The A1185 and A1186 are ultrasensitive, two-wire, unipolar
Hall effect switches. The operate point, BOP, can be fieldprogrammed, after final packaging of the sensor and
placement into the application. This advanced feature allows
the optimization of the sensor switching performance, by
effectively accounting for variations caused by mounting
tolerances for the device and the target magnet.
This family of devices are produced on the Allegro
MicroSystems new DABIC5 BiCMOS wafer fabrication
process, which implements a patented, high-frequency, chopperstabilization technique that achieves magnetic stability and
eliminates the offsets that are inherent in single-element devices
exposed to harsh application environments. Commonly found
in a number of automotive applications, the A1185 and A1186
devices are utilized to sense: seat track position, seat belt buckle
presence, hood/trunk latching, and shift selector position.
Two-wire unipolar switches are particularly advantageous
in price-sensitive applications, because they require one less
wire than the more traditional open-collector output switches.
Not to scale
V+
VCC
0.01 uF
Continued on the next page…
Functional Block Diagram
Program/Lock
Dynamic Offset
Cancellation
Programming
Logic
Clock/Logic
Amp
Offset
Adjust
Low-Pass
Filter
Sample and Hold
Regulator
To all
subcircuits
GND
Package UA Only
GND
A1185-DS, Rev. 2
Page 2
A1185 and
Ultrasensitive T wo-Wire Field-Programmable
A1186
Chopper-Stabilized Unipolar Hall Effect Switches
Description (continued)
Additionally, the system designer gains inherent diagnostics
because output current normally flows in either of two narrowlyspecified ranges. This provides distinct current ranges for I
and I
. Any output current level outside of these two ranges
OUT(L)
OUT(H)
is a fault condition.
Other features of the A1185 and A1186 devices include on-chip
transient protection and a Zener clamp on the power supply to protect
against overvoltage conditions on the supply line.
present. The A1185 has an inverted output current level: switching
LOW in the presence of a south polarity magnetic field of sufficient
strength, and HIGH otherwise.
Both devices are offered in two package styles: LH, a SOT-23W
miniature low-profile package for surface-mount applications, and
UA, a three-lead ultramini Single Inline Package (SIP) for throughhole mounting. Each package is available in a lead (Pb) free version
(suffix, –T) with 100% matte tin plated leadframe.
The output current of the A1186 switches
a south polarity magnetic field of sufficient strength; and switches
LOW otherwise, including when there is no significant magnetic field
HIGH in the presence of
Factory-programmed versions are also available. Refer to: A1145
and A1146.
Selection Guide
Part NumberPb-free
A1185ELHLT-TYes7-in. reel, 3000 pieces/reelSurface mount
A1185EUA-TYesBulk, 500 pieces/bag4-pin SIP through hole
A1185LLHLT-TYes7-in. reel, 3000 pieces/reelSurface mount
A1185LUA-TYesBulk, 500 pieces/bag4-pin SIP through hole
A1186ELHLT-TYes7-in. reel, 3000 pieces/reelSurface mount
A1186EUA-TYesBulk, 500 pieces/bag4-pin SIP through hole
A1186LLHLT-TYes7-in. reel, 3000 pieces/reelSurface mount
A1186LUA-TYesBulk, 500 pieces/bag4-pin SIP through hole
1
Pb-based variants are being phased out of the product line. Certain variants cited in this footnote are in production but have been determined to be NOT FOR NEW
DESIGN. This classification indicates that sale of this device is currently restricted to existing customer applications. The device should not be purchased for new design
applications because obsolescence in the near future is probable. Samples are no longer available. Status change: May 1, 2006. These variants include: A1185ELHLT,
A1185EUA, A1185LLHLT, A1185LUA, A1186ELHLT, A1186EUA, A1186LLHLT, and A1186LUA.
2
Contact Allegro for additional packing options.
3
South (+) magnetic fields must be of sufficient strength.
field at the Hall sensor exceeds the operate point threshold, BOP.
When the magnetic field is reduced to below the release point
threshold, BRP, the device output goes high. The differences
between the magnetic operate and release point is called the
, of the A1185 switches low after the magnetic
CC
hysteresis of the device, B
. This built-in hysteresis allows
HYS
clean switching of the output even in the presence of external
mechanical vibration and electrical noise. The A1186 device
switches with opposite polarity for similar B
and BRP values,
OP
in comparison to the A1185 (see figure 1).
