Datasheet A29001UV-70, A29001UV, A29001UL-90, A29001UL-70, A29001UL Datasheet (AMICC)

A29001/290011 Series

128K X 8 Bit CMOS 5.0 Volt-only,

Preliminary Boot Sector Flash Memory

Features

n 5.0V ± 10% for read and write operations
n Access times:

- 55/70/90 (max.)
n Current:

- 20 mA typical active read current

- 30 mA typical program/erase current

- 1 µA typical CMOS standby
n Flexible sector architecture

- 8 Kbyte/ 4 KbyteX2/ 16 Kbyte/ 32 KbyteX3 sectors

- Any combination of sectors can be erased

- Supports full chip erase

- Sector protection:

A hardware method of protecting sectors to prevent
any inadvertent program or erase operations within
that sector

n Top or bottom boot block configurations available
n Embedded Erase Algorithms

- Embedded Erase algorithm will automatically erase the
entire chip or any combination of designated sectors
and verify the erased sectors

- Embedded Program algorithm automatically writes and
verifies bytes at specified addresses

General Description

The A29001 is a 5.0 volt-only Flash memory organized as
131,072 bytes of 8 bits each. The A29001 offers the
function, but it is not available on A290011. The 128 Kbytes of
data are further divided into seven sectors for flexible sector
erase capability. The 8 bits of data appear on I/O0 - I/O7 while
the addresses are input on A0 to A16. The A29001 is offered in
32-pin PLCC, TSOP, and PDIP packages. This device is
designed to be programmed in-system with the standard
system 5.0 volt VCC supply. Additional 12.0 volt VPP is not
required for in-system write or erase operations. However, the
A29001 can also be programmed in standard EPROM
programmers.
The A29001 has the first toggle bit, I/O6, which indicates
whether an Embedded Program or Erase is in progress, or it is
in the Erase Suspend. Besides the I/O6 toggle bit, the A29001
has a second toggle bit, I/O2, to indicate whether the
addressed sector is being selected for erase. The A29001 also
offers the ability to program in the Erase Suspend mode. The
standard A29001 offers access times of 55, 70 and 90 ns
allowing high-speed microprocessors to operate without wait
states. To eliminate bus contention the device has separate
chip enable (CE), write enable (WE) and output enable (OE)
controls.

RESET

n Typical 100,000 program/erase cycles per sector
n 20-year data retention at 125°C

- Reliable operation for the life of the system
n Compatible with JEDEC-standards

- Pinout and software compatible with single-power­supply Flash memory standard

- Superior inadvertent write protection

n

n Erase Suspend/Erase Resume

n Hardware reset pin (

n Package options

The device requires only a single 5.0 volt power supply for both
read and write functions. Internally generated and regulated
voltages are provided for the program and erase operations.
The A29001 is entirely software command set compatible with
the JEDEC single-power-supply Flash standard. Commands
are written to the command register using standard
microprocessor write timings. Register contents serve as input
to an internal state-machine that controls the erase and
programming circuitry. Write cycles also internally latch
addresses and data needed for the programming and erase
operations. Reading data out of the device is similar to reading
from other Flash or EPROM devices.
Device programming occurs by writing the proper program
command sequence. This initiates the Embedded Program
algorithm - an internal algorithm that automatically times the
program pulse widths and verifies proper program margin.
Device erasure occurs by executing the proper erase
command sequence. This initiates the Embedded Erase
algorithm - an internal algorithm that automatically
preprograms the array (if it is not already programmed) before
executing the erase operation. During erase, the device
automatically times the erase pulse widths and verifies proper
erase margin.

Polling and toggle bits

Data

- Provides a software method of detecting completion of
program or erase operations

- Suspends a sector erase operation to read data from,

or program data to, a non-erasing sector, then
resumes the erase operation

RESET

- Hardware method to reset the device to reading array
data (not available on A290011)

- 32-pin P-DIP, PLCC, or TSOP (Forward type)

)

PRELIMINARY (August, 2001, Version 0.3) 1 AMIC Technology, Inc.

A29001/A290011 Series

The host system can detect whether a program or erase
operation is complete by reading the I/O7 (

Polling) and

Data

I/O6 (toggle) status bits. After a program or erase cycle has
been completed, the device is ready to read array data or
accept another command.
The sector erase architecture allows memory sectors to be
erased and reprogrammed without affecting the data contents
of other sectors. The A29001 is fully erased when shipped
from the factory.
The hardware sector protection feature disables operations for
both program and erase in any combination of the sectors

of memory. This can be achieved via programming
equipment.

The Erase Suspend feature enables the user to put erase on
hold for any period of time to read data from, or program data
to, any other sector that is not selected for erasure. True
background erase can thus be achieved.
Power consumption is greatly reduced when the device is
placed in the standby mode.

The hardware
progress and resets the internal state machine to reading

array data (This feature is not available on the A290021).

Pin Configurations

n DIP n PLCC

NC on A290011

RESET

A16
A15

A12

I/O0
I/O1
I/O2

A7
A6
A5
A4
A3
A2
A1
A0

1
2

3
4
5
6
7
8
9
10
11
12
13
14
15
16 17

A29001/A290011

VCC

32

WE

31

NC

30

A14

29

A13

28

A8

27

A9

26

A11

25

OE

24

A10

23

CE

22

I/O7

21

I/O6

20

I/O5

19

I/O4

18

I/O3VSS

n TSOP (Forward type)

1
2

A9

3

A8

4

A13

5

A14

6

NC

7

WE

8

NC on A290011

VCC

RESET

A16
A15
A12

A7
A6
A5
A4

9
10
11
12
13
14
15
16

A29001V/A290011V

I/O0

RESET

A12

A15

432

5

A7

6

A6

7

A5

8

A4
A3

A2
A1

A0

A29001L/

9

A290011L

10

11
12
13

14151617181920

I/O1

I/O2

pin terminates any operation in

NC on A290011

A16

RESET

VCCWENC

1

VSS

I/O3

323130

I/O4

I/O5

A14

29

A13

28

A8

27

A9

26

A11

25

OE

24

A10

23

CE

22

I/O7

21

I/O6

32

OEA11

31

A10

30

CE

29

I/O
I/O
I/O
I/O
I/O
VSS
I/O
I/O
I/O
A0
A1
A2

7
6
5
4
3

2
1
0

28
27
26
25
24
23
22
21
20
19
18
17 A3

PRELIMINARY (August, 2001, Version 0.3) 2 AMIC Technology, Inc.

Block Diagram

WE

A29001/A290011 Series

I/O0 - I/O7

VCC

VSS

WE

RESET

(N/A A290011)

CE
OE

A0-A16

State

Control

Command

Register

VCC Detector

PGM Voltage

Generator

Timer

Erase Voltage

Generator

STB

Chip Enable

Output Enable

Logic

Y-Decoder

X-decoder

Address Latch

STB

Input/Output

Buffers

Data Latch

Y-Gating

Cell Matrix

Pin Descriptions

Pin No. Description

A0 - A16 Address Inputs

I/O0 - I/O7 Data Inputs/Outputs

CE

OE

RESET

Chip Enable
Write Enable
Output Enable
Hardware Reset (N/A A290011)

VSS Ground

VCC Power Supply

PRELIMINARY (August, 2001, Version 0.3) 3 AMIC Technology, Inc.

A29001/A290011 Series

CE

WE

Absolute Maximum Ratings*

Ambient Operating Temperature . . . . . -55°C to + 125°C

Storage Temperature . . . . . . . . . . . . . . -65°C to + 125°C

Ground to VCC . . . . . . . . . . . . . . . . . . . . . . -2.0V to 7.0V

Output Voltage (Note 1) . . . . . . . . . . . . . . . -2.0V to 7.0V

A9, OE &

All other pins (Note 1) . . . . . . . . . . . . . . . . . -2.0V to 7.0V

Output Short Circuit Current (Note 3) . . . . . . . . . . 200mA

RESET

(Note 2) . . . . . . . . . . . -2.0V to 12.5V

Notes:

1. Minimum DC voltage on input or I/O pins is -0.5V.
During voltage transitions, inputs may undershoot VSS
to -2.0V for periods of up to 20ns. Maximum DC voltage
on output and I/O pins is VCC +0.5V. During voltage
transitions, outputs may overshoot to VCC +2.0V for
periods up to 20ns.

