Datasheet A623308A Datasheet (AMIC)

Page 1
A623308A Series
8K X 8 BIT CMOS SRAM
Document Title 8K X 8 BIT CMOS SRAM
Rev. No.
History Issue Date Remark
0.0 Initial issue November 9, 2004 Preliminary
1.0 Remove non-Pb-free package type July 3, 2006 Final Final version release
(July, 2006, Version 1.0) AMIC Technology, Corp.
Page 2
A623308A Series
Preliminary
8K X 8 BIT CMOS SRAM
Features
Power Supply Range: 4.5V to 5.5V Access times: 70 ns
A623308A-S series: Operating: 35mA (max.) Standby: 10µA (max.) A623308A-SI/SU series: Operating: 35mA (max.) Standby: 15µA (max.)
General Description
The A623308A is a low operating current 65,536-bit static random access memory organized as 8,192 words by 8 bits and operates on a voltage from 4.5V to 5.5V. Inputs and three-state outputs are TTL compatible and allow for direct interfacing with common system bus structures.
Pin Configurations
DIP / SOP  TSOP
Extended operating temperature range: 0°C to 70°C for -
S series, -25°C to 85°C for -SI series, -40°C to 85°C for
-SU series.
Full static operation, no clock or refreshing required All inputs and outputs are directly TTL-compatible Common I/O using three-state output Data retention voltage: 2.0V (min.) Available in 28-pin, DIP/SOP and TSOP Pb-Free package only All Pb-free (Lead-free) products are RoHS compliant
Minimum standby power is drawn by this device when
is at a high level, independent of the other input levels. Data retention is guaranteed at a power supply voltage as low as 2.0V.
CE
A12
I/O I/O1 I/O2
GND
NC
A7 A6
A5 A4 A3 A2 A1 A0
0
1 2
3 4 5
A623308A(M)
6 7
8 9
10 11 12 13 14 15
~
VCC
28
WE
27
NC
26
A8
25
A9
24
A11
23
OE
22
A10
21
CE
20
I/O7
19 18
I/O6 I/O5
17 16
I/O4
3
I/O
A11
VCC
A12
WE
1
OE
2 3
A9
4
A8
5
NC
6 7 8
NC
9 10
A7
11
A6
12
A5
13
A4 A3
14
~
A623308AV
~
~
A10
28
CE
27
I/O
26 25 24 23 22 21 20 19 18 17 16 15
I/O I/O5 I/O4 I/O3 VSS I/O I/O1 I/O0 A0 A1 A2
7 6
2
(July, 2006, Version 1.0) 1 AMIC Technology, Corp.
Page 3
A623308A Series
Block Diagram
A0
A10
A11
A12
I/O0
I/O7
CE OE
WE
CONTROL
CIRCUIT
Pin Descriptions – DIP / SOP
VCC GND
ROW
DECODER
INPUT DATA
CIRCUIT
128 X 512
MEMORY ARRAY
COLUMN I/O
Pin Description-TSOP
Pin No. Symbol Description
1, 26 NC No Connection
2-10, 21, 23-25 A0 - A12 Address Input
11-13, 15-19 I/O0 - I/O7 Data Input/Output
20
22 27
CE OE
WE
Chip Enable Output Enable Write Enable
28 VCC Power Supply 14 GND Ground
Pin No. Symbol Description
5, 8 NC No Connection 2-4, 9-17, 28 A0 - A12 Address Input 18-20, 22-26 I/O0 - I/O7 Data Input/Output
27
1 6
CE OE
WE
Chip Enable Output Enable Write Enable
7 VCC Power Supply
21 GND Ground
(July, 2006, Version 1.0) 2 AMIC Technology, Corp.
