Product specification1995 Jan 20
IC20 Data Handbook
C
Page 2
Philips SemiconductorsProduct specification
Numb
Low voltage/low power single-chip
2
8-bit microcontroller with I
DESCRIPTION
The 80CL410/83CL410 (hereafter generically
referred to as 8XCL410) is manufactured in
an advanced CMOS process that allows the
part to operate at supply voltages down to
1.8V and oscillator frequencies down to DC.
The 8XCL410 has the same instruction set
as the 80C51.
The 8XCL410 features a 4k byte ROM
(83CL410), 128 bytes RAM (both ROM and
RAM are externally expandable to 64k
bytes), four 8-bit ports, two 16-bit
timer/counters, an I
thirteen source, two priority level nested
interrupt structure, and on-chip oscillator
circuitry suitable for quartz crystal, ceramic
resonator, RC, or LC.
The 8XCL410 has two reduced power modes
that are the same as those on the standard
80C51. The special reduced power feature of
this part is that it can be stopped and then
restarted. Running from an external clock
source, the clock can be stopped and after a
period of time restarted. The 8XCL410 will
resume operation from where it was when the
code stopped with no loss of internal state,
RAM contents, or Special Function Register
contents. If the internal oscillator is used the
part cannot be stopped and started, but the
power-down mode, which can be terminated
via an interrupt, can be used to achieve
similar power savings and then restart
without loss of on-chip RAM and Special
Function Register values.
2
C serial interface, a
C
FEA TURES
•Single supply voltage 1.8V to 6.0V
•Frequency from DC to 12MHz
•80C51 based architecture
– 4k × 8 ROM (64k external)
– 128 × 8 RAM (64k external)
– Four 8-bit I/O ports
– Two 16-bit timer/counters
– A thirteen-source, two-level, nested
priority interrupt structure
– 10 external interrupts
•Fully static 80C51 CPU
2
•I
C Serial Interface
•Two power control modes
– Idle mode
– Power-down mode – can be terminated
by reset or external interrupt
•Wake-up via external interrupts at port 1
•Single supply voltage 1.8V to 6.0V
•Frequency range of DC to 12MHz
•On-chip oscillator (quartz crystal, ceramic
resonator, RC, LC)
•Very low power consumption
•Operating temperature range:
–40 to +85°C
80CL410/83CL410
PIN CONFIGURATION
INT2/P1.0
INT3/P1.1
INT4/P1.2
INT5/P1.3
INT6/P1.4
INT7/P1.5
SCL/INT8/P1.6
SDA/INT9/P1.7
INT0
INT1/P3.3
SEE NEXT PAGE FOR QFP PIN FUNCTIONS.
/P3.2
T0/P3.4
T1/P3.5
/P3.6
WR
RD
XTAL2
XTAL1
V
1
11
1
2
3
4
5
6
7
8
9
RST
10
P3.0
11
P3.1
12
13
14
15
16
/P3.7
17
18
19
20
SS
4434
1222
DIP
VSO
QFP
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
V
DD
P0.0/AD0
P0.1/AD1
P0.2/AD2
P0.3/AD3
P0.4/AD4
P0.5/AD5
P0.6/AD6
P0.7/AD7
EA
ALE
PSEN
P2.7/A15
P2.6/A14
P2.5/A13
P2.4/A12
P2.3/A11
P2.2/A10
P2.1/A9
P2.0/A8
33
23
ORDERING CODE
PHILIPS PART ORDER NUMBER
PART MARKING
ROMlessROMROMlessROM
P80CL410HFPP83CL410HFPP80CL410HF N P83CL410HF N
P80CL410HFTP83CL410HFTP80CL410HF D P83CL410HF D
P83CL410HFH
NOTE:
1. Parts ordered by the Philips North America part number will be marked with the Philips part marking.
For emulation purposes, the P85CL000 (Piggyback version) with 256 bytes of RAM is recommended.
1–8I/OPort 1: Port 1 is an 8-bit bidirectional I/O port with internal pull-ups. Port 1 pins that
TYPENAME AND FUNCTION
operation.
to them float and can be used as high-impedance inputs. Port 0 is also the multiplexed
low-order address and data bus during accesses to external program and data
memory. In this application, it uses strong internal pull-ups when emitting 1s.
have 1s written to them are pulled high by the internal pull-ups and can be used as
inputs. As inputs, port 1 pins that are externally pulled low will source current because
of the internal pull-ups. (See DC Electrical Characteristics: I
include:
have 1s written to them are pulled high by the internal pull-ups and can be used as
inputs. As inputs, port 2 pins that are externally being pulled low will source current
because of the internal pull-ups. (See DC Electrical Characteristics: I
the high-order address byte during fetches from external program memory and during
accesses to external data memory that use 16-bit addresses (MOVX @DPTR). In this
application, it uses strong internal pull-ups when emitting 1s. During accesses to
external data memory that use 8-bit addresses (MOV @Ri), port 2 emits the contents
of the P2 special function register.
