Datasheet 74LVTH652WMX, 74LVTH652WM, 74LVTH652MTCX, 74LVTH652MTC Datasheet (Fairchild Semiconductor)

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© 2000 Fairchild Semiconductor Corporation DS012018 www.fairchildsemi.com
April 2000 Revised April 2000
74LVTH652 Low Voltage Octal Trans ceiver/Register with 3-STATE Outputs
74LVTH652 Low Voltage Octal Transceiver/Register
with 3-STATE Outputs
General Description
) are pro­vided to control the tr ansceiver function. (See Functio nal Description).
The LVTH652 data inputs include bush old, eliminati ng the need for external pull-up resistors to hold unused inputs.
This octal transceiver/register is d esigned for low-voltage (3.3V) V
CC
applications, but with the capability to provide a
TTL interface to a 5V enviro nment. The LVTH652 is fabri­cated with an advanced BiCMOS technology to achieve high speed opera tion similar to 5V ABT while maintaining low power dissipation.
Features
Input and output interface capability to systems at 5V V
CC
Bushold data inputs elimina te the nee d for exte rnal pul l­up resistors to hold unused inputs
Live insertion/extraction per mitt ed
Power Up/Down high impedance provides glitch-free
bus loading
Outputs source/sink 32 mA/+64 mA
Functionally compatible with the 74 series 652
Latch-up performance exceeds 500 mA
Ordering Code:
Devices also availab le in Tape and Reel. Specify by appending su ffix let te r “X” to the ordering code.
Logic Symbols
IEEE/IEC
Order Number Package Number Package Description
74LVTH652WM M24B 24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide 74LVTH652MTC MTC24 24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
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74LVTH652
Pin Descriptions Connection Diagram
Truth Table
(Note 1)
H = HIGH Voltage Level L = LOW Voltage Lev el X = Immaterial = LOW to HIGH Clock Transition Note 1: The data output fu nction s may b e enable d or di sabled b y variou s signa ls at OEA B or O EBA
inputs. Data input function s are a lways e nabled, i.e.,
data at the bus pins w ill be stored on every LOW- to -H I GH t ransition on the clock inp ut s .
Logic Diagram
Please note that this diagram is provided o nly f or t he understanding of lo gic operations and should not be used to estimate propagation delays.
Pin Names Description
A
0–A7
Data Register A Inputs/ 3-STATE Outputs
B
0–B7
Data Register B Inputs/
3-STATE Outputs CPAB, CPBA Clock Pulse Inputs SAB, SBA Select Inputs OEAB, OEBA
Output Enable Inputs
Inputs Inputs/Outputs
Operating Mode
OEAB OEBA
CPAB CPBA SAB SBA A0 thru A7B0 thru B
7
L H H or L H or L X X Input Input Isolation LH

X X Store A and B Data
XH
H or L X X Input Not Specified Store A, Hold B
HH

X X Input Output Store A in Both Registers
LXH or L
X X Not Specified Input Hold A, Store B
LL

X X Output Input Store B in Both Registers L L X X X L Output Input Real-Time B Data to A Bus L L X H or L X H Store B Data to A Bus H H X X L X Input Output Real-Time A Data to B Bus H H H or L X H X Stored A Data to B Bus
H L H or L H or L H H Output Output
Stored A Data to B Bus and Stored B Data to A Bus
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74LVTH652
Functional Description
In the transceiver mode , data present a t the HIGH impe d­ance port may be sto red in either the A or B register or both.
The select (SAB, SBA) controls can multiplex stored and real-time.
The examples below demonstrate the four fundamental bus-management fun cti on s t hat c an be performed wi th t he LVTH652.
Data on the A or B data bus, or both can be stored in the internal D-type flip-flop by LOW-to-H IGH transitions at the appropriate Clock Inp uts (CPAB, CPBA) regardless of the Select or Output Enable Inputs. When SAB and SBA are in the real time transfer m od e, it is a lso po ssibl e to sto re d ata without using the internal D-type flip-flops by simulta­neously enabling OEAB and OEBA
. In this configuration each Output reinforces its Input. Thu s when all other data sources to the two sets of bus lin es are in a HIGH imp ed­ance state, each set of bus lines will remain at its last state.
Real-Time Transfer
Bus B to Bus A
Storage
Real-Time Transfer
Bus A to Bus B
Transfer Storage
Data to A or B
OEAB OEBA
CPAB CPBA SAB SBA
LLXXXL
OEAB OEBA
CPAB CPBA SAB SBA
XH
XXX
LXX
XX
LH