2. Minimum DC input voltage on A9 pins is -0.5V. During
voltage transitions, A9,OEand

VSS to -2.0V for periods of up to 20ns. Maximum DC
input voltage on A9 and
overshoot to 13.5V for periods up to 20ns. (

N/A on A290021)

3. No more than one output is shorted at a time. Duration
of the short circuit should not be greater than one
second.

RESET

is +12.5V which may

OE

may overshoot

RESET

is

Device Bus Operations

This section describes the requirements and use of the
device bus operations, which are initiated through the
internal command register. The command register itself
does not occupy any addressable memory location. The
register is composed of latches that store the commands,
along with the address and data information needed to

Table 1. A29001/A290011 Device Bus Operations

*Comments

Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of
this device at these or any other conditions above
those indicated in the operational sections of these
specification is not implied or intended. Exposure to
the absolute maximum rating conditions for extended
periods may affect device reliability.

Operating Ranges

Commercial (C) Devices

Ambient Temperature (TA) . . . . . . . . . . . . . . 0°C to +70°C

VCC Supply Voltages

VCC for ± 10% devices . . . . . . . . . . . . . . +4.5V to +5.5V

Operating ranges define those limits between which the
functionally of the device is guaranteed.

execute the command. The contents of the register serve
as inputs to the internal state machine. The state machine
outputs dictate the function of the device. The appropriate
device bus operations table lists the inputs and control
levels required, and the resulting output. The following
subsections describe each of these operations in further
detail.

Operation

Read L L H H AIN DOUT
Write L H L H AIN DIN
CMOS Standby
TTL Standby H X X
Output Disable L H H H X High-Z
Reset X X X L X High-Z
Temporary Sector Unprotect (Note) X X X VID X X

Legend:
L = Logic Low = VIL, H = Logic High = VIH, VID = 12.0 ± 0.5V, X = Don't Care, DIN = Data In, DOUT = Data Out, AIN = Address In
Note: 1. See the "Sector Protection/Unprotection" section and Temporary Sector Unprotect for more information.

2. This function is not available on A290011.

PRELIMINARY (August, 2001, Version 0.3) 4 AMIC Technology, Inc.

VCC ± 0.5 V

OE

X X

RESET

(N/A A290011)

VCC ± 0.5 V
VCC ± 0.5 V

A0 – A16 I/O0 - I/O7

X High-Z
X High-Z

A29001/A290011 Series

Requirements for Reading Array Data

To read array data from the outputs, the system must drive
the CEand OE pins to VIL. CE is the power control and

selects the device. OE is the output control and gates
array data to the output pins. WE should remain at VIH all

the time during read operation. The internal state machine
is set for reading array data upon device power-up, or after
a hardware reset. This ensures that no spurious alteration
of the memory content occurs during the power transition.
No command is necessary in this mode to obtain array
data. Standard microprocessor read cycles that assert valid
addresses on the device address inputs produce valid data
on the device data outputs. The device remains enabled for
read access until the command register contents are
altered.
See "Reading Array Data" for more information. Refer to the
AC Read Operations table for timing specifications and to
the Read Operations Timings diagram for the timing
waveforms, lCC1 in the DC Characteristics table represents
the active current specification for reading array data.

Writing Commands/Command Sequences

To write a command or command sequence (which
includes programming data to the device and erasing

sectors of memory), the system must drive WE and CE to
VIL, and OE to VIH. An erase operation can erase one

sector, multiple sectors, or the entire device. The Sector
Address Tables indicate the address range that each sector
occupies. A "sector address" consists of the address inputs
required to uniquely select a sector. See the "Command
Definitions" section for details on erasing a sector or the
entire chip, or suspending/resuming the erase operation.
After the system writes the autoselect command sequence,
the device enters the autoselect mode. The system can
then read autoselect codes from the internal register (which
is separate from the memory array) on I/O7 - I/O0. Standard
read cycle timings apply in this mode. Refer to the
"Autoselect Mode" and "Autoselect Command Sequence"
sections for more information.
ICC2 in the Characteristics table represents the active
current specification for the write mode. The "AC
Characteristics" section contains timing specification tables
and timing diagrams for write operations.

Standby Mode

When the system is not reading or writing to the device, it
can place the device in the standby mode. In this mode,
current consumption is greatly reduced, and the outputs are

placed in the high impedance state, independent of the OE
input.

The device enters the CMOS standby mode when the CE
&

RESET

± 0.5V. (Note that this is a more restricted voltage range
than VIH.) The device enters the TTL standby mode when

CE

A290011) is held at VCC±0.5V. The device requires the
standard access time (tCE) before it is ready to read data.
If the device is deselected during erasure or programming,
the device draws active current until the operation is
completed.
ICC3 in the DC Characteristics tables represents the standby
current specification.

pins (CE only on A290011) are both held at VCC

is held at VIH, while

RESET

(Not available on

Output Disable Mode

When the OE input is at VIH, output from the device is
disabled. The output pins are placed in the high impedance

state.

RESET

The
the device to reading array data. When the system drives
the
immediately terminates any operation in progress, tristates

all data output pins, and ignores all read/write attempts for
the duration of the
the internal state machine to reading array data. The

operation that was interrupted should be reinitiated once
the device is ready to accept another command sequence,
to ensure data integrity.

The
system reset would thus also reset the Flash memory,

enabling the system to read the boot-up firmware from the
Flash memory.

Refer to the AC Characteristics tables for
parameters and diagram.

: Hardware Reset Pin (N/A on A290011)

RESET

RESET

RESET

pin provides a hardware method of resetting

pin low for at least a period of tRP, the device

RESET

pin may be tied to the system reset circuitry. A

pulse. The device also resets

RESET

Program and Erase Operation Status

During an erase or program operation, the system may
check the status of the operation by reading the status bits
on I/O7 - I/O0. Standard read cycle timings and ICC read
specifications apply. Refer to "Write Operation Status" for
more information, and to each AC Characteristics section
for timing diagrams.

PRELIMINARY (August, 2001, Version 0.3) 5 AMIC Technology, Inc.

A29001/A290011 Series

Table 2. A29001/A290011 Top Boot Block Sector Address Table

Sector A16 A15 A14 A13 A12 Sector Size

(Kbytes)

SA0 0 0 X X X 32 00000h - 07FFFh
SA1 0 1 X X X 32 08000h - 0FFFFh
SA2 1 0 X X X 32 10000h - 17FFFh
SA3 1 1 0 X X 16 18000h - 1BFFFh
SA4 1 1 1 0 0 4 1C000h - 1CFFFh
SA5 1 1 1 0 1 4 1D000h - 1DFFFh
SA6 1 1 1 1 X 8 1E000h - 1FFFFh

Address Range

Table 3. A29001/A290011 Bottom Boot Block Sector Address Table

Sector A16 A15 A14 A13 A12 Sector Size

(Kbytes)

SA0 0 0 0 0 X 8 00000h - 01FFFh
SA1 0 0 0 1 0 4 02000h - 02FFFh
SA2 0 0 0 1 1 4 03000h - 03FFFh
SA3 0 0 1 X X 16 04000h - 07FFFh
SA4 0 1 X X X 32 08000h - 0FFFFh
SA5 1 0 X X X 32 10000h - 17FFFh
SA6 1 1 X X X 32 18000h - 1FFFFh

Autoselect Mode

The autoselect mode provides manufacturer and device
identification, and sector protection verification, through
identifier codes output on I/O7 - I/O0. This mode is primarily
intended for programming equipment to automatically
match a device to be programmed with its corresponding
programming algorithm. However, the autoselect codes
can also be accessed in-system through the command
register.
When using programming equipment, the autoselect mode
requires VID (11.5V to 12.5 V) on address pinA9. Address
pins A6, A1, and AO must be as shown in Autoselect

Codes (High Voltage Method) table. In addition, when
verifying sector protection, the sector address must appear
on the appropriate highest order address bits. Refer to the
corresponding Sector Address Tables. The Command
Definitions table shows the remaining address bits that are
don't care. When all necessary bits have been set as
required, the programming equipment may then read the
corresponding identifier code on I/O7 - I/O0.To access the
autoselect codes in-system, the host system can issue the
autoselect command via the command register, as shown
in the Command Definitions table. This method does not
require VID. See "Command Definitions" for details on
using the autoselect mode.

