Datasheet A29040V, A29040V-70, A29040V-55, A29040V-150, A29040V-120 Datasheet (AMICC)

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A29040 Series
512K X 8 Bit CMOS 5.0 Volt-only,
Preliminary Uniform Sector Flash Memory
Features
- 55/70/90/120/150 (max.) n Current:
- 20 mA typical active read current
- 30 mA typical program/erase current
- 1 µA typical CMOS standby n Flexible sector architecture
- 8 uniform sectors of 64 Kbyte each
- Any combination of sectors can be erased
- Supports full chip erase
- Sector protection:
A hardware method of protecting sectors to prevent any inadvertent program or erase operations within that sector
n Embedded Erase Algorithms
- Embedded Erase algorithm will automatically erase the entire chip or any combination of designated sectors and verify the erased sectors
General Description
The A29040 is a 5.0 volt-only Flash memory organized as 524,288 bytes of 8 bits each. The 512 Kbytes of data are further divided into eight sectors of 64 Kbytes each for flexible sector erase capability. The 8 bits of data appear on I/O0 - I/O7 while the addresses are input on A0 to A18. The A29040 is offered in 32-pin PLCC, TSOP, and PDIP packages. This device is designed to be programmed in­system with the standard system 5.0 volt VCC supply. Additional 12.0 volt VPP is not required for in-system write or erase operations. However, the A29040 can also be programmed in standard EPROM programmers. The A29040 has a second toggle bit, I/O2, to indicate whether the addressed sector is being selected for erase, and also offers the ability to program in the Erase Suspend mode. The standard A29040 offers access times of 55, 70, 90, 120, and 150 ns, allowing high-speed microprocessors to operate without wait states. To eliminate bus contention
the device has separate chip enable (CE), write enable (WE) and output enable (OE) controls.
The device requires only a single 5.0 volt power supply for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations.
- Embedded Program algorithm automatically writes and verifies bytes at specified addresses
n Typical 100,000 program/erase cycles per sector n 20-year data retention at 125°C
- Reliable operation for the life of the system
n Compatible with JEDEC-standards
- Pinout and software compatible with single-power­supply Flash memory standard
- Superior inadvertent write protection
n
n Erase Suspend/Erase Resume
n Package options
The A29040 is entirely software command set compatible with the JEDEC single-power-supply Flash standard. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine that controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from other Flash or EPROM devices. Device programming occurs by writing the proper program command sequence. This initiates the Embedded Program algorithm - an internal algorithm that automatically times the program pulse widths and verifies proper program margin. Device erasure occurs by executing the proper erase command sequence. This initiates the Embedded Erase algorithm - an internal algorithm that automatically preprograms the array (if it is not already programmed) before executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper erase margin.
Polling and toggle bits
Data
- Provides a software method of detecting completion of program or erase operations
- Suspends a sector erase operation to read data
from, or program data to, a non-erasing sector, then resumes the erase operation
- 32-pin P-DIP, PLCC, or TSOP(Forward type)
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A29040 Series
The host system can detect whether a program or erase operation is complete by reading the I/O7 (
Data
Polling)
and I/O6 (toggle) status bits. After a program or erase cycle has been completed, the device is ready to read array data or accept another command. The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. The A29040 is fully erased when shipped from the factory.
The hardware sector protection feature disables operations for both program and erase in any combination of the sectors of memory. This can be achieved via programming equipment. The Erase Suspend feature enables the user to put erase on hold for any period of time to read data from, or program data to, any other sector that is not selected for erasure. True background erase can thus be achieved. Power consumption is greatly reduced when the device is placed in the standby mode.
Pin Configurations
n DIP n PLCC
A18 A16 A15
A12
A7 A6 A5 A4 A3 A2 A1
A0 I/O0 I/O1 I/O2
1 2
3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
A29040
VCC
32
WE
31
A17
30
A14
29
A13
28
A8
27
A9
26
A11
25
OE
24
A10
23
CE
22
I/O7
21
I/O6
20
I/O5
19
I/O4
18
I/O3VSS
A7 A6 A5 A4 A3
A2 A1
A0
I/O0
A12
432
5 6 7 8 9 10 11 12 13
14151617181920
I/O1
n TSOP (Forward type)
1 2
A9
3
A8
4
A13
5
A14
6
A17
7
WE
8
VCC
9
A18
10
A16
11
A15
12
A12
13
A7
14
A6
15
A5
16
A4
A29040V
A16
A18
A15
1
A29040L
I/O2
I/O3
VSS
VCCWEA17
323130
I/O4
I/O5
I/O6
29 28 27 26 25 24 23 22 21
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 A3
A14 A13 A8 A9 A11 OE A10 CE I/O7
OEA11 A10 CE I/O I/O I/O I/O I/O VSS I/O I/O I/O A0 A1 A2
7 6 5 4 3
2 1 0
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A29040 Series
WE
Block Diagram
I/O0 - I/O7
VCC VSS
A0-A18
WE
CE OE
State
Control
Command
Register
VCC Detector
PGM Voltage
Generator
Timer
Erase Voltage
Generator
STB
Chip Enable
Output Enable
Logic
Y-Decoder
X-decoder
Address Latch
STB
Input/Output
Buffers
Data Latch
Y-Gating
Cell Matrix
Pin Descriptions
Pin No. Description
A0 - A18 Address Inputs
I/O0 - I/O7 Data Inputs/Outputs
CE
OE
Chip Enable Write Enable Output Enable
VSS Ground
VCC Power Supply
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A29040 Series
CE
WE
Absolute Maximum Ratings*
Ambient Operating Temperature . . . . . -55°C to + 125°C
Storage Temperature . . . . . . . . . . . . . . -65°C to + 125°C
VCC to Ground . . . . . . . . . . . . . . . . . . . . . . -2.0V to 7.0V
Output Voltage (Note 1) . . . . . . . . . . . . . . . -2.0V to 7.0V
A9 & OE (Note 2) . . . . . . . . . . . . . . . . . . . -2.0V to 12.5V
All other pins (Note 1) . . . . . . . . . . . . . . . . . -2.0V to 7.0V
Output Short Circuit Current (Note 3) . . . . . . . . . . 200mA
Notes:
1. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, inputs may undershoot VSS to -2.0V for periods of up to 20ns. Maximum DC voltage on output and I/O pins is VCC +0.5V. During voltage transitions, outputs may overshoot to VCC +2.0V for periods up to 20ns.
2. Minimum DC input voltage on A9 pins is -0.5V. During voltage transitions, A9 and OE may overshoot VSS to
-2.0V for periods of up to 20ns. Maximum DC input voltage on A9 and OE is +12.5V which may overshoot
to 13.5V for periods up to 20ns.
3. No more than one output is shorted at a time. Duration of the short circuit should not be greater than one second.
Device Bus Operations
This section describes the requirements and use of the device bus operations, which are initiated through the internal command register. The command register itself does not occupy any addressable memory location. The register is composed of latches that store the commands, along with the address and data information needed to
*Comments
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of these specification is not implied or intended. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.
