Datasheet 74LVTH244SJX, 74LVTH244SJ, 74LVTH244MTCX, 74LVTH244MTC, 74LVTH244MSAX Datasheet (Fairchild Semiconductor)

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© 1999 Fairchild Semiconductor Corporation DS500154 www.fairchildsemi.com
July 1999 Revised August 1999
74LVT244 •74LVTH244 Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs
74LVT244 •74LVTH244 Low Voltage Octal Buffer/Line Driver
with 3-STATE Outputs
General Description
The LVTH244 data inputs include bush old, eliminati ng the need for external pull-up resistors to hold unused inputs.
These octal buffers and line drivers are designed for low­voltage (3.3V) V
CC
applications, but wit h the capability to
provide a TTL interface to a 5V environment. The LVT244 and LVTH244 are fabricated with an advanced BiCMOS technology to achieve h igh speed operation similar to 5V ABT while maintaining low power dissipation.
Features
Input and output interface capability to systems at 5V V
CC
Bushold data inputs eliminate the need for external pull-up resistors to hold unused inputs (74LVTH244), also available without bushold feat ure (74LVT244)
Live insertion/extraction per mitt ed
Power Up/Down high impedance provides glitch-free
bus loading
Outputs source/sink 32 mA/+64 mA
Functionally compatible with the 74 series 244
Latch-up performance exceeds 500 mA
Ordering Code:
Device also available in Tape and Reel. Specify by appending s uffix let te r “X” to the ordering code.
Logic Symbol
IEEE/IEC
Order Number Package Number Package Description
74LVT244WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74LVT244SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LVT244MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 74LVT244MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 74LVTH244WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide 74LVTH244SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 74LVTH244MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide 74LVTH244MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
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74LVT244 •74LVTH244
Connection Diagram Pin Descriptions
Truth Tables
H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial Z = High Impedance
Pin Names Description
OE
1
, OE
2
3-STATE Output Enable Inputs
I
0–I7
Inputs
O
0–O7
Output
Inputs Outputs
OE
1
I
n
(Pins 12, 14, 16, 18)
LL L LH H HX Z
Inputs Outputs
OE
2
I
n
(Pins 3, 5, 7, 9)
LL L LH H HX Z
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74LVT244 •74LVTH244
Absolute Maximum Ratings(Note 1)
Recommended Operating Conditions
Note 1: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions
beyond those indica te d m ay adversely affect dev ic e reliability. Functional operation under absolute maxim um rated conditions is not imp lied. Note 2: I
O
Absolute Maximum Rating must be observed.
Symbol Parameter Value Conditions Units
V
CC
Supply Voltage 0.5 to +4.6 V
V
I
DC Input Voltage 0.5 to +7.0 V
V
O
DC Output Voltage 0.5 to +7.0 Output in 3-STATE V
0.5 to +7.0 Output in HIGH or LOW State (Note 2) V
I
IK
DC Input Diode Current −50 VI < GND mA
I
OK
DC Output Diode Current −50 VO < GND mA
I
O
DC Output Current 64 VO > VCCOutput at HIGH State
mA
128 V
O
> VCCOutput at LOW State
I
CC
DC Supply Current per Supply Pin ±64 mA
I
GND
DC Ground Current per Ground Pin ±128 mA
T
STG
Storage Temperature 65 to +150 °C
Symbol Parameter Min Max Units
V
CC
Supply Voltage 2.7 3.6 V
V
I
Input Voltage 0 5.5 V
I
OH
HIGH-Level Output Current 32
mA
I
OL
LOW-Level Output Current 64
T
A
Free-Air Operating Temperature 40 85 °C
t/V Input Edge Rate, V
IN
= 0.8V–2.0V, VCC = 3.0V 0 10 ns/V
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74LVT244 •74LVTH244
DC Electrical Characteristics
Note 3: All typical va lues are at VCC = 3.3V, TA = 25°C. Note 4: Applies to bu s hold versions only (74LVTH244). Note 5: An externa l driv er must source at leas t the specified current to s w it c h f rom LOW-to-HIGH. Note 6: An externa l driv er must sink at least the sp ec if ied current to switch from H I GH-to-LOW. Note 7: This is the increase in supply current f or each input that is at the spe c if ied voltage level rather t han V
CC
or GND.
Dynamic Switching Characteristics (Note 8)
Note 8: Characteriz ed in SOIC package. Guaranteed parameter, but not tes t ed. Note 9: Max number of outputs defined a s (n ). n1 data inputs are driven 0V to 3V. Output under test held LOW.