Address Range

Table 4. A29001/A290011 Autoselect Codes (High Voltage Method)

Description A16 - A12

Manufacturer ID: AMIC X
Device ID: A29001/

A290011

Sector Protection
Verification

Continuation ID X X VID X VIL X VIH VIH 7Fh

Note:

PRELIMINARY (August, 2001, Version 0.3) 6 AMIC Technology, Inc.

=VIL, OE=VIL and WE=VIH when Autoselect Mode

CE

X X

Sector

Address

A11 - A10 A9

X VID

VID X

X

VID

A8 - A7

X

X

A5 - A2

A6

VIL
VIL X VIL

VIL X VIH VIL

X VIL VIL

A1

A0

VIH

Identifier Code on

I/O7 - I/O0

37h

Top Boot Block: A1h
Bottom Boot Block: 4Ch

0lh (protected)

00h (unprotected)

Sector Protection/Unprotection

WE

WE

WE

WE

The hardware sector protection feature disables both
program and erase operations in any sector. The hardware
sector unprotection feature re-enables both program and
erase operations in previously protected sectors.
Sector protection/unprotection must be implemented using
programming equipment. The procedure requires a high
voltage (VID) on address pin A9 and the control pins.
The device is shipped with all sectors unprotected.
It is possible to determine whether a sector is protected or
unprotected. See "Autoselect Mode" for details.

A29001/A290011 Series

START

RESET = VID

(Note 1)

Hardware Data Protection

The requirement of command unlocking sequence for
programming or erasing provides data protection against
inadvertent writes (refer to the Command Definitions table).
In addition, the following hardware data protection measures
prevent accidental erasure or programming, which might
otherwise be caused by spurious system level signals during
VCC power-up transitions, or from system noise. The device is
powered up to read array data to avoid accidentally writing
data to the array.

Write Pulse "Glitch" Protection

Noise pulses of less than 5ns (typical) on OE, CE or WE
do not initiate a write cycle.

Logical Inhibit

Write cycles are inhibited by holding any one of OE=VIL,

= VIH or

CE

must be a logical zero while OE is a logical one.

= VIH. To initiate a write cycle, CE and

Power-Up Write Inhibit

If

= CE = VIL and OE = VIH during power up, the

device does not accept commands on the rising edge of

. The internal state machine is automatically reset to

reading array data on the initial power-up.

Perform Erase or

Program Operations

RESET = VIH

Temporary Sector

Unprotect

Completed (Note 2)

Notes:

1. All protected sectors unprotected.

2. All previously protected sectors are protected once again.

Figure 1. Temporary Sector Unprotect Operation

Temporary Sector Unprotect (N/A A290011)

This feature allows temporary unprotection of previous
protected sectors to change data in-system. The Sector

Unprotect mode is activated by setting the
During this mode, formerly protected sectors can be

programmed or erased by selecting the sector addresses.
Once VID is removed from the
protected sectors are protected again. Figure 1 shows the

algorithm, and the Temporary Sector Unprotect diagram
shows the timing waveforms, for this feature.

PRELIMINARY (August, 2001, Version 0.3) 7 AMIC Technology, Inc.

RESET

RESET

pin, all the previously

pin to VID.

A29001/A290011 Series

WE

Command Definitions

Writing specific address and data commands or sequences
into the command register initiates device operations. The
Command Definitions table defines the valid register
command sequences. Writing incorrect address and data
values or writing them in the improper sequence resets the
device to reading array data.

All addresses are latched on the falling edge of WE or CE,
whichever happens later. All data is latched on the rising

edge of
appropriate timing diagrams in the "AC Characteristics"

section.

or CE, whichever happens first. Refer to the

Reading Array Data

The device is automatically set to reading array data after
device power-up. No commands are required to retrieve
data. The device is also ready to read array data after
completing an Embedded Program or Embedded Erase
algorithm. After the device accepts an Erase Suspend
command, the device enters the Erase Suspend mode. The
system can read array data using the standard read timings,
except that if it reads at an address within erase-suspended
sectors, the device outputs status data. After completing a
programming operation in the Erase Suspend mode, the
system may once again read array data with the same
exception. See "Erase Suspend/Erase Resume Commands"
for more information on this mode.
The system must issue the reset command to re-enable the
device for reading array data if I/O5 goes high, or while in the
autoselect mode. See the "Reset Command" section, next.
See also "Requirements for Reading Array Data" in the
"Device Bus Operations" section for more information. The
Read Operations table provides the read parameters, and
Read Operation Timings diagram shows the timing diagram.

Reset Command

Writing the reset command to the device resets the device to
reading array data. Address bits are don't care for this
command. The reset command may be written between the
sequence cycles in an erase command sequence before
erasing begins. This resets the device to reading array data.
Once erasure begins, however, the device ignores reset
commands until the operation is complete.
The reset command may be written between the sequence
cycles in a program command sequence before
programming begins. This resets the device to reading array
data (also applies to programming in Erase Suspend mode).
Once programming begins, however, the device ignores
reset commands until the operation is complete.
The reset command may be written between the sequence
cycles in an autoselect command sequence. Once in the
autoselect mode, the reset command must be written to
return to reading array data (also applies to autoselect during
Erase Suspend).
If I/O5 goes high during a program or erase operation, writing
the reset command returns the device to reading array data
(also applies during Erase Suspend).

Autoselect Command Sequence

The autoselect command sequence allows the host system
to access the manufacturer and devices codes, and
determine whether or not a sector is protected. The
Command Definitions table shows the address and data
requirements. This method is an alternative to that shown in
the Autoselect Codes (High Voltage Method) table, which is
intended for PROM programmers and requires VID on
address bit A9.
The autoselect command sequence is initiated by writing two
unlock cycles, followed by the autoselect command. The
device then enters the autoselect mode, and the system may
read at any address any number of times, without initiating
another command sequence.
A read cycle at address XX00h retrieves the manufacturer
code and another read cycle at XX11h retrieves the
continuation code. A read cycle at address XX01h returns the
device code. A read cycle containing a sector address (SA)
and the address 02h in returns 01h if that sector is protected,
or 00h if it is unprotected. Refer to the Sector Address tables
for valid sector addresses.
The system must write the reset command to exit the
autoselect mode and return to reading array data.

Byte Program Command Sequence

Programming is a four-bus-cycle operation. The program
command sequence is initiated by writing two unlock write
cycles, followed by the program set-up command. The
program address and data are written next, which in turn
initiate the Embedded Program algorithm. The system is not
required to provide further controls or timings. The device
automatically provides internally generated program pulses
and verify the programmed cell margin. The Command
Definitions table shows the address and data requirements
for the byte program command sequence.
When the Embedded Program algorithm is complete, the
device then returns to reading array data and addresses are
no longer latched. The system can determine the status of
the program operation by using I/O7 or I/O6. See "Write
Operation Status" for information on these status bits.
Any commands written to the device during the Embedded
Program Algorithm are ignored. Programming is allowed in
any sequence and across sector boundaries. A bit cannot be
programmed from a "0" back to a "1 ". Attempting to do so

may halt the operation and set I/O5 to "1", or cause the
Polling algorithm to indicate the operation was successful.

However, a succeeding read will show that the data is still
"0". Only erase operations can convert a "0" to a "1".

Data

PRELIMINARY (August, 2001, Version 0.3) 8 AMIC Technology, Inc.

A29001/A290011 Series

WE

START

Write Program

Command
Sequence

Embedded

Program

algorithm in

progress

Data Poll

from System

Verify Data ?

No

Yes

Increment Address

Last Address ?

Programming

Yes

Completed

Note : See the appropriate Command Definitions table for
program command sequence.

Figure 2. Program Operation

Chip Erase Command Sequence

Chip erase is a six-bus-cycle operation. The chip erase
command sequence is initiated by writing two unlock cycles,
followed by a set-up command. Two additional unlock write
cycles are then followed by the chip erase command, which
in turn invokes the Embedded Erase algorithm. The device
does not require the system to preprogram prior to erase.
The Embedded Erase algorithm automatically preprograms
and verifies the entire memory for an all zero data pattern
prior to electrical erase. The system is not required to provide
any controls or timings during these operations. The
Command Definitions table shows the address and data
requirements for the chip erase command sequence.