Operating Ranges
Commercial (C) Devices
Ambient Temperature (TA) . . . . . . . . . . . . . 0°C to +70°C
VCC Supply Voltages
VCC for ± 10% devices . . . . . . . . . . . . . +4.5V to +5.5V
Operating ranges define those limits between which the functionally of the device is guaranteed.
execute the command. The contents of the register serve as inputs to the internal state machine. The state machine outputs dictate the function of the device. The appropriate device bus operations table lists the inputs and control levels required, and the resulting output. The following subsections describe each of these operations in further detail.
Table 1. A29040 Device Bus Operations
Operation
Read Write CMOS Standby TTL Standby Output Disable
Legend: L = Logic Low = VIL, H = Logic High = VIH, VID = 12.0 ± 0.5V, X = Don't Care, DIN = Data In, DOUT = Data Out, AIN = Address In Note: See the "Sector Protection/Unprotection" section, for more information.
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VCC ± 0.5 V
H
L L
L
OE
L
H X X H
H
X X
L
H
A0 – A18
AIN AIN
X X X
I/O0 - I/O7
DOUT
DIN High-Z High-Z High-Z
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A29040 Series
Requirements for Reading Array Data
To read array data from the outputs, the system must drive the CEand OE pins to VIL. CE is the power control and
selects the device. OE is the output control and gates array data to the output pins. WE should remain at VIH all
the time during read operation. The internal state machine is set for reading array data upon device power-up, or after a hardware reset. This ensures that no spurious alteration of the memory content occurs during the power transition. No command is necessary in this mode to obtain array data. Standard microprocessor read cycles that assert valid addresses on the device address inputs produce valid data on the device data outputs. The device remains enabled for read access until the command register contents are altered. See "Reading Array Data" for more information. Refer to the AC Read Operations table for timing specifications and to the Read Operations Timings diagram for the timing waveforms, lCC1 in the DC Characteristics table represents the active current specification for reading array data.
Writing Commands/Command Sequences
To write a command or command sequence (which includes programming data to the device and erasing
sectors of memory), the system must drive WE and CE to VIL, and OE to VIH. An erase operation can erase one
sector, multiple sectors, or the entire device. The Sector Address Tables indicate the address range that each sector occupies. A "sector address" consists of the address inputs required to uniquely select a sector. See the "Command Definitions" section for details on erasing a sector or the entire chip, or suspending/resuming the erase operation. After the system writes the autoselect command sequence, the device enters the autoselect mode. The system can then read autoselect codes from the internal register (which is separate from the memory array) on I/O7 - I/O0. Standard read cycle timings apply in this mode. Refer to the
Table 2. Sector Addresses Table
Sector A18
SA0 SA1 SA2 SA3 SA4 SA5 SA6 SA7
Note: All sectors are 64 Kbytes in size.
0 0 0 0 1 1 1 1
A17
0 0 1 1 0 0 1 1
"Autoselect Mode" and "Autoselect Command Sequence" sections for more information. ICC2 in the Characteristics table represents the active current specification for the write mode. The "AC Characteristics" section contains timing specification tables and timing diagrams for write operations.
Program and Erase Operation Status
During an erase or program operation, the system may check the status of the operation by reading the status bits on I/O7 - I/O0. Standard read cycle timings and ICC read specifications apply. Refer to "Write Operation Status" for more information, and to each AC Characteristics section for timing diagrams.
Standby Mode
When the system is not reading or writing to the device, it can place the device in the standby mode. In this mode, current consumption is greatly reduced, and the outputs are
placed in the high impedance state, independent of the OE input.
The device enters the CMOS standby mode when the CE pin is held at VCC ± 0.5V. (Note that this is a more restricted
voltage range than VIH.) The device enters the TTL standby mode when CE is held at VIH. The device requires the
standard access time (tCE) before it is ready to read data. If the device is deselected during erasure or programming, the device draws active current until the operation is completed. ICC3 in the DC Characteristics tables represents the standby current specification.
Output Disable Mode
When the OE input is at VIH, output from the device is disabled. The output pins are placed in the high impedance
state.
A16
0 00000h - 0FFFFh 1 10000h - 1FFFFh 0 20000h - 2FFFFh 1 30000h - 3FFFFh 0 1 0 1
Address Range
40000h - 4FFFFh 50000h - 5FFFFh 60000h - 6FFFFh 70000h - 7FFFFh
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A29040 Series
WE
WE
WE
Autoselect Mode
The autoselect mode provides manufacturer and device identification, and sector protection verification, through identifier codes output on I/O7 - I/O0. This mode is primarily intended for programming equipment to automatically match a device to be programmed with its corresponding programming algorithm. However, the autoselect codes can also be accessed in-system through the command register. When using programming equipment, the autoselect mode requires VID (11.5V to 12.5 V) on address pinA9. Address pins A6, A1, and AO must be as shown in Autoselect Codes (High Voltage Method) table. In addition, when
Table 3. A29040 Autoselect Codes (High Voltage Method)
Description A18 - A16
Manufacturer ID: AMIC X Device ID: A29040 X X
Sector Protection Verification
Sector
Address
A15 - A10 A9
X VID
X
A8 - A7
X
VID X
VID
X
verifying sector protection, the sector address must appear on the appropriate highest order address bits. Refer to the corresponding Sector Address Tables. The Command Definitions table shows the remaining address bits that are don't care. When all necessary bits have been set as required, the programming equipment may then read the corresponding identifier code on I/O7 - I/O0.To access the autoselect codes in-system, the host system can issue the autoselect command via the command register, as shown in the Command Definitions table. This method does not require VID. See "Command Definitions" for details on using the autoselect mode.
A5 - A2
A6
VIL VIL X VIL
VIL X VIH VIL
X VIL VIL
A1
AO
VIH
Identifier Code on
I/O7 - I/O0
37h 86h
0lh (protected)
00h (unprotected)
Continuation ID X X VID X VIL X VIH VIH 7Fh
Sector Protection/Unprotection
The hardware sector protection feature disables both program and erase operations in any sector. The hardware sector unprotection feature re-enables both program and erase operations in previously protected sectors. Sector protection/unprotection must be implemented using programming equipment. The procedure requires a high voltage (VID) on address pin A9 and the control pins. The device is shipped with all sectors unprotected. It is possible to determine whether a sector is protected or unprotected. See "Autoselect Mode" for details.
Hardware Data Protection
The requirement of command unlocking sequence for programming or erasing provides data protection against inadvertent writes (refer to the Command Definitions table). In addition, the following hardware data protection measures prevent accidental erasure or programming, which might otherwise be caused by spurious system level signals during VCC power-up transitions, or from system noise. The device is powered up to read array data to avoid accidentally writing data to the array.
Write Pulse "Glitch" Protection
Noise pulses of less than 5ns (typical) on OE,CE or WE do not initiate a write cycle.