I
I+
CC
Switch to Low
Switch to High
0
B–
B
RP
B
HYS
B
OP
B+
I
CC(H)
I
CC(L)
(A) A1185
Figure 1. Alternative switching behaviors are available in the A118x device family. On the horizontal axis, the B+ direction indicates
increasing south polarity magnetic field strength, and the B– direction indicates decreasing south polarity field strength (including the
case of increasing north polarity).
A limiting factor for switchpoint accuracy when using Hall
effect technology is the small signal voltage developed across
the Hall element. This voltage is proportionally small relative to
the offset that can be produced at the output of the Hall sensor
device. This makes it difficult to process the signal and maintain
an accurate, reliable output over the specified temperature and
voltage range.
Chopper stabilization is a unique approach used to minimize
Hall offset on the chip. The Allegro patented technique, dynamic
quadrature offset cancellation, removes key sources of the output
drift induced by temperature and package stress. This offset
reduction technique is based on a signal modulation-demodulation process. The undesired offset signal is separated from the
magnetically induced signal in the frequency domain through
modulation. The subsequent demodulation acts as a modulation
process for the offset causing the magnetically induced signal
to recover its original spectrum at base band while the dc offset
becomes a high frequency signal. Then, using a low-pass filter,
the signal passes while the modulated dc offset is suppressed.
The chopper stabilization technique uses a 200 kHz high frequency clock. For demodulation process, a sample-and-hold
technique is used, where the sampling is performed at twice
the chopper frequency (400KHz). The sampling demodulation
process produces higher accuracy and faster signal processing
capability. Using this chopper stabilization approach, the chip is
desensitized to the effects of temperature and stress. This technique produces devices that have an extremely stable quiescent
Hall output voltage, is immune to thermal stress, and has precise
recoverability after temperature cycling. This technique is made
possible through the use of a BiCMOS process which allows the
use of low-offset and low-noise amplifiers in combination with
high-density logic integration and sample-and-hold circuits.
The repeatability of switching with a magnetic field is slightly
affected using a chopper technique. The Allegro high frequency
chopping approach minimizes the affect of jitter and makes it
imperceptible in most applications. Applications that may notice
the degradation are those that require the precise sensing of alternating magnetic fields such as ring magnet speed sensing. For
those applications, Allegro recommends the “low jitter” family
of digital sensors.
For additional general application information, visit the Allegro
Web site at www. allegromicro.com.
Typical Application and Programming Circuit
The A118x family of devices MUST be protected by an external bypass capacitor, C
VCC, and the ground pin, GND, of the device. C
both external noise and the noise generated by the chopper-stabilization function. As shown in figure 3, a 0.01 μF capacitor
is typical. (For programming the device, a 0.1 μF capacitor is
recommended for proper fuse blowing.)
Installation of C
BYP
it to the A118x pins are no greater than 5 mm in length. (For
programming the device, the capacitor may be further away from
the device, including mounting on the board used for programming the device.)
C
serves only to protect the A118x internal circuitry. All
BYP
high-frequency interferences conducted along the supply lines
, connected between the supply pin,
BYP
reduces
BYP
must ensure that the traces that connect
are passed directly to the load through C
. As a result, the
BYP
load ECU (electronic control unit) must have sufficient protection, other than C
A series resistor on the supply side, R
tion with C
BYP
When determining the minimum V
device, the voltage drops across R
, must be taken into consideration. The typical value for
R
SENSE
R
is approximately 100 Ω. (All programming, including
SENSE
, installed in parallel with the A118x.
BYP
(not shown), in combina-
S
, creates a filter for EMI pulses.
requirement of the A118x
CC
and the ECU sense resistor,
S
code and lock-bit programming, should be done with direct
connections to VCC and GND, with the use of a 0.1uF bypass
capacitor. Programming across the series resistor or sense resistor may not allow enough energy to properly blow the fuses
in the device, as required for proper programming. The result
would be incorrect switchpoints.
