Datasheet 74LVC04APW, 74LVC04ADB, 74LVC04DB, 74LVC04D Datasheet (Philips)

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74LVC04A
Hex inverter
Product specification Supersedes data of 1997 Mar 28 IC24 Data Handbook
1997 Jun 30
Page 2
Philips Semiconductors Product specification
74L VC04A
Hex inverter
2
1997 Jun 30 853-1953 18162
FEA TURES
•Wide supply range of 1.2V to 3.6V
•Complies with JEDEC standard no. 8-1A
•Inputs accept voltages up to 5.5V
•CMOS low power consumption
•Direct interface with TTL levels
•5-volt tolerant inputs, for interfacing with 5-volt logic
DESCRIPTION
The 74LVC04A is a high-performance, low-power, low-voltage, Si-gate CMOS device and superior to most advanced CMOS compatible TTL families.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in a mixed 3.3 V/5 V environment.
The 74LVC04A provides six inverting buffers.
QUICK REFERENCE DA TA
GND = 0 V; T
amb
= 25°C; tr = tf 2.5 ns
SYMBOL
PARAMETER CONDITIONS TYPICAL UNIT
t
PHL/tPLH
Propagation delay nA to nY
CL = 50 pF; VCC = 3.3 V
2.5 ns
C
I
Input capacitance 5.0 pF
C
PD
Power dissipation capacitance per gate Notes 1 and 2 25 pF
NOTES:
1. C
PD
is used to determine the dynamic power dissipation (PD in µW)
P
D
= CPD V
CC
2
x fi  (CL V
CC
2
fo) where:
f
i
= input frequency in MHz; CL = output load capacity in pF;
f
o
= output frequency in MHz; VCC = supply voltage in V;
(C
L
V
CC
2
fo) = sum of the outputs.
2. The condition is V
I
= GND to V
CC.
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER
14-Pin Plastic SO –40°C to +85°C 74LVC04A D 74LVC04A D SOT108-1 14-Pin Plastic SSOP Type II –40°C to +85°C 74LVC04A DB 74LVC04A DB SOT337-1 14-Pin Plastic TSSOP Type I –40°C to +85°C 74LVC04A PW 74LVC04APW DH SOT402-1
PIN CONFIGURATION
1
2
3
4
5
6
7
1A
1Y
2A
2Y
3A
3Y
GND
V
CC
6A
6Y
5A
5Y
4A
4Y
14
13
12
11
10
9
8
SV00396
PIN DESCRIPTION
PIN NUMBER SYMBOL NAME AND FUNCTION
1, 3, 5, 9, 11, 13 1A to 6A Data inputs 2, 4, 6, 8, 10, 12 1Y to 6Y Data outputs 7 GND Ground (0 V) 14 V
CC
Positive supply voltage
Page 3
Philips Semiconductors Product specification
74LVC04A
Hex inverter
1997 Jun 30
3
LOGIC SYMBOL
1A 1Y
2A
2Y
3A 3Y
4A 4Y
5A 5Y
6A
6Y
1
3
5
9
11
13
2
4
6
8
10
12
SV00397
LOGIC SYMBOL (IEEE/IEC)
12
34
56
98
11 10
13 12
1
1
1
1
1
1
SV00398
LOGIC DIAGRAM (ONE GA TE)
AY
SV00399
FUNCTION T ABLE
INPUTS OUTPUTS
nA nY
L H H L
NOTES:
H = HIGH voltage level L = LOW voltage level
Page 4
Philips Semiconductors Product specification
74LVC04A
Hex inverter
1997 Jun 30
4
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
PARAMETER
CONDITIONS
MIN MAX
UNIT
V
CC
DC supply voltage (for max. speed performance) 2.7 3.6 V
V
CC
DC supply voltage (for low-voltage applications) 1.2 3.6 V
V
I
DC Input voltage range 0 5.5 V
V
O
DC output voltage range 0 V
CC
V
T
amb
Operating ambient temperature range in free-air –40 +85 °C
tr, t
f
Input rise and fall times
VCC = 1.2 to 2.7V VCC = 2.7 to 3.6V
0 0
20 10
ns/V
ABSOLUTE MAXIMUM RATINGS
1
Absolute Maximum Rating System (IEC 134) Voltages are referenced to GND (ground = 0V)
SYMBOL
PARAMETER CONDITIONS RATING UNIT
V
CC
DC supply voltage –0.5 to +6.5 V
I
IK
DC input diode current VI 0 –50 mA
V
I
DC input voltage Note 2 –0.5 to +5.5 V
I
OK
DC output diode current V
O
VCC or VO 0 50 mA
V
O
DC output voltage Note 2 VCC + 0.5 V
I
O
DC output source or sink current VO = 0 to V
CC
50 mA
I
GND
, I
CC
DC VCC or GND current 100 mA
T
stg
Storage temperature range –65 to +150 °C Power dissipation per package
P
TOT
– plastic mini-pack (SO) above +70°C derate linearly with 8 mW/K 500 – plastic shrink mini-pack (SSOP and TSSOP) above +60°C derate linearly with 5.5 mW/K 500
mW
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability .
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
Page 5
Philips Semiconductors Product specification
74LVC04A
Hex inverter
1997 Jun 30
5
DC CHARACTERISTICS
Over recommended operating conditions voltages are referenced to GND (ground = 0V)
LIMITS
SYMBOL PARAMETER TEST CONDITIONS Temp = -40°C to +85°C UNIT
MIN TYP1MAX
p
VCC = 1.2V V
CC
VIHHIGH level Input voltage
VCC = 2.7 to 3.6V 2.0
V
p
VCC = 1.2V GND
VILLOW level Input voltage
VCC = 2.7 to 3.6V 0.8
V
VCC = 2.7V; VI = VIH or VIL;IO = –12mA VCC*0.5
p
VCC = 3.0V; VI = VIH or VIL;IO = –100µA VCC*0.2 V
CC
VOHHIGH level output voltage
VCC = 3.0V; VI = VIH or V
IL;IO
= –18mA VCC*0.6
V
VCC = 3.0V; VI = VIH or V
IL;IO
= –24mA VCC*0.8
VCC = 2.7V; VI = VIH or VIL;IO = 12mA 0.40
V
OL
LOW level output voltage
VCC = 3.0V; VI = VIH or VIL;IO = 100µA 0.20
V
VCC = 3.0V; VI = VIH or V
IL;IO
= 24mA 0.55
p
;
IIInput leakage current
V
CC
= 3.6V;
V
I
= 5.5V or
GND
"0.1
"5µA
I
CC
Quiescent supply current VCC = 3.6V; VI = VCC or GND; IO = 0 0.1 10 µA
∆I
CC
Additional quiescent supply current per input pin
VCC = 2.7V to 3.6V; VI = VCC –0.6V; IO = 0 5 500 µA
NOTES:
1. All typical values are at V
CC
= 3.3V and T
amb
= 25°C.
AC CHARACTERISTICS
GND = 0 V; tr = tf v 2.5 ns; CL = 50 pF
LIMITS
SYMBOL PARAMETER WAVEFORM
VCC = 3.3V ±0.3V VCC = 2.7V VCC = 1.2V
UNIT
MIN TYP1MAX MIN TYP MAX TYP
t
PHL
/
t
PLH
Propagation delay nA to nY
1 1.5 2.5 4.5 1.5 3.2 5.5 16.0 ns
NOTE:
1. These typical values are at V
CC
= 3.3V and T
amb
= 25°C.
AC WAVEFORMS
VM = 1.5 V at VCC w 2.7 V V
M
= 0.5  VCC at VCC < 2.7 V
V
OL
and VOH are the typical output voltage drop that occur with the
output load.
V
M
nA INPUT
nY OUTPUT
V
M
t
PLH
t
PHL
GND
V
I
V
OL
V
OH
SV00395
Waveform 1. Input (nA) to output (nY) propagation delays.
TEST CIRCUIT
PULSE
GENERATOR
V
I
R
T
D.U.T.
V
O
C
L
50pF
S
1
2 < V
CC
Open GND
500Ω
500Ω
V
CC
V
I
t 2.7V V
CC
2.7V – 3.6V 2.7V
Test S
1
t
PLH/tPHL
Open
V
CC
SY00077
Waveform 2. Load circuitry for switching times.
Page 6
Hex inverter
Philips Semiconductors Product specification
74LVC04A
1997 Jun 30
6
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
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Hex inverter
Philips Semiconductors Product specification
74LVC04A
1997 Jun 30
7
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1
Page 8
Hex inverter
Philips Semiconductors Product specification
74LVC04A
1997 Jun 30
8
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
Page 9
Hex inverter
Philips Semiconductors Product specification
74LVC04A
1997 Jun 30
9
NOTES
Page 10
Hex inverter
Philips Semiconductors Product specification
74LVC04A
1997 Jun 30
10
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
LIFE SUPPORT APPLICA TIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381
DEFINITIONS
Data Sheet Identification Product Status Definition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product.
Copyright Philips Electronics North America Corporation 1997
All rights reserved. Printed in U.S.A.
print code Date of release: 05-96 Document order number: 9397-750-04478
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