Logical Inhibit
Write cycles are inhibited by holding any one of OE=VIL,
= VIH or WE = VIH. To initiate a write cycle, CE and
CE
must be a logical zero while OE is a logical one.
Power-Up Write Inhibit
If
= CE = VIL and OE = VIH during power up, the
device does not accept commands on the rising edge of
. The internal state machine is automatically reset to
reading array data on the initial power-up.
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A29040 Series
Command Definitions
Writing specific address and data commands or sequences into the command register initiates device operations. The Command Definitions table defines the valid register command sequences. Writing incorrect address and data values or writing them in the improper sequence resets the device to reading array data.
All addresses are latched on the falling edge of WE or CE, whichever happens later. All data is latched on the rising
edge of WE or CE, whichever happens first. Refer to the appropriate timing diagrams in the "AC Characteristics"
section.
Reading Array Data
The device is automatically set to reading array data after device power-up. No commands are required to retrieve data. The device is also ready to read array data after completing an Embedded Program or Embedded Erase algorithm. After the device accepts an Erase Suspend command, the device enters the Erase Suspend mode. The system can read array data using the standard read timings, except that if it reads at an address within erase-suspended sectors, the device outputs status data. After completing a programming operation in the Erase Suspend mode, the system may once again read array data with the same exception. See "Erase Suspend/Erase Resume Commands" for more information on this mode. The system must issue the reset command to re-enable the device for reading array data if I/O5 goes high, or while in the autoselect mode. See the "Reset Command" section, next. See also "Requirements for Reading Array Data" in the "Device Bus Operations" section for more information. The Read Operations table provides the read parameters, and Read Operation Timings diagram shows the timing diagram.
Reset Command
Writing the reset command to the device resets the device to reading array data. Address bits are don't care for this command. The reset command may be written between the sequence cycles in an erase command sequence before erasing begins. This resets the device to reading array data. Once erasure begins, however, the device ignores reset commands until the operation is complete. The reset command may be written between the sequence cycles in a program command sequence before programming begins. This resets the device to reading array data (also applies to programming in Erase Suspend mode). Once programming begins, however, the device ignores reset commands until the operation is complete. The reset command may be written between the sequence cycles in an autoselect command sequence. Once in the autoselect mode, the reset command must be written to return to reading array data (also applies to autoselect during Erase Suspend). If I/O5 goes high during a program or erase operation, writing the reset command returns the device to reading array data (also applies during Erase Suspend).
Autoselect Command Sequence
The autoselect command sequence allows the host system to access the manufacturer and devices codes, and determine whether or not a sector is protected. The Command Definitions table shows the address and data requirements. This method is an alternative to that shown in the Autoselect Codes (High Voltage Method) table, which is intended for PROM programmers and requires VID on address bit A9. The autoselect command sequence is initiated by writing two unlock cycles, followed by the autoselect command. The device then enters the autoselect mode, and the system may read at any address any number of times, without initiating another command sequence. A read cycle at address XX00h retrieves the manufacturer code and another read cycle at XX11h retrieves the continuation code. A read cycle at address XX01h returns the device code. A read cycle containing a sector address (SA) and the address 02h in returns 01h if that sector is protected, or 00h if it is unprotected. Refer to the Sector Address tables for valid sector addresses. The system must write the reset command to exit the autoselect mode and return to reading array data.
Byte Program Command Sequence
Programming is a four-bus-cycle operation. The program command sequence is initiated by writing two unlock write cycles, followed by the program set-up command. The program address and data are written next, which in turn initiate the Embedded Program algorithm. The system is not required to provide further controls or timings. The device automatically provides internally generated program pulses and verify the programmed cell margin. The Command Definitions table shows the address and data requirements for the byte program command sequence. When the Embedded Program algorithm is complete, the device then returns to reading array data and addresses are no longer latched. The system can determine the status of the program operation by using I/O7 or I/O6. See "Write Operation Status" for information on these status bits. Any commands written to the device during the Embedded Program Algorithm are ignored. Programming is allowed in any sequence and across sector boundaries. A bit cannot be programmed from a "0" back to a "1 ". Attempting to do so may halt the operation and set I/O5 to "1", or cause the
Polling algorithm to indicate the operation was
Data
successful. However, a succeeding read will show that the data is still "0". Only erase operations can convert a "0" to a "1".
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A29040 Series
WE
START
Write Program
Command Sequence
Embedded
Program
algorithm in
progress
Data Poll
from System
Verify Data ?
No
Yes
Increment Address
Last Address ?
Programming
Yes
Completed
Note : See the appropriate Command Definitions table for program command sequence.
Figure 1. Program Operation
Chip Erase Command Sequence
Chip erase is a six-bus-cycle operation. The chip erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the chip erase command, which in turn invokes the Embedded Erase algorithm. The device does not require the system to preprogram prior to erase. The Embedded Erase algorithm automatically preprograms and verifies the entire memory for an all zero data pattern prior to electrical erase. The system is not required to provide any controls or timings during these operations. The Command Definitions table shows the address and data requirements for the chip erase command sequence.
Any commands written to the chip during the Embedded Erase algorithm are ignored. The system can determine the status of the erase operation by using I/O7, I/O6, or I/O2. See "Write Operation Status" for information on these status bits. When the Embedded Erase algorithm is complete, the device returns to reading array data and addresses are no longer latched. Figure 2 illustrates the algorithm for the erase operation. See the Erase/Program Operations tables in "AC Characteristics" for parameters, and to the Chip/Sector Erase Operation Timings for timing waveforms.
Sector Erase Command Sequence
Sector erase is a six-bus-cycle operation. The sector erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the address of the sector to be erased, and the sector erase command. The Command Definitions table shows the address and data requirements for the sector erase command sequence. The device does not require the system to preprogram the memory prior to erase. The Embedded Erase algorithm automatically programs and verifies the sector for an all zero data pattern prior to electrical erase. The system is not required to provide any controls or timings during these operations. After the command sequence is written, a sector erase time­out of 50µs begins. During the time-out period, additional sector addresses and sector erase commands may be written. Loading the sector erase buffer may be done in any sequence, and the number of sectors may be from one sector to all sectors. The time between these additional cycles must be less than 50µs, otherwise the last address and command might not be accepted, and erasure may begin. It is recommended that processor interrupts be disabled during this time to ensure all commands are accepted. The interrupts can be re-enabled after the last Sector Erase command is written. If the time between additional sector erase commands can be assumed to be less than 50µs, the system need not monitor I/O3. Any command other than Sector Erase or Erase Suspend during the time-out period resets the device to reading array data. The system must rewrite the command sequence and any additional sector addresses and commands. The system can monitor I/O3 to determine if the sector erase timer has timed out. (See the " I/O3: Sector Erase Timer" section.) The time-out begins from the rising edge of the final
pulse in the command sequence. Once the sector erase operation has begun, only the Erase Suspend command is valid. All other commands are ignored. When the Embedded Erase algorithm is complete, the device returns to reading array data and addresses are no longer latched. The system can determine the status of the erase operation by using I/O7, I/O6, or I/O2. Refer to "Write Operation Status" for information on these status bits.