The device must be operated below the maximum junction
temperature of the device, T
. Under certain combinations of
J(max)
peak conditions, reliable operation may require derating supplied power or improving the heat dissipation properties of the
application. This section presents a procedure for correlating
factors affecting operating TJ. (Thermal data is also available on
the Allegro MicroSystems Web site.)
The Package Thermal Resistance, R
, is a figure of merit sum-
θJA
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity,
K, of the printed circuit board, including adjacent devices and
traces. Radiation from the die through the device case, R
relatively small component of R
. Ambient air temperature,
θJA
θJC
, is
TA, and air motion are significant external factors, damped by
overmolding.
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD.
PD = VIN × I
ΔT = PD × R
IN
(2)
θJA
(1)
Example: Reliability for V
at TA = 150°C, package UA, using
CC
minimum-K PCB.
Observe the worst-case ratings for the device, specifically:
R
165°C/W, T
θJA =
I
CC(max) = 17
mA.
Calculate the maximum allowable power level, P
J(max) =
165°C, V
CC(max) =
24 V, and
D(max)
. First,
invert equation 3:
ΔT
max
= T
– TA = 165 °C – 150 °C = 15 °C
J(max)
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
P
D(max)
= ΔT
max
÷ R
= 15°C ÷ 165 °C/W = 91 mW
θJA
Finally, invert equation 1 with respect to voltage:
V
CC(est)
= P
D(max)
÷ I
= 91 mW ÷ 17 mA = 5 V
CC(max)
The result indicates that, at TA, the application and device can
dissipate adequate amounts of heat at voltages ≤V
Compare V
able operation between V
R
. If V
θJA
V
is reliable under these conditions.
CC(max)
CC(est)
CC(est)
to V
≥ V
. If V
CC(max)
CC(est)
CC(max)
CC(est)
and V
CC(max)
, then operation between V
≤ V
CC(max)
requires enhanced
.
CC(est)
, then reli-
CC(est)
and
TJ = TA + ΔT (3)
For example, given common conditions such as: T
V
= 12 V, I
CC
P
= VCC × I
D
ΔT = PD × R
= 4 mA, and R
CC
= 12 V × 4 mA = 48 mW
CC
= 48 mW × 140 °C/W = 7°C
θJA
θJA
= 140 °C/W, then:
TJ = TA + ΔT = 25°C + 7°C = 32°C
A worst-case estimate, P
able power level (V
at a selected R
so, a coded series of voltage pulses through the VCC pin is used
to set bitfields in onboard registers. The effect on the device
output can be monitored, and the registers can be cleared and
set repeatedly until the required BOP is achieved. To make the
setting permanent, bitfield-level solid state fuses are blown, and
finally, a device-level fuse is blown, blocking any further coding. It is not necessary to program the release switchpoint, BRP ,
because the difference between BOP and BRP , referred to as the
hysteresis, B
The range of values between B
HYS
, is fixed.
OP(min)
and B
OP(max)
is scaled to
31 increments. The actual change in magnetic flux (G) represented by each increment is indicated by B
(see the Operating
RES
Characteristics table; however, testing is the only method for
verifying the resulting B
). For programming, the 31 incre-
OP
ments are individually identified using 5 data bits, which are
physically represented by 5 bitfields in the onboard registers.
By setting these bitfields, the corresponding calibration value is
programmed into the device.
Three voltage levels are used in programming the device: a low
voltage, V
, a minimum required to sustain register settings; a
PL
mid-level voltage, VPM , used to increment the address counter
in the device; and a high voltage, VPH , used to separate sets of
VPM pulses (when short in duration) and to blow fuses (when
long in duration). A fourth voltage level, essentially 0 V, is used
to clear the registers between pulse sequences. The pulse values
are shown in the Programming Protocol Characteristics table and
in figure 4.
V+
V
PH
V
PM
V
PL
T
0
T
d(1)
Figure 4. Pulse amplitudes and durations
d(P)
T
d(0)
t
Additional information on device programming and programming products is available on www. allegromicro.com. Programming hardware is available for purchase, and programming
software is available free of charge.
