Datasheet A23L9308M-20, A23L9308M, A23L9308L-20, A23L9308L, A23L9308H-20 Datasheet (AMICC)

A23L9308 Series

Preliminary 524,288 X 8 BIT CMOS MASK ROM

PRELIMINARY (October, 2001, Version 0.0) AMIC Technology, Inc.

Document Title
524,288 X 8 BIT CMOS MASK ROM

Revision History

Rev. No. History Issue Date Remark

0.0 Initial issue October 2, 2001 Preliminary

A23L9308 Series

Preliminary 524,288 X 8 BIT CMOS MASK ROM

PRELIMINARY (October, 2001, Version 0.0) 1 AMIC Technology, Inc.

Features

n 524,288 x 8 bit organization
n Wide power supply range: +2.7V to +3.6V
n Access time: 150ns (max.)/3V~3.6V

200ns (max.)/2.7V~3.3V
n Current: Operating: 15mA (max.)/3V~3.6V
10mA (max.)/2.7V~3.3V
Standby: 25ìA (max.)/3V~3.6V
5ìA (max.)/2.7V~3.3V

n Mask Programmed for Chip Enable (power-down)
CE/CE, Output Enable OE/OE /NC

n Three-state outputs for wired-OR expansion
n Full static operation
n All inputs and outputs are directly TTL-compatible
n Available in 32-pin DIP, 32-pin SOP, 32-pin PLCC

packages or in DICE FORM.

General Description

The A23L9308 high-performance Read Only Memory is
configured as 524,288 x 8 bits. It is designed to be
compatible with all microprocessors and similar
applications where high-performance, large-bit storage,
and simple interfacing are important design
considerations. This device is designed for use with
operating voltage from 2.7V to 3.6V.

The A23L9308 offers an automatic POWER-DOWN
controlled by the Chip Enable CE/ CE input. When
CE/ CE goes low/high, the device will automatically

POWER-DOWN and remain in a low power STANDBY
mode as long as CE/ CE remains low/high. A23L9308
also offers OE/ OE /NC (Active High or Low or No

Connection), which eliminates bus contention in multiple
bus microprocessor systems.

Pin Configurations

nn P-DIP / SOP nn PLCC

A23L9308

A6

A10

A9

O6

NC
A16
A15

A12

A7
A6
A5
A4
A3
A2

O0

O1

O3

O4

O5

A11

A9

A13

VCC

A10

A23L9308

1
2
3
4
5
6
7
8

9
10
11

12
13
14 19

20

21

22

23

24

25

26

27

28

29

30

31

32

A8

O2

GND

O6

O7

CE/CE

A14

A5
A4

A3
A2

A1
A0

O0

O7

A8

A13

A14

A12

A15

A16NCVCC

A18

A17

O1

O2

GND

O3

O4

O5

1

2

3

4

5
6

7
8

9
10
11

12
13

323130

141615

171819

20

21

22

23

24

25

26

27

28

29

OE/OE/NC

1815

16

17

A1
A0

A18
A17

CE/CE

A11

A7

OE/OE/NC

A23L9308 Series

PRELIMINARY (October, 2001, Version 0.0) 2 AMIC Technology, Inc.

Block Diagram

COLUMN SELECTOR CIRCUITRY

ROW

DECODER

DRIVER

MEMORY CELL

ARRAY

524,288 X 8

COLUMN

DECODER

DRIVER

POWER-DOWN

OR
OUTPUT
ENABLE

CIRCUITRY

A0 - A18

ADDRESS

INPUTS

O6

O5

O4

O3

O2

O1

O0

CE/CE

OE/OE/NC

O7

A23L9308 Series

PRELIMINARY (October, 2001, Version 0.0) 3 AMIC Technology, Inc.