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A29040 Series
Figure 2 illustrates the algorithm for the erase operation. Refer to the Erase/Program Operations tables in the "AC Characteristics" section for parameters, and to the Sector Erase Operations Timing diagram for timing waveforms.
Erase Suspend/Erase Resume Commands
The Erase Suspend command allows the system to interrupt a sector erase operation and then read data from, or program data to, any sector not selected for erasure. This command is valid only during the sector erase operation, including the 50µs time-out period during the sector erase command sequence. The Erase Suspend command is ignored if written during the chip erase operation or Embedded Program algorithm. Writing the Erase Suspend command during the Sector Erase time-out immediately terminates the time-out period and suspends the erase operation. Addresses are "don't cares" when writing the Erase Suspend command. When the Erase Suspend command is written during a sector erase operation, the device requires a maximum of 20µs to suspend the erase operation. However, when the Erase Suspend command is written during the sector erase time-out, the device immediately terminates the time-out period and suspends the erase operation. After the erase operation has been suspended, the system can read array data from or program data to any sector not selected for erasure. (The device "erase suspends" all sectors selected for erasure.) Normal read and write timings and command definitions apply. Reading at any address within erase-suspended sectors produces status data on I/O7 - I/O0. The system can use I/O7, or I/O6 and I/O2 together, to determine if a sector is actively erasing or is erase-suspended. See "Write Operation Status" for information on these status bits. After an erase-suspended program operation is complete, the system can once again read array data within non­suspended sectors. The system can determine the status of the program operation using the I/O7 or I/O6 status bits, just as in the standard program operation. See "Write Operation Status" for more information. The system may also write the autoselect command sequence when the device is in the Erase Suspend mode. The device allows reading autoselect codes even at addresses within erasing sectors, since the codes are not stored in the memory array. When the device exits the autoselect mode, the device reverts to the Erase Suspend mode, and is ready for another valid operation. See "Autoselect Command Sequence" for more information. The system must write the Erase Resume command (address bits are "don't care") to exit the erase suspend mode and continue the sector erase operation. Further writes of the Resume command are ignored. Another Erase Suspend command can be written after the device has resumed erasing.
START
Write Erase
Command Sequence
Data Poll
from System
Embedded Erase algorithm in progress
No
Data = FFh ?
Yes
Erasure Completed
Note :
1. See the appropriate Command Definitions table for erase command sequences.
2. See "I/O3 : Sector Erase Timer" for more information.
Figure 2. Erase Operation
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A29040 Series
Sector Protect Verify
WE
Read (Note 5) Reset (Note 6)
Autoselect (Note 7)
Program
Table 4. A29040 Command Definitions
Command
Sequence
(Note 1)
Manufacturer ID Device ID 4
Continuation ID 4 555 AA 2AA 55 555 90 X03
(Note 8)
First
Cycles
Addr Data
1 RA RD 1 XXX
4
4
4
F0 555 AA 2AA 555 AA
555 AA
AA
555
Second
Addr
Data Addr
2AA
2AA
2AA
Bus Cycles (Notes 2 - 4)
Third
Data
Addr
55 55
55 555 90
55 555 A0 PA
555
90 X00
555 90 X01 86
Fourth
SA
X02
Fifth
Data
Addr Data Addr
37
7F 00
01
PD
Sixth
Data
Chip Erase 6 Sector Erase Erase Suspend (Note 9) Erase Resume (Note 10)
Legend: X = Don't care RA = Address of the memory location to be read. RD = Data read from location RA during read operation.
PA = Address of the memory location to be programmed. Addresses latch on the falling edge of the
whichever happens later.
PD = Data to be programmed at location PA. Data latches on the rising edge of WE or CE pulse, whichever happens first. SA = Address of the sector to be verified (in autoselect mode) or erased. Address bits A18 - A16 select a unique sector.
Note:
1. See Table 1 for description of bus operations.
2. All values are in hexadecimal.
3. Except when reading array or autoselect data, all bus cycles are write operation.
4. Address bits A18 - A11 are don't cares for unlock and command cycles, unless SA or PA required.
5. No unlock or command cycles required when reading array data.
6. The Reset command is required to return to reading array data when device is in the autoselect mode, or if I/O5 goes high (while the device is providing status data).
7. The fourth cycle of the autoselect command sequence is a read cycle.
8. The data is 00h for an unprotected sector and 01h for a protected sector. See "Autoselect Command Sequence" for more information.
9. The system may read and program in non-erasing sectors, or enter the autoselect mode, when in the Erase Suspend mode.
10. The Erase Resume command is valid only during the Erase Suspend mode.
555 AA 2AA
6 555 AA
1 XXX 1 XXX
B0 30
55
2AA
55 555 80
555 80
555 AA 2AA
555
AA
2AA
55 555 10
SA
55
or CE pulse,
30
11. The time between each command cycle has to be less than 50µs.
PRELIMINARY (August, 2001, Version 0.5) 10 AMIC Technology, Inc.
Page 11
A29040 Series
Write Operation Status
Several bits, I/O2, I/O3, I/O5, I/O6, and I/O7, are provided in the A29040 to determine the status of a write operation. Table 5 and the following subsections describe the functions of these status bits. I/O7, I/O6 and I/O2 each offer a method for determining whether a program or erase operation is complete or in progress. These three bits are discussed first.
I/O7:
Data
Polling
START
Read I/O7-I/O0
Address = VA
The
Polling bit, I/O7, indicates to the host system
Data
whether an Embedded Algorithm is in progress or completed, or whether the device is in Erase Suspend.
Polling is valid after the rising edge of the final WE
Data
pulse in the program or erase command sequence. During the Embedded Program algorithm, the device outputs on I/O7 the complement of the datum programmed to I/O7. This I/O7 status also applies to programming during Erase Suspend. When the Embedded Program algorithm is complete, the device outputs the datum programmed to I/O7. The system must provide the program address to read valid status information on I/O7. If a program address falls
within a protected sector,
Polling on I/O7 is active for
Data
approximately 2µs, then the device returns to reading array data.
During the Embedded Erase algorithm,
Data
Polling
produces a "0" on I/O7. When the Embedded Erase algorithm is complete, or if the device enters the Erase
Suspend mode,
Polling produces a "1" on I/O7.This is
Data
analogous to the complement/true datum output described for the Embedded Program algorithm: the erase function changes all the bits in a sector to "1"; prior to this, the device outputs the "complement," or "0." The system must provide an address within any of the sectors selected for erasure to read valid status information on I/O7. After an erase command sequence is written, if all sectors
selected for erasing are protected,
Polling on I/O7 is
Data
active for approximately 100µs, then the device returns to reading array data. If not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. When the system detects I/O7 has changed from the complement to true data, it can read valid data at I/O7 - I/O0 on the following read cycles. This is because I/O7 may change asynchronously with I/O0 - I/O6 while Output Enable
(OE) is asserted low. The
Polling Timings (During
Data
Embedded Algorithms) figure in the "AC Characteristics" section illustrates this. Table 5 shows the outputs for
Polling on I/O7. Figure 3 shows the
Polling algorithm.