Any commands written to the chip during the Embedded
Erase algorithm are ignored. The system can determine the
status of the erase operation by using I/O7, I/O6, or I/O2. See
"Write Operation Status" for information on these status bits.
When the Embedded Erase algorithm is complete, the device
returns to reading array data and addresses are no longer
latched.
Figure 3 illustrates the algorithm for the erase operation. See
the Erase/Program Operations tables in "AC Characteristics"
for parameters, and to the Chip/Sector Erase Operation
Timings for timing waveforms.

Sector Erase Command Sequence

Sector erase is a six-bus-cycle operation. The sector erase
command sequence is initiated by writing two unlock cycles,
followed by a set-up command. Two additional unlock write
cycles are then followed by the address of the sector to be
erased, and the sector erase command. The Command
Definitions table shows the address and data requirements
for the sector erase command sequence.
The device does not require the system to preprogram the
memory prior to erase. The Embedded Erase algorithm
automatically programs and verifies the sector for an all zero
data pattern prior to electrical erase. The system is not
required to provide any controls or timings during these
operations.
After the command sequence is written, a sector erase time­out of 50µs begins. During the time-out period, additional
sector addresses and sector erase commands may be
written. Loading the sector erase buffer may be done in any
sequence, and the number of sectors may be from one
sector to all sectors. The time between these additional
cycles must be less than 50µs, otherwise the last address
and command might not be accepted, and erasure may
begin. It is recommended that processor interrupts be
disabled during this time to ensure all commands are
accepted. The interrupts can be re-enabled after the last
Sector Erase command is written. If the time between
additional sector erase commands can be assumed to be
less than 50µs, the system need not monitor I/O3. Any
command other than Sector Erase or Erase Suspend during
the time-out period resets the device to reading array data.
The system must rewrite the command sequence and any
additional sector addresses and commands.
The system can monitor I/O3 to determine if the sector erase
timer has timed out. (See the " I/O3: Sector Erase Timer"
section.) The time-out begins from the rising edge of the final

pulse in the command sequence.
Once the sector erase operation has begun, only the Erase
Suspend command is valid. All other commands are ignored.
When the Embedded Erase algorithm is complete, the device
returns to reading array data and addresses are no longer
latched. The system can determine the status of the erase
operation by using I/O7, I/O6, or I/O2. Refer to "Write
Operation Status" for information on these status bits.

PRELIMINARY (August, 2001, Version 0.3) 9 AMIC Technology, Inc.

A29001/A290011 Series

Figure 3 illustrates the algorithm for the erase operation.
Refer to the Erase/Program Operations tables in the "AC
Characteristics" section for parameters, and to the Sector
Erase Operations Timing diagram for timing waveforms.

Erase Suspend/Erase Resume Commands

The Erase Suspend command allows the system to interrupt
a sector erase operation and then read data from, or program
data to, any sector not selected for erasure. This command is
valid only during the sector erase operation, including the
50µs time-out period during the sector erase command
sequence. The Erase Suspend command is ignored if written
during the chip erase operation or Embedded Program
algorithm. Writing the Erase Suspend command during the
Sector Erase time-out immediately terminates the time-out
period and suspends the erase operation. Addresses are
"don't cares" when writing the Erase Suspend command.
When the Erase Suspend command is written during a
sector erase operation, the device requires a maximum of
20µs to suspend the erase operation. However, when the
Erase Suspend command is written during the sector erase
time-out, the device immediately terminates the time-out
period and suspends the erase operation.
After the erase operation has been suspended, the system
can read array data from or program data to any sector not
selected for erasure. (The device "erase suspends" all
sectors selected for erasure.) Normal read and write timings
and command definitions apply. Reading at any address
within erase-suspended sectors produces status data on I/O7

- I/O0. The system can use I/O7, or I/O6 and I/O2 together, to
determine if a sector is actively erasing or is erase­suspended. See "Write Operation Status" for information on
these status bits.
After an erase-suspended program operation is complete,
the system can once again read array data within non­suspended sectors. The system can determine the status of
the program operation using the I/O7 or I/O6 status bits, just
as in the standard program operation. See "Write Operation
Status" for more information.
The system may also write the autoselect command
sequence when the device is in the Erase Suspend mode.
The device allows reading autoselect codes even at
addresses within erasing sectors, since the codes are not
stored in the memory array. When the device exits the
autoselect mode, the device reverts to the Erase Suspend
mode, and is ready for another valid operation. See
"Autoselect Command Sequence" for more information.
The system must write the Erase Resume command
(address bits are "don't care") to exit the erase suspend
mode and continue the sector erase operation. Further writes
of the Resume command are ignored. Another Erase
Suspend command can be written after the device has
resumed erasing.

START

Write Erase

Command
Sequence

Data Poll

from System

No

Data = FFh ?

Yes

Erasure Completed

Note :

1. See the appropriate Command Definitions table for erase
command sequences.

2. See "I/O3 : Sector Erase Timer" for more information.

Figure 3. Erase Operation

Embedded
Erase
algorithm in
progress

PRELIMINARY (August, 2001, Version 0.3) 10 AMIC Technology, Inc.

A29001/A290011 Series

WE

Table 5. A29001/A290011 Command Definitions

Command

Sequence

(Note 1)

Read (Note 5)
Reset (Note 6)

Autoselect

(Note 7)

Program

Manufacturer ID
Device ID

Continuation ID 4 555 AA 2AA 55 555 90 X03
Sector Protect Verify

(Note 8)

Top A1
Bottom

First

Addr Data

Cycles

1 RA RD

1 XXX
4
4

4

4

F0
555 AA 2AA
555 AA

555 AA

AA

555

Second

Addr

Data Addr

2AA

2AA

2AA

Bus Cycles (Notes 2 - 4)

Third

Data

Addr

55
55

55 555 90

55 555 A0 PA

555

90 X00

555 90 X01

SA

X02

Fourth

Data

37

4C
7F

00

01

PD

Fifth

Addr Data Addr

Sixth

Data

Chip Erase 6
Sector Erase

Erase Suspend (Note 9)
Erase Resume (Note 10)

Legend:
X = Don't care
RA = Address of the memory location to be read.
RD = Data read from location RA during read operation.

PA = Address of the memory location to be programmed. Addresses latch on the falling edge of the

whichever happens later.

PD = Data to be programmed at location PA. Data latches on the rising edge of WE or CE pulse, whichever happens first.
SA = Address of the sector to be verified (in autoselect mode) or erased. Address bits A16 - A12 select a unique sector.

Note:

1. See Table 1 for description of bus operations.

2. All values are in hexadecimal.

3. Except when reading array or autoselect data, all bus cycles are write operation.

4. Address bits A16 - A12 are don't cares for unlock and command cycles, unless SA or PA required.

5. No unlock or command cycles required when reading array data.

6. The Reset command is required to return to reading array data when device is in the autoselect mode, or if I/O5 goes high
(while the device is providing status data).

7. The fourth cycle of the autoselect command sequence is a read cycle.

8. The data is 00h for an unprotected sector and 01h for a protected sector. See "Autoselect Command Sequence" for more
information.

9. The system may read and program in non-erasing sectors, or enter the autoselect mode, when in the Erase Suspend
mode.

10. The Erase Resume command is valid only during the Erase Suspend mode.

555 AA 2AA

6 555 AA

1 XXX
1 XXX

B0
30

55

2AA

55 555 80

555 80

555 AA 2AA

555

AA

2AA

55 555 10

SA

55

or CE pulse,

30

11. The time between each command cycle has to be less than 50µs.

PRELIMINARY (August, 2001, Version 0.3) 11 AMIC Technology, Inc.

Write Operation Status

WE

Several bits, I/O2, I/O3, I/O5, I/O6, and I/O7, are provided in
the A29001/A290011 to determine the status of a write
operation. Table 6 and the following subsections describe
the functions of these status bits. I/O7, I/O6 and I/O2 each
offer a method for determining whether a program or erase
operation is complete or in progress. These three bits are
discussed first.

I/O7:

Data

Polling

A29001/A290011 Series

START

Read I/O7-I/O0

Address = VA

The

Polling bit, I/O7, indicates to the host system

Data

whether an Embedded Algorithm is in progress or
completed, or whether the device is in Erase Suspend.

