Datasheet 8 pin mosfet data Datasheet

TC1411/TC1411N

1A High-Speed MOSFET Drivers

Features

• Latch-Up Protected: Will Withstand 500 mA Reverse Current

• Input Will Withstand Negative Inputs Up to 5V

• ESD Protected: 4 kV

• High Peak Output Current: 1A

• Wide Input Supply Voltage Operating Range:

- 4.5V to 16V

• High Capacitive Load Drive Capability:

- 1000 pF in 25 nsec

• Short Delay Time: 30 nsec Typ.

• Matched Delay Times

• Low Supply Current

- With Logic ‘1’ Input: 500 µA

- With Logic ‘0’ Input: 100 µA

• Low Output Impedance: 8Ω

• Available in Space-Saving 8-pin MSOP Package

• Pinout Same as TC1410/TC1412/TC1413

Applications

• Switch Mode Power Supplies

• Pulse Transformer Drive

• Line Drivers

• Relay Driver

Description

The TC1411/TC1411N are 1A CMOS buffers/drivers. They will not latch-up under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking of either polarity occurs on the ground pin. They can accept, without damage or logic upset, up to 500 mA of current of either polarity being forced back into their output. All terminals are fully protected against up to 4 kV of electrostatic discharge.

As MOSFET drivers, the TC1411/TC1411N can easily charge a 1000 pF gate capacitance in 25 nsec with matched rise and fall times, and provide low enough impedance in both the ON and the OFF states to ensure the MOSFET’s intended state will not be affected, even by large transients. The leading and trailing edge propagation delay times are also matched to allow driving short-duration inputs with greater accuracy.

Package Types

8-Pin MSOP/PDIP/SOIC

V

DD

NC

GND

1

2

IN

TC1411

3

4

8

7

6

5

DD

OUT

GND

V

1

DD

IN

2

TC1411N

NC

3

GND

45

8

7

6

V

DD

OUT

GND

2

Inverting

NC = No Internal Connection

6,7

2

Non-Inverting

6,7

Note: Duplicate pins must be connected

together for proper operation.

TC1411/TC1411N

Functional Block Diagram

300 mV

TC1411

Inverting Outputs

V

DD

Output

Input

Effective

Input C = 10 pF

GND

4.7V

Non-Inverting

Outputs

TC1411N

TC1411/TC1411N

1.0 ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

Supply Voltage .....................................................+20V

Input Voltage ......................V

Power Dissipation (T

≤ 70°C)

A

+ 0.3V to GND – 5.0V

DD

† Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.

MSOP..........................................................340 mW

PDIP ............................................................730 mW

SOIC............................................................ 470 mW

Storage Temperature Range .............. -65°C to +150°C

Maximum Junction Temperature...................... +150°C

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V.

Typical values are measured at TA = +25°C, VDD = 16V.

Parameters Sym Min Typ Max Units Conditions

Input

Logic ‘1’, High Input Voltage V

Logic ‘0’, Low Input Voltage V

Input Current I

IH

IL

IN

Output

High Output Voltage V

Low Output Voltage V

Output Resistance R

Peak Output Current I

Latch-Up Protection

I

REV

OH

OL

O

PK

Withstand Reverse Current

Switching Time (Note 1)

Rise Time t

Fall Time t

Delay Time t

R

F

D1

D2

Power Supply

Power Supply Current I

S

Note 1: Switching times ensured by design.