XX
OEAB OEBA CPAB CPBA SAB SBA
HHXXLX
OEAB OEBA
CPAB CPBA SAB SBA
H L H or L H or L H H
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74LVTH652
Absolute Maximum Ratings(Note 2)
Recommended Operating Conditions
Note 2: Absolute Maximum continuous rat ings are those valu es beyond which da m age to the device m ay occur. Exposure to these conditions or co nditions
beyond those indic ated may adversely affec t device reliability. Functional opera ti on under absolute maximum rated conditio ns is not implied. Note 3: I
O
Absolute Maximum Rating must be observed.
Symbol Parameter Value Conditions Units
V
CC
Supply Voltage 0.5 to +4.6 V
V
I
DC Input Voltage 0.5 to +7.0 V
V
O
DC Output Voltage 0.5 to +7.0 Output in 3-STATE
V
0.5 to +7.0 Output in HIGH or LOW State (Note 3)
I
IK
DC Input Diode Current −50 VI < GND mA
I
OK
DC Output Diode Current −50 VO < GND mA
I
O
DC Output Current 64 VO > VCCOutput at HIGH State
mA
128 V
O
> VCCOutput at LOW State
I
CC
DC Supply Current per Supply Pin ±64 mA
I
GND
DC Ground Cu rrent per Ground Pin ±128 mA
T
STG
Storage Temperature 65 to +150 °C
Symbol Parameter Min Max Units
V
CC
Supply Voltage 2.7 3.6 V
V
I
Input Voltage 0 5.5 V
I
OH
HIGH Level Output Current 32 mA
I
OL
LOW Level Output Current 64 mA
T
A
Free-Air Operating Tempera ture −40 85 °C
t/V Input Edge Rate, V
IN
= 0.8V–2.0V, VCC = 3.0V 0 10 ns/V
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74LVTH652
DC Electrical Characteristics
Note 4: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 5: An external dri ve r m us t s ink at least the specified cur rent to switch from HIGH -t o-LOW. Note 6: This is the increas e in supply current for eac h input that is at the specif ied voltage level rather than V
CC
or GND.
Dynamic Switching Characteristics (Note 7)
Note 7: Characterize d in SOIC package. Gu aranteed parameter, but not te sted. Note 8: Max number of outputs defined as (n). n1 data inputs are driven 0V to 3V. Output under test held LOW.
Symbol Parameter
V
CC
TA =−40°C to +85°C
Units Conditions
(V) Min Max
V
IK
Input Clamp Diode Voltage 2.7 −1.2 V II = 18 mA
V
IH
Input HIGH Voltage 2.7–3.6 2.0
V
VO 0.1V or
V
IL
Input LOW Voltage 2.7–3.6 0.8 VO VCC 0.1V
V
OH
Output HIGH Voltage 2.7–3.6 VCC 0.2 V IOH = 100 µA
2.7 2.4 V IOH = 8 mA
3.0 2.0 V IOH = 32 mA
V
OL
Output LOW Voltage 2.7 0.2 V IOL = 100 µA
2.7 0.5 V IOL = 24 mA
3.0 0.4 V IOL = 16 mA
3.0 0.5 V IOL = 32 mA
3.0 0.55 V IOL = 64 mA
I
I(HOLD)
Bushold Input Minimum Drive 3.0 75 µAVI = 0.8V
75 µAVI = 2.0V
I
I(OD)
Bushold Input Over-Drive 3.0 500 µA (Note 4) Current to Change State −500 µA (Note 5)
I
I
Input Current 3.6 10 µAVI = 5.5V
Control Pins 3.6 ±1 µAVI = 0V or V
CC
Data Pins 3.6 −5 µAVI = 0V
1 µAVI = V
CC
I
OFF
Power OFF Leakage Current 0 ±100 µA0V ≤ VI or VO 5.5V
I
PU/PD
Power Up/Down 3-STATE
0–1.5V ±100 µA
VO = 0.5V to 3.0V
Output Current VI = GND or V
CC
I
OZL
3-STATE Output Leakage Current 3.6 −5 µAVO = 0.0V
I
OZH
3-STATE Output Leakage Current 3.6 5 µAVO = 3.6V
I
OZH
+ 3-STATE Output Leakage Current 3.6 10 µAVCC < VO 5.5V
I
CCH
Power Supply Current 3.6 0.19 mA Outputs HIGH
I
CCL