have 1s written to them are pulled high by the internal pull-ups and can be used as
inputs. As inputs, port 3 pins that are externally being pulled low will source current
because of the pull-ups. (See DC Electrical Characteristics: I
special features of the 80C51 family, as listed below:
the device. An internal diffused resistor to V
external capacitor to V
an access to external memory. In normal operation, ALE is emitted at a constant rate
of 1/6 the oscillator frequency, and can be used for external timing or clocking. Note
that one ALE pulse is skipped during each access to external data memory.
device is executing code from the external program memory, PSEN
each machine cycle, except that two PSEN
access to external data memory. PSEN
program memory.
fetch code from external program memory locations 0000H to 0FFFH. If EA
high, the device executes from internal program memory unless the program counter
contains an address greater than 0FFFH.
TMODTimer/counter mode89HGATEC/TM1M0GATEC/TM1M000H
TH0Timer 0 high byte8CH00H
TH1Timer 1 high byte8DH00H
TL0Timer 0 low byte8AH00H
TL1Timer 1 low byte8BH00H
* SFRs are bit addressable.
# SFRs are modified from or added to the 80C51 SFRs.
Serial data
Serial status
trol
DAH
D9H
8F8E8D8C8B8A8988
88HTF1TR1TF0TR0IE1IT1IE0IT000H
00H
11111000B
1995 Jan 20
6
Page 7
Philips SemiconductorsProduct specification
Low voltage/low power single-chip
2
8-bit microcontroller with I
PORT OPTIONS
The pins of port 1 (not P1.6/SCL or
P1.7/SDA), port 2, and port 3 may be
individually configured with one of the
following port options (see Figure 1):
Option 1: Standard Port—
quasi-bidirectional I/O with pull-up.
The strong booster pull-up p1 is
turned on for two oscillator periods
after a 0-to-1 transition in the port
latch. See Figure 1(a).
Option 2: Open Drain—quasi-bidirectional
I/O with n-channel open drain
output. Use as an output requires
the connection of an external
pull-up resistor. See Figure 1(b).
Option 3: Push-Pull—output with drive
capability in both polarities. Under
this option, pins can only be used
as outputs. See Figure 1(c).
The definition of port options for port 0 is
slightly different.
C
Two cases have to be examined. First,
accesses to external memory (EA
access above the built-in memory boundary),
and second, I/O accesses.
External Memory Accesses
Option 1: True 0 and 1 are written as
Option 2: An external pull-up resistor is
Option 3: Not allowed for external memory
I/O Accesses
Option 1: When writing a 1 to the port latch,
= 0 or
address to the external memory
(strong pull-up is used).
needed for external accesses.
accesses as the port can only be
used as output.
the strong pull-up p1 will be on for
two oscillator periods. No weak
pull-up exists. Without an external
pull-up, this option can be used as
a high-impedance input.
80CL410/83CL410
Option 2: Open drain—quasi-bidirectional
I/O with n-channel open drain
output. Use as an output requires
the connection of an external
pull-up resistor. See Figure 1(c).
Option 3: Push-Pull—output with drive
capability in both polarities. Under
this option, pins can only be used
as outputs.
Individual mask selection of the post-reset
state is available on any of the above pins.
Make your selection by appending “S” or “R”
to option 1, 2, or 3 above (e.g., 1S for a
standard I/O to be set after RESET or 2R for
an open-drain I/O to be reset after RESET.
Option S: Set—after reset, this pin will be
initialized High.
Option R: Reset—after reset, this pin will be
initialized Low.
(a)
(b)
(c)
FROM PORT LATCH
INPUT DATA
READ PORT PIN
FROM PORT LATCH
INPUT DATA
READ PORT PIN
STRONG PULL-UP
TWO OSCILLATOR PERIODS
P1
Q
INPUT
BUFFER
Q
INPUT
BUFFER
STRONG PULL-UP
N
N
+5V
P1
P2
I/O PIN
+5V
P3
I/O PIN
+5V
EXTERNAL
PULL-UP
I/O PIN
FROM PORT LATCH
1995 Jan 20
Q
N
Figure 1. Ports
7
Page 8
Philips SemiconductorsProduct specification
Low voltage/low power single-chip
2
8-bit microcontroller with I
POWER-DOWN MODE
The instruction setting PCON.1 is the last
executed prior to going into the power-down
mode. In power-down mode, the oscillator is
stopped. The contents of the the on-chip
RAM and SFRs are preserved. The port pins
output the values held by their respective
SFRs. ALE and PSEN
In the power-down mode, V
reduced to minimize power consumption.