2.0 — — V

——0.8V

-1.0 — 1.0 µA 0V ≤ VIN ≤ V

-10 — 10 -40°C ≤ T

A

= +25°C

DD, TA

≤ +85°C

VDD – 0.025 — — V DC Test

— — 0.025 V DC Test

—811Ω VDD = 16V, IO = 10 mA, TA = +25°C

—1014 0°C ≤ TA ≤ +70°C

— 10 14 -40°C ≤ T

—1.0—AV

DD

= 16V

≤ +85°C

A

— 0.5 — A Duty cycle ≤ 2%, t ≤ 300 µs,

VDD = 16V

—2535nsT

—2740 0°C ≤ T

— 29 40 -40°C ≤ T

—2535nsT

—2740 0°C ≤ T

— 29 40 -40°C ≤ T

—3040nsT

—3345 0°C ≤ T

— 35 45 -40°C ≤ T

—3040nsT

—3345 0°C ≤ T

= +25°C

A

= +25°C

A

= +25°C,

A

= +25°C

A

≤ +70°C

A

≤ +85°C, Figure 4-1

A

≤ +70°C

A

≤ +85°C, Figure 4-1

A

≤ +70°C

A

≤ +85°C, Figure 4-1

A

≤ +70°C

A

— 35 45 -40°C ≤ TA ≤ +85°C, Figure 4-1

—0.51.0mAV

= 3V, VDD = 16V

IN

— 0.1 0.15 VIN = 0V

TC1411/TC1411N

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 16V.

Parameters Sym Min Typ Max Units Conditions

Temperature Ranges

Specified Temperature Range (C) T

Specified Temperature Range (E) T

Specified Temperature Range (V) T

Maximum Junction Temperature T

Storage Temperature Range T

Package Thermal Resistances

Thermal Resistance, 8L-MSOP θ

Thermal Resistance, 8L-PDIP θ

Thermal Resistance, 8L-SOIC θ

A

J

A

JA

0—+70ºC

-40 — +85 ºC

-40 — +125 ºC

——+150ºC

-65 — +150 ºC

—206—ºC/W

—125—ºC/W

—155—ºC/W

TC1411/TC1411N

2.0 TYPICAL PERFORMANCE CURVES

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.

500

TA = +25°C

400

VIN = 3V

300

(µA)

200

SUPPLY

I

100

0

VDD (V)

VIN = 0V

FIGURE 2-1: Quiescent Supply Current vs. Supply Voltage.

1.6

TA = +25°C

1.5

(V)

1.4

1.3

THRESHOLD

V

1.2

V

IH

V

IL

500

400

300

(µA)

200

SUPPLY

I

100

16141210864

VIN = 3V

= 0V

V

IN

0

-40 -20 0 20 40 60 80

TEMPERATURE (°C)

V

SUPPLY

= 16V

FIGURE 2-4: Quiescent Supply Current vs. Temperature.

1.6

V

= 16V

SUPPLY

1.5

(V)

1.4

1.3

THRESHOLD

V

1.2

V

IL

V

IH

1.1

(V)

V

DD

16141210864

FIGURE 2-2: Input Threshold vs. Supply Voltage.

25

= +85°C

T

20

15

(Ohms)

10

DS-ON

R

A

= +25°C

T

A

°C

= -40

T

A

5

0

VDD (V)

16141210864

FIGURE 2-3: High-State Output Resistance vs. Supply Voltage.

1.1

-40

-20 0 20 40 60 80

TEMPERATURE (°C)

FIGURE 2-5: Input Threshold vs. Temperature.

25

20

= +85°C

T

A

15

(Ohms)

10

DS-ON

R

5

0

= +25°C

T

A

T

A

= -40°C

VDD (V)

FIGURE 2-6: Low-State Output Resistance vs. Supply Voltage.

16141210864

TC1411/TC1411N

Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.

100

80

60

(nsec)

40

RISE

t

20

0

C

LOAD

= 1000 pF

= +85°C

T

A

= +25°C

T

A

VDD (V)

T

A

= -40°C

FIGURE 2-7: Rise Time vs. Supply Voltage.

100

(nsec)

D1

t

80

60

40

20

C

LOAD

= 1000 pF

= -40°C

T

A

= +85°C

T

A

= +25°C

T

A

100

80

60

(nsec)

40

FALL

t

20

16141210864

= 1000 pF

C

LOAD

= +85°C

T

A

= +25°C

T

A

°C

= -40

T

A

0

VDD (V)

16141210864

FIGURE 2-10: Fall Time vs. Supply Voltage.

100

80

60

(nsec)

D2

40

t

20

C

LOAD

= 1000 pF

= +85°C

T

A

= +25°C

T

A

T

A

= -40°C

0

VDD (V)

FIGURE 2-8: Propagation Delay vs. Supply Voltage.