Polling is valid after the rising edge of the final

Data

pulse in the program or erase command sequence.
During the Embedded Program algorithm, the device
outputs on I/O7 the complement of the datum programmed
to I/O7. This I/O7 status also applies to programming during
Erase Suspend. When the Embedded Program algorithm
is complete, the device outputs the datum programmed to
I/O7. The system must provide the program address to
read valid status information on I/O7. If a program address

falls within a protected sector,

Polling on I/O7 is

Data

active for approximately 2µs, then the device returns to
reading array data.

During the Embedded Erase algorithm,

Data

Polling

produces a "0" on I/O7. When the Embedded Erase
algorithm is complete, or if the device enters the Erase

Suspend mode,

Polling produces a "1" on I/O7.This

Data

is analogous to the complement/true datum output
described for the Embedded Program algorithm: the erase
function changes all the bits in a sector to "1"; prior to this,
the device outputs the "complement," or "0." The system
must provide an address within any of the sectors selected
for erasure to read valid status information on I/O7.
After an erase command sequence is written, if all sectors

selected for erasing are protected,

Polling on I/O7 is

Data

active for approximately 100µs, then the device returns to
reading array data. If not all selected sectors are protected,
the Embedded Erase algorithm erases the unprotected
sectors, and ignores the selected sectors that are
protected.
When the system detects I/O7 has changed from the
complement to true data, it can read valid data at I/O7 - I/O0
on the following read cycles. This is because I/O7 may
change asynchronously with I/O0 - I/O6 while Output Enable

(OE) is asserted low. The

Polling Timings (During

Data

Embedded Algorithms) figure in the "AC Characteristics"
section illustrates this. Table 6 shows the outputs for

Polling on I/O7. Figure 4 shows the

Polling algorithm.

Data

Data

Yes

I/O7 = Data ?

No

No

Note :

1. VA = Valid address for programming. During a sector
erase operation, a valid address is an address within any
sector selected for erasure. During chip erase, a valid
address is any non-protected sector address.

2. I/O7 should be rechecked even if I/O5 = "1" because
I/O7 may change simultaneously with I/O5.

I/O5 = 1?

Yes

Read I/O7 - I/O0

Address = VA

I/O7 = Data ?

No

FAIL

Yes

PASS

Figure 4. Data Polling Algorithm

PRELIMINARY (August, 2001, Version 0.3) 12 AMIC Technology, Inc.

A29001/A290011 Series

WE

WE

I/O6: Toggle Bit I

Toggle Bit I on I/O6 indicates whether an Embedded
Program or Erase algorithm is in progress or complete, or
whether the device has entered the Erase Suspend mode.
Toggle Bit I may be read at any address, and is valid after

the rising edge of the final
sequence (prior to the program or erase operation), and
during the sector erase time-out.
During an Embedded Program or Erase algorithm
operation, successive read cycles to any address cause

I/O6 to toggle. (The system may use either OE or CE to
control the read cycles.) When the operation is complete,

I/O6 stops toggling.
After an erase command sequence is written, if all sectors
selected for erasing are protected, I/O6 toggles for
approximately 100µs, then returns to reading array data. If
not all selected sectors are protected, the Embedded
Erase algorithm erases the unprotected sectors, and
ignores the selected sectors that are protected.
The system can use I/O6 and I/O2 together to determine
whether a sector is actively erasing or is erase-suspended.
When the device is actively erasing (that is, the Embedded
Erase algorithm is in progress), I/O6 toggles. When the
device enters the Erase Suspend mode, I/O6 stops
toggling. However, the system must also use I/O2 to
determine which sectors are erasing or erase-suspended.
Alternatively, the system can use I/O7 (see the subsection

on " I/O7 :
If a program address falls within a protected sector, I/O6
toggles for approximately 2µs after the program command

sequence is written, then returns to reading array data.
I/O6 also toggles during the erase-suspend-program mode,
and stops toggling once the Embedded Program algorithm
is complete.
The Write Operation Status table shows the outputs for
Toggle Bit I on I/O6. Refer to Figure 5 for the toggle bit
algorithm, and to the Toggle Bit Timings figure in the "AC
Characteristics" section for the timing diagram. The I/O2 vs.
I/O6 figure shows the differences between I/O2 and I/O6 in
graphical form. See also the subsection on " I/O2: Toggle
Bit II".

Data

Polling").

pulse in the command

I/O2: Toggle Bit II

The "Toggle Bit II" on I/O2, when used with I/O6, indicates
whether a particular sector is actively erasing (that is, the
Embedded Erase algorithm is in progress), or whether that
sector is erase-suspended. Toggle Bit II is valid after the

rising edge of the final
sequence.
I/O2 toggles when the system reads at addresses within
those sectors that have been selected for erasure. (The

system may use either OE or CE to control the read
cycles.) But I/O2 cannot distinguish whether the sector is

actively erasing or is erase-suspended. I/O6, by
comparison, indicates whether the device is actively
erasing, or is in Erase Suspend, but cannot distinguish
which sectors are selected for erasure. Thus, both status

pulse in the command

bits are required for sector and mode information. Refer to
Table 6 to compare outputs for I/O2 and I/O6.
Figure 5 shows the toggle bit algorithm in flowchart form,
and the section " I/O2: Toggle Bit II" explains the algorithm.
See also the " I/O6: Toggle Bit I" subsection. Refer to the
Toggle Bit Timings figure for the toggle bit timing diagram.
The I/O2 vs. I/O6 figure shows the differences between I/O2
and I/O6 in graphical form.

Reading Toggle Bits I/O6, I/O2

Refer to Figure 5 for the following discussion. Whenever
the system initially begins reading toggle bit status, it must
read I/O7 - I/O0 at least twice in a row to determine whether
a toggle bit is toggling. Typically, a system would note and
store the value of the toggle bit after the first read. After the
second read, the system would compare the new value of
the toggle bit with the first. If the toggle bit is not toggling,
the device has completed the program or erase operation.
The system can read array data on I/O7 - I/O0 on the
following read cycle.
However, if after the initial two read cycles, the system
determines that the toggle bit is still toggling, the system
also should note whether the value of I/O5 is high (see the
section on I/O5). If it is, the system should then determine
again whether the toggle bit is toggling, since the toggle bit
may have stopped toggling just as I/O5 went high. If the
toggle bit is no longer toggling, the device has successfully
completed the program or erase operation. If it is still
toggling, the device did not complete the operation
successfully, and the system must write the reset
command to return to reading array data.
The remaining scenario is that the system initially
determines that the toggle bit is toggling and I/O5 has not
gone high. The system may continue to monitor the toggle
bit and I/O5 through successive read cycles, determining
the status as described in the previous paragraph.
Alternatively, it may choose to perform other system tasks.
In this case, the system must start at the beginning of the
algorithm when it returns to determine the status of the
operation (top of Figure 5).

I/O5: Exceeded Timing Limits

I/O5 indicates whether the program or erase time has
exceeded a specified internal pulse count limit. Under
these conditions I/O5 produces a "1." This is a failure
condition that indicates the program or erase cycle was not
successfully completed.
The I/O5 failure condition may appear if the system tries to
program a "1 "to a location that is previously programmed
to "0." Only an erase operation can change a "0" back to a
"1." Under this condition, the device halts the operation,
and when the operation has exceeded the timing limits,
I/O5 produces a "1."
Under both these conditions, the system must issue the
reset command to return the device to reading array data.

PRELIMINARY (August, 2001, Version 0.3) 13 AMIC Technology, Inc.

A29001/A290011 Series

I/O3: Sector Erase Timer

After writing a sector erase command sequence, the
system may read I/O3 to determine whether or not an
erase operation has begun. (The sector erase timer does
not apply to the chip erase command.) If additional
sectors are selected for erasure, the entire time-out also
applies after each additional sector erase command.
When the time-out is complete, I/O3 switches from "0" to
"1." The system may ignore I/O3 if the system can
guarantee that the time between additional sector erase
commands will always be less than 50µs. See also the
"Sector Erase Command Sequence" section.
After the sector erase command sequence is written, the

system should read the status on I/O7 (

Data

Polling) or

I/O6 (Toggle Bit 1) to ensure the device has accepted the
command sequence, and then read I/O3. If I/O3 is "1", the
internally controlled erase cycle has begun; all further
commands (other than Erase Suspend) are ignored until
the erase operation is complete. If I/O3 is "0", the device
will accept additional sector erase commands. To ensure
the command has been accepted, the system software
should check the status of I/O3 prior to and following each
subsequent sector erase command. If I/O3 is high on the
second status check, the last command might not have
been accepted. Table 6 shows the outputs for I/O3.

