Datasheet 74LVC4245ADB, 74LVC4245AD Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

74LVC4245A

Octal dual supply translating
transceiver; 3-state

Product specification
Supersedes data of 1998 Jul 29
File under Integrated Circuits, IC24

1999 Jun 15

Philips Semiconductors Product specification

Octal dual supply translating transceiver; 3-state 74LVC4245A

FEATURES

• In accordance with JEDEC
standard no. 8-1A

• Wide supply voltage range:
3 V port: 1.5 to 3.6 V
5 V port: 1.5 to 5.5 V

DESCRIPTION

The 74LVC4245A is a high-performance, low-power, low-voltage, Si-gate
CMOS device, superior to most advanced CMOS compatible TTL families.

The 74LVC4245A is an octal dual supply translating transceiver featuring
non-inverting 3-state bus compatible outputs in both send and receive
directions. It is designed to interface between a 3 and 5 V bus in a mixed 3/5 V
supply environment.

• CMOS low power consumption

• Direct interface with TTL levels

• Control inputs accept voltages up

The 74LVC4245A features an output enable (OE) input for easy cascading and
a send/receive (DIR) input for direction control. (OE) controls the outputs so
that the buses are effectively isolated.

to 5.5 V.

In suspend mode, when V

is zero, there will be no current flow from one

CCA

supply to the other supply. The A-outputs must be set 3-state and the voltage
on the A-bus must be smaller than V

(typ. 0.7 V). V

diode

CCA

≥ V

CCB

suspend mode).

QUICK REFERENCE DATA

GND = 0 V; T

=25°C; tr=tf≤2.5 ns.

amb

SYMBOL PARAMETER CONDITIONS TYPICAL UNIT

t

PHL/tPLH

C

I/O

C

PDA

C

PDB

propagation delay CL=50pF

A

to B

n

n

B

to A

n

n

V

= 5.0 V 4.0 ns

CCA

V

= 3.3 V 4.0 ns

CCB

input/output capacitance 10.0 pF
A port

to B

A

n

n

B

to A

n

n

VI= GND to VCC; note 1 7.8 pF
VI= GND to VCC; note 1 27.9 pF

B port

to B

A

n

n

B

to A

n

n

VI= GND to VCC; note 1 26 pF
VI= GND to VCC; note 1 10.4 pF

(except in

Note

1. C

is used to determine the dynamic power dissipation (PDin µW).

PD

PD=CPD× V

2

× fi+ Σ(CL× V

CC

2

× fo) where:

CC

fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC= supply voltage in Volts;
Σ(CL× V

2

× fo) = sum of the outputs.

CC

1999 Jun 15 2

Philips Semiconductors Product specification

Octal dual supply translating transceiver; 3-state 74LVC4245A

FUNCTION TABLE

See note 1.

INPUT INPUT/OUTPUT

OE DIR A

n

B

n

L L A = B inputs
L H inputs B = A

HX Z Z

Note

1. H = HIGH voltage level;

L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF-state.

ORDERING INFORMATION

PACKAGE

OUTSIDE NORTH

AMERICA

NORTH AMERICA

TEMPERATURE

RANGE

PINS PACKAGE MATERIAL CODE

74LVC4245AD 74LVC4245AD −40 to +85 °C 24 SO plastic SOT137-1
74LVC4245ADB 74LVC4245ADB 24 SSOP plastic SOT340-1
74LVC4245APW 74LVC4245ADH 24 TSSOP plastic SOT355-1

PINNING

PIN SYMBOL DESCRIPTION

1V

CCA

DC supply voltage (5 V bus)
2 DIR direction control
3, 4, 5, 6, 7, 8, 9 and 10 A

0

to A

7

data inputs/outputs
11, 12 and 13 GND ground (0 V)
14, 15, 16, 17, 18, 19, 20 and 21 B
22
23 and 24 V

7

to B

0

data inputs/outputs

OE output enable input (active LOW)

CCB

DC supply voltage (3 V bus)

1999 Jun 15 3

Philips Semiconductors Product specification

Octal dual supply translating transceiver; 3-state 74LVC4245A

handbook, halfpage

handbook, halfpage

V

1

CCA

2

DIR

A

3

0

A

4

1

A

5

2

A

6
A
A
A
A

GND
GND

3
4
5
6
7

4245

7

8

9

10
11
12

MNA451

Fig.1 Pin configuration.