Code Programming. Each bitfield must be individually set. To
do so, a pulse sequence must be transmitted for each bitfield that
is being set to 1. If more than one bitfield is being set to 1, all
pulse sequences must be sent, one after the other, without allowing VCC to fall to zero (which clears the registers).
The same pulse sequence is used to provisionally set bitfields as
is used to permanently set bitfield-level fuses. The only difference is that when provisionally setting bitfields, no fuse-blowing
pulse is sent at the end of the pulse sequence.
PROGRAMMING PROTOCOL CHARACTERISTICS, over operating temperature range, unless otherwise noted
The pulse sequences consist of the following groups of pulses:
1. An enable sequence.
2. A bitfield address sequence.
3. When permanently setting the bitfield, a long V
fuse-blow-
PH
ing pulse. (Note: Blown bit fuses cannot be reset.)
4. When permanently setting the bitfield, the level of VCC must
be allowed to drop to zero between each pulse sequence, in
order to clear all registers. However, when provisionally setting bitfields, V
must be maintained at VPL between pulse
CC
sequences, in order to maintain the prior bitfield settings while
preparing to set additional bitfields.
Bitfields that are not set are evaluated as zeros. The bitfield-level
fuses for 0 value bitfields are never blown. This prevents inad-
V+
V
PH
vertently setting the bitfield to 1. Instead, blowing the devicelevel fuse protects the 0 bitfields from being accidentally set in
the future.
When provisionally trying the calibration value, one pulse
sequence is used, using decimal values. The sequence for setting
the value 5
is shown in figure 5.
10
When permanently setting values, the bitfields must be set individually, and 510 must be programmed as binary 101. Bit 3 is
set to 1 (0001002, which is 410), then bit 1 is set to 1 (0000012,
which is 1
). Bit 2 is ignored, and so remains 0.Two pulse
10
sequences for permanently setting the calibration value 5 are
shown in figure 6. The final V
pulse is maintained for a longer
PH
period, enough to blow the corresponding bitfield-level fuse.
V
PM
V
PL
0
EnableAddressClear
Try 5
10
Figure 5. Pulse sequence to provisionally try calibration value 5.
V+
V
PH
V
PM
V
PL
0
Enable
Figure 6. Pulse sequence to permanently encode calibration value 5 (101 binary, or
Enabling Addressing Mode. The first segment of code is a
keying sequence used to enable the bitfield addressing mode. As
shown in figure 7, this segment consists of one short VPH pulse,
one VPM pulse, and one short VPH pulse, with no supply interruptions. This sequence is designed to prevent the device from
being programmed accidentally, such as by noise on the supply
line.
Address Selection. After addressing mode is enabled, the
target bitfield address, is indicated by a series of VPM pulses, as
shown in figure 8.
V+
V
PH
V
PM
V
PL
0
t
Figure 7. Addressing mode enable pulse sequence
V+
V
PH
V
PM
V
PL
Address 1
Address 2
Address n ( ≤ 127)
Lock Bit Programming. After the desired B
calibration value
OP
is programmed, and all of the corresponding bitfield-level fuses
are blown, the device-level fuse should be blown. To do so, the
lock bit (bitfield address 32) should be encoded as 1 and have
its fuse blown. This is done in the same manner as permanently
setting the other bitfields, as shown in figure 9.
Preliminary dimensions, for reference only
Dimensions in millimeters
U.S. Customary dimensions (in.) in brackets, for reference only
(reference JEDEC TO-236 AB, except case width and terminal tip-to-tip)
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
Hall element (not to scale)
Active Area Depth 0.28 [.011]
Dimensions in inches
Metric dimensions (mm) in brackets, for reference only
A
Dambar removal protrusion (6X)
B
Ejector mark on opposite side
C
Active Area Depth .0195 [0.50] NOM
D
Hall element (not to scale)
The products described herein are manufactured under one or more of the following U.S. patents: 5,045,920; 5,264,783; 5,442,283; 5,389,889;
5,581,179; 5,517,112; 5,619,137; 5,621,319; 5,650,719; 5,686,894; 5,694,038; 5,729,130; 5,917,320; and other patents pending.
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to
permit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro products are not authorized for use as critical components in life-support devices or sys tems without express written approval.
The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, Allegro MicroSystems, Inc. assumes no re spon si bil i ty for its