Page 1
INTEGRATED CIRCUITS
DATA SH EET
74LVC2245A
Octal transceiver with direction pin;
30 Ω series termination resistors;
5 V input/output tolerant; 3-state
Product specification
Supersedes data of 1999 Mar 23
File under Integrated Circuits, IC24
1999 Jun 15
Page 2
Philips Semiconductors Product specification
Octal transceiver with direction pin; 30 Ω series
termination resistors; 5 V input/output tolerant; 3-state
FEATURES
• 5 V tolerant inputs/outputs for interfacing with 5 V logic
• Wide supply voltage range of 1.2 to 3.6 V
• CMOS low power consumption
• Direct interface with TTL levels
• Integrated 30 Ω termination resistors
DESCRIPTION
The 74LVC2245A is a high-performance, low-power,
low-voltage, Si-gate CMOS device, superior to most
advanced CMOS compatible TTL families.
Inputs can be driven from either 3.3 or 5 V devices.
In 3-state operation, outputs can handle 5 V. These
features allow the use of these devices as translators in a
mixed 3.3 V/5 V environment.
The 74LVC2245A is an octal transceiver featuring
non-inverting 3-state bus compatible outputs in both send
and receive directions. The ‘245’ features an output enable
OE) input for easy cascading and a send/receive (DIR)
(
input for direction control OE controls the outputs so that
the buses are effectively isolated.
The 74LVC2245A is designed with 30 Ω series termination
resistors in both HIGH and LOW output stages to reduce
line noise.
74LVC2245A
FUNCTION TABLE
See note 1.
INPUT INPUT/OUTPUT
OE DIR A
L L A = B inputs
L H inputs B = A
HX Z Z
Note
1. H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF-state.
ORDERING INFORMATION
OUTSIDE NORTH
AMERICA
74LVC2245AD 74LVC2245AD −40 to +85 °C 20 SO plastic SOT163-1
74LVC2245ADB 74LVC2245ADB 20 SSOP plastic SOT339-1
74LVC2245APW 74LVC2245APW DH 20 TSSOP plastic SOT360-1
NORTH AMERICA
TEMPERATURE
RANGE
n
PACKAGE
PINS PACKAGE MATERIAL CODE
B
n
1999 Jun 15 2
Page 3
Philips Semiconductors Product specification
Octal transceiver with direction pin; 30 Ω series
74LVC2245A
termination resistors; 5 V input/output tolerant; 3-state
QUICK REFERENCE DATA
GND = 0 V; T
SYMBOL PARAMETER CONDITIONS TYPICAL UNIT
t
PHL/tPLH
C
I
C
PD
Note
1. C
is used to determine the dynamic power dissipation (PDin µW).
PD
PD=CPD× V
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC= supply voltage in V;
Σ(CL× V
PINNING
=25°C; tr=tf≤2.5 ns.
amb
propagation delay Anto Bn; Bnto A
n
CL= 50 pF; VCC= 3.3 V 3.9 ns
input capacitance 5.0 pF
power dissipation capacitance per buffer VI= GND to VCC; note 1 27 pF
2
× fi+ Σ(CL× V
CC
2
× fo) = sum of the outputs.
CC
2
× fo) where:
CC
PIN SYMBOL DESCRIPTION
1 DIR direction control
2, 3, 4, 5, 6, 7, 8, 9 A
0
to A
7
data inputs/outputs
10 GND ground (0 V)
18, 17, 16, 15, 14, 13, 12, 11 B
19
20 V
0
to B
7
data inputs/outputs
OE output enable input (active LOW)
CC
DC supply voltage
1999 Jun 15 3
Page 4
Philips Semiconductors Product specification
Octal transceiver with direction pin; 30 Ω series
termination resistors; 5 V input/output tolerant; 3-state
handbook, halfpage
handbook, halfpage
DIR
1
A
2
0
A
3
1
A
4
2
A
5
A
A
A
A
GND
3
4
5
6
7
2245
6
7
8
9
10
MNA363
Fig.1 Pin configuration.