100

= +25°C

T

A

= 16V

V

DD

80

60

(nsec)

FALL

, t

40

RISE

t

20

0

0 500 1000 1500 2000 2500 3000 3500

C

(pF)

LOAD

t

RISE

t

FALL

FIGURE 2-9: Rise and Fall Times vs. Capacitive Load.

16141210864

0

VDD (V)

16141210864

FIGURE 2-11: Propagation Delay vs. Supply Voltage.

36

= +25°C

T

A

= 16V

V

DD

34

32

30

28

Propagation Delays (nsec)

26

0 500 1000 1500 2000 2500 3000 3500

C

(pF)

LOAD

t

D2

t

D1

FIGURE 2-12: Propagation Delays vs. Capacitive Load.

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

TC1411/TC1411N

Pin No.

1V

2

3 NC No connection

4 GND Ground

5 GND Ground

6 OUTPUT CMOS push-pull output, common to pin 7

7 OUTPUT CMOS push-pull output, common to pin 6

8V

Symbol Description

DD

INPUT Control input

DD

Supply input, 4.5V to 16V

3.1 Supply Input (VDD)

The VDD input is the bias supply for the MOSFET driver and is rated for 4.5V to 16V with respect to the ground pin. The VDD input should be bypassed to ground with a local ceramic capacitor. The value of the capacitor should be chosen based on the capacitive load that is being driven. A value of 1.0 µF is suggested.

3.2 Control Input (INPUT)

The MOSFET driver input is a high-impedance, TTL/CMOS-compatible input. The input has 300 mV of hysteresis between the high and low thresholds that prevents output glitching even when the rise and fall time of the input signal is very slow.

3.3 CMOS Push-pull Output (OUTPUT)

The MOSFET driver output is a low impedance, CMOS push-pull style output, capable of driving a capacitive load with 1A peak currents.

3.4 Ground (GND)

The ground pins are the return path for the bias current and for the high peak currents which discharge the load capacitor. The ground pins should be tied into a ground plane or have very short traces to the bias supply source return.

3.5 No Connect (NC)

No internal connection.

TC1411/TC1411N

4.0 APPLICATION INFORMATION

Input

V

DD

1, 8

2

TC1411

TC1411N

Input: 100 kHz,

square wave,

t

= t

RISE

= 16V

FALL

4.7 µF

4, 5

≤ 10 nsec

6, 7

0.1 µF

Output

CL = 1000 pF

+5V

Input

0V

V

DD

Output

0V

+5V

Input

0V

V

DD

Output

0V

10%

t

D1

t

F

90%

10%

Inverting Driver

TC1411

90%

t

D1

10%

t

R

Non-Inverting Driver

TC1411N

t

D2

90%

t

D2

90%

t

10%

R

10%

90%

t

F

FIGURE 4-1: Switching Time Test Circuit.

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

TC1411/TC1411N

8-Lead MSOP

XXXXXXX

YWWNNN

8-Lead PDIP (300 mil)

XXXXXXXX XXXXXNNN

YYWW

8-Lead SOIC (150 mil)

XXXXXXXX XXXXYYWW

NNN

Example:

1411NE

635256

Example:

TC1411

CPA^^256

Example:

TC1411C

3

e

OA^^0635

3

e

0635

256

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code

3

e

Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available characters for customer-specific information.

3

e

TC1411/TC1411N

8-Lead Plastic Micro Small Outline Package (UA) (MSOP)

Note: For the most current package drawings, please

see the Microchip Packaging Specification located at http://www.microchip.com/packaging

E

E1

p

D

2

n1

B

α

c

F

β

Units

Dimension Limits

Number of Pins

Pitch

Overall Height

Molded Package Thickness

Standoff

Overall Width

Molded Package Width

Overall Length

Foot Length

Foot Angle

Lead Thickness

Lead Width

Mold Draft Angle Top

Mold Draft Angle Bottom

*

Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

See ASME Y14.5M

REF: Reference Dimension, usually without tolerance, for information purposes only.