Symbol Parameter
V
CC
(V)
T A =−40°C to +85°C
Units Conditions
Min Typ Max
(Note 3)
V
IK
Input Clamp Diode Voltage 2.7 −1.2 V II = 18 mA
V
IH
Input HIGH Voltage 2.7–3.6 2.0
V
VO 0.1V or
V
IL
Input LOW Voltage 2.7–3.6 0.8 VO VCC 0.1V
V
OH
Output HIGH Voltage 2.7–3.6 VCC−0.2 V IOH = 100 µA
2.7 2.4 V IOH = 8 mA
3.0 2.0 V IOH = 32 mA
V
OL
Output LOW Voltage 2.7 0.2 V IOL = 100 µA
2.7 0.5 V IOL = 24 mA
3.0 0.4 V IOL = 16 mA
3.0 0.5 V IOL = 32 mA
3.0 0.55 V IOL = 64 mA
I
I(HOLD)
Bushold Input Minimum Drive 3.0 75 µAVI = 0.8V (Note 4) −75 µAVI = 2.0V I
I(OD)
Bushold Input Over-Drive
Current to Change State
3.0 500 µA(Note 5) (Note 4) −500 µA(Note 6) I
I
Input Current 3.6 10 µAVI = 5.5V
Control Pins 3.6 ±1 µAVI = 0V or V
CC
Data Pins 3.6 −5 µAVI = 0V
1 µAVI = V
CC
I
OFF
Power Off Leakage Current 0 ±100 µA0V ≤ VI or VO 5.5V
I
PU/PD
Power up/down 3-STATE
0–1.5V ±100 µA
VO = 0.5V to 3.0V
Output Current VI = GND or V
CC
I
OZL
3-STATE Output Leakage Current 3.6 −5 µAVO = 0.5V
I
OZH
3-STATE Output Leakage Current 3.6 5 µAVO = 3.0V
I
OZH
+ 3-STATE Output Leakage Current 3.6 10 µAVCC < VO 5.5V
I
CCH
Power Supply Current 3.6 0.19 mA Outputs HIGH
I
CCL
Power Supply Current 3.6 5 mA Outputs LOW
I
CCZ
Power Supply Current 3.6 0.19 mA Outputs Disabled
I
CCZ
+ Power Supply Current 3.6 0.19 mA VCC VO 5.5V,
Outputs Disabled
I
CC
Increase in Power Supply Current 3.6 0.2 mA One Input at VCC 0.6V (Note 7) Other Inputs at VCC or GND
Symbol Parameter
V
CC
(V)
TA = 25°C
Units
Conditions
CL = 50 pF, RL = 500
Min Typ Max
V
OLP
Quiet Output Maximum Dynamic V
OL
3.3 0.8 V (Note 9)
V
OLV
Quiet Output Minimum Dynamic V
OL
3.3 0.8 V (Note 9)
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74LVT244 •74LVTH244
AC Electrical Characteristics
Note 10: All typical valu es are at VCC = 3.3V, TA = 25°C. Note 11: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The
specification applies to any out puts switching in the same direction, either HIGH-to-LOW (t
OSHL
) or LOW-to-HIGH (t
OSLH
). Parameter guaranteed by design.
Capacitance (Note 12)
Note 12: Capacitanc e is m easured at frequency f = 1 MHz, per MIL-STD-883, Method 3012.
Symbol Parameter
TA = 40°C to +85°C
CL = 50 pF, RL = 500
Units
VCC = 3.3V ± 0.3V VCC = 2.7V
Min Typ Max Min Max
(Note 10)
t
PLH
Propagation Delay Data to Output 1.1 3.8 1.1 4.0
ns
t
PHL
1.3 3.9 1.3 4.2
t
PZH
Output Enable Time 1.1 4.5 1.1 5.3
ns
t
PZL
1.4 4.4 1.4 5.0
t
PHZ
Output Disable Time 1.9 4.9 1.9 5.1
ns
t
PLZ
1.8 4.4 1.8 4.4
t
OSHL
Output to Output Skew
1.0 1.0 ns
t
OSLH
(Note 11)
Symbol Parameter Conditions Typical Units
C
IN
Input Capacitance VCC = 0V, VI = 0V or V
CC
3pF
C
OUT
Output Capacitance VCC = 3.0V, VO = 0V or V
CC
6pF
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74LVT244 •74LVTH244
Physical Dimensions inches (millimeters) unless otherwise noted
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
Package Number M20B
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M20D
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74LVT244 •74LVTH244
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC20
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74LVT244 •74LVTH244 Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
Package Number MSA20
Fairchild does not assume any responsibility for use of any circuitry described, no circuit pate nt licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or syste ms which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea­sonably expected to result in a significant inju ry to the user.
2. A critical component i n any compon ent of a lif e support device or system whose failu re to perform can be rea­sonably expected to ca use the fa i lure of the life su pp ort device or system, or to affect its safety or effectiveness.
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