22

G3
3EN1

2

3EN2

1

3

4
5
6
7
8
9

10

2

MNA452

V

24

CCB

23

V

CCB

22

OE

21

B

0

20

B

1

19

B

2

18

B

3

17

B

4

16

B

5

15

B

6

14

B

7

13

GND

21

20
19
18
17
16
15
14

handbook, halfpage

10

DIR

2

OE

B

0

B

1

B

2

B

3

B

4

B

5

B

6

B

7

MNA453

22

21

20

19

18

17

16

15

14

A

0

3

A

1

4

A

2

5

A

3

6

A

4

7

A

5

8

A

6

9

A

7

Fig.3 IEC logic symbol.

1999 Jun 15 4

Fig.2 Logic symbol.

Philips Semiconductors Product specification

Octal dual supply translating transceiver; 3-state 74LVC4245A

RECOMMENDED OPERATING CONDITIONS

SYMBOL PARAMETER CONDITIONS

UNIT

MIN. MAX.

LIMITS

V

CCA

DC supply voltage 5 V port

V

CCA

≥ V

(see Fig.5) 1.5 5.5 V

CCB

(for maximum speed performance)

V

CCB

DC supply voltage 3 V port

V

CCA

≥ V

(see Fig.5) 1.5 3.6 V

CCB

(for low-voltage applications)

V

I

V

I/O

DC input voltage range (control inputs) 0 5.5 V
DC input voltage range; output 3-state 0 5.5 V
DC output voltage range; output HIGH or

0V

CC

V

LOW state

T

amb

operating ambient temperature range see DC and AC characteristics

−40 +85 °C

per device

t

r,tf

input rise and fall times V

= 2.7 to 3.0 V 0 20 ns/V

CCB

V

= 3.0 to 3.6 V 0 10

CCB

V

= 3.0 to 4.5 V 0 20

CCA

= 4.5 to 5.5 V 0 10

V

CCA

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134). Voltages are referenced to GND (ground = 0 V).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V
V
I
V
I
V

CCA
CCB

IK

I

OK

I/O

DC supply voltage 5 V port −0.5 +6.5 V
DC supply voltage 3 V port −0.5 +4.6 V
DC input diode current VI<0 −−50 mA
DC input voltage note 1 −0.5 +6.5 V
DC output diode current VO>VCC or VO<0 −±50 mA
DC output voltage; output HIGH or LOW note 1 −0.5 VCC+ 0.5 V
DC input voltage; output 3-state note 1 −0.5 +6.5 V

I

O

I

GND

T
P

, I

stg
tot

DC output diode current VO=0toV
DC VCC or GND current −±100 mA

CC

CC

−±50 mA

storage temperature −65 +150 °C
power dissipation per package

plastic mini-pack (SO) above 70 °C derate linearly

− 500 mW

with 8 mW/K

plastic shrink mini-pack (SSOP and
TSSOP)

above 60 °C derate linearly
with 5.5 mW/K

− 500 mW

Note

1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

1999 Jun 15 5

Philips Semiconductors Product specification

Octal dual supply translating transceiver; 3-state 74LVC4245A

DC CHARACTERISTICS

Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).

SYMBOL PARAMETER

V

IH

HIGH-level input voltage 3 V port 2.7 to 3.6 2.0 −−V

TEST CONDITIONS T

V

OTHER

CCA/B

(V)

MIN. TYP.

(°C)

amb

−40 to +85

(1)

MAX.