Power Supply Current 3.6 5 mA A or B Port Outputs LOW
I
CCZ
Power Supply Current 3.6 0.19 mA Outputs Disabled
I
CCZ
+ Power Supply Current 3.6 0.19 mA VCC VO 5.5V
Outputs Disabled
I
CC
Increase in Power Supply Current
3.6 0.2 mA
One Input at VCC 0.6V
(Note 6) Other Inputs at VCC or GND
Symbol Parameter
V
CC
TA = 25°C
Units
Conditions
(V) Min Typ Max
CL = 50 pF, RL = 500
V
OLP
Quiet Output Maximum Dynamic V
OL
3.3 0.8 V (Note 8)
V
OLV
Quiet Output Minimum Dynamic V
OL
3.3 0.8 V (Note 8)
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74LVTH652
AC Electrical Characteristics
Note 9: Skew is defined as t he absolute value of t he difference between t he actual propagat ion delay for any tw o separate outpu ts of the same device. T he
specification applies to any outputs swit c hing in the same direction, eit her HIGH-to-LOW (t
OSHL
) or LOW-to-HIGH (t
OSLH
).
Capacitance (Note 10)
Note 10: Capacitance is measured at frequency f = 1 MHz, per MIL-STD-883B, Method 3012.
Symbol Parameter
TA = 40°C to +85°C
Units
CL = 50 pF, RL = 500
VCC = 3.3V ± 0.3V VCC = 2.7V
Min Max Min Max
f
MAX
Maximum Clock Frequency 150 150 MHz
t
PLH
Propagation Delay Data to Output 1.8 5.6 1.8 6.2
ns
t
PHL
Clock to A or B 1.8 4.8 1.8 5.6
t
PLH
Propagation Delay Data to Output 1.3 4.5 1.3 4.9
ns
t
PHL
Data to A or B 1.3 4.6 1.3 5.2
t
PLH
Propagation Delay Data to Output 1.5 5.5 1.5 6.4
ns
t
PHL
SBA or SAB to A or B 1.5 5.4 1.5 6.1
t
PZH
Output Enable Time 1.1 5.2 1.1 6.5
ns
t
PZL
OE to A
1.1 5.6 1.1 6.6
t
PHZ
Output Disable Time 2.0 5.5 2.0 6.1
ns
t
PLZ
OE to A
2.0 5.5 2.0 5.9
t
PZH
Output Enable Time 1.3 4.9 1.3 5.7
ns
t
PZL
OE to B 1.3 5.3 1.3 5.8
t
PHZ
Output Disable Time 1.5 5.6 1.5 6.7
ns
t
PLZ
OE to B 1.5 5.6 1.5 6.3
t
W
Pulse Duration Clock HIGH or LOW 3.3 3.3 ns
t
S
Setup Time Data HIGH before CP 1.2 1.5
ns
Data LOW before CP
1.6 2.2
t
H
Hold Time Data HIGH or LOW after CP 0.8 0.8 ns
t
OSHL
Output to Output Skew 1.0 1.0
ns
t
OSLH
(Note 9) 1.0 1.0
Symbol Parameter Conditions Typical Units
C
IN
Input Capacitance VCC = 0V, VI = 0V or V
CC
4pF
C
I/O
Input/Output Capacitance VCC = 3.0V, VO = 0V or V
CC
8pF
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74LVTH652
Physical Dimensions inches (millimeters) unless otherwise noted
24-Lead (0.300’ Wide) Molded Small Outline Package, SOIC JEDEC
Package Number M24B
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74LVTH652 Low Voltage Octal Transceiver/Register with 3-STATE Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
24-Lead Molded Small Outline Package, TSSOP JEDEC
Package Number MTC24
Fairchild does not assume any responsibility for use of any circuitry described, no circuit pate nt licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or syste ms which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea­sonably expected to result in a significant inju ry to the user.
2. A critical component i n any compon ent of a lif e support device or system whose failu re to perform can be rea­sonably expected to ca use the fa i lure of the life su pp ort device or system, or to affect its safety or effectiveness.
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