19
G3
3EN1 (BA)
1
3EN2 (AB)
1
2
4
5
6
7
8
2
MNA365
V
20
CC
19
OE
B
18
0
B
17
1
B
16
2
B
15
3
B
14
4
B
13
5
B
12
6
B
11
7
18
173
16
15
14
13
12
119
handbook, halfpage
DIR
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
74LVC2245A
OE
19
0
B
0
18
1
B
1
17
2
B
2
16
3
B
3
15
4
B
4
14
5
B
5
13
6
B
6
12
7
B
7
11
MNA364
Fig.3 IEC logic symbol.
1999 Jun 15 4
Fig.2 Logic symbol.
Page 5
Philips Semiconductors Product specification
Octal transceiver with direction pin; 30 Ω series
74LVC2245A
termination resistors; 5 V input/output tolerant; 3-state
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER CONDITIONS
V
CC
DC supply voltage (for max. speed
performance)
DC supply voltage (for low-voltage
applications)
V
I
V
O
DC input voltage range 0 5.5 V
DC output voltage range; output HIGH or
LOW state
DC output voltage range; 3-state 0 5.5 V
T
amb
operating ambient temperature range see DC and AC characteristics per
device
t
r,tf
input rise and fall times VCC= 1.2 to 2.7 V 0 20 ns/V
V
= 2.7 to 3.6 V 0 10
CC
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134). Voltages are referenced to GND (ground = 0 V).
LIMITS
UNIT
MIN. MAX.
2.7 3.6 V
1.2 3.6 V
0VCCV
−40 +85 °C
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CC
I
IK
V
I
I
OK
V
O
DC supply voltage −0.5 +6.5 V
DC input diode current VI<0 −−50 mA
DC input voltage note 1 −0.5 +5.5 V
DC output diode current VO>VCC or VO<0 −±50 mA
DC output voltage; output HIGH
note 1 −0.5 VCC+ 0.5 V
or LOW
DC output voltage; output 3-state note 1 −0.5 +6.5 V
I
O
I
GND
T
P
stg
tot
DC output diode current VO= 0 to V
, I
DC VCC or GND current −±100 mA
CC
CC
−±50 mA
storage temperature range −65 +150 °C
power dissipation per package
plastic mini-pack (SO) above +70 °C derate linearly with 8 mW/K − 500 mW
plastic shrink mini-pack (SSOP
and TSSOP)
above +60 °C derate linearly with
5.5 mW/K
− 500 mW
Note
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
1999 Jun 15 5
Page 6
Philips Semiconductors Product specification
Octal transceiver with direction pin; 30 Ω series
74LVC2245A
termination resistors; 5 V input/output tolerant; 3-state
DC CHARACTERISTICS
Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).
TEST CONDITIONS T
SYMBOL PARAMETER
OTHER VCC (V)
MIN. TYP.
V
IH
HIGH-level input voltage 1.2 V
CC
2.7 to 3.6 2.0 −−
VILLOW-level input voltage 1.2 −−GND V
2.7 to 3.6 −−0.8
V
OH
V
OL
I
I
I
OZ
I
off
I
CC
∆I
CC
HIGH-level output voltage VI=VIHor VIL; IO= −6 mA 2.7 VCC− 0.5 −−V
V
V
or VIL; IO= −100 µA 3.0 VCC− 0.2 V
I=VIH
or VIL; IO= −12 mA 3.0 VCC− 0.8 −−
I=VIH
LOW-level output voltage VI=VIHor VIL; IO=6mA 2.7 −−0.40 V
V
V
or VIL; IO= 100 µA 3.0 −−0.20
I=VIH
or VIL; IO=12mA 3.0 −−0.55
I=VIH
input leakage current VI= 5.5 V or GND 3.6 −±0.1 ±5 µA
3-state output OFF-state
current
VI=VIHor VIL;
VO= 5.5 V or GND
3.6 − 0.1 ±10 µA
power off leakage supply VIor VO= 5.5 V 0.0 − 0.1 ±10 µA
quiescent supply current VI=VCCor GND; IO= 0 3.6 − 0.1 20 µA
additional quiescent supply
VI=VCC− 0.6 V; IO= 0 2.7 to 3.6 − 5 500 µA
current per control pin
(°C)
amb
−40 to +85
(1)
MAX.
−−V
CC
−
UNIT
Note
1. All typical values are at V
= 3.3 V and T
CC
amb
=25°C.
