is used to determine the dynamic power dissipation (PD in µW)
PD
= CPD × V
P
D
f
= input frequency in MHz; CL = output load capacity in pF;
i
= output frequency in MHz; VCC = supply voltage in V;
f
o
(C
L
2. The condition is V
= 25°C; tr = tf ≤ 2.5 ns
amb
SYMBOL
t
PHL/tPLH
f
max
C
I
C
PD
2
× fi (CL × V
CC
2
× V
× fo) = sum of the outputs.
CC
= GND to V
I
PARAMETERCONDITIONSTYPICALUNIT
Propagation delay
nCP to nQ, nQ
nSD to nQ, nQ
nR
to nQ, nQ
D
Maximum clock frequency250MHz
Input capacitance5.0pF
Power dissipation capacitance per flip-flopNotes 1 and 230pF
CC.
2
× fo) + (V
CC
2
/RL) × duty factor LOW, where:
O
74LVC74A
DESCRIPTION
The 74LVC74A is a high-performance, low-voltage Si-gate CMOS
device and superior to most advanced CMOS compatible TTL
families.
The 74LVC74A is a dual positive edge triggered, D-type flip-flop with
individual data (D) inputs, clock (CP) inputs, set (S
inputs; also complementary Q and Q
outputs.
The set and reset are asynchronous active LOW inputs and operate
independently of the clock input. Information on the data input is
transferred to the Q output on the LOW-to-HIGH transition of the
clock pulse. The D inputs must be stable one set-up time prior to the
LOW-to-HIGH clock transition, for predictable operation.
Schmitt-trigger action in all data inputs makes the circuit highly
tolerant to slower clock rise and fall times.
CL = 50 pF;
VCC = 3.3 V
3.6
3.5
3.5
) and (RD)
D
ns
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICADWG NUMBER
14-Pin Plastic SO–40°C to +85°C74LVC74A D74LVC74A DSOT108-1
14-Pin Plastic SSOP Type II–40°C to +85°C74LVC74A DB74LVC74A DBSOT337-1
14-Pin Plastic TSSOP Type I–40°C to +85°C74LVC74A PW74LVC74APW DHSOT402-1
PIN CONFIGURATION
1R
1
D
1D
2
1CP
3
1S
4
D
1Q
5
1Q
6
78
GND
1998 Jun 17853-2070 19589
14
13
12
11
10
9
SV00491
V
2R
2D
2CP
2S
2Q
2Q
CC
D
D
LOGIC SYMBOL (IEEE/IEC)
4
3
2
1
10
11
12
13
2
S
C1
1D
R
S
C2
2D
R
5
6
9
8
SV00332
Page 3
Philips Semiconductors Product Specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
H = HIGH voltage level
L = LOW voltage level
X = don“t care
° = LOW-to-HIGH CP transition
Q
= state after the next LOW-to-HIGH CP transition
n+1
FUNCTIONAL DIAGRAM
R
D
CPDQQ
INPUTSOUTPUTS
R
D
CPDQ
4
1S
D
S
D
DQ
CP FF1
Q
R
D
S
D
DQ
CP FF2
Q
R
D
1Q
1Q
2Q
2Q
1D2
3
1CP
1
1R
D
10
2S
D
2D12
2CP11
13
2R
D
n+1
5
6
9
8
Q
n+1
1998 Jun 17
SV00494
3
Page 4
Philips Semiconductors Product Specification
SYMBOL
PARAMETER
CONDITIONS
UNIT
V
V
mW
Dual D-type flip-flop with set and reset;
positive-edge trigger
LOGIC DIAGRAM (ONE FLIP-FLOP)
C
C
D
C
R
D
S
D
CP
C
C
RECOMMENDED OPERA TING CONDITIONS
DC supply voltage (for max. speed performance)2.73.6
CC
DC supply voltage (for low-voltage applications)1.23.6
T
V
V
amb
tr, t
DC input voltage range05.5V
I
DC output voltage range0V
O
Operating free-air temperature range–40+85°C
Input rise and fall times
f
C
C
C
C
C
VCC = 1.2 to 2.7V
VCC = 2.7 to 3.6V
74LVC74A
Q
Q
SV00495
LIMITS
MINMAX
CC
0
0
20
10
V
ns/V
ABSOLUTE MAXIMUM RATINGS
1
In accordance with the Absolute Maximum Rating System (IEC 134)
Voltages are referenced to GND (ground = 0V)
SYMBOLPARAMETERCONDITIONSRATINGUNIT
I
GND
V
I
V
I
OK
V
I
T
DC supply voltage–0.5 to +6.5V
CC
DC input diode currentVIt 0–50mA
IK
DC input voltageNote 2–0.5 to +5.5V
I
DC output diode currentV
DC output voltageNote 2–0.5 to VCC +0.5V
O
DC output source or sink currentVO = 0 to V
O
, I
DC VCC or GND current"100mA
CC
Storage temperature range–65 to +150°C
stg
uVCC or VO t 0"50mA
O
CC
"50mA
Power dissipation per package
P
TOT
– plastic mini-pack (SO)above +70°C derate linearly with 8 mW/K500
– plastic shrink mini-pack (SSOP and TSSOP)above +60°C derate linearly with 5.5 mW/K500
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
1998 Jun 17
4
Page 5
Philips Semiconductors Product Specification
VIHHIGH level Input voltage
V
VILLOW level Input voltage
V
VOHHIGH level output voltage
V
IIInput leakage current
V
V
GND
"0.1
"5µA
t
ns
Dual D-type flip-flop with set and reset;
74LVC74A
positive-edge trigger
DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions voltages are referenced to GND (ground = 0V)
LIMITS
SYMBOLPARAMETERTEST CONDITIONSTemp = -40°C to +85°CUNIT
MINTYP1MAX
V
LOW level output voltage
OL
p
I
CC
∆I
Quiescent supply currentVCC = 3.6V; VI = VCC or GND; IO = 00.110µA
Additional quiescent supply current per
CC
input pin
NOTES:
1. All typical values are at V
p
p
p
= 3.3V and T
CC
amb
= 25°C.