See ASME Y14.5M JEDEC Equivalent: MO-187 Drawing No. C04-111

n

p

A

A2

A1

E

E1

D

L

φ

c

B

α

β

MIN

.030

.000

.016 .024

0° - 8°

.003

.009

5°

5° -

L

INCHES

NOM

.026 BSC

.193 BSC

.118 BSC

.037 REFFFootprint (Reference)

φ

8

--

.033

--

.006

.012

-

A

A1

MILLIMETERS

MAX NOM

.043

.037

.006

.031

.009

.016

15°

MIN

0.65 BSC

-

0.75

0.00

4.90 BSC

3.00 BSC

0.40

0.95 REF

0°

0.08

0.22

*

8

-

0.85

0.60

-

Revised 07-21-05

A2

MAX

1.10

0.95

0.15

0.80

8°

0.23

0.40

15°5° -

8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)

Note: For the most current package drawings, please

E1

D

2

TC1411/TC1411N

see the Microchip Packaging Specification located at http://www.microchip.com/packaging

n

E

β

eB

Dimension Limits MIN NOM MAX MIN NOM MAX Number of Pins Pitch Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32 Molded Package Thickness Base to Seating Plane A1 .015 0.38 Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26 Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60 Overall Length D .360 .373 .385 9.14 9.46 9.78 Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43 Lead Thickness Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78 Lower Lead Width B .014 .018 .022 0.36 0.46 0.56 Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92 Mold Draft Angle Top Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018

1

α

A

c

Units INCHES* MILLIMETERS

n p

A2

c

α

β

.115 .130 .145 2.92 3.30 3.68

.008 .012 .015 0.20 0.29 0.38

A1

B1

B

88

.100 2.54

51015 51015 51015 51015

A2

L

p

TC1411/TC1411N

8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)

Note: For the most current package drawings, please

see the Microchip Packaging Specification located at http://www.microchip.com/packaging

E

E1

p

D

2

B

Number of Pins Pitch

Molded Package Width

Foot Angle Lead Thickness

Mold Draft Angle Top Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012

Drawing No. C04-057

n

45°

c

β

n p

E1

φ

c

α

β

1

h

A

φ

L

048048

A1

MILLIMETERSINCHES*Units

.050

α

A2

MAXNOMMINMAXNOMMINDimension Limits

88

1.27

1.751.551.35.069.061.053AOverall Height

1.551.421.32.061.056.052A2Molded Package Thickness

0.250.180.10.010.007.004A1Standoff §

6.206.025.79.244.237.228EOverall Width

3.993.913.71.157.154.146

5.004.904.80.197.193.189DOverall Length

0.510.380.25.020.015.010hChamfer Distance

0.760.620.48.030.025.019LFoot Length

0.250.230.20.010.009.008

0.510.420.33.020.017.013BLead Width 1512015120 1512015120

APPENDIX A: REVISION HISTORY

Revision D (September 2006)

• Added -40°C to +125°C temperature range to Temperature Characteristics table and Product Information System page.

• Added disclaimer to package outline drawings.

Revision C (March 2003)

• Added 8-Lead MSOP Package.

Revision B (May 2002)

• Converted TELCOM data sheet for Embedded Control Handbook

Revision A (March 2001)

• Original Release of this Document.

TC1411/TC1411N

NOTES:

TC1411/TC1411N

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X /XX

Device

PackageTemperature

Range

Device: TC1411: 1 A Single MOSFET Driver, Inverting

Temperature Range: C = 0°C to +70°C

Package: OA = Plastic SOIC, (150 mil Body), 8-lead

TC1411N: 1 A Single MOSFET Driver, Non-Inverting

E = -40°C to +85°C V = -40°C to +125°C

OA713 = Plastic SOIC, (150 mil Body), 8-lead

UA = Plastic Micro Small Outline (MSOP), 8-lead * UA713 = Plastic Micro Small Outline (MSOP), 8-lead *

PA = Plastic DIP (300 mil Body), 8-lead

* MSOP package is only available in E-Temp.