1999 Jun 15 6
Page 7
Philips Semiconductors Product specification
Octal transceiver with direction pin; 30 Ω series
termination resistors; 5 V input/output tolerant; 3-state
AC CHARACTERISTICS
GND = 0 V; t
SYMBOL PARAMETER WAVEFORMS
t
PHL/tPLH
t
PZH/tPZL
t
PHZ/tPLZ
Note
1. Typical values at V
AC WAVEFORMS
≤2.5 ns.
r=tf
propagation delay
Anto Bn;Bnto A
n
3-state output enable time
OE to An; OE to B
n
3-state output disable time
OE to An; OE to B
CC
n
= 3.3 V and T
= 3.3 V ±0.3 V VCC= 2.7 V
CC
MIN. TYP.
see Figs 4 and 6 1.5 3.9 6.5 1.5 7.5 ns
see Figs 5 and 6 1.5 5.7 9.0 1.5 10.0 ns
see Figs 5 and 6 1.5 4.2 5.9 1.5 6.9 ns
=25°C.
amb
74LVC2245A
LIMITS
(1)
MAX. MIN. MAX.
UNITV
handbook, halfpage
An, B
INPUT
Bn, A
OUTPUT
VM= 1.5V at VCC≥ 2.7 V;
VM= 0.5 VCCat VCC< 2.7 V;
VOL and VOH are typical output voltage drop that occur with the output
load.
V
I
n
GND
t
V
OH
n
V
OL
PHL
V
M
V
M
Fig.4 The input An to output Yn propagation
delays.
t
PLH
MNA366
1999 Jun 15 7
Page 8
Philips Semiconductors Product specification
Octal transceiver with direction pin; 30 Ω series
termination resistors; 5 V input/output tolerant; 3-state
handbook, full pagewidth
VM= 1.5 V at VCC≥ 2.7 V;
VM= 0.5VCCat VCC< 2.7 V;
VX=VOL+0.3VatVCC≥ 2.7 V;
VX=VOL+ 0.1VatVCC< 2.7 V;
OE INPUT
OUTPUT
LOW-to-OFF
OFF-to-LOW
OUTPUT
HIGH-to-OFF
OFF-to-HIGH
V
I
V
M
GND
t
PLZ
V
CC
V
V
OL
V
OH
GND
VY=VOH− 0.3VatVCC≥ 2.7 V;
VY=VOH− 0.1VatVCC< 2.7 V;
VOL and VOH are typical output voltage drop that occur with the output load.
t
PHZ
outputs
enabled
X
V
Y
outputs
disabled
t
PZL
t
PZH
74LVC2245A
V
M
V
M
outputs
enabled
MNA367
handbook, full pagewidth
TEST S
t
PLH/tPHL
t
PLZ/tPZL
t
PHZ/tPZH
open
2 × V
GND
1
CC
Fig.5 The 3-state enable and disable times.
PULSE
GENERATOR
V
CC
<2.7 V V
2.7 to 3.6 V 2.7 V
S1
2 × V
CC
V
CC
V
I
R
CC
T
V
D.U.T.
I
V
O
C
50 pF
Definitions for test circuit:
RL= Load resistor; see Chapter “AC characteristics”.
CL= Load capacitance including jig and probe capacitance (see
Chapter “AC characteristics”).
= Termination resistance should be equal to the output
R
T
Impedance Z
R
L
500 Ω
R
L
L
500 Ω
of the pulse generator.
0
open
GND
MNA368
Fig.6 Load circuitry for switching times.
1999 Jun 15 8
Page 9
Philips Semiconductors Product specification
Octal transceiver with direction pin; 30 Ω series
termination resistors; 5 V input/output tolerant; 3-state
PACKAGE OUTLINES
SO20: plastic small outline package; 20 leads; body width 7.5 mm
D
c
y
Z
20
11
74LVC2245A
SOT163-1
E
H
E
A
X
v M
A
pin 1 index
1
e
0 5 10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
A
max.
