is used to determine the dynamic power dissipation (PD in µW)
1C
PD
= CPD V
P
D
= input frequency in MHz; CL = output load capacity in pF;
f
i
f
= output frequency in MHz; VCC = supply voltage in V;
o
(C
= 25°C; tr =tf 2.5 ns
amb
CC
2
V
L
fo) = sum of the outputs.
CC
PARAMETERCONDITIONSTYPICALUNIT
Propagation delay
CP to Qn;
to Q
MR
n
Input capacitance5.0pF
Power dissipation
capacitance per flip-flop
2
x fi (CL V
2
fo) where:
CC
DESCRIPTION
The 74LVC273 is a low-voltage Si-gate CMOS device, superior to
most advanced CMOS compatible TTL families.
The 74LVC273 has eight edge-triggered , D-type flip-flops with
individual D inputs and Q outputs. The common clock (CP) and
master reset (MR
simultaneously . The state of each D input, one set-up time before
the LOW-to-HIGH clock transition, is transferred to the
corresponding output (Qn) of the flip-flop.
All outputs will be forced LOW independently of clock or data inputs
by a LOW voltage level on the MR
The device is useful for applications where the true output only is
required and the clock and master reset are common to all storage
elements.
CL = 50pF
VCC = 3.3V
VI = GND to V
CC
) inputs load and reset (clear) all flip-flops
input.
6.0
6.0
1
22pF
ns
ORDERING INFORMATION
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICADWG NUMBER
20-Pin Plastic SO–40°C to +85°C74LVC273 D74LVC273 DSOT163-1
20-Pin Plastic SSOP Type II–40°C to +85°C74LVC273 DB74LVC273 DBSOT339-1
20-Pin Plastic TSSOP Type I–40°C to +85°C74LVC273 PW74LVC273PW DHSOT360-1
PIN CONFIGURATION
1
2
Q0
3
D0
4
D1
5
Q1
6
Q2
7
D2
8
D3
9
Q3
GND
20MR
19
18
17
16
15
14
13
12
1110
SY00051
V
Q7
D7
D6
Q6
Q5
D5
D4
Q4
CP
CC
PIN DESCRIPTION
PIN
NUMBER
1MRMaster reset input (active LOW)
2, 5, 6,
9, 12, 15,
16, 19
3, 4, 7,
8, 13, 14,
17, 18
10GNDGround (0V)
11CP
20V
SYMBOLFUNCTION
Q0 – Q7Flip-flop outputs
D0 – D7Data inputs
Clock input (LOW-to-HIGH,
edge-triggered)
CC
Positive power supply
1998 May 20853-2064 19419
2
Page 3
Philips SemiconductorsProduct specification
SYMBOL
PARAMETER
CONDITIONS
UNIT
V
V
74LVC273Octal D-type flip-flop with reset; positive-edge trigger
LOGIC SYMBOL
3
4
7
8
13
14
17
18
IEEE/IEC LOGIC SYMBOL
11
CP
D0
D1
D2
D3
D4
D5
D6
D7
MR
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
2
5
6
9
12
15
16
19
CP
MR
D0
D1
D2
D3
D4
D5
D6
11
1
3
4
7
8
13
14
17
18
C1
R
2
1D
5
6
9
12
15
16
19
SY00050
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7D7
FUNCTION TABLE
1
SY00052
OPERATING
MODES
Reset (clear)LXXL
Load ‘1’HhH
Load ‘0’HIL
H = HIGH voltage level
h = HIGH voltage level one set-up time prior to the
HIGH-to-LOW CP transition
L = LOW voltage level
I= LOW voltage level one set-up time prior to the
HIGH-to-LOW CP transition
= LOW-to-HIGH transition
X = Don’t care
INPUTSOUTPUT
MRCPDnQ0 – Q7
RECOMMENDED OPERATING CONDITIONS
DC supply voltage (for max. speed performance)2.73.6
DC supply voltage (for low-voltage applications)1.23.6
DC Input voltage range05.5V
I
DC Input voltage range for I/Os0V
DC output voltage range0V
O
Operating free-air temperature range–40+85°C
Input rise and fall times
f
T
V
tr, t
CC
V
I/O
V
amb
VCC = 1.2 to 2.7V
VCC = 2.7 to 3.6V
LIMITS
MINMAX
CC
CC
0
0
20
10
V
V
ns/V
1998 May 20
3
Page 4
Philips SemiconductorsProduct specification
P
TOT
VIHHIGH level Input voltage
V
VILLOW level Input voltage
V
VOHHIGH level output voltage
IIInput leakage current
V
V
GND
"0.1
"5µA
74LVC273Octal D-type flip-flop with reset; positive-edge trigger
ABSOLUTE MAXIMUM RATINGS
1
In accordance with the Absolute Maximum Rating System (IEC 134)
Voltages are referenced to GND (ground = 0V)
SYMBOL
V
CC
I
IK
V
I
I
OK
V
O
I
O
I
, I
GND
CC
T
stg
DC supply voltage–0.5 to +6.5V
DC input diode currentVI t0–50mA
DC input voltageNote 2–0.5 to +5.5V
DC output diode currentV
DC output voltageNote 2–0.5 to VCC +0.5V
DC output source or sink currentVO = 0 to V
DC VCC or GND current"100mA
Storage temperature range–65 to +150°C
PARAMETERCONDITIONSRATINGUNIT
uVCC or VO t 0"50mA
O
CC
"50mA
Power dissipation per package
– plastic mini-pack (SO)above +70°C derate linearly with 8 mW/K500
– plastic shrink mini-pack (SSOP and
TSSOP)
above +60°C derate linearly with 5.5 mW/K500
mW
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions voltages are referenced to GND (ground = 0V)
LIMITS
SYMBOLPARAMETERTEST CONDITIONSTemp = -40°C to +85°CUNIT
MINTYP1MAX
V
LOW level output voltage
OL
p
I
OZ
I
CC
∆I
3-State output OFF-state currentVCC = 3.6V; VI = VIH or VIL; VO = VCC or GND0.1"10µA
Quiescent supply currentVCC = 3.6V; VI = VCC or GND; IO = 00.110µA
Additional quiescent supply currentVCC = 2.7V to 3.6V; VI = VCC –0.6V; IO = 05500µA
CC
NOTE:
1. All typical values are at V
p
p
p
= 3.3V and T
CC
amb
= 25°C.