Data
Data
Yes
I/O7 = Data ?
No
No
Note :
1. VA = Valid address for programming. During a sector erase operation, a valid address is an address within any sector selected for erasure. During chip erase, a valid address is any non-protected sector address.
2. I/O7 should be rechecked even if I/O5 = "1" because I/O7 may change simultaneously with I/O5.
I/O5 = 1?
Yes
Read I/O7 - I/O0
Address = VA
I/O7 = Data ?
No
FAIL
Yes
PASS
Figure 3. Data Polling Algorithm
PRELIMINARY (August, 2001, Version 0.5) 11 AMIC Technology, Inc.
Page 12
A29040 Series
WE
WE
I/O6: Toggle Bit I
Toggle Bit I on I/O6 indicates whether an Embedded Program or Erase algorithm is in progress or complete, or whether the device has entered the Erase Suspend mode. Toggle Bit I may be read at any address, and is valid after
the rising edge of the final sequence (prior to the program or erase operation), and during the sector erase time-out. During an Embedded Program or Erase algorithm operation, successive read cycles to any address cause
I/O6 to toggle. (The system may use either OE or CE to control the read cycles.) When the operation is complete,
I/O6 stops toggling. After an erase command sequence is written, if all sectors selected for erasing are protected, I/O6 toggles for approximately 100µs, then returns to reading array data. If not all selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. The system can use I/O6 and I/O2 together to determine whether a sector is actively erasing or is erase-suspended. When the device is actively erasing (that is, the Embedded Erase algorithm is in progress), I/O6 toggles. When the device enters the Erase Suspend mode, I/O6 stops toggling. However, the system must also use I/O2 to determine which sectors are erasing or erase-suspended. Alternatively, the
system can use I/O7 (see the subsection on " I/O7 : Polling").
If a program address falls within a protected sector, I/O6 toggles for approximately 2µs after the program command sequence is written, then returns to reading array data. I/O6 also toggles during the erase-suspend-program mode, and stops toggling once the Embedded Program algorithm is complete. The Write Operation Status table shows the outputs for Toggle Bit I on I/O6. Refer to Figure 4 for the toggle bit algorithm, and to the Toggle Bit Timings figure in the "AC Characteristics" section for the timing diagram. The I/O2 vs. I/O6 figure shows the differences between I/O2 and I/O6 in graphical form. See also the subsection on " I/O2: Toggle Bit II".
pulse in the command
Data
I/O2: Toggle Bit II
The "Toggle Bit II" on I/O2, when used with I/O6, indicates whether a particular sector is actively erasing (that is, the Embedded Erase algorithm is in progress), or whether that sector is erase-suspended. Toggle Bit II is valid after the
rising edge of the final
sequence. I/O2 toggles when the system reads at addresses within those sectors that have been selected for erasure. (The
system may use either cycles.) But I/O2 cannot distinguish whether the sector is
actively erasing or is erase-suspended. I/O6, by comparison, indicates whether the device is actively erasing, or is in Erase Suspend, but cannot distinguish which sectors are selected for erasure. Thus, both status bits are required for
pulse in the command
OE
or
to control the read
CE
sector and mode information. Refer to Table 5 to compare outputs for I/O2 and I/O6. Figure 4 shows the toggle bit algorithm in flowchart form, and the section " I/O2: Toggle Bit II" explains the algorithm. See also the " I/O6: Toggle Bit I" subsection. Refer to the Toggle Bit Timings figure for the toggle bit timing diagram. The I/O2 vs. I/O6 figure shows the differences between I/O2 and I/O6 in graphical form.
Reading Toggle Bits I/O6, I/O2
Refer to Figure 4 for the following discussion. Whenever the system initially begins reading toggle bit status, it must read I/O7 - I/O0 at least twice in a row to determine whether a toggle bit is toggling. Typically, a system would note and store the value of the toggle bit after the first read. After the second read, the system would compare the new value of the toggle bit with the first. If the toggle bit is not toggling, the device has completed the program or erase operation. The system can read array data on I/O7 - I/O0 on the following read cycle. However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the system also should note whether the value of I/O5 is high (see the section on I/O5). If it is, the system should then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling just as I/O5 went high. If the toggle bit is no longer toggling, the device has successfully completed the program or erase operation. If it is still toggling, the device did not complete the operation successfully, and the system must write the reset command to return to reading array data. The remaining scenario is that the system initially determines that the toggle bit is toggling and I/O5 has not gone high. The system may continue to monitor the toggle bit and I/O5 through successive read cycles, determining the status as described in the previous paragraph. Alternatively, it may choose to perform other system tasks. In this case, the system must start at the beginning of the algorithm when it returns to determine the status of the operation (top of Figure
4).
I/O5: Exceeded Timing Limits
I/O5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. Under these conditions I/O5 produces a "1." This is a failure condition that indicates the program or erase cycle was not successfully completed. The I/O5 failure condition may appear if the system tries to program a "1 "to a location that is previously programmed to "0." Only an erase operation can change a "0" back to a "1." Under this condition, the device halts the operation, and when the operation has exceeded the timing limits, I/O5 produces a "1." Under both these conditions, the system must issue the reset command to return the device to reading array data.
PRELIMINARY (August, 2001, Version 0.5) 12 AMIC Technology, Inc.
Page 13
A29040 Series
I/O3: Sector Erase Timer
After writing a sector erase command sequence, the system may read I/O3 to determine whether or not an erase operation has begun. (The sector erase timer does not apply to the chip erase command.) If additional sectors are selected for erasure, the entire time-out also applies after each additional sector erase command. When the time-out is complete, I/O3 switches from "0" to "1." The system may ignore I/O3 if the system can guarantee that the time between additional sector erase commands will always be less than 50µs. See also the "Sector Erase Command Sequence" section. After the sector erase command sequence is written, the
system should read the status on I/O7 (
Data
Polling) or
I/O6 (Toggle Bit 1) to ensure the device has accepted the command sequence, and then read I/O3. If I/O3 is "1", the internally controlled erase cycle has begun; all further commands (other than Erase Suspend) are ignored until the erase operation is complete. If I/O3 is "0", the device will accept additional sector erase commands. To ensure the command has been accepted, the system software should check the status of I/O3 prior to and following each subsequent sector erase command. If I/O3 is high on the second status check, the last command might not have been accepted. Table 5 shows the outputs for I/O3.
No
START
Read I/O7-I/O0
Read I/O7-I/O0
Toggle Bit
= Toggle ?
Yes
I/O5 = 1?
(Note 1)
No
Yes
Read I/O7 - I/O0
Twice
Toggle Bit
= Toggle ?
