•5 volt tolerant inputs/outputs for interfacing with 5V logic
48
1OE
1Y0
1Y1
GND
1Y2
1Y3
V
2Y0
2Y1
GND
2Y2
2Y3
3Y0
3Y1
GND
3Y2
3Y3
V
4Y0
4Y1
GND
4Y2
4Y3
4OE
1
2
3
4
5
6
7
CC
8
9
10
11
12
13
14
15
16
17
18
CC
19
20
21
22
23
24
SW00194
•Wide supply voltage range of 1.2V to 3.6V
•Complies with JEDEC standard no. 8-1A
•CMOS low power consumption
•MULTIBYTE
TM
flow-through standard pin-out architecture
•Low inductance multiple power and ground pins for minimum
noise and ground bounce
•Direct interface with TTL levels
•All data inputs have bus hold (74LVCH16244A only)
DESCRIPTION
The 74LVC(H)16244A is a high-performance, low-power,
low-voltage, Si-gate CMOS device, superior to most advanced
CMOS compatible TTL families. Inputs can be driven from either
3.3V or 5V devices. In 3-State operation, outputs can handle 5V .
These features allow the use of these devices in a mixed 3.3V/5V
environment.
The 74LVC(H)16244A is a 16-bit non-inverting buf fer/line driver with
3-State outputs. The device can be used as four 4-bit buffers, two
8-bit buffers or one 16-bit buffer. The 3-State outputs are controlled
by the output enable inputs 1OE
the outputs to assume a high impedance OFF-state. The device can
be used as four 4-bit buffers, two 8-bit buffers or one 16-bit buffer.
The 74LVC(H)16244A is identical to the 74LVC16240A but has
non-inverting outputs.
The 74LVCH16244A bus hold data inputs eliminates the need for
external pull up resistors to hold unused inputs.
and 2OE. A HIGH on nOE causes
ORDERING INFORMA TION
PACKAGESTEMPERATURE RANGE OUTSIDE NORTH AMERICANORTH AMERICADWG NUMBER
48-Pin Plastic SSOP Type III–40°C to +85°C74LVC16244A DLVC16244A DLSOT370-1
48-Pin Plastic TSSOP Type II–40°C to +85°C74LVC16244A DGGVC16244A DGGSOT362-1
48-Pin Plastic SSOP Type III–40°C to +85°C74LVCH16244A DLVCH16244A DLSOT370-1
48-Pin Plastic TSSOP Type II–40°C to +85°C74LVCH16244A DGGVCH16244A DGGSOT362-1
2OE
47
1A0
46
1A1
45
GND
44
1A2
43
1A3
42
V
CC
41
2A0
40
2A1
39
GND
38
2A2
37
2A3
36
3A0
35
3A1
34
GND
33
3A2
32
3A3
31
V
CC
30
4A0
29
4A1
28
GND
27
4A2
26
4A3
25
3OE
QUICK REFERENCE DATA
GND = 0 V; T
SYMBOL
t
PHL/tPLH
C
I
C
PD
NOTES:
is used to determine the dynamic power dissipation (PD in W):
1. C
PD
P
= CPD × V
D
= input frequency in MHz; CL = output load capacity in pF;
f
i
f
= output frequency in MHz; VCC = supply voltage in V;
o
(C
L
1997 Oct 28853-1994 18612
= 25°C; tr = tf ≤ 2.5 ns
amb
Propagation delay
1An to 1Yn;
2An to 2Yn
Input capacitance5.0pF
Power dissipation capacitance per bufferVI = GND to V
In accordance with the Absolute Maximum Rating System (IEC 134) Voltages are referenced to GND (ground = 0V)
LIMITS
MINMAX
I
GND
V
I
V
V
T
DC supply voltage–0.5+6.5V
CC
I
DC input diode currentVI < 0––50mA
IK
V
DC input voltageNote 2–0.5+6.5V
I
DC output diode currentVO > VCC or VO < 0–
OK
DC output voltage; output HIGH or LOW
O
state
DC output voltage; output 3-StateNote 2–0.56.5V
O
I
DC output source or sink currentVO = 0 to V
O
Note 2–0.5VCC + 0.5V
CC
–
, ICCDC VCC or GND current–
Storage temperature range–65+150°C
stg
50
50
100
mA
mA
mA
Power dissipation per package
P
– SO packageAbove +70°C derate linearly 8mW/K500mW
tot
– SSOP and TSSOP packageAbove +60°C derate linearly 5.5mW/K500
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The input and output voltage ratings may be exceeded if the input and output clamp current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
DC supply voltage (for max. speed
performance)
DC supply voltage (for low-voltage
applications)
DC Input voltage range05.5V
I
DC output voltage range; output HIGH or
O
LOW state
DC output voltage range; output 3-State05.5V
Over recommended operating conditions. V oltages are referenced to GND (ground = 0V)
LIMITS
SYMBOLPARAMETERTEST CONDITIONSTemp = -40°C to +85°CUNIT
MINTYP1MAX
p
p
VCC = 1.2VV
VCC = 2.7 to 3.6V2.0
VCC = 1.2VGND
VCC = 2.7 to 3.6V0.8
VCC = 2.7V; VI = VIH or VIL;IO = –12mAVCC*0.5
p
VCC = 3.0V; VI = VIH or VIL;IO = –100µAVCC*0.2V
VCC = 3.0V; VI = VIH or V
VCC = 3.0V; VI = VIH or V
= –18mAVCC*0.6
IL;IO
= –24mAVCC*0.8
IL;IO
VCC = 2.7V; VI = VIH or VIL;IO = 12mA0.40
V
OL
I
OZ
I
off
I
CC
∆I
I
BHL
I
BHH
I
BHLO
I
BHHO
LOW level output voltage
p
3-State output OFF-state currentVCC = 3.6V; VI = VIH or VIL;VO = 5.5V or GND0.1
Power off leakage supplyVCC = 0.0V; V
Quiescent supply currentVCC = 3.6V; VI = VCC or GND; IO = 00.120µA
Additional quiescent supply current
CC
per input pin
Bus hold LOW sustaining currentVCC = 3.0V; VI = 0.8V
Bus hold HIGH sustaining currentVCC = 3.0V; VI = 2.0V
Bus hold LOW overdrive currentVCC = 3.6V
Bus hold HIGH overdrive currentVCC = 3.6V
VCC = 3.0V; VI = VIH or VIL;IO = 100µA0.20
VCC = 3.0V; VI = VIH or V
;
CC
= 3.6V;
= 5.5V or
I
or VO = 5.5V0.1
I
= 24mA0.55
IL;IO
VCC = 2.7V to 3.6V; VI = VCC –0.6V; IO = 05500µA
2, 3, 4
2, 3, 4
2, 3, 5
2, 3, 5
NOTES:
1. All typical values are at V
2. Valid for data inputs of bus hold parts (LVCH16-A) only.
= 3.3V and T
CC
amb
= 25°C.
3. For data inputs only, control inputs do not have a bus hold circuit.
4. The specified sustaining current at the data input holds the input below the specified VI level.
5. The specified overdrive current at the data input forces the data input to the opposite logic input state.
6. For bus hold parts, the bus hold circuit is switched off when V
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Formative or in Design
Preproduction Product
Full Production
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Copyright Philips Electronics North America Corporation 1997
print codeDate of release: 05-96
Document order number:9397-750-04528
All rights reserved. Printed in U.S.A.
yyyy mmm dd
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