VCC = 1.2VV
VCC = 2.7 to 3.6V2.0
VCC = 1.2VGND
VCC = 2.7 to 3.6V0.8
VCC = 2.7V; VI = VIH or VIL; IO = –12mAVCC*0.5
VCC = 3.0V; VI = VIH or VIL; IO = –100µAVCC*0.2V
VCC = 3.0V; VI = VIH or V
VCC = 3.0V; VI = VIH or V
IO = –12mAVCC*0.6
IL;
IO = –24mAVCC*1.0
IL;
VCC = 2.7V; VI = VIH or VIL; IO = 12mA0.40
VCC = 3.0V; VI = VIH or VIL; IO = 100µA0.20
VCC = 3.0V; VI = VIH or V
;
= 3.6V;
CC
= 5.5V or
I
IO = 24mA0.55
IL;
CC
CC
V
V
1998 May 20
4
Page 5
Philips SemiconductorsProduct specification
74LVC273Octal D-type flip-flop with reset; positive-edge trigger
VM = 1.5V at VCC 2.7V.
VM = 0.5 VCC at VCC 2.7V.
VOL and VOH are the typical output voltage drop that occur with the
output load.
1/f
t
t
PHL
MAX
w
V
M
t
w
V
M
t
PLH
SW00078
V
M
t
rem
V
M
SY00053
V
I
CP INPUT
GND
V
Qn OUTPUT
V
OH
OL
V
M
t
PHL
Waveform 1. Clock (CP) to output (Qn) propagation delays, the
clock pulse width and the maximum clock pulse frequency
V
CC
MR INPUT
GND
V
CC
CP INPUT
GND
V
OH
Qn OUTPUT
V
OL
V
M
Waveform 2. Master reset (MR) pulse width, the master reset to
output (Q
) propagation delays and the master reset to clock
n
(CP) removal time
V
I
CP
INPUT
GND
V
I
Dn
INPUT
GND
V
OH
Qn
OUTPUT
V
OL
NOTE: The shaded areas indicate when the input is permitted to change
V
M
t
su
t
h
V
M
V
M
for predictable output performance.
t
su
t
h
SW00079
Waveform 3. Data set-up and hold times for the data input (Dn)
1998 May 20
5
Page 6
Philips SemiconductorsProduct specification
74LVC273Octal D-type flip-flop with reset; positive-edge trigger
TEST CIRCUIT
t
PULSE
GENERATOR
V
CC
V
I
D.U.T.
R
T
Test Circuit for 3-State Outputs
S
1
V
S1
Open
GND
R
V
O
C
L
L
R
L
90%
NEGATIVE
PULSE
POSITIVE
PULSE
10%
V
M
10%10%
t
THL
t
TLH
90%90%
V
M
W
V
M
(tf)
(tr)t
V
M
t
W
VM = 1.5V
Input Pulse Definition
90%
10%
t
TLH
THL
(tr)
(tf)
V
I
0V
V
I
0V
Switch position
TESTS
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
Open
V
GND
DEFINITIONS
1
S1
V
CC
< 2.7V
2.7–3.6V
V
V
CC
2.7V
I
V
S1
2 V
2 V
CC
CC
Waveform 4. Load circuitry for switching times
RL = Load resistor; see AC CHARACTERISTICS for value.
C
= Load capacitance includes jig and probe capacitance: See AC
L
CHARACTERISTICS for value.
R
= Termination resistance should be equal to Z
T
of pulse generators.
OUT
SY00044
1998 May 20
6
Page 7
Philips SemiconductorsProduct specification
74LVC273Octal D-type flip-flop with reset; positive-edge trigger
SO20:plastic small outline package; 20 leads; body width 7.5 mmSOT163-1
1998 May 20
7
Page 8
Philips SemiconductorsProduct specification
74LVC273Octal D-type flip-flop with reset; positive-edge trigger
SSOP20:plastic shrink small outline package; 20 leads; body width 5.3 mmSOT339-1
1998 May 20
8
Page 9
Philips SemiconductorsProduct specification
74LVC273Octal D-type flip-flop with reset; positive-edge trigger
TSSOP20:plastic thin shrink small outline package; 20 leads; body width 4.4 mmSOT360-1
1998 May 20
9
Page 10
Philips SemiconductorsProduct specification
74LVC273Octal D-type flip-flop with reset; positive-edge trigger
DEFINITIONS
Data Sheet IdentificationProduct StatusDefinition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Philips Semiconductors and Philips Electronics North America Corporation
register eligible circuits under the Semiconductor Chip Protection Act.
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Telephone 800-234-7381
print codeDate of release: 05-96
Document order number:9397-750-04505
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