The Allegro® A1210-A1214 Hall-effect latches are next generation replacements
for the popular Allegro 317x and 318x lines of latching switches. The A121x
Package LH, 3-pin Surface Mount
GND
3
1
2
VCC
VOUT
Package UA, 3-pin SIP
family, produced with BiCMOS technology, consists of devices that feature fast
power-on time and low-noise operation. Device programming is performed after
packaging, to ensure increased switchpoint accuracy by eliminating offsets that
can be induced by package stress. Unique Hall element geometries and low-offset
amplifiers help to minimize noise and to reduce the residual offset voltage normally caused by device overmolding, temperature excursions, and thermal stress.
3
The A1210-A1214 Hall-effect latches include the following on a single silicon
chip: voltage regulator, Hall-voltage generator, small-signal amplifier, Schmitt
trigger, and NMOS output transistor. The integrated voltage regulator permits
operation from 3.8 to 24 V. The extensive on-board protection circuitry makes
possible a ±30 V absolute maximum voltage rating for superior protection in
automotive and industrial motor commutation applications, without adding
external components. All devices in the family are identical except for magnetic
switchpoint levels.
The small geometries of the BiCMOS process allow these devices to be provided in ultrasmall packages. The package styles available provide magnetically
optimized solutions for most applications. Package LH is an SOT23W, a miniature
low-profile surface-mount package, while package UA is a three-lead ultramini
SIP for through-hole mounting. Each package is lead (Pb) free, with 100% matte
tin plated leadframes.
2
VCC
GND
VOUT
1
2
3
AB SO LUTE MAX I MUM RAT INGS
Supply Voltage, VCC..........................................30 V
Reverse-Supply Voltage, V
Output Off Voltage, V
OUT
Reverse-Output Voltage, V
Output Current, I
OUTSINK
Magnetic Flux Density, B.........................Unlimited
Operating Temperature
Ambient, T
Ambient, T
, Range E..................–40ºC to 85ºC
A
, Range L................–40ºC to 150ºC
A
Maximum Junction, T
Storage Temperature, T
A1210-DS
........................ –30 V
RCC
.................................. 30 V
..................... –0.5 V
ROUT
............................... 25 mA
........................165ºC
J(max)
.................. –65ºC to 170ºC
S
Features and Benefits
Continuous-time operation
– Fast power-on time
– Low noise
Stable operation over full operating temperature range
Reverse battery protection
Solid-state reliability
Factory-programmed at end-of-line for optimum performance
Maximum voltage must be adjusted for power dissipation and junction temperature, see Power Derating section.
2
For VCC slew rates greater than 250 V/µs, and TA = 150°C, the Power-On Time can reach its maximum value.
3
CS =oscilloscope probe capacitance.
4
Maximum current limit is equal to the maximum I
5
Magnetic flux density, B, is indicated as a negative value for north-polarity magnetic fields, and as a positive value for south-polarity magnetic fields.
This so-called algebraic convention supports arithmetic comparison of north and south polarity values, where the relative strength of the field is indicated
by the absolute value of B, and the sign indicates the polarity of the field (for example, a –100 G field and a 100 G field have equivalent strength, but
opposite polarity).
V
CC
OUTOFF
OUT(SAT)IOUT
t
PO
t
r
t
f
I
CCON
I
CCOFF
RCC
Z
I
Z
OP
RP
HYS
Operating, TJ < 165°C3.8–24V
V
OUT
Slew rate (dVCC/dt) < 2.5 V/µs, B > BOP + 5 G or
B < BRP – 5 G
The output of these devices switches low (turns on) when a
magnetic field perpendicular to the Hall sensor exceeds the
operate point threshold, BOP. After turn-on, the output is capable
of sinking 25 mA and the output voltage is V
OUT(SAT)
. Notice
that the device latches; that is, a south pole of sufficient strength
towards the branded surface of the device turns the device on,
and the device remains on with removal of the south pole. When
the magnetic field is reduced below the release point, B
RP
,
the device output goes high (turns off). The difference in the
magnetic operate and release points is the hysteresis, B
hys
, of
the device. This built-in hysteresis allows clean switching of the
output, even in the presence of external mechanical vibration and
electrical noise.
Powering-on the device in the hysteresis range, less than BOP
and higher than BRP, allows an indeterminate output state. The
correct state is attained after the first excursion beyond BOP or
.
B
RP
CONTINUOUS-TIME BENEFITS
Continuous-time devices, such as the A121x family, offer the
fastest available power-on settling time and frequency response.
Due to offsets generated during the IC packaging process,
continuous-time devices typically require programming after
packaging to tighten magnetic parameter distributions. In contrast, chopper-stabilized switches employ an offset cancellation
technique on the chip that eliminates these offsets without the
need for after-packaging programming. The tradeoff is a longer
settling time and reduced frequency response as a result of the
chopper-stabilization offset cancellation algorithm.
The choice between continuous-time and chopper-stabilized
designs is solely determined by the application. Battery management is an example where continuous-time is often required. In
these applications, VCC is chopped with a very small duty cycle
in order to conserve power (refer to figure 2). The duty cycle
is controlled by the power-on time, t
, of the device. Because
PO
continuous-time devices have the shorter power-on time, they
are the clear choice for such applications.