Pin Descriptions

Pin No. Symbol Description

32L DIP/SOP 32L PLCC

2 - 12, 23,

25 - 31

2 - 12, 23,

25 - 31

A0 - A18 Address Inputs

22 22

CE/CE

Chip Enable Input (Note 1)

24 24

OE/OE /NC

Output Enable (Note 1)

13 - 15,

17 - 21

13 - 15,

17 - 21

O0 - O7 Data Outputs

32 32 VCC Power Supply
16 16 GND Ground

1 1 NC No Connection (Note 2)

Notes:

1. This pin is user-definable as active high or active low.

2. NC indicates "No Connection."

Recommended DC Operating Conditions

(TA = 0°C to + 70°C)

Symbol Parameter Min. Max. Unit

VCC Supply Voltage 2.7 3.6 V

GND Ground 0 0 V

VIH Input High Voltage 0.7* VCC VCC+0.3 V

VIL Input Low Voltage - 0.5 0.8

V

A23L9308 Series

PRELIMINARY (October, 2001, Version 0.0) 4 AMIC Technology, Inc.

Absolute Maximum Ratings*

Ambient Operating Temperature . . . . . . . -10°C to + 80°C

Storage Temperature . . . . . . . . . . . . . . -65°C to + 150°C

Supply Voltage to Ground Potential . . . . . . . . . . . . . . . . .

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to + 7.0V

Output Voltage . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V

Input Voltage . . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V

Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . 400mW

*Comments

Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of this
device at these or any other conditions above those
indicated in the operational sections of this specification is
not implied or intended. Exposure to the absolute
maximum rating conditions for extended periods may affect
device reliability.

DC Electrical Characteristics (TA = 0°C to + 70°C, GND = 0V)

Symbol Parameter

3V~3.6V 2.7V~3.3V

Unit Conditions Note

Min. Max. Min. Max.

VOH Output High Voltage 2.15 2.15 V IOH = -0.4mA (3V)

VOL Output Low Voltage 0.4 0.4 V IOL = 1.6mA (3V)

VlH Input High Voltage

0.7*VCC VCC+0.5 0.7*VCC VCC+0.5

V

VlL Input Low Voltage -0.5 0.6 -0.5 0.6 V

lLI

Input Leakage Current +5 +5

µA

VCC = max.
VIN = VCC to GND

lLO

Output Leakage Current +5 +5

µA

VCC = max.
VOUT = VCC to GND

1

ICC Operating Supply Current 15 10 mA tCYC = min. 2

ISB Standby Supply Current (TTL) 0.5 0.3 mA

CE = VIH, CE = VIL

ISB1 Standby Supply Current (CMOS) 25 5

µA

CE = VCC - 0.2V,

CE = 0.2V

A23L9308 Series

PRELIMINARY (October, 2001, Version 0.0) 5 AMIC Technology, Inc.

Capacitance

Symbol Parameter Min. Max. Unit Test Conditions Note

CI Input Capacitance 10 pF

TA = 25°C

3

CO Output Capacitance 10 pF

f = 1.0MHz

AC Characteristics (TA = 0°C to +70°C, VCC=3.0V~3.6V for -15, VCC=2.7V~3.3V for -20, GND = 0V)

Symbol Parameter

A23L9308-15 A23L9308-20

Unit Note

Min. Max. Min. Max.

tCYC Cycle Time 150 200 ns

tAA Address Access Time 150 200 ns

tACE Chip Enable Access Time 150 200 ns

tAOE Output Enable Access Time 90 160 ns

tOH Output Hold after Address Change 10 10 ns

tLZ Output Low Z Delay 10 10 ns 4, 6

tHZ Output High Z Delay* 70 70 ns 5, 6

* tHZ is specified from either OE /OE or CE / CE going disabled, whichever occurs first.

Notes:

1. OE/CE = VIL, OE / CE = VIH (Output is unloaded)

2. VIN = VIH/VIL, but OE/CE = VIH,OE / CE = VIL (Output is unloaded)

3.

This parameter is periodically sampled and is not 100% tested. All pins, except pins under test, are tied to AC ground.