Page 4
A623308A Series
Recommended DC Operating Conditions
A = 0°C to +70°C, -25°C to +85°C or -40°C to +85°C)
(T
Symbol Parameter Min. Typ. Max. Unit
VCC Supply Voltage 4.5 5.0 5.5 V
GND Ground 0 0 0 V
VIH Input High Voltage 2.2 - VCC + 0.5 V
VIL Input Low Voltage -0.5 0 +0.8 V
Absolute Maximum Ratings*
VCC to GND . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V
IN, IN/OUT Volt to GND . . . . . . . . . -0.5V to VCC + 0.5V
Operating Temperature, Topr …………………………… ………………………….. 0
Storage Temperature, Tstg . . . . . . . . -55
Power Dissipation, P
Soldering Temp. & Time . . . . . . . . . . . . . 260
°C to +70°C or -40°C to +85°C
T . . . . . . . . . . . . . . . . . . . . . . 0.7W
°C to +125°C
°C, 10 sec
*Comments
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied and exposure to absolute maximum rating conditions for extended periods may affect device reliability.
DC Electrical Characteristics (TA = 0°C to +70°C, -25°C to +85°C or -40°C to +85°C, VCC = 5.0V ± 10%, GND = 0V)
Symbol Parameter
Min. Max. Min. Max.
ILI
ILO
Input Leakage Current - 1 - 1
Output Leakage Current - 1 - 1
ICC Active Power Supply
Current
ICC1
CC2
I
ISB
Dynamic Operating Current
Dynamic Operating Current
Supply Current Standby Power
ISB1
A623308A-70S A623308A-70SI/SU
Unit Conditions
µA
µA
- 5 - 5 mA
- 35 - 35 mA
-
5
-
5
mA
- 0.5 - 0.5 mA
- 10 - 15
µA
IN = GND to VCC
V
CE
V
IH
= V
I/O = GND to VCC
CE = VIL, II/O = 0mA
Min. Cycle, Duty = 100%
CE
CE V I
IL, II/O = 0mA
= V
IL, VIH = VCC
= V
IL = 0V, f = 1 MHz
I/O = 0 mA
CE = VIH
CE VCC - 0.2V
IN 0V
V
VOL Output Low Voltage - 0.4 - 0.4 V IOL = 2.1 mA
VOH Output High Voltage 2.4 - 2.4 - V IOH = -1.0 mA
(July, 2006, Version 1.0) 3 AMIC Technology, Corp.
Page 5
A623308A Series
Truth Table
Mode
Standby H X X High Z ISB, ISB1
Output Disable L H H High Z ICC, ICC1, ICC2
Read L L H DOUT ICC, ICC1, ICC2
Write L X L DIN ICC, ICC1, ICC2
Note: X: H or L
CE OE WE
I/O Operation Supply Current
Capacitance (TA = 25°C, f = 1.0 MHz)
Symbol Parameter Min. Max. Unit Conditions
CIN* Input Capacitance - 6 pF VIN = 0V
CI/O* Input/Output Capacitance - 8 pF VI/O = 0V
* These parameters are sampled and not 100% tested.
(July, 2006, Version 1.0) 4 AMIC Technology, Corp.
Page 6
A623308A Series
AC Characteristics (TA = 0°C to +70°C, -25°C to +85°C or -40°C to +85°C, VCC = 5.0V ± 10%)
Symbol Parameter
Min. Max.
Read Cycle
tRC Read Cycle Time 70 - ns
tAA Address Access Time - 70 ns
tACE Chip Enable Access Time - 70 ns
tOE Output Enable to Output Valid - 35 ns
tCLZ Chip Enable to Output in Low Z 10 - ns
tOLZ Output Enable to Output in Low Z 5 - ns
tCHZ Chip Disable to Output in High Z - 25 ns
tOHZ Output Disable to Output in High Z - 25 ns
tOH Output Hold from Address Change 10 - ns
Write Cycle
A623308A-70S/SI/SU
Unit
tWC Write Cycle Time 70 - ns
tCW Chip Enable to End of Write 60 - ns
tAS Address Set up Time 0 - ns
tAW Address Valid to End of Write 60 - ns
tWP Write Pulse Width 50 - ns
tWR Write Recovery Time 0 - ns
tWHZ Write to Output in High Z - 25 ns
tDW Data to Write Time Overlap 30 - ns
tDH Data Hold from Write Time 0 - ns
tOW Output Active from End of Write 5 - ns
Notes: tCHZ, tOHZ and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are not referred to output voltage levels.
(July, 2006, Version 1.0) 5 AMIC Technology, Corp.