However, the supply voltage must not be
reduced until the power-down mode is active,
and must be restored before the hardware
reset is applied and frees the oscillator. Reset
must be held active until the oscillator has
restarted and stabilized.
From the power-down mode the part can be
restarted by using either the wake-up mode
or the Reset Mode.
Wake-Up Mode
Setting both PD and IDL bits in the PCON
register forces the controller into the
power-down mode. Setting both bits enable
the controller to be woken-up from the
power-down mode via either an enabled
external interrupt INT2–INT9, or a reset
operation.
An external interrupt for an enabled interrupt
INT2–INT9 at port 1 starts both the oscillator
and the delay counter. To ensure that the
oscillator is stable before the controller
restarts, the internal clock will remain inactive
for 1536 oscillator periods after the interrupt
are held low.
may be
DD
C
is detected. This is controlled by the on-chip
delay counter. After this, the PD flag will be
reset, the controller is now in the Idle mode
and the interrupt will be handled in the normal
way.
Reset Mode
Setting only the PD bit in the PCON register
again forces the controller into the
power-down mode, but in this case it can
only be restored to normal operation with a
direct reset operation.
To restore normal operation, the RESET pin
has to be kept High for a minimum of 24
oscillator periods. The on-chip delay counter
is inactive. The user has to insure that the
oscillator is stable before any operation is
attempted. Figure 2 illustrates the two
possibilities for wake-up.
IDLE MODE
The instruction that sets PCON.0 is the last
instruction executed before going into idle
mode. In idle mode, the internal clock is
stopped for the CPU, but not for the interrupt,
timer, and serial port functions. The CPU
status is preserved along with the stack
pointer, program counter, program status
word and accumulator. The RAM and all
other registers maintain their data during idle
mode. The port pins retain the logical states
they held at idle mode activation. ALE and
PSEN
80CL410/83CL410
There are two methods used to terminate the
idle mode. Activation of any interrupt will
cause PCON to be cleared by hardware;
terminating idle mode. The interrupt is
serviced, and following the instruction RETI,
the next instruction to be executed will be the
one following the instruction that put the
device in the the idle mode.
Flag bits GF0 and GF1 can be used to
determine whether the interrupt was received
during normal execution or idle mode. For
example, the instruction that writes to
PCON.0 can also set or clear one or both flag
bits. When idle mode is terminated by an
interrupt, the service routine can examine the
status of the flag bits.
The second method of terminating the idle
mode is with an external hardware reset.
Since the oscillator is still running, the
hardware reset is required to be active for
only two machine cycles to complete the
reset operation. Reset redefines all SFRs,
but does not affect the state of the on-chip
RAM.
The status of the external pins during idle and
power-down mode is shown in Table 2. If the
power-down mode is activated while
accessing external memory, port data held in
the special function register P2 is restored to
port 2. If the data is a logic 1, the port pin is
held high during the power-down mode.
hold at the logic high level.
Table 2.External Pin Status During Idle and Power-Down Modes
C-bus consists of a data line (SDA)
and a clock line (SCL). These lines also
function as I/O port lines P1.7 and P1.6
respectively. The system is unique because
data transport, clock generation, address
recognition and bus control arbitration are all
controlled by hardware. The I
I/O has complete autonomy in byte handling
and operates in four modes:
– Master transmitter
These functions are controlled by the S1CON
register. S1STA is the status register whose
contents may also be used as a vector to
various service routines. S1DAT is the data
shift register and S1ADR the slave address
register. Slave address recognition is
performed by hardware.
S1CON (D8H)
Serial control register
CR2 ENS1 STA STOSIAACR1 CR0
CR0, CR1, CR2
These three bits determine the
serial clock frequency when SIO
is in a master mode.
2
C-bus serial
C
76 5 43 2 1 0
S1CON
76 5 43 2 1 0
S1STA
AAAssert acknowledge bit. When
SISIO interrupt flag. When the SI
SLAVE ADDRESS
S1ADR
SHIFT REGISTER
S1DAT
BUS CLOCK GENERATOR
GC
Figure 3. Serial I/O
the AA flag is set, an
acknowledge (low level to SDA)
will be returned during the
acknowledge clock pulse on the
SCL line when:
– own slave address is received
– general call address is
received (S1ADR.0 = 1)
– data byte received while
device is programmed as
master
– data byte received while
device is selected slave
With AA = 0, no acknowledge will
be returned. Consequently, no
interrupt is requested when the
“own slave address” or general
call address is received.
flag is set, an acknowledge is
returned after any one of the
following conditions:
– a start condition is generated
in master mode
– own slave address received
during AA = 1
– general call address received
while S1ADR.0 and AA = 1
– data byte received or
transmitted in master mode
(even if arbitration is lost)
– data byte received or
transmitted as selected slave
– stop or start condition received
as selected slave receiver or
transmitter
80CL410/83CL410
INTERNAL BUS
STOSTOP flag. With this bit set while
STASTART flag. When the STA bit is
ENS1When ENS1 = 0, the SIO is
in master mode, a STOP
condition is generated. When a
STOP condition is detected on
the bus, the SIO hardware clears
the STO flag. In the slave mode,
the STO flag may also be set to
recover from an error condition.