No

START

Read I/O7-I/O0

Read I/O7-I/O0

Toggle Bit

= Toggle ?

Yes

I/O5 = 1?

(Note 1)

No

Yes

Read I/O7 - I/O0

Twice

Toggle Bit

= Toggle ?

Yes

Program/Erase

Operation Not

Commplete, Write

Reset Command

Notes :

1. Read toggle bit twice to determine whether or not it is
toggling. See text.

2. Recheck toggle bit because it may stop toggling as I/O5
changes to "1". See text.

(Notes 1,2)

No

Program/Erase

Operation Complete

Figure 5. Toggle Bit Algorithm

PRELIMINARY (August, 2001, Version 0.3) 14 AMIC Technology, Inc.

Table 6. Write Operation Status

A29001/A290011 Series

Operation

I/O7 I/O6 I/O5 I/O3 I/O2

(Note 1) (Note 2) (Note 1)

Standard
Mode

Erase
Suspend
Mode

Embedded Program Algorithm

7I/O

Toggle 0 N/A No toggle

Embedded Erase Algorithm 0 Toggle 0 1 Toggle
Reading within Erase

Suspended Sector
Reading within Non-Erase

Suspend Sector
Erase-Suspend-Program

1 No toggle 0 N/A Toggle

Data Data Data Data Data

7I/O

Toggle 0 N/A N/A

Notes:

1. I/O7 and I/O2 require a valid address when reading status information. Refer to the appropriate subsection for further

details.

2. I/O5 switches to “1” when an Embedded Program or Embedded Erase operation has exceeded the maximum timing

limits. See “I/O5: Exceeded Timing Limits” for more information.

Maximum Negative Input Overshoot

20ns 20ns

+0.8V

-0.5V

-2.0V

Maximum Positive Input Overshoot

VCC+2.0V

VCC+0.5V

2.0V

20ns

20ns

20ns20ns

PRELIMINARY (August, 2001, Version 0.3) 15 AMIC Technology, Inc.

DC Characteristics

TTL/NMOS Compatible

A29001/A290011 Series

Parameter

Symbol

ILI Input Load Current

ILIT
ILO Output Leakage Current

ICC1

ICC2
ICC3

VIL Input Low Level
VIH Input High Level

VID

VOL Output Low Voltage

VOH Output High Voltage

CMOS Compatible

Parameter

Symbol

ILI Input Load Current

ILIT

ILO

ICC1

ICC2
ICC3 VCC Standby Current (Notes 2, 5)

VIL Input Low Level
VIH Input High Level

VID

VOL Output Low Voltage
VOH1
VOH2

Notes for DC characteristics (both tables):

1. The ICC current listed includes both the DC operation current and the frequency dependent component (at 6 MHz).
The frequency component typically is less than 2 mA/MHz, withOEat VIH.

2. Maximum ICC specifications are tested with VCC = VCC max.

3. ICC active while Embedded Algorithm (program or erase) is in progress.

4. Not 100% tested.

5. For CMOS mode only, ICC3 = 20µA max at extended temperatures (> +85°C).

6.

RESET

is not available on A290011.

Parameter Description

A9,OE&

VCC Active Read Current
(Notes 1, 2)

VCC Active Write (Program/Erase)
Current (Notes 2, 3, 4)

VCC Standby Current (Note 2)

Voltage for Autoselect and
Temporary Unprotect Sector

A9,OE&
Output Leakage Current

VCC Active Read Current
(Notes 1,2)

VCC Active Program/Erase Current
(Notes 2,3,4)

Voltage for Autoselect and
Temporary Sector Unprotect

Output High Voltage

RESET

Parameter Description

RESET

Input Load Current

Input Load Current

Test Description

VIN = VSS to VCC. VCC = VCC Max
VCC = VCC Max,
A9,OE&
VOUT = VSS to VCC. VCC = VCC Max

CE
CE

CE

VCC = 5.25 V
IOL = 12mA, VCC = VCC Min

IOH = -2.5 mA, VCC = VCC Min

VIN = VSS to VCC, VCC = VCC Max
VCC = VCC Max,
A9,OE&
VOUT = VSS to VCC, VCC = VCC Max

CE
CE

CE

VCC = 5.25 V 10.5 12.5 V
IOL = 12.0 mA, VCC = VCC Min

IOH = -2.5 mA, VCC = VCC Min
IOH = -100 µA. VCC = VCC Min

RESET

= VIL, OE = VIH

= VIL, OE =VIH
= VIH,

RESET

Test Description

RESET

= VIL, OE = VIH

= VIL, OE = VIH
=

RESET

=12.5V

= VCC ± 0.5V

= 12.5V

= VCC ± 0.5 V

Min.

-0.5

2.0

10.5

2.4

Min.

-0.5

0.7 x VCC

0.85 x VCC
VCC-0.4

Typ.

20 30 mA

30

0.4

VCC+0.5 V

Typ. Max. Unit

20

30

1

VCC+0.3 V

Max. Unit

±1.0 µA

100

±1.0

40 mA

1.0 mA

0.8

12.5

0.45

±1.0 µA

100

±1.0 µA

30

40 mA

5

0.8

0.45

µA

µA

V

V
V

V

µA

mA

µA

V

V
V
V

PRELIMINARY (August, 2001, Version 0.3) 16 AMIC Technology, Inc.

AC Characteristics

Output Hold Time from Addresses,

Read Only Operations

A29001/A290011 Series

Parameter Symbols

JEDEC

tAVAV tRC
tAVQV tACC

tELQV tCE
tGLQV tOE

Std

Read Cycle Time (Note 2)

Address to Output Delay

Chip Enable to Output Delay
Output Enable to Output Delay

tOEH

tEHQZ tDF

Output Enable Hold
Time (Note 2)

Chip Enable to Output High Z
(Notes 1,2)

tGHQZ

tDF

Output Enable to Output High Z

(Notes 1,2)

tAXQX tOH

CE

Notes:

1. Output driver disable time.

2. Not 100% tested.

Description Test Setup

Read
Toggle and

Polling

Data

or OE, Whichever Occurs First

= VIL

CE

= VIL

OE

= VIL

OE

Min.

Max.

Max.
Max.

Min.
Min.

Max.

Min.

Speed

-55

55
55

-70

70
70

55 70
30 30

0 0

10 10

18 20

18

20

0

Unit

-90

90
90

90
35

0

10

20

20

0

0

ns
ns

ns
ns
ns

ns

ns

ns

ns

Timing Waveforms for Read Only Operation (

RESET

=VIH on A29001)

tRC

Addresses Addresses Stable

CE

tACC

OE

WE

tOEH

tOE

tCE

Output

High-Z

0V

Output Valid

tDF

tOH

High-Z

PRELIMINARY (August, 2001, Version 0.3) 17 AMIC Technology, Inc.

A29001/A290011 Series

Hardware Reset (

Parameter

JEDEC Std

Note: Not 100% tested.

RESET

Timings

CE, OE

RESET

tREADY

tREADY

tRP
tRH

RESET

RESET

)(N/A on A290011)

Description Test Setup All Speed Options Unit

RESET

Algorithms) to Read or Write (See Note)

RESET

Algorithms) to Read or Write (See Note)

RESET
RESET

Pin Low (During Embedded

Pin Low (Not During Embedded

Pulse Width
High Time Before Read (See Note)

tRP

tReady

Reset Timings NOT during Embedded Algorithms

Reset Timings during Embedded Algorithms

tRH

~

~

Max 20

Max 500 ns

Min 500 ns
Min 50 ns

µs

tRP

Temporary Sector Unprotect (N/A on A290011)

Parameter

JEDEC Std

Note: Not 100% tested.

tVIDR VID Rise and Fall Time (See Note) Min 500 ns
tRSP

RESET

Unprotect

Setup Time for Temporary Sector

Description All Speed Options Unit

Temporary Sector Unprotect Timing Diagram

12V

RESET

0 or 5V

tVIDR tVIDR

CE

WE

tRSP

Min 4

~

~

Program or Erase Command Sequence

~

~

~

~

µs

0 or 5V

PRELIMINARY (August, 2001, Version 0.3) 18 AMIC Technology, Inc.