Page 7
A623308A Series
Timing Waveforms
Read Cycle 1
Address
OE
CE
D
OUT
(1)
t
RC
t
AA
t
OE
5
t
OLZ
t
ACE
5
t
CLZ
t
OH
5
t
OHZ
5
t
CHZ
Read Cycle 2
Address
OUT
D
(1, 2, 4)
t
RC
t
AA
t
t
OH
OH
(July, 2006, Version 1.0) 6 AMIC Technology, Corp.
Page 8
A623308A Series
Timing Waveforms (continued)
Read Cycle 3
Notes: 1.
2. Device is continuously enabled,
3. Address valid prior to or coincident with
4.
5. Transition is measured
Write Cycle 1 (Write Enable Controlled)
(1, 3, 4)
CE
t
D
OUT
WE is high for Read Cycle.
OE = VIL.
±500mV from steady state. This parameter is sampled and not 100% tested.
(6)
CLZ
5
t
ACE
CE = VIL.
CE transition low.
5
t
CHZ
Address
WE
D
CE
D
OUT
t
WC
t
AW
5
t
CW
(4)
1
t
AS
IN
t
WHZ
2
t
WP
t
DW
7
3
t
WR
t
DH
7
t
OW
(July, 2006, Version 1.0) 7 AMIC Technology, Corp.
Page 9
A623308A Series
Timing Waveforms (continued)
Write Cycle 2 (Chip Enable Controlled)
Address
CE
WE
D
D
OUT
Notes: 1. t
2. A Write occurs during the overlap (t
3. t
4. If the remain in a high impedance state.
5. t
6.
7. Transition is measured ±500mV from steady. This parameter is sampled and not 100% tested.
(6)
t
WC
t
AW
5
t
CW
(4)
1
t
AS
2
t
WP
t
DW
IN
7
t
WHZ
AS is measured from the address valid to the beginning of Write.
WP) of a low CE and a low WE.
WR is measured form the earliest of CE or WE going high to the end of the Write cycle.
CE
low transition occurs simultaneously with the WE low transition or after the WE transition, outputs
CW is measured from the later of
CE
going low to the end of Write.
3
t
WR
t
DH
OE level is high or low.
(July, 2006, Version 1.0) 8 AMIC Technology, Corp.
Page 10
A623308A Series
AC Test Conditions
Input Pulse Levels 0V, 3V
Input Rise And Fall Time 5 ns
Input and Output Timing Reference Levels 1.5V
Output Load See Figure 1 and 2
TTL
C
L
30pF
* Including scope and jig.
C
TTL
L
5pF
* Including scope and jig.
Figure 1. Output Load Figure 2. Output Load for t t t
CLZ2, tOHZ, tOLZ, tCHZ1, CHZ2, tWHZ, and tOW
CLZ1,
Data Retention Characteristics
Symbol Parameter Min. Max. Unit Conditions
VDR VCC for Data Retention 2.0 5.5 V
CCDR
I
tCDR Chip Disable to Data Retention Time 0 - ns
tR Operation Recovery Time tRC - ns
Data Retention Current
(TA = 0°C to +70°C, -25°C to +85°C or -40°C to +85°C)
-
3
A
µ
CE VCC - 0.2V
VCC = 2.0V,
CE
VCC - 0.2V
VIN 0V
See Retention Waveform
(July, 2006, Version 1.0) 9 AMIC Technology, Corp.
Page 11
A623308A Series
Low VCC Data Retention Waveform
DATA RETENTION MODE
VCC
CE
4.5V
t
CDR
V
IH
V
DR
≥ 2.0V
4.5V
t
R
V
IH
CE ≥ VDR - 0.2V
Ordering Information
Part No. Access Time (ns)
A623308A-70SF 35 10 28L Pb-Free DIP
A623308AM-70SF 35 10 28L Pb-Free SOP
A623308AV-70SF 35 10 28L Pb-Free TSOP (Forward)
A623308A-70SIF 35 15 28L Pb-Free DIP
A623308AM-70SIF 35 15 28L Pb-Free SOP
A623308AV-70SIF 35 15 28L Pb-Free TSOP (Forward)
A623308A-70SUF 35 15 28L Pb-Free DIP
A623308AM-70SUF 35 15 28L Pb-Free SOP
Operating Current
Max. (mA)
Standby Current
Max. (
µA)
Package
70
A623308AV-70SUF
35 15 28L Pb-Free TSOP (Forward)
(July, 2006, Version 1.0) 10 AMIC Technology, Corp.