4. Output LOW impedance delay (tLZ) is measured from CE or OE going active.

5. Output HIGH impedance delay (tHZ) is measured from CE or OE going inactive.

6. This parameter is sampled and not 100% tested.

A23L9308 Series

PRELIMINARY (October, 2001, Version 0.0) 6 AMIC Technology, Inc.

Timing Waveforms

Propagation Delay from Address (CE/CE= Active, OE/OE= Active)

tAA

VALID

VALID

tCYC

tOH

ADDRESS

INPUTS

DATA OUT

Propagation Delay from Chip Enable or Output Enable (Address Valid)

tACE

tHZ

VALID

DATA OUT

tAOE

CHIP

ENABLE

OUTPUT

ENABLE

VALID

VALID

tLZ

tLZ

AC Test Conditions

Applied Voltage 2.7V~3.6V

Input Pulse Levels 0.4V to 2.4V

Input Rise and Fall Time 10 ns

Timing Measurement Reference Level

VIN = 1.5V

VOUT = 1.5V

Output Load 1 TTL gate and CL = 100pF

A23L9308 Series

PRELIMINARY (October, 2001, Version 0.0) 7 AMIC Technology, Inc.

Function Table

CE/CE OE/OE/NC

O0 - O7 Mode

A A Data Out Read

I X Hi - Z Power-down

A I Hi - Z Output Disable

1. CE/CE and OE/ OE /NC are mask programmable as either active low, active high, or no connection.

2. "A" means "Active," "I" means "Inactive," and "X" means "Either."

Ordering Information

Part No. Access Time (ns) Package

A23L9308-15 150 32L DIP

A23L9308M-15 150 32L SOP

A23L9308L-15 150 32L PLCC

A23L9308H-15 150 DICE FORM

A23L9308-20 200 32L DIP

A23L9308M-20 200 32L SOP

A23L9308L-20 200 32L PLCC

A23L9308H-20 200 DICE FORM

A23L9308 Series

PRELIMINARY (October, 2001, Version 0.0) 8 AMIC Technology, Inc.

Pad Configurations

Pad Location

Coordinate (um) Coordinate (um)

Pad No. Pad Name

X Y

Pad No. Pad Name

X Y
1 VCC -73.6 1406.3 18 O3 138.7 -1419.7
2 A16 -259.9 1419.2 19 O4 261.7 -1419.7
3 A15 -409.9 1419.2 20 O5 413.2 -1419.7
4 A12 -532.9 1419.2 21 O6 536.2 -1419.7
5 A7 -682.9 1419.2 22 O7 687.7 -1419.7

6 A6 -805.9 1419.2 23

CE/CE

810.7 -1419.2
7 A5 -955.9 1419.2 24 A10 960.7 -1419.2
8 A4 -1078.9 1419.2 25

OE/OE /NC

1083.7 -1419.2

9 A3 -1079.3 -1419.7 26 A11 1083.3 1419.2

10 A2 -956.3 -1419.2 27 A9 960.3 1419.2
11 A1 -806.3 -1419.2 28 A8 810.3 1419.2
12 A0 -683.3 -1419.2 29 A13 687.3 1419.2
13 O0 -529.3 -1419.7 30 A14 537.3 1419.2
14 O1 -406.3 -1419.7 31 A17 414.3 1419.2
15 O2 -254.8 -1419.7 32 A18 264.3 1419.2
16 GND -131.8 -1419.7 33 VCC 97.1 1417.7
17 GND -8.8

-1417.7

9 10 11 12 13 14 15 16 18 19 20 21 22 23 2417 25

8 7 6 5 4 3 2 1 32 31 30 29 28 27 2633

A4

A7

A6

A5

A12

A15

A16

VCC

VCC

A18

A17

A14

A13A8A9

A11

A2

O0

A0

A1

O1

O2

GND

GND

O3

O4

O5

O6

O7

CE/CE

A10

OE/OE/NC

A3

(0,0)

X

Y

A23L9308 Series

PRELIMINARY (October, 2001, Version 0.0) 9 AMIC Technology, Inc.