In this case, no STOP condition
is transmitted to the I
2
C-bus.
However, the SIO hardware
behaves as if a STOP condition
has been received and releases
SDA and SCL. The SIO then
switches to the “not addressed”
slave receiver mode. The STO
flag is automatically cleared by
hardware.
set in slave mode, the SIO
hardware checks the status of
2
the I
C-bus and generates a
START condition if the bus is
free. If STA is set while the SIO
is in master mode, SIO transmits
a repeated STAR T condition.
disabled. The SDA and SCL
outputs are in a high-impedance
state; P1.6 and P1.7 function as
open drain ports.
When ENS1 = 1, the SIO is
enabled. The P1.6 and P1.7 port
latches must be set to logic 1.
1995 Jan 20
9
Page 10
Philips SemiconductorsProduct specification
Low voltage/low power single-chip
2
8-bit microcontroller with I
S1STA (D9H)
Status register
SC4 SC3 SC2 SC1 SC0000
S1STA is an 8-bit read-only special function
register. S1STA.3–S1ST A.7 hold a status
code. S1STA.0–S1STA.2 are held LOW. The
contents of S1ST A may be used as a vector
to a service routine. This optimizes response
time of the software and consequently that of
2
the I
C-bus.
The following is a list of the status codes:
Abbreviations used:
SLA: 7-bit slave address
R:Read bit
W:Write bit
ACK
: Acknowledgement (acknowledge
bit = 0)
ACK: Not Acknowledge (acknowledge
bit = 1)
DATA: 8-bit byte to or from the I
MST: Master
SLV:Slave
TRX: Transmitter
REC: Receiver
MST/TRX mode
S1STA value
08H – a START condition has been
transmitted
10H – a repeated START condition has
been transmitted
18H – SLA and W have been transmitted,
ACK received
20H – SLA and W have been transmitted,
ACK
received
28H – DATA of S1DAT has been
transmitted, ACK received
30H – DATA of S1DAT has been
transmitted, ACK
38H – Arbitration lost in SLA, R/W or DATA
received
2
C-bus
C
MST/REC mode
S1STA value
08H – a START condition has been
10H – a repeated START condition has
38H – Arbitration lost while returning ACK
40H – SLA and R have been transmitted,
48H – SLA and R have been transmitted,
50H – DATA has been received, ACK
58H – DATA has been received, ACK
SLV/REC mode
S1STA value
60H – Own SLA and W have been received,
68H – Arbitration lost in SLA, R/W as MST.
70H – General CALL has been received,
78H – Arbitration lost in SLA, R/W as MST.
80H – Previously addressed with own SLA.
88H – Previously addressed with own SLA.
90H – Previously addressed with general
98H – Previously addressed with general
A0H – A STOP condition or repeated START
transmitted
been transmitted
ACK received
ACK
received
returned
returned
ACK returned
Own SLA and W have been received,
ACK returned
ACK returned
General CALL has been received
DATA byte received, ACK returned
DATA byte received, ACK
CALL. DATA byte has been received,
ACK has been returned
CALL. DATA byte has been received,
ACK
has been returned
condition has been received while still
addressed as SLV/REC or SLV/TRX
returned
80CL410/83CL410
SLV/TRX mode
S1STA value
A8H – Own SLA and R have been received,
ACK returned
B0H – Arbitration lost in SLA, R/W as MST.
Own SLA and R have been received,
ACK returned
B8H – DAT A byte has been transmitted,
ACK received
C0H– DATA byte has been transmitted,
ACK
received
C8H– Last DATA byte has been transmitted
(AA = logic 0), ACK received
Miscellaneous
S1STA value
00H – Bus error during MST mode or
selected SLV mode, due to an
erroneous ST ART or STOP condition
F8H – No relevant state interruption
available, SI = 0.
S1DAT (DAH)
Data Shift Register
76543210
Data shift register S1DAT
This register contains the serial data to be
transmitted or data that has just been
received. Bit 7 is transmitted or received first,
i.e., data is shifted from left to right.
S1ADR (DBH)
Slave Address Register
76543210
S1ADR.0, GC: 0 = general CALL address is
not recognized
1 = general CALL address is
recognized
S1ADR.7-1:own slave address
This 8-bit register may be loaded with the
7-bit slave address, to which the controller
will respond when programmed as a slave
receiver/transmitter. The LSB bit (GC) is used
to determine whether the general CALL
address is recognized.