2.65
0.10
A
1
0.30
0.10
0.012
0.004
A2A3b
2.45
0.25
2.25
0.096
0.01
0.089
0.49
0.36
0.019
0.014
p
cD
0.32
0.23
0.013
0.009
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
10
w M
b
p
scale
(1)E(1) (1)
13.0
12.6
0.51
0.49
eHELLpQ
7.6
1.27
7.4
0.30
0.050
0.29
10.65
10.00
0.419
0.394
Q
A
2
0.055
A
1.4
1
detail X
1.1
1.1
1.0
0.4
0.043
0.043
0.039
0.016
(A )
L
p
L
0.25
0.01
A
3
θ
0.25 0.1
0.01
ywv θ
Z
0.9
0.4
8
0.004
0.035
0.016
0
o
o
OUTLINE
VERSION
SOT163-1
IEC JEDEC EIAJ
075E04 MS-013AC
REFERENCES
1999 Jun 15 9
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
Page 10
Philips Semiconductors Product specification
Octal transceiver with direction pin; 30 Ω series
termination resistors; 5 V input/output tolerant; 3-state
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
D
c
y
Z
20 11
E
H
E
74LVC2245A
SOT339-1
A
X
v M
A
pin 1 index
110
w M
b
e
DIMENSIONS (mm are the original dimensions)
mm
A
max.
2.0
0.21
0.05
1.80
1.65
0.25
b
3
p
0.38
0.25
UNIT A1A2A
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
p
0 2.5 5 mm
cD
0.20
7.4
0.09
7.0
(1)E(1)
5.4
5.2
scale
eHELLpQ
0.65
7.9
7.6
Q
A
2
A
1
detail X
0.9
1.03
0.7
0.63
(A )
L
p
L
3
θ
0.131.25 0.2 0.1
A
(1)
Zywv θ
0.9
0.5
o
8
o
0
OUTLINE
VERSION
SOT339-1 MO-150AE
IEC JEDEC EIAJ
REFERENCES
1999 Jun 15 10
EUROPEAN
PROJECTION
ISSUE DATE
93-09-08
95-02-04
Page 11
Philips Semiconductors Product specification
Octal transceiver with direction pin; 30 Ω series
termination resistors; 5 V input/output tolerant; 3-state
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
E
H
E
20
D
c
y
Z
11
74LVC2245A
A
X
v M
A
SOT360-1
pin 1 index
110
w M
b
e
DIMENSIONS (mm are the original dimensions)
UNIT A1A2A
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
A
max.
0.15
mm
1.10
OUTLINE
VERSION
SOT360-1 MO-153AC
0.05
0.95
0.80
IEC JEDEC EIAJ
0.25
b
3
p
0.30
0.19
p
0 2.5 5 mm
scale
(1)E(2) (1)
cD
0.2
6.6
4.5
0.1
REFERENCES
6.4
4.3
0.65
eHELLpQZywv θ
A
6.6
6.2
Q
2
A
1
L
detail X
0.4
0.75
0.3
0.50
(A )
3
L
p
0.13 0.10.21.0
EUROPEAN
PROJECTION
A
θ
0.5
0.2
ISSUE DATE
93-06-16
95-02-04
o
8
o
0
1999 Jun 15 11
Page 12
Philips Semiconductors Product specification
Octal transceiver with direction pin; 30 Ω series
termination resistors; 5 V input/output tolerant; 3-state
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
74LVC2245A
1999 Jun 15 12
Page 13
Philips Semiconductors Product specification
Octal transceiver with direction pin; 30 Ω series
74LVC2245A
termination resistors; 5 V input/output tolerant; 3-state
Suitability of surface mount IC packages for wave and reflow soldering methods
PACKAGE
BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, SMS not suitable
(3)
PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
, SO, SOJ suitable suitable
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
WAVE REFLOW
(2)
(3)(4)
(5)
SOLDERING METHOD
(1)
suitable
suitable
suitable
.
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Jun 15 13
Page 14
Philips Semiconductors Product specification
Octal transceiver with direction pin; 30 Ω series
termination resistors; 5 V input/output tolerant; 3-state
NOTES
74LVC2245A
1999 Jun 15 14
Page 15
Philips Semiconductors Product specification
Octal transceiver with direction pin; 30 Ω series
termination resistors; 5 V input/output tolerant; 3-state
NOTES
74LVC2245A
1999 Jun 15 15
Page 16
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Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 02 67 52 2531, Fax. +39 02 67 52 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
1999 66
Internet: http://www.semiconductors.philips.com
Printed in The Netherlands 245004/02/pp16 Date of release: 1999Jun 15 Document order number: 9397 75005624
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