For more information on the chopper stabilization technique,
refer to Technical Paper STP 97-10, Monolithic Magnetic Hall Sensor Using Dynamic Quadrature Offset Cancellation and
Technical Paper STP 99-1, Chopper-Stabilized Amplifiers with a Track-and-Hold Signal Demodulator.
(A)(B)
V
V+
Switch to Low
OUT
V
Switch to High
0
B–
Figure 1. Switching Behavior of Latches. On the horizontal axis, the B+ direction indicates increasing south polarity magnetic field strength, and the
B– direction indicates decreasing south polarity field strength (including the case of increasing north polarity). This behavior can be exhibited when
using a circuit such as that shown in Panel B.
Extensive applications information for Hall-effect sensors is
available in:
• Hall-Effect IC Applications Guide, Application Note 27701
• Hall-Effect Devices: Gluing, Potting, Encapsulating, Lead Welding and Lead Forming, Application Note 27703.1
• Soldering Methods for Allegro’s Products – SMT and Through-Hole, Application Note 26009
All are provided in Allegro Electronic Data Book, AMS-702,
and the Allegro Web site, www.allegromicro.com.
1
V
CC
V
OUT
2
3
t
PO(max)
Output Sampled
5 4
t
t
Figure 2. Continuous-Time Application, B < BRP.. This figure illustrates the use of a quick cycle for chopping VCC in order to conserve battery power.
Position 1, power is applied to the device. Position 2, the output assumes the correct state at a time prior to the maximum Power-On Time, t
The case shown is where the correct output state is HIGH
. Position 3, t
has elapsed. The device output is valid. Position 4, after the output is
PO(max)
PO(max)
.
valid, a control unit reads the output. Position 5, power is removed from the device.
The device must be operated below the maximum junction
temperature of the device, T
peak conditions, reliable operation may require derating supplied power or improving the heat dissipation properties of the
application. This section presents a procedure for correlating
factors affecting operating TJ. (Thermal data is also available on
the Allegro MicroSystems Web site.)
The Package Thermal Resistance, R
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity,
K, of the printed circuit board, including adjacent devices and
traces. Radiation from the die through the device case, R
relatively small component of R
TA, and air motion are significant external factors, damped by
overmolding.
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD.
PD = VIN × I
∆T = PD × R
. Under certain combinations of
J(max)
, is a figure of merit sum-
θJA
. Ambient air temperature,
θJA
IN
(2)
θJA
(1)
θJC
, is
Example: Reliability for VCC at TA = 150°C, package UA, using
minimum-K PCB.
Observe the worst-case ratings for the device, specifically:
R
165°C/W, T
θJA =
I
CC(max) =
7.5 mA.
Calculate the maximum allowable power level, P
J(max) =
165°C, V
CC(max) =
24 V, and
D(max)
. First,
invert equation 3:
∆T
max
= T
– TA = 165 °C – 150 °C = 15 °C
J(max)
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
P
D(max)
= ∆T
max
÷ R
= 15°C ÷ 165 °C/W = 91 mW
θJA
Finally, invert equation 1 with respect to voltage:
V
CC(est)
= P
D(max)
÷ I
= 91 mW ÷ 7.5 mA = 12.1 V
CC(max)
The result indicates that, at TA, the application and device can
dissipate adequate amounts of heat at voltages ≤V
Compare V
able operation between V
R
. If V
θJA
V
is reliable under these conditions.
CC(max)
CC(est)
CC(est)
to V
≥ V
. If V
CC(max)
CC(est)
CC(max)
CC(est)
and V
CC(max)
, then operation between V
≤ V
CC(max)
requires enhanced
.
CC(est)
, then reli-
CC(est)
and
TJ = TA + ∆T (3)
For example, given common conditions such as: T
V
= 12 V, I
CC
P
= VCC × I
D
∆T = PD × R
= 4 mA, and R
CC
= 12 V × 4 mA = 48 mW
CC
= 48 mW × 140 °C/W = 7°C
θJA
θJA
= 140 °C/W, then:
TJ = TA + ∆T = 25°C + 7°C = 32°C
A worst-case estimate, P
able power level (V
at a selected R
The products described herein are manufactured under one or more of
the following U.S. patents: 5,045,920; 5,264,783; 5,442,283; 5,389,889;
5,581,179; 5,517,112; 5,619,137; 5,621,319; 5,650,719; 5,686,894;
5,694,038; 5,729,130; 5,917,320; and other patents pending.
Allegro MicroSystems, Inc. reserves the right to make, from time to
time, such de par tures from the detail spec i fi ca tions as may be required
to permit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to
verify that the information being relied upon is current.
Allegro products are not authorized for use as critical components in
life-support devices or sys tems without express written approval.
The in for ma tion in clud ed herein is believed to be ac cu rate and reliable.
How ev er, Allegro MicroSystems, Inc. assumes no re spon si bil i ty for its
use; nor for any in fringe ment of patents or other rights of third parties
which may result from its use.