Package Information

P-DIP 32L Outline Dimensions unit: inches/mm

1

32

E

A2

AL

E

1

E

A

D

C

θ

B1

B

A1

Base Plane

Seating Plane

16

17

e

Dimensions in inches Dimensions in mm

Symbol

Min Nom Max Min Nom Max

A - - 0.210 - - 5.334
A1 0.015 - - 0.381 - ­A2 0.149 0.154 0.159 3.785 3.912 4.039

B - 0.018 - - 0.457 ­B1 - 0.050 - - 1.270 -

C - 0.010 - - 0.254 -

D 1.645 1.650 1.655 41.783 41.91 42.037

E 0.537 0.542 0.547 13.64 13.767 13.894
E1 0.590 0.600 0.610 14.986 15.240 15.494
EA 0.630 0.650 0.670 16.002 16.510 17.018

e - 0.100 - - 2.540 -

L 0.120 0.130 0.140 3.048 3.302 3.556

θ 0°

-

15° 0°

-

15°

Notes:

1. The maximum value of dimension D includes end flash.

2. Dimension E does not include resin fins.

A23L9308 Series

PRELIMINARY (October, 2001, Version 0.0) 10 AMIC Technology, Inc.

Package Information

SOP (W.B.) 32L Outline Dimensions unit: inches/mm

1

E

HE

L

LE

c

16

See Detail F

Detail F

1732

A1 A2

A

S

D

Seating Plane

D

y

e

b

θ

Dimensions in inches Dimensions in mm

Symbol

Min Nom Max Min Nom Max

A - - 0.118 - - 3.00
A1 0.004 - - 0.10 - ­A2 0.101 0.106 0.111 2.57 2.69 2.82

b 0.014 0.016 0.020 0.36 0.41 0.51

c 0.006 0.008 0.012 0.15 0.20 0.31

D - 0.805 0.817 - 20.45 20.75

E 0.440 0.445 0.450 11.18 11.30 11.43

e 0.044 0.050 0.056 1.12 1.27 1.42
HE 0.546 0.556 0.566 13.87 14.12 14.38

L 0.023 0.031 0.039 0.58 0.79 0.99
LE 0.047 0.055 0.063 1.19 1.40 1.60

S - - 0.036 - - 0.91

y - - 0.004 - - 0.10

θ

0° - 10° 0° - 10°

Notes:

1. The maximum value of dimension D includes end flash.

2. Dimension E does not include resin fins.

3. Dimension S includes end flash.

A23L9308 Series

PRELIMINARY (October, 2001, Version 0.0) 11 AMIC Technology, Inc.

Package Information

PLCC 32L Outline Dimension unit: inches/mm

A1 A2

A

e

D

y

HD

D

13

GD

b

1

b

GE

c

5

14

20

21

29

30

32

1

4

E

HE

L

θ

Dimensions in inches Dimensions in mm

Symbol

Min Nom Max Min Nom Max

A - - 0.134 - - 3.40
A1 0.0185 - - 0.47 - ­A2 0.105 0.110 0.115 2.67 2.80 2.93

b1 0.026 0.028 0.032 0.66 0.71 0.81

b 0.016 0.018 0.021 0.41 0.46 0.54

C 0.008 0.010 0.014 0.20 0.254 0.35

D 0.547 0.550 0.553 13.89 13.97 14.05

E 0.447 0.450 0.453 11.35 11.43 11.51

e 0.044 0.050 0.056 1.12 1.27 1.42

GD 0.490 0.510 0.530 12.45 12.95 13.46
GE

0.390 0.410 0.430 9.91 10.41 10.92

HD

0.585 0.590 0.595 14.86 14.99 15.11

HE 0.485 0.490 0.495 12.32 12.45 12.57

L 0.075 0.090 0.095 1.91 2.29 2.41

y

- - 0.003 - - 0.075

θ 0° - 10° 0° - 10°

Notes:

1. Dimensions D and E do not include resin fins.

2. Dimensions GD & GE are for PC Board surface mount pad pitch
design reference only.