AC Characteristics

Erase and Program Operations

A29001/A290011 Series

Parameter Symbols Speed

JEDEC

tAVAV
tAVWL tAS
tWLAX tAH
tDVWH tDS
tWHDX tDH

tGHWL tGHWL

tELWL tCS
tWHEH
tWLWH tWP

tWHWL tWPH Write Pulse Width High

tWHWH1 tWHWH1 Byte Programming Operation (Note 2) Typ. 7

Std

tWC

tOES

tCH

Write Cycle Time (Note 1)
Address Setup Time

Address Hold Time
Data Setup Time
Data Hold Time
Output Enable Setup Time
Read Recover Time Before Write

(OE high to WE low)

Setup Time

CE

Hold Time

CE

Write Pulse Width

Description

Min.
Min.
Min.
Min.
Min.
Min.

Min.

Min.
Min.
Min.
Min.

Max.

-55

55

40
25

30 35

-70

70

45
30

20
50

0

0
0

0

0
0

-90

90

45
45

45

Unit

ns
ns
ns
ns
ns
ns

ns

ns
ns
ns
ns

µs
µs

tWHWH2 tWHWH2 Sector Erase Operation (Note 2) Typ. 1 sec

tVCS VCC Set Up Time (Note 1) Min. 50

Notes:

1. Not 100% tested.

2. See the "Erase and Programming Performance" section for more information.

µs

PRELIMINARY (August, 2001, Version 0.3) 19 AMIC Technology, Inc.

Timing Waveforms for Program Operation

Addresses

CE

OE

WE

Data

tVCS

VCC

Note : PA = program addrss, PD = program data, Dout is the true data at the program address.

Program Command Sequence (last two cycles)

tWC

555h

tGHWL

tCS

tCH

tWP

tDS

A0h PD

tAS

PA

tAH

tWPH

tDH

~

~

~

~

~

~

~

~

~

~

~

~

~

~

A29001/A290011 Series

Read Status Data (last two cycles)

PA

tWHWH1

Status

PA

DOUT

PRELIMINARY (August, 2001, Version 0.3) 20 AMIC Technology, Inc.

Timing Waveforms for Chip/Sector Erase Operation

A29001/A290011 Series

Addresses

CE

OE

WE

Data

VCC

tVCS

Erase Command Sequence (last two cycles)

tWC

2AAh

tGHWL

tCH

tWP

tCS

tDS

55h 30h

tAS

SA

555h for chip erase

tWPH

tDH

10h for chip erase

tAH

~

~

~

~

~

~

~

~

~

~

~

~

~

~

tWHWH2

Read Status Data

VA

In

Progress

VA

Complete

Note : SA = Sector Address. VA = Valid Address for reading status data.

PRELIMINARY (August, 2001, Version 0.3) 21 AMIC Technology, Inc.

A29001/A290011 Series

Timing Waveforms for

Addresses

CE

tCH

OE

tOEH

WE

I/O7

I/O0 - I/O6

Polling (During Embedded Algorithms)

Data

tRC

tACC

tCE

tOE

tDF

tOH

Complement

Status Data

~

~

VAVA VA

~

~

~

~

~

~

~

~

Complement True

~

~

Status Data True

~

~

Valid Data

High-Z

High-Z

Valid Data

Note : VA = Valid Address. Illustation shows first status cycle after command sequence, last status read cycle, and array data
read cycle.

PRELIMINARY (August, 2001, Version 0.3) 22 AMIC Technology, Inc.

Timing Waveforms for Toggle Bit (During Embedded Algorithms)

A29001/A290011 Series

Addresses

CE

OE

WE

I/O6 , I/O2

tCH

tOEH

tACC

tCE

tRC

VAVA VA

tOE

tDF

tOH

Valid Status

(first read) (second read) (stop togging)

Valid Status Valid Status Valid Status

~

~

VA

~

~

~

~

~

~

~

~

~

~

Note: VA = Valid Address; not required for I/O6. Illustration shows first two status cycle after command sequence, last status

read cycle, and array data read cycle.

PRELIMINARY (August, 2001, Version 0.3) 23 AMIC Technology, Inc.

Timing Waveforms for I/O2 vs. I/O6

WE

WE

Enter

Embedded

Erasing

WE

Erase

Erase

Suspend

~

~

Erase Suspend

Read

Suspend Program

~

~

Enter Erase

~

~

Erase
Suspend
Program

Resume

~

~

Erase Suspend

Read

A29001/A290011 Series

Erase

~

~

Erase

Erase

Complete

I/O6

I/O2

Note : Both I/O6 and I/O2 toggle with OE or CE. See the text on I/O6 and I/O2 in the section "Write Operation Statue" for
more information.

~

~

~

~

I/O2 and I/O6 toggle with OE and CE

~

~

~

~

~

~

~

~

~

~

~

~

~

~

~

~

AC Characteristics

Erase and Program Operations

Alternate CE Controlled Writes

Parameter Symbols Speed

JEDEC Std

tAVAV tWC Write Cycle Time (Note 1) Min. 55 70 90 ns
tAVEL tAS Address Setup Time Min. 0 ns
tELAX tAH Address Hold Time Min. 40 45 45 ns
tDVEH tDS Data Setup Time Min. 25 30 45 ns
tEHDX tDH Data Hold Time Min. 0 ns
tGHEL tGHEL Read Recover Time Before Write Min. 0 ns
tWLEL tWS

tEHWH tWH

tELEH tCP Write Pulse Width Min. 30 35 45 ns

tEHEL tCPH Write Pulse Width High Min. 20 20 20 ns
tWHWH1 tWHWH1 Byte Programming Operation (Note 2) Typ. 7
tWHWH2 tWHWH2 Sector Erase Operation (Note 2) Typ. 1 sec

Setup Time
Hold Time

Description

-55 -70 -90

Min. 0 ns
Min. 0 ns

Unit

µs

Notes:

3. Not 100% tested.

4. See the "Erase and Programming Performance" section for more information.

PRELIMINARY (August, 2001, Version 0.3) 24 AMIC Technology, Inc.

Timing Waveforms for Alternate CE Controlled Write Operation

PA for program

555 for program

2AA for erase

Addresses

WE

SA for sector erase
555 for chip erase

tAStWC

tWH

tAH

Data Polling

~

~

~

~

~

~

A29001/A290011 Series

PA

tGHEL

OE

tCP

CE

tWS

Data

tRH

A0 for program
55 for erase

Note :

1. PA = Program Address, PD = Program Data, SA = Sector Address, I/O7 = Complement of Data Input, DOUT = Array Data.

2. Figure indicates the last two bus cycles of the command sequence.

tCPH

tDS

tDH

PD for program
30 for sector erase
10 for chip erase

tBUSY

~

~

tWHWH1 or 2

~

~

~

~

I/O7

DOUT

Erase and Programming Performance

Parameter Typ. (Note 1) Max. (Note 2) Unit Comments

Sector Erase Time 1 8 sec
Chip Erase Time 8 64 sec
Byte Programming Time 35 300
Chip Programming Time (Note 3) 3.6 10.8 sec

Notes:

1. Typical program and erase times assume the following conditions: 25°C, 5.0V VCC, 100,000 cycles. Additionally,
programming typically assumes checkerboard pattern.

2. Under worst case conditions of 90°C, VCC = 4.5V (4.75V for -55), 100,000 cycles.

3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes
program faster than the maximum byte program time listed. If the maximum byte program time given is exceeded, only
then does the device set I/O5 = 1. See the section on I/O5 for further information.

4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.

5. System-level overhead is the time required to execute the four-bus-cycle command sequence for programming. See
Table 4 for further information on command definitions.

6. The device has a guaranteed minimum erase and program cycle endurance of 100,000 cycles.

µs

Excludes 00h programming

prior to erasure (Note 4)

Excludes system-level

overhead (Note 5)

PRELIMINARY (August, 2001, Version 0.3) 25 AMIC Technology, Inc.