External events and the real-time-driven
on-chip peripherals require service by the
CPU asynchronous to the execution of any
particular section of code. To tie the
asynchronous activities of these functions to
normal program execution, a multiple-source,
two-priority level, nested interrupt system is
provided. The 8XCL410 acknowledges
interrupt requests from thirteen sources, as
follows:
– INT0 and INT1
– Timer 0 and timer 1
2
–I
C-bus serial I/O interrupt
– INT2 to INT9 (port 1)
Each interrupt vectors to a separate location
in program memory for its service routine.
Each source can be individually enabled or
disabled by corresponding bits in the internal
enable registers (IEN0, IEN1) The priority
level is selected via the interrupt priority
register (IP0, IP1). All enabled sources can
be globally disabled or enabled.
External Interrupts INT2–INT9
Port 1 lines serve an alternative purpose as
eight additional interrupts INT2–INT9. When
enabled, each of these lines can “wake-up”
the device from power-down mode. Using the
IX1 register, each pin may be initialized to
either active high or low. IRQ1 is the interrupt
request flag register. Each flag, if the interrupt
is enabled, will be set on an interrupt request
but it must be cleared by software.
Writing either a “1” or “0” to an IX1 register bit
sets the priority level of the corresponding
external interrupt to active High or Low,
respectively.
The on-chip oscillator circuitry of the
8XCL410 is a single stage inverting amplifier
biased by an internal feedback resistor. (See
Figure 4.) The oscillator can be operated with
a quartz crystal, ceramic resonator, LC
network or RC network. See Figure 5 for
different configurations. When ordering parts,
it is necessary to specify an oscillator option.
The options are: RC when an RC network will
be used, OSC 2 for oscillator operation below
4MHz, OSC 3 for oscillator operation from
4MHz to 10MHz, OSC 4 for oscillator
operation above 10MHz, and 32kHz if 32kHz
to 400kHz operation is desired.
For operation as a standard quartz oscillator,
no external components are needed (except
at 32KHz). When using external capacitors,
ceramic resonators, coils, and RC networks
to drive the oscillator, five different
configurations are supported (see Figure 5
and Table 4).
In the power-down mode the oscillator is
stopped and XTAL1 is pulled high. The
oscillator inverter is switched off to ensure no
current will flow. To drive the device with an
external clock source, apply the external
clock signal to XTAL1, and leave XTAL2 to
float, as shown in Figure 5(f). There are no
requirements on the duty cycle of the
external clock, since the input to the internal
clocking circuitry is split using a flip-flop.
The following options are provided for
optimum on-chip oscillator performance.
Please state option when ordering:
Osc.1: Figure 5(c). An option for 32kHz
Osc.2: Figure 5(e). An option for low-power,
Osc.3: An option for medium frequency
Osc.4: An option for high frequency range
RC:Figure 5(g). An option for an RC
The equivalent circuit data of the internal
oscillator compares with that of matched
crystals.
The externally adjustable RC oscillator has a
frequency range from 100kHz to 500kHz.
(See Figure 7.)
clock applications with external
trimmer for frequency adjustment.
A 4.7MΩ bias resistor must be
connected in parallel with the
crystal.
low-frequency operations using LC
components or quartz.
range applications.
applications.
oscillator.
80CL410/83CL410
Power-on Reset
The 8XCL410 contains on-chip circuitry
which switch the port pins to the
customer-defined logic level as soon as V
exceeds 1.3V if the mask option “ON” has
been chosen (see Figures 8 and 9). As soon
as the minimum supply voltage is reached,
the oscillator will start up. However, to ensure
that the oscillator is stable before the
controller starts, the clock signals are gated
away from the CPU for a further 1536
oscillator periods.
An hysteresis of approximately 50mV at a
typical power-on switching level of 1.3V will
ensure correct operation.
The on-chip power–on reset circuitry can also
be switched off via the mask option “OFF”.
This option reduces the power-down current
to typically 800µA and can be chosen if
external reset circuitry is used. For
applications not requiring the internal reset,
option “OFF” should be chosen.
An automatic reset can be obtained at
power-on by connecting the RST pin to V
via a 10µF capacitor. At power-on, the
voltage on the RST pin is equal to V
the capacitor voltage, and decreases from
V
as the capacitor discharges through the
DD
internal resistor R
the capacitor, the more slowly V
decreases. V
lower threshold of the Schmitt trigger long
enough to effect a complete reset. The time
required is the oscillator start-up time, plus 2
machine cycles.
to ground. The larger
RST
must remain above the
RST
RST
P80CL410:
ROM-less VERSION OF P83CL410
The P80CL410 is a low voltage ROMless
version of the P83CL410. The mask options
on the P80CL410 are fixed as follows:
•Port Options:
All ports except P16/P17 have option “1S”,
i.e., standard port, High after reset. The
ports P16/P17 have option “2S”, i.e., open
drain, High after reset.
