H =High voltage level
L =Low voltage level
X = Don’t care
Z =High impedance ”off” state
SV00010
LOGIC SYMBOL
2
4
6
8
1
11
13
15
17
19
1998 Nov 12
1A0
1A1
1A2
1A3
1OE
2A0
2A1
2A2
2A3
2OE
1Y0
1Y1
1Y2
1Y3
2Y0
2Y1
2Y2
2Y3
18
16
14
12
9
7
5
3
SV00011
3
Page 4
Philips Semiconductors Product specification
I
DC out ut current
mA
SYMBOL
PARAMETER
UNIT
I
mA
74LVT244B3.3V Octal buffer/line driver (3-State)
LOGIC SYMBOL (IEEE/IEC)
1
EN
2
4
6
8
19
EN
119
137
155
173
ABSOLUTE MAXIMUM RA TINGS
SYMBOL
V
CC
V
I
V
OUT
OUT
I
IK
I
OK
T
stg
DC supply voltage–0.5 to +4.6V
DC input voltage
DC output voltage
p
DC input diode currentVI < 0–50mA
DC output diode currentVO < 0–50mA
Storage temperature range–65 to 150°C
PARAMETERCONDITIONSRATINGUNIT
3
3
18
16
14
12
SV00012
1, 2
–0.5 to +7.0V
Output in Off or High state–0.5 to +7.0V
Output in Low state128
Output in High state–64
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
LIMITS
MINMAX
V
CC
V
V
V
I
OH
OL
∆t/∆vInput transition rise or fall rate; outputs enabled10ns/V
T
amb
DC supply voltage2.73.6V
Input voltage05.5V
I
High-level input voltage2.0V
IH
Low-level input voltage0.8V
IL
High-level output current–32mA
Low-level output current32
Low-level output current; current duty cycle ≤ 50%, f ≥ 1kHz64
Operating free-air temperature range–40+85°C
1998 Nov 12
4
Page 5
Philips Semiconductors Product specification
IIIn ut leakage current
4
µA
Data Pins
4
6
74LVT244B3.3V Octal buffer/line driver (3-State)
DC ELECTRICAL CHARACTERISTICS
LIMITS
SYMBOLPARAMETERTEST CONDITIONSTemp = -40°C to +85°CUNIT
MINTYP1MAX
V
V
V
I
OFF
I
HOLD
I
I
PU/PD
I
OZH
I
OZL
I
CCH
I
CCL
I
CCZ
∆I
NOTES:
1. All typical values are at T
2. This is the increase in supply current for each input at the specified voltage level other than V
3. This parameter is valid for any V
transition time of 100µsec is permitted. This parameter is valid for T
4. Unused pins at V
5. I
CCZ
6. This is the bus hold overdrive current required to force the input to the opposite logic state.
Waveform 1. Input (nAx) to Output (nYx) Propagation Delays
TEST CIRCUIT AND WAVEFORMS
2.7V
CC
OE INPUT
Yn OUTPUT
Yn OUTPUT
1.5V
t
PZL
t
PZH
1.5V
1.5V
1.5V
t
PLZ
t
PHZ
0V
3.0V
+ 0.3V
V
OL
V
OL
V
OH
V
OH
0V
SV00103
– 0.3V
Waveform 2. 3-State Output Enable and Disable Times
V
CC
V
OUT
R
L
C
L
R
L
PULSE
GENERATOR
V
IN
D.U.T.
R
T
Test Circuit for 3-State Outputs
SWITCH POSITION
TESTSWITCH
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
DEFINITIONS
RL = Load resistor; see AC CHARACTERISTICS for value.
C
= Load capacitance includes jig and probe capacitance;
L
see AC CHARACTERISTICS for value.
= Termination resistance should be equal to Z
R
T
pulse generators.
Open
6V
GND
OUT
of
6.0V
GND
Open
NEGATIVE
PULSE
POSITIVE
PULSE
FAMILY
74LVT
t
90%
10%
V
M
10%10%
t
THL
t
TLH
90%90%
V
M
W
(tF)
(tR)t
t
W
VM = 1.5V
Input Pulse Definition
INPUT PULSE REQUIREMENTS
AmplitudeRep. Ratet
2.7V
10MHz
V
M
V
W
500ns
M
AMP (V)
90%
0V
(tR)
t
TLH
(tF)
THL
AMP (V)
10%
0V
t
t
R
F
2.5ns 2.5ns
SV00092
1998 Nov 12
6
Page 7
Philips Semiconductors Product specification
74LVT244B3.3V Octal buffer/line driver (3-State)
SO20: plastic small outline package; 20 leads; body width 7.5 mmSOT163-1
1998 Nov
7
Page 8
Philips Semiconductors Product specification
74LVT244B3.3V Octal buffer/line driver (3-State)
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mmSOT339-1
1998 Nov
8
Page 9
Philips Semiconductors Product specification
74LVT244B3.3V Octal buffer/line driver (3-State)
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mmSOT360-1
1998 Nov
9
Page 10
Philips SemiconductorsProduct specification
74LVT244B3.3V Octal buffer/line driver (3-State)
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 05-96
Document order number:9397-750-04814
yyyy mmm dd
10
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