.5V

Output Load See Figure 1 and 2

TTL

CL

30pF

* Including scope and jig. * Including scope and jig.

CL

TTL

5pF

Figure 1. Output Load Figure 2. Output Load for tCLZ1,
tCLZ2, tOHZ, tOLZ, tCHZ1,
tCHZ2, tWHZ, and tOW

Data Retention Characteristics (TA = 0°C to +70°C, -25°C to +85°C or -40°C to +85°C)

Symbol Parameter Min. Max. Unit Conditions

VDR VCC for Data Retention 2.0 5.5 V

ICCDR

Data Retention Current

-

3

tCDR Chip Disable to Data Retention Time 0 - ns

tR Operation Recovery Time tRC - ns

CE ≥ VCC - 0.2V

VCC = 2.0V,

µA

CE ≥ VCC - 0.2V

VIN ≥ 0V

See Retention Waveform

PRELIMINARY (July, 2002, Version 0.2) 9 AMIC Technology, Inc.

A625308A Series

Low VCC Data Retention Waveform

DATA RETENTION MODE

VCC

4.5V

tCDR

VDR ≥ 2.0V

4.5V

tR

CE

VIH

CE ≥ VDR - 0.2V

VIH

Ordering Information

Part No. Access Time (ns)

Operating Current

Max. (mA)

A625308A-70S 35 10 28L DIP

A625308AM-70S 35 10 28L SOP

A625308AV-70S 35 10 28L TSOP (Forward)

A625308A-70SI 35 15 28L DIP

A625308AM-70SI 35 15 28L SOP

70

A625308AV-70SI 35 15 28L TSOP (Forward)

A625308A-70SU 35 15 28L DIP

Standby Current

Max. (µA)

Package

A625308AM-70SU 35 15 28L SOP

A625308AV-70SU

35 15 28L TSOP (Forward)

PRELIMINARY (July, 2002, Version 0.2) 10 AMIC Technology, Inc.

A625308A Series

Package Information

P-DIP 28L Outline Dimensions unit: inches/mm

D

28

E1

15

1

S

AL

A2

B

B1

14

A1

Base Plane

Seating Plane

e1

α

E

C

eA

Symbol

A - - 0.210 - - 5.33
A1 0.010 - - 0.25 - ­A2 0.150 0.155 0.160 3.81 3.94 4.06

B 0.016 0.018 0.022 0.41 0.46 0.56
B1 0.058 0.060 0.064 1.47 1.52 1.63

C 0.008 0.010 0.014 0.20 0.25 0.36

D - 1.460 1.470 - 37.08 37.34

E 0.590 0.600 0.610 14.99 15.24 15.49
E1 0.540 0.545 0.550 13.72 13.84 13.97

e1 0.090 0.100 0.110 2.29 2.54 2.79

L 0.120 0.130 0.140 3.05 3.30 3.56

α

eA 0.630 0.650 0.670 16.00 16.51 17.02

S - - 0.090 - - 2.29

Dimensions in inches Dimensions in mm

Min Nom Max Min Nom Max

0° - 15° 0° - 15°

Notes:

1. The maximum value of dimension D includes end flash.

2. Dimension E1 does not include resin fins.

3. Dimension S includes end flash.

PRELIMINARY (July, 2002, Version 0.2) 11 AMIC Technology, Inc.

A625308A Series

Package Information

SOP (W.B.) 28L Outline Dimensions unit: inches/mm

1528

E

H

θ

L

See Detail F

Detail F

c

L1

y

1

S

Seating Plane

B

D

e

y

D

14

A

A1 A2

Symbol

A
A1 0.004
A2 0.093 0.098 0.103 2.36 2.49 2.62

B 0.014 0.016 0.020 0.36 0.41 0.51

C 0.008 0.010 0.012 0.20 0.25 0.30

D

E 0.326 0.331 0.336 8.28 8.41 8.53

e 0.044 0.050 0.056 1.12 1.27 1.42

H 0.453 0.465 0.477 11.51 11.81 12.12

L 0.028 0.036 0.044 0.71 0.91 1.12

L1 0.059 0.067 0.075 1.50 1.70 1.91

S

y

θ

Dimensions in inches Dimensions in mm

Min Nom Max Min Nom Max

- -

0.713 0.728

-

- -

- -

0°

0.112

- -

0.047

0.004

-

8° 0°

- -

0.10

-

- -

- -

18.11 18.49

2.85

- -

1.19

0.10

-

8°

Notes:

1. The maximum value of dimension D includes end flash.

2. Dimension E does not include resin fins.

3. Dimension S includes end flash.

PRELIMINARY (July, 2002, Version 0.2) 12 AMIC Technology, Inc.

A625308A Series

Dimensions in inches

Dimensions in mm

Package Information

TSOP 28L TYPE I (8 X 13.4mm) Outline Dimensions unit: inches/mm

1

D

Detail "A"

1

E

14

D

y

D

28

15

e

Detail "A"

A2

c

A1

L

S

b

A

θ

Symbol

A - - 0.049 - - 1.25
A1 0.002 - - 0.05 - ­A2 0.037 0.039 0.041 0.95 1.00 1.05

b 0.007 0.009 0.011 0.17 0.22 0.27

c 0.005 - 0.008 0.12 - 0.21

E 0.311 0.315 0.319 7.90 8.00 8.10

L 0.012 0.020 0.028 0.30 0.50 0.70

D 0.520 0.528 0.536 13.20 13.40 13.60
D1 0.461 0.465 0.469 11.70 11.80 11.90

e 0.022 BSC 0.55 BSC

S 0.017 TYP 0.425 TYP

y - - 0.004 - - 0.10

θ 0°

Min Nom Max Min Nom Max

-

5° 0°

-

5°

PRELIMINARY (July, 2002, Version 0.2) 13 AMIC Technology, Inc.

Notes:

1. The maximum value of dimension D1 includes end flash.

2. Dimension E does not include resin fins.

3. Dimension S includes end flash.