1. 32kHz quartz crystals with a series resistance higher than 15kΩ will reduce the guaranteed supply voltage range to 2.5 to 3.5V.
80CL410/83CL410
1
100µH = 5Ω
1mH = 75Ω
Table 5.Oscillator Equivalent Circuit Parameters (see Figure 6)
PARAMETEROPTIONSYMBOLCONDITIONMINTYPMAXUNIT
TransconductanceOsc.1g
Osc.2g
Osc.3g
Osc.4g
Input capacitanceOsc.1c1
Osc.2c1
Osc.3c1
Osc.4c1
Output capacitanceOsc.1c2
Osc.2c2
Osc.3c2
Osc.4c2
Output resistanceOsc.1R2–3800–kΩ
Osc.2R2–65–kΩ
Osc.3R2–18–kΩ
Osc.4R2–5.0–kΩ
m
m
m
m
i
i
i
i
i
i
i
i
T = +25°C; VDD = 4.5V–15–µs
T = +25°C; VDD = 4.5V2006001000µs
T = +25°C; VDD = 4.5V40015004000µs
T = +25°C; VDD = 4.5V1000400010000µs
–3.0–pF
–8.0–pF
–8.0–pF
–8.0–pF
–23.0–pF
–8.0–pF
–8.0–pF
–8.0–pF
1995 Jan 20
14
Page 15
Philips SemiconductorsProduct specification
Low voltage/low power single-chip
2
8-bit microcontroller with I
XTAL1
C1
i
C
R
f
V
1
Figure 6. Equivalent Circuit Diagram
600
400
80CL410/83CL410
XTAL2
g
m
R
2
C2
i
SUPPLY VOLTAGE
POWER-ON RESET
(INTERNAL)
OSCILLATOR
f
OSC
(kHz)
SWITCHING
LEVEL
PDR
200
0
02 4 6
RC (µs)
Figure 7. Frequency as a Function of RC
HYSTERESIS
CPU RUNNING
1995 Jan 20
START-UP
TIME
1536 OSCILLATOR
PERIODS DELAY
Figure 8. Power-on Reset Switching Level
15
Page 16
Philips SemiconductorsProduct specification
Low voltage/low power single-chip
2
8-bit microcontroller with I
ABSOLUTE MAXIMUM RATINGS
PARAMETERRATINGUNIT
Supply voltage–0.5 to +6.5V
All input voltages–0.5 to VDD +0.5V
DC current into any input or output5mA
Total power dissipation300mW
Storage temperature range–65 to +150°C
Operating ambient temperature range–40 to +85°C
Operating junction temperature125°C
NOTES:
1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any conditions other than those described in the AC and DC Electrical Characteristics section
of this specification is not implied.
2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static
charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.
3. Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
noted.
C
V
CC
V
R
CC
RST
10µF
Figure 9. Recommended Power-on Reset Circuitry
1, 2, 3
+
8XCL410
RST
80CL410/83CL410
unless otherwise
SS
1995 Jan 20
16
Page 17
Philips SemiconductorsProduct specification
Low voltage/low power single-chip
2
8-bit microcontroller with I
C
DC ELECTRICAL CHARACTERISTICS
T
= –40°C to +85°C, VSS = 0V
amb
TESTLIMITS
SYMBOLPARAMETERCONDITIONSMINMAXUNIT
V
DD
I
DD
V
IL
V
IH
I
OL
I
OL1
I
OH
I
IL
I
TL
I
LI
R
RST
NOTES:
1. The operating supply current is measured with all output pins disconnected; XTAL1 driven with t
not connected; EA
2. The idle supply current is measured with all output pins disconnected; XTAL1 driven with t
connected; EA
3. The power-down current is measured with all output pins disconnected; XTAL1 not connected; EA
outputs connected to V
4. The RC-oscillator is not implemented in this version.
5. Circuits with “power-on reset” option “OFF” are tested at V
Supply voltagef
(see Figure 13)1.86.0V
CLK
RAM retention voltage in power-down mode1.0—V
Power supply current:
= RST = Port 0 = VDD; all open drain outputs connected to VSS.
= Port 0 = VDD; RST = VSS; all open drain outputs connected to VSS.
.
SS
= 1.8V, with option “ON” (typically 1.3V) are tested at V
DDMIN
r
= tf = 10ns; VIL = VSS, VIH = VDD; XTAL2 not
r
80CL410/83CL410
DD
0.3V
DD
V
DD
±10µA
= 2.3V.