Page 12
A623308A Series
Package Information
P-DIP 28L Outline Dimensions unit: inches/mm
D
28
1
E
15
1
S
2
AL
A
B
B
1
14
1
A
Base Plane
Seating Plane
e
1
α
E
C
e
A
Dimensions in inches Dimensions in mm
Symbol
A - - 0.210 - - 5.33 A1 0.010 - - 0.25 - ­A2 0.150 0.155 0.160 3.81 3.94 4.06
B 0.016 0.018 0.022 0.41 0.46 0.56 B1 0.058 0.060 0.064 1.47 1.52 1.63
C 0.008 0.010 0.014 0.20 0.25 0.36
D - 1.460 1.470 - 37.08 37.34
E 0.590 0.600 0.610 14.99 15.24 15.49 E1 0.540 0.545 0.550 13.72 13.84 13.97
e1 0.090 0.100 0.110 2.29 2.54 2.79
L 0.120 0.130 0.140 3.05 3.30 3.56
α eA 0.630 0.650 0.670 16.00 16.51 17.02
S - - 0.090 - - 2.29
Min Nom Max Min Nom Max
0° - 15° 0° - 15°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E
1 does not include resin fins.
3. Dimension S includes end flash.
(July, 2006, Version 1.0) 11 AMIC Technology, Corp.
Page 13
A623308A Series
Package Information
SOP (W.B.) 28L Outline Dimensions unit: inches/mm
1528
E
H
θ
L
See Detail F
Detail F
c
L
1
y
1
S
Seating Plane
B
D
e
y
D
14
A
A1 A2
Symbol
A A1 0.004 A2 0.093 0.098 0.103 2.36 2.49 2.62
B 0.014 0.016 0.020 0.36 0.41 0.51
C 0.008 0.010 0.012 0.20 0.25 0.30
D
E 0.326 0.331 0.336 8.28 8.41 8.53
e 0.044 0.050 0.056 1.12 1.27 1.42
H 0.453 0.465 0.477 11.51 11.81 12.12
L 0.028 0.036 0.044 0.71 0.91 1.12 L1 0.059 0.067 0.075 1.50 1.70 1.91
S
y
θ
Dimensions in inches Dimensions in mm
Min Nom Max Min Nom Max
- -
- -
0.713 0.728
-
- -
- -
-
0.112
- -
0.10
-
0.047
0.004
- -
- -
8° 0°
18.11 18.49
2.85
- -
1.19
0.10
-
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
(July, 2006, Version 1.0) 12 AMIC Technology, Corp.
Page 14
A623308A Series
Package Information TSOP 28L TYPE I (8 X 13.4mm) Outline Dimensions
D
1
unit: inches/mm
Detail "A"
1
E
14
D
y
D
28
15
e
Detail "A"
2
A
c
A1
L
S
b
A
θ
Symbol
A - - 0.049 - - 1.25 A1 0.002 - - 0.05 - ­A2 0.037 0.039 0.041 0.95 1.00 1.05
b 0.007 0.009 0.011 0.17 0.22 0.27
c 0.005 - 0.008 0.12 - 0.21
E 0.311 0.315 0.319 7.90 8.00 8.10
L 0.012 0.020 0.028 0.30 0.50 0.70
D 0.520 0.528 0.536 13.20 13.40 13.60 D1 0.461 0.465 0.469 11.70 11.80 11.90
e 0.022 BSC 0.55 BSC
S 0.017 TYP 0.425 TYP
y - - 0.004 - - 0.10
θ 0°
Dimensions in inches Dimensions in mm
Min Nom Max Min Nom Max
-
5° 0°
-
5°
Notes:
1. The maximum value of dimension D
1 includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
(July, 2006, Version 1.0) 13 AMIC Technology, Corp.
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