•RAD-PAK® patented shielding against natural space radia-
tion
• Total dose hardness:
- > 100 krad (Si), depending upon space mission
• Excellent single event effects
- SEL
: > 120 MeV/mg/cm
TH
- SEUTH: > 120 MeV/mg/cm2 using all 1’s
• Package:
- 20 pin R
- 20 pin R
• Low gain temperature coefficient:
- 5 ppm/
• Fast interface timing
• Single +5 V to +15 V supply
AD-PAK® Flat Pack
AD-PAK® DIP
°
C typ.
2
V
INPUT D A TA LATCH E S
12
DB11-DBO
DD
DGND
DESCRIPTION:
Maxwell Technologies’ 7545A is a 12-bit CMOS-buffered multiplying DAC with internal data latches, which features a
greater than 100 krad (Si) total dose tolerance, depending
upon space mission. The 7545A features a WR
100 ns which allows interfacing to a much wider range of fast
8-bit and 16-bit microprocessors. It is loaded by a single 12-bit
wide word under the control of the CS
these control inputs low makes the input latches transparent
allowing unbuffered operation of the DAC. The 7545A is particularly suitable for single supply operations and applications
with wide temperature variations.
Maxwell Technologies' patented R
ogy incorporates radiation shielding in the microcircuit package. It eliminates the need for box shielding while providing
the required radiation shielding for a lifetime in orbit or space
mission. In a GEO orbit, R
krad (Si) radiation dose tolerance. This product is available
with screening up to Class S.
12-Bit Buffered Multiplying
Digital to Ana log Converter
TABLE 1. 7545A PINOUT DESCRIPTION
PINSYMBOLDESCRIPTION
1OUT 1Output Current
2AGNDAnalog Ground
3DGNDDigital Ground
4DB 11Data Bit 11 (MSB)
5DB 10Data Bit 10
6DB 9Data Bit 9
7DB 8Data Bit 8
8DB 7Data Bit 7
9DB 6 Data Bit 6
10DB 5Data Bit 5
11DB 4Data Bit 4
12DB 3Data Bit 3
13DB 2Data Bit 2
14DB 1Data Bit 1
15DB 0Data Bit 0 (LSB)
16 CS
17WR
18V
19V
20RFBFeedback Resistance
DD
REF
7545A
Chip Select (Active Low)
Write (Active Low)
Digital Supply Voltage
Reference Input
TABLE 2. 7545A ABSOLUTE MAXIMUM RATINGS
PARAMETERSYMBOLMINMAXUNIT
VDD to DGND---0.317V
Digital Input Voltage to DGND---0.3V
, V
V
RFB
V
PIN1
AGND to DGND---0.3V
Power Dissipation to 75
Thermal Impedance — Flat Package
Thermal Impedance — DIP Package
Operating Temperature---55125
Storage Temperature RangeT
Important Notice:
These data sheets are created using the chip m anufacturers publ ished specifications. Maxwell Technologies verifies
functional ity by testing key parameters eit her by 100% testing, sample testing or char acterization.
The specifications presented within these data sheets represent the latest and most accurate informati on available to
date. However, these specifications are subject to change without notice and Maxwell Technologies assumes no
responsibility for the use of this information.
Maxwell Technologies’ products are not authorized for use as critical components in life support devices or systems
without express written approval from Maxwell Technologies.
Any claim against Maxwell Technologies must be made within 90 days f rom the date of shipment from Maxwell Technologies. Maxwell Technologies’ liability shall be limited to replacement of defective parts.
02.05.02 REV 4
8All data sheets are subject to change without notice