5 V port 4.5 to 5.5 2.0 −−

VILLOW-level input voltage 3 V port 2.7 to 3.6 −−0.8 V

5 V port 4.5 to 5.5 −−0.8

V

OH

V

OL

I

I

I

IHZ/IILZ

HIGH-level output voltage
(3 V port)

HIGH-level output voltage
(5 V port)

LOW-level output voltage
(3 V port)

LOW-level output voltage
(5 V port)

VI=VIHor VIL; IO= −12 mA 2.7 VCC− 0.5 −−V
V
V
V
V
V

or VIL; IO= −100 µA 3.0 VCC− 0.2 V

I=VIH

or VIL; IO= −24 mA 3.0 VCC− 1.0 −−

I=VIH

or VIL; IO= −12 mA 4.5 VCC− 0.5 −−V

I=VIH

or VIL; IO= −100 µA 4.5 VCC− 0.2 V

I=VIH

or VIL; IO= −24 mA 4.5 VCC− 0.8 −−

I=VIH

CC

CC

−

−

VI=VIHor VIL; IO=12mA 2.7 −−0.40 V
V
V
V
V
V

or VIL; IO= 100 µA 3.0 −−0.20

I=VIH

or VIL; IO=24mA 3.0 −−0.55

I=VIH

or VIL; IO=12mA 4.5 −−0.40 V

I=VIH

or VIL; IO= 100 µA 4.5 −−0.20

I=VIH

or VIL; IO=24mA 4.5 −−0.55

I=VIH

input leakage current VI= 5.5 V or GND; note 2 3.6 −±0.1 ±5 µA
input current for common

VI=VCCor GND 3.6 − 0.1 ±15 µA

I/O pins (3 V port)
input current for common

V

I=VCC

or GND 5.5 − 0.1 ±15 µA

I/O pins (5 V port)

I

OZ

I

CC

3-state output OFF-state
current (3 V port)

3-state output OFF-state
current (5 V port)

quiescent supply current

VI=VIHor VIL;

3.6 − 0.1 ±5 µA

VO=VCCor GND
V

I=VIH

or VIL;

5.5 − 0.1 ±5 µA

VO=VCCor GND
VI=VCCor GND; IO= 0 3.6 − 0.1 10 µA

(3 V port)
quiescent supply current

V

I=VCC

or GND; IO= 0 5.5 − 0.1 10 µA

(5 V port)

∆I

CC

additional quiescent supply

VI=VCC− 0.6 V; IO= 0 2.7 to 3.6 − 5 500 µA
current per control pin (3 V
port)

additional quiescent supply

V

I=VCC

− 2.1 V; IO= 0 4.5 to 5.5 − 5 500 µA
current per control pin (5 V
port)

UNIT

Notes

1. All typical values are at V

CCA

= 5.0 V, V

= 3.3 V and T

CCB

2. Not for I/O pins.

1999 Jun 15 6

amb

=25°C.

Philips Semiconductors Product specification

Octal dual supply translating transceiver; 3-state 74LVC4245A

AC CHARACTERISTICS

GND = 0 V; t

SYMBOL PARAMETER WAVEFORMS

t

PHL/tPLH

t

PZH/tPZL

t

PHZ/tPLZ

≤2.5 ns; CL= 50 pF; T

r=tf

propagation delay
Anto B

n

propagation delay
B

to A

n

n

3-state output enable
time OE to A

n

3-state output enable
time

OE to B

n

3-state output disable
time OE to A

n

3-state output disable
time

OE to B

n

= −40 to 85 °C.

amb

LIMITS

V

=5V±0.5 V

CCA

V

= 3.3 V ± 0.3 V V

CCB

MIN. TYP.

(1)

MAX. MIN. TYP.