DDMIN
SS
= tf = 10ns; VIL = VSS, VIH = VDD; XTAL2
= port 0 = VDD; RST = VSS; all open-drain
V
V
1995 Jan 20
17
Page 18
Philips SemiconductorsProduct specification
Low voltage/low power single-chip
2
8-bit microcontroller with I
1.8
1.6
1.4
1.2
1.0
IDD (mA)
0.8
0.6
0.4
0.2
C
80CL410/83CL410
1.2MHz
32kHz
0
0123456
V
MIN = 1.8V
DD
VDD (V)
Typical Operating Current Versus Supply and Frequency (32kHz–1.2MHz) at +25°C
1995 Jan 20
18
Page 19
Philips SemiconductorsProduct specification
Low voltage/low power single-chip
2
8-bit microcontroller with I
C
AC ELECTRICAL CHARACTERISTICS
T
= –40°C to +85°C, VSS = 0V
amb
SYMBOLFIGUREPARAMETERMINMAXMINMAXUNIT
Program Memory
1/t
CLCL
t
LL
t
AL
t
LA
t
LIV
t
LC
t
CC
t
CIV
t
CI
t
CIF
t
AVI
t
AFC
10ALE pulse width1272t
10Address valid to ALE low43t
10Address hold after ALE low48t
10ALE low to valid instruction in2334t
10ALE low to PSEN low58t
10PSEN pulse width2153t
10PSEN low to valid instruction in1253t
10Input instruction hold after PSEN00ns
10Input instruction float after PSEN63t
10Address to valid instruction in3025t
10PSEN low to address float00ns
Data Memory
t
RR
t
WW
t
LA
t
RD
t
DFR
t
LD
t
AD
t
LW
t
AW
t
DWX
t
DW
t
WD
t
AFR
t
WHLH
11RD pulse width4006t
12WR pulse width4006t
11, 12Address hold time after ALE48–t
11RD low to valid data in2505t
11Data float after RD972t
11ALE low to valid data in5178t
11Address to valid data in5859t
11, 12ALE low to RD or WR low2003003t
11, 12Address valid to WR low or RD low2034t
12Data valid to WR transition23t
11Data valid to WR433–7t
12Data hold after WR33t
11RD low to address float
11, 12RD or WR high to ALE high43123t
NOTES:
1. Parameters are valid over operating temperature range unless otherwise specified.
2. Load capacitance for port 0, ALE, and PSEN
3. Interfacing the 8XCL410 to devices with float time up to 75ns is permitted. This limited bus connection will not cause damage to port 0
drivers.
1, 2
12MHz CLOCKVARIABLE CLOCK
Oscillator frequency020MHz
3
1212ns
= 50pF, load capacitance for all other outputs = 40pF .
80CL410/83CL410
–40ns
CLCL
–40ns
CLCL
–35ns
CLCL
–100ns
CLCL
–25ns
CLCL
–35ns
CLCL
–125ns
CLCL
–20ns
CLCL
–115ns
CLCL
–100ns
CLCL
–100ns
CLCL
–35–ns
CLCL
–165ns
CLCL
–70ns
CLCL
–150ns
CLCL
–165ns
CLCL
–503t
CLCL
–130ns
CLCL
–60ns
CLCL
–150–ns
CLCL
–50ns
CLCL
–40t
CLCL
+50ns
CLCL
+40ns
CLCL
1995 Jan 20
19
Page 20
Philips SemiconductorsProduct specification
Low voltage/low power single-chip
2
8-bit microcontroller with I
t
ALE
PSEN
PORT 0
PORT 2
LL
C
t
AL
t
LC
t
LIV
t
CIV
t
LA
A0–A7A0–A7
t
AVI
A8–A15A8–A15
Figure 10. External Program Memory Read Cycle
t
AFC
t
CC
t
CI
INSTR IN
80CL410/83CL410
t
CIF
ALE
PSEN
PORT 0
PORT 2
RD
t
AL
t
LA
A0–A7
FROM RI OR DPL
t
AW
t
WHLH
t
LD
t
LW
t
AFR
t
AD
P2.0–P2.7 OR A8–A15 FROM DPHA8–A15 FROM PCH
t
RR
t
DFR
DATA INA0–A7 FROM PCLINSTR IN
t
RD
Figure 11. External Data Memory Read Cycle
1995 Jan 20
20
Page 21
Philips SemiconductorsProduct specification
Low voltage/low power single-chip
2
8-bit microcontroller with I
ALE
PSEN
WR
t
AL
t
LA
PORT 0
PORT 2
A0–A7
FROM RI OR DPL
t
AW
C
t
LW
t
DWX
P2.0–P2.7 OR A8–A15 FROM DPHA8–A15 FROM PCH
80CL410/83CL410
t
WHLH
t
WW
t
t
DW
DATA OUTA0–A7 FROM PCLINSTR IN
WD
0.9 V
0.4 V
DD
DD
Figure 12. External Data Memory Write Cycle
0.7 V
0.3 V
DD
TEST POINTS
DD
0.7 V
0.3 V
DD
DD
Figure 13. AC Testing Input Waveform
I
500µA
–I
IL
I
IL
100µA
TL
1995 Jan 20
0
VDD/2V
DD
Figure 14. Input Current
21
Page 22
Philips SemiconductorsProduct specification
Low voltage/low power single-chip
2
8-bit microcontroller with I
100
10
f (MHz)
1
0.1
C
80CL410/83CL410
16
12
I
(mA)
DD
8
12MHz
4
8MHz
0.01
01234567
V
(V)
DD
NOTE: Below 32kHz, clock has to be supplied externally.