Yes
Program/Erase
Operation Not
Commplete, Write
Reset Command
Notes :
1. Read toggle bit twice to determine whether or not it is toggling. See text.
2. Recheck toggle bit because it may stop toggling as I/O5 changes to "1". See text.
(Notes 1,2)
No
Program/Erase
Operation
Commplete
Figure 4. Toggle Bit Algorithm
PRELIMINARY (August, 2001, Version 0.5) 13 AMIC Technology, Inc.
Page 14
A29040 Series
Table 5. Write Operation Status
Operation
I/O7 I/O6 I/O5 I/O3 I/O2
(Note 1) (Note 2) (Note 1)
Standard Mode
Erase Suspend Mode
Embedded Program Algorithm
7I/O
Toggle 0 N/A No toggle
Embedded Erase Algorithm 0 Toggle 0 1 Toggle Reading within Erase
Suspended Sector Reading within Non-Erase
Suspend Sector Erase-Suspend-Program
1 No toggle 0 N/A Toggle
Data Data Data Data Data
7I/O
Toggle 0 N/A N/A
Notes:
1. I/O7 and I/O2 require a valid address when reading status information. Refer to the appropriate subsection for further details.
2. I/O5 switches to “1” when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits. See “I/O5: Exceeded Timing Limits” for more information.
PRELIMINARY (August, 2001, Version 0.5) 14 AMIC Technology, Inc.
Page 15
A29040 Series
Maximum Negative Input Overshoot
20ns 20ns
+0.8V
-0.5V
-2.0V
20ns
Maximum Positive Input Overshoot
VCC+2.0V
VCC+0.5V
2.0V
20ns
20ns20ns
PRELIMINARY (August, 2001, Version 0.5) 15 AMIC Technology, Inc.
Page 16
A29040 Series
DC Characteristics
TTL/NMOS Compatible Parameter
Symbol
ILI Input Load Current ILIT A9 Input Load Current ILO Output Leakage Current
ICC1
ICC2 ICC3
VIL Input Low Level VIH Input High Level
VID
VOL Output Low Voltage VOH Output High Voltage
CMOS Compatible
Parameter
Symbol
ILI Input Load Current ILIT A9 Input Load Current ILO
ICC1
ICC2 ICC3
VIL Input Low Level VIH Input High Level
VID
VOL Output Low Voltage VOH1 VOH2
Notes for DC characteristics (both tables):
1. The ICC current listed includes both the DC operation current and the frequency dependent component (at 6 MHz). The frequency component typically is less than 2 mA/MHz, withOEat VIH.
2. Maximum ICC specifications are tested with VCC = VCC max.
3. ICC active while Embedded Algorithm (program or erase) is in progress.
4. Not 100% tested.
5. For CMOS mode only, ICC3 = 20µA max at extended temperatures (> +85°C)
Parameter Description
VCC Active Read Current (Notes 1, 2) VCC Active Write (Program/Erase) Current (Notes 2, 3, 4) VCC Standby Current (Note 2)
Voltage for Autoselect and Sector Protect
Parameter Description
Output Leakage Current VCC Active Read Current
(Notes 1,2) VCC Active Program/Erase Current
(Notes 2,3,4) VCC Standby Current (Notes 2, 5)
Voltage for Autoselect and Sector Protect
Output High Voltage
Test Description
VIN = VSS to VCC. VCC = VCC Max VCC = VCC Max, A9 = 12.5V VOUT = VSS to VCC. VCC = VCC Max
= VIL, OE = VIH
CE
= VIL, OE =VIH
CE
= VIH
CE
VCC = 5.25 V IOL = 12mA, VCC = VCC Min
IOH = -2.5 mA, VCC = VCC Min
Test Description
VIN = VSS to VCC, VCC = VCC Max VCC = VCC Max, A9 = 12.5V VOUT = VSS to VCC, VCC = VCC Max
= VIL, OE = VIH
CE
= VIL, OE = VIH
CE
= VCC ± 0.5 V
CE
VCC = 5.25 V 10.5 12.5 V IOL = 12.0 mA, VCC = VCC Min
IOH = -2.5 mA, VCC = VCC Min IOH = -100 µA. VCC = VCC Min
Min.
-0.5
2.0
10.5
2.4
Min.
-0.5
0.7 x VCC
0.85 x VCC VCC-0.4
Typ.
20 30 mA
30
0.4
Typ. Max. Unit
20
30
1
Max. Unit
±1.0 µA
100
±1.0
40 mA
1.0 mA
0.8
VCC+0.5 V
12.5
0.45
±1.0 µA
100
±1.0 µA
30
40 mA
0.8
VCC+0.3 V
0.45
µA µA
V
V V
V
µA
mA
5
µA
V
V V V
PRELIMINARY (August, 2001, Version 0.5) 16 AMIC Technology, Inc.
Page 17
A29040 Series
Output Hold Time from Addresses,
AC Characteristics
Read Only Operations
Parameter Symbols
JEDEC
Std
tAVAV tRC tAVQV tACC
tELQV tCE tGLQV tOE
tOEH
tEHQZ tDF
tGHQZ
tDF
tAXQX tOH
Notes:
1. Output driver disable time.
2. Not 100% tested.
Description Test Setup
Read Cycle Time (Note 2) Address to Output Delay
Chip Enable to Output Delay Output Enable to Output Delay
Read
Output Enable Hold
Time (Note 2)
Toggle and
Polling
Data
Chip Enable to Output High Z (Notes 1,2)
Output Enable to Output High Z (Notes 1,2)
or OE, Whichever Occurs First
CE
CE OE
OE
= VIL = VIL
= VIL
-55
Min.
55
Max.
Max. Max.
Max.
55
55 70 90 120 30 30 35
Min. Min.
0 0 0
10 10
18 20 20
Max. 18
Min.
0
Speed
-90
-70
-120
70 90 120 70 90 120
50
0 0
10 10
30
20 20 30
0 0
0 0
-150
150 150
150
55
10
35
35
Unit
ns ns
ns ns ns
ns
ns
ns
ns
Timing Waveforms for Read Only Operation
Addresses Addresses Stable
CE
OE
tOEH
WE
Output
High-Z
0V
tACC
tCE
tRC
tOE
Output Valid
tDF
tOH
High-Z
PRELIMINARY (August, 2001, Version 0.5) 17 AMIC Technology, Inc.
Page 18
A29040 Series
AC Characteristics
Erase and Program Operations
Parameter Symbols
JEDEC
tAVAV tAVWL tAS tWLAX tAH tDVWH tDS tWHDX tDH
tGHWL tGHWL
tELWL tCS tWHEH tWLWH tWP
tWHWL tWPH Write Pulse Width High
tWHWH1 tWHWH1
Std
tWC
tOES
tCH
Write Cycle Time (Note 1) Address Setup Time
Address Hold Time
Data Setup Time Data Hold Time Output Enable Setup Time Read Recover Time Before Write
(OE high to WE low)
Setup Time
CE
Hold Time
CE
Write Pulse Width
Byte Programming Operation (Note 2)
Description
Min. Min. Min. Min. Min. Min.
Min.
Min. Min. Min. Min.
Max.
Typ.