CCB

= 2.7 V

(2)

MAX.

see Figs 4 and 7 1.5 4.0 6.5 1.5 4.5 7.0 ns

see Figs 4 and 7 1.5 4.0 6.5 1.5 4.5 7.0 ns

see Figs 6 and 7 1.5 6.2 10 1.5 7.0 11.0 ns

see Figs 6 and 7 1.5 5.0 8.1 1.5 5.7 8.7 ns

see Figs 6 and 7 1.5 5.3 7.5 1.5 5.7 8.0 ns

see Figs 6 and 7 1.5 5.8 7.8 1.5 6.2 8.5 ns

UNIT

Notes

1. Typical values are measured at V

2. Typical values are measured at V

AC WAVEFORMS

handbook, halfpage

An, B
INPUT

Bn, A

OUTPUT

VM= 1.5V at 2.7V ≤ V
VM= 0.5V
VOL and VOH are typical output voltage drop that occur

with the output load.

V

I

n

GND

t

V

OH

n

V

OL

at V

CCA

CCA

PHL

≤ 3.6V;

CCB

≥ 4.5V;

V

M

V

M

= 5.0 V and V

CCA

= 5.0 V and T

CCA

t

PLH

MNA366

= 3.3 V and T

CCB

=25°C.

amb

amb

3.9

handbook, halfpage

V

CCB
(V)

V

3.6

3.3

3.0

2.7

2.4

2.1

1.8

1.5

1.2

0.9

1.5 2.7 5.7

=25°C.

≥ V

CCA

CCB

Full operation

MNA454

3.92.1 4.5 5.13.3

Complies with TTL levels

V

CCA

(V)

Fig.4 The input (An, Bn) to output (Bn, An)

propagation delays.

1999 Jun 15 7

Fig.5 Supply operation area.

Philips Semiconductors Product specification

Octal dual supply translating transceiver; 3-state 74LVC4245A

handbook, full pagewidth

VM= 1.5V at 2.7V ≤ V
VM= 0.5V
VX=VOL+0.3VatV
VX=VOL+ 0.1 (V

CCA

at V

≥ 4.5 V;

CCA

CCB

− VOL)atV

CCA

CCB

≤ 3.6 V;

≤ 3.6 V;

OE INPUT

OUTPUT
LOW-to-OFF
OFF-to-LOW

OUTPUT
HIGH-to-OFF
OFF-to-HIGH

≥ 4.5 V

CCA

V

I

V

M

GND

t

PLZ

V

CC

V

CCB

X

V

Y

≤ 3.6 V;

outputs

disabled

CCA

V

OL

V

OH

GND

VY=VOH− 0.3VatV
VY=VOH− 0.1 (VOH− GND) at V
VOL and VOH are typical output voltage drop that occur with the output load.

t

PHZ

outputs

enabled

≥ 4.5 V;

t

PZL

t

PZH

V

M

V

M

outputs
enabled

MNA367

Fig.6 The 3-state enable and disable times.

handbook, full pagewidth

V

CC

V

I

V

CC

D.U.T.

R

T

V

I

V

CC

2.7 V

3.0 V

TEST S

t

PLH/tPHL

t

PLZ/tPZL

t

PHZ/tPZH

open
2 × V
GND

1

CC

PULSE

GENERATOR

for A and B port
<2.7 V

for B port

2.7 to 3.6 V
for A port

4.5 to 5.5 V

Fig.7 Load circuitry for switching times.

1999 Jun 15 8

S1

2 × V

CC

open

R

L

V

O

C
50 pF

Definitions for test circuit:
RL= Load resistor; see chapter “AC characteristics”.
CL= Load capacitance including jig and probe capacitance

(see chapter “AC characteristics”).
R

T

impedance Z

500 Ω

R

L

= Termination resistance should be equal to the output

L

500 Ω

of the pulse generator.

0

GND

MNA368

Philips Semiconductors Product specification

Octal dual supply translating transceiver; 3-state 74LVC4245A

PACKAGE OUTLINES

SO24: plastic small outline package; 24 leads; body width 7.5 mm

D

c

y

Z

24

pin 1 index

1

e

13

12

w M

b

p

SOT137-1

E

H

E

Q

A

2

A

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

mm

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

A

max.