Figure 15. Frequency Operating Range
5
4
3
f
IDLE
(mA)
2
1
8MHz
12MHz
3.58MHz
0
1246
35
V
(V)
DD
Figure 16. Typical Operating Current as a Function of
I
PD
(µA)
Frequency and V
8
6
4
2
DD
, T
amb
= 25°C
0
0246135
Figure 17. Typical Idle Current as a Function of
Frequency and V
1995 Jan 20
3.58MHz
DD
0246135
V
V
(V)
DD
DD
(V)
Figure 18. Typical Power-Down Current Vs.
, T
amb
= 25°C
Frequency and VDD, T
amb
= 25oC
22
Page 23
Philips SemiconductorsProduct specification
Low voltage/low power single-chip
2
8-bit microcontroller with I
PIGGYBACK SPECIFICATION
The differences between the masked version
and the piggyback are described herein.
General Description
The P85CL000HFZ is a piggy-back version
with 256 bytes of RAM used for emulation of
the P83CL410 microcontroller. The
P85CL000HFZ is manufactured in an
advanced CMOS technology. The instruction
set of the P85CL000HFZ is based on that of
the 8051. The device has low power
consumption and a wide supply voltage
range. The P85CL000HFZ has two software
selectable modes of reduced activity for
further power reduction: Idle and
Power-down. For timing and AC/DC
characteristics, please refer to the P83CL410
specifications.
C
Features
•Full static 80C51 CPU
•8-bit CPU, RAM, I/O in a single
40-lead DIP
•Socket for up to 16k external EPROM
•256 bytes RAM, expandable externally to
64K bytes
•Four 8-bit ports, 32 I/O lines
•Two 16-bit timer/event counters
•External memory expandable up to 128K,
external ROM up to 64K and/or RAM up to
64K
•Thirteen source, thirteen vector interrupt
structure with two priority levels
•Full duplex serial port (UART)
2
•I
C-bus interface for serial transfer on two
lines
80CL410/83CL410
•Enhanced architecture with:
– non-page oriented instructions
– direct addressing
– four eight byte RAM register banks
– stack depth up to 128 bytes
– multiply , divide, subtract and compare
instructions
•STOP and IDLE instructions
•Wake-up via external interrupts at port 1
•Single supply voltage of 1.8V to 6.0V
•On-chip oscillator (option: oscillator 4)
•Very low current consumption
•Operating temperature range:
–40 to +85°C
ST ANDARD PIGGYBACK
Types: P85CL000HFZ
Emulation for: P83CL410, P80CL51
List of differences between masked microcontroller and corresponding piggyback:
PARAMETER
RAM size128256
ROM size4kEPROM size dependent (max 16k)
Port option1, 2, 31
Oscillator optionOsc. 1, 2, 3, 4, RCOsc. 4
Mech. dimensionsStandard Dual In-Line, Small OutlineSee SOT158A
Current cons.I
Voltage rangefullfull, limited by EPROM
ESDspecificationnot tested (dif ferent package)
MASKED CONTROLLERPIGGYBACK
DD
IDD (OSC. 4) + I
EPROM
1995 Jan 20
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent
2
to use the components in the I
2
C specifications defined by Philips. This specification can be ordered using the
VSO40:plastic very small outline package; 40 leadsSOT158-1
C
80CL410/83CL410
1995 Jan 20
25
Page 26
Philips SemiconductorsProduct specification
Low voltage/low power single-chip
2
8-bit microcontroller with I
QFP44:plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mmSOT307-2
C
80CL410/83CL410
1995 Jan 20
26
Page 27
Philips SemiconductorsProduct specification
Low voltage/low power single-chip
2
8-bit microcontroller with I
C
80CL410/83CL410
NOTES
1995 Jan 20
27
Page 28
Philips Semiconductors Product specification
Low voltage/low power single-chip
2
8-bit microcontroller with I
C
80CL410/83CL410
DEFINITIONS
Data Sheet IdentificationProduct StatusDefinition
Objective Specification
Preliminary Specification
Product Specification
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Formative or in Design
Preproduction Product
Full Production
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation
register eligible circuits under the Semiconductor Chip Protection Act.
Copyright Philips Electronics North America Corporation 1995
All rights reserved. Printed in U.S.A.
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