-55
-70
55
70 90
40
45
25
30
30 35
Speed
-90
0 45 50 45 50
0
0
0
0
0 45 50 20
50
7
-120
120
-150
150
50 50
50
Unit
ns ns ns ns ns ns
ns
ns ns ns ns
µs µs
tWHWH2 tWHWH2
Notes:
1. Not 100% tested.
2. See the "Erase and Programming Performance" section for more information.
tVCS
Sector Erase Operation (Note 2)
VCC Set Up Time (Note 1)
Typ.
Min.
1
50
sec
µs
PRELIMINARY (August, 2001, Version 0.5) 18 AMIC Technology, Inc.
Page 19
A29040 Series
Timing Waveforms for Program Operation
Addresses
CE
OE
WE
Data
tVCS
VCC
Note : PA = program addrss, PD = program data, Dout is the true data at the program address.
Program Command Sequence (last two cycles)
tWC
555h
tGHWL
tCS
tCH
tWP
tDS
A0h PD
tAS
PA
tAH
tWPH
tDH
Read Status Data (last two cycles)
~
~
PA
~
~
~
~
~
~
tWHWH1
~
~
~
~
~
~
Status
PA
DOUT
PRELIMINARY (August, 2001, Version 0.5) 19 AMIC Technology, Inc.
Page 20
A29040 Series
Timing Waveforms for Chip/Sector Erase Operation
Addresses
CE
OE
WE
Data
VCC
tVCS
Erase Command Sequence (last two cycles)
tWC
2AAh
tGHWL
tCH
tWP
tCS
tDS
55h 30h
tAS
SA
555h for chip erase
tWPH
tDH
10h for chip erase
tAH
~
~
~
~
~
~
~
~
~
~
~
~
~
~
tWHWH2
Read Status Data
VA
In
Progress
VA
Complete
Note : SA = Sector Address. VA = Valid Address for reading status data.
PRELIMINARY (August, 2001, Version 0.5) 20 AMIC Technology, Inc.
Page 21
A29040 Series
Timing Waveforms for
Addresses
CE
tCH
OE
tOEH
WE
I/O7
I/O0 - I/O6
Polling (During Embedded Algorithms)
Data
tRC
tACC
tCE
tOE
tDF
tOH
Complement
Status Data
~
~
VAVA VA
~
~
~
~
~
~
~
~
Complement True
~
~
Status Data True
~
~
Valid Data
High-Z
High-Z
Valid Data
Note : VA = Valid Address. Illustation shows first status cycle after command sequence, last status read cycle, and array data read cycle.
PRELIMINARY (August, 2001, Version 0.5) 21 AMIC Technology, Inc.
Page 22
A29040 Series
Timing Waveforms for Toggle Bit (During Embedded Algorithms)
Addresses
CE
OE
WE
I/O6 , I/O2
tCH
tOEH
tACC
tCE
tRC
VAVA VA
tOE
tDF
tOH
Valid Status
(first read) (second read) (stop togging)
Valid Status Valid Status Valid Status
~
~
VA
~
~
~
~
~
~
~
~
~
~
Note: VA = Valid Address; not required for I/O6. Illustration shows first two status cycle after command sequence, last status
read cycle, and array data read cycle.
PRELIMINARY (August, 2001, Version 0.5) 22 AMIC Technology, Inc.
Page 23
A29040 Series
WE
WE
Timing Waveforms for I/O2 vs. I/O6
Enter
Embedded
Erasing
WE
Erase
Erase
Suspend
~
~
~
~
Erase Suspend
Read
Enter Erase
Suspend Program
~
~
Erase Suspend Program
Resume
~
~
Erase Suspend
Read
Erase
Erase
~
~
Erase
Complete
I/O6
I/O2
Note : Both I/O6 and I/O2 toggle with OE or CE. See the text on I/O6 and I/O2 in the section "Write Operation Statue" for more information.
~
~
~
~
I/O2 and I/O6 toggle with OE and CE
~
~
~
~
~
~
~
~
~
~
~
~
~
~
~
~
AC Characteristics
Erase and Program Operations
Alternate CE Controlled Writes
Parameter Symbols Speed
JEDEC Std
tAVAV tWC Write Cycle Time (Note 1) Min. 55 70 90 120 150 ns
tAVEL tAS Address Setup Time Min. 0 ns
tELAX tAH Address Hold Time Min. 40 45 45 50 50 ns tDVEH tDS Data Setup Time Min. 25 30 45 50 50 ns tEHDX tDH Data Hold Time Min. 0 ns tGHEL tGHEL Read Recover Time Before Write Min. 0 ns tWLEL tWS
tEHWH tWH
tELEH tCP Write Pulse Width Min. 30 35 45 50 50 ns
tEHEL tCPH Write Pulse Width High Min. 20 20 20 20 20 ns
tWHWH1 tWHWH1
tWHWH2 tWHWH2
Setup Time Hold Time
Byte Programming Operation (Note 2)
Sector Erase Operation (Note 2)
Description
-55 -70 -90 -120 -150
Min. 0 ns Min. 0 ns
Typ. 7
Typ. 1 sec
Unit
µs
Notes:
3. Not 100% tested.
4. See the "Erase and Programming Performance" section for more information.
PRELIMINARY (August, 2001, Version 0.5) 23 AMIC Technology, Inc.
Page 24
A29040 Series
Timing Waveforms for Alternate CE Controlled Write Operation
PA for program
555 for program
2AA for erase
Addresses
WE
SA for sector erase 555 for chip erase
tAStWC
tWH
tAH
Data Polling
~
~
~
~
~
~
PA
tGHEL
OE
tCP
CE
tWS
Data
tRH
A0 for program 55 for erase
Note :
1. PA = Program Address, PD = Program Data, SA = Sector Address, I/O7 = Complement of Data Input, DOUT = Array Data.
2. Figure indicates the last two bus cycles of the command sequence.
tCPH
tDS
tDH
PD for program 30 for sector erase 10 for chip erase
tBUSY
~
~
tWHWH1 or 2
~
~
~
~
I/O7
DOUT
Erase and Programming Performance
Parameter Typ. (Note 1) Max. (Note 2) Unit Comments
Sector Erase Time 1 8 sec Chip Erase Time 8 64 sec Byte Programming Time 35 300 Chip Programming Time (Note 3) 3.6 10.8 sec
Notes:
1. Typical program and erase times assume the following conditions: 25°C, 5.0V VCC, 100,000 cycles. Additionally, programming typically assumes checkerboard pattern.
2. Under worst case conditions of 90°C, VCC = 4.5V (4.75V for -55), 100,000 cycles.
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes program faster than the maximum byte program time listed. If the maximum byte program time given is exceeded, only then does the device set I/O5 = 1. See the section on I/O5 for further information.
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the four-bus-cycle command sequence for programming. See Table 4 for further information on command definitions.