Latch-up Characteristics

Description Min. Max.

Input Voltage with respect to VSS on all I/O pins

A29001/A290011 Series

-1.0V VCC+1.0V
VCC Current
Input voltage with respect to VSS on all pins except I/O pins

(including A9, OEand

Includes all pins except VCC. Test conditions: VCC = 5.0V, one pin at time.

RESET

)

TSOP Pin Capacitance

Parameter Symbol Parameter Description

CIN Input Capacitance

COUT

CIN2 Control Pin Capacitance

Notes:

1. Sampled, not 100% tested.

2. Test conditions TA = 25°C, f = 1.0MHz

Output Capacitance

Test Setup

PLCC and P-DIP Pin Capacitance

Parameter Symbol Parameter Description

CIN Input Capacitance

Test Setup

RESET

VIN=0

VOUT=0

VIN=0

VIN=0

-100 mA

-1.0V

N/A on A290011.

Typ.

6

8.5

7.5

Typ.

4

+100 mA

12.5V

Max.

7.5 pF
12

9

Max. Unit

6

Unit

pF
pF

pF

COUT

CIN2

Notes:

3. Sampled, not 100% tested.

4. Test conditions TA = 25°C, f = 1.0MHz

Output Capacitance
Control Pin Capacitance

Data Retention

Parameter

Minimum Pattern Data Retention Time

VOUT=0

VPP=0

Test Conditions

150°C
125°C

8
8

Min

10
20 Years

12
12

Unit

Years

pF
pF

PRELIMINARY (August, 2001, Version 0.3) 26 AMIC Technology, Inc.

A29001/A290011 Series

Test Conditions

Test Specifications

Test Condition -55 All others Unit

Output Load 1 TTL gate
Output Load Capacitance, CL(including jig capacitance) 30 100 pF
Input Rise and Fall Times 5 20 ns
Input Pulse Levels 0.0 - 3.0 0.45 - 2.4 V
Input timing measurement reference levels 1.5 0.8, 2.0 V
Output timing measurement reference levels 1.5 0.8, 2.0 V

Test Setup

5.0 V

2.7 K

Ω

Device

Under

Test

CL

6.2 K

Ω

Diodes = IN3064 or Equivalent

PRELIMINARY (August, 2001, Version 0.3) 27 AMIC Technology, Inc.

Ordering Information

Current

Top Boot Sector Flash

A29001/A290011 Series

Part No. Access Time

A29001T-55
A290011T-55

A29001TL-55
A290011TL-55

A29001TV-55
A290011TV-55

A29001T-70
A290011T-70

A29001TL-70
A290011TL-70

A29001TV-70
A290011TV-70

A29001T-90
A290011T-90

Active Read

(ns)

55 20 30 1

70 20 30 1

Typ. (mA)

Program/Erase

Current

Typ. (mA)

Standby Current

Typ. (µA)

Package

32Pin DIP

32Pin PLCC

32Pin TSOP

32Pin DIP

32Pin PLCC

32Pin TSOP

32Pin DIP

A29001TL-90
A290011TL-90

A29001TV-90
A290011TV-90

90 20 30 1

32Pin PLCC

32Pin TSOP

PRELIMINARY (August, 2001, Version 0.3) 28 AMIC Technology, Inc.

Ordering Information (continued)

Current

Bottom Boot Sector Flash

A29001/A290011 Series

Part No. Access Time

A29001U-55
A290011U-55

A29001UL-55
A290011UL-55

A29001UV-55
A290011UV-55

A29001U-70
A290011U-70

A29001UL-70
A290011UL-70

A29001UV-70
A290011UV-70

A29001U-90
A290011U-90

Active Read

(ns)

55 20 30 1

70 20 30 1

Typ. (mA)

Program/Erase

Current

Typ. (mA)

Standby Current

Typ. (µA)

Package

32Pin DIP

32Pin PLCC

32Pin TSOP

32Pin DIP

32Pin PLCC

32Pin TSOP

32Pin DIP

A29001UL-90
A290011UL-90

A29001UV-90
A290011UV-90

90 20 30 1

32Pin PLCC

32Pin TSOP

PRELIMINARY (August, 2001, Version 0.3) 29 AMIC Technology, Inc.

A29001/A290011 Series

Package Information

P-DIP 32L Outline Dimensions unit: inches/mm

D

32

E

17

1

AL

A2

B

B1

16

A1

Base Plane

Seating Plane

e

θ

E

1

C

E

A

Symbol

A - - 0.210 - - 5.334
A1 0.015 - - 0.381 - ­A2 0.149 0.154 0.159 3.785 3.912 4.039

B - 0.018 - - 0.457 ­B1 - 0.050 - - 1.270 -

C - 0.010 - - 0.254 -

D 1.645 1.650 1.655 41.783 41.91 42.037

E 0.537 0.542 0.547 13.64 13.767 13.894
E1 0.590 0.600 0.610 14.986 15.240 15.494
EA 0.630 0.650 0.670 16.002 16.510 17.018

e - 0.100 - - 2.540 ­L 0.120 0.130 0.140 3.048 3.302 3.556
θ 0°

Dimensions in inches Dimensions in mm

Min Nom Max Min Nom Max

-

15° 0°

-

15°

Notes:

1. The maximum value of dimension D includes end flash.

2. Dimension E does not include resin fins.

PRELIMINARY (August, 2001, Version 0.3) 30 AMIC Technology, Inc.

A29001/A290011 Series

Package Information

PLCC 32L Outline Dimension unit: inches/mm

13

HD

D

5

14

20

21

A

b

e

b

1

GD

A1 A2

y

D

4

1

E

HE

32

30

29

c

L

θ

GE

Symbol

A - - 0.134 - - 3.40
A1 0.0185 - - 0.47 - ­A2 0.105 0.110 0.115 2.67 2.80 2.93

b1 0.026 0.028 0.032 0.66 0.71 0.81

b 0.016 0.018 0.021 0.41 0.46 0.54
C 0.008 0.010 0.014 0.20 0.254 0.35
D 0.547 0.550 0.553 13.89 13.97 14.05
E 0.447 0.450 0.453 11.35 11.43 11.51

e 0.044 0.050 0.056 1.12 1.27 1.42

GD 0.490 0.510 0.530 12.45 12.95 13.46
GE
HD
HE 0.485 0.490 0.495 12.32 12.45 12.57

L 0.075 0.090 0.095 1.91 2.29 2.41

y

θ 0° - 10° 0° - 10°

Dimensions in inches Dimensions in mm

Min Nom Max Min Nom Max

0.390 0.410 0.430 9.91 10.41 10.92

0.585 0.590 0.595 14.86 14.99 15.11

- - 0.003 - - 0.075

Notes:

1. Dimensions D and E do not include resin fins.

2. Dimensions GD & GE are for PC Board surface mount pad pitch
design reference only.

PRELIMINARY (August, 2001, Version 0.3) 31 AMIC Technology, Inc.

A29001/A290011 Series

Dimensions in inches

Dimensions in mm

Package Information
TSOP 32L TYPE I (8 X 20mm) Outline Dimensions unit: inches/mm

D

e

A2

E

HD

Detail "A"

y

D

c

A1

L

LE

Detail "A"

S

b

A

θ

Symbol

A - - 0.047 - - 1.20

A1
A2

b 0.007 0.009 0.011 0.18 0.22 0.27

c 0.004 - 0.008 0.11 - 0.20
D 0.720 0.724 0.728 18.30 18.40 18.50
E - 0.315 0.319 - 8.00 8.10

e 0.020 BSC 0.50 BSC

HD 0.779 0.787 0.795 19.80 20.00 20.20

L 0.016 0.020 0.024 0.40 0.50 0.60

LE - 0.032 - - 0.80 -

S - - 0.020 - - 0.50

y - - 0.003 - - 0.08

θ 0°

Min Nom Max Min Nom Max

0.002 - 0.006 0.05 - 0.15

0.037 0.039 0.041 0.95 1.00 1.05

-

5° 0°

-

5°

PRELIMINARY (August, 2001, Version 0.3) 32 AMIC Technology, Inc.

Notes:

1. The maximum value of dimension D includes end flash.

2. Dimension E does not include resin fins.

3. Dimension S includes end flash.