Product specification
Supersedes data of 1996 May 29
IC23 Data Handbook
1998 Feb 19
Page 2
Philips Semiconductors Product specification
74L VT2413.3V Octal buffer/line driver (3-State)
FEA TURES
•Octal bus interface
•3-State buffers
•Output capability: +64mA/-32mA
•TTL input and output switching levels
•Input and output interface capability to systems at 5V supply
DESCRIPTION
The 74LVT241 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.
The 74LVT241 device is an octal buffer that is ideal for driving bus
lines. The device features two Output Enables (1OE
controlling four of the 3-State outputs.
, 2OE), each
•Bus-hold data inputs eliminate the need for external pull-up
resistors to hold unused inputs
•Power-up 3-State
•Live insertion/extraction permitted
•No bus current loading when output is tied to 5V bus
•Latch-up protection exceeds 500mA per JEDEC Std 17
•ESD protection exceeds 2000V per MIL STD 883 Method 3015
and 200V per Machine Model.
QUICK REFERENCE DATA
SYMBOLPARAMETER
C
t
PLH
t
PHL
C
OUT
I
CCZ
IN
Propagation delay
nAx to nYx
CL = 50pF;
VCC = 3.3V
Input capacitanceVI = 0V or 3.0V4pF
Output capacitanceOutputs disabled; VO = 0V or 3.0V8pF
Total supply currentOutputs disabled; VCC = 3.6V0.12mA
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICADWG NUMBER
20-Pin Plastic SOL–40°C to +85°C74LVT241 D74LVT241 DSOT163-1
20-Pin Plastic SSOP Type II–40°C to +85°C74LVT241 DB74LVT241 DBSOT339-1
20-Pin Plastic TSSOP Type I–40°C to +85°C74LVT241 PW74LVT241PW DHSOT360-1
H =High voltage level
L =Low voltage level
X = Don’t care
Z =High impedance “off” state
ABSOLUTE MAXIMUM RATINGS
SYMBOL
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
3. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
1998 Feb 19
1, 2
PARAMETERCONDITIONSRATINGUNIT
V
V
CC
V
OUT
DC supply voltage–0.5 to +4.6V
DC input voltage
I
DC output voltage
3
3
Output in Off or High state–0.5 to +7.0V
–0.5 to +7.0V
Output in Low state128
OUT
I
IK
I
OK
T
stg
p
Output in High state–64
DC input diode currentVI < 0–50mA
DC output diode currentVO < 0–50mA
Storage temperature range–65 to 150°C
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3
Page 4
Philips Semiconductors Product specification
SYMBOL
PARAMETER
UNIT
I
mA
IIIn ut leakage current
4
µA
Data ins
4
6
74LVT2413.3V Octal buffer/line driver (3-State)
RECOMMENDED OPERATING CONDITIONS
LIMITS
MINMAX
V
CC
V
V
V
I
OH
OL
∆t/∆vInput transition rise or fall rate; outputs enabled10ns/V
T
amb
DC ELECTRICAL CHARACTERISTICS
SYMBOLPARAMETERTEST CONDITIONST
V
IK
V
OH
V
OL
I
OFF
I
HOLD
I
EX
I
PU/PD
I
OZH
I
OZL
I
CCH
I
CCL
I
CCZ
∆I
CC
NOTES:
1. All typical values are at T
2. This is the increase in supply current for each input at V
3. This parameter is valid for any V
transition time of 100µsec is permitted. This parameter is valid for T
4. Unused pins at V
5. I
CCZ
6. This is the bus hold overdrive current required to force the input to the opposite logic state.
DC supply voltage2.73.6V
Input voltage05.5V
I
High-level input voltage2.0V
IH
Low-level Input voltage0.8V
IL
High-level output current–32mA
Low-level output current32
Low-level output current; current duty cycle ≤ 50%; f ≥ 1kHz64
VCC = 3V; IOL = 32mA0.30.5
VCC = 3V; IOL = 64mA0.40.55
VCC = 0 or 3.6V; VI = 5.5V110
p
VCC = 3.6V; VI = VCC or GNDControl pins±0.1±1
VCC = 3.6V; VI = V
VCC = 3.6V; VI = 0
CC
p
0.11
–1-5
Output off currentVCC = 0V; VI or VO = 0 to 4.5V1±100µA
VCC = 3V; VI = 0.8V75150
Bus Hold current A inputs
VCC = 3V; VI = 2.0V–75–150
VCC = 0V to 3.6V; VCC = 3.6V±500
Current into an output in the
High state when VO > V
Power up/down 3-State
output current
3
VO = 5.5V; VCC = 3.0V60125µA
CC
VCC = ≤ 1.2V; VO = 0.5V to VCC; VI = GND or VCC;
OE/OE = Don’t care
±1±100µA
3-State output High currentVCC = 3.6V; VO = 3.0V15µA
3-State output Low currentVCC = 3.6V; VO = 0.5V–1–5µA
VCC = 3.6V; Outputs High, VI = GND or V
Quiescent supply currentVCC = 3.6V; Outputs Low, VI = GND or V
VCC = 3.6V; Outputs Disabled; VI = GND or V
Additional supply current
per input pin
is measured with outputs pulled to VCC or GND.
or GND
CC
2
amb
= 25°C.