(Tape and Reel)

Examples:

a) TC1411COA: 1A Single MOSFET driver,

b) TC1411CPA: 1A Single MOSFET driver,

c) TC1411EUA713: Tape and Reel,

d) TC1411VOA713: Tape and Reel,

a) TC1411NCPA: 1A Single MOSFET driver,

b) TC1411NEPA: 1A Single MOSFET driver,

c) TC1411NEUA: 1A Single MOSFET driver,

d) TC1411NVPA: 1A Single MOSFET driver,

8LD SOIC pkg, 0°C to +70°C.

8LD PDIP package, 0°C to +70°C.

1A Single MOSFET driver, 8LD MSOP package,

-40°C to +85°C.

1A Single MOSFET driver, 8LD SOIC pkg,

-40°C to +125°C.

8LD PDIP package, 0°C to +70°C.

8LD PDIP package,

-40°C to +85°C.

8LD MSOP package,

-40°C to +85°C.

8LD PDIP package,

-40°C to +125°C

TC1411/TC1411N

NOTES:

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defend, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip intellectual property rights.

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EELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

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All other trademarks mentioned herein are property of their respective companies.

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®

8-bit MCUs, KEELOQ

®

code hopping devices, Serial

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Tel: 86-10-8528-2100 Fax: 86-10-8528-2104

China - Chengdu

Tel: 86-28-8665-5511 Fax: 86-28-8665-7889

China - Fuzhou

Tel: 86-591-8750-3506 Fax: 86-591-8750-3521

China - Hong Kong SAR

Tel: 852-2401-1200 Fax: 852-2401-3431

China - Qingdao

Tel: 86-532-8502-7355 Fax: 86-532-8502-7205

China - Shanghai

Tel: 86-21-5407-5533 Fax: 86-21-5407-5066

China - Shenyang

Tel: 86-24-2334-2829 Fax: 86-24-2334-2393

China - Shenzhen

Tel: 86-755-8203-2660 Fax: 86-755-8203-1760

China - Shunde

Tel: 86-757-2839-5507 Fax: 86-757-2839-5571

China - Wuhan

Tel: 86-27-5980-5300 Fax: 86-27-5980-5118

China - Xian

Tel: 86-29-8833-7250 Fax: 86-29-8833-7256

ASIA/PACIFIC

India - Bangalore

Tel: 91-80-4182-8400 Fax: 91-80-4182-8422

India - New Delhi

Tel: 91-11-4160-8631 Fax: 91-11-4160-8632

India - Pune

Tel: 91-20-2566-1512 Fax: 91-20-2566-1513

Japan - Yokohama

Tel: 81-45-471- 6166 Fax: 81-45-471-6122

Korea - Gumi

Tel: 82-54-473-4301 Fax: 82-54-473-4302

Korea - Seoul

Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934

Malaysia - Penang

Tel: 60-4-646-8870 Fax: 60-4-646-5086

Philippines - Manila

Tel: 63-2-634-9065 Fax: 63-2-634-9069

Singapore

Tel: 65-6334-8870 Fax: 65-6334-8850

Taiwan - Hsin Chu

Tel: 886-3-572-9526 Fax: 886-3-572-6459

Taiwan - Kaohsiung

Tel: 886-7-536-4818 Fax: 886-7-536-4803

Taiwan - Taipei

Tel: 886-2-2500-6610 Fax: 886-2-2508-0102

Thailand - Bangkok

Tel: 66-2-694-1351 Fax: 66-2-694-1350

EUROPE

Austria - Wels

Tel: 43-7242-2244-3910 Fax: 43-7242-2244-393

Denmark - Copenhagen

Tel: 45-4450-2828 Fax: 45-4485-2829

France - Paris

Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79

Germany - Munich

Tel: 49-89-627-144-0 Fax: 49-89-627-144-44

Italy - Milan

Tel: 39-0331-742611 Fax: 39-0331-466781

Netherlands - Drunen

Tel: 31-416-690399 Fax: 31-416-690340

Spain - Madrid

Tel: 34-91-708-08-90 Fax: 34-91-708-08-91

UK - Wokingham

Tel: 44-118-921-5869 Fax: 44-118-921-5820

08/29/06