VCC = 1.2VV
VCC = 2.7 to 3.6V2.0
VCC = 1.2VGND
VCC = 2.7 to 3.6V0.8
VCC = 2.7V; VI = VIH or VIL; IO = –12mAVCC*0.5
VCC = 3.0V; VI = VIH or VIL; IO = –100µAVCC*0.2V
VCC = 3.0V; VI = VIH or V
VCC = 3.0V; VI = VIH or V
IO = –18mAVCC*0.6
IL;
IO = –24mAVCC*1.0
IL;
VCC = 2.7V; VI = VIH or VIL; IO = 12mA0.40
VCC = 3.0V; VI = VIH or VIL; IO = 100µAGND0.20
VCC = 3.0V; VI = VIH or V
;
= 3.6V;
CC
= 5.5V or
I
IO = 24mA0.55
IL;
VCC = 2.7V to 3.6V; VI = VCC –0.6V; IO = 05500µA
CC
CC
V
AC CHARACTERISTICS
GND = 0 V; tr = tf v 2.5 ns; CL = 50 pF; RL = 500; T
SYMBOLPARAMETERWAVEFORM
Propagation delay
nCP to nQ, nQ
t
t
PHL
PLH
Propagation delay
/
nSD to nQ, nQ
Propagation delay
nRD to nQ, nQ
Clock pulse width HIGH or LOWFigure 13.31.3–––
Set or reset pulse width LOWFigure 23.31.7–––
Removal time set or resetFigure 21–3–––ns
Set-up time nD to nCPFigure 12.00.8–––ns
Hold time nD to nCPFigure 11–0.7–––ns
Maximum clock pulse frequencyFigure 1150250–––MHz
t
f
W
rem
t
su
t
h
max
NOTE:
1. These typical values are at V
= 3.3V and T
CC
amb
= –40C to +85C
amb
= 25°C.
Figures 1, 31.53.65.2–6.0ns
Figures 2, 31.53.55.4–6.4ns
Figures 2, 31.53.55.4–6.4ns
LIMITS
VCC = 3.3V ±0.3VVCC = 2.7V
MINTYP
1
MAXMINMAX
UNIT
1998 Jun 17
5
Page 6
Philips Semiconductors Product Specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
AC WAVEFORMS
VM = 1.5 V at VCC 2.7 V
= 0.5 S VCC at VCC < 2.7 V
V
M
V
and VOH are the typical output voltage drop that occur with the
OL
output load.
V
I
nD INPUT
GND
V
I
nCP INPUT
GND
V
OH
nQ OUTPUT
V
OL
V
OH
nQ OUTPUT
V
OL
NOTE: The shaded areas indicate when the inputis permitted to change for predictable
output performance.
Figure 1. Clock (nCP) to output (nQ, nQ) propagation delays,
clock pulse width, nD to nCP set-up times,
the nCP to nD hold times, output transition times
and maximum clock pulse frequency.
V
M
t
h
t
su
1/f
max
V
M
t
W
t
PHL
V
M
V
M
t
PLH
t
h
t
su
t
PLH
t
PHL
SV00489
TEST CIRCUIT
PULSE
GENERATOR
SWITCH POSITION
TESTS
t
PLH/tPHL
Figure 3. Load circuitry for switching times.
V
I
Open
74LVC74A
S
1
500Ω
500Ω
SV00903
2 * V
Open
GND
CC
V
CC
V
O
D.U.T.
R
T
V
1
CC
< 2.7VV
50pF
C
L
V
I
CC
2.7V2.7–3.6V
V
I
nCP INPUT
GND
INPUT
nS
D
GND
INPUT
nR
D
GND
V
OH
nQ OUTPUT
V
OL
V
OH
nQ
OUTPUT
V
OL
V
I
V
M
t
V
I
W
t
PLH
V
M
V
M
t
PHL
t
W
V
M
t
PHL
t
PLH
V
M
t
rem
SV00490
Figure 2. Set (nSD) and reset (nRD) input to output (nQ, nQ)
propagation delays, the set and reset pulse widths
and the nR
D to nCP removal time.
1998 Jun 17
6
Page 7
Philips SemiconductorsProduct specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
SO14: plastic small outline package; 14 leads; body width 3.9 mmSOT108-1
74LVC74A
1998 Jun 17
7
Page 8
Philips SemiconductorsProduct specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mmSOT337-1
74LVC74A
1998 Jun 17
8
Page 9
Philips SemiconductorsProduct specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mmSOT402-1
74LVC74A
1998 Jun 17
9
Page 10
Philips SemiconductorsProduct specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
Data sheet status
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1]
74LVC74A
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print codeDate of release: 06-96
Document order number:9397-750-04487
yyyy mmm dd
10
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