6. The device has a guaranteed minimum erase and program cycle endurance of 100,000 cycles.
µs
Excludes 00h programming prior to erasure (Note 4)
Excludes system-level overhead (Note 5)
PRELIMINARY (August, 2001, Version 0.5) 24 AMIC Technology, Inc.
Page 25
A29040 Series
Latch-up Characteristics
Description Min. Max.
Input Voltage with respect to VSS on all I/O pins
-1.0V VCC+1.0V
VCC Current
Includes all pins except VCC. Test conditions: VCC = 5.0V, one pin at time.
TSOP Pin Capacitance
Parameter Symbol Parameter Description
CIN Input Capacitance
COUT
CIN2 Control Pin Capacitance
Notes:
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0MHz
Output Capacitance
Test Setup
PLCC and P-DIP Pin Capacitance
Parameter Symbol Parameter Description
CIN Input Capacitance
COUT
CIN2
Output Capacitance Control Pin Capacitance
Test Setup
VIN=0
VOUT=0
VIN=0
VIN=0
VOUT=0
VPP=0
-100 mA
Typ.
6
8.5
7.5
Typ.
4
8 8
+100 mA
Max.
7.5 pF 12
9
Max. Unit
6
12
12
Unit
pF pF
pF pF pF
Notes:
3. Sampled, not 100% tested.
4. Test conditions TA = 25°C, f = 1.0MHz
Data Retention
Parameter
Minimum Pattern Data Retention Time
Test Conditions
150°C 125°C
Min
10 20 Years
Unit
Years
PRELIMINARY (August, 2001, Version 0.5) 25 AMIC Technology, Inc.
Page 26
A29040 Series
Test Conditions
Table 6. Test Specifications
Test Condition -55 All others Unit
Output Load 1 TTL gate Output Load Capacitance, CL(including jig capacitance) 30 100 pF Input Rise and Fall Times 5 20 ns Input Pulse Levels 0.0 - 3.0 0.45 - 2.4 V Input timing measurement reference levels 1.5 0.8, 2.0 V Output timing measurement reference levels 1.5 0.8, 2.0 V
5.0 V
2.7 K
Device
Under
Test
CL
6.2 K
Diodes = IN3064 or Equivalent
Figure 7. Test Setup
PRELIMINARY (August, 2001, Version 0.5) 26 AMIC Technology, Inc.
Page 27
A29040 Series
Ordering Information
Part No.
A29040-55 32Pin DIP A29040L-55 32Pin PLCC A29040V-55 A29040-70 32Pin DIP A29040L-70 32Pin PLCC A29040V-70 A29040-90 32Pin DIP A29040L-90 32Pin PLCC A29040V-90 A29040-120 32Pin DIP A29040L-120 32Pin PLCC A29040V-120 A29040-150 32Pin DIP
Access Time
(ns)
55 20 30 1
70 20 30 1
90 20 30 1
120 20 30 1
Active Read
Current
Typ. (mA)
Program/Erase
Current
Typ. (mA)
Standby Current
Typ. (µA)
Package
32Pin TSOP
32Pin TSOP
32Pin TSOP
32Pin TSOP
A29040L-150 32Pin PLCC A29040V-150
150 20 30 1
32Pin TSOP
PRELIMINARY (August, 2001, Version 0.5) 27 AMIC Technology, Inc.
Page 28
A29040 Series
Package Information
P-DIP 32L Outline Dimensions unit: inches/mm
D
32
E
17
1
AL
A2
B
B1
16
A1
Base Plane
Seating Plane
e
θ
E
1
C
E
A
Symbol
A - - 0.210 - - 5.334 A1 0.015 - - 0.381 - ­A2 0.149 0.154 0.159 3.785 3.912 4.039
B - 0.018 - - 0.457 ­B1 - 0.050 - - 1.270 -
C - 0.010 - - 0.254 -
D 1.645 1.650 1.655 41.783 41.91 42.037
E 0.537 0.542 0.547 13.64 13.767 13.894 E1 0.590 0.600 0.610 14.986 15.240 15.494 EA 0.630 0.650 0.670 16.002 16.510 17.018
e - 0.100 - - 2.540 ­L 0.120 0.130 0.140 3.048 3.302 3.556 θ 0°
Dimensions in inches Dimensions in mm
Min Nom Max Min Nom Max
-
15° 0°
-
15°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
PRELIMINARY (August, 2001, Version 0.5) 28 AMIC Technology, Inc.
Page 29
A29040 Series
Package Information
PLCC 32L Outline Dimension unit: inches/mm
13
HD
D
5
14
20
21
A
b
e
b
1
GD
A1 A2
y
D
4
1
E
HE
32
30
29
c
L
θ
GE
Symbol
A - - 0.134 - - 3.40 A1 0.0185 - - 0.47 - ­A2 0.105 0.110 0.115 2.67 2.80 2.93
b1 0.026 0.028 0.032 0.66 0.71 0.81
b 0.016 0.018 0.021 0.41 0.46 0.54 C 0.008 0.010 0.014 0.20 0.254 0.35 D 0.547 0.550 0.553 13.89 13.97 14.05 E 0.447 0.450 0.453 11.35 11.43 11.51
e 0.044 0.050 0.056 1.12 1.27 1.42
GD 0.490 0.510 0.530 12.45 12.95 13.46 GE HD HE 0.485 0.490 0.495 12.32 12.45 12.57
L 0.075 0.090 0.095 1.91 2.29 2.41
y
θ - 10° - 10°
Dimensions in inches Dimensions in mm
Min Nom Max Min Nom Max
0.390 0.410 0.430 9.91 10.41 10.92
0.585 0.590 0.595 14.86 14.99 15.11
- - 0.003 - - 0.075
Notes:
1. Dimensions D and E do not include resin fins.
2. Dimensions GD & GE are for PC Board surface mount pad pitch design reference only.
PRELIMINARY (August, 2001, Version 0.5) 29 AMIC Technology, Inc.
Page 30
A29040 Series
Dimensions in inches
Dimensions in mm
Package Information TSOP 32L TYPE I (8 X 20mm) Outline Dimensions unit: inches/mm
D
e
A2
E
HD
Detail "A"
y
D
c
A1
L
LE
Detail "A"
S
b
A
θ
Symbol
A - - 0.047 - - 1.20
A1 A2
b 0.007 0.009 0.011 0.18 0.22 0.27
c 0.004 - 0.008 0.11 - 0.20 D 0.720 0.724 0.728 18.30 18.40 18.50 E - 0.315 0.319 - 8.00 8.10
e 0.020 BSC 0.50 BSC
HD 0.779 0.787 0.795 19.80 20.00 20.20
L 0.016 0.020 0.024 0.40 0.50 0.60
LE - 0.032 - - 0.80 -
S - - 0.020 - - 0.50
y - - 0.003 - - 0.08
θ 0°
Min Nom Max Min Nom Max
0.002 - 0.006 0.05 - 0.15
0.037 0.039 0.041 0.95 1.00 1.05
-
5° 0°
-
5°
PRELIMINARY (August, 2001, Version 0.5) 30 AMIC Technology, Inc.
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
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