CC
VCC = 3.0 to 3.6V; One input at V
Other inputs at VCC or GND
–0.6V .
between 0V and 1.2V with a transition time of up to 10msec. From V
CC
CC
= 25°C only.
amb
-0.6V;
I
00.120.19
CC,
O =
I
0312mA
CC,
O =
CC,
5
I
= 0
O
0.120.19
0.10.25mA
= 1.2V to VCC = 3.3V ± 10% a
CC
MAX
µA
1998 Feb 19
4
Page 5
Philips Semiconductors Product specification
74LVT2413.3V Octal buffer/line driver (3-State)
AC CHARACTERISTICS
GND = 0V; tR = tF = 2.5ns; CL = 50pF; RL = 500Ω;T
SYMBOLPARAMETERWAVEFORM
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
PZH
t
PZL
t
PHZ
t
PLZ
Propagation delay
nAx to nYx
Output enable time
to High and Low level
1OE to 1Y
n
Output disable time
from High and Low level
1OE to 1Y
n
Output enable time
to High and Low level
2OE to 2Y
n
Output disable time
from High and Low level
2OE to 2Y
n
NOTE:
1. All typical values are at V
= 3.3V and T
CC
amb
= –40°C to +85°C.
amb
= 25°C.
LIMITS
T
= –40°C to +85°C
amb
VCC = +3.3V ±0.3V
2.8
2.8
3.2
3.1
3.6
2.9
3.8
3.8
3.1
2.8
1
MAXMAX
3.8
3.8
4.4
4.3
5.2
4.2
5.1
5.0
4.5
4.0
MINTYP
1
2
2
2
2
1
1
1
1
2
1.6
1
1
1
1
VCC = 2.7VUNIT
4.0
4.0
5.0
4.9
5.4
4.3
5.6
5.4
5.0
4.3
ns
ns
ns
ns
ns
AC WAVEFORMS
VM = 1.5V, VIN = GND to 3.0V
INPUT
OUTPUT
1.5V
t
PLH
1.5V1.5V
Waveform 1. Input (An) to Output (Yn) Propagation Delays
1.5V
t
PHL
3 V
0 V
V
V
SA00028
OE INPUT
OE INPUT
OH
OL
Yn OUTPUT
Yn OUTPUT
V
M
t
PZL
V
M
t
PZH
V
M
V
M
t
PLZ
t
PHZ
3.5V
V
OL
V
OL
V
OH
V
OH
+ 0.3V
– 0.3V
0V
SA00041
Waveform 2. 3–State Output Enable and Disable Times
1998 Feb 19
5
Page 6
Philips Semiconductors Product specification
74LVT2413.3V Octal buffer/line driver (3-State)
TEST CIRCUIT AND WAVEFORMS
V
CC
PULSE
GENERATOR
V
IN
D.U.T.
R
T
V
OUT
R
L
C
L
R
L
Test Circuit for 3-State Outputs
SWITCH POSITION
TESTSWITCH
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
DEFINITIONS
RL = Load resistor; see AC CHARACTERISTICS for value.
= Load capacitance includes jig and probe capacitance;
C
L
see AC CHARACTERISTICS for value.
= Termination resistance should be equal to Z
R
T
pulse generators.
Open
6V
GND
OUT
of
6.0V
GND
Open
NEGATIVE
PULSE
POSITIVE
PULSE
FAMILY
74LVT
t
90%
10%
V
M
10%10%
t
THL
t
TLH
90%90%
V
M
W
(tF)
(tR)t
t
W
90%
V
M
V
M
10%
VM = 1.5V
Input Pulse Definition
INPUT PULSE REQUIREMENTS
AmplitudeRep. Ratet
t
W
2.7V10MHz500ns 2.5ns 2.5ns
AMP (V)
0V
(tR)
t
TLH
(tF)
THL
AMP (V)
0V
t
R
F
SV00092
1998 Feb 19
6
Page 7
Philips Semiconductors Product specification
74LVT2413.3V Octal buffer/line driver (3-State)
SO20:plastic small outline package; 20 leads; body width 7.5 mmSOT163-1
1998 Feb 19
7
Page 8
Philips Semiconductors Product specification
74LVT2413.3V Octal buffer/line driver (3-State)
SSOP20:plastic shrink small outline package; 20 leads; body width 5.3 mmSOT339-1
1998 Feb 19
8
Page 9
Philips Semiconductors Product specification
74LVT2413.3V Octal buffer/line driver (3-State)
TSSOP20:plastic thin shrink small outline package; 20 leads; body width 4.4 mmSOT360-1
1998 Feb 19
9
Page 10
Philips SemiconductorsProduct specification
74LVT2413.3V Octal buffer/line driver (3-State)
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 05-96
Document order number:9397-750-03517
yyyy mmm dd
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