2.65

0.10

OUTLINE
VERSION

SOT137-1

A1A2A

0.30

2.45

0.10

2.25

0.012

0.096

0.004

0.089

IEC JEDEC EIAJ

075E05 MS-013AD

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

(1)E(1) (1)

cD

15.6

7.6

15.2

7.4

0.61

0.30

0.29

0.050

0.60

REFERENCES

1999 Jun 15 9

eHELLpQ

1.27

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

0.25

0.25 0.1

0.01

0.01

EUROPEAN

PROJECTION

ywv θ

Z

0.9

0.4

8

0.004

ISSUE DATE

0.035

0.016

95-01-24
97-05-22

0

o
o

Philips Semiconductors Product specification

Octal dual supply translating transceiver; 3-state 74LVC4245A

SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm

D

c

y

Z

24 13

A

2

A

pin 1 index

1

SOT340-1

E

H

E

Q

L

p

L

(A )

A

X

v M

A

A

3

θ

112

w M

b

e

DIMENSIONS (mm are the original dimensions)

UNIT A

mm

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

A

max.

2.0

OUTLINE
VERSION

SOT340-1 MO-150AG

0.21

0.05

A2A

1

1.80

1.65

IEC JEDEC EIAJ

0.25

b

3

p

0.38

0.25

p

cD

0.20

8.4

0.09

8.0

REFERENCES

0 2.5 5 mm

scale

(1)E(1) (1)

eHELLpQZywv θ

5.4

0.65 1.25

5.2

7.9

7.6

1.03

0.63

detail X

0.9

0.7

EUROPEAN

PROJECTION

0.13 0.10.2

0.8

0.4

ISSUE DATE

93-09-08
95-02-04

o

8

o

0

1999 Jun 15 10

Philips Semiconductors Product specification

Octal dual supply translating transceiver; 3-state 74LVC4245A

TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm

D

c

y

Z

24

pin 1 index

13

A

2

A

1

112

w M

b

e

p

E

H

E

detail X

SOT355-1

A

X

v M

A

Q

(A )

3

A

θ

L

p

L

0 2.5 5 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT A

mm

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

A

max.

1.10

OUTLINE
VERSION

SOT355-1 MO-153AD

0.15

0.05

A2A

1

0.95

0.80

IEC JEDEC EIAJ

0.25

b

3

p

0.30

0.19

(1)E(2) (1)

cD

0.2

7.9

4.5

0.1

REFERENCES

7.7

4.3

0.65

1999 Jun 15 11

eHELLpQZywv θ

6.6

6.2

0.75

0.50

0.4

0.3

EUROPEAN

PROJECTION

0.13 0.10.21.0

0.5

0.2

ISSUE DATE

93-06-16
95-02-04

o

8

o

0

Philips Semiconductors Product specification

Octal dual supply translating transceiver; 3-state 74LVC4245A

SOLDERING
Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Jun 15 12

Philips Semiconductors Product specification

Octal dual supply translating transceiver; 3-state 74LVC4245A

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

WAVE REFLOW

(1)

BGA, SQFP not suitable suitable

SOLDERING METHOD

HLQFP, HSQFP, HSOP, SMS not suitable

(3)

PLCC

, SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

(2)

(3)(4)
(5)

suitable

suitable
suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1999 Jun 15 13

Philips Semiconductors Product specification

Octal dual supply translating transceiver; 3-state 74LVC4245A

NOTES

1999 Jun 15 14

Philips Semiconductors Product specification

Octal dual supply translating transceiver; 3-state 74LVC4245A

NOTES

1999 Jun 15 15

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
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Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. [phone], Fax. [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

1999 66

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 245004/03/pp16 Date of release: 1999Jun 15 Document order number: 9397 750 06037